Narrow-pulse-width high-voltage pulse power supply based on wide bandgap semiconductor device

Abstract

The invention discloses a narrow-pulse-width high-voltage pulse power supply based on a wide bandgap semiconductor device, which comprises a shell, a pulse power supply circuit board is arranged at the lower end in the shell, a plurality of control buttons are uniformly and fixedly arranged on the outer side of the shell, and the control buttons are electrically connected with the pulse power supply circuit board. The upper end of the shell is provided with a cooling mechanism used for controlling the inlet air temperature of cooling airflow, and the lower end of the cooling mechanism is provided with an air guide mechanism used for controlling the air direction of the cooling airflow. An additional cooling structure is designed for the narrow-pulse-width high-voltage pulse power supply, cold air can be conveyed into equipment when the equipment works at high power, the cooling effect of the device can be remarkably improved, and the device is suitable for the narrow-pulse-width high-voltage pulse power supply.

Description

Technical Field

[0001] The present invention relates to the technical field of pulse power supplies, and particularly to a narrow pulse width high-voltage pulse power supply based on wide bandgap semiconductor devices. Background Technique

[0002] A narrow pulse width high-voltage pulse power supply based on wide bandgap semiconductor devices (such as silicon carbide SiC, gallium nitride GaN) is a power supply system that utilizes the high-frequency, high-voltage, and high-efficiency characteristics of wide bandgap materials to generate pulse signals with pulse widths in the nanosecond to microsecond range and voltages up to several thousand volts to dozens of kilovolts. By rapidly turning on and off high-frequency switching devices and combining the energy release of energy storage elements (such as capacitors and inductors), the generation of high-voltage narrow pulses is achieved. Its core advantage lies in the high electron mobility and breakdown electric field strength of wide bandgap materials, enabling the device to operate stably under high frequency and high voltage. The narrow pulse width high-voltage pulse power supply based on wide bandgap semiconductor devices is widely used in the industrial and medical industries due to its high-frequency, high-voltage, and high-efficiency characteristics.

[0003] However, such narrow pulse width high-voltage pulse power supplies based on wide bandgap semiconductor devices in the prior art have the following drawbacks when in use; the equipment is prone to overheating. The pulse power supply achieves high-power output through rapid charge and discharge, but the energy conversion efficiency cannot reach 100%, and the unused energy is dissipated in the form of heat; when such a power supply operates at high frequency, the junction temperature may exceed 150°C, and the traditional air-cooling form has poor heat dissipation effect under such working conditions; it is easy to cause equipment damage.

[0004] Therefore, in view of this problem, an improvement is needed for a narrow pulse width high-voltage pulse power supply based on wide bandgap semiconductor devices. Summary of the Invention

[0005] The purpose of the present invention is to provide a narrow pulse width high-voltage pulse power supply based on wide bandgap semiconductor devices to solve the problems raised in the above background technique.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A narrow pulse width high-voltage pulse power supply based on wide bandgap semiconductor devices, including a housing. A pulse power circuit board is provided at the lower end inside the housing. A plurality of control buttons are uniformly and fixedly provided on the outer side of the housing. The control buttons are electrically connected to the pulse power circuit board. A cooling mechanism for controlling the inlet air temperature of the cooling air flow is provided at the upper end of the housing. A wind guiding mechanism for controlling the wind direction of the cooling air flow is provided at the lower end of the cooling mechanism.

[0007] Preferably, the cooling mechanism includes an air inlet, a fixed frame, an impeller fan, a semiconductor refrigeration plate, a cold-end heat-conducting fin plate, and a hot-end heat-conducting fin plate. An air inlet is fixedly arranged at the upper end of the housing. In the middle of the upper end of the air inlet, a fixed frame is fixedly arranged. An impeller fan is arranged inside the fixed frame. A semiconductor refrigeration plate is fixedly arranged on the inner side wall of the air inlet. On one side of the surface of the semiconductor refrigeration plate, a plurality of cold-end heat-conducting fin plates are evenly and fixedly arranged. On the side of the surface of the semiconductor refrigeration plate away from the cold-end heat-conducting fin plates, a plurality of hot-end heat-conducting fin plates are fixedly arranged. Through the cooling mechanism of this device, the traditional structure of only blowing air for cooling can be changed to blowing cold air for cooling, and then the hot end is directly placed in the external environment for natural heat dissipation. In this way, the cooling air inlet temperature of the device can be greatly reduced, thereby improving the cooling effect of this device on the pulse power supply circuit board during operation.

[0008] Preferably, the air guiding mechanism includes a connecting frame, air guiding plates, connecting tabs, connecting rods, and clamping blocks. A connecting frame is fixedly arranged at the lower end of the air inlet. Inside the connecting frame, a plurality of air guiding plates are evenly and movably arranged through a rotating shaft. At one end of the rotating shaft where the air guiding plate is located, a connecting tab is fixedly arranged. At the upper end of the connecting tab, a connecting rod is movably arranged through a rotating shaft. At the lower end of the connecting rod, a clamping block is fixedly arranged. Through the air guiding mechanism of this device, the cold air conveyed from the air inlet to the inside of the housing can be evenly guided left and right, so as to ensure the cooling uniformity of the cooling air.

[0009] Preferably, the air guiding mechanism further includes a screw rod, a moving plate, a speed reducer, and a motor. On one side of the surface of the connecting frame, a screw rod is movably arranged through a bearing. On the surface of the connecting rod, a moving plate is movably screwed through a thread. The clamping block is movably clamped on the outer surface of the moving plate. On one side of the surface of the connecting frame, a speed reducer is fixedly arranged. At the upper end of the speed reducer, a motor is fixedly arranged. The power output end of the motor is in transmission connection with the screw rod through the speed reducer. By driving the moving plate to move through the screw rod in the air guiding mechanism, the clamping block can be driven to move left and right, so that the connecting rod drives the connecting tab and the air guiding plate to rotate, thereby changing the air guiding direction. The clamping block of this device should be C-shaped and clamped on the outer surface of the moving plate. Because the clamping block needs to move not only left and right but also up and down to drive the connecting tab to rotate, setting the clamping block as C-shaped can enable the clamping block to move up and down.

[0010] Preferably, air outlets are fixedly arranged on both sides of the lower end of the housing surface. The air outlets cooperate with the air inlet to form an air flow cycle to achieve the purpose of cooling the pulse power supply circuit board.

[0011] Preferably, a plurality of cold-end heat-conducting fin plates and hot-end heat-conducting fin plates are provided and evenly spaced on the outer surface of the semiconductor refrigeration plate. Through the plurality of cold-end heat-conducting fin plates and hot-end heat-conducting fin plates, the heat and cold on the surface of the semiconductor refrigeration plate can be fully guided to occur. One is used to cool the pulse power circuit board inside the housing, and the other is used to fully contact the external environment to dissipate its own heat.

[0012] Preferably, a protective frame is fixedly arranged at the upper end of the fixed frame. Through the protective frame, the operation of the impeller fan can be effectively prevented.

[0013] Preferably, a power interface is fixedly arranged on one side of the housing surface. The power interface is electrically connected to the pulse power circuit board. Through the power interface, a 220V power supply can be connected, and then it is regulated by the pulse power circuit board to finally output a pulse power supply.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1. The present invention releases a predetermined pulse power supply through the pulse power circuit board. However, when the pulse power supply realizes high-power output through rapid charge and discharge, a large amount of heat will be generated. At this time, the device can guide the air flow into the housing through the impeller fan, and then the air flow blows on the surface of the pulse power circuit board and is then discharged through the air outlet. In this way, the pulse power circuit board is cooled. When the air supply cooling is insufficient, the semiconductor refrigeration plate can be turned on to perform refrigeration work through the semiconductor refrigeration plate so that the temperature inside the air inlet is rapidly reduced. In this way, the air flow entering the housing from the air inlet can form cold air, which can greatly reduce the inlet air temperature, thereby improving the cooling effect of the device.

[0016] 2. The present invention can drive the screw to rotate through the motor, thereby driving the moving block to move left and right. When the moving block moves left and right, it can also drive the clamping block to move left and right, thereby changing the air guiding direction, so as to ensure the cooling uniformity of the cooling air, and further improve the cooling effect of the device, making it more suitable for narrow pulse width high-voltage pulse power supplies. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of the overall structure of a narrow pulse width high-voltage pulse power supply based on wide bandgap semiconductor devices according to the present invention;

[0018] Figure 2 is a cross-sectional view of a narrow pulse width high-voltage pulse power supply based on wide bandgap semiconductor devices according to the present invention;

[0019] Figure 3 is a narrow pulse width high-voltage pulse power supply based on wide bandgap semiconductor devices according to the present invention Figure 2 side view;

[0020] Figure 4 This is the overall structural view of the air inlet in a narrow-pulse-width high-voltage pulse power supply based on wide-bandgap semiconductor devices according to the present invention;

[0021] Figure 5 This is the bottom view of the air inlet in a narrow-pulse-width high-voltage pulse power supply based on wide-bandgap semiconductor devices according to the present invention;

[0022] Figure 6 This is the overall structural view of the connection frame in a narrow-pulse-width high-voltage pulse power supply based on wide-bandgap semiconductor devices according to the present invention.

[0023] In the figure: 1. Housing; 2. Pulse power supply circuit board; 3. Control button; 4. Air inlet; 5. Fixed frame; 6. Impeller fan; 7. Semiconductor refrigeration plate; 8. Cold-end heat conduction fin plate; 9. Hot-end heat conduction fin plate; 10. Connection frame; 11. Air deflector; 12. Connection tab; 13. Connecting rod; 14. Clamping block; 15. Screw; 16. Moving plate; 17. Reducer; 18. Motor; 19. Air outlet; 20. Protection frame; 21. Power interface. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0025] Please refer to Figures 1-6 , the present invention provides a technical solution: a narrow-pulse-width high-voltage pulse power supply based on wide-bandgap semiconductor devices, including a housing 1, a pulse power supply circuit board 2 is arranged at the lower end inside the housing 1, a plurality of control buttons 3 are uniformly and fixedly arranged on the outer side of the housing 1, and the control buttons 3 are electrically connected to the pulse power supply circuit board 2. A cooling mechanism for controlling the inlet temperature of the cooling air flow is arranged at the upper end of the housing 1, and an air guiding mechanism for controlling the wind direction of the cooling air flow is arranged at the lower end of the cooling mechanism.

[0026] The cooling mechanism includes an air inlet 4, a fixed frame 5, an impeller fan 6, a semiconductor refrigeration plate 7, a cold-end heat-conducting fin plate 8, and a hot-end heat-conducting fin plate 9. The air inlet 4 is fixedly arranged at the upper end of the housing 1. In the middle of the upper end of the air inlet 4, a fixed frame 5 is fixedly arranged. An impeller fan 6 is arranged inside the fixed frame 5. A semiconductor refrigeration plate 7 is fixedly arranged on the inner side wall of the air inlet 4. On one side of the surface of the semiconductor refrigeration plate 7, a plurality of cold-end heat-conducting fin plates 8 are evenly and fixedly arranged. On the side of the surface of the semiconductor refrigeration plate 7 away from the cold-end heat-conducting fin plates 8, a plurality of hot-end heat-conducting fin plates 9 are fixedly arranged. Through the cooling mechanism of this device, the traditional structure of only blowing air for cooling can be changed to blowing cold air for cooling, and then the hot end is directly placed in the external environment for natural heat dissipation. In this way, the cooling air inlet temperature of the device can be greatly reduced, thereby improving the cooling effect of this device on the pulse power circuit board 2 during operation;

[0027] The air guiding mechanism includes a connecting frame 10, air guiding plates 11, connecting tabs 12, connecting rods 13, and clamping blocks 14. The connecting frame 10 is fixedly arranged at the lower end of the air inlet 4. A plurality of air guiding plates 11 are evenly and movably arranged inside the connecting frame 10 through a rotating shaft. At one end of the rotating shaft where the air guiding plate 11 is located, a connecting tab 12 is fixedly arranged. The upper end of the connecting tab 12 is movably arranged through a rotating shaft with a connecting rod 13. The lower end of the connecting rod 13 is fixedly arranged with a clamping block 14. Through the air guiding mechanism of this device, the cold air conveyed from the air inlet 4 into the housing 1 can be evenly guided left and right, so as to ensure the cooling uniformity of the cooling air;

[0028] The air guiding mechanism further includes a screw rod 15, a moving plate 16, a speed reducer 17, and a motor 18. The screw rod 15 is movably arranged on one side of the surface of the connecting frame 10 through a bearing. The moving plate 16 is movably screwed on the surface of the connecting rod 13 through a thread. The clamping block 14 is movably clamped on the outer surface of the moving plate 16. The speed reducer 17 is fixedly arranged on one side of the surface of the connecting frame 10. The motor 18 is fixedly arranged on the upper end of the speed reducer 17. The power output end of the motor 18 is in transmission connection with the screw rod 15 through the speed reducer 17. By driving the moving plate 16 to move through the screw rod 15 in the air guiding mechanism, the clamping block 14 can be driven to move left and right, so that the connecting rod 13 drives the connecting tab 12 and the air guiding plate 11 to rotate, thereby changing the air guiding direction. The clamping block 14 of this device should be C-shaped and clamped on the outer surface of the moving plate 16. Because the clamping block 14 needs to move not only left and right but also up and down to drive the connecting tab 12 to rotate, setting the clamping block 14 as C-shaped can enable the clamping block 14 to move up and down;

[0029] On both sides of the lower end of the surface of the housing 1, air outlets 19 are fixedly arranged. The air outlets 19 cooperate with the air inlets 4 to form an air flow cycle, so as to achieve the purpose of cooling the pulse power supply circuit board 2;

[0030] A plurality of cold-end heat-conducting fin plates 8 and hot-end heat-conducting fin plates 9 are provided, and are evenly spaced on the outer surface of the semiconductor refrigeration plate 7 respectively. Through the plurality of cold-end heat-conducting fin plates 8 and hot-end heat-conducting fin plates 9, the heat and cold on the surface of the semiconductor refrigeration plate 7 can be fully guided to occur. One is used to cool the pulse power supply circuit board 2 inside the housing 1, and the other is used to fully contact the external environment to dissipate its own heat;

[0031] A protective frame 20 is fixedly arranged at the upper end of the fixed frame 5. The protective frame 20 can effectively prevent the impeller fan 6 from working;

[0032] A power interface 21 is fixedly arranged on one side of the surface of the housing 1. The power interface is electrically connected to the pulse power supply circuit board 2. Through the power interface 21, a 220-volt power supply can be connected, and then after being regulated by the pulse power supply circuit board 2, the pulse power supply is finally output.

[0033] Working principle: When using this device, this device releases a predetermined pulse power supply through the pulse power supply circuit board 2. However, when the pulse power supply realizes high-power output through rapid charge and discharge, a large amount of heat will be generated. At this time, this device can guide the air flow into the housing 1 through the impeller fan 6, and then the air flow blows on the surface of the pulse power supply circuit board 2, and then is discharged through the air outlet 19, so as to cool the pulse power supply circuit board 2. When the air supply cooling is insufficient, the semiconductor refrigeration plate 7 can be turned on to perform refrigeration work through the semiconductor refrigeration plate 7 so that the inside of the air inlet 4 is quickly cooled. In this way, the air flow entering the housing 1 from the air inlet 4 can form cold air, so that the air inlet temperature can be greatly reduced, thereby improving the cooling effect of this device;

[0034] And when using this device, the motor 18 can drive the screw 15 to rotate, so as to drive the moving block to move left and right. When the moving block moves left and right, it can also drive the clamping block 14 to move left and right, so as to change the air guiding direction, so as to ensure the cooling uniformity of the cooling air, thereby further improving the cooling effect of this device to be more suitable for narrow pulse width high-voltage pulse power supplies.

[0035] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0036] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A narrow pulse width high voltage pulse power supply based on a wide bandgap semiconductor device, comprising a housing (1), characterized in that: A pulse power supply circuit board (2) is provided at the lower end of the interior of the housing (1); a plurality of control buttons (3) are evenly and fixedly provided on the outside of the housing (1); the control buttons (3) are electrically connected to the pulse power supply circuit board (2); a cooling mechanism for controlling the inlet temperature of the cooling airflow is provided at the upper end of the housing (1); and an air guide mechanism for controlling the wind direction of the cooling airflow is provided at the lower end of the cooling mechanism.

2. The narrow pulse-width high-voltage pulse power supply based on a wide bandgap semiconductor device according to claim 1, wherein: The cooling mechanism comprises an air inlet (4), a fixed frame (5), an impeller fan (6), a semiconductor refrigeration plate (7), a cold-end heat-conducting fin plate (8), and a hot-end heat-conducting fin plate (9); the air inlet (4) is fixedly provided at the upper end of the shell (1); the fixed frame (5) is fixedly provided at the middle part of the upper end of the air inlet (4); the impeller fan (6) is provided inside the fixed frame (5); the semiconductor refrigeration plate (7) is fixedly provided on the inner side wall of the air inlet (4); a plurality of cold-end heat-conducting fin plates (8) are evenly fixedly provided on one side of the surface of the semiconductor refrigeration plate (7); and a plurality of hot-end heat-conducting fin plates (9) are fixedly provided on the side of the surface of the semiconductor refrigeration plate (7) away from the cold-end heat-conducting fin plate (8).

3. The narrow pulse-width high-voltage pulse power supply based on wide-bandgap semiconductor devices according to claim 1, wherein: The air guide mechanism comprises a connecting frame (10), an air guide plate (11), a connecting paddle (12), a connecting rod (13), and a clamping block (14); the connecting frame (10) is fixedly provided at the lower end of the air inlet (4); a plurality of air guide plates (11) are evenly movably provided inside the connecting frame (10) via a rotating shaft; a connecting paddle (12) is fixedly provided at one end of the rotating shaft where the air guide plate (11) is located; a connecting rod (13) is movably provided at the upper end of the connecting paddle (12) via a rotating shaft; and a clamping block (14) is fixedly provided at the lower end of the connecting rod (13).

4. A narrow pulse-width high-voltage pulse power supply based on a wide bandgap semiconductor device according to claim 3, characterized in that: The air guide mechanism further comprises a screw (15), a movable plate (16), a reducer (17), and a motor (18); a screw (15) is movably provided on one side of the surface of the connecting frame (10) via a bearing; a movable plate (16) is movably screwed on the surface of the connecting rod (13) via a thread; the clamping block (14) is movably engaged with the outer surface of the movable plate (16); a reducer (17) is fixedly provided on one side of the surface of the connecting frame (10); a motor (18) is fixedly provided on the upper end of the reducer (17); and a power output end of the motor (18) is transmission-connected to the screw (15) via the reducer (17).

5. A narrow pulse-width high-voltage pulse power supply based on a wide bandgap semiconductor device according to claim 1, characterized in that: Air outlets (19) are fixedly provided on both sides of the lower end of the surface of the shell (1).

6. The narrow pulse width high voltage pulse power supply based on wide bandgap semiconductor devices according to claim 1, wherein: A plurality of the cold-end heat-conducting fin plates (8) and the hot-end heat-conducting fin plates (9) are provided and are evenly spaced apart on the outer surface of the semiconductor refrigeration plate (7).

7. A narrow pulse width high voltage pulse power supply based on a wide bandgap semiconductor device according to claim 1, characterized in that: A protective frame (20) is fixedly provided on the upper end of the fixed frame (5).

8. A narrow pulse width high voltage pulse power supply based on a wide bandgap semiconductor device according to claim 1, characterized in that: A power interface (21) is fixedly provided on one side of the surface of the housing (1), and the power interface (21) is electrically connected to the pulse power circuit board (2).

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