Chip electrical property detection device and manufacturing method thereof

Abstract

The invention provides a chip electrical property detection device and a manufacturing method thereof. The chip electrical detection device comprises a circuit control module, an electrical detection module and a flexible conductive structure. The circuit control module comprises a plurality of electrical conduction structures. The electrical detection module comprises a plurality of movable bearing substrates, a plurality of electrical detection structures and a plurality of electrical connection structures. The plurality of movable bearing substrates are separated from each other and are arranged on the flexible conductive structure. The plurality of electrical detection structures are respectively arranged on the plurality of movable bearing substrates and are respectively electrically connected with the plurality of electrical connection structures. The plurality of electrical connection structures respectively penetrate through the plurality of movable bearing substrates and are respectively electrically connected to the plurality of electrical conduction structures through the flexible conductive structures. Each movable bearing substrate is configured to allow the position of the movable bearing substrate to be slightly adjusted through the flexible conductive structure, so that each electrical detection structure is allowed to be in a state of allowing the position of the movable bearing substrate to be slightly adjusted along with the corresponding movable bearing substrate.

Description

Technical Field

[0001] The present invention relates to a detection device and a manufacturing method thereof, and in particular to a chip electrical property detection device and a manufacturing method thereof. Background Art

[0002] Conventional technology uses a probe tester to power wafer-level micro or mini LED chips, testing each LED chip individually. However, this process is quite slow. If multiple probe testers were required to compensate for the slowdown, production costs would be high and overall efficiency would be very low. Summary of the Invention

[0003] The problem to be improved or solved by the present invention is to provide a chip electrical property detection device and a manufacturing method thereof in view of the deficiencies in the prior art.

[0004] To improve or resolve the aforementioned issues, one of the technical approaches employed by the present invention is to provide a chip electrical testing device, comprising: a circuit control module, an electrical testing module, and a flexible conductive structure. The circuit control module includes a circuit control substrate and multiple electrical conductive structures. The electrical testing module includes multiple movable supporting substrates, multiple electrical testing structures, and multiple electrical connection structures. The flexible conductive structure includes a flexible conductive material layer. wherein the circuit control module, the electrical detection module and the flexible conductive structure cooperate with each other to constitute a chip electrical detection device; wherein the flexible conductive structure is connected between the circuit control module and the electrical detection module, and the electrical detection module is electrically connected to the circuit control module through the flexible conductive structure; wherein the circuit control substrate has a predetermined circuit layout, and a plurality of electrical conduction structures are arranged on the circuit control substrate and electrically connected to the predetermined circuit layout of the circuit control substrate; wherein a plurality of movable supporting substrates are separated from each other and arranged on a flexible conductive material layer, a plurality of electrical detection structures are respectively arranged on a plurality of movable supporting substrates and are respectively electrically connected to a plurality of electrical connection structures through the flexible conductive material layer, and a plurality of electrical connection structures respectively pass through a plurality of movable supporting substrates and are respectively electrically connected to a plurality of electrical conduction structures.

[0005] In order to improve or solve the above-mentioned problems, another technical means adopted by the present invention is to provide a method for manufacturing a chip electrical detection device, which includes: providing a circuit control module, the circuit control module includes a circuit control substrate and a plurality of electrical conductive structures; providing an electrical detection module, the electrical detection module includes a plurality of movable supporting substrates, a plurality of electrical detection structures and a plurality of electrical connection structures; providing a flexible conductive structure, the flexible conductive structure includes a flexible conductive material layer; and, cooperating the circuit control module, the electrical detection module and the flexible conductive structure to form a chip electrical detection device. In which, the flexible conductive structure is connected between the circuit control module and the electrical detection module, and the electrical detection module is electrically connected to the circuit control module through the flexible conductive structure; the circuit control substrate has a predetermined circuit layout, and multiple electrical conduction structures are arranged on the circuit control substrate and electrically connected to the predetermined circuit layout of the circuit control substrate; in which, multiple movable supporting substrates are separated from each other and arranged on the flexible conductive material layer, multiple electrical detection structures are respectively arranged on multiple movable supporting substrates and respectively electrically connected to multiple electrical connection structures, and multiple electrical connection structures respectively penetrate multiple movable supporting substrates and are respectively electrically connected to multiple electrical conduction structures through the flexible conductive material layer.

[0006] One of the beneficial effects of the present invention is that the present invention provides a chip electrical detection device, which can be configured to allow each movable supporting substrate to be in a state that allows slight adjustment of its position through the flexible support of the flexible conductive material layer through the technical solutions of "the circuit control module includes a circuit control substrate and multiple electrical conduction structures", "the electrical detection module includes multiple movable supporting substrates, multiple electrical detection structures and multiple electrical connection structures", "the flexible conductive structure includes a flexible conductive material layer", "the circuit control module, the electrical detection module and the flexible conductive structure cooperate with each other to form a chip electrical detection device", "the multiple movable supporting substrates are separated from each other and arranged on the flexible conductive material layer", "the multiple electrical detection structures are respectively arranged on the multiple movable supporting substrates and are respectively electrically connected to the multiple electrical connection structures" and "the multiple electrical connection structures respectively pass through the multiple movable supporting substrates and are respectively electrically connected to the multiple electrical conduction structures through the flexible conductive material layer", so that each movable supporting substrate is configured to allow it to be in a state that allows it to be slightly adjusted of its position through the flexible support of the flexible conductive material layer, thereby each electrical detection structure is configured to allow it to be in a state that allows it to be slightly adjusted of its position following the corresponding movable supporting substrate.

[0007] One of the beneficial effects of the present invention is that the present invention provides a method for manufacturing a chip electrical detection device, which can be achieved through the technical solutions of "providing a circuit control module, the circuit control module including a circuit control substrate and multiple electrical conductive structures", "providing an electrical detection module, the electrical detection module including multiple movable supporting substrates, multiple electrical detection structures and multiple electrical connection structures", "providing a flexible conductive structure, the flexible conductive structure including a flexible conductive material layer", "cooperating the circuit control module, the electrical detection module and the flexible conductive structure to form a chip electrical detection device", "multiple movable supporting substrates are separated from each other and arranged on the flexible conductive material layer", "multiple electrical detection structures are respectively arranged on the multiple movable supporting substrates and are respectively electrically connected to the multiple electrical connection structures", and "multiple electrical connection structures respectively penetrate the multiple movable supporting substrates and are respectively electrically connected to the multiple electrical conductive structures through the flexible conductive material layer". Therefore, each movable supporting substrate is configured to allow it to be in a state where it can be slightly adjusted in position through the flexible support of the flexible conductive material layer, thereby allowing each electrical detection structure to be in a state where it can be slightly adjusted in position following the corresponding movable supporting substrate.

[0008] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a process diagram of a method for manufacturing a chip electrical detection device provided by the first embodiment of the present invention.

[0010] Figure 2 This is an exploded schematic diagram of the circuit control module, electrical detection module, and flexible conductive structure of the chip electrical detection device provided by the first embodiment of the present invention.

[0011] Figure 3 Schematic diagram of the cooperation between the circuit control module, electrical detection module, and flexible conductive structure of the chip electrical detection device provided by the first embodiment of the present invention (before the multiple movable supporting substrates are separated from each other).

[0012] Figure 4 Schematic diagram of the cooperation between the circuit control module, electrical detection module, and flexible conductive structure of the chip electrical detection device provided by the first embodiment of the present invention (after the multiple movable supporting substrates are separated from each other).

[0013] Figure 5 Schematic diagram of the chip electrical testing device provided by the first embodiment of the present invention before being pressed down to test a plurality of chips to be tested.

[0014] Figure 6 A schematic diagram of the chip electrical testing device provided by the first embodiment of the present invention when being pressed down to test a plurality of chips to be tested.

[0015] Figure 7 This is a schematic diagram illustrating the cooperation between the circuit control module, the electrical detection module, and the flexible conductive structure of the chip electrical detection device provided by the second embodiment of the present invention.

[0016] Figure 8 This is a schematic diagram illustrating the cooperation between the circuit control module, the electrical detection module, and the flexible conductive structure of the chip electrical detection device provided by the third embodiment of the present invention.

[0017] Figure 9 This is a process diagram of a method for manufacturing a chip electrical detection device provided by a fourth embodiment of the present invention.

[0018] Figure 10 This is an exploded schematic diagram of a circuit control module, an electrical detection module, and a flexible conductive structure of a chip electrical detection device provided by a fourth embodiment of the present invention.

[0019] Figure 11 Schematic diagram of the cooperation between the circuit control module, electrical detection module and flexible conductive structure of the chip electrical detection device provided by the fourth embodiment of the present invention.

[0020] Figure 12 This is a schematic diagram of the chip electrical testing device provided by the fourth embodiment of the present invention before being pressed down to test a plurality of chips to be tested.

[0021] Figure 13 This is a schematic diagram of a chip electrical testing device provided by a fourth embodiment of the present invention being pressed down to test a plurality of chips to be tested.

[0022] Figure 14 This is a schematic diagram illustrating the cooperation between the circuit control module, the electrical detection module, and the flexible conductive structure of the chip electrical detection device provided by the fifth embodiment of the present invention. DETAILED DESCRIPTION

[0023] The following is an explanation of the implementation methods of the "chip electrical detection device" and "chip electrical detection device manufacturing method" disclosed in the present invention through specific specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, it should be stated in advance that the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0024] First embodiment

[0025] See Figures 1 to 6 As shown, the first embodiment of the present invention provides a method for manufacturing a chip electrical detection device, which at least includes: first, Figure 1 and Figure 2 As shown, a circuit control module 1 is provided, which includes a circuit control substrate 11 and a plurality of electrical conductive structures 12 (step S100); then, Figure 1 and Figure 2 As shown, an electrical detection module 2 is provided, which includes a plurality of movable supporting substrates 21 (before the plurality of movable supporting substrates 21 are separated from each other), a plurality of electrical detection structures 22 and a plurality of electrical connection structures 23 (step S102); then, Figure 1 and Figure 2 As shown, a flexible conductive structure 3 is provided, and the flexible conductive structure 3 includes at least a flexible conductive material layer 30 (step S104); next, Figure 1 、 Figure 2 and Figure 3 As shown, the circuit control module 1, the electrical detection module 2 and the flexible conductive structure 3 are matched with each other (for example, electrically bonded together) to form a chip electrical detection device D (step S106). Figure 3 and Figure 4 As shown, in step S106, the electrical detection module 2 can Figure 3The multiple cutting lines (multiple imaginary lines) shown perform a cutting step (or material removal step) to separate the multiple movable supporting substrates 21 from each other and enable independent movement. For example, after the multiple movable supporting substrates 21 are separated from each other through the cutting step (or material removal step), two adjacent movable supporting substrates 21 may be separated by a predetermined distance, and the outer surrounding surface of each movable supporting substrate 21 may be a surrounding cut surface 2100 (or a surrounding roughened surface) formed by the cutting method (or material removal method). However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0026] Furthermore, if Figure 2 As shown, the circuit control substrate 11 has a predetermined circuit layout (either a predetermined circuit pattern including conductive vias, or a predetermined circuit trace including conductive vias, or an LED lighting circuit fabricated using a semiconductor process, which may include multiple scan lines and multiple data lines). Furthermore, multiple electrically conductive structures 12 (or multiple electrically conductive pins) may be disposed on the circuit control substrate 11 and electrically connected to the predetermined circuit layout of the circuit control substrate 11. For example, in one embodiment, the predetermined circuit layout of the circuit control substrate 11 may include one or more bottom circuits (not shown) disposed on the bottom of the circuit control substrate 11, one or more top circuits (not shown) disposed on the top of the circuit control substrate 11, and one or more through-circuits (or multiple conductive vias, not shown) extending through the circuit control substrate 11. The circuit control substrate 11 may be configured as a first silicon wafer substrate or any other type of relatively rigid carrier substrate. Furthermore, each electrical conductive structure 12 of the circuit control module 1 may include at least a first conductive element 121 (e.g., a first conductive pin) and a second conductive element 122 (e.g., a second conductive pin) adjacent to each other. The first conductive element 121 and the second conductive element 122 of each electrical conductive structure 12 may be electrically connected to a bottom circuit (not shown) or a through circuit (not shown) of the circuit control substrate 11, and the first conductive element 121 and the second conductive element 122 of each electrical conductive structure 12 may extend downward from the bottom of the circuit control substrate 11. However, the above example is merely one feasible embodiment and is not intended to limit the present invention.

[0027] Furthermore, with Figure 2 and Figure 3As shown, the flexible conductive structure 3 can be electrically connected between the circuit control module 1 and the electrical detection module 2, thereby enabling the electrical detection module 2 to be electrically connected to the circuit control module 1 via the flexible conductive structure 3. For example, the flexible conductive material layer 30 can be configured as any conductive rubber, any conductive polymer, any anisotropic conductive paste (ACP), or any anisotropic conductive film (ACF). Alternatively, any flexible conductive material or any conductive material that can provide elasticity or flexibility can be used. It is worth noting that the conductive rubber includes a plurality of embedded conductive gold wires or a plurality of embedded conductive materials corresponding to the "multiple electrical conductive structures 12 (including the plurality of first conductive elements 121 and the plurality of second conductive elements 122)" or the "multiple top conductive elements 2310." However, the above example is merely one possible embodiment and is not intended to limit the present invention.

[0028] Furthermore, with Figure 3 and Figure 4As shown, multiple movable supporting substrates 21 can be separated from each other and jointly arranged on the flexible conductive material layer 30 after processing through a cutting step (or a material removal step), multiple electrical detection structures 22 can be respectively arranged on the multiple movable supporting substrates 21 and respectively electrically connected to the multiple electrical connection structures 23, and the multiple electrical connection structures 23 can respectively penetrate the multiple movable supporting substrates 21 and respectively be electrically connected to the multiple electrical conductive structures 12 through the flexible conductive material layer 30. For example, in one feasible embodiment, the movable supporting substrate 21 can be configured as a second silicon wafer substrate or any type of relatively hard supporting substrate, each electrical detection structure 22 can include at least a first electrical detection probe 221 (or a first power supply probe, or a first electrical contact probe, or a P-pole contact probe) and a second electrical detection probe 222 (or a second power supply probe, or a second electrical contact probe, or an N-pole contact probe), and each electrical connection structure 23 can include at least two conductive penetration layers 231 (such as two solid conductive pillars, two hollow conductive through holes or two through-silicon vias (TSV)) penetrating the movable supporting substrate 21, each conductive penetration layer 231 having a top conductive component 2310 (or a top conductive pin) at the top, and the bottom of each conductive penetration layer 231 directly electrically contacts the corresponding electrical detection structure 22. Thus, as Figure 4 As shown, when the circuit control module 1, the electrical detection module 2, and the flexible conductive structure 3 cooperate to form a chip electrical detection device D, since the bottom end of each conductive penetration layer 231 can directly electrically contact the corresponding electrical detection structure 22, the first electrical detection probe 221 can sequentially pass through the corresponding conductive penetration layer 231, the flexible conductive material layer 30, and the corresponding first conductive element 121 to be electrically connected to the circuit control module 1, and the second electrical detection probe 222 can sequentially pass through the corresponding conductive penetration layer 231, the flexible conductive material layer 30, and the corresponding second conductive element 122 to be electrically connected to the circuit control module 1. For example, in one embodiment, the first electrical detection probe 221 of the electrical detection structure 22 and the conductive penetration layer 231 of the electrical connection structure 23, which are electrically connected to each other, can be an integrally formed or non-integrated conductive structure, and the second electrical detection probe 222 of the electrical detection structure 22 and the conductive penetration layer 231 of the electrical connection structure 23, which are electrically connected to each other, can be an integrally formed or non-integrated conductive structure. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0029] Furthermore, in one feasible embodiment, the first conductive component 121 and the second conductive component 122 of each electrically conductive structure 12 can directly and electrically contact the corresponding two top conductive components 2310 (eg, Figure 4 Alternatively, the first conductive component 121 and the second conductive component 122 of each electrically conductive structure 12 may be separated from the corresponding two top conductive components 2310 by a predetermined distance. It is worth noting that when the first conductive component 121 and the second conductive component 122 of each electrically conductive structure 12 are separated from the corresponding two top conductive components 2310 by a predetermined distance, the first conductive component 121 and the second conductive component 122 of each electrically conductive structure 12 may be electrically connected to the corresponding two top conductive components 2310 via the flexible conductive material layer 30. However, the above example is merely one feasible embodiment and is not intended to limit the present invention.

[0030] It is worth noting that Figure 4 As shown, since multiple movable supporting substrates 21 can be separated from each other by cutting and arranged on the bottom end of the flexible conductive material layer 30, each movable supporting substrate 21 can be configured to allow "flexible support of the flexible conductive material layer 30 or flexible support (that is, the flexible conductive material layer 30 can be used as a flexible supporting substrate shared by multiple movable supporting substrates 21)" to be in a state that allows slight adjustment of position (for example, each movable supporting substrate 21 can be slightly adjusted or slightly moved in the horizontal direction, vertical direction or tilt direction), thereby allowing each electrical detection structure 22 to be configured to allow the corresponding movable supporting substrate 21 to be in a state that allows slight adjustment of position (for example, the first electrical detection probe 221 and the second electrical detection probe 222 of each electrical detection structure 22 can simultaneously be slightly adjusted or slightly moved in the horizontal direction, vertical direction or tilt direction). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0031] For example, with Figure 5 and Figure 6 As shown, when a chip electrical inspection device D (e.g., an LED spot test fixture) is configured to inspect multiple chips T to be inspected (e.g., multiple micro LED bare die or multiple mini LED bare die disposed on a GaAs epitaxial wafer, or any type of unpackaged light-emitting die), the chip electrical inspection device D can be moved downward (e.g., by downward pressure applied by a flexible pressing device M (e.g., an air bag or any type of flexible pressing plate)). Figure 6As shown), the first electrical detection probe 221 and the second electrical detection probe 222 of each electrical detection structure 22 can respectively and truly electrically contact the two conductive pads T100 of the corresponding chip T to be detected (or can respectively and truly provide "fixed current (or fixed voltage)" to the two conductive pads T100 of the corresponding chip T to be detected). It is worth noting that, as Figure 6 As shown, even when the plurality of chips T to be tested are not in a completely flat state and the plurality of conductive pads T100 of the plurality of chips T to be tested cannot be located on the same horizontal plane (eg Figure 6 When the circuit substrate 22 is on the imaginary line shown (or when the entire circuit substrate for carrying multiple chips T to be tested is warped), since each electrical detection structure 22 can be configured to allow the corresponding movable supporting substrate 21 to be in a state where the position can be slightly adjusted, the first electrical detection probe 221 and the second electrical detection probe 222 of each electrical detection structure 22 can respectively and truly electrically contact the two conductive pads T100 of the corresponding chip T to be tested (or can respectively and truly provide "fixed current (or fixed voltage)" to the two conductive pads T100 of the corresponding chip T to be tested), thereby allowing multiple chips T to be tested to generate detection light sources through the electrical supply of multiple electrical detection structures 22 at the same time, so as to provide the optical detection device S with relevant optical detection (LED lighting test) on the multiple chips T to be tested. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0032] It is worth mentioning that, for example, Figure 5 or Figure 6 As shown, the circuit control substrate 11 of the circuit control module 1 can be configured to carry multiple functional chips C (such as a control chip, a memory chip, or any type of semiconductor chip), and each functional chip C can be electrically connected to a corresponding electrical detection structure 22 via a corresponding electrical conductive structure 12, a flexible conductive material layer 30, and a corresponding electrical connection structure 23. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0033] Furthermore, with Figure 4 、 Figure 5 and Figure 6As shown, the first embodiment of the present invention further provides a chip electrical testing device D, which includes a circuit control module 1, an electrical testing module 2, and a flexible conductive structure 3. The circuit control module 1, electrical testing module 2, and flexible conductive structure 3 can cooperate with each other in any manner to form the chip electrical testing device D. Furthermore, the circuit control module 1 includes a circuit control substrate 11 and a plurality of electrical conductive structures 12. The circuit control substrate 11 has a predetermined circuit layout, and the plurality of electrical conductive structures 12 can be disposed on the circuit control substrate 11 and electrically connected to the predetermined circuit layout of the circuit control substrate 11. Furthermore, the electrical testing module 2 includes a plurality of movable supporting substrates 21, a plurality of electrical testing structures 22, and a plurality of electrical connection structures 23. The flexible conductive structure 3 includes at least one flexible conductive material layer 30. Furthermore, the flexible conductive structure 3 can be connected between the circuit control module 1 and the electrical testing module 2, and the electrical testing module 2 can be electrically connected to the circuit control module 1 via the flexible conductive structure 3. In addition, the plurality of movable supporting substrates 21 can be separated from each other and arranged on the flexible conductive material layer 30, the plurality of electrical detection structures 22 can be respectively arranged on the plurality of movable supporting substrates 21 and respectively electrically connected to the plurality of electrical connection structures 23, and the plurality of electrical connection structures 23 can respectively penetrate the plurality of movable supporting substrates 21 and respectively electrically connected to the plurality of electrical conductive structures 12 through the flexible conductive material layer 30. For example, since the plurality of movable supporting substrates 21 can be arranged on the bottom end of the flexible conductive material layer 30, each movable supporting substrate 21 can be configured to allow the flexible support of the flexible conductive material layer 30 to be in a state allowing slight adjustment of its position, thereby allowing each electrical detection structure 22 to be configured to allow the corresponding movable supporting substrate 21 to be in a state allowing slight adjustment of its position. Furthermore, since each electrical detection structure 22 can be configured to allow the corresponding movable supporting substrate 21 to be in a state where the position can be slightly adjusted, the first electrical detection probe 221 and the second electrical detection probe 222 of each electrical detection structure 22 can respectively and truly electrically contact the two conductive pads T100 of the corresponding chip T to be detected (or can respectively and truly provide "fixed current (or fixed voltage)" to the two conductive pads T100 of the corresponding chip T to be detected) (such as Figure 6As shown). It is worth noting that when each electrical detection structure 22 can be configured to allow for slight position adjustment along with the corresponding movable carrier substrate 21, the multiple electrical detection structures 22 can provide uniform pressing force to the multiple chips T to be detected by using the flexible conductive material layer 30, thereby preventing damage to the multiple chips T to be detected due to contact electrical testing (that is, preventing the chips T to be detected from being broken due to electrical testing). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0034] Second embodiment

[0035] See Figure 7 As shown, the second embodiment of the present invention provides a chip electrical detection device D, which includes a circuit control module 1, an electrical detection module 2 and a flexible conductive structure 3. Figure 7 and Figure 3 From the comparison, it can be seen that the main difference between the second embodiment of the present invention and the first embodiment is that: in the second embodiment, each electrical connection structure 23 can include at least two conductive penetration layers 231 (for example, two solid conductive pillars, two hollow conductive through holes or two through-silicon vias (TSV)) and two conductive connection layers 232 (for example, two conductive circuit layers). Furthermore, the two conductive penetration layers 231 can penetrate the corresponding movable supporting substrate 21, and the two conductive connection layers 232 can be arranged on the bottom end of the corresponding movable supporting substrate 21. The top of each conductive penetration layer 231 has a top conductive component 2310 (or a top conductive pin), and the bottom end of each conductive penetration layer 231 can be directly electrically connected to or electrically contact the corresponding conductive connection layer 232.

[0036] Furthermore, if Figure 10 As shown, when the circuit control module 1, the electrical detection module 2, and the flexible conductive structure 3 cooperate with each other to form a chip electrical detection device D, the first electrical detection probe 221 can sequentially pass through the corresponding conductive connection layer 232, the corresponding conductive penetration layer 231, the flexible conductive material layer 30, and the corresponding first conductive element 121 to be electrically connected to the circuit control module 1, and the second electrical detection probe 222 can sequentially pass through the corresponding conductive connection layer 232, the corresponding conductive penetration layer 231, the flexible conductive material layer 30, and the corresponding second conductive element 122 to be electrically connected to the circuit control module 1. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0037] Therefore, the same as the first embodiment is that Figure 6As shown, since multiple movable supporting substrates 21 can be set on the bottom end of the flexible conductive material layer 30, each movable supporting substrate 21 can be configured to allow the flexible support of the flexible conductive material layer 30 to be in a state that allows slight adjustment of its position, thereby allowing each electrical detection structure 22 to be configured to allow the corresponding movable supporting substrate 21 to be in a state that allows slight adjustment of its position. Furthermore, since each electrical detection structure 22 can be configured to allow the corresponding movable supporting substrate 21 to be in a state that allows slight adjustment of its position, the first electrical detection probe 221 and the second electrical detection probe 222 of each electrical detection structure 22 can respectively and reliably electrically contact the two conductive pads (not shown) of the corresponding chip to be detected (not shown).

[0038] Third embodiment

[0039] See Figure 8 As shown, the third embodiment of the present invention provides a chip electrical detection device D, which includes a circuit control module 1, an electrical detection module 2 and a flexible conductive structure 3. Figure 8 and Figure 4 From the comparison, it can be seen that the main difference between the third embodiment of the present invention and the first embodiment is that: in the third embodiment, each movable supporting substrate 21 can further include a first movable supporting plate 211 (the outer surrounding surface of the first movable supporting plate 211 can be a surrounding cutting surface or a surrounding roughened surface formed by cutting or material removal) and a second movable supporting plate 212 (the outer surrounding surface of the second movable supporting plate 212 can be a surrounding cutting surface or a surrounding roughened surface formed by cutting or material removal), which are separated from each other after processing through a cutting step (or a material removal step), and the first electrical detection probe 221 and the second electrical detection probe 222 of each electrical detection structure 22 can be respectively arranged on the first movable supporting plate 211 and the second movable supporting plate 212 of the corresponding movable supporting substrate 21.

[0040] Therefore, if Figure 8As shown, since the first movable supporting plate 211 and the second movable supporting plate 212 of the multiple movable supporting substrates 21 can be arranged on the bottom end of the flexible conductive material layer 30, the first movable supporting plate 211 and the second movable supporting plate 212 of each movable supporting substrate 21 can be configured to allow the flexible support of the flexible conductive material layer 30 to be in a state allowing slight adjustment of the position, thereby allowing the first electrical detection probe 221 and the second electrical detection probe 222 of each electrical detection structure 22 to be respectively configured to allow the corresponding first movable supporting plate 211 and the second movable supporting plate 212 of the movable supporting substrate 21 to be in a state allowing slight adjustment of the position. Furthermore, since the first electrical detection probe 221 and the second electrical detection probe 222 of each electrical detection structure 22 can be respectively configured to allow the first movable supporting plate 211 and the second movable supporting plate 212 of the corresponding movable supporting substrate 21 to be in a state allowing slight position adjustment, the first electrical detection probe 221 and the second electrical detection probe 222 of each electrical detection structure 22 can respectively and surely electrically contact the two conductive pads (not shown) of the corresponding chip to be tested (not shown).

[0041] Fourth embodiment

[0042] See Figures 9 to 13 As shown, the fourth embodiment of the present invention provides a method for manufacturing a chip electrical detection device, which at least includes: first, Figure 9 and Figure 10 As shown, a structural strengthening module 4 is provided, and the structural strengthening module 4 includes at least a structural strengthening substrate 40 (step S200); then, Figure 9 and Figure 10 As shown, an electrical detection module 2 is provided, which includes a probe carrier substrate 20, a plurality of electrical detection structures 22 and a plurality of electrical connection structures 23 (step S202); then, Figure 9 and Figure 10 As shown, a flexible buffer structure 5 is provided, and the flexible buffer structure 5 includes at least a flexible buffer material layer 50 (step S204); next, Figure 9 、 Figure 10 and Figure 11As shown, the structural reinforcement module 4, the electrical detection module 2 and the flexible buffer structure 5 are coordinated with each other to form a chip electrical detection device D (step S206). Furthermore, the probe carrier substrate 20 can be set on the flexible buffer material layer 50, and the plurality of electrical detection structures 22 can be respectively set on the plurality of probe carrier substrates 20 and respectively electrically connected to the plurality of electrical connection structures 23. In addition, each electrical detection structure 22 includes a first electrical detection probe 221 (or a first power supply probe, or a first electrical contact probe, or a P-pole contact probe) and a second electrical detection probe 222 (or a second power supply probe, or a second electrical contact probe, or an N-pole contact probe). Therefore, with Figure 12 and Figure 13 As shown, the probe carrier substrate 20 can be configured to allow the flexible support of the flexible buffer material layer 50 to be in a state that allows the position to be slightly adjusted, thereby allowing the first electrical detection probe 221 and the second electrical detection probe 222 of each electrical detection structure 22 to be configured to allow the position to be slightly adjusted following the probe carrier substrate 20.

[0043] For example, in one feasible embodiment, the structural reinforcement substrate 40 can be configured as a first silicon wafer substrate or any type of relatively rigid carrier substrate, and the probe carrier substrate 20 can be configured as a second silicon wafer substrate or any type of relatively rigid carrier substrate. In addition, the flexible buffer material layer 50 (or elastic material layer, or flexible material layer) can be configured as a prefabricated polymer material layer (or any type of polymer film material), and the polymer material layer can be silicone or epoxy resin. It is worth mentioning that when the structural reinforcement substrate 40 of the structural reinforcement module 4 is used as a circuit substrate according to different needs, the circuit substrate can be configured to carry multiple functional chips (such as a control chip, a memory chip, or any type of semiconductor chip). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0044] For example, with Figure 12 and Figure 13As shown, when a chip electrical inspection device D (e.g., an LED spot test fixture) is configured to inspect multiple chips T to be inspected (e.g., multiple micro LED bare die or multiple mini LED bare die disposed on a GaAs epitaxial wafer, or any type of unpackaged light-emitting die), the chip electrical inspection device D can be moved downward (e.g., by downward pressure applied by a flexible pressing device M (e.g., an air bag or any type of flexible pressing plate)). Figure 13 As shown), the first electrical detection probe 221 and the second electrical detection probe 222 of each electrical detection structure 22 can respectively and truly electrically contact the two conductive pads T100 of the corresponding chip T to be detected (or can respectively and truly provide "fixed current (or fixed voltage)" to the two conductive pads T100 of the corresponding chip T to be detected). It is worth noting that, as Figure 13 As shown, even when the plurality of chips T to be tested are not in a completely flat state and the plurality of conductive pads T100 of the plurality of chips T to be tested cannot be located on the same horizontal plane (eg Figure 13 The first and second electrical detection probes 221 and 222 of each electrical detection structure 22 can respectively and truly electrically contact the two conductive pads T100 of the corresponding chip T to be detected (or can respectively provide "fixed current (or fixed voltage)" to the two conductive pads T100 of the corresponding chip T to be detected), thereby enabling the multiple chips T to be detected to generate detection light sources through the electrical supply of the multiple electrical detection structures 22 at the same time, so as to provide the optical detection device S with relevant optical detection (LED lighting test) on the multiple chips T to be detected. It is worth noting that when each electrical detection structure 22 can be configured to allow for slight position adjustment along with the corresponding movable carrier substrate 21, the multiple electrical detection structures 22 can provide uniform pressing force to the multiple chips T to be detected by using the flexible conductive material layer 30, thereby preventing damage to the multiple chips T to be detected due to contact electrical testing (that is, preventing the chips T to be detected from being broken due to electrical testing). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0045] Furthermore, with Figure 11 、 Figure 12 and Figure 13As shown, the fourth embodiment of the present invention further provides a chip electrical detection device D, which includes a structural reinforcement module 4, an electrical detection module 2, and a flexible buffer structure 5, and the structural reinforcement module 4, the electrical detection module 2, and the flexible buffer structure 5 can cooperate with each other in any way to form a chip electrical detection device D. In addition, the structural reinforcement module 4 includes a structural reinforcement substrate 40, the electrical detection module 2 includes a probe carrier substrate 20, a plurality of electrical detection structures 22, and a plurality of electrical connection structures 23, and the flexible buffer structure 5 includes a flexible buffer material layer 50. In addition, the probe carrier substrate 20 is disposed on the flexible buffer material layer 50, and the plurality of electrical detection structures 22 are disposed on the probe carrier substrate 20 and are electrically connected to the plurality of electrical connection structures 23, respectively. For example, because each electrical detection structure 22 can be configured to allow for slight position adjustment along with the flexible buffer material layer 50, the first electrical detection probe 221 and the second electrical detection probe 222 of each electrical detection structure 22 can respectively and reliably electrically contact the two conductive pads T100 of the corresponding chip T to be detected. This allows multiple chips T to be detected to generate detection light sources simultaneously through the electrical supply of the multiple electrical detection structures 22, thereby providing light to the optical detection device S for performing relevant optical inspections (LED lighting tests) on the multiple chips T to be detected. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0046] Fifth embodiment

[0047] See Figure 14 As shown, the fifth embodiment of the present invention provides a chip electrical detection device D, which includes a structure reinforcement module 4, an electrical detection module 2 and a flexible buffer structure 5. Figure 14 and Figure 11From the comparison, it can be seen that the main difference between the fifth embodiment of the present invention and the fourth embodiment is that: in the fifth embodiment, the probe supporting substrate 20 may further include a plurality of movable supporting plates 200 separated from each other after processing by a cutting step (or a material removal step), and the plurality of movable supporting plates 200 are separated from each other and arranged on the flexible buffer material layer 50. Furthermore, the first electrical detection probe 221 and the second electrical detection probe 222 of each electrical detection structure 22 may be respectively arranged on two corresponding movable supporting plates 200. In addition, two adjacent movable supporting plates 200 may be separated from each other by a predetermined distance, and the outer surrounding surface of each movable supporting plate 200 may be a surrounding cutting surface 2000 (or a surrounding roughened surface) formed by a cutting method (or a material removal method). Therefore, since multiple movable supporting plates 200 can be arranged separately from each other on the bottom end of the flexible buffer material layer 50, each movable supporting plate 200 can be configured to allow the flexible support of the flexible buffer material layer 50 to be in a state allowing slight adjustment of position, thereby allowing the first electrical detection probe 221 and the second electrical detection probe 222 of each electrical detection structure 22 to be configured to allow the flexible buffer material layer 50 to be in a state allowing slight adjustment of position.

[0048] Advantageous Effects of the Embodiments

[0049] One of the beneficial effects of the present invention is that the present invention provides a chip electrical detection device D, which can be realized by "the circuit control module 1 includes a circuit control substrate 11 and a plurality of electrical conductive structures 12", "the electrical detection module 2 includes a plurality of movable supporting substrates 21, a plurality of electrical detection structures 22 and a plurality of electrical connection structures 23", "the flexible conductive structure 3 includes a flexible conductive material layer 30", "the circuit control module 1, the electrical detection module 2 and the flexible conductive structure 3 cooperate with each other to form the chip electrical detection device D", "the plurality of movable supporting substrates 21 are separated from each other and arranged on the flexible conductive material layer 30", "the plurality of The electrical detection structures 22 are respectively arranged on multiple movable supporting substrates 21 and are respectively electrically connected to multiple electrical connection structures 23” and the technical solutions of “multiple electrical connection structures 23 respectively penetrate multiple movable supporting substrates 21 and are respectively electrically connected to multiple electrical conductive structures 12 through flexible conductive material layers 30”, so that each movable supporting substrate 21 can be configured to allow it to be in a state that allows its position to be slightly adjusted through the flexible support of the flexible conductive material layer 30, thereby each electrical detection structure 22 can be configured to allow it to be in a state that allows its position to be slightly adjusted following the corresponding movable supporting substrate 21.

[0050] One of the beneficial effects of the present invention is that the present invention provides a method for manufacturing a chip electrical detection device D, which can be achieved by "providing a circuit control module 1, the circuit control module 1 includes a circuit control substrate 11 and a plurality of electrical conductive structures 12", "providing an electrical detection module 2, the electrical detection module 2 includes a plurality of movable supporting substrates 21, a plurality of electrical detection structures 22 and a plurality of electrical connection structures 23", "providing a flexible conductive structure 3, the flexible conductive structure 3 includes a flexible conductive material layer 30", "cooperating the circuit control module 1, the electrical detection module 2 and the flexible conductive structure 3 to form a chip electrical detection device D", "separating the plurality of movable supporting substrates 21 from each other The present invention provides the following technical solutions: "a plurality of electrical detection structures 22 are respectively arranged on a plurality of movable supporting substrates 21 and are respectively electrically connected to a plurality of electrical connection structures 23" and "a plurality of electrical connection structures 23 respectively penetrate a plurality of movable supporting substrates 21 and are respectively electrically connected to a plurality of electrical conduction structures 12 through the flexible conductive material layer 30", so that each movable supporting substrate 21 can be configured to allow it to be in a state allowing slight adjustment of its position through the flexible support of the flexible conductive material layer 30, thereby each electrical detection structure 22 can be configured to allow it to be in a state allowing slight adjustment of its position following the corresponding movable supporting substrate 21.

[0051] One of the beneficial effects of the present invention is that the chip electrical detection device D provided by the present invention can be configured to allow the probe carrier substrate 20 to be in a state where it can be slightly adjusted in position through the flexible support of the flexible buffer material layer 50, thereby allowing each electrical detection structure 22 to be in a state where it can be slightly adjusted in position following the probe carrier substrate 20 through the technical solutions of "the structural reinforcement module 4 includes a structural reinforcement substrate 40", "the electrical detection module 2 includes a probe carrier substrate 20, multiple electrical detection structures 22 and multiple electrical connection structures 23", "the flexible buffer structure 5 includes a flexible buffer material layer 50", "the structural reinforcement module 4, the electrical detection module 2 and the flexible buffer structure 5 cooperate with each other to constitute the chip electrical detection device D", "the probe carrier substrate 20 is arranged on the flexible buffer material layer 50" and "the multiple electrical detection structures 22 are arranged on the probe carrier substrate 20 and are respectively electrically connected to the multiple electrical connection structures 23".

[0052] One of the beneficial effects of the present invention is that the present invention provides a method for manufacturing a chip electrical detection device, which can be achieved through the technical solutions of "providing a structural reinforcement module 4, the structural reinforcement module 4 includes a structural reinforcement substrate 40", "providing an electrical detection module 2, the electrical detection module 2 includes a probe carrier substrate 20, multiple electrical detection structures 22 and multiple electrical connection structures 23", "providing a flexible buffer structure 5, the flexible buffer structure 5 includes a flexible buffer material layer 50", "cooperating the structural reinforcement module 4, the electrical detection module 2 and the flexible buffer structure 5 to form a chip electrical detection device D", "the probe carrier substrate 20 is arranged on the flexible buffer material layer 50" and "the multiple electrical detection structures 22 are arranged on the probe carrier substrate 20 and are respectively electrically connected to the multiple electrical connection structures 23", so that the probe carrier substrate 20 can be configured to allow it to be in a state where it can be slightly adjusted in position through the flexible support of the flexible buffer material layer 50, thereby each electrical detection structure 22 can be configured to allow it to be in a state where it can be slightly adjusted in position following the probe carrier substrate 20.

[0053] The contents disclosed above are only optional feasible embodiments of the present invention and do not limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the description and drawings of the present invention are included in the scope of protection of the claims of the present invention.

Claims

1. A chip electrical detection device, characterized in that: The chip electrical property detection device comprises: a circuit control module, comprising a circuit control substrate and a plurality of electrically conductive structures; an electrical detection module, comprising a plurality of movable supporting substrates, a plurality of electrical detection structures, and a plurality of electrical connection structures; and a flexible conductive structure, the flexible conductive structure comprising a flexible conductive material layer; The circuit control module, the electrical detection module and the flexible conductive structure cooperate with each other to form the chip electrical detection device; Wherein, the flexible conductive structure is connected between the circuit control module and the electrical detection module, and the electrical detection module is electrically connected to the circuit control module through the flexible conductive structure; The circuit control substrate has a predetermined circuit layout, and the plurality of electrical conductive structures are disposed on the circuit control substrate and electrically connected to the predetermined circuit layout of the circuit control substrate; Among them, the multiple movable supporting substrates are separated from each other and arranged on the flexible conductive material layer, the multiple electrical detection structures are respectively arranged on the multiple movable supporting substrates and are respectively electrically connected to the multiple electrical connection structures, and the multiple electrical connection structures respectively penetrate the multiple movable supporting substrates and are respectively electrically connected to the multiple electrical conduction structures through the flexible conductive material layer.

2. The chip electrical property detection device according to claim 1, characterized in that: in, Each of the electrical connection structures includes two conductive penetration layers penetrating the corresponding movable supporting substrate and two conductive connection layers disposed on the bottom end of the corresponding movable supporting substrate, the top end of each conductive penetration layer having a top conductive component, and the bottom end of each conductive penetration layer being electrically connected to the corresponding conductive connection layer; Wherein, two adjacent movable supporting substrates are separated from each other by a predetermined distance, and the outer surrounding surface of each movable supporting substrate is a surrounding cutting surface formed by cutting; Each of the electrical conductive structures of the circuit control module includes a first conductive component and a second conductive component adjacent to each other, and each of the electrical detection structures includes a first electrical detection probe and a second electrical detection probe, wherein the first electrical detection probe is electrically connected to the circuit control module by sequentially passing through the corresponding conductive connection layer, the corresponding conductive penetration layer, the flexible conductive material layer, and the corresponding first conductive component, and the second electrical detection probe is electrically connected to the circuit control module by sequentially passing through the corresponding conductive connection layer, the corresponding conductive penetration layer, the flexible conductive material layer, and the corresponding second conductive component; Among them, multiple movable supporting substrates are arranged separately from each other on the bottom end of the flexible conductive material layer, and each of the movable supporting substrates is configured to allow it to be in a state where its position can be slightly adjusted through the flexible support of the flexible conductive material layer, thereby allowing each of the electrical detection structures to be in a state where its position can be slightly adjusted following the corresponding movable supporting substrate.

3. The chip electrical property detection device according to claim 2, characterized in that: in, The first conductive component and the second conductive component of each of the electrically conductive structures are electrically connected to the circuit control substrate, and the first conductive component and the second conductive component of each of the electrically conductive structures extend downward from the bottom end of the circuit control substrate; Wherein, the first conductive component and the second conductive component of each of the electrical conductive structures are directly in electrical contact with the corresponding two top conductive components or are separated from the corresponding two top conductive components; Wherein, the first conductive component and the second conductive component of each of the electrical conductive structures are electrically connected to the corresponding two top conductive components through the flexible conductive material layer; The circuit control substrate of the circuit control module is configured to carry a plurality of functional chips, and each functional chip is electrically connected to the corresponding electrical detection structure through the corresponding electrical conduction structure, the flexible conductive material layer, and the corresponding electrical connection structure; Wherein, the flexible conductive material layer is configured as a conductive rubber, a conductive polymer, an anisotropic conductive adhesive or an anisotropic conductive film; Wherein, the circuit control substrate is configured as a first silicon wafer substrate, and the movable supporting substrate is configured as a second silicon wafer substrate; When the chip electrical detection device is configured to detect multiple chips to be detected, the chip electrical detection device moves downward by applying downward pressure from a flexible pressing device, thereby causing the first electrical detection probe and the second electrical detection probe of each electrical detection structure to electrically contact the two conductive pads of the corresponding chip to be detected; Among them, each of the movable supporting substrates includes a first movable supporting plate and a second movable supporting plate separated from each other, and the first electrical detection probe and the second electrical detection probe of each electrical detection structure are respectively arranged on the first movable supporting plate and the second movable supporting plate of the corresponding movable supporting substrate.

4. The chip electrical property detection device according to claim 1, characterized in that: in, Each of the electrical connection structures includes two conductive penetration layers penetrating the corresponding movable supporting substrate, the top of each conductive penetration layer having a top conductive component, and the bottom of each conductive penetration layer directly electrically contacts the corresponding electrical detection structure; Wherein, two adjacent movable supporting substrates are separated from each other by a predetermined distance, and the outer surrounding surface of each movable supporting substrate is a surrounding cutting surface formed by cutting; Each of the electrical conductive structures of the circuit control module includes a first conductive component and a second conductive component adjacent to each other, and each of the electrical detection structures includes a first electrical detection probe and a second electrical detection probe, wherein the first electrical detection probe sequentially passes through the corresponding conductive penetration layer, the flexible conductive material layer, and the corresponding first conductive component to be electrically connected to the circuit control module, and the second electrical detection probe sequentially passes through the corresponding conductive penetration layer, the flexible conductive material layer, and the corresponding second conductive component to be electrically connected to the circuit control module; Among them, multiple movable supporting substrates are arranged separately from each other on the bottom end of the flexible conductive material layer, and each of the movable supporting substrates is configured to allow it to be in a state where its position can be slightly adjusted through the flexible support of the flexible conductive material layer, thereby allowing each of the electrical detection structures to be in a state where its position can be slightly adjusted following the corresponding movable supporting substrate.

5. The chip electrical property detection device according to claim 4, characterized in that: in, The first conductive component and the second conductive component of each of the electrically conductive structures are electrically connected to the circuit control substrate, and the first conductive component and the second conductive component of each of the electrically conductive structures extend downward from the bottom end of the circuit control substrate; Wherein, the first conductive component and the second conductive component of each of the electrical conductive structures are directly in electrical contact with the corresponding two top conductive components or are separated from the corresponding two top conductive components; Wherein, the first conductive component and the second conductive component of each of the electrical conductive structures are electrically connected to the corresponding two top conductive components through the flexible conductive material layer; The circuit control substrate of the circuit control module is configured to carry a plurality of functional chips, and each functional chip is electrically connected to the corresponding electrical detection structure through the corresponding electrical conduction structure, the flexible conductive material layer, and the corresponding electrical connection structure; Wherein, the flexible conductive material layer is configured as a conductive rubber, a conductive polymer, an anisotropic conductive adhesive or an anisotropic conductive film; Wherein, the circuit control substrate is configured as a first silicon wafer substrate, and the movable supporting substrate is configured as a second silicon wafer substrate; When the chip electrical detection device is configured to detect multiple chips to be detected, the chip electrical detection device moves downward by applying downward pressure from a flexible pressing device, thereby causing the first electrical detection probe and the second electrical detection probe of each electrical detection structure to electrically contact the two conductive pads of the corresponding chip to be detected; Among them, each of the movable supporting substrates includes a first movable supporting plate and a second movable supporting plate separated from each other, and the first electrical detection probe and the second electrical detection probe of each electrical detection structure are respectively arranged on the first movable supporting plate and the second movable supporting plate of the corresponding movable supporting substrate.

6. A method for manufacturing a chip electrical detection device, characterized in that: The manufacturing method of the chip electrical detection device includes: A circuit control module is provided, the circuit control module comprising a circuit control substrate and a plurality of electrical conductive structures; An electrical detection module is provided, comprising a plurality of movable supporting substrates, a plurality of electrical detection structures, and a plurality of electrical connection structures; Providing a flexible conductive structure, the flexible conductive structure comprising a flexible conductive material layer; and The circuit control module, the electrical detection module and the flexible conductive structure cooperate with each other to form the chip electrical detection device; Wherein, the flexible conductive structure is connected between the circuit control module and the electrical detection module, and the electrical detection module is electrically connected to the circuit control module through the flexible conductive structure; The circuit control substrate has a predetermined circuit layout, and the plurality of electrical conductive structures are disposed on the circuit control substrate and electrically connected to the predetermined circuit layout of the circuit control substrate; Among them, the multiple movable supporting substrates are separated from each other and arranged on the flexible conductive material layer, the multiple electrical detection structures are respectively arranged on the multiple movable supporting substrates and are respectively electrically connected to the multiple electrical connection structures, and the multiple electrical connection structures respectively penetrate the multiple movable supporting substrates and are respectively electrically connected to the multiple electrical conduction structures through the flexible conductive material layer.

7. The method for manufacturing a chip electrical detection device according to claim 6, wherein: in, Each of the electrical connection structures includes two conductive penetration layers penetrating the corresponding movable supporting substrate and two conductive connection layers disposed on the bottom end of the corresponding movable supporting substrate, the top end of each conductive penetration layer having a top conductive component, and the bottom end of each conductive penetration layer being electrically connected to the corresponding conductive connection layer; Wherein, two adjacent movable supporting substrates are separated from each other by a predetermined distance, and the outer surrounding surface of each movable supporting substrate is a surrounding cutting surface formed by cutting; Each of the electrical conductive structures of the circuit control module includes a first conductive component and a second conductive component adjacent to each other, and each of the electrical detection structures includes a first electrical detection probe and a second electrical detection probe, wherein the first electrical detection probe is electrically connected to the circuit control module by sequentially passing through the corresponding conductive connection layer, the corresponding conductive penetration layer, the flexible conductive material layer, and the corresponding first conductive component, and the second electrical detection probe is electrically connected to the circuit control module by sequentially passing through the corresponding conductive connection layer, the corresponding conductive penetration layer, the flexible conductive material layer, and the corresponding second conductive component; Among them, multiple movable supporting substrates are separated from each other and arranged on the bottom end of the flexible conductive material layer by cutting or removing materials, and each of the movable supporting substrates is configured to allow it to be in a state that allows its position to be slightly adjusted through the flexible support of the flexible conductive material layer, thereby allowing each of the electrical detection structures to be in a state that allows its position to be slightly adjusted following the corresponding movable supporting substrate.

8. The method for manufacturing a chip electrical property detection device according to claim 7, wherein: in, The first conductive component and the second conductive component of each of the electrically conductive structures are electrically connected to the circuit control substrate, and the first conductive component and the second conductive component of each of the electrically conductive structures extend downward from the bottom end of the circuit control substrate; Wherein, the first conductive component and the second conductive component of each of the electrical conductive structures are directly in electrical contact with the corresponding two top conductive components or are separated from the corresponding two top conductive components; Wherein, the first conductive component and the second conductive component of each of the electrical conductive structures are electrically connected to the corresponding two top conductive components through the flexible conductive material layer; The circuit control substrate of the circuit control module is configured to carry a plurality of functional chips, and each functional chip is electrically connected to the corresponding electrical detection structure through the corresponding electrical conduction structure, the flexible conductive material layer, and the corresponding electrical connection structure; Wherein, the flexible conductive material layer is configured as a conductive rubber, a conductive polymer, an anisotropic conductive adhesive or an anisotropic conductive film; Wherein, the circuit control substrate is configured as a first silicon wafer substrate, and the movable supporting substrate is configured as a second silicon wafer substrate; When the chip electrical detection device is configured to detect multiple chips to be detected, the chip electrical detection device moves downward by applying downward pressure from a flexible pressing device, thereby causing the first electrical detection probe and the second electrical detection probe of each electrical detection structure to electrically contact the two conductive pads of the corresponding chip to be detected; In which, each of the movable supporting substrates includes a first movable supporting plate and a second movable supporting plate separated from each other by cutting or removing material, and the first electrical detection probe and the second electrical detection probe of each electrical detection structure are respectively arranged on the first movable supporting plate and the second movable supporting plate of the corresponding movable supporting substrate.

9. The method for manufacturing a chip electrical detection device according to claim 6, wherein: in, Each of the electrical connection structures includes two conductive penetration layers penetrating the corresponding movable supporting substrate, the top of each conductive penetration layer having a top conductive component, and the bottom of each conductive penetration layer directly electrically contacts the corresponding electrical detection structure; Wherein, two adjacent movable supporting substrates are separated from each other by a predetermined distance, and the outer surrounding surface of each movable supporting substrate is a surrounding cutting surface formed by cutting; Each of the electrical conductive structures of the circuit control module includes a first conductive component and a second conductive component adjacent to each other, and each of the electrical detection structures includes a first electrical detection probe and a second electrical detection probe, wherein the first electrical detection probe sequentially passes through the corresponding conductive penetration layer, the flexible conductive material layer, and the corresponding first conductive component to be electrically connected to the circuit control module, and the second electrical detection probe sequentially passes through the corresponding conductive penetration layer, the flexible conductive material layer, and the corresponding second conductive component to be electrically connected to the circuit control module; Among them, multiple movable supporting substrates are separated from each other and arranged on the bottom end of the flexible conductive material layer by cutting or removing materials, and each of the movable supporting substrates is configured to allow it to be in a state that allows its position to be slightly adjusted through the flexible support of the flexible conductive material layer, thereby allowing each of the electrical detection structures to be in a state that allows its position to be slightly adjusted following the corresponding movable supporting substrate.

10. The method for manufacturing a chip electrical property detection device according to claim 9, wherein: in, The first conductive component and the second conductive component of each of the electrically conductive structures are electrically connected to the circuit control substrate, and the first conductive component and the second conductive component of each of the electrically conductive structures extend downward from the bottom end of the circuit control substrate; Wherein, the first conductive component and the second conductive component of each of the electrical conductive structures are directly in electrical contact with the corresponding two top conductive components or are separated from the corresponding two top conductive components; Wherein, the first conductive component and the second conductive component of each of the electrical conductive structures are electrically connected to the corresponding two top conductive components through the flexible conductive material layer; The circuit control substrate of the circuit control module is configured to carry a plurality of functional chips, and each functional chip is electrically connected to the corresponding electrical detection structure through the corresponding electrical conduction structure, the flexible conductive material layer, and the corresponding electrical connection structure; Wherein, the flexible conductive material layer is configured as a conductive rubber, a conductive polymer, an anisotropic conductive adhesive or an anisotropic conductive film; Wherein, the circuit control substrate is configured as a first silicon wafer substrate, and the movable supporting substrate is configured as a second silicon wafer substrate; When the chip electrical detection device is configured to detect multiple chips to be detected, the chip electrical detection device moves downward by applying downward pressure from a flexible pressing device, thereby causing the first electrical detection probe and the second electrical detection probe of each electrical detection structure to electrically contact the two conductive pads of the corresponding chip to be detected; In which, each of the movable supporting substrates includes a first movable supporting plate and a second movable supporting plate separated from each other by cutting or removing material, and the first electrical detection probe and the second electrical detection probe of each electrical detection structure are respectively arranged on the first movable supporting plate and the second movable supporting plate of the corresponding movable supporting substrate.

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