Touch module, preparation method thereof and display device

Abstract

The invention relates to a touch module, a preparation method of the touch module and a display device. The touch module comprises a first touch assembly and a second touch assembly which are arranged in a stacked mode. The first touch component at least comprises a transparent cover plate, a first metal layer and a first touch layer; the first metal layer is prepared on the surface of one side, far away from the touch surface of the touch module, of the transparent cover plate; the first touch layer is prepared on the side, away from the transparent cover plate, of the first metal layer; the second touch component at least comprises a second touch layer, and the second touch component is adhered to one side, far away from the first metal layer, of the first touch layer; the first touch layer and the second touch layer are used for achieving the touch function of the touch module. The transparent cover plate and the first metal layer on the surface of the transparent cover plate are used as the preparation substrate of the first touch control layer, so that the condition that the preparation substrate is independently arranged for the first touch control layer is avoided, the arrangement of at least one film layer is reduced, the overall thickness of the touch control module is reduced, and the thin design requirement of a related display device is met; and the preparation process flow of the touch module is simplified.

Description

Technical Field

[0001] This application relates to the field of display technologies, and particularly to a touch control module, a preparation method thereof, and a display device. Background Art

[0002] With the continuous progress of science and technology, more and more display devices with touch control functions are widely used in people's daily life and work, bringing great convenience to people's daily life and work, and becoming an important tool indispensable in people's life today.

[0003] The main component for a display device to achieve the touch control function is the touch panel. Compared with a display device that only has a display function, the setting of the touch panel undoubtedly increases the overall thickness of the display device and also increases the preparation process flow of the display device; therefore, there is an urgent need to provide a touch panel that can reduce the overall thickness of the display device and simplify the preparation process flow while ensuring that the display device has a good touch control function. Summary of the Invention

[0004] Based on this, in view of the above technical problems, it is necessary to provide a touch control module that can reduce the overall thickness of the display device and simplify the preparation process flow while ensuring that the display device has a good touch control function.

[0005] In a first aspect, this application provides a touch control module, including:

[0006] Along the thickness direction of the touch control module, the touch control module includes a first touch control component and a second touch control component that are stacked;

[0007] The first touch control component at least includes a transparent cover plate, a first metal layer, and a first touch control layer; wherein, the first metal layer is prepared on one surface of the transparent cover plate away from the touch surface of the touch control module; the first touch control layer is prepared on the side of the first metal layer away from the transparent cover plate;

[0008] The second touch control component at least includes a second touch control layer, and the second touch control component is bonded to the side of the first touch control layer away from the first metal layer;

[0009] The first touch control layer and the second touch control layer are used to implement the touch control function of the touch control module.

[0010] In one embodiment, the first metal layer is a metal silicon layer.

[0011] In one embodiment, the second touch control component further includes:

[0012] A transparent substrate, located on the side of the second touch control layer away from the transparent cover plate;

[0013] A second metal layer, located between the transparent substrate and the second touch layer.

[0014] In one embodiment, the second metal layer is a metal silicon layer.

[0015] In one embodiment, the second touch component further includes:

[0016] A first shadow elimination layer, located between the transparent substrate and the second metal layer;

[0017] An underlayer, located between the first shadow elimination layer and the second metal layer;

[0018] A first silver paste layer, located on a surface of the second touch layer close to the first touch layer.

[0019] In one embodiment, the first touch component further includes:

[0020] A second shadow elimination layer, located between the first metal layer and the first touch layer.

[0021] In one embodiment, the touch module includes a touch area and at least a non-touch area surrounding at least part of the touch area;

[0022] At least the non-touch area further includes:

[0023] An ink layer, located between the first touch layer and the second touch component;

[0024] A carbon paste layer, located on a surface of the ink layer facing the second touch component;

[0025] A second silver paste layer, located on a surface of the carbon paste layer facing the second touch component.

[0026] In a second aspect, the present application further provides a display device, and the display device includes the touch module as described above;

[0027] It further includes a display panel, and the touch module is located on a light-emitting surface side of the display panel.

[0028] In a third aspect, the present application further provides a method for manufacturing a touch module, including:

[0029] Providing a transparent cover plate;

[0030] Preparing a first metal layer on a surface of the transparent cover plate on a side away from a touch surface of the touch module;

[0031] Prepare a first touch layer on the side of the first metal layer away from the transparent cover plate to obtain a first touch component; wherein, the first touch component includes the transparent cover plate, the first metal layer and the first touch layer;

[0032] Provide a second touch component that at least includes a second touch layer;

[0033] Bond the second touch component to the side of the first touch layer away from the first metal layer;

[0034] Wherein, the first touch layer and the second touch layer are used to realize the touch function of the touch module.

[0035] In one embodiment, the preparation of the first metal layer on the side surface of the transparent cover plate away from the touch surface of the touch module includes:

[0036] Prepare a metal silicon layer on the side surface of the transparent cover plate away from the touch surface of the touch module.

[0037] In one embodiment, before providing the second touch component that at least includes a second touch layer, it further includes:

[0038] Provide a transparent substrate;

[0039] Prepare a second touch layer on the side of the transparent substrate facing the touch surface of the touch module to obtain a second touch component.

[0040] In one embodiment, before preparing the second touch layer on the side of the transparent substrate facing the touch surface of the touch module, it further includes:

[0041] Prepare a second metal layer on the side of the transparent substrate facing the touch surface of the touch module.

[0042] In one embodiment, before preparing the second metal layer on the side of the transparent substrate facing the touch surface of the touch module, it further includes:

[0043] Prepare a first anti-glare layer on the side surface of the transparent substrate facing the touch surface of the touch module;

[0044] Prepare a primer layer on the side surface of the first anti-glare layer away from the transparent substrate.

[0045] In one embodiment, after preparing the second touch layer on the side of the transparent substrate facing the touch surface of the touch module, it further includes:

[0046] Print a first silver paste layer on the side surface of the second touch layer away from the transparent substrate.

[0047] In one embodiment, preparing a second metal layer on one side of the transparent substrate facing the touch surface of the touch module includes:

[0048] Preparing a metal silicon layer on one side of the transparent substrate facing the touch surface of the touch module.

[0049] In one embodiment, before preparing the first touch layer on one side of the first metal layer away from the transparent cover plate, it further includes:

[0050] Preparing a second anti-reflection layer on the surface of the first metal layer away from the transparent cover plate.

[0051] In one embodiment, the touch module includes a touch area and a non-touch area at least partially surrounding the touch area;

[0052] After preparing the first touch layer on one side of the first metal layer away from the transparent cover plate, it further includes:

[0053] At least in the non-touch area, printing an ink layer on the surface of the first touch layer away from the first metal layer;

[0054] Printing a carbon paste layer on the surface of the ink layer away from the first touch layer;

[0055] Printing a second silver paste layer on the surface of the carbon paste layer away from the ink layer.

[0056] The above touch module, its preparation method, and display device, by setting a first touch component and a second touch component stacked in the touch module, wherein the first touch component includes a first metal layer directly prepared on one side surface of the transparent cover plate and a first touch layer prepared on one side of the first metal layer away from the transparent cover plate, and the second touch layer in the second touch component is bonded to one side of the first touch layer away from the first metal layer; it can be seen that in this application, by setting the first touch layer on one side of the first metal layer away from the transparent cover plate, that is, using the transparent cover plate and the first metal layer on its surface as the preparation substrate for the first touch layer, it avoids setting a separate preparation substrate for the first touch layer, reduces the setting of at least one film layer, thereby facilitating reducing the overall thickness of the touch module, meeting the thin-type design requirements of the display device corresponding to the touch module, and at the same time simplifying the preparation process flow of the touch module. Description of the Drawings

[0057] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0058] Figure 1 A schematic diagram of a touch control module provided by an embodiment of the present application;

[0059] Figure 2 Provided by an embodiment of the present application Figure 1 A cross-sectional schematic diagram of AA' in

[0060] Figure 3 Provided by an embodiment of the present application Figure 1 Another cross-sectional schematic diagram of AA' in

[0061] Figure 4 A schematic diagram of a display device provided by an embodiment of the present application;

[0062] Figure 5 Provided by an embodiment of the present application Figure 4 A cross-sectional schematic diagram of BB' in

[0063] Figure 6 A preparation flow chart of a touch control module provided by an embodiment of the present application;

[0064] Figure 7 Another preparation flow chart of a touch control module provided by an embodiment of the present application;

[0065] Figure 8 Another preparation flow chart of a touch control module provided by an embodiment of the present application. Detailed implementation manners

[0066] To facilitate the understanding of the present invention, the following will describe the present invention more comprehensively with reference to the relevant accompanying drawings. The preferred embodiments of the present invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0067] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0068] In this document, spatially relative terms such as "upper" and "lower" are defined with reference to the accompanying drawings. Thus, it will be understood that "upper" and "lower" are used interchangeably. It will be understood that when a layer is referred to as being "on" another layer, it can be formed directly on the other layer or an intermediate layer may also be present. Thus, it will be understood that when a layer is referred to as being "directly on" another layer, no intermediate layer is inserted therebetween.

[0069] In the accompanying drawings, for clarity of illustration, the dimensions of layers and regions may be exaggerated. It will be understood that when a layer or element is referred to as being "on" another layer or substrate, the layer or element can be directly on the other layer or substrate or an intermediate layer may also be present. Additionally, it will also be understood that when a layer is referred to as being "between" two layers, the layer can be the only layer between the two layers or one or more intermediate layers may also be present. Additionally, the same reference numerals always denote the same elements.

[0070] Hereinafter, although terms such as "first", "second", etc. may be used to describe various components, these components do not have to be limited to the above terms. The above terms are only used to distinguish one component from another. It will also be understood that expressions used in the singular form include the plural form, unless the singular form of the expression has a distinctly different meaning in the context. Additionally, in the following embodiments, it will also be understood that the terms "comprising" and / or "having" as used herein state the presence of the stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0071] As used in the application documents, the term "and / or" includes any and all combinations of one or more of the associated listed items. When an expression such as "at least one (element) of..." is placed after a list of elements, it modifies the entire list of elements rather than individual elements in the list.

[0072] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this invention belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0073] It should also be understood that terms such as "comprising / including" or "having", etc. specify the presence of the stated features, wholes, steps, operations, components, parts or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0074] Although exemplary embodiments of a touch control module and a display device including the touch control module have been particularly described in the text, many modifications and variations will be obvious to those skilled in the art. Therefore, it will be understood that the touch control module and the display device constituted according to the principles of the present invention can be implemented other than as particularly described in the text. This application is also limited to the claims and their equivalents.

[0075] As described in the background art, in the prior art, a display device with a touch control function has a relatively large film layer thickness compared to a display device with only a display function, increasing the overall thickness of the display device and being unfavorable for the trend of the thin design of the display device.

[0076] In the prior art, a general capacitive touch screen structure is a combination structure of glass + glass or glass + sensing film. The touch screen products of this kind of structure are too thick. When such a touch screen is used in a display device, combined with the cover glass of the display device as a protective layer, the overall thickness of the display device will be too large, the display transparency will be reduced, the touch sensitivity will be reduced, and its production process is relatively complex and the production cost is relatively high. In the wave of the rapid development of touch control technology, such products can no longer meet the current design requirements for the thinness of display devices with touch control functions and the requirements for simplified preparation processes of preparation processes. Therefore, there is an urgent need to provide a touch control module with a smaller thickness and a smaller number of film layers to improve the problems existing in the prior art.

[0077] Figure 1 A schematic diagram of a touch control module provided by an embodiment of this application Figure 2 Provided by an embodiment of this application Figure 1 A cross-sectional schematic diagram of AA' in Figure 1 and Figure 2 Referring to, this application provides a touch control module 100. Along the thickness direction of the touch control module 100, the touch control module 100 includes a first touch control component 20 and a second touch control component 30 which are stacked;

[0078] The first touch control component 20 at least includes a transparent cover plate 21, a first metal layer 22 and a first touch control layer 23; wherein, the first metal layer 22 is prepared on one side surface of the transparent cover plate 21 away from the touch surface of the touch control module 100; the first touch control layer 23 is prepared on the side of the first metal layer 22 away from the transparent cover plate 21;

[0079] The second touch control component 30 at least includes a second touch control layer 31, and the second touch control component 30 is bonded to the side of the first touch control layer 23 away from the first metal layer 22;

[0080] The first touch control layer 23 and the second touch control layer 31 are used to realize the touch control function of the touch control module 100.

[0081] Specifically, the present application provides a touch control module 100. The touch control module 100 includes a first touch component 20 and a second touch component 30. Along the thickness direction of the touch control module 100, the first touch component 20 and the second touch component 30 are stacked. In order to ensure the good touch function of the touch control module 100, the touch control module 100 provided in the present application includes two relatively arranged touch layer structures. Among them, the first touch component 20 includes a first touch layer 23, and the second touch component 30 includes a second touch layer 31.

[0082] Specifically, for the first touch component 20 and the second touch component 30, an optional implementation provided in the present application is that the first touch component 20 includes a transparent cover plate 21. The transparent cover plate 21 is specifically the cover plate (protective cover plate) of the display device including the touch control module 100, that is, the cover plate of the display device is reused as the film layer structure of the first touch component 20 in the present application, and is specifically reused as the transparent cover plate 21; further, the first touch component 20 further includes a first metal layer 22 and a first touch layer 23 on the side of the transparent cover plate 21 away from the touch surface of the touch control module 100. Among them, the first metal layer 22 is directly prepared on the surface of the side of the transparent cover plate 21 away from the touch surface of the touch control module 100, and the first touch layer 23 is prepared on the side of the first metal layer 22 away from the transparent cover plate 21; it can be seen that in the first touch component 20 provided in the present application, the first touch layer 23 can directly use the transparent cover plate 21 and the first metal layer 22 as its preparation substrate, without separately setting a preparation substrate for the first touch layer 23, which is beneficial to reducing the number of film layer structures in the touch control module 100, and reusing the transparent cover plate 21 and the first metal layer 22 as the preparation substrate of the first touch layer 23, compared with separately setting a preparation substrate for the first touch layer 23, also reduces the overall film layer thickness of the touch control module 100, which is beneficial to the thin design trend of the display device including the touch control module 100.

[0083] In addition, in the first touch component 20 provided in the present application, a first metal layer 22 is provided on the surface of the side of the transparent cover plate 21 away from the touch surface of the touch control module 100. The setting of the first metal layer 22 can increase the bonding force between the transparent cover plate 21 and the first touch layer 23, and avoid the situation of coating peeling after the first touch layer 23 is directly made on the surface of the transparent cover plate 21. The setting of the first metal layer 22 between the transparent cover plate 21 and the first touch layer 23 improves the bonding stability between the film layer structures of the first touch component 20, which is beneficial to improving the service life of the touch control module 100, and further beneficial to improving the preparation yield and service life of the display device including the touch control module 100.

[0084] Based on the above settings of the first touch component 20 in the touch module 100, the second touch component 30 is arranged on the side of the first touch component 20 away from the touch surface of the touch module 100. Further, the second touch layer 31 in the second touch component 30 can be adhesively bonded to the side of the first touch layer 23 in the first touch component 20 away from the first metal layer 22. For the adhesion between the first touch layer 23 and the second touch layer 31, an optical adhesive layer 40 with good light transmittance can be selected. For example, OCA (Optically Clear Adhesive, optical transparent adhesive film material) can be used to achieve the adhesive fixation between the first touch layer 23 and the second touch layer 31. And the OCA is located between the first touch layer 23 and the second touch layer 31, which is also beneficial to achieve the insulation between the first touch layer 23 and the second touch layer 31, thus being conducive to ensuring the good touch function of the first touch layer 23 and the second touch layer 31 for the touch module 100.

[0085] That is, the touch module 100 provided in this application, along the thickness direction of the touch module 100, at least includes a transparent cover plate 21, a first metal layer 22, a first touch layer 23, an OCA optical adhesive layer 40, and a second touch layer 31 that are sequentially stacked. The first metal layer 22 is arranged between the transparent cover plate 21 and the first touch layer 23 to improve the bonding force between the transparent cover plate 21 and the first touch layer 23. However, this is only an optional setting method provided in this application, and this application is not limited thereto. For example, it is also possible to directly prepare the first touch layer 23 on the surface of the transparent cover plate 21 away from the touch surface of the touch module 100, so as to further streamline the first metal layer 22, which is beneficial to further reduce the overall thickness of the touch module 100 and further reduce the manufacturing process flow of the touch module 100.

[0086] Furthermore, this application does not limit whether other film layer structures are further arranged between the first touch layer 23 and the OCA optical adhesive layer 40. Other film layer structures can be arranged between the first touch layer 23 and the OCA optical adhesive layer 40 according to requirements, so as to ensure the required display function while ensuring the good touch function of the display device including the touch module 100.

[0087] It should also be supplemented that this application does not limit the preparation material of the first metal layer 22 arranged between the transparent cover plate 21 and the first touch layer 23, as long as the setting of the first metal layer 22 can improve the bonding effect between the transparent cover plate 21 and the first touch layer 23.

[0088] It should be noted that the first metal layer 22 is provided between the transparent cover plate 21 and the first touch layer 23 to enhance the bonding effect between the transparent cover plate 21 and the first touch layer 23. This is only an optional implementation based on existing materials. With the development of technology, if there are other materials that can achieve the effect of improving the bonding force between the transparent cover plate 21 and the first touch layer 23, a film layer made of other materials can also be selected and disposed between the transparent cover plate 21 and the first touch layer 23 to enhance the bonding effect between the transparent cover plate 21 and the first touch layer 23. In addition, with the development of technology, if there is a material for making the first touch layer 23 that can be used as a touch layer and has good bonding force with the transparent cover plate 21, this material can also be used to directly prepare a touch layer on the surface of the transparent cover plate 21 on the side away from the touch module 100 to form the first touch component 20.

[0089] Please continue to refer to Figure 1 and Figure 2 , in an exemplary embodiment, the first metal layer 22 is a metal silicon layer.

[0090] Specifically, a material that can be selected for preparing the first metal layer 22 in this application is metal silicon, that is, the first metal layer 22 is specifically a metal silicon layer; since the transparent cover plate 21 of the display device usually uses a glass cover plate, that is, the material for preparing the transparent cover plate 21 of the first touch component 20 is generally glass, the chemical bond and intermolecular force between metal silicon and glass have a stronger bonding force, and there is also good bonding force between metal silicon and the materials currently used in the display field for making touch layers. It can be seen that setting a metal silicon layer between the transparent cover plate 21 and the first touch layer 23 is beneficial to improving the bonding force between the transparent cover plate 21 and the first touch layer 23, so as to improve the assembly structure stability of the first touch component 20, and is beneficial to reducing or eliminating the situation of fracture and fragmentation of the touch module 100, thereby improving the service life of the display device including the touch module 100.

[0091] In addition, the price of metal silicon is relatively cheap, which is beneficial to reducing the manufacturing cost of the touch module 100; metal silicon has good stability, which is beneficial to improving the reliability and service life of the touch module 100; metal silicon has a light weight, which is beneficial to ensuring that the touch module 100 has a light weight; furthermore, using a metal silicon layer as the first metal layer 22 in the first touch component 20 is beneficial to ensuring that the display device containing the touch module 100 has a low manufacturing cost, good reliability and service life, and a light weight.

[0092] It should be added that in the embodiments provided by the present application, a metal silicon layer is provided between the transparent cover plate 21 and the first touch layer 23 to avoid the problem of coating peeling that easily occurs when the first touch layer 23 is directly prepared on the surface of the glass material transparent cover plate 21. With the development of technology, if there are other materials that can achieve the effect of improving the bonding force between the transparent cover plate 21 and the first touch layer 23, a film layer made of other materials can also be selected and arranged between the transparent cover plate 21 and the first touch layer 23 to improve the bonding effect between the transparent cover plate 21 and the first touch layer 23.

[0093] Figure 3 For the Figure 1 another cross-sectional schematic diagram of AA' in the embodiments of the present application, please refer to Figure 1 and Figure 3 , in an exemplary embodiment, the second touch component 30 further includes:

[0094] a transparent substrate 32, located on the side of the second touch layer 31 away from the transparent cover plate 21;

[0095] a second metal layer 33, located between the transparent substrate 32 and the second touch layer 31.

[0096] Specifically, the present application also provides an alternative embodiment. In addition to the second touch layer 31 in the second touch component 30, it further includes a transparent substrate 32 and a second metal layer 33. Along the thickness direction of the touch module 100, the second touch layer 31, the second metal layer 33, and the transparent substrate 32 are sequentially stacked, that is, the transparent substrate 32 is located on the side of the second touch layer 31 away from the transparent cover plate 21, and the second metal layer 33 is located between the transparent substrate 32 and the second touch layer 31. Here, the second metal layer 33 can specifically be a metal silicon layer. By providing a metal silicon layer between the second touch layer 31 and the transparent substrate 32, it is beneficial to improve the bonding force between the second touch layer 31 and the transparent substrate 32, avoid the problem of coating peeling when the second touch layer 31 is directly prepared on the surface of the transparent substrate 32, thereby being beneficial to improving the assembly structure stability of the second touch component 30, being beneficial to reducing or eliminating the situation of fracture or fragmentation of the touch module 100, and thus being able to improve the service life of the display device including the touch module 100.

[0097] It should be added that with the development of technology, if there are other materials that can achieve the effect of improving the bonding force between the second touch layer 31 and the transparent substrate 32, a film layer made of other materials can also be selected and arranged between the second touch layer 31 and the transparent substrate 32.

[0098] It should also be supplemented that the present application does not specifically limit whether there are other film layer structures between the second metal layer 33 of the transparent substrate 32 and between the second metal layer 33 and the second touch layer 31. Other film layer structures can be provided between the second metal layer 33 of the transparent substrate 32 and / or between the second metal layer 33 and the second touch layer 31 according to requirements, so as to ensure good touch function and display function of the display device including the touch module 100.

[0099] It should also be supplemented that the present application does not specifically limit the preparation material of the transparent substrate 32. For example, PET (Polyethylene terephthalate) can be selected to make the transparent substrate 32. PET has good light transmittance, good flexibility and stability, which can not only ensure the structural stability of the second touch component 30, but also ensure the light transmittance and service life of the second touch component 30. In addition, when PET is used as the preparation substrate of the second touch layer 31, the PET transparent substrate 32 can be made very thin, which is beneficial to reducing the overall thickness of the touch module 100, and thus beneficial to the thin design of the display device including the touch module 100.

[0100] It should also be supplemented that in the embodiment provided by the present application, a second metal layer 33 (metal silicon layer) is provided between the transparent substrate 32 and the second touch layer 31 to enhance the bonding force between the transparent substrate 32 and the second touch layer 31. This is just an optional setting method provided by the present application, and the present application is not limited thereto. For example, the second touch layer 31 can also be directly prepared on the surface of the transparent substrate 32 on the touch surface side facing the touch module 100, so as to further streamline the film layer of the second metal layer 33, which is beneficial to further reducing the overall thickness of the touch module 100 and further reducing the preparation process flow of the touch module 100. That is, with the development of technology, if there is a material that can be used as a touch layer and has good bonding force with the transparent substrate 32, this material can be used to directly prepare the touch layer on the surface of the transparent substrate 32 on the touch surface side facing the touch module 100.

[0101] It should also be supplemented that the first metal layer 22 and the second metal layer 33 provided in the touch module 100 of the present application are specifically selected as metal silicon layers. Along the thickness direction of the touch module 100, the thickness of the metal silicon layer can be selected to be about 2nm, which is very thin and will not affect the light transmittance of the display device including the touch module 100, nor will it cause the problem that the first touch layer 23 and / or the second touch layer 31 are visible. The setting of the metal silicon layer not only increases the structural stability of the touch module 100, but also ensures good display effect of the related display device.

[0102] Among them, along the thickness direction of the touch module 100, the preparation thickness of the metal silicon layer can be selected between 1 nm and 30 nm. For example, besides the aforementioned 2 nm, for example, the thickness can also be selected to be 5 nm, 12 nm, 18 nm, etc. A metal silicon layer with a thickness less than 1 nm requires very high preparation accuracy, which will greatly increase the preparation cost of the touch module 100. A metal silicon layer with a thickness greater than 30 nm will cause a significant increase in the overall thickness of the touch module 100, which is not conducive to the trend of the thin design of related display devices. Therefore, in this application, the preparation thickness of the metal silicon layer is selected between 1 nm and 30 nm, which can not only reduce the preparation cost of the touch module 100, but also ensure the thin design of related display devices, and can also improve the bonding force and stability between at least some layers of the touch module 100.

[0103] It should also be added that this application does not specifically limit whether the transparent substrate 32 and the transparent cover plate 21 are rigid substrates or flexible substrates, and the transparent substrate 32 and the transparent cover plate 21 can be selected as rigid substrates or flexible substrates according to design requirements. Among them, the rigid substrate can be selected from glass and silicon wafers, and the flexible substrate can be selected from PET (Polyethyleneterephthalate), PMMA (Polymethyl methacrylate), and PC (Polycarbonate).

[0104] Please continue to refer to Figure 1 and Figure 3 , in an exemplary embodiment, the second touch component 30 further includes:

[0105] A first anti-ghosting layer 34, located between the transparent substrate 32 and the second metal layer 33;

[0106] An underlayer 35, located between the first anti-ghosting layer 34 and the second metal layer 33;

[0107] A first silver paste layer 36, located on the surface of the second touch layer 31 close to the first touch layer 23.

[0108] Specifically, an alternative embodiment provided by the present application is that, on the basis of including a transparent substrate 32, a second metal layer 33, and a second touch layer 31, the second touch component 30 may further include a first anti-reflection layer 34 and an underlayer 35. Among them, the first anti-reflection layer 34 is disposed between the transparent substrate 32 and the second metal layer 33, and the underlayer 35 is disposed between the first anti-reflection layer 34 and the second metal layer 33; the anti-reflection film (the first anti-reflection layer 34) is beneficial to increasing the light transmittance of the second touch component 30 and reducing the reflectance, so that the display device including the touch module 100 has a better visual effect; the underlayer 35 can be specifically prepared as a silicon dioxide layer, so that the underlayer 35 has the characteristics of stable dielectric property and good moisture resistance, which is beneficial to improving the service life and yield of the touch module 100.

[0109] It should be added that the proposed setting of the first anti-reflection layer 34 and the underlayer 35 between the transparent substrate 32 and the second metal layer 33 of the second touch component 30 is only an alternative embodiment provided by the present application, but the present application is not limited thereto. Other film layer structures can also be selected between the transparent substrate 32 and the second metal layer 33, or on the basis of including the first anti-reflection layer 34 and / or the underlayer 35, other film layer structures can be further set, as long as the good touch function of the touch module 100 and the good display function of the display device including the touch module 100 can be ensured.

[0110] The second touch component 30 may further include a first silver paste layer 36. Among them, the first silver paste layer 36 can be disposed on the surface of the second touch layer 31 close to the first touch layer 23, and the first silver paste layer 36 is disposed in the edge area (non-touch area) of the touch module 100, that is, the first silver paste layer 36 can be disposed in the non-display area of the display device including the touch module 100. The first silver paste layer 36 can be used to form a conductive Pad (liner) corresponding to the touch trace of the touch layer, so as to realize the conduction of the conductive line through the silver paste.

[0111] It should also be added that the preparation materials of the first anti-reflection layer 34 can be selected from silicon dioxide, zirconia, and titanium oxide.

[0112] Please continue to refer to Figure 1 and Figure 3 , in an exemplary embodiment, the first touch component 20 further includes:

[0113] A second anti-reflection layer 24, located between the first metal layer 22 and the first touch layer 23.

[0114] Specifically, an alternative embodiment provided by the present application is that, on the basis of the first touch component 20 being provided with a transparent cover plate 21, a first metal layer 22, and a first touch layer 23, a second anti-reflection layer 24 may be further provided between the first metal layer 22 and the first touch layer 23. The second anti-reflection layer 24 is beneficial to increasing the light transmittance of the first touch component 20 and reducing the reflectance, so that the display device including the touch module 100 has a better visual effect; at the same time, the anti-reflection film (the second anti-reflection layer 24) is also beneficial to reducing the visual contrast between the area where the touch traces or touch electrodes are provided in the touch module 100 and the vacant area between the touch traces or touch electrodes, thereby being beneficial to improving the display effect of the display device including the touch module 100 and the appearance consistency when in the non-display state.

[0115] It should also be supplemented that the preparation material of the second anti-reflection layer 24 can be selected from silicon dioxide, silicon nitride, niobium oxide, and titanium oxide; that is, the production material of the second anti-reflection layer 24 and the production material of the first anti-reflection layer 34 may not be exactly the same.

[0116] Please continue to refer to Figure 1 and Figure 3 , in an exemplary embodiment, the touch module 100 includes a touch area 10 and a non-touch area 11 that at least partially surrounds the touch area 10;

[0117] At least the non-touch area 11 further includes:

[0118] An ink layer 25, located between the first touch layer 23 and the second touch component 30;

[0119] A carbon paste layer 26, located on the surface of the ink layer 25 facing the second touch component 30;

[0120] A second silver paste layer 27, located on the surface of the carbon paste layer 26 facing the second touch component 30.

[0121] Specifically, the touch module 100 provided by the present application includes a touch area 10 and a non-touch area 11 surrounding the touch area 10. Among them, the touch module 100 at least further includes an ink layer 25, a carbon paste layer 26, and a second silver paste layer 27 provided in the non-touch area 11. Among them, the ink layer 25, the carbon paste layer 26, and the second silver paste layer 27 can be used to cover the entire non-touch area 11, which is beneficial to the color uniformity of the non-display area of the display device corresponding to the touch module 100, improves the aesthetics of the display device, and at the same time is also beneficial to avoiding the problem of light leakage in the non-display area of the display device and improving the display effect of the display device. In addition, at least the second silver paste layer 27 can be used to prepare the conductive Pad (liner) corresponding to the touch traces in the first touch layer 23 to realize the conduction of the conductive line through the silver paste.

[0122] It should be added that the setting of the ink layer 25, the carbon paste layer 26, and the second silver paste layer 27 in the non-touch area 11 on the surface of the first touch layer 23 facing the second touch layer 31 is only an optional implementation manner provided by this application. Any one of the ink layer 25, the carbon paste layer 26, and the second silver paste layer 27, or a combination of any two of them, can also be set in the non-touch area 11 according to requirements. This application does not make specific limitations on this.

[0123] It can be seen that the touch module 100 provided by this application can include, along the thickness direction of the touch module 100, a transparent cover plate 21, a first metal layer 22, a second anti-reflection layer 24, a first touch layer 23, an ink layer 25, a carbon paste layer 26, a second silver paste layer 27, an OCA layer, a first silver paste layer 36, a second touch layer 31, a second metal layer 33, a primer layer 35, a first anti-reflection layer 34, and a transparent substrate 32 that are sequentially stacked. Among them, the ink layer 25, the carbon paste layer 26, the second silver paste layer 27, and the first silver paste layer 36 can be only set in the non-touch area 11. Any one of the remaining film layer structures can be set in the touch area 10, or set in the touch area 10 and at least part of the non-touch area 11 according to requirements. This application does not make specific limitations on this, as long as it can ensure the good touch function and good display function of the display module including the touch module 100.

[0124] Compared with the traditional touch module 100, the touch module 100 provided by this application has at least one less base film and OCA layer, making the touch module 100 more price-competitive, and making the film layer lamination process of the touch module 100 simpler and the overall yield level better. Moreover, the touch module 100 provided by this application has better flexibility, and the yield performance such as fracture defects is better, because the Sensor (the first touch layer 23) on the Glass will not be fractured due to the deformation of the substrate. In addition, for the touch module 100 provided by this application, problems such as Ag (silver) migration will also be greatly reduced.

[0125] The touch module 100 provided in the present application is configured such that the touch module 100 includes a first touch component 20 and a second touch component 30 which are stacked. Specifically, the first touch component 20 includes a first metal layer 22 directly formed on one surface of the transparent cover plate 21, and a first touch layer 23 formed on the side of the first metal layer 22 away from the transparent cover plate 21. The second touch layer 31 in the second touch component 30 is bonded to the side of the first touch layer 23 away from the first metal layer 22. It can be seen that by arranging the first touch layer 23 on the side of the first metal layer 22 away from the transparent cover plate 21, that is, using the transparent cover plate 21 and the first metal layer 22 on its surface as the preparation substrate for the first touch layer 23, it is possible to avoid separately providing a preparation substrate for the first touch layer 23, reduce the setting of at least one film layer, thereby facilitating the reduction of the overall thickness of the touch module 100, meeting the thin design requirements of the display device corresponding to the touch module 100, and at the same time simplifying the preparation process flow of the touch module 100.

[0126] Figure 4 It is a schematic diagram of a display device provided by an embodiment of the present application. Figure 5 Provided by an embodiment of the present application Figure 4 A cross-sectional schematic diagram of BB' in Figures 1 - 3 Please refer to Figure 4 and Figure 5 Based on the same inventive concept, the present application further provides a display device 200. The display device 200 includes a touch module 100, and the touch module 100 is any one of the touch modules 100 provided by the present application.

[0127] It further includes a display panel 300, and the touch module 100 is located on the light-emitting surface side of the display panel 300.

[0128] Specifically, the display device 200 includes a display panel 300 and a touch module 100 located on the light-emitting surface side of the display panel 300. The transparent cover plate 21 in the first touch component 20 of the touch module 100 serves as the protective cover plate in the display device 200, eliminating the need to provide an additional protective cover plate on the surface of the touch module 100 away from the display panel 300. That is, the transparent cover plate 21 provided by the present application can be used both as the protective cover plate of the display device 200 and as the preparation substrate for the first touch layer 23, thereby reducing the number of film layer structures in the display device 200, facilitating the thin design trend of the display device 200, and also simplifying the preparation process flow of the display device 200. In addition, it reduces the fingerprint distance, which is beneficial to improving the touch sensitivity of the display device 200, and also reduces the distance between the display panel 300 and the light-emitting surface of the display device 200, thus facilitating the improvement of the light transmission effect of the display device 200 to enhance the display effect of the display device 200. In this way, it is beneficial to further improve the user experience.

[0129] It should be noted that for the embodiments of the display device 200 provided in the embodiments of the present application, reference may be made to the embodiments of the touch control module 100 described above, and repeated descriptions will not be elaborated here. The display device 200 provided in the present application may be: a mobile phone, a tablet computer, a television, a touch controller, a display, a notebook computer, a digital photo frame, a navigator, a wearable device, an Internet of Things device, or any product and component having display and touch control functions. The embodiments disclosed in the present application are not limited thereto.

[0130] Figure 6 The following is a preparation flowchart of a touch control module provided for an embodiment of the present application. Please refer to Figure 1 、 Figure 2 、 Figure 4 、 Figure 5 and Figure 6 . Based on the same inventive concept, the present application further provides a preparation method for a touch control module 100, including steps 101-step 105, where:

[0131] Step 101: Provide a transparent cover plate 21;

[0132] Step 102: Prepare a first metal layer 22 on one side surface of the transparent cover plate 21 away from the touch surface of the touch control module 100;

[0133] Step 103: Prepare a first touch layer 23 on one side of the first metal layer 22 away from the transparent cover plate 21 to obtain a first touch component 20; wherein, the first touch component 20 includes a transparent cover plate 21, a first metal layer 22, and a first touch layer 23;

[0134] Step 104: Provide a second touch component 30 including at least a second touch layer 31;

[0135] Step 105: Bond the second touch component 30 to one side of the first touch layer 23 away from the first metal layer 22;

[0136] Among them, the first touch layer 23 and the second touch layer 31 are used to implement the touch control function of the touch control module 100.

[0137] Specifically, the present application further provides a preparation method for a touch control module 100, including performing step 101 to provide a transparent cover plate 21, and the transparent cover plate 21 may specifically be the cover plate (protective cover plate) of the display device 200 including the touch control module 100, that is, reusing the cover plate of the display device 200 as the film layer structure of the first touch component 20 in the present application.

[0138] Step 102 is performed to prepare a first metal layer 22 on a surface of the transparent cover plate 21 provided in step 101, which is away from the touch surface of the touch module 100. Then, step 103 is performed to prepare a first touch layer 23 on a side of the first metal layer 22 away from the transparent cover plate 21, so as to obtain a first touch component 20 including the transparent cover plate 21, the first metal layer 22, and the first touch layer 23 through steps 101-step 103.

[0139] It can be seen that in the preparation of the first touch component 20 in the touch module 100 provided in this application, the first touch layer 23 can directly use the transparent cover plate 21 and the first metal layer 22 as its preparation substrate, without separately setting a preparation substrate for the first touch layer 23, which is beneficial to reducing the number of film layer structures in the touch module 100. Moreover, reusing the transparent cover plate 21 and the first metal layer 22 as the preparation substrate of the first touch layer 23 simplifies the preparation process of the touch module 100 compared with separately setting a preparation substrate for the first touch layer 23, and also reduces the overall film layer thickness of the touch module 100, which is beneficial to the thinning design trend of the display device 200 including the touch module 100.

[0140] In addition, in the first touch component 20 provided in this application, the first metal layer 22 is prepared on a surface of the transparent cover plate 21 away from the touch surface of the touch module 100. The setting of the first metal layer 22 can increase the bonding force between the transparent cover plate 21 and the first touch layer 23, and avoid the situation of coating peeling after the first touch layer 23 is manufactured. The setting of the first metal layer 22 between the transparent cover plate 21 and the first touch layer 23 improves the bonding stability between the film layer structures of the first touch component 20, which is beneficial to improving the service life of the touch module 100, and further beneficial to improving the preparation yield and service life of the display device 200 including the touch module 100.

[0141] The preparation method of the touch module 100 further includes step 104. Step 104 can be performed after step 103, or before step 101, or between any two of steps 101-step 103. This application does not make specific limitations on this; step 104 is performed to provide a second touch component 30 including at least a second touch layer 31. Then, step 105 is performed after steps 103 and 104 to bond the second touch component 30 to a side of the first touch layer 23 away from the first metal layer 22, so as to complete the assembly of the touch module 100 including the first touch component 20 and the second touch component 30.

[0142] Among them, the second touch layer 31 in the second touch component 30 can be set to adhere to the side of the first touch layer 23 in the first touch component 20 away from the first metal layer 22. For the adhesion between the first touch layer 23 and the second touch layer 31, an optical adhesive layer 40 with good light transmittance can be selected. For example, OCA (Optically Clear Adhesive, optical transparent adhesive film material) can be used to achieve the adhesion and fixation between the first touch layer 23 and the second touch layer 31, and the OCA is located between the first touch layer 23 and the second touch layer 31, which is also beneficial to achieving the insulation between the first touch layer 23 and the second touch layer 31, thereby being beneficial to ensuring the good touch function of the first touch layer 23 and the second touch layer 31 for realizing the touch module 100.

[0143] That is, the touch module 100 provided by the present application, in the thickness direction of the touch module 100, at least includes a transparent cover plate 21, a first metal layer 22, a first touch layer 23, an OCA optical adhesive layer 40, and a second touch layer 31 that are sequentially stacked. The first metal layer 22 is provided between the transparent cover plate 21 and the first touch layer 23 to improve the bonding force between the transparent cover plate 21 and the first touch layer 23; however, this is only an optional setting method provided by the present application, and the present application is not limited thereto. For example, the first touch layer 23 can also be directly prepared on the surface of the transparent cover plate 21 on the side away from the touch surface of the touch module 100, so as to further streamline the preparation of the first metal layer 22, which is beneficial to further reducing the overall thickness of the touch module 100 and further reducing the preparation process flow of the touch module 100.

[0144] Among them, an optional implementation manner provided by the present application is that in the thickness direction of the touch module 100, the thickness range of the first touch layer 23 selected for plating is 1nm - 60nm. For example, the thickness of the first touch layer 23 can be selected to be 20nm, 30nm, 50nm, etc.; the preparation of the first touch layer 23 less than 1nm requires a high-precision preparation process, which will increase the preparation cost of the touch module 100. If the first touch layer 23 is prepared to be greater than 60nm, it will significantly increase the thickness of the touch module 100, which is not conducive to the thin design requirements of the display device 200 including the touch module 100 at present. Therefore, selecting the preparation thickness of the first touch layer 23 between 1nm and 60nm is beneficial to ensuring that the touch module 100 has a small production cost and can ensure the thinness of the relevant display device 200.

[0145] Furthermore, the present application does not limit whether other film layer structures are further provided between the first touch layer 23 and the OCA optical adhesive layer 40. Other film layer structures can be provided between the first touch layer 23 and the OCA optical adhesive layer 40 according to requirements, so as to ensure the required display function on the basis of ensuring the good touch function of the display device 200 including the touch module 100.

[0146] It should also be supplemented that the present application does not limit the preparation material of the first metal layer 22 disposed between the transparent cover plate 21 and the first touch layer 23, as long as the setting of the first metal layer 22 can improve the bonding effect between the transparent cover plate 21 and the first touch layer 23.

[0147] It should be noted that setting the first metal layer 22 between the transparent cover plate 21 and the first touch layer 23 to increase the bonding effect between the transparent cover plate 21 and the first touch layer 23 is only an optional implementation manner based on existing materials. With the development of technology, if there are other materials that can achieve the effect of improving the bonding force between the transparent cover plate 21 and the first touch layer 23, a film layer made of other materials can also be selected and disposed between the transparent cover plate 21 and the first touch layer 23 to improve the bonding effect between the transparent cover plate 21 and the first touch layer 23. In addition, with the development of technology, if there is a material for making the first touch layer 23 that can be used as a touch layer and has a good bonding force with the transparent cover plate 21, this material can also be used to directly prepare a touch layer on the surface of the transparent cover plate 21 on the side away from the touch module 100 to form the first touch component 20.

[0148] Please continue to refer to Figure 1 、 Figure 2 and Figures 4 - 6 , in an exemplary embodiment, for the above-mentioned step 102 of preparing the first metal layer 22 on the surface of the transparent cover plate 21 on the side away from the touch module 100, the specific implementation can be:

[0149] Prepare a metal silicon layer on the surface of the transparent cover plate 21 on the side away from the touch module 100.

[0150] Specifically, for the content of preparing the first metal layer 22 on the surface of the transparent cover plate 21 on the side away from the touch module 100 in step 102, the specific implementation can be to prepare a metal silicon layer on the surface of the transparent cover plate 21 on the side away from the touch module 100; that is, the optional preparation material of the first metal layer 22 is metal silicon.

[0151] Since the transparent cover plate 21 of the display device usually uses a glass cover plate, that is, the preparation material of the transparent cover plate 21 of the first touch component 20 is generally glass. The chemical bond and intermolecular force between metal silicon and glass have a stronger binding force, and there is also a good binding force between metal silicon and the materials currently used in the display field to make the touch layer. It can be seen that setting a metal silicon layer between the transparent cover plate 21 and the first touch layer 23 is beneficial to improving the binding force between the transparent cover plate 21 and the first touch layer 23, so as to improve the assembly structure stability of the first touch component 20, and is beneficial to reducing or eliminating the situation of fracture and fragmentation of the touch module 100, thereby improving the service life of the display device 200 including the touch module 100.

[0152] In addition, the price of metal silicon is relatively cheap, which is beneficial to reducing the manufacturing cost of the touch module 100; metal silicon has good stability, which is beneficial to improving the reliability and service life of the touch module 100; metal silicon has a light weight, which is beneficial to ensuring that the touch module 100 has a light weight; furthermore, using the metal silicon layer as the first metal layer 22 in the first touch component 20 is beneficial to ensuring that the display device 200 containing the touch module 100 has a low manufacturing cost, good reliability and service life, and a light weight.

[0153] It should be added that in the embodiment provided in this application, setting a metal silicon layer between the transparent cover plate 21 and the first touch layer 23 is to avoid the problem of coating peeling that easily occurs when the first touch layer 23 is directly prepared on the surface of the glass - material transparent cover plate 21; with the development of technology, if there are other materials that can achieve the effect of improving the binding force between the transparent cover plate 21 and the first touch layer 23, a film layer made of other materials can also be selected and set between the transparent cover plate 21 and the first touch layer 23 to improve the binding effect between the transparent cover plate 21 and the first touch layer 23.

[0154] Among them, along the thickness direction of the touch module 100, the preparation thickness of the first metal layer 22 (metal silicon) can be selected between 1nm and 30nm. For example, the thickness can also be selected to be 2nm, 5nm, 12nm, 18nm, etc. A metal silicon layer with a thickness less than 1nm requires very high preparation precision, which will greatly increase the manufacturing cost of the touch module 100. A metal silicon layer with a thickness greater than 30nm will cause a significant increase in the overall thickness of the touch module 100, which is not conducive to the thin - type design trend of the relevant display device 200. Therefore, in this application, the preparation thickness of the metal silicon layer is selected between 1nm and 30nm, which can not only reduce the manufacturing cost of the touch module 100, but also ensure the thin - type design of the relevant display device 200, and can also improve the binding force and stability between at least some film layers of the touch module 100.

[0155] Figure 7Another preparation flowchart of the touch module provided by the embodiment of the present application. It should be noted that Figure 7 "Preparing the second touch layer on the side of the second metal layer facing the touch surface of the touch module" shown in step 107 corresponds to "Step 107, preparing the second touch layer 31 on the side of the transparent substrate 32 facing the touch surface of the touch module 100" in the following content. Since Figure 7 shows the preparation process of all the film layers of a touch module, therefore Figure 7 the wording in some processes in Figure 7 has been adjusted compared to the description in the following text content to make Figure 7 the process steps in

[0156] Please refer to Figure 1 and Figures 3 - 5 Refer to Figure 7 . In an exemplary embodiment, before performing step 104 to provide the second touch component 30 including at least the second touch layer 31, steps 106 and 107 are further included, where:

[0157] Step 106, providing the transparent substrate 32;

[0158] Step 107, preparing the second touch layer 31 on the side of the transparent substrate 32 facing the touch surface of the touch module 100 to obtain the second touch component 30.

[0159] Specifically, the present application provides a method for preparing the second touch component 30. Specifically, before performing step 104 to provide the second touch component 30 including at least the second touch layer 31, the steps for preparing the second touch component 30 should be included, specifically at least steps 106 and 107. Among them, step 106 is used to provide the transparent substrate 32 as the preparation substrate for the second touch layer 31, and then step 107 is performed to prepare the second touch layer 31 on the side of the transparent substrate 32 facing the touch surface of the touch module 100 to achieve the preparation of the second touch component 30.

[0160] Among them, an optional implementation manner provided by the present application is that, along the thickness direction of the touch control module 100, the thickness range of the second touch control layer 31 is selected to be 5 nm - 100 nm. For example, the thickness of the second touch control layer 31 can be selected to be 30 nm, 50 nm, etc.; the preparation of the second touch control layer 31 with a thickness less than 5 nm requires a high-precision preparation process, which will increase the preparation cost of the touch control module 100. If the second touch control layer 31 is prepared with a thickness greater than 100 nm, it will significantly increase the thickness of the touch control module 100, which is not conducive to the thin design requirement of the display device 200 including the touch control module 100 at present. Therefore, selecting the preparation thickness of the second touch control layer 31 between 5 nm and 100 nm is beneficial to ensuring that the touch control module 100 has a relatively low production cost and can ensure the thin design of the relevant display device 200.

[0161] It should be added that the present application does not specifically limit whether there are other film layer structures in the second touch control component 30 except for the transparent substrate 32 and the second touch control layer 31. Other required film layer structures can be provided on one or both sides of the second touch control layer 31 facing and / or away from the transparent substrate 32 according to requirements.

[0162] It should also be added that the present application does not specifically limit the preparation material of the transparent substrate 32. For example, PET (Polyethylene terephthalate) can be selected to make the transparent substrate 32. PET has good light transmittance, good flexibility and stability, which can not only ensure the structural stability of the second touch control component 30, but also ensure the light transmittance and service life of the second touch control component 30. In addition, when PET is used as the preparation substrate of the second touch control layer 31, the PET transparent substrate 32 can be made very thin, which is beneficial to reducing the overall thickness of the touch control module 100, and thus beneficial to the thin design of the display device 200 including the touch control module 100.

[0163] It should also be added that the present application does not specifically limit whether the transparent substrate 32 and the transparent cover plate 21 are rigid substrates or flexible substrates. The transparent substrate 32 and the transparent cover plate 21 can be selected as rigid substrates or flexible substrates according to design requirements. Among them, the rigid substrate can be selected from glass and silicon wafers, and the flexible substrate can be selected from PET (Polyethylene terephthalate), PMMA (Polymethyl methacrylate), and PC (Polycarbonate).

[0164] It should also be supplemented that the first touch layer 23 and the second touch layer 31 can be optionally prepared as any one of ITO (Indium-Tin-Oxide, indium tin oxide thin film), SNW (Silver Nanowire, silver nanowire thin film), MM (Metal Mesh, metal mesh thin film), or other selectable film layers that can form touch electrodes.

[0165] Please continue to refer to Figure 1 、 Figures 3 - 5 and Figure 7 In an exemplary embodiment, before performing step 107 to prepare the second touch layer 31 on one side of the transparent substrate 32 facing the touch surface of the touch module 100, it further includes:

[0166] Step 108, preparing a second metal layer 33 on one side of the transparent substrate 32 facing the touch surface of the touch module 100.

[0167] Specifically, the present application also provides a method for preparing the second touch component 30. Specifically, before performing the content of preparing the second touch layer 31 on one side of the transparent substrate 32 facing the touch surface of the touch module 100 in step 107, step 108 can be first performed to prepare a second metal layer 33 on one side of the transparent substrate 32 facing the touch surface of the touch module 100. The second metal layer 33 can be made of a material having a strong bonding force with at least one of the transparent substrate 32 and the second touch layer 31, so as to enhance the bonding force between the second touch layer 31 and the transparent substrate 32 and avoid the problem of coating peeling when the second touch layer 31 is directly prepared on the surface of the transparent substrate 32, thereby facilitating the improvement of the assembly structure stability of the second touch component 30 and reducing or eliminating the occurrence of breakage and fragmentation of the touch module 100, and thus improving the service life of the display device 200 including the touch module 100.

[0168] Among them, along the thickness direction of the touch module 100, the preparation thickness of the second metal layer 33 (metal silicon) can be selected between 2 nm and 30 nm. For example, its thickness can be selected to be 5 nm, 12 nm, 18 nm, etc. A metal silicon layer with a thickness less than 2 nm requires very high preparation accuracy, which will greatly increase the preparation cost of the touch module 100. A metal silicon layer with a thickness greater than 30 nm will cause a significant increase in the overall thickness of the touch module 100, which is not conducive to the thin design trend of the related display device 200. Therefore, the present application selects the preparation thickness of the metal silicon layer between 2 nm and 30 nm, which can not only reduce the preparation cost of the touch module 100, but also ensure the thin design of the related display device 200, and can also improve the bonding force and stability between at least some film layers of the touch module 100.

[0169] Please continue to refer to Figure 1 、Figures 3 - 5 and Figure 7 , in an exemplary embodiment, before performing step 107 to prepare the second metal layer 33 on one side of the transparent substrate 32 facing the touch surface of the touch module 100, steps 109 and 110 may be performed first, where:

[0170] Step 109, prepare a first anti-reflection layer 34 on one side surface of the transparent substrate 32 facing the touch surface of the touch module 100;

[0171] Step 110, prepare a primer layer 35 on one side surface of the first anti-reflection layer 34 away from the transparent substrate 32.

[0172] Specifically, the present application also provides a method for preparing the second touch component 30. Specifically, before performing the content of preparing the second touch layer 31 on one side of the transparent substrate 32 facing the touch surface of the touch module 100 in step 107, step 109 may be performed first to prepare a first anti-reflection layer 34 on one side surface of the transparent substrate 32 facing the touch surface of the touch module 100. The anti-reflection film (first anti-reflection layer 34) is beneficial to increasing the light transmittance of the second touch component 30 and reducing the reflectance, so that the display device 200 including the touch module 100 has a better visual effect. Then, step 110 is performed to prepare a primer layer 35 on one side surface of the first anti-reflection layer 34 away from the transparent substrate 32. Specifically, a silicon dioxide layer may be deposited on one side surface of the first anti-reflection layer 34 away from the transparent substrate 32, so that the primer layer 35 has the characteristics of stable dielectric properties and good moisture resistance, which is beneficial to improving the service life and yield of the touch module 100. In addition, the preparation material of the primer layer 35 may also be selected as a combination of silicon dioxide and silicon nitride, or only silicon nitride is selected.

[0173] Among them, the preparation material of the first anti-reflection layer 34 may be selected from silicon dioxide, zirconia, and titanium oxide. The first anti-reflection layer 34 may be prepared on one side surface of the transparent substrate 32 facing the touch surface of the touch module 100 by coating. Specifically, methods such as roll coating or slot coating may be selected for coating the first anti-reflection layer 34.

[0174] An alternative embodiment provided by the present application is that, along the thickness direction of the touch module 100, the coating thickness of the first anti-reflection layer 34 can range from 0.05 μm to 20 μm. For example, its thickness can be selected to be 0.8 μm. The preparation of the first anti-reflection layer 34 with a thickness less than 0.05 μm requires a high-precision preparation process, which will increase the preparation cost of the touch module 100 and it is difficult to ensure the uniformity of the preparation of the first anti-reflection layer 34. If the first anti-reflection layer 34 is prepared to be greater than 20 μm, it will significantly increase the thickness of the touch module 100, which is not conducive to the thin design requirements of the display device 200 including the touch module 100 at present. Therefore, selecting the coating thickness of the first anti-reflection layer 34 between 0.05 μm and 20 μm is beneficial to ensuring that the touch module 100 has a relatively low production cost, can ensure the thinness of the relevant display device 200, and is also conducive to the uniform coating of the first anti-reflection layer 34 to ensure the uniformity of the preparation of the first anti-reflection layer 34, which is beneficial to improving the display effect of the relevant display device 200.

[0175] Along the thickness direction of the touch module 100, the preparation thickness of the silicon dioxide layer (the underlayer 35) can range from 2 nm to 30 nm. For example, its thickness can be selected to be 10 nm.

[0176] It should be added that the present application proposes to provide the first anti-reflection layer 34 and the underlayer 35 between the transparent substrate 32 and the second metal layer 33 of the second touch component 30, which is only an alternative embodiment provided by the present application, but the present application is not limited thereto. Other film layer structures can also be selected between the transparent substrate 32 and the second metal layer 33, or other film layer structures can be further provided on the basis of including the first anti-reflection layer 34 and / or the underlayer 35, as long as the good touch function of the touch module 100 and the good display function of the display device 200 including the touch module 100 can be ensured.

[0177] Please continue to refer to Figure 1 、 Figures 3 - 5 and Figure 7 , in an exemplary embodiment, after performing step 107 to prepare the second touch layer 31 on the side of the transparent substrate 32 facing the touch surface of the touch module 100, it further includes:

[0178] Step 120, printing a first silver paste layer 36 on the surface of the second touch layer 31 away from the transparent substrate 32.

[0179] Specifically, the present application further provides a method for preparing the second touch component 30. Specifically, after performing the step of preparing the second touch layer 31 on the side of the transparent substrate 32 facing the touch surface of the touch module 100 in step 107, step 120 may further be included. A first silver paste layer 36 is printed on the surface of the second touch layer 31 away from the transparent substrate 32. The first silver paste layer 36 may be disposed on the surface of the second touch layer 31 close to the first touch layer 23, and the first silver paste layer 36 is disposed in the edge area of the touch module 100, that is, the first silver paste layer 36 may be disposed in the non-display area of the display device 200 including the touch module 100. The first silver paste layer 36 can be used to form a conductive Pad (liner) corresponding to the touch trace of the touch layer, so as to realize the conduction of the conductive line through the silver paste.

[0180] Among them, the first silver paste layer 36 can be prepared on the surface of the second touch layer 31 away from the transparent substrate 32 by printing.

[0181] That is, as Figure shown, the preparation process of the second touch component 30 in the touch module 100 should be: step 106, providing a transparent substrate; step 109, preparing a first anti-reflection layer on the side surface of the transparent substrate facing the touch surface of the touch module; step 110, preparing a primer layer on the surface of the first anti-reflection layer away from the transparent substrate; step 108, preparing a second metal layer on the side of the primer layer facing the touch surface of the touch module; step 107, preparing a second touch layer on the side of the second metal layer facing the touch surface of the touch module; step 120, printing a first silver paste layer on the surface of the second touch layer away from the transparent substrate to obtain the second touch component.

[0182] Please continue to refer to ​ 、 ​ and ​ In an exemplary embodiment, when step 108 is executed, preparing the second metal layer 33 on the side of the transparent substrate 32 facing the touch surface of the touch module 100 may specifically be executed as:

[0183] Prepare a metal silicon layer on the side of the transparent substrate 32 facing the touch surface of the touch module 100.

[0184] Specifically, regarding the content of preparing the second metal layer 33 on the side of the transparent substrate 32 facing the touch surface of the touch module 100 in step 108, it can be specifically selected to prepare a metal silicon layer on the side of the transparent substrate 32 facing the touch surface of the touch module 100. That is, the second metal layer 33 can be specifically selected as the metal silicon layer. There is a good bonding force between the metal silicon and the materials currently used in the display field for making the touch layer, as well as between the materials used for making the transparent substrate 32. Therefore, by setting a metal silicon layer between the second touch layer 31 and the transparent substrate 32, it is beneficial to improve the bonding force between the second touch layer 31 and the transparent substrate 32 and avoid the problem of coating peeling when the second touch layer 31 is directly prepared on the surface of the transparent substrate 32.

[0185] It should be added that with the development of technology, if there are other materials that can achieve the effect of improving the bonding force between the second touch layer 31 and the transparent substrate 32, a film layer made of other materials can also be selected and set between the second touch layer 31 and the transparent substrate 32.

[0186] It should also be added that the present application does not specifically limit whether there are other film layer structures between the second metal layer 33 of the transparent substrate 32 and between the second metal layer 33 and the second touch layer 31. Other film layer structures can be set between the second metal layer 33 of the transparent substrate 32 and / or between the second metal layer 33 and the second touch layer 31 according to requirements to ensure the good touch function and display function of the display device 200 including the touch module 100.

[0187] It should also be added that in the embodiment provided by the present application, a second metal layer 33 (metal silicon layer) is set between the transparent substrate 32 and the second touch layer 31 to improve the bonding force between the transparent substrate 32 and the second touch layer 31. This is just an optional setting method provided by the present application, and the present application is not limited thereto. For example, it can also be selected to directly prepare the second touch layer 31 on the surface of the side of the transparent substrate 32 facing the touch surface of the touch module 100, thereby further streamlining the film layer of the second metal layer 33, which is beneficial to further reduce the overall thickness of the touch module 100 and further reduce the manufacturing process flow of the touch module 100. That is, with the development of technology, if there is a material that can be used as a touch layer and has a good bonding force with the transparent substrate 32, this material can be used to directly prepare the touch layer on the surface of the side of the transparent substrate 32 facing the touch surface of the touch module 100.

[0188] Please continue to refer to ​ 、 ​ and ​ , in an exemplary embodiment, before preparing the first touch layer 23 on the side of the first metal layer 22 away from the transparent cover plate 21 in step 103, it further includes:

[0189] Step 130: Prepare a second anti-reflection layer 24 on the surface of the first metal layer 22 away from the transparent cover plate 21.

[0190] Specifically, the present application also provides an alternative preparation method for the first touch component 20. Before performing the content of preparing the first touch layer 23 on the side of the first metal layer 22 away from the transparent cover plate 21 in step 103, first perform step 130 to prepare a second anti-reflection layer 24 on the surface of the first metal layer 22 away from the transparent cover plate 21. Among them, the second anti-reflection layer 24 can be prepared on the surface of the first metal layer 22 away from the transparent cover plate 21 by sputtering; the preparation material of the second anti-reflection layer 24 can be selected from silicon dioxide, silicon nitride, niobium oxide, and titanium oxide. That is, the production materials of the second anti-reflection layer 24 and the first anti-reflection layer 34 may not be exactly the same. Among them, the sputtering sequence of the second anti-reflection layer 24 is to first sputter silicon dioxide and / or silicon nitride, and then sputter the optical layers niobium oxide and titanium oxide.

[0191] By preparing the second anti-reflection layer 24 between the first metal layer 22 and the first touch layer 23, the second anti-reflection layer 24 is beneficial to increasing the light transmittance of the first touch component 20 and reducing the reflectivity, so that the display device 200 including the touch module 100 has a better visual effect; at the same time, the anti-reflection film (second anti-reflection layer 24) is also beneficial to reducing the visual contrast between the area where the touch traces or touch electrodes are arranged in the touch module 100 and the vacant area between the touch traces or touch electrodes, thereby being beneficial to improving the display effect of the display device 200 including the touch module 100 and the appearance consistency when in the non-display state.

[0192] The present application also provides an alternative implementation manner. Along the thickness direction of the touch module 100, the sputtering thickness value range of the second anti-reflection layer 24 can be between 0.05 μm and 20 μm. For example, its thickness can be selected to be 0.8 μm. The preparation of the second anti-reflection layer 24 with a thickness less than 0.05 μm requires a high-precision preparation process, which will increase the preparation cost of the touch module 100 and it is difficult to ensure the preparation uniformity of the second anti-reflection layer 24. If the second anti-reflection layer 24 is prepared with a thickness greater than 20 μm, it will significantly increase the thickness of the touch module 100, which is not conducive to the thin design requirements of the current display device 200 including the touch module 100. Therefore, selecting the sputtering thickness of the second anti-reflection layer 24 between 0.05 μm and 20 μm is beneficial to ensuring that the touch module 100 has a relatively low production cost, and can ensure the thinness of the relevant display device 200. At the same time, it is also beneficial to the uniform sputtering of the second anti-reflection layer 24 to ensure the preparation uniformity of the second anti-reflection layer 24, which is beneficial to improving the display effect of the relevant display device 200.

[0193] Among them, the silicon dioxide and / or silicon nitride in the second light-blocking layer 24 is equivalent to the underlayer film layer in the second light-blocking layer 24, and the prepared thickness of the underlayer film layer can be selected to account for 5%-35% of the total thickness of the second light-blocking layer 24.

[0194] Please continue to refer to ​ 、 ​ and ​ , in an exemplary embodiment, the touch module 100 includes a touch area 10 and a non-touch area 11 that at least partially surrounds the touch area 10;

[0195] After performing step 103 of preparing the first touch layer 23 on the side of the first metal layer 22 away from the transparent cover plate 21, steps 140-step 160 can be further performed, where:

[0196] Step 140, at least within the non-touch area 11, print an ink layer 25 on the surface of the first touch layer 23 away from the first metal layer 22;

[0197] Step 150, print a carbon paste layer 26 on the surface of the ink layer 25 away from the first touch layer 23;

[0198] Step 160, print a second silver paste layer 27 on the surface of the carbon paste layer 26 away from the ink layer 25.

[0199] Specifically, the touch module 100 provided in this application includes a touch area 10 and a non-touch area 11 surrounding the touch area 10. Among them, the touch module 100 at least further includes, by performing step 140, printing an ink layer 25 on the surface of the first touch layer 23 away from the first metal layer 22 at least within the non-touch area 11, and then performing step 150, printing a carbon paste layer 26 on the surface of the ink layer 25 away from the first touch layer 23, and then performing step 160, printing a second silver paste layer 27 on the surface of the carbon paste layer 26 away from the ink layer 25.

[0200] Among them, the ink layer 25, the carbon paste layer 26 and the second silver paste layer 27 can be used to cover the entire non-touch area 11, which is beneficial to the color uniformity of the non-display area of the display device 200 corresponding to the touch module 100, improves the aesthetics of the display device 200, and at the same time is also beneficial to avoiding the problem of light leakage in the non-display area of the display device 200 and improving the display effect of the display device 200. In addition, at least the second silver paste layer 27 can be used to prepare the conductive Pad (liner) corresponding to the touch trace in the first touch layer 23 to realize the conduction of the conductive line through the silver paste.

[0201] It should be added that the application proposes to provide an ink layer 25, a carbon paste layer 26, and a second silver paste layer 27 on the non-touch area 11 on the surface of the first touch layer 23 facing the second touch layer 31. This is only an optional implementation provided by the application. It is also possible to select any one of the ink layer 25, the carbon paste layer 26, and the second silver paste layer 27, or a combination of any two of them, and set them in the non-touch area 11 according to requirements. The application does not make specific limitations on this.

[0202] That is, as ​ shown, the preparation process of the first touch component 20 in the touch module 100 should be: Step 101, provide a transparent cover plate; Step 102, prepare a first metal layer on the surface of the transparent cover plate on the side away from the touch surface of the touch module; Step 130, prepare a second anti-reflection layer on the surface of the first metal layer away from the transparent cover plate; Step 103, prepare a first touch layer on the side of the second anti-reflection layer away from the transparent cover plate; Step 140, at least in the non-touch area, print an ink layer on the surface of the first touch layer away from the first metal layer; Step 150, print a carbon paste layer on the surface of the ink layer away from the first touch layer; Step 160, print a second silver paste layer on the surface of the carbon paste layer away from the ink layer to obtain the first touch component.

[0203] As ​ shown, after obtaining the first touch component and the second touch component, perform Step 105, bond the second touch component to the side of the first touch layer away from the first metal layer to obtain the touch module.

[0204] Another optional implementation provided by the application is to prepare at least one of the ink layer 25, the carbon paste layer 26, and the second silver paste layer 27 between the transparent cover plate 21 and the first touch layer 23. That is, on the side of the transparent cover plate 21 away from the touch surface of the touch module 100, after at least one of the ink layer 25, the carbon paste layer 26, and the second silver paste layer 27 is prepared, then the first touch layer 23 is prepared.

[0205] In addition, the first silver paste layer 36 and / or the second silver paste layer 27 can be prepared by printing or spraying. The application does not make specific limitations on this.

[0206] It should be understood that although the steps in the flowchart of the accompanying drawings are shown sequentially according to the indication of the arrows, these steps are not necessarily executed sequentially in the order indicated by the arrows. Unless there is a clear indication in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, at least a part of the steps in the accompanying drawings may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or steps or stages in other steps.

[0207] ​ The following is another preparation flowchart of the touch module provided by the embodiment of the present application. Please refer to ​ Refer to ​ , here is also an optional preparation process for the touch module 100: provide Glass (the transparent cover plate 21 made of glass material), clean the Glass, such as by using flat cleaning or ultrasonic cleaning, deposit metal silicon (the first metal layer 22) on the surface of the Glass on the side away from the touch surface of the touch module 100, deposit IM (Index Match, the second anti-reflection layer 24) on the surface of the metal silicon, deposit ITO (Indium Tin Oxide, indium tin oxide, the first touch layer 23) on the surface of the IM, perform dry etching on the ITO by using laser or etching paste or yellow light, print edge ink (the ink layer 25) on the surface of the ITO, and then print edge carbon paste (the carbon paste layer 26), and then print edge silver paste circuit (the second silver paste layer 27) to complete the preparation of the glass touch component. Among them, Glass can be selected to be etched with Ag and tempered.

[0208] Then, provide a PET substrate (the transparent substrate 32), coat an IM layer (the first anti-reflection layer 34) on the side of the PET substrate facing the touch surface of the touch module 100, bake it and perform Plasma (ion bombardment) on it, and then deposit silicon dioxide (the underlayer 35), and then deposit metal silicon (the second metal layer 33) on the surface of the underlayer 35, and then deposit ITO (the second touch layer 31), and then print silver paste (the first silver paste layer 36), and bake it, perform dry etching and water washing on it to complete the preparation of the substrate touch component.

[0209] Finally, bond the glass touch component and the substrate touch component. Specifically, bond the ITO of the glass touch component and the ITO of the substrate touch component through OCA optical glue, that is ​ the GF bonding in

[0210] The present application also provides the following optional process parameters when preparing the first touch layer on the side of the transparent cover plate away from the touch surface of the touch module:

[0211] Heating temperature: 80~120℃, Eg: 90℃;

[0212] Heating time: 8~15min, Eg: 10min;

[0213] Handling pressure: 1.0~9.0×10 -3~-5 Pa, Eg: 8.0×10 -3 Pa;

[0214] Plasma pressure: 1.0~9.0×10 -4~-6 Pa, Eg: 7.0×10 -4 Pa;

[0215] Film forming pressure: 1.0~9.0×10 -4~-6 Pa, Eg: 7.0×10 -4 Pa;

[0216] Target cavity argon purge flow rate: 200~500sccm, Eg: 250sccm;

[0217] Ion source RF-Plasma power: 1.5~3.0KW, Eg: 2KW;

[0218] Ion source RF-base power: 1.0~2.5KW, Eg: 1.5KW;

[0219] Ion source RF-target power: 1.0~2.5KW, Eg: 1.5KW;

[0220] Ion source RF-Plasma argon purge flow rate: 80~300sccm, Eg: 100sccm;

[0221] Ion source RF-Plasma oxygen purge flow: 50~200sccm, Eg: 80sccm;

[0222] Ion source RF-base oxygen purge flow: 80~300sccm, Eg: 150sccm;

[0223] Ion source RF-target oxygen purge flow rate: 80~300sccm, Eg: 150sccm;

[0224] Ion source RF-Plasma duration: 90~1200S, Eg: 600S;

[0225] The present application also provides a method for preparing a second touch layer on the side of the transparent substrate facing the touch surface of the touch module, wherein the process parameters that can be selected are as follows:

[0226] Heating temperature: room temperature ~ 80℃, Eg: room temperature;

[0227] Heating time: 0 - 10 min, Eg: 0 min;

[0228] Handling pressure: 0.5 - 9.0×10 -3~-4 Pa, Eg: 2.0×10 -3 Pa;

[0229] Plasma pressure: 0.5 - 9.0×10 -3~-5 Pa, Eg: 3.0×10 -3 Pa;

[0230] Film forming pressure: 0.5 - 9.0×10 -3~-5 Pa, Eg: 3.0×10 -3 Pa;

[0231] Argon purge flow rate in the target chamber: 100 - 400 sccm, Eg: 150 sccm;

[0232] Ion source RF - Plasma power: 0.6 - 2.0 KW, Eg: 1.5 KW;

[0233] Ion source RF - bottom layer power: 0.2 - 1.5 KW, Eg: 1.0 KW;

[0234] Ion source RF - target power: 0.2 - 1.5 KW, Eg: 1.0 KW;

[0235] Ion source RF - Plasma argon purge flow rate: 40 - 200 sccm, Eg: 60 sccm;

[0236] Ion source RF - Plasma oxygen purge flow rate: 20 - 100 sccm, Eg: 40 sccm;

[0237] Ion source RF - bottom layer oxygen purge flow rate: 40 - 200 sccm, Eg: 60 sccm;

[0238] Ion source RF - target oxygen purge flow rate: 40 - 200 sccm, Eg: 60 sccm;

[0239] Ion source RF - Plasma duration: 30 - 600 S, Eg: 120 S;

[0240] Among them, ℃ is the unit of temperature Celsius, Eg means for example, min is minute, Pa is the unit of air pressure Pascal, sccm is standard cubic centimeter per minute, KW is the unit of power kilowatt, S is second; RF is Radio Frequency, that is, radio frequency.

[0241] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the various technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as falling within the scope described in this specification.

[0242] The above-described embodiments merely represent several implementation manners of the present invention. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent shall be subject to the appended claims.

Claims

1. A touch module, characterized in that: Along the thickness direction of the touch module, the touch module includes a first touch component and a second touch component stacked together; The first touch assembly at least includes a transparent cover plate, a first metal layer and a first touch layer; wherein the first metal layer is prepared on a side of the transparent cover plate away from the touch surface of the touch module; the first touch layer is prepared on a side of the first metal layer away from the transparent cover plate; The second touch component at least includes a second touch layer, and the second touch component is adhered to a side of the first touch layer away from the first metal layer; The first touch layer and the second touch layer are used to implement the touch function of the touch module.

2. The touch module according to claim 1, wherein: The first metal layer is a metal silicon layer.

3. The touch module according to claim 1, wherein: The second touch component further includes: a transparent substrate, located on a side of the second touch layer away from the transparent cover plate; The second metal layer is located between the transparent substrate and the second touch layer.

4. The touch module according to claim 3, wherein: The second metal layer is a metal silicon layer.

5. The touch module according to claim 3, wherein: The second touch component further includes: A first shadow elimination layer is located between the transparent substrate and the second metal layer; a bottom layer, located between the first shadow-eliminating layer and the second metal layer; The first silver paste layer is located on a surface of the second touch layer on a side close to the first touch layer.

6. The touch module according to claim 1, wherein: The first touch component further includes: The second shadow elimination layer is located between the first metal layer and the first touch layer.

7. The touch module according to claim 1, wherein: The touch module includes a touch area and a non-touch area at least partially surrounding the touch area; At least the non-touch area further includes: an ink layer, located between the first touch layer and the second touch component; a carbon paste layer, located on a surface of the ink layer facing the second touch component; The second silver paste layer is located on a surface of the carbon paste layer facing the second touch component.

8. A display device, characterized in that: A touch module comprising any one of claims 1 to 7; It also includes a display panel, and the touch module is located on the light-emitting surface side of the display panel.

9. A method for preparing a touch module, characterized in that: include: Provide a transparent cover; forming a first metal layer on a surface of the transparent cover plate away from the touch surface of the touch module; A first touch layer is prepared on a side of the first metal layer away from the transparent cover plate to obtain a first touch assembly; wherein the first touch assembly includes the transparent cover plate, the first metal layer and the first touch layer; providing a second touch component including at least a second touch layer; bonding the second touch component to a side of the first touch layer away from the first metal layer; The first touch layer and the second touch layer are used to implement the touch function of the touch module.

10. The method for preparing a touch module according to claim 9, wherein: The step of preparing a first metal layer on a surface of the transparent cover plate away from the touch surface of the touch module comprises: A metal silicon layer is prepared on a surface of the transparent cover plate that is away from the touch surface of the touch module.

11. The method for preparing a touch module according to claim 9, wherein: Before providing the second touch component including at least the second touch layer, the method further includes: providing a transparent substrate; A second touch layer is prepared on a side of the transparent substrate facing the touch surface of the touch module to obtain a second touch component.

12. The method for preparing a touch module according to claim 11, wherein: Before forming the second touch layer on the side of the transparent substrate facing the touch surface of the touch module, the method further includes: A second metal layer is formed on a side of the transparent substrate facing the touch surface of the touch module.

13. The method for preparing a touch module according to claim 12, wherein: Before forming the second metal layer on the side of the transparent substrate facing the touch surface of the touch module, the method further includes: A first shadow elimination layer is formed on a surface of the transparent substrate facing the touch surface of the touch module; A primer layer is prepared on a surface of the first shadow eliminating layer which is away from the transparent substrate.

14. The method for preparing a touch module according to claim 12, wherein: After the second touch layer is formed on the side of the transparent substrate facing the touch surface of the touch module, the method further includes: A first silver paste layer is printed on a surface of the second touch layer away from the transparent substrate.

15. The method for preparing a touch module according to claim 12, wherein: The step of preparing a second metal layer on a side of the transparent substrate facing the touch surface of the touch module comprises: A metal silicon layer is prepared on a side of the transparent substrate facing the touch surface of the touch module.

16. The method for preparing a touch module according to claim 9, wherein: Before forming the first touch layer on the side of the first metal layer away from the transparent cover plate, the method further includes: A second shadow eliminating layer is prepared on a surface of the first metal layer away from the transparent cover plate.

17. The method for preparing a touch module according to claim 9, wherein: The touch module includes a touch area and a non-touch area at least partially surrounding the touch area; After the first touch layer is formed on the side of the first metal layer away from the transparent cover plate, the method further includes: At least in the non-touch area, printing an ink layer on a surface of the first touch layer away from the first metal layer; Printing a carbon paste layer on a surface of the ink layer away from the first touch layer; A second silver paste layer is printed on a surface of the carbon paste layer away from the ink layer.

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