Display panel, display device and preparation method of display panel

Abstract

The invention discloses a display panel, a display device and a preparation method of the display panel, the display panel comprises a display area, a bonding area and a bending area connecting the display area and the bonding area, and the display panel comprises a substrate located in the display area, the bonding area and the bending area; the array layer is arranged on one side of the substrate, and the array layer is located in the display area, the bending area and the bonding area; the isolation layer is arranged on the side, away from the substrate, of the array layer, and the isolation layer is provided with a first through hole at least located in the bending area; the protection layer is arranged on the side, away from the substrate, of the isolation layer, the protection layer is provided with a second through hole at least located in the bending area, and the second through hole is communicated with the first through hole; wherein the orthographic projection of the first through hole on the substrate is located in the orthographic projection of the second through hole on the substrate. According to the display panel, the risk that cracks are generated in the bending area can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] With the development and popularization of display technology in recent years, display panels have been applied to various electronic devices, such as mobile phones, tablet computers, or other portable electronic devices.

[0003] Currently, display panels are developing towards extremely narrow bezels, and the risk of cracks in the bending area is also increasing. Summary of the Invention

[0004] The present application provides a display panel, a display device, and a method for manufacturing a display panel, which can reduce the risk of cracks in a bending area.

[0005] According to a first aspect of an embodiment of the present application, there is provided a display panel, comprising a display area, a bonding area, and a bending area connecting the display area and the bonding area, the display panel comprising: a substrate located in the display area, the bonding area, and the bending area; an array layer disposed on one side of the substrate, and the array layer is located in the display area, the bending area, and the bonding area; an isolation layer disposed on a side of the array layer away from the substrate, the isolation layer being provided with at least a first through hole located in the bending area; a protective layer disposed on a side of the isolation layer away from the substrate, the protective layer being provided with at least a second through hole located in the bending area, the second through hole being connected to the first through hole; wherein the orthographic projection of the first through hole on the substrate is within the orthographic projection of the second through hole on the substrate.

[0006] Wherein, in a direction parallel to the substrate, a distance between a hole wall of the second through hole and a hole wall of the first through hole ranges from 2 micrometers to 10 micrometers.

[0007] Wherein, the display panel further comprises:

[0008] A touch layer is provided between the array layer and the protective layer and is located at least in the display area, wherein the film layer in the touch layer is reused as the isolation layer.

[0009] The touch layer includes a first conductive layer, an insulating layer and a second conductive layer arranged in sequence in a direction away from the substrate, the first conductive layer and the second conductive layer are both located in the display area and the bonding area, and the orthographic projections of the first conductive layer and the second conductive layer on the substrate are within the orthographic projection of the insulating layer on the substrate, wherein the insulating layer is reused as the isolation layer.

[0010] The display panel further includes a buffer layer located between the touch layer and the substrate, wherein the first through hole penetrates the buffer layer;

[0011] Preferably, the material of the buffer layer includes at least one of an organic material and an inorganic material.

[0012] Wherein, the material of the isolation layer includes inorganic material;

[0013] Preferably, the material of the protective layer includes OC glue;

[0014] Preferably, the array layer includes a planarization layer, at least a portion of the planarization layer is located in the bending region, and an orthographic projection of the planarization layer on the substrate covers an orthographic projection of the first through hole on the substrate;

[0015] Preferably, the display panel further includes a pixel definition layer located between the array layer and the isolation layer, at least a portion of the pixel definition layer is located in the bending area, and the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the first through hole on the substrate.

[0016] A second aspect of an embodiment of the present application provides a display device, comprising any one of the display panels described above.

[0017] A third aspect of an embodiment of the present application provides a method for preparing a display panel, the method comprising: forming an array layer located in a display area, a bending area, and a bonding area on one side of a substrate, wherein the bending area connects the display area and the bonding area; forming an isolation layer on a side of the array layer facing away from the substrate, the orthographic projection of the isolation layer on the substrate at least covering the substrate located in the bending area; forming a protective layer on a whole surface on a side of the isolation layer facing away from the substrate; patterning the protective layer to form a second through hole on the protective layer at least located in the bending area; patterning the isolation layer to form a first through hole on the isolation layer that is aligned with the second through hole, wherein the orthographic projection of the first through hole on the substrate is within the orthographic projection of the second through hole on the substrate.

[0018] The step of forming an isolation layer at least located in the bending region on a side of the array layer facing away from the substrate includes:

[0019] forming a first conductive layer on the entire surface of the array layer on a side facing away from the substrate;

[0020] patterning the first conductive layer to remove at least the first conductive layer located in the bending region;

[0021] forming an entire insulating layer on a side of the first conductive layer facing away from the substrate, wherein the insulating layer is reused as the isolation layer;

[0022] Form a second conductive layer covering the entire surface on the side of the insulating layer away from the substrate;

[0023] Pattern the second conductive layer to at least remove the second conductive layer located in the bending region;

[0024] Moreover, the step of patterning the isolation layer to form a first through hole on the isolation layer and corresponding to the second through hole includes:

[0025] Pattern the exposed insulating layer to obtain the first through hole.

[0026] Before forming a first conductive layer covering the entire surface on the side of the array layer away from the substrate, it further includes:

[0027] Form a buffer layer covering the entire surface on the side of the array layer away from the substrate;

[0028] Moreover, the step of patterning the exposed insulating layer to obtain the first through hole includes:

[0029] Pattern the insulating layer and the buffer layer simultaneously to obtain the first through hole penetrating through the insulating layer and the buffer layer.

[0030] The beneficial effect is that the present application sets the orthographic projection of the first through hole on the substrate within the orthographic projection of the second through hole on the substrate. Thus, during the preparation process, the second through hole is formed first, and then the first through hole is formed. When the second through hole is formed, since the first through hole has not been completely formed, the film layer under the isolation layer will not be directly exposed in the second through hole. The isolation layer exposed in the second through hole can protect the film layer under the isolation layer, and can avoid the reaction between the residual developer in the process of patterning the protective layer and the film layer under the isolation layer, resulting in film layer degradation and cracks. Therefore, the solution of the present application can reduce the risk of crack generation in the bending region. Description of the Drawings

[0031] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to these drawings, where:

[0032] Figure 1 is a schematic structural diagram of an embodiment of a display panel of the present application;

[0033] Figure 2 is a schematic diagram of the preparation process in an embodiment of the preparation method of the display panel of the present application;

[0034] Figure 3 It is a schematic structural diagram of another embodiment of the display panel of the present application;

[0035] Figure 4 It is a schematic structural diagram of yet another embodiment of the display panel of the present application. Specific Embodiments

[0036] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present application.

[0037] It should be noted that the terms "first" and "second" in the present application are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically defined. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0038] Referring to "embodiments" herein means that the specific features, structures or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0039] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the associated objects before and after.

[0040] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0041] In the description of the embodiments of the present application, the orientation or positional relationship indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of the present application.

[0042] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral body; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0043] Refer to Figure 1 , in an embodiment of the present application, the display panel 100 includes a display area 10, a bonding area 20, and a bending area 30 connecting the display area 10 and the bonding area 20. The display area 10 is mainly used for displaying images, and usually has structures such as a driving circuit and light-emitting elements. The bonding area 20 and the bending area 30 do not emit light and have no display function. Among them, the bonding area 20 is used for bonding components such as a driving chip or a circuit board, and the bending area 30 is used for bending, so that the bonding area 20 can be bent to the back of the display panel 100 in the display area 10, thereby realizing the narrow border of the display panel 100.

[0044] The display panel 100 of the present application can be an OLED display panel, a Liquid Crystal Display (LCD), a Mirco-LED display panel (Micro Light Emitting Diode), or other types of display panels. The present application does not limit the specific type of the display panel 100.

[0045] At the same time, the display panel 100 includes a substrate 110, an array layer 120, an isolation layer 130, and a protection layer 140 that are sequentially stacked.

[0046] The substrate 110 is located in the display area 10, the bonding area 20, and the bending area 30. Specifically, the substrate 110 plays a supporting role in the display panel 100. It can be a flexible substrate or a rigid substrate. When the substrate 110 is a flexible substrate, its material can be polyimide (PI), or it can also be a multi-layer structure in which organic layers and inorganic layers are alternately stacked. For example, the substrate 110 includes an inorganic layer, an organic layer, and an inorganic layer stacked in sequence. At this time, the multi-layer structure in which organic layers and inorganic layers are alternately stacked can take into account the flexibility and strength of the substrate 110, enabling the display panel 100 to have a bending function and being able to resist fracture and deformation. When the substrate 110 is a rigid substrate, its material can be glass or metal. The present application does not limit the structure of the substrate 110.

[0047] The array layer 120 is disposed on one side of the substrate 110, and the array layer 120 is located in the display area 10, the bending area 30, and the bonding area 20. The array layer 120 located in the display area 10 is provided with a driving circuit for driving the light-emitting pixels to emit light. The driving circuit includes a transistor and a storage capacitor. The transistor includes a semiconductor portion, a gate, a source, and a drain. The capacitor includes a first electrode plate and a second electrode plate. Among them, the gate and the first electrode plate can be located in the first metal layer, the second electrode plate can be located in the second metal layer, and the source and the drain can be located in the third metal layer. An interlayer insulating layer is provided between the first metal layer and the second metal layer, and between the second metal layer and the third metal layer. At the same time, the array layer may further include a fourth metal layer and a planarization layer. The fourth metal layer is provided with signal lines, and the signal lines are electrically connected to the driving circuit and the light-emitting pixels. The planarization layer is used for planarization to ensure the flatness of the display panel 100.

[0048] The isolation layer 130 is disposed on the side of the array layer 120 away from the substrate 110. The isolation layer 130 is provided with at least a first through hole 131 located in the bending area 30. Specifically, in order to improve the bending performance of the bending area 30 and reduce the stress on the display panel 100 during the bending process, at least a first through hole 131 located in the bending area 30 is provided on the isolation layer 130, that is, at least the isolation layer 130 located in the bending area 30 is removed. Among them, the first through hole 131 can be entirely located in the bending area 30, or partially located in the bending area 30 and partially located in the display area 10 and / or the bonding area 20. It can be understood that when the first through hole 131 is entirely located in the bending area 30, that is, the isolation layer 130 located in the bending area 30 is completely removed during the manufacturing process.

[0049] The protective layer 140 is disposed on the side of the isolation layer 130 away from the substrate 110. The protective layer 140 is provided with at least a second through hole 141 located in the bending area 30, and the second through hole 141 is in communication with the first through hole 131. Specifically, the protective layer 140 protects the entire display panel 100. Similarly, in order to improve the bending performance of the bending area 30 and reduce the stress on the display panel 100 during the bending process, at least a second through hole 141 located in the bending area 30 is provided on the protective layer 140, that is, at least the protective layer 140 located in the bending area 30 is removed.

[0050] In the present embodiment, the orthographic projection of the first through hole 131 on the substrate 110 is located within the orthographic projection of the second through hole 141 on the substrate 110, that is, the opening area of the second through hole 141 is larger than the opening area of the first through hole 131. It can also be understood that the orthographic projection of the hole wall of the first through hole 131 on the substrate 110 is located within the orthographic projection of the hole wall of the second through hole 141 on the substrate 110. Specifically, during the preparation process, the second through hole 141 is formed first, and then the first through hole 131 is formed. When the second through hole 141 is formed, since the first through hole 131 has not been completely formed, the film layer under the isolation layer 130 (such as the array layer 120) will not be directly exposed in the second through hole 141, and the isolation layer 130 exposed in the second through hole 141 can protect the film layer under the isolation layer 130 (such as the array layer 120), and can prevent the residual developer in the process of patterning the protective layer 140 from reacting with the film layer under the isolation layer 130 (such as the array layer 120) to cause cracks after the film layer degrades. Therefore, the solution of the present application can reduce the risk of cracks in the bending area 30.

[0051] The following combines Figure 1 and Figure 2 , and introduces the preparation process of the display panel 100:

[0052] S110: Form an array layer 120 on one side of the substrate 110 in the display area 10, the bending area 30, and the bonding area 20. Among them, the bending area 30 connects the display area 10 and the bonding area 20.

[0053] The specific process of forming the array layer 120 belongs to the prior art and will not be specifically introduced here.

[0054] S120: Form an isolation layer 130 on the side of the array layer 120 away from the substrate 110. The orthographic projection of the isolation layer 130 on the substrate 110 at least covers the substrate 110 located in the bending area 30.

[0055] Among them, a whole isolation layer 130 can be formed, or an isolation layer 130 only located in the bending area 30 can be formed.

[0056] Among them, any preparation process in the prior art can be adopted to form the isolation layer 130, and the present application does not limit the specific process of preparing the isolation layer 130.

[0057] S130: Form a whole-surface protective layer 140 on the side of the isolation layer 130 facing away from the substrate 110.

[0058] Specifically, the protective layer 140 is used to prevent external water and oxygen from invading the inside of the display panel 100.

[0059] S140: Pattern the protective layer 140 to form at least a second through hole 141 located in the bending area 30 on the protective layer 140.

[0060] Specifically, when forming the second through hole 141, since the positive projection of the isolation layer 130 on the substrate 110 at least covers the substrate 110 located in the bending area 30, the film layer (such as the array layer 120) under the isolation layer 130 will not be directly exposed in the second through hole 141. Therefore, it is possible to avoid the reaction between the remaining developer in the process of patterning the protective layer 140 and the film layer (such as the array layer 120) under the isolation layer 130, which may cause cracks after the film layer degrades. That is, the isolation layer 130 can be used to protect the film layer under the isolation layer 130.

[0061] S150: Pattern the isolation layer 130 to form a first through hole 131 on the isolation layer 130, where the positive projection of the first through hole 131 on the substrate 110 is located within the positive projection of the second through hole 141 on the substrate 110.

[0062] Specifically, after patterning the protective layer 140 to form the second through hole 141, then pattern the isolation layer 130 to form the first through hole 131. Since the first through hole 131 is formed after the second through hole 141, the opening area of the first through hole 131 is smaller than the opening area of the second through hole 141, that is, the positive projection of the first through hole 131 on the substrate 110 is located within the positive projection of the second through hole 141 on the substrate 110.

[0063] As can be seen from the above, the orthographic projection of the first through hole 131 on the substrate 110 is located within the orthographic projection of the second through hole 141 on the substrate 110. Thus, during the manufacturing process, the second through hole 141 is formed first, and then the first through hole 131 is formed. When the second through hole 141 is formed, since the first through hole 131 has not been completely formed, the film layer under the isolation layer 130 (such as the array layer 120) will not be directly exposed in the second through hole 141. The isolation layer 130 exposed in the second through hole 141 can protect the film layer under the isolation layer 130 (such as the array layer 120), and can prevent the residual developer in the process of patterning the protective layer 140 from reacting with the film layer under the isolation layer 130 (such as the array layer 120), resulting in cracks after the film layer degrades. Therefore, the solution of the present application can reduce the risk of cracks in the bending area 30.

[0064] In one embodiment, the material of the isolation layer 130 includes inorganic materials, such as at least one of silicon nitride and silicon oxide. In one embodiment, the material of the protective layer 140 includes OC glue. It should be noted that the present application does not limit the specific materials of the isolation layer 130 and the protective layer 140, and can be specifically set according to actual needs.

[0065] At the same time, the present application does not specifically limit the thickness of the isolation layer 130, which can be specifically set according to actual needs.

[0066] Refer to Figure 1 , in one embodiment, in the direction parallel to the substrate 110, the distance L between the hole wall of the second through hole 141 and the hole wall of the first through hole 131 ranges from 2 μm to 10 μm. For example, the distance L between the hole wall of the second through hole 141 and the hole wall of the first through hole 131 is 2 μm, 5 μm or 10 μm, etc. The setting of the above distance range can avoid increasing the manufacturing difficulty due to too small distance L, and can also avoid affecting the bending performance of the bending area 30 due to too large distance L. It should be noted that the present application does not specifically limit the distance L between the hole wall of the second through hole 141 and the hole wall of the first through hole 131, which can be specifically set according to actual needs and is not limited here.

[0067] Continue to refer to Figure 1 , the display panel 100 further includes a touch control layer 230, and the touch control layer 230 is disposed between the array layer 120 and the protective layer 140 and at least located in the display area 10. Among them, the film layer in the touch control layer 230 is multiplexed as the isolation layer 130. Specifically, the touch control layer 230 is used to implement the touch control function, and generally includes two touch electrodes (TX electrode and RX electrode) that are insulated and disposed in the display area 10. In order to avoid increasing the manufacturing process of the display panel 100 by adding an isolation layer 130, in this embodiment, the film layer in the touch control layer 230 is used as the isolation layer 130.

[0068] It should be noted that in other embodiments, the isolation layer 130 may not be the film layer in the touch layer 230. For example, the isolation layer 130 is another film layer located between the touch layer 230 and the array layer 120, or the isolation layer 130 is another film layer located between the touch layer 230 and the protection layer 140.

[0069] Continue to refer to Figure 1 , in one embodiment, the touch layer 230 includes a first conductive layer 232, an insulating layer 233, and a second conductive layer 234 that are sequentially arranged in a direction away from the substrate 110. The first conductive layer 232 is located in the display area 10 and the bonding area 20, the second conductive layer 234 is located in the display area 10 and the bonding area 20, and the orthographic projections of the first conductive layer 232 and the second conductive layer 234 on the substrate 110 are within the orthographic projection of the insulating layer 233 on the substrate 110. Among them, the insulating layer 233 is reused as the isolation layer 130.

[0070] In one embodiment, a first touch electrode and a second touch electrode are formed on the first conductive layer 232. The first touch electrode includes a plurality of first electrode portions arranged and electrically connected in a first direction, the second touch electrode includes a plurality of second electrode portions arranged and electrically connected in a second direction, and the first direction intersects the second direction. Among them, adjacent two second electrode portions are electrically connected through a bridge electrode formed in the second conductive layer 234. Of course, it is also possible that the first touch electrode and the second touch electrode are formed on the second conductive layer 234, and the bridge electrode is formed on the first conductive layer 232.

[0071] Specifically, in combination with Figure 2 , at this time, step S120 specifically includes:

[0072] S121: Form a whole-surface first conductive layer 232 on a side of the array layer 120 away from the substrate 110.

[0073] Among them, any one of the existing technologies such as electroplating, chemical vapor deposition, and physical vapor deposition can be used to form the first conductive layer 232 on the array layer 120.

[0074] S122: Pattern the first conductive layer 232 to at least remove the first conductive layer 232 located in the bending area 30.

[0075] Specifically, since the first conductive layer 232 is a metal material, in order to improve the bending ability of the bending area 30, the first conductive layer 232 located in the bending area 30 is removed.

[0076] In one embodiment, while removing the first conductive layer 232 located in the bending area 30, a first touch electrode and a second touch electrode located on the first conductive layer 232 are also formed in the display area 10.

[0077] S123: Form a full-surface insulating layer 233 on the side of the first conductive layer 232 away from the substrate 110, and the insulating layer 233 is reused as the isolation layer 130.

[0078] S124: Form a full-surface second conductive layer 234 on the side of the insulating layer 233 away from the substrate 110.

[0079] S125: Pattern the second conductive layer 234 to at least remove the second conductive layer 234 located in the bending area 30.

[0080] Specifically, since the second conductive layer 234 is a metal material, in order to improve the bending ability of the bending area 30, the second conductive layer 234 located in the bending area 30 is removed.

[0081] In an embodiment, while removing the second conductive layer 234 located in the bending area 30, a bridge electrode located on the second conductive layer 234 is also formed in the display area 10, and the bridge electrode is electrically connected to two adjacent second electrode portions through a via hole formed in the insulating layer 233.

[0082] Meanwhile, step S150 specifically includes:

[0083] S151: Pattern the exposed insulating layer 233 to obtain the first through hole 131.

[0084] Specifically, after forming the protective layer 140 and patterning the protective layer 140 to obtain the second through hole 141, the insulating layer 233 is then patterned (specifically, the exposed insulating layer 233 is patterned) to obtain the first through hole 131. Since the first through hole 131 is formed after the second through hole 141, the orthographic projection of the first through hole 131 on the substrate 110 is located within the orthographic projection of the second through hole 141 on the substrate 110, and when forming the second through hole 141, the insulating layer 233 can protect the underlying film layer (such as the array layer 120) to avoid the reaction of the developing solution with the underlying film layer and the generation of cracks after the film layer degrades.

[0085] In the above embodiment, the insulating layer 233 in the touch control layer 230 is reused as the isolation layer 130. However, in other embodiments, other film layers in the touch control layer 230 can also be set to be reused as the isolation layer 130. For example, refer to Figure 3, in other embodiments, the first conductive layer 232 in the touch control layer 230 is reused as the isolation layer 130. At this time, during the preparation process, after the array layer 120 is formed on the substrate 110, the touch control layer 230 is prepared. This process specifically includes: first forming the first conductive layer 232, patterning the first conductive layer 232 to form touch electrodes located in the display area 10 and retaining the first conductive layer 232 located in the bending area 30. Then, an insulating layer 233 is formed on the first conductive layer 232, and the insulating layer 233 is patterned to at least remove the insulating layer 233 located in the bending area 30. Then, a second conductive layer 234 is formed and patterned to at least remove the second conductive layer 234 located in the bending area 30. Then, a whole-surface protective layer 140 is formed and patterned to form a second through hole 141 at least located in the bending area 30. During the formation of the second through hole 141, since the first conductive layer 232 is located in the bending area 30, the film layer under the touch control layer 230 can be effectively protected and cracks can be avoided. Finally, the first conductive layer 232 in the bending area 30 is patterned to form a first through hole 131.

[0086] Similarly, in other embodiments, the second conductive layer 234 in the touch control layer 230 can also be set to be reused as the isolation layer 130.

[0087] Or in other embodiments, all the film layers in the touch control layer 230 can also be used to be reused as the isolation layer 130. At this time, during the preparation process, after the array layer 120 is formed on the substrate 110, the touch control layer 230 is formed. At this time, during the preparation of the touch control layer 230, all parts of the touch control layer 230 located in the bending area 30 are retained (that is, the first conductive layer 232, the insulating layer 233, and the second conductive layer 234 located in the bending area 30 are retained). Then, a whole-surface protective layer 140 is formed and the protective layer 140 is patterned to form a second through hole 141 at least located in the bending area 30. Then, the touch control layer 230 located in the bending area 30 is removed to form a first through hole 131. In this embodiment, during the formation of the second through hole 141, the touch control layer 230 located in the bending area 30 can protect the underlying film layer and prevent the developer from reacting with the underlying film layer to cause cracks.

[0088] Continue to refer to Figure 1 , in one embodiment, the display panel 100 further includes a buffer layer 160 located between the touch control layer 230 and the substrate 110, and the first through hole 131 penetrates through the buffer layer 160.

[0089] Among them, the material of the buffer layer 160 may include at least one of an organic material and an inorganic material. That is, the buffer layer 160 may only include an organic material, may only include an inorganic material, or may include both an organic material and an inorganic material at the same time. The present application does not limit the specific material of the buffer layer 160.

[0090] Specifically, during the preparation, before step S121, it further includes: forming a full-surface buffer layer 160 on the side of the array layer 120 facing away from the substrate 110, and step S151 specifically includes: simultaneously patterning the insulating layer 233 and the buffer layer 160 to obtain a first through hole 131 penetrating through the insulating layer 233 and the buffer layer 160. That is, while patterning the insulating layer 133, the buffer layer 160 is also patterned, so as to expose at least a part of the array layer 120.

[0091] It should be noted that in other embodiments, the buffer layer 160 may not be provided.

[0092] Or, in other embodiments, referring to Figure 4 it is also possible to set the buffer layer 160 to be reused as the isolation layer 130. At this time, during the preparation process, after forming the array layer 120 on the substrate 110, a full-surface buffer layer 160 is formed, and then a touch control layer 230 is prepared on the side of the buffer layer 160 facing away from the substrate 110, wherein during the preparation of the touch control layer 230, the touch control layer 230 located in the bending area 30 is removed (during the formation of the touch control layer 230, first form a first conductive layer 232, then remove the first conductive layer 232 located in the bending area 30, then form an insulating layer 233, and remove the insulating layer 233 located in the bending area 30, then form a second conductive layer 234, and remove the second conductive layer 234 located in the bending area 30), then a full-surface protective layer 140 is formed on the side of the touch control layer 230 facing away from the substrate 110, then the protective layer 140 is patterned to form a second through hole 141 at least located in the bending area 30, and then the buffer layer 160 is patterned to form a first through hole 131 at least located in the bending area 30. In this embodiment, during the patterning of the protective layer 140, since the buffer layer 160 can cover the bending area 30, the buffer layer 160 can protect the film layer below it, avoiding the reaction of the remaining developer with the film layer below the buffer layer 160 and resulting in cracks after the film layer degrades.

[0093] Continue to refer to Figure 1, the array layer 120 includes a planarization layer 121, at least a part of the planarization layer 121 is located in the bending region 30, and the orthographic projection of the planarization layer 121 on the substrate 110 covers the orthographic projection of the first through hole 131 on the substrate 110. The array layer 120 may include a plurality of stacked planarization layers 121, and at least a part of each planarization layer 121 is located in the bending region 30, and the orthographic projection of each planarization layer 121 on the substrate 110 covers the orthographic projection of the first through hole 131 on the substrate 110. Wherein, the array layer 120 may further include a metal layer 122, at least a part of the metal layer 122 is located in the bending region 30, and the orthographic projection of the metal layer 122 on the substrate 110 covers the orthographic projection of the first through hole 131 on the substrate 110.

[0094] Continue to refer to Figure 1 , in one embodiment, the display panel further includes a pixel defining layer 150 located between the array layer 120 and the touch control layer 230. At least a part of the pixel defining layer 150 is located in the bending region 30. Specifically, the pixel defining layer 150 is located in the display region 10, the bonding region 20, and the bending region 30. The pixel defining layer 150 located in the display region 10 is provided with pixel openings (not shown in the figure), and light-emitting pixels are formed in the pixel openings. The driving circuit in the array layer 120 drives the light-emitting pixels to emit light. At the same time, the pixel defining layer 150 and the touch control layer 230 may also be provided with support columns (not shown in the figure) to support the mask plate. Wherein, the orthographic projection of the pixel defining layer 150 on the substrate 110 covers the orthographic projection of the first through hole 131 on the substrate 110. In a specific application scenario, at least a part of the pixel defining layer 150 is exposed in the first through hole 131.

[0095] It should be noted that the display panel 100 may further include a microlens layer (not shown in the figure), a polarizer, a cover plate (not shown in the figure), etc. located on the side of the protective layer 140 away from the substrate 110. Among them, the microlens layer and the cover plate both belong to the prior art and will not be specifically introduced here.

[0096] In addition, the present application also protects a display device, which includes the display panel 100 in any of the above embodiments. For the specific structure, reference can be made to the above relevant content. The display device may be any device with a limited function such as a mobile phone, a computer, a game console, etc., and is not limited here.

[0097] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied to other related technical fields, are equally included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel includes a display area, a bonding area, and a bending area connecting the display area and the bonding area. The display panel includes: a substrate, located in the display area, the bonding area, and the bending area; An array layer is provided on one side of the substrate, and the array layer is located in the display area, the bending area and the bonding area; an isolation layer, disposed on a side of the array layer facing away from the substrate, the isolation layer being provided with a first through hole at least located in the bending region; a protective layer, disposed on a side of the isolation layer facing away from the substrate, the protective layer being provided with a second through hole at least located in the bending region, the second through hole being connected to the first through hole; The orthographic projection of the first through hole on the substrate is located within the orthographic projection of the second through hole on the substrate.

2. The display panel according to claim 1, wherein: In a direction parallel to the substrate, a distance between a hole wall of the second through hole and a hole wall of the first through hole ranges from 2 micrometers to 10 micrometers.

3. The display panel according to claim 1, wherein: The display panel further comprises: A touch layer is provided between the array layer and the protective layer and is located at least in the display area, wherein the film layer in the touch layer is reused as the isolation layer.

4. The display panel according to claim 3, wherein: The touch layer includes a first conductive layer, an insulating layer, and a second conductive layer arranged in sequence in a direction away from the substrate, the first conductive layer and the second conductive layer are both located in the display area and the bonding area, and the orthographic projections of the first conductive layer and the second conductive layer on the substrate are located within the orthographic projection of the insulating layer on the substrate, wherein the insulating layer is reused as the isolation layer.

5. The display panel according to claim 3, wherein: The display panel further includes a buffer layer located between the touch layer and the substrate, wherein the first through hole penetrates the buffer layer; Preferably, the material of the buffer layer includes at least one of an organic material and an inorganic material.

6. The display panel according to claim 1, wherein: The material of the isolation layer includes inorganic material; Preferably, the material of the protective layer includes OC glue; Preferably, the array layer includes a planarization layer, at least a portion of the planarization layer is located in the bending region, and an orthographic projection of the planarization layer on the substrate covers an orthographic projection of the first through hole on the substrate; Preferably, the display panel further includes a pixel definition layer located between the array layer and the isolation layer, at least a portion of the pixel definition layer is located in the bending area, and the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the first through hole on the substrate.

7. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 6.

8. A method for preparing a display panel, characterized in that: The method comprises: forming an array layer located in a display area, a bending area, and a bonding area on one side of the substrate, wherein the bending area connects the display area and the bonding area; forming an isolation layer on a side of the array layer facing away from the substrate, wherein the orthographic projection of the isolation layer on the substrate at least covers the substrate located in the bending region; forming a protective layer on the entire surface of the isolation layer on a side facing away from the substrate; patterning the protective layer to form a second through hole on the protective layer at least located in the bending area; The isolation layer is patterned to form a first through hole on the isolation layer and aligned with the second through hole, wherein an orthographic projection of the first through hole on the substrate is located within an orthographic projection of the second through hole on the substrate.

9. The method according to claim 8, characterized in that The step of forming an isolation layer at least located in the bending region on a side of the array layer facing away from the substrate comprises: forming a first conductive layer on the entire surface of the array layer on a side facing away from the substrate; patterning the first conductive layer to remove at least the first conductive layer located in the bending region; forming an entire insulating layer on a side of the first conductive layer facing away from the substrate, wherein the insulating layer is reused as the isolation layer; forming a second conductive layer on the entire surface of the insulating layer on a side facing away from the substrate; patterning the second conductive layer to remove at least the second conductive layer located in the bending region; Furthermore, the step of patterning the isolation layer to form a first through hole on the isolation layer and the second through hole includes: The exposed insulating layer is patterned to obtain the first through hole.

10. The method according to claim 9, characterized in that Before forming the first conductive layer on the entire side of the array layer facing away from the substrate, the method further includes: forming a buffer layer on the entire surface of the array layer on a side facing away from the substrate; Furthermore, the step of patterning the exposed insulating layer to obtain the first through hole comprises: The insulating layer and the buffer layer are patterned simultaneously to obtain the first through hole penetrating the insulating layer and the buffer layer.

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