Supercapacitor module box and temperature control method thereof

Abstract

The present invention provides a supercapacitor module box and a temperature control method thereof, comprising a shell, a plurality of speed-regulating fans arranged on the front side of the shell, and a plurality of supercapacitor modules and a plurality of heat dissipation components arranged inside the shell, and a plurality of air inlets are arranged on the rear side of the shell; an epoxy board is provided at the bottom of each supercapacitor module; and a first glue potting layer is provided between every two adjacent capacitor cells in each supercapacitor module, a second glue potting layer is provided between each supercapacitor module and the corresponding epoxy board, and a third glue potting layer is provided on the outer side of the supercapacitor structure formed by each supercapacitor module and the corresponding epoxy board to form a glue potting capacitor structure, and each glue potting capacitor structure is provided between every two adjacent heat dissipation components in the plurality of heat dissipation components and in contact with the adjacent heat dissipation components to improve the heat dissipation effect, thereby improving the performance of the supercapacitor module box and extending the service life.

Description

Technical Field

[0001] The present invention relates to the technical field of supercapacitors, and in particular to a supercapacitor module box and a temperature control method thereof. Background Art

[0002] With the acceleration of urbanization and the increase in high-rise buildings, elevator energy consumption is becoming increasingly prominent. Failure to effectively utilize the regenerative energy generated by traditional elevators during braking and deceleration not only wastes energy but also increases the burden on the power grid. Supercapacitor modules, with their high power density, fast charge and discharge capabilities, and long life, are an ideal choice for elevator energy-saving systems.

[0003] However, during operation, especially during braking and deceleration, elevator systems generate a large amount of regenerative energy. High-rate charging and discharging also generate significant heat, making heat dissipation a key bottleneck restricting performance and reliability. Traditional cooling solutions often use air cooling or metal heat dissipation components. However, air cooling systems are noisy, energy-intensive, and difficult to achieve uniform temperature. Heat dissipation efficiency decreases significantly, especially in enclosed environments. While metal heat dissipation components can conduct heat locally, they are limited by contact thermal resistance and spatial layout, making them unable to effectively cover the complex internal structure of the module. This leads to uneven temperature distribution, and localized overheating can easily cause capacitance decay, increased internal resistance, and even the risk of thermal runaway in the supercapacitor module box. Summary of the Invention

[0004] The embodiments of the present invention provide a supercapacitor module box and a temperature control method thereof, aiming to solve the problem in the prior art that the supercapacitor module box has poor heat dissipation effect, resulting in limited performance and lifespan.

[0005] In the first aspect, an embodiment of the present invention provides a supercapacitor module box, comprising: a shell, multiple supercapacitor modules, multiple heat dissipation components and multiple speed-regulating fans, wherein the multiple speed-regulating fans are arranged on the front side of the shell, and multiple air inlets are arranged on the rear side of the shell; the multiple supercapacitor modules and the multiple heat dissipation components are all arranged inside the shell, and an epoxy board is provided at the bottom of each supercapacitor module in the multiple supercapacitor modules; wherein a first glue potting layer is provided between every two adjacent capacitor cells in each supercapacitor module, and a second glue potting layer is provided between each supercapacitor module and the corresponding epoxy board, and a third glue potting layer is provided on the outer side surface of the supercapacitor structure formed by each supercapacitor module and the corresponding epoxy board to form a corresponding glue-potting capacitor structure; each glue-potting capacitor structure is provided between every two adjacent heat dissipation components in the multiple heat dissipation components, and each glue-potting capacitor structure is in contact with the adjacent heat dissipation component.

[0006] Furthermore, a plurality of heating plates are evenly arranged on the left and right side surfaces of each supercapacitor module in the plurality of supercapacitor modules, so as to heat the capacitor cells in the corresponding supercapacitor module.

[0007] Furthermore, each of the plurality of supercapacitor modules is provided with a plurality of thermistors, and each of the plurality of thermistors is provided between every two adjacent capacitor cells to collect the temperature difference between every two adjacent capacitor cells.

[0008] Furthermore, it also includes multiple fixed plates and multiple BMS modules, the multiple fixed plates are located above the multiple supercapacitor modules, and the left and right ends of each of the multiple fixed plates are respectively fixedly set on the left and right side surfaces of the shell; each of the multiple BMS modules is fixedly set on the corresponding fixed plate among the multiple fixed plates, and each BMS module is electrically connected to the corresponding supercapacitor module.

[0009] Furthermore, each of the plurality of heat dissipation components includes heat dissipation fins and at least one heat-conducting aluminum plate, the at least one heat-conducting aluminum plate is connected to the heat dissipation fins, and the at least one heat-conducting aluminum plate is attached to the potted capacitor structure.

[0010] Furthermore, it also includes a plurality of U-shaped baffles, wherein the bottom plate of each of the plurality of U-shaped baffles is arranged on the shell, and one side plate of each U-shaped baffle is arranged on the front side of the corresponding glue-potted capacitor structure, and the other side plate of each U-shaped baffle is arranged on the rear side of the corresponding glue-potted capacitor structure.

[0011] Furthermore, it includes a plurality of buffer insulating members, and every two of the plurality of buffer insulating members are respectively arranged on the upper and lower ends of a corresponding supercapacitor module among the plurality of supercapacitor modules.

[0012] In a second aspect, an embodiment of the present invention further provides a temperature control method for a supercapacitor module box, which is applied to the supercapacitor module box described in the first aspect, and the method includes:

[0013] When receiving a temperature acquisition instruction, each of the multiple thermistors on each supercapacitor module acquires a first temperature difference between every two adjacent capacitor cells according to the temperature acquisition instruction, obtains first data, and sends the first data to a target BMS module connected to the corresponding supercapacitor module;

[0014] The target BMS module receives the first data, filters the first data using a preset filtering algorithm to obtain second data, and performs temperature balance analysis on the second data to obtain a temperature range of the target supercapacitor module;

[0015] The target BMS module performs hierarchical control on the target supercapacitor module according to the temperature grading strategy and the temperature range;

[0016] The target BMS module monitors the second temperature difference between every two adjacent capacitor cells in the target supercapacitor module in real time to obtain a first monitoring result;

[0017] If the first monitoring result is that the temperature difference between any two adjacent capacitor cells in the target supercapacitor module is greater than a first preset temperature threshold, the target BMS module generates a balancing alarm signal.

[0018] Furthermore, the target BMS module performs hierarchical control on the target supercapacitor module according to the temperature grading strategy and the temperature range, including:

[0019] The target BMS module obtains a first sub-strategy, a second sub-strategy, a third sub-strategy, and a fourth sub-strategy included in the temperature grading strategy;

[0020] If the target BMS module detects that the temperature range is within the first preset temperature range, it activates the corresponding plurality of heating plates for heating according to the first sub-strategy and controls the output power of the target supercapacitor module;

[0021] If the target BMS module detects that the temperature range is within the second preset temperature range, the target supercapacitor module is controlled to be in a natural heat dissipation state according to the second sub-strategy;

[0022] If the target BMS module detects that the temperature range is within a third preset temperature range, the target BMS module starts the plurality of speed-adjustable fans according to the third sub-strategy and adjusts the speeds of the plurality of speed-adjustable fans according to a preset speed-adjusting algorithm;

[0023] If the target BMS module detects that the temperature range is within a fourth preset temperature range, it generates an alarm signal or a shutdown signal according to the fourth sub-strategy.

[0024] Furthermore, after the target BMS module performs hierarchical control on the target supercapacitor module according to the temperature grading strategy and the temperature range, the method further includes:

[0025] The target BMS module monitors the current temperature of the target supercapacitor module in real time to obtain a second monitoring result;

[0026] If the second monitoring result is that the current temperature of the target supercapacitor module exceeds a second preset temperature threshold, the target BMS module activates the corresponding multiple heating plates for heating;

[0027] If the second monitoring result is that the current temperature of the target supercapacitor module does not exceed the third preset temperature threshold, the target BMS module generates an alarm signal or a shutdown signal.

[0028] An embodiment of the present invention provides a supercapacitor module box and a temperature control method thereof, comprising a shell, multiple speed-regulating fans arranged on the front side of the shell, and multiple supercapacitor modules and multiple heat dissipation components arranged inside the shell, and multiple air inlets are arranged on the rear side of the shell; an epoxy board is provided at the bottom of each supercapacitor module; and a first glue potting layer is provided between every two adjacent capacitor cells in each supercapacitor module, a second glue potting layer is provided between each supercapacitor module and the corresponding epoxy board, and a third glue potting layer is provided on the outer side of the supercapacitor structure formed by each supercapacitor module and the corresponding epoxy board to form a glue potting capacitor structure, and each glue potting capacitor structure is provided between every two adjacent heat dissipation components in the multiple heat dissipation components and in contact with the adjacent heat dissipation components to improve the heat dissipation effect, thereby improving the performance of the supercapacitor module box and extending the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 A schematic structural diagram of a supercapacitor module box provided in one embodiment of the present invention;

[0031] Figure 2 A schematic structural diagram of a supercapacitor module box with the top of the housing removed provided by one embodiment of the present invention;

[0032] Figure 3 A schematic structural diagram of one of the supercapacitor modules in a supercapacitor module box provided in one embodiment of the present invention;

[0033] Figure 4 Another structural schematic diagram of a supercapacitor module box with the top plate of the housing removed provided by one embodiment of the present invention;

[0034] Figure 5 A schematic flow chart of a temperature control method for a supercapacitor module box provided in one embodiment of the present invention;

[0035] Among them, the reference numerals in the figures are:

[0036] 10. Supercapacitor module box; 110. Housing; 111. Air inlet; 120. Supercapacitor module; 121. Capacitor monomer; 122. Heating plate; 123. Thermistor; 130. Heat dissipation assembly; 131. Heat dissipation fins; 132. Thermally conductive aluminum plate; 140. Speed-regulating fan; 150. Epoxy board; 160. First glue potting layer; 170. Second glue potting layer; 180. Fixing plate; 190. BMS module; 200. U-shaped baffle; 210. Buffer insulation; 220. Glue-potting capacitor structure. DETAILED DESCRIPTION

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0038] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0039] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the present invention. As used in the specification and appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0040] The terms "center," "upper," "left," "right," "vertical," "horizontal," "inner," and "outer" used in this specification to indicate positions or locations are based on the positions or locations shown in the accompanying drawings, or the positions or locations in which the inventive product is typically placed when in use. These terms are intended solely to facilitate and simplify the description of the invention and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used solely for distinction and should not be construed as indicating or implying relative importance.

[0041] It should be further understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0042] See also Figures 1 to 3 , Figure 1 A schematic structural diagram of a supercapacitor module box provided in one embodiment of the present invention; Figure 2 A schematic structural diagram of a supercapacitor module box with the top of the housing removed provided by one embodiment of the present invention; Figure 3 This is a structural diagram of one of the supercapacitor modules in the supercapacitor module box provided by one embodiment of the present invention; wherein, Figure 3 In addition to the supercapacitor module 120, it also includes an epoxy plate 150 corresponding to the supercapacitor module 120, a first glue potting layer 160, a second glue potting layer 170 and a buffer insulation part 210 arranged on the supercapacitor module 120. The first aspect of the present invention provides a supercapacitor module box 10, comprising: a shell 110, a plurality of supercapacitor modules 120, a plurality of heat dissipation components 130 and a plurality of speed-regulating fans 140, wherein the plurality of speed-regulating fans 140 are arranged on the front side of the shell 110, and a plurality of air inlets 111 are arranged on the rear side of the shell 110; the plurality of supercapacitor modules 120 and the plurality of heat dissipation components 130 are all arranged inside the shell 110, and the bottom of each supercapacitor module 120 in the plurality of supercapacitor modules 120 is provided with an epoxy plate 150; wherein, each supercapacitor module 120 is provided with an epoxy plate 150; wherein, each supercapacitor module 120 is provided with an epoxy plate 150; wherein, A first glue potting layer 160 is arranged between every two adjacent capacitor monomers 121 in the super capacitor module 120, and a second glue potting layer 170 is arranged between each super capacitor module 120 and the corresponding epoxy board 150, and a third glue potting layer is arranged on the outer surface of the super capacitor structure formed by each super capacitor module 120 and the corresponding epoxy board 150 to form a corresponding glue potting capacitor structure 220; each glue potting capacitor structure 220 is arranged between every two adjacent heat dissipation components 130 in the multiple heat dissipation components 130, and each glue potting capacitor structure 220 is in contact with the adjacent heat dissipation component 130.

[0043] In this embodiment, the supercapacitor module box 10 is mainly used in an elevator system, and is mainly composed of a shell 110, multiple supercapacitor modules 120, multiple heat dissipation components 130 and multiple speed-regulating fans 140; wherein, multiple speed-regulating fans 140 are arranged in the middle area of ​​the front side of the shell 110; the number of the multiple speed-regulating fans 140 is preferably two in this embodiment, and each of the multiple speed-regulating fans 140 is preferably a PWM speed-regulating fan; in addition, in the shell 110, 0 is provided with a plurality of air inlets 111 on the rear side surface, so that the supercapacitor module box 10 forms an air duct structure with air inlet at the rear and air outlet at the front; in specific implementation, two PWM speed-regulating fans are used to blow air outward to realize negative pressure heat dissipation, so that external cold air enters from the gaps or the plurality of air inlets 111 of the supercapacitor module box 10, flows through the plurality of supercapacitor modules 120 and heating elements such as the BMS module, and is then discharged by the two PWM speed-regulating fans, so as to form an airflow path that runs through the entire supercapacitor module box 10, thereby avoiding local heat accumulation.

[0044] In addition, the bottom of each of the multiple supercapacitor modules 120 in this embodiment is adhered to an epoxy plate 150, thereby providing protection and insulation. Furthermore, in order to quickly dissipate the heat generated by each supercapacitor module 120 to the outside, a highly thermally conductive colloid is filled in the gap between each two adjacent capacitor cells 121 in each supercapacitor module 120 to form a heat conduction channel that directly contacts the surface of the capacitor cells 121, namely, a first glue layer 160. Furthermore, a highly thermally conductive colloid (such as silicone or epoxy resin) is also filled in the gap between each supercapacitor module 120 and the corresponding epoxy plate 150, namely, a second glue layer 170. The thickness of the first and second glue layers 160, 170, in this embodiment is preferably 1.0 mm to ensure uniform coverage without affecting the electrical insulation between the capacitor cells 121. In addition, in order to further reduce the resistance, each of the multiple supercapacitor modules 120 in this embodiment is spaced apart from two adjacent heat dissipation components 130, thereby reserving a glue pouring channel to facilitate uniform coating of a thermally conductive colloid, i.e., a third glue pouring layer (not shown), on the six outer sides of the supercapacitor structure formed by each supercapacitor module 120 and the corresponding epoxy board 150, thereby forming a corresponding glue pouring capacitor structure 220, and then the first glue pouring layer 160, the second glue pouring layer 170 and the third glue pouring layer together constitute a heat dissipation network, so that heat is transferred from the supercapacitor module 120 to the heat dissipation component 130 more quickly; In the embodiment, the thickness of the third glue potting layer is preferably 2-3 mm; wherein each glue potting capacitor structure 220 includes a corresponding first glue potting layer 160, a corresponding second glue potting layer 170, a corresponding supercapacitor module 120 and a corresponding epoxy board 150; wherein, the number of the multiple supercapacitor modules 120 is preferably three supercapacitor modules 120 in the embodiment; the number of capacitor monomers 121 in each supercapacitor module 120 is preferably 32 capacitor monomers 121 in the embodiment, adopting a 32 series and 1 parallel connection method; the number of the multiple heat dissipation components 130 is preferably four heat dissipation components 130 in the embodiment.

[0045] Furthermore, each glue-potted capacitor structure 220 is arranged between every two adjacent heat dissipation components 130 among the multiple heat dissipation components 130, and each glue-potted capacitor structure 220 is in contact with the adjacent heat dissipation component 130, so that the first glue potting layer 160, the second glue potting layer 170 and the third glue potting layer on each supercapacitor module 120 and the adjacent heat dissipation component 130 can work together to eliminate the air thermal resistance and thereby improve the heat conduction efficiency; and, through the rear air inlet and front air outlet air duct structure design formed by the supercapacitor module box 10, uniform heat dissipation can be achieved and local heat accumulation can be avoided.

[0046] In one embodiment, if Figure 2 and Figure 3 As shown, a plurality of heating plates 122 are evenly arranged on the left and right side surfaces of each supercapacitor module 120 in the plurality of supercapacitor modules 120 for heating the capacitor monomers 121 in the corresponding supercapacitor module 120 .

[0047] In this embodiment, multiple heating fins 122 are evenly disposed on the left and right sides of each supercapacitor module 120. The multiple heating fins 122 are tightly fitted to each supercapacitor module 120 to ensure uniform heat transfer to each capacitor cell 121. Specifically, two heating fins 122 are evenly disposed on each left and right side of each supercapacitor module 120. In this embodiment, the heating fins 122 are preferably PTC heating fins. This embodiment eliminates temperature gradients within each supercapacitor module 120 by symmetrically arranging the PTC heating fins on the left and right sides, thereby avoiding the problem of capacitor performance degradation caused by local overheating or overcooling.

[0048] In one embodiment, if Figure 2 and Figure 3 As shown, each of the multiple supercapacitor modules 120 is provided with multiple thermistors 123 , and each of the multiple thermistors 123 is provided between every two adjacent capacitor cells 121 to collect the temperature difference between every two adjacent capacitor cells 121 .

[0049] In this embodiment, during the charging and discharging process, each supercapacitor module 120 is prone to local overheating due to differences in internal resistance or poor contact between the capacitor monomers 121, resulting in performance degradation or even thermal runaway of the supercapacitor module 120. Therefore, in order to accurately monitor the temperature difference between adjacent capacitor monomers 121, this embodiment installs a thermistor 123 in the middle area of ​​every two adjacent capacitor monomers 121, so that the temperature difference between adjacent capacitor monomers 121 can be accurately collected through the thermistors 123 in the gaps between adjacent monomers; wherein, each of the multiple thermistors 123 is preferably an NTC thermistor in this embodiment.

[0050] In one embodiment, if Figures 1 to 4 As shown, it also includes a plurality of fixing plates 180 and a plurality of BMS modules 190, the plurality of fixing plates 180 are located above the plurality of supercapacitor modules 120, and the left and right ends of each fixing plate 180 in the plurality of fixing plates 180 are respectively fixedly arranged on the left and right side surfaces of the shell 110; each BMS module 190 in the plurality of BMS modules 190 is fixedly arranged on a corresponding fixing plate 180 in the plurality of fixing plates 180, and each BMS module 190 is electrically connected to the corresponding supercapacitor module 120.

[0051] In this embodiment, the supercapacitor module box 10 includes, in addition to a housing 110, a plurality of supercapacitor modules 120, a plurality of heat dissipation components 130, and a plurality of speed-adjustable fans 140, a plurality of fixing plates 180 and a plurality of BMS modules 190; wherein, the plurality of fixing plates 180 are arranged above the plurality of supercapacitor modules 120 at equal intervals, and the left and right ends of each fixing plate 180 in the plurality of fixing plates 180 can be fixedly mounted on the left and right side surfaces of the housing 110 by fasteners such as screws; and the The number of the plurality of fixed plates 180 is the same as the number of the plurality of BMS modules 190, so that each of the plurality of BMS modules 190 can be fixedly installed on a corresponding fixed plate 180 among the plurality of fixed plates 180; in addition, each BMS module 190 can be electrically connected to a corresponding supercapacitor module 120 among the plurality of supercapacitor modules 120 via a communication line such as CAN, thereby enabling real-time monitoring and management of the corresponding supercapacitor module 120 through each BMS module 190.

[0052] In one embodiment, if Figures 1 to 4 As shown, each heat dissipation component 130 of the multiple heat dissipation components 130 includes a heat dissipation fin 131 and at least one heat-conducting aluminum plate 132 , the at least one heat-conducting aluminum plate 132 is connected to the heat dissipation fin 131 , and the at least one heat-conducting aluminum plate 132 is attached to the glue-potted capacitor structure 220 .

[0053] In this embodiment, in order to improve the heat dissipation efficiency, each heat dissipation component 130 in this embodiment specifically includes a heat dissipation fin 131 and at least one heat-conducting aluminum plate 132; wherein, the at least one heat-conducting aluminum plate 132 is adhered to the glue-potted capacitor structure 220; and the at least one heat-conducting aluminum plate 132 is adhered to the heat dissipation fin 131, and the heat generated by the adjacent supercapacitor module 120 can be conducted to the heat dissipation fin 131 fixedly connected to the heat-conducting aluminum plate 132; wherein, the thickness of the heat-conducting aluminum plate 132 is preferably 2-8 mm in this embodiment; and the heat dissipation fin 131 accelerates the heat conducted from the heat-conducting aluminum plate 132 to the surrounding environment through a plurality of parallel fin structures, thereby achieving the purpose of heat dissipation.

[0054] More specifically, in this embodiment, the number of the plurality of heat dissipation components 130 preferably includes a first heat dissipation component, a second heat dissipation component, a third heat dissipation component and a fourth heat dissipation component; wherein, the first heat dissipation component includes a first heat dissipation fin and a first heat-conducting aluminum plate, one side of the first heat dissipation fin is bonded and connected to a side surface inside the shell 110, the other side of the first heat dissipation fin is bonded and connected to one side of the first heat-conducting aluminum plate, and the other side of the first heat-conducting aluminum plate is bonded and connected to one side of the corresponding glue-potted capacitor structure 220; the second heat dissipation component includes a second heat dissipation fin, a second heat-conducting aluminum plate and a third heat-conducting aluminum plate, one side of the second heat dissipation fin is bonded and connected to one side of the second heat-conducting aluminum plate, the other side of the second heat dissipation fin is bonded and connected to one side of the third heat-conducting aluminum plate, and the other side of the second heat-conducting aluminum plate is bonded and connected to one side of the corresponding glue-potted capacitor structure 220; the The other side of the three thermally conductive aluminum plates is bonded and connected to one side of the corresponding glue-potted capacitor structure 220; the third heat dissipation component includes a third heat dissipation fin, a fourth heat dissipation aluminum plate and a fifth heat dissipation aluminum plate, one side of the third heat dissipation fin is bonded and connected to one side of the fourth heat dissipation aluminum plate, the other side of the third heat dissipation fin is bonded and connected to one side of the fifth heat dissipation aluminum plate, the other side of the fourth heat dissipation aluminum plate is bonded and connected to one side of the corresponding glue-potted capacitor structure 220; the other side of the fifth heat dissipation aluminum plate is bonded and connected to one side of the corresponding glue-potted capacitor structure 220; the fourth heat dissipation component includes a fourth heat dissipation fin and a sixth heat dissipation aluminum plate, one side of the fourth heat dissipation fin is bonded and connected to the other side surface inside the shell 110, the other side of the fourth heat dissipation fin is bonded and connected to one side of the sixth heat dissipation aluminum plate, and the other side of the sixth heat dissipation aluminum plate is bonded and connected to one side of the corresponding glue-potted capacitor structure 220.

[0055] In one embodiment, if Figure 1 、 Figure 3 and Figure 4 As shown, it also includes a plurality of U-shaped baffles 200, the bottom plate of each of the plurality of U-shaped baffles 200 is set on the shell 110, and one side plate of each U-shaped baffle 200 is set on the front side of the corresponding glue-filled capacitor structure 220, and the other side plate of each U-shaped baffle 200 is set on the rear side of the corresponding glue-filled capacitor structure 220.

[0056] In this embodiment, the supercapacitor module box 10 further includes a plurality of U-shaped baffles 200, and the bottom plate of each of the plurality of U-shaped baffles 200 is fixed to the shell 110 by fasteners such as nuts or bolts; and the number of the plurality of U-shaped baffles 200 is the same as the number of the plurality of supercapacitor modules 120; in addition, one side plate of the U-shaped baffle 200 is tightly fitted and fixed to the front side of the corresponding glue-potted capacitor structure 220, and the other side plate is tightly fitted and fixed to the rear side of the corresponding glue-potted capacitor structure 220, so that the U-shaped baffle 200 is adapted to the glue-potted capacitor structure 220 to ensure that there is no relative movement between the glue-potted capacitor structure 220. At the same time, the presence of the multiple U-shaped baffles 200 plays a certain guiding role in the dissipation of heat, so that the heat can be more concentratedly transferred to the heat dissipation duct inside the supercapacitor module box 10, thereby cooperating with the air cooling heat dissipation method of the multiple speed-controlled fans 140 to accelerate the discharge of heat; wherein, the U-shaped baffles 200 are preferably stainless steel baffles in this embodiment.

[0057] In one embodiment, if Figure 1 、 Figure 3 and Figure 4 As shown, a plurality of buffer insulators 210 are further included, and every two buffer insulators 210 of the plurality of buffer insulators 210 are respectively disposed on the upper and lower ends of a corresponding supercapacitor module 120 of the plurality of supercapacitor modules 120 .

[0058] In this embodiment, to ensure the stability and safety of the supercapacitor modules 120 during operation, the supercapacitor module box 10 also includes multiple buffer insulators 210. Two of the buffer insulators 210 are respectively disposed at the upper and lower ends of a corresponding supercapacitor module 120. In this embodiment, each of the buffer insulators 210 is preferably EVA foam. By disposing the buffer insulators 210 at the upper and lower ends of each supercapacitor module 120, this embodiment provides a buffering effect, preventing the U-shaped baffle 200 from impacting the supercapacitor module 120. It also provides insulation, preventing short circuits between the supercapacitor module 120 and other components.

[0059] See also Figure 5 , Figure 5 A flow chart of a temperature control method for a supercapacitor module box provided in one embodiment of the present invention; a second aspect of the present invention provides a temperature control method for a supercapacitor module box, which is applied to the supercapacitor module box described in the first aspect.

[0060] like Figure 5 As shown, the method includes steps S110 to S150.

[0061] S110: When a temperature acquisition instruction is received, each of the multiple thermistors on each supercapacitor module acquires a first temperature difference between every two adjacent capacitor cells according to the temperature acquisition instruction, obtains first data, and sends the first data to a target BMS module connected to the corresponding supercapacitor module;

[0062] S120: The target BMS module receives the first data, filters the first data using a preset filtering algorithm to obtain second data, and performs temperature balance analysis on the second data to obtain a temperature range of the target supercapacitor module.

[0063] S130, the target BMS module performs hierarchical control on the target supercapacitor module according to the temperature grading strategy and the temperature range;

[0064] S140: The target BMS module monitors the second temperature difference between every two adjacent capacitor cells in the target supercapacitor module in real time to obtain a first monitoring result;

[0065] S150: If the first monitoring result indicates that the temperature difference between any two adjacent capacitor cells in the target supercapacitor module is greater than a first preset temperature threshold, the target BMS module generates a balancing alarm signal.

[0066] In this embodiment, when each of the multiple thermistors in each supercapacitor module receives a temperature collection instruction, it accurately collects the first temperature difference between every two adjacent capacitor cells according to the temperature collection instruction. For example, if each supercapacitor module has 32 supercapacitor cells, there are 31 gaps between adjacent capacitor cells, and a thermistor is installed in each gap, thus collecting 31 first data points. Each of the multiple thermistors then transmits the collected first data in the form of a digital signal to the target BMS module connected to each supercapacitor module via a specific communication protocol (such as Modbus RTU). The temperature collection instruction can be generated manually or by a preset timer task. During the data transmission process, differential signal transmission and a checksum mechanism can be used to ensure the accuracy and reliability of the first data, effectively reducing signal interference and data transmission errors.

[0067] After receiving the first data, the target BMS module first filters the first data using a preset filtering algorithm, such as a median filter or a mean filter, to remove noise and interference signals from the first data, thereby generating smoother and more accurate second data. The target BMS module then performs a temperature uniformity analysis on the second data, such as by calculating statistical indicators such as the variance and standard deviation of the second data to assess the degree of temperature variation between adjacent capacitor cells within the target supercapacitor module. The target BMS module then determines the target supercapacitor module's temperature range based on preset temperature uniformity criteria. The target BMS module then implements tiered control of the target supercapacitor module based on a preset temperature grading strategy and temperature ranges. For example, when the target supercapacitor module's temperature range is within the normal temperature range (-20°C to 45°C), the BMS module maintains the target supercapacitor module in normal operation without performing any special control operations, allowing the module to achieve natural heat dissipation through the coordinated action of the first, second, and third potting layers and multiple heat dissipation components on the target supercapacitor module.

[0068] In addition, after the target BMS module performs corresponding grading control on the target supercapacitor module according to the temperature grading strategy and the temperature range, the target BMS module will continue to monitor the second temperature difference between every two adjacent capacitor cells in the module in real time, and obtain a first monitoring result by continuously collecting temperature difference data of each thermistor and performing real-time analysis; if the first monitoring result is that the temperature difference between any two adjacent capacitor cells in the target supercapacitor module is greater than a first preset temperature threshold (for example, 5°C), the target BMS module will immediately generate a balance alarm signal; wherein, the balance alarm signal can be issued in a variety of ways, such as issuing a sound alarm through a buzzer, sending the alarm information to the host computer software through the network, etc., so that relevant maintenance personnel can promptly inspect and maintain the supercapacitor module box after receiving the alarm signal, and take corresponding measures to solve the problem of temperature imbalance, thereby ensuring the safe and stable operation of the supercapacitor module box. Finally, after the target BMS module completes real-time monitoring of the target supercapacitor module, the target BMS module reports the operating data and adaptive parameter adjustments in this process to the external monitoring system in real time via CAN / RS485 communication, and performs parameter adjustment in the external monitoring system to obtain adjusted operating data and adaptive parameters. The adjusted operating data and adaptive parameters are then returned to the target supercapacitor module, thereby achieving real-time updates of the charge and discharge current and voltage, balancing management parameters (balancing trigger threshold, balancing current, etc.), and heat dissipation control parameters; and returns to continue executing the step of, when a temperature acquisition instruction is received, each of the multiple thermistors on each supercapacitor module acquires the first temperature difference between every two adjacent capacitor cells according to the temperature acquisition instruction to obtain first data. This cycle is repeated until the target supercapacitor module is in the optimal operating state, thereby ensuring that the target supercapacitor module meets the energy storage application requirements of high reliability and long life.

[0069] In one embodiment, the step S130 includes:

[0070] The target BMS module obtains a first sub-strategy, a second sub-strategy, a third sub-strategy and a fourth sub-strategy included in the temperature grading strategy;

[0071] If the target BMS module detects that the temperature range is within the first preset temperature range, it activates the corresponding plurality of heating plates for heating according to the first sub-strategy and controls the output power of the target supercapacitor module;

[0072] If the target BMS module detects that the temperature range is within the second preset temperature range, the target supercapacitor module is controlled to be in a natural heat dissipation state according to the second sub-strategy;

[0073] If the target BMS module detects that the temperature range is within a third preset temperature range, the target BMS module starts the plurality of speed-adjustable fans according to the third sub-strategy and adjusts the speeds of the plurality of speed-adjustable fans according to a preset speed-adjusting algorithm;

[0074] If the target BMS module detects that the temperature range is within a fourth preset temperature range, it generates an alarm signal or a shutdown signal according to the fourth sub-strategy.

[0075] In this embodiment, to ensure that the target supercapacitor module can operate stably and efficiently under different ambient temperatures, the BMS module dynamically adjusts its working state and heat dissipation / heating measures based on the temperature grading strategy and temperature range. The target BMS module first obtains the first sub-strategy, the second sub-strategy, the third sub-strategy, and the fourth sub-strategy included in the temperature grading strategy; and detects the temperature range of the target supercapacitor module to determine which preset temperature range the temperature range is in. Specifically, when the target BMS module detects that the temperature range is in the first preset temperature range, it activates multiple heating plates for heating according to the first sub-strategy, and dynamically adjusts the output power of the target supercapacitor module to avoid performance degradation due to low temperature. In this embodiment, the first preset temperature range is preferably less than -20°C. When the target BMS module detects that the temperature range is in the second preset temperature range, it turns off the heating plates on the target supercapacitor module according to the second sub-strategy and controls the target supercapacitor module to be in a natural heat dissipation state to maintain its operation within the optimal operating temperature range. In this embodiment, the second preset temperature range is preferably -20°C to 45°C. When the target BMS module detects that the temperature range is within the third preset temperature range, it starts multiple speed-regulating fans according to the third sub-strategy and dynamically adjusts the speeds of the multiple speed-regulating fans through a preset speed regulation algorithm (such as a PID control algorithm) to achieve precise temperature control; wherein, the third preset temperature range is preferably 45°C to 65°C in this embodiment. And when the target BMS module detects that the temperature range is within the fourth preset temperature range, it indicates that the target supercapacitor module is in a dangerous state. At this time, an alarm signal is generated according to the fourth sub-strategy and sent to an external monitoring system through a communication interface. At the same time, to prevent damage to the target supercapacitor module, the target BMS module may also trigger a shutdown signal to automatically cut off the output of the target supercapacitor module to ensure the safety of the target supercapacitor module box; wherein, the fourth preset temperature range is preferably greater than 65°C in this embodiment.

[0076] In one embodiment, after step S130, the method further includes:

[0077] The target BMS module monitors the current temperature of the target supercapacitor module in real time to obtain a second monitoring result;

[0078] If the second monitoring result is that the current temperature of the target supercapacitor module exceeds a second preset temperature threshold, the target BMS module activates the corresponding multiple heating plates for heating;

[0079] If the second monitoring result is that the current temperature of the target supercapacitor module does not exceed the third preset temperature threshold, the target BMS module generates an alarm signal or a shutdown signal.

[0080] In this embodiment, after completing the hierarchical control of the target supercapacitor module, the target BMS module not only monitors the second temperature difference between each two adjacent capacitor cells in the target supercapacitor module, but also monitors the current temperature of the target supercapacitor module in real time. Specifically, the current temperature of the target supercapacitor module can be collected by the temperature sensor on the target supercapacitor module; if the current temperature of the target supercapacitor module is detected to exceed the second preset temperature threshold, the target supercapacitor module is in a low temperature state. At this time, the target BMS module immediately starts the corresponding multiple heating plates for heating until the temperature of the target supercapacitor module returns to the normal working range; if the current temperature of the target supercapacitor module is detected to be less than the third preset temperature threshold, it indicates that the target supercapacitor module is in an overcooling environment, which may cause safety hazards. At this time, the target BMS module immediately generates an alarm signal and sends it to an external monitoring system via a CAN bus, etc., or triggers a shutdown signal to cut off the output of the target supercapacitor module. In addition, the target BMS module also detects the status of the sensor in the target supercapacitor module in real time. If it is detected that the sensor fails, it switches to a redundant sensor to ensure the normal operation of the target supercapacitor module.

[0081] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A supercapacitor module box, characterized in that: include: A shell, multiple supercapacitor modules, multiple heat dissipation components and multiple speed-regulating fans, wherein the multiple speed-regulating fans are arranged on the front side of the shell, and multiple air inlets are arranged on the rear side of the shell; the multiple supercapacitor modules and the multiple heat dissipation components are all arranged inside the shell, and the bottom of each supercapacitor module in the multiple supercapacitor modules is provided with an epoxy board; wherein a first glue potting layer is provided between every two adjacent capacitor cells in each supercapacitor module, and a second glue potting layer is provided between each supercapacitor module and the corresponding epoxy board, and a third glue potting layer is provided on the outer side of the supercapacitor structure formed by each supercapacitor module and the corresponding epoxy board to form a corresponding glue potting capacitor structure; each glue potting capacitor structure is provided between every two adjacent heat dissipation components in the multiple heat dissipation components, and each glue potting capacitor structure is in contact with the adjacent heat dissipation component; A plurality of heating plates are evenly arranged on the left and right sides of each supercapacitor module in the plurality of supercapacitor modules, so as to heat the capacitor cells in the corresponding supercapacitor module; Each of the plurality of supercapacitor modules is provided with a plurality of thermistors, and each of the plurality of thermistors is provided between every two adjacent capacitor cells to collect the temperature difference between every two adjacent capacitor cells; The supercapacitor module box further includes a plurality of fixing plates and a plurality of BMS modules, wherein the plurality of fixing plates are located above the plurality of supercapacitor modules, and the left and right ends of each of the plurality of fixing plates are fixedly arranged on the left and right side surfaces of the housing respectively; each of the plurality of BMS modules is fixedly arranged on a corresponding fixing plate among the plurality of fixing plates, and each BMS module is electrically connected to the corresponding supercapacitor module; Each of the plurality of heat dissipation components includes heat dissipation fins and at least one heat-conducting aluminum plate, wherein the at least one heat-conducting aluminum plate is connected to the heat dissipation fins, and the at least one heat-conducting aluminum plate is attached to the potted capacitor structure; The supercapacitor module box further includes a plurality of U-shaped baffles, wherein the bottom plate of each of the plurality of U-shaped baffles is arranged on the housing, and one side plate of each U-shaped baffle is arranged on the front side of the corresponding glue-potting capacitor structure, and the other side plate of each U-shaped baffle is arranged on the rear side of the corresponding glue-potting capacitor structure; The supercapacitor module box further includes a plurality of buffer insulating members, and every two of the plurality of buffer insulating members are respectively arranged on upper and lower ends of a corresponding supercapacitor module among the plurality of supercapacitor modules.

2. A temperature control method for a supercapacitor module box, applied to the supercapacitor module box according to claim 1, characterized in that: The method comprises: When receiving a temperature acquisition instruction, each of the multiple thermistors on each supercapacitor module acquires a first temperature difference between every two adjacent capacitor cells according to the temperature acquisition instruction, obtains first data, and sends the first data to a target BMS module connected to the corresponding supercapacitor module; The target BMS module receives the first data, filters the first data using a preset filtering algorithm to obtain second data, and performs temperature balance analysis on the second data to obtain a temperature range of the target supercapacitor module; The target BMS module performs hierarchical control on the target supercapacitor module according to the temperature grading strategy and the temperature range; The target BMS module monitors the second temperature difference between every two adjacent capacitor cells in the target supercapacitor module in real time to obtain a first monitoring result; If the first monitoring result is that the temperature difference between any two adjacent capacitor cells in the target supercapacitor module is greater than a first preset temperature threshold, the target BMS module generates a balancing alarm signal.

3. The temperature control method of the supercapacitor module box according to claim 2, characterized in that: The target BMS module performs hierarchical control on the target supercapacitor module according to the temperature grading strategy and the temperature range, including: The target BMS module obtains a first sub-strategy, a second sub-strategy, a third sub-strategy and a fourth sub-strategy included in the temperature grading strategy; If the target BMS module detects that the temperature range is within the first preset temperature range, it activates the corresponding plurality of heating plates for heating according to the first sub-strategy and controls the output power of the target supercapacitor module; If the target BMS module detects that the temperature range is within the second preset temperature range, the target supercapacitor module is controlled to be in a natural heat dissipation state according to the second sub-strategy; If the target BMS module detects that the temperature range is within a third preset temperature range, the target BMS module starts the plurality of speed-adjustable fans according to the third sub-strategy and adjusts the speeds of the plurality of speed-adjustable fans according to a preset speed-adjusting algorithm; If the target BMS module detects that the temperature range is within a fourth preset temperature range, it generates an alarm signal or a shutdown signal according to the fourth sub-strategy.

4. The temperature control method of the supercapacitor module box according to claim 2, characterized in that: After the target BMS module performs hierarchical control on the target supercapacitor module according to the temperature grading strategy and the temperature range, the method further includes: The target BMS module monitors the current temperature of the target supercapacitor module in real time to obtain a second monitoring result; If the second monitoring result is that the current temperature of the target supercapacitor module exceeds a second preset temperature threshold, the target BMS module activates the corresponding multiple heating plates for heating; If the second monitoring result is that the current temperature of the target supercapacitor module does not exceed the third preset temperature threshold, the target BMS module generates an alarm signal or a shutdown signal.

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