Aluminum-based copper-clad plate and preparation method thereof

Abstract

According to the aluminum-based copper-clad plate and the preparation method thereof, the aluminum-based copper-clad plate comprises an aluminum plate, an insulating layer and a conducting layer which are sequentially arranged, a photo-thermal conforming curing layer is arranged on the non-working surface of the aluminum plate, and the photo-thermal conforming curing layer comprises alicyclic epoxy resin, a photoinitiator, a thermal initiator, a flatting agent and matte powder. The high-molecular polymer layer is coated on the surface of the aluminum plate, the surface coating is formed through UV light and heat mixing curing, the surface coating is good in adhesive force on an aluminum base material and has good high-temperature resistance, acid and alkali resistance, corrosion resistance, abrasion resistance and the like, and compared with an anodic oxidation treatment mode or a protective film pasting mode and the like, the surface coating has the advantages of being good in heat resistance, corrosion resistance, corrosion resistance and the like. The curing agent has the advantages of high curing speed, low energy consumption, energy conservation and environment friendliness, and the production efficiency of the aluminum-based copper-clad plate is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of basic materials in the field of electronic information, and more specifically, relates to an aluminum-based copper-clad plate and a preparation method thereof. Background Art

[0002] Aluminum-based copper-clad laminate is a metal-based copper-clad laminate with excellent heat dissipation performance. It is a type of raw material for aluminum-based printed circuit boards and is widely used in products with high heat dissipation requirements, such as LED lighting. Aluminum-based copper-clad laminates generally include a conductive layer (copper foil layer), an insulating layer, and an aluminum plate layer. The existing production process of aluminum-based copper-clad laminates mainly includes the following steps: grinding, laminating, exposure, development, etching, and film stripping. Among them, acidic or alkaline solutions are used in the etching and film stripping processes. Aluminum is a highly active metal and easily reacts with the acidic or alkaline solutions in the process, causing damage to the surface of the aluminum plate.

[0003] In order to prevent the surface of the aluminum plate from being corroded by acidic or alkaline solutions during the manufacturing process, some protective measures are usually taken to protect the aluminum plate. The more common method is to anodize the aluminum plate. Anodizing is an electrochemical method that uses a large amount of acidic substances as electrolytes. After the treatment, a large amount of waste liquid will be generated, which is not conducive to environmental protection and has a poor working environment. In addition, the electrochemical method has the disadvantages of large equipment investment, high production costs, high energy consumption, and low efficiency. Another method is to protect the surface of the aluminum plate with a protective film such as PI, PET, PVC or PE. However, during the film application process, due to factors such as electrostatic adsorption, spatial pollution, and plate edge shear particles, impurities are easily adsorbed, and it may be squeezed in subsequent processes, which can easily scratch the protective film, exposing the aluminum plate and corroding it with acid and alkali solutions. Summary of the Invention

[0004] The purpose of the present invention is to provide an environmentally friendly and efficient aluminum-based copper-clad laminate that can effectively protect aluminum plates and a preparation method thereof.

[0005] In order to achieve the above objectives, the present invention adopts the following technical solutions:

[0006] An aluminum-based copper-clad laminate comprises: an aluminum plate, an insulating layer and a conductive layer arranged in sequence; a photothermal conforming curing layer is provided on the non-working surface of the aluminum plate; the photothermal conforming curing layer comprises: an alicyclic epoxy resin, a photoinitiator, a thermal initiator, a leveling agent and matte powder.

[0007] Furthermore, the photothermal composite curing layer has a thickness of 2 to 8 μm.

[0008] Furthermore, the alicyclic epoxy resin is at least one of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate, bis((3,4-epoxycyclohexyl)methyl)adipate, and 1,2-epoxy-4-vinylcyclohexane.

[0009] Furthermore, the photoinitiator is at least one of diphenyl-(4-phenylthio)phenylsulfonium hexafluoroantimonate, 4-(phenylthio)phenyldiphenylsulfonium hexafluorophosphate, and bis(4-tert-butylphenyl)iodonium hexafluorophosphate.

[0010] Furthermore, the thermal initiator is an imidazole thermal initiator.

[0011] Furthermore, the leveling agent is a siloxane containing double bonds and epoxy groups.

[0012] The present invention also provides a method for preparing the aforementioned aluminum-based copper-clad laminate, comprising the following steps:

[0013] performing a roughening treatment on the non-working surface of the aluminum plate;

[0014] Cleaning and drying the aluminum plate;

[0015] Applying a photothermal composite curing adhesive on the non-working surface of the aluminum plate;

[0016] The aluminum plate coated with the photothermal composite curing adhesive is cured to form the photothermal composite curing layer on the aluminum plate.

[0017] Furthermore, the proportions of the components in the photothermal composite curing layer are as follows: 70-90% alicyclic epoxy resin, 1.5-5.5% photoinitiator, 0.03-0.3% thermal initiator, 0.05-0.1% leveling agent, and 8-25% matte powder.

[0018] Furthermore, the non-working surface of the aluminum plate is roughened by grinding and drawing;

[0019] and / or, cleaning the aluminum plate by high-pressure water washing and ultrasonic cleaning in sequence;

[0020] and / or, drying the aluminum plate by blowing with a hot air knife at 50° C. to 80° C. and baking at 50° C. to 80° C. in sequence;

[0021] And / or, infrared light is used for curing, and the heating temperature is 90°C.

[0022] Furthermore, the wavelength of the infrared light source is 250nm to 800nm.

[0023] It can be seen from the above technical solution that in order to solve the problem that the surface of the aluminum plate of the aluminum-based circuit board is easily corroded by reacting with acidic or alkaline solutions during the manufacturing process, and the surface of the aluminum plate is damaged, the present invention forms a surface coating by coating a layer of polymer on the surface of the aluminum plate and curing it through a combination of UV light and heat. The surface coating has good adhesion to the aluminum substrate, and has good high temperature resistance, acid and alkali resistance, corrosion resistance, wear resistance and other properties. Moreover, compared with anodizing treatment or applying a protective film, the surface coating has the advantages of fast curing speed, low energy consumption, energy saving and environmental protection, thereby improving the production efficiency of the aluminum-based copper clad laminate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 This is a schematic structural diagram of an aluminum-based copper-clad laminate according to an embodiment of the present invention;

[0026] Figure 2 The present invention is a flowchart of a method for preparing an aluminum-based copper-clad laminate. DETAILED DESCRIPTION

[0027] The present invention is described in detail below in conjunction with the accompanying drawings. When describing the embodiments of the present invention in detail, for the convenience of explanation, the drawings showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. It should be noted that the drawings are simplified and all use non-precise scales, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features; the terms "positive", "negative", "bottom", "upper", "lower", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0028] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, it can mean a fixed connection, a detachable connection, or an integral connection; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean internal communication between two components; it can mean a wireless connection or a wired connection. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0029] In order to prevent the surface of the aluminum-based copper-clad laminate from being corroded by acidic or alkaline solutions during the preparation process, the aluminum plate is usually anodized or protected by a protective film. However, anodizing has the disadvantages of high cost, poor working environment, and being unfavorable to the environment. The protective film has the disadvantages of easily absorbing impurities and may be damaged, resulting in the exposure of the aluminum plate.

[0030] In response to the shortcomings of existing protection methods, the present invention proposes a new process for aluminum-based copper clad laminates. By adding a step of coating a photothermal composite curing layer on the surface of the aluminum plate in the conventional preparation process, the surface of the aluminum plate is protected by the photothermal composite curing layer to prevent the aluminum plate from being corroded by acidic or alkaline liquids in the process.

[0031] like Figure 1 As shown, the aluminum-based copper-clad laminate of the present invention includes an aluminum plate 1, an insulating layer 2 and a conductive layer 3 (copper foil) stacked in sequence, and a photothermal composite curing layer 4 is provided on the non-working surface of the aluminum plate 1 (the surface of the aluminum plate not opposite to the insulating layer).

[0032] The photothermal composite curing layer contains the following substances: alicyclic epoxy resin, a photoinitiator, a thermal initiator, a leveling agent, and a matte powder. The photothermal composite curing layer can have a thickness of 2 to 8 μm.

[0033] Among them, alicyclic epoxy resins can provide good bonding properties and high curing efficiency, which can improve the flexibility of the photothermal composite cured layer. In some embodiments, the alicyclic epoxy resin can be one or more of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate (Model TTA21), bis((3,4-epoxycyclohexyl)methyl)adipate (Model TTA26), and 1,2-epoxy-4-vinylcyclohexane (Model TTA11).

[0034] A photoinitiator is used to initiate photocuring, thereby curing the photothermal composite curing layer. In some embodiments, the photoinitiator may be one or more of diphenyl-(4-phenylthio)phenylsulfonium hexafluoroantimonate (Model 6976), 4-(phenylthio)phenyldiphenylsulfonium hexafluorophosphate (Model 6992), and bis(4-tert-butylphenyl)iodonium hexafluorophosphate (Model PAG101).

[0035] The thermal initiator is used to initiate thermal curing, making the photothermal composite curing layer more completely cured and having a higher hardness. In some embodiments, the thermal initiator can be an imidazole thermal initiator, such as one or more of 2-methylimidazole, 2-phenylimidazole, and 2-ethyl-4-methylimidazole.

[0036] The leveling agent is used to reduce the surface tension of the photothermal composite curing layer, wet the aluminum plate, prevent shrinkage in the photothermal composite curing layer, and increase the compatibility between the various materials in the photothermal composite curing layer. In some embodiments, the leveling agent can be a siloxane with a composite structure containing double bonds and epoxy groups, such as the leveling agent model DY-ETE302G-2. This siloxane has an epoxy group at one end, which can form a chemical bond with the initiator, allowing the grafted end at the other end to firmly bond to the surface of the matte powder in the system, improving the stability of the matte powder in the coating system.

[0037] Matting powder is used to control the surface gloss of the photothermal composite curing layer, increasing its wear and scratch resistance. It also increases the specific surface area of the photothermal composite curing layer, improving its adhesion and preventing the protective film and surface thermal adhesive from peeling off.

[0038] The present invention performs sulfur-free oxidation on the surface of the aluminum plate of the aluminum-based copper-clad laminate, uses alicyclic epoxy resin as the main body, and compounding a photoinitiator and a thermal initiator for use in initiating system polymerization. More photoinitiators can ensure the curing speed, and the thermal initiator can generate a large amount of heat during the light source lighting process to continue to initiate the curing of the system, ensuring that the system is completely cured. Through UV light and heat mixed curing, the curing speed is fast, the energy consumption is low, and it is energy-saving and environmentally friendly. The formed photothermal composite curing layer has good adhesion to the surface of the aluminum plate, good acid and alkali resistance, corrosion resistance and wear resistance, and good surface effect. Compared with traditional film lamination and anodized film methods, it reduces environmental pollution and improves the production efficiency of the aluminum-based copper-clad laminate.

[0039] like Figure 2 As shown, the preparation method of the aluminum-based copper-clad laminate of the present invention comprises the following steps:

[0040] Roughen the non-working surface of the aluminum plate, such as sending the aluminum plate to a grinding and brushing device for grinding and brushing. By fine grinding the non-working surface of the aluminum plate, the bonding strength of the photothermal composite curing layer is improved;

[0041] Clean the aluminum plate after grinding and brushing, such as first rinsing it with high-pressure water, and then placing it in an ultrasonic device for ultrasonic cleaning to improve the cleanliness of the non-working surface of the aluminum plate;

[0042] The cleaned aluminum plate is dried; in some embodiments, it can be blown dry with a hot air knife at 50°C to 80°C, and then baked at 50°C to 80°C until the surface is completely dry;

[0043] The non-working surface of the dried aluminum plate is coated with a photothermal composite curing adhesive; the composition of the photothermal composite curing layer (by mass) is as follows: 70-90% alicyclic epoxy resin, 1.5-5.5% photoinitiator, 0.03-0.3% thermal initiator, 0.05-0.1% leveling agent, and 8-25% matte powder;

[0044] The aluminum plate coated with the photothermal composite curing adhesive is cured; the aluminum plate is placed in a curing device and cured by infrared light, the heating temperature is adjusted to 90°C, and the leveling time is 5 minutes; the wavelength of the infrared light source can be 250nm to 800nm.

[0045] The present invention is further described below by way of specific examples. Unless otherwise specified, the reagents, materials, and instruments used in the following description are all conventional reagents, materials, and instruments, which are commercially available. The reagents involved can also be synthesized by conventional synthesis methods.

[0046] Example 1

[0047] The preparation method of the aluminum-based copper-clad laminate of this embodiment comprises the following steps:

[0048] S1. Prepare the photothermal composite curing layer glue; add 75 parts of alicyclic epoxy resin (all parts by mass below), 2.5 parts of photoinitiator, 0.03 parts of thermal initiator, 0.05 parts of leveling agent, 10 parts of matte powder, and an appropriate amount of solvent. The solvent used in this embodiment is ethyl acetate. Stir evenly to prepare the photothermal composite curing coating glue; the alicyclic epoxy resin in this embodiment is a mixture of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, bis((3,4-epoxycyclohexyl)methyl)adipate, and 1,2-epoxy-4-vinylcyclohexane. In specific applications, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (model TTA21), bis((3,4-epoxycyclohexyl)methyl)adipate, and 1,2-epoxy-4-vinylcyclohexane are used. The ratio of ((3,4-epoxycyclohexyl) methyl) adipate (model TTA26) and 1,2-epoxy-4-vinylcyclohexane (model TTA11) can be 10-20:50-60:5-20 (parts by mass). In this embodiment, the ratio of 3,4-epoxycyclohexyl methyl-3,4-epoxycyclohexane carboxylate, bis((3,4-epoxycyclohexyl) methyl) adipate, and 1,2-epoxy-4-vinylcyclohexane is 15:55:5. The photoinitiator model is 6976, which has low curing light intensity and high photoinduced curing efficiency. The thermal initiator is 2-methylimidazole, which is chemically pure. The leveling agent is DY-ETE302G-2.

[0049] S2. Brushing and drawing an aluminum plate with a thickness of 0.76 mm;

[0050] S3, cleaning the aluminum plate after grinding, brushing and drawing;

[0051] S4, drying the cleaned aluminum plate;

[0052] S5, coating the prepared light-thermal composite curing layer adhesive on the non-working surface of the aluminum plate;

[0053] S6. Prepare an aluminum plate with a photothermal composite curing layer by UV light and heat curing. Then, prepare an insulating layer and a conductive layer on the aluminum plate in sequence using conventional processes to prepare an aluminum-based copper-clad laminate. The thickness of the photothermal composite curing layer in this embodiment is 3 μm.

[0054] The aluminum-based copper clad laminate of this embodiment was subjected to hardness, boiling resistance, acid resistance and alkali resistance tests. The pencil hardness of the photothermal composite cured layer on the aluminum plate was measured to be 2HB, the boiling resistance was 300 hours, the acid resistance was 115 hours, and the alkali resistance was 120 hours.

[0055] The method steps for testing hardness, boiling resistance, acid resistance and alkali resistance adopted in the present invention are as follows:

[0056] Hardness test: Use a pencil designed for testing the corresponding hardness (e.g., a 2HB Zhonghua brand pencil). Use a utility knife to cut a cylindrical lead. Grind it flat on 400-grit sandpaper. Place the pencil in a pencil hardness tester. At a 45° angle, use a force of 1 kg to scratch five 10mm long lines back and forth on the same location on the coating surface. Use an eraser to erase the pencil marks and observe the scratches. Judgment standard: The coating surface should be free of any scratches or marks.

[0057] Boiling resistance: Place the sample in boiling water at normal pressure. After boiling for 300 hours, use Scotch60 tape to tear off the sample and observe whether the coating on the sample falls off.

[0058] Acid resistance: Place the sample in a 3% hydrochloric acid (HCl) solution and soak it at room temperature for 115 hours. Observe the coating and no surface changes will be observed.

[0059] Alkali resistance: Place the sample in a 5% sodium hydroxide (NaOH) solution and soak it at room temperature for 120 hours. Observe the coating and no surface changes will be observed.

[0060] Example 2

[0061] S1. Prepare a photothermal composite curing layer adhesive; 80 parts of alicyclic epoxy resin, 3 parts of photoinitiator, 0.03 parts of thermal initiator, 0.05 parts of leveling agent, 15 parts of matte powder, and an appropriate amount of solvent are stirred evenly to prepare a photothermal composite curing coating adhesive; the model of the photoinitiator in this embodiment is 6976, the thermal initiator is 2-methylimidazole, the purity is chemically pure, and the leveling agent is DY-ETE302G-2; the ratio of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane, bis((3,4-epoxycyclohexyl)methyl)adipate, and 1,2-epoxy-4-vinylcyclohexane in this embodiment is 15:55:10;

[0062] S2. Brushing and drawing an aluminum plate with a thickness of 0.78 mm;

[0063] S3, cleaning the aluminum plate after grinding, brushing and drawing;

[0064] S4, drying the cleaned aluminum plate;

[0065] S5, coating the prepared photothermal composite curing layer adhesive on the non-working surface of the aluminum plate, wherein the photothermal composite curing layer has a thickness of 3.5 μm;

[0066] S6. An aluminum plate having a photothermal composite curing layer is prepared by mixed curing with UV light and heat, and an insulating layer and a conductive layer are sequentially prepared on the aluminum plate by conventional processes to obtain an aluminum-based copper clad laminate.

[0067] The aluminum-based copper clad laminate of this embodiment was tested for hardness, boiling resistance, acid resistance and alkali resistance. The pencil hardness of the photothermal composite cured layer on the aluminum plate was measured to be 2H, boiling resistance was 250 hours, acid resistance was 115 hours, and alkali resistance was 125 hours.

[0068] Example 3

[0069] S1. Prepare a photothermal composite curing layer adhesive; 85 parts of alicyclic epoxy resin, 3 parts of photoinitiator, 0.04 parts of thermal initiator, 0.05 parts of leveling agent, 20 parts of matte powder, and an appropriate amount of solvent are stirred evenly to prepare a photothermal composite curing coating adhesive; the photoinitiator model of this embodiment is 6976, the thermal initiator is 2-methylimidazole, the purity is chemically pure, and the leveling agent is DY-ETE302G-2; the ratio of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane, bis((3,4-epoxycyclohexyl)methyl)adipate, and 1,2-epoxy-4-vinylcyclohexane in this embodiment is 10:60:15;

[0070] S2. Brushing and drawing an aluminum plate with a thickness of 0.82 mm;

[0071] S3, cleaning the aluminum plate after grinding, brushing and drawing;

[0072] S4, drying the cleaned aluminum plate;

[0073] S5, coating the prepared photothermal composite curing layer adhesive on the non-working surface of the aluminum plate, wherein the photothermal composite curing layer has a thickness of 3.5 μm;

[0074] S6. An aluminum plate having a photothermal composite curing layer is prepared by mixed curing with UV light and heat, and an insulating layer and a conductive layer are sequentially prepared on the aluminum plate by conventional processes to obtain an aluminum-based copper clad laminate.

[0075] The aluminum-based copper clad laminate of this embodiment was tested for hardness, boiling resistance, acid resistance and alkali resistance. The pencil hardness of the photothermal composite cured layer on the aluminum plate was measured to be 3HB, the boiling resistance was 230 hours, the acid resistance was 120 hours, and the alkali resistance was 130 hours.

[0076] Example 4

[0077] S1. Prepare a photothermal composite curing layer adhesive; 90 parts of alicyclic epoxy resin, 3.5 parts of photoinitiator, 0.045 parts of thermal initiator, 0.05 parts of leveling agent, 25 parts of matte powder, and an appropriate amount of solvent are stirred evenly to prepare a photothermal composite curing coating adhesive; the photoinitiator model of this embodiment is 6976, the thermal initiator is 2-methylimidazole, the purity is chemically pure, and the leveling agent is DY-ETE302G-2; the ratio of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane, bis((3,4-epoxycyclohexyl)methyl)adipate, and 1,2-epoxy-4-vinylcyclohexane in this embodiment is 10:60:20;

[0078] S2. Brushing and drawing an aluminum plate with a thickness of 0.86 mm;

[0079] S3, cleaning the aluminum plate after grinding, brushing and drawing;

[0080] S4, drying the cleaned aluminum plate;

[0081] S5, coating the prepared photothermal composite curing layer adhesive on the non-working surface of the aluminum plate, wherein the photothermal composite curing layer has a thickness of 3.5 μm;

[0082] S6. An aluminum plate having a photothermal composite curing layer is prepared by mixed curing with UV light and heat, and an insulating layer and a conductive layer are sequentially prepared on the aluminum plate by conventional processes to obtain an aluminum-based copper clad laminate.

[0083] The aluminum-based copper clad laminate of this embodiment was tested for hardness, boiling resistance, acid resistance and alkali resistance. The pencil hardness of the photothermal composite cured layer on the aluminum plate was measured to be 4H, the boiling resistance was 300 hours, the acid resistance was 130 hours, and the alkali resistance was 130 hours.

[0084] Example 5

[0085] S1. Prepare a photothermal composite curing layer adhesive; add 80 parts of alicyclic epoxy resin, 3.5 parts of photoinitiator, 0.065 parts of thermal initiator, 0.05 parts of leveling agent, 25 parts of matte powder, and an appropriate amount of solvent, stir evenly, and prepare a photothermal composite curing coating adhesive; the model of the photoinitiator in this embodiment is 6976, the thermal initiator is 2-methylimidazole, the purity is chemically pure, and the leveling agent is DY-ETE302G-2; the alicyclic epoxy resin used in this embodiment is bis((3,4-epoxycyclohexyl)methyl)adipate; the epoxy resin is bisphenol A epoxy resin CYD-128.

[0086] S2. Brushing and drawing an aluminum plate with a thickness of 0.86 mm;

[0087] S3, cleaning the aluminum plate after grinding, brushing and drawing;

[0088] S4, drying the cleaned aluminum plate;

[0089] S5, coating the prepared photothermal composite curing layer adhesive on the non-working surface of the aluminum plate, wherein the photothermal composite curing layer has a thickness of 3.5 μm;

[0090] S6. An aluminum plate having a photothermal composite curing layer is prepared by mixed curing with UV light and heat, and an insulating layer and a conductive layer are sequentially prepared on the aluminum plate by conventional processes to obtain an aluminum-based copper clad laminate.

[0091] The aluminum-based copper clad laminate of this embodiment was tested for hardness, boiling resistance, acid resistance and alkali resistance. The pencil hardness of the photothermal composite cured layer on the aluminum plate was measured to be 3H, the boiling resistance was 230 hours, the acid resistance was 110 hours, and the alkali resistance was 115 hours.

[0092] It can be seen from the test results of Examples 1-5 that the aluminum-based copper-clad laminate of the present invention protects the surface of the aluminum plate through a photothermal composite curing system. The photothermal composite curing layer formed on the non-working surface of the aluminum plate has a hardness that meets the use requirements of the circuit board, has good acid and alkali resistance, can effectively protect the aluminum plate, and prevent the acidic or alkaline solution in the process from corroding the aluminum plate. Moreover, the present invention does not require the use of specific equipment, has low cost, high efficiency, and is environmentally friendly. The hardness and scratch resistance of the coating can be adjusted by adjusting the amount of matte powder. For example, increasing the amount of matte powder can improve the hardness and scratch resistance of the coating. The acid and alkali resistance of the coating can be adjusted by adjusting the amount of 1,2-epoxy-4-vinylcyclohexane resin. For example, increasing the amount of 1,2-epoxy-4-vinylcyclohexane can improve the acid and alkali resistance of the coating.

[0093] The above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the specific implementation methods of the present invention can still be modified or replaced by equivalents. Any modification or equivalent replacement that does not depart from the spirit and scope of the present invention should be included in the scope of the present invention.

Claims

1. An aluminum-based copper-clad laminate, characterized in that: include: An aluminum plate, an insulating layer and a conductive layer are arranged in sequence, and a photothermal conforming curing layer is arranged on the non-working surface of the aluminum plate. The photothermal conforming curing layer includes: alicyclic epoxy resin, photoinitiator, thermal initiator, leveling agent and matte powder.

2. The aluminum-based copper-clad laminate according to claim 1, wherein: The thickness of the photothermal composite curing layer is 2 to 8 μm.

3. The aluminum-based copper-clad laminate according to claim 1, wherein: The alicyclic epoxy resin is at least one of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate, bis((3,4-epoxycyclohexyl)methyl)adipate, and 1,2-epoxy-4-vinylcyclohexane.

4. The aluminum-based copper-clad laminate according to claim 1, wherein: The photoinitiator is at least one of diphenyl-(4-phenylthio)phenylsulfonium hexafluoroantimonate, 4-(phenylthio)phenyldiphenylsulfonium hexafluorophosphate, and bis(4-tert-butylphenyl)iodonium hexafluorophosphate.

5. The aluminum-based copper-clad laminate according to claim 1, wherein: The thermal initiator is an imidazole thermal initiator.

6. The aluminum-based copper-clad laminate according to claim 1, wherein: The leveling agent is siloxane containing double bonds and epoxy groups.

7. The method for preparing the aluminum-based copper-clad laminate according to any one of claims 1 to 6, wherein: The following steps are involved: performing a roughening treatment on the non-working surface of the aluminum plate; Cleaning and drying the aluminum plate; Applying a photothermal composite curing adhesive on the non-working surface of the aluminum plate; The aluminum plate coated with the photothermal composite curing adhesive is cured to form the photothermal composite curing layer on the aluminum plate.

8. The preparation method according to claim 7, wherein: The proportions of the components in the photothermal composite curing layer are as follows: 70-90% alicyclic epoxy resin, 1.5-5.5% photoinitiator, 0.03-0.3% thermal initiator, 0.05-0.1% leveling agent, and 8-25% matte powder.

9. The preparation method according to claim 7, wherein: The non-working surface of the aluminum plate is roughened by brushing and drawing; and / or, cleaning the aluminum plate by high-pressure water washing and ultrasonic cleaning in sequence; and / or, drying the aluminum plate by blowing with a hot air knife at 50° C. to 80° C. and baking at 50° C. to 80° C. in sequence; And / or, infrared light is used for curing, and the heating temperature is 90°C.

10. The preparation method according to claim 9, wherein: The wavelength of the infrared light source is 250nm to 800nm.

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