Display module packaging method and system and display module

Abstract

The invention relates to the technical field of display equipment, in particular to a display module packaging method and system and a display module. The display module packaging method provided by the invention comprises the following steps: preparing an optical film layer, and cutting the optical film layer into a plurality of optical films based on the number of LED chips; a carrier film is provided, at least two first alignment marks are arranged on the surface of the display module according to the positions of the LED chips, second alignment marks corresponding to the first alignment marks are arranged on the carrier film, and the optical film is arranged at the second alignment marks of the carrier film to form a packaging film layer; the first alignment marks are in one-to-one correspondence with the optical films on the packaging film layer, and the packaging film layer is attached to the display module through a hot pressing process; the LED chip is small in size and high in requirement for packaging precision, the optical film layer is cut and then combined with the carrier film, the carrier film and the display module are correspondingly packaged according to the supporting and separating characteristics of the carrier film, the packaging process is simple, convenient and easy to operate, and the corresponding size after packaging is accurate.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and particularly relates to a display module encapsulation method, system, and display module.

Background Art

[0002] The light emitted by an LED chip usually has a high brightness concentration, and it is easy to appear spot or uneven brightness. By adding an optical film outside the LED chip, the light can be made softer, reducing the spot phenomenon and improving the overall display quality.

[0003] However, there are still some bottlenecks in the existing display module encapsulation process. In the traditional encapsulation step, the whole optical film is attached to the display module, but the whole attachment may be uneven, resulting in poor display effects, or it is easy to generate bubbles or wrinkles during the attachment process, affecting the display quality; and before the optical film is attached to the LED chip, precise alignment needs to be carried out between the LED chip and the optical film, and the position tolerance is controlled within ±5μm, otherwise edge light leakage or local dark areas are likely to occur, and this process usually requires extremely high precision and consumes a lot of time and energy to ensure a good attachment effect, so as not to affect the light uniformity and diffusion effect.

Summary of the Invention

[0004] In order to solve the technical problem of low alignment accuracy in the existing display module encapsulation process, the present invention provides a display module encapsulation method, system, and display module.

[0005] To solve the above technical problems, the present invention provides the following technical solutions: A display module encapsulation method, the display module includes an LED chip, and the method includes the following steps: preparing an optical film layer, and cutting and tailoring the optical film layer into a plurality of optical film pieces based on the number of the LED chips; providing a carrier film, at least two first alignment marks are provided on the surface of the display module according to the positions of the LED chips, second alignment marks corresponding to the first alignment marks are provided on the carrier film, and the optical film pieces are arranged at the second alignment marks on the carrier film to form an encapsulation film layer;

[0006] Making the first alignment marks correspond to the optical film pieces on the encapsulation film layer one by one, and attaching the encapsulation film layer to the display module through a hot pressing process.

[0007] Preferably, making the first alignment marks correspond to the optical film pieces on the encapsulation film layer one by one, and attaching the encapsulation film layer to the display module through a hot pressing process, includes:

[0008] A packaging device is provided, the packaging device comprising a pressurizing device and a discharge device spaced apart from the pressurizing device on the same side, wherein a heating device is provided on the packaging device corresponding to the display module;

[0009] When the packaging film layer is discharged from the discharge device until the first alignment mark corresponds to the second alignment mark one by one, the pressurizing device presses the packaging film layer to attach it to the display module;

[0010] The heat of the heating device is transferred to the packaging film layer through the display module, and the pressurizing device heat-presses and packages the packaging film layer onto the display module.

[0011] Preferably, the packaging device further includes a driving device, and the pressurizing device applies pressure to press the packaging film layer onto the display module, comprising:

[0012] Determine whether the first alignment mark and the second alignment mark are accurately aligned. If so, the pressurizing device presses the packaging film layer to adhere it to the side of the display module where the LED chip is set; if not, control the driving device to drive the display module and / or the packaging film layer to realign.

[0013] Preferably, preparing the optical film layer comprises:

[0014] A light-homogenizing film and an adhesive layer are provided, and the light-homogenizing film and the adhesive layer are superimposed and pressed into an optical film layer through a hot pressing process.

[0015] Preferably, the display module further includes a substrate, the LED chip is arranged on the substrate, and the step of laminating the packaging film layer to the display module through a hot pressing process further includes:

[0016] The adhesive layer is directly attached to the LED chip, the light uniforming film covers the side of the LED chip away from the substrate, and the height of the adhesive layer on the substrate is greater than or equal to the height of the LED chip on the substrate.

[0017] To solve the above technical problems, the present invention provides another technical solution as follows: a display module packaging system for implementing the display module packaging method as described above, the system comprising: a preparation mechanism for preparing the optical film layer, and cutting the optical film layer into a plurality of optical film sheets based on the number of the LED chips;

[0018] A pressing mechanism is used to provide the carrier film, wherein the surface of the display module is provided with at least two first alignment marks according to the position of the LED chip, and the carrier film is provided with second alignment marks corresponding to the first alignment marks, and the optical film is arranged at the second alignment marks on the carrier film to form an encapsulation film layer;

[0019] The hot pressing and laminating mechanism is used to align the first alignment marks with the optical films on the encapsulation film layer one by one, and laminate the encapsulation film layer on the display module through a hot pressing process.

[0020] Preferably, the laminating mechanism includes a feeding device for feeding the encapsulation film layer in the form of a coil.

[0021] Preferably, the hot pressing and laminating mechanism includes a transmission device and a pressing device. A heating device is provided in the transmission device corresponding to the display module. The pressing device is used to press and attach the encapsulation film layer to the display module, and the heating device is used to heat the display module and the encapsulation film layer.

[0022] Preferably, the hot pressing and laminating mechanism further includes a detection device for detecting the position deviation between the first alignment mark and the second alignment mark.

[0023] To solve the above technical problems, the present invention provides another technical solution as follows: A display module prepared by the display module encapsulation method as described above.

[0024] Compared with the prior art, a display module encapsulation method, system and display module provided by the present invention have the following beneficial effects:

[0025] 1. A display module encapsulation method provided by the present invention provides an encapsulation method that utilizes the carrying function of the carrier film to fix and support the optical film layer. Based on the professional experience of technicians and product requirements, the optical film layer is cut into several optical films corresponding to the quantity, type, size, and use of the LED chips. The cut optical films are laminated and attached to the carrier film to form an encapsulation film layer; attaching the optical films made into specific shapes and sizes to the carrier film facilitates encapsulation operations and applications in different devices and processes, making the position adjustment of the optical films in subsequent processing steps simpler and more efficient, and reducing the complexity of the encapsulation process; at least two first alignment marks are provided on the surface of the display module according to the positions of the LED chips, and a plurality of second alignment marks corresponding to the first alignment marks are provided on the carrier film. The carrier film has an alignment relationship with the LED chips, so indirectly there is also an alignment relationship between the encapsulation film layer formed by the optical film and the carrier film and the LED chips. Substantially, the carrier film is an intermediate carrier indirectly carrying the alignment relationship between the optical film and the LED chips, helping the optical film to be attached to the LED correspondingly, ensuring the position accuracy, and the optical film being attached to the carrier film facilitates the handling and operation of the optical film, especially when the cut optical films are small and difficult to directly pick up, the carrier film provides an operation carrier and reduces the operation difficulty.

[0026] 2. A display module packaging method provided by the present invention further includes providing a packaging device corresponding to the packaging method. The packaging device performs thermocompression lamination, cooperating with a heating device provided corresponding to the display module, and a pressurizing device of the device applies pressure to the packaging film layer to promote the one-time corresponding lamination of the packaging film layer. The packaging process of pressurizing and laminating in combination with heat is simple and easy to operate. At the same time, since the heating device is arranged inside the packaging device and does not directly contact the packaging film layer, after the lamination is completed, the packaging film layer can be cured more quickly. When the first alignment mark on the packaging film layer corresponds one by one to the second alignment mark on the display module, the heat of the heating component is transmitted to the packaging film layer through the display module, and the packaging film layer can be laminated more closely to the display module after being heated. The optical film is corresponding to the LED chip and completely covers the LED chip. There is a heat transfer interval and the optical film is not directly heated, and the waiting curing time is short.

[0027] 3. A display module packaging method provided by the present invention, during the display module packaging process, through the alignment judgment of the first alignment mark and the second alignment mark, if the alignment is complete, the packaging film layer is thermocompression laminated to the display module by combining the pressurizing device and the heating device of the packaging device; if the alignment is inaccurate, the corresponding driving device is controlled to drive the display module and / or the packaging film layer to perform re-alignment, improving the packaging accuracy, reducing errors, meeting the requirements of high-density packaging. During the packaging process, it is detected and automatically adjusted in real time, reducing manual intervention and downtime; the re-alignment can be achieved by driving the display module to perform axial movement in the horizontal direction so that the first alignment mark coincides with the second alignment mark, or by adjusting the distance between the packaging module and the LED chip.

[0028] 4. A display module packaging method provided by the present invention, the optical film layer is used for protection and packaging. The method includes a pre-synthesis step of the optical film layer. The optical film layer is formed by laminating a light homogenizing film and an adhesive layer. The adhesive layer makes the connection between the light homogenizing film and other components more stable, enhancing the stability when subjected to external force impact or long-term use, and ensuring the stable exertion of the light homogenizing function; the light homogenizing film scatters and refracts the light emitted by a point light source or a non-uniform light source, making the light evenly distributed within a certain area, reducing the brightness difference, improving the illumination uniformity. In the packaged display module, the light homogenizing film can make the light emitted by the LED chip more uniform, improving the display quality and visual comfort, and reducing visual fatigue caused by uneven light.

[0029] 5. A display module encapsulation method provided by the present invention, in which the glue layer is directly attached to the LED chip, the light homogenizing film is stacked with the glue layer, and after encapsulation, the light homogenizing film faces away from the side of the LED chip. The height of the glue layer on the substrate is greater than or equal to the height of the LED chip on the substrate, so the height of the light homogenizing film on the substrate is much greater than the height of the LED chip on the substrate, further improving the light output uniformity, making the light emitted by the light-emitting chip more stable and the display effect better.

[0030] 6. The embodiment of the present invention also provides a display module encapsulation system, which has the same beneficial effects as the above-mentioned display module encapsulation method and will not be elaborated here.

[0031] 7. A display module encapsulation system provided by the present invention, the optical film is a flexible and thin material. When it is carried by single-piece clamping, it is easy to deform or be damaged. The optical film is arranged on the carrier film. The carrier film has a certain strength and provides support for the optical film, protecting the optical film from being scratched or contaminated by dust during transportation and encapsulation. The combination of the carrier film and the optical film enhances the mechanical strength. Therefore, the composite encapsulation film layer can be fed continuously in a long size through the coiling device, realizing continuous feeding, reducing the number of times of manual intervention and the number of times the material is exposed to the environment, reducing the risk of operation errors and the risk of dust adsorption or external force scratching. The coiling feeding can also be compatible with various different types of encapsulation film layers.

[0032] 8. A display module encapsulation system provided by the present invention, the transmission device is combined with the pressing device and the heating device to realize the process of thermally pressing and attaching the encapsulation film layer to the display module. The heating device preheats the display module, and the display module transfers heat to the encapsulation film layer at intervals to activate the glue layer on the encapsulation film layer and realize the attachment of the glue layer to the display module. The heating device always remains in a working state after the encapsulation process starts, reducing the process interval; the pressing device accurately applies pressure to the display module, and combines with the heating device to complete pressing and curing synchronously, shortening the encapsulation time to meet the requirements of complex materials and processes. The transmission device conveys and drives the display module. The three work together to precisely control multiple elements such as heating temperature, pressing pressure, and heating time, avoiding defects such as incomplete attachment and air bubbles, and improving the quality of thermocompression bonding.

[0033] 9. A display module encapsulation system provided by the present invention, the detection device is used to detect the position deviation between the first alignment mark and the second alignment mark. During the encapsulation process, the detection device continuously detects the position deviation between the first alignment mark and the second alignment mark, eliminating the need for manual sampling inspection and reducing the debugging time; if the deviation is within a reasonable range, the pressing device applies pressure correspondingly to attach the encapsulation film to the display module. If it exceeds the reasonable deviation range, various adjustment mechanisms can be used for alignment adjustment.

[0034] 10. The embodiment of the present invention further provides a display module, which is prepared by the display module encapsulation method as described above and has the same beneficial effects as the above display module encapsulation method, so details are not described herein again.

Description of the Drawings

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0036] Figure 1 It is a flowchart of the display module encapsulation method provided by the first embodiment of the present invention.

[0037] Figure 2 It is a schematic assembly diagram of the display module and the encapsulation film layer of the display module encapsulation method provided by the first embodiment of the present invention.

[0038] Figure 3 It is a schematic diagram of the cutting effect of the optical film layer of the display module encapsulation method provided by the first embodiment of the present invention.

[0039] Figure 4 It is a side view of the display module after the encapsulation film layer and the display module are assembled by the display module encapsulation method provided by the first embodiment of the present invention.

[0040] Figure 5 It is a top view of the display module after the encapsulation film layer and the display module are assembled by the first embodiment of the present invention.

[0041] Figure 6 It is a schematic assembly diagram of the encapsulation film layer, the display module, and the encapsulation device of the display module encapsulation method provided by the first embodiment of the present invention.

[0042] Figure 7 It is a block diagram of the encapsulation device of the display module encapsulation method provided by the first embodiment of the present invention.

[0043] Figure 8 It is a block diagram of the display module encapsulation system provided by the second embodiment of the present invention.

[0044] Figure 9 It is a block diagram of the hot press fitting mechanism of the display module encapsulation system provided by the second embodiment of the present invention.

[0045] Description of the reference numerals:

[0046] 100. Optical film layer; 101. Optical film; 102. Light homogenizing film; 103. Adhesive layer; 200. Carrier film; 201. Encapsulation film layer; 203. Second alignment mark; 300. Display module; 301. Substrate; 302. LED chip; 303. First alignment mark; 400. Encapsulation device; 500. Encapsulation system;

[0047] 1. Transmission device; 2. Pressurizing device; 3. Heating device; 4. Feeding device; 5. Driving device; 6. Detection device;

[0048] 51. Preparation mechanism; 52. Pressing mechanism; 53. Thermal pressing and laminating mechanism.

Specific embodiments

[0049] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further details the present invention in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0050] Please refer to Figure 1 - Figure 4 , a first embodiment of the present invention provides a method for encapsulating a display module. The display module 300 includes an LED chip 302. The method for encapsulating the display module includes the following steps:

[0051] Step S1, prepare an optical film layer 100, and cut and trim the optical film layer 100 into a plurality of optical films 101 based on the number of LED chips 302;

[0052] Step S2, provide a carrier film 200. At least two first alignment marks 303 are provided on the surface of the display module 300 according to the positions of the LED chips 302. Second alignment marks 203 corresponding to the first alignment marks 303 are provided on the carrier film 200. The optical film 101 is disposed at the second alignment marks 203 of the carrier film 200 to form an encapsulation film layer 201;

[0053] Step S3, make the first alignment marks 303 correspond to the optical films 101 on the encapsulation film layer 201 one by one, and attach the encapsulation film layer 201 to the display module 300 through a thermal pressing process.

[0054] It can be understood that encapsulating the optical film layer 100 on the display module 300 can prevent physical or chemical damage to the light board side of the display component from the external environment, enhance the scratch resistance, and extend the service life. The optical film layer 100 is flexible and has a certain hardness. When laminating, it needs to be accurately aligned with the LED chip 302 to provide good light transmittance, uniform light, and reduce scattering.

[0055] Further, by utilizing the bearing function of the carrier film 200, the optical film layer 100 is fixed and supported. Based on the professional experience of the process personnel and the product requirements, the optical film layer 100 is cut into a plurality of optical film pieces 101 corresponding to the quantity, type, size, and use of the LED chips 302. After cutting, the optical film pieces 101 are pressed and attached to the carrier film 200 to form a packaging film layer 201; the optical film pieces 101 made into specific shapes and sizes are attached to the carrier film 200, so that in subsequent processing steps, only the position of the corresponding carrier film 200 needs to be adjusted for the position of the optical film pieces 101, reducing the complexity of the packaging process and the physical damage to the optical film pieces 101 during the packaging process. Compared with the whole-piece attached optical film layer 100, the present invention cuts the optical film layer 100 and accurately aligns and fits it, reducing material waste and saving costs.

[0056] On the surface of the display module 300, at least two first alignment marks 303 are provided according to the positions of the LED chips 302. A plurality of second alignment marks 203 corresponding to the first alignment marks 303 are provided on the carrier film 200. The carrier film 200 has an alignment relationship with the LED chips 302. Thus, indirectly, there is also an alignment relationship between the packaging film layer 201 formed by the optical film pieces 101 and the carrier film 200 and the LED chips 302. Substantially, the carrier film 200 serves as an intermediate carrier indirectly bearing the alignment relationship between the optical film pieces 101 and the LED chips 302, helping the optical film pieces 101 to be attached to the LEDs correspondingly and ensuring the position accuracy. Moreover, the optical film pieces 101 are attached to the carrier film 200, which is convenient for handling and operating the optical film pieces 101. Especially for the small and difficult-to-directly-pick-up optical film pieces 101 after cutting, the carrier film 200 provides a carrier for operation, reducing the operation difficulty.

[0057] Specifically, a display module packaging method provided by the present invention uses a hot pressing process to attach the packaging film layer 201 to the display module 300. The prepared display module 300 can quickly achieve color conversion and light shaping, while ensuring that the thickness of the packaging film layer 201 is uniform and effective, providing excellent protection performance.

[0058] Further, please refer to Figure 3 , step S1 of preparing the optical film layer 100 includes: step S11 of providing a light homogenizing film 102 and an adhesive layer 103, stacking the light homogenizing film 102 and the adhesive layer 103 and pressing them into the optical film layer 100 through a hot pressing process.

[0059] Specifically, in a display module packaging method provided by the present invention, the film to be packaged is the optical film layer 100. The optical film layer 100 is pressed into one body by a light homogenizing film 102 and an adhesive layer 103. The light homogenizing film 102 makes the light evenly distributed, avoiding the light being too concentrated or generating light spots; the adhesive layer 103 is used for bonding or packaging to ensure a tight combination between the optical film layer 100 and the LED chips 302.

[0060] Further, the display module 300 further includes a substrate 301, and the LED chip 302 is disposed on the substrate 301. In step S1, attaching the encapsulation film layer 201 to the display module 300 by a hot pressing process further includes:

[0061] The adhesive layer 103 is directly attached to the LED chip 302, the light homogenizing film 102 covers the side of the LED chip 302 facing away from the substrate 301, and the height of the adhesive layer 103 on the substrate 301 is greater than or equal to the height of the LED chip 302 on the substrate 301.

[0062] It can be understood that during the process of attaching the encapsulation film layer 201 to the display module 300 by a hot pressing process, the light homogenizing film 102 is disposed on the side of the LED chip 302 facing away from the display module 300, and the adhesive layer 103 is disposed on the side of the LED chip 302 facing the display module 300, so as to ensure that the light homogenizing film 102 completely covers the light emitting surface of the LED chip 302 and achieve the effect of the light homogenizing film 102.

[0063] Please refer to Figure 4 , the height of the adhesive layer 103 on the substrate 301 is greater than or equal to the height of the LED chip 302 on the substrate 301 and the light homogenizing film 102 covers the side of the LED chip 302 facing away from the substrate 301. Thus, the height of the light homogenizing film 102 on the substrate 301 is much greater than the height of the LED chip 302 on the substrate 301. The adhesive layer 103 provides mechanical protection for the LED chip 302 and enhances the stability of the encapsulation structure. The light homogenizing film 102 reduces the loss of light emitted by the LED chip 302, optimizes the light beam distribution, and makes the light more evenly distributed.

[0064] It should be noted that in step S1, based on the number of LED chips 302, the optical film layer 100 is cut and trimmed into a plurality of optical film pieces 101. The optical film layer 100 is cut and trimmed into optical film pieces 101 of any shape. The trimming shape and area are preset and specified by technicians based on the type of LED chip 302 used in the display module 300. Based on the same type of LED chip 302 on the same display module 300, the optical film layer 100 is cut and trimmed into a plurality of optical film pieces 101 of different shapes. The shape cut out from the optical film piece 101 can be any shape, such as a triangle, a circle, and a square, as long as it can completely cover the LED chip 302. In the present invention, the specific shape of the optical film piece 101 is not limited.

[0065] It should be noted that the optical film 101 of any shape completely covers the LED chip 302. One optical film 101 can cover one LED chip 302, or one optical film 101 can cover an array of LED chips 302. According to different application requirements and performance requirements, different coverage areas and coverage shapes are selected to meet specific optical performance and cost control requirements.

[0066] Among them, in a non-limiting embodiment, one optical film 101 covers one LED chip 302, and the optical film 101 and the LED chip 302 are in one-to-one correspondence, realizing the precise fitting of the optical film 101 and the LED chip 302, making the light emitted by each LED chip 302 more uniform in all directions, avoiding problems such as light spots and dark areas, and improving the uniformity of lighting or display.

[0067] Furthermore, covering an array of LED chips 302 with one optical film 101 can simplify the encapsulation process and reduce complex one-to-one alignment. The first alignment mark 303 can be set based on an array of LED chips 302, simplifying the alignment process and covering a larger area.

[0068] Furthermore, in step S2, at least two first alignment marks 303 are provided on the surface of the display module 300 according to the positions of the LED chips 302, and second alignment marks 203 corresponding to the first alignment marks 303 are provided on the carrier film 200.

[0069] Specifically, the alignment relationship between the first alignment mark 303 and the second alignment mark 203 is realized based on a mechanical alignment relationship or / and an optical alignment relationship.

[0070] It can be understood that mechanical alignment or optical alignment, or a combination of both is used. Mechanical alignment relies on mechanical structures and positioning devices, and optical alignment uses image recognition and processing technologies, which can achieve precise identification and positioning of alignment points. At the same time, mechanical alignment and optical alignment are adopted to make full use of the advantages of both to achieve higher alignment accuracy and stability.

[0071] Specifically, when the first alignment mark 303 and the second alignment mark 203 are aligned mechanically, mechanical structures such as guide rails, positioning pins, and limit blocks provided at the alignment marks are used to align the carrier film 200 and the LED chip 302; when aligned optically, the alignment marks of the carrier film 200 and the LED chip 302 are detected by the reflection or transmission of light beams, thereby achieving alignment.

[0072] It should be noted that as Figure 3 and Figure 5The first alignment mark 303 and the second alignment mark 203 shown are only for schematic display, and there are differences from the first alignment mark 303 and the second alignment mark 203 in the actual manufacturing process, but their functions are to achieve the alignment of the carrier film 200 and the LED chip 302.

[0073] Furthermore, in step S2, the optical film 101 is disposed at the second alignment mark 203 of the carrier film 200 to form the encapsulation film layer 201. The optical film 101 can be fixed on the carrier film 200 by mechanical fixing to form the encapsulation film layer 201, or the optical film 101 and the carrier film 200 can be combined by a thermocompression process relying on the thermoplastic property of the adhesive layer 103, or the optical film 101 and the carrier film 200 can be closely attached by a vacuum adsorption method to form the encapsulation film layer 201. In the present invention, the formation method of the encapsulation film layer 201 is not specifically limited as long as the stable connection between the optical film 101 and the carrier film 200 can be achieved.

[0074] Furthermore, in step S3, the first alignment mark 303 is made to correspond to the optical film 101 on the encapsulation film layer 201 one by one, and the encapsulation film layer 201 is attached to the display module 300 by a thermocompression process, including step S31: providing an encapsulation device 400, the encapsulation device 400 includes a pressing device 2 and a feeding device 4 arranged at an interval on the same side as the pressing device 2, and a heating device 3 is provided on the encapsulation device 400 corresponding to the display module 300; when the encapsulation film layer 201 is fed from the feeding device 4 until the first alignment mark 303 and the second alignment mark 203 correspond to each other one by one, the pressing device 2 applies pressure to press and attach the encapsulation film layer 201 to the display module 300; the heat of the heating device 3 is transmitted to the encapsulation film layer 201 through the display module 300, and the pressing device 2 thermocompression seals the encapsulation film layer 201 to the display module 300.

[0075] It can be understood that the pressing device 2 applies pressure to the encapsulation film layer 201 on the display module 300, and combines with the heat transmitted on the display module 300 to help the encapsulation film layer 201 better adhere to the display module 300, and can achieve the thermocompression and pressing encapsulation of the encapsulation film layer 201, making the adhering process fast and convenient.

[0076] Please refer to Figures 6 - 7, in step S31, a packaging device 400 is provided. When the first alignment mark 303 is aligned with the optical film 101 on the encapsulation film layer 201 one by one, the pressing device 2 presses the encapsulation film layer 201 against the display module 300. After being attached to the display module 300, the heat of the heating component is transferred to the encapsulation film layer 201 through the display module 300. The encapsulation film layer 201 can be more closely attached to the display module 300 when heated, and is encapsulated onto the display module 300. It is simply and quickly encapsulated onto the display module 300. The encapsulation film layer 201 completely covers the LED chip 302, with a heat transfer interval, and does not directly heat the encapsulation film layer 201, and the waiting curing time is short.

[0077] Furthermore, the packaging device 400 further includes a driving device 5. Before the pressing device 2 presses the encapsulation film layer 201 against the display module 300 in step S31, it further includes step S311: determining whether the alignment between the first alignment mark 303 and the second alignment mark 203 is accurate. If so, the pressing device 2 presses the encapsulation film layer 201 against the surface of the display module 300 where the LED chip 302 is provided; if not, the driving device 5 is controlled to drive the display module 300 and / or the encapsulation film layer 201 to realign.

[0078] It can be understood that before the pressing device 2 applies pressure to fit, it is first determined whether the alignment between the first alignment mark 303 and the second alignment mark 203 is accurate, and the position of the encapsulation film layer 201 above the display module 300 is adjusted based on the alignment.

[0079] Preferably, the alignment adjustment can be to control the driving device 5 to drive the display module 300 so that the first alignment mark 303 is completely aligned with the second alignment mark 203, or to control the driving device 5 to readjust the encapsulation film layer 201 above the display module 300, or to drive both of them to move together to achieve the best alignment between the first alignment mark 303 and the second alignment mark 203.

[0080] In a non-limiting embodiment, the packaging device 400 further includes a transmission device 1 that can move horizontally. The display module 300 is placed on the transmission device 1 of the packaging device 400 and moves horizontally. When controlling the driving device 5 to drive the display module 300 so that the first alignment mark 303 is completely aligned with the second alignment mark 203, it can be that the encapsulation film layer 201 is fixed, and the driving device 5 drives the transmission device 1 so that the first alignment mark 303 follows the transmission device 1 to move horizontally until it is detected that the first alignment mark 303 is completely aligned with the second alignment mark 203.

[0081] In another non - restrictive embodiment, the encapsulation device 400 further includes a discharging device 4 disposed on the same side as the pressurizing device 2. The encapsulation film layer 201 is discharged from the discharging device 4. When the control driving device 5 drives the display module 300 so that the first alignment mark 303 is completely aligned with the second alignment mark 203, it can be that the display module 300 is placed stationary on the encapsulation device 400, and the driving device 5 drives the discharging device 4 to move the already discharged encapsulation film layer 201 until it is detected that the first alignment mark 303 is completely aligned with the second alignment mark 203.

[0082] It should be noted that the encapsulation device 400 further includes a detection device 6. The detection device 6 can use a high - resolution camera and image - processing software to automatically identify the position and deviation of the alignment marks, or can also use laser scanning technology to measure the position deviation of the alignment marks.

[0083] It should be noted that a display module encapsulation method adopted in the present invention is applicable to the display module 300 with a flip - chip structure. The front of the LED chip 302 in the flip - chip structure has no electrode and wire bonding obstruction, and the encapsulation film layer 201 can be directly attached to the light - emitting front of the LED chip 302. While the LED chip 302 in the front - chip structure has gold wires exposed on the outside, and a protective gold wire needs to be placed in advance before encapsulating the optical film 101.

[0084] Please refer to Figure 8 - Figure 9 , the second embodiment of the present invention provides a display module 300 encapsulation system 500 for implementing a display module encapsulation method as provided in the first embodiment. The display module 300 encapsulation system 500 includes: a preparation mechanism 51: used for preparing the optical film layer 100, and cutting and tailoring the optical film layer 100 into a plurality of optical films 101 based on the number of LED chips 302;

[0085] A lamination mechanism 52, used for providing the carrier film 200. At least two first alignment marks 303 are provided on the surface of the display module 300 according to the positions of the LED chips 302, and second alignment marks 203 corresponding to the first alignment marks 303 are provided on the carrier film 200. The optical film 101 is disposed at the second alignment marks 203 of the carrier film 200 to form an encapsulation film layer 201;

[0086] A thermocompression lamination mechanism 53, used for making the first alignment marks 303 correspond to the optical films 101 on the encapsulation film layer 201 one by one, and laminating the encapsulation film layer 201 on the display module 300 through a thermocompression process.

[0087] Understandably, the preparation mechanism 51 is responsible for preparing and processing materials for encapsulation, such as the optical film layer 100 and the optical film sheet 101, ensuring the consistency of each batch of optical film sheets 101, and enabling a series of pretreatment steps such as cutting the optical film layer 100 to be completed quickly, improving the overall production efficiency, and laying a good foundation for the subsequent pressing and laminating processes; the pressing mechanism 52 presses the optical film sheet 101 onto the carrier film 200 by applying pressure. The carrier film 200 has a second alignment mark 203 corresponding to the first alignment mark 303 that marks the position of the LED chip 302, ensuring that the optical film sheet 101 pressed onto the carrier film 200 can be aligned neatly with the LED chip 302 during the subsequent encapsulation process. The thermal pressing and laminating mechanism 53 quickly laminates the encapsulation film layer 201 onto the display module 300 through the combined action of heating and pressure. By precisely controlling the temperature and pressure, the thermal pressing and laminating mechanism 53 can ensure uniform thickness of the materials, improving the quality and performance of the product.

[0088] Further, the pressing mechanism 52 includes a feeding device 4, and the feeding device 4 is used for feeding the encapsulation film layer 201 in the form of a coil.

[0089] Understandably, the encapsulation film layer 201 is uncoiled from the feeding device 4. The coil uncoiling automatically releases the coil, realizes continuous feeding, precisely controls the feeding length and tension, reduces losses, and saves costs. The coil uncoiling device 4 can accommodate coils of different widths, thicknesses, and materials.

[0090] Further, the thermal pressing and laminating mechanism 53 includes a transmission device 1 and a pressing device 2. A heating device 3 is arranged in the transmission device 1 corresponding to the display module 300. The pressing device 2 is used for pressing and attaching the encapsulation film layer 201 onto the display module 300, and the heating device 3 is used for heating the display module 300 and the encapsulation film layer 201.

[0091] Understandably, the feeding device 4 and the pressing device 2 are arranged on the same side, which helps the entire process of feeding the encapsulation film layer 201 to pressing and encapsulating to be smooth and efficient, reducing the operation difficulty.

[0092] As a non-limiting implementation, the pressing device 2 includes a pressing roller. The pressing roller provides uniform pressure through rolling, distributes the pressure evenly over the entire contact surface. The pressing roller is made of rubber with good elasticity and shock absorption performance, reducing bubbles and voids generated during the lamination of the encapsulation film layer 201 and the display module 300, and improving the lamination quality.

[0093] Further, the thermal pressing and laminating mechanism 53 further includes a detection device 6, and the detection device 6 is used for detecting the position deviation between the first alignment mark 303 and the second alignment mark 203.

[0094] Understandably, the detection device 6 can automatically identify and measure the deviation between the first alignment mark 303 and the second alignment mark 203 by using a machine vision sensing system, or a laser scanning technology can also be adopted to measure the positional deviation between the first alignment mark 303 and the second alignment mark 203. In the present invention, the detection method of the detection device 6 is not specifically limited, as long as it can quickly and accurately detect whether the first alignment mark 303 and the second alignment mark 203 are completely aligned.

[0095] The third embodiment of the present invention provides a display module 300, which is prepared by a display module encapsulation method provided in the first embodiment.

[0096] A display module 300 has the same beneficial effects as the above display module encapsulation method, and will not be elaborated here.

[0097] In the embodiments provided by the present invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0098] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present invention. Therefore, the "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. Those skilled in the art should also know that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to the present invention.

[0099] In various embodiments of the present invention, it should be understood that the magnitude of the sequence numbers of the above processes does not necessarily mean the inevitable sequence of execution. The execution sequence of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

[0100] The flowcharts and block diagrams in the accompanying drawings of the present invention illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagram may represent a module, a segment of a program, or a part of code that contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should be particularly noted that each block in the block diagram and / or flowchart, as well as combinations of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system that performs the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0101] Compared with the prior art, a display module encapsulation method, system, and display module provided by the present invention have the following beneficial effects:

[0102] 1. A display module encapsulation method provided by the present invention provides an encapsulation method that uses the carrying function of a carrier film to fix and support an optical film layer. Based on the professional experience of technicians and the product requirements, the optical film layer is cut into several optical film pieces corresponding to the number, type, size, and use of LED chips. The cut optical film pieces are pressed and attached to the carrier film to form an encapsulation film layer; attaching the optical film pieces made into a specific shape and size to the carrier film facilitates encapsulation operations and applications in different devices and processes, making the position adjustment of the optical film pieces in subsequent processing steps simpler and more efficient, and reducing the complexity of the encapsulation process; at least two first alignment marks are provided on the surface of the display module according to the positions of the LED chips, and a plurality of second alignment marks corresponding to the first alignment marks are provided on the carrier film. The carrier film has an alignment relationship with the LED chips, so indirectly there is also an alignment relationship between the encapsulation film layer formed by the optical film pieces and the carrier film and the LED chips. In essence, the carrier film serves as an intermediate carrier indirectly carrying the alignment relationship between the optical film pieces and the LED chips, helping the optical film pieces to be attached to the LEDs correspondingly, ensuring position accuracy, and the optical film pieces being attached to the carrier film facilitates the handling and operation of the optical film pieces. Especially for the cut optical film pieces that are small and difficult to directly pick up, the carrier film provides an operation carrier, reducing the operation difficulty.

[0103] 2. A display module encapsulation method provided by the present invention further includes providing an encapsulation device corresponding to the encapsulation method. The encapsulation device performs thermocompression bonding, cooperating with a heating device provided corresponding to the display module, and a pressurizing device of the device applies pressure to the encapsulation film layer to promote the one-time corresponding bonding of the encapsulation film layer. The encapsulation process of bonding under pressure and combined with heat is simple and easy to operate. At the same time, since the heating device is arranged inside the encapsulation device and does not directly contact the encapsulation film layer, after the bonding is completed, the encapsulation film layer can be cured more quickly. When the first alignment mark on the encapsulation film layer corresponds one by one with the second alignment mark on the display module, the heat of the heating component is transmitted to the encapsulation film layer through the display module, and the encapsulation film layer can be bonded more closely to the display module when heated. The optical film is corresponding to the LED chip and completely covers the LED chip. There is a heat transfer interval and the optical film is not directly heated, and the waiting curing time is short.

[0104] 3. A display module encapsulation method provided by the present invention, during the display module encapsulation process, through the alignment judgment of the first alignment mark and the second alignment mark, if the alignment is complete, the encapsulation film layer is thermocompression bonded to the display module by combining the pressurizing device and the heating device of the encapsulation device; if the alignment is inaccurate, the corresponding driving device is controlled to drive the display module and / or the encapsulation film layer to perform re-alignment, improving the encapsulation accuracy, reducing errors, meeting the requirements of high-density encapsulation, detecting and automatically adjusting in real time during the encapsulation process, reducing manual intervention and downtime; the re-alignment can be to make the first alignment mark coincide with the second alignment mark by driving the display module to perform axial movement in the horizontal direction, or to adjust the distance between the encapsulation module and the LED chip.

[0105] 4. A display module encapsulation method provided by the present invention, the optical film layer is used for protection and encapsulation. The method includes a pre-synthesis step of the optical film layer. The optical film layer is formed by laminating a light homogenizing film and an adhesive layer. The adhesive layer makes the connection between the light homogenizing film and other components more stable, enhancing the stability when subjected to external force impact or long-term use, and ensuring the stable performance of the light homogenizing function; the light homogenizing film scatters and refracts the light emitted by a point light source or a non-uniform light source, making the light evenly distributed within a certain area, reducing the brightness difference, improving the illumination uniformity. In the encapsulated display module, the light homogenizing film can make the light emitted by the LED chip more uniform, improving the display quality and visual comfort, and reducing visual fatigue caused by uneven light.

[0106] 5. A display module packaging method provided by the present invention, in which the glue layer is directly attached to the LED chip, the light homogenizing film is stacked with the glue layer, and after packaging, the light homogenizing film faces away from the side of the LED chip. The height of the glue layer on the substrate is greater than or equal to the height of the LED chip on the substrate, so the height of the light homogenizing film on the substrate is much greater than the height of the LED chip on the substrate, further improving the light output uniformity, making the light emitted by the light-emitting chip more stable and the display effect better.

[0107] 6. The embodiment of the present invention also provides a display module packaging system, which has the same beneficial effects as the above-mentioned display module packaging method and will not be elaborated here.

[0108] 7. In a display module packaging system provided by the present invention, the optical film is a flexible and thin material. When it is carried by single-piece clamping, it is easy to deform or be damaged. The optical film is arranged on the carrier film. The carrier film has a certain strength and provides support for the optical film to protect the optical film from being scratched or contaminated by dust during transportation and packaging. The combination of the carrier film and the optical film enhances the mechanical strength. Therefore, the composite packaging film layer can be fed continuously in a long size through the coiling device, realizing continuous feeding, reducing the number of times of manual intervention and the number of times the material is exposed to the environment, reducing the risk of operation errors and the risk of dust adsorption or external force scratching. Coiling feeding can also be compatible with various different types of packaging film layers.

[0109] 8. In a display module packaging system provided by the present invention, the transmission device is combined with the pressurizing device and the heating device to realize the process of thermally pressing and attaching the packaging film layer to the display module. The heating device preheats the display module, and the display module transfers heat to the packaging film layer at intervals to activate the glue layer on the packaging film layer and realize the attachment of the glue layer to the display module. The heating device always remains in a working state after the packaging process starts, reducing the process interval; the pressurizing device accurately applies pressure to the display module and synchronously completes pressing and curing in combination with the heating device, shortening the packaging time to meet the requirements of complex materials and processes. The transmission device transports and drives the display module. The three work together to accurately control multiple elements such as heating temperature, pressurizing pressure, and heating time, avoiding defects such as incomplete attachment and air bubbles, and improving the quality of thermocompression bonding.

[0110] 9. In a display module packaging system provided by the present invention, the detection device is used to detect the position deviation between the first alignment mark and the second alignment mark. During the packaging process, the detection device continuously detects the position deviation between the first alignment mark and the second alignment mark, eliminating the need for manual sampling inspection and reducing the debugging time; if the deviation is within a reasonable range, the pressurizing device applies pressure correspondingly to attach the packaging film to the display module. If the deviation exceeds the reasonable range, various adjustment mechanisms can be used for alignment adjustment.

[0111] 10. The embodiment of the present invention further provides a display module, which is prepared by the display module encapsulation method as described above and has the same beneficial effects as the above display module encapsulation method, which will not be elaborated herein.

[0112] The above has introduced in detail a display module encapsulation method, system and display module disclosed in the embodiments of the present invention. Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A display module encapsulation method, the display module including an LED chip, characterized in that: The method comprises the following steps: preparing an optical film layer, and cutting the optical film layer into a plurality of optical film sheets based on the number of the LED chips; Providing a carrier film, wherein the surface of the display module is provided with at least two first alignment marks according to the position of the LED chip, and the carrier film is provided with a second alignment mark corresponding to the first alignment mark, and the optical film is arranged at the second alignment mark on the carrier film to form an encapsulation film layer; The first alignment marks are aligned one-to-one with the optical films on the packaging film layer, and the packaging film layer is attached to the display module through a hot pressing process.

2. The display module packaging method according to claim 1, characterized in that The method comprises: placing the first alignment mark in one-to-one correspondence with the optical film on the packaging film layer, and laminating the packaging film layer on the display module through a hot pressing process, comprising: A packaging device is provided, the packaging device comprising a pressurizing device and a discharge device spaced apart from the pressurizing device on the same side, wherein a heating device is provided on the packaging device corresponding to the display module; When the packaging film layer is discharged from the discharge device until the first alignment mark corresponds to the second alignment mark one by one, the pressurizing device presses the packaging film layer to attach it to the display module; The heat of the heating device is transferred to the packaging film layer through the display module, and the pressurizing device heat-presses and packages the packaging film layer onto the display module.

3. The display module encapsulation method according to claim 2, wherein: The packaging device further includes a driving device, and the pressurizing device applies pressure to press the packaging film layer onto the display module, including: Determine whether the first alignment mark and the second alignment mark are accurately aligned. If so, the pressurizing device presses the packaging film layer to adhere it to the side of the display module where the LED chip is set; if not, control the driving device to drive the display module and / or the packaging film layer to realign.

4. The display module packaging method according to claim 1, characterized in that: The preparation of the optical film layer includes: A light-homogenizing film and an adhesive layer are provided, and the light-homogenizing film and the adhesive layer are superimposed and pressed into an optical film layer through a hot pressing process.

5. The display module packaging method according to claim 4, wherein: The display module further includes a substrate, the LED chip is arranged on the substrate, and laminating the packaging film layer on the display module through a hot pressing process further includes: The adhesive layer is directly attached to the LED chip, the light uniforming film covers the side of the LED chip away from the substrate, and the height of the adhesive layer on the substrate is greater than or equal to the height of the LED chip on the substrate.

6. A display module packaging system for implementing the display module packaging method according to any one of claims 1-5, characterized in that: The system comprises: Preparation mechanism: used for preparing the optical film layer, and cutting the optical film layer into a plurality of optical film sheets based on the number of the LED chips; A pressing mechanism is used to provide the carrier film, wherein the surface of the display module is provided with at least two first alignment marks according to the position of the LED chip, and the carrier film is provided with second alignment marks corresponding to the first alignment marks, and the optical film is arranged at the second alignment marks on the carrier film to form an encapsulation film layer; A hot pressing bonding mechanism is used to make the first alignment mark correspond one-to-one with the optical film on the packaging film layer, and bond the packaging film layer to the display module through a hot pressing process.

7. The display module packaging system according to claim 6, wherein: The lamination mechanism includes a feeding device for feeding the encapsulation film layer in the form of a coil.

8. The display module packaging system according to claim 6, wherein: The hot press lamination mechanism includes a transmission device and a pressing device. A heating device is provided in the transmission device corresponding to the display module. The pressing device is used to press and attach the encapsulation film layer onto the display module, and the heating device is used to heat the display module and the encapsulation film layer.

9. The display module packaging system according to claim 8, wherein: The hot press lamination mechanism further includes a detection device for detecting the position deviation between the first alignment mark and the second alignment mark.

10. A display module, characterized in that, The display module is prepared by the display module encapsulation method according to any one of claims 1 to 5.

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