Display substrate and display device
By setting up a concave and convex morphology on the pad design of the LED display substrate, the contact area between the pad and the solder layer is increased, the problem of insufficient bonding force between the LED and the backplate is solved, the bonding stability is improved, and the risk of shedding is reduced.
Patent Information
- Application Number
- CN202410132414.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-30
- Publication Date
- 2025-08-05
AI Technical Summary
The lack of binding force between the LED and the back plate leads to frequent dark spots falling off.
A concave and convex morphology is provided on the side of the first pad close to the second pad, thereby increasing the contact area between the pad and the solder layer, thereby enhancing the bonding force between the pad and the back plate.
The bonding force between the light emitting unit and the back plate is improved, and the risk of falling off of the light emitting unit is reduced.
Smart Images
Figure CN120435148A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of display technology, and in particular to a display substrate and a display device. Background Art
[0002] Micro-LED (micro light-emitting diode) and Mini-LED (submillimeter light-emitting diode) are miniaturized LED (light-emitting diode) array structures with self-luminous display properties. Their advantages include high brightness, low power consumption, small size, ultra-high resolution and color saturation.
[0003] As research progresses, LED size is gradually decreasing, which brings with it numerous technical challenges. In particular, defects frequently occur during die bonding, where insufficient shear force (i.e., bonding strength) between the LED and the backplane leads to LED detachment and dark spots.
[0004] Therefore, there is a need to provide an improved display substrate to solve the above problems. Summary of the Invention
[0005] The purpose of the present application is to provide a display substrate and a display device in which an LED and a backplane are firmly combined.
[0006] The present application discloses a display substrate, which includes:
[0007] a light emitting unit, the light emitting unit comprising one of the first pad group or the second pad group;
[0008] a back plate, the back plate comprising the other of the first solder pad group or the second solder pad group;
[0009] a welding layer, the welding layer being disposed between the first welding pad group and the second welding pad group;
[0010] The first pad group includes a plurality of first pads; the second pad group includes a plurality of second pads; the plurality of first pads correspond to the plurality of second pads;
[0011] A side of the first pad close to the second pad has a concave-convex topography.
[0012] Optionally, a side of the first pad close to the second pad includes a plurality of first protrusions.
[0013] Optionally, the second pad includes a plurality of second protrusions on a side close to the first pad, and the orthographic projection of the first protrusion in the first direction has no overlapping area with the orthographic projection of the second protrusion in the first direction, and the first direction is a direction perpendicular to the display substrate.
[0014] Optionally, several of the first protrusions include strip protrusions that cross each other perpendicularly, and several of the strip protrusions constitute a grid-like protrusion structure; several of the second protrusions include columnar protrusions arranged in an array; the orthographic projections of the columnar protrusions in the first direction fall within the grid of the orthographic projections of the strip protrusions in the first direction.
[0015] Optionally, the distance between two adjacent second protrusions is a, the width of the strip-shaped protrusion is b; a≥b+40 μm.
[0016] Optionally, the distance between two adjacent second protrusions is a, the width of the strip-shaped protrusion is b; a≥b+10 μm.
[0017] Optionally, the first pad group is arranged on the light-emitting unit; and a plurality of the second protrusions constitute an identification morphology for alignment identification.
[0018] Optionally, a plurality of the first protrusions include columnar protrusions arranged in a rectangular array, and a plurality of the identification features include columnar protrusions arranged in a rectangular array.
[0019] Optionally, some of the first protrusions include columnar protrusions arranged in a rectangular array, and some of the identification features include cross-shaped protrusions.
[0020] Optionally, the columnar protrusion is a regular quadrangular pyramid-shaped protrusion.
[0021] Optionally, the first pad group is arranged on the light-emitting unit; the plurality of second pads include an anode second pad connected to the back plate anode and a cathode second pad connected to the back plate cathode; a first retaining wall is arranged along the edge of the anode second pad close to the cathode second pad, and a second retaining wall is arranged along the edge of the cathode second pad close to the anode second pad.
[0022] Optionally, the backplane includes:
[0023] substrate;
[0024] a driving circuit, wherein the driving circuit is disposed on one side of the substrate;
[0025] a planar layer, the planar layer being arranged on a side of the driving circuit layer away from the substrate;
[0026] A plurality of spacers are provided on the side of the flat layer away from the driving circuit layer, and a metal layer is provided on the side of the flat layer and the spacers away from the driving circuit layer; the metal layer and the spacers together form a first protrusion or a second protrusion.
[0027] The present application also discloses a display device, which includes the above-mentioned display substrate.
[0028] Compared with the related art, the side of the first solder pad close to the second solder pad in the present application has a concave-convex morphology, which increases the contact area between the first solder pad and the welding layer, thereby increasing the bonding force between the first solder pad and the second solder pad, and further increasing the bonding force between the light-emitting unit and the back panel, reducing the risk of the light-emitting unit falling off.
[0029] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.
[0031] Figure 1 This is a schematic structural diagram of an embodiment of a display substrate in this application.
[0032] Figure 2 This is a schematic structural diagram of an embodiment of a display substrate in this application.
[0033] Figure 3 This is a schematic structural diagram of an embodiment of a display substrate in this application.
[0034] Figure 4 This is a schematic diagram of the partial structure of the backplane pad in one embodiment of the substrate shown in this application.
[0035] Figure 5 This is a schematic diagram of the partial structure of the light-emitting unit pad in one embodiment of the substrate of this application.
[0036] Figure 6 This is a partial structural diagram of the combination of the back plate and the pad of the light-emitting unit in one embodiment of the display substrate of the present application.
[0037] Figure 7 For the Figure 6 Schematic cross-sectional view along line AA.
[0038] Figure 8 This is a schematic diagram of the partial structure of the backplane pad in one embodiment of the substrate shown in this application.
[0039] Figure 9 This is a schematic diagram of the partial structure of the light-emitting unit pad in one embodiment of the substrate of this application.
[0040] Figure 10 This is a partial structural diagram of the combination of the back plate and the pad of the light-emitting unit in one embodiment of the display substrate of the present application.
[0041] Figure 11This is a schematic diagram of the partial structure of the backplane pad in one embodiment of the substrate shown in this application.
[0042] Figure 12 This is a schematic diagram of the partial structure of the light-emitting unit pad in one embodiment of the substrate of this application.
[0043] Figure 13 This is a partial structural diagram of the combination of the back plate and the pad of the light-emitting unit in one embodiment of the display substrate of the present application.
[0044] Figure 14 This is a schematic diagram of the partial structure of the backplane pad in one embodiment of the substrate shown in this application.
[0045] Figure 15 This is a schematic diagram of the partial structure of the light-emitting unit pad in one embodiment of the substrate of this application.
[0046] Figure 16 This is a partial structural diagram of the combination of the back plate and the pad of the light-emitting unit in one embodiment of the display substrate of the present application. DETAILED DESCRIPTION
[0047] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with this specification. Rather, they are merely examples of apparatus and methods consistent with certain aspects of this specification, as detailed in the appended claims.
[0048] The terminology used in this application is for the purpose of describing specific embodiments only and is not intended to limit the present disclosure. Unless otherwise defined, technical or scientific terms used in this specification should have the same ordinary meaning as those having ordinary skill in the art to which this application belongs. The terms "first," "second," and similar terms used in this specification and claims do not denote any order, quantity, or importance, but are simply used to distinguish different components. Similarly, terms such as "a" or "an" do not denote a limitation of quantity, but rather indicate the presence of one. "Multiple" or "several" means two or more. Unless otherwise indicated, terms such as "front," "rear," "lower," and / or "upper" are used for convenience only and are not intended to limit the scope of the present disclosure to a specific location or spatial orientation. Terms such as "include" or "comprising" mean that the elements or objects listed before "include" or "comprising" include the elements or objects listed after "include" or "comprising" and their equivalents, and do not exclude other elements or objects. Terms such as "connected" or "connected" are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect.
[0049] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit the present disclosure. As used in this specification and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
[0050] like Figures 1 to 3 As shown, the present application provides a display substrate, which includes:
[0051] A light emitting unit 100, wherein the light emitting unit 100 includes one of the first pad group 300 and the second pad group 500;
[0052] A back plate 200, wherein the back plate 200 includes the other of the first pad group 300 and the second pad group 500;
[0053] A welding layer 400 , wherein the welding layer 400 is disposed between the first pad group 300 and the second pad group 500 ;
[0054] The first pad group 300 includes a plurality of first pads 310; the second pad group 500 includes a plurality of second pads 510; the plurality of first pads 310 and the plurality of second pads 510 are positioned correspondingly;
[0055] A side of the first pad 310 close to the second pad 510 has a concave-convex topography.
[0056] In the present application, the first solder pad 310 has a concave-convex topography on one side close to the second solder pad 510, which increases the contact area between the first solder pad 310 and the welding layer 400, thereby increasing the bonding force between the first solder pad 310 and the second solder pad 510, and further increasing the bonding force between the light-emitting unit 100 and the back panel 200, thereby reducing the risk of the light-emitting unit 100 falling off.
[0057] The following will describe in detail the various embodiments of the present application that are consistent with the above-mentioned creative concepts.
[0058] like Figures 1 to 3 As shown, the present application provides a display substrate, which includes the light-emitting unit 100 , the back plate 200 , the first pad group 300 , the welding layer 400 , and the second pad group 500 .
[0059] The light emitting unit 100 is an LED light emitting unit. Specifically, the light emitting unit can be a Mini-LED light emitting unit, or a Micro-LED light emitting unit, etc. Optionally, the pad structure of the light emitting unit 100 is arranged on the same side of the light emitting unit 100.
[0060] The backplane 200 drives the light-emitting unit 100 to emit light, and includes a driving circuit for controlling the light-emitting unit 100. For example, the backplane 200 may include the substrate 210, the active layer 220, the first gate insulating layer 230, the first gate metal layer 240, the second gate insulating layer 250, the second gate metal layer 260, the interlayer insulating layer 270, the first source-drain metal layer 280, the first planarizing layer 290, the first passivation layer 291, the second source-drain metal layer 293, the second passivation layer 294, and the second planarizing layer 295.
[0061] The active layer 220 is disposed on one side of the substrate 210. The first gate insulating layer 230 is disposed on a side of the active layer 220 away from the substrate 210. The first gate metal layer 240 is disposed on a side of the first gate insulating layer 230 away from the active layer 220. The first gate metal layer 240 forms the gate of the transistor. The second gate insulating layer 250 is disposed on a side of the first gate metal layer 240 away from the first gate insulating layer 230. The second gate metal layer 260 is disposed on a side of the second gate insulating layer 250 away from the first gate metal layer 240. The second gate metal layer 260 cooperates with the first gate metal layer 240 to form a capacitor structure. The interlayer insulating layer 270 is disposed on a side of the second gate metal layer 260 away from the second gate insulating layer 250. The first source-drain metal layer 280 is disposed on a side of the interlayer insulating layer 270 away from the second gate metal layer 260. The first source-drain metal layer 280 is connected to the active layer 220 to form the source and drain of the transistor.
[0062] The active layer 220, the first gate insulation layer 230, the first gate metal layer 240, the second gate insulation layer 250, the second gate metal layer 260, the interlayer insulation layer 270 and the first source-drain metal layer 280 form a number of transistor and capacitor structures and a connection structure between the transistors and the capacitors, thereby forming a driving circuit structure of the light-emitting unit 100.
[0063] The first planarizing layer 290 is disposed on a side of the first source / drain metal layer 280 away from the first source / drain metal layer 280. The first passivation layer 291 is disposed on a side of the first planarizing layer 290 away from the first source / drain metal layer 280. The second source / drain metal layer 293 is disposed on a side of the first passivation layer 291 away from the first planarizing layer 290, and a portion of the second source / drain metal layer 293 is connected to the output terminal of the driving circuit structure. The second passivation layer 294 is disposed on a side of the second source / drain metal layer 293 away from the first passivation layer 291. The second planarizing layer 295 is disposed on a side of the second passivation layer 294 away from the second source / drain metal layer 293. Portions of the second passivation layer 294 and the second planarizing layer 295 are removed to expose a portion of the second source / drain metal layer 293, thereby forming a pad structure.
[0064] The light-emitting unit 100 includes one of a first solder pad group 300 and a second solder pad group 500. The back plate 200 includes the other of the first solder pad group 300 and the second solder pad group 500. The first solder pad group 300 includes a plurality of first solder pads 310. The second solder pad group 500 includes a plurality of second solder pads 510. The positions of the plurality of first solder pads 310 and the plurality of second solder pads 510 correspond to each other. The side of the first solder pad 310 close to the second solder pad 510 has a concave-convex morphology. For example, the first solder pad group 300 is arranged on a side of the light-emitting unit 100 close to the back plate 200, and the first solder pad group 300 includes two first solder pads 310. The second solder pad group 500 is arranged on the back plate 200, and the second solder pad group 500 includes two second solder pads 510. The positions of the two second solder pads 510 correspond to the positions of the two first solder pads 310, respectively. That is, the orthographic projections of the two second solder pads 510 in the first direction F1 overlap with the orthographic projections of the two second solder pads 510 in the first direction F1. The first direction F1 is a direction perpendicular to the display substrate. The welding layer 400 is provided between the first solder pad group 300 and the second solder pad group 500. That is, the first solder pad 310 and its corresponding second solder pad 510 are connected by the welding layer 400. The welding layer 400 can be formed by melting tin solder paste, or by melting gold or a mixture of gold and tin. The side of the first solder pad 310 close to the second solder pad 510 has a concave-convex morphology, which increases the contact area between the first solder pad 310 and the welding layer 400, thereby increasing the bonding force between the first solder pad 310 and the second solder pad 510, and further increasing the bonding force between the light-emitting unit 100 and the back panel 200, thereby reducing the risk of the light-emitting unit 100 falling off.
[0065] like Figure 2As shown, optionally, the first pad group 300 can be set on the back plate 200, and the first pad group 300 includes two first pads 310. The second pad group 500 can be set on the side of the light-emitting unit 100 close to the back plate 200, and the second pad group 500 includes two second pads 510. The positions of the two second pads 510 correspond to the positions of the two first pads 310 respectively. That is, the orthographic projections of the two second pads 510 in the first direction F1 overlap with the orthographic projections of the two second pads 510 in the first direction F1. The welding layer 400 is provided between the first pad group 300 and the second pad group 500. That is, the first pad 310 and its corresponding second pad 510 are connected through the welding layer 400. The side of the first pad 310 close to the second pad 510 has a concave-convex morphology.
[0066] like Figure 1 As shown, optionally, the first pad group 300 is arranged on a side of the light-emitting unit 100 close to the back plate 200, and the first pad group 300 includes two first pads 310. The second pad group 500 is arranged on the back plate 200, and the second pad group 500 includes two second pads 510. The positions of the two second pads 510 correspond to the positions of the two first pads 310, respectively. That is, the orthographic projections of the two second pads 510 in the first direction F1 overlap with the orthographic projections of the two second pads 510 in the first direction F1. The welding layer 400 is arranged between the first pad group 300 and the second pad group 500. That is, the first pad 310 and its corresponding second pad 510 are connected via the welding layer 400. The side of the first pad 310 close to the second pad 510 has a concave-convex morphology, and the side of the second pad 510 close to the first pad 310 also has a concave-convex morphology. The convex portion on the first pad 310 corresponds to the concave portion on the second pad 510, and vice versa. That is, the projection of the convex portion on the first pad 310 in the first direction F1 falls within the projection of the concave portion on the second pad 510 in the first direction F1, and the projection of the convex portion on the second pad 510 in the first direction F1 falls within the projection of the concave portion on the first pad 310 in the first direction F1.
[0067] like Figure 2As shown, when the first pad group 300 is provided on the back plate 200, the back plate 200 further includes a spacer layer 292. The spacer layer 292 is provided between the first passivation layer 291 and the second source-drain metal layer 293. The morphology of the spacer layer 292 is determined according to the concave-convex morphology of the first pad 310. Specifically, no spacers are provided at the positions corresponding to the concave parts of the concave-convex morphology of the first pad 310, and spacers of a certain height are provided at the positions corresponding to the convex parts of the concave-convex morphology of the first pad 310 to raise the spacers. Then, the second source-drain metal layer 293 is provided on the spacer layer 292 to form the desired concave-convex morphology.
[0068] like Figure 3 As shown, in an optional embodiment, the first pad 310 includes a plurality of first protrusions 311 on a side close to the second pad 510. The second pad 510 includes a plurality of second protrusions 511 on a side close to the first pad 310. The orthographic projections of the first protrusions 311 along the first direction F1 and the orthographic projections of the second protrusions 511 along the first direction F1 do not overlap. In other words, the first protrusions 311 and the second protrusions 511 are offset.
[0069] like Figures 3 to 7As shown, optionally, the plurality of first protrusions 311 include strip-shaped protrusions that intersect perpendicularly to each other, and the plurality of strip-shaped protrusions form a grid-like protrusion structure. The plurality of second protrusions 511 include columnar protrusions arranged in an array. The orthographic projections of the columnar protrusions in the first direction F1 fall within the grid of the orthographic projections of the strip-shaped protrusions in the first direction F1. For example, the first protrusions 311 include a plurality of strip-shaped protrusions extending along the second direction F2 and a plurality of strip-shaped protrusions extending along the third direction F3, wherein the second direction F2 is perpendicular to the third direction F3. The plurality of strip-shaped protrusions extending along the second direction F2 are arranged at equal intervals along the third direction F3, and the plurality of strip-shaped protrusions extending along the third direction F3 are arranged at equal intervals along the second direction F2. The strip-shaped protrusions extending along the third direction F3 intersect the strip-shaped protrusions extending along the second direction F2 to form a square grid-like structure. The orthographic projections of the second protrusions 511 in the first direction F1 fall within the square gaps in the grid-like structure. Optionally, the first protrusion 311 is a quadrangular pyramid structure, and the second protrusion 511 is a regular quadrangular pyramid structure. The top surface of the first protrusion 311 faces the second solder pad 510, and the top surface of the second protrusion 511 faces the first solder pad 310. The distance between the bottom surfaces of two adjacent second protrusions 511 is a, the width of the first protrusion 311 is b, and the die bonding alignment accuracy error of the light-emitting unit 100 is c, a≥b+2d. When the light-emitting unit 100 is a Mini-LED light-emitting unit, d is 20μm, that is, a≥b+40μm. When the light-emitting unit is a Micro-LED light-emitting unit, d is 5μm, a≥b+10μm. Of course, the first protrusion 311 and the second protrusion 511 can also have other morphologies. For example, the first protrusion 311 is cylindrical, and the second protrusion 511 is also cylindrical. Or the first protrusion 311 is cylindrical, and the second protrusion 511 is a prism, and so on. It only needs to satisfy the requirement that the orthographic projection of the first protrusion 311 in the first direction F1 and the orthographic projection of the second protrusion 511 in the first direction F1 have no overlapping area, that is, the first protrusion 311 and the second protrusion 511 are misaligned.
[0070] like Figures 8 to 13As shown, in an optional embodiment, the first solder pad group 300 is disposed on the light-emitting unit 100, and the second solder pad group 500 is disposed on the backplane 200. The first solder pad 310 includes a plurality of first protrusions 311 on the side closest to the second solder pad 510. The second solder pad 510 includes a plurality of second protrusions 511 on the side closest to the first solder pad 310. The orthographic projections of the first protrusions 311 and the orthographic projections of the second protrusions 511 along the first direction F1 do not overlap. That is, the first protrusions 311 and the second protrusions 511 are offset. The plurality of second protrusions 511 form an identification feature for alignment and identification. The plurality of second protrusions 511 can be cylindrical, polyhedral, or other irregularly shaped protrusions. The array formed by the plurality of second protrusions 511 can also be determined based on needs. For example, the plurality of second protrusions 511 can form a rectangular array, a circular array, or other irregularly shaped arrays, as long as the second protrusions 511 can form an array that can be identified.
[0071] For example, Figures 8 to 10 As shown, in an optional embodiment, a plurality of the first protrusions 311 include columnar protrusions arranged in a rectangular array, and a plurality of the second protrusions 511 include columnar protrusions arranged in a rectangular array, and four columnar second protrusions 511 form a marking morphology. The columnar protrusions can be regular quadrangular pyramidal protrusions, and the corners of the bottom surfaces of the first protrusions 311 and the corners of the bottom surfaces of the second protrusions 511 are in contact with each other in the projection along the first direction F1. The array formed by the second protrusions 511 and the array formed by the first protrusions are projected in the first direction F1 as shown in FIG. Figure 10 The array structure shown.
[0072] For example, Figures 10 to 13 As shown, in an optional embodiment, a plurality of the first protrusions 311 include columnar protrusions arranged in a rectangular array, and a plurality of the second protrusions 511 include cross-shaped protrusions, and a cross-shaped second protrusion 511 forms a marking morphology. The columnar protrusions can be regular quadrangular pyramid-shaped protrusions. In the projection along the first direction F1, the circumference of a cross-shaped second protrusion 511 is surrounded by four regular quadrangular pyramid-shaped first protrusions 311. The array formed by the second protrusions 511 and the array formed by the first protrusions are projected in the first direction F1 as shown in FIG. Figure 13 The array structure shown.
[0073] The plurality of second protrusions 511 form an identification morphology for alignment identification, so that the light emitting unit 100 has better alignment accuracy during die bonding and reduces alignment errors.
[0074] like Figures 14 to 16As shown, in an optional embodiment, the first solder pad group 300 is disposed on the light-emitting unit 100. The second solder pad group 500 is disposed on the backplate 200. The plurality of second solder pads 510 include an anode second solder pad connected to the anode of the backplate 200 and a cathode second solder pad connected to the cathode of the backplate. A first retaining wall 512 is provided along the edge of the anode second solder pad near the cathode second solder pad, and a second retaining wall 513 is provided along the edge of the cathode second solder pad near the anode second solder pad. Specifically, the first retaining wall 512 extends along the side of the anode second solder pad near the cathode second solder pad and extends away from the cathode second solder pad at both ends of the side. The second retaining wall 513 extends along the side of the cathode second solder pad near the anode second solder pad and extends away from the anode second solder pad at both ends of the side. This prevents solder paste overflow and short circuits between the cathode and cathode when forming the solder layer 400. Of course, the shapes of the first retaining wall 512 and the second retaining wall 513 can be determined according to needs, and can be strip-shaped, block-shaped, or other special shapes. As long as the first retaining wall 512 and the second retaining wall 513 form a blocking structure for the solder paste to prevent the cathode and anode solder pastes from overflowing in the opposite direction, it is sufficient.
[0075] This application uses a raised structure to form a concave-convex topography, increasing the contact area between the pad and the solder layer, thereby strengthening the bonding force between the light-emitting unit and the backplane and preventing the light-emitting unit from shifting or falling off. The raised structure can also form an identification topography for alignment, making the alignment of the light-emitting unit more precise during die bonding. The raised structure can also form a barrier structure for solder paste, preventing it from overflowing and short-circuiting the anode and cathode when the solder paste forms a solder layer.
[0076] The present application also discloses a display device, which includes the above-mentioned display substrate.
[0077] Other embodiments of the present invention will readily occur to those skilled in the art upon consideration of the present invention and practice of the invention claimed herein. This specification is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of this specification and include common knowledge or customary techniques in the art not claimed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present invention being indicated by the following claims.
[0078] It should be understood that the present description is not limited to the exact structure that has been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.
[0079] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.
Claims
1. A display substrate, characterized in that: include: a light emitting unit, the light emitting unit comprising one of the first pad group or the second pad group; a back plate, the back plate comprising the other of the first solder pad group or the second solder pad group; a welding layer, the welding layer being disposed between the first welding pad group and the second welding pad group; The first pad group includes a plurality of first pads; the second pad group includes a plurality of second pads; the plurality of first pads correspond to the plurality of second pads; A side of the first pad close to the second pad has a concave-convex topography.
2. The display substrate according to claim 1, wherein: A side of the first pad close to the second pad includes a plurality of first protrusions.
3. The display substrate according to claim 2, wherein: The second pad includes a plurality of second protrusions on a side close to the first pad, and the orthographic projection of the first protrusion in a first direction has no overlapping area with the orthographic projection of the second protrusion in the first direction, and the first direction is a direction perpendicular to the display substrate.
4. The display substrate according to claim 3, wherein: Several of the first protrusions include strip protrusions that cross each other perpendicularly, and several of the strip protrusions form a grid-like protrusion structure; several of the second protrusions include columnar protrusions arranged in an array; the orthographic projections of the columnar protrusions in the first direction fall into the grid of the orthographic projections of the strip protrusions in the first direction.
5. The display substrate according to claim 4, wherein: The distance between two adjacent second protrusions is a, the width of the strip-shaped protrusion is b; a≥b+40 μm.
6. The display substrate according to claim 4, wherein: The distance between two adjacent second protrusions is a, the width of the strip-shaped protrusion is b; a≥b+10 μm.
7. The display substrate according to claim 3, wherein: The first pad group is arranged on the light-emitting unit; and a plurality of the second protrusions constitute an identification shape for alignment identification.
8. The display substrate according to claim 7, wherein: A plurality of the first protrusions include columnar protrusions arranged in a rectangular array, and a plurality of the identification features include columnar protrusions arranged in a rectangular array.
9. The display substrate according to claim 7, wherein: Several of the first protrusions include columnar protrusions arranged in a rectangular array, and several of the identification features include cross-shaped protrusions.
10. The display substrate according to any one of claims 1, 8 or 9, characterized in that: The columnar protrusion is a regular quadrangular pyramid-shaped protrusion.
11. The display substrate according to claim 1, wherein The first solder pad group is arranged on the light-emitting unit; the plurality of second solder pads include an anode second solder pad connected to the anode of the back plate and a cathode second solder pad connected to the cathode of the back plate; a first retaining wall is arranged along the edge of the side of the anode second solder pad close to the cathode second solder pad, and a second retaining wall is arranged along the edge of the side of the cathode second solder pad close to the anode second solder pad.
12. The display substrate according to claim 3, wherein: The backplane comprises: substrate; a driving circuit, wherein the driving circuit is disposed on one side of the substrate; a planar layer, the planar layer being arranged on a side of the driving circuit layer away from the substrate; A plurality of spacers are provided on the side of the flat layer away from the driving circuit layer, and a metal layer is provided on the side of the flat layer and the spacers away from the driving circuit layer; the metal layer and the spacers together form a first protrusion or a second protrusion.
13. A display device, characterized in that: The display device comprises the display substrate according to any one of claims 1 to 12.