Chip transfer processing method and chip processing equipment

Abstract

The present invention belongs to the field of chip processing technology, and discloses a chip transfer processing method and chip processing equipment. The method includes obtaining the chip position, adsorbing the second area on the back of the chip, and lifting the chip to the handover position to separate the chip from the ejection device; handing over the chip to transfer from the second area on the back of the chip to the first area on the back of the chip; after the handover, transferring the chip and keeping the front side of the chip facing up until the chip is transferred to a preset position; by adopting the above method, the chip located on the ejection device is adsorbed from the second area on the back, and then transferred to the first area on the back of the chip, thereby replacing the existing method of directly adsorbing the front side of the chip, the chip is picked up, and then the chip is transferred and kept facing up until bonding is completed at the preset position. During the entire picking and transfer process, the front side of the chip will not be adsorbed and there will be no contact with the front side of the chip, thereby avoiding scratches on the front side of the chip and generating dirt, and effectively ensuring the bonding effect.

Description

Technical Field

[0001] The present invention relates to the field of chip processing technology, and in particular to a chip transfer processing method and chip processing equipment. Background Art

[0002] The bonding process between the chip and the material to be bonded refers to the process of tightly combining the chip and the material to be bonded through physical or chemical means. During the bonding process between the chip and the material to be bonded, the chip is picked up and transported.

[0003] In existing technology, chips are typically adhered to an adhesive film or carried on a tray. A lift-out device is first used to lift the chip from the back, and then a mechanism is used to pick up the chip from the front. The chip is then transferred to a specific location for bonding. However, contact between the mechanism and the front of the chip can easily cause scratches and contamination, which can affect the final bonding effect.

[0004] That is, the existing mechanism picks up the adsorbed chip from the front at the ejection device and transfers the chip, which has the disadvantage of easily causing scratches and dirt on the front of the chip, thereby affecting the bonding effect. Summary of the Invention

[0005] The purpose of the present invention is to provide a chip transfer processing method and chip processing equipment, so as to pick up and transfer the chip from the ejection device without contacting the front side of the chip, avoid contact with the front side of the chip, effectively prevent scratches and dirt on the front side of the chip, and ensure the bonding effect.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] The present invention provides a chip transfer processing method, wherein the back side of the chip faces downward, and an ejection device lifts up a first area of ​​the back side of the chip. The chip transfer processing method is used to transfer and process the chip without contacting the front side of the chip, and includes the following steps:

[0008] Obtaining the position of the chip, adsorbing the second area on the back side of the chip, and lifting the chip to the handover position to separate the chip from the ejection device;

[0009] Handing over the chip at the handover position to switch from adsorbing the second area on the back side of the chip to adsorbing the first area on the back side of the chip; after the handover, transferring the chip and keeping the front side of the chip facing upward until the chip is transferred to a predetermined position;

[0010] At the preset position, the front side of the chip is bonded to the surface of the material to be bonded.

[0011] As an optional technical solution for a chip transfer processing method, from obtaining the chip position to before bonding, the chip is transferred by moving along a straight path and / or a curved path to always adsorb the back of the chip and keep the front of the chip facing up.

[0012] As an optional technical solution for a chip transfer processing method, after obtaining the chip position, the picking finger of the picking mechanism is moved to the position corresponding to the chip position, and the picking finger rises until it contacts the back of the chip and adsorbs the second area on the back of the chip.

[0013] As an optional technical solution for a chip transfer processing method, before the picking finger contacts the back of the chip, the distance between the two picking fingers of the picking mechanism is adjusted until they are compatible with the chip.

[0014] As an optional technical solution for a chip transfer processing method, a picking mechanism is used to adsorb and lift the chip to the handover position; at the handover position, the chip transfer finger of the chip transfer mechanism adsorbs the first area on the back of the chip, and then the picking mechanism is closed so that it cannot adsorb the chip. The chip transfer finger drives the chip to move and detach from the picking mechanism to complete the handover.

[0015] As an optional technical solution for a chip transfer processing method, the chip transfer mechanism includes multiple groups of synchronously moving chip transfer fingers, and each group of chip transfer fingers completes the handover with the picking mechanism from the handover position in turn.

[0016] As an optional technical solution for a chip transfer processing method, before the chip transfer finger absorbs the chip, the chip transfer finger is moved to the handover and material collection position corresponding to the chip position with reference to the position of the picking mechanism, and the chip transfer finger is lifted at the handover and material collection position until it contacts the chip.

[0017] As an optional technical solution for a chip transfer processing method, after the handover and before the chip is transferred to the preset position, the chip is transferred to a detection position, and the chip is detected at the detection position.

[0018] As an optional technical solution for a chip transfer processing method, before the chip is transferred to the detection position, the chip is transferred to a cleaning position, and the chip is cleaned at the cleaning position.

[0019] The present invention provides a chip processing device, comprising:

[0020] The picking mechanism includes a picking drive structure and a picking finger, wherein the picking drive structure drives the picking finger to move, and the picking finger is used to adsorb the second area on the back side of the chip;

[0021] The chip conveying mechanism includes a chip conveying driving structure and a chip conveying finger. The chip conveying driving structure drives the chip conveying finger to move, and the chip conveying finger is used to adsorb the first area on the back side of the chip.

[0022] As an optional technical solution for chip processing equipment, it also includes a fixed platform and a pressurizing mechanism, wherein the fixed platform is used to fix the material to be bonded at a preset position and keep the bonding surface of the material to be bonded facing downward, and the pressurizing mechanism is used to bond the front side of the chip to the material to be bonded at the preset position.

[0023] Beneficial effects:

[0024] The present invention provides a chip transfer processing method, wherein the back of the chip faces downward, and an ejection device lifts up the first area of ​​the back of the chip. The chip transfer processing method is used to transfer and process the chip without contacting the front of the chip, obtain the chip position, adsorb the second area of ​​the back of the chip, and lift the chip to a handover position to separate the chip from the ejection device; at the handover position, the chip is handed over to transfer from the second area of ​​the back of the chip to the first area of ​​the back of the chip; after the handover, the chip is transferred and the front of the chip is kept facing upward until the chip is transferred to a preset position; at the preset position, the front of the chip is bonded to the surface of the material to be bonded. By adopting the above method, the chip located on the ejection device is adsorbed from the second area of ​​the back, and then transferred to the first area of ​​the back of the chip, thereby replacing the existing method of directly adsorbing the front of the chip, the chip is picked up, and then the chip is transferred and the front of the chip is kept facing upward until bonding is completed at the preset position. During the entire picking and transfer process, the front of the chip is not adsorbed and there is no contact with the front of the chip, thereby avoiding scratches and dirt on the front of the chip, and effectively ensuring the bonding effect.

[0025] The present invention provides a chip processing device, comprising a pickup mechanism and a chip transfer mechanism. The pickup mechanism includes a pickup drive structure and a pickup finger. The pickup drive structure drives the pickup finger to move, and the pickup finger is used to attract the second area on the back side of the chip. The chip transfer mechanism includes a chip transfer drive structure and a chip transfer finger. The chip transfer drive structure drives the chip transfer finger to move, and the chip transfer finger is used to attract the first area on the back side of the chip. By using the pickup drive structure and the chip transfer structure to transfer the chip, the attraction position on the back side of the chip can be changed while effectively protecting the front side of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a structural diagram of a picking mechanism provided by an embodiment of the present invention;

[0027] Figure 2 1 is a structural diagram of a film transmission mechanism provided by an embodiment of the present invention;

[0028] Figure 3It is a structural diagram of a picking mechanism and a film conveying mechanism provided by an embodiment of the present invention;

[0029] Figure 4 This is a flow chart of a chip transfer processing method provided by an embodiment of the present invention;

[0030] Figure 5 This is a partial structural diagram of a pickup mechanism picking up a chip provided by an embodiment of the present invention;

[0031] Figure 6 This is a partial structural diagram of a chip transfer mechanism and a chip transfer mechanism provided by an embodiment of the present invention;

[0032] Figure 7 It is a partial structural diagram of the film conveying finger and the first material receiving device provided in an embodiment of the present invention;

[0033] Figure 8 It is a partial structural diagram of a first material receiving device, a detection device, and a cleaning device provided in an embodiment of the present invention;

[0034] Figure 9 This is a partial structural diagram of the film-transmitting finger and the pressing mechanism provided by an embodiment of the present invention in a first state;

[0035] Figure 10 This is a partial structural diagram of the film-transmitting finger and the pressing mechanism provided by an embodiment of the present invention in the second state;

[0036] Figure 11 is a partial structural diagram of the film-transmitting finger and the pressing mechanism in the third state provided by an embodiment of the present invention;

[0037] Figure 12 Schematic diagram of the structure of the pressurizing mechanism and the fixing platform provided in an embodiment of the present invention;

[0038] Figure 13 It is a schematic structural diagram of the bonding between a chip and a material to be bonded provided by an embodiment of the present invention.

[0039] In the picture:

[0040] 1. Chip; 2. Material to be bonded; 3. Ejector;

[0041] 4. Sheet removal station; 5. Processing station; 6. Bonding station;

[0042] 10. Picking mechanism; 11. Picking drive structure; 12. Picking finger;

[0043] 20. Film transmission mechanism; 21. Film transmission drive structure; 22. Film transmission finger; 22a. First film transmission finger; 22b. Second film transmission finger;

[0044] 30. Detection device; 40. Cleaning device;

[0045] 50. First material receiving device; 51. First material receiving shaft; 52. Transmission mechanism;

[0046] 60. Pressurizing mechanism; 61. Second material receiving shaft;

[0047] 70. Fixed platform. DETAILED DESCRIPTION

[0048] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0049] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0050] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0051] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on those shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0052] like Figure 1As shown, on the one hand, this embodiment provides a chip processing device, which includes a picking mechanism 10, and the picking mechanism 10 includes a picking drive structure 11 and a picking finger 12. The picking drive structure 11 drives the picking finger 12 to move, and the picking finger 12 is used to adsorb the second area on the back side of the chip 1.

[0053] The chip 1 has a front side and a back side, which are arranged opposite to each other along the thickness direction of the chip 1. The front side of the chip 1 is used for bonding with the material 2 to be bonded, which includes but is not limited to a wafer, a chip or a PCB.

[0054] Specifically, two picking fingers 12 are arranged at intervals, and the picking driving structure 11 is connected to the picking fingers 12. The picking driving structure 11 drives at least one picking finger 12 to move so that the two picking fingers 12 move closer to or farther away from each other.

[0055] Among them, the picking drive structure 11 can be connected to the picking finger 12 through a transmission component, and the transmission component can be a screw nut and a gear rack, etc.; in order to limit the moving trajectory of the two picking fingers 12, a guide rail extending in the horizontal direction can be further set; the picking drive structure 11 is a motor or a cylinder; an air channel is provided in the picking finger 12, and a suction device is arranged at one end of the air channel of the picking finger 12 and a suction port is provided at the other end, and the suction device can be used to generate negative pressure at the suction port of the picking finger 12 to adsorb the chip 1; the suction device of the picking mechanism 10 can be opened or closed at any time according to actual needs.

[0056] In this embodiment, the pickup drive structure 11 drives the two pickup fingers 12 to move synchronously in the horizontal direction; when the distance between the two pickup fingers 12 matches the size of the chip 1, the two pickup fingers 12 can respectively adsorb the second area on the back side of the chip 1 from both sides.

[0057] like Figure 2 As shown, the chip processing equipment also includes a chip conveying mechanism 20, which includes a chip conveying driving structure 21 and a chip conveying finger 22. The chip conveying driving structure 21 drives the chip conveying finger 22 to move, and the chip conveying finger 22 is used to adsorb the first area on the back of the chip 1.

[0058] Specifically, the chip transmission drive structure 21 can be a rotary or transverse movable drive structure, and the chip transmission finger 22 is fixed on the turntable of the rotary drive structure, or fixed on the carrier plate of the transverse movable drive structure; an air channel is provided in the chip transmission finger 22, and an aspirator is arranged at one end of the air channel of the chip transmission finger 22 and an adsorption port is provided at the other end. The aspirator can be used to generate negative pressure at the adsorption port of the chip transmission finger 22 to adsorb the chip 1; the aspirator of the chip transmission mechanism 20 can be opened or closed at any time according to actual needs.

[0059] In this embodiment, the film transmission drive structure 21 is a rotary drive structure, and the film transmission fingers 22 are fixed on the turntable of the film transmission drive structure 21. The turntable is a circular disk, and two groups of film transmission fingers 22 are arranged at intervals around the turntable; the film transmission fingers 22 extend along the radial direction of the turntable, and the film transmission fingers 22 are retractable structures independently controlled by a motor or a cylinder.

[0060] like Figures 3 to 5 As shown, the chip processing equipment is provided with a chip picking station 4 and a bonding station 6; when the turntable of the chip transfer driving structure 21 rotates and drives the chip transfer finger 22 to move, the chip transfer finger 22 moves from one of the chip picking station 4 and the bonding station 6 to the position of the other.

[0061] In this embodiment, the chip processing equipment further includes a processing station 5. The wafer removal station 4, the processing station 5, and the bonding station 6 are spaced apart around the circumference of the turntable, with the processing station 5 located between the wafer removal station 4 and the bonding station 6. When one of the groups of wafer transfer fingers 22 moves to the processing station 5, the chip 1 attracted by the group of wafer transfer fingers 22 is inspected and / or cleaned.

[0062] It is understood that the pick-up finger 12 of the pick-up mechanism 10 is configured to be able to rise and fall vertically and extend and retract horizontally, and the chip-transfer finger 22 of the chip-transfer mechanism 20 is configured to be able to rise and fall vertically and move horizontally. This allows the pick-up mechanism 10 and the chip-transfer mechanism 20 to be aligned with the workstations of the chip processing equipment to smoothly complete the transfer and processing of the chip 1. The specific implementation and control of the movement of the pick-up finger 12 or the chip-transfer finger 22 can be designed with reference to existing technologies, such as by equipping them with a lifting drive or a corresponding mechanical structure for lateral movement. Alternatively, a control system can be provided to precisely control the movement of the pick-up mechanism 10 and the chip-transfer mechanism 20.

[0063] The ejection device 3 is located at the chip removal station 4, and the ejection device 3 lifts up the first area on the back side of the chip 1 (see Figure 5 ); The picking mechanism 10 is also located at the chip picking station 4. The picking fingers 12 of the picking mechanism 10 can adsorb the second area on the back of the chip 1 and lift the chip 1 to the handover position in the vertical direction, so that the chip 1 is separated from the ejection device 3; a group of chip transfer fingers 22 of the chip transfer mechanism 20 stays at the chip picking station 4 and waits. When the chip 1 is lifted to the handover position by the picking fingers 12, the chip transfer fingers 22 extend, and the chip transfer fingers 22 and the picking fingers 12 hand over the chip 1 at the handover position. After the handover, the chip transfer fingers 22 adsorb the first area on the back of the chip 1, and then the chip transfer fingers 22 drive the chip 1 to transfer and keep the front of the chip 1 facing up, and transfer the chip 1 to the processing station 5 and the bonding station 6 in turn. The chip 1 completes the chip bonding from bottom to top at the bonding station 6. In this embodiment, the first area is the middle position of the back of the chip 1, and the second area is the edge position of the back of the chip 1.

[0064] By adopting the pickup mechanism 10 and the chip transfer mechanism 20 to transfer the chip 1 at the transfer position, the adsorption position of the back side of the chip 1 can be changed and the front side of the chip 1 can be effectively protected.

[0065] See also Figure 12 Optionally, the chip processing equipment also includes a fixed platform 70 and a pressurizing mechanism 60, the fixed platform 70 is used to fix the material to be bonded 2 at a preset position and keep the bonding surface of the material to be bonded 2 facing downward, and the pressurizing mechanism 60 is used to bond the front side of the chip 1 to the material to be bonded 2 at the preset position.

[0066] In this embodiment, the fixed platform 70 and the pressurizing mechanism 60 are both located at the bonding station 6 (i.e., the preset position); each group of transfer fingers 22 has at least two transfer parts, and all the transfer parts on each group of transfer fingers 22 are used to jointly support the back of the chip 1. A gap is formed between two adjacent transfer parts for the pressurizing mechanism 60 to pass through. After the transfer fingers 22 transfer the chip 1 to the bonding station 6, the pressurizing mechanism 60 partially passes through the gap of the transfer fingers 22 and is used to lift the first area on the back of the chip 1. The transfer fingers 22 retract, and then the pressurizing mechanism 60 lifts the chip 1 and bonds the front side of the chip 1 to the material 2 to be bonded from bottom to top; the material 2 to be bonded is a wafer.

[0067] In this embodiment, the chip processing equipment is placed on a horizontal workbench to ensure a stable state. "Upward" refers to the side facing away from the horizontal workbench, and "downward" refers to the side facing the horizontal workbench. "Bonding chip 1 from bottom to top" means that chip 1 is moved vertically away from the horizontal workbench. In other embodiments, "bonding material 2 from top to bottom" can also be employed, where chip 1 remains stationary while material 2 is moved vertically toward the horizontal workbench.

[0068] like Figure 4 As shown, another aspect of this embodiment provides a chip transfer processing method, wherein the back side of the chip 1 faces downward, and the ejection device 3 lifts up the first area of ​​the back side of the chip 1. The chip transfer processing method is used to transfer and process the chip 1 without contacting the front side of the chip 1, and specifically includes the following steps:

[0069] Step S1 , obtaining the position of the chip 1 , adsorbing the second area on the back side of the chip 1 , and lifting the chip 1 to the handover position, so that the chip 1 is separated from the ejection device 3 .

[0070] See also Figure 5Typically, an identification system is used to identify the positions of the chips 1 attached to the wafer ring, and then one of the chips 1 is moved to the position of the ejection device 3. The ejection device 3 uses ejector pins to eject upward from the initial position in a vertical direction to gradually lift the first area on the back of the chip 1.

[0071] Step S11: A specific height position is pre-set, and the ejection device 3 is used to lift the chip 1 to the specific height position. Then, based on the position and height of the chip 1, the pick-up finger 12 of the pick-up mechanism 10 is moved to a position corresponding to the position of the chip 1. The pick-up finger 12 is raised until it contacts the back side of the chip 1 and absorbs the second area on the back side of the chip 1. In this embodiment, the pick-up finger 12 is moved to the side of the chip 1 facing the horizontal operating table, that is, below the chip 1 and corresponding to the position of the chip 1.

[0072] Step S12 : Next, the pick-up fingers 12 of the pick-up mechanism 10 are used to absorb and lift the chip 1 to the handover position.

[0073] Optionally, before the pick-up fingers 12 come into contact with the back of the chip 1, the distance between the two pick-up fingers 12 of the pick-up mechanism 10 is adjusted until the distance between the two pick-up fingers 12 matches the chip 1. By adjusting the positions of the two pick-up fingers 12 before the pick-up fingers 12 come into contact with the back of the chip 1, it is possible to adapt to chips 1 of different sizes and ensure the stability of the chip 1 adsorption.

[0074] When the two pick fingers 12 come into contact with the back of the chip 1, the suction device of the pick mechanism 10 is opened, allowing both pick fingers 12 to absorb the back of the chip 1. After the pick fingers 12 absorb the back of the chip 1, they are moved upward in the vertical direction to lift the chip 1, separating the back of the chip 1 from the ejection device 3 until the chip 1 is lifted to the handover position. At this time, the ejector pins of the ejection device 3 return to their initial position in the vertical direction.

[0075] Step S2, hand over the chip 1 at the handover position, so as to transfer from the second area on the back side of the adsorption chip 1 to the first area on the back side of the adsorption chip 1; after the handover, transfer the chip 1 and keep the front side of the chip 1 facing up until the chip 1 is transferred to the preset position.

[0076] The chip 1 is transferred at the transfer position, which refers to the process of transferring the chip 1 from one mechanism to another. In this embodiment, at the transfer position, the chip 1 is transferred from the pickup mechanism 10 to the transfer mechanism 20.

[0077] Step S21 : Before the transfer finger 22 absorbs the chip 1 , refer to the position of the pickup mechanism 10 and move the transfer finger 22 to the transfer position corresponding to the position of the chip 1 . The transfer finger 22 is lifted at the transfer position until it contacts the chip 1 .

[0078] See also Figure 6 In this embodiment, a group of chip-transmitting fingers 22 of the chip-transmitting mechanism 20 stays at the chip-retrieving station 4 and waits. By controlling the extension of the chip-transmitting finger 22, the end of the chip-transmitting finger 22 can be extended to the side of the chip 1 facing the horizontal operating table (that is, below the chip 1 and corresponding to the position of the chip 1), and reaches the handover and material-retrieving position, and then the chip-transmitting finger 22 is controlled to move upward in the vertical direction to achieve contact with the back of the chip 1.

[0079] In step S22 , at the handover position, the chip finger 22 of the chip transfer mechanism 20 is used to adsorb the first area on the back side of the chip 1 , and then the pickup mechanism 10 is closed so that it cannot adsorb the chip 1 . The chip finger 22 drives the chip 1 to move and detach from the pickup mechanism 10 to complete the handover.

[0080] First, the chip 1 located on the ejection device 3 is adsorbed from the second area on the back side, and then the chip 1 is adsorbed on the first area on the back side, thereby replacing the existing method of directly adsorbing the front side of the chip 1. This can not only pick up the chip 1 from the ejection device 3 without contacting the back side of the chip 1, but also help the stability of the chip 1 during the subsequent transfer process.

[0081] During the handover process, the chip transfer finger 22 moves the chip 1 vertically upward from the space between the two picking fingers 12 until the chip 1 is completely free of the space between the two picking fingers 12. The chip transfer finger 22 then retracts, moving the chip 1 away from the picking mechanism 10. In other embodiments, after the suction device of the picking mechanism 10 is turned off, the picking fingers 12 can be controlled to move downward vertically while the chip transfer finger 22 moves the chip 1 upward, thereby quickly completing the handover process and separating from the picking mechanism 10.

[0082] Step S23: After the handover, the chip 1 is transferred by the chip transfer finger 22 and kept facing up until the chip 1 is transferred to the preset position.

[0083] Optionally, the wafer transfer mechanism 20 includes multiple sets of synchronously moving wafer transfer fingers 22, with each set of wafer transfer fingers 22 sequentially transferring from a transfer position to the pickup mechanism 10. Specifically, the wafer transfer drive structure 21 drives a set of wafer transfer fingers 22 to move to a position corresponding to the chip 1, then drives a set of wafer transfer fingers 22 to rise until they contact the back of the chip 1, and activates the corresponding suction device. This set of wafer transfer fingers 22 then attracts the first area on the back of the chip 1.

[0084] By providing multiple groups of chip transfer fingers 22, the chip transfer mechanism 20 drives the multiple groups of chip transfer fingers 22 to move synchronously, so as to move the multiple groups of chip transfer fingers 22 to the chip retrieval station 4 in sequence, continuously transferring multiple chips 1, which helps to improve the transfer processing efficiency.

[0085] In this embodiment, the film transmission mechanism 20 has two sets of film transmission fingers 22. The two sets of film transmission fingers 22 are arranged at the same height and the angle between their extension directions is 90 degrees. Figure 3 , the two groups of chip transfer fingers 22 are respectively the first chip transfer finger 22a and the second chip transfer finger 22b; when the chip transfer mechanism 20 is in operation, the first chip transfer finger 22a is first stopped at the chip picking station 4 for standby. After the first chip transfer finger 22a is adsorbed onto the chip 1, the turntable of the chip transfer mechanism 20 rotates counterclockwise to move the first chip transfer finger 22a to the processing station 5, and the second chip transfer finger 22b is moved to the chip picking station 4; after the second chip transfer finger 22b adsorbs the next chip 1, the turntable of the chip transfer mechanism 20 continues to rotate counterclockwise to move the first chip transfer finger 22a to the bonding station 6, and the second chip transfer finger 22b is moved to the processing station 5. This process is cyclical, and multiple chips 1 can be continuously transferred and bonded, effectively improving the transfer and processing efficiency of the chip 1.

[0086] Optionally, after handover and before chip 1 is transferred to a preset position, chip 1 is transferred to a testing position and tested at the testing position. By transferring chip 1 to the testing position for testing before bonding, the surface integrity, roughness, and thickness of chip 1 are tested. Multi-dimensional testing verifies whether the characteristics of chip 1 meet bonding requirements before bonding, thereby ensuring the reliability of chip 1 and the yield rate after bonding.

[0087] Optionally, before the chip 1 is transferred to the detection position, the chip 1 is transferred to a cleaning position, where the chip 1 is cleaned. By transferring the chip 1 to the cleaning position before detection, attachments and particulate contaminants on the chip 1 can be removed, thereby ensuring detection accuracy.

[0088] See also Figure 7 and Figure 8 In this embodiment, the chip processing equipment also includes a detection device 30, a cleaning device 40 and a first material receiving device 50. The detection device 30 is arranged at the detection position, the cleaning device 40 is arranged at the cleaning position, and the first material receiving device 50 includes a first material receiving shaft 51 and a transmission mechanism 52. The first material receiving shaft 51 is used to cooperate with the corresponding chip transfer finger 22 located at the processing station 5 to transfer the chip 1, and the transmission mechanism 52 is used to drive the first material receiving shaft 51 to move.

[0089] When one group of chip transfer fingers 22 moves to the processing station 5, the transmission mechanism 52 of the first material receiving device 50 drives the first material receiving shaft 51 to move horizontally to the bottom of the chip 1 adsorbed by this group of chip transfer fingers 22. The first material receiving shaft 51 can be extended and retracted vertically. Since the chip transfer fingers 22 are provided with a transmission part, there is a gap between two adjacent transmission parts. When the first material receiving shaft 51 is extended, it partially passes through the gap between the chip transfer fingers 22 to lift the first area on the back of the chip 1; the first material receiving shaft 51 is controlled to vacuum adsorb the chip 1, and the suction device on the corresponding chip transfer finger 22 is closed so that the chip transfer finger 22 cannot adsorb the chip 1. The first material receiving shaft 51 continues to extend until it is separated from the chip transfer finger 22, and then the chip transfer finger 22 moves horizontally and retracts.

[0090] The transmission mechanism 52 drives the first receiving shaft 51 and the chip 1 to move in sequence to the cleaning device 40 for cleaning and to the detection device 30 for detection. After the detection is completed, the first receiving shaft 51 and the chip 1 are driven back to the processing station 5, and the corresponding chip transfer finger 22 re-adsorbs the first area on the back of the chip 1 (that is, the chip transfer finger 22 extends horizontally close to the first receiving shaft 51. When the first receiving shaft 51 is in the gap between the chip transfer finger 22, the chip transfer finger 22 contacts the back of the chip 1 at the gap position, and can then adsorb the back of the chip 1). The chip transfer finger 22 re-adsorbs the back of the chip 1, and the chip transfer driving structure 21 drives the chip transfer finger 22 and the chip 1 to transfer to the bonding station 6.

[0091] Step S3: Bond the front side of the chip 1 to the surface of the material 2 to be bonded at a preset position.

[0092] See also Figures 9 and 10 , the chip transfer finger 22 extends and keeps adsorbing the chip 1, and the chip transfer finger 22 is on standby at the bonding station 6; the pressurizing mechanism 60 includes a second material receiving shaft 61 that extends vertically, and the second material receiving shaft 61 extends and partially inserts into the gap between the chip transfer fingers 22. The second material receiving shaft 61 contacts and adsorbs the first area on the back side of the chip 1, and closes the vacuum adsorption of the chip transfer finger 22. The second material receiving shaft 61 continues to extend and drives the chip 1 to separate from the chip transfer finger 22, and then the chip transfer finger 22 retracts laterally.

[0093] See also Figures 11 to 13 After the chip-transfer finger 22 retracts laterally, it will no longer be between the pressurizing mechanism 60 and the fixed platform 70, and will not affect the bonding of the chip 1. The second material-transferring shaft 61 retracts vertically, bringing the back of the chip 1 into contact with the pressurizing body of the pressurizing mechanism 60. The pressurizing body of the pressurizing mechanism 60 adsorbs the back of the chip 1, and the vacuum adsorption of the second material-transferring shaft 61 is turned off. The material 2 to be bonded on the fixed platform 70 is automatically aligned with the chip 1 on the pressurizing mechanism 60. The pressurizing body of the pressurizing mechanism 60 drives the chip 1 to move vertically from bottom to top until the front of the chip 1 is bonded to the bonding surface of the material 2 to be bonded.

[0094] In this embodiment, from the time chip 1 is positioned until bonding, the chip 1 is transferred along a linear and / or curved path to maintain suction on the back side of the chip 1 and keep the front side of the chip facing upward. By transferring the chip 1 along a linear and / or curved path, there is no need to flip the chip 1, and the back side of the chip 1 is always suctioned, ensuring stable transfer of the chip 1 and keeping the front side of the chip facing upward in preparation for subsequent bonding.

[0095] By adopting the above-mentioned chip transfer processing method, the chip 1 located on the ejection device 3 is adsorbed from the second area on the back side, and then transferred to the first area on the back side of the chip 1, thereby replacing the existing method of directly adsorbing the front side of the chip 1, completing the picking up of the chip 1, and then transferring the chip 1 and keeping the front side of the chip 1 facing up until bonding is completed at the preset position. During the entire picking and transfer process, the front side of the chip 1 will not be adsorbed and there will be no contact with the front side of the chip 1, thereby avoiding scratches and dirt on the front side of the chip 1, and effectively ensuring the bonding effect.

[0096] It can be understood that the chip transfer processing method provided in this embodiment can be, but is not limited to, using the picking mechanism 10 and the chip transfer mechanism 20 of the chip processing equipment to transfer the chip 1. It can also be achieved by using two or more mechanisms of other structures to ensure that the chip 1 located on the ejection device 3 can be adsorbed from the second area on the back side, and then handed over to the first area on the back side of the chip 1, and no contact is made with the front side of the chip 1 during the handover and transfer process. The number of times the chip 1 is handed over can be adjusted according to the actual processing equipment used.

[0097] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A chip transfer processing method, characterized in that: The back side of the chip (1) faces downward, and the ejection device (3) lifts up the first area of ​​the back side of the chip (1). The chip transfer processing method is used to transfer and process the chip (1) without contacting the front side of the chip (1), and includes the following steps: Obtaining the position of the chip (1), adsorbing the second area on the back of the chip (1), and lifting the chip (1) to the handover position so that the chip (1) is separated from the ejection device (3); Handing over the chip (1) at the handover position to switch from adsorbing the second area on the back side of the chip (1) to adsorbing the first area on the back side of the chip (1); after the handover, transferring the chip (1) and keeping the front side of the chip (1) facing upward until the chip (1) is transferred to a preset position; At the preset position, the front side of the chip (1) is bonded to the surface of the material (2) to be bonded.

2. The chip transfer processing method according to claim 1, characterized in that: From obtaining the position of the chip (1) to before bonding, the chip (1) is transferred by moving along a straight path and / or a curved path to always adsorb the back of the chip (1) and keep the front of the chip (1) facing upward.

3. The chip transfer processing method according to claim 1, characterized in that: After obtaining the position of the chip (1), the picking finger (12) of the picking mechanism (10) is moved to a position corresponding to the position of the chip (1), and the picking finger (12) is raised until it contacts the back of the chip (1) and adsorbs the second area on the back of the chip (1).

4. The chip transfer processing method according to claim 3, characterized in that: Before the picking finger (12) contacts the back of the chip (1), the distance between the two picking fingers (12) of the picking mechanism (10) is adjusted until they are adapted to the chip (1).

5. The chip transfer processing method according to claim 1, characterized in that: A pick-up mechanism (10) is used to absorb and lift the chip (1) to the handover position; at the handover position, a chip finger (22) of a chip transfer mechanism (20) is used to absorb the first area on the back side of the chip (1), and then the pick-up mechanism (10) is closed so that it cannot absorb the chip (1), and the chip finger (22) drives the chip (1) to move and detach from the pick-up mechanism (10) to complete the handover.

6. The chip transfer processing method according to claim 5, characterized in that: The film transmission mechanism (20) includes a plurality of groups of synchronously moving film transmission fingers (22), and each group of film transmission fingers (22) completes the handover with the picking mechanism (10) from the handover position in turn.

7. The chip transfer processing method according to claim 5, characterized in that: Before the chip-transmitting finger (22) absorbs the chip (1), the chip-transmitting finger (22) is moved to a transfer and material-collecting position corresponding to the position of the chip (1) with reference to the position of the pickup mechanism (10), and the chip-transmitting finger (22) is lifted at the transfer and material-collecting position until it contacts the chip (1).

8. The chip transfer processing method according to claim 1, characterized in that: After the handover and before the chip (1) is transferred to the preset position, the chip (1) is transferred to a detection position, and the chip (1) is detected at the detection position.

9. The chip transfer processing method according to claim 8, characterized in that: Before the chip (1) is transferred to the detection position, the chip (1) is transferred to a cleaning position, and the chip (1) is cleaned at the cleaning position.

10. Chip processing equipment, characterized in that include: A picking mechanism (10) comprises a picking drive structure (11) and a picking finger (12), wherein the picking drive structure (11) drives the picking finger (12) to move, and the picking finger (12) is used to adsorb the second area on the back side of the chip (1); The chip transmission mechanism (20) comprises a chip transmission driving structure (21) and a chip transmission finger (22), wherein the chip transmission driving structure (21) drives the chip transmission finger (22) to move, and the chip transmission finger (22) is used to adsorb the first area on the back side of the chip (1).

11. The chip processing equipment according to claim 10, characterized in that: It also includes a fixing platform (70) and a pressurizing mechanism (60), wherein the fixing platform (70) is used to fix the material to be bonded (2) at a preset position and keep the bonding surface of the material to be bonded (2) facing downward, and the pressurizing mechanism (60) is used to bond the front side of the chip (1) to the material to be bonded (2) at the preset position.

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