Pump turbulence model construction method and system based on intelligent flow control

Abstract

The invention relates to a method and a system for constructing a pumping turbulence model based on intelligent flow control, and belongs to the technical field of fusion of artificial intelligence control and fluid conveying. The method comprises the steps that according to the type of a plating solution and the size of pumping flow, the pumping type and model are selected, and pipeline diameter and flow range data are configured; configuring a frequency converter and a flow meter according to the type and the model of the pump to obtain a matched pump device module with the frequency converter and the flow meter; constructing a pump turbulence model based on a Reynolds stress transport equation; the real-time flow of the plating solution conveyed by the pumping turbulent flow is monitored in real time, and the variable quantity of the real-time flow is calculated. According to the invention, the pump can be precisely adjusted to convey a plating solution in a turbulent flow mode, and the adjustable interval is the pump flow threshold range; and the threshold range is used as a standard to strictly control the turbulent flow mode flow of pumping and conveying the plating solution, so that an excellent, precise and controllable pumping turbulent flow mode and system are provided for a high-end plating equipment module of a semiconductor lead frame.

Description

Technical Field

[0001] The present invention relates to a method and system for constructing a pump turbulence model based on flow intelligent control, and belongs to the technical field of integration of artificial intelligence control and fluid transportation. Background Art

[0002] Pumping the electroplating solution is a highly sensitive system to the effects of the local electrochemical and physical spatial environment on metal ions during the metal plating process of semiconductor electronic components. It has extensive applications in high-end manufacturing fields such as the development of micro-precision electronic products, electrochemical research, and metal plating of semiconductor electronic components. During the production and operation of semiconductor electronic component plating, numerous and complex factors influence the deposition of metal ions from the electroplating solution on the surface of the semiconductor electronic component, including the type of pump, the diameter of the piping, and the pump flow rate. Consequently, these various factors can lead to varying degrees of variation in the actual metal coating. In mild cases, this can lead to difficulty controlling the coating area, rapid deposition, and a rough coating. In severe cases, this can result in a lack of coating density and uneven thickness distribution, making it difficult to meet the high-performance requirements of semiconductor electronic components.

[0003] Currently, according to ISO 9906:2012, the hydraulic performance acceptance test standard for rotary dynamic pumps, the highest level of pump accuracy, Class 1, has a flow rate tolerance of ±3%. As mentioned above, in the plating process of small and precision electronic products, a pump deviation of ±3% will result in a deviation of at least ±3% in the plating solution delivered by the pump, which will have a serious impact on the precious metal plating of small and precision electronic products. Therefore, it is of great importance to explore and develop a method and system for constructing a pump turbulence model with low flow rate tolerance and more stable plating solution delivery. Summary of the Invention

[0004] To solve the above problems, the present invention provides a method and system for constructing a pump turbulence model based on intelligent flow control to meet the requirements of optimal stability conditions for pumping electroplating solutions during the metal plating process of high-end semiconductor electronic components. The deviation of the plating solution delivered by the pump is lower, and it has good flow accuracy and can shorten the R&D cycle.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is as follows: In a first aspect, the present invention provides a method for constructing a pump turbulence model, the method comprising: Step 1: Select the pump type, model, pipe diameter, and flow range data based on the type of plating solution and pump flow rate; Step 2: Configure the inverter and flow meter according to the pump type and model in step 1 to obtain a matching pump device module with inverter and flow meter; Step 3: Construct a pump turbulence model based on the Reynolds stress transport equation, including: Calculating the flow rate during turbulent pumping of plating solutions Q= P×η / 2.73 H Where: Q is the flow rate, m 3 / h; P is the shaft power, KW; or is the water pump efficiency, %; 2.73 is a constant; H is the lift, m; Combined turbulent viscosity m t and correction factor c 1ε 、 c 2ε , optimize the Reynolds stress transport equation and generate the pump turbulence standard flow Q 标准流量 ; Step 4: Real-time monitoring of the flow rate of the plating solution delivered by the pump turbulently Q 实时流量 , calculate the change in real-time traffic △Q = Q 实时流量 - Q 标准流量 ; Step 5: When △Q Out of the threshold range [-1% × Q 标准流量， 1% × Q 标准流量 ], dynamically adjust the pump frequency to make △Q Within the above threshold range, maintain stable flow; when △Q Does not exceed the threshold range [-1% × Q 标准流量， 1% × Q 标准流量 ], the plating solution is continuously delivered by the pump turbulent flow.

[0006] In one embodiment of the present invention, the Reynolds stress transport equation includes: Formula 2 Formula 3 in, r is the fluid density, k is the turbulent energy, e is the turbulent dissipation rate; u For pulsating energy, m t is the turbulent viscosity value, s is the fluid scattering coefficient, P As parameters, Gis the turbulent kinetic energy generated by the mean velocity gradient, c μ 、 s k 、 s ε 、 c 1ε 、 c 2ε 、 c 3ε is a constant; In formula 2, express t The continuous turbulent energy differential term at time , express x i The continuous turbulent energy and pulsating energy differential terms in the direction, the right side of the equal sign is the specific expansion; express x j Directional The energy differential term shown is specifically the turbulent viscosity value and t The turbulent viscosity value at time t is divided by the sum of the turbulent kinetic energy and the fluid scattering coefficient multiplied by x j The turbulent energy differential in the direction of middle P ij Indicates a specific parameter, G ij represents the turbulent kinetic energy generated by a specific mean velocity gradient, hey represents the product of fluid density and turbulent dissipation rate; In formula 3, express t The differential term of the turbulent dissipation rate at time , express x The continuous dissipation rate and pulsation energy differential term in the direction, the right side of the equal sign is the specific expansion; express x j Directional The energy differential term shown is specifically the turbulent viscosity value and t The turbulent viscosity value at time t is divided by the sum of the fluid scattering coefficients of the turbulent energy condition multiplied by x j Directional differential of turbulent dissipation rate; middle P ij Indicates a specific parameter, G ij It represents the sum of the turbulent kinetic energy generated by a specific mean velocity gradient and a specific constant C 1ε The product of Represents a specific constant C2ε The product of the energy of the fluid and the density of the fluid, multiplied by the square of the turbulent dissipation rate, and divided by the turbulent energy.

[0007] In one embodiment of the present invention, the turbulent viscosity m t for: .

[0008] In one embodiment of the present invention, the metal ions of the plating solution include: Single layer plating Au, Ag, Ni, Sn, Cu, Pd, Rh, Pt; Alloy plating: Au-Ni, Pd-Ni, Ni-P, W-Ni, Ag-Sn, Au-Sn, Rh-Ru and Pt-Rh or Au-W-Ni ternary or above alloy metals.

[0009] In one embodiment of the present invention, the method is applicable to semiconductor electronic components to be processed, and the semiconductor electronic components to be processed include: precision terminals, lead frames, wafer chips and precision decorations.

[0010] In a second aspect, the present invention provides a system for constructing a pump turbulence model, for implementing the method for constructing the pump turbulence model, the system comprising: A pump operation module for conveying plating solution; The flow intelligent control module is used to control the pump operation module, simulate the turbulence model of the plating solution transported by the pump in the plating equipment module through the Reynolds stress transport equation, and calculate and obtain the pump turbulence modeling data; The data training module is used to compare the real-time flow and frequency conversion data of the pump turbulence of the pump operation module with the modeling data for training; The analog-to-digital conversion mechanism is used to convert the continuous variable analog signal into a discrete digital signal during the operation of the pump operation module; A processor, configured to identify and process the digital signal output by the analog-to-digital conversion mechanism; Automatic regulator, which is used to continuously monitor and adjust the controlled parameters of the processor's negative feedback mechanism to keep them consistent with the set value; The digital-to-analog conversion mechanism is used to convert the discrete digital signal output by the automatic regulator into a continuously changing analog signal.

[0011] In one embodiment of the present invention, the pump operation module includes a pump, a frequency converter, a flow meter and a plating solution.

[0012] In a third aspect, the present invention provides a method for delivering a plating solution by pump turbulence based on intelligent flow control, characterized in that the method for constructing a pump turbulence model is adopted, comprising: S1: constructing a database of conditions for transporting plating solutions under pump turbulence conditions, wherein the pump turbulence conditions include: plating solution temperature, plating solution specific gravity, precision flow meter, pump frequency, and connecting pipe diameter; thereby constructing an initial pump turbulence model linked to the database; S2: Extract two different pump turbulence flow conditions from the database, use the pump operation module to perform the actual operation of pump turbulence to transport the plating solution on the semi-guide wire frame, and calculate the change of the real-time pump turbulence flow rate. △Q The measured data are imported into the initial Reynolds stress transport equation; S3: Changes in the imported real-time pump turbulent flow rate △Q The measured data are used to improve the initial Reynolds stress transport equation into an initial pump turbulence model; S4: In the process of improving the initial Reynolds stress transport equation in S3, the correction coefficient within the specified flow range of the pump turbulent transport of the plating solution is obtained through training optimization. c 1ε and c 2ε , to obtain accurate modeling standard flow Q 标准流量 ; S5: Selecting the simulation modeling standard flow rate in the initial pump turbulence model Q 标准流量 , the feedback is applied to the actual operation of pumping turbulent flow to transport the plating solution, and the subsequent real-time pump turbulent flow rate is obtained Q 实测流量 The amount of change △Q The measured data are imported into the initial pump turbulence model to obtain the upgraded pump turbulence model; S6: Real-time loop S5 to obtain the continuously iteratively upgraded pump turbulence model; S7: Select a generation of upgraded pump turbulence model in S6 as the applied pump turbulence model, use the applied pump turbulence model to obtain the optimal real-time pump turbulence flow variation condition data, and realize the construction and optimization of the pump turbulence model based on the optimal flow variation condition data.

[0013] In a fourth aspect, the present invention provides a computer-readable storage medium storing computer instructions, wherein the computer instructions are executed by a processor to perform the method described above.

[0014] In a fifth aspect, the present invention provides a computer program product, wherein the computer program product stores computer instructions, and the computer instructions are executed by a processor to perform the method described.

[0015] The beneficial effects of the present invention are: The present invention improves the conditions of pump turbulence transport of plating solution and constructs the Reynolds stress transport equation for training. The constructed Reynolds stress transport equation outputs the pump turbulence transport of plating solution conditions that meet the threshold range. The flow data processing results of the modeled pump turbulence and the modeling change standard are obtained by calculating the pump turbulence transport conditions. △Q When the value is “zero”, the flow of the pump turbulence maintains a stable operation, and the change of the pump turbulence flow output in real time △Q When the standard value "zero" is slightly deviated, the optimized Reynolds stress transport equation of the present invention is instantaneously activated to adjust the real-time slightly high or low change in the pump turbulent flow rate. △ Q Real-time control to maintain its change △Q It is within the control standard range, which strictly controls the high-end quality requirements of the turbulent flow of the plating solution.

[0016] In addition, a model system of pump turbulence transport of plating solution was constructed, and the change of pump turbulence flow was measured. △Q The threshold range is the standard, and the flow rate of the plating solution transported by the pump is regulated in real time to be infinitely close to the set standard value, thereby maintaining the change in the pump turbulent flow rate. △Q The wireless approaches "zero", thereby obtaining the preferred standard of the optimized and perfect Reynolds stress transport equation of the present invention, achieving accurate and rapid identification of the screening results of available pump turbulence or unavailable pump turbulence and obtaining the preferred method for transporting the plating solution by pump turbulence.

[0017] Based on the optimized and improved Reynolds stress transport equation of the present invention, the change in the adjustable flow rate of the pump turbulent transport of plating solutions of various different monomeric metal salts, divalent metal salts and ternary or higher metal salts can be quickly established in the actual production process. △Q Threshold range, and then obtain the optimal pump turbulence control method for semiconductor electronic components through the pump turbulence plating equipment module, which can not only quickly realize the accuracy of predicting the local coating thickness of semiconductor electronic components, but also greatly reduce the error with the actual coating thickness of electroplated products, promote the improvement of the uniformity of coating thickness, and meet the high quality requirements of high-end semiconductor lead frame products.

[0018] The plating solution flow intelligent control system constructed by the present invention can precisely adjust the pump to deliver the plating solution in a turbulent mode. The adjustable range is the pump flow threshold range. This threshold range is used as a standard to strictly control the turbulent flow rate of the plating solution delivered by the pump, thereby providing an excellent, precisely controllable pump turbulence mode and system for high-end plating equipment modules for semiconductor lead frames. By continuously optimizing the simulated flow rate and actual flow rate of the pump frequency conversion-flow control system in real time during the operation of the plating solution delivery system, the optimal standard for the pump turbulence mode for delivering the plating solution is obtained, thus achieving a method and system for constructing a pump turbulence mode that can accurately and quickly obtain intelligent flow control. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 Schematic diagram of a pump for delivering electroplating solution according to the present invention.

[0021] Figure 2 This is a composition diagram of the construction system of the pump turbulence model based on flow intelligent control of the present invention.

[0022] Figure 3 It is a flow chart of the method for constructing a pump turbulence model based on flow intelligent control of the present invention.

[0023] Figure 4 Schematic diagram of the change of turbulent flow rate of the intelligently controlled pump over time in the third embodiment of the present invention.

[0024] Figure 5 It is a schematic diagram of the change of turbulent flow rate of the non-intelligent control pump over time in comparative example 1 of the present invention.

[0025] In the figure: 100, pump operation module; 200, flow intelligent control module; 300, data training module; 400, analog-to-digital conversion mechanism; 500, processor; 600, automatic regulator; 700, digital-to-analog conversion mechanism; 1000, construction system. DETAILED DESCRIPTION

[0026] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0027] Example 1: like Figure 1 、 Figure 2 and Figure 3 As shown, this embodiment provides a method for constructing a pump turbulence model based on flow intelligent control, and the model is based on the Reynolds Stress Model.

[0028] This embodiment applies the Reynolds turbulence mechanics principle and strictly and comprehensively integrates the effects of fluid streamline curvature, vortex, rotation, and rapid changes in strain rate through the Reynolds stress transport equation, which can provide accurate predictions for the flow of plating solutions in complex pumps. Therefore, the present invention uses the Reynolds stress transport equation to simulate the turbulence model of the pump transporting plating solution in the plating equipment module, calculates its turbulence model, and uses it to quickly and accurately obtain a method and system for constructing a pump turbulence model. The method for constructing the pump turbulence model includes: Step 1: Select the pump type and model, the diameter of the configured pipe and the pump flow range data according to the type of plating solution and the flow rate of the pump; Step 2: Configure the inverter and flow meter according to the pump type and model in step 1 to obtain a matching pump device module with inverter and flow meter; Step 3: constructing a pump turbulence model based on the Reynolds stress transport equation, and when the pump device module is in operation, monitoring the change in the flow rate of the plating solution transported by the pump turbulence in real time through the automatic detection system of the plating solution transported by the pump turbulence; During the process of the pump turbulently transporting the plating solution, the flow rate is calculated according to the following formula: Q= P×η / 2.73 H Formula 1 Where: Q is the flow rate, m 3 / h; P is the shaft power, KW; or is the water pump efficiency, %; 2.73 is a constant; H is the lift, m.

[0029] For the pump turbulent transport of the plating solution of the present invention, it is necessary to further meet the requirements of "turbulent" flow, and be able to integrate the Reynolds stress transport equation of the fluid's streamline curvature, vortex, rotation and rapid change of strain rate. It is a construction method and system for simulating and calculating its turbulence model and for quickly and accurately obtaining the pump turbulence model.

[0030] The calculation of the turbulent flow of the pump to transport the plating solution is as shown in Formula 2 and Formula 3: Formula 2 Formula 3 In formula 2 and formula 3, r is the fluid density, k is the turbulent energy, e is the turbulent dissipation rate; t For the moment, u For pulsating energy, m t is the turbulent viscosity value, s is the fluid scattering coefficient, P is the parameter, G is the turbulent kinetic energy generated by the mean velocity gradient.

[0031] In formula 2, express t The continuous turbulent energy differential term at time , express x i The continuous turbulent energy and pulsating energy differential terms in the direction, the right side of the equal sign is the specific expansion; express x j Directional The energy differential term shown is specifically the turbulent viscosity value and t The turbulent viscosity value at time t is divided by the sum of the turbulent kinetic energy and the fluid scattering coefficient multiplied by x j The turbulent energy differential in the direction of middle P ij Indicates a specific parameter, G ij represents the turbulent kinetic energy generated by a specific mean velocity gradient, hey It represents the product of fluid density and turbulent dissipation rate.

[0032] In formula 3, express t The differential term of the turbulent dissipation rate at time , express x The continuous dissipation rate and pulsation energy differential term in the direction, the right side of the equal sign is the specific expansion; express x j Directional The energy differential term shown is specifically the turbulent viscosity value and t The turbulent viscosity value at time t is divided by the sum of the fluid scattering coefficients of the turbulent energy condition multiplied by x j Directional differential of turbulent dissipation rate; middle P ij Indicates a specific parameter, G ijIt represents the sum of the turbulent kinetic energy generated by a specific mean velocity gradient and a specific constant C 1ε The product of Represents a specific constant C 2ε The product of the energy of the fluid and the density of the fluid, multiplied by the square of the turbulent dissipation rate, and divided by the turbulent energy.

[0033] Furthermore, in Formula 2 and Formula 3, c μ 、 s k 、 s ε 、 c 1ε 、 c 2ε 、 c 3ε It is a constant under certain conditions.

[0034] in c 1ε and c 2ε It is the correction coefficient related to the turbulent flow of the plating solution delivered by the pump of the present invention. Only by selecting the corresponding correction coefficient within the specified flow range of the turbulent flow of the plating solution delivered by the pump of the present invention can the accurate modeling standard flow be obtained. Q 标准流量 .

[0035] In formula 2 and formula 3, t Turbulent viscosity at time m t The formula 4 is as follows: Formula 4 Step 4: Real-time monitoring of the flow rate of the plating solution delivered by the pump turbulently Q 实时流量 , calculate the change in real-time traffic △Q .

[0036] By using the computational network of the Reynolds stress transport equation for pumped turbulent flow transport of plating solution, for the selected pumped turbulent flow transport of plating solution, the flow conditions in the pumped turbulent flow plating equipment module are simulated and calculated to obtain accurate pumped turbulent flow simulation results, which are combined with the precipitation energy potential of the plated metal in the electroplating solution used. Under different simulation conditions of pumped turbulent flow transport of electroplating solution, the modeling data of pumped turbulent flow transport of plating solution and the change of real-time flow rate are accurately calculated. △Q The processing result, the change of the real-time traffic △Q Calculate as follows: △Q = Q 实时流量- Q 标准流量 Formula 5 Q 实时流量 The flow rate of the plating solution is delivered by the pump turbulent flow, Q 标准流量 is the simulated flow rate obtained by calculating according to Formula 1 to Formula 4.

[0037] Step 5: Use the flow change threshold of the following formula 6 to judge the actual change of the pump turbulent flow △Q When it is "zero", the change standard of the pump turbulence flow calculated by the intelligent control pump turbulence model network under the same pumping conditions is also "zero", and the pump turbulence flow of the plating equipment module to transport the plating solution maintains a stable operation; and when the change of the pump turbulence flow output in real time is △Q When the standard value "zero" is slightly deviated, the optimized and improved Reynolds stress transport network calculation model of the present invention is instantly started to adjust the real-time slightly high or low change in the pump turbulent flow rate. △Q Real-time regulation is performed to adjust the flow rate of the turbulent flow of the pump to transport the plating solution so that it approaches the set standard value infinitely and maintains its change △Q Within the control standards.

[0038] -1% × Q 标准流量 ≤ △Q ≤ 1% × Q 标准流量 Formula 6 Optionally, the semiconductor electronic components to be processed include: precision terminals, lead frames, wafer chips and precision decorations.

[0039] Optionally, the metal ions in the plating solution include: Single layer plating Au, Ag, Ni, Sn, Cu, Pd, Rh, Pt; Alloy plating: Au-Ni, Pd-Ni, Ni-P, W-Ni, Ag-Sn, Au-Sn, Rh-Ru and Pt-Rh or Au-W-Ni ternary or above alloy metals.

[0040] Example 2: like Figure 2 As shown, this embodiment provides a system for constructing a pump turbulence model based on flow intelligent control, which is used to implement the method for constructing a pump turbulence model based on flow intelligent control described in Example 1. The construction system 1000 includes: The pump operation module 100 is used to transport the plating solution, including a pump, a frequency converter, a flow meter and the plating solution; The flow intelligent control module 200 is used to control the pump operation module 100, simulate the turbulence model of the plating solution transported by the pump in the plating equipment module through the Reynolds stress transport equation, and calculate and obtain the pump turbulence modeling data; The data training module 300 is used to compare and train the real-time flow and frequency conversion data of the pump turbulence of the pump operation module 100 with the modeling data; The analog-to-digital conversion mechanism 400 is used to convert the continuous variable analog signal into a discrete digital signal during the operation of the pump operation module 100; The processor 500 is used to identify and process the digital signal output by the analog-to-digital conversion mechanism 400; The automatic regulator 600 is used to continuously monitor and adjust the controlled parameters of the negative feedback mechanism of the processor 500 to keep them consistent with the set value; The digital-to-analog conversion mechanism 700 is used to convert the discrete digital signal output by the automatic regulator 600 into a continuously changing analog signal.

[0041] The above-mentioned construction system 1000 realizes signal standardization and anti-interference processing through centralized control of the pump turbulence model; the delivered plating solution has a turbulent mode flow, forming an excellent, precise and controllable pump turbulence mode and system for high-end plating equipment modules of semiconductor lead frames.

[0042] The above-mentioned construction system 1000 is used to detect the change in flow rate of pump turbulence in real time. △Q , and the set standard flow rate of pump turbulence simulation Q 标准流量 Compare them and when both satisfy the above formula 6, the corresponding pump turbulence real-time flow is saved. Q 实测流量 , which is further used to improve and continuously optimize the simulated standard flow of the constructed system, in order to obtain a more precise range of flow changes for real-time detection of pump turbulence △Q The error is reduced, and a method and system for constructing a more micro-controlled pump turbulence model is provided.

[0043] Example 3: This embodiment describes in detail the construction process of the fast, accurate optimization, classification and discrimination model data processing system of the present invention in combination with the actual case of transporting the plating solution under the pump turbulence condition to be selected. Figure 1 The pump shown has a flow rate range of 100 to 300 liters per minute. The method of turbulently conveying the plating solution by the pump includes the following steps: S1: constructing a database of conditions for transporting plating solutions under pump turbulence conditions, wherein the pump turbulence conditions include: plating solution temperature, plating solution specific gravity, precision flow meter, pump frequency, and connecting pipe diameter; thereby constructing an initial pump turbulence model linked to the database; S2: Extract two different pump turbulence flow conditions from the database, use the pump operation module 100 to perform the actual operation of pump turbulence to transport the plating solution on the semi-guide wire frame, and calculate the change of the real-time pump turbulence flow rate. △Q The measured data are imported into the initial Reynolds stress transport equation; S3: Changes in the imported real-time pump turbulent flow rate △Q The measured data are used to improve the initial Reynolds stress transport equation into an initial pump turbulence model; S4: Correction coefficients of Formula 2 and Formula 3 of the Reynolds stress transport equation during the improvement of the initial Reynolds stress transport equation in S3 c 1ε and c 2ε , is a specific parameter closely related to the present invention's turbulent pumping of plating solution. The correction coefficient within a specified flow range of the turbulent pumping of plating solution is obtained through training optimization. c 1ε and c 2ε , and then obtain accurate modeling standard flow Q 标准流量 ; S5: Simulating the standard flow rate within the initial pump turbulence model Q 标准流量 The optimization is carried out and the feedback is applied to the actual operation of pumping turbulent flow to transport the plating solution. The subsequent real-time pump turbulent flow rate is Q 实测流量 The amount of change △Q The measured data are imported into the initial pump turbulence model to obtain the upgraded pump turbulence model; S6: Real-time loop S5 to obtain the continuously iteratively upgraded pump turbulence model to improve the accuracy of the pump turbulence model; S7: Select a suitable generation of upgraded pump turbulence model in S6 as the applied pump turbulence model, use the applied pump turbulence model to obtain the optimal real-time pump turbulence flow variation condition data, and based on the optimal flow variation condition data, realize the construction of the pump turbulence model and the optimization of its intelligent control system.

[0044] This example sets the pump turbulent flow rate to 200 liters / minute, which is the modeling standard flow rate. Q 标准流量The pump frequency is set to 50 Hz and the pump turbulence model system with intelligent flow control of the present invention is used to measure the specific plating solution and the high-speed silver plating device of the semiconductor lead frame. The measured flow rate is 200 liters / min and 50 Hz respectively. Q 实测流量 Data such as Figure 4 As shown: from Figure 4 It can be seen that the measured results of the pump turbulence model system for intelligent flow control of the present invention are: 199.1< Q 实测流量 <200.9 199.1-200< Q 实测流量 - Q 标准流量 <200.9-200 Therefore, -0.9< △Q ＜ 0.9 Right now △Q Satisfying Formula 7 -0.9%× Q 标准流量 ≤ △Q ≤0.9%× Q 标准流量 Formula 7 The above results clearly prove that the flow rate tolerance of the pump turbulence model system of the flow intelligent control of the present invention is less than ±0.9%; its characteristic is that according to the intelligent control accuracy requirements, the interval range of the Reynolds stress calculation equation of the present invention can be set to 1 second ≤ △T ≤60 seconds, where △T is the time interval; from this formula, we can see that the smaller the interval of the operation time is, the more accurate the measured flow rate is per unit time. Q 实测流量 The more times you train, the closer the training results are to the modeling settings. Q 标准流量 The standard value is 200 liters / minute; in other words, the flow rate of the real-time test Q 实测流量 As long as there is a slight deviation from the set model flow Q 标准流量 The tendency of the standard value can not only perform calculation training for the budding state of small deviations, but also maintain the flow of real-time pump turbulence. Q 实测流量 Infinitely close to the modeling setting Q 标准流量 The standard value is 200 liters / minute, which is the change in the real-time pump turbulent flow rate. △Q The threshold range of formula 7 can actually be satisfied.

[0045] Furthermore, Figure 4 The flow rate results of the turbulent pump transporting the plating solution every ten minutes, and the change in the turbulent pump flow rate △Q As shown in Table 1.

[0046] Table 1 Flow rate results of the plating solution transported by pump turbulence and the change of pump turbulence flow rate △Q

[0047] Comparative Example 1: Comparative Example 1: The pump operation module 100 for transporting the plating solution under the pump turbulence condition of Example 3 of the present invention is used. All other systems of the pump turbulence model with intelligent flow control of the present invention are disabled. The pump turbulence flow rate is the same as that of Example 3, set to 200 liters / minute, and the running time is 80 minutes. The measured flow rate is Q 实测流量 Data such as Figure 5 As shown: from Figure 5 It can be seen that the measured results of the pump operation module for transporting the plating solution under the pump turbulence condition of comparative example 1 are: 196.8< Q 实测流量 <203.2, 196.8-200< Q 实测流量 - Q 标准流量 <203.2-200 Therefore, -3.2< △Q ＜ 3.2 Right now △Q Satisfies formula 8: -3.2%× Q 标准流量 ≤ △Q ≤3.2%× Q 标准流量 Formula 8 The results of the comparative example 1 show that the allowable flow deviation of the pump operation module 100 for transporting the plating solution under the pump turbulence condition is less than ±3.2%.

[0048] Furthermore, the pump used in the pump operation module 100 has a Class 1 accuracy. According to ISO 9906:2012 rotary dynamic pump. Hydraulic performance acceptance test standard: when the pump has the highest level of Class 1 accuracy, the allowable flow deviation is ±3%; when the pump has Class 2 accuracy, the allowable flow deviation is ±5%. Therefore, under the conditions of the pump operation module 100 used in this comparative experiment, the accuracy is between Class 1 and Class 2 of the ISO9906 standard.

[0049] It is not difficult to see from the existing ISO 9906:2012 standard and the experimental results of Comparative Example 1 that the existing control technology level of pump flow delivery of plating solution has the following very obvious shortcomings compared with the pump turbulence model technology for intelligent flow control of the present invention: 1. When using the highest level 1 pump accuracy of the existing ISO 9906:2012 standard, under the pump turbulence condition of Example 1, the allowable flow deviation of the pump operation module 100 for conveying the plating solution is ≤±3.2%; 2. Compared with the flow rate tolerance of the pump turbulence model system with intelligent flow control of the present invention, which is ≤±0.9%, the accuracy is significantly different; 3. When using the existing highest level 1 pump precision, the precious metal plating process for high-end semiconductor lead frames has poor coating distribution uniformity and cannot meet the requirements of high-performance semiconductor electronic products; 4. Due to the lack of plating process conditions that meet high performance requirements, the production and processing efficiency of semiconductor lead frame products on the plating production line is very low, and the low yield rate will lead to high production costs.

[0050] In summary, the method and system for constructing a pump turbulence model based on intelligent flow control provided by the present invention can quickly establish the change in the adjustable flow rate of the pump turbulence transport of plating solutions of various different monomeric metal salts, divalent metal salts and ternary or higher metal salts in the actual production process by optimizing and improving the Reynolds stress transport equation. △Q Threshold range, and then obtain the optimal pump turbulence control method for semiconductor electronic components through the pump turbulence plating equipment module, which can not only quickly realize the accuracy of predicting the local coating thickness of semiconductor electronic components, but also greatly reduce the error with the actual coating thickness of electroplated products, improve the uniformity of coating thickness, and meet the high quality requirements of high-end semiconductor lead frame products.

[0051] Some steps in the embodiments of the present invention may be implemented using software, and the corresponding software program may be stored in a readable storage medium, such as a CD or a hard disk.

[0052] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. A method for constructing a pump turbulence model, characterized in that: The method comprises: Step 1: Select the pump type, model, pipe diameter, and flow range data based on the type of plating solution and pump flow rate; Step 2: Configure the inverter and flow meter according to the pump type and model in step 1 to obtain a matching pump device module with inverter and flow meter; Step 3: Construct a pump turbulence model based on the Reynolds stress transport equation, including: Calculating the flow rate during turbulent pumping of plating solutions Q = P × η / 2.73 H Where: Q is the flow rate, m 3 / h; P is the shaft power, KW; η is the water pump efficiency, %; 2.73 is a constant; H is the lift, m; Combined turbulent viscosity μ t and correction factor c 1ε 、 c 2ε , optimize the Reynolds stress transport equation and generate the pump turbulence standard flow Q 标准流量 ; Step 4: Real-time monitoring of the flow rate of the plating solution delivered by the pump turbulently Q 实时流量 , calculate the change in real-time traffic △Q = Q 实时流量 - Q 标准流量 ; Step 5: When △Q Out of the threshold range [-1% × Q 标准流量， 1% × Q 标准流量 ], dynamically adjust the pump frequency to make △Q Within the above threshold range, maintain stable flow; when △Q Does not exceed the threshold range [-1% × Q 标准流量， 1% × Q 标准流量 ], the plating solution is continuously delivered by the pump turbulent flow.

2. The method for constructing a pump turbulence model according to claim 1, wherein: The Reynolds stress transport equation includes: Formula 2 Formula 3 in, ρ is the fluid density, k is the turbulent energy, ε is the turbulent dissipation rate; u For pulsating energy, μ t is the turbulent viscosity value, σ is the fluid scattering coefficient, P is the parameter, G is the turbulent kinetic energy generated by the mean velocity gradient, c μ 、 σ k 、 σ ε 、 c 1ε 、 c 2ε 、 c 3ε is a constant; In formula 2, express t The continuous turbulent energy differential term at time , express x i The continuous turbulent energy and pulsating energy differential terms in the direction, the right side of the equal sign is the specific expansion; express x j Directional The energy differential term shown is specifically the turbulent viscosity value and t The turbulent viscosity value at time t is divided by the sum of the turbulent kinetic energy and the fluid scattering coefficient multiplied by x j The turbulent energy differential in the direction of middle P ij Indicates a specific parameter, G ij represents the turbulent kinetic energy generated by a specific mean velocity gradient, ρε represents the product of fluid density and turbulent dissipation rate; In formula 3, express t The differential term of the turbulent dissipation rate at time , express x The continuous dissipation rate and pulsation energy differential term in the direction, the right side of the equal sign is the specific expansion; express x j Directional The energy differential term shown is specifically the turbulent viscosity value and t The turbulent viscosity value at time t is divided by the sum of the fluid scattering coefficients of the turbulent energy condition multiplied by x j Directional differential of turbulent dissipation rate; middle P ij Indicates a specific parameter, G ij It represents the sum of the turbulent kinetic energy generated by a specific mean velocity gradient and a specific constant C 1ε The product of Represents a specific constant C 2ε The product of the energy of the fluid and the density of the fluid, multiplied by the square of the turbulent dissipation rate, and divided by the turbulent energy.

3. The method for constructing a pump turbulence model according to claim 2, wherein: The turbulent viscosity μ t for: 。 4. The method for constructing a pump turbulence model according to claim 1, wherein: The metal ions of the plating solution include: Single layer plating Au, Ag, Ni, Sn, Cu, Pd, Rh, Pt; Alloy plating: Au-Ni, Pd-Ni, Ni-P, W-Ni, Ag-Sn, Au-Sn, Rh-Ru and Pt-Rh or Au-W-Ni ternary or above alloy metals.

5. The method for constructing a pump turbulence model according to claim 1, wherein: The method is applicable to semiconductor electronic components to be processed, and the semiconductor electronic components to be processed include: precision terminals, lead frames, wafer chips and precision decorations.

6. A system for constructing a pump turbulence model, characterized in that: A method for constructing a pump turbulence model according to any one of claims 1 to 5, the system comprising: A pump operation module (100) for conveying a plating solution; The flow intelligent control module (200) is used to control the pump operation module (100), simulate the turbulence model of the plating solution transported by the pump in the plating equipment module through the Reynolds stress transport equation, and calculate and obtain pump turbulence modeling data; A data training module (300) is used to compare and train the real-time flow and frequency conversion data of the pump turbulence of the pump operation module (100) with the modeling data; The analog-to-digital conversion mechanism (400) is used to convert a continuous variable analog signal into a discrete digital signal during the operation of the pump operation module (100); A processor (500) is used to identify and process the digital signal output by the analog-to-digital conversion mechanism (400); An automatic regulator (600) is used to continuously monitor and adjust the controlled parameter using the negative feedback mechanism of the processor (500) to keep it consistent with the set value; The digital-to-analog conversion mechanism (700) is used to convert the discrete digital signal output by the automatic regulator (600) into a continuously changing analog signal.

7. The system for constructing a pump turbulence model according to claim 6, characterized in that: The pump operation module (100) comprises a pump, a frequency converter, a flow meter and a plating solution.

8. A method for delivering plating solution by pump turbulence based on intelligent flow control, characterized in that: The method for constructing a pump turbulence model according to any one of claims 1 to 5 comprises: S1: constructing a database of conditions for transporting plating solutions under pump turbulence conditions, wherein the pump turbulence conditions include: plating solution temperature, plating solution specific gravity, precision flow meter, pump frequency, and connecting pipe diameter; thereby constructing an initial pump turbulence model linked to the database; S2: extracting two different pump turbulence flow conditions from the database, using the pump operation module (100) to perform the actual operation of pump turbulence to transport the plating solution on the semi-guide wire frame, and obtaining the change in the real-time pump turbulence flow △Q The measured data are imported into the initial Reynolds stress transport equation; S3: Changes in the imported real-time pump turbulent flow rate △Q The measured data are used to improve the initial Reynolds stress transport equation into an initial pump turbulence model; S4: In the process of improving the initial Reynolds stress transport equation in S3, the correction coefficient within the specified flow range of the pump turbulent transport of the plating solution is obtained through training optimization. c 1ε and c 2ε , to obtain accurate modeling standard flow Q 标准流量 ; S5: Selecting the simulation modeling standard flow rate in the initial pump turbulence model Q 标准流量 , the feedback is applied to the actual operation of pumping turbulent flow to transport the plating solution, and the subsequent real-time pump turbulent flow rate is obtained Q 实测流量 The amount of change △Q The measured data are imported into the initial pump turbulence model to obtain the upgraded pump turbulence model; S6: Real-time loop S5 to obtain the continuously iteratively upgraded pump turbulence model; S7: Select a generation of upgraded pump turbulence model in S6 as the applied pump turbulence model, use the applied pump turbulence model to obtain the optimal real-time pump turbulence flow variation condition data, and realize the construction and optimization of the pump turbulence model based on the optimal flow variation condition data.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions, and the computer instructions are used by a processor to execute the method according to any one of claims 1 to 5.

10. A computer program product, characterized in that The computer program product stores computer instructions, and the computer instructions are used by a processor to execute the method according to any one of claims 1 to 5.

Images