Wafer edge exposure system

Abstract

The invention provides a wafer edge exposure system. The wafer edge exposure system comprises a cavity; the exposure unit is positioned in the cavity and is used for exposing the edge of the wafer; the bearing unit is located in the cavity, the bearing unit comprises a moving mechanism and a rotating mechanism, the rotating mechanism is arranged on the moving mechanism and used for bearing a wafer and driving the wafer to rotate, and the moving mechanism is used for driving the wafer to move in the first direction; the control unit is electrically connected with the moving mechanism and the rotating mechanism, and the control unit controls the bearing unit to work according to an image needing to be exposed so as to drive the wafer to move. According to the wafer edge exposure system provided by the invention, the control unit controls the moving mechanism and the rotating mechanism to move cooperatively, so that the exposure requirements of different shapes are met, the applicability is improved, and the overall structure of the wafer edge exposure system is compact.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular, to a wafer edge exposure system. Background Art

[0002] The wafer edge exposure device is an important part of the front-end spin coating and developing equipment and the lithography machine for online operation, and is the core component for realizing seamless connection of wafer coating, lithography, and developing. During the spin coating process of photoresist, under the action of centrifugal force and surface tension, the colloid accumulates at the wafer edge, resulting in too thick a film thickness of the lithography machine in the wafer edge area. In subsequent processes, this part of the colloid is likely to peel off, causing defects at the wafer edge. To prevent such adverse situations, an edge exposure device is provided in the spin coater and developer to perform exposure and development on the wafer edge position, thereby removing the unnecessary photoresist at the edge part.

[0003] The methods for removing photoresist at the wafer edge mainly include chemical edge removal method and edge exposure method. Among them, the chemical edge removal method is to spray a solvent on the wafer edge during the wafer coating process to eliminate the photoresist at the wafer edge. The disadvantage of this method is that the solvent is likely to splash into the middle pattern area of the wafer, affecting the pattern transfer quality in the subsequent lithography stage. The edge exposure method is to adsorb the wafer on the rotating mechanism through vacuum, fix the exposure lens above the wafer to generate a rectangular light spot of a certain size, and then use the rotation of the rotating table to achieve wafer edge exposure. The exposed photoresist can be removed by the developer in the subsequent developing stage. Compared with the chemical edge removal method, the edge exposure method has high exposure accuracy.

[0004] However, with the development requirements, the size and shape of the edge area to be exposed of the product are constantly changing, such as the exposed area being oval or rectangular, etc. The existing wafer edge exposure devices cannot meet the current exposure requirements. Summary of the Invention

[0005] The purpose of the present invention is to provide a wafer edge exposure system with a compact structure, which can achieve different-shaped exposure requirements and improve applicability.

[0006] To achieve the above purpose, in the first aspect, the present invention provides a wafer edge exposure system, including: A cavity; An exposure unit, located in the cavity, for exposing the edge of the wafer; A carrying unit, located in the cavity, the carrying unit includes a moving mechanism and a rotating mechanism. The rotating mechanism is arranged on the moving mechanism for carrying the wafer and can drive the wafer to rotate. The moving mechanism is used to drive the wafer to move along the first direction; A control unit, electrically connected to both the moving mechanism and the rotating mechanism, controls the working of the carrying unit according to the image to be exposed, so as to drive the wafer to move. In some embodiments, an input part is provided on the control unit; When the edge area to be exposed is set as an annular shape through the input part, during the exposure process, the control unit controls the moving mechanism to be stationary and controls the rotating mechanism to rotate; When the edge area to be exposed is set as a polygon through the input part, during the exposure process, the control unit controls the rotating mechanism to drive the wafer to rotate and decomposes the wafer rotation speed V x =V*sinθ, Vx represents the speed in the first direction, and the control unit controls the moving mechanism to move in the negative direction in the first direction at a speed of Vx.

[0007] In some embodiments, the wafer edge exposure system further includes a detection unit located in the cavity; The detection unit is electrically connected to the control unit. The detection unit is used to detect whether the wafer is concentric with the rotating mechanism. When the wafer is eccentric with the rotating mechanism, the detection unit calculates the eccentricity, and during the exposure process, the control unit controls the moving mechanism to move according to the eccentricity to compensate for the eccentricity.

[0008] In some embodiments, the detection unit includes a sensor and an identification member; Among them, the identification member includes a first identification member, a second identification member, a third identification member, and a fourth identification member; In the same plane, the first identification member and the second identification member are oppositely arranged, and the third identification member and the fourth identification member are oppositely arranged to form a detection area; The sensor is oppositely arranged with the detection area and faces the center of the detection area; When the carrying unit moves the wafer to the position where the detection area is located, the sensor determines whether the wafer is concentric with the rotating mechanism by detecting the distances between the wafer edge and the adjacent first identification member, second identification member, third identification member, and fourth identification member.

[0009] In some embodiments, the moving mechanism includes a driver, a moving platform, and two sliding tracks arranged oppositely; Both of the sliding tracks extend along the first direction; Both ends of the moving platform are respectively slidably connected to a corresponding one of the sliding tracks; The driver is connected to the moving platform and is used to drive the moving platform to slide; The rotation mechanism is fixedly arranged at the center of the moving platform; When the moving platform moves to the detection area, the center of the detection area is located on the rotation axis of the rotation mechanism.

[0010] In some embodiments, the wafer edge exposure system further includes a limiting member arranged on the sliding track; When the moving platform contacts the limiting member, the center of the detection area is located on the rotation axis of the rotation mechanism.

[0011] In some embodiments, an installation groove is formed on a side wall of the limiting member facing the moving platform, and a contact sensor is arranged in the installation groove. The contact sensor is electrically connected to the sensor; When the moving platform contacts the contact sensor, the contact sensor generates a control signal, and the sensor receives the control signal for detecting the distances between the edge of the wafer or the exposure area and the adjacent first identification member, second identification member, third identification member, and fourth identification member.

[0012] In some embodiments, the exposure unit includes a light source assembly, a lens, and a light intensity detector; The light source assembly is electrically connected to the control unit, and the light source assembly can irradiate light through the lens towards the edge of the wafer; The light intensity detector is electrically connected to the control unit, and the light intensity detector is arranged opposite to the lens for detecting the light intensity of the lens and feeding it back to the control unit.

[0013] In some embodiments, the lens includes a main body, a lens group, a reflector, and an optical integrator; The main body has a first channel and a second channel that communicate with each other, and the first channel is perpendicular to the second channel. The light receiving end of the main body is located at one end of the first channel, and the light emitting end of the main body is located at one end of the second channel; The optical integrator is arranged in the first channel and close to the light receiving end; The lens group is arranged in the first channel and the second channel; The reflector is arranged at the connection of the first channel and the second channel for reflecting light to the second channel and emitting it through the light emitting end.

[0014] In some embodiments, the lens group includes at least one double-sided convex lens and at least one single-sided convex lens, and one side of the single-sided convex lens is a plane; The double-sided convex lens and the single-sided convex lens are arranged at intervals in the first channel. The single-sided convex lens is close to the optical integrator, and the plane of the single-sided convex lens faces the optical integrator. The double-sided convex lens and the single-sided convex lens are arranged at intervals in the second channel. The single-sided convex lens in the second channel is close to the light emitting end, and the plane of the single-sided convex lens faces the light emitting end.

[0015] The beneficial effects of the wafer edge exposure system provided by the present invention are as follows: 1. The wafer edge exposure system provided by the present invention controls the coordinated movement of the moving mechanism and the rotating mechanism through the control unit, so as to meet the exposure requirements of different shapes, improve the applicability, and make the overall structure of the wafer edge exposure system compact.

[0016] 2. The detection unit in the cavity, through the cooperation of the sensor and the identification member, can not only calculate the offset of the wafer, but also judge the consistency of the exposure area, thereby improving the reliability of the wafer edge exposure system.

[0017] 3. By using the lens group, the mirror and the optical integrator in combination, the shape and uniformity of the light beam output by the lens are homogenized and shaped, improving the effect of the edge exposure process. Description of the Drawings

[0018] Figure 1 It is a schematic structural diagram of the wafer edge exposure system according to the embodiment provided by the present invention; Figure 2 It is a top view of the carrier unit carrying the wafer according to the embodiment provided by the present invention; Figure 3 It is a schematic diagram of decomposing the rotation speed of the wafer according to the present invention; Figure 4 It is a schematic diagram of detecting the wafer by using the detection unit according to the embodiment provided by the present invention; Figure 5 It is a schematic structural diagram of the lens according to the embodiment provided by the present invention.

[0019] Reference Signs: Cavity 1, wafer transfer port 11, exposure unit 2, light source assembly 21, lens 22, main body 221, first channel 2211, second channel 2212, lens group 222, double-sided convex lens 2221, single-sided convex lens 2222, mirror 223, optical integrator 224, light intensity detector 23, exposure area 24, carrier unit 3, moving mechanism 31, moving platform 311, sliding track 312, rotating mechanism 32, limiting member 33, control unit 4, input unit 41, detection unit 5, sensor 51, identification member 52, first identification member 521, second identification member 522, third identification member 523, fourth identification member 524, wafer 6. Detailed implementation manners

[0020] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art to which the present invention pertains. The words such as "including" used herein mean that the elements or items appearing before this word cover the elements or items listed after this word and their equivalents, without excluding other elements or items. The "connection" described herein may be a direct connection or an indirect connection, that is, a connection through an intermediate.

[0021] In addition, it should be understood that the orientation or positional relationships indicated by "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. herein are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation on the present invention. The "first" and "second" herein are only for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise stated, the meaning of "a plurality" is two or more.

[0022] In view of the problems existing in the prior art, the embodiments of the present invention provide a wafer edge exposure system. Refer to Figure 1 and Figure 2As shown, it includes a cavity 1, an exposure unit 2, a carrier unit 3, and a control unit 4. Among them, the exposure unit 2 is located inside the cavity 1 and is used to perform exposure processing on the edge of the wafer 6. The carrier unit 3 is arranged inside the cavity 1. The carrier unit 3 includes a moving mechanism 31 and a rotating mechanism 32. The rotating mechanism 32 is arranged on the moving mechanism 31. A suction cup is provided on the rotating mechanism 32 for carrying the wafer 6 and capable of driving the wafer 6 to rotate. The moving mechanism 31 is used to drive the wafer 6 to move in the first direction. The control unit 4 is electrically connected to both the moving mechanism 31 and the rotating mechanism 32. The control unit 4 controls the operation of the carrier unit 3 according to the image to be exposed, so as to drive the movement of the wafer 6.

[0023] In this embodiment, the exposure unit 2 is used to emit light to form an exposure area on the edge of the wafer 6, so as to perform exposure processing on the edge of the wafer 6. The control unit 4 controls the coordinated use of the rotating mechanism 32 and the moving mechanism 31 according to the image to be exposed, so as to meet the requirements of different exposure images, improve the applicability, and make the overall structure of the wafer edge exposure system compact.

[0024] Specifically, referring to Figures 1 to 3 As shown, an input part 41 is provided on the control unit 4. The input part 41 can be a touch screen, and a control program is set inside the control unit 4. When the edge area to be exposed is set as a ring through the input part 41, the control unit 4 controls the moving mechanism 31 to move, so that the edge of the wafer 6 is located directly below the light emitted by the exposure unit 2. Then, during the exposure process, the control unit 4 controls the moving mechanism 31 to remain stationary and controls the rotating mechanism 32 to rotate. When the edge area to be exposed is set as a polygon through the input part 41, during the exposure process, the control unit 4 controls the rotating mechanism to drive the wafer 6 to rotate, and decomposes the rotation speed V of the wafer 6 x =V*sinθ, Vx represents the speed in the first direction, V represents the rotation speed of the wafer 6, and the control unit 4 controls the moving mechanism 31 to move in the negative direction in the first direction at a speed of Vx.

[0025] For example, in this embodiment, when the edge area to be exposed is rectangular, the technician inputs a control instruction into the control unit 4 through the input unit 41. When the rotation speed of the wafer 6 is V, the control unit 4 decomposes V to obtain the speed Vx in the first direction and the speed Vy in the second direction. Wherein, the direction indicated by the X-axis represents the positive direction in the first direction, and the direction indicated by the Y-axis represents the positive direction in the second direction. Then, the control unit 4 controls the moving mechanism 31 to move along the negative direction of the X-axis at the speed Vx, thereby canceling the speed Vx of the wafer 6 in the first direction, so that the exposure unit 2 performs an exposure process along a straight line on the wafer 6. According to this method, a required rectangular image is finally exposed on the wafer 6.

[0026] Reference Figure 1 、 Figure 2 and Figure 4 As shown in, in some embodiments, the wafer edge exposure system further includes a detection unit 5 located in the cavity 1. The detection unit 5 and the exposure unit 2 are oppositely arranged. The carrying unit 3 is located between the detection unit 5 and the exposure unit 2. The detection unit 5 is electrically connected to the control unit 4. The detection unit 5 is used to detect whether the wafer 6 is concentric with the rotating mechanism 32. When the wafer 6 is eccentric with the rotating mechanism 32, the detection unit 5 calculates the eccentricity, and during the exposure process, the control unit 4 controls the moving mechanism 31 to move according to the eccentricity to compensate for the eccentricity.

[0027] In this embodiment, a wafer transmission port 11 is provided on a side wall of the cavity 1 close to the detection unit 5. When it is necessary to expose the wafer 6, the control unit 4 controls the moving mechanism 31 to be close to the wafer transmission port 11. The wafer 6 enters the cavity 1 through the wafer transmission port 11 and is adsorbed and fixed by the suction cup on the rotating mechanism 32. Then, the detection unit 5 is used to detect whether the fixed wafer 6 is concentric with the rotating mechanism 32. When the wafer 6 is eccentric with the rotating mechanism 32, the detection unit 5 calculates the eccentricity and feeds it back to the control unit 4, so that during the exposure of the wafer 6, the control unit 4 controls the moving mechanism 31 to move in the opposite direction to compensate for the eccentricity, thereby ensuring the uniformity of the exposure of the wafer 6.

[0028] In addition, when the exposure process is completed, the moving mechanism 31 drives the exposed wafer 6 to move close to the wafer transmission port 11. At this time, the detection unit 5 can detect the wafer 6 again to determine whether the edge area of the exposed wafer 6 is uniform. If the edge area of the exposed wafer 6 is not uniform, the staff can check and adjust the system in time, so as to increase the function of the wafer edge exposure system and improve the reliability of the wafer 6 exposure process in a limited space.

[0029] Reference Figure 1 、 Figure 2 and Figure 4 As shown, in some specific embodiments, the detection unit 5 includes a sensor 51 and an identification member 52. Among them, the identification member 52 includes a first identification member 521, a second identification member 522, a third identification member 523, and a fourth identification member 524, which are in the same plane and are arranged above the bearing unit 3 through a connecting member. The first identification member 521 and the second identification member 522 are oppositely arranged, and the third identification member 523 and the fourth identification member 524 are oppositely arranged to form a detection area, and the detection area is square. The sensor 51 is arranged opposite to the detection area, and the detection part of the sensor 51 faces the center of the detection area.

[0030] When the bearing unit 3 moves the wafer 6 to the position where the detection area is located, the sensor 51 determines whether the wafer 6 is concentric with the rotating mechanism 32 by detecting the distances (D1, D2, D3, D4) between the edge of the wafer 6 and the adjacent first identification member 521, second identification member 522, third identification member 523, and fourth identification member 524. And when the wafer 6 is eccentric with the rotating mechanism 32, the eccentric distance (eccentricity) and the eccentric direction can also be calculated. Thus, during the exposure process, the control unit 4 can control the movement of the moving mechanism 31 according to the actual situation to supplement the eccentric distance. For example, as Figure 4 shown, when the sensor 51 detects that D1 is less than D2 and D3 is equal to D4, it can be determined that the wafer 6 is offset in the direction of the first identification member 521, and the eccentricity is obtained by calculating the difference between D1 and D2.

[0031] Reference Figure 1 and Figure 2 As shown, in some embodiments, the moving mechanism 31 includes a driver, a moving platform 311, and two oppositely arranged sliding rails 312. Among them, the sliding rails 312 both extend along the first direction, and both ends of the moving platform 311 are slidably connected to a corresponding sliding rail 312. The driver is connected to the moving platform 311 and is used to drive the moving platform 311 to slide. The rotating mechanism 32 is fixedly arranged at the center of the moving platform 311. And when the moving platform 311 moves to the position below the detection area, the center of the detection area is located on the rotation axis of the rotating mechanism 32.

[0032] Furthermore, there is a limiting member 33 on the sliding rail 312. When the moving platform 311 contacts the limiting member 33, the center of the detection area is located on the rotation axis of the rotating mechanism 32.

[0033] In this embodiment, by providing the limiting member 33 on the sliding track 312, the reliability of the movement of the moving platform 311 to directly below the detection area is ensured, and the situation where the position detection of the wafer 6 by the detection unit 5 is inaccurate is avoided.

[0034] In some embodiments, an installation groove is formed on a side wall of the limiting member 33 facing the moving platform 311, and a contact sensor is provided in the installation groove. The contact sensor is electrically connected to the sensor 51.

[0035] When the moving platform 311 contacts the contact sensor, the contact sensor generates a control signal, and the sensor 51 receives the control signal to detect the distances between the edge of the wafer 6 or the exposed edge area and the adjacent first identification member 521, second identification member 522, third identification member 523, and fourth identification member 524, so as to realize the automatic detection of whether the wafer 6 is eccentric and whether the exposed edge area is processed evenly.

[0036] Reference Figure 1 、 Figure 4 and Figure 5 As shown in, in some embodiments, the exposure unit 2 includes a light source assembly 21, a lens 22, and a light intensity detector 23. Among them, the light source assembly 21 is electrically connected to the control unit 4. The light source assembly 21 can irradiate light through the lens 22 toward the edge of the wafer 6 to form an exposure area 24. The light intensity detector 23 is electrically connected to the control unit 4, and the light intensity detector 23 is disposed opposite to the lens 22 and is used for detecting the light intensity of the lens 22 and feeding it back to the control unit 4.

[0037] In this embodiment, before exposing the edge of the wafer 6, the light source assembly 21 is turned on, and the light intensity value output by the current lens 22 is read through the light intensity detector 23, and it is determined whether the light intensity is within the light intensity range required for exposure. If it is not within the light intensity range, the control unit 4 controls and adjusts the aperture opening of the exposure assembly until the light intensity value reaches the set range, so as to ensure the reliability of the exposure process.

[0038] Further, the lens 22 includes a main body 221, a lens group 222, a mirror 223, and an optical integrator 224. Among them, the main body 221 has a first channel 2211 and a second channel 2212 that communicate with each other. The first channel 2211 is perpendicular to the second channel 2212. The light receiving end of the main body 221 is located at one end of the first channel 2211, and the light emitting end of the main body 221 is located at one end of the second channel 2212. The optical integrator 224 is disposed in the first channel 2211 and near the light receiving end. The lens group 222 is disposed in the first channel 2211 and the second channel 2212. The mirror 223 is disposed at the connection of the first channel 2211 and the second channel 2212 for reflecting light to the second channel 2212 and emitting it through the light emitting end.

[0039] In this embodiment, the optical integrator 224 is an optical glass device. Its function is to utilize the principle of total internal reflection of light. Light undergoes multiple reflections inside the light rod, and each reflection forms a virtual light source image. Multiple reflections form a two-dimensional virtual light source matrix, making the light more uniform, so that the light passing through itself achieves a uniform effect at the exit. And in combination with the lens group 222, it further plays a role in homogenizing and shaping the light beam to improve the effect of the exposure process.

[0040] In some embodiments, the lens group 222 includes at least one double convex lens 2221 and at least one single convex lens 2222, and one side of the single convex lens 2222 is a plane; the double convex lens 2221 and the single convex lens 2222 are disposed at intervals in the first channel 2211. The single convex lens 2222 is close to the optical integrator 224, and the plane of the single convex lens 2222 faces the optical integrator 224; the double convex lens 2221 and the single convex lens 2222 are disposed at intervals in the second channel 2212. The single convex lens 2222 in the second channel 2212 is close to the light emitting end, and the plane of the single convex lens 2222 faces the light emitting end.

[0041] In this embodiment, by using the lens group 222, the mirror 223, and the optical integrator 224 in cooperation, the shape and uniformity of the light beam output by the lens 22 are homogenized and shaped, improving the effect of the edge exposure process.

[0042] As described above, the above is only the specific implementation manner of the embodiments of the present application, but the protection scope of the embodiments of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of the present application should be covered by the protection scope of the embodiments of the present application. Therefore, the protection scope of the embodiments of the present application should be subject to the protection scope of the claims.

Claims

1. A wafer edge exposure system, characterized in that, Comprising: A cavity; An exposure unit, located within the cavity, for exposing the edge of a wafer; A carrier unit, located within the cavity, the carrier unit including a moving mechanism and a rotating mechanism, the rotating mechanism being disposed on the moving mechanism for carrying the wafer and capable of driving the wafer to rotate, the moving mechanism being used to drive the wafer to move in a first direction; A control unit, electrically connected to both the moving mechanism and the rotating mechanism, the control unit controlling the operation of the carrier unit according to the image to be exposed to drive the movement of the wafer.

2. The wafer edge exposure system according to claim 1, wherein An input part is provided on the control unit; When the edge area to be exposed is set as an annulus through the input part, during the exposure process, the control unit controls the moving mechanism not to move and controls the rotating mechanism to rotate; When the edge area to be exposed is set as a polygon through the input unit, during the exposure process, the control unit controls the rotation mechanism to drive the wafer to rotate and decomposes the wafer rotation speed V x =V*sinθ, where Vx represents the speed in the first direction, and the control unit controls the moving mechanism to move in the negative direction in the first direction at a speed of Vx.

3. The wafer edge exposure system according to claim 1, characterized in that, It further includes a detection unit located within the cavity; The detection unit is electrically connected to the control unit, the detection unit is used to detect whether the wafer is concentric with the rotating mechanism, when the wafer is eccentric with the rotating mechanism, the detection unit calculates the eccentricity, and during the exposure process, the control unit controls the movement of the moving mechanism according to the eccentricity to compensate for the eccentricity.

4. The wafer edge exposure system according to claim 3, wherein, The detection unit includes a sensor and an identification member; Wherein, the identification member includes a first identification member, a second identification member, a third identification member and a fourth identification member; In the same plane, the first identification member and the second identification member are oppositely arranged, and the third identification member and the fourth identification member are oppositely arranged to form a detection area; The sensor is oppositely arranged with the detection area and faces the center of the detection area; When the carrier unit moves the wafer to the position where the detection area is located, the sensor determines whether the wafer is concentric with the rotating mechanism by detecting the distances between the edge of the wafer and the adjacent first identification member, second identification member, third identification member and fourth identification member.

5. The wafer edge exposure system according to claim 4, wherein, The moving mechanism includes a driver, a moving platform, and two oppositely arranged sliding tracks; The sliding tracks both extend along the first direction; Both ends of the moving platform are respectively slidably connected to a corresponding one of the sliding tracks; The driver is connected to the moving platform for driving the sliding of the moving platform; The rotating mechanism is fixedly disposed at the center of the moving platform; When the moving platform moves to the detection area, the center of the detection area is located on the rotation axis of the rotating mechanism.

6. The wafer edge exposure system according to claim 5, characterized in that, It further includes a limiting member disposed on the sliding track; When the moving platform contacts the limiting member, the center of the detection area is located on the rotation axis of the rotating mechanism.

7. The wafer edge exposure system according to claim 6, wherein, An installation groove is formed on the side wall of the limiting member facing the moving platform, and a contact inductor is disposed in the installation groove, and the contact inductor is electrically connected to the sensor; When the moving platform contacts the contact inductor, the contact inductor generates a control signal, and the sensor receives the control signal for detecting the distances between the edge of the wafer or the exposure area and the adjacent first identification member, second identification member, third identification member and fourth identification member.

8. The wafer edge exposure system according to any one of claims 1 to 7, characterized in that, The exposure unit includes a light source assembly, a lens and a light intensity detector; The light source component is electrically connected to the control unit, and the light source component can irradiate light towards the edge of the wafer through the lens. The light intensity detector is electrically connected to the control unit, and the light intensity detector is disposed opposite to the lens for detecting the light intensity of the lens and feeding it back to the control unit.

9. The wafer edge exposure system according to claim 8, wherein, The lens includes a main body, a lens group, a reflector, and an optical integrator. The main body has a first channel and a second channel that are interconnected, and the first channel is perpendicular to the second channel. The light receiving end of the main body is located at one end of the first channel, and the light emitting end of the main body is located at one end of the second channel. The optical integrator is disposed in the first channel and near the light receiving end. The lens group is disposed in the first channel and the second channel. The reflector is disposed at the connection of the first channel and the second channel for reflecting light to the second channel and emitting it through the light emitting end.

10. The wafer edge exposure system according to claim 9, wherein The lens group includes at least one double-sided convex lens and at least one single-sided convex lens, and one side of the single-sided convex lens is a plane. The double-sided convex lens and the single-sided convex lens are disposed at intervals in the first channel. The single-sided convex lens is near the optical integrator, and the plane of the single-sided convex lens faces the optical integrator. The double-sided convex lens and the single-sided convex lens are disposed at intervals in the second channel. The single-sided convex lens in the second channel is near the light emitting end, and the plane of the single-sided convex lens faces the light emitting end.

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