Three-dimensional optical waveguide manufacturing device

Abstract

The invention belongs to the technical field of optical waveguide manufacturing, and particularly relates to a three-dimensional optical waveguide manufacturing device which comprises a furnace body, a quartz support, a heat preservation cylinder and a wafer clamp. The quartz support stretches across the opening of the furnace body, and the wafer clamp is hung in a heat preservation cylinder in the furnace body through the quartz support. The wafer clamp further comprises a main clamp body and an auxiliary clamp body which are detachably spliced, the auxiliary clamp body and a sealing plate of the main clamp body are bonded and sealed, and the inner wall of the main clamp body and the inner wall of the auxiliary clamp body are provided with matrix positive electrodes, wafers and copper negative electrodes. And gaps for molten salt to enter the main clamp body and the auxiliary clamp body are formed between the copper negative electrode and the second end surfaces of the main clamp body and the auxiliary clamp body. According to the device, the three-dimensional structure of the optical waveguide can be buried and manufactured, assembling is easy and convenient, wafers are not prone to being damaged, the device is suitable for stably manufacturing the three-dimensional optical waveguide in batches, the short circuit situation is not prone to occurring, and it can be guaranteed that the temperature of molten salt is uniform and cooling is gentle.

Description

Technical Field

[0001] The present invention belongs to the technical field of optical waveguide manufacturing, and particularly relates to a three-dimensional optical waveguide manufacturing device. Background Art

[0002] Electric field-assisted ion exchange is a common method for manufacturing optical waveguide chips. The working principle is to contact the wafer with molten salt for ion exchange, so that sodium ions in the wafer are exchanged for larger-sized ions such as silver and potassium, realizing local modification of the wafer material, changing its refractive index to form an optical waveguide, and accelerating the ion exchange rate under the action of the electric field formed between the positive electrode and the negative electrode. By adjusting the magnitude of the electric field, larger-sized ions such as silver and potassium obtained by wafer exchange can be enriched at different depth positions of the wafer material, realizing buried optical waveguides with different depths. The main process steps for manufacturing an optical waveguide include wafer cleaning, sputtering an Al film on the wafer surface, spin-coating a photoresist on the Al film, designing a photolithography pattern on the photoresist surface and performing photolithography, etching the wafer, and obtaining an optical waveguide through electric field-assisted ion exchange and burial.

[0003] When manufacturing an optical waveguide by electric field-assisted burial, it is necessary to ensure that the surface waveguide surface of the wafer is in contact with the molten salt, so that silver, potassium and other ions in the molten salt can enter the wafer to achieve ion exchange. At the same time, it is necessary to prevent the positive electrode with voltage from being connected to the molten salt or the negative electrode, otherwise it will cause a short circuit.

[0004] To solve this problem, those skilled in the art have designed relevant devices. For example, as proposed by Zeng Ling in the article "Research on Electric Field-Assisted Ion Exchange Waveguides", a ring-shaped container is set on the front side of the wafer, molten salt is added into the ring-shaped container, and a block-shaped or planar positive electrode is set thereon. The negative electrode is connected on the back side of the wafer by methods such as coating. Although this structure can achieve electric field-assisted ion exchange and buried manufacturing of optical waveguides, for each optical waveguide chip manufactured, molten salt needs to be added into the ring-shaped container again. It is not suitable for mass production and is only suitable for single experiments. Moreover, the wafer is in a uniform electric field. Although it can achieve the effect of burying the optical waveguide, it cannot achieve the three-dimensional structure burial of the optical waveguide. Another example is the existing patent solution with the authorization announcement number CN101907739B. An outer ceramic is used to hold the molten salt for exchange, an inner ceramic, a ceramic sheet, and an exchange K9 glass sheet are fixedly stacked together in sequence, and the inner ceramic is fixedly connected to a ceramic rod. The inner ceramic is suspended in the outer ceramic through the ceramic rod. Through holes are provided at the bottom of the inner ceramic and the ceramic sheet for fixing the negative electrode. The negative electrode is in close contact with one side of the nickel-plated film of the exchange K9 glass through the through hole of the ceramic sheet. Although this structure can achieve electric field-assisted ion exchange and buried manufacturing to obtain an optical waveguide, since the exchange K9 glass sheet is exposed at the bottom of the ceramic sheet, and the inner ceramic, the ceramic sheet, and the exchange K9 glass sheet are adhesively stacked together in sequence, the exchange K9 glass sheet is prone to being knocked, damaged, and falling off during the assembly process. Moreover, there is no limit to the assembly position of the ceramic sheet, and it is difficult to control the position accuracy during assembly, which is not suitable for mass production. In addition, the exchange K9 glass sheet is also in a uniform electric field. Although it can achieve the effect of burying the optical waveguide, it cannot achieve the three-dimensional structure burial of the optical waveguide. Summary of the Invention

[0005] The present invention provides a three-dimensional optical waveguide manufacturing device, aiming to solve the problems existing in the above-mentioned prior art. The device includes:

[0006] A furnace body with an opening at the top, a furnace cover is provided at the opening at the top of the furnace body, and a first wire passing hole is provided on the furnace cover;

[0007] A quartz bracket, connected to the inner wall of the furnace body and spanning the opening of the furnace body;

[0008] A heat preservation cylinder, arranged inside the furnace body and located below the quartz bracket, for holding molten salt;

[0009] The wafer fixture is suspended on the quartz bracket and located inside the heat preservation cylinder; the wafer fixture further includes a main fixture body and a sub-fixture body that are detachably spliced. A sealing plate is provided on the first end face of the main fixture body. The first end face of the main fixture body and the first end face of the sub-fixture body are hermetically connected through the sealing plate, and the sealing plate is provided with a second wire harness through hole. The inner walls of the main fixture body and the sub-fixture body from the first end face to the second end face are sequentially provided with a first electrode groove for fixing the matrix positive electrode, a wafer groove for fixing the wafer, and a second electrode groove for fixing the copper negative electrode. The electrical connection wire of the matrix positive electrode sequentially passes through the second wire harness through hole and the first wire harness through hole and is connected to an external power supply. The electrical connection wire of the copper negative electrode directly passes through the first wire harness through hole and is connected to an external power supply. The electrical connection wires of the matrix positive electrode and the copper negative electrode are both mica tape insulated cable wires. Protrusion parts are provided on the second end faces of the main fixture body and the sub-fixture body. The second electrode groove is arranged on the inner wall of the protrusion part. A gap for the molten salt to enter the interiors of the main fixture body and the sub-fixture body is formed between the copper negative electrode and the second end faces of the main fixture body and the sub-fixture body.

[0010] In a specific embodiment, the furnace cover is hinged at the opening of the furnace body. Electric heating wires and a first temperature sensor are embedded inside the furnace wall of the furnace body. A second temperature sensor is embedded in the wafer fixture. The signal connection wire of the second temperature sensor is a mica tape insulated signal wire. The signal connection wire of the second temperature sensor passes through the first wire harness through hole and is connected to an external controller. The electric heating wires and the first temperature sensor are also connected to an external controller, and are used to control the heating power of the electric heating wires according to the temperatures detected by the first temperature sensor and the second temperature sensor. The inner wall material of the furnace body is high-alumina brick, which is used to conduct the heat of the electric heating wires.

[0011] In a specific embodiment, at least a pair of limiting square grooves are provided on the inner wall of the furnace body. The two ends of the quartz bracket are respectively placed in a pair of the limiting square grooves. The quartz bracket and the wafer fixture are arranged in one-to-one correspondence and there is at least one.

[0012] In a specific embodiment, the heat preservation cylinder includes an inner cylinder and an outer cylinder. The molten salt is placed inside the inner cylinder. A filling cavity is formed by arranging a space between the outer wall of the inner cylinder and the inner wall of the outer cylinder. A heat preservation medium is provided in the filling cavity.

[0013] In a specific embodiment, a support ring is fixed inside the outer cylinder. The inner cylinder is fixed on the support ring. The outer cylinder is made of aluminum alloy or stainless steel. The inner cylinder is made of quartz. The support ring is made of quartz or ceramic. The heat preservation medium is molten salt.

[0014] In a specific embodiment, a lifting lug is provided on the side wall of the main clamp body, and a fiberglass rope loop is penetrated through the lifting lug, and the fiberglass rope loop is suspended on the quartz bracket.

[0015] In a specific embodiment, both the main clamp body and the sub-clamp body are in a semi-circular structure or a semi-square structure. Both the main clamp body and the sub-clamp body are made of quartz. A positioning groove is provided on the splicing surface of the main clamp body, and a positioning pin for inserting into the positioning groove is provided on the splicing surface of the sub-clamp body, and the splicing surfaces of the main clamp body and the sub-clamp body are fixedly bonded by an insulating adhesive.

[0016] In a specific embodiment, a first chamfer surface is provided between the splicing surface of the main clamp body and its outer wall, and a second chamfer surface is provided between the splicing surface of the sub-clamp body and its outer wall. The first chamfer surface and the second chamfer surface are fixedly bonded by an insulating adhesive.

[0017] In a specific embodiment, the sealing plate is integrally formed with the main clamp body, and the sealing plate and the first end surface of the sub-clamp body are fixedly bonded by an insulating adhesive.

[0018] In a specific embodiment, between the matrix positive electrode and the first electrode groove, between the wafer and the wafer groove, between the copper negative electrode and the second electrode groove, and between the electrical connection line of the matrix positive electrode and the inner wall of the second wire harness through hole are all fixedly bonded by an insulating adhesive.

[0019] The present invention has at least the following beneficial effects:

[0020] 1. By using a matrix positive electrode to replace the traditional positive electrode, the voltage between each positive electrode block of the matrix positive electrode and the copper negative electrode can be adjusted as needed, thereby realizing the three-dimensional structure of the buried optical waveguide.

[0021] 2. By adopting a spliced wafer fixture structure, using the first electrode groove to fix the matrix positive electrode, using the wafer groove to fix the wafer, using the second electrode groove to fix the copper negative electrode, and designing the wafer into a hidden structure, the assembly of the wafer and the positive and negative electrodes is very simple and convenient and the wafer is not easily damaged, which is suitable for stable batch manufacturing of three-dimensional optical waveguides.

[0022] 3. The first end surface of the main clamp body and the first end surface of the sub-clamp body are sealed and connected by a sealing plate, so that the matrix positive electrode is located in a closed and insulated space of the wafer fixture, which can effectively prevent the matrix positive electrode from being connected and short-circuited with the molten salt or the copper negative electrode.

[0023] 4. By setting the double thermal insulation structure of the thermal insulation cylinder and the furnace body, the temperature of the molten salt in the thermal insulation cylinder can be ensured to be uniform and the temperature drop to be gentle.

[0024] 5. By adopting the structure of suspending the wafer fixture with a quartz bracket, the fixing structure of the wafer fixture is made simpler and very convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is an overall three-dimensional view of an embodiment of the present invention.

[0026] Figure 2 It is a structural diagram of the quartz bracket in an embodiment of the present invention.

[0027] Figure 3 It is a three-dimensional sectional view of the thermal insulation cylinder in an embodiment of the present invention.

[0028] Figure 4 It is an overall structural diagram of the wafer fixture in an embodiment of the present invention.

[0029] Figure 5 It is a three-dimensional structural diagram of the main fixture body in an embodiment of the present invention.

[0030] Figure 6 It is a three-dimensional structural diagram of the sub-fixture body in an embodiment of the present invention.

[0031] Figure 7 It is an overall sectional structural diagram of the wafer fixture in an embodiment of the present invention.

[0032] Reference numerals: furnace body 1, furnace cover 11, first wire harness through hole 111, limiting square groove 12, quartz bracket 2, anti-rotation surface 21, thermal insulation cylinder 3, inner cylinder 31, outer cylinder 32, filling cavity 33, support ring 34, wafer fixture 4, main fixture body 41, positioning groove 411, first chamfered surface 412, sealing plate 413, second wire harness through hole 414, lifting lug 415, sub-fixture body 42, positioning pin 421, second chamfered surface 422, protruding portion 43, gap 44, matrix positive electrode 5, wafer 6, copper negative electrode 7, glass fiber rope loop 8. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] Please refer to Figure 1 and Figure 2 , a three-dimensional optical waveguide manufacturing device provided by the present invention, the device includes: a furnace body 1 with an open top, a quartz bracket 2, a thermal insulation cylinder 3 and a wafer fixture 4.

[0034] A furnace cover 11 is hinged at the opening at the top of the furnace body 1 for opening or closing the opening of the furnace body 1, and a first wire harness through hole 111 is provided on the furnace cover 11 for a cable to pass through.

[0035] The inner wall of the furnace body 1 is provided with at least a pair of limiting square grooves 12. Both ends of the quartz bracket 2 are respectively placed in a pair of limiting square grooves 12 and span the opening of the furnace body 1. The quartz bracket 2 is of a cylindrical structure, and both ends thereof are provided with anti-rotation surfaces 21 that cooperate with the inner walls of the limiting square grooves 12, so that the quartz bracket 2 will not rotate freely after being assembled into the limiting square grooves 12.

[0036] Please refer to Figure 1 and Figure 3 , the heat preservation cylinder 3 is arranged inside the furnace body 1 and is located below the quartz bracket 2 for containing molten salt. The heat preservation cylinder 3 includes an inner cylinder 31 and an outer cylinder 32. The molten salt is contained inside the inner cylinder 31. A filling cavity 33 is formed by arranging a gap between the outer wall of the inner cylinder 31 and the inner wall of the outer cylinder 32, and a heat preservation medium is arranged in the filling cavity 33. A support ring 34 is fixed inside the outer cylinder 32, and the inner cylinder 31 is fixed on the support ring 34. The outer cylinder 32 is made of aluminum alloy or stainless steel, the inner cylinder 31 is made of quartz, and the support ring 34 is made of quartz or ceramic. The heat conductivity and thermal expansion coefficient of the support ring 34 made of quartz or ceramic are similar to those of the inner cylinder 31 made of quartz, and problems such as uneven heat transfer or poor thermal matching resulting in the explosion of the inner cylinder 31 will not occur. The heat preservation medium adopts molten salt, so that the heat preservation medium has the same characteristics as the molten salt contained in the inner cylinder 31, ensuring the uniform temperature and gentle cooling of the molten salt. The heat preservation cylinder 3 adopts a double-layer heat preservation structure of the inner cylinder 31 and the outer cylinder 32, further ensuring the uniform temperature and gentle cooling of the molten salt. Moreover, the heat preservation cylinder 3 and the furnace body 1 form a double heat preservation structure, further ensuring the uniform temperature and gentle cooling of the molten salt.

[0037] Please refer to Figures 4 - 7 , the wafer fixture 4 further includes a main fixture body 41 and a sub-fixture body 42 that are both of semi-circular ring structures. Both the main fixture body 41 and the sub-fixture body 42 are made of quartz. The main fixture body 41 and the sub-fixture body 42 are spliced and installed together. The splicing surface of the main fixture body 41 is provided with a positioning groove 411, and the splicing surface of the sub-fixture body 42 is provided with a positioning pin 421 for inserting into the positioning groove 411. Moreover, the splicing surfaces of the main fixture body 41 and the sub-fixture body 42 are bonded and fixed by an insulating adhesive. A first chamfer surface 412 is arranged between the splicing surface of the main fixture body 41 and its outer wall, and a second chamfer surface 422 is arranged between the splicing surface of the sub-fixture body 42 and its outer wall. The first chamfer surface 412 and the second chamfer surface 422 are also bonded and fixed by an insulating adhesive, further improving the firmness of the splicing structure.

[0038] A sealing plate 413 is provided on the first end face of the main chuck body 41. The sealing plate 413 is also made of quartz and is integrally formed with the main chuck body 41 to improve the sealing performance. During splicing, the first end face of the main chuck body 41 and the first end face of the sub-chuck body 42 are hermetically connected through the sealing plate 413, and the sealing plate 413 and the first end face of the sub-chuck body 42 are adhesively fixed through insulating glue, so that the main chuck body 41 and the sub-chuck body 42 are spliced into a cup-shaped wafer fixture 4 structure. Of course, in other embodiments, the main chuck body 41 and the sub-chuck body 42 may also be semi-square structures, as long as they can be spliced into a cup-shaped wafer fixture 4 structure, the solution of this invention application can be realized.

[0039] On the inner walls of the main chuck body 41 and the sub-chuck body 42 from the first end face to the second end face, there are successively provided a first electrode groove for fixing the matrix positive electrode 5, a wafer groove for fixing the wafer 6, and a second electrode groove for fixing the copper negative electrode 7. The sealing plate 413 is provided with a second wire harness through hole 414. The electrical connection wire of the matrix positive electrode 5 sequentially passes through the second wire harness through hole 414 and the first wire harness through hole 111 and is connected to an external power supply. The electrical connection wire of the copper negative electrode 7 directly passes through the first wire harness through hole 111 and is connected to an external power supply. Between the matrix positive electrode 5 and the first electrode groove, between the wafer 6 and the wafer groove, between the copper negative electrode 7 and the second electrode groove, and between the electrical connection wire of the matrix positive electrode 5 and the inner wall of the second wire harness through hole 414, they are all adhesively fixed through insulating glue, so that the matrix positive electrode 5 is installed in a closed and insulated space constructed by the main chuck body 41, the sub-chuck body 42, the wafer 6, and the sealing plate 413, which can effectively prevent the matrix positive electrode 5 from being connected and short-circuited with the molten salt or the copper negative electrode. The electrical connection wires of the matrix positive electrode 5 and the copper negative electrode 7 are both mica tape insulated cable wires to ensure that the electrical connection wire of the matrix positive electrode 5 and the electrical connection wire of the copper negative electrode 7 can withstand the high temperature of the molten salt environment and be insulated from the molten salt.

[0040] Protrusions 43 are provided on the second end faces of the main chuck body 41 and the sub-chuck body 42. The second electrode groove is provided on the inner wall of the protrusion 43. A gap 44 for the molten salt to enter the interiors of the main chuck body 41 and the sub-chuck body 42 is formed between the copper negative electrode 7 and the second end faces of the main chuck body 41 and the sub-chuck body 42.

[0041] Please refer to Figure 1 and Figure 4, a lifting lug 415 is provided on the side wall of the main jig body 41. A fiberglass rope loop 8 is passed through the lifting lug 415, and the fiberglass rope loop 8 is suspended on the quartz bracket 2, so as to realize hanging the assembled wafer jig 4 as a whole on the quartz bracket 2, and making the wafer jig 4 as a whole immersed in the molten salt contained inside the heat preservation cylinder 3. It should be noted that both the main jig body 41 and the auxiliary jig body 42 are made of quartz, and the insulating adhesive bonding force between the main jig body 41 and the auxiliary jig body 42 can fully ensure that the two will not separate during use.

[0042] An electric heating wire (not shown in the figure) and a first temperature sensor (not shown in the figure) are also embedded inside the furnace wall of the furnace body 1. A second temperature sensor (not shown in the figure) is embedded in the wafer jig 4. The second temperature sensor is a thermocouple sensor. The signal connecting wire of the second temperature sensor is a mica tape insulated signal wire. The signal connecting wire of the second temperature sensor passes through the first wire bundle through hole 111 and is connected to an external controller. The electric heating wire and the first temperature sensor are also connected to the external controller, and are used to control the heating power of the electric heating wire according to the temperatures detected by the first temperature sensor and the second temperature sensor to realize active heat preservation. It should be noted that this control principle is prior art and will not be elaborated here. The inner wall material of the furnace body 1 is high-alumina brick, which is used to improve the efficiency of conducting the heat of the electric heating wire.

[0043] Working principle of the present invention: First, the matrix positive electrode 5, the wafer 6, and the copper negative electrode 7 are respectively bonded and fixed in the first electrode groove, the wafer groove, and the second electrode groove on the main fixture body 41 through insulating glue. After curing, the sub-fixture body 42 is spliced with the main fixture body 41, so that the matrix positive electrode 5, the wafer 6, and the copper negative electrode 7 are respectively inserted into the first electrode groove, the wafer groove, and the second electrode groove of the sub-fixture body 42, and are bonded and fixed through insulating glue. At the same time, the electrical connection wire of the matrix positive electrode 5 passes through the second wire harness through-hole 414 and penetrates the sealing plate 413. The sealing plate 413 and the first end face of the sub-fixture body 42, between the first chamfered surface 412 and the second chamfered surface 422, and between the electrical connection wire of the matrix positive electrode 5 and the second wire harness through-hole 414 are also bonded and fixed through insulating glue. Then, the molten salt is placed in the inner cylinder 31 of the heat preservation cylinder 3 in the furnace body 1. The whole wafer fixture 4 is suspended on the quartz bracket 2 through the fiberglass rope loop 8, and the two ends of the quartz bracket 2 are respectively placed in a pair of limit square grooves 12 of the furnace body so that the whole wafer fixture 4 is immersed in the molten salt. Finally, the electrical connection wire of the matrix positive electrode 5 passes through the first wire harness through-hole 111 and is connected to an external power supply, and the electrical connection wire of the copper negative electrode 7 passes through the first wire harness through-hole 111 and is connected to an external power supply to form an electrical circuit. The opening of the furnace body 1 is closed by the furnace cover 11 to form a closed heat preservation environment. The molten salt enters the wafer fixture 4 through the gap 44 formed between the copper negative electrode 7 and the second end faces of the main fixture body 41 and the sub-fixture body 42 to contact the wafer 6, realizing ion exchange. Under the action of electric fields of different sizes formed between the matrix positive electrode 5 and the copper negative electrode 7, a three-dimensional structure of a buried optical waveguide is realized. After the three-dimensional optical waveguide is fabricated, the wafer fixture 4 is taken out of the furnace body 1, cooled, and cleaned. A colloid softening agent is dropped into the insulating glue on the contact surface between the main fixture body 41 and the sub-fixture body 42 to soften the insulating glue, so that the main fixture body 41 and the sub-fixture body 42 can be opened. Then, a colloid softening agent is dropped into the insulating glue between the matrix positive electrode 5 and the first electrode groove, between the wafer 6 and the wafer groove, and between the copper negative electrode 7 and the second electrode groove, and the matrix positive electrode 5, the wafer 6, and the copper negative electrode 7 can be taken out.

[0044] It should be noted that in other embodiments of the present invention, the quartz brackets 2 and the wafer fixtures 4 are provided in one-to-one correspondence and there are multiple of them, so as to realize processing multiple wafers 6 at a time and improve the batch production efficiency.

[0045] It should be noted that the circuit structure and working principle of the matrix positive electrode 5 are both prior arts, and the specific structure and working principle of the matrix positive electrode 5 will not be elaborated in this application.

[0046] It should be noted that the technical solution of this application can also be used to manufacture a two-dimensional optical waveguide structure. Just remove the matrix positive electrode and the copper negative electrode, that is, remove the electric field, and let the wafer directly contact the molten salt to achieve ion exchange. However, the ion exchange rate will be relatively slow and a three-dimensional optical waveguide structure will not be formed.

[0047] The above content is a further detailed description of the present invention in combination with specific preferred embodiments. It cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention belongs, without departing from the concept of the present invention, several simple deductions and substitutions can still be made, which should all be regarded as belonging to the protection scope of the present invention.

Claims

1. A three-dimensional optical waveguide manufacturing apparatus, characterized in that, Comprising: A furnace body (1) with an open top, where a furnace cover (11) is provided at the opening of the top. A first wire harness through-hole (111) is provided on the furnace cover (11). A quartz bracket (2), connected to the inner wall of the furnace body (1) and spanning the opening of the furnace body (1). A heat preservation cylinder (3), arranged inside the furnace body (1) and located below the quartz bracket (2), for containing molten salt. A wafer fixture (4), suspended on the quartz bracket (2) and located inside the heat preservation cylinder (3). The wafer fixture (4) further includes a main fixture body (41) and a sub-fixture body (42) that can be detachably spliced. A sealing plate (413) is provided on the first end face of the main fixture body (41). The first end face of the main fixture body (41) and the first end face of the sub-fixture body (42) are hermetically connected through the sealing plate (413), and a second wire harness through-hole (414) is provided on the sealing plate (413). On the inner walls of the main fixture body (41) and the sub-fixture body (42) from the first end face to the second end face, there are successively provided a first electrode groove for fixing the matrix positive electrode (5), a wafer groove for fixing the wafer (6), and a second electrode groove for fixing the copper negative electrode (7). The electric connection wire of the matrix positive electrode (5) sequentially passes through the second wire harness through-hole (414) and the first wire harness through-hole (111) and is connected to an external power supply. The electric connection wire of the copper negative electrode (7) directly passes through the first wire harness through-hole (111) and is connected to an external power supply. The electric connection wires of the matrix positive electrode (5) and the copper negative electrode (7) are both mica tape insulated cable wires. Protruding portions (43) are provided on the second end faces of the main fixture body (41) and the sub-fixture body (42). The second electrode groove is arranged on the inner wall of the protruding portion (43). A gap (44) for the molten salt to enter the interiors of the main fixture body (41) and the sub-fixture body (42) is formed between the copper negative electrode (7) and the second end faces of the main fixture body (41) and the sub-fixture body (42).

2. The three-dimensional optical waveguide manufacturing apparatus according to claim 1, characterized in that, The furnace cover (11) is hinged at the opening of the furnace body (1). An electric heating wire and a first temperature sensor are embedded inside the furnace wall of the furnace body (1). A second temperature sensor is embedded in the wafer fixture (4). The signal connection wire of the second temperature sensor is a mica tape insulated signal wire. The signal connection wire of the second temperature sensor passes through the first wire harness through-hole (111) and is connected to an external controller. The electric heating wire and the first temperature sensor are also connected to an external controller, for controlling the heating power of the electric heating wire according to the temperatures detected by the first temperature sensor and the second temperature sensor. The inner wall material of the furnace body (1) is high-alumina brick, for conducting the heat of the electric heating wire.

3. The three-dimensional optical waveguide manufacturing apparatus according to claim 1, wherein At least a pair of limiting square grooves (12) are provided on the inner wall of the furnace body (1), and both ends of the quartz bracket (2) are respectively placed in a pair of the limiting square grooves (12). The quartz brackets (2) and the wafer clamps (4) are provided in one-to-one correspondence and there is at least one.

4. The three-dimensional optical waveguide manufacturing apparatus according to claim 1, wherein The heat preservation cylinder (3) includes an inner cylinder (31) and an outer cylinder (32). The molten salt is placed inside the inner cylinder (31). A filling cavity (33) is formed by a spaced arrangement between the outer wall of the inner cylinder (31) and the inner wall of the outer cylinder (32), and a heat preservation medium is provided in the filling cavity (33).

5. The three-dimensional optical waveguide manufacturing apparatus according to claim 4, wherein A support ring (34) is fixed inside the outer cylinder (32), and the inner cylinder (31) is fixed on the support ring (34). The outer cylinder (32) is made of aluminum alloy or stainless steel, the inner cylinder (31) is made of quartz, the support ring (34) is made of quartz or ceramic, and the heat preservation medium is molten salt.

6. The three-dimensional optical waveguide manufacturing apparatus according to claim 1, characterized in that, Lifting lugs (415) are provided on the side wall of the main clamp body (41), and a fiberglass rope loop (8) is passed through the lifting lugs (415), and the fiberglass rope loop (8) is suspended on the quartz bracket (2).

7. The three-dimensional optical waveguide manufacturing apparatus according to claim 1, wherein Both the main clamp body (41) and the sub-clamp body (42) are of semi-circular structure or semi-square structure. Both the main clamp body (41) and the sub-clamp body (42) are made of quartz. A positioning groove (411) is provided on the splicing surface of the main clamp body (41), and a positioning pin (421) for inserting into the positioning groove (411) is provided on the splicing surface of the sub-clamp body (42), and the splicing surfaces of the main clamp body (41) and the sub-clamp body (42) are fixedly bonded by insulating glue.

8. The three-dimensional optical waveguide manufacturing apparatus according to claim 7, wherein A first chamfer surface (412) is provided between the splicing surface of the main clamp body (41) and its outer wall, and a second chamfer surface (422) is provided between the splicing surface of the sub-clamp body (42) and its outer wall. The first chamfer surface (412) and the second chamfer surface (422) are fixedly bonded by insulating glue.

9. The three-dimensional optical waveguide manufacturing apparatus according to claim 1, characterized in that The sealing plate (413) is integrally formed with the main clamp body (41), and the sealing plate (413) and the first end face of the sub-clamp body (42) are fixedly bonded by insulating glue.

10. The three-dimensional optical waveguide manufacturing apparatus according to claim 2, characterized in that, Between the matrix positive electrode (5) and the first electrode groove, between the wafer (6) and the wafer groove, between the copper negative electrode (7) and the second electrode groove, and between the inner wall of the second wire harness through hole (414) and the electrical connection line of the matrix positive electrode (5), they are all fixedly bonded by insulating glue.

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