Two-component epoxy resin composition for semiconductor packaging as well as preparation method and application of two-component epoxy resin composition

Abstract

The invention discloses a two-component epoxy resin composition for semiconductor packaging as well as a preparation method and application thereof, the composition comprises the following components in parts by weight: a component A: 100 parts of epoxy resin, 0-20 parts of filler and 0-13 parts of glycerol; a component B: 40-60 parts of a curing agent; the epoxy resin comprises epoxy resin containing a benzene ring structure and alicyclic epoxy resin, and the curing agent comprises an amine curing agent containing a benzene ring structure and 2-isooctyl succinic anhydride. When the two-component epoxy resin composition for semiconductor packaging is used, the component A and the component B are heated and mixed for reaction, and the epoxy resin containing the benzene ring structure and the alicyclic epoxy resin as well as the amine curing agent containing the benzene ring structure and the 2-isooctyl succinic anhydride are used for preparing the two-component epoxy resin composition for semiconductor packaging. A three-dimensional network structure with rigid structures such as benzene rings, flexible structures such as alkyl groups and hydrogen bonds is formed, so that the epoxy resin composition has a relatively low thermal expansion coefficient, and wafer warping can be inhibited.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and more particularly to a two-component epoxy resin composition for semiconductor packaging, a preparation method thereof, and applications thereof. Background Art

[0002] Semiconductors are materials with electrical conductivity between conductors and insulators at room temperature. Because their conductivity can be controlled and falls within the range between conductors and insulators, semiconductors are widely used in integrated circuits, communications systems, consumer electronics, photovoltaic power generation, high-power power conversion, and lighting applications, particularly in products like computers and mobile phones.

[0003] The semiconductor manufacturing process consists of wafer fabrication, wafer testing, chip packaging, testing, and final warehousing of finished products. Chip packaging involves semiconductor packaging technology. Semiconductor packaging technology is categorized into traditional packaging and wafer-level packaging. Traditional packaging involves dicing the wafer into chips and then packaging them. Wafer-level packaging, on the other hand, involves partially or fully packaging the wafer before dicing it into individual pieces.

[0004] Fan-Out Wafer-Level Packaging (FOWLP) is a type of wafer-level packaging in semiconductor packaging technology. It allows for more I / O routing outside the chip's boundaries, thereby increasing I / O density, reducing package size, and improving electrical performance. Specifically, in FOWLP, the chip is first placed on a larger carrier (usually a wafer). A redistribution layer (RDL) then connects the chip's I / O points to the carrier's surface, further "fanning out" ("fanning-out") the I / O points beyond the chip's boundaries, achieving higher I / O density. The plastic encapsulation process is a key step in FOWLP, protecting the chip and expanding its area. Epoxy resin is typically used as the encapsulation material. However, the volume shrinkage caused by the high thermal expansion coefficient of epoxy resin during the curing process is one of the causes of wafer warping. Wafer warping not only reduces the process accuracy of subsequent mask lithography and limits the increase in redistribution layer density, but also causes solder balls to crack and fall off and interposer delamination. It is a prominent problem that restricts the development of Fan-Out wafer-level packaging.

[0005] Therefore, it is of great significance to develop a two-component epoxy resin composition for semiconductor packaging with a small thermal expansion coefficient to suppress wafer warping. Summary of the Invention

[0006] The purpose of the present invention is to solve the problem in the prior art that the large thermal expansion coefficient of epoxy resin causes wafer warping, and to provide a two-component epoxy resin composition for semiconductor packaging, a preparation method and an application thereof.

[0007] To achieve the above object, the technical solution adopted by the present invention is: In a first aspect, the present invention provides a two-component epoxy resin composition for semiconductor encapsulation, which comprises, by weight: component A: 100 parts of epoxy resin, 0-20 parts of filler, and 0-13 parts of glycerin; Component B: 40-60 parts of curing agent; The epoxy resin comprises an epoxy resin containing a benzene ring structure and an alicyclic epoxy resin, and the mass ratio of the epoxy resin containing a benzene ring structure to the alicyclic epoxy resin is (1-4):1; The curing agent includes an amine curing agent containing a benzene ring structure and 2-isooctyl succinic anhydride, and the mass ratio of the amine curing agent containing a benzene ring structure to the 2-isooctyl succinic anhydride is (1-7):1; The filler is at least one of mica powder, silicon dioxide, aluminum nitride, magnesium oxide, aluminum oxide, calcium carbonate, and magnesium carbonate.

[0008] The two-component epoxy resin composition for semiconductor encapsulation of the present invention is heated and mixed with components A and B for reaction during use. By controlling the amounts of an epoxy resin containing a benzene ring structure and an alicyclic epoxy resin, as well as an amine curing agent containing a benzene ring structure and 2-isooctylsuccinic anhydride, a three-dimensional network structure having rigid structures such as benzene rings, flexible structures such as alkyl groups, and hydrogen bonds is formed. The three-dimensional network structure is not only stable but also resistant to external temperature stimulation, making the two-component epoxy resin composition for semiconductor encapsulation less likely to expand or shrink when subjected to ambient temperature changes such as curing, and having a low thermal expansion coefficient. This enables the two-component epoxy resin composition for semiconductor encapsulation to suppress wafer warpage when used in semiconductor encapsulation technology.

[0009] In the present invention, the weight ratio of component A to component B is (100-133):(40-60), specifically (113-133):(40-60), or 120:(40-60).

[0010] In the present invention, the alicyclic epoxy resin is poly[(2-oxiranyl)-1,2-cyclohexanediol]2-ethyl-2-(hydroxymethyl)-1,3-propylene glycol ether (3:1), and its CAS number is 244772-00-7.

[0011] Preferably, the mass ratio of the epoxy resin containing a benzene ring structure to the alicyclic epoxy resin is 1:1, 1.2:1, 1.5:1, 1.7:1, 2:1, 2.2:1, 2.5:1, 2.7:1, 3:1, 3.2:1, 3.5:1, 3.7:1, 4:1 or a range consisting of any two of these values.

[0012] More preferably, the mass ratio of the epoxy resin containing a benzene ring structure to the alicyclic epoxy resin is (2-4):1.

[0013] Preferably, the epoxy resin containing a benzene ring structure is at least one of bisphenol A epoxy resin, hydrogenated bisphenol F epoxy resin, biphenyl epoxy resin, and bisphenol F epoxy resin.

[0014] Preferably, the epoxy equivalent of the epoxy resin containing a benzene ring structure is 150-200 g / eq.

[0015] Preferably, the epoxy equivalent of the alicyclic epoxy resin is 150-200 g / eq.

[0016] More preferably, the epoxy equivalent of the alicyclic epoxy resin is 170-200 g / eq.

[0017] Preferably, the mass ratio of the amine curing agent containing a benzene ring structure to 2-isooctylsuccinic anhydride is 1:1, 1.2:1, 1.5:1, 1.7:1, 2:1, 2.2:1, 2.5:1, 2.7:1, 3:1, 3.2:1, 3.5:1, 3.7:1, 4:1, 4.2:1, 4.5:1, 4.7:1, 5:1, 5.2:1, 5.5:1, 5.7:1, 6:1, 6.2:1, 6.5:1, 6.7:1, 7:1 or a range consisting of any two of these values.

[0018] More preferably, the mass ratio of the benzene ring structure-containing amine curing agent to 2-isooctylsuccinic anhydride is (2-5):1.

[0019] Preferably, the amine curing agent containing a benzene ring structure is at least one of diethyltoluenediamine, 2,4,6-triethyl-1,3,5-benzenetrimethylamine, o-xylylenediamine, 1,3-phenylenediamine, 1,4-phenylenediamine, and 1,3,5-benzenetrimethylamine.

[0020] Preferably, the weight parts of the curing agent are 40 parts, 41 parts, 42 parts, 43 parts, 44 parts, 45 parts, 46 parts, 47 parts, 48 parts, 49 parts, 50 parts, 51 parts, 52 parts, 53 parts, 54 parts, 55 parts, 56 parts, 57 parts, 58 parts, 59 parts, 60 parts or a range consisting of any two of these values.

[0021] More preferably, the weight portion of the curing agent is 45-55 parts.

[0022] Preferably, the weight percentage of the filler is 0 parts, 1 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts or a range consisting of any two of these values.

[0023] More preferably, the weight proportion of the filler is 10-20 parts.

[0024] Preferably, the filler is mica powder, silicon dioxide and aluminum nitride.

[0025] More preferably, the filler is mica powder, silicon dioxide and aluminum nitride in a mass ratio of 1:(2-5):(0.5-3).

[0026] Preferably, the weight parts of the glycerol are 0 parts, 1 parts, parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts or a range consisting of any two of these values.

[0027] More preferably, the weight proportion of the glycerol is 3-13 parts.

[0028] More preferably, the weight portion of the glycerol is 3-8 parts.

[0029] The present invention increases the number of hydrogen bonds in a three-dimensional network structure formed by the two-component epoxy resin composition for semiconductor encapsulation by adding glycerol and controlling the amount of glycerol, further stabilizes the three-dimensional network structure, and thus further reduces the thermal expansion coefficient of the two-component epoxy resin composition for semiconductor encapsulation.

[0030] In a second aspect, the present invention provides a method for preparing a two-component epoxy resin composition for semiconductor encapsulation, comprising: S1. mixing the components in component A, heating and melting, to obtain component A; S2. Heat component B to obtain component B.

[0031] Preferably, in step S1, the temperature of heating and melting is 100-200°C.

[0032] Preferably, in step S2, the heating temperature is 40-100°C.

[0033] In the two-component epoxy resin composition for semiconductor encapsulation of the present invention, component A and component B are packaged separately. When used, components A and B only need to be heated and mixed.

[0034] In a third aspect, the present invention provides an application of a two-component epoxy resin composition for semiconductor packaging in semiconductors.

[0035] In a fourth aspect, the present invention provides a Fan-Out wafer-level packaging method for a semiconductor chip, comprising the following steps: (1) Chip placement: Place the semiconductor chip face up on a temporary carrier; (2) Plastic encapsulation: heating and mixing component A and component B of a two-component epoxy resin composition for semiconductor encapsulation, and using the mixture to encapsulate the semiconductor chip and a temporary carrier together to obtain a plastic encapsulation body; (3) Redistribution layer (RDL) fabrication: The redistribution layer is fabricated on the plastic package through photolithography and electroplating processes; (4) Solder ball attachment: Solder balls are formed on the redistribution layer (RDL) through the ball planting reflow process; (5) Remove the temporary carrier to obtain the semiconductor chip after Fan-Out wafer-level packaging.

[0036] Preferably, the temperature of the heating and mixing in step (2) is 40-160°C.

[0037] Preferably, the temporary carrier is a wafer.

[0038] Compared with the prior art, the present invention has the following beneficial effects: The two-component epoxy resin composition for semiconductor encapsulation of the present invention is heated and mixed with components A and B for reaction during use. By controlling the amounts of an epoxy resin containing a benzene ring structure and an alicyclic epoxy resin, as well as an amine curing agent containing a benzene ring structure and 2-isooctylsuccinic anhydride, a three-dimensional network structure having rigid structures such as benzene rings, flexible structures such as alkyl groups, and hydrogen bonds is formed. The three-dimensional network structure is not only stable but also resistant to external temperature stimulation, making the two-component epoxy resin composition for semiconductor encapsulation less likely to expand or shrink when subjected to ambient temperature changes such as curing, and having a low thermal expansion coefficient. This enables the two-component epoxy resin composition for semiconductor encapsulation to suppress wafer warpage when used in semiconductor encapsulation technology.

[0039] The present invention adds fillers to a two-component epoxy resin composition for semiconductor encapsulation and controls the mass ratio of mica powder, silicon dioxide, and aluminum nitride to fill small particles of different hardness in a three-dimensional network structure formed by the two-component epoxy resin composition for semiconductor encapsulation, thereby further stabilizing the three-dimensional network structure and further reducing the thermal expansion coefficient of the two-component epoxy resin composition for semiconductor encapsulation.

[0040] The present invention increases the number of hydrogen bonds in a three-dimensional network structure formed by the two-component epoxy resin composition for semiconductor encapsulation by adding glycerol and controlling the amount of glycerol, further stabilizes the three-dimensional network structure, and thus further reduces the thermal expansion coefficient of the two-component epoxy resin composition for semiconductor encapsulation. DETAILED DESCRIPTION

[0041] In order to better illustrate the purpose, technical solutions and advantages of the present invention, the present invention will be further described below in conjunction with specific embodiments.

[0042] In the various embodiments and comparative examples of the present invention, the usage of each reagent is as follows: Biphenyl epoxy resin, YX4000, epoxy equivalent weight 185g / eq, Mitsubishi, Japan; Alicyclic epoxy resin, poly[(2-oxiranyl)-1,2-cyclohexanediol]2-ethyl-2-(hydroxymethyl)-1,3-propylene glycol ether (3:1), CAS number 244772-00-7, epoxy equivalent weight 170-200 g / eq, JD190613144329, Shanghai Jiader Chemical Technology Co., Ltd. Bisphenol A epoxy resin, DER383, epoxy equivalent weight 176-183g / eq, Dow Chemical, USA; Bisphenol F epoxy resin, NPEF-170, epoxy equivalent weight 160-180 g / eq, Nan Ya, Taiwan, China; Mica powder, dry process mica powder, D302552, 800 mesh, Shanghai Aladdin Biochemical Technology Co., Ltd.; Silica, S104574, particle size 5 μm, Shanghai Aladdin Biochemical Technology Co., Ltd.; Aluminum nitride, A109772, particle size 2.0 μm, Shanghai Aladdin Biochemical Technology Co., Ltd.

[0043] Examples 1-17 and Comparative Examples 1-7 Examples 1-17 and Comparative Examples 1-7 provide different two-component epoxy resin compositions for semiconductor encapsulation. The only difference between them is the amount of each component and the mass ratio of the specific components. Calculated by weight, the two-component epoxy resin compositions for semiconductor encapsulation of Examples 1-17 and Comparative Examples 1-7 respectively include the components shown in Table 1: Table 1 Formulations of two-component epoxy resin compositions for semiconductor packaging in Examples 1-17 and Comparative Examples 1-7 In the above table, “epoxy resin” is a mixture of biphenyl epoxy resin and alicyclic epoxy resin, “curing agent” is a mixture of 1,3,5-benzenetrimethylamine and 2-isooctylsuccinic anhydride, and “filler” is a mixture of mica powder, silicon dioxide and aluminum nitride.

[0044] The preparation method of the two-component epoxy resin composition for semiconductor encapsulation provided in Examples 1-17 and Comparative Examples 1-7 comprises: S1. Mix the ingredients in component A and melt them at 155°C for 35 minutes to obtain component A; S2. Heat component B at 60℃ for 30min to obtain component B.

[0045] Example 18 This embodiment provides a two-component epoxy resin composition for semiconductor packaging and a preparation method thereof. The difference between this embodiment and Example 1 is that bisphenol A epoxy resin is used instead of biphenyl epoxy resin, and the rest is consistent with Example 1.

[0046] Example 19 This embodiment provides a two-component epoxy resin composition for semiconductor packaging and a preparation method thereof. The difference between this embodiment and Example 1 is that bisphenol F epoxy resin is used instead of biphenyl epoxy resin, and the rest is consistent with Example 1.

[0047] Example 20 This embodiment provides a two-component epoxy resin composition for semiconductor packaging and a preparation method thereof. The difference between this embodiment and Example 1 is that 2,4,6-triethyl-1,3,5-benzenetrimethylamine is used instead of 1,3,5-benzenetrimethylamine, and the rest is consistent with Example 1.

[0048] Example 21 This embodiment provides a two-component epoxy resin composition for semiconductor packaging and a preparation method thereof. The difference between this embodiment and Example 1 is that 1,4-phenylenediamine is used instead of 1,3,5-phenyltrimethylamine, and the rest is consistent with Example 1.

[0049] Example 22 This embodiment provides a two-component epoxy resin composition for semiconductor packaging and a preparation method thereof. The difference between this embodiment and Example 1 is that mica powder replaces the mixture of mica powder, silicon dioxide and aluminum nitride, that is, the filler contains only mica powder, and the rest is consistent with Example 1.

[0050] Application Examples This application example provides a fan-out wafer-level packaging method for a semiconductor chip, comprising the following steps: (1) Chip placement: Place the semiconductor chip face up on a temporary carrier (wafer); (2) Plastic encapsulation: heating and mixing component A and component B of any one of the two-component epoxy resin compositions for semiconductor encapsulation in Examples 1-22 at 120° C., and encapsulating a semiconductor chip and a temporary carrier (wafer) together using the mixture to obtain a plastic encapsulation body; (3) Redistribution layer (RDL) fabrication: The redistribution layer is fabricated on the plastic package through photolithography and electroplating processes; (4) Solder ball attachment: Solder balls are formed on the redistribution layer (RDL) through the ball planting reflow process; (5) Remove the temporary carrier (wafer) to obtain the semiconductor chip after Fan-Out wafer-level packaging.

[0051] Performance Testing The performance tests of the two-component epoxy resin compositions for semiconductor encapsulation of the embodiments and comparative examples were conducted, specifically: (1) Thermal expansion coefficient test Components A and B of the two-component epoxy resin composition for semiconductor encapsulation of each embodiment or comparative example were heated and mixed at 120° C. for 15 minutes, and coated into a 1 mm thick film. The film was fully cured at 180° C. After curing, the film was naturally cooled to room temperature and left at room temperature for 24 hours. The film was cut into 8 mm × 5 mm sample films to be tested, and placed on a thermomechanical analyzer TMA. The temperature was raised from room temperature to 250° C. and measured and analyzed according to the national standard GB / T 36800.2-2018 "Thermomechanical Analysis of Plastics (TMA) Part 2: Determination of Linear Thermal Expansion Coefficient and Glass Transition Temperature". After the measurement, the linear thermal expansion coefficient value in the range of 175-225° C. was taken as the thermal expansion coefficient of the two-component epoxy resin composition for semiconductor encapsulation of each embodiment or comparative example. (2) Wafer warpage test Components A and B of the two-component epoxy resin composition for semiconductor encapsulation of each embodiment or comparative example were heated and mixed at 120° C. for 15 minutes, and then coated on a 4-inch wafer to form a 1 mm thick film. The film was then baked at 180° C. for 1.5 hours, and removed after natural cooling. Residual resin around the wafer was removed, and the wafer was allowed to stand for 24 hours. One side of the wafer was fixed on a steel plate, and the warping distance of the other side of the wafer was measured (specifically, the height distance between the highest point of the warped side of the wafer and the lowest point of the fixed side of the wafer, that is, the height distance between the highest point of the warped side of the wafer and the steel plate). This distance is the warpage; The experimental results are shown in the following table: Table 2 Thermal expansion coefficients of two-component epoxy resin compositions for semiconductor encapsulation in various embodiments and comparative examples As shown in Table 2, the two-component epoxy resin composition for semiconductor encapsulation of the present invention is heated and mixed with components A and B for reaction during use. By controlling the amounts of the epoxy resin containing a benzene ring structure and the alicyclic epoxy resin, as well as the amine curing agent containing a benzene ring structure and 2-isooctylsuccinic anhydride, a three-dimensional network structure is formed, which has rigid structures such as benzene rings, flexible structures such as alkyl groups, and hydrogen bonds. This three-dimensional network structure is not only stable but also resistant to external temperature stimulation, making the two-component epoxy resin composition for semiconductor encapsulation less susceptible to expansion or contraction during ambient temperature changes such as curing, and having a low thermal expansion coefficient. This enables the two-component epoxy resin composition for semiconductor encapsulation to suppress wafer warpage when used in semiconductor packaging technology. Specifically: (1) It can be seen from Examples 1-4 and Comparative Examples 1-3 that only when the mass ratio of the epoxy resin containing a benzene ring structure to the alicyclic epoxy resin is within the range of (1-4):1, can the two-component epoxy resin composition for semiconductor encapsulation have a low thermal expansion coefficient and suppress wafer warpage when used in semiconductor encapsulation technology; (2) It can be seen from Examples 1, 5-8 and Comparative Examples 4-6 that the two-component epoxy resin composition for semiconductor packaging can have a lower thermal expansion coefficient and suppress wafer warpage when used in semiconductor packaging technology only when the mass ratio of the amine curing agent containing a benzene ring structure and 2-isooctyl succinic anhydride is within the range of (1-7):1; (3) From Examples 1, 9-12 and Comparative Example 7, it can be seen that when the amount of epoxy resin is 100 parts, by controlling the amount of curing agent within the range of 40-60 parts, the two-component epoxy resin composition for semiconductor encapsulation can have a lower thermal expansion coefficient and can suppress wafer warpage when used in semiconductor encapsulation technology; (4) As can be seen from Examples 1 and 13, the addition of fillers is beneficial for further reducing the thermal expansion coefficient of the two-component epoxy resin composition for semiconductor encapsulation; (5) As can be seen from Example 1 and Examples 14-17, by adding glycerol and controlling the amount of glycerol, the number of hydrogen bonds in the three-dimensional network structure formed by the two-component epoxy resin composition for semiconductor encapsulation can be increased, and the three-dimensional network structure can be further stabilized, thereby further reducing the thermal expansion coefficient of the two-component epoxy resin composition for semiconductor encapsulation; (6) From Example 1 and Examples 18-19, it can be seen that two-component epoxy resin compositions for semiconductor packaging with a low thermal expansion coefficient can be prepared using different epoxy resins containing benzene ring structures; (7) From Example 1 and Examples 20-21, it can be seen that using different amine curing agents containing a benzene ring structure can prepare a two-component epoxy resin composition for semiconductor packaging with a low thermal expansion coefficient; (8) It can be seen from Example 1 and Example 22 that a two-component epoxy resin composition for semiconductor packaging with a low thermal expansion coefficient can be prepared using different fillers.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A two-component epoxy resin composition for semiconductor encapsulation, characterized in that: Calculated by weight, including: Component A: 100 parts of epoxy resin, 0-20 parts of filler, 0-13 parts of glycerin; Component B: 40-60 parts of curing agent; The epoxy resin comprises an epoxy resin containing a benzene ring structure and an alicyclic epoxy resin, and the mass ratio of the epoxy resin containing a benzene ring structure to the alicyclic epoxy resin is (1-4):1; The curing agent includes an amine curing agent containing a benzene ring structure and 2-isooctyl succinic anhydride, and the mass ratio of the amine curing agent containing a benzene ring structure to the 2-isooctyl succinic anhydride is (1-7):1; The filler is at least one of mica powder, silicon dioxide, aluminum nitride, magnesium oxide, aluminum oxide, calcium carbonate, and magnesium carbonate.

2. The two-component epoxy resin composition for semiconductor encapsulation according to claim 1, wherein: The mass ratio of the epoxy resin containing a benzene ring structure to the alicyclic epoxy resin is (2-4):

1.

3. The two-component epoxy resin composition for semiconductor encapsulation according to claim 1, wherein: The mass ratio of the amine curing agent containing a benzene ring structure to 2-isooctylsuccinic anhydride is (2-5):

1.

4. The two-component epoxy resin composition for semiconductor encapsulation according to claim 1, wherein: The weight proportion of the curing agent is 45-55 parts.

5. The two-component epoxy resin composition for semiconductor encapsulation according to claim 1, wherein: At least one of the following: (1) The epoxy resin containing a benzene ring structure is at least one of bisphenol A epoxy resin, hydrogenated bisphenol F epoxy resin, biphenyl epoxy resin, and bisphenol F epoxy resin; (2) The amine curing agent containing a benzene ring structure is at least one of diethyltoluenediamine, 2,4,6-triethyl-1,3,5-benzenetrimethylamine, o-xylylenediamine, 1,3-benzenediamine, 1,4-benzenediamine, and 1,3,5-benzenetrimethylamine.

6. The two-component epoxy resin composition for semiconductor encapsulation according to claim 1, wherein: At least one of the following: (1) The weight proportion of the filler is 10-20 parts; (2) The filler is mica powder, silicon dioxide and aluminum nitride; (3) The weight proportion of the glycerol is 3-13 parts.

7. The two-component epoxy resin composition for semiconductor encapsulation according to claim 6, wherein: The filler is mica powder, silicon dioxide and aluminum nitride in a mass ratio of 1:(2-5):(0.5-3).

8. A method for preparing the two-component epoxy resin composition for semiconductor encapsulation according to any one of claims 1 to 7, comprising: S1. Mix the ingredients in component A, heat and melt to obtain component A; S2. Heat component B to obtain component B.

9. Use of the two-component epoxy resin composition for semiconductor encapsulation according to any one of claims 1 to 7 in semiconductors.

10. A Fan-Out wafer-level packaging method for semiconductor chips, characterized in that: The steps include: (1) Chip placement: Place the semiconductor chip face up on a temporary carrier; (2) Plastic encapsulation: heating and mixing component A and component B of the two-component epoxy resin composition for semiconductor encapsulation according to any one of claims 1 to 7, and using the mixture to encapsulate the semiconductor chip and the temporary carrier together to obtain a plastic encapsulation body; (3) Redistribution layer fabrication: The redistribution layer is fabricated on the plastic package through photolithography and electroplating processes; (4) Solder ball attachment: Solder balls are formed on the redistribution layer through the ball planting reflow process; (5) Remove the temporary carrier to obtain the semiconductor chip after Fan-Out wafer-level packaging.

Images