Method for acquiring state of stamping parameter, electronic equipment and storage medium

Abstract

The invention relates to the field of data processing, in particular to a method for obtaining the state of stamping parameters, electronic equipment and a storage medium, and the method comprises the steps that according to a control instruction, a stamping machine is controlled to conduct stamping operation on a to-be-stamped part according to the current stamping parameters, and a corresponding stamping forming part is obtained and serves as a current stamping forming part; state information and crack information of the current punch forming part are obtained, and feature vectors of the current punch forming part are obtained based on the obtained state information and crack information; the state information comprises strain rate, stress and stamping transient temperature rise; based on the feature vector of the current punching forming part, the state value of the current punching parameter of the punching machine is obtained; and comparing the obtained state value of the current stamping parameter with a preset state value threshold value, and outputting corresponding prompt information based on a comparison result. The indication information representing whether the punching parameters of the punching machine need to be adjusted or not can be output according to the feature vector of the current punching forming part.

Description

Technical Field

[0001] The present invention relates to the field of data processing, and in particular to a method, electronic equipment and storage medium for obtaining the state of stamping parameters. Background Art

[0002] Solar photovoltaic brackets are specialized brackets designed for placing, installing, and securing solar panels in photovoltaic power generation systems. They are typically made from materials such as zinc-magnesium-aluminum, aluminum alloys, carbon steel, and stainless steel. Because they are exposed to outdoor use for extended periods, they require strong corrosion resistance and a high degree of defect-free performance. Solar panel brackets are typically produced through stamping. The stamping parameters of the stamping machine have a certain impact on the performance of the bracket. Therefore, during the stamping process, it is important to maintain these parameters within a reasonable range. Summary of the Invention

[0003] In view of the above technical problems, the technical solution adopted by the present invention is: According to a first aspect of the present invention, there is provided a method for obtaining a state of a stamping parameter, the method comprising the following steps: S100, obtaining a stamping control instruction, wherein the stamping control instruction includes current stamping parameters of the stamping machine; the stamping parameters include stamping speed, stamping pressure, and die clearance.

[0004] S200 , in response to receiving the control instruction, controlling the stamping machine to perform a stamping operation on the part to be stamped with current stamping parameters to obtain a corresponding stamped part as the current stamped part.

[0005] S300, obtaining the status information and crack information of the current stamped part, and obtaining the characteristic vector of the current stamped part based on the obtained status information and crack information; the status information includes strain rate, stress and stamping transient temperature rise; the characteristic vector includes thickness, chemical composition, corrected strain rate, corrected stamping transient temperature rise and crack generation risk index.

[0006] S400, obtaining a state value of a current stamping parameter of the stamping machine based on a feature vector of the current stamped part; S500: Compare the acquired state value of the current stamping parameter with a preset state value threshold, and output corresponding prompt information based on the comparison result.

[0007] According to a second aspect of the present invention, an electronic device is provided, comprising a processor and a memory; the processor is configured to execute the steps of the method according to the first aspect of the present invention by calling a program or instruction stored in the memory.

[0008] According to a third aspect of the present invention, there is provided a computer-readable storage medium storing a program or instructions, wherein the program or instructions enable a computer to execute the steps of the method according to the first aspect of the present invention.

[0009] The present invention has at least the following beneficial effects: The method for obtaining the state of stamping parameters provided by an embodiment of the present invention includes: according to a control instruction, controlling a stamping machine to perform a stamping operation on a to-be-stamped part with current stamping parameters, obtaining a corresponding stamped part as the current stamped part; obtaining state information and crack information of the current stamped part, and obtaining a feature vector of the current stamped part based on the obtained state information and crack information; the state information includes strain rate, stress and stamping transient temperature rise; the feature vector includes thickness, chemical composition, corrected strain rate, corrected stamping transient temperature rise and crack generation risk index; based on the feature vector of the current stamped part, obtaining the state value of the current stamping parameter of the stamping machine; comparing the obtained state value of the current stamping parameter with a preset state value threshold, and outputting corresponding prompt information based on the comparison result. The present invention can output indication information representing whether the stamping parameters of the stamping machine need to be adjusted according to the feature vector of the current stamped part, and can provide prompt information for whether the stamping parameter setting is reasonable in actual application scenarios, so as to maximize the inspection performance of the stamped part, such as corrosion resistance and defect-free performance.

[0010] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0012] Figure 1 A flowchart of a method for obtaining the state of stamping parameters provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0013] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0014] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0015] It should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts describe the steps as sequential processes, many of the steps can be performed in parallel, concurrently, or simultaneously. In addition, the order of the steps can be rearranged. A process can be terminated when its operation is completed, but can also have additional steps not included in the accompanying drawings. A process can correspond to a method, function, procedure, subroutine, subprogram, etc.

[0016] The embodiment of the present invention provides a method for obtaining the state of stamping parameters, such as Figure 1 As shown, the method may include the following steps: S100, obtaining a stamping control instruction, wherein the stamping control instruction includes current stamping parameters of the stamping machine; the stamping parameters include stamping speed, stamping pressure, and die clearance.

[0017] In an embodiment of the present invention, the stamping control instruction may be sent by the host computer. The current stamping parameters are determined based on the current prompt information, which includes first prompt information indicating that the current stamping parameters are in a normal state and second prompt information indicating that the current stamping parameters are in an abnormal state.

[0018] In the embodiment of the present invention, the die gap refers to the gap between the stamping dies.

[0019] S200 , in response to receiving the control instruction, controlling the stamping machine to perform a stamping operation on the part to be stamped with current stamping parameters to obtain a corresponding stamped part as the current stamped part.

[0020] In an embodiment of the present invention, the current stamped part may be a solar photovoltaic bracket.

[0021] In an exemplary embodiment, the part to be stamped is a substrate made of zinc-magnesium-aluminum material.

[0022] In another exemplary embodiment, the part to be stamped may be a coated substrate. The substrate may be a steel plate, and the coating may be a zinc-magnesium-aluminum material. Preferably, in an embodiment of the present invention, the part to be stamped is a steel plate coated with a zinc-magnesium-aluminum material.

[0023] S300: Acquire state information and crack information of the current stamped part, and acquire a feature vector of the current stamped part based on the acquired state information and crack information.

[0024] In an embodiment of the present invention, the state information may include strain rate, stress, and stamping transient temperature rise. The strain rate can be obtained by measuring the deformation at the R angle of the coating bend using a laser speckle strain gauge, and the specific acquisition method can be conventional. The accuracy of the laser speckle strain gauge can be ±0.01%. Stress can be obtained by embedding a thin film stress sensor on the surface of the stamping mold, and the specific acquisition method can be conventional. The thin film stress sensor can have a range of 0-300 MPa. The stamping transient temperature rise can be monitored using an infrared thermal imager, and the specific monitoring method can be conventional.

[0025] In an embodiment of the present invention, the feature vector may include thickness, chemical composition, modified strain rate, modified stamping transient temperature rise, and crack formation risk index.

[0026] In an embodiment of the present invention, the chemical composition of the stamped part may be the chemical composition of each material constituting the stamped part. When the stamped part is a steel plate coated with zinc-magnesium-aluminum material, the chemical composition of the stamped part may include the zinc content, aluminum content, magnesium content, and other element contents. The other element contents may be the element contents used in the steel plate.

[0027] In the embodiments of the present invention, the corrected strain rate is the strain rate obtained by correcting the strain rate in the state information, and the corrected stamping transient temperature rise is the stamping transient temperature rise obtained by correcting the stamping transient temperature rise in the state information. Those skilled in the art will appreciate that existing correction methods can be used to obtain the corrected strain rate and the corrected stamping transient temperature rise.

[0028] In the embodiment of the present invention, the crack information of the stamped part can be obtained by scanning the lens.

[0029] In one embodiment of the present invention, the crack generation risk index of the current stamped part satisfies the following conditions: HCI t =α×CDI t +β×∑ t-1 i=1 [HCI i ×e -γ（t-i） ]+λ×SPI t .

[0030] Among them, HCI t Generate a risk index, CDI, for cracks in current stamped parts t is the current crack characterization index of the current stamped part, HCI i is the crack generation risk index of the stamped part obtained by the stamping machine during the i-th stamping, i ranges from 1 to t-1, t is the current total number of stamping times of the stamping machine, SPI t is the stress-position coupling risk index for the current stamped part. α, β, and λ are preset weights, γ is the time decay coefficient, and e is a natural constant. α, β, λ, and γ can be empirical values. In one exemplary embodiment, α = 0.6, β = 0.3, λ = 0.1, and γ = 0.16.

[0031] Furthermore, CDI t The following conditions must be met: CDI t =k1×L+k2×W+k3×N.

[0032] Where k1 is the first coefficient, k2 is the second coefficient, and k3 is the third coefficient. k1+k2+k3=1. L is the length of the current stamped part, W is the width of the current stamped part, and N is the number of crack branches in the current stamped part. k1, k2, and k3 can be empirical values. In one exemplary embodiment, k1=0.2, k2=0.5, and k3=0.3.

[0033] Furthermore, SPI t The following conditions must be met: SPI t =(σ / σ yeild ) 2 ×(1 / (1+e -（d-0.2） / 0.05 )).

[0034] Among them, σ is the stress of the current stamping part, σ yeild is the material yield strength of the current stamped part, and d is the shortest distance between the crack and the corresponding edge in the current stamped part. Specifically, the distances between all cracks and the corresponding edges can be obtained, and then the shortest distance is selected as d.

[0035] In another embodiment of the present invention, the crack formation risk index of the current stamped part satisfies the following conditions: HCI t =1 / (1+e -f（y） ).

[0036] Among them, f(y) is the preset function expression, f(y)=f1×ε+f2×△T+f3×m.

[0037] Among them, ε is the strain rate of the current stamped part, △T is the stamping transient temperature change of the current stamped part, m is the content of the chemical component that affects the detection performance of the stamped part, f1 is the first coefficient, f2 is the second coefficient, and f3 is the third coefficient.

[0038] In an embodiment of the present invention, the detection performance of the stamped part may include corrosion resistance, and the chemical component that affects the detection performance of the stamped part may be magnesium, that is, m is the magnesium content.

[0039] S400 , obtaining a state value of a current stamping parameter of the stamping machine based on a feature vector of the current stamped part.

[0040] Furthermore, in an embodiment of the present invention, the state value of the current stamping parameter of the stamping machine satisfies the following conditions: S=w1×S1+w2×S2+w3×S3.

[0041] Among them, S is the state value, S1 is the first sub-state value, S2 is the second sub-state value, S3 is the third sub-state value, w1 is the first weight, w2 is the second weight, w3 is the third weight, w1+w2+w3=1.

[0042] Furthermore, S1=1-SC, where SC is the predicted value of the crack area ratio of the current stamped part.

[0043] In the embodiment of the present invention, the crack area ratio is the ratio of the total area of the fission region to the total area of the detected region.

[0044] Among them, SC meets the following conditions: SC=SC0×exp[α1×(w Al / p1)-α2×(w Mg / p2) 2 +α3×ln(ε / ε0)+α4×(△T / T0)+α5×HCI t -α6×h / h0].

[0045] Wherein, SC0 is the initial crack area ratio of the current stamped part, which can be obtained based on the acquired crack information, specifically the ratio of the area of all cracks to the total area of the stamped part. h is the thickness of the current stamped part. w Al is the aluminum content of the current stamped part, w Mg is the magnesium content of the current stamped part. ε is the corrected strain rate of the current stamped part, and ε0 is the quasi-static strain rate, which can be 10 -3 / s, that is, the strain per second is 0.001. △T is the corrected stamping transient temperature rise of the current stamped part, p1 is the first percentage, for example, it can be 5%. p2 is the second percentage, for example, it can be 1.5%. α1, α2, α3, α4, α5 and α6 are all fitting coefficients, which can be empirical values. In an exemplary embodiment, α1=1.8, α2=2.5, α3=0.8, α4=0.5, α5=1.2, α6=0.6. T0 is the preset reference temperature, which can be 100℃. exp() is the exponential function, and h0 is the preset thickness, which can be 1mm.

[0046] Furthermore, S2 = 1-Δc, where Δc is the dimensional deviation of the current stamped part. The dimensional deviation of a stamped part refers to the difference between the actual dimensions of the part and the theoretical dimensions specified in the design drawings or technical requirements. In this embodiment of the present invention, the dimensional deviation is a linear dimensional deviation.

[0047] Those skilled in the art know that the dimensional deviation can be obtained based on existing technologies, for example, it can be determined based on the thickness, chemical composition, strain rate, stamping transient temperature rise and crack formation risk index of the stamped part.

[0048] In an exemplary embodiment, Δc may satisfy the following conditions: △c=d1×(△h / h inital )+d2×ln(ε / ε0)+d3×△T / T0+d4×(w Mg / p2)+d5×HCl t .

[0049] Among them, △h is the thickness change value of the current stamping part, which is equal to h inital -h,h inital is the initial thickness of the stamped part, d1 is the thickness sensitivity coefficient, d2 is the strain rate sensitivity coefficient, d3 is the thermal expansion coefficient, d4 is the chemical composition sensitivity coefficient, and d5 is the crack index sensitivity coefficient.

[0050] In the embodiment of the present invention, S3 is used to characterize the energy consumption increment of the stamped part, that is, S3 is equal to the energy consumption increment of the stamped part.

[0051] In an embodiment of the present invention, the energy consumption increment of the stamped part can be obtained based on existing methods. In an exemplary embodiment, the energy consumption increment can be equal to the actual power consumption of the stamping machine and the minimum deformation energy of the force calculated based on the material plastic deformation theory. In an exemplary embodiment, the minimum deformation energy E min The following conditions can be met: E min ≈V×∫0 s（p）σ×ds. Where s represents the total strain of the material, s(p) is the final plastic strain of the material, which is equal to the total strain minus the elastic strain, and V is the volume of the molded part, in m 3 , ds means the integral operation on s.

[0052] S500: Compare the acquired state value of the current stamping parameter with a preset state value threshold, and output corresponding prompt information based on the comparison result.

[0053] Furthermore, S500 specifically includes: If the state value of the current stamping parameter is greater than or equal to the preset state value threshold, a first prompt message indicating that the current stamping parameter is in a normal state is output; otherwise, a second prompt message indicating that the current stamping parameter is in an abnormal state is output.

[0054] In the embodiment of the present invention, the preset state value threshold may be an empirical value.

[0055] In actual application scenarios, users can determine whether to adjust the current stamping parameters based on the output prompt information. The specific adjustment method can be determined according to actual conditions. The present invention does not make any special limitations. The present invention aims to provide a prompt information to prompt the status of the current stamping parameters.

[0056] An embodiment of the present invention also provides an electronic device, comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are configured to execute the method described in the embodiment of the present invention.

[0057] An embodiment of the present invention further provides a computer-readable storage medium storing computer-executable instructions, wherein the computer instructions are used to execute the method described in the embodiment of the present invention.

[0058] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in the present invention can be achieved. This is not limited herein.

[0059] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A method for obtaining the state of a stamping parameter, characterized in that, The method comprises the following steps: S100, obtaining a stamping control instruction, wherein the stamping control instruction includes current stamping parameters of the stamping machine; the stamping parameters include stamping speed, stamping pressure, and die clearance; S200, in response to receiving the control instruction, controlling the stamping machine to perform a stamping operation on the part to be stamped using the current stamping parameters to obtain a corresponding stamped part as the current stamped part; S300, obtaining state information and crack information of the current stamped part, and obtaining a feature vector of the current stamped part based on the obtained state information and crack information; the state information includes strain rate, stress, and stamping transient temperature rise; the feature vector includes thickness, chemical composition, corrected strain rate, corrected stamping transient temperature rise, and crack formation risk index; S400, obtaining a state value of a current stamping parameter of the stamping machine based on a feature vector of the current stamped part; S500: Compare the acquired state value of the current stamping parameter with a preset state value threshold, and output corresponding prompt information based on the comparison result.

2. The method according to claim 1, characterized in that S500 specifically includes: If the state value of the current stamping parameter is greater than or equal to the preset state value threshold, a first prompt message indicating that the current stamping parameter is in a normal state is output; otherwise, a second prompt message indicating that the current stamping parameter is in an abnormal state is output.

3. The method according to claim 1, characterized in that The current crack generation risk index of stamped parts meets the following conditions: HCI t =α×CDI t +β×∑ t-1 i=1 [HCI i ×e -γ（t-i） ]+λ×SPI t ; Among them, HCI t Generate a risk index, CDI, for cracks in current stamped parts t is the current crack characterization index of the current stamped part, HCI i is the crack generation risk index of the stamped part obtained by the stamping machine during the i-th stamping, i ranges from 1 to t-1, t is the current total number of stamping times of the stamping machine, SPI t is the stress-position coupling risk index of the current stamped part, α, β, and λ are preset weights, γ is the time attenuation coefficient, and e is a natural constant.

4. The method according to claim 3, characterized in that CDI t The following conditions must be met: CDI t =k1×L+k2×W+k3×N; Among them, k1 is the first coefficient, k2 is the second coefficient, k3 is the third coefficient, k1+k2+k3=1, L is the length of the current stamped part, W is the width of the current stamped part, and N is the number of crack branches of the current stamped part.

5. The method according to claim 3, characterized in that SPI t The following conditions are met: SPI t =(σ / σ) yeild ) 2 ×(1 / (1+e) -（d-0.2） / 0.05 )); Among them, σ is the stress of the current stamping part, σ yeild is the material yield strength of the current stamped part, and d is the shortest distance between the crack and the corresponding edge in the current stamped part.

6. The method according to claim 3, characterized in that The state value of the current stamping parameter of the stamping machine meets the following conditions: S=w1×S1+w2×S2+w3×S3; Among them, S is the state value of the current stamping parameter of the stamping machine, S1 is the first sub-state value, S2 is the second sub-state value, S3 is the third sub-state value, w1 is the first weight, w2 is the second weight, w3 is the third weight, w1+w2+w3=1; S1=1-SC, SC is the predicted value of the crack area ratio of the current stamped part; S2=1-△c, △c is the dimensional deviation of the current stamped part, and S3 is used to characterize the energy consumption increment of the stamped part.

7. The method according to claim 6, characterized in that The parts to be stamped are steel plates coated with zinc-magnesium-aluminum material; SC meets the following conditions: SC=SC0×exp[α1×(w Al / p1)-α2×(w Mg / p2) 2 +α3×ln(ε / ε0)+α4×(△T / T0)+α5×HCI t -α6×h / h0]; Among them, SC0 is the initial crack area ratio of the current stamping part, h is the thickness of the current stamping part, w Al is the aluminum content of the current stamped part, w Mg is the magnesium content of the current stamped part, ε is the corrected strain rate of the current stamped part, ε0 is the quasi-static strain rate, △T is the corrected stamping transient temperature rise of the current stamped part, p1 is the first percentage, p2 is the second percentage, α1, α2, α3, α4, α5 and α6 are all fitting coefficients, T0 is the preset reference temperature, exp() is the exponential function, and h0 is the preset thickness.

8. The method according to claim 1, characterized in that The current stamped parts are solar photovoltaic brackets.

9. An electronic device, characterized in that: including processor and memory; The processor is configured to execute the steps of the method according to any one of claims 1 to 8 by calling the program or instructions stored in the memory.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium is used to store a program or instruction, and the program or instruction enables a computer to execute the steps of the method according to any one of claims 1 to 8.

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