Onboard antenna and display device

Abstract

The embodiment of the invention discloses an onboard antenna and display equipment, the onboard antenna comprises a substrate, a chip module, an antenna and a connecting circuit, the substrate is arranged perpendicular to the horizontal plane, and the substrate comprises a first area and a second area; the chip module is arranged on the other surface of the first area; the antenna is arranged in the second area and comprises a radiator, and the radiator is attached to the substrate; the connecting line is electrically connected with the antenna and the chip module; wherein the antenna and the chip module carry out signal processing through the connecting line. According to the embodiment of the invention, the substrate is arranged perpendicular to the horizontal plane, namely, the substrate is vertically arranged, and the radiator is attached to the substrate, so that the radiator is also vertically arranged, the radiation direction of the antenna is the horizontal direction, and the signal strength in the horizontal direction can be improved.

Description

Technical Field

[0001] The present application relates to the field of on-board antennas, and particularly to an on-board antenna and a display device. Background Art

[0002] In the related art, a display device has an antenna board and a chip board. In order to improve the signal strength, the antenna board and the chip board of the display device are usually arranged in the frame. The antenna board and the chip board are combined together by a split assembly method. For the convenience of assembly, the antenna board and the chip board are usually connected by a plug-in method, so that the antenna board is arranged perpendicular to the chip board. Since the width of the chip board is often greater than the thickness of the display device, the chip board can only be vertically installed in the frame and cannot be horizontally installed in the frame. Therefore, the antenna board can only be horizontally installed in the frame, resulting in relatively poor signal strength in the horizontal direction of the display device. Summary of the Invention

[0003] An embodiment of the present application provides an on-board antenna and a display device, which can improve the signal strength in the horizontal direction of the display device.

[0004] In a first aspect, an embodiment of the present application provides an on-board antenna. The on-board antenna includes a substrate, a chip module, an antenna, and a connection line. The substrate is perpendicular to the horizontal plane and includes a first area and a second area; the chip module is arranged on the other surface of the first area; the antenna is arranged in the second area, and the antenna includes a radiator which is attached to the substrate; the connection line is electrically connected to both the antenna and the chip module; wherein, the antenna and the chip module perform signal processing through the connection line.

[0005] In some exemplary embodiments, the antenna further includes a feed pin connected to the radiator. The connection line includes a first copper-clad layer which is attached to the substrate and is electrically connected to both the feed pin and the chip module.

[0006] In some exemplary embodiments, the antenna further includes a ground pin connected to the radiator. The ground pin is spaced from the feed pin. The chip module includes a ground layer. The on-board antenna further includes a second copper-clad layer which is electrically connected to both the ground layer and the ground pin.

[0007] In some exemplary embodiments, the chip module and the antenna are arranged on the same surface or different surfaces of the substrate.

[0008] In some exemplary embodiments, the first area and the second area are located on both sides of the length direction of the substrate. The chip module is arranged along the length direction. The number of antennas is multiple, and the multiple antennas are spaced along the length direction of the substrate.

[0009] In some exemplary embodiments, a pluggable terminal is further included. The pluggable terminal is electrically connected to the chip module, and the on-board antenna can be connected to an external device through the pluggable terminal.

[0010] In some exemplary embodiments, the radiator is spaced apart from the substrate.

[0011] In some exemplary embodiments, the antenna is disposed on two surfaces of the substrate.

[0012] In a second aspect, an embodiment of the present application provides a display device, which includes a display panel, a border, and an on-board antenna. The border is disposed around the display panel; the radiation direction of the radiator is the same as the light-emitting direction of the display panel.

[0013] In some exemplary embodiments, the border includes a metal bracket and a decorative cover plate. The metal bracket is provided with a hollowed-out area corresponding to the radiator, and the area of the hollowed-out area is greater than or equal to the area of the antenna. The decorative cover plate covers the metal bracket to block the hollowed-out area.

[0014] In some exemplary embodiments, the on-board antenna is fixedly disposed on the inner surface of the back side of the metal bracket. The inner surface of the back side is away from the decorative cover plate and is disposed opposite to the decorative cover plate.

[0015] In some exemplary embodiments, the on-board antenna is fixedly disposed on the inner surface of the metal bracket, and the radiator is close to the decorative cover plate.

[0016] Beneficial effects: In the embodiment of the present application, the substrate is disposed perpendicular to the horizontal plane, that is, the substrate is disposed vertically. Since the radiator is disposed in contact with the substrate, the radiator is also disposed vertically, so that the radiation direction of the antenna is the horizontal direction, and the signal strength in the horizontal direction can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] Figure 1 It is a top view structural schematic diagram of an on-board antenna in an embodiment of the present application;

[0019] Figure 2 It is a side view structural schematic diagram of the on-board antenna in an embodiment of the present application;

[0020] Figure 3 It is a top view structural schematic diagram of the on-board antenna in another embodiment of the present application;

[0021] Figure 4 Schematic structural diagram of a display device in an embodiment of the present application;

[0022] Figure 5 Schematic structural diagram of a display device in another embodiment of the present application;

[0023] Figure 6 Exploded structural schematic diagram of a frame in an embodiment of the present application.

[0024] Explanation of reference numerals: 100, on-board antenna; 110, substrate; 110a, first surface; 110b, second surface; 111, first region; 112, second region; 120, ground layer; 130, chip module; 140, antenna; 141, radiator; 142, feed pin; 143, ground pin; 150, connection line; 160, plug-in terminal; 170, second copper-clad layer; 200, display device; 210, frame; 211, metal bracket; 211a, hollowed-out area; 212, decorative cover plate; 220, display panel. Detailed implementation manners

[0025] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0026] As Figure 1-2 shown, in a first aspect of an embodiment of the present application, an on-board antenna 100 is provided. The on-board antenna 100 includes a substrate 110, a chip module 130, an antenna 140, and a connection line 150. The on-board antenna 100 can be applied to a display device 200.

[0027] The substrate 110 is an insulating board. The material of the substrate 110 can be, for example, epoxy glass cloth laminate, which is a laminated product formed by hot pressing with epoxy resin as an adhesive. It has high mechanical strength at high temperatures and good electrical performance stability under high humidity. The substrate 110 is disposed perpendicular to the horizontal plane. The substrate 110 includes a first region 111 and a second region 112. The first region 111 and the second region 112 are adjacent or spaced apart, that is, the first region 111 and the second region 112 respectively correspond to two different parts on the substrate 110. The substrate 110 has a first surface 110a and a second surface 110b facing away from each other. It can be understood that, since the first region 111 and the second region 112 respectively correspond to two different parts on the substrate 110, the first region 111 has two surfaces, namely the first surface 110a and the second surface 110b, and the second region 112 also has two surfaces, namely the first surface 110a and the second surface 110b.

[0028] It can be understood that the chip module 130 usually needs to be grounded. Therefore, the on-board antenna 100 may further include a ground layer 120. The ground layer 120 may be disposed on the first surface 110a or the second surface 110b of the first region 111. In this embodiment, an example in which the ground layer 120 is disposed on the first surface 110a of the first region 111 is described. Exemplarily, the ground layer 120 may be a metal layer attached to the surface of the substrate 110. For example, the ground layer 120 is a copper layer, and the ground layer 120 may be attached to the ground layer 120 by means of etching, printing, bonding, etc. Of course, when the substrate 110 is a multi-layer board, the ground layer 120 may also be disposed inside the substrate 110.

[0029] The chip module 130 may be disposed on the first surface 110a or the second surface 110b of the first region 111, and the chip module 130 is electrically connected to the ground layer 120. In this embodiment, an example in which the chip module 130 is disposed on the second surface 110b of the first region 111 is described. Exemplarily, the chip module 130 may include a radio frequency chip and peripheral components adapted to the radio frequency chip. The radio frequency chip and the peripheral components are electrically connected through a copper-clad structure. It can be understood that the radio frequency chip and the peripheral components usually need to be grounded. In this regard, vias may be provided on the substrate 110, and a metal layer is provided on the inner wall of the vias to connect the first surface 110a and the second surface 110b of the substrate 110. The radio frequency chip and the peripheral components may be electrically connected to the ground layer 120 through the metal layer on the inner wall of the vias.

[0030] The antenna 140 may be disposed on the first surface 110a or the second surface 110b of the second region 112. The antenna 140 includes a radiator 141. The radiator 141 is attached to the substrate 110, and the length of the radiator 141 is 1 / 4 wavelength. The radiator 141 is the main part of the antenna 140 that emits and receives signals. The radiator 141 may be in the shape of a strip, a plate, etc. The type of the antenna 140 may be a conventional type such as an inverted F antenna or a PIFA antenna. However, it should be noted that the type of the antenna 140 cannot be a patch antenna. Although the patch antenna can improve the integration of the antenna board and reduce the volume of the antenna board. However, in order to ensure the signal strength of the patch antenna, a ground layer 120 needs to be provided on the back of the antenna board corresponding to the patch antenna, and a certain distance needs to be maintained between the patch antenna and the ground layer 120 on the back of the antenna board, which makes the thickness of the antenna board relatively thick, thus increasing the cost of the antenna board. In the substrate 110 of this embodiment, a ground layer 120 does not need to be provided on the back corresponding to the antenna 140, that is, the second region 112 does not need to be provided with a ground layer 120, nor does it need to thicken the substrate 110.

[0031] It should be noted that the number of antennas 140 can be one or more. The multiple antennas 140 can be of the same type or different types. When the types of the multiple antennas 140 are different, the corresponding chip modules 130 have multiple different types. For example, the radio frequency chips are WiFi chips, AP (Access Point) chips, and BT (Bluetooth) chips, and the corresponding antennas 140 can be WiFi antennas, AP antennas, and BT antennas. It can be understood that one WiFi chip can correspond to two or more WiFi antennas, thereby enhancing the signal strength. The radiation frequency bands of the antennas can be, for example, 2.4 GHz and 5 GHz.

[0032] The connection line 150 is electrically connected to both the antenna 140 and the chip module 130 to achieve conduction between the antenna 140 and the chip module 130. The antenna 140 and the chip module 130 perform signal processing through the connection line 150. That is, the chip module 130 can transmit the transmitted signal to the antenna 140 through the connection line 150 so that the antenna 140 sends the transmitted signal, or the antenna 140 can transmit the received signal to the chip module 130 through the connection line 150 so that the chip module 130 receives the received signal.

[0033] In summary, in the present application, the antenna 140 and the chip module 130 are disposed on the same substrate 110. The antenna 140 and the chip module 130 are connected through the connection line 150, with better stability and a smaller overall volume of the board-mounted antenna 100. At the same time, the antenna 140 and the chip module 130 being disposed on the same substrate can also save the cost of coaxial cables and eliminate the need for separate certifications, saving the manpower, material resources, and financial resources required for certification. When the board-mounted antenna 100 is installed, it is installed in the vertical direction. Since the radiator 141 is disposed in contact with the substrate 110, the radiator 141 is also vertically disposed, so that the radiation direction of the antenna 140 is the horizontal direction, which can enhance the signal strength in the horizontal direction. At the same time, in the present application, there is no need to provide a grounding layer 120 at the position where the antenna 140 is located, and there is no need to consider the distance between the antenna 140 and the grounding layer 120. Therefore, the substrate 110 does not need to be thickened, thereby saving costs.

[0034] As Figure 2As shown, in some embodiments, the antenna 140 further includes a feeding pin 142 connected to the radiator 141, and the shape of the feeding pin 142 can be columnar or strip-shaped. The connection line 150 includes a first copper-clad layer, which has good electrical conductivity stability. The first copper-clad layer is disposed in contact with the substrate 110 and is electrically connected to both the feeding pin 142 and the chip module 130. The first copper-clad layer provides a conduction path between the feeding pin 142 and the chip module 130, and the first copper-clad layer can be formed by etching or chemical corrosion in such ways as equal line pitch and equal line width. It can be understood that since the RF chip and the peripheral components are electrically connected through the copper-clad structure, the first copper-clad layer can be manufactured by the same process as the copper-clad structure, thereby saving costs and improving production efficiency.

[0035] In some alternative embodiments, the connection line 150 can also be a coaxial cable, and the routing of the coaxial cable is more flexible than that of the first copper-clad layer.

[0036] Continuing to refer to Figure 2 , in some embodiments, the antenna 140 further includes a grounding pin 143 connected to the radiator 141, and the grounding pin 143 is spaced from the feeding pin 142. The grounding layer 120 of the board where the chip module 130 is located can just be used as the radiation ground of the antenna 140, thereby enhancing the radiation of the antenna 140 and reducing the area of the antenna 140's clearance area. Grounding the antenna 140 can improve the impedance of the antenna 140 and reduce the resonant frequency of the antenna 140. By changing the spacing distance between the grounding pin 143 and the feeding pin 142, the impedance of the antenna 140 can be adjusted. By changing the lengths of the grounding pin 143 and the feeding pin 142, the radiation intensity of the antenna 140 can be adjusted.

[0037] The on-board antenna 100 further includes a second copper-clad layer 170, which has good electrical conductivity stability. The second copper-clad layer 170 is electrically connected to both the grounding layer 120 and the grounding pin 143. The second copper-clad layer 170 provides a conduction path between the grounding pin 143 and the grounding layer 120, and the second copper-clad layer 170 can be formed by etching or chemical corrosion in such ways as equal line pitch and equal line width. It can be understood that since the RF chip and the peripheral components are electrically connected through the copper-clad structure, the second copper-clad layer 170 can be manufactured by the same process as the first copper-clad layer and the copper-clad structure, thereby saving costs and improving production efficiency. The grounding pin 143 can be disposed at the end of one end of the radiator 141, and the feeding pin 142 can be disposed between the end of the other end of the radiator 141 and the grounding pin 143. Optionally, the feeding pin 142 is closer to the grounding pin 143 than the end of the other end of the radiator 141.

[0038] As Figure 1-2As shown, in some embodiments, the chip module 130 and the antenna 140 are disposed on the same surface of the substrate 110, so that only a ground layer 120 needs to be disposed on one surface of the substrate 110 without disposing electronic components. Compared with the chip module 130 and the antenna 140 being disposed on different surfaces of the substrate 110, the setting method of this embodiment can reduce the overall thickness of the board-mounted antenna 100, and the surface of the board-mounted antenna 100 without electronic components can be used as a mounting surface, and the mounting surface abuts against an external device without worrying about the electronic components being damaged.

[0039] In some embodiments, the chip module 130 and the antenna 140 are disposed on different surfaces of the substrate 110, so that both surfaces of the substrate 110 can be fully utilized, thereby reducing the area of the substrate and making the board-mounted antenna more compact. Optionally, the ground layer 120 covers the first surface 110a of the entire first region 111. The larger the area of the ground layer 120, the better the gain of the antenna 140.

[0040] As Figure 1 and Figure 4 As shown, in some embodiments, the board-mounted antenna 100 is mainly installed in the frame 210 of the display device, and the frame 210 includes a bottom frame, and the bottom frame is usually strip-shaped. Therefore, if the substrate 110 is installed in the bottom frame, the substrate 110 is also adaptively strip-shaped. The first region 111 and the second region 112 are located on both sides of the length direction of the substrate 110, and the chip module 130 is arranged along the length direction. The number of antennas 140 is multiple, and the multiple antennas 140 are arranged at intervals along the length direction of the substrate 110. The interval distance between the multiple antennas 140 can be larger, so that the interference between the multiple antennas 140 is less. Moreover, the connection line 150 only needs to extend from the first region 111 to the edge of the second region 112, the wiring difficulty is low, and there is no interference with the antenna 140 signal. If the first region 111 and the second region 112 are located on both sides of the width direction of the substrate 110, in order to reduce signal interference, the multiple antennas 140 still can only be arranged at intervals along the length direction of the substrate 110. At this time, in order to connect different antennas 140, the connection line 150 needs to extend into the second region 112, increasing the wiring difficulty and also causing interference to the antenna 140 signal.

[0041] As Figure 1 As shown, in some embodiments, the board-mounted antenna 100 further includes a pluggable terminal 160. The pluggable terminal 160 is electrically connected to the chip module 130. The board-mounted antenna 100 can be connected to an external device through the pluggable terminal 160, so that the connection between the board-mounted antenna 100 and the external device is more convenient, facilitating the production, assembly, repair and replacement of the external device. The pluggable terminal 160 can be, for example, a USB male connector.

[0042] AsFigure 4 and Figure 5 As shown in Figure 5 , in a second aspect of the embodiments of the present application, a display device 200 is provided. The display device 200 includes a display panel 220, a border 210, and an on-board antenna 100. Exemplarily, the display device 200 can be an LED TV, a conference tablet, etc.

[0043] The border 210 is disposed around the display panel 220. Exemplarily, the border 210 can be a quadrilateral border 210 that surrounds the four sides of the display panel 220. Exemplarily, the border 210 can be a strip-shaped border 210 that is disposed around one side of the display panel 220. That is, one side of the display panel 220 has a relatively thick border 210, and the other three sides have no border 210 or have an ultra-thin border 210, so as to facilitate the splicing of multiple display devices 200. After splicing, the display device 200 has a larger display area.

[0044] The radiation direction of the radiator 141 is the same as the light-emitting direction of the display panel 220. It should be noted that, strictly speaking, the radiation direction of the radiator 141 is in all directions, but the intensities in each direction are significantly different. Therefore, the radiation direction of the radiator 141 has obvious directivity. In this embodiment, the direction in which the radiation signal of the radiator 141 is the strongest is the radiation direction of the radiator 141.

[0045] When a user uses the display device 200, the user is usually located in front of the display device 200, that is, on the light-emitting side of the display panel 220. Therefore, setting the radiation direction of the display device 200 to the light-emitting direction can facilitate the user to use a mobile device to communicate and connect with the display device 200. For example, use a mobile phone to project a screen, transfer files, and perform a Bluetooth connection with the display device 200. It can be understood that the number of on-board antennas 100 in a single display device 200 can be multiple, so as to further improve the signal strength of the display device 200.

[0046] Such as Figure 6As shown, in some embodiments, the frame 210 includes a metal bracket 211 and a decorative cover plate 212. The metal bracket 211 has a relatively high strength and can bear the weight of the display panel 220. The metal bracket 211 can be exemplary in a square tube shape. The metal bracket 211 has a hollowed-out area 211a corresponding to the radiator 141 to avoid the metal bracket 211 shielding the radiator 141, so that the radiator 141 can emit and receive signals. The area of the hollowed-out area 211a is greater than or equal to the area of the radiator 141 to minimize the interference of the metal bracket 211 on the radiator 141. The decorative cover plate 212 is covered on the metal bracket 211 to block the hollowed-out area 211a, thereby playing a certain role in enclosing the metal bracket 211 and protecting the on-board antenna 100 inside the metal bracket 211. In addition, the decorative cover plate 212 makes the display device 200 have better integrity, reduces the interference to the user's vision, and enables the user's vision to focus on the display panel 220.

[0047] In some embodiments, the on-board antenna 100 is fixedly disposed on the inner surface of the back side of the metal bracket 211. The inner surface of the back side is the surface that is far from the decorative cover plate 212 and is opposite to the decorative cover plate 212. At this time, the radiator 141, the substrate 110, and the inner surface of the back side are parallel to each other. The inner surface of the back side plays a certain reflection effect to improve the directivity of the on-board antenna 100. The closer the on-board antenna 100 is to the inner surface of the back side, the better the reflection effect, so that the directivity of the on-board antenna 100 is better.

[0048] In some embodiments, the radiator 141 and the substrate 110 are spaced apart to reduce the shielding of the substrate 110 from the signal and improve the radiation intensity of the radiator 141.

[0049] In some embodiments, the radiator 141 is disposed close to the decorative cover plate 212 to reduce the shielding of the decorative cover plate 212 from the signal and improve the radiation intensity of the radiator 141.

[0050] In some embodiments, the antenna 140 is disposed on both the front and back surfaces of the substrate 110, so that the display device 200 has strong signals on both the front and back. The signals emitted by the antenna 140 disposed on the back surface of the substrate 110 are reflected by the metal bracket 211 and then emitted toward the light-emitting surface of the display device 200, which can also enhance the signal intensity on the front of the display device 200.

[0051] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of the present application, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, it is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the accompanying drawings are only for illustrative purposes and should not be construed as a limitation to the present application. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0052] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An on-board antenna, which is applied to a display device, is characterized in that Comprising: A substrate, arranged perpendicular to the horizontal plane, the substrate comprising a first region and a second region; A chip module, arranged in the first region; An antenna, arranged in the second region, the antenna comprising a radiator, the radiator being attached to the substrate; And A connection line, electrically connected to both the antenna and the chip module; Wherein, the antenna and the chip module perform signal processing through the connection line.

2. The on-board antenna according to claim 1, characterized in that, The antenna further comprises a feeding pin connected to the radiator, the connection line comprising a first copper-clad layer, the first copper-clad layer being attached to the substrate and electrically connected to both the feeding pin and the chip module.

3. The on-board antenna according to claim 2, characterized in that, The antenna further comprises a grounding pin connected to the radiator, the grounding pin being spaced apart from the feeding pin, the chip module comprising a grounding layer, the on-board antenna further comprising a second copper-clad layer, the second copper-clad layer being electrically connected to both the grounding layer and the grounding pin.

4. The on-board antenna according to claim 1, wherein The chip module and the antenna are arranged on the same surface or different surfaces of the substrate.

5. The on-board antenna according to claim 1, characterized in that, The first region and the second region are located on both sides of the length direction of the substrate, the chip module is arranged along the length direction, the number of the antennas is multiple, and the multiple antennas are spaced apart along the length direction of the substrate.

6. The on-board antenna according to claim 1, characterized in that, Further comprising a pluggable terminal, the pluggable terminal being electrically connected to the chip module, and the on-board antenna can be connected to an external device through the pluggable terminal.

7. The on-board antenna according to claim 1, characterized in that, The antenna is arranged on two surfaces of the substrate.

8. A display device, characterized in that, Comprising: A display panel; A frame, arranged around the display panel; And The on-board antenna according to any one of claims 1-7, the radiation direction of the radiator being the same as the light-emitting direction of the display panel.

9. The display device according to claim 8, characterized in that, The frame comprises a metal bracket and a decorative cover plate, the metal bracket having a hollowed-out area corresponding to the radiator, and the area of the hollowed-out area being greater than or equal to the area of the radiator, and the decorative cover plate covering the metal bracket to block the hollowed-out area.

10. The display device according to claim 9, wherein The on-board antenna is fixedly arranged on the inner surface of the metal bracket, and the radiator is close to the decorative cover plate.

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