Pose adjusting device and method for circuit module assembly and server

Abstract

The invention provides a position and posture adjusting device and method for a circuit module assembly and a server, and the device comprises a first position and posture adjusting module which is used for adjusting or fixing the assembly position and posture of a plurality of circuit modules in a first direction under the condition that the first position and posture adjusting module is inserted into a plurality of intervals limited by the plurality of circuit modules; the second pose adjusting module is used for adjusting or fixing the assembly poses of the plurality of circuit modules in a second direction under the condition that the second pose adjusting module is arranged on the top surfaces, far away from the substrate, of the plurality of circuit modules in a crossing manner; the driving module is configured to respond to a control instruction from the substrate management controller and drive the first pose adjusting module to adjust or fix the assembly poses of the plurality of circuit modules in a first direction; and / or responding to a control instruction from the substrate management controller, and driving the second pose adjusting module to adjust or fix the assembly poses of the plurality of circuit modules in a second direction.

Description

Technical Field

[0001] The present invention relates to the field of server technology, and more specifically, to a posture adjustment device, method and server for a circuit module assembly. Background Art

[0002] In server products, common side-by-side vertical plug-in components include PCIe expansion cards, memory modules, hard drives, etc. These components can be installed on the server motherboard through vertical slots to achieve functional expansion and data storage.

[0003] However, during actual assembly, these side-by-side vertically plugged components are prone to center point offset and skew insertion, which can cause mechanical stress. This stress can lead to slot deformation and poor contact between gold fingers, which in turn can cause communication data anomalies (speed reduction, bandwidth reduction, communication failure, etc.) and hardware damage, seriously affecting product stability and service life. Summary of the Invention

[0004] In view of the above problems, the present invention provides a posture adjustment device, a server, a medium and a program product for a circuit module assembly.

[0005] According to one aspect of the present invention, a posture adjustment device for a circuit module assembly is provided, wherein the circuit module assembly includes a plurality of circuit modules arranged at intervals, and the plurality of circuit modules are arranged on a substrate, and the device includes: a first posture adjustment module, for adjusting or fixing the assembly posture of the plurality of circuit modules in a first direction when inserted into a plurality of intervals defined by the plurality of circuit modules, the first direction being perpendicular to the installation direction of the plurality of circuit modules; a second posture adjustment module, for adjusting or fixing the assembly posture of the plurality of circuit modules in a second direction when arranged across the top surface of the plurality of circuit modules away from the substrate, the second direction being parallel to the installation direction of the plurality of circuit modules; a driving module, configured to: drive the first posture adjustment module to adjust or fix the assembly posture of the plurality of circuit modules in the first direction in response to a control instruction from a baseboard management controller; and / or drive the second posture adjustment module to adjust or fix the assembly posture of the plurality of circuit modules in the second direction in response to a control instruction from the baseboard management controller.

[0006] Another aspect of the present invention provides a pose adjustment method, which is applied to the above-mentioned pose adjustment device. The method includes: in response to a first target control instruction from a baseboard management controller, a driving module drives a first pose adjustment module to enable the first pose adjustment module to keep a plurality of circuit modules in a target horizontal pose; in response to a second target control instruction from the baseboard management controller, the driving module drives a second pose adjustment module to enable the second pose adjustment module to keep the plurality of circuit modules in a target vertical pose and fix the plurality of circuit modules in the target vertical pose relative to the substrate in a second direction; and in response to a third target control instruction from the baseboard management controller, the driving module drives the first pose adjustment module to fix the plurality of circuit modules in the target horizontal pose relative to the substrate in a first direction.

[0007] Another aspect of the present invention provides a pose adjustment method for a circuit module assembly, which is applied to a baseboard management controller. The circuit module assembly is disposed on a substrate. The method includes: in response to a first control being triggered, sending a first target control instruction to a pose adjustment device for the circuit module assembly to keep the circuit module assembly in a target horizontal pose; in response to a second control being triggered, sending a second target control instruction to the pose adjustment device to keep the circuit module assembly in a target vertical pose and fix the circuit module assembly in the target vertical pose relative to the substrate in a second direction, where the second direction is parallel to the installation direction of the circuit module assembly; and in response to a third control being triggered, sending a third target control instruction to the pose adjustment device to fix the circuit module assembly in the target horizontal pose relative to the substrate in a first direction, where the first direction is perpendicular to the installation direction of the circuit module assembly.

[0008] Another aspect of the present invention provides a server, including: a baseboard management controller, a circuit module assembly, and the above-mentioned pose adjustment device, where the baseboard management controller is used to implement the steps of the above method.

[0009] Another aspect of the present invention further provides a computer-readable storage medium, on which a computer program or instruction is stored. When the computer program or instruction is executed by a processor, the steps of the above method are implemented.

[0010] Another aspect of the present invention further provides a computer program product, including a computer program or instruction. When the computer program or instruction is executed by a processor, the steps of the above method are implemented. Description of the Drawings

[0011] Through the following description of the embodiments of the present invention with reference to the drawings, the above content and other objects, features, and advantages of the present invention will become clearer. In the drawings:

[0012] Figure 1AShows an application scenario diagram of side-by-side vertically inserted components according to an embodiment of the present invention.

[0013] Figure 1B Shows a schematic diagram of the pose deviation of the GPU card assembly according to a related embodiment.

[0014] Figure 2 Shows a pose adjustment device, a circuit module assembly, and a substrate according to an embodiment of the present invention.

[0015] Figure 3 Shows a schematic diagram of the principle of a pose adjustment device according to an embodiment of the present invention.

[0016] Figure 4 Shows a pose adjustment device and a baseboard management controller according to an embodiment of the present invention.

[0017] Figure 5 Shows a flowchart of a pose adjustment method according to an embodiment of the present invention.

[0018] Figure 6 Shows a flowchart of a pose adjustment method according to another embodiment of the present invention.

[0019] Figure 7 Shows a block diagram of a server according to an embodiment of the present invention.

[0020] Explanation of reference numerals: 101a, backplane; 102a, PCIe card; 103a, PCIe slot; 104a, rail structure; 201, first pose adjustment module; 202, second pose adjustment module; S1, substrate; D1, interval. Detailed implementation manners

[0021] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present invention. In the following detailed description, for the sake of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present invention. However, obviously, one or more embodiments can also be implemented without these specific details. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present invention.

[0022] The terms used herein are merely for describing specific embodiments and are not intended to limit the present invention. The terms "including", "comprising", etc. used herein indicate the presence of the described features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0023] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those of ordinary skill in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification, and should not be interpreted in an idealized or overly rigid manner.

[0024] In cases where expressions similar to "at least one of A, B, and C" are used, generally, it should be interpreted according to the meaning commonly understood by those of ordinary skill in the art (for example, "a system having at least one of A, B, and C" should include, but not be limited to, a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0025] It should also be noted that the directional terms mentioned in the embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only references to the directions in the accompanying drawings and are not used to limit the protection scope of the present invention. Throughout the drawings, the same elements are denoted by the same or similar reference numerals. Conventional structures or configurations will be omitted when they may cause confusion in the understanding of the present invention.

[0026] In server products, common side-by-side vertically inserted components typically include PCIe expansion cards, memory modules, hard drives, etc. These components can be installed on the server motherboard through vertical slots to achieve function expansion and data storage.

[0027] As an example, a PCIe expansion card (Peripheral Component Interconnect Express, PCI Express expansion card) is a high-speed serial computer expansion bus standard for computer systems, widely used in servers, desktops, and embedded systems. A PCIe expansion card can be connected to the motherboard through a PCIe slot to expand the functions of a computer, such as increasing graphics processing capabilities, network connection capabilities, storage expansion capabilities, etc. The application of PCIe expansion cards in server products is very extensive, including GPU cards, graphics cards, network cards, etc. Server products usually carry a relatively large number of PCIe cards. Especially in the GPU BOX products in the field of AI, 8 double-slot or 16 single-slot GPU cards will be installed.

[0028] However, during the actual assembly process, problems such as the deviation of the center point of the position and the inclined insertion of the above-mentioned vertically inserted side-by-side components are likely to occur, resulting in mechanical stress. This mechanical stress may cause phenomena such as slot deformation and poor contact of the gold fingers, which in turn may lead to abnormal communication data (such as speed reduction, bandwidth reduction, inability to communicate, etc.) and hardware damage problems, seriously affecting the product stability and service life. Therefore, a solution capable of releasing and reducing the aforementioned mechanical stress is needed to improve the manufacturing quality and working stability of the product.

[0029] Figure 1A The application scenario diagram of the vertically inserted side-by-side components according to an embodiment of the present invention is shown.

[0030] Taking the PCIe card as an example, Figure 1A The application scenario of the vertically inserted side-by-side components is exemplarily shown. For example, it may include a backplane 101a and multiple PCIe cards 102a for vertical side-by-side installation.

[0031] As Figure 1A shown, at least one PCIe slot 103a can be integrated on the backplane 101a, and its gold finger contacts are used for electrical matching with the gold finger interface at the bottom of the PCIe card 102a. At least one vertical guide structure 104a can be provided on the side of the backplane 101a, and the guide structure 104a is used for physical limitation of the PCIe card 102a. This vertical side-by-side installation structure allows multiple PCIe cards 102a (such as 4 GPU cards) to be densely deployed within the limited chassis depth.

[0032] Exemplarily, when installing the PCIe card 102a (such as a GPU acceleration card), the gold finger area at the bottom of the PCIe card 102a needs to be accurately aligned from top to bottom along the guide structure 104a, so that the PCIe card 102a is perpendicular to the backplane 101a. Then insert it smoothly into the PCIe slot 103a until the slot buckle is locked.

[0033] Figure 1B The schematic diagram of the pose deviation of the GPU card assembly position according to the related embodiment is shown.

[0034] Taking the GPU card as an example, as Figure 1B shown, due to its large weight and size, problems such as the deviation of the center point of the position and the inclined insertion are more likely to occur during assembly, resulting in mechanical stress problems. The skewed GPU card may cause poor contact with the slot, affecting the stability and reliability of PCIe communication, and may even cause system failures. In addition, the skewed GPU card will also apply additional mechanical stress to the slot, and long-term use may cause slot deformation, component damage, and even affect the structural stability of the entire server.

[0035] For the aforementioned mechanical stress issue, using PCIe cards as an example, solutions include improving the manufacturing precision of chassis components to reduce tolerances after PCIe card assembly. By increasing the manufacturing precision requirements for chassis, boards, guide rails, and other related components, and adding high-precision guide mechanisms, the cumulative dimensional tolerances of the assembled components can be minimized. This, in turn, reduces the degree of skew insertion and center point offset of the PCIe card, thereby reducing mechanical stress.

[0036] Although the above solutions can alleviate the mechanical stress problem to a certain extent, they still have some shortcomings, such as:

[0037] 1. High design complexity: It takes a lot of effort to design the coordination between the mechanical structure and the PCBA board to achieve the optimal high-precision assembly method. At the same time, it is necessary to add high-precision positioning structures and guide structures, which increases the complexity and cost.

[0038] 2. High process requirements: It requires advanced structural parts manufacturing technology and is difficult to mass produce.

[0039] 3. Poor flexibility: The size and angle of high-precision guides and guide rails are difficult to adjust and cannot accommodate PCIe cards of different sizes and weights.

[0040] 4. Limited effect: Although it can reduce some stress, it still cannot avoid the board position deviation and mechanical stress caused by improper operation of the assembly workers.

[0041] In view of this, embodiments of the present invention provide a posture adjustment device, method, server, medium, and program product for a circuit module assembly, wherein the aforementioned circuit module assembly includes multiple circuit modules arranged at intervals, and the multiple circuit modules are arranged on a substrate. For example, the circuit modules may include PCIe cards, memory sticks, hard drives, and other circuit modules that support side-by-side vertical insertion, and the substrate may be, for example, a server motherboard. Exemplarily, the multiple circuit modules can be vertically inserted on the substrate.

[0042] Figure 2 Shown are a posture adjustment device, a circuit module assembly and a substrate according to an embodiment of the present invention.

[0043] like Figure 2 As shown in Figure 1 (side view), the circuit module assembly includes multiple circuit modules (such as PCIe cards), which are arranged in a spaced manner on the substrate S1. For example, multiple PCIe cards can be vertically inserted into a server motherboard.

[0044] like Figure 2 As shown, the posture adjustment device includes a first posture adjustment module 201, a second posture adjustment module 202 and a driving module ( Figure 2(not shown in the figure). The first pose adjustment module 201 is used to adjust or fix the assembly pose of a plurality of circuit modules in the first direction when inserted into a plurality of intervals D1 defined by the plurality of circuit modules, and the first direction is perpendicular to the installation direction of the plurality of circuit modules. The second pose adjustment module 202 is used to adjust or fix the assembly pose of the plurality of circuit modules in the second direction when arranged across the top surface of the plurality of circuit modules away from the substrate S1, and the second direction is parallel to the installation direction of the plurality of circuit modules.

[0045] For example, a plurality of PCIe cards can be vertically inserted into the server motherboard, and the installation direction of the PCIe cards is the vertical direction. A plurality of intervals are defined between the plurality of PCIe cards and between the plurality of PCIe cards and the chassis. The first pose adjustment module can be inserted into the aforementioned plurality of intervals so as to be able to adjust or fix the assembly pose of the plurality of PCIe cards in the horizontal direction. For example, the first pose adjustment module can push / correct the assembly pose of the plurality of PCIe cards in the horizontal direction and can fix the plurality of PCIe cards in the correct assembly pose in the horizontal direction.

[0046] The first pose adjustment module can be inserted into the plurality of intervals defined by the plurality of circuit modules. This design can enable each circuit module to be uniformly stressed and have a consistent pose in the first direction, and further can effectively adjust each circuit module to the correct assembly pose in the first direction, completely releasing the mechanical stress generated when the circuit module is assembled with skew.

[0047] For example, a second pose adjustment module can be provided on the top surface of the plurality of PCIe cards away from the substrate. The second pose adjustment module straddles the leftmost and rightmost ends of the plurality of PCIe cards so as to be able to adjust or fix the assembly pose of the plurality of PCIe cards in the vertical direction. For example, the second pose adjustment module can press / correct the assembly pose of the plurality of PCIe cards in the vertical direction and can fix the plurality of PCIe cards in the correct assembly pose in the vertical direction.

[0048] The second pose adjustment module is arranged in a spanning manner, which can ensure that the poses of the plurality of circuit modules are consistent in the second direction. This design not only provides an overall fixing function but also can uniformly adjust the entire circuit module assembly.

[0049] The driving module is respectively connected to the first pose adjustment module and the second pose adjustment module. The driving module can be used to drive the first pose adjustment module to adjust or fix the assembly pose of the plurality of circuit modules in the first direction; and / or to drive the second pose adjustment module to adjust or fix the assembly pose of the plurality of circuit modules in the second direction.

[0050] As an example, the driving module can drive the first pose adjustment module to move in the horizontal direction so that the first pose adjustment module can adjust or fix the assembly poses of multiple PCIe cards in the horizontal direction. As another example, the driving module can drive the second pose adjustment module to move in the vertical direction so that the second pose adjustment module can adjust or fix the assembly poses of multiple PCIe cards in the vertical direction.

[0051] In one embodiment, a BMC (Baseboard Management Controller) can be used to control the pose adjustment device. The BMC is a dedicated controller commonly found in devices such as servers, responsible for monitoring and managing hardware states, such as temperature, voltage, fan speed, etc., and providing remote management functions. For example, the driving module can be connected to the BMC, and the BMC can control the driving module to achieve the control of the first pose adjustment module and / or the second pose adjustment module.

[0052] In one embodiment, the driving module can be configured to: in response to a control instruction from the baseboard management controller, drive the first pose adjustment module to adjust or fix the assembly poses of multiple circuit modules in the first direction; and / or in response to a control instruction from the baseboard management controller, drive the second pose adjustment module to adjust or fix the assembly poses of multiple circuit modules in the second direction. As an example, in response to a control instruction from the BMC, the driving module can drive the first pose adjustment module to adjust or fix the assembly poses of multiple PCIe cards in the horizontal direction. As another example, in response to a control instruction from the BMC, the driving module can drive the second pose adjustment module to adjust or fix the assembly poses of multiple PCIe cards in the vertical direction.

[0053] According to an embodiment of the present invention, the first pose adjustment module can be inserted into multiple intervals defined by multiple circuit modules. The first pose adjustment module can adjust or fix the assembly poses of multiple circuit modules in the first direction to release the mechanical stress generated when the circuit modules are assembled with skew. The second pose module can be disposed across the top surfaces of multiple circuit modules. The second pose adjustment module can adjust or fix the assembly poses of multiple circuit modules in the second direction to ensure that multiple circuit modules are fully inserted. The driving module can drive the first pose adjustment module and / or the second pose adjustment module. Control instructions can be sent to the driving module through the BMC to control the driving module to drive the first pose adjustment module and / or the second pose adjustment module, thereby realizing the automatic adjustment of the assembly poses of the circuit module components.

[0054] According to an embodiment of the present invention, the first pose adjustment module includes a plurality of first pose adjustment units, and the plurality of first pose adjustment units are respectively inserted into a plurality of intervals defined by a plurality of circuit modules, so that each side of each circuit module is provided with a first pose adjustment unit; the second pose adjustment module includes a second pose adjustment unit, and the length of the second pose adjustment unit is adapted to the sum of the widths of the plurality of circuit modules in the first direction.

[0055] In one embodiment, the length range of the first pose adjustment unit can be 70% to 100% of the length of a single circuit module in the third direction, and the third direction is perpendicular to both the first direction and the second direction. The length range of the second pose adjustment unit can be 80% to 100% of the sum of the widths of the plurality of circuit modules in the first direction.

[0056] In one example, 8 GPU cards can be assembled side by side and vertically in a chassis from left to right, and the 8 GPU cards define a total of 9 intervals. For example, the first pose adjustment module can include 9 first pose adjustment units, and these 9 first pose adjustment units can be respectively inserted into the aforementioned 9 intervals, so that each side of each GPU card is provided with a first pose adjustment unit. For each GPU card, the first pose adjustment units on both sides thereof can adjust or fix the assembly pose of the GPU card in the left-right direction. For example, the second pose adjustment module can include a second pose adjustment unit, and the second pose adjustment unit can be arranged across the top of the 8 GPU cards, and the length of the second pose adjustment unit is adapted to the sum of the widths of the 8 GPU cards in the left-right direction, and the second pose adjustment unit can adjust or fix the assembly pose of the 8 GPU cards in the up-down direction.

[0057] According to an embodiment of the present invention, the first pose adjustment unit includes a first airbag, and the second pose adjustment unit includes a second airbag. Among them, the plurality of first airbags are interconnected. The first airbag is used to form a set of clamping structures between adjacent two first airbags when the air pressure inside the plurality of first airbags all meets the first preset condition, and the clamping structure is used to hold the circuit module located inside the clamping structure in the target horizontal pose. The first airbag is also used to form a set of fixing structures between adjacent two first airbags when the air pressure inside the plurality of first airbags all meets the second preset condition, and the fixing structure is used to fix the target circuit module relative to the substrate in the first direction in the target horizontal pose. The second airbag is used to press against the top surfaces of the plurality of circuit modules and hold the plurality of circuit modules in the target vertical pose when the air pressure inside the second airbag meets the third preset condition; the second airbag is also used to press against the top surfaces of the plurality of circuit modules and fix the plurality of circuit modules relative to the substrate in the second direction in the target vertical pose when the air pressure inside the second airbag meets the fourth preset condition.

[0058] Figure 3The schematic diagram of the pose adjustment device according to an embodiment of the present invention is shown.

[0059] As Figure 3 (Top view perspective) shown, a plurality of first airbags can be respectively inserted into a plurality of intervals defined by a plurality of circuit modules (such as GPU cards), so that one first airbag is provided on both sides of each circuit module. The second airbag can be arranged across the top surface of the plurality of circuit modules away from the substrate. Among them, the plurality of first airbags communicate with each other, so the internal pressure values and inflation pressures of the plurality of first airbags are the same.

[0060] As an example, as Figure 3 shown, one first airbag is provided on each of the left and right sides of each GPU card. It can be understood that if the plurality of first airbags are inflated, their volumes will increase, so that the GPU cards on both sides of the first airbags can be pushed horizontally, thereby correcting the assembly skew of the GPU cards; on this basis, if the plurality of first airbags are continuously inflated, their internal inflation pressures will increase, so that the GPU cards can be fixed in the horizontal direction, thereby fixing the GPU cards in the correct horizontal pose.

[0061] For example, when the air pressure inside each first airbag satisfies the first preset condition, two adjacent first airbags can form a clamping structure, and this clamping structure can hold the GPU card located inside the clamping structure in the target horizontal pose. For example, when the air pressure inside each first airbag satisfies the second preset condition, two adjacent first airbags can form a fixing structure, and this fixing structure can fix the GPU card located inside the fixing structure relative to the substrate in the horizontal direction in the target horizontal pose.

[0062] As an example, as Figure 3 shown, a second airbag is provided on the top of multiple GPU cards. Optionally, the number of second airbags can be one or more. It can be understood that if the second airbag is inflated, its volume will increase, so that the multiple GPU cards below the second airbag can be uniformly pressed vertically, thereby ensuring that the multiple GPU cards are completely inserted; on this basis, if the second airbag is continuously inflated, its internal inflation pressure will increase, so that the multiple GPU cards can be fixed in the vertical direction, thereby fixing the multiple GPU cards in the correct vertical pose.

[0063] For example, when the air pressure inside the second airbag satisfies the third preset condition, the second airbag can press against the top surface of the multiple GPU cards and hold the multiple GPU cards in the target vertical pose. For example, when the air pressure inside the second airbag satisfies the fourth preset condition, the second airbag can press against the top surface of the multiple GPU cards and fix the multiple GPU cards relative to the substrate in the vertical direction in the target vertical pose.

[0064] Those skilled in the art can set reasonable first preset conditions, second preset conditions, third preset conditions and fourth preset conditions according to actual needs or application scenarios, and no specific limitations are made here.

[0065] According to one embodiment of the present invention, the posture correction device can realize the simple and effective automatic release of the assembly stress of the PCIe card. By filling multiple first airbags in multiple gaps of multiple vertically inserted PCIe cards, the pressure after the first airbags are expanded can push and correct the offset PCIe card in the horizontal direction, and can also fix the PCIe card in the correct horizontal posture. Since the multiple first airbags are connected, their internal pressure values and expansion pressures are the same, so that each PCIe card can be balanced in the horizontal direction and have the correct assembly posture, thereby completely releasing the mechanical stress generated during assembly deviation. Furthermore, by arranging a second airbag on the top of multiple vertically inserted PCIe cards, the pressure after the second airbags are expanded can push the PCIe card in the vertical direction so that it is fully inserted into the PCIe slot, and can also fix the PCIe card in the correct vertical posture. Since the length of the second airbag is adapted to the total width of the multiple vertically inserted PCIe cards in the horizontal direction, each PCIe card can be balanced in the vertical direction and have the correct assembly posture.

[0066] In one embodiment, the posture correction device provided by the embodiment of the present invention can automatically release the stress of GPU card assembly, significantly improve the stability of the GPU card during installation and use, extend the service life of the equipment, and reduce maintenance costs. Its beneficial effects may include at least:

[0067] 1. Simplify the installation process: No complex support structure is required, and stress relief can be achieved by simply filling the airbag, which greatly reduces the difficulty and cost of installation.

[0068] 2. Improve stability: The airbag can automatically adjust the pressure to make the GPU card evenly stressed, effectively avoiding the problems of slot deformation and poor contact of gold fingers caused by uneven stress.

[0069] 3. Strong adaptability: The device is suitable for GPU cards of various sizes and weights, and has high versatility and flexibility.

[0070] 4. Improve production yield: This device can effectively reduce position deviation during GPU card assembly, reduce communication problems caused by assembly, and improve product production yield.

[0071] According to an embodiment of the present invention, the driving module includes a gas supply module, and the gas supply module includes an air pump, a first valve, and a second valve. Among them, the air pump is used to provide gas, and both the first valve and the second valve are used to discharge gas; the first pose adjustment module further includes an air pipe, the first end of the air pipe is respectively connected to the first valve and the first inflation port of the air pump, and the second end of the air pipe is respectively communicated with a plurality of first air bags; one end of the second air bag close to the air pump is respectively connected to the second valve and the second inflation port of the air pump.

[0072] In one embodiment, the air pump can be selected as an inflation pump, for example, which supports 2 inflation interfaces (the first inflation port and the second inflation port respectively). The BMC can be connected to the air pump to control the inflation or stop inflation of the first inflation port and / or the second inflation port.

[0073] Exemplarily, the first valve and the second valve can be selected as exhaust valves. The BMC can be respectively connected to the first valve and the second valve to control the exhaust or stop exhaust of the first valve and / or the second valve.

[0074] In one embodiment, the first pose adjustment module further includes an air pipe, the first end of the air pipe is respectively connected to the first inflation port and the first exhaust valve, and the second end of the air pipe is respectively communicated with a plurality of first air bags. For example, gas can enter the air pipe through the first inflation port of the air pump and then enter a plurality of first air bags respectively, and the air pipe can enable the plurality of first air bags to be inflated evenly. For example, gas can be discharged from the plurality of first air bags through the air pipe and the first valve respectively, and the air pipe can enable the plurality of first air bags to be exhausted evenly. Based on this, the use of the air pipe can ensure that the internal air pressure and expansion pressure of the plurality of first air bags are consistent, so as to achieve the force balance of each circuit module in the horizontal direction and the correct assembly pose.

[0075] In one embodiment, one end of the second air bag close to the air pump can be respectively connected to the second inflation port and the second exhaust valve. For example, gas can enter the second air bag through the second inflation port of the air pump. For example, gas can be discharged from the second air bag through the second valve.

[0076] According to an embodiment of the present invention, the gas supply module further includes a first barometer and a second barometer. The first barometer is used to sense the air pressure inside the plurality of first air bags, and the second barometer is used to sense the air pressure inside the second air bag.

[0077] In one embodiment, the air pump can be selected as a small inflation pump integrated with a pressure sensor. The air pump can include a first barometer and a second barometer, for example. For example, the first barometer can be used to sense the air pressure inside each first air bag, and the second barometer can be used to sense the air pressure inside the second air bag.

[0078] As an example, the BMC can monitor the air pressures inside the first airbag and the second airbag through the first barometer and the second barometer, and further control the inflation pump to inflate or control the exhaust valve to exhaust based on the airbag pressures. For example, when the BMC determines through the barometer that the airbag pressure reaches a preset value, the BMC can control the inflation pump to stop inflating. For example, when the BMC determines through the barometer that the airbag pressure exceeds a preset threshold, the BMC can control the exhaust valve to exhaust.

[0079] According to an embodiment of the present invention, both the first airbag and the second airbag are made of an elastic material; the plurality of first airbags are configured to allow gas to be respectively filled into the plurality of first airbags through the ventilation pipe, or allow gas to be discharged from the plurality of first airbags through the ventilation pipe; the second airbag is configured to allow gas to be filled into the second airbag through the second inflation port, or allow gas to be discharged from the second airbag through the second valve.

[0080] For example, the production materials of the first airbag and the second airbag can be selected as silicone rubber, which not only has excellent high-temperature resistance performance, but also has good elasticity and wear resistance, ensuring the reliability of long-term use.

[0081] Figure 4 [[ID=I0]]A pose adjustment device and a baseboard management controller according to an embodiment of the present invention are shown.

[0082] In one embodiment, as Figure 4 shown, the first airbag can be assembled on the GPU rail of the front window, for example. All the first airbags can be respectively connected to the ventilation pipe through a hose, and the ventilation pipes are respectively connected to the first valve and the first inflation port of the inflation pump. The second airbag can be assembled on the cross beam, for example, and one end of the second airbag can be directly connected to the second valve and the second inflation port of the inflation pump.

[0083] As an example, the BMC can monitor the first air pressure value of each first airbag through the first barometer, and control the first inflation port to inflate the plurality of first airbags based on the first air pressure value, or control the first valve to exhaust the plurality of first airbags based on the first air pressure value. For example, the BMC can control the first inflation port to open, and gas can be respectively filled into the plurality of first airbags through the ventilation pipe, and the plurality of first airbags expand respectively. For example, the BMC can control the first valve to open, and gas can be respectively discharged from the plurality of first airbags through the ventilation pipe, and the plurality of first airbags contract respectively.

[0084] As an example, the BMC can monitor the second air pressure value of the second airbag through a second barometer, and control the second inflation port to inflate the second airbag based on the second air pressure value, or control the second valve to exhaust the second airbag based on the second air pressure value. For example, the BMC can control the second inflation port to open, and gas can be filled into the second airbag through the second inflation port, causing the second airbag to expand. For example, the BMC can control the second valve to open, and gas can be discharged from the inside of the second airbag through the second valve, causing the second airbag to contract.

[0085] According to an embodiment of the present invention, the air pump is configured to: in response to a first inflation instruction from the baseboard management controller, provide gas to the ventilation pipe through the first inflation port; or in response to a second inflation instruction from the baseboard management controller, provide gas to the second airbag through the second inflation port; the first valve is configured to: in response to a first exhaust instruction from the baseboard management controller, discharge the gas in the ventilation pipe; the second valve is configured to: in response to a second exhaust instruction from the baseboard management controller, discharge the gas in the second airbag.

[0086] For example, in response to a first inflation instruction from the BMC, the air pump can provide gas to the ventilation pipe through the first inflation port, enabling the gas to uniformly enter multiple first airbags through the ventilation pipe. For example, in response to a second inflation instruction from the BMC, the air pump can provide gas to the second airbag through the second inflation port, enabling the gas to enter the second airbag.

[0087] For example, in response to a first exhaust instruction from the BMC, the first valve can open, enabling the gas to be uniformly discharged from multiple first airbags through the exhaust pipe and the first valve. For example, in response to a second exhaust instruction from the BMC, the second valve can open, enabling the gas to be discharged from the second airbag through the second valve.

[0088] An embodiment of the present invention also provides a posture adjustment method for a circuit module assembly, which is applied to the posture adjustment device as described above.

[0089] Figure 5 A flowchart of a posture adjustment method according to an embodiment of the present invention is shown.

[0090] As Figure 5 shown, the posture adjustment method 500 may include operations S510 to S530.

[0091] In operation S510, in response to a first target control instruction from the baseboard management controller, the driving module drives the first posture adjustment module so that the first posture adjustment module holds multiple circuit modules in a target horizontal posture.

[0092] In operation S520, in response to a second target control instruction from the baseboard management controller, the driving module drives the second pose adjustment module to keep the plurality of circuit modules in the target vertical pose and fix the plurality of circuit modules in the target vertical pose relative to the substrate in the second direction.

[0093] In operation S530, in response to a third target control instruction from the baseboard management controller, the driving module drives the first pose adjustment module to fix the plurality of circuit modules in the target horizontal pose relative to the substrate in the first direction.

[0094] In one embodiment, taking the application scenario of vertically inserting multiple GPU cards side by side into a server chassis as an example, the working method of the pose adjustment device can be as follows:

[0095] First, the GPU card is inserted downward from above the chassis into the guiding track, which only plays a role of low-precision guiding at this time to facilitate the GPU card to continue moving downward.

[0096] Then, the lowermost end of the baffle is inserted into the guiding slot below the chassis, and this guiding slot structure only plays a role of low-precision guiding. Then the GPU card continues to be inserted downward, and the gold fingers are inserted into the backplane PCIE slot. Until the hook above the PCIe board baffle touches the structural beam, stop inserting downward. At this time, the GPU card reaches the appropriate assembly position in the vertical direction, and there are low-precision guiding tracks and bottom guiding slots in other directions to limit its movement range.

[0097] After the pose adjustment device is powered on and started, the assembly correction process can be started through the BMC control interface.

[0098] In the first step, the BMC controls the first inflation port of the air pump to start, inflating a plurality of first airbags. After the plurality of first airbags expand, they push the GPU card to the left or right, automatically and evenly adjusting the horizontal position of the GPU card. At this time, the left and right sides of the GPU card are evenly stressed, and the card spacing is almost the same, and almost no structural stress is generated. When the pressure of the first airbag reaches 1 / 2 of the target value pressure (at this time, the air pressure is 1 Psi), stop inflating. At this time, the GPU card has completed the position adjustment in the horizontal direction and is in the best horizontal installation position. Since the horizontal pressure does not reach the fixing effect of the GPU card, it can still move in the vertical direction so that the vertical position of the GPU card can be adjusted after the second airbag at the top of the GPU card expands.

[0099] In the second step, the BMC controls the second inflation port of the air pump to start, inflating the second airbag. The second airbag above the GPU card is inflated to the target pressure value of 2 Psi. After the second airbag expands, it fills the space between the cross beam and the GPU card, fixing the GPU card in the vertical direction.

[0100] In the third step, the BMC controls the start of the first inflation port of the inflation pump and continues to inflate multiple first airbags to the target pressure value of 2 Psi. After the multiple first airbags expand, they fill the gaps on both sides of each GPU card, fixing the GPU card in the horizontal direction.

[0101] So far, the automatic adjustment, stress release, and fixing operations of the assembly position of the GPU card are completed. Based on the automated inflation / deflation and air pressure monitoring mechanism, it can ensure that each GPU card is uniformly stressed and has a correct position and pose. Based on the integrated software and hardware comprehensive solution, it can effectively reduce the stress during the assembly process of the GPU card.

[0102] Figure 6 The flowchart of the position and pose adjustment method according to another embodiment of the present invention is shown.

[0103] As Figure 6 shown, the method 600 includes operations S610 to S630.

[0104] In operation S610, in response to the first control being triggered, a first target control instruction is sent to the position and pose adjustment device for the circuit module component to hold the circuit module component in the target horizontal position and pose.

[0105] In operation S620, in response to the second control being triggered, a second target control instruction is sent to the position and pose adjustment device to hold the circuit module component in the target vertical position and pose, and fix the circuit module component in the target vertical position and pose relative to the substrate in the second direction, where the second direction is parallel to the installation direction of the circuit module component.

[0106] In operation S630, in response to the third control being triggered, a third target control instruction is sent to the position and pose adjustment device to fix the circuit module component in the target horizontal position and pose relative to the substrate in the first direction, where the first direction is perpendicular to the installation direction of the circuit module component.

[0107] In one embodiment, the user can trigger various control instructions based on the BMC control interface to implement operations such as position and pose adjustment, stress release, and fixing of multiple PCIe cards.

[0108] For example, the user can set the target air pressure value through the BMC control interface and monitor the air pressure status of the first airbag and the second airbag.

[0109] For example, the user can trigger the first control through the BMC control interface. In response to the first control being triggered, the BMC can send a first target control instruction to the position and pose adjustment device for the circuit module component to hold the circuit module component in the target horizontal position and pose.

[0110] For example, the user can trigger the second control through the BMC control interface. In response to the triggering of the second control, the BMC can send a second target control instruction to the pose adjustment device to maintain the circuit module assembly in the target vertical pose and fix the circuit module assembly in the target vertical pose relative to the substrate in the second direction, where the second direction is parallel to the installation direction of the circuit module assembly.

[0111] For example, the user can trigger the third control through the BMC control interface. In response to the triggering of the third control, the BMC sends a third target control instruction to the pose adjustment device to fix the circuit module assembly in the target horizontal pose relative to the substrate in the first direction, where the first direction is perpendicular to the installation direction of the circuit module assembly.

[0112] Optionally, the first control, the second control, and the third control can also be combined into one control. The user can complete operations S610 to S630 with one key by triggering this control.

[0113] According to an embodiment of the present invention, the pose adjustment device includes a second airbag and a plurality of first airbags. The plurality of first airbags are used to adjust and fix the assembly pose of the circuit module assembly in the horizontal direction, and the second airbag is used to adjust and fix the assembly pose of the circuit module assembly in the vertical direction. The pose adjustment method further includes: obtaining first air pressure data regarding the plurality of first airbags and second air pressure data regarding the second airbag; in the case where the first air pressure data is less than a first preset threshold, sending a first inflation instruction to cause each of the plurality of first airbags to expand and fix the circuit module assembly in the target horizontal pose relative to the substrate in the first direction; in the case where the second air pressure data is less than a second preset threshold, sending a second inflation instruction to cause the second airbag to expand and fix the circuit module assembly in the target vertical pose relative to the substrate in the second direction; in the case where the first air pressure data is greater than a third preset threshold, sending a first exhaust instruction to cause each of the plurality of first airbags to contract and fix the circuit module assembly in the target horizontal pose relative to the substrate in the first direction; in the case where the second air pressure data is greater than a fourth preset threshold, sending a second exhaust instruction to cause the second airbag to contract and fix the circuit module assembly in the target vertical pose relative to the substrate in the second direction.

[0114] In one embodiment, the BMC can obtain the first air pressure data regarding the plurality of first airbags and the second air pressure data regarding the second airbag. For example, the BMC can regularly (such as once every 1S) read the air pressure values at the first inflation port and the second inflation port.

[0115] In one example, based on the first air pressure data and the second air pressure data, the BMC can dynamically adjust the airbag pressure according to actual requirements to ensure the best stress distribution. For example, when the first air pressure data is less than the first preset threshold, the BMC can send a first inflation instruction to replenish air to multiple first airbags, so as to maintain the force for fixing the GPU card in the horizontal direction generated by the expansion of the multiple first airbags. For example, when the second air pressure data is less than the second preset threshold, the BMC can send a second inflation instruction to replenish air to the second airbag, so as to maintain the force for fixing the GPU card in the vertical direction generated by the expansion of the second airbag.

[0116] For example, when the first air pressure data is greater than the third preset threshold, the BMC can send a first exhaust instruction to avoid excessive air pressure inside the multiple first airbags. For example, when the second air pressure data is greater than the fourth preset threshold, the BMC can send a second exhaust instruction to avoid excessive air pressure inside the second airbag.

[0117] Those skilled in the art can set reasonable first preset threshold, second preset threshold, third preset threshold and fourth preset threshold according to actual requirements or application scenarios, etc., and no specific limitation is made here. For example, when the BMC reads the air pressure value lower than 90% of the set value for 10 consecutive times, the air replenishment and inflation operation is automatically started to maintain the force for fixing the GPU card generated by the expansion of the airbag.

[0118] In one embodiment, an exhaust button can be provided on the BMC control interface. After the user clicks the exhaust button, the BMC controls the exhaust valve to open to release the gas in the airbag, so as to repair and replace the GPU card. A gas replenishment button can be provided on the BMC control interface. After the user clicks the gas replenishment button, the BMC controls the air pump to start and inflate the airbag, and stops inflating after reaching the set air pressure value.

[0119] According to an embodiment of the present invention, the pose adjustment method further includes: in response to the fourth control being triggered, sending a third exhaust instruction to cause each of the multiple first airbags to contract, and sending a fourth exhaust instruction to cause the second airbag to contract; when the first air pressure data and the second air pressure data meet the pose correction condition, sequentially sending a first target control instruction, a second target control instruction and a third target control instruction.

[0120] In one embodiment, a stress release button can be provided on the BMC control interface. After the user clicks the stress release button, the BMC first controls the exhaust valve to release pressure and exhaust gas. When the set low pressure threshold is reached, it automatically calls the assembly correction process described above to perform a position correction and fixation for the GPU card again according to the assembly correction operation process, achieving the effect of releasing stress.

[0121] According to an embodiment of the present invention, the pose adjustment method further includes: sending an alarm notification when the bit error rate of the circuit module assembly is greater than or equal to a preset bit error rate threshold; and sending an alarm notification when the first exhaust command or the second exhaust command has not been sent within a preset duration, and the number of times the first air pressure data is less than the first preset threshold and / or the number of times the second air pressure data is less than the second preset threshold is greater than or equal to a preset number threshold.

[0122] In one embodiment, the BMC may support a communication anomaly detection function. For example, when the BMC detects that the bit error rate of the PCIe card is greater than or equal to a preset bit error rate threshold, it indicates that the communication of the circuit module is abnormal, then it is determined that the current circuit module assembly is abnormal. The BMC records it in the operation log and triggers an alarm, lights up the system alarm light and sends the alarm log to the background, and requests the management console for maintenance.

[0123] In one embodiment, the BMC may also support a leak detection function. For example, when the BMC detects that the airbag pressure value decreases frequently, such as the exhaust valve has not been opened within 1 hour, but the air pressure value decreases multiple times, and the air replenishment times during this period are greater than 3 times, it is determined that there is an abnormal leakage problem. The BMC records it in the operation log and triggers an alarm, lights up the system alarm light and sends the alarm log to the background, and requests the management console for maintenance.

[0124] An embodiment of the present invention also provides a server. Figure 7 The block diagram of the server according to an embodiment of the present invention is shown.

[0125] As Figure 7 shown, the server 700 may include a baseboard management controller 701, a circuit module assembly 702, and the pose adjustment device 703 as described above. Among them, the baseboard management controller 701 is used to implement the steps of the pose adjustment method applied to the baseboard management controller as described above.

[0126] The present invention also provides a computer-readable storage medium, which may be included in the device / device / system described in the above embodiments; or it may exist alone without being assembled into the device / device / system. The above computer-readable storage medium carries one or more programs, and when the one or more programs are executed, the method according to the embodiments of the present invention is implemented.

[0127] According to an embodiment of the present invention, the computer-readable storage medium may be a non-volatile computer-readable storage medium, for example, it may include but is not limited to: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above. In the present invention, the computer-readable storage medium may be any tangible medium that contains or stores a program, and this program can be used by or in combination with an instruction execution system, device, or apparatus.

[0128] An embodiment of the present invention further includes a computer program product, which includes a computer program that contains program code for executing the method shown in the flowchart. When the computer program product runs in a computer system, this program code is used to enable the computer system to implement the pose adjustment method provided by the embodiment of the present invention.

[0129] When this computer program is executed by a processor, it executes the above functions defined in the system / apparatus of the embodiment of the present invention. According to an embodiment of the present invention, the above-described systems, apparatuses, modules, units, etc. can be implemented by computer program modules.

[0130] In one embodiment, this computer program can rely on tangible storage media such as optical storage devices and magnetic storage devices. In another embodiment, this computer program can also be transmitted and distributed in the form of a signal on a network medium, and be downloaded and installed through the communication part, and / or be installed from a removable medium. The program code contained in this computer program can be transmitted by any suitable network medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0131] In such an embodiment, this computer program can be downloaded and installed from the network through the communication part, and / or be installed from a removable medium. When this computer program is executed by a processor, it executes the above functions defined in the system of the embodiment of the present invention. According to an embodiment of the present invention, the above-described systems, devices, apparatuses, modules, units, etc. can be implemented by computer program modules.

[0132] According to embodiments of the present invention, program code for executing the computer programs provided by the embodiments of the present invention can be written in any combination of one or more programming languages. Specifically, these computing programs can be implemented using high-level procedural and / or object-oriented programming languages, and / or assembly / machine languages. The programming languages include, but are not limited to, programming languages such as Java, C++, Python, the "C" language, or similar programming languages. The program code can be executed entirely on the user's computing device, partially on the user's device, partially on a remote computing device, or entirely on a remote computing device or server. In the case of a remote computing device, the remote computing device can be connected to the user's computing device through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computing device (e.g., by connecting through the Internet using an Internet service provider).

[0133] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code that contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than that marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram or flowchart, and the combination of blocks in the block diagram or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0134] In the above description of the present invention, unless otherwise clearly specified and defined, terms such as "fixed", "installed", "connected", or "coupled" should be understood in a broad sense. For example, with respect to the term "connected", it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements. Therefore, unless otherwise clearly defined in the present invention, those skilled in the art can understand the specific meanings of the above terms in the present invention according to specific circumstances.

[0135] Based on the above description of the present invention, those skilled in the art can also understand the terms used as follows. For example, terms indicating orientation or positional relationship such as "upper", "lower", "front", "rear", "left", "right", "length", "width", "thickness", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", "center", "longitudinal", "transverse", "clockwise" or "counterclockwise", etc. are based on the orientation or positional relationship shown in the drawings of the present invention. It is only for the purpose of facilitating the description of the solution of the present invention and simplifying the description, rather than explicitly or implicitly indicating that the device or element involved must have the specific orientation, be constructed and operate in the specific orientation. Therefore, the above terms of orientation or positional relationship cannot be understood or interpreted as a limitation to the solution of the present invention.

[0136] In addition, the terms "first" or "second" etc. used in the present invention to refer to numbers or ordinals are only for descriptive purposes and cannot be understood as explicitly or implicitly indicating relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three or more, etc., unless otherwise specifically defined.

[0137] Those skilled in the art can understand that the features described in the various embodiments of the present invention can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in the present invention. In particular, without departing from the spirit and teachings of the present invention, the features described in the various embodiments of the present invention can be combined and / or combined in various ways. All such combinations and / or combinations fall within the scope of the present invention.

[0138] The embodiments of the present invention have been described above. However, these embodiments are only for illustrative purposes and not for limiting the scope of the present invention. Although the embodiments have been described separately above, this does not mean that the measures in the respective embodiments cannot be used advantageously in combination. Without departing from the scope of the present invention, those skilled in the art can make various substitutions and modifications, and all such substitutions and modifications should fall within the scope of the present invention.

Claims

1. A pose adjustment device for a circuit module component, characterized in that The circuit module assembly includes a plurality of circuit modules arranged at intervals, and the plurality of circuit modules are disposed on a substrate. The pose adjustment device includes: A first pose adjustment module, configured to adjust or fix the assembly poses of the plurality of circuit modules in a first direction when inserted into the plurality of intervals defined by the plurality of circuit modules, where the first direction is perpendicular to the installation direction of the plurality of circuit modules; A second pose adjustment module, configured to adjust or fix the assembly poses of the plurality of circuit modules in a second direction when spanning the top surfaces of the plurality of circuit modules away from the substrate, where the second direction is parallel to the installation direction of the plurality of circuit modules; A driving module, configured to: in response to a control instruction from a baseboard management controller, drive the first pose adjustment module to adjust or fix the assembly poses of the plurality of circuit modules in the first direction; and / or in response to a control instruction from the baseboard management controller, drive the second pose adjustment module to adjust or fix the assembly poses of the plurality of circuit modules in the second direction.

2. The device according to claim 1, wherein The first pose adjustment module includes a plurality of first pose adjustment units, and the plurality of first pose adjustment units are respectively configured to be inserted into the plurality of intervals defined by the plurality of circuit modules, so that one of the first pose adjustment units is provided on each side of each circuit module; The second pose adjustment module includes a second pose adjustment unit, and the length of the second pose adjustment unit is adapted to the sum of the widths of the plurality of circuit modules in the first direction.

3. The device according to claim 2, wherein The first pose adjustment unit includes a first airbag, and the first airbag is configured to form a clamping structure by two adjacent first airbags when the air pressures inside the plurality of first airbags all meet a first preset condition, and the clamping structure is configured to hold the circuit module located inside the clamping structure in a target horizontal pose; the first airbag is further configured to form a fixing structure by two adjacent first airbags when the air pressures inside the plurality of first airbags all meet a second preset condition, and the fixing structure is configured to fix the target circuit module relative to the substrate in the first direction at the target horizontal pose; The second pose adjustment unit includes a second airbag, and the second airbag is configured to press against the top surfaces of the plurality of circuit modules and hold the plurality of circuit modules in a target vertical pose when the air pressure inside the second airbag meets a third preset condition; the second airbag is further configured to press against the top surfaces of the plurality of circuit modules and fix the plurality of circuit modules relative to the substrate in the second direction at the target vertical pose when the air pressure inside the second airbag meets a fourth preset condition.

4. The device according to claim 3, characterized in that, The driving module includes a gas supply module, and the gas supply module includes an air pump, a first valve, and a second valve. Among them, the air pump is used to supply gas, and both the first valve and the second valve are used to discharge gas; The first pose adjustment module further includes a ventilation pipe. The first end of the ventilation pipe is respectively connected to the first valve and the first inflation port of the air pump, and the second end of the ventilation pipe is respectively communicated with a plurality of the first air bags; One end of the second air bag close to the air pump is respectively connected to the second valve and the second inflation port of the air pump.

5. The device according to claim 4, characterized in that, Both the first air bag and the second air bag are made of elastic materials; A plurality of the first air bags are configured to: allow gas to be respectively filled into the plurality of the first air bags through the ventilation pipe, or allow gas to be discharged from the plurality of the first air bags through the ventilation pipe; The second air bag is configured to: allow gas to be filled into the second air bag through the second inflation port, or allow gas to be discharged from the second air bag through the second valve.

6. The device according to claim 4, wherein The air pump is configured to: in response to a first inflation instruction from the baseboard management controller, supply gas to the ventilation pipe through the first inflation port; or in response to a second inflation instruction from the baseboard management controller, supply gas to the second air bag through the second inflation port; The first valve is configured to: in response to a first exhaust instruction from the baseboard management controller, discharge the gas in the ventilation pipe; The second valve is configured to: in response to a second exhaust instruction from the baseboard management controller, discharge the gas in the second air bag.

7. The device according to claim 4, characterized in that, The gas supply module further includes a first barometer and a second barometer. The first barometer is used to sense the air pressure inside the plurality of the first air bags, and the second barometer is used to sense the air pressure inside the second air bag.

8. A pose adjustment method for a circuit module component, characterized in that, Applied to the pose adjustment device according to any one of claims 1-7, the method includes: In response to a first target control instruction from the baseboard management controller, the driving module drives the first pose adjustment module so that the first pose adjustment module holds the plurality of circuit modules in a target horizontal pose; In response to a second target control instruction from the baseboard management controller, the driving module drives the second pose adjustment module so that the second pose adjustment module holds the plurality of circuit modules in a target vertical pose and fixes the plurality of circuit modules in the target vertical pose relative to the baseboard in the second direction; and In response to a third target control instruction from the baseboard management controller, the driving module drives the first pose adjustment module so that the first pose adjustment module fixes the plurality of circuit modules in the target horizontal pose relative to the baseboard in the first direction.

9. A pose adjustment method for a circuit module component, characterized in that Applied to a baseboard management controller, the circuit module assembly is disposed on a baseboard, and the method includes: In response to a first control being triggered, send a first target control instruction to the pose adjustment device for the circuit module assembly to hold the circuit module assembly in a target horizontal pose; In response to the triggering of the second control, send a second target control instruction to the pose adjustment device to hold the circuit module assembly in the target vertical pose and fix the circuit module assembly relative to the substrate in the target vertical pose in a second direction, where the second direction is parallel to the installation direction of the circuit module assembly; In response to the triggering of the third control, send a third target control instruction to the pose adjustment device to fix the circuit module assembly relative to the substrate in the target horizontal pose in a first direction, where the first direction is perpendicular to the installation direction of the circuit module assembly.

10. According to the method described in claim 9, the pose adjustment device includes a second airbag and a plurality of first airbags. The plurality of first airbags are used to adjust and fix the assembly pose of the circuit module assembly in the horizontal direction, and the second airbag is used to adjust and fix the assembly pose of the circuit module assembly in the vertical direction, characterized in that, The method further includes: Obtain first air pressure data regarding the plurality of first airbags and second air pressure data regarding the second airbag; When the first air pressure data is less than a first preset threshold, send a first inflation instruction to cause each of the plurality of first airbags to expand and fix the circuit module assembly relative to the substrate in the target horizontal pose in the first direction; When the second air pressure data is less than a second preset threshold, send a second inflation instruction to cause the second airbag to expand and fix the circuit module assembly relative to the substrate in the target vertical pose in the second direction; When the first air pressure data is greater than a third preset threshold, send a first exhaust instruction to cause each of the plurality of first airbags to contract and fix the circuit module assembly relative to the substrate in the target horizontal pose in the first direction; When the second air pressure data is greater than a fourth preset threshold, send a second exhaust instruction to cause the second airbag to contract and fix the circuit module assembly relative to the substrate in the target vertical pose in the second direction.

11. The method according to claim 10, characterized in that, The method further includes: In response to the triggering of the fourth control, send a third exhaust instruction to cause each of the plurality of first airbags to contract and send a fourth exhaust instruction to cause the second airbag to contract; When the first air pressure data and the second air pressure data meet the pose correction condition, sequentially send the first target control instruction, the second target control instruction, and the third target control instruction.

12. The method according to claim 10, characterized in that, The method further includes: When the bit error rate of the circuit module assembly is greater than or equal to a preset bit error rate threshold, send an alarm notification; When the first exhaust instruction or the second exhaust instruction has not been sent within a preset time period, and the number of times the first air pressure data is less than the first preset threshold and / or the number of times the second air pressure data is less than the second preset threshold is greater than or equal to a preset number threshold, send the alarm notification.

13. A server, characterized in that, Comprising a substrate management controller, a circuit module assembly, and the pose adjustment device according to any one of claims 1-7, wherein the substrate management controller is used to implement the steps of the method according to any one of claims 9-12.

14. A computer-readable storage medium having a computer program or instructions stored thereon, characterized in that, When the computer program or instruction is executed by a processor, it implements the steps of the method according to any one of claims 9-12.

15. A computer program product, comprising a computer program or instructions, characterized in that, When the computer program or instruction is executed by a processor, it implements the steps of the method according to any one of claims 9-12.

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