Computer heat dissipation device installed on computer case

Abstract

The invention relates to the field of computer heat dissipation, in particular to a computer heat dissipation device installed on a computer case, and solves the problems that heat dissipation holes are automatically cleaned, the heat dissipation efficiency is guaranteed, meanwhile, heat dissipation uniformity is guaranteed through multi-stage heat dissipation, and excessive or insufficient local heat dissipation is avoided, the computer heat dissipation device comprises a base and the case, and the case is fixedly installed at the top of the base. Under the action of the sliding heat dissipation plate, the heat dissipation area of the device can be increased, meanwhile, under the action of left-right displacement of the sliding heat dissipation plate and the broadening heat dissipation plate, uniform heat dissipation can be achieved, the phenomenon of local overheating or supercooling can be avoided, meanwhile, the displacement of the sliding heat dissipation plate of the device and water outlet of the water tank can form a linkage effect, and the device is convenient to use. According to the device, displacement can be carried out only when the device is started for heat dissipation, displacement when heat dissipation is needed is avoided, energy loss caused by idle movement is prevented, the linkage effect is achieved, meanwhile, multi-stage heat dissipation is achieved, and the phenomenon that heat dissipation is too much or too little is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of computer heat dissipation, and particularly relates to a computer heat dissipation device installed in a computer chassis. Background Art

[0002] With the rapid development of computer technology, the performance of computers has been continuously improved, and the integration degree and operating speed of their internal components have also become higher and higher. However, this has also brought a significant problem, that is, the heat generated by the computer during long-term operation has increased substantially. If these heats cannot be effectively dissipated, the temperature inside the computer will continue to rise, leading to a series of adverse consequences.

[0003] Existing computer heat dissipation devices have many limitations. On the one hand, after long-term use, a large amount of dust will adhere to the heat dissipation holes inside the chassis. The accumulation of dust will cause a large amount of heat generated by the components inside the chassis to be unable to be discharged in time, thus affecting the heat dissipation effect of the computer host. On the other hand, existing heat dissipation devices usually can only perform single-level heat dissipation, and it is difficult to accurately control the temperature according to the actual operating heat inside the chassis. This may lead to insufficient heat dissipation during high-load operation and local overheating; while during low-load operation, there may be overheating, resulting in energy waste.

[0004] Traditional heat dissipation devices often cannot ensure the uniformity of heat dissipation and are prone to local overheating. This will not only affect the overall performance and stability of the computer, but may also shorten the service life of the hardware.

[0005] Therefore, the present invention provides a computer heat dissipation device installed in a computer chassis to solve the above problems. Summary of the Invention

[0006] In view of the above situation, in order to overcome the deficiencies of the prior art, the present invention provides a computer heat dissipation device installed in a computer chassis to solve the problems that can automatically clean the heat dissipation holes, ensure the heat dissipation efficiency, and at the same time ensure the uniformity of heat dissipation through multi-level heat dissipation, and avoid the problems of excessive or insufficient local heat dissipation.

[0007] In order to achieve the above object, the technical solution adopted by the present invention is as follows: A computer heat dissipation device installed in a computer case, comprising a base and a case. The case is fixedly installed on the top of the base. A fixing plate is fixedly installed on the inner wall of the case. A sliding heat dissipation plate is slidably connected to the outer wall of the fixing plate. A widened heat dissipation plate is installed on the outer wall of the sliding heat dissipation plate. A scraping plate is installed on the outer wall of the widened heat dissipation plate. A blocking mechanism is installed on the inner top wall of the case; heat dissipation holes are formed in the interior of the case, and the heat dissipation holes are matched with the scraping plate. A heat dissipation prevention box is fixedly installed on the outer wall of the case, and the heat dissipation prevention box is drivingly connected to the sliding heat dissipation plate; a water tank is installed inside the base, and the water tank is matched with the sliding heat dissipation plate. A temperature detection sensor is installed on the inner side wall of the case, and the temperature detection sensor is controllably connected to the water tank; under the action of the sliding heat dissipation plate, the heat dissipation area of the device can be increased. At the same time, under the action of the left and right displacement of the sliding heat dissipation plate and the widened heat dissipation plate, uniform heat dissipation can be achieved, avoiding the phenomenon of overheating or overcooling in local areas. At the same time, the displacement of the sliding heat dissipation plate of the device can form a linkage effect with the water outlet of the water tank, realizing that displacement only occurs when the device starts to dissipate heat, avoiding displacement when heat dissipation is required, preventing energy loss due to empty displacement, achieving a linkage effect, and at the same time, the device has multi-stage heat dissipation, avoiding the phenomenon of excessive or insufficient heat dissipation.

[0008] Preferably, a U-shaped return pipe is installed inside the sliding heat dissipation plate. One end of the U-shaped return pipe is an outlet and the other end is an inlet. The U-shaped return pipe is hermetically connected to the water tank and fluidly conducts. The number of widened heat dissipation plates is multiple, and the multiple widened heat dissipation plates are evenly installed on the outer wall of the sliding heat dissipation plate. A widened U-shaped pipe is installed inside the widened heat dissipation plate. The widened U-shaped pipe is hermetically connected to the U-shaped return pipe and fluidly conducts; the water tank supplies water to the U-shaped return pipe of the device. At this time, heat dissipation is carried out on the interior of the case through the U-shaped return pipe and the widened U-shaped pipe, which can increase the heat dissipation area. After the cold water circulates through the pipeline, it takes away the heat inside the case. The pipeline of the device is attached to the side wall of the case to ensure the heat dissipation efficiency.

[0009] Preferably, a chute is formed on the inner wall of the fixed plate. A slider is fixedly installed on the outer wall of the sliding heat dissipation plate. Friction lines are arranged on the outer wall of the slider. The slider is slidably connected to the inside of the chute. An abutting liquid bag is installed at one end inside the chute. A diversion pipe is installed at the liquid inlet end of the abutting liquid bag. The other end of the diversion pipe is connected to the outlet end of the liquid outlet control box. The outlet end of the liquid outlet control box is hermetically connected to and in fluid communication with the water tank. The liquid outlet control box is fixedly installed on the inner bottom wall of the sliding heat dissipation plate. A push rod is slidably connected to the inner wall of the liquid outlet control box. The push rod matches the abutting block. The abutting block is fixedly installed on the inner bottom wall of the chassis. A liquid outlet pipe is installed at the liquid outlet end of the abutting liquid bag. The liquid outlet end of the liquid outlet pipe is connected to the U-shaped return pipe. A one-way valve is installed on the liquid outlet pipe. The direction of the one-way valve is from the abutting liquid bag to the U-shaped return pipe. A return spring is installed at the other end inside the chute. The other end of the return spring is fixedly connected to one end of the slider. A guiding inclined groove is formed inside the chute. The guiding inclined groove matches the slider. The diameter of the diversion pipe is larger than that of the liquid outlet pipe. When the device is initially used, it is detected by the temperature detection sensor. When the temperature rises, at this time, the water tank supplies water to the inside of the U-shaped return pipe. At the same time, the liquid outlet control box supplies water to the inside of the abutting liquid bag through the diversion pipe. At this time, the abutting liquid bag will expand inside the chute. Furthermore, the abutting liquid bag abuts against the sliding heat dissipation plate to displace, realizing the function of reciprocating and uniform heat dissipation. The water tank forms a closed loop with the U-shaped return pipe and the widened U-shaped pipe, realizing recycling and avoiding waste of water source. After being dissipated by the water tank, it can be recycled. At the same time, when supplying water, the abutting liquid bag can be inflated to realize the displacement of the sliding heat dissipation plate driven by water supply, realizing the function of automatic reciprocating and uniform heat dissipation. The diameter of the diversion pipe of this device is much larger than that of the liquid outlet pipe.

[0010] Preferably, the number of the sliding heat dissipation plates is two. The widened heat dissipation plates on the outer walls of the two sliding heat dissipation plates are staggered from each other. When the two sliding heat dissipation plates of this device are displaced, collision between the two plates can be avoided, ensuring the operation safety between them and improving the heat dissipation efficiency.

[0011] Preferably, the interior of the liquid outlet control box is sequentially divided into a sealing cavity, a liquid outlet cavity and a pressing cavity. A sealing plate is slidably connected to the interior of the liquid outlet control box in a sealed manner. The outer wall of the sealing plate located inside the sealing cavity is solid. An outlet groove is formed on the outer wall of the sealing plate located inside the liquid outlet cavity. A pressing spring is fixedly installed at one end of the sealing plate located inside the pressing cavity. The other end of the sealing plate is fixedly installed with the pressing rod. A diversion groove is formed on the inner bottom wall of the liquid outlet cavity. The diversion groove matches the liquid outlet cavity and is connected to the water tank. Friction lines are provided on the outer wall of the sealing plate; in the initial state of the device, the diversion groove is opposite to the outlet groove, so that the liquid outlet control box forms a conducting fluid channel. When the water tank supplies water, the water inside the water tank will enter the pressing liquid bladder through the liquid outlet control box, causing the pressing liquid bladder to push the sliding heat dissipation plate to displace. When the sliding heat dissipation plate moves to the innermost side, the slider will slide into the guiding inclined groove, causing the sliding heat dissipation plate to displace to the innermost side. At the same time, when the sliding heat dissipation plate is close to the innermost side during displacement, the pressing rod will press against the pressing block, causing the pressing rod to drive the sealing plate to displace. The sealing plate gradually displaces, and at this time the liquid outlet control box closes. The liquid inside the pressing liquid bladder flows out through the liquid outlet pipe. Under the action of the reset spring, the sliding heat dissipation plate is reset. At the same time, under the action of the friction lines of the slider, the sliding heat dissipation plate is slowly reset to achieve reciprocating heat dissipation; through the setting of the liquid outlet control box, the device can automatically push the sliding heat dissipation plate to reciprocate for heat dissipation when supplying water for heat dissipation. At the same time, during reciprocation, it can automatically close and open the water supply of the pressing liquid bladder. On the one hand, it can avoid the phenomenon that the water inside the pressing liquid bladder is too much and causes it to burst. On the other hand, it can automatically control the automatic reciprocating displacement of the sliding heat dissipation plate to achieve the function of automatic control. The reset of the sealing plate of the device is slow, which can avoid the conflict with the reset of the sliding heat dissipation plate and prevent the rapid filling and expansion of the inside of the pressing liquid bladder when it is just reset.

[0012] Preferably, a driving gear plate is fixedly installed on the side wall of the top of the sliding heat dissipation plate; an impeller is rotatably connected inside the anti-dispersion box, a reduction box is fixedly installed on the top of the anti-dispersion box, the large gear of the reduction box is meshed with the driving gear plate, and the small gear of the reduction box is drivingly connected with the impeller; a dust suction hole is formed in the side wall of the anti-dispersion box, a check valve plate is fixedly installed inside the anti-dispersion box, the check valve plate is located on the inner wall of the dust suction hole, and the width of the check valve plate gradually decreases from outside to inside; when the sliding heat dissipation plate slides in this device, the driving gear plate is driven to displace at this time, and the scraping plate is driven to displace. The scraping plate scrapes and cleans the heat dissipation holes, achieving the effect of automatic cleaning, avoiding the phenomenon of inability to dissipate heat caused by the blockage of the heat dissipation holes, automatically and regularly cleaning the heat dissipation holes, and driving the impeller to rotate rapidly under the action of the reduction box, which can suck dust. When cleaning the heat dissipation holes, the smaller dust adhering to the outer wall of the heat dissipation holes can be prevented from being raised and entering the interior of the chassis. On the premise of ensuring the cleaning effect, the dust can be collected to avoid the phenomenon of flying everywhere.

[0013] Preferably, the base includes a fixed column and a sliding column. A driving lead screw is rotatably connected inside the fixed column. A fixed threaded block is fixedly installed on the inner bottom wall of the sliding column. The fixed threaded block is threadedly connected to the outer wall of the driving lead screw. The sliding column is slidably connected inside the fixed column. There are multiple driving lead screws, and multiple driving lead screws are drivingly connected through a transmission belt. The transmission belt is connected to the output end of a driving motor, and the driving motor is electrically connected to the temperature detection sensor. An upper support plate is fixedly installed on the upper part of the side wall of the sliding column. Heat dissipation fins are fixedly installed on the bottom of the upper support plate. A rubber pad is fixedly installed on the side wall of the bottom of the upper support plate. The side wall of the rubber pad is fixedly connected to the side wall of the sliding column. Filter holes are formed in the outer wall of the rubber pad. A lower support plate is fixedly installed on the bottom of the rubber pad. The side wall of the lower support plate is fixedly connected to the side wall of the fixed column; a water pump is installed on the top of the water tank. The water outlet end of the water pump is connected to a U-shaped return pipe through a sealed hose. The water pump is electrically connected to the temperature detection sensor; in the initial state of this device, heat dissipation is carried out through the heat dissipation holes. When the temperature detection sensor detects abnormal temperature, the driving motor will be started at this time, so that the driving lead screw rotates to drive the sliding column to displace upward. At this time, the rubber pad is stretched. The rubber pad is in a compressed state in the initial state and can play a role in shock absorption, etc. After the rubber pad is stretched, the filter holes are opened, achieving a secondary heat dissipation effect on the chassis. When the temperature drops slightly, the water pump realizes the function of tertiary heat dissipation. The water pump drives the sliding heat dissipation plate to displace for heat dissipation. When the temperature continues to drop slowly, two sliding heat dissipation plates can be started to dissipate heat synchronously. At the same time, the filter holes dissipate heat from the water tank, realizing the function of multiple heat dissipations, ensuring uniform heat dissipation, and being able to be automatically controlled.

[0014] Preferably, the blocking mechanism includes a blocking box. A partition is fixedly installed inside the blocking box. A downward pressure spring is fixedly installed on the inner bottom wall of the blocking box. A conductive ball is installed at the bottom of the downward pressure spring. Both ends of the conductive ball abut against conductive wires. One end of the conductive wire is connected to a power source, and the other end is connected to the components of the chassis. The bottom of the conductive ball abuts against the top of a top extension rod. The bottom of the top extension rod abuts against the inner wall of a hinge plate. The hinge plate is hinged to the bottom of the blocking box. The number of hinge plates is two. A fusing material is provided at the bottom of the relatively-facing ends of the two hinge plates. The bottom of the partition is filled with a fire extinguishing material. In the initial state of the device, the top extension rod abuts upward and the downward pressure spring abuts downward. At this time, the conductive ball maintains a balanced state and abuts against the conductive wire to conduct electricity. When the temperature inside the chassis becomes extremely abnormal or too high, the fusing material melts at this time, and the fire extinguishing material is dumped to achieve fire extinguishing. At the same time, the conductive ball loses the abutting force of the top extension rod and displaces downward under the action of the downward pressure spring, and the conductive wire disengages, realizing the power-off function and automatic blocking, ensuring the safety of the device, and at the same time avoiding the phenomenon of affecting surrounding items when the chassis is abnormal. The fusing material of this device can be polyethylene wax, and the melting point of polyethylene wax is 90°C to 120°C. At the same time, the fusing material can also be paraffin wax, etc., as long as the melting point is within the range of 90°C to 120°C.

[0015] The beneficial effects of the present invention are as follows: 1. Under the action of the sliding heat dissipation plate, the heat dissipation area of the device can be increased. At the same time, under the left and right displacement of the sliding heat dissipation plate and the widened heat dissipation plate, uniform heat dissipation can be achieved, avoiding the phenomenon of overheating or overcooling in local areas. At the same time, the displacement of the sliding heat dissipation plate of the device can form a linkage effect with the water outlet of the water tank, realizing that displacement only occurs when the device starts to dissipate heat, avoiding displacement when heat dissipation is required, preventing energy loss due to empty displacement, achieving a linkage effect, and at the same time, multi-stage heat dissipation of the device avoids the phenomenon of excessive or insufficient heat dissipation.

[0016] 2. The device abuts against the liquid sac to displace the sliding heat dissipation plate, realizing the function of reciprocating and uniform heat dissipation. The water tank forms a closed loop by a U-shaped return pipe and a widened U-shaped pipe, realizing recycling and avoiding the waste of water source. After heat dissipation through the water tank, it can be recycled repeatedly. At the same time, when supplying water, it can expand to abut against the liquid sac to realize the displacement of the sliding heat dissipation plate driven by water supply, realizing the function of automatic reciprocating and uniform heat dissipation. When the two sliding heat dissipation plates of the device are displaced, they can avoid collision between the two plates, ensuring the operation safety between them and improving the heat dissipation efficiency.

[0017] 3. Through the setting of the liquid outlet control box, when the device conducts water supply for heat dissipation, it can automatically push and slide the heat dissipation plate for reciprocating heat dissipation. At the same time, during the reciprocation, it can automatically close and open the water supply to the abutting liquid bag. On the one hand, it can avoid the phenomenon that the water in the abutting liquid bag is too much and causes it to burst. On the other hand, it can automatically control the automatic reciprocating displacement of the sliding heat dissipation plate to achieve the function of automatic control. The sealing plate of the device resets slowly, which can avoid the conflict with the reset of the sliding heat dissipation plate and prevent the phenomenon that the inside of the abutting liquid bag is quickly filled with water and expands when it just resets.

[0018] 4. When the sliding heat dissipation plate of the device slides, it drives the driving gear plate to move at this time, and drives the scraping plate to move. The scraping plate scrapes and cleans the heat dissipation holes to achieve the effect of automatic cleaning, avoiding the phenomenon that heat dissipation cannot be carried out due to the blockage of the heat dissipation holes, and automatically regularly cleaning the heat dissipation holes. Driven by the speed reducer, the impeller rotates rapidly, which can suck dust, avoiding the smaller dust adhering to the outer wall of the heat dissipation holes from being lifted and entering the inside of the chassis when cleaning the heat dissipation holes, and being able to collect dust on the premise of ensuring the cleaning effect and avoiding the phenomenon of flying everywhere.

[0019] 5. The device dissipates heat through the heat dissipation holes in the initial state. When the temperature detection sensor detects abnormal temperature, the driving motor will be started at this time, causing the driving lead screw to rotate and drive the sliding column to move upward. At this time, the rubber pad is stretched. The rubber pad is in a compressed state in the initial state and can play a role in shock absorption, etc. After the rubber pad is stretched, the filter holes are opened, achieving a secondary heat dissipation effect on the chassis. When the temperature drops slightly, the water pump realizes the function of tertiary heat dissipation. The water pump drives the sliding heat dissipation plate to move for heat dissipation. When the temperature continues to drop slowly, two sliding heat dissipation plates can be started to dissipate heat synchronously. At the same time, the filter holes dissipate heat from the water tank, realizing the function of multiple heat dissipation, ensuring uniform heat dissipation, and being able to be automatically controlled.

[0020] 6. In the initial state of the device, the top extension rod abuts upward and the downward pressure spring abuts downward. At this time, the conductive ball maintains a balanced state and abuts against the conductive wire for conduction. When the temperature inside the chassis is too abnormal or high, the fusing material melts at this time and the fire extinguishing material is dumped to achieve fire extinguishing. At the same time, the conductive ball loses the abutting force of the top extension rod and moves downward under the action of the downward pressure spring, and the conductive wire disengages, realizing the function of power off, achieving automatic blocking, ensuring the safety of the device, and avoiding the phenomenon of affecting surrounding items when the chassis is abnormal. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the front three-dimensional view of the present invention; Figure 2 It is a schematic diagram of the cross-section of the chassis of the present invention; Figure 3Schematic cross - sectional view of the sliding heat dissipation plate of the present invention; Figure 4 Schematic view of the interior of the sliding heat dissipation plate of the present invention; Figure 5 Schematic view of the exterior of the fixing plate of the present invention; Figure 6 Front - view schematic view of the sliding heat dissipation plate of the present invention; Figure 7 Schematic cross - sectional view of the liquid - outlet control box of the present invention; Figure 8 Schematic cross - sectional view of the anti - dispersion box of the present invention; Figure 9 Schematic view of the interior of the base of the present invention; Figure 10 Schematic view of the unfolded rubber pad of the present invention; Figure 11 Schematic view of the blocking mechanism of the present invention.

[0022] In the figure: 1. Base; 101. Fixed column; 102. Slide column; 103. Driving lead screw; 104. Fixed threaded block; 105. Transmission belt; 106. Driving motor; 107. Upper support plate; 108. Heat dissipation fins; 109. Rubber pad; 110. Filter hole; 111. Lower support plate; 2. Chassis; 3. Fixing plate; 301. Slide groove; 302. Pressing liquid sac; 303. Diversion pipe; 304. Liquid - outlet control box; 305. Pressing rod; 306. Pressing block; 307. Return spring; 308. Guide inclined groove; 309. Liquid - outlet pipe; 310. Check valve; 311. Sealing cavity; 312. Liquid - outlet cavity; 313. Pressing cavity; 314. Sealing plate; 315. Liquid - outlet groove; 316. Pressing spring; 317. Diversion groove; 4. Sliding heat dissipation plate; 401. U - shaped return pipe; 402. Driving toothed plate; 5. Widened heat dissipation plate; 501. Widened U - shaped pipe; 6. Scraping plate; 7. Blocking mechanism; 701. Blocking box; 702. Partition board; 703. Pressing - down spring; 704. Conductive ball; 705. Conductive wire; 706. Top - extending rod; 707. Hinged plate; 708. Fusing material; 709. Fire - extinguishing material; 8. Anti - dispersion box; 801. Reduction box; 802. Impeller; 803. Check plate; 9. Water tank; 901. Water pump; 902. Sealing hose; 10. Temperature detection sensor; 11. Heat dissipation hole. Detailed implementation manners

[0023] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principle of the present invention and are not intended to limit the protection scope of the present invention.

[0024] A computer heat dissipation device installed in a computer case, as shown in the attached Figures 1-3 figure, includes a base 1 and a case 2. The case 2 is fixedly installed on the top of the base 1. A fixing plate 3 is fixedly installed on the inner wall of the case 2. A sliding heat dissipation plate 4 is slidably connected to the outer wall of the fixing plate 3. An extended heat dissipation plate 5 is installed on the outer wall of the sliding heat dissipation plate 4. A scraping plate 6 is installed on the outer wall of the extended heat dissipation plate 5. A blocking mechanism 7 is installed on the inner top wall of the case 2; heat dissipation holes 11 are opened in the interior of the case 2, and the heat dissipation holes 11 are matched with the scraping plate 6. An anti-diffusion box 8 is fixedly installed on the outer wall of the case 2, and the anti-diffusion box 8 is drivingly connected to the sliding heat dissipation plate 4; as shown in the attached Figure 9 figure, a water tank 9 is installed inside the base 1, and the water tank 9 is matched with the sliding heat dissipation plate 4. A temperature detection sensor 10 is installed on the inner side wall of the case 2, and the temperature detection sensor 10 is control-connected to the water tank 9; under the action of the sliding heat dissipation plate 4 of this device, the heat dissipation area of this device can be increased. At the same time, under the action of the left and right displacement of the sliding heat dissipation plate 4 and the extended heat dissipation plate 5, uniform heat dissipation can be achieved, avoiding the phenomenon of overheating or overcooling in local areas. At the same time, the displacement of the sliding heat dissipation plate 4 of this device can form a linkage effect with the water outlet of the water tank 9, realizing that displacement will only occur when this device starts to dissipate heat, avoiding displacement when heat dissipation is required, preventing energy loss caused by empty displacement, realizing the linkage effect, and at the same time, multi-stage heat dissipation of this device avoids the phenomenon of excessive or insufficient heat dissipation.

[0025] As shown in the attached Figures 3-4 figure, a U-shaped return pipe 401 is installed inside the sliding heat dissipation plate 4. One end of the U-shaped return pipe 401 is an outlet and the other end is an inlet. The U-shaped return pipe 401 is hermetically connected to the water tank 9 and fluid-conductive. The number of extended heat dissipation plates 5 is multiple, and multiple extended heat dissipation plates 5 are evenly installed on the outer wall of the sliding heat dissipation plate 4. An extended U-shaped pipe 501 is installed inside the extended heat dissipation plate 5, and the extended U-shaped pipe 501 is hermetically connected to the U-shaped return pipe 401 and fluid-conductive; this device supplies water to the U-shaped return pipe 401 through the water tank 9. At this time, heat dissipation is carried out on the interior of the case 2 through the U-shaped return pipe 401 and the extended U-shaped pipe 501, which can increase the heat dissipation area. After the cold water circulates through the pipeline, it takes away the heat inside the case 2. The pipeline of this device is attached to the side wall of the case 2 to ensure the heat dissipation efficiency.

[0026] As shown in the attached Figures 4-5As shown in the figure, a chute 301 is formed on the inner wall of the fixing plate 3. A slider is fixedly installed on the outer wall of the sliding heat dissipation plate 4, and friction lines are arranged on the outer wall of the slider. The slider is slidably connected to the inside of the chute 301. One end inside the chute 301 is provided with a jacking liquid sac 302. The liquid inlet end of the jacking liquid sac 302 is provided with a diversion pipe 303. The other end of the diversion pipe 303 is connected to the outlet end of the liquid outlet control box 304. The outlet end of the liquid outlet control box 304 is hermetically connected to and in fluid communication with the water tank 9. The liquid outlet control box 304 is fixedly installed on the inner bottom wall of the sliding heat dissipation plate 4. A jacking rod 305 is slidably connected to the inner wall of the liquid outlet control box 304. The jacking rod 305 is matched with a jacking block 306. The jacking block 306 is fixedly installed on the inner bottom wall of the chassis 2. The liquid outlet end of the jacking liquid sac 302 is provided with a liquid outlet pipe 309. The liquid outlet end of the liquid outlet pipe 309 is connected to a U-shaped return pipe 401. A one-way valve 310 is installed on the liquid outlet pipe 309. The direction of the one-way valve 310 is from the jacking liquid sac 302 to the U-shaped return pipe 401. The other end inside the chute 301 is provided with a return spring 307. The other end of the return spring 307 is fixedly connected to one end of the slider. A guiding inclined groove 308 is formed inside the chute 301. The guiding inclined groove 308 is matched with the slider. The diameter of the diversion pipe 303 is larger than that of the liquid outlet pipe 309. When the device is initially used, it is detected by the temperature detection sensor 10. When the temperature rises, at this time, the water tank 9 supplies water to the inside of the U-shaped return pipe 401, and at the same time, the liquid outlet control box 304 supplies water to the inside of the jacking liquid sac 302 through the diversion pipe 303. At this time, the jacking liquid sac 302 will expand inside the chute 301, and then the jacking liquid sac 302 jacks the sliding heat dissipation plate 4 to displace, realizing the function of reciprocating and uniform heat dissipation. The water tank 9 and the U-shaped return pipe 401 and the widened U-shaped pipe 501 form a closed loop to realize recycling and avoid waste of water source. After being cooled by the water tank 9, it can be recycled. At the same time, when supplying water, it can expand the jacking liquid sac 302 to realize the displacement of the sliding heat dissipation plate 4 driven by the water supply, realizing the function of automatic reciprocating and uniform heat dissipation. The diameter of the diversion pipe 303 of this device is much larger than that of the liquid outlet pipe 309.

[0027] As shown in the attached Figure 6 figure, there are two sliding heat dissipation plates 4, and the widened heat dissipation plates 5 on the outer walls of the two sliding heat dissipation plates 4 are staggered with each other. When the two sliding heat dissipation plates 4 of this device are displaced, collisions between the two plates can be avoided, ensuring the operation safety between the two and improving the heat dissipation efficiency.

[0028] As shown in the attached Figure 7As shown in the figure, the interior of the liquid outlet control box 304 is successively divided into a sealing cavity 311, a liquid outlet cavity 312, and a pressing cavity 313. A sealing plate 314 is hermetically and slidably connected inside the liquid outlet control box 304. The outer wall of the sealing plate 314 located inside the sealing cavity 311 is solid. An outlet groove 315 is formed on the outer wall of the sealing plate 314 located inside the liquid outlet cavity 312. A pressing spring 316 is fixedly installed at one end of the sealing plate 314 located inside the pressing cavity 313. A pressing rod 305 is fixedly installed at the other end of the sealing plate 314. A diversion groove 317 is formed on the inner bottom wall of the liquid outlet cavity 312. The diversion groove 317 matches the liquid outlet cavity 312 and is connected to the water tank 9. Friction lines are provided on the outer wall of the sealing plate 314. In the initial state of the device, the diversion groove 317 is opposite to the outlet groove 315, so that a conducting fluid channel is formed in the liquid outlet control box 304. When the water tank 9 supplies water, the water inside the water tank 9 will enter the interior of the pressing liquid sac 302 through the liquid outlet control box 304, causing the pressing liquid sac 302 to push the sliding heat dissipation plate 4 to displace. When the sliding heat dissipation plate 4 moves to the innermost side, the slider will slide into the guiding inclined groove 308, causing the sliding heat dissipation plate 4 to displace to the innermost side. At the same time, when the sliding heat dissipation plate 4 is close to the innermost side during displacement, the pressing rod 305 will press against the pressing block 306, causing the pressing rod 305 to drive the sealing plate 314 to displace. The sealing plate 314 gradually displaces, and at this time, the liquid outlet control box 304 closes. The liquid inside the pressing liquid sac 302 flows out through the liquid outlet pipe 309. Under the action of the return spring 307, the sliding heat dissipation plate 4 is reset. At the same time, under the action of the friction lines of the slider, the sliding heat dissipation plate 4 is slowly reset to achieve reciprocating heat dissipation. Through the setting of the liquid outlet control box 304, the device can automatically push the sliding heat dissipation plate 4 to reciprocate for heat dissipation when supplying water for heat dissipation. At the same time, during reciprocation, it can automatically close and open the water supply of the pressing liquid sac 302. On the one hand, it can avoid the phenomenon that the water inside the pressing liquid sac 302 is too much and causes bursting. On the other hand, it can automatically control the automatic reciprocating displacement of the sliding heat dissipation plate 4 to achieve the function of automatic control. The reset of the sealing plate 314 of the device is slow, which can avoid conflicts with the reset of the sliding heat dissipation plate 4 and prevent the phenomenon that the interior of the pressing liquid sac 302 is quickly filled with water and expands when just reset.

[0029] As shown in the attached Figures 1-2 and attached Figure 8As shown, a driving gear plate 402 is fixedly installed on the side wall of the top of the sliding heat dissipation plate 4; an impeller 802 is rotatably connected inside the anti-dispersion box 8, a reduction gear box 801 is fixedly installed on the top of the anti-dispersion box 8, the large gear of the reduction gear box 801 is meshed and connected with the driving gear plate 402, and the small gear of the reduction gear box 801 is drivingly connected with the impeller 802; a dust suction hole is formed in the side wall of the anti-dispersion box 8, a check valve plate 803 is fixedly installed inside the anti-dispersion box 8, the check valve plate 803 is located on the inner wall of the dust suction hole, and the width of the check valve plate 803 decreases sequentially from outside to inside; when the sliding heat dissipation plate 4 slides, the driving gear plate 402 is driven to displace, and the scraping plate 6 is driven to displace. The scraping plate 6 scrapes and cleans the heat dissipation holes 11, achieving the effect of automatic cleaning, avoiding the phenomenon of inability to dissipate heat caused by the blockage of the heat dissipation holes 11, and automatically and regularly cleaning the heat dissipation holes 11. Under the action of the reduction gear box 801, the impeller 802 is driven to rotate rapidly, capable of sucking dust, avoiding the smaller dust adhered to the outer wall of the heat dissipation holes 11 from being lifted and entering the interior of the chassis 2 when cleaning the heat dissipation holes 11, and being able to collect dust on the premise of ensuring the cleaning effect, avoiding phenomena such as flying around.

[0030] As attached Figures 9-10As shown in the figure, the base 1 includes a fixed column 101 and a sliding column 102. A driving lead screw 103 is rotatably connected inside the fixed column 101. A fixed threaded block 104 is fixedly installed on the inner bottom wall of the sliding column 102. The fixed threaded block 104 is threadedly connected to the outer wall of the driving lead screw 103. The sliding column 102 is slidably connected inside the fixed column 101. The number of driving lead screws 103 is multiple. The multiple driving lead screws 103 are drivingly connected through a transmission belt 105. The transmission belt 105 is connected to the output end of a driving motor 106. The driving motor 106 is electrically connected to a temperature detection sensor 10. An upper support plate 107 is fixedly installed on the upper part of the side wall of the sliding column 102. Heat dissipation fins 108 are fixedly installed on the bottom of the upper support plate 107. A rubber pad 109 is fixedly installed on the side wall of the bottom of the upper support plate 107. The side wall of the rubber pad 109 is fixedly connected to the side wall of the sliding column 102. Filter holes 110 are formed on the outer wall of the rubber pad 109. A lower support plate 111 is fixedly installed on the bottom of the rubber pad 109. The side wall of the lower support plate 111 is fixedly connected to the side wall of the fixed column 101; A water pump 901 is installed on the top of the water tank 9. The water outlet end of the water pump 901 is connected to a U-shaped return pipe 401 through a sealed hose 902. The temperature of the water pump 901 is electrically connected to the detection sensor 10; In the initial state of the device, heat dissipation is carried out through the heat dissipation holes 11. When the temperature detection sensor 10 detects abnormal temperature, the driving motor 106 will be started at this time, so that the driving lead screw 103 rotates to drive the sliding column 102 to move upward. At this time, the rubber pad 109 is stretched. The rubber pad 109 is in a compressed state in the initial state and can play a role in shock absorption, etc. After the rubber pad 109 is stretched, the filter holes 110 are opened, achieving a secondary heat dissipation effect on the chassis 2. When the temperature drops slightly, the water pump 901 realizes the function of tertiary heat dissipation. The water pump 901 drives the sliding heat dissipation plate 4 to move for heat dissipation. When the temperature continues to drop slowly, two sliding heat dissipation plates 4 can be started to dissipate heat synchronously. At the same time, the filter holes 110 dissipate heat from the water tank 9, realizing the function of multiple heat dissipations, ensuring uniform heat dissipation, and being able to be automatically controlled.

[0031] As shown in the attached Figure 11As shown in the figure, the blocking mechanism 7 includes a blocking box 701. Inside the blocking box 701, a partition 702 is fixedly installed. On the inner bottom wall of the blocking box 701, a downward pressure spring 703 is fixedly installed. At the bottom of the downward pressure spring 703, a conductive ball 704 is installed. Both ends of the conductive ball 704 abut against a conductive wire 705. One end of the conductive wire 705 is connected to a power source, and the other end is connected to the components of the chassis 2. The bottom of the conductive ball 704 abuts against the top of a top extension rod 706. The bottom of the top extension rod 706 abuts against the inner wall of a hinge plate 707. The hinge plate 707 is hinged to the bottom of the blocking box 701. The number of hinge plates 707 is two. At the bottom of the opposite ends of the two hinge plates 707, a fusing material 708 is provided. The bottom of the partition 702 is filled with a fire extinguishing material 709. In the initial state of the device, the top extension rod 706 abuts upward, and the downward pressure spring 703 abuts downward. At this time, the conductive ball 704 maintains a balanced state and abuts against the conductive wire 705 to conduct electricity. When the temperature inside the chassis 2 is too abnormal or high, at this time, the fusing material 708 melts, and the fire extinguishing material 709 is dumped to achieve fire extinguishing. At the same time, the conductive ball 704 loses the abutting force of the top extension rod 706. Under the action of the downward pressure spring 703, the conductive ball 704 moves downward, and the conductive wire 705 disengages, realizing the power-off function and automatic blocking, ensuring the safety of the device. At the same time, it avoids the phenomenon of affecting surrounding items when the chassis 2 is abnormal. The fusing material of this device can be polyethylene wax, and the melting point of polyethylene wax is 90°C - 120°C. At the same time, the fusing material can also be paraffin wax, etc., as long as the melting point is within the range of 90°C - 120°C.

[0032] It should be noted that in the description of the present invention, the terms indicating directions or positional relationships such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings. This is only for the convenience of description and does not indicate or imply that the device or component must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation to the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0033] In addition, it should also be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] So far, the technical solution of the present invention has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of the present invention.

Claims

1. A computer heat dissipation device installed in a computer chassis, comprising a base (1) and a chassis (2), characterized in that, The top of the base (1) is fixedly installed with a chassis (2). On the inner wall of the chassis (2), a fixing plate (3) is fixedly installed. On the outer wall of the fixing plate (3), a sliding heat dissipation plate (4) is slidably connected. On the outer wall of the sliding heat dissipation plate (4), a widened heat dissipation plate (5) is installed. On the outer wall of the widened heat dissipation plate (5), a scraping plate (6) is installed. On the inner top wall of the chassis (2), a blocking mechanism (7) is installed; Inside the chassis (2), heat dissipation holes (11) are formed. The heat dissipation holes (11) are matched with the scraping plate (6). On the outer wall of the chassis (2), a heat dissipation prevention box (8) is fixedly installed. The heat dissipation prevention box (8) is drivingly connected to the sliding heat dissipation plate (4); Inside the base (1), a water tank (9) is installed. The water tank (9) is matched with the sliding heat dissipation plate (4). On the inner side wall of the chassis (2), a temperature detection sensor (10) is installed. The temperature detection sensor (10) is controllably connected to the water tank (9).

2. The computer heat dissipation device installed in a computer chassis according to claim 1, characterized in that, Inside the sliding heat dissipation plate (4), a U-shaped return pipe (401) is installed. One end of the U-shaped return pipe (401) is an outlet and the other end is an inlet. The U-shaped return pipe (401) is hermetically connected to the water tank (9) and is fluidly conductive. The number of the widened heat dissipation plates (5) is multiple. The multiple widened heat dissipation plates (5) are evenly installed on the outer wall of the sliding heat dissipation plate (4). Inside the widened heat dissipation plate (5), a widened U-shaped pipe (501) is installed. The widened U-shaped pipe (501) is hermetically connected to the U-shaped return pipe (401) and is fluidly conductive.

3. The computer heat dissipation device installed in a computer chassis according to claim 2, wherein, On the inner wall of the fixing plate (3), a chute (301) is formed. On the outer wall of the sliding heat dissipation plate (4), a slider is fixedly installed. On the outer wall of the slider, friction lines are provided. The slider is slidably connected inside the chute (301). At one end inside the chute (301), a top liquid sac (302) is installed. The liquid inlet end of the top liquid sac (302) is installed with a diversion pipe (303). The other end of the diversion pipe (303) is connected to the outlet end of a liquid outlet control box (304). The outlet end of the liquid outlet control box (304) is hermetically connected to the water tank (9) and is fluidly conductive. The liquid outlet control box (304) is fixedly installed on the inner bottom wall of the sliding heat dissipation plate (4). Inside the inner wall of the liquid outlet control box (304), a top rod (305) is slidably connected. The top rod (305) is matched with a top block (306). The top block (306) is fixedly installed on the inner bottom wall of the chassis (2). The liquid outlet end of the top liquid sac (302) is installed with a liquid outlet pipe (309). The liquid outlet end of the liquid outlet pipe (309) is connected to the U-shaped return pipe (401). A one-way valve (310) is installed on the liquid outlet pipe (309). The direction of the one-way valve (310) is from the top liquid sac (302) to the U-shaped return pipe (401); At the other end inside the chute (301), a return spring (307) is installed, and the other end of the return spring (307) is fixedly connected to one end of the slider. A guiding inclined groove (308) is formed inside the chute (301), and the guiding inclined groove (308) matches the slider. The diameter of the diversion pipe (303) is larger than the diameter of the liquid outlet pipe (309).

4. The computer heat dissipation device installed in a computer chassis according to claim 3, characterized in that, The number of the sliding heat dissipation plates (4) is two, and the widened heat dissipation plates (5) on the outer walls of the two sliding heat dissipation plates (4) are offset from each other.

5. A computer heat dissipation device installed in a computer chassis according to claim 4, characterized in that, The inside of the liquid outlet control box (304) is successively divided into a sealing cavity (311), a liquid outlet cavity (312), and an abutting cavity (313). A sealing plate (314) is hermetically and slidably connected inside the liquid outlet control box (304). The outer wall of the sealing plate (314) located inside the sealing cavity (311) is solid. A liquid outlet groove (315) is formed on the outer wall of the sealing plate (314) located inside the liquid outlet cavity (312). An abutting spring (316) is fixedly installed at one end of the sealing plate (314) located inside the abutting cavity (313). The other end of the sealing plate (314) is fixedly installed with the abutting rod (305). A diversion groove (317) is formed on the inner bottom wall of the liquid outlet cavity (312), and the diversion groove (317) matches the liquid outlet cavity (312). The diversion groove (317) is connected to the water tank (9). Friction stripes are provided on the outer wall of the sealing plate (314).

6. The computer heat dissipation device installed in a computer chassis according to claim 5, wherein, A driving toothed plate (402) is fixedly installed on the side wall at the top of the sliding heat dissipation plate (4); An impeller (802) is rotatably connected inside the anti-scattering box (8). A speed reduction box (801) is fixedly installed on the top of the anti-scattering box (8). The large gear of the speed reduction box (801) is meshed with the driving toothed plate (402), and the small gear of the speed reduction box (801) is drivingly connected to the impeller (802); A dust suction hole is formed on the side wall of the anti-scattering box (8). A check valve plate (803) is fixedly installed inside the anti-scattering box (8). The check valve plate (803) is located on the inner wall of the dust suction hole, and the width of the check valve plate (803) gradually decreases from outside to inside.

7. The computer heat dissipation device installed in a computer chassis according to claim 6, characterized in that, The base (1) includes a fixed column (101) and a sliding column (102). A driving lead screw (103) is rotatably connected inside the fixed column (101). A fixed threaded block (104) is fixedly installed on the inner bottom wall of the sliding column (102). The fixed threaded block (104) is threadedly connected to the outer wall of the driving lead screw (103). The sliding column (102) is slidably connected inside the fixed column (101). The number of the driving lead screws (103) is multiple, and the multiple driving lead screws (103) are drivingly connected by a transmission belt (105). The transmission belt (105) is connected to the output end of a driving motor (106). The driving motor (106) is electrically connected to the temperature detection sensor (10). An upper support plate (107) is fixedly installed on the upper part of the side wall of the sliding column (102). Heat dissipation fins (108) are fixedly installed on the bottom of the upper support plate (107). A rubber pad (109) is fixedly installed on the side wall of the bottom of the upper support plate (107). The side wall of the rubber pad (109) is fixedly connected to the side wall of the sliding column (102). Filter holes (110) are formed in the outer wall of the rubber pad (109). A lower support plate (111) is fixedly installed on the bottom of the rubber pad (109). The side wall of the lower support plate (111) is fixedly connected to the side wall of the fixed column (101); A water pump (901) is installed on the top of the water tank (9). The water outlet end of the water pump (901) is connected to a U-shaped return pipe (401) through a sealed hose (902). The water pump (901) is electrically connected to the temperature detection sensor (10).

8. The computer heat dissipation device installed in a computer chassis according to claim 7, characterized in that, The blocking mechanism (7) includes a blocking box (701). A partition plate (702) is fixedly installed inside the blocking box (701). A downward pressure spring (703) is fixedly installed on the inner bottom wall of the blocking box (701). A conductive ball (704) is installed at the bottom of the downward pressure spring (703). Both ends of the conductive ball (704) are abutted against a conductive wire (705). One end of the conductive wire (705) is connected to a power supply, and the other end is connected to the components of the chassis (2). The bottom of the conductive ball (704) is abutted against the top of a top extension rod (706). The bottom of the top extension rod (706) is abutted against the inner wall of a hinge plate (707). The hinge plate (707) is hinged to the bottom of the blocking box (701). The number of the hinge plates (707) is two. A fusing material (708) is arranged at the bottom of the opposite ends of the two hinge plates (707). The bottom of the partition plate (702) is filled with a fire extinguishing material (709).

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