Optical module

Abstract

An optical module (200) includes an optical fiber adapter (700), an optical housing member (500), a laser assembly (431), and a multiplexing assembly (490), the laser assembly (431) emitting optical signals of a plurality of wavelengths, the multiplexing assembly (490) including a first multiplexing member (4341) configured to reflect the optical signal of the first wavelength and a second multiplexing member (4342) configured to reflect the optical signal of the second wavelength, the first multiplexing member (4341) configured to reflect the optical signal of the second wavelength, and the second multiplexing member (4342) configured to reflect the optical signal of the second wavelength. The second combiner (4342) is configured to reflect one of the first wavelength optical signal and the second wavelength optical signal, and transmit the other of the first wavelength optical signal and the second wavelength optical signal to achieve beam combination.

Description

optical modules

[0001] This disclosure claims the priority of application number 202420062434.3 filed with the China Patent Office on January 10, 2024; the priority of application number 202323186443.8 filed with the China Patent Office on November 23, 2023; the priority of application number 202323173880.6 filed with the China Patent Office on November 23, 2023; the priority of application number 202323186404.8 filed with the China Patent Office on November 23, 2023; the priority of application number 202311542497.5 filed with the China Patent Office on November 17, 2023; and the priority of application number 202311539987.X filed with the China Patent Office on November 17, 2023; all of which are incorporated by reference into this disclosure. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are key components in optical communication equipment. Furthermore, the transmission rates of optical modules are constantly increasing as optical communication technology evolves.

[0004] Summary of the Invention

[0005] The present disclosure provides an optical module, comprising:

[0006] Fiber optic adapter, one end of which is used to connect to an external optical fiber;

[0007] The optical housing component includes a first housing and a first upper cover, the first upper cover being connected to the first housing; wherein one end of the first housing is connected to the other end of the optical fiber adapter, the other end of the first housing is formed with a notch, and a fifth connection hole is formed on the side wall of the other end of the first housing; one side of the first housing is connected to the first light receiving component and the second light receiving component, and the one side of the first housing extends from the side edge of the one end of the first housing to the side edge of the notch; a second baffle is formed in the first housing, one side of the second baffle supporting and connecting the first optical filter, and the other side of the second baffle is provided with a fourth displacement prism, one end of the fourth displacement prism is located on the side of the fifth connection hole, and the other end of the fourth displacement prism is located on the side of the first optical filter;

[0008] The light emitting component, located in the sleep cavity, includes:

[0009] A laser assembly for emitting a first wavelength optical signal and a second wavelength optical signal;

[0010] A combining component is configured to combine multiple beams of first wavelength optical signals and second wavelength optical signals into one beam; the combining component includes a first combining component and a second polarization combining component, the first combining component is configured to reflect the first wavelength optical signal, the second combining component is configured to reflect one of the first wavelength optical signal and the second wavelength optical signal and transmit the other of the first wavelength optical signal and the second wavelength optical signal to achieve beam combining. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0012] FIG1 is a partial structural diagram of an optical communication system according to some embodiments;

[0013] FIG2 is a partial structural diagram of a host computer according to some embodiments;

[0014] FIG3 is a structural diagram of an optical module according to some embodiments;

[0015] FIG4 is an exploded view of an optical module according to some embodiments;

[0016] FIG5 is a first schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure;

[0017] FIG6 is a second schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure;

[0018] FIG7 is an exploded schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0019] FIG8 is a cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0020] FIG9 is an exploded schematic diagram of a light emitting device according to some embodiments of the present disclosure;

[0021] FIG10 is a partial schematic diagram 1 of a light emitting device according to some embodiments of the present disclosure;

[0022] FIG11 is a second partial schematic diagram of a light emitting device according to some embodiments of the present disclosure;

[0023] FIG12 is a schematic diagram of an optical path of a light emitting device according to some embodiments of the present disclosure;

[0024] FIG13 is an exploded schematic diagram of a beam combiner provided according to some embodiments of the present disclosure;

[0025] FIG14 is an exploded view of a light emitting component according to some embodiments;

[0026] FIG15 is an exploded view of a first optical assembly and a transmitting housing according to some embodiments;

[0027] FIG16 is a structural diagram of a launch housing according to some embodiments;

[0028] FIG17 is a light path diagram of a first optical component according to some embodiments;

[0029] FIG18 is another optical path diagram of the first optical component according to some embodiments;

[0030] FIG19 is a combined optical path diagram of a first optical component and a second optical component according to some embodiments;

[0031] FIG20 is a schematic diagram illustrating the optical axis of a wave plate, the polarization direction of an incident light signal, and the polarization direction of an outgoing light signal according to some embodiments;

[0032] FIG21 is an exploded view of a supporting member, a second polarization combining member, and a third polarization combining member according to some embodiments;

[0033] FIG22 is a structural diagram of a supporting member according to some embodiments;

[0034] FIG23 is a structural diagram of a supporting member provided in another perspective according to some embodiments;

[0035] FIG24 is a cross-sectional view of a support member according to some embodiments;

[0036] FIG25 is a schematic structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0037] FIG26 is an exploded schematic diagram 1 of a light emitting component according to some embodiments of the present disclosure;

[0038] FIG27 is a second exploded schematic diagram of a light emitting component according to some disclosed embodiments;

[0039] FIG28 is a schematic diagram of a partial structure of a light emitting component according to some disclosed embodiments;

[0040] FIG29 is a second schematic diagram of a partial structure of a light emitting component according to some disclosed embodiments;

[0041] FIG30 is a third schematic diagram of a partial structure of another light emitting component provided according to some disclosed embodiments;

[0042] FIG31 is a schematic diagram 1 of a multiplexing component provided according to some disclosed embodiments;

[0043] FIG32 is a first schematic diagram of a decomposition of a multiplex component according to some disclosed embodiments;

[0044] FIG33 is a second schematic diagram of a multiplexing component provided according to some disclosed embodiments;

[0045] FIG34 is a schematic diagram of an optical path of a multiplexing component according to an embodiment;

[0046] FIG35 is a third schematic diagram of a multiplexing component provided according to some disclosed embodiments;

[0047] FIG36 is a first structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0048] FIG37 is a second structural diagram of a light emitting component provided according to some embodiments of the present disclosure;

[0049] FIG38 is an exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0050] FIG39 is a schematic diagram of a partial structure of a light emitting component according to some embodiments of the present disclosure;

[0051] FIG40 is a second schematic diagram of a partial structure of a light emitting component according to some embodiments of the present disclosure;

[0052] FIG41 is a third schematic diagram of a partial structure of a light emitting component provided according to some embodiments of the present disclosure;

[0053] FIG42 is a first cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0054] FIG43 is a second cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0055] FIG44 is a third cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0056] FIG45 is a transmission optical path diagram of an optical transmission signal according to some embodiments of the present disclosure;

[0057] FIG46 is a first structural diagram of a mounting bracket according to some embodiments of the present disclosure;

[0058] FIG47 is a second structural diagram of a mounting bracket according to some embodiments of the present disclosure;

[0059] FIG48 is a diagram illustrating a mounting bracket in use according to some embodiments of the present disclosure;

[0060] FIG49 is a structural diagram of a fiber optic adapter and a transceiver cavity according to some embodiments;

[0061] FIG50 is an exploded view of a fiber optic adapter and a transceiver cavity according to some embodiments;

[0062] FIG51 is a cross-sectional view of a fiber optic adapter and a transceiver cavity according to some embodiments;

[0063] FIG52 is an exploded view of a transceiver cavity according to some embodiments;

[0064] FIG53 is a structural diagram of a transceiver housing according to some embodiments;

[0065] FIG54 is a light path diagram of a second optical assembly according to some embodiments;

[0066] FIG55 is a first structural schematic diagram of a first housing according to some embodiments of the present disclosure;

[0067] FIG56 is an exploded schematic diagram of a first housing according to some embodiments of the present disclosure;

[0068] FIG57 is a second structural schematic diagram of a first housing according to some embodiments of the present disclosure;

[0069] FIG58 is a first view of a first housing in use according to some embodiments of the present disclosure;

[0070] FIG59 is a second diagram illustrating a first housing in use according to some embodiments of the present disclosure;

[0071] Figure 60 is a cross-sectional view of an optical receiving component provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0072] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0073] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0074] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0075] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0076] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments. As shown in Figure 1 , the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 , and a network cable 103 .

[0077] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0078] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0079] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0080] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0081] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0082] Figure 2 is a partial structural diagram of a host computer provided according to some embodiments. To clearly illustrate the connection between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has raised structures such as fins to increase the heat dissipation area.

[0083] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0084] Figure 3 is a structural diagram of an optical module provided according to some embodiments, and Figure 4 is an exploded view of an optical module provided according to some embodiments. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500.

[0085] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0086] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0087] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0088] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical port, from which the gold finger of the circuit board 300 extends and is inserted into the electrical connector of the host computer 100; opening 205 is an optical port, which is configured to connect to the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.

[0089] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, and the light receiving component 500 within the housing. The upper housing 201 and the lower housing 202 provide encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0090] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0091] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0092] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0093] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LIAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0094] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0095] The circuit board 300 also includes a gold finger formed on the surface of its end, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0096] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger.

[0097] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0098] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0099] The optical emitting component and the optical receiving component constitute the optical transceiver component, which is electrically connected to the circuit board 300. The optical emitting component is the transmitting end of the optical transceiver component, and the optical receiving component is the receiving end of the optical transceiver component. Both the transmitting end and the receiving end of the optical transceiver component are electrically connected to the circuit board 300.

[0100] FIG5 is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure, and FIG6 is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure. As shown in FIG5 and FIG6, one end of the optical receiving component 500 is connected to the optical fiber adapter 700, and the other end of the optical receiving component 500 is connected to the optical emitting component 400. The optical signal generated by the optical emitting component 400 is first transmitted to the optical receiving component 500, then transmitted to the optical fiber adapter 700 through the optical receiving component 500, and finally output through the optical fiber adapter 700; the external input optical signal is input to the optical receiving component 500 through the optical fiber adapter 700, so that the optical receiving component 500 and the optical emitting component 400 share the optical fiber adapter 700, thereby allowing the uplink optical signal and the downlink optical signal of the optical module to share the optical fiber 101.

[0101] In some embodiments, the optical transmitting component 400 generates optical transmit signals of multiple wavelengths and is capable of combining the optical transmit signals of multiple wavelengths into a single optical transmit signal. The optical receiving component 500 is provided with multiple optical receiving components, enabling the optical receiving component 500 to receive optical receive signals comprising multiple wavelengths. For example, the optical transmitting component 400 generates optical transmit signals of three wavelengths, each having different rates, such as a first wavelength optical signal, a second wavelength optical signal, and a third wavelength optical signal having different rates. The optical receiving component 500 receives optical receive signals of three wavelengths, each having different rates, such as a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal having different rates.

[0102] In some embodiments, the wavelength range of the first wavelength optical signal is 1340-1344 nm, such as the wavelength of the first wavelength optical signal is 1342 nm; the wavelength range of the second wavelength optical signal is 1575-1580 nm, such as the wavelength of the second wavelength optical signal is 1577 nm; the wavelength range of the third wavelength optical signal is 1480-1500 nm, such as the wavelength of the third wavelength optical signal is 1490 nm; the wavelength range of the fourth wavelength optical signal is 1260-1280 nm, such as the wavelength of the fourth wavelength optical signal is 1270 nm; the wavelength range of the fifth wavelength optical signal is 1284-1288 nm, such as the wavelength of the fifth wavelength optical signal is 1286 nm; and the wavelength range of the sixth wavelength optical signal is 1290-1330 nm, such as the wavelength of the sixth wavelength optical signal is 1310 nm.

[0103] In some embodiments, the receiving rates of the photodetector in the first light receiving component 530, the receiving rates of the photodetector in the second light receiving component 540, and the receiving rates of the photodetector in the third light receiving component 550 are different. For example, the receiving rate of the photodetector in the second light receiving component 540 is greater than the receiving rate of the photodetector in the first light receiving component 530, and the receiving rate of the photodetector in the second light receiving component 540 is greater than the receiving rate of the photodetector in the third light receiving component 550. This ensures that the optical path of the fifth wavelength optical signal with the highest transmission rate from the output of the wavelength division multiplexer 564 to the photodetector is relatively short and the optical path is simplest, so that the photodetector in the second light receiving component 540 can receive the optical signal with high coupling efficiency. For example, the receiving rate of the photodetector in the first light receiving component 530 is 10G, the receiving rate of the photodetector in the second light receiving component 540 is 50G, and the receiving rate of the photodetector in the third light receiving component 550 is 2.5G.

[0104] In some embodiments, the optical receiving component 500 includes a first shell 510 and a first upper cover 520, and the first shell 510 and the first upper cover 520 are connected to form a first cavity. A first light receiving component 530, a second light receiving component 540 and a third light receiving component 550 are provided on the side wall of the first shell 510. A receiving chamber is formed inside the first cavity, which is used to accommodate devices and realize connection or communication between devices. Exemplarily, a displacement prism, a reflector, etc. are provided in the receiving chamber. In some embodiments, an inner cavity is provided on the first shell 510, so that the first upper cover 520 covers the first shell 510 to form a receiving chamber; the first upper cover 520 is located on the side of the first shell 510 facing the cover plate 2011.

[0105] In some embodiments, one end of the first housing 510 is connected to the fiber optic adapter 700, and the other end of the first housing 510 is connected to the light emitting component 400. A first light receiving component 530, a second light receiving component 540, and a third light receiving component 550 are disposed on one side of the first housing 510. This allows the fiber optic adapter 700, the light emitting component 400, the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 to be encapsulated within the first housing 510, thereby optically connecting the fiber optic adapter 700, the light emitting component 400, the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 to the first receiving cavity. The light emitting component 400, the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 are electrically connected to the circuit board 300 via a flexible circuit board.

[0106] In some embodiments, the optical transmission component 400 includes a second housing 410 and a second upper cover 420. The second upper cover 420 covers and connects to the second housing 410 to form a second cavity. A plurality of pins 430 are provided on the sidewalls of the second housing 410. Within the second housing 410 are located components for generating and transmitting optical transmission signals. The pins 430 connect to a flexible printed circuit board (FPCB) for electrical connection to the circuit board 300. For example, one end of the second housing 410 connects to the other end of the first housing 510; the second upper cover 420 is located on the side of the second housing 410 facing the base plate 2021.

[0107] In some embodiments, multiple rows of pins are respectively disposed on two connected side walls of the second housing 410 , and the pins in the bottom row of the two connected side walls include high-frequency pins.

[0108] In some embodiments, the bottom of the first housing 510 is provided with an inclined surface 510a, which slopes from the bottom of the first housing 510 toward the other end of the first housing 510 to facilitate the avoidance of tooling associated with assembling the light emitting component 400. For example, when the second upper cover 420 and the second housing 410 are connected by seam welding, the inclined surface 510a avoids the seam welding machine.

[0109] In some embodiments, the optical module includes multiple flexible circuit boards. For example, the light emitting component 400 is electrically connected to the circuit board 300 via two flexible circuit boards, and the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 are electrically connected to the circuit board 300 via corresponding flexible circuit boards.

[0110] FIG7 is a schematic diagram of an exploded view of the internal structure of an optical module provided according to some embodiments of the present disclosure. As shown in FIG7 , the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 are coaxially packaged. For example, a first connection hole 511, a second connection hole 512, and a third connection hole 513 are provided on the side wall of the first shell 510, and the first connection hole 511, the second connection hole 512, and the third connection hole 513 are respectively connected to the first accommodating cavity; the first light receiving component 530 is embedded in the first connection hole 511, the second light receiving component 540 is embedded in the second connection hole 512, and the third light receiving component 550 is embedded in the third connection hole 513.

[0111] The other end of the first housing 510 is formed with a notched corner 510b, located to the side of the third connection hole 513. A connection seat 5101 is disposed within the notched corner 510b. One end of the connection seat 5101 is connected to a side wall of the first housing 510, and the other end of the connection seat 5101 is connected to the second housing 410. Exemplarily, the connection seat 5101 is integrally formed with the first housing 510. A fifth connection hole 5102 is disposed on the connection seat 5101, connecting the first housing 510 and the second housing 410.

[0112] In some examples, the optical emitting component 400 can generate optical signals of two wavelengths.

[0113] FIG8 is a cross-sectional view of a light-emitting component provided according to some embodiments of the present disclosure. FIG9 is a schematic diagram of an exploded view of a light-emitting device provided according to some embodiments of the present disclosure. As shown in FIG8 and FIG9, the light-emitting component 400 provided in the present disclosure includes a tube base 410, a tube cap 420, and other components disposed within the tube cap 420 and the tube base 410. The tube cap 420 is disposed on one end of the tube base 410. The tube base 410 includes a plurality of pins 430, which are used to electrically connect the flexible circuit board to other electrical components within the light-emitting component, thereby electrically connecting the light-emitting component 400 to the circuit board 300. This embodiment only uses the structure shown in FIG5 as an example.

[0114] The tube cap is buckled onto the tube base 410 to form a light emitting space, and the first light emitting component 450, the second light emitting component 470, the first collimating lens 460, the second collimating lens 480, and the combiner (in some examples, also called a combiner component) 490 are arranged inside the light emitting space.

[0115] The base 410 is used to support and carry the first light emitting assembly 450, the second light emitting assembly 470, the first collimating lens 460, the second collimating lens 480, and the beam combiner 490. The base 410 is provided with a plurality of through holes for fixing the pins.

[0116] To increase optical communication rates, an optical module is configured with multiple optical channels, each carrying a different signal. Multiple channels refers to at least two optical channels. Different optical channels carry different signals. Therefore, multiple optical receiving channels are configured within the optical receiving component to simultaneously receive multiple signal beams. In the embodiments of the present disclosure, the multiple signal beams include two signal beams.

[0117] In some embodiments of the present disclosure, a light window 421 is provided at the top of the tube cap 420 to facilitate the emission of the second optical signal emitted by the optical emitting component from within the optical emitting space. The second optical signal includes a first signal light and a second signal light, wherein the first signal light and the second signal light have different wavelengths, for example, the first signal light has a wavelength of λ1 and the second signal light has a wavelength of λ2.

[0118] Figure 10 is a partial schematic diagram of a light emitting device according to some embodiments of the present disclosure. Figure 11 is a partial schematic diagram of a light emitting device according to some embodiments of the present disclosure. Figure 12 is a schematic diagram of the optical path of a light emitting device according to some embodiments of the present disclosure. As shown in Figures 10-12, in some embodiments, a semiconductor cooler 440 is provided within the light emitting space, and the semiconductor cooler 440 is located on the tube base 410. A first substrate 411 is provided above the semiconductor cooler 440, and the first substrate 411 is used to support the first light emitting assembly 450, the first collimating lens 460, and the second substrate 412.

[0119] The first optical transmission assembly 450 is positioned on the first substrate 411 and includes a first base plate 451 and a first COC structure 452. The first base plate 451 is positioned between the first COC structure 452 and the first substrate 411. The first base plate 451 is used to elevate the first COC structure 452 to facilitate coupling between the first optical transmission assembly and the first collimating lens 460. This ensures that the optical axis of the first signal light emitted by the first optical transmission assembly is aligned with the central axis of the first collimating lens 460. The first COC structure 452 emits the first signal light. The light emitted by the first COC structure 452 is divergent light.

[0120] The first collimating lens 460 is located at the light-emitting side of the first light emitting assembly 450 , and the first collimating lens 460 collimates the first signal light.

[0121] The second substrate 412 is located on the first substrate 411. The second substrate 412 is used to carry the beam combiner (in some examples, it can also be called a wave combining component) 490, the second collimating lens 480, and the second light emitting component 470. The second substrate is located on the first substrate 411 and provides a flat mounting platform for carrying the beam combiner 490, the second collimating lens 480, and the second light emitting component 470. The second substrate 412 is located on one side of the first collimating lens 460, and one end of the second substrate 412 extends to the outside of the first substrate to increase the surface area of ​​the second substrate 412. A TEC pin 432 is provided below the second substrate 412, and the height of the upper surface of the TEC pin 432 is lower than the lower surface of the second substrate 412. The TEC pin is electrically connected to the semiconductor cooler to realize power supply to the semiconductor cooler.

[0122] A beam combiner 490 is located above the second substrate 412 and on the light-exiting side of the first collimating lens 460. The beam combiner 490 reflects the first signal light and changes its angle, shifting the propagation direction of the first signal light from parallel to the base to perpendicular to the base. After passing through the beam combiner 490, the first signal light is directed toward the light window 421.

[0123] A third substrate 413 is provided above the second substrate 412. The third substrate 413 is used to support the second collimating lens 480 and the second light emitting assembly 470. The second signal light emitted by the second light emitting assembly 470 is collimated by the second collimating lens 480 and then redirected by the beam combiner 490 toward the light window.

[0124] The beam combiner 490 is located between the first collimating lens and the second collimating lens, and combines the first signal light and the second signal light into one beam.

[0125] In some embodiments, the beam combiner 490 is provided with a first reflective layer 491 and a second reflective layer 492. The angle between the first reflective layer 491 and the second reflective layer 492 is 90°. The first signal light after passing through the first collimating lens 460 is located below the angular bisector of the first and second reflective layers 491 and 492. The second signal light after passing through the second collimating lens 480 is located above the angular bisector of the first and second reflective layers 491 and 492. The central axis of the first optical transmission assembly is lower than the angular bisector of the first and second reflective layers; the central axis of the second optical transmission assembly is higher than the angular bisector of the first and second reflective layers.

[0126] Therefore, the vertical distance between the second light emitting assembly and the first substrate is greater than the vertical distance between the first light emitting assembly and the first substrate.

[0127] After being reflected by the first reflective layer 491 , the first signal light is transmitted through the second reflective layer 492 , and is combined with the second signal light reflected by the second reflective layer 492 into one beam.

[0128] In some embodiments, to reduce the space occupied by the light emitting components, the height difference between the first light emitting assembly and the second light emitting assembly may be adjusted so that the channels of the combined first signal light and the second signal light overlap.

[0129] FIG13 is an exploded schematic diagram of a beam combiner provided according to some embodiments of the present disclosure. As shown in FIG13 , beam combiner 490 includes a first right-angle prism 4901, a second right-angle prism 4902, and a third right-angle prism 4903. One right-angle side of second right-angle prism 4902 is connected to the hypotenuse of first right-angle prism 4901, and the other right-angle side of second right-angle prism 4902 is connected to the hypotenuse of third right-angle prism 4903. First right-angle prism 4901 and second right-angle prism 4902 are connected by optical adhesive; third right-angle prism 4903 and second right-angle prism 4902 are also connected by optical adhesive.

[0130] The first reflective layer 491 is located at the connection between the first right-angle prism 4901 and the second right-angle prism 4902 , and the first signal light is reflected by the first reflective layer 491 .

[0131] The second reflective layer 492 is located at the connection between the third right-angle prism 4903 and the second right-angle prism 4902 . The first signal light is transmitted through the second reflective layer 492 , and the second signal light is reflected by the second reflective layer 492 .

[0132] The first right-angle prism 4901 includes a first right-angled surface 4911, a second right-angled surface 4912, and a first inclined surface 4913. The second right-angled prism 4902 includes a third right-angled surface 4921, a fourth right-angled surface 4922, and a second inclined surface 4923. The third right-angled prism 4903 includes a fifth right-angled surface 4931, a sixth right-angled surface 4932, and a third inclined surface 4933. The first inclined surface 4913 is connected to the third right-angled surface 4921; the fourth right-angled surface 4922 is connected to the third inclined surface 4933. The second inclined surface 4923 is perpendicular to the first substrate and faces the first light emitting assembly.

[0133] In some embodiments, in order to improve the coupling efficiency of the first signal light, the second inclined surface is provided with a first anti-reflection film to increase the transmittance of the first signal light and reduce reflection.

[0134] In order to improve the coupling efficiency of the second signal light, a second anti-reflection film is provided on the fifth right-angled surface to increase the transmittance of the second signal light and reduce reflection.

[0135] The sixth right-angled surface is provided with a third anti-reflection film to increase the transmittance of the first signal light and the second signal light and reduce reflection.

[0136] In some embodiments of the present disclosure, in order to shorten the bonding length between the pins and the optical emission component, a plurality of power supply pins 431 are further provided. The upper surface of the power supply pins 431 is higher than the upper surface of the TEC pins 432 .

[0137] The present embodiment provides an optical transmission component, including: a tube base 410, a tube cap 420, and other components disposed within the tube cap 420 and tube base 410. The tube base 410 includes a first substrate, which supports a first optical transmission assembly and a second substrate. A beam combiner and a second optical transmission assembly are disposed on the second substrate. The beam combiner is located between the first and second optical transmission assemblies. The beam combiner changes the propagation direction of the first and second signal lights and combines the first and second signal lights into a single beam. The beam combiner includes a first reflective layer 491 and a second reflective layer 492. The angle between the first and second reflective layers 491 and 492 is 90°. After passing through the first collimating lens 460, the first signal light is located below the angular bisector of the first and second reflective layers 491 and 492. After passing through the second collimating lens 480, the second signal light is located above the angular bisector of the first and second reflective layers 491 and 492.

[0138] One end of the second substrate extends beyond the first substrate to increase the surface area of ​​the second substrate 412. TEC pins 432 are located below the second substrate 412. The top surface of the TEC pins 432 is lower than the bottom surface of the second substrate 412. The TEC pins are electrically connected to the semiconductor cooler to provide power to the cooler.

[0139] In some embodiments, the first light emitting chip in the first light emitting assembly is an EML laser. The wavelength of the first signal light is 1577 nm. The second light emitting chip in the second light emitting assembly is a DFB laser. The wavelength of the first signal light is 1490 nm.

[0140] Figure 14 is an exploded view of an optical transmission component according to some embodiments. Figure 15 is an exploded view of a second optical component and a transmission housing according to some embodiments. Figure 16 is a structural diagram of a transmission housing according to some embodiments. As shown in Figures 14, 5, and 16, an optical transmission component 400 includes a transmission cover 401 and a transmission housing 402. The transmission cover 401 covers the transmission housing 402 to form a transmission cavity. A first optical component 403 is disposed within the transmission cavity and is used to transmit optical signals.

[0141] In some embodiments, the first end of the transmitting housing 402 is provided with a third through hole 4211. A light window is positioned within the third through hole 4211, configured to transmit the transmitted light signal and seal the light hole. The light window is embedded within the third through hole 4211 to seal the third through hole 4211; the light window can be made of transparent glass. The light window seals the third through hole 4211, allowing the transmitted light signal to pass through while also sealing the third through hole 4211 to ensure the sealing performance of the transmitting housing 402. In some embodiments, the light window may also be embedded in a connection with the fourth through hole 51321.

[0142] In some embodiments, a notch is provided at the second end of the launch housing 402, and the notch passes through the second end of the launch housing 402. One end of the first circuit board 301 is embedded in the notch, that is, one end of the first circuit board 301 passes through the notch and extends into the inner cavity of the launch housing 402.

[0143] In some embodiments, a first optical assembly 403 is disposed within the inner cavity of the transmitting housing 402. The first optical assembly 403 includes a laser assembly 431. The laser assembly 431 is positioned near one end of the first circuit board 301 to facilitate electrical connection of the laser assembly 431 to the first circuit board 301. The laser assembly 431 is configured to transmit multiple optical signals of different wavelengths. Exemplarily, the laser assembly 431 is connected to the first circuit board 301 by wire bonding.

[0144] In some embodiments, a socket 4234 is provided at the second end of the launch shell 402, and the socket 4234 passes through the second end of the launch shell 402. The first end of the launch pin 405 is connected to the second circuit board 302, and the second end of the launch pin 405 passes through the socket 4234 and extends into the inner cavity of the launch shell 402.

[0145] In some embodiments, a first optical assembly 403 is disposed within the inner cavity of the transmitting housing 402. The first optical assembly 403 includes a laser assembly 431. Laser assembly 431 is positioned near one end of the transmitting pin 405 to facilitate electrical connection of laser assembly 431 to the transmitting pin 405. Laser assembly 431 is configured to transmit multiple optical signals of different wavelengths. Exemplarily, laser assembly 431 is connected to transmitting pin 405 via wire bonding.

[0146] In some embodiments, the first optical component 403 further includes a lens component 432 , which is disposed on the optical path from the laser component 431 to the combiner component for collimating the optical signal generated by the laser component 431 and transmitting it to the combiner component.

[0147] In some embodiments, the first optical component 403 further includes a combining component, which is used to combine multiple optical signals of different wavelengths emitted by the laser component 431 into one transmitted optical signal.

[0148] As shown in Figures 14, 15, and 16, in some embodiments, the second end of the transmitting housing 402 is provided with multiple jacks 4234. The multiple jacks 4234 include a first jack and a second jack. The first jack is closer to the bottom of the transceiver housing 402. The first jack is used to insert a first transmitting pin, and the second jack is used to insert a second transmitting pin, thereby reducing signal crosstalk between the first transmitting pin and the second transmitting pin. The first transmitting pin is a rate-dependent transmitting pin 405, and the second transmitting pin is a rate-independent transmitting pin 405.

[0149] As shown in Figures 14 and 15, in some embodiments, a first soldering pad 406 is further provided at the second end of the transmitting shell 402, one end of the first soldering pad 406 is welded to the first transmitting pin located on the first socket, and the other end of the first soldering pad 406 is wired to the soldering pad where the laser component 431 is located.

[0150] In some embodiments, the first optical component 403 is fixed in the emission cavity through the substrate 404, and the soldering pad where the laser component 431 is located is connected to the first soldering pad 406 by wire bonding, so that the soldering pad where the laser component 431 is located is flush with the height of the first soldering pad 406, thereby shortening the wire bonding length between the soldering pad where the laser component 431 is located and the first soldering pad 406.

[0151] In some embodiments, the launch housing 402 has an opening. For example, the launch housing 402 includes a first launch side panel 421, a second launch side panel 422, a third launch side panel 423, a fourth launch side panel 424, and a launch bottom panel 425. The first launch side panel 421, the second launch side panel 422, the third launch side panel 423, and the fourth launch side panel 424 are connected end to end, and the first launch side panel 421, the second launch side panel 422, the third launch side panel 423, and the fourth launch side panel 424 are all connected to the launch bottom panel 425 to form a launch cavity having an opening.

[0152] The first emitting side plate 421 has a third through hole 4211 .

[0153] The third launching side panel 423 includes a first sub-launching side panel 4231, a second sub-launching side panel 4232 and a third sub-launching side panel 4233. The first sub-launching side panel 4231 is connected to the launching base panel 425. The distances between the first sub-launching side panel 4231, the second sub-launching side panel 4232 and the third sub-launching side panel 4233 and the launching base panel 425 increase successively. The first sub-launching side panel 4231, the second sub-launching side panel 4232 and the third sub-launching side panel 4233 are connected successively so that the third launching side panel 423 is stepped.

[0154] A first solder pad 406 is provided on the surface of the first sub-emitting side panel 4231 facing the opening of the emission housing 402. A first socket is provided on the surface of the second sub-emitting side panel 4232 facing the laser assembly 431. The first socket passes through the second sub-emitting side panel 4232 to facilitate insertion of the first emission pin from the emission housing 402 into the emission housing 402. A first socket is provided on the surface of the third sub-emitting side panel 4233 facing the laser assembly 431. A second socket passes through the third sub-emitting side panel 4233 to facilitate insertion of the second emission pin from the emission housing 402 into the emission housing 402.

[0155] The first jack passes through the second sub-transmitting side panel 4232, and the second jack passes through the third sub-transmitting side panel 4233. The second sub-transmitting side panel 4232 and the third sub-transmitting side panel 4233 are stepped, so as to extend the distance between the first jack and the second jack in the length direction of the transmitting shell 402, reduce the distance between the first jack and the second jack in the height direction of the transmitting shell 402, and thereby reduce the signal crosstalk between the first transmitting pin inserted into the first jack and the second transmitting pin inserted into the second jack.

[0156] The fourth emitting side panel 424 includes a fourth sub-emitting side panel 4241 and a fifth sub-emitting side panel 4242. One side surface of the fourth sub-emitting side panel 4241 is connected to the emitting bottom panel 425, and the other side surface of the fourth sub-emitting side panel 4241 is connected to the fifth sub-emitting side panel 4242, so that the fourth emitting side panel 424 is stepped; one end of the fourth sub-emitting side panel 4241 is connected to the first emitting side panel 421, and the other end of the fourth sub-emitting side panel 4241 is connected to the first sub-emitting side panel 4231; one end of the fifth sub-emitting side panel 4242 is connected to the first emitting side panel 421, and the other end of the fifth sub-emitting side panel 4242 is connected to the second sub-emitting side panel 4232 and the third sub-emitting side panel 4233.

[0157] One end of the fourth sub-emitting side plate 4241 is connected to the first emitting side plate 421 , and the fourth sub-emitting side plate 4241 is connected to the first sub-emitting side plate 4231 to reduce the storage space of the emitting cavity and further limit the substrate 404 .

[0158] Figure 17 is an optical path diagram of a first optical assembly according to some embodiments. Figure 18 is another optical path diagram of the first optical assembly according to some embodiments. Figure 19 is a combined optical path diagram of the first and second optical assemblies according to some embodiments. As shown in Figures 17, 18, and 19, laser assembly 431 includes a first laser assembly 4311, a second laser assembly 4312, and a third laser assembly 4313. Second laser assembly 4312 is located between first laser assembly 4311 and third laser assembly 4313. The light output directions of first laser assembly 4311, second laser assembly 4312, and third laser assembly 4313 are directed toward the multiplexing assembly. In some embodiments, first laser assembly 4311 emits an optical signal of a first wavelength, second laser assembly 4312 emits an optical signal of a second wavelength, and third laser assembly 4313 emits an optical signal of a third wavelength. The optical axes of the first, second, and third wavelength optical signals are parallel to the longitudinal extension of the transmitting housing. Exemplarily, the wavelength range of the first wavelength optical signal is 1340-1344 nm, such as the wavelength of the first wavelength optical signal is 1342 nm; the wavelength range of the second wavelength optical signal is 1480-1500 nm, such as the wavelength of the second wavelength optical signal is 1490 nm; the wavelength range of the third wavelength optical signal is 1575-1580 nm, such as the wavelength of the third wavelength optical signal is 1577 nm.

[0159] In some embodiments, the transmission rate of the first laser assembly 4311 is greater than the transmission rate of the third laser assembly 4313, and the transmission rate of the third laser assembly 4313 is greater than the transmission rate of the second laser assembly 4312. For example, the transmission rate of the first laser assembly 4311 is 50G, the transmission rate of the second laser assembly 4312 is 2.5G, and the transmission rate of the third laser assembly 4313 is 10G.

[0160] In some embodiments, the light-emitting end faces of the first laser assembly 4311, the second laser assembly 4312 and the third laser assembly 4313 are not flush, that is, the light-emitting end faces of the first laser assembly 4311, the second laser assembly 4312 and the third laser assembly 4313 are located on different length surfaces of the emitting shell.

[0161] In some embodiments, first laser assembly 4311, second laser assembly 4312, and third laser assembly 4313 utilize a chip-on-carrier (COC) package, which can also be referred to as chip-on-ceramic substrate (CPC). Therefore, the side profiles of first laser assembly 4311, second laser assembly 4312, and third laser assembly 4313 are relatively regular, such as rectangular.

[0162] In some embodiments, lens assembly 432 includes a first lens 4321, a second lens 4322, and a third lens 4323. First lens 4321 is disposed on the optical transmission path from first laser assembly 4311 to the combiner assembly, second lens 4322 is disposed on the optical transmission path from second laser assembly 4312 to the combiner assembly, and third lens 4323 is disposed on the optical transmission path from third laser assembly 4313 to the combiner assembly. In some embodiments, first lens 4321, second lens 4322, and third lens 4323 are disposed on substrate 404. However, embodiments of the present disclosure are not limited to first lens 4321, second lens 4322, and third lens 4323 being disposed on substrate 404.

[0163] In some embodiments, the combining component includes a wavelength division multiplexer, the input side of the wavelength division multiplexer faces the laser component, and the output side of the wavelength division multiplexer faces the third through hole 4211. The wavelength division multiplexer combines the optical signal of the first wavelength, the optical signal of the second wavelength, and the optical signal of the third wavelength emitted by the laser component 431 into one optical signal.

[0164] In some embodiments, the wavelength combining component includes a plurality of optical filters, which cooperate with each other to combine the optical signal of the first wavelength, the optical signal of the second wavelength, and the optical signal of the third wavelength into one optical signal.

[0165] In some embodiments, the combining assembly includes a polarization assembly 433 and a polarization combining assembly 434. Polarization assembly 433 is used to adjust the polarization direction of the optical signal, and polarization combining assembly 434 combines multiple polarized beams into a single beam. The polarization assembly adjusts the polarization direction of the optical signal, and then combines the multiple polarized beams into a single beam by the polarization combining assembly, thereby achieving wave combining in the optical emitting component.

[0166] As shown in FIG17 , in some embodiments, the polarization component 433 includes a first polarization component 4331, a second polarization component 4332, and a third polarization component 4333. The first polarization component 4331 is located in the light-emitting direction of the first laser assembly 4311 and is used to adjust the deflection direction of the first wavelength optical signal emitted by the first laser assembly 4311 so that the polarization direction of the first wavelength optical signal is horizontal, i.e., horizontally polarized light. The second polarization component 4332 is located in the light-emitting direction of the second laser assembly 4312 and is used to adjust the deflection direction of the second wavelength optical signal emitted by the second laser assembly 4312 so that the polarization direction of the second wavelength optical signal is vertical, i.e., second vertically polarized light. The third polarization component 4333 is located in the light-emitting direction of the third laser assembly 4313 and is used to adjust the deflection direction of the third wavelength optical signal emitted by the third laser assembly 4313 so that the polarization direction of the third wavelength optical signal is vertical, i.e., first vertically polarized light.

[0167] In some examples, the polarization combining component may include a first combining component and a second combining component, the first combining component may be configured to reflect a first wavelength optical signal, the second combining component may be configured to reflect one of the first wavelength optical signal and the second wavelength optical signal, and transmit the other of the first wavelength optical signal and the second wavelength optical signal.

[0168] In some examples, the positions of the first and second wavelength combining elements can be interchanged. For example, in some examples, the second wavelength combining element can be configured to reflect the first wavelength optical signal, and the first wavelength combining element can be configured to reflect one of the first wavelength optical signal and the second wavelength optical signal and transmit the other of the first wavelength optical signal and the second wavelength optical signal.

[0169] In some examples, the first wavelength multiplexing element is configured to reflect one of the first wavelength optical signal and the second wavelength optical signal and transmit the other of the first wavelength optical signal and the second wavelength optical signal as a specific example for illustration.

[0170] As shown in Figure 17, in some embodiments, the polarization combining component 434 includes a first polarization combining component (in some examples, it can also be called the first combining component) 4341, a second polarization combining component (in some examples, it can also be called the second combining component) 4342 and a third polarization combining component (in some examples, it can also be called the third combining component) 4343. The first polarization combining component 4341 is located on the left side of the first polarization component 4331 and between the third through hole 4211 and the first polarization component 4331. The first polarization combining component 4341 is used to transmit the horizontally polarized light (horizontally polarized light) of the first wavelength optical signal, and is also used to reflect the vertically polarized light (second vertical polarized light) of the second wavelength optical signal and the vertically polarized light (first vertical polarized light) of the third wavelength optical signal, and then combine the three into one optical signal. The second polarization combiner 4342 is located to the left of the second polarization component 4332. The second polarization combiner 4342 is configured to reflect the vertically polarized light (second vertically polarized light) of the second wavelength optical signal to the first polarization combiner 4341, and to transmit the vertically polarized light (first vertically polarized light) of the third wavelength optical signal to the first polarization combiner 4341. The third polarization combiner 4343 is located to the left of the third polarization component 4333. The third polarization combiner 4343 is configured to reflect the vertically polarized light (first vertically polarized light) of the third wavelength optical signal to the second polarization combiner 4342.

[0171] In some embodiments, the first polarization combining element 4341 is a polarization beam splitter, which can transmit horizontally polarized light and reflect vertically polarized light to achieve beam combining. For example, the first vertically polarized light and the second vertically polarized light are reflected by the polarization beam splitter, while the horizontally polarized light is transmitted by the polarization beam splitter to achieve beam combining.

[0172] In some embodiments, the second polarization combiner 4342 is a filter that can reflect the second wavelength optical signal and transmit the third wavelength optical signal to achieve beam combining. The second polarization combiner 4342 is tilted relative to the central axis of the second polarization component 4332. For example, the angle between the second polarization combiner 4342 and the central axis of the second polarization component 4332 is 45°.

[0173] In some embodiments, the third polarization combiner 4343 is a reflector that reflects the third wavelength optical signal. The third polarization combiner 4343 is tilted relative to the central axis of the third polarization component 4333. For example, the angle between the third polarization combiner 4343 and the central axis of the third polarization component 4333 is 45°.

[0174] The polarization component 433 and the polarization combining component 434 shown in Figure 22 are placed in the transmitting shell 402. The third through hole 4211 of the transmitting shell 402 is coaxial with the third polarization combining component 4343. The opening of the transmitting shell 402 is facing downward in the opposite direction to the opening of the transceiver shell.

[0175] As shown in FIG18 , in some embodiments, a first polarization component 4331 is used to adjust the deflection direction of a first wavelength optical signal emitted by the first laser assembly 4311 so that the polarization direction of the first wavelength optical signal is vertical, i.e., first vertically polarized light. A second polarization component 4332 is used to adjust the deflection direction of a second wavelength optical signal emitted by the second laser assembly 4312 so that the polarization direction of the second wavelength optical signal is vertical, i.e., second vertically polarized light. A third polarization component 4333 is used to adjust the deflection direction of a third wavelength optical signal emitted by the third laser assembly 4313 so that the polarization direction of the third wavelength optical signal is horizontal, i.e., horizontally polarized light.

[0176] As shown in FIG18 , in some embodiments, a third polarization combiner 4343 is located between the third through-hole 4211 and the third polarization component 4333. The first polarization combiner 4341 is configured to reflect the vertically polarized light (first polarized light) of the first wavelength optical signal to the second polarization combiner 4342. The second polarization combiner 4342 is configured to reflect the vertically polarized light (second vertical polarized light) of the second wavelength optical signal to the third polarization combiner 4343, and further configured to transmit the vertically polarized light (first polarized light) of the first wavelength optical signal to the third polarization combiner 4343. The third polarization combiner 4343 is configured to transmit the horizontally polarized light (horizontally polarized light) of the third wavelength optical signal and reflect the vertically polarized light (first polarized light) of the first wavelength optical signal and the vertically polarized light (second vertical polarized light) of the second wavelength optical signal to achieve beam combining.

[0177] In some embodiments, the first polarization combiner 4341 is a reflector that reflects the first wavelength optical signal. The first polarization combiner 4341 is tilted relative to the central axis of the first polarization component 4331. For example, the angle between the first polarization combiner 4341 and the central axis of the first polarization component 4331 is 45°.

[0178] In some embodiments, the second polarization combiner 4342 is a filter that can reflect the second wavelength optical signal and transmit the first wavelength optical signal to achieve beam combining. The second polarization combiner 4342 is arranged at an angle relative to the central axis of the second polarization component 4332. For example, the angle between the second polarization combiner 4342 and the central axis of the second polarization component 4332 is 45°.

[0179] In some embodiments, the third polarization combiner 4343 is a polarization beam splitter that can transmit horizontally polarized light and reflect vertically polarized light to achieve beam combining. For example, the first vertically polarized light and the second vertically polarized light are reflected by the polarization beam splitter, while the horizontally polarized light is transmitted by the polarization beam splitter to achieve beam combining.

[0180] The polarization component 433 and the polarization combining component 434 shown in Figure 18 are placed in the transmitting shell 402. The third through hole 4211 of the transmitting shell 402 is coaxial with the third polarization combining component 4343. The opening direction of the transmitting shell 402 is the same as the downward direction of the opening of the transceiver shell.

[0181] As shown in FIG17 , the first wavelength optical signal emitted by the first laser assembly 4311 is transmitted to the first lens 4321, collimated by the first lens 4321, and transmitted to the first polarization component 4331. The polarization direction of the first wavelength optical signal is adjusted by the first polarization component 4331 before being transmitted to the first polarization combiner 4341. The second wavelength optical signal emitted by the second laser assembly 4312 is transmitted to the second lens 4322, collimated by the second lens 4322, and transmitted to the second polarization component 4332. The polarization direction of the second wavelength optical signal is adjusted by the second polarization component 4332 before being transmitted to the second polarization combiner 4342. The third wavelength optical signal emitted by the third laser assembly 4313 is transmitted to the third lens 4323, collimated by the third lens 4323, and transmitted to the third polarization component 4333. The polarization direction of the third wavelength optical signal is adjusted by the third polarization component 4333 before being transmitted to the third polarization combiner 4343. The third polarization combiner 4343 reflects the vertically polarized light of the third wavelength optical signal to the second polarization combiner 4342. The second polarization combiner 4342 reflects the vertically polarized light of the second wavelength optical signal to the first polarization combiner 4341 and transmits the vertically polarized light of the third wavelength optical signal to the first polarization combiner 4341. The first polarization combiner 4341 transmits the horizontally polarized light of the first wavelength optical signal and reflects the vertically polarized light of the second wavelength optical signal and the third wavelength optical signal, so that the horizontally polarized light of the first wavelength optical signal, the vertically polarized light of the second wavelength optical signal, and the vertically polarized light of the third wavelength optical signal are combined into one optical signal.

[0182] As shown in FIG19 , after the horizontally polarized light of the first wavelength optical signal, the vertically polarized light of the second wavelength optical signal, and the third wavelength optical signal are combined into a beam of optical signals, the optical signal is first adjusted in the Y direction by the first displacement prism 5171 and then incident on the first filter 5172. Then, the optical signal is incident on the second displacement prism 5173 through the first filter 5172. Then, the optical signal is adjusted in the Y direction by the second displacement prism 5173 and incident on the fourth lens 5174. Finally, the optical signal is converged by the fourth lens 5174.

[0183] FIG20 is a schematic diagram illustrating the optical axis of a wave plate, the polarization direction of an incident light signal, and the polarization direction of an outgoing light signal according to some embodiments. As shown in FIG19 , a is the polarization direction of the incident light signal, b is the optical axis of the first wave plate, and c is the polarization direction of the outgoing light signal. FIGA is a schematic diagram illustrating that the polarization direction of an outgoing light signal obtained after the incident light signal with a polarization direction of 45° passes through the wave plate is horizontal, FIGB is a schematic diagram illustrating that the polarization direction of an outgoing light signal obtained after the incident light signal with a polarization direction of 135° passes through the wave plate is horizontal, FIGC is a schematic diagram illustrating that the polarization direction of an outgoing light signal obtained after the incident light signal with a polarization direction of 45° passes through the wave plate is vertical, and FIGC is a schematic diagram illustrating that the polarization direction of an outgoing light signal obtained after the incident light signal with a polarization direction of 135° passes through the wave plate is vertical. As shown in FIG20 , in some embodiments, the wave plate is a half-wave plate, and the incident linearly polarized light passes through the half-wave plate to emit linearly polarized light. The characteristic of a half-wave plate is that the polarization direction of the incident light and the polarization direction of the outgoing light are symmetrical with respect to the optical axis of the half-wave plate.

[0184] The following only uses the polarization component 433 and the polarization combining component 434 shown in Figure 17 as an example to introduce the beam combining principle of the optical emitting component. Since the optical signal after the polarization combining component combines includes a vertical polarization state and a horizontal polarization state, if a structural component for reverse isolation is provided after the polarization combining component, then at least two isolators need to be provided after the polarization combining component to play a reverse isolation role. Therefore, an isolator can be provided before the polarization combining component. Since the isolator includes a first polarizer, a Faraday plate, and a second polarizer, an isolator is provided before the polarization combining component, and the optical signal emits non-horizontally polarized light and non-vertically polarized light after passing through the isolator. In order to make the optical signal emit horizontally polarized light or vertically polarized light after passing through the polarization component, it is necessary to add a wave plate after the second polarizer. Non-horizontally polarized light emits horizontally polarized light after passing through the wave plate, and non-vertically polarized light emits horizontally polarized light or vertically polarized light after passing through the wave plate. The reverse isolation principle of the isolator is as follows: the Faraday plate rotates in the same direction, and the polarized light passing through the first polarizer cannot return to the first polarizer after the Faraday rotation, so that the isolator composed of the first polarizer, the Faraday plate and the second polarizer has a reverse isolation effect.

[0185] In some embodiments, the first polarization component 4331, the second polarization component 4332 and the third polarization component 4333 all include a first polarizer, a Faraday plate, a second polarizer and a wave plate. The first polarizer, the Faraday plate, the second polarizer and the wave plate are sequentially away from the first laser component. The first wavelength light signal emitted by the first laser component passes through the first polarizer, the Faraday plate, the second polarizer and the wave plate in sequence and is emitted. The angle between the optical axis of the wave plate and the horizontal plane is a preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to horizontal polarized light or vertical polarized light after passing through the wave plate. For example, the angle between the optical axis of the wave plate of the first polarization component 4331 and the horizontal plane is a first preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to horizontal polarized light after passing through the wave plate; the angle between the optical axis of the wave plate of the second polarization component 4332 and the horizontal plane is a second preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to vertical polarized light after passing through the wave plate; the angle between the optical axis of the wave plate of the third polarization component 4333 and the horizontal plane is a third preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to vertical polarized light after passing through the wave plate.

[0186] The first preset angle is different from the second preset angle.

[0187] The polarization direction of the second polarizer of the second polarization assembly is the same as the polarization direction of the second polarizer of the third polarization assembly, so that the second preset angle is the same as the third preset angle.

[0188] In some embodiments, the first polarizer is a horizontal polarizer, and the second polarizer is a 45° polarizer. For example, the first polarization component 4331 includes a horizontal polarizer, a Faraday plate, and a 45° polarizer, the second polarization component 4332 includes a horizontal polarizer, a Faraday plate, and a 45° polarizer, and the third polarization component 4333 includes a horizontal polarizer, a Faraday plate, and a 45° polarizer.

[0189] In some embodiments, the first polarizer is a vertical polarizer, and the second polarizer is a 135° polarizer. For example, the first polarization component 4331 includes a vertical polarizer, a Faraday plate, and a 135° polarizer, the second polarization component 4332 includes a vertical polarizer, a Faraday plate, and a 135° polarizer, and the third polarization component 4333 includes a vertical polarizer, a Faraday plate, and a 135° polarizer.

[0190] In some embodiments, a first polarizer, a Faraday plate, and a second polarizer are sequentially connected to form an isolator. A wave plate is located outside the isolator and is mounted on substrate 404. For example, a horizontal polarizer, a Faraday plate, and a 45° polarizer are sequentially connected to form an isolator; a vertical polarizer, a Faraday plate, and a 135° polarizer are sequentially connected to form an isolator. In some embodiments, the first polarizer, the Faraday plate, and the second polarizer are sequentially bonded using glue.

[0191] In some embodiments, a first polarizer, a Faraday plate, a second polarizer, and a wave plate are sequentially connected to form an isolator. This not only facilitates the mounting of the wave plate but also reduces the space required for the transmitter housing. For example, a horizontal polarizer, a Faraday plate, a 45° polarizer, and a wave plate are sequentially connected to form an isolator; a vertical polarizer, a Faraday plate, a 135° polarizer, and a wave plate are sequentially connected to form an isolator. In some embodiments, the first polarizer, Faraday plate, second polarizer, and wave plate are sequentially bonded using glue.

[0192] Since the structures of the first polarization component 4331, the second polarization component 4332 and the third polarization component 4333 are the same, only the optical axis angles of the wave plates are slightly different. Instead of introducing each polarization component in detail, only the first polarization component 4331 and the second polarization component 4332 are used as examples to introduce the polarization components.

[0193] Taking the first polarization assembly 4331 as an example, the first polarization assembly 4331 includes a horizontal polarizer, a Faraday plate, a 45° polarizer, and a first wave plate. The horizontal polarizer, Faraday plate, 45° polarizer, and first wave plate are sequentially positioned away from the first laser assembly 4311. After passing through the horizontal polarizer, Faraday plate, and 45° polarizer, the optical signal emits 45° polarized light. As shown in A of FIG19 , 45° polarized light (i.e., an incident light signal with a 45° polarization direction) is polarized by the first wave plate to obtain horizontal polarized light (i.e., an outgoing light signal with a horizontal polarization direction). The optical axis of the first wave plate is obtained by rotating the polarization direction of the incident light signal clockwise by 22.5°. That is, the angle between the optical axis of the first wave plate and the horizontal plane is a first preset angle of 22.5°.

[0194] In some embodiments, the horizontal polarizer, the Faraday plate, and the 45° polarizer are sequentially connected to form a fourth isolator, and the first wave plate is located outside the fourth isolator.

[0195] In some embodiments, a horizontal polarizer, a Faraday plate, a 45° polarizer, and a first wave plate are sequentially connected to form a first isolator.

[0196] In some embodiments, the first polarization assembly 4331 includes a vertical polarizer, a Faraday plate, a 135° polarizer, and a first wave plate. The vertical polarizer, Faraday plate, 135° polarizer, and first wave plate are sequentially positioned away from the first laser assembly 4311. After the optical signal passes through the vertical polarizer, Faraday plate, and 135° polarizer, it emits 135° polarized light. As shown in FIG20B , the 135° polarized light (i.e., the incident light signal with a 135° polarization direction) is polarized by the first wave plate to obtain horizontally polarized light (i.e., the outgoing light signal with a horizontal polarization direction). The optical axis of the first wave plate is obtained by rotating the polarization direction of the incident light signal counterclockwise by 22.5°. That is, the angle between the optical axis of the first wave plate and the horizontal plane is a first predetermined angle, which is 157.5°.

[0197] In some embodiments, the vertical polarizer, the Faraday plate, and the 135° polarizer are sequentially connected to form a fourth isolator, and the first wave plate is located outside the fourth isolator.

[0198] In some embodiments, a vertical polarizer, a Faraday plate, a 135° polarizer, and a first wave plate are sequentially connected to form a first isolator.

[0199] The above configuration does not consider adjusting the magnetic poles of the first or fourth isolators. If the magnetic poles of the fourth isolator are adjusted, the fourth isolator includes a vertical polarizer, a Faraday plate, and a 45° polarizer. If the magnetic poles of the first isolator are adjusted, the first isolator includes a vertical polarizer, a Faraday plate, a 45° polarizer, and a first wave plate. The first wave plate's optical axis forms an angle of 22.5° with the horizontal plane.

[0200] Taking the second polarization assembly 4332 as an example, the second polarization assembly 4332 includes a horizontal polarizer, a Faraday plate, a 45° polarizer, and a second wave plate. The horizontal polarizer, Faraday plate, 45° polarizer, and second wave plate are sequentially spaced away from the second laser assembly 4312. After passing through the horizontal polarizer, Faraday plate, and 45° polarizer, the optical signal emits 45° polarized light. As shown in C of FIG20 , the 45° polarized light (i.e., the incident light signal with a 45° polarization direction) is polarized by the second wave plate to obtain vertically polarized light (i.e., the outgoing light signal with a vertical polarization direction). The optical axis of the second wave plate is obtained by rotating the polarization direction of the incident light signal counterclockwise by 22.5°. That is, the angle between the optical axis of the second wave plate and the horizontal plane is a second preset angle, which is 67.5°.

[0201] In some embodiments, the horizontal polarizer, the Faraday plate, and the 45° polarizer are sequentially connected to form a fifth isolator, and the second wave plate is located outside the fifth isolator.

[0202] In some embodiments, a horizontal polarizer, a Faraday plate, a 45° polarizer, and a second wave plate are sequentially connected to form a second isolator.

[0203] In some embodiments, the second polarization assembly 4332 includes a vertical polarizer, a Faraday plate, a 135° polarizer, and a second wave plate. The vertical polarizer, Faraday plate, 135° polarizer, and second wave plate are sequentially positioned away from the second laser assembly 4312. After the optical signal passes through the vertical polarizer, Faraday plate, and 135° polarizer, it emits 135° polarized light. As shown in D of FIG19 , the 135° polarized light (i.e., the incident light signal with a 135° polarization direction) is polarized by the second wave plate to obtain vertically polarized light (i.e., the outgoing light signal with a vertical polarization direction). The optical axis of the second wave plate is obtained by rotating the polarization direction of the incident light signal clockwise by 22.5°. That is, the angle between the optical axis of the second wave plate and the horizontal plane is a second predetermined angle, which is 112.5°.

[0204] In some embodiments, the vertical polarizer, the Faraday plate, and the 135° polarizer are sequentially connected to form a fifth isolator, and the second wave plate is located outside the fifth isolator.

[0205] In some embodiments, a vertical polarizer, a Faraday plate, a 135° polarizer, and a second wave plate are sequentially connected to form a second isolator.

[0206] The above configuration does not consider adjusting the magnetic poles of the second or fifth isolators. If the magnetic poles of the fifth isolator are adjusted, the fifth isolator will include a vertical polarizer, a Faraday plate, and a 45° polarizer. If the magnetic poles of the second isolator are adjusted, the second isolator will include a vertical polarizer, a Faraday plate, a 45° polarizer, and a second wave plate. The angle between the optical axis of the second wave plate and the horizontal plane is 67.5°.

[0207] The third polarization component 4333 may include a sixth isolator and a third wave plate, or may include a third isolator, wherein the third isolator includes a third wave plate, and the third wave plate is positioned at a third predetermined angle with the horizontal plane. Both the third polarization component 4333 and the second polarization component 4332 function to adjust the deflection direction of the optical signal so that the polarization direction of the optical signal is vertical. Therefore, the sixth isolator is identical to the fifth isolator, and the third isolator is identical to the second isolator, and their details are not further described here.

[0208] The sixth isolator is the same as the fifth isolator, which means that the sixth isolator can be any embodiment of the fifth isolator; the third isolator is the same as the second isolator, which means that the third isolator can be any embodiment of the second isolator.

[0209] FIG21 is an exploded view of a supporting member, a second polarization combining member, and a third polarization combining member provided according to some embodiments. As shown in FIG21 , a supporting member 407 is further provided on the substrate 404. One side of the supporting member 407 supports the third polarization combiner 4343, and the other side of the supporting member 407 supports the second polarization combiner 4342. The third polarization combiner 4343 is arranged parallel to the second polarization combiner 4342. The supporting member 407 is provided with a first through hole, one end of which is connected to the third polarization combiner 4343, and the other end of the first through hole is directed toward the third polarization component 4333, so that the vertically polarized light of the third wavelength optical signal emitted by the third polarization component 4333 is incident on the third polarization combiner 4343 through the first through hole. The supporting member 407 is also provided with a second through hole, one end of which is connected to the second polarization combiner 4342, and the other end of the second through hole is connected to the third polarization combiner 4343, so that the third wavelength optical signal reflected by the third polarization combiner 4343 is reflected to the second polarization combiner 4342 through the second through hole.

[0210] Figure 22 is a structural diagram of a supporting member provided according to some embodiments. Figure 23 is a structural diagram of a supporting member provided according to some embodiments from another perspective. Figure 24 is a cross-sectional view of a supporting member provided according to some embodiments. As shown in Figures 22, 23 and 24, in some embodiments, the side surface of the supporting member 407 includes a first limiting surface 471, a first supporting surface 472, a second limiting surface 473, a first connecting surface 474, a second connecting surface 475, a third limiting surface 476, a second supporting surface 477, a third connecting surface and a fourth connecting surface, and the first limiting surface 471, the first supporting surface 472, the second limiting surface 473, the first connecting surface 474, the second connecting surface 475, the third limiting surface 476, the second supporting surface 477, the third connecting surface and the fourth connecting surface are connected in sequence. The first supporting surface 472 supports the third polarization combining component 4343, and the first limiting surface 471, the first supporting surface 472 and the second limiting surface 473 are connected in sequence to form a recessed limiting groove to limit the third polarization combining component 4343; the first connecting surface 474 is in contact and connected with the fourth sub-emitting side plate 4241 of the fourth emitting side plate 424, and the second connecting surface 475 faces the third polarization component 4333; the second supporting surface 477 supports the second polarization combining component 4342, and the third limiting surface 476 is connected to the second supporting surface 477 to form a recessed limiting groove to limit the second polarization combining component 4342.

[0211] In some embodiments, the first supporting surface 472 and the second supporting surface 477 are arranged in parallel to ensure that the vertically polarized light of the third wavelength optical signal reflected by the third polarization combiner 4343 is reflected to the second polarization combiner 4342 as much as possible.

[0212] As shown in Figures 22, 23 and 24, one end of the first through hole 478 is located at the second connecting surface 475, the other end of the first through hole 478 is located at the first supporting surface 472, one end of the second through hole 479 is located at the first supporting surface 472, and the other end of the second through hole 479 is located at the second supporting surface 477. The first through hole 478 is connected to the second through hole 479, so that the third polarization combiner 4343 receives the vertical polarized light of the third wavelength optical signal through the first through hole 478, and reflects the vertical polarized light of the third wavelength optical signal to the second polarization combiner 4342 through the second through hole 479.

[0213] Figure 25 is a schematic diagram of the structure of a light emitting component provided according to some embodiments of the present disclosure. Figure 26 is a first exploded schematic diagram of a light emitting component provided according to some embodiments of the present disclosure. As shown in Figures 25 and 26, the light emitting component 400 includes a second cavity 410, which includes a second shell 411 and a second upper cover 412. The second shell 411 forms an inner cavity, and the second upper cover 412 covers and connects to the second shell 411, forming a relatively sealed cavity structure with the second shell 411.

[0214] A connecting portion 4112 is provided on the side of the second cavity 410 , and the second cavity 410 is connected to the first shell 510 via the connecting portion 4112 , so that the connection between the second cavity 410 and the first shell 510 is conveniently achieved through the connecting portion 4112 .

[0215] As shown in Figure 25, a fixing surface 4111 is provided on the top of the second shell 411, and the second upper cover 412 is fixedly connected to the fixing surface 4111; a first through hole 4113 is provided on the second shell 411, and the first through hole 4113 is connected to the inner cavity of the second shell 411 and the first through hole 4113 is connected to the connecting part 4112. The first through hole 4113 is connected to the fifth connecting hole through the connecting part 4112, and the first through hole 4113 is used to output optical signals.

[0216] In some embodiments, the light emitting component 400 includes an isolator 420 . Exemplarily, the isolator 420 is disposed in the first through hole 4113 , seals the first through hole 4113 , and prevents the optical signal output from the first cavity through the fifth connection hole 5151 from entering the second cavity 410 .

[0217] In some embodiments, a transfer block 430 is disposed at the other end of the second housing 411. Transfer block 430 is used to electrically connect the electrical components within the second cavity 410 to the circuit board 300. Exemplarily, transfer block 430 is embedded in the other end of the second housing 411, with one end of transfer block 430 extending into the second housing 411 and the other end of transfer block 430 located outside the second housing 411. Transfer block 430 is electrically connected to circuit board 300 via a flexible circuit board. In some embodiments, transfer block 430 utilizes a ceramic substrate, but is not limited to ceramic substrates.

[0218] Figure 27 is a second exploded schematic diagram of a light emitting component according to some disclosed embodiments. As shown in Figure 27 , the other end of the second housing 411 is provided with an opening 4114 extending through the other end of the second housing 411. One end of the adapter block 430 is embedded in the opening 4114, extending through the opening 4114 and into the inner cavity of the second housing 411.

[0219] In some embodiments, a laser assembly is disposed within the interior of the second housing 411, positioned adjacent to one end of the adapter block 430 to facilitate electrical connection of the laser assembly to the adapter block 430. The laser assembly is configured to transmit multiple optical signals of varying wavelengths. Exemplarily, the laser assembly is connected to the adapter block 430 via bonding wires.

[0220] In some embodiments, a multiplexing component (in some examples, also called a combining component) 460 is further provided in the inner cavity of the second shell 411. The multiplexing component 460 is used to combine multiple optical signals of different wavelengths emitted by the laser component into one transmitted optical signal.

[0221] In some embodiments, the light emitting component 400 further includes a collimating lens 490 , which is disposed on the optical path from the laser component to the multiplexing component 460 , and is used to collimate the optical signal generated by the laser component and transmit it to the light input port of the multiplexing component 460 .

[0222] FIG28 is a schematic diagram of a partial structure of a light emitting component according to some disclosed embodiments. In some embodiments, as shown in FIG28,

[0223] In some embodiments, the light-emitting end faces of the first laser assembly 451 , the second laser assembly 452 , and the third laser assembly 453 are flush, that is, the light-emitting end faces of the first laser assembly 451 , the second laser assembly 452 , and the third laser assembly 453 are located on the same length surface of the second shell 411 .

[0224] In some embodiments, the light-emitting end faces of the first laser assembly 451 and the second laser assembly 452 are flush, that is, the light-emitting end faces of the first laser assembly 451 and the second laser assembly 452 are located on the same length plane of the second housing 411. The light-emitting end faces of the second laser assembly 452 and the third laser assembly 453 are not flush, that is, the light-emitting end faces of the third laser assembly 453 and the second laser assembly 452 are located on different length planes of the second housing 411.

[0225] In some embodiments, the light emitting component 400 further includes a thermoelectric cooler (TEC) 470 . The TEC 470 is disposed in the inner cavity of the second housing 411 and below the laser assembly. The TEC 470 is used to adjust the temperature of the laser assembly.

[0226] In some embodiments, the light emitting component 400 further includes a support plate 480 , the top of the TEC 470 is fixedly connected to the support plate 480 , and the first laser assembly 451 , the second laser assembly 452 and the third laser assembly 453 are disposed on the support plate 480 .

[0227] In some embodiments, the collimating lens 490 includes a first collimating lens 491, a second collimating lens 492, and a third collimating lens 493. The first collimating lens 491 is disposed on the optical transmission path from the first laser assembly 451 to the multiplexing assembly 460, the second collimating lens 492 is disposed on the optical transmission path from the second laser assembly 452 to the multiplexing assembly 460, and the third collimating lens 493 is disposed on the optical transmission path from the third laser assembly 453 to the multiplexing assembly 460. In some embodiments, the first collimating lens 491, the second collimating lens 492, and the third collimating lens 493 are disposed on the support plate 480. Of course, the embodiments of the present disclosure are not limited to the first collimating lens 491, the second collimating lens 492, and the third collimating lens 493 being disposed on the support plate 480.

[0228] In some embodiments, the reusing assembly 460 is disposed on a support plate 480 .

[0229] Figure 29 is a second schematic diagram of a partial structure of an optical transmission component according to some disclosed embodiments. Figure 29 is a schematic diagram from another angle of Figure 28. In some examples, as shown in Figures 28 and 29, multiplexing assembly 460 includes a first filter (in some examples, also referred to as a first wavelength combining element) 461, a second filter (in some examples, also referred to as a second wavelength combining element) 462, a third filter (in some examples, also referred to as a fourth wavelength combining element) 463, and a fourth filter (in some examples, also referred to as a third wavelength combining element) 464. The arrows in Figure 29 indicate the direction of light. The first laser assembly 451 includes a first optical transmission chip 4511, which emits signal light of a first wavelength. A first collimating lens 491 is located in the light-emitting direction of the first optical transmission chip 4511 and collimates the signal light of the first wavelength emitted by the first optical transmission chip 4511. The first filter 461 is located on the other side of the first collimating lens 491 and reflects the signal light of the first wavelength.

[0230] For ease of description, the angle of the filter refers to the angle between the normal line of the filter and the propagation direction of the collimated first wavelength signal light. The propagation direction of the first wavelength signal light is the length direction of the light emitting component.

[0231] For example, the first filter reflects the signal light of the first wavelength, and the angle between the normal line of the first filter and the length direction of the light emitting component is 45°.

[0232] The second laser assembly 452 includes a second light emitting chip 4521, which emits signal light of a second wavelength. A second collimating lens 492 is located in the light-emitting direction of the second light emitting chip 4521 and collimates the signal light of the second wavelength emitted by the second light emitting chip 4521. A second filter 462 is located on the other side of the second collimating lens 492, and the signal light of the second wavelength is transmitted through the second filter. The second filter 462 is also arranged parallel to the first filter 461. After being reflected by the first filter, the signal light of the first wavelength is directed toward the second filter 462. The second filter reflects the signal light of the first wavelength.

[0233] For example, the second filter reflects the signal light of the first wavelength, and the angle between the normal line of the second filter and the length direction of the light emitting component is 45°. The second filter transmits the signal light of the second wavelength.

[0234] The third filter 463 is located on the light-emitting side of the second filter 462. The second wavelength signal light passes through the second filter and then passes through the third filter 463. The first wavelength signal light is reflected by the second filter and then passes through the third filter 463.

[0235] The third laser assembly 453 includes a third light emitting chip 4531, which emits signal light of a third wavelength. A third collimating lens 493 is located in the light-emitting direction of the third light emitting chip 4531 and collimates the signal light of the third wavelength emitted by the third light emitting chip 4531. A fourth filter 464 is located on the other side of the third collimating lens 493, and the signal light of the third wavelength is reflected by the fourth filter. The fourth filter 464 is also arranged parallel to the third filter 463. After being reflected by the fourth filter, the signal light of the third wavelength is directed toward the third filter 463.

[0236] The third filter 463 reflects the third wavelength signal light, and transmits the first wavelength signal light and the second wavelength signal light.

[0237] In some embodiments, the first wavelength signal light emitted by the first light emitting chip 4511 is collimated by the first collimating lens 491 , reflected by the first filter, reflected by the second filter, transmitted through the third filter, and then enters the first shell 510 from the second cavity 410 .

[0238] The second wavelength signal light emitted by the second light emitting chip 4521 is collimated by the second collimating lens 492 , passes through the second filter and the third filter, and enters the first housing 510 from the second cavity 410 .

[0239] The third wavelength signal light emitted by the third light emitting chip 4531 is collimated by the third collimating lens 493 , reflected by the fourth filter 464 , and then reflected by the third filter before entering the first housing 510 from the second cavity 410 .

[0240] In some embodiments, the angle between the second filter and the third filter is 90°.

[0241] The present invention adopts a filter to realize beam combining of light of different wavelengths, has a simple structure, is inexpensive, and can greatly reduce material costs.

[0242] In some embodiments, the third light emitting chip 4531 is an electrical absorption modulated laser (EML) and is packaged with a semiconductor laser amplifier. One end of the first high-frequency transmission line is connected to the positive electrode of the electro-absorption modulator of the EML by bonding.

[0243] In some embodiments, the third light emitting chip 4531 is tilted, but the direction of the third wavelength optical signal output by the third light emitting chip 4531 is parallel to the length direction of the second shell 411, effectively reducing the reflected light signal from entering the third light emitting chip 4531 and interfering with the light emission of the third light emitting chip 4531.

[0244] In some embodiments, the first light emitting chip 4511 is an EML, and one end of the second high-frequency transmission line is connected to the positive electrode of the electro-absorption modulator of the EML by bonding.

[0245] In some embodiments, the TEC 470 includes a first electrode and a second electrode, and the first electrode and the second electrode are located at the edge of the TEC 470 package. Exemplarily, the first electrode and the second electrode are disposed on a side of the third laser assembly 453 away from the second laser assembly 452 .

[0246] In some embodiments, the arrangement of the first laser assembly 451, the second laser assembly 452 and the third laser assembly 453, combined with the structural form of the adapter block 430, can make full use of the space of the second shell 411, facilitate the arrangement of the first laser assembly 451, the second laser assembly 452 and the third laser assembly 453 in the second shell 411, and realize the electrical connection between the first laser assembly 451, the second laser assembly 452 and the third laser assembly 453 and the circuit board 300.

[0247] Figure 29 is a third schematic diagram of a partial structure of another optical emission component provided according to some disclosed embodiments. Figure 30 is a first schematic diagram of a multiplexing assembly provided according to some disclosed embodiments. Figure 32 is a first exploded schematic diagram of a multiplexing assembly provided according to some disclosed embodiments. In some examples, as shown in Figures 29-32, multiplexing assembly 460 includes: a first prism 465, a second prism 466, a third prism 467, and a fourth prism 468. The oblique surface of the second prism 466 is connected to the first prism 465, a right-angled surface of the third prism is connected to the first prism 465, and the oblique surface of the third prism is connected to the fourth prism 468.

[0248] The first prism 465 is a rhombus-shaped prism. It includes a first side surface 4651, a second side surface 4652, a third side surface 4653, and a fourth side surface 4654. The first side surface 4651 is positioned opposite the fourth side surface 4654, while the second side surface 4652 is positioned opposite the third side surface 4653. The angle between the first side surface 4651 and the second side surface is 45°. The first side surface 4651 is perpendicular to the length of the light-emitting component.

[0249] The second prism 466 is a triangular prism, and includes a first right-angled surface 4661 , a second right-angled surface 4662 , and a first oblique side surface 4663 .

[0250] The first right-angled surface 4661 is parallel to the first side surface 4651. In some embodiments, the first right-angled surface 4661 and the first side surface 4651 are located in the same plane. The first right-angled surface 4661 and the first side surface 4651 are located at the same position along the length of the light emitting component, or the first right-angled surface 4661 and the first side surface 4651 can be located at different positions along the length of the light emitting component.

[0251] The first oblique side surface 4663 is connected to the third side surface 4653 , and an included angle between the first oblique side surface 4663 and the first right-angled surface 4661 is 45°.

[0252] In some embodiments, the first oblique side surface 4663 and the third side surface 4653 have the same shape and area to facilitate assembly.

[0253] The third prism 467 is a triangular prism. The third prism 467 includes a third right-angled surface 4671 , a fourth right-angled surface 4672 , and a second oblique side surface 4673 .

[0254] The third right-angled surface 4671 is parallel to the first side surface 4651. In some embodiments, the third right-angled surface 4671 is connected to the third side surface 4653.

[0255] FIG33 is a second schematic diagram of a multiplexing component according to some disclosed embodiments. As shown in FIG33 , the third right-angled surface 4671 and the third side surface 4653 can be separated.

[0256] The included angle between the second oblique side surface 4673 and the third right-angled surface 4671 is 45°. The included angle between the second oblique side surface 4673 and the first oblique side surface 4663 is 90°.

[0257] The fourth prism 468 is a rhombus-shaped prism. It includes a fifth side surface 4681, a sixth side surface 4682, a seventh side surface 4683, and an eighth side surface 4684. The fifth side surface 4681 is positioned opposite the eighth side surface 4684, while the sixth side surface 4682 is positioned opposite the seventh side surface 4683. The angle between the fifth side surface 4681 and the sixth side surface 4682 is 45°. The fifth side surface 4681 is perpendicular to the length of the light-emitting component.

[0258] The sixth side surface 4682 is connected to the second oblique side surface 4673. In some embodiments, the sixth side surface 4682 and the second oblique side surface 4673 have the same shape and area to facilitate assembly.

[0259] In some embodiments of the present disclosure, the first prism 465 and the second prism 466 are connected to form a first lens group, and the third prism 467 and the fourth prism 468 are connected to form a second lens group. The first lens group and the second lens group can be connected or separated.

[0260] FIG34 is a schematic diagram of an optical path of a multiplexing assembly according to an embodiment. As shown in FIG34 , in some embodiments, a third reflective film 4603 is disposed between the third side surface 4653 and the first oblique side surface 4663 . The third reflective film 4603 reflects the first wavelength signal light and transmits the second wavelength signal light.

[0261] A fourth reflective film 4604 is disposed between the sixth side surface 4682 and the second oblique side surface 4673 . The fourth reflective film 4604 transmits the first wavelength signal light and the second wavelength signal light, and reflects the third wavelength signal light.

[0262] The second side surface 4652 is provided with a first reflective film 4602, which reflects the signal light of the first wavelength. The seventh side surface 4683 is provided with a second reflective film 4605, which reflects the signal light of the third wavelength.

[0263] The first laser assembly 451 includes a first light emitting chip 4511, which emits signal light of a first wavelength. A first collimating lens 491 is located in the light-emitting direction of the first light emitting chip 4511 and collimates the signal light of the first wavelength emitted by the first light emitting chip 4511. The signal light of the first wavelength enters the multiplexing assembly through the first side surface 4651, is reflected by the second side surface 4652, and then travels toward the third side surface 4653. After being reflected by the third reflective film 4603, it travels toward the fourth side surface 4654, passes through the fourth reflective film 4604, and is emitted from the eighth side surface 4684.

[0264] The second laser assembly 452 includes a second light emitting chip 4521, which emits signal light of a second wavelength. A second collimating lens 492 is located in the light-emitting direction of the second light emitting chip 4521. The second collimating lens 492 collimates the signal light of the second wavelength emitted by the second light emitting chip 4521. The signal light of the second wavelength sequentially passes through the second prism 466, the first prism, the third prism, and the fourth prism, and is emitted through the eighth side surface 4684.

[0265] The third laser assembly 453 includes a third light emitting chip 4531, which emits signal light of a third wavelength. A third collimating lens 493 is located in the light-emitting direction of the third light emitting chip 4531. The third collimating lens 493 collimates the signal light of the third wavelength emitted by the third light emitting chip 4531. The signal light of the third wavelength enters the fourth prism through the fifth side surface 4681, is reflected by the second reflective film 4605, and then is reflected by the fourth reflective film 4604 before being emitted through the eighth side surface 4684.

[0266] In some embodiments of the present disclosure, the first, second, and third wavelength signal lights are combined into a single beam by using the first, third, second, and fourth reflective films in a multiplexing assembly. This simple structure and low cost significantly reduce material costs. Compared to the example filter, the first, third, second, and fourth reflective films are disposed on the surface of the prism at predetermined angles, eliminating the need for angular coupling between the first, third, second, and fourth reflective films during installation. During installation, only the length and angular position of the multiplexing assembly need to be determined based on the first side surface 4651.

[0267] Figure 35 is a fourth schematic diagram of a multiplexing component provided according to some disclosed embodiments. As shown in Figure 35 , the second prism 466 may also be a trapezoidal prism.

[0268] In some embodiments, the multiplexing assembly 460 includes a first prism 465, a second prism 466, a third prism 467, and a fourth prism 468. A right-angled surface of the third prism is connected to the first prism 465, and an inclined surface of the third prism is connected to the fourth prism 468. A third reflective film 4603 is provided on the third side surface 4653. The third reflective film 4603 reflects the first wavelength signal light and transmits the second wavelength signal light.

[0269] A fourth reflective film 4604 is disposed between the sixth side surface 4682 and the second oblique side surface 4673 . The fourth reflective film 4604 transmits the first wavelength signal light and the second wavelength signal light, and reflects the third wavelength signal light.

[0270] The second side surface 4652 is provided with a first reflective film 4602, which reflects the signal light of the first wavelength. The seventh side surface 4683 is provided with a second reflective film 4605, which reflects the signal light of the third wavelength.

[0271] The first laser assembly 451 includes a first light emitting chip 4511, which emits signal light of a first wavelength. A first collimating lens 491 is located in the light-emitting direction of the first light emitting chip 4511 and collimates the signal light of the first wavelength emitted by the first light emitting chip 4511. The signal light of the first wavelength enters the multiplexing assembly through the first side surface 4651, is reflected by the second side surface 4652, and then travels toward the third side surface 4653. After reflection by the third reflective film 4603, the reflected signal light travels toward the fourth side surface 4654, passes through the fourth side surface 4654, the fourth reflective film 4604, and the first oblique side surface 4663, and is emitted through the eighth side surface 4684.

[0272] The second laser assembly 452 includes a second light emitting chip 4521, which emits signal light of a second wavelength. A second collimating lens 492 is located in the light-emitting direction of the second light emitting chip 4521. The second collimating lens 492 collimates the signal light of the second wavelength emitted by the second light emitting chip 4521. The signal light of the second wavelength sequentially passes through the second prism, the first prism, the third prism, and the fourth prism, and is emitted through the eighth side surface 4684.

[0273] The third laser assembly 453 includes a third light emitting chip 4531, which emits signal light of a third wavelength. A third collimating lens 493 is located in the light-emitting direction of the third light emitting chip 4531. The third collimating lens 493 collimates the signal light of the third wavelength emitted by the third light emitting chip 4531. The signal light of the third wavelength enters the fourth prism through the fifth side surface 4681, is reflected by the second reflective film 4605, and then is reflected by the fourth reflective film 4604 before being emitted through the eighth side surface 4684.

[0274] In some embodiments of the present disclosure, the first, second, and third wavelength signal lights are combined into a single beam by using the first, third, second, and fourth reflective films in a multiplexing assembly. This simple structure and low cost significantly reduce material costs. Compared to the example filter, the first, third, second, and fourth reflective films are disposed on the surface of the prism at predetermined angles, eliminating the need for angular coupling between the first, third, second, and fourth reflective films during installation. During installation, only the length and angular position of the multiplexing assembly need to be determined based on the first side surface 4651.

[0275] Figure 36 is a schematic diagram (I) of the structure of a light emitting component according to some embodiments of the present disclosure. Figure 37 is a schematic diagram (II) of the structure of a light emitting component according to some embodiments of the present disclosure. Figure 38 is an exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure. As shown in Figures 36-38, the light emitting component 400 includes a second housing 410 and a second upper cover 420. The second upper cover 420 covers and connects to the second housing 410 to form a second cavity. The second housing 410 includes a bottom plate 411, a first side wall 412, a second side wall 413, a third side wall 414, and a fourth side wall 415. The first, second, third, and fourth side walls 412, 413, 414, and 415 are sequentially connected, with their bottoms connected to the bottom plate 411, forming a second inner cavity. The tops of the first, second, third, and fourth side walls 412, 413, 414, and 415 are supported and connected to the second upper cover 420. The bottom plate 411 supports the device. In some embodiments, the second housing 410 is formed integrally from metal.

[0276] The first sidewall 412 is located at one end of the second housing 410. A sixth connection hole 4121 is provided on the first sidewall 412. The sixth connection hole 4121 communicates with the second inner cavity and serves as a light outlet for the second cavity. The sixth connection hole 4121 connects to the first housing 510, connecting the second housing 410 to the accommodating cavity 517 through the sixth connection hole 4121. For example, the other end of the connecting base 5101 is embedded with the sixth connection hole 4121. In some embodiments, a boss 4122 is provided on the outer side of the first sidewall 412. One end of the sixth connection hole 4121 extends through the boss 4122, and the end of the connecting base 5101 is embedded with the connecting boss 4122.

[0277] The second sidewall 413 is located on a side of the first housing 510, within the notched corner 510b and adjacent to the third light receiving element 550. The third sidewall 414 is located at the other end of the first housing 510, adjacent to the circuit board 300. The fourth sidewall 415 is located on a side of the first housing 510, with the second sidewall 413 located at the edge of the notched corner 510b. Exemplarily, two rows of pins are provided on each of the third and fourth sidewalls 414, 415, each row including a plurality of pins 430. For ease of description, the row of pins on the third and fourth sidewalls 414, 415 that is adjacent to the bottom plate 411 is referred to as the bottom row of pins on the third and fourth sidewalls 414, 415. The pins 430 on the third and fourth sidewalls 414, 415 are electrically connected to the circuit board 300 via corresponding flexible printed circuit boards.

[0278] A first laser assembly 440, a second laser assembly 450, and a third laser assembly 460 are disposed within the second housing 410. In some embodiments, the first laser assembly 440 is located on the sides of the second sidewall 413 and the third sidewall 414; the second laser assembly 450 and the third laser assembly 460 are located on the sides of the fourth sidewall 415, with the third laser assembly 460 located on the side of the second laser assembly 450 away from the third sidewall 414. The third laser assembly 460 is located on the side of the first sidewall 412. This arrangement allows the first, second, and third laser assemblies 440, 450, and 460 to be distributed along two adjacent sidewalls of the second housing 410, forming a triangular arrangement rather than a single row, thereby reducing the packaging volume of the optical emitting component 400. For example, the first laser assembly 440 generates an optical signal of a first wavelength, the second laser assembly 450 generates an optical signal of a second wavelength, and the third laser assembly 460 generates an optical signal of a third wavelength.

[0279] In some embodiments, the third sidewall 414 is disposed along the width direction of the second housing 410, and the fourth sidewall is disposed along the length direction of the second housing 410. This allows the first laser assembly 440 to be disposed within the width direction of the second housing 410, thereby reducing the width dimension of the second housing 410. The second laser assembly 450 and the third laser assembly 460 are disposed within the length direction of the second housing 410, in conjunction with the first laser assembly 440 disposed within the width direction of the second housing 410. This allows sufficient laser assemblies to be disposed within the second housing 410, while reducing the overall dimension of the second housing 410 and, consequently, the dimension of the light-emitting component 400.

[0280] In some embodiments, the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 have different transmission rates. For example, the transmission rate of the first laser assembly 440 is greater than the transmission rate of the second laser assembly 450, and the transmission rate of the second laser assembly 450 is greater than the transmission rate of the third laser assembly 460. For example, the transmission rate of the first laser assembly 440 is 50G, the transmission rate of the second laser assembly 450 is 10G, and the transmission rate of the third laser assembly 460 is 2.5G.

[0281] A second filter 416 and a third filter 417 are also disposed on the side of the light outlet in the second housing 410. The second filter 416 and the third filter 417 are disposed on the side of the sixth connection hole 4121 and are located on the output optical paths of the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460. The second filter 416 and the third filter 417 are disposed side by side. The second filter 416 and the third filter 417 are used to change the transmission optical paths of the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal, allowing the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal to pass through the sixth connection hole 4121. Exemplarily, the third filter 417 and the second filter 416 transmit the first wavelength optical signal, the third filter 417 reflects the second wavelength optical signal, and the second filter 416 transmits the second wavelength optical signal and reflects the third wavelength optical signal.

[0282] In some embodiments, the second filter 416 and the third filter 417 are arranged on the side where the first side wall 412 and the second side wall 413 are connected, so that the second filter 416, the third filter 417 and the first laser assembly 440 are arranged compactly, which facilitates controlling the length direction of the second shell 410.

[0283] In some embodiments, second filter 416 is disposed at the intersection of the output optical paths of first laser assembly 440 and third laser assembly 460, and third filter 417 is disposed at the intersection of the output optical paths of first laser assembly 440 and second laser assembly 450. First laser assembly 440 is located on the transmissive side of third filter 417, second laser assembly 450 is located on the reflective side of third filter 417, and third laser assembly 460 is located on the reflective side of second filter 416. Exemplarily, second filter 416 includes a first optical surface and a second optical surface, which are primary optical surfaces of second filter 416. Third filter 417 includes a third optical surface and a fourth optical surface, which are primary optical surfaces of third filter 417. The first optical surface faces third laser assembly 460, the second optical surface faces third filter 417, the third optical surface faces second laser assembly 450, and the fourth optical surface faces first laser assembly 440.

[0284] In some embodiments, a mounting bracket 470 is further disposed within the second housing 410. The mounting bracket 470 is disposed on the side of the sixth connection hole 4121 and is fixed within the second housing 410. The mounting bracket 470 supports and connects the second optical filter 416 and the third optical filter 417. The second optical filter 416 and the third optical filter 417 are fixed within the second housing 410 via the mounting bracket 470, facilitating the fixing of the second optical filter 416 and the third optical filter 417 within the second housing 410.

[0285] In some embodiments, a lens 418 is further disposed within the second housing 410. The lens 418 is disposed on the optical path from the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 to the second filter 416 or the third filter 417. For example, a first lens 4181 is disposed on the optical path from the first laser assembly 440 to the third filter 417 to collimate the first wavelength optical signal; a second lens 4182 is disposed on the optical path from the second laser assembly 450 to the third filter 417 to collimate the second wavelength optical signal; and a third lens 4183 is disposed on the optical path from the third laser assembly 460 to the second filter 416 to collimate the third wavelength optical signal.

[0286] Figure 39 is a partial structural schematic diagram of a light emitting component provided according to some embodiments of the present disclosure, Figure 40 is a partial structural schematic diagram of a light emitting component provided according to some embodiments of the present disclosure, Figure 41 is a partial structural schematic diagram of a light emitting component provided according to some embodiments of the present disclosure, Figure 42 is a cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure, Figure 43 is a cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure, and Figure 44 is a cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure. Figures 39 to 44 show the internal structure of the light emitting component in the embodiments of the present disclosure.

[0287] In some embodiments, the first laser assembly 440 includes a first substrate 441 and a first laser chip 442. The first laser chip 442 is mounted on the first substrate 441 and integrates an electro-absorption modulated laser and a semiconductor optical amplifier. A ground layer 4410, a first high-frequency pad 4411, a first LD pad 4412, and a first SOA pad 4413 are provided on the first substrate 441. The first laser chip 442 is mounted on the ground layer 4410, with the first high-frequency pad 4411, the first LD pad 4412, and the first SOA pad 4413 located on the sides of the first laser chip 442. The first high-frequency pad 4411, the first LD pad 4412, and the first SOA pad 4413 are each wire-bonded to the first laser chip 442. A first high-frequency pin 4301, a first SOA pin 4302, and a first LD pin 4303 are disposed on the third sidewall 414. These pins are embedded in the third sidewall 414, with their ends extending into the inner cavity of the second housing 410. These pins are insulated from the third sidewall 414 by insulating layers. The first high-frequency pin 4301 is located in the bottom row of pins on the third sidewall 414. The first high-frequency pin 4301 is electrically connected to the first high-frequency pad 4411, the first SOA pin 4302 is electrically connected to the first SOA pad 4413, and the first LD pin 4303 is electrically connected to the first LD pad 4412. In some embodiments, one end of the first high frequency pin 4301 is wired to the first high frequency pad 4411 , one end of the first SOA pin 4302 is wired to the first SOA pad 4413 , and one end of the first LD pin 4303 is wired to the first LD pad 4412 .

[0288] In some embodiments, the height of the first high-frequency pin 4301 on the third sidewall 414 is lower than the height of the first SOA pin 4302 and the first LD pin 4303 on the third sidewall 414, that is, the first high-frequency pin 4301 is closer to the bottom plate 411. A first ground pin 4304 is also provided on the third sidewall 414. The first ground pin 4304 is located to the side of the first high-frequency pin 4301 and is electrically connected to the third sidewall 414.

[0289] In some embodiments, a first adapter board 481 is further provided in the second shell 410, and a circuit pattern is provided on the first adapter board 481 to realize electrical connection between the first high-frequency pin 4301 and the first laser assembly 440 through the first adapter board 481. The first adapter board 481 can also be used for impedance matching of the first laser chip 442 to ensure the impedance continuity of the high-frequency transmission link.

[0290] In some embodiments, a first high-frequency transmission line 4811 is disposed on the front of the first adapter plate 481. A first ground layer 4812 is disposed on one side of the first high-frequency transmission line 4811, and a second ground layer 4813 is disposed on the other side of the first high-frequency transmission line 4811. One end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pad 4411, and the other end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pin 4301. Exemplarily, one end of the first high-frequency transmission line 4811 is wire-bonded to the first high-frequency pad 4411, and the other end of the first high-frequency transmission line 4811 is soldered to the first high-frequency pin 4301; the ground layer 4110 is wire-bonded to the first ground layer 4812 and the second ground layer 4813.

[0291] In some embodiments, a ground layer is set on the back of the first adapter board 481, and via holes are respectively set on the first ground layer 4812 and the second ground layer 4813. The first ground layer 4812 and the second ground layer 4813 are respectively connected to the ground layer on the back of the first adapter board 481 through the via holes.

[0292] In some embodiments, the second laser assembly 450 includes a second substrate 451 and a second laser chip 452. The second laser chip 452 is mounted on the second substrate 451 and integrates an electro-absorption modulated laser and a semiconductor optical amplifier. A ground layer 4510, a second high-frequency pad 4511, a second LD pad 4512, and a second SOA pad 4513 are provided on the second substrate 451. The second high-frequency pad 4511, the second LD pad 4512, and the second SOA pad 4513 are located on the sides of the second laser chip 452. The second laser chip 452 is mounted on the ground layer 4510, and the second high-frequency pad 4511, the second LD pad 4512, and the second SOA pad 4513 are respectively wire-bonded to the second laser chip 452.

[0293] Pins 430 further include a second high-frequency pin 4305, a second SOA pin 4306, and a second LD pin 4307. Second high-frequency pin 4305 is located in the bottom row of pins on third sidewall 414. Second high-frequency pin 4305 is electrically connected to second high-frequency pad 4511, second SOA pin 4306 is electrically connected to second SOA pad 4513, and second LD pin 4307 is electrically connected to second LD pad 4512.

[0294] In some embodiments, a second adapter plate 482 is further disposed within the second housing 410, with a circuit board pattern disposed thereon. The second adapter plate 482 is used to electrically connect the second high-frequency pin 4305 to the second laser assembly 450. The second adapter plate 482 can also be used to impedance match the second laser chip 452 to ensure impedance continuity of the high-frequency transmission link.

[0295] In some embodiments, a second high-frequency pin 4305 is embedded in and connected to the third sidewall 414, insulated from the third sidewall 414 by an insulating layer. A second adapter plate 482 is disposed on a side of the third sidewall 414. A second SOA pin 4306 and a second LD pin 4307 are embedded in and connected to the fourth sidewall 415 and insulated from the fourth sidewall 415 by an insulating layer. The second SOA pin 4306 is wired to the second SOA pad 4513, and the second LD pin 4307 is wired to the second LD pad 4512. A second ground pin 4308 is also disposed on the third sidewall 414, located on a side of the second high-frequency pin 4305 and electrically connected to the third sidewall 414. Exemplarily, the second ground pin 4308 is located on a side of the second high-frequency pin 4305 that is proximal to the first high-frequency pin 4301. The second adapter plate 482 is located on the same sidewall of the second housing 410 as the first adapter plate 481. This facilitates assembly of the second adapter plate 482 and increases the density of components within the second housing 410, thereby helping to reduce the size of the second housing 410. In some embodiments, a second high-frequency transmission line 4821 is disposed on the front surface of the second adapter plate 482. A third ground plane 4822 is disposed on one side of the second high-frequency transmission line 4821, and a fourth ground plane 4823 is disposed on the other side of the second high-frequency transmission line 4821. One end of the second high-frequency transmission line 4821 is electrically connected to the second high-frequency pad 4511, and the other end of the second high-frequency transmission line 4821 is electrically connected to the second high-frequency pin 4305. Exemplarily, one end of the second high-frequency transmission line 4821 is bonded to the second high-frequency pad 4511, and the other end of the second high-frequency transmission line 4821 is soldered to the second high-frequency pin 4305. The ground plane 4510 electrically connects the third ground plane 4822 and the fourth ground plane 4823.

[0296] In some embodiments, a ground layer is provided on the back of the second adapter plate 482, and vias are provided in the third and fourth ground layers 4822 and 4823, respectively. The third and fourth ground layers 4822 and 4823 are connected to the ground layer on the back of the second adapter plate 482 through the vias. In some embodiments, a third adapter plate 483 is further provided within the second housing 410, with a circuit pattern provided thereon. The third adapter plate 483 is positioned between the second laser assembly 450 and the second adapter plate 482, with the side edges of the third adapter plate 483 adjacent to the first laser assembly 440. The third adapter plate 483 is used to achieve an electrical connection between the second laser assembly 450 and the second adapter plate 482. The third adapter plate 483 can also be used to impedance match the second laser chip 452 to ensure impedance continuity of the high-frequency transmission link. The third adapter plate 483 helps reduce the length of the wires between the second laser assembly 450 and the second adapter plate 482, thereby reducing parasitic inductance and ensuring high-frequency signal transmission quality. In some embodiments, a third high-frequency transmission line 4831 is disposed on the front surface of the third adapter plate 483, a fifth ground layer 4832 is disposed on one side of the third high-frequency transmission line 4831, and a sixth ground layer 4833 is disposed on the other side of the third high-frequency transmission line 4831. One end of the third high-frequency transmission line 4831 is electrically connected to the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is electrically connected to the second high-frequency transmission line 4821. Exemplarily, one end of the second high-frequency transmission line 4821 is wired to the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is wired to one end of the second high-frequency transmission line 4821; the fifth ground layer 4832 is wired to the third ground layer 4822, the sixth ground layer 4833 is wired to the fourth ground layer 4823, and the fifth and sixth ground layers 4832 and 4833 are each wired to the ground layer 4510.

[0297] In some embodiments, a third LD pad 4834 and a third SOA pad 4835 are further provided on the front surface of the third adapter board 483. The third LD pad 4834 and the third SOA pad 4835 are located near the first laser assembly 440. The first LD pad 4412 and the first LD pin 4303 are electrically connected to the third LD pad 4834, respectively. The first SOA pad 4413 and the first SOA pin 4302 are electrically connected to the third SOA pad 4835, respectively. This allows the first laser assembly 440, the first LD pin 4303, and the first SOA pin 4302 to be electrically connected via the third adapter board 483, thereby facilitating control of the bonding arc height and thus facilitating bonding. In some embodiments, capacitors are mounted on third LD pad 4834 and third SOA pad 4835, respectively. First LD pad 4412 and first LD pin 4303 are connected to the capacitors mounted on third LD pad 4834, respectively. First SOA pad 4413 and first SOA pin 4302 are wired to connect the capacitors mounted on third SOA pad 4835. A third adapter plate 483 is disposed at the junction of third sidewall 414 and fourth sidewall 415, enabling third adapter plate 483 to serve both first laser assembly 440 and second laser assembly 450, thereby facilitating coordinated use of space within second housing 410.

[0298] In some embodiments, the third laser assembly 460 includes a third substrate 461 and a third laser chip 462. A negative electrode pad 4611 and a positive electrode pad 4612 are provided on the third substrate. The third laser chip 462 is mounted on the negative electrode pad 4611 and is wire-bonded to the positive electrode pad 4612. The pins 430 also include a third LD pin 4309 and a fourth LD pin 4310. The third LD pin 4309 is wire-bonded to the positive electrode pad 4612, and the fourth LD pin 4310 is wire-bonded to the negative electrode pad 4611. Exemplarily, the third LD pin 4309 and the fourth LD pin 4310 are embedded in the fourth sidewall 415, with their ends respectively extending into the inner cavity of the second housing 410 and insulated from the fourth sidewall 415 by an insulating layer.

[0299] In some embodiments, the third laser assembly 460 further includes a backlight detector 463, which is disposed on the third substrate 461 and located on the backlight side of the third laser chip 462. The backlight detector 463 is configured to receive backlight from the third laser chip 462 to monitor optical signals at a third wavelength. Pins 430 further include an MPD pin 4311, which is wired to the backlight detector 463. Exemplarily, the MPD pin 4311 is embedded in the fourth sidewall 415, with the end of the MPD pin 4311 extending into the inner cavity of the second housing 410. The MPD pin 4311 is insulated from the fourth sidewall 415 by an insulating layer.

[0300] In some embodiments, a thermoelectric cooler (TEC) 490 is further disposed within the second housing 410. The bottom of the TEC 490 is connected to the base plate 411, and the top of the TEC 490 supports the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460. The sides of the TEC 490 include a first TEC pad 491 and a second TEC pad 492, which are located on the sides of the second sidewall 413. The pins 430 also include a first TEC pin 4312 and a second TEC pin 4313. The first TEC pin 4312 is electrically connected to the first TEC pad 491, and the second TEC pin 4313 is electrically connected to the second TEC pad 492. Exemplarily, the first TEC pin 4312 and the second TEC pin 4313 are embedded in the third sidewall 414, with their ends extending into the inner cavity of the second housing 410 and insulated from the third sidewall 414 by an insulating layer.

[0301] In some embodiments, a support plate 419 is further disposed within second housing 410 and is positioned atop TEC 490. The bottom of support plate 419 is connected to the top of TEC 490, while the top of support plate 419 supports and connects first laser assembly 440, second laser assembly 450, and third laser assembly 460. In some embodiments, support plate 419 is electrically connected to the ground layer on the front surface of third adapter plate 483.

[0302] In some embodiments, a fourth adapter plate 484 is further disposed within the second housing 410. The fourth adapter plate 484 is disposed on the support plate 419 and has a circuit pattern disposed thereon. The fourth adapter plate 484 is used to connect the TEC pads and TEC pins. Exemplarily, the fourth adapter plate 484 includes a fourth substrate 4841 on which a first metal layer 4842 and a second metal layer 4843 are disposed. The first metal layer 4842 and the second metal layer 4843 extend along the length of the fourth substrate 4841. The fourth adapter plate 484 is disposed adjacent to the second sidewall 413 and adjacent to the first laser assembly 440. One end of the first metal layer 4842 is wire-bonded to the first TEC pad 491, and the other end of the first metal layer 4842 is wire-bonded to the first TEC pin 4312. One end of the second metal layer 4843 is wire-bonded to the second TEC pad 492, and the other end of the second metal layer 4843 is wire-bonded to the second TEC pin 4313.

[0303] In some embodiments, a temperature sensor 4836 is further provided on the third adapter board 483; illustratively, the temperature sensor 4836 is a thermistor. Pins 430 also include an RTH pin 4314, which is embedded in the third sidewall 414. One end of the RTH pin 4314 extends into the inner cavity of the second housing 410 and is insulated from the third sidewall 414 by an insulating layer. One end of the RTH pin 4314 is electrically connected to the temperature sensor 4836.

[0304] In some embodiments, a transfer pad 4837 is further provided on the third adapter board 483. The transfer pad 4837 is disposed on the side of the temperature sensor 4836 and is connected to the temperature sensor 4836 and the RTH pin 4314 by wire bonding. The transfer pad 4837 facilitates the connection between the temperature sensor 4836 and the RTH pin 4314, thereby reducing the risk of heat being transferred to the RTH pin 4314 through the wire bonding when the temperature sensor 4836 is directly connected to the RTH pin 4314, which could cause the temperature sensor 4836 to detect inaccurate temperature in the second cavity.

[0305] In some embodiments, the inner side of the third sidewall 414 includes a first side surface 4141, a second side surface 4142, a first stepped surface 4143, and a second stepped surface 4144. The first side surface 4141 is connected to the first stepped surface 4143, one end of the second stepped surface 4144 is connected to the first side surface 4141, and the other end of the second stepped surface 4144 is connected to the second side surface 4142. The first stepped surface 4143 is closer to the bottom plate 411 than the second stepped surface 4144. That is, the height of the first stepped surface 4143 in the second housing 410 is lower than the height of the second stepped surface 4144 in the second housing 410.

[0306] The first stepped surface 4143 supports and connects the first adapter plate 481 and the second adapter plate 482. One end of the first high-frequency pin 4301 and one end of the second high-frequency pin 4305 each pass through the first side surface 4141. One end of the first high-frequency pin 4301 extends above the first adapter plate 481, while one end of the second high-frequency pin 4305 extends to the second adapter plate 482. One end of the RTH pin 4314 passes through the first side surface 4141, while one end of the first SOA pin 4302, one end of the first LD pin 4303, one end of the first TEC pin 4312, and one end of the second TEC pin 4313 each pass through the second side surface 4142. The second ground pin 4308 is located between the first high-frequency pin 4301 and the second high-frequency pin 4305. The first ground pin 4304 is located on the side of the first high-frequency pin 4301 away from the second high-frequency pin 4305.

[0307] In some embodiments, the pins extending through the first side surface 4141 form a first row of pins 430a, and the pins extending through the second side surface 4142 form a second row of pins 430b. That is, the pins disposed on the third side wall 414 are arranged in two rows. The pins in the first row of pins 430a are staggered with the pins in the second row of pins 430b to facilitate pin bonding and adaption to flexible printed circuit boards, while also reducing the risk of air leakage caused by deformation of the insulating layer used to secure the pins.

[0308] In some embodiments, the MPD pin 4311 and the second SOA pin 4306 are located in a row, and the second LD pin 4307 , the third LD pin 4309 , and the fourth LD pin 4310 are located in a row.

[0309] In some embodiments, the sixth connection hole 4121 is a stepped through hole that gradually becomes smaller from one side of the boss 4122 to the inside of the second housing 410. A sealing window 4123 is provided in the sixth connection hole 4121 at the boss 4122 to seal the sixth connection hole 4121.

[0310] FIG45 is a transmission optical path diagram of an optical transmission signal provided according to some embodiments of the present disclosure, and FIG45 shows the transmission optical path of the optical transmission signal. As shown in Figure 45, the first wavelength optical signal generated by the first laser assembly 440 is transmitted to the first lens 4181, collimated by the first lens 4181, and then transmitted to the third filter 417. It is transmitted through the third filter 417 to the second filter 416, and then transmitted to the sixth connection hole 4121 through the second filter 416; the second wavelength optical signal generated by the second laser assembly 450 is transmitted to the second lens 4182, collimated by the second lens 4182, and then transmitted to the third filter 417. It is reflected by the third filter 417 and transmitted to the second filter 416, and then transmitted to the sixth connection hole 4121 through the second filter 416; the third wavelength optical signal generated by the third laser assembly 460 is transmitted to the third lens 4183, collimated by the third lens 4183, and then transmitted to the second filter 416. It is reflected by the second filter 416 and transmitted to the sixth connection hole 4121. The second filter 416 and the third filter 417 allow the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal to share a common optical path when outputting from the second housing 410 .

[0311] Figure 46 is a schematic diagram (I) of the structure of a mounting bracket according to some embodiments of the present disclosure. Figure 47 is a schematic diagram (II) of the structure of a mounting bracket according to some embodiments of the present disclosure. Figure 48 is a diagram of a mounting bracket in use according to some embodiments of the present disclosure. As shown in Figures 46-48, mounting bracket 470 includes a bracket body 471, with first and second supports 472 and 473 disposed on its sides. The bottom of bracket body 471 is connected to support plate 419. One end of first support 472 is connected to bracket body 471, and the other end of first support 472 extends away from bracket body 471. One end of second support 473 is connected to bracket body 471, and the other end of second support 473 extends away from bracket body 471. A gap 474 is formed between first support 472 and second support 473. Gap 474 allows transmission of the first and third wavelength optical signals.

[0312] In some embodiments, a first support surface 4721 is provided on one side of the first support body 472, a second support surface 4722 is provided on the other side of the first support body 472, a third support surface 4731 is provided on one side of the second support body 473, and a fourth support surface 4732 is provided on the other side of the second support body 473. The first support surface 4721 and the third support surface 4731 are inclined at a first preset angle, while the second support surface 4722 and the fourth support surface 4732 are inclined at a second preset angle. The first support surface 4721 and the third support surface 4731 support and connect the second optical filter 416, while the second support surface 4722 and the fourth support surface 4732 support and connect the third optical filter 417, thereby facilitating the fixing of the second filter 416 and the third filter 417.

[0313] In some embodiments, the bracket body 471 is further provided with a first limiting surface 4711 and a second limiting surface 4712, respectively located on the side edges of the bracket body 471. The first limiting surface 4711 is located at one end of the first support surface 4721, and the second limiting surface 4712 is located at one end of the second support surface 4722. For example, one end of the first limiting surface 4711 and one end of the second limiting surface 4712 extend to the top of the bracket body 471, respectively, while the other ends of the first limiting surface 4711 and the other ends of the second limiting surface 4712 extend to the bottom of the bracket body 471. The first limiting surface 4711 is provided for retaining the second filter 416, while the second limiting surface 4712 is provided for retaining the third filter 417. The first limiting surface 4711 and the second limiting surface 4712 facilitate precise assembly of the second filter 416 and the third filter 417.

[0314] In some embodiments, a first driver chip 320, a second driver chip 330, a third driver chip 340, and an MCU 350 are provided on the circuit board 300. The first driver chip 320 is electrically connected to the first laser assembly 440 and the second light receiving component 540. The first driver chip 320 is used to drive the first laser assembly 440 to generate a first wavelength optical signal and receive and process the electrical signal output by the second light receiving component 540 when receiving the fifth wavelength optical signal; the second driver chip 330 is electrically connected to the second laser assembly 450 and the first light receiving component 530. The second driver chip 330 is used to drive the second laser assembly 450 to generate a second wavelength optical signal and receive and process the electrical signal output by the first light receiving component 530 when receiving the fourth wavelength optical signal; the third driver chip 340 is electrically connected to the third laser assembly 460 and the third light receiving component 550. The third driver chip 340 is used to drive the second laser assembly 450 to generate a third wavelength optical signal and receive and process the electrical signal output by the third light receiving component 550 when receiving the sixth wavelength optical signal. The MCU 350 is connected to the gold finger 310 and controls the connection between the first driver chip 320 , the second driver chip 330 and the third driver chip 340 .

[0315] In some examples, the optical receiving component 500 includes a transceiver cavity 510 and a plurality of optical receiving assemblies connected to the transceiver cavity 510. For example, the plurality of optical receiving assemblies include a first optical receiving assembly 520, a second optical receiving assembly 530, and a third optical receiving assembly 540.

[0316] In some embodiments, the optical emitting component 400 utilizes a micro-optical package, and the first optical receiving assembly 520, the second optical receiving assembly 530, and the third optical receiving assembly 540 utilize a coaxial package. Exemplarily, the receiving optical axes of the first optical receiving assembly 520, the second optical receiving assembly 530, and the third optical receiving assembly 540 are parallel to each other. That is, the first optical receiving assembly 520, the second optical receiving assembly 530, and the third optical receiving assembly 540 each include a receiving tube cap and a receiving tube socket. The receiving tube cap is mounted on the receiving tube socket to form a receiving cavity. A light receiving chip is disposed within the receiving cavity. The light receiving chip receives optical signals and converts them into electrical signals.

[0317] The receiver socket is also provided with a receiver pin, one end of which is connected to the first circuit board 301 via the second circuit board 302, thereby electrically connecting the receiver pin and the first circuit board 301. The receiver pin extends upward from the bottom of the receiver socket until it extends beyond the top of the receiver socket, where it is wired to the pad where the optical receiver chip is located, thereby electrically connecting the receiver pin and the optical receiver chip, thereby transmitting the electrical signal to the first circuit board 301 through the receiver pin.

[0318] In some embodiments, the optical module 200 is configured to receive a beam of optical signals including three wavelength ranges and to transmit a beam of optical signals including three wavelength ranges. For example, the optical transmitting component 400 is configured to output a beam of optical signals including a first wavelength, a second wavelength, and a third wavelength, the first optical receiving component 520 is configured to receive an optical signal at a fourth wavelength, the second optical receiving component 530 is configured to receive an optical signal at a fifth wavelength, and the third optical receiving component 540 is configured to receive an optical signal at a sixth wavelength.

[0319] In some embodiments, the first side of the transceiver cavity 510 is connected to the fiber optic adapter 700, the second side of the transceiver cavity 510 is provided with the first light receiving assembly 520, the second light receiving assembly 530, and the third light receiving assembly 540, and the third side of the transceiver cavity 510 is provided with the light emitting component 400. For example, the first side of the transceiver cavity 510 is adjacent to the optical port of the optical module, the second side of the transceiver cavity 510 is adjacent to the lower side plate 2022 of the lower housing 202, and the third side of the transceiver cavity 510 is adjacent to the electrical port of the optical module.

[0320] In some embodiments, a first connection hole is provided on the first side of the transceiver cavity 510, a second connection hole is provided on the second side of the transceiver cavity 510, a third connection hole is provided on the fourth side of the transceiver cavity 510, and a fifth connection hole is provided on the third side of the transceiver cavity 510. The first connection hole, the second connection hole, the third connection hole, the fourth connection hole, and the fifth connection hole are respectively connected to the inner cavity of the transceiver cavity 510. The other end of the fiber optic adapter 700 is connected to the first connection hole; the first light receiving assembly 520 is connected to the second connection hole, the second light receiving assembly 530 is connected to the third connection hole, the third light receiving assembly 540 is connected to the fourth connection hole, and the light emitting component 400 is connected to the fifth connection hole. For example, the second connection hole, the third connection hole, and the fourth connection hole are arranged in sequence on the second side of the transceiver cavity 510.

[0321] Figure 49 is a structural diagram of a fiber optic adapter and a transceiver cavity according to some embodiments. Figure 50 is an exploded view of the fiber optic adapter and transceiver cavity according to some embodiments. Figure 51 is a cross-sectional view of the fiber optic adapter and transceiver cavity according to some embodiments. As shown in Figures 49, 50, and 51, in some embodiments, a fiber optic adapter 700 is disposed on a first side of a transceiver cavity 510. One end of the fiber optic adapter 700 is used to connect to an optical fiber, and the other end of the fiber optic adapter 700 communicates with the transceiver cavity 510, enabling optical connection of the transceiver cavity 510 to the optical fiber through the fiber optic adapter 700. For example, a first connection hole 5111 is disposed on one side of the transceiver cavity 510, and a connecting sleeve 710 is disposed on the other end of the fiber optic adapter 700. One end of the connecting sleeve 710 is embedded with the fiber optic adapter 700, and the other end of the connecting sleeve 710 connects to the transceiver cavity 510, connecting the fiber optic adapter 700 to the first connection hole 5111. The connecting sleeve 710 facilitates connection of the fiber optic adapter 700 to the transceiver cavity 510. Exemplarily, the other end of the optical fiber adapter 700 is embedded in the connecting sleeve 710 , and the end of the optical fiber ferrule in the optical fiber adapter 700 is located in the connecting sleeve 710 .

[0322] In some embodiments, the first connection hole 5111 extends from the inside of the transceiver cavity 510 to the outside of the transceiver cavity 510, that is, the first connection hole 5111 is a through hole that passes through the first side panel of the transceiver cavity 510, so as to facilitate the transmission of optical signals back and forth between the transceiver cavity 510 and the optical fiber adapter 700 outside the transceiver cavity 510.

[0323] In some embodiments, a fourth lens 5174 is disposed within the first connection hole 5111. The fourth lens 5174 is used to collimate / converge optical signals. For example, optical signals transmitted from the transceiver cavity 510 to the fiber optic adapter 700 are converged by the fourth lens 5174, while optical signals transmitted from the fiber optic adapter 700 to the transceiver cavity 510 are collimated by the fourth lens 5174. The fourth lens 5174 disposed within the first connection hole 5111 saves space within the transceiver cavity 510 that would otherwise be occupied by the fourth lens 5174, helping to reduce the size of the optical receiving component 500 and facilitating assembly of the optical receiving component 500 within the optical module.

[0324] In some embodiments, a second connection hole 5121, a third connection hole 5122, and a fourth connection hole 5123 are provided on the second side of the transceiver cavity 510. The top of the first light receiving assembly 520 is embedded in the second connection hole 5121, the top of the second light receiving assembly 530 is embedded in the third connection hole 5122, and the top of the third light receiving assembly 540 is embedded in the fourth connection hole 5123. The separation of the second connection hole 5121, the third connection hole 5122, and the fourth connection hole 5123 allows the first light receiving assembly 520, the second light receiving assembly 530, and the third light receiving assembly 540 to be isolated from each other, effectively reducing high-frequency crosstalk, thermal crosstalk, etc. between the first light receiving assembly 520, the second light receiving assembly 530, and the third light receiving assembly 540. For example, corresponding connection holes are embedded in the receiving tube caps of the first light receiving assembly 520, the second light receiving assembly 530, and the third light receiving assembly 540.

[0325] In some embodiments, a fifth connection hole 5131 is provided on the third side of the transceiver cavity 510, one end of the fifth connection hole 5131 is connected to the inner cavity of the transceiver cavity 510, the other end of the fifth connection hole 5131 is connected to one end of the connecting portion 5132, the other end of the connecting portion 5132 is connected to the light emitting component 400, and a fourth through hole 51321 is provided inside the connecting portion 5132, the fourth through hole 51321 is connected to the fifth connection hole 5131, so that the optical signal emitted by the light emitting component 400 can be incident on the interior of the transceiver cavity 510.

[0326] Figure 52 is an exploded view of a transceiver cavity according to some embodiments. Figure 53 is a structural diagram of a transceiver housing according to some embodiments. As shown in Figures 52 and 53, in some embodiments, transceiver cavity 510 includes a transceiver cover 515 and a transceiver housing. The transceiver cover 515 covers the transceiver housing to form transceiver cavity 510. A second optical assembly 517 is disposed within transceiver cavity 510 to transmit optical signals to fiber optic adapter 700 and receive optical signals transmitted by fiber optic adapter 700.

[0327] In some embodiments, the transceiver housing is recessed inward to form an accommodating cavity 516 , and the second optical component 517 is disposed in the accommodating cavity 516 to accommodate the second optical component 517 .

[0328] In some embodiments, the transceiver housing has an opening. For example, the transceiver housing includes a first transceiver side panel 511, a second transceiver side panel 512, a third transceiver side panel 513, and a fourth transceiver side panel 514. The first transceiver side panel 511, the second transceiver side panel 512, the third transceiver side panel 513, and the fourth transceiver side panel 514 are connected end to end in sequence. The first transceiver side panel 511, the second transceiver side panel 512, the third transceiver side panel 513, and the fourth transceiver side panel 514 are located at the edge of the accommodating cavity 516. The first transceiver side panel 511 is located on a first side of the transceiver housing, the second transceiver side panel 512 is located on a second side of the transceiver housing, the third transceiver side panel 513 is located on a third side of the transceiver housing, and the fourth transceiver side panel 514 is located on a fourth side of the transceiver housing. The fourth side of the transceiver housing is adjacent to the lower side panel 2022 of the lower housing 202 and is located on a different side of the transceiver housing than the second side of the transceiver housing. The first transceiver side panel 511 is provided with a first connection hole 5111, the second transceiver side panel 512 is provided with a second connection hole 5121, a third connection hole 5122, and a fourth connection hole 5123, and the third transceiver side panel 513 is provided with a fifth connection hole 5131. Exemplarily, the first transceiver side panel 511, the second transceiver side panel 512, the third transceiver side panel 513, and the fourth transceiver side panel 514 are integrally formed.

[0329] In some embodiments, the third transceiver side panel 513 includes a first sub-transceiver side panel 5133 and a second sub-transceiver side panel 5134, one end of the first sub-transceiver side panel 5133 is connected to the second transceiver side panel 512, the other end of the first sub-transceiver side panel 5133 is connected to one end of the second sub-transceiver side panel 5134, and the other end of the second sub-transceiver side panel 5134 is connected to the fourth transceiver side panel 514, so that the third transceiver side panel 513 has an avoidance notch to avoid the light emitting component 400.

[0330] In some embodiments, the second sub-transceiver side panel 5134 is provided with an avoidance gap 5135, which is formed by the inner wall of the second sub-transceiver side panel 5134 being recessed toward the outer wall of the second sub-transceiver side panel 5134, and the side wall of the avoidance gap 5135 includes one end of the fifth connection hole 5131.

[0331] In some embodiments, the accommodating cavity 516 includes a first accommodating cavity, a second accommodating cavity 5165 and a third accommodating cavity 5166, and the first accommodating cavity, the second accommodating cavity 5165 and the third accommodating cavity 5166 are interconnected so that the optical signal can be transmitted from the first accommodating cavity to the second accommodating cavity 5165 and from the first accommodating cavity to the third accommodating cavity 5166.

[0332] In some embodiments, the first transceiver side panel 511 and the second transceiver side panel 512 form a second accommodating cavity 5165 , and the first sub-transceiver side panel 5133 and the second transceiver side panel 512 form a third accommodating cavity 5166 .

[0333] In some embodiments, the first accommodating cavity includes an accommodating cavity body 5163, a storage piece 5169, a second storage groove 5162 and a third storage groove 5164, the first connecting hole 5111 is located on the first side of the accommodating cavity body 5163, the third storage groove 5164 is located on the second side of the accommodating cavity body 5163, the storage piece 5169 is located on the third side of the accommodating cavity body 5163, the second storage groove 5162 is located on the fourth side of the accommodating cavity body 5163, the second storage groove 5162 and the third storage groove 5164 are more recessed relative to the accommodating cavity body 5163, and the storage piece 5169 is more protruding relative to the accommodating cavity body 5163.

[0334] The third storage groove 5164 is communicated with the accommodating cavity body 5163, the second accommodating cavity 5165 and the third accommodating cavity 5166 respectively, so that the first accommodating cavity, the second accommodating cavity 5165 and the third accommodating cavity 5166 are communicated with each other.

[0335] In some embodiments, the first end of the placement piece 5169 is connected to the accommodating cavity body 5163, and the second end of the placement piece 5169 is connected to the inner side wall of the second sub-transceiver side panel 5134 of the third transceiver side panel 513. The placement piece 5169 is more recessed relative to the second sub-transceiver side panel 5134 to facilitate the mounting of optical components.

[0336] In some embodiments, a first storage groove 5161 is provided on the storage member 5169. The first storage groove 5161 is located between the accommodating cavity body 5163 and the avoidance gap 5135. The first storage groove 5161 is recessed relative to the storage member 5169 to facilitate the placement of optical components.

[0337] In some embodiments, the first storage slot 5161 is located between the accommodating cavity body 5163 and the second sub-transceiver side plate 5134 of the third transceiver side plate 513, the first port of the first storage slot 5161 is connected to the fifth connecting hole 5131, and the second port of the first storage slot 5161 is located at the notch of the first support surface 5167, so that the second port of the first storage slot 5161 is connected to the accommodating cavity body 5163, so that the optical signal incident through the fifth connecting hole 5131 can be transmitted along the first storage slot 5161 to the accommodating cavity body 5163.

[0338] In some embodiments, the central axes of the first port of the first storage slot 5161 and the second port of the first storage slot 5161 do not coincide with each other, that is, the first port of the first storage slot 5161 and the second port of the first storage slot 5161 do not coincide with each other on the Y axis.

[0339] In some embodiments, the accommodating cavity body 5163 includes a first sidewall and a second sidewall. The first sidewall of the accommodating cavity body 5163 is disposed opposite the second sidewall of the accommodating cavity body 5163. The second sidewall of the accommodating cavity body 5163 is connected to the first end of the storage member 5169. The second sidewall of the accommodating cavity body 5163 includes a first support surface 5167. The first support surface 5167 is the connection surface between the first storage slot 5161 and the accommodating cavity body 5163. The first support surface 5167 is used to support a portion of the second optical assembly. For example, the first support surface 5167 is an inclined surface, sloping from one end to the other end along the inner sidewall of the third transceiver side plate 513. That is, the central axis of the fifth connection hole 5131 is not perpendicular to the first support surface 5167.

[0340] In some embodiments, the second side wall of the accommodating cavity body 5163 also includes a second supporting surface 5168, which is used to support part of the second optical component. The first supporting surface 5167 and the second supporting surface 5168 are connected, and the first supporting surface 5167 and the second supporting surface 5168 are arranged non-parallel to each other, so that the second supporting surface 5168 is arranged parallel to the inner wall of the second sub-transceiver side panel 5134.

[0341] FIG54 is a light path diagram of a second optical assembly according to some embodiments. As shown in FIG54 , in some embodiments, the second optical assembly 517 includes a first displacement prism 5171, a first optical filter 5172, a second displacement prism 5173, a fourth lens 5174, a first reflector 5175, a wave splitter 5176, a second optical filter 5177, a third displacement prism 5178, and a fourth displacement prism 5179. The fourth lens 5174 is located in the first connecting hole 5111, and the first displacement prism 5171, the first optical filter 5172, the second displacement prism 5173, the first reflector 5175, the wave splitter 5176, the second optical filter 5177, the third displacement prism 5178, and the fourth displacement prism 5179 are located in the accommodating cavity 516.

[0342] The first port of the first storage slot 5161 and the second port of the first storage slot 5161 do not overlap on the Y-axis. To adjust the position of the optical signal on the Y-axis so that the optical signal propagates from the first port of the first storage slot 5161 to the second port of the first storage slot 5161, in some embodiments, a first displacement prism 5171 is disposed within the first storage slot 5161. The optical signal enters the first displacement prism 5171 through the incident surface of the first displacement prism 5171. The optical signal is reflected from the first reflection surface of the first displacement prism 5171 to the second reflection surface of the first displacement prism 5171. The optical signal is then reflected from the second reflection surface of the first displacement prism 5171 to the exit surface of the first displacement prism 5171, and then exits through the exit surface of the first displacement prism 5171.

[0343] In some embodiments, a first optical filter 5172 is disposed on the first supporting surface 5167, covering the second port of the first storage slot 5161. The signal light output by the light emitting component 400 is transmitted to the first optical filter 5172. The first optical filter 5172 is configured to transmit the optical signal output by the light emitting component 400 and transmit it to the second displacement prism 5173. The first optical filter 5172 is also configured to reflect the optical signal output from the second displacement prism 5173 to the first reflector 5175. Exemplarily, the first surface of the first optical filter 5172 faces the second displacement prism 5173, and the second surface of the first filter 5172 rests on the first supporting surface 5167.

[0344] In some embodiments, the second displacement prism 5173 is used to adjust the position of the optical signal in the Y direction of the transceiver housing to accommodate the optical module's requirements for the assembly position of the fiber optic adapter 700 and to provide sufficient space for the installation of the first reflector 5175 and the first filter 5172. The optical signal enters the second displacement prism 5173 through its incident surface. The optical signal is reflected from its first reflective surface to its second reflective surface. The optical signal is then reflected from its second reflective surface to its exit surface, where it is emitted.

[0345] For transmitted optical signals, the incident surface of the second displacement prism 5173 refers to the side of the second displacement prism 5173 facing the first optical filter 5172, and the exit surface of the second displacement prism 5173 refers to the side of the second displacement prism 5173 facing the fourth lens 5174. For received optical signals, the incident surface of the second displacement prism 5173 refers to the side of the second displacement prism 5173 facing the fourth lens 5174, and the exit surface of the second displacement prism 5173 refers to the side of the second displacement prism 5173 facing the first optical filter 5172.

[0346] In some embodiments, the second displacement prism 5173 is located at the edge of the first connection hole 5111, so that the optical signal passing through the first connection hole 5111 is transmitted to the second displacement prism 5173, and the optical signal output by the second displacement prism 5173 is transmitted to the first connection hole 5111. Exemplarily, the first side surface of the second displacement prism 5173 abuts against the first side wall of the accommodating cavity body 5163 (i.e., the inner side wall of the first transceiver side plate 511), or the first side surface of the second displacement prism 5173 is sealedly connected to the first connection hole 5111.

[0347] In some embodiments, the first side surface of the second displacement prism 5173 is perpendicular or approximately perpendicular to the central axis of the first connecting hole 5111, so that the optical signal incident on the first side surface of the second displacement prism 5173 through the first connecting hole 5111 is transmitted perpendicularly or approximately perpendicularly to the first side surface of the second displacement prism 5173, and the optical signal output from the first side surface of the second displacement prism 5173 can be transmitted to the first connecting hole 5111 along the central axis of the first connecting hole 5111.

[0348] In some embodiments, a first reflector 5175 is disposed within the second storage slot 5162 and is configured to reflect the optical signal reflected by the first filter 5172 to the wave splitter 5176. To facilitate the first reflector 5175 reflecting the optical signal to the wave splitter 5176, the first reflector 5175 is disposed at an angle within the first accommodating cavity, that is, the reflective surface of the first reflector 5175 is non-parallel to the second side surface of the second displacement prism 5173 and the angle between the two is less than 90°.

[0349] In some embodiments, a side wall of the second storage slot 5162 is the inner side wall of the fourth transceiver side panel 514. A first support member 5141 is attached to the inner side wall of the fourth transceiver side panel 514. The first side wall of the first support member 5141 is attached parallel to the inner side wall of the fourth transceiver side panel 514. The second side wall of the first support member 5141 is perpendicular to the first side wall of the first support member 5141. The third side wall of the first support member 5141 is connected to the first side wall and the second side wall of the first support member 5141 at both ends, respectively. The third side wall of the first support member 5141 is an inclined surface, i.e., one end of the third side wall of the first support member 5141 is closer to the first side wall of the first support member 5141 than the other end of the third side wall of the first support member 5141. For example, a first reflector 5175 is attached to the third side wall of the first support member 5141.

[0350] In some embodiments, the side of the splitter 5176 rests on the second support surface 5168 , and the side of the splitter 5176 contacts the positioning notch 51681 , and the positioning notch 51681 facilitates the positioning and assembly of the splitter 5176 .

[0351] In some embodiments, a wave splitter 5176 is disposed at the bottom of the housing cavity body 5163, with the light incident side of the wave splitter 5176 facing the first reflector 5175 and the light splitting output side of the wave splitter 5176 facing the second transceiver side panel 512. The wave splitter 5176 is configured to split the optical signal reflected by the first reflector 5175 according to wavelength. Exemplarily, the wave splitter 5176 splits a beam of optical signals including a fourth wavelength, a fifth wavelength, and a sixth wavelength into three beams according to wavelength.

[0352] In some embodiments, a third displacement prism 5178 is disposed in the second accommodating cavity 5165, and the fourth wavelength optical signal output by the wave splitter 5176 is transmitted to the third displacement prism 5178. A fourth displacement prism 5179 is disposed in the third accommodating cavity 5166, and the sixth wavelength optical signal output by the wave splitter 5176 is transmitted to the fourth displacement prism 5179. The third displacement prism 5178 and the fourth displacement prism 5179 are used to adjust the position of the optical signal in the X direction of the transceiver housing, so that the optical signal split by the wave splitter 5176 can be transmitted to the corresponding first optical receiving assembly 520, second optical receiving assembly 530, and third optical receiving assembly 540.

[0353] In some embodiments, multiple second filters are disposed within the second and third accommodating cavities 5165 and 5166, such as a second filter disposed at the output end of the third displacement prism 5178 and a second filter disposed at the output end of the fourth displacement prism 5179. The second filters are used to filter the optical signal before it enters the corresponding optical receiving component, reducing noise in the corresponding wavelength optical signal and ensuring the quality of optical signal reception. For example, a second filter 5177 is disposed within the third storage slot 5164 and is located at the end of the third connecting hole 5122. The second filter 5177 is located at the light input front end of the second optical receiving assembly 530. The second filter 5177 is used to filter out noise in the optical signal about to enter the second optical receiving assembly 530, thereby improving the quality of the light entering the second optical receiving assembly 530.

[0354] As shown in Figure 12, the emission light signal output by the light emitting component 400 is first adjusted in position in the Y direction by the first displacement prism 5171 and then incident on the first filter 5172, then incident on the second displacement prism 5173 through the first filter 5172, and then adjusted in position in the Y direction by the second displacement prism 5173 and incident on the fourth lens 5174, and finally converged by the fourth lens 5174.

[0355] A beam of received optical signals including the fourth wavelength, the fifth wavelength and the sixth wavelength is first collimated by the fourth lens 5174 and then transmitted to the second displacement prism 5173. Then, the position in the Y direction is adjusted by the second displacement prism 5173 and then incident on the first filter 5172. Then, the received optical signals are reflected by the first filter 5172 again and transmitted to the first reflector 5175. Then, the received optical signals are reflected by the first reflector 5175 and transmitted to the wavelength splitter 5176. Finally, the received optical signals are split into the fourth wavelength optical signal, the fifth wavelength optical signal and the sixth wavelength optical signal according to the wavelength of the optical signals by the wavelength splitter 5176.

[0356] The light signal is reflected by the first reflection surface of the second displacement prism 5173 to the second reflection surface of the second displacement prism 5173 , and then reflected by the second reflection surface of the second displacement prism 5173 to the exit surface of the second displacement prism 5173 , and then emitted through the exit surface of the second displacement prism 5173 .

[0357] The fourth wavelength optical signal is transmitted to the incident surface of the third displacement prism 5178. The optical signal passes through the incident surface of the third displacement prism 5178 and is incident on the first reflection surface of the third displacement prism 5178. The optical signal is reflected from the first reflection surface of the third displacement prism 5178 to the second reflection surface of the third displacement prism 5178. The optical signal is reflected from the second reflection surface of the third displacement prism 5178 to the exit surface of the third displacement prism 5178. The optical signal is emitted from the exit surface of the third displacement prism 5178 to the first light receiving component 520. The fifth wavelength optical signal passes through the second filter 5177 and is transmitted to the second light receiving component 530. The sixth wavelength optical signal is transmitted to the incident surface of the fourth displacement prism 5179. The optical signal passes through the incident surface of the fourth displacement prism 5179 and is incident on the first reflection surface of the fourth displacement prism 5179. The optical signal is reflected by the first reflection surface of the fourth displacement prism 5179 to the second reflection surface of the fourth displacement prism 5179. The optical signal is reflected by the second reflection surface of the fourth displacement prism 5179 to the exit surface of the fourth displacement prism 5179. The optical signal is emitted through the exit surface of the fourth displacement prism 5179 to the third light receiving component 540.

[0358] The fourth wavelength optical signal is transmitted to the first optical receiving component 520, the fifth wavelength optical signal is transmitted to the second optical receiving component 530, and the sixth wavelength optical signal is transmitted to the third optical receiving component 540. Of course, in some embodiments, the optical signal transmitted to the first optical receiving component 520 is not limited to the fourth wavelength optical signal and may also include optical signals of other wavelengths, but is mainly the fourth wavelength optical signal; the optical signal transmitted to the second optical receiving component 530 is not limited to the fifth wavelength optical signal and may also include optical signals of other wavelengths, but is mainly the fifth wavelength optical signal; the optical signal transmitted to the third optical receiving component 540 is not limited to the sixth wavelength optical signal and may also include optical signals of other wavelengths, but is mainly the sixth wavelength optical signal.

[0359] In some embodiments, the wavelength of the fourth wavelength optical signal is smaller than the wavelength of the fifth wavelength optical signal, and the wavelength of the fifth wavelength optical signal is smaller than the wavelength of the sixth wavelength optical signal. For example, the wavelength range of the fourth wavelength optical signal received by the first optical receiving component 520 is 1260-1280 nm, such as the wavelength of the fourth wavelength optical signal is 1270 nm; the wavelength range of the fifth wavelength optical signal received by the second optical receiving component 530 is 1284-1288 nm, such as the wavelength of the fifth wavelength optical signal is 1286 nm; and the wavelength range of the sixth wavelength optical signal received by the third optical receiving component 540 is 1290-1330 nm, such as the wavelength of the sixth wavelength optical signal is 1310 nm.

[0360] The first optical receiving assembly 520, the second optical receiving assembly 530, and the third optical receiving assembly 540 each include a photodetector, which is used to receive optical signals and convert them into electrical signals. In some embodiments, the receiving rate of the photodetector in the second optical receiving assembly 530 is greater than the receiving rate of the photodetector in the first optical receiving assembly 520, and the receiving rate of the photodetector in the second optical receiving assembly 530 is greater than the receiving rate of the photodetector in the third optical receiving assembly 540. This ensures that the optical path of the fifth wavelength optical signal with the highest transmission rate from the output of the demultiplexer 5176 to the photodetector is relatively short and simple, allowing the photodetector in the second optical receiving assembly 530 to receive the optical signal with high coupling efficiency. For example, the receiving rate of the photodetector in the first optical receiving assembly 520 is 10G, the receiving rate of the photodetector in the second optical receiving assembly 530 is 50G, and the receiving rate of the photodetector in the third optical receiving assembly 540 is 2.5G.

[0361] In some embodiments, one end of the light emitting component 400 is connected to the second sub-transceiver side panel 5134, and one side of the light emitting component 400 is close to the first sub-transceiver side panel 5133, so that the light emitting component 400 is located at the avoidance notch of the transceiver housing, thereby making the assembly of the light emitting component 400 and the light receiving component 500 more compact, effectively reducing the overall size of the light emitting component 400 and the light receiving component 500. Figure 55 is a structural schematic diagram of a first housing provided according to some embodiments of the present disclosure, Figure 56 is a decomposed schematic diagram of a first housing provided according to some embodiments of the present disclosure, and Figure 57 is a structural schematic diagram of a first housing provided according to some embodiments of the present disclosure. As shown in Figures 55-57, a accommodating cavity 517 is formed inside the first housing 510, and the first connecting hole 511, the second connecting hole 512, the third connecting hole 513 and the fourth connecting hole 514 are respectively connected to the accommodating cavity 517.

[0362] In some embodiments, a first displacement prism 561, a first reflector 562, a first filter 563, a wavelength division multiplexer 564, a second displacement prism 565, a third displacement prism 566, and a fourth displacement prism 567 are disposed within the accommodating cavity 517. A first mounting surface 518 is provided on the top of the first housing 510, and the first mounting surface 518 supports and connects to the first upper cover 520.

[0363] Figure 58 shows a first housing in use according to some embodiments of the present disclosure, and Figure 59 shows a second first housing in use according to some embodiments of the present disclosure. As shown in Figures 55-59, the accommodating chamber 517 includes a first accommodating chamber 5171, a second accommodating chamber 5172, and a third accommodating chamber 5173. The first side of the first accommodating chamber 5171 communicates with the fourth connection hole 514. The second accommodating chamber 5172 is disposed on the second side of the first accommodating chamber 5171. A first baffle 5174 is disposed between the second accommodating chamber 5172 and the first accommodating chamber 5171. The first baffle 5174 defines a first through cavity 5175, which connects the first accommodating chamber 5171 with the second accommodating chamber 5172. The top of the first baffle 5174 supports and connects to the first upper cover 520. A third accommodating cavity 5173 is provided on the third side of the first accommodating cavity 5171. A second baffle 5176 is provided between the first and third accommodating cavities 5171 and 5173. A second through cavity 5177 is defined in the second baffle 5176, connecting the first and third accommodating cavities 5171 and 5173. The second accommodating cavity 5172 extends from one end of the first housing 510 to the other end of the first housing 510, with the other end of the second accommodating cavity 5172 extending to the side of the notched corner 510b. The third accommodating cavity 5173 is located on the side of the fifth connecting hole 5102 and is connected to the fifth connecting hole 5102.

[0364] The first displacement prism 561, the first reflector 562, the first optical filter 563, and the wavelength division multiplexer 564 are disposed in the first accommodating cavity 5171, the second displacement prism 565 and the third displacement prism 566 are disposed in the second accommodating cavity 5172, and the fourth displacement prism 567 is disposed in the third accommodating cavity 5173. Exemplarily, the sides of the second displacement prism 565 and the third displacement prism 566 abut against the sidewall of the first baffle 5174, which fixedly supports the second displacement prism 565 and the third displacement prism 566. The first optical filter 563 is disposed on the second baffle 5176, which fixedly supports the first optical filter 563.

[0365] In the embodiment of the present disclosure, the fourth displacement prism 567 is used to make the fifth connecting hole 5102 closer to the center line of the first shell 510 to adapt to the light emitting component 400, and to make the assembly of the light emitting component 400 and the optical accommodating component 500 more concentrated, thereby facilitating the reduction of the space occupied by assembling the light emitting component 400 and the optical accommodating component 500 in the optical module, and adapting to the requirements of multiple transmission channels of the optical module.

[0366] In some embodiments, a mounting base 568 is further disposed within the accommodating cavity 517. The bottom of the mounting base 568 is connected to the bottom of the first accommodating cavity 5171, and the side of the mounting base 568 securely supports the first reflector 562. For example, the first reflector 562 is first secured to the mounting base 568, then positioned to a predetermined position through optical coupling, and the mounting base 568 is secured. The mounting base 568 facilitates securing the first reflector 562 within the first accommodating cavity 5171.

[0367] In some embodiments, an opening 519 is provided on the fourth side of the first accommodating cavity 5171. The opening 519 is located on the side of the mounting base 568, and a sealing plate 5191 is provided in the opening 519. The opening 519 is provided on the fourth side of the first accommodating cavity 5171 to facilitate the fixed installation of the mounting base 568, thereby facilitating the fixation of the first reflector 562 in the first accommodating cavity 5171. Exemplarily, when the first reflector 562 is set to a preset position through optical coupling, an optical fixing device irradiates the mounting base 568 with light for optical fixation through the opening 519, thereby fixing the mounting base 568 to the bottom plate of the first accommodating cavity 5171. After the mounting base 568 is optically fixed to the first accommodating cavity 5171, the sealing plate 5191 is fixed to the opening 519.

[0368] FIG60 is a cross-sectional view of an optical receiving component according to some embodiments of the present disclosure, illustrating the optical transmission paths of optical receiving and transmitting signals within the optical receiving component. The optical transmitting signal output by the optical transmitting component 400 is transmitted through the fifth connection hole 5102 to the incident surface of the fourth displacement prism 567, then transmitted through the incident surface of the fourth displacement prism 567 to the first reflection surface of the fourth displacement prism 567. The optical transmitting signal is then reflected from the first reflection surface of the fourth displacement prism 567 to the second reflection surface of the fourth displacement prism 567, then transmitted to the light exiting surface of the fourth displacement prism 567. The light exiting surface of the fourth displacement prism 567 is then transmitted to the first optical filter 563, then to the first displacement prism 561, and then out of the fourth connection hole 514 along the output optical path of the first displacement prism 561. The signal is then converged by the first lens 516 and transmitted to the optical fiber adapter 700. The optical receiving signal is transmitted to the first lens 516 through the optical fiber adapter 700, collimated by the first lens 516 and transmitted to the light incident surface of the first displacement prism 561, then transmitted to the first reflection surface of the first displacement prism 561 through the light incident surface of the first displacement prism 561, reflected by the first reflection surface of the first displacement prism 561 and transmitted to the second reflection surface of the first displacement prism 561, then reflected by the second reflection surface of the first displacement prism 561 and transmitted to the light exit surface of the first displacement prism 561, then transmitted through the light exit surface of the first displacement prism 561 to the first filter 563, reflected by the first filter 563 and transmitted to the first reflection mirror 562, and then reflected by the first reflection mirror 562 and transmitted to the wavelength division multiplexer 564. If the received optical signal includes an optical signal with a fourth wavelength, the fourth wavelength optical signal is transmitted to the second shifting prism 565 via the wavelength division multiplexer 564, and then transmitted to the first optical receiving component 530 via the second shifting prism 565. If the received optical signal includes an optical signal with a fifth wavelength, the fifth wavelength optical signal is transmitted to the second optical receiving component 540 via the wavelength division multiplexer 564. If the received optical signal includes an optical signal with a sixth wavelength, the sixth wavelength optical signal is transmitted to the third shifting prism 566 via the wavelength division multiplexer 564, and then transmitted to the third optical receiving component 550 via the third shifting prism 566.

[0369] In some embodiments, a filter 541 is provided at the light input front end of the second light receiving component 540 , and the filter 541 is used to filter out the clutter in the optical signal that is about to be incident on the second light receiving component 540 , thereby improving the quality of the optical signal incident on the second light receiving component 540 .

[0370] In some embodiments, an isolator 569 is provided in the fifth connection hole 5102. The isolator 569 is used to prevent the light emission signal reflected back by the fourth displacement prism 567 from re-entering the second shell 410, thereby reducing the impact of the reflected light emission signal on the light emission signal generated by the light emission component 400.

[0371] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: Fiber optic adapter, one end of which is used to connect to an external optical fiber; The optical accommodating component comprises a first shell and a first upper cover, wherein the first upper cover is connected to the first shell; wherein one end of the first shell is connected to the other end of the optical fiber adapter, the other end of the first shell is formed with a notch, and a fifth connecting hole is formed on the side wall of the other end of the first shell; one side of the first shell is connected to the first light receiving component and the second light receiving component, and one side of the first shell extends from the side edge of one end of the first shell to the side edge of the notch; a second baffle is formed in the first shell, one side of the second baffle supports and connects the first optical filter, and the other side of the second baffle is provided with a fourth displacement prism, one end of the fourth displacement prism is located on the side of the fifth connecting hole, and the other end of the fourth displacement prism is located on the side of the first optical filter; The light emitting component is located in the missing corner and includes: A laser assembly, configured to emit a first wavelength optical signal and a second wavelength optical signal; A wave combining component is configured to combine multiple beams of the first wavelength optical signal and the second wavelength optical signal into one beam; the wave combining component includes a first wave combining component and a second wave combining component, the first wave combining component is configured to reflect the first wavelength optical signal, and the second wave combining component is configured to reflect one of the first wavelength optical signal and the second wavelength optical signal and transmit the other of the first wavelength optical signal and the second wavelength optical signal to achieve beam combining.

2. The optical module according to claim 1, wherein: The light emitting component further comprises: Pipe socket; A pipe cap, which is arranged above the pipe seat and is provided with a light window; A TEC, located above the tube holder; A first substrate, located above the TEC, the first substrate carrying a first light emitting component and a second substrate; The second substrate carries the wave combining component and the second light emitting component; Wherein: the first optical transmitting component is configured to transmit the first wavelength optical signal, and the second optical transmitting component is configured to transmit the second wavelength optical signal; The wave combining component is located between the first light emitting component and the second light emitting component; The first wavelength combining element has a first reflection layer, and the first wavelength optical signal is reflected on the first reflection layer; The second wavelength combining element has a second reflection layer, the second wavelength optical signal is reflected on the second reflection layer, and the first wavelength optical signal is transmitted through the second reflection layer; The first wavelength optical signal and the second wavelength optical signal are combined by the combining component and then transmitted through the optical window.

3. The optical module according to claim 2, wherein: The first reflective layer is arranged vertically to the second reflective layer; The central axis of the first light emitting assembly is lower than the bisector of the angle between the first reflecting layer and the second reflecting layer; The central axis of the second light emitting assembly is higher than the bisector of the first reflecting layer and the second reflecting layer.

4. The optical module according to claim 2, wherein: The wave combining component comprises: a first right angle prism, a second right angle prism and a third right angle prism; the first right angle prism is configured as the first wave combining component, and the third right angle prism is configured as the second wave combining component; Wherein, the hypotenuse of the first right-angle prism is connected to a right-angle side of the second right-angle prism; The hypotenuse of the third right-angle prism is connected to the other right-angle side of the second right-angle prism; The hypotenuse of the second right-angle prism faces the first light emitting assembly; The first reflective layer is located between the first right-angle prism and the second right-angle prism; The second reflective layer is located between the second right-angle prism and the third right-angle prism.

5. The optical module according to claim 4, wherein: The first right-angle prism comprises a first right-angle surface, a second right-angle surface and a first inclined surface; The second right-angle prism includes a third right-angle surface, a fourth right-angle surface and a second inclined surface; The third right-angle prism comprises a fifth right-angle surface, a sixth right-angle surface and a third inclined surface; The first inclined surface is connected to the third right-angle surface; the fourth right-angle surface is connected to the third inclined surface; The second inclined surface is perpendicular to the first substrate, and faces the first light emitting component.

6. The optical module according to claim 5, wherein: The second inclined surface is provided with a first anti-reflection film, configured to increase the transmittance of the first signal light; The fifth right-angle surface is provided with a second anti-reflection film, which is configured to increase the transmittance of the second signal light; The sixth right-angle surface is provided with a third anti-reflection film, which is configured to increase the transmittance of the first signal light and the second signal light.

7. The optical module according to claim 2, characterized in that: The light emitting component further includes: a TEC pin, wherein the TEC pin is located below the second substrate, and a top of the TEC pin is lower than a lower surface of the second substrate; The TEC pin is electrically connected to the TEC.

8. The optical module according to claim 1, wherein: The laser assembly is further configured to emit a third wavelength optical signal, and the optical module further comprises: A polarization component is configured to adjust the polarization direction of an optical signal; the polarization component comprises a first polarization component, a second polarization component and a third polarization component, the first polarization component, the second polarization component and the third polarization component all comprise a first polarizer, a Faraday plate, a second polarizer and a wave plate, the first polarizer, the Faraday plate, the second polarizer and the wave plate are sequentially away from the laser component, a first wavelength optical signal sequentially passes through the first polarizer, the Faraday plate, the second polarizer and the wave plate of the first polarization component to emit a first vertical polarized light, a second wavelength optical signal sequentially passes through the first polarizer, the Faraday plate, the second polarizer and the wave plate of the second polarization component to emit a horizontal polarized light; a third wavelength optical signal sequentially passes through the first polarizer, the Faraday plate, the second polarizer and the wave plate of the third polarization component to emit a second vertical polarized light; The wave combining component further includes a third wave combining component, wherein the first wave combining component is located between the second wave combining component and the third wave combining component; The third wave combining component is configured to reflect the second vertical polarized light to the first wave combining component, the first wave combining component is configured to reflect the first vertical polarized light to the second wave combining component, and transmit the second vertical polarized light to the second wave combining component; the second wave combining component is configured to reflect the first vertical polarized light and the second vertical polarized light, and transmit the horizontal polarized light.

9. The optical module according to claim 8, wherein: The first polarizer, the Faraday plate, the second polarizer and the wave plate are sequentially connected to form an isolator; The angle between the optical axis of the wave plate of the first polarization component and the horizontal plane is a first preset angle, so that the first polarization component emits the first vertical polarized light; the angle between the optical axis of the wave plate of the second polarization component and the horizontal plane is a second preset angle, so that the second polarization component emits the horizontal polarized light; the angle between the optical axis of the wave plate of the third polarization component and the horizontal plane is a third preset angle, so that the third polarization component emits the second vertical polarized light; The first preset angle is different from the second preset angle; The polarization direction of the second polarizer of the first polarization component is the same as the polarization direction of the second polarizer of the third polarization component, so that the first preset angle is the same as the third preset angle.

10. The optical module according to claim 8, wherein: The first polarizer, the Faraday plate and the second polarizer are sequentially connected to form an isolator, and the wave plate is located outside the isolator; The angle between the optical axis of the wave plate of the first polarization component and the horizontal plane is a first preset angle, so that the first polarization component emits the first vertical polarized light; the angle between the optical axis of the wave plate of the second polarization component and the horizontal plane is a second preset angle, so that the second polarization component emits the horizontal polarized light; the angle between the optical axis of the wave plate of the third polarization component and the horizontal plane is a third preset angle, so that the third polarization component emits the second vertical polarized light; The first preset angle is different from the second preset angle; The polarization direction of the second polarizer of the first polarization component is the same as the polarization direction of the second polarizer of the third polarization component, so that the first preset angle is the same as the third preset angle.

11. The optical module according to claim 8, wherein: The first polarizer is a horizontal polarizer, and the second polarizer is a 45° polarizer; Alternatively, the first polarizer is a vertical polarizer, and the second polarizer is a 135° polarizer.

12. The optical module according to claim 8, wherein: The light emitting component further comprises a supporting member, the supporting member comprises a first supporting surface and a second supporting surface, the first supporting surface is used to support the third wave combining component, the second supporting surface is used to support the first wave combining component, and the first supporting surface is arranged in parallel with the second supporting surface; The supporting member has a first through hole and a second through hole, one end of the first through hole and one end of the second through hole are both located on the first supporting surface, the other end of the first through hole is located on a side of the supporting member facing the third polarization combining element, the other end of the second through hole is located on the second supporting surface, and the first through hole and the second through hole are connected.

13. The optical module according to claim 12, wherein: The optical emitting component further comprises an emitting housing, wherein a third through hole is provided at the first end of the emitting device, and the central axis of the third through hole coincides with the central axis of the second wave combining device, so that the optical signal combined by the second wave combining device is emitted through the third through hole; the third through hole is connected to the fifth connecting hole; The second end of the transmitting shell is provided with a transmitting pin, one end of which is connected to the circuit board, and the other end of which extends into the transmitting shell and is connected to the laser component by wire bonding.

14. The optical module according to claim 13, wherein: The launch shell includes a first launch side plate, a second launch side plate, a third launch side plate and a fourth launch side plate, the first launch side plate, the second launch side plate, the third launch side plate and the fourth launch side plate are connected end to end, the first launch side plate is provided with the third through hole, the third launch side plate includes a first sub-launching side plate, a second sub-launching side plate and a third sub-reflection plate, the first sub-launching side plate, the second sub-launching side plate and the third sub-reflection plate are stepped, the fourth launch side plate includes a fourth sub-launching side plate and a fifth sub-launching side plate, the fourth sub-launching side plate and the fifth sub-launching side plate are stepped, the first sub-launching side plate is connected to the fourth sub-launching side plate to limit the substrate, wherein the substrate support is configured as the laser component.

15. The optical module according to claim 1, further comprising: Upper shell, A lower shell body, which is covered with the upper shell body to form a cavity; A circuit board is located in the cavity. The light emitting component is located in the cavity and is electrically connected to the circuit board. The laser assembly includes: A first optical transmitting chip is configured to transmit the first wavelength optical signal; A second optical transmitting chip is configured to transmit the second wavelength optical signal; A third optical transmitting chip is configured to transmit an optical signal of a third wavelength; The first wavelength combining element is located on the light output path of the first light emitting chip and reflects the first wavelength optical signal; The second wavelength combining element is arranged in parallel with the first filter, and is configured to reflect the first wavelength optical signal from the first wavelength combining element and transmit the second wavelength optical signal; The wavelength combining component further includes: a third wavelength combining element, located on the light output path of the third optical emitting chip, and configured to reflect the third wavelength optical signal; The fourth wavelength combining component is located at one side of the second wavelength combining component, and is configured to transmit the first wavelength optical signal and the second wavelength optical signal, and reflect the third wavelength optical signal.

16. The optical module according to claim 15, wherein: The light emitting component also includes: A first collimating lens is located between the first light emitting chip and the first wave combining element; A second collimating lens is located between the second light emitting chip and the second wave combining element; The third collimating lens is located between the third light emitting chip and the third wave combining element.

17. The optical module according to claim 15, wherein: The light emitting component also includes: Second upper cover; A second shell, forming an inner cavity with the second upper cover; A transfer block is provided at one end of the second shell, one end of the transfer block is embedded in the inner cavity to be electrically connected to the first light emitting chip, the second light emitting chip and the third light emitting chip; the other end of the transfer block is electrically connected to the circuit board.

18. The optical module according to claim 17, wherein: The light emitting component also includes: TEC, located in the inner cavity; A support plate is located above the TEC, and the first light emitting chip, the second light emitting chip and the third light emitting chip are located above the support plate.

19. The optical module according to claim 15, wherein: A first reflection film is disposed on the second side of the first wavelength combining element, and the first reflection film reflects the first wavelength optical signal; a third reflection film is disposed on the fourth side of the first wavelength combining element, and the third reflection film transmits the first wavelength optical signal, and the third reflection film transmits the second wavelength optical signal; A third reflection film is provided between the third side surface of the first wave combining element and the first oblique side surface of the second wave combining element, and the third reflection film reflects the first wavelength optical signal. A fourth reflection film is disposed on the first oblique side surface of the second wavelength combining element. The first wavelength signal light and the second wavelength signal light are transmitted through the fourth reflection film, and the fourth reflection film reflects the third wavelength signal light.

20. The optical module according to claim 19, wherein: The first wave combining element comprises a first prism, wherein the first side surface and the fourth side surface are arranged opposite to each other, and the second side surface and the third side surface are arranged opposite to each other; and the angle between the first side surface and the second side surface is 45°; The second wave combining element comprises a second prism, the first right-angled surface of which is parallel to the first side surface, and the first oblique side surface is connected to the third side surface; The fourth wave combining element comprises a third prism having a third right-angled surface, a fourth right-angled surface and a second oblique side surface; The third wave combining element comprises a fourth prism, wherein the fifth side surface is arranged opposite to the eighth side surface, the sixth side surface is arranged opposite to the seventh side surface, and the sixth side surface is arranged opposite to the seventh side surface. The side surface is connected to the second oblique side surface.

21. The optical module according to claim 20, wherein: The second prism is connected to the third prism.

22. The optical module according to claim 20, wherein: The second prism is disposed separately from the third prism.

23. The optical module according to claim 1, wherein: The light emitting component comprises a second cavity and a first laser assembly, a second laser assembly, a third laser assembly, a second filter and a third filter arranged in the second cavity, the second filter is configured as the first wave combining component, and the third filter is configured as the second wave combining component; the second cavity comprises two connected side walls, the first laser assembly, the second laser assembly and the third laser assembly are distributed on the sides of the two connected side walls, the first laser assembly generates a first wavelength optical signal, the second laser assembly generates a second wavelength optical signal, and the third laser assembly generates a third wavelength optical signal; Multiple rows of pins are respectively arranged on the two connected side walls, and the pins in the bottom row on the two connected side walls include high-frequency pins, and the ends of the high-frequency pins extend into the second cavity; a light outlet is arranged at one end of the second cavity, and the light outlet is optically connected to the optical accommodation component; The second filter and the third filter are arranged side by side on the side of the light outlet, the first optical surface of the second filter faces the third laser assembly, the second optical surface of the second filter faces the third optical surface of the third filter, the third optical surface faces the second laser assembly, and the fourth optical surface of the third filter faces the first laser assembly; the first laser assembly, the second laser assembly and the third laser assembly are electrically connected to corresponding high-frequency pins respectively.

24. The optical module according to claim 23, wherein: The second cavity comprises a second shell and a second upper cover, the second shell comprises a bottom plate, a first side wall, a second side wall, a third side wall and a fourth side wall, the first side wall, the second side wall, the third side wall and the fourth side wall are sequentially connected and the bottom is connected to the bottom plate, and the tops of the first side wall, the second side wall, the third side wall and the fourth side wall are supported and connected to the second upper cover; The first side wall is connected to the optical receiving component, the first laser assembly is arranged on the side of the third side wall, the second laser assembly and the third laser assembly are arranged on the side of the fourth side wall, and the third side wall and the fourth side wall are respectively provided with multiple rows of pins; The second filter and the third filter are arranged on the side where the first side wall is connected to the second side wall.

25. The optical module according to claim 23 or 24, wherein: A first lens is disposed between the first laser assembly and the fourth optical surface, a second lens is disposed between the second laser assembly and the third optical surface, and a third lens is disposed between the third laser assembly and the first optical surface.

26. The optical module according to claim 23, wherein: A mounting bracket is also provided in the second cavity, and the mounting bracket includes a bracket body, a first support body, and a second support body; one end of the first support body is connected to the side of the bracket body, and the other end of the first support body extends away from the bracket body; one end of the second support body is connected to the side of the bracket body, and the other end of the second support body extends away from the bracket body; A gap is set between the first support body and the second support body, one side of the first support body and one side of the second support body support and connect the second filter, the other side of the first support body and the other side of the second support body support and connect the third filter; the first wavelength optical signal and the third wavelength optical signal pass through the gap.

27. The optical module according to claim 26, wherein: A first supporting surface is provided on one side of the first supporting body, and a second supporting surface is provided on the other side of the first supporting body; a third supporting surface is provided on one side of the second supporting body, and a fourth supporting surface is provided on the other side of the second supporting body; a first limiting surface and a second limiting surface are provided on the side edge of the bracket body; The first supporting surface and the third supporting surface support and connect the second optical filter, the second supporting surface and the fourth supporting surface support and connect the third optical filter, the first limiting surface limit-connects the second optical filter, and the second limiting surface limit-connects the third optical filter.

28. The optical module according to claim 23, wherein: The first shell is provided with a first displacement prism, a fourth displacement prism and the first filter. The first displacement prism is provided at the light passage of the first shell, and the fourth displacement prism is located at the front end of the light outlet of the second cavity. The light emission signal inputted into the first shell by the light emitting component is sequentially transmitted to the optical fiber adapter through the fourth displacement prism, the first filter and the first displacement prism. The first displacement prism, the fourth displacement prism and the first filter adjust the transmission direction of the emission light signal.

29. The optical module according to claim 28, wherein: A first connection hole, a second connection hole and a third connection hole are provided on the side of the first housing, the first connection hole is connected to the first light receiving component, the second connection hole is connected to the second light receiving component, and the third connection hole is connected to the third light receiving component; A first reflector, a wavelength division multiplexer, a second displacement prism and a third displacement prism are also arranged in the first housing. The optical receiving signal inputted through the optical fiber adapter is transmitted to the wavelength division multiplexer through the first displacement prism, the first filter and the first reflector in sequence; the fourth wavelength optical signal is transmitted to the second displacement prism through the wavelength division multiplexer, and is transmitted to the first optical receiving component through the second displacement prism; the fifth wavelength optical signal is transmitted to the second optical receiving component through the wavelength division multiplexer; The sixth wavelength optical signal is transmitted to the third displacement prism through the wavelength division multiplexer, and is transmitted to the third light receiving component through the third displacement prism.

30. The optical module according to claim 28, wherein: A connecting seat is arranged in the notch, and an end of the connecting seat is connected to the second cavity; the fifth connecting hole is arranged on the connecting seat, and the fifth connecting hole is connected to the inner cavity of the first shell, and an isolator is arranged in the fifth connecting hole.

31. The optical module according to claim 24, wherein: The light emitting component further comprises a first adapter plate and a second adapter plate; The first adapter plate and the second adapter plate are arranged on the side of the third side wall, the first laser assembly is located on the side of the first adapter plate, the second laser assembly is located on the side of the second adapter plate, the third laser assembly is located on the side of the second laser assembly, and the first laser assembly, the second laser assembly and the third laser assembly are distributed on the sides of two connected side walls of the second housing; A first high-frequency transmission line is arranged on the first adapter board, and a second high-frequency transmission line is arranged on the second adapter board; the first laser component and the first high-frequency pin are electrically connected to the first high-frequency transmission line respectively, and the second laser component and the second high-frequency pin are electrically connected to the second high-frequency transmission line respectively.

32. The optical module according to claim 31, wherein: A plurality of rows of pins are arranged on the fourth side wall of the second housing, and the second laser assembly and the third laser assembly are arranged on the side of the fourth side wall; A third adapter plate is also provided in the second shell, and the third adapter plate is provided between the second laser assembly and the second adapter plate and is located at the edge of the connection between two connected side walls of the second shell; a third high-frequency transmission line is provided on the third adapter plate, and one end of the third high-frequency transmission line is connected to the second laser assembly by bonding, and the other end of the third high-frequency transmission line is connected to the second high-frequency transmission line by bonding.

33. The optical module according to claim 31, wherein: The third side wall is provided with a first step surface and a first side surface, the bottom of the first side surface is connected to the first step surface; the first adapter board and the second adapter board are provided on the first step surface, one end of the first high-frequency pin passes through the first side surface and extends to the top of the first adapter board, and one end of the second high-frequency pin passes through the first side surface and extends to the top of the second adapter board; The first high-frequency pin is connected to the first high-frequency transmission line by soldering, and the second high-frequency pin is connected to the second high-frequency transmission line by soldering.

34. The optical module according to claim 33, wherein: A first ground layer and a second ground layer are arranged on the front side of the first adapter board, and a ground layer is arranged on the back side of the first adapter board; the first ground layer is arranged on one side of the first high-frequency transmission line, and the second ground layer is arranged on the other side of the first high-frequency transmission line; the first ground layer and the second ground layer are respectively connected to the ground layers through vias, and the ground layers are electrically connected to the first step surface.

35. The optical module according to claim 33, wherein: A TEC, a support plate and a fourth adapter plate are also arranged in the second housing, the bottom of the TEC is connected to the bottom plate of the second housing, the top of the TEC is provided with the support plate, and the support plate supports the first laser assembly, the second laser assembly, the third laser assembly and the fourth adapter plate; A first TEC pad and a second TEC pad are disposed on the TEC, and the first TEC pad and the second TEC pad are disposed on the side of the second side wall of the second housing; The first metal layer and the second metal layer are arranged on the fourth adapter board, and the first TEC pin and the second TEC pin are also arranged on the third side wall. The first metal layer is respectively connected with the first TEC pad and the first TEC pin by wires, and the second metal layer is respectively connected with the second TEC pad and the second TEC pin by wires.

36. The optical module according to claim 31, wherein The first laser assembly includes a first substrate and a first laser chip, and the first laser chip is mounted on the first substrate; a first high-frequency pad, a first LD pad, and a first SOA pad are also provided on the first substrate; the first high-frequency pad, the first LD pad, and the first SOA pad are respectively connected to the first laser chip by wire bonding, and the first high-frequency pad is also connected to the first high-frequency transmission line by wire bonding; A first LD pin and a first SOA pin are also disposed on the third side wall. The first LD pin is electrically connected to the first LD pad, and the first SOA pin is electrically connected to the first SOA pad.

37. The optical module according to claim 32, wherein: A third ground layer and a fourth ground layer are arranged on the front side of the second adapter plate, the third ground layer is arranged on one side of the second high-frequency transmission line, and the fourth ground layer is arranged on the other side of the second high-frequency transmission line; The third adapter board is further provided with a fifth ground layer and a sixth ground layer, the fifth ground layer is provided on one side of the third high-frequency transmission line, and the sixth ground layer is provided on the other side of the third high-frequency transmission line; The third formation bonding wire is connected to the fifth formation, and the fourth formation bonding wire is connected to the sixth formation.

38. The optical module according to claim 37, wherein: The second laser assembly includes a second substrate and a second laser chip, and the second laser chip is mounted on the second substrate; a second high-frequency pad, a second LD pad, and a second SOA pad are provided on the second substrate; the second high-frequency pad, the second LD pad, and the second SOA pad are respectively connected to the second laser chip by wire bonding, and the second high-frequency pad is also connected to the third high-frequency transmission line by wire bonding; The fourth side wall is provided with a second SOA pin and a second LD pin, the second LD pin is wired to the second LD pad, and the second SOA pin is wired to the second SOA pad.

39. The optical module according to claim 32, wherein: The third laser assembly includes a third substrate and a third laser chip, the third substrate is provided with a negative electrode pad and a positive electrode pad, and the third laser chip is mounted on the negative electrode pad; The fourth side wall is also provided with a third LD pin and a fourth LD pin. The third LD pin is connected to the positive electrode pad by wire bonding, and the fourth LD pin is connected to the negative electrode pad by wire bonding.

40. The optical module according to claim 35, wherein: The third side wall is provided with a second step surface and a second side surface, one end of the second step surface is connected to the first side surface, and the other end of the second step surface is connected to the bottom of the second side surface; Ends of the first TEC pad and the first TEC pin pass through the second side surface.

41. The optical module according to claim 31, wherein: The light emitting component also includes a mounting bracket, and the second shell includes a first side wall, a second side wall, a third side wall and a fourth side wall; the first side wall is connected to the other end of the first shell, a sixth connection hole is formed on the first side wall, and the second shell is connected to the first shell through the sixth connection hole, and the sixth connection hole is used to transmit the optical signal to the first shell; the third side wall is connected to the fourth side wall, and a plurality of rows of pins are arranged on the third side wall, and a plurality of pins are arranged on the fourth side wall; the backlight side of the first laser assembly is close to the third side wall, and the backlight side of the second laser assembly and the backlight side of the third laser assembly are close to the fourth side wall; The mounting bracket is arranged on the side of the sixth connecting hole, and the second filter and the third filter are arranged on the mounting bracket. The second filter and the third filter are located on the central axis of the sixth connecting hole, the first optical surface of the second filter faces the third laser assembly, the second optical surface of the second filter faces the third optical surface of the third filter, the third optical surface faces the second laser assembly, and the fourth optical surface of the third filter faces the first laser assembly.

42. The optical module according to claim 41, wherein The mounting bracket includes a bracket body and a first supporting body and a second supporting body connected to the side of the bracket body, a gap is formed between the first supporting body and the second supporting body, the gap is used to transmit the optical signal and the gap is located on the central axis of the sixth connecting hole; The bracket body is connected to the second shell, and the first support body and the second support body support and connect the second filter and the third filter.

43. The optical module according to claim 42, wherein: The bottom of the second support body is connected to the second shell; a first support surface is formed on one side of the first support body, and a second support surface is formed on the other side of the first support body; a third support surface is formed on one side of the second support body, and a fourth support surface is formed on the other side of the second support body; The first supporting surface and the third supporting surface are supported and connected to the second optical filter, and the second supporting surface and the fourth supporting surface are supported and connected to the third optical filter.

44. The optical module according to claim 43, wherein: The side of the bracket body is formed with a first limiting surface and a second limiting surface, the first limiting surface is located on one side of the first supporting body, the second limiting surface is located on the other side of the second supporting body, the first limiting surface is located at one end of the first supporting surface, and the second limiting surface is located at one end of the second supporting surface; the first limiting surface is limitatively connected to the second filter, and the second limiting surface is limitatively connected to the third filter.

45. The optical module of claim 41, wherein: A TEC is also disposed in the second housing, and the TEC supports and connects the first laser assembly, the second laser assembly, the third laser assembly and the mounting bracket; the TEC includes a first TEC pad and a second TEC pad, and the first TEC pad and the second TEC pad are located on a side of the mounting bracket close to the second side wall; The multiple rows of pins on the third side wall include a first TEC pin and a second TEC pin, the first TEC pin is electrically connected to the first TEC pad, and the second TEC pin is electrically connected to the second TEC pad.

46. ​​The optical module according to claim 45, wherein A fourth adapter plate is further disposed in the second housing, and the fourth adapter plate is close to the second side wall; The fourth adapter plate includes a fourth substrate, one end of the fourth substrate is close to the mounting bracket, and the other end of the fourth substrate is close to the first laser assembly; a first metal layer and a second metal layer are provided on the fourth substrate, and the first metal layer and the second metal layer extend from one end of the fourth substrate to the other end of the fourth substrate; The first metal layer is wired to connect the first TEC pad and the first TEC pin respectively, and the second metal layer is wired to connect the second TEC pad and the second TEC pin respectively.

47. The optical module of claim 41, wherein: A first step surface is arranged at the edge of the third side wall, and a first adapter plate is arranged on the first step surface; a first high-frequency transmission line, a first ground layer and a second ground layer are arranged on the front side of the first adapter plate, the first ground layer is located on one side of the first high-frequency transmission line, and the second ground layer is located on the other side of the first high-frequency transmission line; a ground layer is arranged on the back side of the first adapter plate, and the ground layer is respectively connected to the first ground layer and the second ground layer through vias; The multiple rows of pins on the third side wall include first high-frequency pins, the first laser component includes a first high-frequency pad, and the first high-frequency transmission line is electrically connected to the first high-frequency pin and the first high-frequency pad, respectively.

48. The optical module of claim 41, wherein: A first step surface is arranged at an edge of the third side wall, a second adapter plate is arranged on the first step surface, and a third adapter plate is arranged between the second adapter plate and the second laser assembly; A second high-frequency transmission line, a third ground layer and a fourth ground layer are arranged on the front side of the second adapter board, the third ground layer is located on one side of the second high-frequency transmission line, and the fourth ground layer is located on the other side of the second high-frequency transmission line; a ground layer is arranged on the back side of the second adapter board, and the ground layer is respectively connected to the third ground layer and the fourth ground layer through vias; A third high-frequency transmission line, a fifth ground layer and a sixth ground layer are arranged on the front side of the third adapter plate, the fifth ground layer is located on one side of the third high-frequency transmission line, and the sixth ground layer is located on the other side of the third high-frequency transmission line; The multiple rows of pins on the third side wall include a second high-frequency pin, and the second laser component includes a second high-frequency pad and a ground layer. The second high-frequency pad, the third high-frequency transmission line, the second high-frequency transmission line and the second high-frequency pin are electrically connected in sequence; the ground layer bonding wire connects the fifth ground layer and the sixth ground layer, the fifth ground layer bonding wire connects the third ground layer, and the sixth ground layer bonding wire connects the fourth ground layer.

49. The optical module of claim 41, wherein: The multiple pins on the fourth side wall are divided into two rows, and the row of pins close to the bottom plate of the second shell includes a third LD pin and a fourth LD pin; the third laser component includes a negative electrode pad and a positive electrode pad, the third LD pin is wired to the positive electrode pad, and the fourth LD pin is wired to the negative electrode pad.

50. The optical module according to claim 30, wherein: The first housing has an accommodating cavity formed inside, and the accommodating cavity includes a first accommodating cavity, a second accommodating cavity and a third accommodating cavity; The second accommodating cavity extends along one side of the first shell, a first baffle is provided between the first accommodating cavity and the second accommodating cavity, a first through cavity is provided on the first baffle, and the first accommodating cavity is connected to the second accommodating cavity through the first through cavity; The third accommodating cavity is located on the side of the other end of the first shell, the second baffle is arranged between the first accommodating cavity and the third accommodating cavity, the second baffle is provided with a second through cavity, the first accommodating cavity is connected to the third accommodating cavity through the second through cavity, and the fourth displacement prism is arranged in the third accommodating cavity; the top support of the first baffle is connected to the first upper cover.

51. The optical module according to claim 50, wherein: An opening is arranged on the other side of the first shell, a sealing plate is arranged inside the opening, and the sealing plate is sealingly connected to the opening; A mounting seat is arranged on the side of the sealing plate, a first reflector is arranged on the mounting seat, a wavelength division multiplexer is arranged on the reflection light path of the first reflector, the light output end of the wavelength division multiplexer is located in the first through cavity, and the side of the wavelength division multiplexer contacts and is connected to the side of the second baffle.

52. The optical module of claim 30, wherein: The second cavity comprises a second shell and a second upper cover, wherein the second upper cover is connected to the second shell and is close to the bottom of the optical module; the first upper cover is close to the top of the optical module; The first upper cover is close to the top of the optical module. The bottom of the first shell is provided with an inclined surface. One end of the inclined surface is connected to the bottom surface of the first shell, and the other end of the inclined surface is connected to the side surface of the first shell.

53. The optical module of claim 50, wherein: A fourth connecting hole is provided on a side wall at one end of the first shell, and the fourth connecting hole is connected to the first accommodating cavity; a first displacement prism is provided in the first accommodating cavity, one end of the first displacement prism is located on the side of the fourth connecting hole, and the other end of the first displacement prism is close to the other side of the first shell.

54. The optical module of claim 51, wherein: A first connecting hole, a second connecting hole and a third connecting hole are provided on a side wall of one side of the first housing, the first light receiving component is embedded in the first connecting hole, the second light receiving component is embedded in the second connecting hole, and the third light receiving component is embedded in the third connecting hole; A second displacement prism and a third displacement prism are arranged in the second accommodating cavity, one end of the second displacement prism is located at the side of the first connecting hole, and the other end of the second displacement prism is located at the light output end of the wavelength division multiplexer; one end of the third displacement prism is located at the light output end of the wavelength division multiplexer, and the other end of the third displacement prism is located at the side of the third connecting hole.

55. The optical module of claim 53, wherein: The fourth connecting hole comprises a lens mounting hole, in which a first lens is arranged; A lens mounting seat is provided on the first lens, and the first lens is connected to the lens mounting hole through the lens mounting seat.

56. The optical module of claim 30, wherein: The receiving rate of the photodetector in the second light receiving component is greater than the receiving rate of the photodetector in the first light receiving component, and the receiving rate of the photodetector in the second light receiving component is greater than the receiving rate of the photodetector in the third light receiving component.

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