A high-precision integrated backlight structure

Abstract

This invention relates to a high-precision integrated backlight structure, belonging to the field of backlight technology. The high-precision integrated backlight structure includes a front frame. Inside the front frame, from top to bottom, are arranged a light guide assembly, a backlight board, a diffuse reflection film, a control board, and a heat dissipation base frame. A heat dissipation mechanism is installed between the diffuse reflection film and the control board. The heat dissipation mechanism includes a heat-conducting plate disposed between the diffuse reflection film and the control board. The design of dividing the working fluid into multiple parts and confining them to independent spaces allows the integrated backlight to effectively absorb heat from corresponding positions on the backlight board or control board even when operating at an angle or vertically. This not only reduces the probability of "thermal drift" of the backlight board due to uneven temperature, thus improving the stability of the optical bistable state, but also reduces the probability of the control board being damaged by overheating. This significantly improves the spectral accuracy and operational stability of the integrated backlight.

Description

Technical Field

[0001] This invention relates to the field of backlight technology, and in particular to a high-precision integrated backlight structure. Background Technology

[0002] An integrated backlight is a compact and stable backlight assembly that includes a one-piece injection-molded frame, a light guide plate that converts point light sources into surface light sources, an optical film that homogenizes the light, and auxiliary components such as reflectors and a backplate. It aims to improve assembly efficiency, reliability, and performance stability. Currently, high-power integrated backlights typically use vapor chambers as their heat dissipation structure, as vapor chambers provide more uniform heat conduction compared to heat pipes and other heat dissipation structures.

[0003] When a high-power integrated backlight is installed at a large angle, the liquid working fluid inside the heat spreader only partially and indirectly contacts the backlight. The backlight, which is above the liquid working fluid, needs to dissipate heat through the evaporation and flow of the gaseous working fluid. This will cause uneven temperatures between the two parts. Over time, this can easily cause "thermal drift" in the backlight, making it difficult to stabilize the optical performance of the backlight and significantly affecting the operating accuracy of the backlight. Summary of the Invention

[0004] Therefore, it is necessary to provide a high-precision integrated backlight structure to address the problem that high-power integrated backlights are prone to "thermal drift" when installed at large angles, which has a significant impact on the backlight's operating accuracy.

[0005] A high-precision integrated backlight structure includes a front frame. Inside the front frame, from top to bottom, there are a light guide assembly, a backlight board, a diffuse reflection film, a control board, and a heat dissipation bottom frame. A heat dissipation mechanism is installed between the diffuse reflection film and the control board.

[0006] Furthermore, the heat dissipation mechanism includes a heat-conducting plate disposed between the diffuse reflection film and the control board. The outer side of the heat-conducting plate extends through the front frame, and a grid-like heat dissipation air cavity is formed on the outer side of the heat-conducting plate. The top of the heat-conducting plate has evenly distributed square holes that are staggered with the grid-like heat dissipation air cavity. A heat-conducting block is fixedly connected inside the square holes, and a liquid-absorbing core is fixedly connected inside the heat-conducting block. The liquid-absorbing core is filled with a working fluid that is initially in a liquid state. A barrier plate is fixedly connected inside the liquid-absorbing core, and a uniformly distributed liquid-guiding port is formed on the top of the barrier plate. A heat-conducting frame fixedly connected to the liquid-guiding core is fixedly connected inside the liquid-guiding port. Two adjacent heat-conducting frames are staggered on both sides of the barrier plate.

[0007] Furthermore, the inner diameter of the mesh-like heat dissipation cavity gradually increases from the center point of the heat-conducting plate towards the direction away from the center point of the heat-conducting plate, and the vertical cross-sectional shape of a single channel in the mesh-like heat dissipation cavity is circular.

[0008] Furthermore, the heat-conducting block, the barrier plate, and the heat-conducting frame are all fixedly connected to the liquid-absorbing core through a sintering process.

[0009] Furthermore, the liquid guide port and the heat conduction frame are both stamped on the corresponding parts of the barrier plate using a mechanical die stamping process.

[0010] Furthermore, the heat-conducting frame has an open isosceles trapezoidal shape in cross-section, with the opening of the heat-conducting frame facing the liquid guide port.

[0011] Furthermore, the heat-conducting block and the square hole are both rectangular parallelepipeds that match each other, and the heat-conducting block is fixedly connected to the inside of the square hole by a vacuum brazing process.

[0012] Furthermore, flexible thermal pads are bonded to both the top and bottom ends of the heat-conducting plate. The top of the upper flexible thermal pad is in contact with the diffuse reflection film, and the bottom of the lower flexible thermal pad is in contact with the control plate.

[0013] Furthermore, the dimensions of the contact area between the flexible thermal pad and the diffuse reflection film are the same, and the dimensions of the contact area between the flexible thermal pad and the control board are the same. The flexible thermal pad is a silicon-based flexible thermal conductive material component.

[0014] Furthermore, the top four sides of the heat-conducting plate are provided with evenly distributed slots that are staggered with the grid-like heat dissipation air chambers, and the bottom four sides of the front frame are fixedly connected with evenly distributed plugs that are inserted into the adjacent slots.

[0015] Furthermore, the cross-sectional shape of the socket and the plug is a matching rectangle, and the number of the socket and the plug is the same and not less than thirty.

[0016] The aforementioned high-precision integrated backlight structure, which refines the working fluid into multiple parts and confines them in independent spaces, enables the integrated backlight to effectively absorb heat from the corresponding positions of the backlight board or control board even when operating at an angle or vertically. This not only reduces the probability of "thermal drift" of the backlight board due to uneven temperature, thereby improving the stability of the optical bistable state, but also reduces the probability of the control board being damaged by overheating. As a result, the spectral accuracy and operational stability of the integrated backlight are significantly improved.

[0017] The integrated backlight uses a grid-like heat dissipation cavity with a gradually expanding airflow channel. Regardless of whether the backlight is used tilted or horizontally, the density and flow friction of the heated air inside the grid-like heat dissipation cavity are significantly reduced. This allows the heated air to be accelerated and guided outward along the inner wall of the grid-like heat dissipation cavity, resulting in lower temperatures for the heat conduction plate and heat conduction block. This further reduces the probability of local overheating of the backlight board or control board, and further reduces the probability of "thermal drift" of the backlight board due to uneven temperature. At the same time, the indirect cooling design also prevents the external environment from contacting the light guide component, backlight board, and control board, ensuring the overall protection effect of the integrated backlight. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 This is a cross-sectional schematic diagram of the overall structure in this invention;

[0021] Figure 3 This is an exploded view of the overall structure of the present invention;

[0022] Figure 4 This is a schematic diagram showing the connection between the front frame and the heat dissipation mechanism in this invention;

[0023] Figure 5 This is an exploded view of the heat dissipation mechanism in this invention;

[0024] Figure 6 This is a cross-sectional schematic diagram of the heat-conducting plate in this invention;

[0025] Figure 7 This is a partial exploded view of the heat dissipation mechanism in this invention.

[0026] Figure label:

[0027] 100. Front frame; 200. Light guide assembly; 300. Backlight panel; 400. Diffuse reflection film; 500. Control board; 600. Heat dissipation base frame; 700. Heat dissipation mechanism; 710. Heat conduction plate; 711. Mesh-shaped heat dissipation cavity; 712. Square hole; 713. Insert; 720. Heat conduction block; 730. Liquid absorbent core; 740. Barrier plate; 741. Liquid outlet; 750. Heat conduction frame; 760. Flexible heat conduction pad; 800. Insert block. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this specification are for illustrative purposes only and do not represent the only possible implementation.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0031] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0032] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0033] The following is combined with Figure 1 - Figure 7The present invention describes a high-precision integrated backlight structure.

[0034] In one embodiment, a high-precision integrated backlight structure includes a front frame 100. Inside the front frame 100, from top to bottom, a light guide assembly 200, a backlight plate 300, a diffuse reflection film 400, a control board 500, and a heat dissipation bottom frame 600 are arranged sequentially. A heat dissipation mechanism 700 is installed between the diffuse reflection film 400 and the control board 500.

[0035] The light guide assembly 200 has the following structure from bottom to top, including but not limited to:

[0036] The high-temperature resistant frame not only separates the structure above the high-temperature resistant frame from the backlight panel 300, preventing the backlight panel 300 from deforming the structure above the high-temperature resistant frame, but also reduces the probability of vibration between the structure above the high-temperature resistant frame and the backlight panel 300.

[0037] The light guide plate achieves uniform light diffusion through a precisely designed dot distribution;

[0038] The first diffuser is used for light interference and to initially improve brightness uniformity;

[0039] The first prism is used to focus light to enhance display brightness;

[0040] The second prism is used to enhance the light-gathering effect and further enhance the display brightness;

[0041] The second diffuser plate is used to eliminate light interference and further improve brightness uniformity;

[0042] The light guide assembly 200 is stacked in layers: high-temperature resistant frame → first light guide plate → first diffuser sheet → first prism sheet → second prism sheet → second diffuser plate, and the vibration buffering characteristics of the frame are used to isolate the thermal effects of the backlight plate 300.

[0043] The top of the heat dissipation base frame 600 has a groove that matches the control board 500. The control board 500 is fixed inside the groove by high-temperature resistant adhesive. The input end and output end of the control board 500 pass through the groove and the heat dissipation base frame 600 in sequence and extend out of the heat dissipation base frame 600. The bottom of the heat dissipation base frame 600 has evenly distributed air guide grooves. The heat dissipation base frame 600 and the plug block 800 are fixedly connected together by vacuum brazing process.

[0044] When the control board 500 and the heat sink base frame 600 need to be connected together, first apply high-temperature resistant adhesive evenly to the groove at the top of the heat sink base frame 600, then accurately embed the control board 500 into the groove, and ensure that its input and output terminals pass through the grooves reserved in the heat sink base frame 600 respectively. After the adhesive has cured, check whether the fit between the control board 500 and the groove and the extension length of the terminals meet the tolerance requirements.

[0045] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, the heat dissipation mechanism 700 includes a heat-conducting plate 710 disposed between the diffuse reflection film 400 and the control board 500. The outer side of the heat-conducting plate 710 extends through the front frame 100. A grid-shaped heat dissipation air cavity 711 is opened on the outer side of the heat-conducting plate 710. Square holes 712 are evenly distributed and staggered with the grid-shaped heat dissipation air cavity 711 on the top of the heat-conducting plate 710. A heat-conducting block 720 is fixedly connected inside the square hole 712. A liquid-absorbing core 730 is fixedly connected inside the heat-conducting block 720. The liquid-absorbing core 730 is filled with a working fluid that is initially in a liquid state. A barrier plate 740 is fixedly connected inside the liquid-absorbing core 730. A liquid-guiding port 741 is evenly distributed on the top of the barrier plate 740. A heat-conducting frame 750 fixedly connected to the liquid-guiding core 730 is fixedly connected inside the liquid-guiding port 741. Two adjacent heat-conducting frames 750 are staggered on both sides of the barrier plate 740.

[0046] When the integrated backlight is running on a moving object such as a vehicle, when the vehicle stops or travels on a bumpy road, causing the integrated backlight to shake, the baffle plate 740, together with the heat conduction frame 750, can prevent the liquid working medium inside the liquid absorber 730 from directly impacting the liquid absorber 730. This effectively reduces the probability of the liquid absorber 730 loosening or falling off under impact, ensuring that the liquid absorber 730 can be used normally. The heat conduction frame 750 and the baffle plate 740 can guide the heat of the gasified working medium to the liquid working medium during the gas-liquid circulation process, so that the gasified working medium can be liquefied faster, which can accelerate the gas-liquid circulation rate of the working medium.

[0047] During the manufacturing of the heat dissipation mechanism 700, the liquid guide port 741 and the heat conduction frame 750 are first stamped out on the barrier plate 740 using a stamping mechanism with corresponding molds. Then, an unsealed heat conduction block 720 is manufactured, followed by the liquid absorber 730. The stamped barrier plate 740 is then placed inside the liquid absorber 730. Subsequently, the liquid absorber 730 is sintered inside the heat conduction block 720. After the liquid absorber 730 is sintered, the inside of the liquid absorber 730 is evacuated to a vacuum state. Liquid working fluid is then injected into the liquid absorber 730, and the liquid absorber 730 is sealed, thus sealing the heat conduction block 720. Finally, the side end of the heat conduction block 720 is turned upwards, and further processing is performed. A number of holes and slots 713 are opened on the side of the heat-conducting plate 710 until all the holes and slots together form a complete grid-like heat dissipation cavity 711. Then, the heat-conducting plate 710 is placed horizontally, and a number of square holes 712 are opened at the misaligned position of the grid-like heat dissipation cavity 711. Then, the heat-conducting block 720 is embedded in the square hole 712 and is bonded to the heat-conducting plate 710 by vacuum brazing. Finally, a silicon-based flexible heat-conducting pad 760 is bonded to the top and bottom surfaces of the heat-conducting plate 710. The size of the upper and lower pads must be strictly consistent with the contact surfaces of the diffuse reflection film 400 and the control board 500. At this time, the heat dissipation mechanism 700 is completed.

[0048] like Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7As shown, the inner diameter of the mesh-like heat dissipation cavity 711 gradually increases from the center point of the heat-conducting plate 710 away from the center point of the heat-conducting plate 710. The vertical cross-sectional shape of a single channel in the mesh-like heat dissipation cavity 711 is circular. When the integrated backlight structure is placed horizontally, this can guide the gas inside the mesh-like heat dissipation cavity 711 outward, thereby accelerating the exhaust rate of the heated air inside the mesh-like heat dissipation cavity 711 and reducing the retention rate of the heated air inside the mesh-like heat dissipation cavity 711. The heat-conducting block 720, the baffle plate 740, and the heat-conducting frame 750 are all fixedly connected to the liquid-absorbing core 730 through a sintering process. This can improve the effective connection rate between the heat-conducting block 720, the baffle plate 740, and the heat-conducting frame 750 and the liquid-absorbing core 730, thereby improving the heat conduction rate. Both the liquid guide port 741 and the heat conduction frame 750 are stamped onto the corresponding parts of the barrier plate 740 using a mechanical die stamping process. This reduces the manufacturing difficulty of the barrier plate 740, the liquid guide port 741, and the heat conduction frame 750, thereby reducing the cost of use. The heat conduction frame 750 has an open isosceles trapezoidal cross-section, with the cross-section opening facing the liquid guide port 741. This not only increases the contact area between the heat conduction frame 750 and the liquid absorber 730 to improve the heat conduction effect, but also increases the strength of the barrier plate 740 and the heat conduction frame 750, thereby reducing the probability of deformation of the heat conduction block 720. The heat conduction block 720 and the square hole 712 are both matching cuboids, and the heat conduction block 720 is fixedly connected to the inside of the square hole 712 by a vacuum brazing process.

[0049] Flexible thermal pads 760 are bonded to both the top and bottom ends of the heat-conducting plate 710. The top of the upper flexible thermal pad 760 contacts the diffuse reflection film 400, and the bottom of the lower flexible thermal pad 760 contacts the control plate 500. The dimensions of the contact areas between the upper flexible thermal pad 760 and the diffuse reflection film 400 are the same, and the dimensions of the contact areas between the lower flexible thermal pad 760 and the control plate 500 are the same. The flexible thermal pad 760 is a silicon-based flexible thermal conductive material component. This not only fills the gaps between the diffuse reflection film 400 and the control plate 500 and the heat-conducting plate 710 or the heat-conducting block 720 to improve the heat conduction rate, but also acts as a flexible buffer for the diffuse reflection film 400, the control plate 500, the heat-conducting plate 710 and the heat-conducting block 720, thereby improving the drop resistance of the integrated backlight.

[0050] The top four sides of the heat-conducting plate 710 are provided with evenly distributed sockets 713 that are staggered with the grid-shaped heat dissipation air chambers 711. The bottom four sides of the front frame 100 are fixedly connected with evenly distributed plug blocks 800 that are inserted into adjacent sockets 713. The cross-sectional shape of the sockets 713 and the plug blocks 800 are both matching rectangles. The number of sockets 713 and plug blocks 800 is the same and not less than thirty.

[0051] The front frame 100 with integrated optical components is pressed down as a whole, so that the plug 800 is fully inserted into the socket 713 on the heat conduction plate 710 to form a closed-loop mechanical structure, and the connection strength is enhanced by vacuum brazing; the heat dissipation mechanism 700 is activated to verify the heat exchange efficiency of the gradually expanding airflow channel of the mesh-like heat dissipation cavity 711 and the bottom air guide groove, ensuring that the working fluid phase change cycle is normal; the backlight brightness uniformity and heat dissipation performance are tested by powering on, the hot spot distribution is detected by using a thermal imager, and the arrangement of the heat conduction frame 750 of the liquid guide port 741 is adjusted to optimize the heat dissipation path.

[0052] Working principle: When the integrated backlight is used at an angle, multiple independently operating working fluids are locked at the corresponding height by the liquid-absorbing core 730. At this time, the working fluid can still indirectly contact the backlight board 300 or the control board 500 for gas-liquid circulation. This can effectively reduce the probability of excessive temperature difference between the two ends of the backlight board 300 or the control board 500, which are far apart in height. This not only reduces the probability of "thermal drift" of the backlight board 300 due to uneven temperature, but also reduces the probability of overheating and damage of the control board 500 due to excessive temperature. This significantly improves the spectral accuracy and operational stability of the integrated backlight. At the same time, this can also accelerate the gas-liquid circulation rate of the working fluid inside the liquid-absorbing core 730, thereby accelerating the heat dissipation effect on the backlight board 300 or the control board 500.

[0053] While the heat-conducting plate 710 and heat-conducting block 720 conduct heat from the backlight board 300 or control board 500, the heat can also be transferred into the mesh-like heat dissipation cavity 711 through the heat-conducting plate 710. This heats the air temperature in the corresponding area of ​​the mesh-like heat dissipation cavity 711, which effectively reduces the air density and flow friction in that area, allowing the air in that area to be discharged outward more quickly. Furthermore, the mesh-like heat dissipation cavity 711, which adopts a gradually expanding airflow channel, allows the heated air to be guided outward more quickly along the inner wall of the mesh-like heat dissipation cavity 711, regardless of whether the integrated backlight is used tilted or horizontally. This not only accelerates the air exchange rate inside and outside the mesh-like heat dissipation cavity 711, making the temperature of the heat-conducting plate 710 and heat-conducting block 720 even lower, but also further reduces the probability of local overheating of the backlight board 300 or control board 500, further reducing the probability of "thermal drift" of the backlight board 300 due to uneven temperature, and the probability of damage to the control board 500 due to overheating.

[0054] It should be noted that the high-temperature resistant frame, first light guide plate, first diffuser sheet, first prism sheet, second prism sheet, second diffuser plate, backlight plate 300, diffuse reflection film 400, control board 500, liquid absorption core 730 and working fluid mentioned above are all devices with relatively mature existing technology, and will not be described in detail here.

[0055] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The above-described embodiments are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. A high-precision integrated backlight structure, comprising a front frame (100), wherein the interior of the front frame (100) is provided with, from top to bottom, a light guide assembly (200), a backlight plate (300), a diffuse reflection film (400), a control board (500), and a heat dissipation base frame (600), characterized in that, A heat dissipation mechanism (700) is installed between the diffuse reflection film (400) and the control board (500); The heat dissipation mechanism (700) includes a heat-conducting plate (710) disposed between the diffuse reflection film (400) and the control panel (500). The outer side of the heat-conducting plate (710) extends through the front frame (100). A grid-like heat dissipation air cavity (711) is formed on the outer side of the heat-conducting plate (710). The top of the heat-conducting plate (710) has evenly distributed square holes (712) that are staggered with the grid-like heat dissipation air cavity (711). A heat-conducting block (720) is fixedly connected inside each square hole (712). A liquid-absorbing core (730) is fixedly connected inside the hot block (720). The liquid-absorbing core (730) is filled with a working fluid that is initially in a liquid state. A baffle plate (740) is fixedly connected inside the liquid-absorbing core (730). The top of the baffle plate (740) is provided with uniformly distributed liquid guide ports (741). A heat-conducting frame (750) fixedly connected to the liquid-absorbing core (730) is fixedly connected inside the liquid guide port (741). Two adjacent heat-conducting frames (750) are staggered on both sides of the baffle plate (740).

2. The high-precision integrated backlight structure according to claim 1, characterized in that, The inner diameter of the mesh-shaped heat dissipation cavity (711) gradually increases from the center point of the heat-conducting plate (710) toward the direction away from the center point of the heat-conducting plate (710), and the vertical cross-sectional shape of a single channel in the mesh-shaped heat dissipation cavity (711) is circular.

3. The high-precision integrated backlight structure according to claim 1, characterized in that, The heat-conducting block (720), the barrier plate (740), and the heat-conducting frame (750) are all fixedly connected to the liquid-absorbing core (730) through a sintering process.

4. The high-precision integrated backlight structure according to claim 1, characterized in that, The liquid guide port (741) and the heat conduction frame (750) are both stamped on the corresponding parts of the barrier plate (740) by mechanical die stamping process.

5. The high-precision integrated backlight structure according to claim 1, characterized in that, The heat-conducting frame (750) has an open isosceles trapezoidal shape in cross-section, and the opening of the heat-conducting frame (750) faces the liquid guide port (741).

6. The high-precision integrated backlight structure according to claim 1, characterized in that, The heat-conducting block (720) and the square hole (712) are both rectangular parallelepipeds that match each other. The heat-conducting block (720) is fixedly connected to the inside of the square hole (712) by a vacuum brazing process.

7. The high-precision integrated backlight structure according to claim 1, characterized in that, Flexible thermal pads (760) are bonded to both the top and bottom ends of the heat-conducting plate (710). The top of the upper flexible thermal pad (760) is in contact with the diffuse reflection film (400), and the bottom of the lower flexible thermal pad (760) is in contact with the control plate (500).

8. The high-precision integrated backlight structure according to claim 7, characterized in that, The flexible thermal pad (760) and the diffuse reflection film (400) have the same size at their contact points, and the flexible thermal pad (760) and the control board (500) have the same size at their contact points. The flexible thermal pad (760) is a silicon-based flexible thermal conductive material component.

9. The high-precision integrated backlight structure according to claim 1, characterized in that, The top four sides of the heat-conducting plate (710) are provided with evenly distributed slots (713) that are staggered with the grid-shaped heat dissipation air chamber (711). The bottom four sides of the front frame (100) are fixedly connected with evenly distributed plugs (800) that are inserted into the adjacent slots (713).

10. The high-precision integrated backlight structure according to claim 9, characterized in that, The cross-sectional shape of the socket (713) and the plug (800) are both matching rectangles, and the number of the socket (713) and the plug (800) is the same and not less than thirty.

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