Thin-film resistor network on-off identification circuit and method based on multi-path selection mode
The thin film resistor grid on-off recognition circuit designed through multiple selection method solves the problem of poor effect of thin film resistor grid circuits in the prior art in space debris detection, and achieves fast and accurate fragment parameter recognition, which improves detection accuracy and efficiency.
Patent Information
- Application Number
- CN202510701798.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-28
- Publication Date
- 2025-08-05
AI Technical Summary
The existing thin-film resistive gate circuit design is incomplete in space debris detection, making it difficult to effectively obtain multi-physical parameters of the debris, especially information such as size, position and impact time.
The on-off recognition circuit of the film resistor grid designed using a multiple-channel selection method includes a thin film resistor grid, on-off identification circuit, multiple-channel selection circuit and on-off identification circuit. The external impact fragments are detected through the on-off state of the resistor wire, and the position and size information of the impact fragments are analyzed in combination with the front and back break signals. The signal channel multiplexing design is used to reduce the number of output channels to achieve rapid identification.
Quickly identify the on-off state of a large number of resistive wires in a very short time, improving the detection accuracy and efficiency of parameters such as the size, position and impact time of space debris, and reducing the scale of circuit implementation.
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Figure CN120428338A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of space debris environment detection, and in particular to a thin film resistor network on-off identification circuit and method based on a multi-path selection mode. Background Art
[0002] The space environment is teeming with submillimeter and millimeter-scale debris, creating a high probability of collision with spacecraft and posing a significant risk. To obtain parameters of the space debris environment, various countries have conducted research and on-orbit testing on various principles for detecting small debris. Early detection methods primarily employed single-mode methods, including semiconductor detectors, ionization detectors, piezoelectric detectors, thin-film resistor grid detectors, and acoustic emission detectors, primarily to obtain debris flux information. In recent years, international attention has shifted to the integrated detection of multiple physical parameters, including space debris flux, size, velocity, and direction, and space debris detection structures have been developed that combine multiple detection technologies. The latest on-orbit detection method combines thin-film resistor grids with acoustic emission. The structure of the thin-film resistor grid and the choice of circuit processing significantly impact the detector's performance. Existing thin-film resistor grid circuit designs offer inadequate detection results, necessitating circuit design optimization to enhance debris information acquisition capabilities. Summary of the Invention
[0003] In view of this, the present invention provides a thin-film resistor network on-off identification circuit and method based on a multi-path selection method. One or more embodiments of this specification also relate to a thin-film resistor network on-off identification method based on a multi-path selection method to address technical deficiencies in the prior art.
[0004] According to a first aspect of the present invention, a thin film resistor network on-off identification circuit based on a multi-path selection method is provided, comprising:
[0005] It includes a thin film resistor network, an on / off identification circuit, a multi-way selection circuit and an on / off identification circuit;
[0006] The thin film resistor network is composed of an array of parallel resistor wires on both sides, which are used to detect external impact debris by the on and off states of the resistor wires.
[0007] The on-off identification circuit is connected to the resistance wire of the thin film resistor network to generate a level signal representing the on-off state of the resistance wire;
[0008] The multi-channel selection circuit queries the level signal of the resistor wire by taking turns to select, and adopts the signal channel multiplexing design to reduce the number of output channels;
[0009] The on-off recognition circuit identifies the on-off state of the resistor wire according to the level signal, and analyzes the position and size information of the impact fragments in combination with the front and back broken wire signals.
[0010] In some embodiments, the array of resistor wires of the thin film resistor network is formed into a grid structure by a cross design;
[0011] The line width and spacing of the resistance wires are the same, achieving the preset fragment size resolution capability;
[0012] The total number of resistor wire arrays is determined based on the effective detection area requirements.
[0013] In some embodiments, the on / off identification circuit adopts a voltage divider circuit design;
[0014] One end of the resistor wire is grounded, and the other end is connected to the power supply voltage through a pull-up resistor;
[0015] When the resistance wire is not broken, the voltage divider outputs a low-level signal; when the resistance wire is broken, the voltage divider outputs a high-level signal.
[0016] In some embodiments, the multi-way selection circuit uses a multi-way switch chip to implement signal gating;
[0017] The input end of the multi-way switch chip is connected to multiple resistor wires, and the selection path is controlled by the address code input signal and the write signal;
[0018] The output signal of the multi-way switch chip is connected to the power supply voltage through the pull-up resistor, and the level signal of the output selection resistor wire is output.
[0019] In some embodiments, the multiplexing circuit adopts a signal channel multiplexing design;
[0020] The address code input signals and write signals of multiple multiplexer chips share the same set of drive signals;
[0021] The driving signal is provided by the pin of the programmable logic chip, and the output signals are respectively connected to different pins of the programmable logic chip.
[0022] In some embodiments, the on-off identification circuit detects the on-off state of the resistance wire by high-speed scanning;
[0023] The signal gating time of the multiplexing circuit is less than a preset threshold, ensuring a real-time response to impact debris.
[0024] In some embodiments, the thin film resistor network includes a plurality of arrays of resistor wires;
[0025] Each group of resistance wires is processed by an independent multi-way selection circuit and on-off identification circuit;
[0026] The multiplexing circuits of each group multiplex the driving signals to reduce the total number of signal channels.
[0027] In some embodiments, the on-off identification circuit locates the impact point by analyzing the number of broken wires and the intersection of the positions of the positive and negative resistance wires;
[0028] The position error range of the impact point is determined by the line width and spacing size of the resistance wire.
[0029] According to a second aspect of the present invention, a method for identifying on / off status of a thin film resistor network based on a multi-path selection method is provided, comprising:
[0030] The method is implemented based on the thin film resistor network on-off identification circuit based on a multi-path selection method according to the preceding claims, and the method comprises:
[0031] Identify the signal on / off status of multiple resistance wires of the thin film resistor network through a multi-path selection method;
[0032] According to the signal on-off status recognition result, the number of disconnected wires, disconnection time and disconnection position information of the resistance wire are obtained;
[0033] The size parameters and impact parameters of the fragments are analyzed based on the information of the number of broken wires, the time of broken wires and the position of broken wires.
[0034] In some embodiments, the size parameters of the fragments include a size range in two dimensions;
[0035] Impact parameters include impact location and impact time;
[0036] The size range and impact parameters were obtained through correlation analysis of the number of wire breaks, wire break time, and wire break location information.
[0037] At least one embodiment of the present invention realizes a thin film resistor network on / off identification circuit based on a multi-way selection method through the design of a thin film resistor network, an on / off identification circuit, a multi-way selection circuit, and an on / off identification circuit, which can quickly identify the on / off status of a large number of resistor wire signals in a very short time period. BRIEF DESCRIPTION OF THE DRAWINGS
[0038] Figure 1 This is a schematic diagram of a simple structure of a debris detector on the International Space Station in the prior art;
[0039] Figure 2 This is a schematic diagram of the thin film resistor network structure of a thin film resistor network on-off identification circuit based on a multi-path selection method provided by the present invention;
[0040] Figure 3 This is a schematic diagram of an on / off identification circuit of a thin film resistor network on / off identification circuit based on a multi-path selection method provided by the present invention;
[0041] Figure 4This is a schematic diagram of a 32-way resistor wire signal selection circuit of a thin film resistor network on-off identification circuit based on a multi-way selection method provided by the present invention;
[0042] Figure 5 This is a schematic diagram of a 256-way resistor wire signal multiplexing circuit in a thin film resistor network on-off identification circuit based on a multi-way selection method provided by the present invention;
[0043] Figure 6 This is a schematic diagram of a 256-way resistor wire on-off identification circuit of a thin film resistor network on-off identification circuit based on a multi-way selection method provided by the present invention;
[0044] Figure 7 The present invention provides a flowchart of a method for identifying on / off behavior of a thin film resistor network based on a multi-path selection method. DETAILED DESCRIPTION
[0045] The following description sets forth many specific details to facilitate a thorough understanding of this specification. However, this specification can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without violating the scope of this specification. Therefore, this specification is not limited to the specific implementations disclosed below.
[0046] The terms used in one or more embodiments of this specification are for the purpose of describing specific embodiments only and are not intended to limit one or more embodiments of this specification. The singular forms of "a" and "the" used in one or more embodiments of this specification and the appended claims are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used in one or more embodiments of this specification refers to and includes any or all possible combinations of one or more associated listed items. The modifications of "one" and "a plurality" mentioned in this disclosure are illustrative and not restrictive, and those skilled in the art should understand that unless the context clearly indicates otherwise, it should be understood as "one or more".
[0047] It should be understood that although the terms first, second, etc. may be used to describe various information in one or more embodiments of this specification, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of one or more embodiments of this specification, the first may also be referred to as the second, and similarly, the second may also be referred to as the first. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".
[0048] like Figure 1As shown, the debris detector on the International Space Station is designed as a two-layer detector structure combining a thin-film resistor grid and acoustic emission sensors. The first layer uses a resistor grid structure with an array of parallel resistor wires fabricated on a single surface of a thin film to determine debris size. Four acoustic emission sensors are also placed on the thin-film resistors to determine impact location information. The second layer uses four acoustic emission sensors arranged on a thin metal plate to locate the impact location using acoustic emission signals. The circuit processing of the first layer's thin-film resistor grid detector connects multiple resistor wires in parallel. When a fragment impacts the thin-film resistor grid, it causes a local break in the resistor wires, resulting in a change in the parallel resistance value. The magnitude of the resistance change determines the number of breakages, further used to estimate the size of the fragment. Impact time and location information are determined by the four acoustic emission sensors on the thin film. This two-layer structure combines to measure parameters such as debris flux, size, velocity, and direction.
[0049] Based on this, Figure 2 As shown, the present invention designs a thin film resistor network on-off identification circuit based on a multi-channel selection method, which adopts a parallel resistor wire array prepared on the front and back sides of the thin film to form a cross-shaped thin film resistor network detection structure. The resistor wire signal processing method adopts a high-speed on-off identification circuit form based on a multi-channel selection method, and the fragment size, impact position, impact time and other information are tested by identifying the on-off information of each resistor wire.
[0050] Specifically, some embodiments of this specification provide a thin film resistor network on-off identification circuit based on a multi-way selection method, including a thin film resistor network, an on-off identification circuit, a multi-way selection circuit, and an on-off identification circuit, specifically including:
[0051] The thin-film resistor network is composed of an array of resistor wires arranged in parallel on the front and back sides, and is used to detect external impact fragments by detecting the on-off status of the resistor wires; the on-off identification circuit connects the resistor wires of the thin-film resistor network to generate a level signal representing the on-off status of the resistor wires; the multi-channel selection circuit queries the level signal of the resistor wire by rotating the selection method, and adopts a signal channel multiplexing design to reduce the number of output channels; the on-off recognition circuit identifies the on-off status of the resistor wire according to the level signal, and analyzes the position and size information of the impact fragments in combination with the front and back broken wire signals.
[0052] A thin-film resistor network can refer to a flexible detection substrate with a double-sided, cross-conductor structure, which uses a grid layout to achieve two-dimensional location of space debris impacts. A continuity identification circuit can refer to an interface conversion module that converts the physical state of a conductor into a logic level. A multiplexing circuit can refer to a time-division multiplexing controller that enables high-density signal acquisition. A continuity identification circuit can refer to a signal processor capable of timing analysis and spatial resolution.
[0053] The beneficial effects of one of the embodiments of the present specification include at least: through the design of a thin film resistor network, an on / off identification circuit, a multi-way selection circuit, and an on / off identification circuit, a thin film resistor network on / off identification circuit based on a multi-way selection method is realized, which can quickly identify the on / off status of a large number of resistor wire signals within a very short time period.
[0054] In some embodiments, the resistor wire array of the thin film resistor network forms a grid structure through a cross design; the line width and spacing size of the resistor wires are the same to achieve a preset fragment size resolution capability; the total number of resistor wire arrays is determined according to the effective detection area requirements.
[0055] The grid structure can refer to a spatial sampling matrix formed by a network of orthogonally arranged wires. Line width and spacing can refer to key geometric parameters that determine detection accuracy. The effective detection area can refer to the customizable and scalable physical coverage area.
[0056] Thin-film resistor grids are primarily used to detect debris smaller than a millimeter in size. With a 50-micron resistor wire width and 50-micron spacing, the array can achieve a fragment size resolution of 50 microns, with a detection error of ±100 microns for the impact location. To ensure a sufficient effective detection area, a large number of resistor wires are required. For example, to achieve an effective detection area of approximately 20 cm x 20 cm, the thin-film resistor grid can be designed with 4096 resistor wires (2048 each on the front and back sides).
[0057] In some embodiments, the thin film resistor network includes multiple arrays of resistor wires; each array of resistor wires is processed by an independent multiplexing circuit and an on / off identification circuit; the multiplexing circuits of each array multiplex drive signals to reduce the total number of signal channels. The multiple arrays of resistor wires may also refer to detection units with a modular partitioning design.
[0058] In some embodiments, the on / off identification circuit utilizes a voltage divider circuit design; one end of a resistive wire is grounded, and the other end is connected to a power supply voltage via a pull-up resistor. When the resistive wire is intact, the voltage divider outputs a low-level signal; when the resistive wire is broken, the voltage divider outputs a high-level signal. The voltage divider circuit may refer to a state detection topology based on an impedance ratio. The pull-up resistor may refer to a reference impedance element that provides a reference voltage.
[0059] Specifically, if Figure 3As shown, one end of the resistor wire can be grounded, and the other end can be connected to the voltage signal VCC through a pull-up resistor R. The resistance R1 of the resistor wire is relatively small, typically only a few ohms, and the pull-up resistor R is designed to be larger than the resistance R1 of the resistor wire, such as hundreds of ohms. When the resistor wire is intact, the voltage signal VCC1 at the voltage divider is low, indicating that no disconnection has occurred. When the resistor wire is disconnected, the voltage signal VCC1 at the voltage divider is high, indicating that a disconnection has occurred.
[0060] In some embodiments, a multi-channel selection circuit uses a multi-way switch chip to implement signal gating. The input end of the multi-way switch chip is connected to multiple resistor wires, and the gating path is controlled by address code input signals and write signals. The output signal of the multi-way switch chip is connected to the power supply voltage through a pull-up resistor, and the output signal is a level signal that selects the resistor wires. The multi-way switch chip can refer to an integrated channel selection device. The address code input signal can refer to a binary channel addressing code. The write signal can refer to a gating enable control pulse.
[0061] Specifically, if Figure 4 As shown, 32 resistor wires are connected to the input terminals S1 to S32 of the multi-way switch chip respectively. In this way, each multi-way switch chip only needs one write signal / WR, five address code input signals / A0-A4 and one output signal / D, a total of 7 signal channels to realize the rotation selection of the 32 resistor wire signals.
[0062] In some embodiments, the multi-way selection circuit adopts a signal channel multiplexing design; the address code input signals and write signals of multiple multi-way switch chips share the same set of drive signals; the drive signals are provided by the pins of the programmable logic chip, and the output signals are respectively connected to different pins of the programmable logic chip.
[0063] In some embodiments, the on / off identification circuit detects the on / off status of the resistor wire using high-speed scanning. The signal gating time of the multiplexing circuit is less than a preset threshold, ensuring real-time response to impact debris. High-speed scanning can refer to a fast polling mechanism that meets dynamic detection requirements.
[0064] Signal channel multiplexing can refer to a topological optimization method for resource sharing. A programmable logic chip can refer to a digital controller with parallel processing capabilities. Using a circuit design that uses signal channel multiplexing for multiplexer circuits can reduce the scale of circuit implementation. Assuming the number of resistor wires in a thin-film resistor network is designed to be 4096 (2048 each on the front and back sides), this number of resistor wires is very large. If a design using 7 signal channels for 32 resistor wires is used, the entire thin-film resistor network would require 896 signal channels. This still requires a very large circuit for back-end signal recognition and processing. The drive current required for the write signal / WR and address code signals / A0-A4 of the multiplexer switch chip is extremely low, typically in the microampere range. In contrast, the drive current for the signal / IO pins of a typical FPGA chip can reach milliamperes. A single signal / IO pin on an FPGA chip can drive multiple address code signals.
[0065] Therefore, if Figure 5 As shown, the write signals / WR and address code signals / A0-A4 of eight multiplexer chips can be reused. Specifically, the write signals / WR and address code signals / A0-A4 of the eight multiplexers required for the 256 resistor wire signals are connected together and driven by the signal / IO pins of six FPGA chips. The eight output signals / D are each connected to the signal / IO pin of one FPGA chip. This reduces the number of FPGA chip signal / IO pins required for the 256 resistor wire signals to 14. The 4096 resistor wire signals of the entire thin-film resistor network are divided into 16 groups, each with 256 resistor wires. Each group requires: 5 address code signals / A0-A4, 1 write signal / WR, and 8 output signals / D, for a total of 14 independent signal channels. The 16 groups of the thin-film resistor network require a total of 224 signal channels for control and selection. With 2048 resistor wires on each side, only 224 FPGA chip signal / IO pins are required, significantly reducing the circuit implementation scale and facilitating engineering design and application.
[0066] The on / off identification circuit utilizes a circuit design integrated with an FPGA chip. The FPGA's 224 signal / IO pins are connected to 16 groups of 80 address signals / A0-A4 and 16 write signals / WR, enabling gating control of the multiplexer chips. These pins are then connected to 16 groups of 128 output signals / D from the multiplexer chips, identifying their high and low levels. A low level indicates no disconnection, while a high level indicates a disconnection. The FPGA's signal / IO pins can simultaneously read signals from the signal channels, enabling the on / off status of all 4096 resistor conductors in the thin-film resistor network to be determined within a 1-microsecond cycle. Figure 6 The schematic diagram of the on-off identification circuit for one of the signal groups is shown.
[0067] On one hand, the present invention rapidly identifies the on / off status of multiple resistor conductor signals in a thin-film resistor network, obtaining information on the number of resistor conductor breaks, the duration of the break, and the location of the break. This information is used to analyze the two-dimensional dimensions of debris ranging from hundreds of microns to millimeters and traveling at speeds below 15 kilometers per hour, and accurately analyze the impact location and time information. On the other hand, the present invention utilizes a multi-way switching design for a rotating query circuit to rapidly select resistor conductor signals within a 1-microsecond cycle. The selected resistor conductors are designed with a pull-up circuit, causing the potential of the connected signal / IO pins to change before and after the selected resistor conductors break, enabling the on / off status of multiple resistor conductor signals to be identified and output within a 1-microsecond cycle. Furthermore, based on the multi-way selection circuit, the present invention multiplexes the write signal and address code signals into the circuit, enabling a single signal / IO pin to multiplex multiple signals. This reduces the number of FPGA signal / IO pins and the implementation scale of the identification circuit, allowing for rapid identification of the on / off status of the entire thin-film resistor network within a 1-microsecond cycle.
[0068] Specifically, the thin-film resistor network of the present invention uses an array structure with parallel resistor wires prepared on both the front and back sides of the thin film, forming a cross-shaped mesh structure. The resistor wire width is designed to be 50 microns, and the resistor wire spacing is designed to be 50 microns. This achieves a fragment size resolution of 50 microns, and the detection error of the fragment impact position is within ±100 microns. At the same time, through the design of a physical logic circuit for generating and identifying on-off marks, the test error of the fragment impact time is achieved to be ±1 microsecond, and the average measurement error of the detector within the speed range of 6.5 km / s to 8 km / s is about 9%. In contrast, existing detection methods only resolve the size in one dimension, with a detection error of ±3 cm for the fragment impact position and a test error of ±4.5 microseconds for the fragment impact time, and an average measurement error of 18% for the detector within the speed range of 6.5 km / s to 8 km / s.
[0069] In some embodiments, the continuity identification circuit locates the impact point by analyzing the number of broken wires and the intersection of the front and back resistance wires. The positional error range of the impact point is determined by the wire width and spacing of the resistance wires. The intersection point can refer to the spatial correlation point of the two-dimensional signal. The error range can refer to the system's inherent spatial resolution.
[0070] Corresponding to the above method embodiments, this specification also provides a method embodiment for identifying on / off status of a thin film resistor network based on a multi-channel selection method. The method is implemented based on an on / off identification circuit of a thin film resistor network based on a multi-channel selection method. Figure 7 FIG1 shows a flow chart of a method for identifying the on / off state of a thin film resistor network based on a multi-path selection method provided in some embodiments of this specification. Figure 7 As shown, the method includes:
[0071] Identify the signal on / off status of multiple resistance wires of the thin film resistor network through a multi-path selection method;
[0072] According to the signal on-off status recognition result, the number of disconnected wires, disconnection time and disconnection position information of the resistor wire are obtained;
[0073] The size parameters and impact parameters of the fragments are analyzed based on the information of the number of broken wires, the time of broken wires and the position of broken wires.
[0074] The multiplexing method may refer to a time-series multiplexing signal acquisition strategy. The size parameter may refer to the inverted geometric characteristics of the debris. The impact parameter may refer to a collision feature set containing spatiotemporal information.
[0075] In some embodiments, the size parameters of the fragments include the size range in two-dimensional directions; the impact parameters include the impact position and impact time; the size range and impact parameters are obtained by correlation analysis of the number of broken lines, the broken line time and the broken line position information.
[0076] Two-dimensional directions can refer to spatial dimensions in an orthogonal coordinate system. Correlation analysis can refer to a method for solving multi-source data fusion. Beneficial Effect: Establishes a multi-dimensional parameter correlation model to improve the completeness of fragment feature description.
[0077] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0078] The preferred embodiments disclosed above are intended only to help illustrate this specification. The optional embodiments do not exhaustively describe all details, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the content of the present invention. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize this specification. This specification is limited only by the claims and their full scope and equivalents.
Claims
1. A thin film resistor network on-off identification circuit based on a multi-path selection method, characterized in that: It includes a thin film resistor network, an on / off identification circuit, a multi-way selection circuit and an on / off identification circuit; The thin film resistor network is composed of an array of resistor wires arranged in parallel on both sides, and is used to detect external impact debris by the on and off states of the resistor wires; The on-off identification circuit is connected to the resistance wire of the thin film resistor network to generate a level signal representing the on-off state of the resistance wire; The multi-channel selection circuit queries the level signal of the resistance wire in a round-robin manner and adopts a signal channel multiplexing design to reduce the number of output channels; The on-off identification circuit identifies the on-off state of the resistance wire according to the level signal, and analyzes the position and size information of the impact fragments in combination with the front and back disconnection signals.
2. The thin film resistor network on-off identification circuit according to claim 1, characterized in that: The resistor wire array of the thin film resistor network is designed to form a grid structure through a cross design; The line width and spacing of the resistance wires are the same, achieving a preset fragment size resolution capability; The total number of the resistor wire arrays is determined according to the effective detection area requirement.
3. The thin film resistor network on-off identification circuit according to claim 1, characterized in that: The on / off identification circuit adopts a voltage divider circuit design; One end of the resistance wire is grounded, and the other end is connected to the power supply voltage through a pull-up resistor; When the resistance wire is not broken, the voltage divider outputs a low-level signal; when the resistance wire is broken, the voltage divider outputs a high-level signal.
4. The thin film resistor network on-off identification circuit according to claim 3, characterized in that: The multi-way selection circuit uses a multi-way switch chip to realize signal gating; The input end of the multi-way switch chip is connected to a plurality of resistance wires, and the selection path is controlled by the address code input signal and the write signal; The output signal of the multi-way switch chip is connected to the power supply voltage through the pull-up resistor, and the level signal of the gate resistor wire is output.
5. The thin film resistor network on-off identification circuit according to claim 4, characterized in that: The multiplexing circuit adopts a signal channel multiplexing design; The address code input signals and write signals of multiple multiplexer chips share the same set of drive signals; The driving signal is provided by the pins of the programmable logic chip, and the output signals are respectively connected to different pins of the programmable logic chip.
6. The thin film resistor network on-off identification circuit according to claim 1, characterized in that: The on-off identification circuit detects the on-off state of the resistance wire by high-speed scanning; The signal gating time of the multiplex selection circuit is less than a preset threshold, thereby ensuring a real-time response to impact fragments.
7. The thin film resistor network on-off identification circuit according to claim 1, characterized in that: The thin film resistor network includes multiple groups of resistor wire arrays; Each group of resistance wires is processed by an independent multi-way selection circuit and on-off identification circuit; The multiplexing circuits of each group multiplex the driving signals to reduce the total number of signal channels.
8. The thin film resistor network on-off identification circuit according to claim 1, characterized in that: The on-off identification circuit locates the impact point by analyzing the number of broken wires and the intersection of the positions of the positive and negative resistance wires; The position error range of the impact point is determined by the line width and spacing size of the resistance wire.
9. A method for identifying the on / off state of a thin film resistor network based on a multi-path selection method, characterized in that: The method is implemented based on the thin film resistor network on-off identification circuit based on a multi-path selection method according to any one of claims 1 to 8, and the method includes: Identify the signal on / off status of multiple resistance wires of the thin film resistor network through a multi-path selection method; According to the signal on-off state recognition result, the number of disconnected wires, the disconnection time and the disconnection position information of the resistance wire are obtained; The size parameters and impact parameters of the fragments are analyzed based on the information of the number of broken wires, the time of broken wires and the position of broken wires.
10. The method according to claim 9, characterized in that The size parameters of the fragments include size ranges in two dimensions; The impact parameters include impact position and impact time; The size range and impact parameters are obtained by correlation analysis of the number of broken wires, the broken wire time and the broken wire position information.
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