An anti-diffusion agent for PCB glass substrates, its preparation method and application

Abstract

This invention discloses an anti-diffusion agent for PCB glass substrates, its preparation method, and its application, relating to the field of printed circuit board manufacturing technology. The anti-diffusion agent comprises the following components in mass concentrations: 0.5-2.5% surface enhancer, 0.5-2.5% bonding agent, 1.0-3.0% wetting agent, 0.5-2.5% stabilizer, 0.2-1.5% co-solvent, and the balance being water. The surface enhancer is a sulfonate compound containing fluorine and silicon functional groups, the bonding agent is a nitrazole compound containing sulfur functional groups, the wetting agent is a benzyl alcohol compound containing hydroxyl functional groups, the stabilizer is a piperidine derivative, and the co-solvent is an ether solvent. This invention provides an anti-diffusion agent for PCB glass substrates that can reduce the surface tension of the glass substrate, strengthen the interfacial adhesion between the substrate and the ink, fundamentally inhibit the diffusion of ink on the substrate surface, and significantly improve the product yield of the solder resist process.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing technology, and in particular to an anti-diffusion agent for PCB glass substrates, its preparation method, and its application. Background Technology

[0002] With the rapid advancement of electronic information technology, printed circuit boards (PCBs) are evolving towards higher density, higher precision, and miniaturization. In the field of high-end PCB manufacturing, glass substrates, due to their excellent dimensional stability, insulation properties, and low dielectric constant, are gradually becoming the core material for high-frequency and high-speed PCBs, packaging substrates, and other products. Inkjet printing technology, with its advantages of not requiring masks and being able to perform customized processing of complex patterns, is widely used in the circuit patterning and surface marking of PCB glass substrates.

[0003] However, ink diffusion during inkjet printing on PCB glass substrates severely impacts product quality and production efficiency. The precision of PCB circuit patterns directly affects the accuracy and stability of signal transmission. Excessive line width errors and reduced line spacing due to ink diffusion can easily lead to short circuits, signal crosstalk, and other malfunctions, reducing PCB yield. Simultaneously, PCB manufacturing demands extremely high clarity and durability of surface markings; diffused ink can obscure these markings, affecting product identification and traceability. Traditional anti-diffusion methods, such as adjusting printing parameters and optimizing ink formulations, are insufficient to meet the high precision and reliability requirements of current PCB glass substrate inkjet printing. Furthermore, PCB production often pursues large-scale, continuous manufacturing, and the shortcomings of existing anti-diffusion technologies in terms of stability and cost control hinder further industry development. Therefore, developing an anti-diffusion agent specifically designed for PCB glass substrate inkjet printing is of great significance for improving PCB manufacturing technology and promoting the development of the electronics and information industry.

[0004] Currently, developing anti-diffusion agents suitable for inkjet printing on PCB glass substrates faces multiple technical challenges:

[0005] 1. Process chain compatibility challenge: The anti-diffusion agent needs to be seamlessly adapted to the complex multi-process flow of PCB (pretreatment, printing, curing, etching, etc.) to ensure that it is effective at each stage and does not interfere with the process;

[0006] 2. The Performance Balancing Dilemma: While suppressing diffusion, the electrical performance of the PCB must be strictly guaranteed. Anti-diffusion agents must not damage the insulation of the glass substrate or increase circuit resistance. In particular, it is crucial to avoid introducing conductive impurities or polar groups that could affect high-frequency signal transmission (dielectric constant, dielectric loss tangent). The protective layer formed must also be dense and defect-free (e.g., pinholes, cracks) to prevent partial discharge under an electric field, which could jeopardize reliability.

[0007] 3. Multi-ink system adaptation challenges: The system must be compatible with a variety of inks (conductive, insulating, solder resist) that exhibit significant differences in PCB inkjet printing. For conductive inks, it must not cause metal particle aggregation and reduce conductivity; for insulating inks, it must not damage the insulation properties after curing; for solder resist inks, it must not weaken their adhesion and chemical resistance.

[0008] 4. The Paradox of Scale and Cost: Meeting the massive demands of the PCB industry requires anti-diffusion agents to be easily mass-produced and cost-controllable. However, high-performance solutions (such as complex organic synthesis, nanomaterials / layer-by-layer self-assembled coatings) often involve cumbersome processes, expensive raw materials, and long lead times. Simplifying processes or reducing costs can easily lead to performance degradation. Achieving a balance between high performance and low-cost mass production is a key bottleneck.

[0009] Several existing patents describe methods related to inkjet printing technology. Chinese patent CN114845474A describes a method for printing patterned solder resist on PCBs, using an anti-diffusion liquid for pretreatment. This method introduces a way to improve the contact angle between the substrate surface and the ink, but the diffusion performance on the copper surface and the ink is poor. Chinese patent CN119855060A discloses a PCB inkjet printing pretreatment agent, its preparation method, and a PCB inkjet printing method. This technology can not only effectively reduce the surface tension of the copper surface and the substrate surface, but also promote uniform ink distribution and improve the product yield of the fine line inkjet printing process.

[0010] It is evident that existing technologies offer some solutions to the diffusion problem in inkjet printing on ordinary PCB boards. However, their anti-diffusion effectiveness is less than satisfactory when dealing with glass substrates. As a core material in high-end PCB manufacturing, ink diffusion during inkjet printing on glass substrates has become a key bottleneck restricting PCB performance improvement and industrial upgrading. Previous anti-diffusion methods are insufficient to meet the stringent requirements of high precision and reliability in high-end PCB manufacturing; existing anti-diffusion technologies, due to their high cost and poor stability, severely restrict large-scale PCB production. Summary of the Invention

[0011] To address the shortcomings of existing technologies, this invention provides an anti-diffusion agent for PCB glass substrates, its preparation method, and its application, primarily used in the pretreatment stage of the solder resist process for PCB inkjet printing on glass substrates.

[0012] Specifically, the following technical solutions are included:

[0013] In a first aspect, an anti-diffusion agent for PCB glass substrates is provided, comprising the following components in mass concentrations: 0.5-2.5% surface reinforcing agent, 0.5-2.5% bonding agent, 1.0-3.0% wetting agent, 0.5-2.5% stabilizer, 0.2-1.5% co-solvent, and the balance being water; wherein the surface reinforcing agent is a sulfonate compound containing fluorine and silicon functional groups, the bonding agent is a nitrazole compound containing sulfur functional groups, the wetting agent is a benzyl alcohol compound containing hydroxyl functional groups, the stabilizer is a piperidine derivative, and the co-solvent is an ether solvent.

[0014] The synergistic mechanism of each component is as follows:

[0015] Surface enhancer: It covalently bonds with the glass surface through functional groups, while the other end forms a cross-linked structure with organic phases such as ink, thus constructing a bridging system of "inorganic substrate-enhancer-organic coating" and greatly improving the interfacial adhesion.

[0016] Bonding agent: Optimizes the interfacial compatibility between the glass surface and the resin matrix, enhances the structural stability of the composite system, effectively improves the flexural strength and impact resistance of the material, and avoids interfacial debonding problems;

[0017] Wetting agent: As an amphiphilic compound, it has both hydrophilic and oleophilic functional groups, which can reduce the surface tension of copper surface and substrate, promote the full contact between the oleophobic component in the anti-diffusion agent and the circuit board surface, and provide ideal interface conditions for ink bonding.

[0018] Stabilizers: By maintaining the chemical balance of each component in the system, they inhibit light, heat, or oxidative decomposition reactions, ensuring that the drug maintains stable bonding performance over a long period of time.

[0019] Cosolvent: Solves the dissolution problem of hydrophobic components in the system, promotes the formation of a homogeneous and stable solution system of each component, and ensures the applicability of the process.

[0020] Furthermore, the anti-diffusion agent for PCB glass substrates is composed of the following components in mass concentrations: surface enhancer 0.5-1.5%, bonding agent 0.5-1.5%, wetting agent 1.0-2.0%, stabilizer 0.5-1.5%, co-solvent 0.2-1.0%, and the balance being water.

[0021] The water mentioned is tap water or DI water.

[0022] Furthermore, the surface enhancer is one or more of trimethylsilyl trifluoromethanesulfonate (CAS No.: 27607-77-8), methyl trifluoromethanesulfonate (CAS No.: 64035-64-9), and triisopropylsilyl trifluoromethanesulfonate (CAS No.: 80522-42-5).

[0023] Furthermore, the bonding agent is one or more of 5-benzylthiotetrazole (CAS No.: 21871-47-6), 5-ethylthiotetrazole (CAS No.: 89797-68-2), and 3-amino-1-methyl-5-methylthio-1,2,4-triazole (CAS No.: 84827-78-1).

[0024] Furthermore, the wetting agent is one or more of 2-hydroxy-3-methoxybenzyl alcohol (CAS No.: 4383-05-5), 2-hydroxy-5-nitrobenzyl alcohol (CAS No.: 39224-61-8), and 4-fluoro-3-hydroxybenzyl alcohol (CAS No.: 934241-78-8).

[0025] Furthermore, the stabilizer is one or more of 3-(1H-1,2,4-triazol-1-yl)piperidine (CAS No.: 774511-83-0), 4-(4-methyl-4H-1,2,4-triazol)piperidine (CAS No.: 297172-18-0), and 4-(1,3-dioxolane-2-yl)piperidine (CAS No.: 202062-80-4).

[0026] Furthermore, the cosolvent is one or more of benzoin isopropyl ether (CAS No.: 6652-28-4), rum ether (CAS No.: 8030-89-5), and methyl cedarwood ether (CAS No.: 19870-74-7).

[0027] In a second aspect, a method for preparing an anti-diffusion agent for PCB glass substrates as described in the first aspect is provided, comprising the following steps: weighing surface enhancer, bonding agent, wetting agent, stabilizer and cosolvent and the remaining water in sequence and adding them to a reaction vessel, and stirring and mixing at room temperature of 25-28°C for 30-35 minutes to obtain an anti-diffusion agent for PCB glass substrates.

[0028] Thirdly, a method for printing solder resist on a PCB glass substrate is provided, comprising the following steps: surface treatment of the glass substrate using the anti-diffusion agent for PCB glass substrates described in the first aspect.

[0029] Furthermore, the surface treatment temperature is 25±1℃, the surface treatment section length is 1.0m, and the linear velocity is 2.0±0.1m / min.

[0030] The beneficial effects of this invention are as follows:

[0031] This invention provides an anti-diffusion agent for PCB glass substrates, its preparation method, and its application. The anti-diffusion agent is composed of a surface enhancer, bonding agent, wetting agent, stabilizer, co-solvent, and a balance of water. It can construct an organic functional layer on the surface of the glass substrate and achieve performance optimization through a dual mechanism: on the one hand, it reduces the surface tension of the glass substrate, and on the other hand, it strengthens the interfacial bonding force between the substrate and the ink, fundamentally inhibiting the diffusion of ink on the substrate surface and significantly improving the product yield of the solder resist process. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a diagram showing the ink contact angle on the surface of a glass substrate after treatment with an anti-diffusion agent using the PCB glass substrate of Embodiment 1 of the present invention.

[0034] Figure 2 This is a diagram showing the ink contact angle on the surface of a glass substrate after treatment with an anti-diffusion agent for a PCB glass substrate according to Embodiment 2 of the present invention.

[0035] Figure 3 This is a diagram showing the ink contact angle on the surface of a glass substrate after treatment with an anti-diffusion agent for a PCB glass substrate according to Embodiment 3 of the present invention.

[0036] Figure 4 This is a diagram showing the ink contact angle on the surface of the PCB glass substrate treated with an anti-diffusion agent according to Comparative Example 1 of the present invention.

[0037] Figure 5 This is a diagram showing the ink contact angle on the surface of the PCB glass substrate treated with an anti-diffusion agent according to Comparative Example 11 of the present invention.

[0038] Figure 6 This is a diagram showing the ink contact angle on the surface of the PCB glass substrate treated with an anti-diffusion agent according to Comparative Example 12 of the present invention.

[0039] Figure 7 This is a diagram showing the ink contact angle on the surface of a glass substrate treated with the anti-diffusion liquid of Comparative Example 13 of the present invention. Detailed Implementation

[0040] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0042] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0043] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0044] To better understand the technical content of the present invention, the technical solution of the present invention will be further introduced and explained below with reference to specific embodiments.

[0045] It should be noted that the white dots on the ink in the attached image are reflections from the ink during the photograph.

[0046] Example 1

[0047] An anti-diffusion agent for PCB glass substrates comprises the following components at the following mass concentrations:

[0048] Surface enhancer 1.0%, specifically: trimethylsilyl trifluoromethanesulfonate;

[0049] The bonding agent is 1.0%, specifically 5-benzylthiotetrazole;

[0050] The wetting agent is 1.5%, specifically 2-hydroxy-3-methoxybenzyl alcohol;

[0051] Stabilizer 1.0%, specifically 3-(1H-1,2,4-triazol-1-yl)piperidine;

[0052] The cosolvent is 0.5%, specifically benzoin isopropyl ether;

[0053] The remainder is DI water.

[0054] The method for preparing the anti-diffusion agent for PCB glass substrates includes the following steps: weighing surface enhancer, bonding agent, wetting agent, stabilizer and cosolvent and the remaining water in sequence and adding them to a reaction vessel, stirring and mixing at room temperature of 25°C for 30 minutes to obtain the anti-diffusion agent for PCB glass substrates.

[0055] Example 2

[0056] An anti-diffusion agent for PCB glass substrates comprises the following components at the following mass concentrations:

[0057] Surface enhancer 1.0%, specifically: methyl trifluoromethanesulfonate (trimethylsilyl) ester;

[0058] The bonding agent is 1.0%, specifically 5-ethylthiotetrazole;

[0059] The wetting agent is 1.5%, specifically 2-hydroxy-5-nitrobenzyl alcohol;

[0060] Stabilizer 1.0%, specifically 4-(4-methyl-4H-1,2,4-triazole)piperidine;

[0061] The co-solvent is 0.5%, specifically rum ether;

[0062] The remainder is DI water.

[0063] Example 3

[0064] An anti-diffusion agent for PCB glass substrates comprises the following components at the following mass concentrations:

[0065] Surface enhancer 1.0%, specifically: triisopropyltrifluoromethanesulfonate;

[0066] The bonding agent is 1.0%, specifically: 3-amino-1-methyl-5-methylthio-1,2,4-triazole;

[0067] The wetting agent is 1.5%, specifically 4-fluoro-3-hydroxybenzyl alcohol;

[0068] Stabilizer 1.0%, specifically 4-(1,3-dioxolane-2-yl)piperidine;

[0069] The cosolvent is 0.5%, specifically methyl cedarwood ether;

[0070] The remainder is DI water.

[0071] Example 4

[0072] An anti-diffusion agent for PCB glass substrates comprises the following components at the following mass concentrations:

[0073] Surface enhancer 0.5%, specifically: trimethylsilyl trifluoromethanesulfonate;

[0074] The bonding agent is 0.5%, specifically 5-benzylthiotetrazole;

[0075] The wetting agent is 1.0%, specifically 2-hydroxy-3-methoxybenzyl alcohol;

[0076] The stabilizer is 0.5%, specifically 3-(1H-1,2,4-triazol-1-yl)piperidine;

[0077] The cosolvent is 0.2%, specifically benzoin isopropyl ether;

[0078] The remainder is D1 water.

[0079] Example 5

[0080] An anti-diffusion agent for PCB glass substrates comprises the following components at the following mass concentrations:

[0081] Surface enhancer 1.5%, specifically: trimethylsilyl trifluoromethanesulfonate;

[0082] The bonding agent is 1.5%, specifically 5-benzylthiotetrazole;

[0083] The wetting agent is 2.0%, specifically 2-hydroxy-3-methoxybenzyl alcohol;

[0084] The stabilizer is 1.5%, specifically 3-(1H-1,2,4-triazol-1-yl)piperidine;

[0085] The cosolvent is 1.0%, specifically benzoin isopropyl ether;

[0086] The remainder is D1 water.

[0087] Comparative Example 1

[0088] The only difference between Comparative Example 1 and Example 1 is that the components do not contain surface enhancers.

[0089] Comparative Example 2

[0090] The only difference between Comparative Example 2 and Example 1 is that the components do not contain a bonding agent.

[0091] Comparative Example 3

[0092] The only difference between Comparative Example 3 and Example 1 is that the components do not contain a wetting agent.

[0093] Comparative Example 4

[0094] The only difference between Comparative Example 4 and Example 1 is that the components do not contain stabilizers.

[0095] Comparative Example 5

[0096] The only difference between Comparative Example 5 and Example 1 is that the components do not contain a cosolvent.

[0097] Comparative Example 6

[0098] The only difference between Comparative Example 6 and Example 1 is that the mass concentration of the surface enhancer in the component is 3.0%.

[0099] Comparative Example 7

[0100] The only difference between Comparative Example 7 and Example 1 is that the mass concentration of the bonding agent in the component is 3.0%.

[0101] Comparative Example 8

[0102] The only difference between Comparative Example 8 and Example 1 is that the mass concentration of the wetting agent in the component is 4.0%.

[0103] Comparative Example 9

[0104] The only difference between Comparative Example 9 and Example 1 is that the mass concentration of the stabilizer in the component is 3.0%.

[0105] Comparative Example 10

[0106] The only difference between Comparative Example 10 and Example 1 is that the mass concentration of the cosolvent in the component is 2.0%.

[0107] Comparative Example 11

[0108] The only difference between Comparative Example 11 and Example 1 is that the surface reinforcing agent component was replaced with an equal mass of trimethosi-methanesulfonate (CAS No.: 10090-05-8).

[0109] Comparative Example 12

[0110] The only difference between Comparative Example 12 and Example 1 is that the surface reinforcing agent component was replaced with an equal mass of 1-fluoro-2,4,6-trimethylpyridine trifluoromethanesulfonate (CAS No.: 107264-00-6).

[0111] Comparative Example 13

[0112] Comparative Example 13 provides an anti-diffusion liquid. The difference between Comparative Example 13 and Example 1 is that it uses prior art (Chinese Patent Application CN202210765329.1). Specifically, by mass fraction, its components include: 4.0% bonding agent (diepoxyphenyl mercaptan compound); 2.0% reinforcing agent (phenol disulfonic acid); 2.5% wetting agent (3-dodecylbenzene-1,2-diol); 1.5% accelerator (2,4-thiazolidinedione); and 2.0% stabilizer (2,4-dihydroxybenzophenone).

[0113] The preparation methods of the anti-diffusion agents for PCB glass substrates in Examples 2-5 and Comparative Examples 1-12 are the same as those in Example 1. Furthermore, the preparation method of the anti-diffusion liquid in Comparative Example 13 is the same as that in Example 1.

[0114] Performance testing

[0115] This invention discloses a method for inkjet printing solder resist on a PCB glass substrate, comprising the following steps: S1 feeding section; S2 degreasing section; S3 water washing section; S4 anti-diffusion section; S5 water washing section; S6 drying section; and S7 inkjet printing section.

[0116] The S1 feeding section is for placing the glass substrate to be inkjet printed. The process parameters of the feeding section are: feeding section length 1.0m, linear speed 5.0±0.2m / min.

[0117] The S2 degreasing section is used to clean the glass substrate that has passed through the S1 feeding section, removing surface impurities. The process parameters for the degreasing section are: sulfuric acid concentration of 1.5% (with the remainder being tap water); temperature of 25±1℃; length of the degreasing section of 4.0m; linear velocity of 1.0±0.2m / min; and pressure of 1.5±0.2kg / cm². 2 This section is an immersion type.

[0118] The S3 water washing section involves rinsing the glass substrate, which has passed through the S2 degreasing section, with tap water. The process parameters for this water washing section are: temperature 25±1℃, length 1.0m, linear velocity 4.0±0.2m / min, and pressure 1.5±0.2kg / cm². 2 This section is a spray system.

[0119] The S4 anti-diffusion section is used for surface treatment of the glass substrate after the S3 water washing section. The chemical solution used is the one prepared in the embodiments or comparative examples of this invention, and the proportion of the solution used is the undiluted solution. The process parameters of the anti-diffusion section are: temperature 25±1℃, length of the anti-diffusion section 1.0m; linear speed 2.0±0.1m / min, and this section is an immersion type.

[0120] The S5 water washing section involves rinsing the glass substrate that has passed through the S4 anti-diffusion section with tap water. The process parameters for the water washing section are: temperature 25±1℃, length 1.0m, linear velocity 4.0±0.2m / min, and pressure 1.5±0.2kg / cm. 2 This section is a spray system.

[0121] The drying section of S6 is used to dry the glass substrate after the water washing section of S5. The drying process parameters are: temperature 70±2℃, drying section length 2.0m, and linear speed 2.0±0.2m / min.

[0122] The inkjet printing section of the S7 performs inkjet printing on the glass substrate after the drying process of the S6 section. The ink model used is H-9100 of Shenzhen Rongda Photo-sensitive Technology Co., Ltd. The process parameters of the solder mask inkjet printing section are as follows: temperature 25 ± 5 °C, single-sided printing time is 1 minute, and double-sided printing is performed.

[0123] Performance tests were carried out on the glass substrates after the solder mask printing method for PCB glass substrates using the anti-diffusion agent or anti-diffusion liquid of the embodiment / comparative example of the present invention. The performance of the anti-diffusion agent of the present invention is mainly evaluated in three aspects:

[0124] The first is the ink contact angle: that is, the contact angle detection between the glass substrate and the solder mask ink. A contact angle measuring instrument of model JYC-1 is used to measure the contact angle between the surface of the glass substrate after the solder mask printing method for PCB glass substrates and the solder mask ink. The method is to drop the ink on the surface of the glass substrate using a syringe, and the specific value is measured by the instrument. The required contact angle is between 80-90°.

[0125] The second is the 3m tape adhesion grade: that is, the ink adhesion detection. The 3m tape test method is adopted. Specifically, a tape of model 3m600# is flatly adhered to the ink area of the glass substrate after the inkjet printing section process, and then the tape is quickly peeled off at a uniform speed, and the ink peeling situation in the test area is observed.

[0126] Grid method rating standard:

[0127] Grade 0: No ink peeling, no residue on the back of the tape;

[0128] Grade 1: Minor peeling at the edge of the small grid, peeling area ≤ 5%;

[0129] Grade 2: Peeling area 5%-15%;

[0130] Grade 3: Peeling area 15%-35%;

[0131] Grade 4: Peeling area 35%-65%;

[0132] Grade 5: Peeling area > 65%, extremely poor adhesion.

[0133] It is required that the test result is grade 0 or grade 1 to be qualified, otherwise the test result is unqualified.

[0134] The third is whether there are bubbles after soaking in strong alkali: that is, the chemical corrosion resistance detection. The glass substrate after the inkjet printing section process is placed in a 10% NaOH solution with a mass concentration and soaked for 30 minutes. It is required that there are no bubbles on the surface of the glass substrate after soaking.

[0135] The PCB glass substrates of Examples 1-5 were subjected to performance tests using an anti-diffusion agent. The test results are shown in Table 1 below.

[0136] Table 1. Performance test results of anti-diffusion agents for PCB glass substrates in Examples 1-5

[0137]

[0138] Figure 1 This is a diagram showing the ink contact angle on the surface of a glass substrate after treatment with an anti-diffusion agent using the PCB glass substrate of Embodiment 1 of the present invention. Figure 2 This is a diagram showing the ink contact angle on the surface of a glass substrate after treatment with an anti-diffusion agent for a PCB glass substrate according to Embodiment 2 of the present invention. Figure 3 This is a diagram showing the ink contact angle on the surface of a glass substrate after treatment with an anti-diffusion agent using the PCB glass substrate of Embodiment 3 of the present invention. Figures 1-3 As can be seen from the experimental data of Examples 1-5 in Table 1, the anti-diffusion agent for PCB glass substrates in this invention can effectively prevent ink diffusion on the surface of the glass substrate during the inkjet printing process. The ink contact angle test data shows that the contact angle between the glass substrate and the solder resist ink is between 86.5-87.0°, meeting the requirements for ink anti-diffusion performance. The adhesion level test results of 3M tape show an adhesion level of 0, with no ink peeling and no residue on the back of the tape, indicating that the anti-diffusion agent provides excellent bonding strength and compatibility with the ink, meeting the adhesion performance requirements. The chemical corrosion resistance test shows that after the glass substrate is immersed in a 10% NaOH solution for 30 minutes, there is no blistering on the surface of the glass substrate, meeting the chemical corrosion resistance requirements. The anti-diffusion agent can form an organic layer on the surface of the glass substrate, reducing the surface tension of the glass substrate while strengthening the bonding force between the glass substrate surface and the ink, preventing the inkjet ink from diffusing on the glass substrate surface, and improving the product qualification rate of the solder resist printing process.

[0139] The PCB glass substrates of Comparative Examples 1-5 were subjected to performance tests using an anti-diffusion agent. The test results are shown in Table 2 below.

[0140] Table 2. Performance test results of anti-diffusion agents for PCB glass substrates in Comparative Examples 1-5

[0141]

[0142] Figure 4 This is a diagram showing the ink contact angle on the surface of the PCB glass substrate treated with an anti-diffusion agent according to Comparative Example 1 of the present invention. From... Figure 4As shown in Table 2, the difference between Comparative Examples 1-5 and Example 1 is that the anti-diffusion agent lacks one of the following components: surface enhancer, bonding agent, wetting agent, stabilizer, and co-solvent, respectively. Experimental data shows that the surface enhancer and bonding agent are the core active substances for anti-diffusion function. When either component is missing, the contact angle of the glass substrate surface decreases significantly, confirming that they synergistically dominate the anti-diffusion performance of the anti-diffusion agent. Simultaneously, the adhesion and chemical corrosion resistance of the glass substrate surface decrease, specifically manifested as ink peeling and blistering after immersion in strong alkali. The wetting agent, stabilizer, and co-solvent, as auxiliary functional components, all contribute to varying degrees of degradation in the contact angle between the glass substrate and the ink, the adhesion of the glass substrate surface, and the chemical corrosion resistance, fully demonstrating that the comprehensive performance of the anti-diffusion agent for PCB glass substrates of this invention is the result of the synergistic effect of its various effective components.

[0143] The performance of the PCB glass substrates of Comparative Examples 6-12 with anti-diffusion agents and Comparative Example 13 with anti-diffusion liquids was tested. The test results are shown in Table 3 below:

[0144] Table 3. Performance test results of the anti-diffusion agent for PCB glass substrates in Comparative Examples 6-12 and the anti-diffusion liquid in Comparative Example 13.

[0145]

[0146] Figure 5 This is a diagram showing the ink contact angle on the surface of the PCB glass substrate treated with an anti-diffusion agent according to Comparative Example 11 of the present invention. Figure 6 This is a diagram showing the ink contact angle on the surface of the PCB glass substrate treated with an anti-diffusion agent according to Comparative Example 12 of the present invention. Figure 7 This is a diagram showing the ink contact angle on the surface of a glass substrate treated with the anti-diffusion liquid of Comparative Example 13 of the present invention. Figures 5-7As shown in Table 3, the difference between Comparative Examples 6-10 and Example 1 lies in the fact that the surface enhancer, bonding agent, wetting agent, stabilizer, and co-solvent in the single component of the anti-diffusion agent are all above the upper limit of the mass concentration specified by the anti-diffusion liquid of this invention. Experimental data show that, comparing the test results of Examples 1-5 and Comparative Examples 6-10, when the mass concentrations of surface enhancer, bonding agent, wetting agent, stabilizer, and co-solvent exceed the range specified by this invention, the contact angle between the glass substrate and the ink, the adhesion of the substrate surface, and the chemical corrosion resistance show almost no significant changes. This indicates that when the concentration of each component is too high, the surface energy of the organic layer formed by the anti-diffusion agent and the substrate tends to stabilize, and the anti-diffusion ability is not enhanced due to the increase in concentration; at the same time, excessive addition of components not only fails to improve performance but also increases the cost of preparing the solution. Therefore, the mass concentration of each component of the anti-diffusion agent for PCB glass substrates of this invention needs to be controlled within the range specified in the examples to ensure that the performance of the solution meets the standards and to avoid cost waste caused by excessive mass concentration.

[0147] The difference between Comparative Examples 11-12 and Example 1 lies in the surface reinforcing agent component: trimethylsilyl trifluoromethanesulfonate was replaced with equal masses of fluorine-free functional group-like compounds and silicon-free functional group-like compounds, respectively. Experimental data show that fluorine and silicon functional groups play important roles in surface reinforcing agents. The absence of either functional group will lead to a decrease in the performance of the anti-diffusion agent, indicating that fluorine and silicon functional groups in surface reinforcing agents have an important influence on the performance of anti-diffusion agents.

[0148] The difference between Comparative Example 13 and Example 1 is that the anti-diffusion agent of the present invention is compared with the prior art (Chinese patent application CN202210765329.1). The experimental data show that the anti-diffusion agent of the present invention has better anti-diffusion performance on PCB glass substrates.

[0149] In summary, this invention discloses an anti-diffusion agent for PCB glass substrates, its preparation method, and its application, primarily used in the pretreatment stage of the solder resist process for inkjet printing on glass substrates. This anti-diffusion agent is composed of a surface enhancer, bonding agent, wetting agent, stabilizer, co-solvent, and a balance of water. It can construct an organic functional layer on the surface of the glass substrate, achieving performance optimization through a dual-action mechanism: on the one hand, it reduces the surface tension of the glass substrate; on the other hand, it strengthens the interfacial adhesion between the substrate and the ink, fundamentally inhibiting the diffusion of inkjet printing ink on the substrate surface and significantly improving the product yield of the solder resist process.

[0150] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An anti-diffusion agent for PCB glass substrates, characterized in that, It is composed of the following components in mass concentrations: surface enhancer 0.5-2.5%, bonding agent 0.5-2.5%, wetting agent 1.0-3.0%, stabilizer 0.5-2.5%, cosolvent 0.2-1.5%, and the balance being water; wherein the surface enhancer is one or more of trimethylsilyl trifluoromethanesulfonate, trimethylsilyl trifluoromethanesulfonate, and triisopropylsilyl trifluoromethanesulfonate; the bonding agent is a nitrazole compound containing a sulfur functional group; the wetting agent is a benzyl alcohol compound containing a hydroxyl functional group; the stabilizer is a piperidine derivative; and the cosolvent is an ether solvent.

2. The anti-diffusion agent for PCB glass substrates as described in claim 1, characterized in that, It consists of the following components in mass concentrations: surface enhancer 0.5-1.5%, bonding agent 0.5-1.5%, wetting agent 1.0-2.0%, stabilizer 0.5-1.5%, cosolvent 0.2-1.0%, and the balance being water.

3. The anti-diffusion agent for PCB glass substrates as described in claim 1, characterized in that, The bonding agent is one or more of 5-benzylthiotetrazole, 5-ethylthiotetrazole, and 3-amino-1-methyl-5-methylthio-1,2,4-triazole.

4. The anti-diffusion agent for PCB glass substrates as described in claim 1, characterized in that, The wetting agent is one or more of 2-hydroxy-3-methoxybenzyl alcohol, 2-hydroxy-5-nitrobenzyl alcohol, and 4-fluoro-3-hydroxybenzyl alcohol.

5. The anti-diffusion agent for PCB glass substrates as described in claim 1, characterized in that, The stabilizer is one or more of 3-(1H-1,2,4-triazol-1-yl)piperidine, 4-(4-methyl-4H-1,2,4-triazol)piperidine, and 4-(1,3-dioxolane-2-yl)piperidine.

6. The anti-diffusion agent for PCB glass substrates as described in claim 1, characterized in that, The cosolvent is one or more of benzoin isopropyl ether, rum ether, and methyl cedarwood ether.

7. The method for preparing the anti-diffusion agent for PCB glass substrates according to any one of claims 1-6, characterized in that, The process includes the following steps: weigh out the surface enhancer, bonding agent, wetting agent, stabilizer, and cosolvent in sequence, add them to the reaction vessel along with the remaining water, and stir and mix at room temperature of 25-28℃ for 30-35 minutes to obtain the anti-diffusion agent for PCB glass substrates.

8. A method for printing solder resist on a PCB glass substrate, characterized in that, The method includes the following steps: surface treatment of the glass substrate using the anti-diffusion agent for PCB glass substrates as described in any one of claims 1-6.

9. The method for printing solder resist on a PCB glass substrate as described in claim 8, characterized in that, The surface treatment temperature is 25±1℃, the surface treatment section length is 1.0m, and the linear velocity is 2.0±0.1m / min.

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