Hole-making information extraction method, device, equipment, medium and program product

Abstract

The invention relates to a drilling information extraction method, which comprises the following steps: determining a target assembly, determining a target sub-assembly from the target assembly, and determining a sub-assembly set according to the distance between the target sub-assembly and other sub-assemblies; traversing the parts of the target sub-assembly to obtain parts describing the hole making process information, and obtaining a plurality of point-line graphs corresponding to the parts describing the hole making process information according to the corresponding geometric graph set; traversing other parts of the target sub-assembly, obtaining the number of laminated parts according to the distance between the other parts of the target sub-assembly and each dot-line graph, and obtaining process parameters corresponding to each dot-line graph based on the number of the laminated parts; the Hash table is generated based on the process parameters corresponding to each dot-line graph, and the hole making information result is obtained through the clustering algorithm, so that the problems that the hole making process information obtaining efficiency is low, and a data structure capable of being received by a hole making program cannot be automatically generated in the related technology are solved, and the automation degree and efficiency of the production process are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of aircraft assembly, and particularly relates to a method, device, equipment, medium and program product for extracting hole-making information. Background Art

[0002] There are a large number of positioning and connection requirements for structural parts in aircraft assembly. Therefore, hole-making in laminated structures is very common. In order to improve the hole-making quality and processing efficiency, automated hole-making processes have been widely studied. Automated hole-making requires extracting relevant process information of holes from the assembly model, such as hole diameter, number of laminations, lamination thickness, workpiece material, countersink depth, etc., and organizing it into a reasonable data structure for easy reading and utilization by the automated hole-making program.

[0003] In related technologies, generally, (Computer Aided Three-dimensional Interactive Application, CATIA) is used to extract hole-making process information from the model. In this process, relevant functions need to be manually invoked, and a data structure that can be received by the subsequent automated hole-making program needs to be input.

[0004] However, the manual extraction of hole-making process information in related technologies has a high degree of process repetition and is very cumbersome. It is also prone to operation errors during the process. Moreover, a large amount of manual input is required to form a data structure that can be received by the subsequent automated hole-making program, which affects the automation level and efficiency of the overall production process and urgently needs to be solved. Summary of the Invention

[0005] The present invention provides a method, device, equipment, medium and program product for extracting hole-making information to solve problems such as low efficiency in obtaining hole-making process information and inability to automatically generate a data structure that can be received by the hole-making program in related technologies, and improve the automation level and efficiency of the production process.

[0006] An embodiment of the first aspect of the present invention provides a method for extracting hole-making information, including the following steps: determining a target assembly, determining a target sub-assembly from the target assembly, and determining a set of sub-assemblies according to the distance between the target sub-assembly and other sub-assemblies in the target assembly; traversing the parts of the target sub-assembly to obtain parts describing hole-making process information, and obtaining a plurality of point-line graphics corresponding to the parts describing hole-making process information according to the geometric graphics set corresponding to the parts describing hole-making process information; based on each point-line graphic, traversing other parts of the target sub-assembly, and obtaining the number of stacked parts according to the distance between other parts of the target sub-assembly and each point-line graphic, and obtaining process parameters corresponding to each point-line graphic based on the number of stacked parts; generating a hash table based on the process parameters corresponding to each point-line graphic, and obtaining the hole-making information result through a preset clustering algorithm.

[0007] Further, in some embodiments, the obtaining process parameters corresponding to each point-line graphic based on the number of stacked parts includes: if the number of stacked parts is less than a preset number threshold, traversing the parts of other sub-assemblies in the set of sub-assemblies until the number of stacked parts reaches the preset number threshold or the traversal of the set of sub-assemblies ends, to obtain process parameters corresponding to each point-line graphic.

[0008] Further, in some embodiments, the obtaining process parameters corresponding to each point-line graphic based on the number of stacked parts includes: if the number of stacked parts is the same as the preset number threshold, obtaining process parameters corresponding to each point-line graphic according to the current result.

[0009] Further, in some embodiments, the determining a set of sub-assemblies according to the distance between the target sub-assembly and other sub-assemblies in the target assembly includes: sequentially comparing the distances between the target sub-assembly and other sub-assemblies, and generating the set of sub-assemblies according to the sub-assemblies with distances less than a preset value.

[0010] Further, in some embodiments, the hash table generated based on the process parameters corresponding to each point-line graphic includes: obtaining the thickness of each hole-making part based on the process parameters corresponding to each point-line graphic; using the endpoint coordinates of each point-line graphic as keys, and generating the hash table according to the thickness of each hole-making part and the process parameters corresponding to each point-line graphic.

[0011] According to the hole-making information extraction method provided by the embodiments of the present invention, a set of sub-assemblies is determined based on the distance between the target sub-assembly and other sub-assemblies. Then, the parts of the target sub-assembly are traversed to obtain the parts describing the hole-making process information and their corresponding multiple point-line graphics. Based on each point-line graphic, other parts of the target sub-assembly are traversed to obtain the number of stacked parts and the corresponding process parameters. A hash table is generated according to the process parameters, and the hole-making information result is obtained through a preset clustering algorithm, which solves the problems in the related art such as low efficiency of obtaining hole-making process information and inability to automatically generate a data structure that can be received by the hole-making program, and improves the automation degree and efficiency of the production process.

[0012] The second aspect of the embodiments of the present invention provides a hole-making information extraction device, which includes: an acquisition module, configured to determine a target assembly, determine a target sub-assembly from the target assembly, and determine a set of sub-assemblies according to the distance between the target sub-assembly and other sub-assemblies in the target assembly; a data processing module, which traverses the parts of the target sub-assembly to obtain the parts describing the hole-making process information, and obtains multiple point-line graphics corresponding to the parts describing the hole-making process information according to the geometric graphic set corresponding to the parts describing the hole-making process information; a calculation module, configured to traverse other parts of the target sub-assembly based on each point-line graphic, and obtain the number of stacked parts according to the distance between other parts of the target sub-assembly and each point-line graphic, and obtain the process parameters corresponding to each point-line graphic based on the number of stacked parts; a generation module, configured to generate a hash table based on the process parameters corresponding to each point-line graphic, and obtain the hole-making information result through a preset clustering algorithm.

[0013] Further, in some embodiments, the calculation module is specifically configured to: when the number of stacked parts is less than a preset number threshold, traverse the parts of other sub-assemblies in the set of sub-assemblies until the number of stacked parts reaches the preset number threshold or the traversal of the set of sub-assemblies ends, and obtain the process parameters corresponding to each point-line graphic.

[0014] Further, in some embodiments, the data processing module is specifically configured to: when the number of stacked parts is the same as the preset number threshold, obtain the process parameters corresponding to each point-line graphic according to the current result.

[0015] Further, in some embodiments, the acquisition module is specifically configured to: sequentially compare the distances between the target sub-assembly and other sub-assemblies, and generate the set of sub-assemblies according to the sub-assemblies with distances less than a preset value.

[0016] Further, in some embodiments, the generating module is specifically configured to: obtain the part thickness of each hole-making based on the process parameters corresponding to each dot-line pattern; use the endpoint coordinates of each dot-line pattern as keys, and generate the hash table according to the part thickness of each hole-making and the process parameters corresponding to each dot-line pattern.

[0017] According to the hole-making information extraction device provided by the embodiments of the present invention, a set of sub-assemblies is determined based on the distance between the target sub-assembly and other sub-assemblies, then the parts of the target sub-assembly are traversed to obtain the parts describing the hole-making process information and obtain the corresponding multiple dot-line patterns, the other parts of the target sub-assembly are traversed based on each dot-line pattern to obtain the number of stacked parts and the corresponding process parameters, a hash table is generated according to the process parameters, and the hole-making information result is obtained through a preset clustering algorithm, which solves the problems in the related art such as low efficiency in obtaining hole-making process information and inability to automatically generate a data structure that can be received by the hole-making program, and improves the automation degree and efficiency of the production process.

[0018] An embodiment of the third aspect of the present invention provides an electronic device, including: a memory, a processor, and a computer program stored on the memory and executable on the processor, and the processor executes the program to implement the hole-making information extraction method as described in the above embodiments.

[0019] An embodiment of the fourth aspect of the present invention provides a computer-readable storage medium, on which a computer program is stored, and the program is executed by a processor to implement the hole-making information extraction method as described in the above embodiments.

[0020] An embodiment of the fifth aspect of the present invention provides a computer program product, including a computer program, and the computer program is executed to implement the hole-making information extraction method as described above.

[0021] The additional aspects and advantages of the present invention will be partly given in the following description, partly will become obvious from the following description, or will be understood through the practice of the present invention. Description of the Drawings

[0022] The above and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the following description of the embodiments in conjunction with the drawings, where:

[0023] Figure 1 It is a flowchart of the hole-making information extraction method provided by the embodiments of the present invention;

[0024] Figure 2 It is a schematic diagram of the relative geometric relationship between the dot-line pattern and the part provided by a specific embodiment of the present invention;

[0025] Figure 3Flowchart for obtaining part process information for a dot-line graphic provided according to a specific embodiment of the present invention;

[0026] Figure 4 Schematic diagram showing the geometric representation of hole arrangements provided according to a specific embodiment of the present invention;

[0027] Figure 5 Flowchart for a method of extracting hole-making information provided according to a specific embodiment of the present invention;

[0028] Figure 6 Block diagram of a device for extracting hole-making information provided according to an embodiment of the present invention;

[0029] Figure 7 Schematic diagram of the structure of an electronic device provided according to an embodiment of the present invention. Detailed Description of the Specific Embodiment

[0030] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.

[0031] The hole-making information extraction method, device, equipment, medium and program product according to the embodiments of the present invention will be described below. In view of the problems in the related art such as the low efficiency of obtaining hole-making process information and the inability to automatically generate a data structure that can be received by the hole-making program, the present invention provides a hole-making information extraction method. The method determines a set of sub-assemblies based on the distance between the target sub-assembly and other sub-assemblies, then traverses the parts of the target sub-assembly to obtain parts describing the hole-making process information and their corresponding multiple dot-line graphics. Based on each dot-line graphic, other parts of the target sub-assembly are traversed to obtain the number of stacked parts and the corresponding process parameters. A hash table is generated according to the process parameters, and the hole-making information result is obtained through a preset clustering algorithm, solving the problems in the related art such as the low efficiency of obtaining hole-making process information and the inability to automatically generate a data structure that can be received by the hole-making program, and improving the automation degree and efficiency of the production process.

[0032] Specifically, Figure 1 Flowchart for a method of extracting hole-making information provided according to an embodiment of the present invention.

[0033] As Figure 1 shown, the hole-making information extraction method includes the following steps:

[0034] In step S101, a target assembly is determined, a target sub-assembly is determined from the target assembly, and a set of sub-assemblies is determined according to the distance between the target sub-assembly and other sub-assemblies in the target assembly.

[0035] Among them, the target assembly is the model to be imported into the CATIA software; the target sub-assembly is one of the assembly components in the model imported into the CATIA software, and the other sub-assemblies are all the remaining sub-assemblies in the target assembly model imported into the CATIA software except the target sub-assembly. The sub-assembly set is the set of sub-assemblies where the target sub-assembly and other sub-assemblies satisfy a preset distance relationship.

[0036] Among them, in some embodiments, determining the sub-assembly set according to the distance between the target sub-assembly and other sub-assemblies in the target assembly includes: sequentially comparing the distances between the target sub-assembly and other sub-assemblies, and generating a sub-assembly set based on the sub-assemblies with distances less than a preset value.

[0037] As a possible implementation method, select the target sub-assembly A, calculate the distances between other sub-assemblies and the target sub-assembly A. If the distance between an other sub-assembly and the target sub-assembly A is 0, record this sub-assembly. The set of all sub-assemblies with a distance of 0 is the sub-assembly set M.

[0038] It should be noted that in the frame beam structure, the drilling of holes is mainly focused on the gusset plate positions at the intersections of the frame beams. Therefore, there are two types of laminations: gusset plate-frame and gusset plate-beam, and the upper limit N M of the number of laminations is 2. When designing the model, the frame and the beam are usually not established in the same sub-assembly. However, if all parts of all sub-assemblies are traversed for each hole, the time efficiency is too low. Therefore, after selecting the sub-assembly A, which does not contain all the workpiece information required for hole drilling, other sub-assemblies are traversed, and the distance calculation method for assembly-assembly is called to obtain M, reducing the subsequent traversal range.

[0039] In step S102, traverse the parts of the target sub-assembly to obtain the parts describing the hole-making process information, and obtain multiple point-line graphics corresponding to the parts describing the hole-making process information according to the geometric graphic set corresponding to the parts describing the hole-making process information.

[0040] Among them, the parts of the target sub-assembly are the various components that make up the target sub-assembly, the hole-making process information is the parameters describing the hole-making process, such as hole diameter, countersink depth and other parameters, and the point-line graphics are the graphics including point coordinates and line segment lengths.

[0041] As a possible implementation method, traverse the parts in the target sub-assembly A, find the part R describing the hole information, open the geometric graphic set S therein, traverse the geometric graphic set S through the assembly tree, find multiple point-line graphics L corresponding to the parts describing the hole-making process information, and confirm information such as hole diameter, countersink depth, and countersink angle through the numbers of the multiple point-line graphics L.

[0042] In step S103, based on each dot-line graph, traverse the other parts of the target sub-assembly, obtain the number of stacked parts according to the distance between the other parts of the target sub-assembly and each dot-line graph, and obtain the process parameters corresponding to each dot-line graph based on the number of stacked parts.

[0043] Wherein, the number of stacked parts is the number of layers when all parts in any sub-assembly are stacked together, and the process parameters corresponding to each dot-line graph are the characteristic parameters of each dot-line graph, such as thickness, workpiece material, etc.

[0044] Wherein, in some embodiments, obtaining the process parameters corresponding to each dot-line graph based on the number of stacked parts includes: if the number of stacked parts is less than the preset number threshold, traverse the parts of other sub-assemblies in the sub-assembly set until the number of stacked parts reaches the preset number threshold or the traversal of the sub-assembly set ends, and obtain the process parameters corresponding to each dot-line graph.

[0045] Further, in some embodiments, obtaining the process parameters corresponding to each dot-line graph based on the number of stacked parts includes: if the number of parts is the same as the preset number threshold, obtain the process parameters corresponding to each dot-line graph according to the current result.

[0046] Specifically, each dot-line graph L is composed of two endpoints P1, P2 and the middle line segment L0. First, read the coordinates of P1 and P2, traverse the other parts in the target sub-assembly A, and create two new points P1 * , P2 * in the geometric figure set according to the coordinates of P1 and P2, and create a line segment L0 * connecting them. Among them, the geometric relationship is as Figure 2 shown. Calculate the distances from the other parts in the target sub-assembly A to both ends and the line itself of each dot-line graph L using the point-entity distance calculation and line-entity distance calculation methods inside the part. For example, the distance L * from P1 P1 to the part entity, the distance L * from P2 P2 to the part entity, and the distance L * from L0 L0 to the part entity.

[0047] Further, determine whether the dot-line passes through the part and calculate the thickness of the part at the passing position; if the distance from the other parts in the target sub-assembly A to the dot-line graph L is less than D0 / 2, record the part. If the number of recorded parts is less than the upper limit N m of the stacking number, traverse each part of each sub-assembly in the sub-assembly set M, repeat the above steps until the number of recorded parts reaches N m or the traversal ends.

[0048] Specifically, if the distance from other parts to the dot-line pattern L, denoted as L L0 is greater than D0 / 2, it indicates that the dot-line does not pass through the part; otherwise, it indicates that the dot-line passes through the part. The thickness of the part at this location is calculated as follows:

[0049]

[0050] where H is the thickness of the part at the hole-making location, L L is the length of L, L P1 is the distance from P1 * to the solid of the part, L P2 is the distance from P2 * to the solid of the part, L L0 is the distance from L0 * to the solid of the part.

[0051] It should be noted that if the belt plate, beam, and geometric figure set S are all in the sub-assembly A. After traversing the parts in A, if L passes through the belt plate-beam laminate, the corresponding belt plate and beam parts are completely recorded, and the recorded quantity reaches N m . If L passes through the belt plate-frame laminate, only the belt plate part is recorded, and all parts in all sub-assemblies in M need to be traversed until the recorded quantity reaches N m or the traversal ends.

[0052] In step S104, a hash table is generated based on the process parameters corresponding to each dot-line pattern, and the hole-making information result is obtained through a preset clustering algorithm.

[0053] Among them, in some embodiments, the hash table generated based on the process parameters corresponding to each dot-line pattern includes: obtaining the part thickness of each hole-making based on the process parameters corresponding to each dot-line pattern; using the endpoint coordinates of each dot-line pattern as the key, and generating a hash table according to the part thickness of each hole-making and the process parameters corresponding to each dot-line pattern. It should be noted that the hash table generated based on the process parameters corresponding to each dot-line pattern is a key-value pair index table, which can facilitate the search for the process parameter values corresponding to each dot-line pattern.

[0054] As a possible implementation method, the preset clustering algorithm clusters the holes according to the coordinates, separates different batches of holes, and then clusters them again according to the coordinates within each batch to obtain the specific arrangement of the holes. After two clusters, the batch arrangement is recorded, and a list of the coordinates of the holes in the same batch is established. A hash table is established with the batch serial number as the key and the internal arrangement of the batch and the coordinates of each hole as the value.

[0055] Specifically, as Figure 3 shown, Figure 3The flowchart for obtaining part process information for the dot-line graph provided according to a specific embodiment of the present invention includes the following steps:

[0056] In step S301, obtain the parts in the sub-assembly and calculate the distance from the parts to the dot-line graph.

[0057] In step S302, determine whether the distance is less than the set value. If it is less than the set value, execute step S303; if it is greater than or equal to the set value, execute step S301.

[0058] In step S303, calculate the thickness of the part and record the part information.

[0059] In step S304, determine whether the stack layer quantity upper limit is reached. If the upper limit is not reached, execute step S305; if the upper limit is reached, execute step S310.

[0060] In step S305, obtain the parts in the sub-assembly with other distances of 0 and calculate the distance.

[0061] In step S306, determine whether the distance is less than the set value. If it is less than the set value, execute step S307; if it is greater than or equal to the set value, execute step S305.

[0062] In step S307, calculate the thickness of the part again and record the part information.

[0063] In step S308, determine again whether the stack layer quantity upper limit is reached. If the upper limit is not reached, execute step S309; if the upper limit is reached, execute step S310.

[0064] In step S309, record the information in the hash table

[0065] In step S310, the recording ends.

[0066] Further, cluster the coordinates of the keys in the hash table. Consider each intersection of the frame beams as a batch, and use the DBSCAN clustering method to cluster the X coordinates and Y coordinates respectively to obtain the total number of frames and the total number of beams. Re-establish the hash table by batch, using the number of frames and beams corresponding to the batch as the key and the coordinate set of each hole in the batch as the value. Use the same method to cluster within each batch to obtain the total number of rows and the total number of columns. Thus, the data collation and the acquisition of the hole layout situation are completed.

[0067] In addition, to make the result of the hole-making information intuitive and easy to obtain, after establishing the hash table, it can also be simultaneously displayed on the user side through the graph to visually show the batch layout of the holes and the internal layout of each batch. If the user clicks on one of the intersections, that is, selects a batch of holes, then the layout of this batch of holes is displayed.

[0068] Such asFigure 4 As shown Figure 4 It is a schematic diagram showing the geometric pattern of hole arrangements provided according to a specific embodiment of the present invention, which shows the arrangements of a total of 6 batches of holes in 2 beams and 3 frames, where the first batch of holes has 2 rows and 8 columns.

[0069] To enable those skilled in the relevant art to better understand the method for extracting hole-making information in the embodiments of the present invention, the following will be explained in conjunction with specific embodiments.

[0070] Figure 5 It is a flowchart of the method for extracting hole-making information provided according to a specific embodiment of the present invention.

[0071] As Figure 5 shown, the method for extracting hole-making information includes the following steps

[0072] In step S501, select a model and import it.

[0073] In step S502, select sub-assembly A.

[0074] In step S503, find the geometric graphics set S in A.

[0075] In step S504, find the parts passed through by the point-line graphic L in S.

[0076] In step S505, read, look up the table, and calculate to obtain the process information.

[0077] In step S506, establish a hash table.

[0078] In step S507, determine whether the traversal is completed. If the traversal is completed, execute step S508. If the traversal is not completed, repeat step S504.

[0079] In step S508, determine whether to end the extraction of hole-making information. If the extraction of hole-making information for this time is ended, execute step S509. If the extraction of hole-making information for this time is not ended, repeat step S502.

[0080] In step S509, cluster to represent different batches and hole position arrangements.

[0081] In step S510, display through graphics.

[0082] According to the hole-making information extraction method provided by an embodiment of the present invention, a sub-assembly set is determined based on the distance between a target sub-assembly and other sub-assemblies, and then the parts of the target sub-assembly are traversed to obtain the parts describing the hole-making process information and obtain a plurality of point-line graphics corresponding thereto. Based on each point-line graphic, other parts of the target sub-assembly are traversed to obtain the number of stacked parts and the corresponding process parameters. A hash table is generated according to the process parameters, and the hole-making information result is obtained through a preset clustering algorithm, which solves the problems in the related art such as low efficiency in obtaining hole-making process information and inability to automatically generate a data structure that can be received by a hole-making program, and improves the automation degree and efficiency of the production process.

[0083] Next, a hole-making information extraction device according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0084] Figure 6 It is a schematic block diagram of a hole-making information extraction device provided by an embodiment of the present invention.

[0085] As Figure 6 shown, the hole-making information extraction device 10 includes: an acquisition module 100, a data processing module 200, a calculation module 300, and a generation module 400.

[0086] Among them, the acquisition module 100 is used to determine a target assembly, determine a target sub-assembly from the target assembly, and determine a sub-assembly set according to the distance between the target sub-assembly and other sub-assemblies in the target assembly; the data processing module 200 traverses the parts of the target sub-assembly to obtain the parts describing the hole-making process information, and obtains a plurality of point-line graphics corresponding to the parts describing the hole-making process information according to the geometric graphic set corresponding to the parts describing the hole-making process information; the calculation module 300 is used to traverse other parts of the target sub-assembly based on each point-line graphic, and obtain the number of stacked parts according to the distance between other parts of the target sub-assembly and each point-line graphic, and obtain the process parameters corresponding to each point-line graphic based on the number of stacked parts; the generation module 400 is used to generate a hash table based on the process parameters corresponding to each point-line graphic, and obtain the hole-making information result through a preset clustering algorithm.

[0087] Further, in some embodiments, the calculation module 300 is specifically used for: when the number of stacked parts is less than a preset number threshold, traversing the parts of other sub-assemblies in the sub-assembly set until the number of stacked parts reaches the preset number threshold or the traversal of the sub-assembly set ends, to obtain the process parameters corresponding to each point-line graphic.

[0088] Further, in some embodiments, the data processing module 200 is specifically used for: when the number of stacked parts is the same as the preset number threshold, obtaining the process parameters corresponding to each point-line graphic according to the current result.

[0089] Further, in some embodiments, the obtaining module 100 is specifically configured to: sequentially compare the distances between the target sub-assembly and other sub-assemblies, and generate a sub-assembly set based on the sub-assemblies with distances less than a preset value.

[0090] Further, in some embodiments, the generating module 400 is specifically configured to: obtain the part thickness of each hole-making based on the process parameters corresponding to each dot-line pattern; use the endpoint coordinates of each dot-line pattern as keys, and generate a hash table according to the part thickness of each hole-making and the process parameters corresponding to each dot-line pattern.

[0091] It should be noted that the foregoing explanation of the embodiments of the hole-making information extraction method also applies to the hole-making information extraction device of this embodiment, and will not be elaborated here.

[0092] According to the hole-making information extraction device provided by the embodiments of the present invention, a sub-assembly set is determined based on the distances between the target sub-assembly and other sub-assemblies, then the parts of the target sub-assembly are traversed to obtain the parts describing the hole-making process information and obtain the corresponding multiple dot-line patterns, the other parts of the target sub-assembly are traversed based on each dot-line pattern to obtain the number of stacked parts and the corresponding process parameters, a hash table is generated according to the process parameters, and the hole-making information result is obtained through a preset clustering algorithm, which solves the problems in the related art such as low efficiency of obtaining hole-making process information and inability to automatically generate the data structure that the hole-making program can receive, and improves the automation degree and efficiency of the production process.

[0093] Figure 7 FIG. is a schematic structural diagram of an electronic device according to an embodiment of the present invention. The electronic device may include:

[0094] A memory 701, a processor 702, and a computer program stored on the memory 701 and executable on the processor 702.

[0095] When the processor 702 executes the program, it implements the hole-making information extraction method provided in the above embodiments.

[0096] Further, the electronic device further includes:

[0097] A communication interface 703 for communication between the memory 701 and the processor 702.

[0098] The memory 701 is used to store a computer program executable on the processor 702.

[0099] The memory 701 may include a high-speed RAM memory, and may also include a non-volatile memory, such as at least one disk memory.

[0100] If the memory 701, the processor 702, and the communication interface 703 are implemented independently, the communication interface 703, the memory 701, and the processor 702 can be interconnected via a bus and communicate with each other. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 7 only a thick line is used in Figure 7 to represent it, but it does not mean that there is only one bus or one type of bus.

[0101] Optionally, in a specific implementation, if the memory 701, the processor 702, and the communication interface 703 are integrated on a single chip, the memory 701, the processor 702, and the communication interface 703 can communicate with each other through an internal interface.

[0102] The processor 702 may be a Central Processing Unit (CPU), or an Application Specific Integrated Circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present invention.

[0103] In addition, an embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored, and when the program is executed by a processor, the hole-making information extraction method as described above is implemented.

[0104] In addition, an embodiment of the present invention further provides a computer program product, including a computer program, and the computer program is executed to implement the hole-making information extraction method as described above.

[0105] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or N embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0106] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "N" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0107] Any process or method description in a flowchart or described in other ways herein can be understood to represent a module, segment, or part of code including one or more N executable instructions for implementing a customized logic function or process, and the scope of the preferred embodiments of the present invention includes additional implementations, where the functions can be executed in a substantially simultaneous manner or in a reverse order according to the involved functions, rather than in the order shown or discussed, which should be understood by those skilled in the art to which the embodiments of the present invention pertain.

[0108] It should be understood that each part of the present invention can be implemented by hardware, software, firmware, or a combination thereof. In the above embodiments, the N steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware as in another embodiment, any one or a combination of the following techniques well known in the art can be used: discrete logic circuits with logic gate circuits for implementing logic functions on data signals, application specific integrated circuits with appropriate combinational logic gate circuits, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.

[0109] Those of ordinary skill in the art of this technology can understand that all or part of the steps carried by the methods of the above embodiments can be completed by instructing relevant hardware through a program, and the program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiments.

Claims

1. A method for extracting hole-making information, characterized in that, Including the following steps: Determine the target assembly, determine the target sub-assembly from the target assembly, and determine the sub-assembly set according to the distance between the target sub-assembly and other sub-assemblies in the target assembly; Traverse the parts of the target sub-assembly to obtain the parts describing the hole-making process information, and obtain multiple point-line graphics corresponding to the parts describing the hole-making process information according to the geometric graphics set corresponding to the parts describing the hole-making process information; Based on each point-line graphic, traverse the other parts of the target sub-assembly, and obtain the number of stacked parts according to the distance between the other parts of the target sub-assembly and each point-line graphic, and obtain the process parameters corresponding to each point-line graphic based on the number of stacked parts; Generate a hash table based on the process parameters corresponding to each point-line graphic, and obtain the hole-making information result through a preset clustering algorithm.

2. The method according to claim 1, wherein The obtaining the process parameters corresponding to each point-line graphic based on the number of stacked parts includes: If the number of stacked parts is less than the preset number threshold, traverse the parts of other sub-assemblies in the sub-assembly set until the number of stacked parts reaches the preset number threshold or the traversal of the sub-assembly set ends, and obtain the process parameters corresponding to each point-line graphic.

3. The method according to claim 1, wherein The obtaining the process parameters corresponding to each point-line graphic based on the number of stacked parts includes: If the number of stacked parts is the same as the preset number threshold, obtain the process parameters corresponding to each point-line graphic according to the current result.

4. The method according to claim 1, wherein The determining the sub-assembly set according to the distance between the target sub-assembly and other sub-assemblies in the target assembly includes: Compare the distances between the target sub-assembly and other sub-assemblies in turn, and generate the sub-assembly set according to the sub-assemblies with distances less than the preset value.

5. The method according to claim 1, characterized in that, The hash table generated based on the process parameters corresponding to each point-line graphic includes: Obtain the part thickness of each hole-making based on the process parameters corresponding to each point-line graphic; Using the endpoint coordinates of each point-line graphic as the key, generate the hash table according to the part thickness of each hole-making and the process parameters corresponding to each point-line graphic.

6. A hole-making information extraction device, characterized in that, The device includes: An acquisition module for determining the target assembly, determining the target sub-assembly from the target assembly, and determining the sub-assembly set according to the distance between the target sub-assembly and other sub-assemblies in the target assembly; A data processing module that traverses the parts of the target sub-assembly to obtain the parts describing the hole-making process information, and obtains multiple point-line graphics corresponding to the parts describing the hole-making process information according to the geometric graphics set corresponding to the parts describing the hole-making process information; A calculation module for, based on each point-line graphic, traversing the other parts of the target sub-assembly, obtaining the number of stacked parts according to the distance between the other parts of the target sub-assembly and each point-line graphic, and obtaining the process parameters corresponding to each point-line graphic based on the number of stacked parts; A generation module, configured to generate a hash table based on the process parameters corresponding to each dot-line pattern, and obtain a result of hole-making information through a preset clustering algorithm.

7. The hole-making information extraction device according to claim 6, wherein The calculation module is specifically configured to: When the number of stacked parts is less than a preset number threshold, traverse the parts of other sub-assemblies in the sub-assembly set until the number of stacked parts reaches the preset number threshold or the traversal of the sub-assembly set ends, so as to obtain the process parameters corresponding to each dot-line pattern.

8. An electronic device, characterized in that, It includes: A memory, a processor, and a computer program stored on the memory and executable on the processor, wherein the processor executes the program to implement the hole-making information extraction method according to any one of claims 1-5.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, The program is executed by the processor to be used for implementing the hole-making information extraction method according to any one of claims 1-5.

10. A computer program product, comprising a computer program, characterized in that, The computer program is executed to be used for implementing the hole-making information extraction method according to any one of claims 1-5.

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