A loading and unloading system for ultrasonic scanning

Abstract

The present application relates to the technical field of ultrasonic flaw detection, and more particularly to a loading and unloading system for ultrasonic scanning, comprising a bracket, a gripping claw and a flipping claw provided on the bracket, a lateral translation mechanism provided on the bracket, a longitudinal translation mechanism provided on the lateral translation mechanism, a lifting mechanism provided on the longitudinal translation mechanism, a gripping claw provided on the lifting mechanism, the gripping claw comprising a gripping base connected to the lifting mechanism, a gripping substrate vertically rotatably connected to the gripping base, and two opposing clamping claws slidably connected to the lower surface of the gripping substrate; a flipping base fixed to the bracket, the flipping claw comprising a flipping base horizontally rotatably connected to the flipping base, and two opposing flipping claws horizontally slidably connected to the flipping substrate. The gripping claw and the flipping claw cooperate with each other to achieve flipping and transfer of chip modules, providing ease of use.

Description

Technical Field

[0001] The present application relates to the technical field of ultrasonic flaw detection, and in particular to a loading and unloading system for ultrasonic scanning. Background Art

[0002] After chip module soldering is complete, the terminal soldering points need to be inspected to eliminate soldering defects or faults. Scanning Ultrasonic Trace (SAT) testing uses pure water as a medium to transmit ultrasonic signals. The system detects the differences in reflection rate and energy between high-frequency ultrasound and materials of varying densities. Inspecting chip modules using SAT on the chip module production line is an essential inspection process in semiconductor packaging.

[0003] When testing the chip module, the chip needs to be loaded face down in a waterproof carrier so that the back of the chip is exposed and tested.

[0004] In the existing technology, due to the space limitation of SAT, when transferring and conveying chip modules, when transferring the IGBT modules to be tested, the chip modules need to be manually placed on a waterproof carrier and transferred to the testing area. Automatic flipping and transfer cannot be achieved, resulting in low work efficiency as products are tested in batches. Summary of the Invention

[0005] In order to improve work efficiency, the present application provides a loading and unloading system for ultrasonic scanning.

[0006] The present application provides an ultrasonic scanning loading and unloading system that adopts the following technical solutions:

[0007] A loading and unloading system for ultrasonic scanning includes a bracket, on which a grabbing claw and a turning claw are provided.

[0008] The bracket is provided with a transverse translation mechanism, the transverse translation mechanism is provided with a longitudinal translation mechanism, the longitudinal translation mechanism is provided with a lifting mechanism, the grabbing claw is provided on the lifting mechanism, the grabbing claw includes a grabbing base connected to the lifting mechanism, the grabbing base is vertically rotatably connected to the grabbing base, and the lower surface of the grabbing base is slidably connected to two clamping claws facing each other;

[0009] A turning seat is fixed on the bracket, and the turning claw comprises a turning base plate which is horizontally rotatably connected to the turning seat, and two turning clamping claws which are opposite to each other are horizontally slidably connected to the turning base plate.

[0010] By adopting the above technical solution, the lateral and longitudinal translation mechanisms drive the grasping claws to move and adjust their position until they are directly above the chip module. The lifting mechanism then drives the grasping claws down to grasp the chip module. The clamping claws clamp on both sides of the chip module. The grasping claws then rise and move the chip module to the flip seat. The chip module is placed into the flipping claws, which clamp and secure the chip module. The flipping claws then flip the chip module, and the grasping claws again grasp and transport the flipped chip module. The grasping claws and flipping claws cooperate to achieve flipping and transfer of the chip module, making it easy to use.

[0011] Preferably, a grabbing screw is horizontally rotatably connected to the grabbing base plate, the grabbing screw is provided with two sections of threads with opposite rotation directions, each section of the threads is equipped with a grabbing plate, and the two clamping claws are respectively connected to the two grabbing plates.

[0012] By adopting the above technical solution, the grasping screw rotates, and the two grasping plates drive the clamping claws to move toward or away from each other synchronously to clamp or release the chip module.

[0013] Preferably, a concave buffer groove is provided on the surfaces facing each other of the clamping claws, the direction of the buffer groove is parallel to the movement direction of the clamping claws, a buffer block is slidably connected in the buffer groove, and a buffer spring is provided between the buffer block and the bottom of the buffer groove.

[0014] By adopting the above technical solution, the clamping claws clamp and fix the chip module, the buffer block contacts the chip module and compresses the buffer spring, and the buffer block and the buffer spring provide buffering protection for the chip module.

[0015] Preferably, a sliding groove parallel to the grab screw is provided in the grab plate, and an insertion groove connected to the sliding groove is provided on the lower surface of the grab plate, the width of the insertion groove is smaller than the width of the sliding groove, the upper end of the clamping claw is provided with a sliding block slidably connected to the sliding groove, the width of the sliding block is larger than the width of the insertion groove, and the ends of the two grab plates close to each other are provided with a locking groove located on the side wall of the sliding groove, the end of the sliding block is slidably connected to a locking rod matching the locking groove, the buffer block is fixed with a buffer rack, and a control rod is rotatably connected in the clamping claw, the lower end of the control rod is coaxially fixed with a control gear meshing with the buffer rack, and the upper end of the control rod is coaxially fixed with a transmission gear, and the end of the locking rod away from the locking groove is fixed with a transmission rack meshing with the transmission gear, and when the buffer spring is in a natural state, the locking rod is inserted into the locking groove.

[0016] By adopting the above technical solution, different chip modules have different widths, and the spacing between the clamping claws and the chip modules when they are clamped also varies. When the clamping claws clamp the chip modules, the gripping plate drives the clamping claws toward the chip module, and the buffer block contacts the side of the chip module. To ensure gripping stability, the gripping plate continues to move, increasing the pressing force between the clamping claws and the chip module. During the movement of the gripping plate, the buffer block is compressed and moves, driving the buffer rack to move synchronously. The buffer rack rotates the control rod via the control gear, and the control rod drives the locking rod to slide via the transmission gear. As the gripping plates continue to move toward each other, the buffer block is gradually compressed, and the locking rod continues to move until the locking rod is pulled out of the locking groove. At this point, the clamping claw and the gripping plate slide together. As the gripping plate continues to move, the sliding block slides relative to each other within the sliding groove. The clamping claw no longer moves in conjunction with the gripping plate, and the buffer block is no longer subjected to increased pressure, remaining in a stable state. By setting the sliding block and locking rod, the connection between the clamping claw and the grabbing plate is flexible, and the connection position of the clamping claw and the grabbing plate can be adjusted, thereby changing the gripping range of the clamping claw and adapting to a variety of chip modules of different sizes. Secondly, when the grabbing plate is in motion, the buffer block can buffer and protect the chip. When the buffer spring reaches its compression limit, it can no longer buffer the chip module. When the grabbing plate continues to move, the locking rod and the grabbing plate are disengaged, and the buffer block is no longer subjected to greater pressure. In other words, the buffer block will not exert greater pressure on the chip module, thus achieving secondary protection for the chip module.

[0017] Preferably, the side wall of the sliding block is rotatably connected to a rotating roller, a rotating wheel is coaxially fixed on the rotating roller, the rotating wheel is in contact with the inner wall of the sliding groove, and a reset torsion spring is provided between the rotating roller and the sliding block. When the reset torsion spring is in a natural state, the sliding block is located at the end of the sliding groove where a locking groove is provided.

[0018] By adopting this technical solution, after the locking rod is pulled out of the locking slot, the sliding block slides within the sliding slot, causing the rotating wheel to contact the inner wall of the sliding slot, driving the rotating wheel to rotate. The rotating wheel then drives the rotating roller to rotate and twist the reset torsion spring. When the clamping claw releases the chip module, the reset torsion spring drives the rotating wheel to rotate, which in turn drives the sliding block to move within the sliding slot, causing the locking rod to re-align with the locking slot. The locking rod is then reinserted into the locking slot under the action of the buffer spring.

[0019] Preferably, both ends of the grabbing substrate are provided with interference rods coaxially facing the sliding slot, the length of the interference rods is smaller than the length of the sliding slot, and the projection size of the interference rods toward the sliding slot is smaller than the size of the sliding slot.

[0020] By adopting the above technical solution, the clamping claw releases the chip module, and the two grab plates move in opposite directions, that is, the grab plates move toward the end of the grab base plate, and the resistance rod is gradually inserted into the sliding groove. The resistance rod contacts the sliding block and pushes the sliding block toward the other end of the sliding groove until the sliding block is located at the other end of the sliding groove, so that the locking rod is opposite to the locking groove, and the locking rod is reinserted into the locking groove under the action of the buffer spring.

[0021] Preferably, the surfaces of the clamping claws facing each other are provided with clamping grooves located on the upper and lower sides of the buffer groove, a clamping block is slidably connected in the clamping groove, a clamping gear is provided between the buffer block and the clamping block, and the buffer block and the clamping block are both provided with tooth grooves that mesh with the clamping gear.

[0022] By adopting the above technical solution, the clamping claw clamps and fixes the chip module, and the buffer block contacts the chip module. During the process of the clamping claw clamping the chip, the buffer block is under pressure and continuously slides in the buffer groove. During the sliding process of the buffer block, the clamping block is driven by the clamping gear to extend from the clamping groove. The clamping block clamps the upper and lower sides of the chip module to clamp and fix the chip module, thereby improving the clamping stability of the chip module.

[0023] Preferably, a fixing tube pointing to the clamping block is fixed on the side of the clamping claw away from the clamping groove, and a clamping hole is provided on the clamping block that is opposite to the fixing tube. A connecting rod is rotatably connected in the clamping hole, and the end of the connecting rod is passed through the fixing tube. A spiral groove is provided on the inner wall of the fixing tube, and a connecting block is fixed on the end of the connecting rod that is slidably connected to the spiral groove. A support groove facing the buffer block is vertically provided at the end of the clamping block away from the fixing rod, and a support block is slidably connected in the support groove. A connecting gear is coaxially fixed to the end of the connecting rod away from the connecting block, and a supporting tooth groove that meshes with the connecting gear is provided on the support block.

[0024] By adopting this technical solution, as the clamping block extends from the clamping slot, the connecting rod moves with it. During this movement, the connecting block rotates, driven by the spiral groove, causing the connecting rod to rotate while following the movement of the clamping block, rotating relative to the clamping block. This rotation of the connecting rod drives the support block, which extends from the support slot and presses against the surface of the chip module via the connecting gear, further enhancing the clamping effect of the clamping claws on the chip module.

[0025] In summary, this application has the following beneficial technical effects:

[0026] The grabbing claw and the flipping claw cooperate with each other to realize the flipping and transfer of the chip module, which is easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the embodiment;

[0028] Figure 2 2 is a schematic structural diagram of a grabbing claw in an embodiment;

[0029] Figure 3 2. This is a schematic diagram of the connection between the buffer block and the clamping block in the embodiment;

[0030] Figure 4 Schematic diagram of the internal structure of the clamping block in the embodiment;

[0031] Figure 5 Schematic diagram of the connection between the buffer block and the grab base in the embodiment.

[0032] Description of reference numerals:

[0033] 1. Bracket; 11. Turning seat; 2. Grasping claw; 21. Grasping base; 22. Grasping substrate; 221. Interference rod; 23. Clamping claw; 231. Buffer groove; 232. Buffer block; 2321. Buffer rack; 2322. Tooth groove; 233. Buffer spring; 234. Sliding block; 2341. Rotating roller; 2342. Rotating wheel; 2343. Reset torsion spring; 235. Locking rod; 2351. Transmission rack; 236. Control lever; 2361. Control gear; 2362. Transmission gear; 237. Clamping groove; 23 8. Clamping block; 2381. Clamping gear; 2382. Clamping hole; 2383. Connecting rod; 2384. Connecting block; 2385. Support groove; 2386. Support block; 23861. Support tooth groove; 2387. Connecting gear; 239. Fixed tube; 2391. Spiral groove; 24. Grabbing screw; 25. Grabbing plate; 251. Sliding groove; 252. Insertion groove; 253. Locking groove; 3. Flip claw; 31. Flip substrate; 32. Flip clamping claw; 4. Horizontal translation mechanism; 5. Longitudinal translation mechanism; 6. Lifting mechanism. DETAILED DESCRIPTION

[0034] The present application is further described in detail below in conjunction with all the accompanying drawings.

[0035] The present application discloses an ultrasonic scanning loading and unloading system, referring to Figure 1 The device comprises a bracket 1, to which are movably connected a grabbing claw 2 and a flipping claw 3. The grabbing claw 2 grabs the chip module, while the flipping claw 3 flips the chip module. The two claws cooperate to flip and transport the chip module. A flip base 11 is fixed to the bracket 1. A flip base 31 is horizontally connected to the flip base 11 for horizontal rotation. Two facing flip clamps 32 are horizontally connected to the flip base 31 for horizontal sliding movement.

[0036] Reference Figure 1The bracket 1 is provided with a transverse translation mechanism 4, which includes a horizontal transverse track and a transverse slider slidably connected to the transverse track. The transverse slider is provided with a longitudinal translation mechanism 5, which includes a horizontal longitudinal track perpendicular to the transverse track, and a longitudinal slider slidably connected to the longitudinal track. The longitudinal slider is provided with a lifting mechanism 6, which includes a vertical track vertically fixed to the longitudinal slider and a vertical slider slidably connected to the vertical track. The grabbing claw 2 is mounted on the vertical slider.

[0037] Reference Figure 1 The horizontal translation mechanism 4 and the vertical translation mechanism 5 drive the gripping claw 2 to move in two directions on the horizontal plane, thereby adjusting the position. The lifting mechanism 6 drives the gripping claw 2 to move up and down in the vertical direction. The three mechanisms work together to improve the gripping accuracy of the gripping claw 2 on the chip module.

[0038] Reference Figure 1 and Figure 2 The gripping claw 2 comprises a gripping base 21 fixedly connected to a vertical slider. A gripping base plate 22 is connected to the gripping base 21 via a rotary cylinder, whose output shaft points vertically downward. The gripping base 22 is horizontally connected to a gripping screw 24. The screw 24 has two sections of threads rotating in opposite directions, each with a gripping plate 25 attached. Each gripping plate 25 is connected to a clamping claw 23.

[0039] Reference Figure 1 and Figure 2 The gripping screw 24 rotates, driving the two gripping claws 23 to move synchronously toward or away from each other through the two gripping plates 25, thereby gripping or releasing the chip module. The gripping claws 23 clamp on both sides of the chip module. The rotary cylinder is activated, driving the chip module to rotate 90°. The gripping claws 23 then move the chip module to the flipping claws 3 for flipping.

[0040] Reference Figure 3 The surfaces of the clamping claws 23 facing each other are provided with concave buffer grooves 231. The direction of the buffer grooves 231 is parallel to the movement direction of the clamping claws 23. A buffer block 232 is slidably connected in the buffer groove 231. A buffer spring 233 is provided between the buffer block 232 and the bottom of the buffer groove 231. When the buffer spring 233 is in a natural state, the end of the buffer block 232 is located at the end of the buffer groove 231. When the clamping claws 23 clamp the chip module, the buffer block 232 contacts the chip module. The clamping claws 23 continue to move toward the chip module, and the buffer block 232 squeezes the buffer spring 233. The buffer spring 233 and the buffer block 232 provide buffering protection for the chip module to prevent damage to the chip module caused by excessive pressure.

[0041] Reference Figure 3The surfaces of the clamping claws 23 facing each other are provided with concave clamping grooves 237 located on the upper and lower sides of the buffer groove 231, and a clamping block 238 is slidably connected in the clamping groove 237. A clamping gear 2381 is provided between the buffer block 232 and the clamping block 238, and a tooth groove 2322 is provided on the buffer block 232 and the clamping block 238 to engage with the clamping gear 2381.

[0042] Reference Figure 3 When the clamping claw 23 clamps the chip module, the buffer block 232 slides toward the bottom of the buffer groove 231. During the sliding process of the buffer block 232, the clamping gear 2381 drives the clamping block 238 to extend from the clamping groove 237. The clamping blocks 238 are located on the upper and lower sides of the chip module to shield and protect the chip module, thereby improving the stability of clamping the chip module.

[0043] Reference Figure 3 and Figure 4 A fixing tube 239 is fixed to the side of the clamping claw 23 away from the clamping groove 237, pointing toward the clamping block 238. A clamping hole 2382 is defined within the clamping block 238, facing the fixing tube 239. A connecting rod 2383 is rotatably connected to the clamping hole 2382. One end of the connecting rod 2383 is rotatably connected to the clamping hole 2382, while the other end extends through the fixing tube 239. A connecting block 2384 is fixed to the outer wall of the end of the connecting rod 2383 located within the fixing tube 239, pointing toward the inner wall of the fixing tube 239. A spiral groove 2391 is defined within the inner wall of the fixing tube 239, and the connecting block 2384 is slidably connected to the spiral groove 2391.

[0044] Reference Figure 3 and Figure 4 When the clamping block 238 drives the connecting rod 2383 to slide, the other end of the connecting rod 2383 slides in the fixed tube 239. Due to the restriction of the spiral groove 2391, the connecting rod 2383 rotates around the axis, that is, the connecting rod 2383 rotates and moves with the clamping block 238. However, the connecting rod 2383 only rotates relative to the clamping block 238.

[0045] Reference Figure 3 and Figure 4 The end of the clamping block 238 away from the fixed rod has a vertical support groove 2385 extending toward the buffer block 232. A support block 2386 is slidably connected to the support groove 2385. A connecting gear 2387 is coaxially fixed to the end of the connecting rod 2383 away from the connecting block 2384. The support block 2386 has a support tooth groove 23861 that meshes with the connecting gear 2387. The end of the support block 2386 facing the buffer block 232 is made of an elastic material, such as rubber.

[0046] Reference Figure 3 and Figure 4Buffer block 232 clamps the chip module. When buffer block 232 is pressed and moved, clamping blocks 238 gradually extend from clamping holes 2382 to the upper and lower sides of the chip module. As clamping block 238 moves, connecting rod 2383 rotates and follows the movement of clamping block 238. Rotating connecting rod 2383 drives support block 2386 to slide via connecting gear 2387. Support block 2386 gradually extends from support groove 2385 to press against the upper and lower sides of the chip module, further improving the clamping stability of clamping claw 23 on the chip module.

[0047] Reference Figure 2 、 Figure 3 and Figure 5 The clamping claw 23 moves along with the grab plate 25 to clamp the chip module. A sliding groove 251 parallel to the grab screw 24 is provided in the grab plate 25. An insertion groove 252 connected to the sliding groove 251 is provided on the lower surface of the grab plate 25. The longitudinal section of the sliding groove 251 and the insertion groove 252 form a "T" shape. A sliding block 234 is provided at the upper end of the clamping claw 23, which is slidably connected to the sliding groove 251. The width of the sliding block 234 is greater than the width of the insertion groove 252. The clamping claw 23 is slidably connected to the grab plate 25 via the sliding block 234, so that the positional relationship between the clamping claw 23 and the grab plate 25 can be adjusted, and the distance between the two clamping claws 23 can be changed to adapt to chip modules of different sizes.

[0048] Reference Figure 3 and Figure 5 The ends of the grab plates 25 that are close to each other are provided with locking grooves 253 on the side walls of the sliding grooves 251. The end of the sliding block 234 is slidably connected to a locking rod 235 that cooperates with the locking grooves 253. When the locking rod 235 is inserted into the locking grooves 253, the clamping claw 23 is fixedly connected to the grab plate 25. When the locking rod 235 slides out of the locking grooves 253, the clamping claw 23 and the grab plate 25 are slidably connected.

[0049] Reference Figure 3 and Figure 5 A buffer rack 2321 is fixed to the buffer block 232. A vertically arranged control rod 236 is rotatably connected to the clamping claw 23. A control gear 2361 is coaxially fixed to the lower end of the control rod 236, which meshes with the buffer rack 2321. A transmission gear 2362 is coaxially fixed to the upper end of the control rod 236. A transmission rack 2351 is fixed to the end of the locking rod 235 away from the locking groove 253, which meshes with the transmission gear 2362. When the buffer spring 233 is in its natural state, the locking rod 235 is inserted into the locking groove 253.

[0050] Reference Figure 3 and Figure 5When the width of the chip module is large, the buffer block 232 moves with the grab plate 25 to clamp the chip module, and the buffer block 232 squeezes the buffer spring 233. As the grab plate 25 continues to move, the buffer block 232 continues to move. On the one hand, the buffer spring 233 is gradually squeezed until it is compressed to the limit. On the other hand, during the sliding process of the buffer block 232, the control rod 236 is driven to rotate through the control gear 2361, and the control rod 236 drives the locking rod 235 to slide through the transmission gear 2362.

[0051] Reference Figure 3 and Figure 5 That is, as the buffer block 232 moves toward the bottom of the buffer groove 231, the buffer spring 233 is compressed to its limit, while the locking rod 235 gradually slides out of the locking groove 253. When the buffer spring 233 is compressed to its limit, the locking rod 235 slides out of the locking groove 253. At this point, the gripping plate 25 continues to move, while the clamping claw 23 is restrained by the chip module and cannot move. The buffer spring 233 is compressed to its limit, and the buffer block 232 is also unable to move. The sliding block 234 slides within the sliding groove 251, and the clamping claw 23 and gripping plate 25 move relative to each other. The pressure on the chip module is relatively constant, protecting the chip module. Moreover, the sliding between the clamping claw 23 and the gripping plate 25 increases the clamping range of the clamping claw 23.

[0052] Reference Figure 3 and Figure 5 The side wall of the sliding block 234 is rotatably connected to a rotating roller 2341, and a rotating wheel 2342 is coaxially fixed on the rotating roller 2341. The rotating wheel 2342 contacts the inner wall of the sliding groove 251. A reset torsion spring 2343 is provided between the rotating roller 2341 and the sliding block 234. When the reset torsion spring 2343 is in a natural state, the sliding block 234 is located at the end of the sliding groove 251 where a locking groove 253 is provided.

[0053] Reference Figure 3 and Figure 5 After the locking rod 235 is pulled out of the locking slot 253, the sliding block 234 slides within the sliding slot 251, and the rotating wheel 2342 contacts the inner wall of the sliding slot 251, driving the rotating wheel 2342 to rotate. The rotating wheel 2342 drives the rotating roller 2341 to rotate and twist the return torsion spring 2343. When the clamping claw 23 releases the chip module, the return torsion spring 2343 drives the rotating wheel 2342 to rotate, and the rotating wheel 2342 drives the sliding block 234 to move within the sliding slot 251, so that the locking rod 235 is aligned with the locking slot 253 again. Under the action of the buffer spring 233, the locking rod 235 is reinserted into the locking slot 253.

[0054] Reference Figure 3 and Figure 5Both ends of the grabbing substrate 22 are provided with a resistance rod 221 coaxially facing the sliding groove 251 , the length of the resistance rod 221 is smaller than the length of the sliding groove 251 , and the projection size of the resistance rod 221 toward the sliding groove 251 is smaller than the size of the sliding groove 251 .

[0055] Reference Figure 3 and Figure 5 , the clamping claw 23 clamps the chip module, and after transporting the chip module to the corresponding position, the clamping claw 23 releases the chip module, that is, the two grabbing plates 25 move in opposite directions. The end of the locking rod 235 contacts the inner wall of the sliding groove 251, the buffer block 232 cannot slide, and the buffer spring 233 is still in a compressed state. At this time, the reset torsion spring 2343 drives the rotating wheel 2342 to rotate, and the rotating wheel 2342 drives the sliding block 234 to slide in the direction of the locking groove 253. At the same time, the grabbing plate 25 moves toward the interference rod 221. When the grabbing plate 25 moves to the interference rod 221, the interference rod 221 is inserted into the sliding groove 251 and contacts the sliding block 234. As the grabbing plate 25 continues to move, the interference rod 221 pushes the sliding block 234 in the direction of the locking groove 253. The sliding block 234 moves toward the locking groove 253 under the action of the resistance rod 221 and the return torsion spring 2343 until the locking rod 235 is directly opposite the locking groove 253. At this time, the buffer spring 233 applies a thrust to the buffer block 232, the buffer block 232 is reset, and the locking rod 235 is inserted into the locking groove 253.

[0056] The operating principle of the ultrasonic scanning loading and unloading system according to the present application is as follows: the lateral translation mechanism 4 and the longitudinal translation mechanism 5 drive the grasping claw 2 to move directly above the chip module. The lifting mechanism 6 moves the grasping claw 2 to the chip module, and the clamping claw 23 clamps both sides of the chip module. The lateral translation mechanism 4, the longitudinal translation mechanism 5, and the lifting mechanism 6 feed the chip module between the two flipping claws 32. The two flipping claws 3 clamp the ends of the chip module. The clamping claw 23 releases the chip module, the flipping claw 3 rotates the chip module 180 degrees, and the clamping claw 23 grabs the chip module again and transports it.

[0057] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A loading and unloading system for ultrasonic scanning, comprising a bracket (1), wherein the bracket (1) is provided with a grabbing claw (2) and a turning claw (3), characterized in that: The bracket (1) is provided with a transverse translation mechanism (4), a longitudinal translation mechanism (5), and a lifting mechanism (6); the grabbing claw (2) is provided on the lifting mechanism (6); the grabbing claw (2) comprises a grabbing base (21) connected to the lifting mechanism (6); a grabbing substrate (22) is vertically rotatably connected to the grabbing base (21); and two opposite clamping claws (23) are slidably connected to the lower surface of the grabbing substrate (22); The grabbing base plate (22) is horizontally rotatably connected to a grabbing screw (24), the grabbing screw (24) is provided with two sections of threads with opposite rotation directions, and the two sections of threads are respectively provided with a grabbing plate (25), and the two clamping claws (23) are respectively connected to the two grabbing plates (25); The surfaces of the clamping claws (23) facing each other are provided with inwardly concave buffer grooves (231), the direction of the buffer grooves (231) is parallel to the movement direction of the clamping claws (23), a buffer block (232) is slidably connected in the buffer grooves (231), and a buffer spring (233) is provided between the buffer block (232) and the bottom of the buffer grooves (231); The grab plate (25) is provided with a sliding groove (251) parallel to the grab screw (24), the lower surface of the grab plate (25) is provided with an insertion groove (252) connected to the sliding groove (251), the upper end of the clamping claw (23) is provided with a sliding block (234) slidably connected to the sliding groove (251), and the ends of the two grab plates (25) close to each other are provided with a locking groove (253) located on the side wall of the sliding groove (251), and the end of the sliding block (234) is slidably connected to the locking groove (253) The locking rod (235) is provided with a buffer rack (2321) fixed on the buffer block (232), a control rod (236) is rotatably connected in the clamping claw (23), a control gear (2361) meshing with the buffer rack (2321) is coaxially fixed to the lower end of the control rod (236), a transmission gear (2362) is coaxially fixed to the upper end of the control rod (236), and a transmission rack (2351) meshing with the transmission gear (2362) is fixed to the end of the locking rod (235) away from the locking groove (253); The side wall of the sliding block (234) is rotatably connected to a rotating roller (2341), a rotating wheel (2342) is coaxially fixed on the rotating roller (2341), the rotating wheel (2342) contacts the inner wall of the sliding groove (251), a reset torsion spring (2343) is provided between the rotating roller (2341) and the sliding block (234), and when the reset torsion spring (2343) is in a natural state, the sliding block (234) is located at the end of the sliding groove (251) provided with a locking groove (253); both ends of the grabbing substrate (22) are provided with a contact rod (221) coaxially facing the sliding groove (251), the length of the contact rod (221) is smaller than the length of the sliding groove (251), and the projection size of the contact rod (221) toward the sliding groove (251) is smaller than the size of the sliding groove (251); The surfaces of the clamping claws (23) facing each other are provided with clamping grooves (237) located on the upper and lower sides of the buffer groove (231); a clamping block (238) is slidably connected in the clamping groove (237); a clamping gear (2381) is provided between the buffer block (232) and the clamping block (238); and a tooth groove (2322) meshing with the clamping gear (2381) is provided on both the buffer block (232) and the clamping block (238).

2. The ultrasonic scanning loading and unloading system according to claim 1, characterized in that: A fixing tube (239) pointing to the clamping block (238) is fixed on the side of the clamping claw (23) away from the clamping groove (237), and the clamping block (238) is provided with a clamping hole (2382) facing the fixing tube (239). A connecting rod (2383) is rotatably connected in the clamping hole (2382). The end of the connecting rod (2383) is passed through the fixing tube (239), and a spiral groove (2391) is provided on the inner wall of the fixing tube (239). A sliding screw is fixed to the end of the connecting rod (2383). The connecting block (2384) is movably connected to the spiral groove (2391), the end of the clamping block (238) away from the fixed rod is vertically provided with a support groove (2385) toward the buffer block (232), the support groove (2385) is slidably connected with a support block (2386), the end of the connecting rod (2383) away from the connecting block (2384) is coaxially fixed with a connecting gear (2387), and the support block (2386) is provided with a supporting tooth groove (23861) engaged with the connecting gear (2387).

3. The ultrasonic scanning loading and unloading system according to claim 1, characterized in that: A flip seat (11) is fixed on the bracket (1), and the flip claw (3) includes a flip base plate (31) horizontally rotatably connected to the flip seat (11), and two flip clamping claws (32) facing each other are horizontally slidably connected to the flip base plate (31).

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