Wafer separation device for semiconductor processing

Abstract

The invention relates to the field of semiconductor processing, and discloses a wafer separating device for semiconductor processing, which comprises a sleeve block, a mounting shell and a mounting plate, the mounting shell fixedly sleeves the middle part of the sleeve block, the mounting plate fixedly sleeves the upper part of the inner cavity of the mounting shell, and the two sides of the left side of the mounting plate are symmetrically and fixedly sleeved with breathable blocks and a driving mechanism. The driving mechanism is arranged on the upper surface of the mounting plate, the rotating shaft is in threaded connection to the middle of the mounting plate, and the upper portion of the rotating shaft is slidably sleeved with a gear sleeve. The first elastic piece is limited to pull the air suction sleeve downwards to move upwards through hydraulic fluid between the sliding plate in the inner cavity of the mounting shell and the air suction sleeve, so that when the wafer is separated from the substrate, the adsorption mechanism stably pulls the wafer to move upwards at the upward moving speed of the rotating shaft, and the problem that when an existing wafer is separated from the substrate, the wafer cannot move upwards is solved. And the adsorption device rigidly pulls the wafer to be separated from the viscous substrate and move upwards, so that the wafer vibrates violently and accelerates instantaneously, and the problems of stress concentration, breakage and bending of the wafer are caused.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technologies, and particularly relates to a wafer separation device for semiconductor processing. Background Art

[0002] A wafer separation device is a device for separating a wafer from an adhered substrate.

[0003] In the prior art, when the adsorption device separates the wafer from the viscous substrate, the wafer is usually lifted from the substrate by a hard pulling method. This method is extremely likely to cause violent vibration of the wafer and stress concentration caused by gravitational acceleration, resulting in problems such as wafer breakage or bending, seriously affecting the quality and yield of the wafer. In addition, when the existing adsorption device adsorbs the wafer, due to the sudden increase in adsorption pressure, it is easy to cause wafer deformation. Especially for wafers with a smaller thickness, this deformation is more obvious. This not only limits the production efficiency but also increases the manufacturing cost. In addition, the adsorption device uses valve-controlled constant-pressure adsorption. When adsorbing wafers thicker than the standard thickness, the wafers are likely to fall off the adsorption device. When adsorbing wafers thinner than the standard thickness, problems such as wafer bending and deformation are caused. Summary of the Invention

[0004] The present application proposes a wafer separation device for semiconductor processing, which has the advantages of uniform force application and controllable adsorption force, and is used to solve the problems of wafer breakage and bending caused by the hard pulling of the adsorption device when separating the wafer from the substrate.

[0005] To achieve the above object, the present application adopts the following technical solution: A wafer separation device for semiconductor processing, comprising:

[0006] A sleeve block and a mounting shell, the mounting shell is fixedly sleeved in the middle of the sleeve block;

[0007] [[ID=·25]]A mounting plate, the mounting plate is fixedly sleeved in the upper part of the inner cavity of the mounting shell, and air-permeable blocks are symmetrically and fixedly sleeved on both sides of the left side of the mounting plate;

[0008] A driving mechanism, the driving mechanism is arranged on the upper surface of the mounting plate;

[0009] A rotating shaft, the rotating shaft is threadedly connected to the middle of the mounting plate, and a gear sleeve is slidably sleeved on the upper part of the rotating shaft;

[0010] A pulling mechanism, the pulling mechanism is arranged at the bottom of the rotating shaft and the middle of the inner cavity of the mounting shell;

[0011] A guiding mechanism, the guiding mechanism is arranged in the middle of the mounting plate;

[0012] An adsorption mechanism, the adsorption mechanism is arranged between the bottom of the mounting shell and the bottom of the guiding mechanism;

[0013] An electromagnetic mechanism, which is arranged in the middle between the pulling mechanism and the adsorption mechanism;

[0014] Hydraulic fluid, which is arranged between the bottom end of the inner cavity mounting plate of the sleeve block and the top end of the adsorption mechanism.

[0015] Preferably, the driving mechanism includes a first driving member, which is fixedly installed on the upper surface of the mounting plate. The output end of the first driving member is fixedly installed with a gear, and the gear meshes with the gear sleeve. The upper and lower sides of the gear are symmetrically and fixedly installed with limit blocks, and the gear sleeve is located in the middle of the two limit blocks. The above structure can drive the rotating shaft during operation, so that the rotating shaft drives the pulling mechanism to move upward, the pulling mechanism drives the adsorption mechanism to move upward, and the adsorption mechanism drives the wafer to separate from the substrate.

[0016] Preferably, the pulling mechanism includes a sliding plate, which is movably sleeved at the bottom of the rotating shaft. The sliding plate is slidably sleeved with the mounting shell. The left and right sides of the sliding plate are symmetrically and fixedly sleeved with first one-way valves. The front and rear sides of the sliding plate are symmetrically and fixedly sleeved with second one-way valves. The bottom end of the sliding plate is fixedly installed with a first elastic member, and the bottom end of the first elastic member is fixedly connected with the adsorption mechanism. The above structure can control the upward movement speed of the adsorption mechanism driving the wafer during operation.

[0017] Preferably, the diversion mechanism includes a first sleeve, the bottom end of the first sleeve is fixedly installed with a second sleeve, and the bottom end of the second sleeve is fixedly installed with a third sleeve. The first sleeve, the second sleeve and the third sleeve are all slidably sleeved in the middle of the rotating shaft. The top end of the first sleeve is fixedly installed with a second driving member, and the output end of the second driving member is fixedly installed with a connecting rod. The bottom end of the connecting rod is slidably sleeved with a threaded block, and the threaded block is threadedly connected with the second sleeve. The bottom end of the threaded block is fixedly installed with a second elastic member, and the bottom end of the second elastic member is fixedly installed with a piston. The piston is slidably sleeved with the second sleeve. A ring groove is formed at the bottom of the inner cavity of the second sleeve, and the piston is located above the ring groove. The above structure can control the air pressure in the adsorption mechanism cavity and the adsorption pressure of the adsorption mechanism on the wafer during operation.

[0018] Preferably, the adsorption mechanism includes an air suction sleeve, the top end of the air suction sleeve is fixedly installed at the bottom end of the first elastic member, and the third sleeve is slidably sleeved in the middle of the air suction sleeve. The upper part of the inner cavity of the air suction sleeve is slidably sleeved with a connecting sleeve, and the connecting sleeve is fixedly sleeved at the bottom of the third sleeve. A plurality of sets of plug shafts are fixedly sleeved at equal intervals around the circumference of the bottom of the connecting sleeve. A through hole is formed in the middle of the plug shaft. A plug sleeve is fixedly sleeved at the bottom of the inner cavity of the air suction sleeve, and the plug shaft is slidably sleeved with the plug sleeve. A rubber pad is fixedly installed on the bottom surface of the plug sleeve. The above structure can adsorb the wafer to fit on the bottom surface of the rubber pad during operation.

[0019] Preferably, the electromagnetic mechanism includes a limiting ring fixedly installed at the top end of the suction sleeve. A magnetic ring is fixedly installed at the bottom end of the sliding plate, and an electromagnet is fixedly installed at the top end of the suction sleeve.

[0020] Preferably, the air-permeable block is made of a material that is air-permeable but water-impermeable. The contact surfaces of the two limiting blocks and the gear sleeve are smooth surfaces.

[0021] Preferably, the opening direction of the first one-way valve is downward, the opening direction of the second one-way valve is upward, and the resistance for the second one-way valve to open is greater than the elastic force of the first elastic member.

[0022] Preferably, ventilation holes are formed on the left and right sides of the upper surface of the threaded block. The first sleeve, the second sleeve, and the third sleeve are all made of heat-insulating materials.

[0023] Preferably, the plug sleeve is designed as an equilateral hexagon, and the rubber pad is made of rubber material.

[0024] The beneficial effects of the present invention are as follows:

[0025] 1. After the rubber pad fits the surface of the wafer, the electromagnetic mechanism is started in the forward direction. The electromagnetic mechanism pushes the diversion mechanism to move upward. The diversion mechanism drives the connecting sleeve to move upward along the inner cavity of the suction sleeve. The connecting sleeve drives the plug shaft to move upward, increasing the space between the bottom end of the plug shaft in the inner cavity of the plug sleeve and the contact surface of the wafer. As a result, the air pressure between the inner cavity of the connecting sleeve and the bottom of the piston in the inner cavity of the diversion mechanism gradually decreases. At the same time, by setting the second elastic member and the piston, the air pressure between the bottom of the piston in the inner cavity of the diversion mechanism is always kept constant until the top surface of the connecting sleeve moves upward to contact the suction sleeve. At this time, the adsorption pressure between the wafer and the rubber pad is approximately equal to the elastic force of the stretched second elastic member. At the same time, the adsorption pressure between the wafer and the rubber pad gradually increases following the stretching of the second elastic member, thus overcoming the problem that the adsorption pressure suddenly increases and causes the wafer to deform when the existing adsorption device adsorbs the wafer. In addition, by starting the second driving member in the forward direction, the distance when the top end of the piston moves below the top end of the annular groove is increased, increasing the stretching length of the second elastic member. As a result, the negative pressure required in the inner cavity of the third sleeve increases, thereby increasing the adsorption pressure between the wafer and the rubber pad, and thus realizing the adsorption of wafers with different weights with different adsorption pressures, avoiding the problem that the wafer deforms when adsorbing a wafer with a small thickness.

[0026] 2. After the wafer is adsorbed on the bottom surface of the rubber pad in the present invention, when the rotating shaft is started in the forward direction and the sliding plate is driven by the rotating shaft to move upward, the sliding plate pulls the first elastic member to elongate, and the hydraulic fluid above the sliding plate flows to the lower part of the sliding plate through the first one-way valve. When the upward moving sliding plate pulls the adsorption mechanism upward through the first elastic member and the adsorption mechanism pulls the wafer to separate from the substrate, the elastic force generated by the first elastic member cannot alone squeeze the hydraulic fluid at the bottom of the sliding plate through the adsorption mechanism to squeeze the valve of the second one-way valve open. At this time, the hydraulic fluid between the sliding plate and the air suction sleeve in the inner cavity of the mounting shell restricts the first elastic member from pulling the air suction sleeve upward, so that when the wafer is separated from the substrate, the adsorption mechanism steadily pulls the wafer upward at the speed of the upward movement of the rotating shaft, thus avoiding the sudden upward instantaneous movement of the wafer caused by the first elastic member when the wafer is separated from the substrate, which causes violent vibration of the wafer and generates a huge instantaneous gravitational acceleration, resulting in stress concentration of the wafer and causing cracking and bending of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings forming a part of the specification depict the embodiments disclosed in the present application and, together with the specification, are used to explain the principles disclosed in the present application in a clear and understandable manner.

[0028] With reference to the drawings, the present disclosure can be more clearly understood from the following detailed description, wherein:

[0029] Figure 1 is a schematic diagram of the overall external structure of the present invention;

[0030] Figure 2 is a schematic sectional structure diagram of the mounting shell of the present invention;

[0031] Figure 3 is a schematic diagram of the pulling mechanism structure of the present invention;

[0032] Figure 4 is a schematic diagram of the adsorption mechanism structure of the present invention;

[0033] Figure 5 is a schematic diagram of the diversion mechanism structure of the present invention.

[0034] Wherein: 1. sleeve block; 2. mounting shell; 3. mounting plate; 301. air-permeable block; 4. driving mechanism; 401. first driving member; 402. gear; 403. limiting block; 5. rotating shaft; 501. tooth sleeve; 6. pulling mechanism; 601. sliding plate; 602. first one-way valve; 603. second one-way valve; 604. first elastic member; 7. diversion mechanism; 701. first sleeve; 702. second sleeve; 703. third sleeve; 704. second driving member; 705. connecting rod; 706. threaded block; 707. second elastic member; 708. piston; 709. annular groove; 8. adsorption mechanism; 801. suction sleeve; 802. connecting sleeve; 803. plug shaft; 804. plug sleeve; 805. rubber pad; 9. electromagnetic mechanism; 901. limiting ring; 902. magnetic ring; 903. electromagnet. Detailed implementation manner

[0035] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0036] Please refer to Figures 1 to 5 As shown, a wafer separation device for semiconductor processing includes:

[0037] A sleeve block 1 and a mounting shell 2, and the mounting shell 2 is fixedly sleeved in the middle of the sleeve block 1;

[0038] A mounting plate 3, the mounting plate 3 is fixedly sleeved on the upper part of the inner cavity of the mounting shell 2, and two air-permeable blocks 301 are symmetrically and fixedly sleeved on both sides of the left side of the mounting plate 3. The air-permeable blocks 301 are made of air-permeable and water-impermeable materials and are made of waterproof cloth, so that the air pressure between the mounting plate 3 and the pulling mechanism 6 is always the same as the atmospheric pressure outside the device, so as to maintain the stable cyclic exchange of the hydraulic fluid on the upper and lower sides of the pulling mechanism 6 in the inner cavity of the mounting shell 2;

[0039] A driving mechanism 4, and the driving mechanism 4 is arranged on the upper surface of the mounting plate 3;

[0040] A rotating shaft 5, the rotating shaft 5 is threadedly connected to the middle of the mounting plate 3, and a tooth sleeve 501 is slidably sleeved on the upper part of the rotating shaft 5;

[0041] A pulling mechanism 6, and the pulling mechanism 6 is arranged at the bottom of the rotating shaft 5 and the middle of the inner cavity of the mounting shell 2;

[0042] A diversion mechanism 7, and the diversion mechanism 7 is arranged in the middle of the mounting plate 3;

[0043] The adsorption mechanism 8 is arranged between the bottom of the installation shell 2 and the bottom of the diversion mechanism 7;

[0044] The electromagnetic mechanism 9 is arranged in the middle between the pulling mechanism 6 and the adsorption mechanism 8;

[0045] The hydraulic fluid is arranged between the bottom end of the inner cavity mounting plate 3 of the sleeve block 1 and the top end of the adsorption mechanism 8.

[0046] Please refer to Figure 1 and Figure 2 As shown in

[0047] The contact surfaces of the two limit blocks 403 and the tooth sleeve 501 are smooth surfaces, so as to reduce the frictional resistance between the limit blocks 403 and the tooth sleeve 501, reduce the rotational load of the first driving member 401, and at the same time, the two limit blocks 403 limit the up and down positions of the tooth sleeve 501 to prevent the tooth sleeve 501 from moving up and down;

[0048] During use, when the output end of the first driving member 401 rotates forward, the output end of the first driving member 401 drives the gear 402 to rotate. The gear 402 drives the rotating shaft 5 to rotate. The rotating shaft 5 moves upward and rotates along the mounting plate 3 threadedly connected thereto. At the same time, since the two limit blocks 403 limit the tooth sleeve 501, at this time, the rotating shaft 5 slides upward along the tooth sleeve 501.

[0049] Please refer to Figures 1 to 3 As shown in

[0050] The opening direction of the first one-way valve 602 is downward, and the opening direction of the second one-way valve 603 is upward. The resistance to opening the valve of the second one-way valve 603 is greater than the elastic force of the first elastic member 604. Thus, when the adsorption mechanism 8 adsorbs on the upper surface of the wafer and the wafer adheres to the adhesion substrate, when the rotating shaft 5 rotating forward drives the sliding plate 601 to move upward, the sliding plate 601 pulls the first elastic member 604 to elongate, and the hydraulic fluid above the sliding plate 601 flows through the first one-way valve 602 to the lower part of the sliding plate 601. When the wafer is separated from the substrate, the elastic force generated by the first elastic member 604 cannot separately open the valve of the second one-way valve 603 by squeezing the hydraulic fluid at the bottom of the sliding plate 601 through the adsorption mechanism 8. Therefore, when the wafer is separated from the substrate, the first elastic member 604 will not suddenly pull the wafer to move upward instantaneously, causing violent vibration of the wafer and generating a huge gravitational acceleration, resulting in stress concentration of the wafer and causing the wafer to crack and bend.

[0051] Please refer to Figures 1 to 5 As shown, the diversion mechanism 7 includes a first sleeve 701. A second sleeve 702 is fixedly installed at the bottom end of the first sleeve 701. A third sleeve 703 is fixedly installed at the bottom end of the second sleeve 702. The first sleeve 701, the second sleeve 702, and the third sleeve 703 are all slidably sleeved on the middle part of the rotating shaft 5. A second driving member 704 is fixedly installed at the top end of the first sleeve 701. A connecting rod 705 is fixedly installed at the output end of the second driving member 704. A threaded block 706 is slidably sleeved at the bottom end of the connecting rod 705. The threaded block 706 is threadedly connected to the second sleeve 702. A second elastic member 707 is fixedly installed at the bottom end of the threaded block 706. A piston 708 is fixedly installed at the bottom end of the second elastic member 707. The piston 708 is slidably sleeved in the second sleeve 702. An annular groove 709 is formed at the bottom of the inner cavity of the second sleeve 702. The piston 708 is located above the annular groove 709;

[0052] Vent holes are formed on the left and right sides of the upper surface of the threaded block 706, so that the hot air entering the first sleeve 701 flows through the vent holes to the lower part of the threaded block 706. The first sleeve 701, the second sleeve 702, and the third sleeve 703 are all made of heat-insulating materials. The first sleeve 701, the second sleeve 702, and the third sleeve 703 are all made of high-carbon steel, so as to reduce the loss of heat of the hot air flowing through the middle parts of the first sleeve 701, the second sleeve 702, and the third sleeve 703;

[0053] During use, the second driving member 704 is started in the forward direction. The output end of the second driving member 704 drives the connecting rod 705 to rotate. The connecting rod 705 drives the threaded block 706 to rotate. The threaded block 706 rotates along the threaded surface of the second sleeve 702 and moves upward. The threaded block 706 drives the piston 708 to move upward through the second elastic member 707, increasing the distance between the top of the piston 708 and the top of the annular groove 709. Thus, when the piston 708 moves downward until the top of the piston 708 moves below the top of the annular groove 709, the distance increases, the stretching length of the second elastic member 707 increases, and the negative pressure required in the inner cavity of the third sleeve 703 increases;

[0054] In addition, before the adsorption mechanism 8 adsorbs the wafer, high-temperature gas is introduced into the inner cavity of the first sleeve 701. The high-temperature gas is sprayed onto the surface of the wafer through the flow guiding mechanism 7, the inner cavity of the connecting sleeve 802, and the plug shaft 803 in sequence to heat the wafer, reducing the viscosity of the colloid between the wafer and the substrate and facilitating the subsequent separation of the wafer from the substrate.

[0055] Please refer to Figures 1 to 4 As shown, the adsorption mechanism 8 includes an air suction sleeve 801. The top of the air suction sleeve 801 is fixedly installed at the bottom end of the first elastic member 604. The third sleeve 703 is slidably sleeved in the middle of the air suction sleeve 801. The upper part of the inner cavity of the air suction sleeve 801 is slidably sleeved with a connecting sleeve 802. The connecting sleeve 802 is fixedly sleeved at the bottom of the third sleeve 703. A plurality of groups of plug shafts 803 are fixedly sleeved at equal intervals on the circumference of the bottom of the connecting sleeve 802. A through hole is provided in the middle of the plug shaft 803. A plug sleeve 804 is fixedly sleeved at the bottom of the inner cavity of the air suction sleeve 801. The plug shaft 803 is slidably sleeved with the plug sleeve 804. A rubber pad 805 is fixedly installed on the bottom surface of the plug sleeve 804;

[0056] The rubber pad 805 is made of rubber material, thus preventing the hard plug sleeve 804 from directly contacting the wafer and scratching the surface of the wafer. The plug sleeve 804 is designed as an equilateral hexagon, so that the rubber pad 805 at its bottom contacts the wafer evenly, avoiding uneven stress;

[0057] During use, when the rubber pad 805 adheres to the surface of the wafer, when the electromagnetic mechanism 9 drives the flow guiding mechanism 7 to move upward, the flow guiding mechanism 7 drives the connecting sleeve 802 to move upward along the inner cavity of the air suction sleeve 801. The connecting sleeve 802 drives the plug shaft 803 to move upward. The space between the bottom end of the plug shaft 803 and the contact surface of the wafer in the inner cavity of the plug sleeve 804 increases. Furthermore, the air pressure between the inner cavity of the connecting sleeve 802 and the bottom of the piston 708 in the inner cavity of the flow guiding mechanism 7 decreases, attracting the piston 708 to pull the second elastic member 707 to stretch and move downward.

[0058] Please refer to Figure 3As shown in the figure, the electromagnetic mechanism 9 includes a limit ring 901, which is fixedly installed at the top end of the suction sleeve 801. A magnetic ring 902 is fixedly installed at the bottom end of the sliding plate 601, and an electromagnet 903 is fixedly installed at the top end of the suction sleeve 801;

[0059] Among them, the limit ring 901 is used to limit the upward movement distance of the suction sleeve 801, so as to prevent the connecting sleeve 802 from driving the suction sleeve 801 to move upward when the connecting sleeve 802 moves upward along the inner cavity of the suction sleeve 801. During use, the magnetic ring 902 is energized, and the magnetic ring 902 pushes the electromagnet 903 to move upward, and the electromagnet 903 drives the flow guiding mechanism 7 to move.

[0060] Working principle:

[0061] In the present invention, after the rubber pad 805 fits the surface of the wafer, the electromagnetic mechanism 9 is started forward. The electromagnetic mechanism 9 pushes the flow guiding mechanism 7 to move upward. The flow guiding mechanism 7 drives the connecting sleeve 802 to move upward along the inner cavity of the suction sleeve 801. The connecting sleeve 802 drives the plug shaft 803 to move upward. The space between the bottom end of the plug shaft 803 in the inner cavity of the plug sleeve 804 and the contact surface of the wafer increases. As a result, the air pressure between the inner cavity of the connecting sleeve 802 and the bottom of the piston 708 in the inner cavity of the flow guiding mechanism 7 gradually decreases, attracting the piston 708 to pull the second elastic member 707 to elongate and move downward. When the piston 708 moves downward until the top end of the piston 708 moves below the top end of the annular groove 709, at this time, the air above the piston 708 flows to the lower part of the piston 708, and the air pressure between the inner cavity of the connecting sleeve 802 and the bottom of the piston 708 in the inner cavity of the flow guiding mechanism 7 returns upward. At this time, the second elastic member 707 returns upward, pulling the piston 708 to move upward, and so on;

[0062] Thus, the air pressure between the inner cavity of the connecting sleeve 802 and the bottom of the piston 708 in the inner cavity of the flow guiding mechanism 7 is always kept unchanged until the top surface of the connecting sleeve 802 moves upward to contact the suction sleeve 801. At this time, the adsorption pressure between the wafer and the rubber pad 805 is approximately equal to the elastic force of the second elastic member 707 being stretched. At the same time, the adsorption pressure between the wafer and the rubber pad 805 gradually increases following the stretching of the second elastic member 707, thereby overcoming the problem that the adsorption pressure suddenly increases and causes the wafer to deform when the existing adsorption device adsorbs the wafer. In addition, by starting the second driving member 704 forward, the distance when the top end of the piston 708 moves below the top end of the annular groove 709 is increased, the stretching length of the second elastic member 707 is increased, and thus the negative pressure required in the inner cavity of the third sleeve 703 increases, thereby increasing the adsorption pressure between the wafer and the rubber pad 805, so as to realize the adsorption of wafers with different weights with different adsorption pressures and avoid the wafer being adsorbed and deformed;

[0063] In addition, when the wafer is adsorbed on the bottom surface of the rubber pad 805 in the present invention, when the rotating shaft 5 is started in the forward direction and the rotating shaft 5 drives the sliding plate 601 to move upward, the sliding plate 601 pulls the first elastic member 604 to elongate, and the hydraulic fluid above the sliding plate 601 flows to the lower part of the sliding plate 601 through the first one-way valve 602. When the upward-moving sliding plate 601 pulls the adsorption mechanism 8 upward through the first elastic member 604 and the adsorption mechanism 8 pulls the wafer away from the substrate, the elastic force generated by the first elastic member 604 cannot separately squeeze the hydraulic fluid at the bottom of the sliding plate 601 through the adsorption mechanism 8 to squeeze the valve of the second one-way valve 603 to open. At this time, the hydraulic fluid between the sliding plate 601 and the suction sleeve 801 in the inner cavity of the mounting shell 2 restricts the first elastic member 604 from pulling the suction sleeve 801 upward. Thus, when the wafer is separated from the substrate, the adsorption mechanism 8 steadily pulls the wafer upward at the speed of the upward movement of the rotating shaft 5, thereby avoiding the sudden upward instantaneous movement of the wafer caused by the sudden pulling of the first elastic member 604 when the wafer is separated from the substrate, which may cause severe vibration of the wafer and generate a huge gravitational acceleration, resulting in stress concentration of the wafer and causing cracking and bending of the wafer.

[0064] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered by the scope of the claims of the present invention.

Claims

1. A wafer separation device for semiconductor processing, characterized in that, Including: A sleeve block (1) and a mounting shell (2), the mounting shell (2) is fixedly sleeved in the middle of the sleeve block (1); A mounting plate (3), the mounting plate (3) is fixedly sleeved in the upper part of the inner cavity of the mounting shell (2), and breathable blocks (301) are symmetrically and fixedly sleeved on both sides of the left side of the mounting plate (3); A driving mechanism (4), the driving mechanism (4) is arranged on the upper surface of the mounting plate (3); A rotating shaft (5), the rotating shaft (5) is threadedly connected to the middle of the mounting plate (3), and a gear sleeve (501) is slidably sleeved on the upper part of the rotating shaft (5); A pulling mechanism (6), the pulling mechanism (6) is arranged between the bottom of the rotating shaft (5) and the middle of the inner cavity of the mounting shell (2); A guiding mechanism (7), the guiding mechanism (7) is arranged in the middle of the mounting plate (3); An adsorption mechanism (8), the adsorption mechanism (8) is arranged between the bottom of the mounting shell (2) and the bottom of the guiding mechanism (7); An electromagnetic mechanism (9), the electromagnetic mechanism (9) is arranged in the middle between the pulling mechanism (6) and the adsorption mechanism (8); Hydraulic fluid, the hydraulic fluid is arranged between the bottom end of the mounting plate (3) in the inner cavity of the sleeve block (1) and the top end of the adsorption mechanism (8).

2. A wafer separation device for semiconductor processing according to claim 1, characterized in that, The driving mechanism (4) includes a first driving member (401), the first driving member (401) is fixedly installed on the upper surface of the mounting plate (3), a gear (402) is fixedly installed at the output end of the first driving member (401), the gear (402) meshes with the gear sleeve (501), limiting blocks (403) are symmetrically and fixedly installed on the upper and lower sides of the gear (402), and the gear sleeve (501) is located in the middle of the two limiting blocks (403).

3. A wafer separation device for semiconductor processing according to claim 2, characterized in that, The pulling mechanism (6) includes a sliding plate (601), the sliding plate (601) is movably sleeved on the bottom of the rotating shaft (5), the sliding plate (601) is slidably sleeved with the mounting shell (2), first one-way valves (602) are symmetrically and fixedly sleeved on both sides of the left and right of the sliding plate (601), second one-way valves (603) are symmetrically and fixedly sleeved on both sides of the front and back of the sliding plate (601), a first elastic member (604) is fixedly installed at the bottom end of the sliding plate (601), and the bottom end of the first elastic member (604) is fixedly connected to the adsorption mechanism (8).

4. A wafer separation device for semiconductor processing according to claim 3, characterized in that, The diversion mechanism (7) includes a first sleeve (701). A second sleeve (702) is fixedly installed at the bottom end of the first sleeve (701). A third sleeve (703) is fixedly installed at the bottom end of the second sleeve (702). The first sleeve (701), the second sleeve (702) and the third sleeve (703) are all slidably sleeved on the middle part of the rotating shaft (5). A second driving member (704) is fixedly installed at the top end of the first sleeve (701). A connecting rod (705) is fixedly installed at the output end of the second driving member (704). A threaded block (706) is slidably sleeved at the bottom end of the connecting rod (705). The threaded block (706) is threadedly connected to the second sleeve (702). A second elastic member (707) is fixedly installed at the bottom end of the threaded block (706). A piston (708) is fixedly installed at the bottom end of the second elastic member (707). The piston (708) is slidably sleeved in the second sleeve (702). A ring groove (709) is formed at the bottom of the inner cavity of the second sleeve (702). The piston (708) is located above the ring groove (709).

5. A wafer separation device for semiconductor processing according to claim 4, characterized in that, The adsorption mechanism (8) includes an air suction sleeve (801). The top end of the air suction sleeve (801) is fixedly installed at the bottom end of the first elastic member (604). The third sleeve (703) is slidably sleeved in the middle part of the air suction sleeve (801). A connecting sleeve (802) is slidably sleeved in the upper part of the inner cavity of the air suction sleeve (801). The connecting sleeve (802) is fixedly sleeved at the bottom of the third sleeve (703). A plurality of plug shafts (803) are fixedly sleeved at equal intervals in the circumferential direction at the bottom of the connecting sleeve (802). A through hole is formed in the middle of the plug shaft (803). A plug sleeve (804) is fixedly sleeved at the bottom of the inner cavity of the air suction sleeve (801). The plug shaft (803) is slidably sleeved in the plug sleeve (804). A rubber pad (805) is fixedly installed on the bottom surface of the plug sleeve (804).

6. The wafer separation device for semiconductor processing according to claim 5, wherein, The electromagnetic mechanism (9) includes a limit ring (901). The limit ring (901) is fixedly installed at the top end of the air suction sleeve (801). A magnetic ring (902) is fixedly installed at the bottom end of the sliding plate (601). An electromagnet (903) is fixedly installed at the top end of the air suction sleeve (801).

7. A wafer separation device for semiconductor processing according to claim 6, characterized in that, The air-permeable block (301) is made of a material that is air-permeable but water-impermeable. The contact surfaces of the two limit blocks (403) and the gear sleeve (501) are smooth surfaces.

8. A wafer separation device for semiconductor processing according to claim 7, characterized in that, The opening direction of the first one-way valve (602) is downward. The opening direction of the second one-way valve (603) is upward. The resistance to opening the valve of the second one-way valve (603) is greater than the elastic force of the first elastic member (604).

9. A wafer separation device for semiconductor processing according to claim 8, characterized in that, Vent holes are formed on the left and right sides of the upper surface of the threaded block (706). The first sleeve (701), the second sleeve (702) and the third sleeve (703) are all made of heat-insulating materials.

10. A wafer separation device for semiconductor processing according to claim 9, characterized in that, The plug sleeve (804) is designed as an equilateral hexagon. The rubber pad (805) is made of rubber material.

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