Heating device and heating equipment

Abstract

The invention relates to a heating device and heating equipment, the heating device comprises a base, a central rotating module and a plurality of heating modules, the central rotating module comprises a rotating part and a plurality of first transmission parts, and the rotating part is rotatably arranged on the base; the plurality of heating modules surround the rotating piece and are movably arranged on the base along the radial direction of the wafer; wherein the two ends of the first transmission part are rotatably connected with the rotating part and the heating modules respectively, and the rotating part is configured to be used for synchronously driving the multiple heating modules, so that the multiple heating modules are close to the rotating part at the same time or away from the rotating part at the same time in the radial direction of the wafer. According to the heating device, the positions can be switched at the same time, the structure in the heating device is more integrated and simplified, the heating device is more convenient to use, and the influence on the production efficiency is avoided.

Description

Technical Field

[0001] The present application relates to the field of semiconductor equipment, and in particular to a heating device and a heating equipment. Background Art

[0002] During the semiconductor manufacturing process, the expansion film on the back of the wafer can be stretched during the wafer expansion process. This stretching exerts a tensile force on the wafer to which it is tightly attached. This can break the modified layer created by laser dicing on the wafer's dicing paths, separating the wafer into individual grains along the modified layer. Alternatively, the wafer, initially separated by "cold expansion," can be stretched a second time to increase the spacing between grains on the wafer. The originally flat expansion film becomes loose after stretching, making it impossible to maintain the spacing between grains after expansion. Grains bonded to the expansion film are prone to colliding with each other, resulting in defects such as chipping and scratches. Therefore, the loose expansion film on the wafer needs to be heated to shrink and restore its tension.

[0003] Currently, wafers come in varying sizes. To heat the relaxed expanded film on wafers of varying sizes, the heating module for the expanded film needs to be switched according to the wafer size. In related art, when multiple heating modules are used, each needs to be switched individually, making the heating module structure and operation more complex. Summary of the Invention

[0004] The purpose of the present application is to provide a heating device and a heating apparatus to solve the problems of complex structure and complicated use of heating modules in related technologies.

[0005] In order to achieve the above-mentioned object, the present application provides a heating device for heat-treating an expanded film on a wafer, the heating device comprising:

[0006] base;

[0007] a central rotating module, comprising a rotating member and a plurality of first transmission members, wherein the rotating member is rotatably disposed on the base; and

[0008] a plurality of heating modules, the plurality of heating modules surrounding the rotating member and movably disposed on the base along a radial direction of the wafer;

[0009] Wherein, both ends of the first transmission member are rotatably connected to the rotating member and the heating module respectively, and the rotating member is configured to synchronously drive the multiple heating modules so that the multiple heating modules are simultaneously close to the rotating member or simultaneously away from the rotating member along the radial direction of the wafer.

[0010] As an optional embodiment, the heating device includes a plurality of mounting units movably arranged on the base, and the heating module is arranged on the mounting units;

[0011] One end of the first transmission member is rotatably connected to the rotating member, and the other end of the first transmission member is rotatably connected to the mounting unit. The rotating member is configured to synchronously drive multiple mounting units so that multiple heating modules simultaneously approach the rotating member or simultaneously move away from the rotating member along the radial direction of the wafer. The mounting unit provides installation space for the heating module, and the first transmission member can also be indirectly rotatably connected to the heating module through the mounting unit. In this way, the rotating member and the first transmission member indirectly drive the heating module to move radially along the wafer through the mounting unit.

[0012] As an optional embodiment, the base is provided with a bearing seat and a bearing mounted on the outside of the bearing seat, and the rotating member is constructed in an annular shape and mounted on the bearing, so that the rotating member can be rotatably mounted on the base. The bearing and the bearing seat ensure that the rotating member can be rotatably mounted on the base while minimizing friction during rotation of the rotating member. The rotating member can be provided with a shaft body, and multiple first transmission members are rotatably mounted on the shaft body, so that the first transmission members can be rotatably connected to the rotating member constructed in an annular shape.

[0013] As an optional embodiment, the heating device further includes a locking module, and the locking module includes:

[0014] plug;

[0015] A plurality of locking plates: the plurality of locking plates are respectively arranged on the base and around the rotating member, and the locking plates have a first positioning hole; and

[0016] A latch seat, the latch seat being connected to the rotating member and having a second positioning hole,

[0017] The base has a first clearance hole for circumventing the latch, and the latch is configured to sequentially pass through the first clearance hole, the second positioning hole, and the first positioning hole to lock the rotation angle of the rotating member. The locking module can lock the rotating member to prevent it from rotating when the position of the heating module does not need to be changed, so that the heating module will not shift during the heating of the expansion membrane, ensuring the stability of the heating module during use.

[0018] As an optional implementation, the heating device further includes a position detection module, and the position detection module includes:

[0019] A detection sensor is disposed on the base, wherein the detection sensor is configured to emit a signal indicating the radial position of the heating module relative to the wafer. The sensor signal allows an operator to determine the position of the heating module and control the movement or stopping of the heating module.

[0020] As an optional embodiment, the heating device includes a drive module configured to drive the rotating member to rotate. The drive module drives the rotating member to rotate, indicating that the rotating member is the active member and the heating module is the passive member, and the rotating member actively drives the multiple heating modules to switch positions.

[0021] As an optional embodiment, the drive module includes a handle disposed on the rotating member, the handle being used to manually drive the rotating member to rotate. The base defines a first clearance hole for the handle to pass through, and the handle extends toward and beyond the first clearance hole. In this way, an operator can manually drive the handle to manually drive the rotating member to rotate and switch the position of the heating module.

[0022] As an optional embodiment, the heating device has a driving module, and the driving module is configured to drive any of the heating modules to move radially along the wafer on the base. When the driving module drives any of the heating modules to move radially along the wafer on the base, it means that the heating module connected to the driving module is the active component, and the other heating modules and the rotating component are the driven components. Taking the heating module connected to the driving module as the active component as an example, when the heating module as the active component moves in the radial direction of the wafer, the heating module as the active component will convert its own linear motion into the rotational motion of the rotating component, and the rotational motion of the rotating component will be converted into the linear motion of the other heating modules.

[0023] As an optional embodiment, the base is provided with a plurality of first mounting rods extending radially along the wafer. The plurality of first mounting rods are arranged in parallel and spaced apart, and are located on both sides of the heating module's direction of movement. The heating module is slidably mounted on the first mounting rods. The plurality of parallel first mounting rods form a guide rail structure that effectively constrains the movement trajectory of the heating module, preventing lateral deviation and shaking of the heating module and ensuring the stability of the heating module during movement.

[0024] On the other hand, the present application further discloses a heating device for heat-treating an expansion film attached to the wafer, wherein the edge of the expansion film is fixed to a wafer frame, and the heating device comprises:

[0025] a thermal expansion plate, used for carrying the expansion film;

[0026] A heating device as described in any one of the above; and

[0027] A driving device is connected to the base and is used to drive the base to rotate.

[0028] Compared with the prior art, the present invention has the following advantages:

[0029] The heating device of the present application, through the rotating part of the central rotating module and multiple first transmission parts, can drive multiple heating modules during one rotation of the rotating part, and simultaneously approach the rotating part or simultaneously move away from the rotating part in the radial direction of the wafer so that the heating device can heat the expansion film of wafers of different sizes. When the rotating part simultaneously drives multiple heating modules away from the rotating part along the radial direction of the wafer, the size of the wafer that can be heated by the heating device increases. When the rotating part simultaneously drives multiple heating modules close to the rotating part along the radial direction of the wafer, the size of the wafer that can be heated by the heating device decreases. Compared with the related art, each heating module needs to be switched individually. The multiple heating modules of the present application can be switched at the same time. The structure in the heating device is more integrated, the structure of the heating device is simpler, and it is simpler to use, avoiding the impact on production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 It is a structural schematic diagram of a wafer before wafer expansion in the related art;

[0032] Figure 2 It is a structural schematic diagram of the heating device disclosed in the embodiment of the present application;

[0033] Figure 3 is a top view of the heating device disclosed in an embodiment of the present application;

[0034] Figure 4 is a structural diagram of the central rotation module disclosed in an embodiment of the present application;

[0035] Figure 5 yes Figure 2 Enlarged view of part A;

[0036] Figure 6 is a schematic structural diagram of a shielding unit disclosed in an embodiment of the present application;

[0037] Figure 7yes Figure 2 Magnified view of part B.

[0038] Description of reference numerals:

[0039] 1-heating device, 11-base, 111-bearing, 112-bearing seat, 113-first avoidance hole, 114-first opening, 115-second opening, 116-first mounting rod, 117-second mounting rod, 118-second avoidance hole, 12-central rotating module, 121-rotating member, 1211-axis body, 122-first transmission member, 13-heating module, 14-mounting unit, 15-locking module, 151-latch, 152-locking plate, 1521-first positioning hole, 153- Latch seat, 1531-second positioning hole, 16-position detection module, 161-detection sensor, 162-trigger part, 163-mounting slide rail, 17-drive module, 171-handle, 18-shielding unit, 19-transmission module, 191-first pulley, 192-second pulley, 193-connecting belt, 1931-first section, 1932-second section, 2-wafer, 21-expansion film, 22-wafer frame, 23-grain, 24-pitch, 3-first connecting platform, 31-second connecting platform. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0041] In this application, terms such as "upper," "lower," "left," "right," "front," "back," "inner," and "outer" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0042] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0043] Furthermore, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0044] Furthermore, the terms "first," "second," etc., are primarily used to distinguish between different devices, elements, or components (which may or may not be of the same type and configuration), and are not intended to indicate or imply the relative importance or quantity of the devices, elements, or components indicated. Unless otherwise specified, "plurality" means two or more.

[0045] Reference Figure 1 , Figure 1 This is a schematic diagram of the structure of wafer 2 before expansion in the related art. In certain production processes of semiconductor wafer 2, an expansion film 21 is usually adhered to the lower surface of wafer 2, and the edge of expansion film 21 is fixed to wafer frame 22. When wafer 2 is expanded, the expansion film 21 on the lower surface of wafer 2 is expanded and stretched. As the expansion film 21 is expanded and stretched, it exerts a tensile force on wafer 2, which is tightly attached to it. This can break the modified layer produced by laser hidden cutting on the saw path of wafer 2, separating wafer 2 into individual grains 23 along the path of the modified layer. Alternatively, wafer 2 separated by initial stretching through "cold expansion" can be stretched a second time to increase the spacing 24 between grains 23 on wafer 2. The originally flat expansion film 21 will become loose after being stretched. After the expansion process, the loose expansion film 21 between the wafer frame 22 and the wafer 2 cannot maintain the spacing 24 between the grains 23 obtained after the expansion, making it easy for the grains 23 on the expansion film 21 to collide with each other, resulting in defects such as edge chipping and scratches. Therefore, it is necessary to heat the loose expansion film 21 to shrink it and restore it to a taut state to maintain the spacing 24 between the grains 23.

[0046] Continue to refer to Figure 1 Typically, wafer 2 is circular, with a wafer frame 22 surrounding it and securing the edge of expansion film 21. After expansion, a heating module is required to heat the loose, ring-shaped expansion film 21 between wafer 2 and wafer frame 22. The larger the wafer 2, the further away from the center of the wafer 2 in the radial direction the loose expansion film 21 needs to be heated.

[0047] Wafers 2 usually have different sizes. Taking 8-inch wafers 2 and 12-inch wafers 2 as examples, in the related art, in order to heat the relaxed expansion films 21 on wafers 2 of different sizes, the heating module used for the expansion film 21 needs to switch positions according to the different sizes of the wafers 2 in order to be compatible with both 8-inch and 12-inch wafers 2 without changing the original structure. That is, the heating module needs to move along the radial direction of the wafer 2 so that the heating module can be compatible with both 8-inch and 12-inch wafers 2. Specifically, when the wafer 2 is switched from 8 inches to 12 inches, the heating module needs to move along the radial direction of the wafer 2, toward the direction away from the center of the wafer 2, so that the heating module can correspond to the position of the expansion film 21. When the wafer 2 is switched from 12 inches to 8 inches, the heating module needs to move along the radial direction of the wafer 2, toward the direction close to the center of the wafer 2, so that the heating module can correspond to the position of the expansion film 21. When multiple heating modules are provided at the same time, each heating module needs to be switched individually when the specifications of the wafer 2 are switched, which makes the structure and use of the heating module more complicated, increases the equipment cost, and also affects the production efficiency.

[0048] In view of this, the present application discloses a heating device and a heating equipment, which can drive multiple heating modules through the rotating parts and multiple first transmission parts of the central rotating module during one rotation of the rotating part, and simultaneously approach the rotating part or simultaneously move away from the rotating part in the radial direction of the wafer so that the heating device can heat the expansion film of wafers of different sizes. When the rotating part simultaneously drives the multiple heating modules away from the rotating part along the radial direction of the wafer, the size of the wafer that can be heated by the heating device increases. When the rotating part simultaneously drives the multiple heating modules close to the rotating part along the radial direction of the wafer, the size of the wafer that can be heated by the heating device decreases. Compared with the related art, each heating module needs to be switched individually. The multiple heating modules of the present application can be switched at the same time. The structure in the heating device is more integrated, the structure of the heating device is simpler, and it is simpler to use, avoiding the impact on production efficiency.

[0049] The solution of this application will be described in detail below with reference to the accompanying drawings.

[0050] This application discloses a heating device 1 for heat treating an expansion film 21 on a wafer 2. Figure 2 and Figure 3 , Figure 2 It is a structural schematic diagram of the heating device 1 disclosed in the embodiment of the present application;

[0051] Figure 3: It is a top view of the heating device 1 disclosed in the embodiment of the present application. The heating device 1 includes a base 11, a central rotating module 12 and a plurality of heating modules 13: the central rotating module 12 includes a rotating member 121 and a plurality of first transmission members 122, the rotating member 121 is rotatably arranged on the base 11; the plurality of heating modules 13 surround the rotating member 121 and are movably arranged on the base 11 along the radial direction of the wafer 2; wherein, the two ends of the first transmission member 122 are rotatably connected to the rotating member 121 and the heating modules 13 respectively, and the rotating member 121 is configured to synchronously drive the plurality of heating modules 13 so that the plurality of heating modules 13 are simultaneously close to the rotating member 121 or simultaneously away from the rotating member 121 along the radial direction of the wafer 2.

[0052] exist Figure 2 In the figure, the heating module 13 is represented by a cube with dotted lines, which is only a schematic diagram of the position of the heating module 13 and does not represent the actual structure and size of the heating module 13. It can be understood that in the present application, the heating module 13 needs to meet the heating conditions for the expansion membrane 21. Furthermore, the present application does not limit the specific structure of the heating module 13, and any heating module 13 that can meet the heating conditions for the expansion membrane 21 can be used. It should be understood that in the present application, the heating of the expansion membrane 21 refers to heating the expansion membrane 21 of the wafer 2, that is, heating the expansion membrane 21 between the wafer frame 22 and the wafer 2.

[0053] In some embodiments, taking the rotating member 121 as an active member, when the rotating member 121 rotates, the rotating member 121 drives the first transmission member 122 to move. As described above, since the two ends of the first transmission member 122 are rotatably connected to the rotating member 121 and the heating module 13, respectively, and the heating module 13 is movably arranged on the base 11 along the radial direction of the wafer 2. Based on this, when the rotating member 121 rotates, on the one hand, the rotational motion of the rotating member 121 is converted into the swinging of the first transmission member 122, that is, when the rotating member 121 rotates, the first transmission member 122 swings relative to the rotating member 121 and the heating module 13. On the other hand, the rotational motion of the rotating member 121 is converted into the linear motion of the first transmission member 122 along the radial direction of the wafer 2, that is, when the rotating member 121 rotates, the rotational force of the rotating member 121 is converted into a pulling force or a pushing force on the heating module 13. In this way, the rotating member 121 can drive the heating module 13 to perform linear motion along the radial direction of the wafer 2 through the first transmission member 122, so that the heating module 13 can approach or move away from the rotating member 121. When there are multiple first transmission members 122 and multiple heating modules 13, during one rotation of the rotating member 121, the rotating member 121 can cause multiple heating modules 13 to approach the rotating member 121 or move away from the rotating member 121 at the same time. In the actual application of the heating module 13, the rotation axis of the rotating member 121 can correspond to the center of the wafer 2. In this way, the approach of the heating module 13 to the rotating member 121 or the distance therefrom can be understood as the approach of the heating module 13 to the center of the wafer 2.

[0054] The heating device 1 of the present application, through the rotating member 121 of the central rotating module 12 and the multiple first transmission members 122, can drive the multiple heating modules 13 to move in the radial direction of the wafer 2 during one rotation of the rotating member 121, so that the heating modules 13 can simultaneously approach the rotating member 121 or simultaneously move away from the rotating member 121. When the rotating member 121 simultaneously drives the multiple heating modules 13 away from the rotating member 121 along the radial direction of the wafer 2, the heating device 1 can heat the expanded film 21 of the wafer 2 with larger size specifications, that is, the size specifications of the wafer 2 that the heating device 1 can adapt to increase. When the rotating member 121 simultaneously drives the multiple heating modules 13 close to the rotating member 121 along the radial direction of the wafer 2, the heating device 1 can heat the expanded film 21 of the wafer 2 with smaller size specifications, that is, the size specifications of the wafer 2 that the heating device 1 can adapt to decrease. In this way, the heating device 1 of the present application can heat the expanded film 21 of wafers 2 of different sizes. Compared with the related art, each heating module 13 needs to be switched in position by the operator individually. The heating device 1 of the present application, while ensuring that the expansion film 21 can be heated and can adapt to wafers 2 of different sizes, multiple heating modules 13 can be switched in position at the same time, making the structure in the heating device 1 more integrated and simplified, and the use of the heating device 1 is also more convenient, avoiding the impact on production efficiency.

[0055] Specifically, taking the application of the heating device 1 to 8-inch wafer 2 and 12-inch wafer 2 as an example, when the rotating part 121 simultaneously drives multiple heating modules 13 away from the rotating part 121 along the radial direction of the wafer 2, the heating device 1 can change from heating the expansion film 21 of the 8-inch wafer 2 to heating the expansion film 21 of the 12-inch wafer 2, and the size specifications of the wafer 2 that the heating device 1 can adapt to increase; when the rotating part 121 simultaneously drives multiple heating modules 13 along the radial direction of the wafer 2 to approach the rotating part 121, the heating device 1 can change from heating the expansion film 21 of the 12-inch wafer 2 to heating the expansion film 21 of the 8-inch wafer 2, and the size specifications of the wafer 2 that the heating device 1 can adapt to decrease.

[0056] In some embodiments, the heating device 1 may include a plurality of mounting units 14 movably disposed on the base 11. For example, the mounting unit 14 may be configured in a plate shape, and the heating module 13 may be disposed on the mounting unit 14. One end of the first transmission member 122 may be rotatably connected to the rotating member 121, and the other end of the first transmission member 122 may be rotatably connected to the mounting unit 14. The rotating member 121 is configured to synchronously drive the plurality of mounting units 14 so that the plurality of heating modules 13 simultaneously approach the rotating member 121 or simultaneously move away from the rotating member 121 in the radial direction of the wafer 2. The mounting unit 14 may be configured in a polygonal plate shape. The mounting unit 14 provides a mounting space for the heating module 13. The first transmission member 122 may also be indirectly rotatably connected to the heating module 13 through the mounting unit 14. In this way, the rotating member 121 and the first transmission member 122 indirectly drive the heating module 13 to move in the radial direction of the wafer 2 through the mounting unit 14.

[0057] The number of heating modules 13 can be at least two. Optionally, in this application, the number of heating modules 13 is four. Figure 3 , in the circumferential direction of the wafer 2, four heating modules 13 are arranged at equal intervals and around the rotating member 121, and are respectively arranged above, below, and on the left and right sides of the rotating member 121. When the rotating member 121 rotates in the first rotation direction, the rotational force of the rotating member 121 will be converted into a pulling force on the installation unit 14, so that multiple installation units 14 are close to the rotating member 121 at the same time. When the rotating member 121 rotates in the second rotation direction, the rotational force of the rotating member 121 will be converted into a thrust on the installation unit 14, so that multiple installation units 14 are away from the rotating member 121 at the same time. It can be understood that the first rotation direction is one of the clockwise direction and the counterclockwise direction, the second rotation direction is the other of the clockwise direction and the counterclockwise direction, and the first rotation direction is opposite to the second rotation direction. Figure 3 The paper direction is referenced. Figure 3 In , the first rotation direction is clockwise and the second rotation direction is counterclockwise. Figure 3 In the figure, the mounting unit 14 and the first transmission member 122 each have two outlines, one of which is a solid outline, at which time the mounting unit 14 is at a position away from the rotating member 121. The other is a dotted outline, at which time the mounting unit 14 is at a position close to the rotating member 121. When the rotating member 121 rotates in the first rotation direction, the mounting unit 14 and the first transmission member 122 can move from the position corresponding to the solid outline to the position corresponding to the dotted outline. When the rotating member 121 rotates in the second rotation direction, the mounting unit 14 and the first transmission member 122 can move from the position corresponding to the dotted outline to the position corresponding to the solid outline. It can be understood that in Figure 3 In order to facilitate the understanding of the installation unit 14 and the first transmission member 122, Figure 3In the figure, the heating module 13 is not shown.

[0058] In some embodiments, the base 11 may be provided with a bearing seat 112 and a bearing 111 sleeved on the bearing seat 112. The rotating member 121 is constructed in an annular shape and sleeved on the bearing 111, so that the rotating member 121 can be rotatably provided on the base 11. Figure 4 , Figure 4 This is a schematic diagram of the structure of the central rotating module 12 disclosed in an embodiment of the present application. The bearing 111 and bearing seat 112 ensure that the rotating member 121 can be rotatably mounted on the base 11 while minimizing friction during rotation of the rotating member 121. The rotating member 121 may be provided with a shaft 1211, and a plurality of first transmission members 122 are rotatably mounted on the shaft 1211, allowing the first transmission members 122 to be rotatably connected to the annular rotating member 121.

[0059] In some embodiments, the heating device 1 may further include a locking module 15, which includes a latch 151, a plurality of locking plates 152, and a latch seat 153. The plurality of locking plates 152 are respectively disposed on the base 11 and are disposed around the rotating member 121. The locking plates 152 have a first positioning hole 1521. The latch seat 153 is connected to the rotating member 121 and has a second positioning hole 1531. The base 11 has a first avoidance hole 113 for avoiding the latch 151. The latch 151 is configured to sequentially pass through the first avoidance hole 113, the second positioning hole 1531, and the first positioning hole 1521 to lock the rotation angle of the rotating member 121. The locking module 15 can lock the rotating member 121 to prevent the rotating member 121 from rotating when the position of the heating module 13 does not need to be changed. This prevents the heating module 13 from shifting while heating the expansion membrane 21, thereby ensuring the stability of the heating module 13 during use. The latch 151 can be connected to the locking plate 152 from the side of the base 11 away from the first transmission member 122. The latch 151 can first pass through the first avoidance hole 113, and then pass through the first positioning hole 1521 and the second positioning hole 1531 to prevent the first transmission member 122 from blocking the second positioning hole 1531 on the latch seat 153, making it difficult to install the latch 151. Figure 4 The latch seat 153 can also be partially accommodated in the first avoidance hole 113, utilizing the size of the base 11 itself, making the locking module 15 and the base 11 more compact. Figure 4 In the figure, the latch 151 has two outlines, one of which is a solid line outline. At this time, the latch 151 is inserted into the first positioning hole 1521 and the rotation angle of the rotating member 121 is fixed; the other is a dotted line outline. At this time, the latch 151 is not inserted into the first positioning hole 1521 and the rotation angle of the rotating member 121 is not fixed.

[0060] Specifically, taking the application of the heating device 1 to 8-inch wafer 2 and 12-inch wafer 2 as an example, when the heating module 13 moves to the position corresponding to the expansion membrane 21 of the 8-inch wafer 2, the pin 151 can pass through the first avoidance hole 113, the second positioning hole 1531 and the first positioning hole 1521 on the pin seat 153 in sequence. In this way, the position of the rotating part 121 is locked, and the heating device 1 is fixed in the position for heating the expansion membrane 21 of the 8-inch wafer 2. When it is necessary to heat the expanded film 21 of the 12-inch wafer 2, the pin 151 can be pulled out first, the rotating part 121 can be rotated, and the heating module 13 can be moved to the position corresponding to the expanded film 21 of the 12-inch wafer 2. At this time, the pin 151 can be passed through the first avoidance hole 113, the second positioning hole 1531 and the first positioning hole 1521 on the other pin seat 153 in sequence. In this way, the position of the rotating part 121 is locked again, and the heating device 1 is fixed in the position for heating the expanded film 21 of the 12-inch wafer 2.

[0061] In some embodiments, the heating device 1 may include a drive module 17, which is configured to drive the rotating member 121 to rotate and / or to drive any heating module 13 to move radially relative to the wafer 2 on the susceptor 11. When the drive module 17 drives the rotating member 121 to rotate, the rotating member 121 serves as the active member and the heating module 13 as the passive member. The rotating member 121 actively drives the multiple heating modules 13 to switch positions. When the drive module 17 drives any heating module 13 to move radially relative to the wafer 2 on the susceptor 11, the heating module 13 connected to the drive module 17 serves as the active member, while the other heating modules 13 and the rotating member 121 serve as passive members. For example, if the heating module 13 connected to the drive module 17 serves as the active member, when the active heating module 13 moves radially relative to the wafer 2, the active heating module 13 converts its own linear motion into rotational motion of the rotating member 121, which in turn converts the rotational motion of the rotating member 121 into linear motion of the other heating modules 13.

[0062] Taking the rotating member 121 as an active member as an example, in some embodiments, the driving module 17 can be a handle 171 provided on the rotating member 121, and the base 11 is provided with a second avoidance hole 118 for avoiding the handle 171, and the handle 171 extends toward the second avoidance hole 118 and extends outside the second avoidance hole 118. In this way, the operator can manually drive the handle 171 to manually drive the rotating member 121 to rotate to switch the position of the heating module 13. This method of manually switching the position of the heating module 13 is suitable for scenarios where the switching frequency is not high. In other embodiments, when the switching frequency is high, the driving module 17 can be a driving motor, and the driving motor is connected to the rotating member 121. The operator can remotely control the driving motor to control the rotation of the rotating member 121, which is suitable for scenarios where the switching frequency is high.

[0063] Taking the heating module 13 as an active component as an example, in some embodiments, the driving module 17 can be a telescopic cylinder connected to the heating module 13, the telescopic cylinder is arranged on the base 11, and the telescopic cylinder has a telescopic rod extending along the radial direction of the wafer 2, and one section of the telescopic rod is connected to the heating module 13. In this way, when the telescopic rod is extended or retracted, it can drive the heating module 13 to move in a straight line. Furthermore, the cylinder body of the telescopic cylinder can be arranged on the side of the telescopic rod close to the rotating part 121, so that when the telescopic rod is retracted, the heating module 13 will be close to the rotating part 121, and when the telescopic rod is extended, the heating module 13 will be away from the rotating part 121. In addition to the telescopic cylinder, the driving module 17 can also be a driving motor, a screw and a nut seat. The output shaft of the driving motor drives the screw to rotate, and the nut seat is sleeved on the screw and connected to the rotating part 121, which can also realize that the heating module 13 acts as an active component and moves in the radial direction of the wafer 2.

[0064] It should be noted that when the driving module 17 drives the rotating member 121 to rotate, that is, when the rotating member 121 is an active member, in addition to the above-mentioned implementation of the driving module 17, the driving module 17 can also include other feasible embodiments, as long as it is ensured that the driving module 17 can drive the rotating member 121 to rotate, this application does not make specific restrictions on this. Correspondingly, when the driving module 17 drives any heating module 13 to move radially along the wafer 2 on the base 11, that is, when the heating module 13 is an active member, this application does not make specific restrictions on the implementation of the driving module 17, as long as it is ensured that the driving module 17 can drive any heating module 13 to move radially along the wafer 2 on the base 11. It should be noted that, in order to facilitate the understanding of this application, in this application, the part involving the rotation of the rotating member 121, unless otherwise specified, is understood and explained as if the driving module 17 drives the rotating member 121 to rotate, that is, the rotating member 121 is an active member.

[0065] The heating device 1 may further include a position detection module 16, which includes a detection sensor 161. The detection sensor 161 is configured to emit a signal indicating the radial position of the heating module 13 relative to the wafer 2. The signal from the detection sensor 161 allows an operator to determine the position of the heating module 13 and control the movement or stopping of the heating module 13.

[0066] In some embodiments, the position detection module 16 may further include a trigger unit 162, which may be specifically referred to in Figure 5 , Figure 5 yes Figure 2Enlarged view of section A; detection sensor 161 is disposed on base 11, trigger unit 162 is disposed on heating module 13 and faces detection sensor 161, and trigger unit 162 is configured such that when trigger unit 162 passes by detection sensor 161, detection sensor 161 emits a signal. As described above, in the case where heating device 1 is provided with mounting unit 14, trigger unit 162 can be disposed on mounting unit 14. In the present application, one or more position detection modules 16 can be provided, and the multiple position detection modules 16 correspond to the multiple heating modules 13, respectively.

[0067] Taking the application of the heating device 1 to 8-inch wafer 2 and 12-inch wafer 2 as an example, the trigger part 162 can be configured as follows: when the heating module 13 moves to the position corresponding to the expansion membrane 21 of the 8-inch wafer 2 or the 12-inch wafer 2, the trigger part 162 passes through the detection sensor 161, causing the detection sensor 161 to send a signal. In this way, when the detection sensor 161 sends a signal, it indicates that the heating module 13 has been switched to the corresponding position at this time. The operator can stop the rotation of the rotating part 121 and fix the rotating part 121 to fix the position of the heating module 13.

[0068] The position detection module 16 may further include a mounting rail 163 extending along the movement path of the mounting unit 14. A plurality of detection sensors 161 are provided and slidably disposed on the mounting rail 163, so that the positions of the plurality of detection sensors 161 can be adjusted, and the positions at which the detection sensors 161 send signals can be adjusted. This further increases the applicable range of the heating device 1. For example, the detection sensor 161 may send a signal when the heating module 13 moves to the position of the expansion film 21 for an 8-inch wafer 2 or a 10-inch wafer 2, or the detection sensor 161 may send a signal when the heating module 13 moves to the position of the expansion film 21 for an 8-inch or 12-inch wafer 2; or further, the detection sensor 161 may send a signal when the heating module 13 moves to the position of the expansion film 21 for a 10-inch or 12-inch wafer 2.

[0069] In some embodiments, the detection sensor 161 may be an optical sensor that can emit a light signal, and the trigger portion 162 may be a reflector that reflects the light signal. When the trigger portion 162 passes through the detection sensor 161 and the detection sensor 161 receives the reflected light signal, the detection sensor 161 is triggered and emits a corresponding signal. In other embodiments, in addition to optical sensors, an acoustic wave sensor that can emit sound waves may also be used. The trigger portion 162 may be a reflector that can emit sound wave signals. When the detection sensor 161 receives the sound wave signal reflected by the trigger portion 162, the position information of the trigger portion 162 can be obtained to obtain the position of the installation unit 14. In addition to the two embodiments mentioned above, the detection sensor 161 and the corresponding trigger portion 162 can also be designed as other feasible embodiments, and this application does not make specific limitations on this.

[0070] Generally speaking, when the heating module 13 is in use, the heat of the heating module 13 will radiate outward. When heating the expansion membrane 21, the heat of the heating module 13 may also affect the wafer 2 itself and other components arranged near the wafer 2. At this time, the heating device 1 also includes a plurality of shielding units 18. For example, the shielding unit 18 can be constructed in a plate shape. The shielding unit 18 can be movably set on the base 11. The shielding unit 18 is used to block the heat of the heating module 13 to limit the heating range of the heating device 1. In this way, the heat of the heating module 13 can be prevented from affecting the wafer 2 itself or other components arranged near the wafer 2. At the same time, when heating the expansion membrane 21, the shielding unit 18 can also protect the wafer 2 to prevent components falling from above the wafer 2 from damaging the wafer 2.

[0071] The moving path of the heating module 13 may have a first position and a second position, and the shielding unit 18 may be configured as follows: when the heating module 13 moves to the first position, the shielding unit 18 moves to the second position, and when the heating module 13 moves to the second position, the shielding unit 18 moves to the first position. In this way, when the heating module 13 moves to the first position, the shielding unit 18 can move to the second position to prevent the heat of the heating module 13 located at the first position from affecting the wafers within the range of the second position or other components arranged adjacent to the second position. When the heating module 13 moves to the second position, the shielding unit 18 can move to the first position to prevent the heat of the heating module 13 located at the second position from affecting the wafers within the range of the first position or other components arranged adjacent to the first position.

[0072] In some embodiments, the shielding unit 18 can be located between the heating module 13 and the base 11. The base 11 has a first opening 114 and a second opening 115 spaced apart along the moving path of the heating module 13. The heat output of the heating module 13 is directed toward the base 11. The first position of the heating module 13 can correspond to the first opening 114, and the second position of the heating module 13 can correspond to the second opening 115. Taking the application of the heating device 1 to 8-inch wafers 2 and 12-inch wafers 2 as an example, the position of the first opening 114 can correspond to the position of the expanded film 21 of the 12-inch wafer 2, and the position of the second opening 115 can correspond to the position of the expanded film 21 of the 8-inch wafer 2. In this way, the first position of the heating module 13 can correspond to the position of the expanded film 21 of the 12-inch wafer 2, and the second position of the heating module 13 can correspond to the position of the expanded film 21 of the 8-inch wafer 2. Alternatively, the position of the first opening 114 may correspond to the position of the expansion film 21 of the 8-inch wafer 2, and the position of the second opening 115 may correspond to the position of the expansion film 21 of the 12-inch wafer 2. In this way, the first position of the heating module 13 may correspond to the position of the expansion film 21 of the 8-inch wafer 2, and the second position of the heating module 13 may correspond to the position of the expansion film 21 of the 12-inch wafer 2. In this application, the first opening 114 corresponds to the position of the expansion film 21 of the 12-inch wafer 2, and the second opening 115 corresponds to the position of the expansion film 21 of the 8-inch wafer 2. For details, please refer to Figure 6 ,exist Figure 6 In FIG, two wafers 2 are shown, wherein the upper wafer 2 is an 8-inch wafer 2 and the lower wafer 2 is a 12-inch wafer 2. It can be understood that Figure 6 The two wafers 2 shown are merely for illustrative purposes to understand the positions of the first opening 114 and the second opening 115 , and do not mean that two wafers 2 are actually provided during the heating process of the expanded film 21 .

[0073] Furthermore, the shielding unit 18 can be understood as follows: when the heating module 13 moves to the first position, the shielding unit 18 shields the second opening 115; when the heating module 13 moves to the second position, the shielding unit 18 shields the first opening 114. When the heating module 13 moves to the second position and the shielding unit 18 shields the first opening 114, the heating module 13 can heat the expanded film 21 of the 8-inch wafer 2, and the shielding unit 18 moves to the outside of the wafer 2 to prevent the heat of the heating device 1 from affecting other components arranged near the wafer 2. When the heating module 13 moves to the first position and the shielding unit 18 shields the second opening 115, the heating module 13 can heat the expanded film 21 of the 12-inch wafer 2, and the shielding unit 18 moves into the wafer 2 to prevent the heat of the heating module 13 from affecting the wafer 2 itself.

[0074] In some embodiments, the heating device 1 may include a transmission module 19 disposed on the base 11. The heating module 13 and the shielding unit 18 are respectively connected to the transmission module 19. The transmission module 19 is configured to drive the heating module 13 and the shielding unit 18 to move simultaneously and in opposite directions. The transmission module 19 indirectly connects the rotating member 121 to the shielding unit 18. The rotating member 121 first drives the heating module 13 to move, and the heating module 13 then drives the shielding unit 18 through the transmission module 19.

[0075] It is understandable that, through the transmission module, the central rotating module 12 can simultaneously drive multiple heating modules 13 to approach the rotating member 121 or simultaneously move away from the rotating member 121, and can also simultaneously drive multiple shielding units 18 to approach the rotating member 121 or simultaneously move away from the rotating member 121 during one rotation of the rotating member 121. In this way, the rotational motion of the rotating member 121 can be converted into the linear motion of the heating module 13 and the linear motion of the shielding unit 18 respectively. In the case where multiple shielding units 18 are provided, the operator does not need to adjust the positions of the multiple shielding units 18 individually. In the case where the shielding units 18 are provided, the structure of the heating device 1 is more integrated and simplified, and the use of the heating device 1 is also more convenient, avoiding the impact on production efficiency.

[0076] In some embodiments, the transmission module 19 may include a first pulley 191, a second pulley 192 and a connecting belt 193. The first pulley 191 and the second pulley 192 are rotatably disposed on the base 11 and are arranged at intervals along the moving direction of the heating module 13; the connecting belt 193 is respectively sleeved on the first pulley 191 and the second pulley 192, and the connecting belt 193 is formed with a first section 1931 and a second section 1932 that are relatively disposed. The heating module 13 is connected to one of the first section 1931 and the second section 1932, and the shielding unit 18 is connected to the other of the first section 1931 and the second section 1932. In this way, the connecting belt 193 sleeved on the first pulley 191 and the second pulley 192 can form a closed loop structure. The two pulleys will drive one of the first section 1931 and the second section 1932 to move linearly and force the other of the first section 1931 and the second section 1932 to move in the opposite direction. In this way, when the heating module 13 moves linearly along the radial direction of the wafer 2, the shielding unit 18 can move in the opposite direction. Figure 7The connecting belt 193 is formed into two sections, with the section of the connecting belt 193 away from the base 11 being the first section 1931 and the section of the connecting belt 193 closer to the base 11 being the second section 1932. In this case, the heating module 13 can be connected to the first section 1931, and the shielding unit 18 can be connected to the second section 1932. The heating module 13 is fixed to the first section 1931. The movement of the heating module 13 will pull the first section 1931 to move. The movement of the first section 1931, through the pulley, drives the second section 1932 to move in the opposite direction.

[0077] It is understood that the first pulley 191, the second pulley 192, and the connecting belt 193 can be mutually transmitted through gear meshing. For example, the first pulley 191 and the second pulley 192 can be gears, and correspondingly, the connecting belt 193 can be provided with teeth. In this case, the first section 1931 and the second section 1932 can be understood as two racks. In this way, when the two pulleys rotate, the rotational motion of the gears can be converted into the linear motion of the two racks, realizing transmission between the two pulleys and the connecting belt 193. In some embodiments, the first pulley 191 and the second pulley 192 can also be sprockets, and correspondingly, the connecting belt 193 can be a chain. The connecting belt 193 can mesh with the first pulley 191 and the second pulley 192 to realize transmission. In another embodiment, the first pulley 191 and the second pulley 192 can be rollers, and correspondingly, the connecting belt 193 can be a belt. The transmission between the connecting belt 193 and the first pulley 191 and the second pulley 192 can be realized by friction.

[0078] The base 11 may be provided with a plurality of first mounting rods 116 and a plurality of second mounting rods 117, each extending radially along the wafer 2. The plurality of first mounting rods 116 are arranged in parallel and spaced apart, and are located on either side of the heating module 13 in the direction of movement. The heating module 13 is slidably mounted on the first mounting rods 116. The plurality of second mounting rods 117 are arranged in parallel and spaced apart, and are located on either side of the shielding unit 18 in the direction of movement. The shielding unit 18 is slidably mounted on the second mounting rods 117. The plurality of first mounting rods 116 arranged in parallel can form a guide rail structure, effectively constraining the movement trajectory of the heating module 13, preventing lateral deviation and shaking of the heating module 13, and ensuring the stability of the heating module 13 during movement. Similarly, the plurality of second mounting rods 117 arranged in parallel can also form a guide rail structure, effectively constraining the movement trajectory of the shielding unit 18, preventing lateral deviation and shaking of the shielding unit 18, and ensuring the stability of the shielding unit 18 during movement.

[0079] As described above, when the base 11 is provided with the first mounting rod 116, the second mounting rod 117 and the transmission module 19, the heating device 1 may further include a first connecting platform 3 and a second connecting platform 31 connected to the heating module 13 and the shielding unit 18, respectively. The first connecting platform 3 is used to connect to the connecting belt 193, and the second connecting platform 31 is used to connect to the mounting rod. When the mounting unit 13 is provided, the first connecting platform 3 and the second connecting platform 31 may be indirectly connected to the heating module 13 through the mounting unit 13. In some embodiments, the first connecting platform 3 and the second connecting platform 31 may also be connected to each other, see Figure 7 , the mounting rod is close to the heating module 13 and the shielding unit 18, and the transmission module 19 is away from the heating module 13 and the shielding unit 18. At this time, the second connecting platform 31 can be directly connected to the heating module 13 and the shielding unit 18, and the first connecting platform 3 is set on the second connecting platform 31 and connected to the connecting belt 193 in the transmission module 19.

[0080] According to a second aspect of the present application, a heating device is also provided. The heating device is used to heat treat an expanded film 21 on a wafer 2. The edge of the expanded film 21 is fixed to a wafer frame 22. The heating device includes a heat expansion plate, a heating device 1, and a drive device. The heat expansion plate is used to support the expanded film 21. The heating device 1 is any of the heating devices 1 described above and has all of the beneficial effects thereof, which are not further described here. The drive device is connected to the base 11 and is used to drive the base 11 to rotate, thereby driving the multiple heating modules 13 to move along the circumference of the wafer 2.

[0081] Taking the heating device as an example, when heating the expanded film 21 of a 12-inch wafer 2, the latch 151 of the locking module 15 can sequentially penetrate the first avoidance hole 113, the second positioning hole 1531, and the first positioning hole 1521 on the locking plate 152 to fix the rotation angle of the rotating member 121, while maintaining the positions of the heating module 13 and the shielding unit 18. At this point, the heating module 13 can be in the first position, which corresponds to the position of the expanded film 21 of the 12-inch wafer 2. Correspondingly, the shielding unit 18 is in the second opening 115.

[0082] When it is necessary to process the 8-inch wafer 2, the latch 151 must be pulled out first to rotate the rotating member 121, and then the rotating member 121 must be rotated by the driving module 17. As described above, the operator can manually drive the rotating member 121 to rotate by the handle 171. In this way, the multiple first transmission members 122 will respectively pull the multiple heating modules 13 so that the multiple heating modules 13 can be close to the rotating member 121, that is, so that the multiple heating modules 13 are close to the center of the wafer 2 at the same time. Furthermore, through the transmission module 19, the shielding unit 18 can move in the opposite direction to the heating module 13, that is, move in a direction away from the rotating member 121. When the heating module 13 moves a certain distance, the detection sensor 161 in the position detection module 16 can be triggered to send a signal that the heating module 13 has moved into position. At this time, the heating module 13 moves from the first position to the second position, and the second position corresponds to the position of the expansion film 21 of the 8-inch wafer 2. Correspondingly, the shielding unit 18 moves from the second opening 115 to the first opening 114. By detecting the signal of the sensor 161, the operator can stop the movement of the heating module 13 and the shielding unit 18. The pin 151 in the locking module 15 can pass through the first avoidance hole 113, the second positioning hole 1531 and the first positioning hole 1521 on the other locking plate 152 in sequence to fix the rotation angle of the rotating part 121, so that the heating equipment can heat the expansion film 21 of the 8-inch wafer 2. Through the above process, the heating equipment can be compatible with both 8-inch and 12-inch wafers 2 and heat the expansion film 21 on the wafer 2.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heating device, characterized in that: Used for heat-treating an expansion film (21) attached to a wafer (2), the heating device (1) comprises: base (11); a central rotating module (12), comprising a rotating member (121) and a plurality of first transmission members (122), wherein the rotating member (121) is rotatably disposed on the base (11); and a plurality of heating modules (13), the plurality of heating modules (13) surrounding the rotating member (121) and being movably arranged on the base (11) along the radial direction of the wafer (2); The two ends of the first transmission member (122) are rotatably connected to the rotating member (121) and the heating module (13), respectively, and the rotating member (121) is configured to synchronously drive the plurality of heating modules (13), so that the plurality of heating modules (13) are simultaneously close to the rotating member (121) or simultaneously away from the rotating member (121) along the radial direction of the wafer (2).

2. The heating device according to claim 1, characterized in that The heating device (1) comprises a plurality of mounting units (14) movably arranged on the base (11), and the heating module (13) is arranged on the mounting units (14); One end of the first transmission member (122) is rotatably connected to the rotating member (121), and the other end of the first transmission member (122) is rotatably connected to the mounting unit (14). The rotating member (121) is configured to synchronously drive a plurality of the mounting units (14), so that the plurality of heating modules (13) simultaneously approach the rotating member (121) or simultaneously move away from the rotating member (121) along the radial direction of the wafer (2).

3. The heating device according to claim 1, characterized in that The base (11) is provided with a bearing seat (112) and a bearing (111) sleeved outside the bearing seat (112); the rotating member (121) is constructed in an annular shape and sleeved on the bearing (111), so that the rotating member (121) can be rotatably arranged on the base (11).

4. The heating device according to claim 1, characterized in that The heating device (1) further comprises a locking module (15), wherein the locking module (15) comprises: Latch (151); A plurality of locking plates (152): the plurality of locking plates (152) are respectively arranged on the base (11) and arranged around the rotating member (121), and the locking plates (152) have a first positioning hole (1521); and A latch seat (153), the latch seat (153) is connected to the rotating member (121), and the latch seat (153) has a second positioning hole (1531), The base (11) has a first avoidance hole (113) for avoiding the latch (151), and the latch (151) is configured to be able to pass through the first avoidance hole (113), the second positioning hole (1531) and the first positioning hole (1521) in sequence to lock the rotating member (121).

5. The heating device according to claim 1, characterized in that The heating device (1) further comprises a position detection module (16), wherein the position detection module (16) comprises: A detection sensor (161) is provided on the base (11), wherein the detection sensor (161) is configured such that a signal emitted by the detection sensor (161) is used to represent the radial position of the heating module (13) relative to the wafer (2).

6. The heating device according to any one of claims 1 to 5, characterized in that: The heating device (1) has a driving module (17), and the driving module (17) is configured to drive the rotating member (121) to rotate.

7. The heating device according to claim 6, characterized in that The driving module (17) comprises a handle (171) arranged on the rotating member (121), the handle (171) being used to manually drive the rotating member (121) to rotate, the base (11) being provided with a first avoidance hole (113) for avoiding the handle (171), and the handle (171) extending toward the first avoidance hole (113) and extending outside the first avoidance hole (113).

8. The heating device according to any one of claims 1 to 5, characterized in that: The heating device (1) has a driving module (17), and the driving module (17) is configured to drive any one of the heating modules (13) to move along the radial direction of the wafer (2) on the base (11).

9. The heating device according to claim 8, characterized in that A plurality of first mounting rods (116) are provided on the base (11), and the first mounting rods (116) extend radially along the wafer (2), wherein the plurality of first mounting rods (116) are arranged in parallel and at intervals, and are located on both sides of the moving direction of the heating module (13), and the heating module (13) can be slidably mounted on the first mounting rods (116).

10. A heating device, characterized in that: The heating device is used to perform heat treatment on the expansion film (21) attached to the wafer (2), the edge of the expansion film (21) being fixed on the wafer frame (22), and the heating device comprises: a thermal expansion plate for carrying the expansion film (21); The heating device (1) according to any one of claims 1 to 9; and A driving device is connected to the base (11) and is used to drive the base (11) to rotate.

Images