Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multi-layer electronic component comprises a main body, the first surface and the second surface are opposite to each other in a first direction, the third surface and the fourth surface are connected to the first surface and the second surface and are opposite to each other in a second direction, and the third surface and the fourth surface are connected to the first surface and the second surface. The third surface and the fourth surface are a fifth surface and a sixth surface which are opposite to each other in a third direction; the main body includes dielectric layers, internal electrodes alternately disposed with the dielectric layers in the first direction, and auxiliary electrodes spaced apart from the internal electrodes and disposed on both sides of the internal electrodes in the third direction; and an external electrode disposed on the main body. At least one of the auxiliary electrodes includes an oxide region on an end portion of the at least one auxiliary electrode in the third direction, the oxide region including an oxide.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0015010, filed on January 31, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic component. Background Art

[0003] A multi-layer ceramic capacitor (MLCC), which is a multi-layer electronic component, is a chip capacitor that is mounted on a printed circuit board of various electronic products (such as image display devices (such as liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, mobile phones, etc.) and is used to charge or discharge therefrom.

[0004] Because a multi-layer ceramic capacitor can have a small size and a high capacitance and can be easily mounted, such a multi-layer ceramic capacitor can be used as a component of various electronic devices. As electronic devices such as computers and mobile devices have been designed to have smaller sizes and higher output powers, the demand for smaller sizes and higher capacitances of multi-layer ceramic capacitors has also increased.

[0005] In addition, as the application of automotive electronic components has increased, it may be necessary to ensure high reliability in various environments.

[0006] Generally, a multi-layer ceramic capacitor can be manufactured by laminating and pressing ceramic green sheets printed with a conductive paste for an inner electrode, and then performing a cutting process and a sintering process. A stepped difference may be formed due to the thickness of the inner electrode pattern between a portion printed with the conductive paste for the inner electrode and a portion not printed with the conductive paste for the inner electrode, and this stepped difference may become larger as the number of laminated layers increases.

[0007] In addition, regarding the difference in the material filling rate between a portion printed with the conductive paste for the inner electrode and a portion not printed with the conductive paste for the inner electrode, during the cooling process after the sintering process, thermal stress caused by the difference in the coefficient of thermal expansion may occur concentratedly in the portion not printed with the conductive paste for the inner electrode, and thus, cracks or delamination defects may occur. Summary of the Invention

[0008] An embodiment of the present disclosure is to provide a multi-layer electronic component having improved reliability.

[0009] An embodiment of the present disclosure is to provide a multi-layer electronic component in which the influence of the stepped difference in the edge portion is alleviated.

[0010] Embodiments of the present disclosure are directed to a multi-layer electronic component in which cracks and delamination are prevented.

[0011] According to an embodiment of the present disclosure, a multi-layer electronic component includes: a body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and opposite to each other in a third direction, and the body includes a dielectric layer, inner electrodes alternately arranged with the dielectric layer in the first direction, and auxiliary electrodes spaced apart from the inner electrodes and disposed on both sides of the inner electrodes in the third direction; and an outer electrode disposed on the body. At least one of the auxiliary electrodes includes an oxide region located at an end of the at least one auxiliary electrode in the third direction, and the oxide region includes an oxide.

[0012] According to an embodiment of the present disclosure, a multi-layer electronic component includes: a body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and opposite to each other in a third direction, and the body includes a dielectric layer, inner electrodes alternately arranged with the dielectric layer in the first direction, and auxiliary electrodes spaced apart from the inner electrodes and disposed on both sides of the inner electrodes in the third direction; and an outer electrode disposed on the body. The inner electrodes include a first inner electrode and a second inner electrode, the first inner electrode is spaced apart from the fourth surface and connected to the third surface, and the second inner electrode is spaced apart from the third surface and connected to the fourth surface. The auxiliary electrodes include a first auxiliary electrode and a second auxiliary electrode, the first auxiliary electrode is disposed on each of both sides of the first inner electrode in the third direction, and the second auxiliary electrode is disposed on each of both sides of the second inner electrode in the third direction. The first auxiliary electrode is spaced apart from the fourth surface and connected to the third surface. The second auxiliary electrode is spaced apart from the third surface and connected to the fourth surface. The first auxiliary electrode and the second auxiliary electrode are partially overlapped with each other in the first direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view showing a multi-layer electronic component according to an embodiment of the present disclosure; Figure 2 is a cross-sectional view taken along line I-I' in Figure 1 ; Figure 3 is a cross-sectional view taken along line II-II' in Figure 1 ; Figure 4 is an enlarged view showing region K1 in Figure 3 ; Figure 5 is a plan view showing a first inner electrode and a first auxiliary electrode according to an embodiment of the present disclosure; Figure 6 is a plan view showing a second inner electrode and a second auxiliary electrode according to an embodiment of the present disclosure; Figure 7 is a perspective exploded view showing the main body in Figure 1 ; Figure 8 is an image obtained by scanning a cross-section taken along line II-II' in Figure 1 using a scanning electron microscope; Figure 9 is Figure 8 a scanned enlarged image of the auxiliary electrode in; Figure 10 is a scanned image of the W-direction - T-direction cross-section of Comparative Example 1; and Figure 11 is a scanned image of the W-direction - T-direction cross-section of Comparative Example 2. DETAILED DESCRIPTION

[0014] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0015] These embodiments are described in sufficient detail to enable those skilled in the art to practice the present disclosure. It should be understood that although the various embodiments of the present disclosure are different, they are not necessarily mutually exclusive. For example, without departing from the spirit and scope of the present disclosure, the structures, shapes, and dimensions described as examples in the embodiments of the present disclosure can be implemented in another embodiment. In addition, without departing from the spirit and scope of the present disclosure, the position or arrangement of the elements in the embodiments can be modified. Therefore, the following detailed description should not be construed as having a limiting meaning, and the scope of the present disclosure is only defined by the properly interpreted appended claims and the full scope of the equivalents given by the claims.

[0016] In the drawings, like elements will be represented by like reference numerals. In addition, redundant descriptions and detailed descriptions of known functions and elements that may unnecessarily obscure the gist of the present disclosure will be omitted. In the drawings, some elements may be exaggerated, omitted, or shown briefly, and the dimensions of the elements do not necessarily reflect the actual dimensions of these elements. The terms "comprising," "including," "configured to," etc. in the specification are used to indicate the presence of features, quantities, steps, operations, elements, components, or combinations thereof, and do not exclude the possibility of combining or adding one or more other features, quantities, steps, operations, elements, components, or combinations thereof.

[0017] In the drawings, the first direction may be defined as the thickness (T) direction, the second direction may be defined as the length (L) direction, and the third direction may be defined as the width (W) direction.

[0018] Multi-layer electronic component Figure 1 is a perspective view showing a multilayer electronic component according to an embodiment.

[0019] Figure 2 is along Figure 1 a sectional view taken along line I-I' in

[0020] Figure 3 is along Figure 1 a sectional view taken along line II-II' in

[0021] Figure 4 is a view showing Figure 3 an enlarged view of region K1 in

[0022] Figure 5 is a plan view showing a first internal electrode and a first auxiliary electrode according to an embodiment.

[0023] Figure 6 is a plan view showing a second internal electrode and a second auxiliary electrode according to an embodiment.

[0024] Figure 7 is a view showing Figure 1 an exploded perspective view of the body in

[0025] Hereinafter, the multilayer electronic component 100 according to an embodiment will be described in more detail with reference to Figures 1 to 7 Although a multilayer ceramic capacitor will be described as an example of the multilayer electronic component, embodiments thereof are not limited thereto, and the multilayer electronic component of the present disclosure can be applied to various electronic components such as inductors, piezoelectric elements, varistors, or thermistors.

[0026] The multilayer electronic component 100 may include: a body 110 having a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and opposite to each other in a third direction. The body 110 includes a dielectric layer 111, inner electrodes 121 and 122 alternately arranged with the dielectric layer 111 in the first direction, and auxiliary electrodes 121d and 122d spaced apart from the inner electrodes 121 and 122 and disposed on both sides of the inner electrodes 121 and 122 in the third direction; and outer electrodes 131 and 132 disposed on the body 110. The auxiliary electrodes 121d and 122d include oxide regions 121d1, 121d2, 122d1, and 122d2 located at the ends of the auxiliary electrodes 121d and 122d in the third direction, and the oxide regions 121d1, 121d2, 122d1, and 122d2 include oxides.

[0027] Generally, a multilayer ceramic capacitor can be manufactured by laminating and pressing ceramic green sheets printed with a conductive paste for the inner electrodes, and then performing a cutting process and a sintering process. The portion where the conductive paste for the inner electrodes is printed and the portion where the conductive paste for the inner electrodes is not printed may have a step difference formed due to the thickness of the inner electrode pattern, and this step difference may increase as the number of stacked layers increases.

[0028] In addition, regarding the difference in the material filling rate between the portion where the conductive paste for the inner electrodes is printed and the portion where the conductive paste for the inner electrodes is not printed, during the cooling process after the sintering process, thermal stress caused by the difference in the coefficient of thermal expansion may occur concentratedly in the portion where the conductive paste for the inner electrodes is not printed, and thus, cracks or delamination defects may occur.

[0029] According to an embodiment, by disposing auxiliary electrodes on both sides of the inner electrode in the width direction and including oxide regions containing oxides at the ends of the auxiliary electrodes in the third direction, cracks and delamination can be prevented.

[0030] Hereinafter, each component included in the multilayer electronic component 100 according to the embodiment will be described.

[0031] In the body 110, the dielectric layer 111 and the inner electrodes 121 and 122 may be alternately laminated in the first direction.

[0032] The shape of the body 110 is not limited to any specific shape, but as Figure 1As shown, the main body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Due to the shrinkage of the ceramic powder included in the main body 110 during the firing process or the polishing of the corners, the main body 110 may not have an exact hexahedral shape formed by straight lines, but may have a substantially hexahedral shape.

[0033] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and are opposite to each other in a third direction. The first surface 1 may be a mounting surface that is set to face the substrate when the multilayer electronic component 100 is mounted on the substrate.

[0034] Since the edge regions of the dielectric layer 111 on which the inner electrodes 121 and 122 are not provided overlap in the first direction, a step difference may be formed due to the thickness of the inner electrodes 121 and 122, such that when observed based on the first surface 1 and / or the second surface 2, the corners connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or the corners connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that contracts toward the center of the main body 110 in the first direction. Alternatively, due to the shrinkage behavior during the process of sintering the main body, when observed based on the first surface 1 and / or the second surface 2, the corners connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or the corners connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that contracts toward the center of the main body 110 in the first direction. Alternatively, in order to prevent cracking defects, each corner connecting the surfaces of the main body 110 may be rounded by performing a separate process. Therefore, the corners connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or the corners connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a rounded shape.

[0035] The multiple dielectric layers 111 forming the main body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other, making it difficult to identify the boundary between them without using a scanning electron microscope (SEM). The number of stacked dielectric layers may not be specifically limited, and the number of stacked layers may be determined by considering the size of the multilayer electronic component. For example, the main body may be formed by stacking 400 or more layers of dielectric layers.

[0036] The dielectric layer 111 can be formed by preparing a ceramic slurry including ceramic powder, an organic solvent, an additive, and a binder, preparing a green sheet by coating the ceramic slurry on a carrier film and drying the ceramic slurry, and then firing the green sheet. The ceramic powder is not limited to any specific example as long as sufficient electrostatic capacitance can be obtained using it. For example, barium titanate (BaTiO3)-based powder or CaZrO3-based powder can be used as the ceramic powder. The BaTiO3-based ceramic powder can be one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1). The CaZrO3-based powder can be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0037] Therefore, the dielectric layer 111 can include one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1). In an embodiment, the dielectric layer 111 can include (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1) as the main component.

[0038] When a magnetic material is used to replace the dielectric material and applied to the main body 110, the multilayer electronic component can be used as an inductor. The magnetic material can be, for example, ferrite particles and / or metallic magnetic particles. When the multilayer electronic component is used as an inductor, the internal electrode can be a coil-shaped conductor.

[0039] In addition, when a piezoelectric material is used to replace the dielectric material and applied to the main body 110, the multilayer electronic component can be used as a piezoelectric device. The piezoelectric material can be, for example, PZT (lead zirconate titanate).

[0040] In addition, when a ZnO-based material or a SiC-based material is used to replace the dielectric material and applied to the main body 110, the multilayer electronic component can be used as a varistor, and when a spinel-based material is used to replace the dielectric material and applied to the main body 110, the multilayer electronic component can be used as a thermistor.

[0041] That is, by appropriately changing the material or structure of the main body 110, the multilayer electronic component 100 according to the embodiment can be used as a multilayer ceramic capacitor and can also be used as an inductor, a piezoelectric device, a varistor, or a thermistor.

[0042] The main body 110 may include a capacitance forming portion Ac that forms a capacitance, and covering portions 112 and 113. The capacitance forming portion Ac is provided in the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 that face each other, and a dielectric layer 111 is located between the first internal electrode 121 and the second internal electrode 122. The covering portions 112 and 113 are formed on the upper and lower portions of the capacitance forming portion Ac in a first direction.

[0043] In addition, the capacitance forming portion Ac contributes to forming the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 and interposing the dielectric layer 111 therebetween.

[0044] The covering portions 112 and 113 may include: an upper covering portion 112 provided on the upper portion of the capacitance forming portion Ac in a first direction; and a lower covering portion 113 provided on the lower portion of the capacitance forming portion Ac in a first direction.

[0045] The upper covering portion 112 and the lower covering portion 113 can be formed by laminating a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the capacitance forming portion Ac in the thickness direction, respectively, and can prevent damage to the internal electrode due to physical stress and / or chemical stress.

[0046] The upper covering portion 112 and the lower covering portion 113 do not include internal electrodes and may include the same material as the material of the dielectric layer 111.

[0047] That is to say, the upper covering portion 112 and the lower covering portion 113 may include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0048] The thicknesses of the covering portions 112 and 113 may not be limited to any specific example. For example, the average thickness tc of the covering portions 112 and 113 may be less than or equal to 200 μm. Here, the average thickness of the covering portions 112 and 113 may refer to the average thickness of each of the upper covering portion 112 and the lower covering portion 113.

[0049] The average thickness tc of the covering portions 112 and 113 may represent the average dimension in the first direction of each of the covering portions 112 and 113, and may be the average value of the dimensions in the first direction of the covering portions 112 and 113 measured at five equally spaced points in the second direction on the upper or lower part of the capacitor forming portion Ac in the first direction.

[0050] In addition, the edge portions 114 and 115 may be provided on the side surfaces of the capacitor forming portion Ac in the third direction.

[0051] The edge portions 114 and 115 may include a first edge portion 114 provided on one side surface of the capacitor forming portion Ac in the third direction and a second edge portion 115 provided on the other side surface of the capacitor forming portion Ac in the third direction. That is to say, the edge portions 114 and 115 may be respectively provided on the two side surfaces of the capacitor forming portion Ac in the width direction.

[0052] As Figure 3 shown, the edge portions 114 and 115 may represent: in the cross-section of the main body 110 in the width direction - thickness (W-T) direction, the regions between the two ends in the width direction of the first inner electrode 121 and the second inner electrode 122 and the outer surfaces of the main body 110 in the width direction.

[0053] The edge portions 114 and 115 may mainly prevent damage to the inner electrodes due to physical stress and / or chemical stress.

[0054] The auxiliary electrodes 121d and 122d may be provided in the edge portions 114 and 115.

[0055] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be alternately arranged opposite to each other with the dielectric layer 111 located between the first inner electrode 121 and the second inner electrode 122, and may be respectively exposed to the third surface 3 and the fourth surface 4 of the main body 110.

[0056] The first inner electrode 121 may be spaced apart from the fourth surface 4 and may be exposed to the third surface 3, and the second inner electrode 122 may be spaced apart from the third surface 3 and may be exposed to the fourth surface 4.

[0057] That is, the first inner electrode 121 is not connected to the second outer electrode 132 but is connected to the first outer electrode 131, and the second inner electrode 122 is not connected to the first outer electrode 131 but is connected to the second outer electrode 132. Accordingly, the first inner electrode 121 may be spaced apart from the fourth surface 4 by a predetermined distance, and the second inner electrode 122 may be spaced apart from the third surface 3 by a predetermined distance. In addition, each of the first inner electrode 121 and the second inner electrode 122 may be spaced apart from the fifth surface 5 and the sixth surface 6 of the main body 110.

[0058] The conductive metal included in the inner electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but embodiments thereof are not limited thereto.

[0059] The average thickness td of the dielectric layer 111 may not be limited to any specific example and may be, for example, 0.1 μm to 10.0 μm. The average thickness te of the inner electrodes 121 and 122 may not be limited to any specific example and may be, for example, 0.05 μm to 3.0 μm. In addition, the average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 may be arbitrarily set according to desired characteristics or applications. For example, in the case of a small information technology (IT) electronic component, in order to achieve miniaturization and high capacitance, the average thickness td of the dielectric layer 111 may be less than or equal to 0.4 μm, and the average thickness te of the inner electrodes 121 and 122 may be less than or equal to 0.4 μm.

[0060] The average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 may respectively represent the average size of the dielectric layer 111 in the first direction and the average size of the inner electrodes 121 and 122 in the first direction. The average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can be obtained from an image obtained by scanning a cross-section of the main body 110 in the first and second directions using a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, the average thickness td of the dielectric layer 111 can be obtained by measuring the thickness at a plurality of points (e.g., 30 equally spaced points) in the second direction of one dielectric layer 111 and averaging the measured thicknesses. In addition, the average thickness te of the inner electrodes 121 and 122 can be obtained by measuring the thickness at a plurality of points (e.g., 30 equally spaced points) in the second direction of one of the inner electrodes 121 and 122 and averaging the measured thicknesses. The 30 equally spaced points can be specified in the capacitance forming section Ac. In addition, by measuring the average values of 10 dielectric layers 111 and 10 inner electrodes 121 and 122, the average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can be made more general.

[0061] The auxiliary electrodes 121d and 122d may be spaced apart from the inner electrodes 121 and 122 and may be provided on both sides of the inner electrodes 121 and 122 in the third direction. That is, the auxiliary electrodes 121d and 122d may be provided in the edge portions 114 and 115 and may be disposed in the same plane as the inner electrodes 121 and 122. The auxiliary electrodes 121d and 122d may be provided in the edge portions 114 and 115 and may mitigate the influence of the step difference caused by the thickness of the inner electrode, and may reduce the thermal stress after sintering, thereby preventing cracks on the edge portion.

[0062] The auxiliary electrodes 121d and 122d may include oxide regions 121d1, 121d2, 122d1, and 122d2 including oxides located at the ends of the auxiliary electrodes 121d and 122d in the third direction. Since the auxiliary electrodes 121d and 122d include the oxide regions 121d1, 121d2, 122d1, and 122d2, the bonding force between the auxiliary electrodes 121d and 122d and the dielectric layer 111 can be improved, thereby preventing cracks and delamination. In addition, since the auxiliary electrodes 121d and 122d are disposed adjacent to the outer surface of the main body 110 in the third direction, the auxiliary electrodes 121d and 122d may be vulnerable to moisture penetration, but since the auxiliary electrodes 121d and 122d include the oxide regions 121d1, 121d2, 122d1, and 122d2, a reduction in reliability due to moisture penetration can be prevented.

[0063] In order to reduce the step difference caused by the thickness of the internal electrode, when the dielectric material is coated on the area where the internal electrode pattern is not printed after the internal electrode pattern is printed on the green ceramic sheet, an additional process of coating the dielectric material is required, which may reduce the productivity. According to an embodiment, the auxiliary electrodes 121d and 122d can be formed by being printed simultaneously with the internal electrode pattern without adding another process, so that the step difference caused by the thickness of the internal electrode can be prevented without reducing the productivity.

[0064] In the embodiment, when the average width of the auxiliary electrodes 121d and 122d in the third direction is defined as Wd, and the sum of the average widths of the oxide regions 121d1, 121d2, 122d1, and 122d2 in the third direction is defined as Wo, 0.09 ≤ Wo / Wd ≤ 0.5 can be satisfied. Therefore, the effects of preventing cracks and delamination caused by the auxiliary electrodes can be improved.

[0065] When Wo / Wd is less than 0.09, since the oxide region is relatively small, the effects of preventing cracks and delamination may be insufficient, and when Wo / Wd exceeds 0.5, the internal electrode may also be oxidized, thereby reducing the capacitance per unit volume of the multilayer electronic component.

[0066] Referring to Figure 4 , Wo can be the sum of the average width Wo1 of the oxide region 121d1 disposed at one end of the auxiliary electrode 121d in the third direction and the average width Wo2 of the oxide region 121d2 disposed at the other end of the auxiliary electrode 121d in the third direction.

[0067] The numerical range of Wd is not limited to any specific example, and for example, Wd can be in the range of 0.1 μm to 100 μm. In this case, Wo can be controlled to satisfy 0.09 ≤ Wo / Wd ≤ 0.5.

[0068] Figure 8 is an image obtained by scanning a cross-section taken along line II-II' in Figure 1 using a scanning electron microscope. Figure 9 is Figure 8 a scanned and magnified image of the auxiliary electrode in

[0069] The method for measuring Wd and Wo will be described with reference to Figure 8 and Figure 9 . Wd and Wo can be measured by observing an image obtained by using a scanning electron microscope (SEM) to observe a cross-section cut from the center of the main body in the second direction in the first and third directions. As Figure 9As shown, in an embodiment, an oxide region may be provided at an end of the auxiliary electrode in the third direction. In the SEM image, the oxide region can be observed to be darker than the non-oxide region, and the oxide region and the non-oxide region can be distinguished from each other by the naked eye. Therefore, an image program can be used to distinguish the oxide region, and the width Wo' of the oxide region and the width Wd' of the auxiliary electrode can be measured.

[0070] As shown in Table 1 below, the width Wd' of each of the nine auxiliary electrodes and the width Wo' of their oxide regions can be measured, and then Wo' / Wd' can be calculated. The arithmetic means of Wo', Wd', and Wo / Wd' can be determined as Wo, Wd, and Wo / Wd, respectively.

[0071] [Table 1]

[0072] To observe the effect of preventing cracks and delamination due to the formation of the oxide region, an inventive example of a multilayer ceramic capacitor in Figure 8 was prepared, and Comparative Example 1 and Comparative Example 2 in which auxiliary electrodes were included but the auxiliary electrodes did not include oxide regions at the ends in the third direction were prepared, and whether cracks were formed was observed. The formation of the oxide region in the auxiliary electrode was controlled by adjusting the firing conditions. For the inventive example, the firing process was carried out in a weak reducing atmosphere, and for Comparative Example 1 and Comparative Example 2, the firing process was carried out in a strong reducing atmosphere.

[0073] For each of 26 samples of the inventive example and Comparative Example 1 and Comparative Example 2, it was confirmed whether cracks and delamination occurred, and the number of samples in which cracks and delamination occurred is listed in Table 2 below. Additionally, as shown in Table 2 below, if the auxiliary electrode included an oxide region, it was marked as "O", and if the auxiliary electrode did not include an oxide region, it was marked as "X".

[0074] Cracks and delamination were confirmed by observing an image obtained by using an optical microscope to observe a cross-section in the first and third directions cut from the center of the main body in the second direction. When a crack greater than or equal to 1 μm was observed or a gap between layers greater than or equal to 1 μm was observed, the sample was determined to be defective, and the number of defective samples is listed in Table 2.

[0075] [Table 2]

[0076] Referring to Table 2, in the inventive example in which the auxiliary electrode included an oxide region, cracks and delamination did not occur in any of the 26 samples.

[0077] In Comparative Example 1 and Comparative Example 2 in which the auxiliary electrode does not include an oxide region, the occurrence rate of cracks and delamination exceeds 60%.

[0078] Figure 10 is a scanned image of the W-direction - T-direction cross section of Comparative Example 1. Figure 11 is a scanned image of the W-direction - T-direction cross section of Comparative Example 2. As Figure 10 and Figure 11 shown in, in Comparative Example 1 and Comparative Example 2, cracks of 1 μm or more were observed between the auxiliary electrode and the inner electrode, or gaps between layers of 1 μm or more were observed.

[0079] In an embodiment, the oxide region may be provided on both one end and the other end of the auxiliary electrode in the third direction. However, the embodiment is not limited thereto, and in an embodiment, the oxide region may be provided only on one of one end and the other end of the auxiliary electrode in the third direction.

[0080] In an embodiment, based on the total area of the auxiliary electrode, the area fraction occupied by the oxide in the auxiliary electrode may be greater than or equal to 10% and less than or equal to 40%. The region other than the oxide region in the auxiliary electrode may also include an oxide, but the area fraction occupied by the oxide in the region other than the oxide region is limited. Thus, an auxiliary capacitance may be formed in the auxiliary electrode. For example, the area fraction occupied by the oxide in the central portion of the auxiliary electrode may be less than 10%. Here, the central portion of the auxiliary electrode may represent the region located in the middle when the auxiliary electrode is divided into five equal parts in the third direction. More preferably, the area fraction occupied by the oxide in the central portion of the auxiliary electrode may be less than 5%.

[0081] An SEM image may be used to obtain the area fraction occupied by the oxide in the auxiliary electrode. Referring to Figure 9 , since the oxide can be clearly distinguished by the brightness difference in the SEM image, the area fraction may be calculated by the brightness difference using an image analysis program. In addition, for more accurate analysis, the area fraction may be calculated by analyzing the scanned image using an SEM - energy dispersive X-ray spectrometer (EDS).

[0082] The area fraction occupied by the oxide in the ends of the inner electrodes 121 and 122 in the third direction may be less than 10%. In addition, different from the auxiliary electrodes 121d and 122d, the oxide region may not be provided in the ends of the inner electrodes 121 and 122 in the third direction. Here, the ends of the inner electrode in the third direction may represent the regions located in the first part and the last part when the inner electrode is divided into five equal parts in the third direction. More preferably, the area fraction occupied by the oxide in the ends of the inner electrodes 121 and 122 in the third direction may be less than 5%.

[0083] The conductive metal included in the auxiliary electrodes 121d and 122d may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and their alloys, but the embodiments are not limited thereto. However, in order to easily form the auxiliary electrodes 121d and 122d and the inner electrodes 121 and 122 by a single printing process, the auxiliary electrodes 121d and 122d may include the same conductive metal as the conductive metal included in the inner electrodes 121 and 122. For example, the auxiliary electrodes 121d and 122d may include Ni, and the oxide included in the auxiliary electrodes 121d and 122d may be Ni oxide.

[0084] In an embodiment, the inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 is spaced apart from the fourth surface 4 and connected to the third surface 3. The second inner electrode 122 is spaced apart from the third surface 3 and connected to the fourth surface 4. The auxiliary electrodes 121d and 122d may include a first auxiliary electrode 121d and a second auxiliary electrode 122d. The first auxiliary electrode 121d is disposed on both sides of the first inner electrode 121 in the third direction, and the second auxiliary electrode 122d is disposed on both sides of the second inner electrode 122 in the third direction. In addition, the first auxiliary electrode 121d and the second auxiliary electrode 122d may partially overlap each other in the first direction.

[0085] Therefore, similar to the first inner electrode 121 and the second inner electrode 122, the first auxiliary electrode 121d and the second auxiliary electrode 122d may be alternately disposed in the first direction, and the dielectric layer 111 is located therebetween.

[0086] In an embodiment, the first auxiliary electrode 121d may be spaced apart from the fourth surface 4 and may be connected to the third surface 3, and the second auxiliary electrode 122d may be spaced apart from the third surface 3 and may be connected to the fourth surface 4.

[0087] Therefore, the first auxiliary electrode 121d may be connected to the first external electrode 131, the second auxiliary electrode 122d may be connected to the second external electrode 132, and the first auxiliary electrode 121d and the second auxiliary electrode 122d may form auxiliary capacitance forming portions Ad1 and Ad2 that contribute to capacitance formation. Therefore, according to the embodiment, since the multilayer electronic component 100 includes the auxiliary capacitance forming portions Ad1 and Ad2, the capacitance per unit volume of the multilayer electronic component 100 can be improved.

[0088] In an embodiment, when the average width in the third direction of the region where the fifth surface and the inner electrode are spaced apart from each other is defined as Wm, and the average width in the third direction of the auxiliary electrode disposed in the region where the fifth surface and the inner electrode are spaced apart from each other is defined as Wd, 0.05 ≤ Wd / Wm < 1 can be satisfied. In this case, the average width in the third direction of the region where the sixth surface and the inner electrode are spaced apart from each other can be substantially the same as Wm, and the average width in the third direction of the auxiliary electrode disposed in the region where the sixth surface and the inner electrode are spaced apart from each other can be substantially the same as Wd. Therefore, the average width in the third direction of the region where the sixth surface and the inner electrode are spaced apart from each other can also be defined as Wm, and the average width in the third direction of the auxiliary electrode disposed in the region where the sixth surface and the inner electrode are spaced apart from each other can also be defined as Wd.

[0089] When Wd / Wm is 1, the auxiliary electrodes 121d and 122d are exposed to the fifth surface and the sixth surface of the main body 110, thereby possibly degrading the moisture-proof reliability. And when Wd / Wm is less than 0.05, the effect of preventing cracks and delamination may be insufficient.

[0090] In an embodiment, when the average width in the third direction of the region where the fifth surface and the inner electrode are spaced apart from each other is defined as Wm, and the average thickness in the third direction of the region where the inner electrode and the auxiliary electrode are spaced apart from each other in the third direction is defined as Wg, 0.03 ≤ Wg / Wm can be satisfied.

[0091] When Wg / Wm is less than 0.03, the auxiliary electrode and the inner electrode may be connected due to blurred printing, which may be problematic.

[0092] In an embodiment, when the average width in the third direction of the inner electrode is defined as Wi, and the average width in the third direction of the auxiliary electrode is defined as Wd, 0.03 ≤ Wd / Wi ≤ 0.20 can be satisfied.

[0093] When Wd / Wi exceeds 0.20, the capacitance per unit volume may decrease, and when Wd / Wi is less than 0.03, the effect of preventing cracks and delamination may be insufficient.

[0094] Wm, Wg, Wd, and Wi can be measured by observing an image obtained from a cross-section in the first direction and the third direction cut from the center of the main body 110 in the second direction, and can be measured from an SEM scan image as in Figure 8 and their values can be the average values of the values measured from nine auxiliary electrodes and inner electrodes located at the center of the main body in the first direction.

[0095] The method of forming oxide regions 121d1, 121d2, 122d1, and 122d including an oxide on the third-direction ends of auxiliary electrodes 121d and 122d is not limited to any specific example. However, even when using the same paste as that for forming inner electrodes 121 and 122, auxiliary electrodes 121d and 122d can be disposed close to the outer surface of the main body and are likely to be greatly affected by the sintering temperature, sintering atmosphere, and heat treatment duration. Therefore, oxide regions 121d1, 121d2, 122d1, and 122d can be formed and their lengths can be adjusted by controlling the sintering temperature, sintering atmosphere, and heat treatment duration.

[0096] Outer electrodes 131 and 132 can be disposed on the third surface 3 and the fourth surface 4 of the main body 110.

[0097] Outer electrodes 131 and 132 can be respectively disposed on the third surface 3 and the fourth surface 4 of the main body 110, and can include a first outer electrode 131 and a second outer electrode 132 respectively connected to the first inner electrode 121 and the second inner electrode 122.

[0098] In an embodiment, the multilayer electronic component 100 can have two outer electrodes 131 and 132, but the number or shape of the outer electrodes 131 and 132 can vary according to the shape of the inner electrodes 121 and 122 or other purposes.

[0099] Outer electrodes 131 and 132 can be formed using any conductive material (such as a metal), and specific materials can be determined considering electrical characteristics and structural stability, and outer electrodes 131 and 132 can have a multilayer structure.

[0100] For example, outer electrodes 131 and 132 can include electrode layers 131a and 132a disposed on the main body 110 and plating layers 131b and 132b disposed on the electrode layers 131a and 132a.

[0101] For more specific examples of the electrode layers 131a and 132a, the electrode layers 131a and 132a can be fired electrodes including a conductive metal and glass, and / or can be resin-based electrodes including a conductive metal and resin.

[0102] In addition, in the electrode layers 131a and 132a, the fired electrode and the resin-based electrode can be sequentially formed on the main body 110. In addition, the electrode layers 131a and 132a can be formed by transferring a sheet including a conductive metal to the main body 110, or can be formed by transferring a sheet including a conductive metal to the fired electrode.

[0103] A material with excellent conductivity can be used as the conductive metal included in the electrode layers 131a and 132a, and it is not limited to any specific example. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and their alloys.

[0104] The plating layers 131b and 132b can improve the mounting characteristics. The types of the plating layers 131b and 132b are not limited to any specific example, and the plating layers 131b and 132b can be a single plating layer including one or more of Ni, Sn, Pd, and their alloys, or can be formed into multiple layers.

[0105] For more specific examples of the plating layers 131b and 132b, the plating layers 131b and 132b can be Ni plating layers or Sn plating layers, or can be in a form where Ni plating layers and Sn plating layers are sequentially formed on the electrode layers 131a and 132a, or can be in a form where Sn plating layers, Ni plating layers, and Sn plating layers are sequentially formed on the electrode layers 131a and 132a. In addition, the plating layers 131b and 132b can include multiple Ni plating layers and / or multiple Sn plating layers.

[0106] The size of the multilayer electronic component 100 is not limited to any specific example.

[0107] However, the effect of improving reliability and the effect of preventing cracks and delamination in the embodiments can be significant in the multilayer electronic component 100 with a size of 1608 (length × width: 1.6 mm × 0.8 mm) or smaller.

[0108] Considering manufacturing errors and the size of the outer electrodes, when the length of the multilayer electronic component 100 is less than or equal to 1.7 mm and the width is less than or equal to 0.9 mm, the effect of improving reliability and the effect of improving the capacitance per unit volume in the embodiments can be significant. Here, the length of the multilayer electronic component 100 can represent the maximum size of the multilayer electronic component 100 in the second direction, and the width of the multilayer electronic component 100 can represent the maximum size of the multilayer electronic component 100 in the third direction.

[0109] According to the foregoing embodiments, by providing auxiliary electrodes including oxide regions on both sides in the width direction of the inner electrodes, the reliability of the multilayer electronic component can be improved.

[0110] In addition, the influence of the step difference at the edge portion can be alleviated.

[0111] In addition, cracks and delamination can be prevented.

[0112] The scope of the present disclosure is not limited to the specific embodiments. More precisely, variants, equivalents, and alternatives included in the disclosed concept and technical scope of this specification can be adopted.

[0113] In an embodiment, the term "embodiment" does not refer to the same embodiment and may be provided to describe and emphasize different features of each embodiment. The embodiments proposed above may be implemented without excluding the possibility of combining features with other embodiments. For example, unless otherwise stated, even if the features described in an embodiment are not described in another embodiment, the description may be understood as being relevant to another embodiment.

[0114] Unless the context clearly dictates otherwise, singular statements cover plural statements.

[0115] Although the embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: a body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction, and the body includes a dielectric layer, inner electrodes alternately arranged with the dielectric layer in the first direction, and auxiliary electrodes spaced apart from the inner electrodes and disposed on both sides of the inner electrodes in the third direction; and an outer electrode disposed on the body, wherein at least one of the auxiliary electrodes includes an oxide region located at an end of the at least one auxiliary electrode in the third direction, and the oxide region includes an oxide.

2. The multilayer electronic component according to claim 1, wherein, When the average width of the auxiliary electrode in the third direction is defined as Wd and the sum of the average widths of the oxide regions in the third direction is defined as Wo, 0.09 ≤ Wo / Wd ≤ 0.5 is satisfied.

3. The multi-layer electronic component according to claim 2, wherein, Wd is greater than or equal to 0.1 μm and less than or equal to 100 μm.

4. The multilayer electronic component according to claim 1, wherein, The oxide region is disposed on both an end and the other end of the at least one of the auxiliary electrodes in the third direction.

5. The multilayer electronic component according to claim 1, wherein, Based on the total area of the at least one of the auxiliary electrodes, the area fraction occupied by the oxide in the at least one of the auxiliary electrodes is greater than or equal to 10% and less than or equal to 40%.

6. The multilayer electronic component according to claim 1, wherein, At least one of the auxiliary electrodes includes Ni, and the oxide is Ni oxide.

7. The multilayer electronic component according to claim 1, Among them, wherein the inner electrodes include a first inner electrode and a second inner electrode, the first inner electrode is spaced apart from the fourth surface and connected to the third surface, the second inner electrode is spaced apart from the third surface and connected to the fourth surface, and wherein the auxiliary electrodes include a first auxiliary electrode and a second auxiliary electrode, the first auxiliary electrode is disposed on each of both sides of the first inner electrode in the third direction, and the second auxiliary electrode is disposed on each of both sides of the second inner electrode in the third direction.

8. The multilayer electronic component according to claim 7, Among them, wherein the first auxiliary electrode is spaced apart from the fourth surface and connected to the third surface, and wherein the second auxiliary electrode is spaced apart from the third surface and connected to the fourth surface.

9. The multi-layer electronic component according to claim 1, wherein, When the average width of the region where the fifth surface and the inner electrode are spaced apart from each other in the third direction is defined as Wm, and the average width of the auxiliary electrode disposed in the region where the fifth surface and the inner electrode are spaced apart from each other in the third direction is defined as Wd, 0.05 ≤ Wd / Wm < 1 is satisfied.

10. The multilayer electronic component according to claim 1, wherein, When the average width in the third direction of the region where the fifth surface and the inner electrode are spaced apart from each other is defined as Wm, and the average width in the third direction of the region where the inner electrode and the auxiliary electrode are spaced apart from each other in the third direction is defined as Wg, 0.03 ≤ Wg / Wm is satisfied.

11. The multilayer electronic component according to claim 1, wherein, When the average width in the third direction of the inner electrode is defined as Wi and the average width in the third direction of the auxiliary electrode is defined as Wd, 0.03 ≤ Wd / Wi ≤ 0.20 is satisfied.

12. The multilayer electronic component according to claim 1, wherein, The area fraction occupied by the oxide in the central portion of at least one of the auxiliary electrodes is less than 10%.

13. The multilayer electronic component according to claim 1, wherein, The area fraction occupied by the oxide at both ends in the third direction of at least one of the inner electrodes is less than 10%.

14. A multilayer electronic component, comprising: A main body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction, and the main body includes a dielectric layer, inner electrodes alternately arranged with the dielectric layer in the first direction, and auxiliary electrodes spaced apart from the inner electrodes and arranged on both sides of the inner electrodes in the third direction; And An outer electrode provided on the main body, Wherein, the inner electrodes include a first inner electrode and a second inner electrode, the first inner electrode is spaced apart from the fourth surface and connected to the third surface, and the second inner electrode is spaced apart from the third surface and connected to the fourth surface, Wherein, the auxiliary electrodes include a first auxiliary electrode and a second auxiliary electrode, the first auxiliary electrode is provided on each of the two sides of the first inner electrode in the third direction, and the second auxiliary electrode is provided on each of the two sides of the second inner electrode in the third direction, Wherein, the first auxiliary electrode is spaced apart from the fourth surface and connected to the third surface, Wherein, the second auxiliary electrode is spaced apart from the third surface and connected to the fourth surface, and Wherein, the first auxiliary electrode and the second auxiliary electrode partially overlap each other in the first direction.

15. The multilayer electronic component according to claim 14, wherein, When the average width in the third direction of the region where the fifth surface and the inner electrode are spaced apart from each other is defined as Wm, and the average width in the third direction of the auxiliary electrode provided in the region where the fifth surface and the inner electrode are spaced apart from each other is defined as Wd, 0.05 ≤ Wd / Wm < 1 is satisfied.

16. The multilayer electronic component according to claim 14, wherein, When the average width in the third direction of the region where the fifth surface and the inner electrode are spaced apart from each other is defined as Wm, and the average width in the third direction of the region where the inner electrode and the auxiliary electrode are spaced apart from each other in the third direction is defined as Wg, 0.03 ≤ Wg / Wm is satisfied.

17. The multilayer electronic component according to claim 14, wherein, When the average width of the inner electrode in the third direction is defined as Wi and the average width of the auxiliary electrode in the third direction is defined as Wd, 0.03 ≤ Wd / Wi ≤ 0.20 is satisfied.

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