Vehicle system based on optical communication and vehicle

Abstract

The invention discloses a vehicle system based on optical communication and a vehicle, the system comprises a center module and an edge module, the edge module comprises a photoelectric communication module and a vehicle terminal device electrically connected with the photoelectric communication module, and the center module is electrically connected with the photoelectric communication module. And the photoelectric communication module is configured to perform photoelectric conversion processing and signal transmission on the received electric signal so as to realize communication between the central module and the vehicle terminal. Therefore, the vehicle terminal equipment in the central module and the vehicle terminal equipment in each edge module in the vehicle system can interact through the optical signal, so that the problems of high time delay, low transmission rate and the like during electric signal data transmission are avoided to a certain extent; therefore, data transmission time delay and data transmission efficiency between the central module and the vehicle terminal equipment can be guaranteed, application scenes with high real-time requirements such as vehicle information acquisition and analysis and data interaction between the vehicle and the cloud platform can be better supported, and the use experience of a user on the vehicle is guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of vehicles, and particularly relates to a vehicle system and a vehicle based on optical communication. Background Art

[0002] With the upgrade of in-vehicle components, the connection relationship between in-vehicle components has gradually been replaced from traditional mechanical connection to electrical signal connection. However, limited by the transmission speed of electrical signals, there are corresponding time delays in both the information reporting efficiency of in-vehicle components and the issuing efficiency of control commands for in-vehicle components, which results in a low information interaction efficiency between vehicle areas and to a certain extent affects the execution of vehicle functions and the user experience of using the vehicle. Summary of the Invention

[0003] The present application provides a vehicle system and a vehicle based on optical communication.

[0004] An embodiment of the present application provides a vehicle system based on optical communication. The system includes a central module and an edge module. The edge module includes an optoelectronic communication module and a vehicle terminal device electrically connected to the optoelectronic communication module. The central module is electrically connected to the optoelectronic communication module;

[0005] The optoelectronic communication module is configured to perform optoelectronic conversion processing and signal transmission on the received electrical signal to realize communication between the central module and the vehicle terminal device.

[0006] In this way, in the embodiment of the present application, between the central module in the vehicle system and the vehicle terminal devices in each edge module, the conversion of electrical signal data and optical signal data and the transmission of optical signal data can be performed through the optoelectronic communication module, so that the central module and the vehicle terminal devices in each edge module can interact through optical signals, thereby avoiding problems such as high time delay and low transmission rate during the transmission of electrical signal data to a certain extent. Therefore, the data transmission time delay and data transmission efficiency between the central module and the vehicle terminal device can be ensured, and thus real-time application scenarios with high requirements such as vehicle information collection and analysis and data interaction between the vehicle and the cloud platform can be better supported, and the user experience of using the vehicle is guaranteed.

[0007] In some embodiments of the present application, there are multiple edge modules, and the bandwidth demand of the vehicle terminal device in each edge module is less than or equal to the upper limit of the bandwidth supported by the optoelectronic communication module.

[0008] In this way, in the embodiment of the present application, each edge module in the vehicle system can be divided according to the upper limit of the bandwidth supported by the optoelectronic communication module.

[0009] In some embodiments of the present application, the edge modules are multiple divided according to position.

[0010] Thus, in the embodiments of the present application, each edge module in the vehicle system can be divided according to the location of the module and the upper limit of the bandwidth supported by the optoelectronic communication module.

[0011] In some embodiments of the present application, the system includes a front center domain edge module, a left front domain edge module, a right front domain edge module, a left rear domain edge module, and a right rear domain edge module.

[0012] In some embodiments of the present application, the edge modules are multiple ones divided according to functions.

[0013] Thus, in the embodiments of the present application, each edge module in the vehicle system can be divided according to the functions of the module and the upper limit of the bandwidth supported by the optoelectronic communication module.

[0014] In some embodiments of the present application, the edge modules include an autonomous driving domain edge module, an intelligent networking and vehicle body domain edge module, a power domain edge module, a chassis domain edge module, and an intelligent cockpit domain edge module.

[0015] In some embodiments of the present application, the central module includes a processing chip and a root bridge device electrically connected to the processing chip. The processing chip can send electrical signals to the optoelectronic communication module through the root bridge device and can receive electrical signals sent by the optoelectronic communication module through the root bridge device.

[0016] In some embodiments of the present application, the central module further includes an internal memory communicatively connected to the root bridge device through the Peripheral Component Interconnect Express (PCIe) protocol.

[0017] In some embodiments of the present application, the central module further includes a first switch communicatively connected to the root bridge device through the Peripheral Component Interconnect Express (PCIe) protocol.

[0018] In some embodiments of the present application, the central module further includes an endpoint device communicatively connected to the root bridge device through the Peripheral Component Interconnect Express (PCIe) protocol.

[0019] In some embodiments of the present application, the system further includes a second switch, and the central module is connected to the optoelectronic communication module through the second switch.

[0020] Thus, in the embodiments of the present application, the central module can receive data information reported by multiple vehicle terminal devices through the switch, and the central module can send electrical signal data to multiple optoelectronic communication modules through the second switch.

[0021] In some embodiments of the present application, the optoelectronic communication module includes at least one master optical module, at least one optical splitter, and a plurality of slave optical modules that are sequentially connected by optical fibers. The central module is electrically connected to the master optical module, and the slave optical modules are electrically connected to the vehicle terminal devices.

[0022] In some embodiments of the present application, there are a plurality of the vehicle terminal devices, and the master optical module is configured to:

[0023] When receiving the first electrical signal data sent by the central module, according to the first electrical signal data and the pre-determined mapping relationship data between the electrical signal data and the device identification information, determine the target device identification information;

[0024] Determine the first optical signal data according to the first electrical signal data and the target device identification information, where the target device identification information is used to identify the target vehicle terminal device that receives the first electrical signal data among the plurality of vehicle terminal devices;

[0025] Send the first optical signal data to the optical splitter.

[0026] In this way, before converting the electrical signal into an optical signal and transmitting the optical signal, the target device identification information of the recipient of the first electrical signal data can be determined first through the first electrical signal data and the pre-determined mapping relationship data between the electrical signal data and the device identification information. Furthermore, after the electrical signal is converted into an optical signal and the optical signal is transmitted, the electrical signal data can be sent to the corresponding recipient based on the target device identification information, ensuring the robust transmission of the electrical signal data.

[0027] In some embodiments of the present application, the optical splitter is configured to forward the first optical signal data to the plurality of slave optical modules.

[0028] In this way, in the embodiments of the present application, the first optical signal data sent by the master optical module can be forwarded to each slave optical module in the module through the optical splitter.

[0029] In some embodiments of the present application, the slave optical module is configured to:

[0030] When the target device identification information matches the pre-stored device identification information, determine the first electrical signal data according to the first optical signal data;

[0031] Send the first electrical signal data to the target vehicle terminal device.

[0032] Thus, in the embodiments of the present application, when the target device identification information in the first optical signal data matches the pre-stored device identification information, the slave optical module determines the first electrical signal data according to the first optical signal data, and sends the first electrical signal data to the target vehicle terminal device, thereby ensuring the stable transmission of the first electrical signal data.

[0033] In some embodiments of the present application, the slave optical module is configured to:

[0034] When receiving the second electrical signal data sent by the vehicle terminal device, determine the second optical signal data according to the second electrical signal data;

[0035] Send the second optical signal data to the optical splitter.

[0036] Thus, in the embodiments of the present application, when the slave optical module receives the second electrical signal data sent by the vehicle terminal device, it can perform optoelectronic conversion processing on the second electrical signal data to determine the second optical signal data according to the second electrical signal data, and send the second optical signal data to the optical splitter to perform data transmission of the second optical signal data through the optical splitter.

[0037] In some embodiments of the present application, both the first electrical signal data and the second electrical signal data include all types of data frames in the data link layer and all types of data streams in the physical layer.

[0038] In some embodiments of the present application, the optical splitter is configured to forward the second optical signal data to the master optical module.

[0039] Thus, in the embodiments of the present application, the second optical signal data can be forwarded by the optical splitter to the master optical module, thereby completing the data transmission of the second optical signal data.

[0040] In some embodiments of the present application, the master optical module is configured to:

[0041] Determine the second electrical signal data according to the second optical signal data;

[0042] Send the second electrical signal data to the central module.

[0043] Thus, in the embodiments of the present application, when the master optical module receives the second optical signal data forwarded by the optical splitter, it can determine the second electrical signal data according to the second optical signal data and send the second electrical signal data to the central module, thereby completing the data transmission of the vehicle terminal device to the central module.

[0044] In some embodiments of the present application, the master optical module is configured to:

[0045] Determine the first electrical signal data as the first payload data;

[0046] Configure the first frame header data according to the first payload data and the target device identification information;

[0047] Merge the first payload data and the first frame header data to obtain the first optical signal data.

[0048] In this way, in the embodiments of the present application, the master optical module can determine the first payload data according to the first electrical signal data, configure the first frame header data through the target device identification information, and then package and encapsulate the first payload data and the first frame header data as the first optical signal data to realize the conversion of the first electrical signal data to the first optical signal data.

[0049] In some embodiments of the present application, the slave optical module is configured as:

[0050] Determine the second electrical signal data as the second payload data;

[0051] Configure the second frame header data according to the second payload data;

[0052] Merge the second payload data and the second frame header data to obtain the second optical signal data.

[0053] In this way, in the embodiments of the present application, the slave optical module can determine the second electrical signal data as the second payload data, configure the second frame header data according to the second payload data, and merge the second payload data and the second frame header data to obtain the second optical signal data, thereby realizing the conversion of the second electrical signal data to the second optical signal data.

[0054] In some embodiments of the present application, both the first frame header data and the second frame header data include a first parameter, and the first parameter is used to indicate the number of payload data in the optical signal data.

[0055] In some embodiments of the present application, both the first frame header data and the second frame header data include a second parameter, and the second parameter is used to indicate the fragmentation state of the payload data.

[0056] In some embodiments of the present application, both the first frame header data and the second frame header data include a third parameter, and the third parameter is used to indicate the fragmentation sequence number corresponding to each piece after the payload data is fragmented.

[0057] In some embodiments of the present application, both the first frame header data and the second frame header data include a fourth parameter, and the fourth parameter is used to indicate the source of the payload data.

[0058] In some embodiments of the present application, both the first frame header data and the second frame header data include a fifth parameter, and the fifth parameter is used to store device identification information.

[0059] In some embodiments of the present application, the master optical module includes an electrical signal interface, and the master optical module is configured to:

[0060] Receive the first electrical signal data sent by the central module according to the electrical signal interface.

[0061] Thus, in the embodiments of the present application, the master optical module can receive the first electrical signal data sent by the central module through the electrical signal interface, and then can perform photoelectric conversion and other processing on the first electrical signal data sent by the central module.

[0062] In some embodiments of the present application, the master optical module includes a signal processing chip, and the master optical module is configured to:

[0063] Determine the target device identification information according to the first electrical signal data and the pre-determined mapping relationship data between the electrical signal data and the device identification information;

[0064] Perform packaging and encapsulation processing on the target device identification information and the first electrical signal data to obtain a first downlink physical frame;

[0065] Perform differential signal conversion on the first downlink physical frame to obtain the first downlink electrical signal.

[0066] Thus, in some embodiments of the present application, the master optical module can determine the target device identification information corresponding to the target device identification information through the signal processing chip, and perform packaging and encapsulation processing on the first electrical signal data and the target device identification information to obtain a first downlink physical frame, and perform differential signal conversion on the first downlink physical frame to obtain a first downlink electrical signal, and complete the data download from the central module to the vehicle terminal device through the first downlink electrical signal.

[0067] In some embodiments of the present application, the signal processing chip includes a storage unit for storing the mapping relationship data.

[0068] In some embodiments of the present application, the master optical module includes a driver, and the master optical module is configured to:

[0069] Amplify the received first downlink electrical signal according to the driver to obtain a first amplified electrical signal.

[0070] Thus, in the embodiments of the present application, the driver of the master optical module can amplify the first downlink electrical signal output by the signal processing signal to obtain a first amplified electrical signal to meet the subsequent signal processing requirements.

[0071] In some embodiments of the present application, the master optical module includes a laser, and the master optical module is configured to:

[0072] Perform optoelectronic conversion processing on the received first amplified electrical signal according to the laser to obtain a downlink optical signal.

[0073] Thus, in the embodiments of the present application, the master optical module can perform optoelectronic conversion processing on the first amplified electrical signal output by the driver through the laser to convert the first amplified electrical signal into a downlink optical signal, thereby completing the conversion from an electrical signal to an optical signal.

[0074] In some embodiments of the present application, the master optical module includes a demultiplexer and an optical signal interface, and the master optical module is configured to:

[0075] Send the downlink optical signal to the optical splitter according to the demultiplexer and the optical signal interface.

[0076] Thus, in the embodiments of the present application, the master optical module can send the downlink optical signal to the optical splitter through the internal demultiplexer and optical signal interface to complete the transmission of the optical signal.

[0077] In some embodiments of the present application, the optical splitter is configured to forward the downlink optical signal to the master optical module.

[0078] Thus, in the embodiments of the present application, the downlink optical signal can be forwarded to the slave optical module through the optical splitter, so that the transmission of the downlink optical signal can proceed stably.

[0079] In some embodiments of the present application, the slave optical module includes an optical signal interface, and the slave optical module is configured to:

[0080] Receive the downlink optical signal according to the optical signal interface.

[0081] Thus, in the embodiments of the present application, the slave optical module can receive the downlink optical signal forwarded by the optical splitter through its own optical signal interface.

[0082] In some embodiments of the present application, the slave optical module includes a demultiplexer and a photodetector, and the slave optical module is configured to:

[0083] Forward the downlink optical signal to the photodetector according to the demultiplexer.

[0084] Thus, in the embodiments of the present application, the photodetector inside the slave optical module can receive the downlink optical signal forwarded by the demultiplexer, and then can perform corresponding processing on the downlink optical signal.

[0085] In some embodiments of the present application, the slave optical module is configured to:

[0086] According to the photodetector, perform photoelectric conversion processing on the downlink optical signal to obtain a second downlink electrical signal.

[0087] Thus, in the embodiments of the present application, the slave optical module can perform photoelectric conversion processing on the downlink optical signal forwarded by the demultiplexer through the internal photodetector to obtain a second downlink electrical signal, thereby completing the conversion from optical signal to electrical signal.

[0088] In some embodiments of the present application, the slave optical module includes an amplifier, and the slave optical module is configured to:

[0089] According to the amplifier, amplify the transimpedance and limiting of the second downlink electrical signal to obtain a second downlink physical frame in differential signal form.

[0090] Thus, in the embodiments of the present application, the slave optical module can amplify the transimpedance and limiting of the second downlink electrical signal output by the photodetector through the internal amplifier, thereby obtaining a second downlink physical frame in differential signal form.

[0091] In some embodiments of the present application, the slave optical module includes a signal processing chip, and the slave optical module is configured to:

[0092] According to the signal processing chip, when the target device identification information matches the pre-stored device identification information, perform unpacking processing on the second downlink physical frame in differential signal form to obtain the first electrical signal data;

[0093] Send the first electrical signal data to the target vehicle terminal device.

[0094] Thus, in the embodiments of the present application, the slave optical module can perform unpacking processing on the second downlink physical frame in differential signal form through the internal signal processing chip to obtain the first electrical signal data when the target device identification information matches the pre-stored device identification information, and send the first electrical signal data to the target vehicle terminal device, thereby completing the data downlink between the central module and the vehicle terminal device.

[0095] In some embodiments of the present application, the slave optical module includes an electrical signal interface, and the slave optical module is configured to:

[0096] Receiving second electrical signal data sent by the vehicle terminal device according to the electrical signal interface.

[0097] Thus, in the embodiment of the present application, the slave optical module can receive the second electrical signal data sent by the vehicle terminal device based on the internal electrical signal interface for subsequent processing.

[0098] In some embodiments of the present application, the slave optical module includes a signal processing chip, and the slave optical module is configured to:

[0099] Packaging and encapsulating the second electrical signal data according to the signal processing chip to obtain a first uplink physical burst frame;

[0100] Performing differential signal conversion on the first uplink physical burst frame to obtain a first uplink electrical signal.

[0101] Thus, in the embodiment of the present application, the slave optical module can perform packaging and encapsulation processing on the second electrical signal data received by the electrical signal interface through the internal signal processing chip to obtain a first uplink physical burst frame, and perform differential signal conversion on the first uplink physical burst frame to obtain a first uplink electrical signal.

[0102] In some embodiments of the present application, the slave optical module includes a driver, and the slave optical module is configured to:

[0103] Amplifying the first uplink electrical signal according to the driver to obtain a second amplified electrical signal.

[0104] Thus, in the embodiment of the present application, the slave optical module can amplify the first uplink electrical signal output by the signal processing chip through the internal driver to obtain a second amplified electrical signal.

[0105] In some embodiments of the present application, the slave optical module includes a laser, and the slave optical module is configured to:

[0106] Performing optoelectronic conversion processing on the second amplified electrical signal according to the laser to obtain an uplink optical signal.

[0107] Thus, in the embodiment of the present application, the slave optical module can perform optoelectronic conversion processing on the second amplified electrical signal output by the driver through the internal laser to obtain an uplink optical signal.

[0108] In some embodiments of the present application, the slave optical module includes a demultiplexer and an optical signal interface, and the slave optical module is configured to:

[0109] Sending the uplink optical signal to the optical splitter according to the demultiplexer and the optical signal interface.

[0110] Thus, in the embodiments of the present application, the slave optical module can send the upstream optical signal output by the laser to the optical splitter based on its own optical splitter and optical signal interface for signal transmission of the upstream optical signal.

[0111] In some embodiments of the present application, the optical splitter is configured to forward the upstream optical signal to the master optical module.

[0112] Thus, in the embodiments of the present application, the upstream optical signal can be forwarded to the master optical module through the optical splitter, thereby completing the signal transmission of the upstream optical signal.

[0113] In some embodiments of the present application, the master optical module includes an optical signal interface, and the master optical module is configured to:

[0114] Receive the upstream optical signal according to the optical signal interface.

[0115] Thus, in the embodiments of the present application, the master optical module can receive the upstream optical signal forwarded by the optical splitter through its own optical signal interface to perform subsequent processing on the upstream optical signal.

[0116] In some embodiments of the present application, the master optical module includes an optical splitter and a photodetector, and the master optical module is configured to:

[0117] Forward the upstream optical signal to the photodetector according to the optical splitter.

[0118] Thus, in the embodiments of the present application, the photodetector inside the master optical module can receive the upstream optical signal based on the optical splitter, so as to perform corresponding processing on the upstream optical signal.

[0119] In some embodiments of the present application, the master optical module is configured to:

[0120] Perform photoelectric conversion processing on the upstream optical signal according to the photodetector to obtain a second upstream electrical signal.

[0121] Thus, in the embodiments of the present application, the master optical module can perform photoelectric conversion processing on the upstream optical signal forwarded by the optical splitter through the internal photodetector to obtain a second upstream electrical signal, thereby completing the conversion from optical signal to electrical signal. [[ID=�6]]

[0122] In some embodiments of the present application, the master optical module includes an amplifier, and the master optical module is configured to:

[0123] Amplify the transimpedance and limiting of the second upstream electrical signal according to the amplifier to obtain a second upstream physical frame in differential signal form.

[0124] Thus, in the embodiments of the present application, the master optical module can amplify the transimpedance and limiting of the second upstream electrical signal output by the photodetector through an internal amplifier, thereby obtaining a second upstream physical frame in the form of a differential signal.

[0125] In some embodiments of the present application, the master optical module includes a signal processing chip, and the master optical module is configured to:

[0126] According to the signal processing chip, unpack the second upstream physical burst frame in the form of a differential signal to obtain the second electrical signal data;

[0127] Send the second electrical signal data to the central module.

[0128] Thus, in the embodiments of the present application, the master optical module can unpack the second upstream physical frame in the form of a differential signal output by the amplifier through an internal signal processing chip to obtain the second electrical signal data of the central module and can send the second electrical signal data to the central module, thereby completing the data upstream between the vehicle terminal device and the central module.

[0129] An embodiment of the present application provides a vehicle, and the vehicle includes the above-mentioned vehicle system based on optical communication.

[0130] In the vehicle provided by the embodiment of the present application, between the central module in the vehicle system and the vehicle terminal devices in each edge module, the conversion between electrical signal data and optical signal data and the transmission of optical signal data can be performed through the optical and electrical communication module, so that the central module and the vehicle terminal devices in each edge module can interact through optical signals, thereby avoiding problems such as high time delay and low transmission rate during the transmission of electrical signal data to a certain extent. Therefore, the data transmission time delay and data transmission efficiency between the central module and the vehicle terminal device can be guaranteed, and thus applications with high real-time requirements such as vehicle information collection and analysis and data interaction between the vehicle and the cloud platform can be better supported, and the user experience of using the vehicle is guaranteed.

[0131] The additional aspects and advantages of the embodiments of the present application will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0132] The above and / or additional aspects and advantages of the present application will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0133] Figure 1 is a schematic diagram of a vehicle system based on optical communication in some embodiments of the present application;

[0134] Figure 2 Schematic diagram of a vehicle system based on optical communication in some embodiments of the present application;

[0135] Figure 3 Schematic diagram of an application scenario in some embodiments of the present application;

[0136] Figure 4 Schematic diagram of an application scenario in some embodiments of the present application;

[0137] Figure 5 Schematic diagram of an application scenario in some embodiments of the present application;

[0138] Figure 6 Schematic diagram of an application scenario in some embodiments of the present application;

[0139] Figure 7 Schematic diagram of an application scenario in some embodiments of the present application;

[0140] Figure 8 Schematic diagram of an application scenario in some embodiments of the present application;

[0141] Figure 9 Schematic diagram of an application scenario in some embodiments of the present application;

[0142] Figure 10 Schematic diagram of an application scenario in some embodiments of the present application;

[0143] Figure 11 Schematic diagram of a second switch in some embodiments of the present application;

[0144] Figure 12 Schematic diagram of an application scenario in some embodiments of the present application;

[0145] Figure 13 Schematic diagram of an application scenario in some embodiments of the present application;

[0146] Figure 14 Schematic diagram of an application scenario in some embodiments of the present application;

[0147] Figure 15 Schematic diagram of an application scenario in some embodiments of the present application;

[0148] Figure 16 Schematic diagram of an application scenario in some embodiments of the present application;

[0149] Figure 17 Schematic diagram of an application scenario in some embodiments of the present application;

[0150] Figure 18 Schematic diagram of an application scenario in some embodiments of the present application. Detailed implementation manners

[0151] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the embodiments of the present application, and should not be construed as a limitation to the embodiments of the present application.

[0152] In the related art, a whole vehicle can be divided into five control systems, namely a body control system, a power control system, a chassis control system, an intelligent cockpit control system, and an autonomous driving control system. Each control system is respectively controlled by its own domain controller, and the computing power of the domain controller is determined by its core processor chip.

[0153] It can be understood that in the case where a whole vehicle is divided into multiple control systems (such as the above five control systems), since the functions executed by one control system may depend on the data of another or multiple control systems. Therefore, there is data interaction between multiple control systems. Furthermore, when one control system executes a certain function, the execution efficiency of this function is limited not only by the computing power of this control system and the data transmission efficiency in the vehicle, but also by the data interaction efficiency between this control system and other control systems.

[0154] Furthermore, the data in vehicles in the related art is mostly in the form of electrical signals such as CAN (Controller Area Network) bus signals, LIN (Local Interconnect Network), PCIe (Peripheral Component Interconnect express) signals, and Ethernet signals.

[0155] With the introduction of high-computing-power chips, the computing power has been further increased, and domain integration has also been continuously promoted. The automotive electronic and electrical architecture has evolved from a domain architecture to a central computing unit, forming a central platform architecture that integrates domains.

[0156] However, limited by the transmission delay, transmission efficiency, etc. of electrical signals, the data processing efficiency in the in-vehicle system is correspondingly limited. At the same time, the in-vehicle electrical signal transmission harness is usually a copper cable, and the weight and layout difficulty of this kind of copper cable harness are relatively high. Therefore, the data transmission method based on electrical signals will also affect the weight of the whole vehicle and the layout of the in-vehicle harness to a certain extent.

[0157] Moreover, if there is electromagnetic interference between the interfaces of in-vehicle processing chips, it will further increase the wiring difficulty of the vehicle and further reduce the efficiency of the in-vehicle system to receive and transmit information to execute a function. Also, even if the computing power of the in-vehicle processing chip is high, due to the constraints during the transmission of electrical signals, the computing power of the central module chip based on the central platform architecture may not be fully utilized.

[0158] Based on the above possible problems, please refer to Figure 1 , an embodiment of the present application provides a vehicle system 1000 based on optical communication. The system includes a central module 1100 and an edge module 1200. The edge module 1200 includes an optoelectronic communication module 1210 and a vehicle terminal device 1220 electrically connected to the optoelectronic communication module. The central module 1100 is electrically connected to the optoelectronic communication module 1210. The optoelectronic communication module 1210 is configured to perform optoelectronic conversion processing and signal transmission on the received electrical signal to realize communication between the central module 1100 and the vehicle terminal device 1220.

[0159] Specifically, in the embodiment of the present application, the central module 1100 in the vehicle system 1000 can send an electrical signal to the optoelectronic communication module 1210 in the edge module 1200, so that the optoelectronic communication module 1210 converts the received electrical signal into an optical signal and transmits it, and converts the optical signal into an electrical signal to provide it to the vehicle terminal device 1220 in the edge module 1200, thereby realizing the information distribution of the central module 1100 to the vehicle terminal device 1220.

[0160] Moreover, the vehicle terminal device 1220 in the edge module 1200 can send an electrical signal to the optoelectronic communication module 1210 in the edge module 1200, so that the optoelectronic communication module 1210 converts the received electrical signal into an optical signal and transmits it, and converts the optical signal into an electrical signal to provide it to the central module 1100, thereby realizing the information upload of the vehicle terminal device 1220 to the central module 1100.

[0161] In this way, in the embodiment of the present application, between the central module 1100 in the vehicle system and the vehicle terminal devices 1220 in each edge module 1200, the conversion between electrical signal data and optical signal data and the transmission of optical signal data can be performed through the optoelectronic communication module 1210, so that the central module 1100 and the vehicle terminal devices 1220 in each edge module 1200 can interact through optical signals, thereby avoiding problems such as high time delay and low transmission rate during the transmission of electrical signal data to a certain extent. Therefore, the data transmission time delay and data transmission efficiency between the central module 1100 and the vehicle terminal device 1220 can be guaranteed, and thus application scenarios with high real-time requirements such as vehicle information collection and analysis, and data interaction between the vehicle and the cloud platform can be better supported, and the user experience of using the vehicle can be guaranteed.

[0162] In addition, it can also be understood that since data interaction is carried out through optical signal data, some of the electrical signal data transmission harnesses in the vehicle are replaced by optical signal data transmission harnesses. For example, copper cables are replaced by optical fibers. Compared with copper cables, optical fibers have a lower weight, possess strong EMC (Electromagnetic Compatibility) performance, and support high-bandwidth and low-latency data transmission.

[0163] In addition, Ethernet requires a specially defined management protocol, while the XGS-PON technology has a complete built-in management protocol (OMCI), which is convenient for centralized management. Moreover, the Ethernet technology has a symmetric rate, while the upstream and downstream rates of XGS-PON can be different and can be designed according to demand, supporting flexible rate adaptation to the requirements of service scenarios.

[0164] In addition, it can be understood that in the implementation manner of the present application, the central module 1100 can be understood as a processor with relatively high computing power. In one example, the central module 1100 is responsible for the automatic driving, intelligent cockpit, body control, power control, and chassis control of the whole vehicle, and can also be responsible for data interaction and data processing between the vehicle and the cloud platform.

[0165] It can also be understood that the specific structure of the central module 1100 can be set according to the actual situation. For example, in one example, reference can be specifically made to Figure 2 , Figure 2 , which is a schematic diagram of a vehicle system based on optical communication in some implementation manners of the present application. That is, the central module 1100 includes a processing chip 1101 and a root bridge device 1102 (Root Complex) connected to the processing chip 1101. The processing chip 1101 can send electrical signal data to the optoelectronic communication module 1210 through the root bridge device 1102, and receive the electrical signal data sent by the optoelectronic communication module 1210 through the root bridge device 1102. The central module 1100 includes a processing chip 1101 and a root bridge device 1102 electrically connected to the processing chip 1101. The processing chip 1101 can send electrical signals to the optoelectronic communication module 1210 through the root bridge device 1102, and can receive the electrical signals sent by the optoelectronic communication module 1210 through the root bridge device 1102.

[0166] Among them, the processing chip 1101 can be set according to actual situations. For example, in one example, the CPU (Central Processing Unit) computing power of the processing chip 1101 is 220K DMIPS, the GPU (Graphics Processing Unit) computing power is 3.1T FLOPS, and the NPU (Neural Processing Unit) computing power is 30TOPS. In another example, the processing chip 1101 refers to a chipset composed of two sub-chips in cascade, and the AI (Artificial Intelligence) computing power of each sub-chip is 254TOPS.

[0167] It can also be understood that in addition to the root bridge device 1102 and the processing chip 1101, other units can also be included in the central module 1100. For example, in one example as Figure 2 shown, the central module 1100 further includes an internal memory 1103 that is communicatively connected to the root bridge device 1102 through the Peripheral Component Interconnect Express (PCIe) protocol. In one example as Figure 2 shown, the central module 1100 further includes a first switch 1105 that is communicatively connected to the root bridge device 1102 through the PCIe protocol. In another example as Figure 2 shown, the central module 1100 further includes an endpoint device that is communicatively connected to the root bridge device 1102 through the PCIe protocol.

[0168] In one example, the internal memory 1103 is DDR5 or the like. Optionally, if the processing chip 1101 has its own memory or uses a High Bandwidth Memory (HBM) as the memory chip, the internal memory 1103 in the figure can be omitted.

[0169] In addition, the endpoint device refers to Figure 2 the PCIe device 1105 in, that is, a PCI Express Endpoint connected through PCI Express. In one example, the PCIe device 1105 includes modules and chips connected through PCI Express, such as modules not included in the processing chip 1101, such as a DSP (Digital Signal Processing) chip, an MCU (Micro Controller Unit), an Ethernet chip, and a radio chip.

[0170] The second switch can be understood as a PCIe expansion interface, which can provide routing and switching services for devices connected to the first switch 1105. In one example, a switch can be connected to devices such as multiple SSDs (Solid State Disks).

[0171] As Figure 2 shown, in the embodiment of the present application, the central module 1100 includes a bridge 1106, that is, a PCI Express to PCI / PCI-X Bridge. It can be understood that the bridge 1106 can be understood as an expansion interface, which can provide a connection between the PCI Express and PCI / PCI-X hierarchies. Therefore, in the embodiment of the present application, the processing chip 1101 can connect to PCI / PCI-X mounted devices through the root bridge device 1102 and the bridge 1106, or connect to other interface devices and modules not included in the processing chip 1101 by using a PCI / PCI-X adapter.

[0172] In the embodiment of the present application, the optoelectronic communication module 1210 can be used for the mutual conversion of optical signals and electrical signals, and can also be used for the transmission of optical signal data.

[0173] In the embodiment of the present application, the edge module 1200 can be understood as the above-mentioned body control system, power control system, chassis control system, intelligent cockpit control system, and autonomous driving control system.

[0174] In the embodiment of the present application, the vehicle terminal devices 1220 in each edge module 1200 can also be set according to actual situations. For example, in one example, the vehicle terminal device 1220 can be at least one of devices such as a high-definition central control screen, a high-definition instrument panel, pixel lights, high-definition cameras, lidar, millimeter-wave radar, TCU (Telematic Control Unit), V-BOX, and T-BOX (Telematics-BOX).

[0175] In some embodiments of the present application, there are multiple edge modules 1200, and the bandwidth demand of the vehicle terminal devices 1220 in each edge module 1200 is less than or equal to the upper bandwidth limit supported by the optoelectronic communication module 1210.

[0176] Specifically, in one example, the optoelectronic communication module 1210 supports signal transmission based on the xgs-pon protocol, and the upper bandwidth limit of the optoelectronic communication module 1210 is 10 Gbps. Therefore, in the embodiment of the present application, in any edge area, the sum of the bandwidth demands of all vehicle terminal devices 1220 in the area is less than or equal to 10 Gbps.

[0177] More specifically, in one example, a vehicle system includes multiple areas, such as a cockpit domain and an autonomous driving domain. The autonomous driving domain includes 10 edge modules 1200, and the total bandwidth demand of all vehicle terminal devices 1220 within any edge module 1200 is less than 10 Gbps. Furthermore, the cockpit domain includes two edge modules 1200, one of which may include a central control display (PAD) with a bandwidth demand of 4962 Mbps and a passenger display with a bandwidth demand of 2382 Mbps. The other edge module 1200 may include an interior rearview mirror (or electronic interior rearview mirror) with a bandwidth demand of 865 Mbps, two rear displays with a bandwidth demand of 2382 Mbps, a roof projector with a bandwidth demand of 2382 Mbps, an instrument panel with a bandwidth demand of 1742 Mbps, and a head-up display with a bandwidth demand of 1164 Mbps.

[0178] Thus, in the embodiment of the present application, the edge modules in the vehicle system may be divided according to the upper limit of the bandwidth supported by the optoelectronic communication module.

[0179] It should be noted that, in the embodiment of the present application, the regional modules can be determined and divided according to actual conditions. For example, in one example, the edge modules 1200 are divided into multiple ones according to the location.

[0180] To more clearly illustrate the implementation of this application, please refer to Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 8 、 Figure 9 as well as Figure 10 , Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 8 、 Figure 9 as well as Figure 10 These are all schematic diagrams of application scenarios in certain embodiments of the present application.

[0181] Specifically, if Figure 3 In the example shown, the edge module 1200 includes a front edge module, a left front edge module, a right front edge module, a left rear edge module, and a right rear edge module. In other words, the vehicle system 1000 includes an edge module 1200 located in the left front area of the vehicle (let this module be module 1200). 5-1 ), the edge module 1200 located in the front area of the vehicle (let this module be moudel 5-2 ), the edge module 1200 located in the right front area of the vehicle (let this module be moudel 5-3) The edge module 1200 located in the left rear area of the vehicle (let this module be moudel 5-4 ) and the edge module 1200 located in the right rear area of the vehicle (let this module be moudel 5-5 ). Correspondingly, the vehicle system 1000 includes five optical communication lines (or five optoelectronic communication modules 1210).

[0182] Furthermore, as Figure 3 shown, the vehicle terminal device 1220 in moudel1 may include sensors in all the autonomous driving domains in the left front area of the vehicle, such as millimeter-wave radars, lidars, high-definition cameras, etc.). At the same time, the vehicle terminal device 1220 may also include all the relevant modules in the intelligent network connection and body domains in the left front area to implement functions related to TCU, V-BOX, T-BOX, and intelligent antenna modules. Among them, all the relevant modules in the intelligent network connection and body domains in the left front area include at least one of devices such as GNSS antennas, Wi-Fi antennas, Bluetooth antennas, UWB antennas, V2X antennas, FM antennas, AM antennas, 4G cellular antennas, and 5G cellular antennas and corresponding components.

[0183] And, the vehicle terminal device 122 in moudel1 may also include a domain controller related to the body domain to implement control of the body such as vehicle lights, door locks, windows, rearview mirrors, windshield wipers, tailgates, etc.

[0184] Moreover, the vehicle terminal device 1220 in moudel 5-1 may also include all the power domain sensors, power domain controllers, chassis domain sensors, and chassis domain controllers in the left front area. And, the vehicle terminal device 1220 in moudel 5-1 may also include all the devices related to the intelligent cockpit domain in the left front area. In one example, all the devices related to the intelligent cockpit domain in the left front area include a central control screen, an instrument panel, cockpit entertainment devices, etc.

[0185] It can be understood that, similar to moudel 5-1 , the vehicle terminal device 1220 in moudel 5-2 may include relevant sensors, relevant domain controllers, relevant modules, etc. in the front area of the vehicle. The specific situation can be set according to the foregoing "vehicle terminal device 1220 in moudel 5-1 " and the actual situation.

[0186] It can also be understood that, similar to that located in moudel 5-1 , the vehicle terminal device 1220 in moudel 5-3 may include relevant sensors, relevant domain controllers, relevant modules, etc. in the right front area of the vehicle. moudel5-4 The vehicle terminal device 1220 therein may include relevant sensors, relevant domain controllers, relevant modules, etc. in the left rear area of the vehicle. moudel 5-5 The vehicle terminal device 1220 therein may include relevant sensors, relevant domain controllers, relevant modules, etc. in the right rear area of the vehicle,

[0187] In such as Figure 4 In an example shown, the vehicle system 1000 includes an edge module 1200 located in the left front area of the vehicle (let this module be moudel 6-1 ), an edge module 1200 located in the front middle area of the vehicle (let this module be moudel 6-2 ), an edge module 1200 located in the right front area of the vehicle (let this module be moudel 6-3 ), an edge module 1200 located in the left rear area of the vehicle (let this module be moudel 6-4 ), an edge module 1200 located in the rear middle area of the vehicle (let this module be moudel 6-5 ), and an edge module 1200 located in the right rear area of the vehicle (let this module be moudel 6-6 ). Correspondingly, the vehicle system 1000 includes six optical communication lines (or six optoelectronic communication modules 1210).

[0188] In such as Figure 5 In an example shown, the vehicle system 1000 includes an edge module 1200 located in the left front area of the vehicle (and relatively close to the Figure 4 upper left corner) (let this module be moudel 7-1 ), an edge module 1200 located in the left front area of the vehicle (let this module be moudel 7-2 ), an edge module 1200 located in the right front area of the vehicle (and relatively close to the Figure 4 upper right corner) (let this module be moudel 7-3 ), an edge module 1200 located in the left front area of the vehicle (and located below moudel 7-1 ) (let this module be moudel 7-4 ), an edge module 1200 located in the left rear area of the vehicle (let this module be moudel 7-5 ), an edge module 1200 located in the right front area of the vehicle (and located below moudel 7-3 ) (let this module be moudel 7-7 ). Correspondingly, the vehicle system 1000 includes seven optical communication lines (or seven optoelectronic communication modules 1210).

[0189] In such as Figure 6In one example shown, the vehicle system 1000 includes eight edge modules 1200 located at different positions. Correspondingly, the vehicle system 1000 includes eight optical communication lines (or eight optoelectronic communication modules 1210).

[0190] In an example such as Figure 7 shown, the vehicle system 1000 includes 13 edge modules 1200 located at different positions. Correspondingly, the vehicle system 1000 includes thirteen optical communication lines (or thirteen optoelectronic communication modules 1210).

[0191] In an example such as Figure 8 shown, the vehicle system 1000 includes two edge modules 1200 located at different positions. Correspondingly, the vehicle system 1000 includes two optical communication lines (or two optoelectronic communication modules 1210).

[0192] In an example such as Figure 9 shown, the vehicle system 1000 includes three edge modules 1200 located at different positions. Correspondingly, the vehicle system 1000 includes three optical communication lines (or three optoelectronic communication modules 1210).

[0193] In an example such as Figure 10 shown, the vehicle system 1000 includes four edge modules 1200 located at different positions. Correspondingly, the vehicle system 1000 includes four optical communication lines (or four optoelectronic communication modules 1210).

[0194] It can be understood that in examples such as Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8 , Figure 9 and Figure 10 respectively shown, the vehicle terminal devices 1220 included in the edge modules 1200 located at different positions can be designed according to the actual situation and / or Figure 2 corresponding description. To avoid repetition, it will not be elaborated here.

[0195] Thus, in the embodiments of the present application, each edge module in the vehicle system can be divided according to the location of the module and the upper limit of the bandwidth supported by the optoelectronic communication module.

[0196] In addition, it can also be understood that in addition to setting each edge module urchased in the vehicle system 1000 by location, the edge module 1200 can also be set in other ways. For example, in some embodiments of the present application, the edge module 1200 includes multiple modules divided by function.

[0197] To clearly illustrate the embodiments of the present application, please refer to againFigure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8 , Figure 9 and Figure 10 . That is, in the example shown in ​ , the entire vehicle is divided into an autonomous driving domain, an intelligent networking and body domain, a power domain, a chassis domain, and an intelligent cockpit domain. Correspondingly, the edge modules include an autonomous driving domain edge module, an intelligent networking and body domain edge module, a power domain edge module, a chassis domain edge module, and an intelligent cockpit domain edge module. Or rather, moudel 5-1 corresponds to the autonomous driving domain, moudel 5-2 corresponds to the intelligent networking and body domain, moudel 5-3 corresponds to the power domain, moudel 5-4 corresponds to the chassis domain, and moudel 5-5 corresponds to the intelligent cockpit domain.

[0198] Among them, the vehicle terminal device 1220 in moudel 5-1 may include all sensors in the autonomous driving domain, including but not limited to millimeter-wave radars, lidars, high-definition cameras, etc. The vehicle terminal device 1220 in moudel 5-2 may include relevant modules in the intelligent networking and body domain, such as at least one of devices such as GNSS antennas, Wi-Fi antennas, Bluetooth antennas, UWB antennas, and corresponding components, and may also include controllers for components such as vehicle lights, door locks, windows, rearview mirrors, windshield wipers, and tailgates.

[0199] It can be understood that the vehicle terminal device 1220 in moudel 5-3 may include sensors and controllers deployed in the power domain, the vehicle terminal device 1220 in moudel 5-4 may include sensors and controllers deployed in the chassis domain, and the vehicle terminal device 1220 in moudel 5-5 may include sensors and controllers deployed in the intelligent cockpit domain, as well as intelligent cockpit domain-related devices such as a central control screen, an instrument panel, and cockpit entertainment devices.

[0200] In addition, on the basis of ​ , the intelligent networking and body domain is split into an intelligent networking domain and a body domain, so that the entire vehicle is divided into 6 functional domains corresponding to the autonomous driving domain, the intelligent networking domain, the body domain, the power domain, the chassis domain, and the intelligent cockpit domain. For any one of these 6 functional domains, the sensors, controllers, and related devices (such as the central control screen in the intelligent cockpit domain) of the functional domain are all connected to an optoelectronic communication module 1210, and thus, as shown in​ The six edge modules 1200 shown.

[0201] When the entire vehicle can be divided into the left front area of the autonomous driving domain, the right front area of the autonomous driving domain, the rear area sensors of the autonomous driving domain, the intelligent cockpit domain, the intelligent network connection and body domain, the power domain, and the chassis domain, the allocation of the edge module 1200 can be referred to ​ . For example, in one example, moudel 7-1 corresponds to the left front area of the autonomous driving domain, moudel 7-2 corresponds to the intelligent cockpit domain, moudel 7-3 corresponds to the right front area of the autonomous driving domain, moudel 7-4 corresponds to the intelligent network connection and body domain, moudel 7-5 corresponds to the power domain, moudel 7-6 corresponds to the rear area of the autonomous driving domain, moudel 7-7 corresponds to the chassis domain.

[0202] Among them, the vehicle terminal device 1220 in moudel 7-1 may include sensors in the left front area of the autonomous driving domain. The vehicle terminal device 1220 in moudel 7-2 may include relevant devices and controller sensors deployed in the intelligent cockpit domain. The vehicle terminal device 1220 in moudel 7-3 may include sensors deployed in the right front area of the autonomous driving domain. The vehicle terminal device 1220 in moudel 7-4 may include relevant devices and controller sensors deployed in the intelligent network connection and body area. The vehicle terminal device 1220 in moudel 7-5 may include sensors and controllers deployed in the power domain. The vehicle terminal device 1220 in moudel 7-6 may include sensors deployed in the rear area of the autonomous driving domain. The vehicle terminal device 1220 in moudel 7-7 may include sensors and controllers deployed in the chassis domain.

[0203] In ​In the content shown, the entire vehicle can be divided into 8 functional domains, and each functional domain corresponds to an edge module 1200. In one example, these 8 functional domains are: the left front area of the autonomous driving domain, the right front area of the autonomous driving domain, the left rear area of the autonomous driving domain, the right rear area of the autonomous driving domain, the intelligent cockpit domain, the chassis domain, the power domain, and the intelligent networking and body domain. In another example, these 8 functional domains are: the left front area of the autonomous driving domain, the right front area of the autonomous driving domain, the overall rear vehicle area, the first half area of the intelligent cockpit domain, the second half area of the intelligent driving domain, the chassis domain, the power domain, and the intelligent networking and body domain. In another example, these 8 functional domains are: the left front area of the autonomous driving domain, the right front area of the autonomous driving domain, the overall rear vehicle area, the intelligent cockpit domain, the chassis domain, the power domain, the intelligent networking domain, and the body domain.

[0204] In ​ the content shown, the entire vehicle can be divided into 13 functional domains, and each functional domain corresponds to an edge module 1200. Therefore, there are 13 edge modules 1200, which are respectively designated as moudel 13-1 , moudel 13-2 , …, moudel 13-13 . Then, in the order from left to right and from top to bottom, these 13 functional domains are: the first sub-region of the intelligent cockpit domain (corresponding to the edge module 1200 moudel 13-1 ), the second sub-region of the intelligent cockpit domain (corresponding to the edge module 1200 moudel 13-2 ), the first half area of the left front area of autonomous driving (designated as moudel 13-3 ), the second half area of the left front area of autonomous driving (designated as moudel 13-4 ), the first half area of the right front area of autonomous driving (designated as moudel 13-5 ), the second half area of the right front area of autonomous driving (designated as moudel 13-6 ), the chassis domain (designated as moudel 13-7 ), the third sub-region of the intelligent cockpit domain (designated as moudel 13-8 ), the power domain (designated as moudel 13-9 ), the left rear area of autonomous driving (designated as moudel 13-10 ), the body domain (designated as moudel 13-11 ), the intelligent networking domain (designated as moudel 13-12 ), the right rear area of autonomous driving (designated as moudel 13-13 ).

[0205] In addition, in ​In one example shown, vehicle system 1000 includes two edge modules 1200 for implementing different vehicle functions. Correspondingly, vehicle system 1000 includes two optical communication lines (or two optoelectronic communication modules 1210).

[0206] In an example as ​ shown, vehicle system 1000 includes three edge modules 1200 for implementing different vehicle functions. Correspondingly, vehicle system 1000 includes three optical communication lines (or three optoelectronic communication modules 1210).

[0207] In an example as ​ shown, vehicle system 1000 includes four edge modules 1200 for implementing different vehicle functions. Correspondingly, vehicle system 1000 includes four optical communication lines (or four optoelectronic communication modules 1210).

[0208] Thus, in the embodiments of the present application, each edge module 1200 in vehicle system 1000 can be divided according to the functions of the module and the upper limit of the bandwidth supported by optoelectronic communication module 1210.

[0209] Please refer to again ​ , in some embodiments of the present application, the system further includes a second switch 1310, and central module 1100 is connected to optoelectronic communication module 1210 through second switch 1310. That is, to improve the information interaction efficiency within the vehicle system, or rather, to improve the efficiency of the central module 1100 in issuing control instructions to each vehicle terminal device 1220 in the vehicle system, and the reporting efficiency of the data information sent by each vehicle terminal device 1220 to the central module 1100, central module 1100 can send electrical signal data to multiple optoelectronic communication modules 1210 through second switch 1310, so that multiple optoelectronic communication modules 1210 send the electrical signal data to the corresponding vehicle terminal devices 1220. Conversely, each optoelectronic communication module 1210 can send the data information reported by vehicle terminal device 1220 to the switch, so that central module 1100 can receive the data information reported by multiple vehicle terminal devices 1220 through the switch.

[0210] Thus, in the embodiments of the present application, central module 1100 can receive the data information reported by multiple vehicle terminal devices 1220 through the switch, and central module 1100 can send electrical signal data to multiple optoelectronic communication modules 1210 through second switch 1310.

[0211] In one example, the structure of second switch 1310 is as ​ , ​FIG2 is a schematic diagram of a second switch 1310 in certain embodiments of the present application. Specifically, in the embodiments of the present application, the second switch 1310 includes a first virtual bridge 1312 connected to the root bridge device 1102 via an upstream port 1311 (Upstream Port), and also includes a second virtual bridge 1313 connected to the optical communication module 1210 via a downstream port 1314 (Downstream Port).

[0212] Among them, a downstream port 1314 can be connected to an optoelectronic communication module 1210. Further, if it is necessary to connect to multiple optoelectronic communication modules 1210 at the same time, the second virtual bridge 1313 and the corresponding downstream port 1314 can be expanded, such as ​ In the example, a first virtual bridge 1312 can be connected to at least two second virtual bridges 1313 .

[0213] In certain embodiments of the present application, the optoelectronic communication module 1210 includes at least one master-end optical module, at least one optical splitter, and multiple slave-end optical modules connected in sequence through optical fibers. The central module 1100 is electrically connected to the master-end optical module, and the slave-end optical module is electrically connected to the vehicle terminal device 1220.

[0214] To more clearly illustrate the implementation of this application, please refer to ​ 、 ​ 、 ​ and ​ , ​ 、 ​ 、 ​ and ​ All of them are schematic diagrams of application scenarios in certain embodiments of the present application. That is, in the embodiments of the present application, the optoelectronic communication module 1210 is based on a 1×N structural design or an M×N structural design, where N refers to the number of slave optical modules and M refers to the number of master optical modules. Specifically, ​ and ​ The optoelectronic communication module 1210 is based on a 1×N structure and consists of a master optical module, an optical splitter, and two slave optical modules. ​ and ​ The optoelectronic communication module 1210 is based on an M×N structure and is composed of two master-end optical modules, a splitter and two slave-end optical modules. It can be understood that the above M and N can be set according to actual conditions. ​ 、 ​ 、 ​ and ​ This is just an example. ​ 、 ​ 、 ​ and ​ The SOC in FIG refers to the central module 1100 .

[0215] To more clearly illustrate the function of the optoelectronic communication module 1210 in the embodiment of the present application, please refer to ​ and ​ That is, in an example where the electrical signal data is a PCIe data frame, the optical signal data is an XGS-PON data frame, and the vehicle terminal device 1220 includes a telematics processor (Telematics-BOX, T-BOX), the telematics processor can send PCIe data frames to the slave optical module through its own PCIe interface.

[0216] Then, the slave optical module receives the PCIe data frame according to its own PCIe interface, and performs optoelectronic conversion on the PCIe data frame to encapsulate the PCIe data frame into an XGS-PON uplink physical burst frame, and sends the XGS-PON uplink physical burst frame to the optical splitter through its own XGS-PON interface, so that the optical splitter forwards the XGS-PON uplink physical burst frame to the master optical module.

[0217] Next, after receiving the XGS-PON uplink physical burst frame according to its own XGS-PON interface, the master optical module performs photoelectric conversion on the XGS-PON uplink physical burst frame to convert the XGS-PON uplink physical burst frame into a PCIe data frame, and sends the PCIe data frame to the central module 1100 through its own PCIe interface.

[0218] Finally, the central module 1100 receives the PCIe data frame according to its own PCIe interface to perform corresponding processing, and the uplink process of the electrical signal data is completed by the telematics processor central module 1100.

[0219] In addition, considering the adaptation problem of the vehicle terminal device 1220 for the transmission and reception of electrical signal data, in the embodiment of the present application, when the format of the electrical signal that can be transmitted and received by the vehicle terminal device 1220 itself cannot match the format of the electrical signal that can be transmitted and received by the slave optical module, the vehicle terminal device 1220 can be connected to the slave optical module through one or more external signal switching units.

[0220] For example, see again ​ and ​ That is, in the example where the electrical signal data is a PCIe data frame, the optical signal data is an XGS-PON data frame, and the vehicle terminal device 1220 includes a panoramic camera / display / central control screen, the central module 1100 can send PCIe data frames to the master-end optical module through its own PCIe interface.

[0221] Next, the master optical module will perform optoelectronic conversion on the received PCIe data frame to encapsulate the PCIe data frame into an XGS-PON downstream physical frame, and send the XGS-PON downstream physical frame to the slave optical module through its own XGS-PON interface and optical splitter.

[0222] Then, after the slave optical module receives the XGS-PON downstream physical frame through the optical splitter, it performs optoelectronic conversion on the XGS-PON downstream physical frame to convert the XGS-PON downstream physical frame into a PCIe data frame.

[0223] Furthermore, since the panoramic camera / display / central control screen has the ability to receive and transmit GMSL (Gigabit Multimedia Serial Link) 2 signals but does not have the ability to receive and transmit PCIe data frames, the panoramic camera / display / central control screen is connected to the slave optical module through an external GMSL2 deserializer and an adapter. Thus, after the slave optical module unpacks the PCIe data frame in the XGS-PON downstream physical frame, it sends the PCIe data frame to the adapter through its own PCIe interface and the PCIe interface of the adapter.

[0224] Then, the PCIe data frame is converted by the adapter to be converted into an intermediate format signal, such as any one of MIPI CSI (Mobile Industry Processor Interface Camera Serial Interface) signal, D-HYDP signal, DP signal, eDP signal, DSI signal.

[0225] Then, via the MIPI CSI interface of the adapter itself and the MIPI CSI interface of the GMSL2 deserializer, the intermediate format signal is transmitted to the GMSL2 deserializer, and the GMSL2 deserializer converts the GMSL2 deserializer into a GMSL2 signal.

[0226] Finally, the GMSL2 deserializer transmits the GMSL2 signal to the panoramic camera / display / central control screen based on its own GMSL2 interface and the GMSL2 interface of the panoramic camera / display / central control screen. Thus, the downstream process of the electrical signal data from the central module 1100 to the vehicle terminal device 1220 ends.

[0227] In some embodiments of the present application, there are multiple vehicle terminal devices 1220, and the master optical module is configured as:

[0228] In the case of receiving the first electrical signal data sent by the central module 1100, determine the target device identification information according to the first electrical signal data and the pre-determined mapping relationship data between the electrical signal data and the device identification information;

[0229] Determine the first optical signal data according to the first electrical signal data and the target device identification information, where the target device identification information is used to identify the target vehicle terminal device 1220 that receives the first electrical signal data among the multiple vehicle terminal devices 1220;

[0230] Send the first optical signal data to the optical splitter.

[0231] It should be noted that in the embodiment of the present application, during the process of generating the first electrical signal data by the central module 1100, the "pointing information" for characterizing the data recipient (i.e., the target vehicle terminal device 1220) can be written into the electrical signal, and the mapping relationship data of the embodiment of the present application can record the "device identification information" of different vehicle terminal devices 1220 corresponding to different "pointing information". Furthermore, the optical and electrical communication module 1210 can determine the identification information of the recipient of the first electrical signal data, that is, the target device identification information, according to the mapping relationship data and the first electrical signal data.

[0232] It should also be noted that in the embodiment of the present application, the vehicle terminal device 1220 can be understood as an ONU (Optical Network Unit), and the device identification information of the vehicle terminal device 1220 can be understood as an ONU ID (Optical Network Unit Identity Document).

[0233] In this way, before converting the electrical signal to the optical signal and transmitting the optical signal, the target device identification information of the recipient of the first electrical signal data can be determined first through the first electrical signal data and the pre-determined mapping relationship data of the electrical signal - device identification information. Furthermore, after the electrical signal is converted to the optical signal and the optical signal is transmitted, the electrical signal data can be sent to the corresponding recipient based on the target device identification information, ensuring the robust transmission of the electrical signal data.

[0234] In addition, it can be understood that the above-mentioned "pointing information" can be set according to the actual situation. For example, in some embodiments, the first electrical signal frame header data includes an address field at the target position. In other words, the "address field at the target position" is the above-mentioned "pointing information". For example, in one example, the above-mentioned "address field at the target position" refers to a 62-bit field from the 2nd bit to the 63rd bit in the first electrical signal frame header data in the Non-Flit mode. In another example, the above-mentioned "address field at the target position" refers to a 30-bit field from the 2nd bit to the 31st bit in the first electrical signal frame header data.

[0235] For another example, in some other embodiments of the present application, the first electrical signal frame header data includes at least one of a bus number (BusNumber) field, a function number (Function Number) field, and a device number (Device Number) field. In other words, "at least one of the bus number field, the function number field, and the device number field" is the above-mentioned "pointing information".

[0236] Correspondingly, in the embodiments of the present application, the mapping relationship data can also be set according to the actual situation. For example, in some embodiments, the mapping relationship data can be divided into two types. One is the first mapping relationship sub-data, and the other is the second mapping relationship sub-data. Among them, there can be multiple copies of the second mapping relationship sub-data.

[0237] Furthermore, the first mapping relationship sub-data is used to indicate a copy of the second mapping relationship sub-data corresponding to the first electrical signal data, or in other words, to indicate "the second mapping relationship sub-data in multiple copies that 'can be used to confirm the recipient of the first electrical signal data'".

[0238] In one example, the first mapping relationship sub-data can be understood as a mapping table with the above-mentioned "target attribute of the target field in the first electrical signal frame header data" as the key and the second mapping relationship sub-data as the value. The second mapping relationship sub-data can be understood as a mapping table with the above-mentioned "value of the target field in the first electrical signal frame header data" as the key and the device identification information as the value. It should be noted that in the embodiments of the present application, the field attribute refers to the field length and field type, and the target attribute is the field length and / or field type.

[0239] In another example, the first mapping relationship sub-data is a mapping table with the "target attribute of the target field in the first electrical signal frame header data" and the "current transmission mode of the first electrical signal data" jointly as the key and the second mapping relationship sub-data as the value. Among them, in one example, the first electrical signal data can be transmitted through two transmission modes. One is the Flit mode, and the other is the Non-Flit mode.

[0240] In one example, the target field is a field with a length of 62 bytes from the 2nd bit to the 63rd bit in the header data of the first electrical signal.

[0241] In one example, the target field is a field with a length of 30 bytes from the 2nd bit to the 31st bit in the header data of the first electrical signal.

[0242] In one example, the target field is a combined field with a length of 16 bytes, which is composed of an 8-bit Bus Number, a 5-bit Device Number, and a 3-bit FCN NUM in the header data of the first electrical signal.

[0243] In one example, the target field is a combined field with a length of 16 bytes, which is composed of an 8-bit Bus Number and an 8-bit Function Number in the header data of the first electrical signal.

[0244] In some embodiments of the present application, the optical splitter is configured to forward the first optical signal data to multiple slave optical modules.

[0245] Specifically, in the embodiments of the present application, the optical splitter can provide the function of data broadcasting. Specifically, for the optical splitter in the optical and electrical communication module 1210, when receiving the first optical signal data sent by the master optical module, the optical splitter can forward the first optical signal data to each slave optical module connected to itself, thereby realizing the broadcasting of the first optical signal data to each slave optical module.

[0246] In this way, in the embodiments of the present application, the first optical signal data sent by the master optical module can be forwarded to each slave optical module in the module through the optical splitter.

[0247] In some embodiments of the present application, the slave optical module is configured to:

[0248] When the target device identification information matches the pre-stored device identification information, determine the first electrical signal data according to the first optical signal data;

[0249] Send the first electrical signal data to the target vehicle terminal device 1220.

[0250] Specifically, in the embodiments of the present application, after receiving the first optical signal data forwarded by the optical splitter, the slave optical module can verify the target device identification information in the first optical signal data.

[0251] Specifically, after receiving the first optical signal data from the slave optical module, the target device identification information in the first optical signal data can be read, and the target device identification information is compared one by one with each device identification information stored in advance by itself to determine whether the "target device identification information in the first optical signal data" is the same as the "one or more device identification information stored by itself".

[0252] If the "target device identification information in the first optical signal data" is the same as the "one or more device identification information stored by itself", it is determined that the recipient of the first optical signal data is connected to the slave optical module itself. Furthermore, the slave optical module processes the first optical signal data to determine the first electrical signal data and forwards the first electrical signal data to the vehicle terminal device 1220 pointed to by the target device identification information.

[0253] Conversely, if the "target device identification information in the first optical signal data" is not the same as any of the device identification information stored by itself, it is determined that the recipient of the first optical signal data is not connected to the slave optical module itself. Furthermore, the slave optical module ignores the first optical signal data.

[0254] In one example, the device identification information stored by the slave optical module includes the "device identification information of each vehicle terminal device 1220 connected to the slave optical module".

[0255] In this way, in the embodiment of the present application, when the slave optical module can match the target device identification information in the first optical signal data with the pre-stored device identification information, the first electrical signal data is determined according to the first optical signal data, and the first electrical signal data is sent to the target vehicle terminal device 1220, thereby ensuring the stable transmission of the first electrical signal data.

[0256] In some embodiments of the present application, the slave optical module is configured to:

[0257] When receiving the second electrical signal data sent by the vehicle terminal device 1220, determine the second optical signal data according to the second electrical signal data;

[0258] Send the second optical signal data to the optical splitter.

[0259] Specifically, in the embodiment of the present application, when the vehicle terminal device 1220 desires to send data to the central module 1100, the vehicle terminal device 1220 may send the generated second electrical signal data to the slave optical module. Correspondingly, after receiving the second electrical signal data, the slave optical module may perform optoelectronic conversion processing on the second electrical signal data to convert the second electrical signal data into an optical signal, that is, the above-mentioned second optical signal data. Then, the slave optical module may send the second optical signal data to the optical splitter, so that the optical splitter forwards the second electrical signal data to the master optical module, thereby realizing the data transmission of the second optical signal data.

[0260] In this way, in the embodiment of the present application, the slave optical module can perform optoelectronic conversion processing on the second electrical signal data when receiving the second electrical signal data sent by the vehicle terminal device 1220, so as to determine the second optical signal data according to the second electrical signal data, and send the second optical signal data to the optical splitter to perform the data transmission of the second optical signal data through the optical splitter.

[0261] In some embodiments of the present application, both the first electrical signal data and the second electrical signal data include all types of data frames in the data link layer and all types of data streams in the physical layer.

[0262] Specifically, in one example, the electrical signal data includes data link layer packets (DLLP) in the data link layer, transaction layer packets (TLP) with headers and trailers added in the data link layer, data link layer payloads (DLLP) with headers and trailers added in the physical layer logical sub-block, data link layer packets with headers and trailers added in the non-flit mode in the physical layer logical sub-block, and flit data frames in the physical layer logical sub-block.

[0263] More specifically, when the first payload data is the XGEM Payload in the XGEM frame, there are five types of the first payload data in total. One is the DLLP in the data link layer. The second is the TLP in the data link layer, that is, the data packet obtained by adding the frame header and frame tail of the data link layer to the TLP in the Transaction Layer. The third is the TLP with different frame headers and frame tails added in the Physical Layer in the 8b / 10b or 128b / 130b encoding form in the Non-Flit mode. The fourth is the DLLP with different frame headers and frame tails added in the Physical Layer in the 8b / 10b or 128b / 130b encoding form in the Non-Flit mode. The fifth is the flit data frame of the physical layer logic sub-block in the 8b / 10b, 128b / 130b, 1b / 1b encoding mode in the Flit mode. In the structure of this frame, the TLP and DLP have fixed positions, where the TLP is the data frame of the transaction layer, and the DLP (In Flit Mode, the Data Link Layer Payload within a Flit) is the DLLP in the Flit mode.

[0264] In some embodiments of the present application, the optical splitter is configured to forward the second optical signal data to the master optical module.

[0265] Specifically, during the process of the vehicle terminal device 1220 sending data to the central module 1100, the optical splitter can forward the second optical signal data to the master optical module connected to itself when receiving the second optical signal data sent by the slave optical module, thereby completing the data transmission of the second optical signal data.

[0266] In this way, in the embodiments of the present application, the second optical signal data can be forwarded by the optical splitter to the master optical module, so as to complete the data transmission of the second optical signal data.

[0267] In some embodiments of the present application, the master optical module is configured to:

[0268] Determine the second electrical signal data according to the second optical signal data;

[0269] Send the second electrical signal data to the central module 1100.

[0270] Specifically, in the process of the vehicle terminal device 1220 sending data to the central module 1100, when the master optical module receives the second electrical signal data forwarded by the optical splitter, corresponding processing such as optoelectronic conversion can be performed on the second electrical signal data to determine the second electrical signal data based on the second optical signal data. Furthermore, the master optical module can send the second electrical signal data to the central module 1100 so that the central module 1100 performs corresponding processing on the second electrical signal data.

[0271] In this way, in the embodiment of the present application, the master optical module can, after receiving the second optical signal data forwarded by the optical splitter, determine the second electrical signal data based on the second optical signal data and send the second electrical signal data to the central module 1100, thereby completing the data transmission of the vehicle terminal device 1220 to the central module 1100.

[0272] In the embodiment of the present application, the master optical module is configured to:

[0273] Determine the first electrical signal data as the first payload data;

[0274] Configure the first frame header data according to the first payload data and the target device identification information;

[0275] Merge the first payload data and the first frame header data to obtain the first optical signal data.

[0276] Specifically, in the embodiment of the present application, the master optical module can use the first electrical signal data as the payload, and can write the target device identification information into the frame header to complete the configuration of the frame header. Furthermore, the frame header containing the target device identification information and the first electrical signal data as the payload are merged and packaged to obtain the optical signal data to be transmitted.

[0277] It can be understood that since the first electrical signal data is transmitted as the payload of the first optical signal data, the slave optical module can unpack the first optical signal data to obtain the payload in the first optical signal data, that is, the original first electrical signal data without data processing can be obtained.

[0278] It can also be understood that since the target device identification information is written into the frame header, the slave optical module can read the target device identification information in the frame header of the first optical signal data to determine whether the target device identification information matches any one of the multiple device identification information pre-stored by itself, and unpack the first optical signal data in the case of a match.

[0279] In an example where the device identification information is ONU-ID and the first optical signal data is an XGEM data frame, the device identification information (ONU-ID) can be assigned to the XGEM port-ID field of the XGEM frame header.

[0280] Thus, in the embodiment of the present application, the master optical module can determine the first payload data according to the first electrical signal data, configure the first frame header data through the target device identification information, and then package and encapsulate the first payload data and the first frame header data into the first optical signal data to implement the conversion of the first electrical signal data to the first optical signal data.

[0281] Furthermore, due to the realization of the transparent transmission of electrical signal data, the consistency between the electrical signal data sent by the central module 1100 and the electrical signal data received by the vehicle terminal device 1220 can be ensured, and the stability and reliability of data transmission can be enhanced, and data processing operations such as compression, encryption, and decryption during data transmission can be reduced. Therefore, the occurrence of data loss or damage during data transmission can be reduced, and the load during data transmission and the delay during data transmission can be reduced, so that the data transmission efficiency and data transmission throughput can be improved. Thus, applications with high real-time requirements such as vehicle information collection and analysis, and data interaction between vehicles and cloud platforms can be better supported, and the user experience of using the vehicle can be guaranteed.

[0282] In some embodiments of the present application, the slave optical module is configured to:

[0283] Determine the second electrical signal data as the second payload data;

[0284] Configure the second frame header data according to the second payload data;

[0285] Combine the second payload data and the second frame header data to obtain the second optical signal data.

[0286] Specifically, in the embodiment of the present application, the slave optical module can use the second electrical signal data sent by the vehicle terminal device 1220 as the payload, and combine and encapsulate the payload with the pre-configured frame header to obtain the second optical signal data and send the second optical signal data to the master optical module through the optical splitter. After receiving the second optical signal data, the master optical module can unpack and encapsulate the second optical signal data to obtain the payload in the second optical signal data, and then obtain the transparently transmitted second electrical signal data, and thus the second electrical signal data can be sent to the central module 1100 so that the central module 1100 can perform corresponding processing on the second electrical signal data.

[0287] Thus, in the embodiment of the present application, the slave optical module can determine the second electrical signal data as the second payload data, configure the second frame header data according to the second payload data, and combine the second payload data and the second frame header data to obtain the second optical signal data, thereby realizing the conversion of the second electrical signal data to the second optical signal data.

[0288] In addition, it can be understood that both the slave optical module and the master optical module in the embodiments of the present application can configure the frame header data. In the embodiments of the present application, the configurable parameters in the frame header data can be set according to the actual situation.

[0289] In one example, both the first frame header data and the second frame header data include a first parameter, and the first parameter is used to indicate the number of payload data in the optical signal data.

[0290] In one example, both the first frame header data and the second frame header data include a second parameter, and the second parameter is used to indicate the fragmentation state of the payload data.

[0291] In one example, both the first frame header data and the second frame header data include a third parameter, and the third parameter is used to indicate the fragmentation sequence number corresponding to each piece after the payload data is fragmented.

[0292] In one example, both the first frame header data and the second frame header data include a fourth parameter, and the fourth parameter is used to indicate the source of the payload data.

[0293] In one example, both the first frame header data and the second frame header data include a fifth parameter, and the fifth parameter is used to store device identification information.

[0294] In one example, the second frame header data among the first frame header data and the second frame header data includes at least one of the above-mentioned first parameter, second parameter, third parameter, fourth parameter, and fifth parameter.

[0295] In one example, for details, please refer to ​ , ​ is a schematic diagram of an application scenario in some embodiments of the present application. That is, when the first payload data is the XGEM Payload in the XGEM frame, the configurable parameters in the frame header data include the PLI field (i.e., the first parameter), the FF field (i.e., the second parameter), the FSN field (i.e., the third parameter), the MSN field (i.e., the fourth parameter), and the XGEM port-ID field (i.e., the fifth parameter).

[0296] Among them, the PLI field has a size of 14 bits and can be used to indicate the load length and the number of control frames, accurate to bytes. It should be noted that in the Flit mode, the PLI bit can be set to a fixed value to control the number of physical layer logic sub-block data streams in an XGEM frame, that is, the number of the first payload data. It can be understood that in the embodiments of the present application, multiple physical layer logic sub-block data streams (each 256 Bytes) can be placed in the load of an XGEM frame for transmission simultaneously, and the specific number of transmitted physical layer logic sub-blocks can be controlled by the PLI. When the PLI field is used as a parameter for frame number control, the bit value of the PLI field should be a multiple of decimal 256 after being converted to a decimal value. For example, if n physical layer logic sub-block data streams are to be transmitted, the PLI bit value is set to n×256 in binary, where n is less than or equal to 529.

[0297] The FF field has a size of 2 bits and is used to indicate the fragmentation status of the first payload data, that is, whether the first payload data is fragmented.

[0298] The FSN field has a size of 6 bits and is used to indicate the fragmentation sequence number corresponding to the first payload data.

[0299] The MSN field has a size of 2 bits and is used to indicate the data source, that is, the source of the first payload data or the electrical signal data.

[0300] It can be understood that the unpacking process of the optical signal data can be performed according to the various parameters in the frame header data. Therefore, based on the configuration of the various parameters in the frame header data, the robust execution of unpacking the optical signal data to obtain the electrical signal data can be guaranteed to a certain extent.

[0301] In some embodiments of the present application, the master optical module includes an electrical signal interface, and the master optical module is configured to:

[0302] Receive the first electrical signal data sent by the central module 1100 according to the electrical signal interface.

[0303] To illustrate the embodiments of the present application more clearly, please refer to ​ , ​ which is a schematic diagram of an application scenario in some embodiments of the present application. Specifically, in an example as ​ shown, both the master optical module and the slave optical module include an electrical signal interface 210, a signal processing chip 110, 1220, a driver 230, a laser 240, a demultiplexer 250, a photodetector 260, an amplifier 270, a clock recovery chip 280, and an optical signal interface 290.

[0304] Further, the electrical signal interface can be used for the transceiver of electrical signal data. Therefore, for the master optical module, the master optical module can receive the first electrical signal data sent by the central module 1100 through the signal interface to perform processing such as optoelectronic conversion on the received first electrical signal data.

[0305] Thus, in the embodiment of the present application, the master optical module can receive the first electrical signal data sent by the central module 1100 through the electrical signal interface, and then can perform processing such as optoelectronic conversion on the first electrical signal data sent by the central module 1100.

[0306] In some embodiments of the present application, the master optical module includes a signal processing chip 1101, and the master optical module is configured to:

[0307] Determine the target device identification information according to the first electrical signal data and the mapping relationship data between the electrical signal data and the device identification information determined in advance;

[0308] Perform packet encapsulation processing on the target device identification information and the first electrical signal data to obtain the first downlink physical frame;

[0309] Perform differential signal conversion on the first downlink physical frame to obtain the first downlink electrical signal.

[0310] To clearly illustrate the embodiment of the present application, please refer to again ​ . That is, as ​ shown, after the central module 1100 sends the first electrical signal data to the master optical module, the first electrical signal data is transmitted to the signal processing chip 1101 of the master optical module through the electrical signal interface of the master optical module. After determining the target device identification information corresponding to the first electrical signal data according to the first electrical signal data, the signal processing chip 1101 of the master optical module can perform packet framing on the first electrical signal data and the target device identification information together to obtain the XGS-PON downlink physical frame (Downstream PHY frame) carrying the first electrical signal data and the target device identification information, that is, the first downlink physical frame. Then, the signal processing chip 1101 of the master optical module can also perform differential signal conversion on the first downlink physical frame to obtain the first downlink physical frame in the form of differential electrical signals, that is, the above-mentioned first downlink electrical signal, so as to complete the data download from the central module 1100 to the vehicle terminal device 1220 in the subsequent steps.

[0311] In one example, the signal processing chip 1101 of the master optical module includes a storage unit for storing mapping relation data. Therefore, in the embodiments of the present application, when the signal processing signal of the master optical module receives the first electrical signal data, it can also determine the pre-stored mapping relation data, and through the mapping relation data and the first electrical signal data, determine the above-mentioned target device identification information, and when obtaining the target device identification information, jointly package and frame the first electrical signal data and the target device identification information to obtain the above-mentioned first downlink physical frame.

[0312] In this way, in some embodiments of the present application, the master optical module can determine the target device identification information corresponding to the target device identification information through the signal processing chip 1101, and perform packaging and encapsulation processing on the first electrical signal data and the target device identification information to obtain the first downlink physical frame, and perform differential signal conversion on the first downlink physical frame to obtain the first downlink electrical signal, and complete the data download from the central module 1100 to the vehicle terminal device 1220 through the first downlink electrical signal.

[0313] In some embodiments of the present application, the master optical module includes a driver, and the master optical module is configured to:

[0314] According to the driver, amplify the received first downlink electrical signal to obtain a first amplified electrical signal.

[0315] Specifically, in the embodiments of the present application, after the master optical module converts the first electrical signal data sent by the central module 1100 into the first downlink electrical signal through the signal processing chip 1101, the first downlink electrical signal will be transmitted to the driver of the master optical module. After receiving the first downlink electrical signal, the driver of the master optical module can amplify the first downlink electrical signal to obtain the amplified first downlink electrical signal, that is, the above-mentioned first amplified electrical signal, to meet the subsequent signal processing requirements.

[0316] In this way, in the embodiments of the present application, the driver of the master optical module can amplify the first downlink electrical signal output by the signal processing signal to obtain the first amplified electrical signal to meet the subsequent signal processing requirements.

[0317] In some embodiments of the present application, the master optical module includes a laser, and the master optical module is configured to:

[0318] According to the laser, perform optoelectronic conversion processing on the received first amplified electrical signal to obtain a downlink optical signal.

[0319] Specifically, in the embodiment of the present application, when the master optical module amplifies the first downlink electrical signal based on the driver to obtain a first amplified electrical signal that can match the requirements of the input electrical signal interface of the laser, the first amplified electrical signal can be transmitted to the laser of the master optical module. Then, the master optical module can perform optoelectronic conversion processing on the first amplified electrical signal through the laser to convert the first amplified electrical signal into optical signal data, that is, the above-mentioned downlink optical signal.

[0320] In this way, in the embodiment of the present application, the master optical module can perform optoelectronic conversion processing on the first amplified electrical signal output by the driver through the laser to convert the first amplified electrical signal into a downlink optical signal, thereby completing the conversion from electrical signal to optical signal.

[0321] In some embodiments of the present application, the master optical module includes a demultiplexer and an optical signal interface, and the master optical module is configured to:

[0322] Send the downlink optical signal to the optical splitter according to the demultiplexer and the optical signal interface.

[0323] Specifically, in the embodiment of the present application, when the master optical module completes the optoelectronic conversion of the first amplified electrical signal to obtain a downlink optical signal, it can send the downlink optical signal to the optical splitter through the internal demultiplexer and optical signal interface for optical signal transmission.

[0324] In this way, in the embodiment of the present application, the master optical module can send the downlink optical signal to the optical splitter through the internal demultiplexer and optical signal interface to complete the optical signal transmission.

[0325] In some embodiments of the present application, the optical splitter is configured to forward the downlink optical signal to the master optical module.

[0326] Specifically, in the embodiment of the present application, when the optical splitter in the optical communication component receives the optical signal sent by the master optical module, that is, the downlink optical signal, the optical splitter can broadcast the downlink optical signal to each slave optical module so that each slave optical module can process or ignore the received downlink optical signal according to needs.

[0327] In this way, in the embodiment of the present application, the downlink optical signal can be forwarded to the slave optical module through the optical splitter, making the transmission of the downlink optical signal proceed steadily.

[0328] In some embodiments of the present application, the slave optical module includes an optical signal interface, and the slave optical module is configured to:

[0329] Receive the downlink optical signal according to the optical signal interface.

[0330] Specifically, in the embodiments of the present application, the slave optical module can receive the downstream optical signal forwarded by the optical splitter based on the internal optical signal interface. It can be understood that when the slave optical module receives the downstream optical signal, it indicates the end of the transmission process of the downstream optical signal. Therefore, in the subsequent process, the slave optical module can process the downstream optical signal according to the pre-set policy to gradually restore it to the first electrical signal data, or ignore the downstream optical signal.

[0331] Thus, in the embodiments of the present application, the slave optical module can receive the downstream optical signal forwarded by the optical splitter through its own optical signal interface.

[0332] In some embodiments of the present application, the slave optical module includes a demultiplexer and a photodetector, and the slave optical module is configured to:

[0333] Forward the downstream optical signal to the photodetector according to the demultiplexer.

[0334] Specifically, in the embodiments of the present application, when the optical signal interface of the slave optical module receives the input of the downstream optical signal, the downstream optical signal is transmitted through the optical signal interface to the demultiplexer inside the slave optical module, and then through the demultiplexer, it is transmitted to the photodetector inside the slave optical module.

[0335] Thus, in the embodiments of the present application, the photodetector inside the slave optical module can receive the downstream optical signal forwarded by the demultiplexer, and then can perform corresponding processing on the downstream optical signal.

[0336] In some embodiments of the present application, the slave optical module is configured to:

[0337] Perform photoelectric conversion processing on the downstream optical signal according to the photodetector to obtain a second downstream electrical signal. Specifically, in the embodiments of the present application, after the photodetector inside the slave optical module receives the downstream optical signal, it can perform photoelectric conversion processing on the downstream optical signal to convert the downstream optical signal into an electrical signal, that is, the above-mentioned second downstream electrical signal.

[0338] In one example, the second downstream electrical signal is the same as the above-mentioned first downstream electrical signal.

[0339] Thus, in the embodiments of the present application, the slave optical module can perform photoelectric conversion processing on the downstream optical signal forwarded by the demultiplexer through the internal photodetector to obtain a second downstream electrical signal, thereby completing the conversion of the optical signal to the electrical signal.

[0340] In some embodiments of the present application, the slave optical module includes an amplifier, and the slave optical module is configured to:

[0341] According to the amplifier, the transimpedance and limiting of the second downlink electrical signal are amplified to obtain a second downlink physical frame in the form of a differential signal.

[0342] Specifically, in the embodiment of the present application, after the photodetector converts the downlink optical signal into the second downlink electrical signal, the second downlink electrical signal can be input to the amplifier. When the amplifier receives the second downlink electrical signal, it can perform transimpedance and limiting amplification on the second downlink electrical signal to obtain the above-mentioned second amplified electrical signal.

[0343] In an example as ​ shown, the amplifiers of the slave optical module and the master optical module both include a transimpedance amplifier and a limiting amplifier. Furthermore, during the data downlink process, the second downlink electrical signal can first be subjected to transimpedance amplification by the transimpedance amplifier of the slave optical module, and then subjected to limiting amplification by the limiting amplifier of the slave optical module, thereby obtaining the second downlink physical frame in the form of a differential signal as described above.

[0344] It can be understood that after the signal processing chip 1101 of the master optical module outputs the first downlink physical frame in the form of a differential electrical signal, that is, after outputting the above-mentioned first downlink electrical signal, the first downlink electrical signal is converted into an optical signal. Therefore, in the embodiment of the present application, when the downlink optical signal is restored to an electrical signal, the restored electrical signal can exist in the form of a differential signal, that is, the second downlink physical frame in the form of a differential signal.

[0345] In this way, in the embodiment of the present application, the slave optical module can perform transimpedance and limiting amplification on the second downlink electrical signal output by the photodetector through the internal amplifier, thereby obtaining the second downlink physical frame in the form of a differential signal.

[0346] In some embodiments of the present application, the slave optical module includes a signal processing chip 1101, and the slave optical module is configured to:

[0347] According to the signal processing chip 1101, when the target device identification information matches the pre-stored device identification information, perform unpacking processing on the second downlink physical frame in the form of a differential signal to obtain the first electrical signal data;

[0348] Send the first electrical signal data to the target vehicle terminal device 1220.

[0349] Specifically, in the embodiment of the present application, after the slave optical module performs amplification processing on the second downlink electrical signal through the internal amplifier to obtain the second downlink physical frame in the form of a differential signal (such as the XGS-PON downlink physical frame), the second downlink physical frame in the form of a differential signal can be transmitted to the signal processing chip 1101 of the slave optical module.

[0350] Next, the signal processing chip 1101 reads the frame header in the second downlink physical frame in the form of a differential signal to obtain the target device identification information therein.

[0351] Then, the signal processing chip 1101 compares the read target device identification information with each device identification information pre-stored in itself to determine whether the target device identification information matches any of the device identification information pre-stored in itself.

[0352] If it does not match any of the device identification information, the signal processing chip 1101 can discard the second downlink physical frame in the form of a differential signal. Conversely, if it matches at least one device identification information, the signal processing chip 1101 can unpack the second downlink physical frame in the form of a differential signal to obtain the payload therein (i.e., the PCIe data frame), and use the payload data as the first electrical signal data generated by the central module 1100. Finally, the signal processing chip 1101 of the slave optical module can send the first electrical signal data to the vehicle terminal device 1220 through the electrical signal interface.

[0353] In one example, in the signal processing chip 1101 of the slave optical module, the "device identification information of the vehicle terminal device 1220 connected to the slave optical module" is stored.

[0354] In this way, in the embodiment of the present application, the slave optical module can, through the internal signal processing chip 1101, unpack the second downlink physical frame in the form of a differential signal to obtain the first electrical signal data when the target device identification information matches the pre-stored device identification information, and send the first electrical signal data to the target vehicle terminal device 1220, thereby completing the data downlink between the central module 1100 and the vehicle terminal device 1220.

[0355] In some embodiments of the present application, the slave optical module includes an electrical signal interface, and the slave optical module is configured to:

[0356] Receive the second electrical signal data sent by the vehicle terminal device 1220 according to the electrical signal interface.

[0357] Specifically, in the data uplink process (i.e., the process in which the vehicle terminal device 1220 reports information to the central module 1100), the vehicle terminal device 1220 can generate the second electrical signal data and send the second electrical signal data to the slave optical module. Correspondingly, the slave optical module can receive the second electrical signal data based on its internal electrical signal interface for corresponding processing such as photoelectric conversion processing.

[0358] Thus, in the embodiments of the present application, the slave optical module can receive the second electrical signal data sent by the vehicle terminal device 1220 based on the internal electrical signal interface for subsequent processing.

[0359] In some embodiments of the present application, the slave optical module includes a signal processing chip 1101, and the slave optical module is configured to:

[0360] According to the signal processing chip 1101, perform packet encapsulation processing on the second electrical signal data to obtain a first upstream physical burst frame;

[0361] Perform differential signal conversion on the first upstream physical burst frame to obtain a first upstream electrical signal.

[0362] Specifically, in the embodiments of the present application, after the slave optical module receives the second electrical signal data sent by the vehicle terminal device 1220 through the optical signal interface, the second electrical signal data is transmitted through the optical signal interface to the signal processing chip 1101 of the slave optical module for processing by the signal processing chip 1101 of the slave optical module.

[0363] Correspondingly, perform packet framing on the second electrical signal data to obtain an XGS-PON upstream physical burst frame (Upstream FS burst frame) carrying the second electrical signal data packet, that is, the first upstream physical frame.

[0364] In addition, the signal processing chip 1101 of the slave optical module can also perform differential signal conversion on the first upstream physical frame to obtain a first upstream physical frame in the form of a differential electrical signal, that is, the above-mentioned first upstream electrical signal, and then perform subsequent processing through the first upstream electrical signal.

[0365] Thus, in the embodiments of the present application, the slave optical module can perform packet encapsulation processing on the second electrical signal data received through the electrical signal interface through the internal signal processing chip 1101 to obtain a first upstream physical burst frame, and perform differential signal conversion on the first upstream physical burst frame to obtain a first upstream electrical signal.

[0366] In some embodiments of the present application, the slave optical module includes a driver, and the slave optical module is configured to:

[0367] According to the driver, perform amplification processing on the first upstream electrical signal to obtain a second amplified electrical signal.

[0368] Specifically, in the embodiment of the present application, after the slave optical module converts the second electrical signal data into the above-mentioned first upstream electrical signal based on the internal signal processing chip 1101, the first upstream electrical signal can be transmitted to the driver inside the slave optical module. Then, the driver inside the slave optical module can amplify the first upstream electrical signal to make the first upstream electrical signal meet the subsequent signal processing requirements, and obtain the second amplified electrical signal.

[0369] Thus, in the embodiment of the present application, the slave optical module can amplify the first upstream electrical signal output by the signal processing chip 1101 through the internal driver, thereby obtaining the second amplified electrical signal.

[0370] In some embodiments of the present application, the slave optical module includes a laser, and the slave optical module is configured as:

[0371] Perform optoelectronic conversion processing on the second amplified electrical signal according to the laser to obtain an upstream optical signal.

[0372] Specifically, after the driver inside the slave optical module amplifies the first upstream electrical signal to obtain the second amplified electrical signal that can match the input electrical signal interface requirements of the laser, the second amplified electrical signal will be transmitted to the laser of the slave optical module. Correspondingly, the laser can perform optoelectronic conversion processing on the second amplified electrical signal to convert the second amplified electrical signal into an optical signal, that is, the above-mentioned upstream optical signal.

[0373] Thus, in the embodiment of the present application, the laser inside the slave optical module can perform optoelectronic conversion processing on the second amplified electrical signal output by the driver, thereby obtaining an upstream optical signal.

[0374] In some embodiments of the present application, the slave optical module includes a demultiplexer and an optical signal interface, and the slave optical module is configured as:

[0375] Send the upstream optical signal to the optical splitter according to the demultiplexer and the optical signal interface.

[0376] Specifically, in the embodiment of the present application, when the slave optical module converts the second amplified electrical signal into the above-mentioned upstream optical signal based on the internal laser, the slave optical module can send the upstream optical signal to the optical splitter based on its own demultiplexer and optical signal interface for the transmission of the upstream optical signal.

[0377] Thus, in the embodiment of the present application, the slave optical module can send the upstream optical signal output by the laser to the optical splitter based on its own demultiplexer and optical signal interface for the signal transmission of the upstream optical signal.

[0378] In some embodiments of the present application, the optical splitter is configured to forward the upstream optical signal to the master optical module.

[0379] Specifically, in the embodiments of the present application, in the optical communication component, the optical splitter can forward the upstream optical signal to the master optical module to complete the transmission of the upstream optical signal when receiving the upstream optical signal sent by the slave optical module.

[0380] Signal transmission of No.

[0381] In some embodiments of the present application, the master optical module includes an optical signal interface, and the master optical module is configured to:

[0382] Receive the upstream optical signal according to the optical signal interface.

[0383] Specifically, in the embodiments of the present application, the master optical module can receive the upstream optical signal forwarded by the optical splitter based on its own optical signal interface, and then can perform corresponding processing on the upstream optical signal, such as photoelectric conversion or signal amplification.

[0384] It can be understood that when the master optical module receives the upstream optical signal based on the optical signal interface, it indicates that the signal transmission process of the upstream optical signal ends. Therefore, in the subsequent process, the upstream optical signal will be gradually restored to the second electrical signal data by the processing of the master optical module.

[0385] Thus, in the embodiments of the present application, the master optical module can receive the upstream optical signal forwarded by the optical splitter through its own optical signal interface to perform subsequent processing on the upstream optical signal.

[0386] In some embodiments of the present application, the master optical module includes a demultiplexer and a photodetector, and the master optical module is configured to:

[0387] Forward the upstream optical signal to the photodetector according to the demultiplexer.

[0388] Specifically, in the embodiments of the present application, after the optical signal interface of the master optical module receives the input of the upstream optical signal, the upstream optical signal is transmitted through the optical signal interface to the demultiplexer inside the master optical module, and then is demultiplexed by the demultiplexer and transmitted to the photodetector inside the master optical module.

[0389] Thus, in the embodiments of the present application, the photodetector inside the master optical module can receive the upstream optical signal based on the demultiplexer, so as to perform corresponding processing on the upstream optical signal.

[0390] In some embodiments of the present application, the master optical module is configured to:

[0391] Perform photoelectric conversion processing on the upstream optical signal according to the photodetector to obtain a second upstream electrical signal.

[0392] Specifically, in the embodiments of the present application, after the photodetector inside the master optical module receives the upstream optical signal, it can perform photoelectric conversion processing on the upstream optical signal to convert the upstream optical signal into an electrical signal, that is, the second upstream electrical signal mentioned above.

[0393] In one example, the second upstream electrical signal is the same as the first upstream electrical signal mentioned above.

[0394] In this way, in the embodiments of the present application, the master optical module can perform photoelectric conversion processing on the upstream optical signal forwarded by the demultiplexer through the internal photodetector to obtain the second upstream electrical signal, thereby completing the conversion from optical signal to electrical signal.

[0395] In some embodiments of the present application, the master optical module includes an amplifier, and the master optical module is configured to:

[0396] According to the amplifier, amplify the transimpedance and limiting of the second upstream electrical signal to obtain the second upstream physical frame in differential signal form.

[0397] The processing unit in the embodiments of the present application is configured to amplify the transimpedance and limiting of the second upstream electrical signal according to the amplifier of the master optical module to obtain the second upstream physical frame in differential signal form.

[0398] Specifically, in the embodiments of the present application, after the photodetector converts the upstream optical signal into the second upstream electrical signal, the second upstream electrical signal will be input to the amplifier. When the amplifier receives the second upstream electrical signal, it can amplify the transimpedance and limiting of the second upstream electrical signal to obtain the second upstream physical frame in differential signal form.

[0399] In an example as ​ shown, both the amplifier of the master optical module and the amplifier of the master optical module include a transimpedance amplifier and a limiting amplifier. Further, during the data upstream process, the second upstream electrical signal can first be transimpedance amplified by the transimpedance amplifier of the master optical module, and then be limiting amplified by the limiting amplifier of the master optical module.

[0400] In this way, in the embodiments of the present application, the master optical module can amplify the transimpedance and limiting of the second upstream electrical signal output by the photodetector through the internal amplifier, thereby obtaining the second upstream physical frame in differential signal form.

[0401] In some embodiments of the present application, the master optical module includes a signal processing chip 1101, and the master optical module is configured to:

[0402] According to the signal processing chip 1101, perform unpacking processing on the second upstream physical burst frame in differential signal form to obtain the second electrical signal data;

[0403] Send the second electrical signal data to the central module 1100.

[0404] Specifically, in the embodiment of the present application, after the master optical module amplifies the second upstream electrical signal through an internal amplifier to obtain a second upstream physical frame in differential signal form, the second upstream physical frame in differential signal form can be transmitted to the signal processing chip 1101 of the master optical module.

[0405] Next, the signal processing chip 1101 unpacks the second upstream physical frame in differential signal form to unpack the payload data therein, that is, to obtain the second electrical signal data of the vehicle terminal device 1220. Furthermore, the signal processing chip 1101 of the master optical module can send the second electrical signal data to the central module 1100 through an electrical signal interface.

[0406] In this way, in the embodiment of the present application, the master optical module can unpack the second upstream physical frame in differential signal form output by the amplifier through the internal signal processing chip 1101 to obtain the second electrical signal data of the central module 1100, and can send the second electrical signal data to the central module 1100, thereby completing the data uplink between the vehicle terminal device 1220 and the central module 1100.

[0407] It can be understood that in the embodiment of the present application, the functions, models, etc. of the electrical signal interfaces, signal processing chips 1101, drivers, lasers, demultiplexers, photodetectors, amplifiers, and optical signal interfaces in the master optical module and the slave optical module can be set according to actual situations. Therefore, to clearly illustrate the electrical signal interfaces, signal processing chips 1101, drivers, lasers, demultiplexers, photodetectors, amplifiers, and optical signal interfaces in the embodiment of the present application, next, ​ For example, the above-mentioned electrical signal interfaces, signal processing chips 1101, drivers, lasers, demultiplexers, photodetectors, amplifiers, and optical signal interfaces are used as examples to illustrate these components.

[0408] In one example, the signal processing chip 1101220 is a Media Access Control (MAC) chip.

[0409] In one example, the driver 230 in the master optical module 1201 is a VCSEL (Vertical Cavity Surface Emitting Laser) Driver.

[0410] In one example, the laser 240 in the master optical module 1201 is a single-mode laser such as a Distributed Feedback Laser (DFB), and only supports single-mode optical signals.

[0411] In another example, the laser 240 is a VCSEL laser. It can be understood that single-mode lasers such as DFBs deteriorate severely at high temperatures, have a high failure risk, and the cost of single-mode lasers and the single-mode optical fibers used in networking with them is relatively high. Therefore, when a VCSEL laser is used as the light source, it can support multimode optical signal transmission, has better high-temperature performance, and lower networking costs.

[0412] In an example such as ​ shown, the amplifier 270 includes a transimpedance amplifier 271 and a limiting amplifier 272.

[0413] More specifically, in one example, the master optical module 1201 includes a Burst Mode Trans-impedance Amplifier (BM-TIA), and the slave optical module 1203 includes a Trans-impedance Amplifier (TIA).

[0414] Similarly, in an example such as ​ shown, the master optical module includes a Burst Mode Limited Amplifier (BM-LA), and the slave optical module includes a Limited Amplifier (LA).

[0415] In one example, the optical signal interface 290 supports optical signal communication for single-fiber bidirectional transmission.

[0416] In one example, the wavelength division multiplexer 250 is used to separate the upstream / downstream wavelengths to support single-fiber bidirectional transmission of optical signals.

[0417] In one example, the clock recovery chip 280 in the master optical module is a Burst Mode Clock and Data Recovery (BM-CDR) chip, and the clock recovery chip 280 in the slave optical module 1203 is a Clock and Data Recovery (CDR) chip.

[0418] In one example, the photodetector 260 (Photodetector, PD) includes a P-type semiconductor - intrinsic semiconductor - N-type semiconductor photodiode (Positive-Intrinsic-Negative Photodiode, PIN-photodetector). In another example, the photodetector 260 includes an avalanche photodiode (Avalanche Photodiode, APD-photodetector).

[0419] It can also be understood that, in the embodiments of the present application, the signal processing chips 1101220 of the master optical module and the signal processing chips 1101220 of the slave optical module can both be used for receiving, packing, unpacking, and sending electrical signals. Among them, the signal processing chip 1101220 of the master end can also be used for data communication control of the master optical module, including but not limited to adapting to network latency and bandwidth allocation, etc. The communication between the master optical module and external devices also passes through the signal processing chip 1101220. As ​ shown, the signal processing chip 1101220 is connected to the electrical signal interface 210 and can be further connected to external devices such as the central module.

[0420] In addition, in the embodiments of the present application, the output end of the signal processing chip 1101220 is connected to the driver 230, and the output end of the driver 230 is connected to the laser 240. The signal processing chip 1101220 packs and converts the data and then sends the electrical signal carrying the first payload data in the form of a differential electrical signal. The driver 230 receives the electrical signal and amplifies it to match the requirements of the input electrical signal interface 210 of the laser 240. The laser 240 converts the drive electrical signal into an optical signal. The optical signal is coupled to the outside through the optical demultiplexer 250 and the optical signal interface 290.

[0421] Furthermore, in the embodiments of the present application, the optical signal interface 290 is connected to the optical demultiplexer 250, the optical demultiplexer 250 is connected to the photodetector 260, the photodetector 260 is connected to the amplifier 270, and the amplifier 270 is connected to the signal processing chip 1101220 via the clock recovery chip 280. After the optical signal interface 290 receives the optical signal, it is transmitted to the photodetector 260 through the optical demultiplexer 250. The photodetector converts the optical signal into a differential electrical signal form and transmits it to the amplifier 270. The transimpedance amplifier 271 performs transimpedance amplification on the differential electrical signal, and the limiting amplifier 272 performs limiting amplification on the differential electrical signal. The differential electrical signal is transmitted to the signal processing chip 1101220 via the clock recovery chip 280. The signal processing chip 1101220 unpacks the data, and the decoded electrical signal is transmitted from the electrical signal interface 210 to the outside.

[0422] It can also be understood that both the master optical module and the slave optical module support the reception and transmission of upstream burst data. Specifically, the input end of the photodetector 260 is connected to the demultiplexer 250, and the output end is connected to the transimpedance amplifier 271, which is subsequently connected in sequence to the limiting amplifier 272, the clock recovery chip 280, and the signal processing chip 1101220. The upstream burst optical signal is coupled into the optical signal interface 290 through the multimode optical fiber, and then input into the photodetector 260 through the demultiplexer 250. The photodetector 260 performs photoelectric signal conversion, converting the burst optical signal into a burst electrical signal. The transimpedance amplifier 271 is used to transimpedance amplify the burst electrical signal converted by the photodetector 260, the limiting amplifier 272 is used for limiting amplification of the burst electrical signal, the clock recovery chip 280 is used for data clock recovery of the burst electrical signal, and the upstream signal is introduced into the signal processing chip 1101220.

[0423] During the reception and transmission of the downstream signal data frame, the input end of the photodetector 260 is connected to the demultiplexer 250, and the output end is connected to the transimpedance amplifier 271, which is subsequently connected in sequence to the limiting amplifier 272, the clock recovery chip 280, and the signal processing chip 1101220. The downstream optical signal is coupled into the optical signal interface 290 through the multimode optical fiber, and then input into the photodetector 260 through the demultiplexer 250. The photodetector 260 performs photoelectric signal conversion, converting the optical signal into an electrical signal. The transimpedance amplifier 271 is used to transimpedance amplify the electrical signal converted by the photodetector 260, the limiting amplifier 272 is used for limiting amplification of the electrical signal, the clock recovery chip 280 is used for data clock recovery of the electrical signal, and the downstream signal is introduced into the signal processing chip 1101220. The signal processing chip 1101220 processes the downstream signal and forwards it to the vehicle terminal device connected thereto.

[0424] Optionally, in some embodiments of the present application, the signal processing chip 1101 of the master optical module includes a storage unit for storing mapping relationship data. That is, the mapping relationship data can be stored in the memory of the signal processing chip 1101 of the master optical module, such as Nor Flash.

[0425] Furthermore, when the PCIe data frame arrives at the signal processing chip 1101 of the master optical module, the signal processing chip 1101 will perform corresponding operations according to the currently stored mapping table type. Specifically, if only a first-level mapping table is stored in the memory, the MAC chip directly looks up the corresponding ONU-UD in the mapping table after parsing the address bits of the PCIe data frame, and assigns it to the XGEM port-ID field of the XGEM frame header.

[0426] If the memory stores a first-level and a second-level mapping table, the signal processing chip 1101 first parses the PCIe data frame address, looks up the corresponding second-level mapping table address according to the classification mode of the second-level mapping table in the first-level mapping table, and then queries the corresponding ONU-ID in the second-level mapping table and assigns it to the XGEM port-ID field of the XGEM frame header.

[0427] In some embodiments of the present application, the central module includes multiple root bridge devices. Further, in the case of including multiple root bridge devices, the connection relationship between any root bridge device and other devices can be referred to ​ . That is, as ​ shown, the central module can be directly connected to multiple PCIe devices (i.e., the endpoint devices in ​ ) through the root bridge device, or the central module can be connected to a switch through the root bridge device and then connected to multiple PCIe devices through the switch, or the central module can be connected to a multi-layer switch through the root bridge device and then connected to multiple PCIe devices through this multi-layer switch.

[0428] In the description of this specification, the descriptions referring to terms such as "specifically", "further", "specially", "understandably", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0429] Any process or method description shown in the flowchart or described in other ways herein can be understood as representing a module, segment or part of code including one or more executable instructions for implementing a specific logical function or process, and the scope of the preferred embodiments of the present application includes additional implementations, where the functions can be executed in a substantially simultaneous manner or in the reverse order according to the involved functions, rather than in the order shown or discussed, which should be understood by those skilled in the art of the embodiments of the present application.

[0430] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present application.

Claims

1. A vehicle system based on optical communication, characterized in that, The system includes a central module and edge modules. The edge modules include an optoelectronic communication module and vehicle terminal devices electrically connected to the optoelectronic communication module. The central module is electrically connected to the optoelectronic communication module; The optoelectronic communication module is configured to perform optoelectronic conversion processing and signal transmission on the received electrical signals to realize communication between the central module and the vehicle terminal devices.

2. The system according to claim 1, wherein There are multiple edge modules, and the bandwidth demand of the vehicle terminal devices in each edge module is less than or equal to the upper limit of the bandwidth supported by the optoelectronic communication module.

3. The system according to claim 2, wherein The edge modules are multiple ones divided according to positions.

4. The system according to claim 3, wherein, The system includes a front center domain edge module, a left front domain edge module, a right front domain edge module, a left rear domain edge module, and a right rear domain edge module.

5. The system according to claim 2, wherein The edge modules are multiple ones divided according to functions.

6. The system according to claim 5, wherein The edge modules include an autonomous driving domain edge module, an intelligent networking and vehicle body domain edge module, a power domain edge module, a chassis domain edge module, and an intelligent cockpit domain edge module.

7. The system according to claim 1, wherein The central module includes a processing chip and a root bridge device electrically connected to the processing chip. The processing chip can send electrical signals to the optoelectronic communication module through the root bridge device and can receive electrical signals sent by the optoelectronic communication module through the root bridge device.

8. The system according to claim 7, wherein The central module further includes an internal memory communicatively connected to the root bridge device through the Peripheral Component Interconnect Express (PCIe) protocol.

9. The system according to claim 7, wherein The central module further includes a first switch communicatively connected to the root bridge device through the Peripheral Component Interconnect Express (PCIe) protocol.

10. The system according to claim 7, wherein The central module further includes an endpoint device communicatively connected to the root bridge device through the Peripheral Component Interconnect Express (PCIe) protocol.

11. The system according to claim 7, wherein The system further includes a second switch, and the central module is connected to the optoelectronic communication module through the second switch.

12. The system according to claim 1, wherein The optoelectronic communication module includes at least one main end optical module, at least one optical splitter, and multiple slave end optical modules connected in sequence through optical fibers. The central module is electrically connected to the main end optical module, and the slave end optical modules are electrically connected to the vehicle terminal devices.

13. The system according to claim 12, wherein There are multiple vehicle terminal devices, and the main end optical module is configured to: When receiving the first electrical signal data sent by the central module, determine the target device identification information according to the first electrical signal data and the pre-determined mapping relationship data between the electrical signal data and the device identification information; Determine the first optical signal data according to the first electrical signal data and the target device identification information, where the target device identification information is used to identify the target vehicle terminal device that receives the first electrical signal data among the multiple vehicle terminal devices; Send the first optical signal data to the optical splitter.

14. The system according to claim 13, wherein The optical splitter is configured to forward the first optical signal data to the multiple slave end optical modules.

15. The system according to claim 14, characterized in that, The slave end optical module is configured to: When the target device identification information matches the pre-stored device identification information, determine the first electrical signal data according to the first optical signal data; Send the first electrical signal data to the target vehicle terminal device.

16. The system according to claim 13, wherein, The slave end optical module is configured to: In the case of receiving the second electrical signal data sent by the vehicle terminal device, determine the second optical signal data according to the second electrical signal data; Send the second optical signal data to the optical splitter.

17. The system according to claim 16, wherein Both the first electrical signal data and the second electrical signal data include all types of data frames in the data link layer and all types of data streams in the physical layer.

18. The system according to claim 16, wherein The optical splitter is configured to forward the second optical signal data to the master optical module.

19. The system according to claim 18, characterized in that, The master optical module is configured as follows: Determine the second electrical signal data according to the second optical signal data; Send the second electrical signal data to the central module.

20. The system according to claim 16, wherein The master optical module is configured as follows: Determine the first electrical signal data as the first payload data; Configure the first frame header data according to the first payload data and the target device identification information; Merge the first payload data and the first frame header data to obtain the first optical signal data.

21. The system according to claim 20, wherein The slave optical module is configured as follows: Determine the second electrical signal data as the second payload data; Configure the second frame header data according to the second payload data; Merge the second payload data and the second frame header data to obtain the second optical signal data.

22. The system according to claim 21, wherein Both the first frame header data and the second frame header data include a first parameter, and the first parameter is used to indicate the number of payload data in the optical signal data.

23. The system according to claim 21, wherein Both the first frame header data and the second frame header data include a second parameter, and the second parameter is used to indicate the fragmentation state of the payload data.

24. The system according to claim 21, wherein Both the first frame header data and the second frame header data include a third parameter, and the third parameter is used to indicate the corresponding fragment sequence number of each fragment after the payload data is fragmented.

25. The system according to claim 21, wherein Both the first frame header data and the second frame header data include a fourth parameter, and the fourth parameter is used to indicate the source of the payload data.

26. The system according to claim 21, wherein Both the first frame header data and the second frame header data include a fifth parameter, and the fifth parameter is used to store device identification information.

27. The system according to claim 12, wherein The master optical module includes an electrical signal interface, and the master optical module is configured as follows: Receive the first electrical signal data sent by the central module according to the electrical signal interface.

28. The system according to claim 27, wherein The master optical module includes a signal processing chip, and the master optical module is configured as follows: Determine the target device identification information according to the first electrical signal data and the pre-determined mapping relationship data between the electrical signal data and the device identification information; Perform a packaging and encapsulation process on the target device identification information and the first electrical signal data to obtain a first downlink physical frame; Perform a differential signal conversion on the first downlink physical frame to obtain the first downlink electrical signal.

29. The system according to claim 28, wherein The signal processing chip includes a storage unit for storing the mapping relationship data.

30. The system according to claim 28, wherein The master optical module includes a driver, and the master optical module is configured as follows: Amplify the received first downlink electrical signal according to the driver to obtain a first amplified electrical signal.

31. The system according to claim 30, wherein, The master optical module includes a laser, and the master optical module is configured as follows: Perform an optoelectronic conversion process on the received first amplified electrical signal according to the laser to obtain a downlink optical signal.

32. The system according to claim 31, wherein The master optical module includes a demultiplexer and an optical signal interface, and the master optical module is configured as follows: Send the downstream optical signal to the optical splitter according to the optical demultiplexer and the optical signal interface.

33. The system according to claim 32, wherein The optical splitter is configured to forward the downstream optical signal to the master optical module.

34. The system according to claim 33, wherein The slave optical module includes an optical signal interface, and the slave optical module is configured to: Receive the downstream optical signal according to the optical signal interface.

35. The system according to claim 34, wherein The slave optical module includes an optical demultiplexer and a photodetector, and the slave optical module is configured to: Forward the downstream optical signal to the photodetector according to the optical demultiplexer.

36. The system according to claim 35, wherein The slave optical module is configured to: Perform photoelectric conversion processing on the downstream optical signal according to the photodetector to obtain a second downstream electrical signal.

37. The system according to claim 36, wherein, The slave optical module includes an amplifier, and the slave optical module is configured to: Amplify the transimpedance and limiting of the second downstream electrical signal according to the amplifier to obtain a second downstream physical frame in differential signal form.

38. The system according to claim 37, wherein The slave optical module includes a signal processing chip, and the slave optical module is configured to: Unpack the second downstream physical frame in differential signal form according to the signal processing chip to obtain the first electrical signal data when the target device identification information matches the pre-stored device identification information; Send the first electrical signal data to the target vehicle terminal device.

39. The system according to claim 12, wherein, The slave optical module includes an electrical signal interface, and the slave optical module is configured to: Receive the second electrical signal data sent by the vehicle terminal device according to the electrical signal interface.

40. The system according to claim 39, characterized in that, The slave optical module includes a signal processing chip, and the slave optical module is configured to: Perform packing and encapsulation processing on the second electrical signal data according to the signal processing chip to obtain a first upstream physical burst frame; Perform differential signal conversion on the first upstream physical burst frame to obtain a first upstream electrical signal.

41. The system according to claim 40, wherein The slave optical module includes a driver, and the slave optical module is configured to: Amplify the first upstream electrical signal according to the driver to obtain a second amplified electrical signal.

42. The system according to claim 41, wherein, The slave optical module includes a laser, and the slave optical module is configured to: Perform photoelectric conversion processing on the second amplified electrical signal according to the laser to obtain an upstream optical signal.

43. The system according to claim 42, wherein, The slave optical module includes an optical demultiplexer and an optical signal interface, and the slave optical module is configured to: Send the upstream optical signal to the optical splitter according to the optical demultiplexer and the optical signal interface.

44. The system according to claim 43, wherein The optical splitter is configured to forward the upstream optical signal to the master optical module.

45. The system according to claim 44, characterized in that, The master optical module includes an optical signal interface, and the master optical module is configured to: [[ID= 46. The system according to claim 45, wherein, ​ ​ 47. The system according to claim 46, wherein ​ ​ 48. The system according to claim 47, wherein ​ ​ 49. The system according to claim 48, wherein The master optical module includes a signal processing chip, and the master optical module is configured to: According to the signal processing chip, unpack the second uplink physical burst frame in the form of differential signals to obtain the second electrical signal data; Send the second electrical signal data to the central module.

50. A vehicle, characterized in that, The vehicle includes the system according to any one of claims 1-49.

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