Integrated ATR ruggedized computer
Through the integrated ATR reinforcement computer design, combined with liquid-cooled heat dissipation and electromagnetic shielding structure, the structural complexity and insufficient heat dissipation of existing liquid-cooled heat dissipation computer chassis are solved, and efficient and reliable heat dissipation performance and harsh environmental adaptability are achieved.
Patent Information
- Application Number
- CN202510503893.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-22
- Publication Date
- 2025-08-05
AI Technical Summary
The existing liquid-cooled cooling computer chassis has complex structure, large size, poor maintenance, low reliability, weak environmental adaptability, and insufficient air-cooled cooling capacity, which cannot meet the efficient cooling needs in harsh environments.
An integrated ATR reinforcement computer is designed, using a structure that combines reinforced chassis and liquid-cooled radiator parts to achieve efficient heat dissipation through the design of liquid-cooled tank and relay tank, temperature management is managed using coolant circulation, and electromagnetic shielding is improved by combining conductive rubber strips and aerospace plug-ins.
It achieves efficient and reliable heat dissipation performance, enhances adaptability to harsh environments, and improves the electromagnetic shielding effect and the overall integration of the equipment.
Smart Images

Figure CN120428822A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of computer technology, and more particularly to an integrated ATR reinforced computer. Background Art
[0002] With the continuous development of electronic technology and large-scale integrated circuit technology, the functions of electronic equipment are constantly enriched and the performance is constantly improving. The power consumption and heat per unit volume of electronic equipment have also increased significantly. At present, industrial control computers and ruggedized computers used in harsh environments generally adopt forced air cooling technology. Although it has a simple structure, high reliability and low cost, it is limited by factors such as the small heat capacity of air and low heat transfer coefficient. The air-cooled ruggedized computer generally has a small heat dissipation capacity and a large system noise. It is only suitable for situations where the device heat power density is small and the heat dissipation space is large.
[0003] Liquid cooling, a relatively mature heat dissipation technology, has long been widely used in automotive and high-performance commercial server cooling systems, including IBM's Aquasar liquid-cooled supercomputer, Emerson's LiebertXD liquid-cooled server, and HP's XW9400 water-cooled workstation computer cooling system. Through continuous development and improvement, liquid cooling technology has been increasingly applied in high-performance computers and computers designed for harsh environments. The United States has even introduced VITIA48, a standard for computer liquid cooling ruggedization. Liquid-cooled computers offer heat dissipation capabilities three to five times greater than air-cooled systems, while also offering excellent noise control.
[0004] Existing liquid-cooled computer cases are mostly used in large computer systems or high-end server fields. Considering the safety and reliability of liquid-cooled computers, existing liquid-cooled computer cases generally have disadvantages such as complex structure, large size, poor maintainability, low reliability, weak environmental adaptability and low internal integration.
[0005] Therefore, it is of great practical value to design an integrated ATR reinforced computer with simple structure, high reliability, high integration and strong adaptability to harsh environments. Summary of the Invention
[0006] In order to overcome the above-mentioned defects, the present invention provides an integrated ATR reinforced computer, which specifically adopts the following technical solutions:
[0007] An integrated ATR reinforced computer, comprising:
[0008] A chassis component, the chassis component including a reinforced chassis heat sink, a panel component and an aviation plug-in component, the panel component and the aviation plug-in component are both arranged on the reinforced chassis heat sink to collaboratively provide protection and heat dissipation;
[0009] The internal module is arranged in the reinforced chassis heat sink, and the reinforced chassis heat sink provides efficient heat dissipation and protection for the internal module.
[0010] Preferably, the reinforced chassis heat sink includes a reinforced chassis and a liquid-cooled heat sink, and the liquid-cooled heat sink is arranged on the reinforced chassis; a first liquid cooling groove is provided on the outer side of a groove wall of the reinforced chassis, a second liquid cooling groove is provided on the outer side of another groove wall of the reinforced chassis, and a third liquid cooling groove is provided on the outer side of the groove bottom of the reinforced chassis.
[0011] Preferably, a first liquid-cooled relay upper tank is provided on the upper side of the bottom surface of the first liquid-cooling tank, a first liquid-cooled relay lower tank is provided on the lower side of the bottom surface of the first liquid-cooling tank, and the first liquid-cooled relay upper tank and the first liquid-cooled relay lower tank are connected by a first liquid-cooled through-hole; a second liquid-cooled relay upper tank is provided on the upper side of the bottom surface of the second liquid-cooling tank, a second liquid-cooled relay lower tank is provided on the lower side of the bottom surface of the second liquid-cooling tank, and the second liquid-cooled relay upper tank and the second liquid-cooled relay lower tank are connected by a second liquid-cooled through-hole; a third liquid-cooled relay upper tank is provided on the upper side of the bottom surface of the third liquid-cooling tank, a third liquid-cooled relay lower tank is provided on the lower side of the bottom surface of the third liquid-cooling tank, and the third liquid-cooled relay upper tank and the third liquid-cooled relay lower tank are connected by a third liquid-cooled through-hole.
[0012] Preferably, the liquid-cooled heat sink includes a first liquid-cooled heat sink, a second liquid-cooled heat sink and a third liquid-cooled heat sink, the first liquid-cooled heat sink is arranged in the first liquid-cooling tank, the second liquid-cooled heat sink is arranged in the second liquid-cooling tank, and the third liquid-cooled heat sink is arranged in the third liquid-cooling tank.
[0013] Preferably, the first liquid-cooled heat sink includes a first liquid-cooled heat sink, a fourth liquid-cooled relay upper groove is provided on the upper side of one side of the first liquid-cooled heat sink, a fourth liquid-cooled relay lower groove is provided on the lower side of one side of the first liquid-cooled heat sink, and the fourth liquid-cooled relay upper groove and the fourth liquid-cooled relay lower groove are connected by a fourth liquid-cooled through-hole; one side of the first liquid-cooled heat sink is fixedly embedded in the first liquid-cooled groove, and a first sealing ring is provided between the fourth liquid-cooled relay upper groove and the first liquid-cooled relay upper groove, and a second sealing ring is provided between the fourth liquid-cooled relay lower groove and the first liquid-cooled relay lower groove.
[0014] Preferably, the second liquid-cooled heat sink includes a second liquid-cooled heat sink, the second liquid-cooled heat sink has the same structure as the first liquid-cooled heat sink, the second liquid-cooled heat sink is embedded in the second liquid-cooled tank, and the second liquid-cooled heat sink is connected to the second liquid-cooled relay upper tank and the second liquid-cooled relay lower tank in the same manner as the first liquid-cooled heat sink is connected to the first liquid-cooled relay upper tank and the first liquid-cooled relay lower tank.
[0015] Preferably, the third liquid-cooled heat sink includes a third liquid-cooled heat sink, a fifth liquid-cooled relay upper groove is provided on the upper side of one side of the third liquid-cooled heat sink, a fifth liquid-cooled relay lower groove is provided on the lower side of one side of the third liquid-cooled heat sink, and the fifth liquid-cooled relay upper groove and the fifth liquid-cooled relay lower groove are connected by a fifth liquid-cooled through-hole; one side of the third liquid-cooled heat sink is fixedly embedded in the third liquid-cooled groove, and a third sealing ring is provided between the fifth liquid-cooled relay upper groove and the third liquid-cooled relay upper groove, and a fourth sealing ring is provided between the fifth liquid-cooled relay lower groove and the third liquid-cooled relay lower groove;
[0016] Preferably, the panel member includes an upper cover and a lower cover, the upper cover is fastened and sealed on one port of the reinforced chassis, and a first conductive rubber strip is provided between the upper cover and one end of the reinforced chassis; the lower cover is fastened and sealed on the other port of the reinforced chassis, and a second conductive rubber strip is provided between the lower cover and the other end of the reinforced chassis.
[0017] Preferably, the aviation plug-in unit includes an aviation plug-in board and an aviation plug, the aviation plug-in board is tightly and sealedly arranged on the reinforced chassis slot, and a third conductive rubber strip is arranged between the aviation plug-in board and the reinforced chassis slot, and the aviation plug is arranged on the aviation plug-in board.
[0018] Preferably, the internal modules include a filter, a main processing module, an MBI board, a video processing module and a power module, and the filter, the main processing module, the MBI board, the video processing module and the power module are all arranged in the reinforced chassis.
[0019] The present invention has at least the following beneficial effects:
[0020] 1) The integrated ATR reinforced computer of the present invention has a reasonable structural design, small size, high heat dissipation efficiency, high heat dissipation reliability, strong anti-interference ability, high integration and strong adaptability to harsh environments;
[0021] 2) The integrated ATR reinforced computer of the present invention is provided with a reinforced chassis and a liquid-cooled heat sink. The reinforced chassis and the liquid-cooled heat sink cooperate with each other to transfer the temperature to the coolant in the first liquid-cooling through-hole through the reinforced chassis. When the coolant heats up and the density decreases, it rises from the first liquid-cooling through-hole to the first liquid-cooling relay upper groove. The coolant in the first liquid-cooling relay upper groove is pushed into the fourth liquid-cooling through-hole to dissipate heat outward. The coolant in the fourth liquid-cooling through-hole dissipates heat and cools down outward through the first heat dissipation groove. After cooling, the density of the coolant increases and sinks into the first liquid-cooling relay lower groove, and then flows into the first liquid-cooling through-hole to complete self-circulation, which significantly improves the heat dissipation efficiency, heat dissipation reliability and adaptability to harsh environments.
[0022] Other advantages, objectives and features of the present invention will be reflected in part through the following description, and in part will be understood by those skilled in the art through study and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 This is the main view of the integrated ATR reinforcement computer of the present invention;
[0024] Figure 2 This is a schematic diagram of the front three-dimensional structure of the integrated ATR reinforced computer of the present invention;
[0025] Figure 3 This is a schematic diagram of the rear three-dimensional structure of the integrated ATR reinforced computer of the present invention;
[0026] Figure 4 ATR reinforcement computer for the present invention Figure 1 Schematic diagram of the three-dimensional structure in the cross-section along the CC direction;
[0027] Figure 5 This is a front view of a reinforced chassis heat sink in an integrated ATR reinforced computer according to the present invention;
[0028] Figure 6 A top view of a reinforced chassis heat sink in an integrated ATR reinforced computer according to the present invention;
[0029] Figure 7 Schematic diagram of the three-dimensional structure of the reinforced chassis heat sink in the integrated ATR reinforced computer of the present invention;
[0030] Figure 8 ATR reinforcement computer for the present invention Figure 5 Schematic diagram of the three-dimensional structure in the cross section along the AA direction;
[0031] Figure 9 ATR reinforcement computer for the present invention Figure 8 A partial enlarged view of middle F;
[0032] Figure 10 ATR reinforcement computer for the present invention Figure 5 Schematic diagram of the three-dimensional structure in the cross-section along the middle BB direction;
[0033] Figure 11 ATR reinforcement computer for the present invention Figure 10 A partial enlarged view of G in the middle;
[0034] Figure 12 This is a top view of the power module in the integrated ATR reinforced computer of the present invention;
[0035] Figure 13 This is a side view of the power module in the integrated ATR reinforced computer of the present invention;
[0036] Figure 14 ATR reinforcement computer for the present invention Figure 13 Main view of the section in the middle DD direction;
[0037] Figure 15 ATR reinforcement computer for the present invention Figure 13 Main view of the section in the EE direction.
[0038] Among them: 1-reinforced chassis, 2-first liquid-cooling relay upper slot, 3-first liquid-cooling through-hole, 4-first liquid-cooling heat sink, 5-fourth liquid-cooling relay upper slot, 6-fourth liquid-cooling through-hole, 7-first heat sink, 9-third liquid-cooling heat sink, 10-upper cover, 11-lower cover, 12-bottom fixing plate, 13-aviation plug-in board, 14-aviation plug-in, 15-filter, 16-main processing module, 17-MBI board, 18-video processing module, 19-power module, 20-middle partition, 21-flexible thermal pad. DETAILED DESCRIPTION
[0039] The technical solutions of the present invention will be described in detail below by way of embodiments with reference to the accompanying drawings. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention.
[0040] The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, B exists alone, and A and B exist at the same time. The term " / and" in this article describes another type of association object relationship, indicating that two relationships can exist. For example, A / and B can mean: A exists alone, and A and B exist alone. In addition, the character " / " in this article generally indicates that the previous and subsequent associated objects are in an "or" relationship.
[0041] according to Figures 1-15As shown, an integrated ATR reinforced computer includes a chassis and internal modules, wherein the internal modules are mounted on the chassis. The chassis includes a reinforced chassis heat sink, a panel, and an aviation plug-in unit, wherein the panel and the aviation plug-in unit are both mounted on the reinforced chassis heat sink. The reinforced chassis heat sink includes a reinforced chassis 1 and a liquid cooling heat sink, wherein the liquid cooling heat sink is mounted on the reinforced chassis 1.
[0042] The reinforced chassis 1 is in the shape of a rectangular trough and is integrally formed using AZ31B magnesium alloy. Furthermore, a first liquid cooling trough is provided on the outer side of one trough wall of the reinforced chassis 1. The first liquid cooling trough is in the shape of a rectangular trough and is smaller in size than one trough wall of the reinforced chassis 1. A second liquid cooling trough is provided on the outer side of another trough wall of the reinforced chassis 1. The second liquid cooling trough is in the shape of a rectangular trough and is smaller in size than another trough wall of the reinforced chassis 1. A third liquid cooling trough is provided on the outer side of the bottom of the trough of the reinforced chassis 1. The third liquid cooling trough is in the shape of a rectangular trough and is smaller in size than the bottom of the trough of the reinforced chassis 1.
[0043] The first liquid-cooling tank has a first upper liquid-cooling relay tank 2 disposed on the upper side of its bottom surface, and a first lower liquid-cooling relay tank disposed on the lower side of its bottom surface. A first liquid-cooling through-hole 3 connects the first upper liquid-cooling relay tank 2 and the first lower liquid-cooling relay tank. Multiple first liquid-cooling through-holes 3 are evenly distributed along the tank wall of the reinforced chassis 1.
[0044] A second liquid-cooling relay upper tank is provided on the upper side of the bottom surface of the second liquid-cooling tank, and a second liquid-cooling relay lower tank is provided on the lower side of the bottom surface of the second liquid-cooling tank. A second liquid-cooling through-hole is provided between the second liquid-cooling relay upper tank and the second liquid-cooling relay lower tank. Multiple second liquid-cooling through-holes are evenly distributed on the other tank wall of the reinforced chassis 1.
[0045] The third liquid-cooling tank has an upper third liquid-cooling relay tank disposed on the upper side of the bottom surface, and a lower third liquid-cooling relay tank disposed on the lower side of the bottom surface. A third liquid-cooling through-hole connects the upper third liquid-cooling relay tank and the lower third liquid-cooling relay tank, and multiple third liquid-cooling through-holes are evenly distributed on the bottom wall of the reinforced chassis 1.
[0046] The liquid-cooled heat sink includes a first liquid-cooled heat sink, a second liquid-cooled heat sink and a third liquid-cooled heat sink. The first liquid-cooled heat sink is arranged in the first liquid-cooling tank, the second liquid-cooled heat sink is arranged in the second liquid-cooling tank, and the third liquid-cooled heat sink is arranged in the third liquid-cooling tank.
[0047] The first liquid-cooled heat sink includes a first liquid-cooled heat sink 4, the size of which is no larger than that of the first liquid-cooled tank. A fourth liquid-cooled relay upper tank 5 is provided on the upper side of one side of the first liquid-cooled heat sink 4, and a fourth liquid-cooled relay lower tank is provided on the lower side of one side of the first liquid-cooled heat sink 4. The fourth liquid-cooled relay upper tank 5 and the fourth liquid-cooled relay lower tank are connected by a fourth liquid-cooled through-hole 6. Furthermore, a first heat dissipation tank 7 is provided on the other side of the first liquid-cooled heat sink 4. The first heat dissipation tank 7 is located between two adjacent fourth liquid-cooled through-holes 6 to increase the contact area between the other side of the first liquid-cooled heat sink 4 and the air, thereby improving heat dissipation efficiency.
[0048] One end of the first liquid-cooled heat sink 4 is fixedly embedded in the first liquid-cooled tank, and a first sealing ring is provided between the opening of the fourth liquid-cooled relay upper tank 5 and the opening of the first liquid-cooled relay upper tank 2, thereby ensuring a sealed connection between the fourth liquid-cooled relay upper tank 5 and the first liquid-cooled relay upper tank 2. Simultaneously, a second sealing ring is provided between the opening of the fourth liquid-cooled relay lower tank and the opening of the first liquid-cooled relay lower tank, thereby ensuring a sealed connection between the fourth liquid-cooled relay lower tank and the first liquid-cooled relay lower tank. Optionally, both the first and second sealing rings are conductive rubber sealing rings.
[0049] Furthermore, the first liquid-cooling relay lower tank, the first liquid-cooling through-hole 3, the first liquid-cooling relay upper tank 2, the fourth liquid-cooling relay upper tank 5, the fourth liquid-cooling through-hole 6, and the fourth liquid-cooling relay lower tank are filled with coolant. It should be noted that when the internal temperature of the integrated ATR-reinforced computer rises, the temperature is transferred to the coolant in the first liquid-cooling through-hole 3 through the reinforced chassis 1. As the coolant's temperature rises and its density decreases, it rises from the first liquid-cooling through-hole 3 to the first liquid-cooling relay upper tank 2. The coolant in the first liquid-cooling relay upper tank 2 is then pushed into the fourth liquid-cooling through-hole 6 and dissipates heat outward. This significantly improves the heat dissipation efficiency of the reinforced chassis 1.
[0050] The second liquid-cooled heat sink includes a second liquid-cooled heat sink, which has the same structure as the first liquid-cooled heat sink 4. The second liquid-cooled heat sink is embedded in the second liquid-cooled tank, and the connection method between the second liquid-cooled heat sink and the second liquid-cooled relay upper tank and the second liquid-cooled relay lower tank is the same as the connection method between the first liquid-cooled heat sink 4 and the first liquid-cooled relay upper tank 2 and the first liquid-cooled relay lower tank.
[0051] The third liquid-cooled heat sink includes a third liquid-cooled heat sink 9, the size of which is no larger than that of the third liquid-cooled tank. A fifth liquid-cooled relay upper tank is provided on the upper side of one side of the third liquid-cooled heat sink 9, and a fifth liquid-cooled relay lower tank is provided on the lower side of one side of the third liquid-cooled heat sink 9. The fifth liquid-cooled relay upper tank and the fifth liquid-cooled relay lower tank are connected by a fifth liquid-cooled through-hole. Furthermore, a second heat sink is provided on the other side of the third liquid-cooled heat sink 9, and the second heat sink is located between two adjacent fifth liquid-cooled through-holes to increase the contact area between the other side of the third liquid-cooled heat sink 9 and the air, thereby improving heat dissipation efficiency.
[0052] One end of the third liquid-cooled heat sink 9 is fixedly embedded in the third liquid-cooled tank, and a third sealing ring is provided between the fifth liquid-cooled relay upper notch and the third liquid-cooled relay upper notch, thereby ensuring a sealed connection between the fifth liquid-cooled relay upper notch and the third liquid-cooled relay upper notch. Simultaneously, a fourth sealing ring is provided between the fifth liquid-cooled relay lower notch and the third liquid-cooled relay lower notch, thereby ensuring a sealed connection between the fifth liquid-cooled relay lower notch and the third liquid-cooled relay lower notch. Optionally, both the third and fourth sealing rings are conductive rubber sealing rings.
[0053] It should be noted that the reinforced chassis 1 and the liquid cooling element cooperate to form an electromagnetic shielding structure by using two layers of metal plates to prevent or reduce the propagation of electromagnetic energy, thereby significantly improving the anti-interference performance of the integrated ATR reinforced computer.
[0054] The panel assembly includes an upper cover plate 10 and a lower cover plate 11. The upper cover plate 10 is a rectangular plate and is sealed and secured to one end of the reinforced chassis 1 using a first screw. A first conductive rubber strip is provided between the upper cover plate 10 and one end of the reinforced chassis 1 to improve sealing and conductive connectivity between the two, thereby enhancing electromagnetic shielding. The lower cover plate 11 is sealed and secured to the other end of the reinforced chassis 1 using a bottom fixing plate 12 and a second screw. A second conductive rubber strip is provided between the lower cover plate 11 and the other end of the reinforced chassis 1 to improve sealing and conductive connectivity between the two, thereby enhancing electromagnetic shielding.
[0055] The aviation plug-in unit includes an aviation plug-in plate 13 and an aviation plug 14. The aviation plug-in plate 13 is rectangular and is sealed and secured to the notch of the reinforced chassis 1 using a third screw. A third conductive rubber strip is provided between the aviation plug-in plate 13 and the notch of the reinforced chassis 1 to improve sealing and conductive connectivity between the two, forming a sealed structure that effectively prevents the effects of electromagnetic radiation. The aviation plug 14 is provided through the aviation plug-in plate 13, and multiple aviation plugs 14 are distributed at predetermined locations on the aviation plug-in plate 13.
[0056] The internal modules include a filter 15, a main processing module 16, an MBI board 17, a video processing module 18, and a power module 19. These components are all located within the reinforced chassis 1. The filter 15 is mounted on a central partition 20 within the reinforced chassis 1, which is independently installed within the reinforced chassis 1. The low-pass filter 15 is installed near the power input port. The input line of the power filter 15 is kept as far away from the output line as possible and is twisted to prevent recoupling and address issues caused by conducted interference.
[0057] The main processing module 16 is fastened to the reinforced chassis 1 by the first locking strip thereon, and the main processing module 16 fits tightly against a groove wall of the reinforced chassis 1 to quickly conduct the temperature of the board to the reinforced chassis 1 for heat dissipation. In addition, the main processing module 16 is installed with a high thermal conductivity thermal pad close to the cold plate to increase the heat conduction area through the reinforced chassis 1. When laying out the circuit board, sufficient heat dissipation space and channels are left on the power conversion chip board that is prone to heat accumulation to prevent the main components such as crystal oscillators, integrated circuits, diodes, transistors, precision resistors, etc. from being close to them and suffering thermal shock. Part of the heat of the computer electrical components is conducted to the reinforced chassis 1 through the cold plate. The MBI board 17 is fastened to the reinforced chassis 1 by the second locking strip thereon. The video processing module 18 is fastened to the reinforced chassis 1 by the third locking strip thereon.
[0058] The power module 19 is fastened in the reinforced chassis 1 by the fourth locking strip thereon, and the power module 19 is tightly fitted with the other groove wall of the reinforced chassis 1 to improve the heat conduction of the power module 19 to the reinforced chassis 1. Furthermore, the gap between the heating element and the cold plate is filled with thermal conductive material inside the power board to increase the heat transfer efficiency. The thermal conductive material selected this time is a flexible thermal pad 21, which has good viscosity, is soft and compressible, and has good shockproof performance. Its thermal conductivity coefficient: 3.0; hardness: ShoreA10-40; pressure resistance: >6000; temperature range: -60-200℃. Therefore, it can completely discharge the air between the electronic components and the heat sink during use, achieving the effect of full contact and increased heat dissipation.
[0059] Furthermore, the cables used within the integrated ATR-reinforced computer include: power cables, video signal cables, Category 5e shielded network cables, and CAN signal cables. The power cables are twisted-pair cables to prevent coupling and are spatially separated from other signal cables to prevent interference. The CAN signal cables, which are less susceptible to interference, also use twisted-pair cables. The Category 5e shielded network cables have shielding layers to prevent external interference and ensure communication speeds. The video signal cables use dedicated cables to prevent crosstalk and other types of signal interference. The selection of these cables prevents mutual interference between different signals, enhances electromagnetic shielding, and ensures normal and stable operation of the equipment.
[0060] Although the embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the description and implementation methods. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and illustrations shown and described herein.
Claims
1. An integrated ATR reinforced computer, characterized in that: include: A chassis component, the chassis component including a reinforced chassis heat sink, a panel component and an aviation plug-in component, the panel component and the aviation plug-in component are both arranged on the reinforced chassis heat sink to collaboratively provide protection and heat dissipation; The internal module is arranged in the reinforced chassis heat sink, and the reinforced chassis heat sink provides efficient heat dissipation and protection for the internal module.
2. The integrated ATR reinforced computer according to claim 1, characterized in that: The reinforced chassis heat sink includes a reinforced chassis and a liquid-cooled heat sink, and the liquid-cooled heat sink is arranged on the reinforced chassis; a first liquid cooling groove is provided on the outer side of one groove wall of the reinforced chassis, a second liquid cooling groove is provided on the outer side of another groove wall of the reinforced chassis, and a third liquid cooling groove is provided on the outer side of the groove bottom of the reinforced chassis.
3. The integrated ATR reinforced computer according to claim 2, characterized in that: A first liquid-cooled relay upper tank is provided on the upper side of the bottom surface of the first liquid-cooling tank, a first liquid-cooled relay lower tank is provided on the lower side of the bottom surface of the first liquid-cooling tank, and the first liquid-cooled relay upper tank and the first liquid-cooled relay lower tank are connected by a first liquid-cooled through-hole; a second liquid-cooled relay upper tank is provided on the upper side of the bottom surface of the second liquid-cooling tank, a second liquid-cooled relay lower tank is provided on the lower side of the bottom surface of the second liquid-cooling tank, and the second liquid-cooled relay upper tank and the second liquid-cooled relay lower tank are connected by a second liquid-cooled through-hole; a third liquid-cooled relay upper tank is provided on the upper side of the bottom surface of the third liquid-cooling tank, a third liquid-cooled relay lower tank is provided on the lower side of the bottom surface of the third liquid-cooling tank, and the third liquid-cooled relay upper tank and the third liquid-cooled relay lower tank are connected by a third liquid-cooled through-hole.
4. The integrated ATR reinforced computer according to claim 2 or 3, characterized in that: The liquid-cooled heat sink includes a first liquid-cooled heat sink, a second liquid-cooled heat sink and a third liquid-cooled heat sink. The first liquid-cooled heat sink is arranged in the first liquid-cooling tank, the second liquid-cooled heat sink is arranged in the second liquid-cooling tank, and the third liquid-cooled heat sink is arranged in the third liquid-cooling tank.
5. The integrated ATR reinforced computer according to claim 4, characterized in that: The first liquid-cooled heat sink includes a first liquid-cooled heat sink, a fourth liquid-cooled relay upper groove is provided on the upper side of one side of the first liquid-cooled heat sink, a fourth liquid-cooled relay lower groove is provided on the lower side of one side of the first liquid-cooled heat sink, and the fourth liquid-cooled relay upper groove and the fourth liquid-cooled relay lower groove are connected by a fourth liquid-cooled through-hole; one side of the first liquid-cooled heat sink is fixedly embedded in the first liquid-cooled groove, and a first sealing ring is provided between the fourth liquid-cooled relay upper groove and the first liquid-cooled relay upper groove, and a second sealing ring is provided between the fourth liquid-cooled relay lower groove and the first liquid-cooled relay lower groove.
6. The integrated ATR reinforced computer according to claim 5, characterized in that: The second liquid-cooled heat sink includes a second liquid-cooled heat sink, which has the same structure as the first liquid-cooled heat sink. The second liquid-cooled heat sink is embedded in the second liquid-cooled tank, and the connection method between the second liquid-cooled heat sink and the second liquid-cooled relay upper tank and the second liquid-cooled relay lower tank is the same as the connection method between the first liquid-cooled heat sink and the first liquid-cooled relay upper tank and the first liquid-cooled relay lower tank.
7. The integrated ATR reinforced computer according to claim 5, characterized in that: The third liquid-cooled heat sink includes a third liquid-cooled heat sink, a fifth liquid-cooled relay upper groove is provided on the upper side of one side of the third liquid-cooled heat sink, a fifth liquid-cooled relay lower groove is provided on the lower side of one side of the third liquid-cooled heat sink, and the fifth liquid-cooled relay upper groove and the fifth liquid-cooled relay lower groove are connected by a fifth liquid-cooled through-hole; one side of the third liquid-cooled heat sink is fixedly embedded in the third liquid-cooled groove, and a third sealing ring is provided between the fifth liquid-cooled relay upper groove and the third liquid-cooled relay upper groove, and a fourth sealing ring is provided between the fifth liquid-cooled relay lower groove and the third liquid-cooled relay lower groove.
8. The integrated ATR reinforced computer according to claim 2 or 3, characterized in that: The panel component includes an upper cover and a lower cover. The upper cover is fastened and sealed on one port of the reinforced chassis, and a first conductive rubber strip is provided between the upper cover and one end of the reinforced chassis; the lower cover is fastened and sealed on the other port of the reinforced chassis, and a second conductive rubber strip is provided between the lower cover and the other end of the reinforced chassis.
9. The integrated ATR reinforced computer according to claim 2 or 3, characterized in that: The aviation plug-in unit includes an aviation plug-in board and an aviation plug. The aviation plug-in board is tightly and sealedly arranged on the notch of the reinforced chassis, and a third conductive rubber strip is arranged between the aviation plug-in board and the notch of the reinforced chassis. The aviation plug is arranged on the aviation plug-in board.
10. The integrated ATR reinforced computer according to claim 2 or 3, characterized in that: The internal modules include a filter, a main processing module, an MBI board, a video processing module and a power module. The filter, the main processing module, the MBI board, the video processing module and the power module are all arranged in the reinforced chassis.