Hot melt adhesive composition, packaging part and electronic equipment

Abstract

The invention discloses a hot melt adhesive composition, a packaging component and electronic equipment, and relates to the field of electronic component auxiliary materials, and the hot melt adhesive composition comprises 95 wt% or more of polystyrene resin; 1 to 5 wt% of epoxy resin; 0-4 wt% of a first additive; the first additive includes a first tackifying resin, a first plasticizer, and a first filler. The packaging component comprises an insulating part, at least one surface of the insulating part is provided with a hot-pressing adhesive layer, the hot-pressing adhesive layer sequentially comprises a hot melt adhesive layer, a base material layer and a double-sided adhesive layer which are bonded, and the double-sided adhesive layer is bonded to at least one surface of the insulating part; and the hot melt adhesive layer is formed by a hot melt adhesive composition. The electronic equipment comprises a metal shell with a heat dissipation mesh structure, and at least a packaging part is pasted at the position, corresponding to the heat dissipation mesh structure, in the metal shell.

Description

Technical Field

[0001] The present application relates to the technical field of electronic component accessories, and in particular to a hot melt adhesive composition, a packaging component, and an electronic device. Background Art

[0002] Electronic devices are typically assembled by gluing protective components like housings together using hot melt adhesives. Currently, hot melt adhesives are primarily based on synthetic resins, often supplemented with additives like viscosity modifiers and antioxidants.

[0003] However, the adhesive layer structure of the hot melt adhesive will be revealed through some hole structures, which is significantly different from the appearance of the electronic device itself, affecting the appearance quality and poor user experience. Summary of the Invention

[0004] In view of the above problems, the present application provides a hot melt adhesive composition, a packaging component, and an electronic device. The solution is as follows:

[0005] In a first aspect, the present application provides a hot melt adhesive composition, which includes: more than 95 wt% of polystyrene resin; 1 to 5 wt% of epoxy resin; 0 to 4 wt% of a first additive; the first additive includes a first tackifying resin, a first plasticizer and a first filler.

[0006] In a possible implementation, the weight ratio of the first tackifying resin, the first plasticizer, and the first filler is (30-50): (2-10): (5-40).

[0007] In a possible implementation, the first additive further includes one or more of a first vulcanizing agent, a first antioxidant, and a first solvent;

[0008] The first additive may optionally include, by weight: 0-20 parts of a first vulcanizing agent; 0-1 part of a first antioxidant; and 0-1 part of a first solvent. In one possible implementation, the hot melt adhesive composition forms a non-transparent adhesive layer having a matte surface structure, and the light transmittance of the adhesive layer may be less than 50%.

[0009] And / or, at least one side of the adhesive layer formed by the hot melt adhesive composition is further provided with an isolation film.

[0010] The second aspect of the present application provides a hot-pressed adhesive part, comprising a supporting base and a hot melt adhesive layer bonded to at least one side thereof, wherein the hot melt adhesive layer is formed by a hot melt adhesive composition, and the hot melt adhesive composition comprises: more than 95 wt% of a polystyrene resin; 1 to 5 wt% of an epoxy resin; 0 to 4 wt% of a first additive; the first additive comprises a first tackifying resin, a first plasticizer, and a first filler.

[0011] A third aspect of the present application provides a packaging component, comprising an insulating member, wherein at least one surface of the insulating member is provided with a hot-pressed adhesive layer, the hot-pressed adhesive layer sequentially comprising a hot-melt adhesive layer, a base material layer, and a double-sided adhesive layer, the double-sided adhesive layer being adhered to at least one surface of the insulating member;

[0012] The hot melt adhesive layer is formed by a hot melt adhesive composition, which includes: more than 95wt% of polystyrene resin; 1-5wt% of epoxy resin; 0-4wt% of a first additive; the first additive includes a first tackifying resin, a first plasticizer and a first filler.

[0013] In a possible implementation, at least one of the following is satisfied: the substrate layer has a gram weight of less than 18 g / m 2 The double-sided adhesive layer is an acrylic double-sided adhesive layer with a temperature resistance of more than 90°C; the double-sided adhesive layer has a grid structure.

[0014] In a possible implementation, the double-sided adhesive layer may include: 87-93 wt% of an acrylic resin elastomer; 7-13 wt% of a second additive; the second additive includes a second tackifying resin, a second plasticizer, and a second filler;

[0015] The copolymer monomers of the acrylic resin elastomer include a main monomer and a modified monomer, wherein the main monomer includes butyl acrylate and 2-ethylhexyl acrylate, and the modified monomer includes one or more of acrylic acid, glycidyl methacrylate, hydroxyethyl acrylate and 2-hydroxypropyl acrylate;

[0016] In the main monomer of the acrylic resin elastomer, the mass ratio of butyl acrylate and 2-ethylhexyl acrylate is (51-60): (8-10); and / or, the modified monomer of the acrylic resin elastomer includes: 3-8 parts of acrylic acid, 1-3 parts of glycidyl methacrylate, 2-3 parts of hydroxyethyl acrylate, and 4-5 parts of 2-hydroxypropyl acrylate.

[0017] In a possible implementation, the second additive further includes one or more of a second vulcanizing agent, a second antioxidant, and a second solvent;

[0018] Calculated in parts by weight, the second additive may optionally include: 0 to 20 parts of a second vulcanizing agent; 0 to 1 part of a second antioxidant; and 0 to 1 part of a second solvent.

[0019] In a possible implementation, the thickness of the hot-pressed adhesive layer is 0.1 to 0.2 mm; and / or the insulating member is a Mylar sheet.

[0020] A fourth aspect of the present application provides an electronic device, comprising a metal housing having a heat dissipation mesh structure, wherein a packaging component is attached to the interior of the metal housing at locations corresponding to the heat dissipation mesh structure;

[0021] The packaging component includes an insulating member, at least one surface of the insulating member is provided with a hot-pressing adhesive layer, the hot-pressing adhesive layer sequentially including a hot-melt adhesive layer, a base material layer and a double-sided adhesive layer, and the double-sided adhesive layer is adhered to at least one surface of the insulating member;

[0022] The hot melt adhesive layer is formed by a hot melt adhesive composition, wherein the hot melt adhesive layer of the hot pressing adhesive layer is adhered to the metal shell; the hot melt adhesive composition includes: more than 95wt% of polystyrene resin; 1-5wt% of epoxy resin; 0-4wt% of a first additive; the first additive includes a first tackifying resin, a first plasticizer and a first filler.

[0023] In a possible implementation, the heat-pressed adhesive layer completely covers a surface of the insulating component.

[0024] In one possible implementation, the metal shell includes a body and a heat dissipation mesh sheet embedded and installed on the outside of the body. The heat dissipation mesh sheet has a heat dissipation mesh structure and is installed at a position corresponding to a heat generation position of the electronic device. The extension direction of the heat dissipation mesh sheet is consistent with the plane direction of the body.

[0025] The main body further has a plurality of heat dissipation holes extending perpendicularly to the direction of the heat dissipation mesh sheet, corresponding to heat generation locations of the electronic device; an encapsulation component is affixed to the main body at locations corresponding to the heat dissipation mesh structure. In one possible implementation, the main body has a plurality of closable heat dissipation holes, the insulating member is located at the locations of the main body where the heat dissipation holes need to be closed, and the hot melt adhesive layer of the heat-pressing adhesive layer is affixed to the main body; the heat-pressing adhesive layer optionally has a hollow structure that coincides with the locations of the heat dissipation holes of the main body.

[0026] In a possible implementation, at least one of the following conditions is met: the metal shell is an aluminum shell; the thickness of the hot-pressed adhesive layer is 0.1 to 0.2 mm; and the insulating member is a Mylar sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and other features, advantages, and aspects of the various embodiments of the present application will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. Throughout the drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and that the originals and elements are not necessarily drawn to scale.

[0028] Figure 1 Schematic diagram of some existing electronic equipment housing structures;

[0029] Figure 2A schematic structural diagram of a hot-pressed adhesive component provided in an embodiment of the present application;

[0030] Figure 3 A schematic cross-sectional view of a packaging component provided in an embodiment of the present application;

[0031] Figure 4 A schematic diagram of a housing structure of an electronic device provided in some embodiments of the present application;

[0032] Figure 5 A schematic structural diagram of a partial cross-section of a packaging component provided in Example 3 of the present application;

[0033] Figure 6 A schematic structural diagram of a partial cross-section of a packaging component provided in Example 4 of the present application;

[0034] Figure 7 Schematic diagram of selective opening of holes in the metal shell in Example 5 of the present application;

[0035] Figure 8 This is a schematic diagram of the inner side surface of the packaging component and the metal shell body in Example 5 of the present application;

[0036] Figure 9 This is a schematic diagram of the exterior appearance of the packaging component and the heat dissipation mesh sheet attached to each other in Example 5 of the present application;

[0037] Figure 10 This is a schematic structural diagram of the hot pressing fixture in Example 5 of the present application;

[0038] Figure 11 The test results of Example 3 or Example 4 of this application are as follows;

[0039] Figure 12 These are photos before and after the test of Comparative Example 1.

[0040] Reference numerals:

[0041] 10-first Mylar; 11-aluminum shell; 111-heat dissipation mesh sheet; 20-non-woven fabric, 21-hot-melt adhesive layer, 22-isolating film; 30-non-woven fabric substrate layer, 31-hot-melt adhesive layer, 32-isolating film, 33-acrylic double-sided adhesive layer, 34 is Mylar sheet; 40-hot-melt adhesive layer, 41-main body of metal shell, 411-heat dissipation mesh sheet; 50-substrate layer, 51-hot-melt adhesive layer, 52-matte isolating film, 53-double-sided adhesive layer, 54-second Mylar; 60-substrate layer, 61-hot-melt adhesive layer, 62-matte isolating film, 63-double-sided adhesive layer, 64-third Mylar; 71-aluminum body, 710, 712, 713-heat dissipation holes, 711-heat dissipation mesh sheet. DETAILED DESCRIPTION

[0042] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application. The terms used in the implementation methods section of this application are only used to explain the specific embodiments of the present application and are not intended to limit this application. The embodiments of the present application are described below in conjunction with the drawings. It is known to those skilled in the art that with the development of technology and the emergence of new scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0043] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, and this is merely a way of distinguishing the objects of the same attributes when describing them in the embodiments of the present application. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, so that the process, method, system, product or equipment comprising a series of units need not be limited to those units, but may include other units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0044] Mylar (meaning Mylar or Mylar) is a trade name for a film or sheet made from a polyester polymer material. It features high flatness, chemical resistance, and excellent mechanical and heat resistance. Mylar can be coated with functional coatings to further impart excellent insulation or antistatic properties, making it suitable for applications such as electronic packaging and insulation protection.

[0045] Mylar is often combined with other materials such as adhesive layers to form functional laminated structures. For example, in laptop devices, Mylar needs to be packaged with auxiliary materials such as aluminum shells and assembled by hot melt adhesive. Figure 1 Some existing electronic equipment housing structures are shown. Figure 1 In the figure, 10 is the first Mylar, 11 is the aluminum shell, and 111 is the mesh heat sink. The first Mylar 10, which primarily provides insulation and protection, is bonded to a hot-melt adhesive layer and assembled with the aluminum shell 11, which is provided with the mesh heat sink 111. The mesh heat sink 111 is positioned to correspond to the location of heat-generating electronic components in the electronic device, and its extension direction is aligned with the plane of the aluminum shell 11.

[0046] However, the adhesive layer on the first Mylar surface is visible through the heat dissipation mesh, creating a noticeable difference from the aluminum shell's metallic appearance. Even if some of the adhesive layer is removed, the unadhesive first Mylar portion will appear to float, detracting from the aesthetic quality of laptop cases.

[0047] The present invention provides a hot melt adhesive composition comprising: at least 95 wt% of a polystyrene resin; 1-5 wt% of an epoxy resin; and 0-4 wt% of a first additive, wherein the first additive comprises a first tackifying resin, a first plasticizer, and a first filler. The hot melt adhesive composition provided herein exhibits excellent bonding strength and can form a matte adhesive layer, thereby addressing the problem of poor appearance quality in electronic devices and improving user experience.

[0048] The hot melt adhesive composition described in the embodiments of this application is primarily composed of polystyrene resin, a thermoplastic resin material synthesized from the monomer styrene (CAS No. 100-42-5). It exhibits excellent electrical insulation properties and a transparency exceeding 90%. Furthermore, the mass percentage of the polystyrene resin can range from 95% to 96%.

[0049] This embodiment of the present application incorporates 1-5% by weight of epoxy resin, a thermosetting polymer material containing two or more epoxy groups within its molecule. Epoxy resins such as bisphenol A and F can be used, with an epoxy value of 0.25-0.45. This embodiment of the present application utilizes a hot melt adhesive formulation comprised of a number of epoxy-based substances, with the epoxy resin addition ratio ranging from 1wt%, 2wt%, 3wt%, or 4wt%, among others, to increase the reversible hot melt transition temperature and thereby form a non-transparent adhesive layer.

[0050] Furthermore, the hot melt adhesive composition may include 0-4 wt% of a first additive, which may include a first tackifying resin and a first plasticizer. Tackifying resins are typically used to increase the viscosity of rubber materials and may include C5 resin (the C5 fraction derived from naphtha decomposition) or C9 resin. The plasticizer may include an epoxy-containing plasticizer, such as a high-boiling epoxy ester compound, including but not limited to epoxidized oils such as epoxidized soybean oil (i.e., epoxyglycerol tricarboxylate).

[0051] In parts by weight, the first additive in the embodiment of the present application may include: 30-50 parts of a first tackifying resin; and 2-10 parts of a first plasticizer. That is, the mass ratio of the first tackifying resin to the first plasticizer may be (30-50):(2-10). In some exemplary embodiments, the weight of the first tackifying resin may be 30 parts, 33 parts, 35 parts, 37 parts, or 50 parts; and the weight of the first plasticizer may be 2 parts, 3 parts, 4 parts, 5 parts, 8 parts, or 10 parts.

[0052] To further enhance strength and reduce costs, the first additive may include 5 to 40 parts by weight of a first filler, and further include 10 to 39 parts by weight of the first filler, such as 15 parts, 20 parts, 30 parts, or 35 parts. For example, the first filler may be selected from one or more of calcium carbonate, talc, and precipitated silica, and further may be precipitated silica or calcium carbonate. Precipitated silica, also known as hydrated silica, activated silica, precipitated silica, and precipitated hydrated silica, primarily consists of SiO2.

[0053] In addition, the first additive may also include one or more of a first vulcanizing agent, a first antioxidant and a first solvent. The vulcanizing agent may be called a cross-linking agent, and generally polyamines, organic carboxylic acid ammonium salts, dithioformates, etc. are selected, and the reversible temperature can be increased by cross-linking and curing. The antioxidant can delay or inhibit the oxidative aging of the material. For example, it can be a p-phenylenediamine antioxidant, such as antioxidants 4010NA, 4020, etc. The chemical name of antioxidant 4010NA is N-isopropyl-N'-phenyl-p-phenylenediamine; antioxidant 4020 is also called antioxidant 6PPD, and its chemical name is N-(1,3-dimethylbutyl)-N'-phenyl-p-phenylenediamine. The solvent may be water, or a hydrocarbon, an ester, etc., and this application has no special restrictions.

[0054] For example, the first additive may include less than or equal to 20 parts of the first vulcanizing agent; or may include: less than or equal to 20 parts of the first vulcanizing agent and less than 1 part of the first antioxidant; or, the first additive may include: less than or equal to 20 parts of the first vulcanizing agent; less than 1 part of the first antioxidant and the first solvent respectively.

[0055] In some embodiments of the present application, the hot melt adhesive composition may be composed of polystyrene, epoxy resin, tackifying resin, plasticizer, filler, vulcanizing agent, antioxidant, and solvent. The first additive may include: 0.1 to 20 parts of a first vulcanizing agent (e.g., 1 to 15 parts); 0.01 to 1 part of a first antioxidant; and 0.01 to 1 part of a first solvent. The "first" mentioned above primarily distinguishes the second additive in the double-sided adhesive layer described below, as well as the specific components thereof.

[0056] The hot melt adhesive composition described in the embodiment of the present application can form a non-transparent adhesive layer, that is, the surface of the adhesive layer can be matte; for example, the light transmittance of the adhesive layer can be less than 50%, and in some embodiments it can be a matte adhesive layer. The adhesive layer formed by the hot melt adhesive composition has a surface matte structure, which can be a matte coating and / or a surface grid design; in some possible embodiments, it can be a tabular grid design for matting. The hot melt adhesive composed of the above components in the embodiment of the present application has strong viscosity, can form a good integrated bonding structure with Mylar, etc., and is also convenient for positioning during assembly applications; at the same time, the temperature of its reversible hot melt conversion can be 45 to 60°C, and it has good temperature resistance. The thickness of the adhesive layer formed by the hot melt adhesive composition described in the embodiment of the present application is not limited, such as 0.04-0.07mm; an isolation film can also be provided on at least one side of the adhesive layer to facilitate subsequent hot melt bonding processing and assembly applications.

[0057] By utilizing the aforementioned technical solution, the hot melt adhesive composition provided herein primarily comprises a certain proportion of polystyrene synthetic resin, along with a small amount of epoxy resin, as well as components such as tackifying resin and fillers. The combined effects of these components allow the hot melt adhesive to form a non-transparent adhesive layer, meaning the surface can be matte, ensuring a matte appearance. Furthermore, its strong adhesion allows it to form a well-integrated bonding structure with materials such as Mylar, thereby resolving the issue of poor appearance quality in encapsulated electronic devices.

[0058] Furthermore, the hot melt adhesive composition can be combined with a high-performance acrylic double-sided adhesive through a substrate, etc., and can be attached to Mylar with a thinner thickness; in addition, the heat resistance and aging resistance can be improved.

[0059] The embodiment of the present application provides a hot-pressed adhesive component, which may include a supporting substrate and a hot-melt adhesive layer bonded to at least one side thereof;

[0060] The hot melt adhesive layer can be formed from a hot melt adhesive composition comprising: at least 95 wt% of a polystyrene resin; 1-5 wt% of an epoxy resin; and 0-4 wt% of a first additive, wherein the first additive comprises a first tackifying resin, a first plasticizer, and a first filler. The hot-pressed adhesive component provided in the present embodiment has a hot melt adhesive layer with high bonding strength and a matte surface, facilitating application.

[0061] See also Figure 2 , Figure 2 This is a schematic structural diagram of a hot-pressed adhesive component provided in an embodiment of the present application; wherein 20 is a non-woven fabric, 21 is a hot-melt adhesive layer, and 22 is an isolation film.

[0062] The hot-pressed adhesive component of the present application may include a supporting substrate, on which the hot melt adhesive composition may be applied to form an adhesive layer. The supporting substrate may also be referred to as a base material layer, and may be made of a flexible and / or rigid material.

[0063] In some embodiments, the embodiments of the present application use a relatively flexible non-woven fabric substrate; non-woven fabrics are also called non-woven fabrics, non-woven fabrics, and non-woven fabrics. They are made of oriented or randomly arranged fibers through friction, cohesion, bonding, or a combination of these methods. They are relatively light and moderately soft. This application has no special restrictions on the specific fiber types of the non-woven fabric substrate. Chemical fibers such as polypropylene, viscose fibers, and natural fibers such as cotton can all be made into non-woven fabrics. The substrate layer can further have a gram weight of less than 18g / m 2 The nonwoven fabric substrate layer, for example, Figure 2 The weight of the non-woven fabric 20 can be 5 to 15 g / m 2 (Can be expressed as 5-15G.) This application can use a non-woven fabric substrate with a lower square meter weight to make the substrate more permeable to hot melt adhesive, so as to reduce the thickness of the end product; in some embodiments, commercially available 9G or 14G non-woven tissue paper can be used, and the substrate thickness can be 0.01mm.

[0064] In the embodiment of the present application, a hot melt adhesive layer 21 is bonded to one side of the non-woven fabric 20; an outer layer of the non-supporting substrate of the hot-pressed adhesive component is a release film 22. The hot melt adhesive layer 21 is a matte hot melt adhesive film formed from the hot melt adhesive composition described above, the composition of which is not detailed here. Furthermore, the release film 22 can also be a matte material layer.

[0065] In addition, the hot-pressed adhesive component may also include a double-sided adhesive isolation layer. The double-sided adhesive isolation layer is composed of a double-sided adhesive layer and an isolation layer bonded to each other, with one side of the double-sided adhesive layer bonded to the substrate layer and the other side bonded to the isolation layer. After removing the isolation layer from the double-sided adhesive layer, the hot-pressed adhesive component of this embodiment can be bonded to structures such as Mylar.

[0066] In some embodiments of the present application, the double-sided adhesive layer may be an acrylic double-sided adhesive layer, which may be composed of an acrylic pressure-sensitive adhesive, the main raw materials of which may include an acrylic resin elastomer (monomers such as acrylic acid, butyl acrylate, and hydroxyethyl acrylate), and additives including solvents. The double-sided adhesive layer may be a heat-resistant acrylic double-sided adhesive layer of 90°C or above, and may be 0.05 to 0.08 mm thick. Commercially available or homemade acrylic double-sided adhesive may be used.

[0067] In some possible embodiments, the double-sided adhesive layer may include: 87-93 wt % of an acrylic resin elastomer; 7-13 wt % of a second additive; and the second additive includes a second tackifying resin, a second plasticizer, and a second filler.

[0068] The double-sided adhesive layer comprises an acrylic elastomer, a synthetic rubber resin that primarily acts as an adhesive and bonding agent. This elastomer, referred to as acrylic rubber (ACM), is copolymerized with acrylic ester as the primary monomer. The acrylic elastomer has a saturated carbon backbone and polar ester side chains, exhibiting excellent mechanical and processing properties. The mass percentage of the acrylic elastomer can range from 87% to 93%, for example, 87%, 90%, or 93%.

[0069] The copolymer monomers of the acrylic resin elastomer may include a main monomer and a modifying monomer. The main monomer may include: n-butyl acrylate (BA) and 2-ethylhexyl acrylate (2EHA), so that the side chain ester group has a large number of carbon atoms and high cold resistance. The mass ratio of butyl acrylate and 2-ethylhexyl acrylate may be (51-60): (8-10), and may be 51:10, 51:8, 52:9, 58:9, 60:8, 60:10, 60:9, etc. In order to maintain the good oil resistance of the acrylic resin elastomer and improve its low temperature resistance, facilitate polymerization and vulcanization, etc., the modifying monomer may include: one or more of acrylic acid (AA), glycidyl methacrylate (GMA), hydroxyethyl acrylate (HEA), and 2-hydroxypropyl acrylate (HPA); and may further be composed of acrylic acid, glycidyl methacrylate, hydroxyethyl acrylate, and 2-hydroxypropyl acrylate.

[0070] In a possible embodiment of the present application, the main monomer may include 51 to 60 parts (or 52 to 57 parts, etc.) of butyl acrylate and 8 to 10 parts of 2-ethylhexyl acrylate, and the modified monomer may include 3 to 8 parts of acrylic acid, 1 to 3 parts of glycidyl methacrylate, 2 to 3 parts of hydroxyethyl acrylate, and 4 to 5 parts of 2-hydroxypropyl acrylate. The mass ratio of acrylic acid, glycidyl methacrylate, hydroxyethyl acrylate, and 2-hydroxypropyl acrylate may be (3 to 8): (1 to 3): (2 to 3): (4 to 5), and may further be (4 to 5): (1 to 2.5): (2 to 2.5): (4 to 4.5).

[0071] The acrylic resin elastomer described in the examples of this application can be commercially available or synthesized. Its synthesis method is primarily emulsion polymerization. The type and ratio of monomers, as well as the addition of additives such as emulsifiers and molecular weight regulators, can have a certain impact on the processing properties of the acrylic rubber. The polymerization temperature is generally between 50 and 100°C, and condensation reflux can be used to control the polymerization rate. Post-polymerization processing can be performed using conventional process conditions.

[0072] Furthermore, the proportion of the second additive can be 7-13% by weight, for example, 7%, 10%, 11%, 12%, 13%, etc. The second additive includes a second tackifying resin, a second plasticizer, and a second filler. The second tackifying resin can be a C5 or C9 resin, etc. The second plasticizer includes, but is not limited to, epoxidized oils such as epoxidized soybean oil. The second filler can be selected from one or more of calcium carbonate, talc, and precipitated silica.

[0073] The type and proportion of the second additive can be the same as or different from the first additive, and there is no particular limitation. The mass ratio of the second tackifying resin to the second plasticizer can also be (30-50): (2-10); the second additive can include 5-40 parts by weight of a second filler.

[0074] The second additive may further include one or more of a second vulcanizing agent, a second antioxidant, and a second solvent; the solvent may be water, or a hydrocarbon, an ester, etc., and there is no special limitation in this application.

[0075] In some possible embodiments, according to the product characteristics, the embodiments of the present application adjust the ratio of acrylic acid, hydroxyethyl acrylate and solvent in the acrylic double-sided adhesive (for example, including 1 part of the second solvent) to improve its viscosity, better bond the applied parts, and reduce product aging; its temperature resistance can be increased to 90-99°C (that is, when conducting tensile performance tests - PA tests at this high temperature, there is basically no glue overflow).

[0076] In some possible embodiments, the double-sided adhesive layer may have a grid structure, that is, air guide grooves are formed along the bonding direction; this grid-designed double-sided adhesive layer can reduce bubbles during bonding.

[0077] The isolation layer of the double-sided adhesive isolation layer is generally made of colored glassine paper, such as white, yellow, etc. Glassine paper, also known as translucent cellophane, is made of glassine base paper by calendering and has good protective properties.

[0078] The basic processing technology of the hot-pressed adhesive parts in some embodiments of the present application may include:

[0079] blending the components of the hot melt adhesive composition described above;

[0080] Applying the hot melt adhesive composition on one surface of the non-woven fabric substrate and performing preliminary curing for 10-12 hours;

[0081] An acrylic pressure-sensitive adhesive is coated on the other surface of the non-woven fabric substrate, and the coating can be fully covered or partially covered. During the coating process, the two sides are preferably isolated using a polyethylene terephthalate (PET) release film. After re-aging, the side of the acrylic pressure-sensitive adhesive away from the substrate can be replaced with yellow release paper, or replaced with white glassine paper, etc.

[0082] The hot-pressed adhesive described in the embodiments of this application can be used as a packaging product for some electronic devices, creating a matte finish. Due to its strong adhesive properties, the hot-pressed adhesive can form a well-integrated bonding structure with materials such as Mylar, thereby improving the appearance quality of the electronic device. Furthermore, the hot-pressed adhesive can be reduced in thickness, such as to 0.1-0.2 mm. Its heat resistance and aging resistance can also be improved, and the temperature required for re-softening after complete curing can also be increased.

[0083] From a process perspective, generally, the acrylic double-sided adhesive layer is only coated once. In the hot-pressed adhesive parts of possible embodiments of the present application, the hot melt adhesive composition can be coated twice, and the acrylic pressure-sensitive adhesive can also be coated twice. The advantage of this is that the aging resistance, low temperature resistance and viscosity are fully improved.

[0084] In some possible embodiments, the mass ratio of the hot melt adhesive layer, the double-sided adhesive layer, and the base material layer may be 57-73%: 30-40%: 10-20%.

[0085] The present application further provides a packaging component, comprising an insulating member, wherein at least one surface of the insulating member is provided with a hot-pressed adhesive layer, wherein the hot-pressed adhesive layer sequentially comprises a hot-melt adhesive layer, a base material layer, and a double-sided adhesive layer, wherein the double-sided adhesive layer is adhered to at least one surface of the insulating member;

[0086] The hot melt adhesive layer can be formed by a hot melt adhesive composition, which includes: more than 95wt% of polystyrene resin; 1-5wt% of epoxy resin; 0-4wt% of a first additive; the first additive includes a first tackifying resin, a first plasticizer and a first filler.

[0087] The packaging components provided in the embodiments of the present application have a hot-melt adhesive layer with a high bonding strength and a matte surface, facilitating ease of use. By utilizing the aforementioned technical solutions, the hot-pressed adhesive components and packaging components provided herein can be used to package certain electronic devices, with a matte exterior surface. Due to their strong adhesive properties, the hot-pressed adhesive components can form a well-integrated bonding structure with materials such as Mylar, thereby enhancing the appearance quality of the electronic devices.

[0088] See also Figure 3 , Figure 3This is a schematic diagram of the cross-sectional structure of a packaging component provided in an embodiment of the present application; wherein 30 is a non-woven fabric substrate layer, 31 is a hot melt adhesive layer, 32 is an isolation film, 33 is an acrylic double-sided adhesive layer, and 34 is a Mylar sheet.

[0089] The packaging component described in the embodiment of the present application may include a hot-pressed adhesive layer, which may be composed of a non-woven fabric substrate layer 30, a hot-melt adhesive layer 31, an isolation film 32 and an acrylic double-sided adhesive layer 33 that are bonded together.

[0090] The composition of the substrate layer, hot melt adhesive layer, and double-sided adhesive layer are as described above. In some possible embodiments, the substrate layer may have a gram weight of less than 18 g / m 2 The non-woven fabric substrate layer has better permeability; the double-sided adhesive layer can be an acrylic double-sided adhesive layer with a temperature resistance of more than 90°C, which has high performance. Furthermore, the thickness of the hot-pressed adhesive layer can be 0.1 to 0.2 mm, which is relatively thin.

[0091] The packaging component described in this embodiment includes an insulating member, which can be Mylar sheet 34. Its shape, size, and performance are not particularly limited, and conventional Mylar can be used. The acrylic double-sided adhesive layer 33 is adhered to one surface of the Mylar sheet 34. The two can be bonded together by removing the glassine paper from the hot-pressed adhesive described above.

[0092] The packaging component described herein can be used in some electronic devices to achieve a matte appearance. Due to the strong adhesive properties of the hot melt adhesive, the hot-pressed adhesive layer and Mylar, etc., form a well-integrated bonding structure, thereby improving the appearance quality of the electronic device.

[0093] An embodiment of the present application provides an electronic device, which may include a metal housing having a heat dissipation mesh structure, and a packaging component may be attached to the metal housing at a position corresponding to the heat dissipation mesh structure;

[0094] The packaging component includes an insulating member, at least one surface of which is provided with a hot-press adhesive layer, the hot-press adhesive layer sequentially comprising a hot-melt adhesive layer, a base material layer, and a double-sided adhesive layer, the double-sided adhesive layer being adhered to at least one surface of the insulating member; the hot-melt adhesive layer can be formed of a hot-melt adhesive composition, wherein the hot-melt adhesive layer of the hot-press adhesive layer is adhered to the metal shell;

[0095] The hot melt adhesive composition comprises: more than 95 wt% of polystyrene resin; 1-5 wt% of epoxy resin; and 0-4 wt% of a first additive; the first additive comprises a first tackifying resin, a first plasticizer and a first filler.

[0096] The electronic device provided in the embodiments of the present application is mainly applied to products such as laptop computers and mobile phones, and is not limited to electronic display devices with metal shells having heat dissipation structures.

[0097] In some embodiments of the present application, the laptop computer may include a metal housing having a heat dissipation mesh structure. The heat dissipation mesh structure may be a portion of the metal housing or a heat sink embedded in the metal housing. The heat dissipation mesh structure is positioned to correspond to the location of components such as the processor in the laptop computer, and is generally rectangular in shape. The mesh structure comprises a high-density array of uniformly arranged small holes, which can achieve a certain heat dissipation effect. Each of the small holes is generally a regularly shaped through-hole, such as a rectangular hole, a diamond hole, a regular hexagonal hole, a circular hole, etc., and there is no particular limitation on the specific size of the small holes.

[0098] Corresponding to the heat dissipation mesh structure, a packaging component including an insulating part can be pasted inside the metal shell. The insulating part can be a Mylar sheet, which can be used to insulate and protect electronic components. The shape of the Mylar sheet can be rectangular or a regular polygon (such as the letter "T" shape, etc.); one of its surfaces can be provided with a fully covered hot-pressed adhesive layer, thereby pasting it on the metal shell. The hot-pressed adhesive layer includes a bonded hot melt adhesive layer, a base material layer and a double-sided adhesive layer in sequence. The double-sided adhesive layer is pasted on the surface of the Mylar sheet, and the hot melt adhesive layer can be pasted on the inner surface of the metal shell. The hot melt adhesive layer can be formed by the hot melt adhesive composition described above, and can be a highly viscous matte adhesive layer. In this way, the hot melt adhesive layer that passes through the heat dissipation mesh appears matte and is firmly bonded, thereby improving the appearance quality of the laptop computer.

[0099] In a possible implementation of this embodiment, the metal housing of the laptop can be made of aluminum or stainless steel, and its heat dissipation mesh structure can also be made of aluminum. The composition of the hot-pressed adhesive layer is as described above, and its thickness can be 0.1-0.2 mm.

[0100] Figure 4 A schematic diagram of the housing structure of an electronic device provided in some embodiments of the present application is shown. Figure 4 As shown, the electronic device is a notebook computer; wherein 40 is a hot melt adhesive layer, 41 is the body of the metal shell, and 411 is a heat dissipation mesh sheet.

[0101] In some embodiments of the present application, the laptop computer includes a metal housing, which may include a body 41 and a heat dissipation mesh sheet 411 that can be embedded and mounted on the outside of the body 41. The heat dissipation mesh sheet 411 may have a heat dissipation mesh structure and may be installed in a position corresponding to a heat-generating location in the laptop computer (e.g., where the processor is located). The heat dissipation mesh sheet 411 extends in the same direction as the plane of the body 41.

[0102] As laptop processor performance improves and graphics processing tasks increase, they often generate a lot of heat when running high-load applications, resulting in reduced system performance, reduced stability, and even hardware damage. To address this heat dissipation issue under high-load conditions, some embodiments of the present application may further include at least two heat dissipation holes in the body 41 corresponding to the heat generation locations of the laptop computer in a direction perpendicular to the extension of the heat dissipation mesh sheet 411, and their shapes are generally rectangular. Typically, the direction in which the heat dissipation mesh sheet extends is the XY plane direction, and the direction perpendicular to this is the Z direction, which is also the thickness direction.

[0103] In an embodiment of the present application, a packaging component may be attached to the inner side of the main body 41 of the metal shell at the location corresponding to the heat dissipation mesh sheet 411; the main body 41 and the heat dissipation mesh sheet 411 may both be made of aluminum, etc. The packaging component includes an insulating member, generally in the form of a sheet, etc. The insulating member may be a Mylar sheet, which may be in the form of a strip. As an insulating member, a hot-pressed adhesive layer is provided on one surface of the Mylar sheet, and the hot-pressed adhesive layer sequentially includes a bonded hot-melt adhesive layer 40, a base material layer, and a double-sided adhesive layer, and the double-sided adhesive layer is attached to the surface of the Mylar sheet; the hot-melt adhesive layer 40 is formed from the hot-melt adhesive composition described above and is attached to the main body 41. The hot-melt adhesive layer 40 in this embodiment will show its matte surface through the heat dissipation holes of the main body 41 and the heat dissipation mesh sheet 411, and its bonding strength is relatively high.

[0104] Alternatively, the metal shell body described in some embodiments of the present application may have multiple closable heat dissipation holes, such as three or four. Closable heat dissipation holes refer to heat dissipation holes that can be covered with other components. The insulating member may be located on the outside of the body at locations where the heat dissipation holes need to be closed, providing insulation protection. The insulating member may be a plurality of Mylar sheets shaped to correspond to the heat dissipation holes. Furthermore, the hot-pressed adhesive layer may have a hollow structure that partially coincides with the locations of the heat dissipation holes on the body, improving heat dissipation. The double-sided adhesive layer may be attached to the surface of the insulating member, and the hot-melt adhesive layer may be attached to the outside of the body, followed by the heat dissipation mesh sheet.

[0105] In some possible embodiments, the thickness of the heat-pressed adhesive layer may be 0.1 to 0.2 mm. The relatively thin thickness can simultaneously solve the problems of bonding strength and appearance, and the Z-direction space requirement for high-density openings on the back for heat dissipation.

[0106] By utilizing the aforementioned technical solution, the electronic device provided herein dissipates heat through the heat dissipation mesh structure of its metal housing. The packaging component primarily provides insulation protection, with a hot-melt adhesive layer of a specific composition applied to the surface of the insulating member. The hot-melt adhesive layer, which penetrates the heat dissipation mesh, creates a matte surface and provides a strong bond. Consequently, the electronic device exhibits a high-quality appearance.

[0107] Based on the heat dissipation of the electronic device provided by this application through the heat dissipation mesh structure, a number of heat dissipation holes can be selectively opened on the housing body to solve the heat dissipation problem of devices such as laptops under high load conditions. Furthermore, this application can use a thinned hot-pressed adhesive layer and packaging components to expand the space perpendicular to the direction in which the heat dissipation mesh sheet extends. This not only facilitates heat dissipation but also meets the space design requirements in this direction.

[0108] To better illustrate the present invention, the following examples are provided to further illustrate the present invention. Unless otherwise specified, the technical means used in the present invention are conventional means well known to those skilled in the art, and the various raw materials, reagents, instruments and equipment used in the present invention can be purchased from the market or prepared by existing methods.

[0109] Example 1

[0110] This embodiment provides a hot melt adhesive composition comprising a polystyrene resin, an epoxy resin, a tackifying resin, an epoxy plasticizer, a filler, a vulcanizing agent, an antioxidant, and a solvent. The amounts used are shown in Table 1. The additive composition is shown in Table 2. This composition can form a matte adhesive layer with a pull-out force exceeding 10 kgf and a reversible hot melt transition temperature of 60°C.

[0111] Table 1 Hot melt adhesive formula

[0112] Components Proportion parameter polystyrene resin 95％ Transparency 90% epoxy resin 4％ Epoxy content 0.44 additive 1％

[0113] Table 2 Composition of additives in hot melt adhesive

[0114] Components Specific types parts by weight Tackifying resin C5 resin 50 Epoxy plasticizers Epoxidized soybean oil 2 filler Precipitated silica 20 vulcanizing agent Polyamine 10 Antioxidants Antioxidant 4020 1 solvent water 1

[0115] Example 2

[0116] This example provides a hot melt adhesive composition comprising a polystyrene resin, an epoxy resin, a tackifying resin, an epoxy plasticizer, a filler, a vulcanizing agent, an antioxidant, and a solvent. The amounts used are shown in Table 3. The additive composition is shown in Table 4. This composition can form a matte adhesive layer with a pull-out force exceeding 10 kgf and a reversible hot melt transition temperature of 60°C.

[0117] Table 3 Hot melt adhesive formula

[0118] Components Proportion parameter polystyrene resin 98％ Transparency 90% epoxy resin 1％ Epoxy content 0.44 additive 1％

[0119] Table 4 Composition of additives in hot melt adhesive

[0120] Components Specific types parts by weight Tackifying resin C5 resin 30 Epoxy plasticizers Epoxidized soybean oil 10 filler Precipitated silica 30 vulcanizing agent Polyamine 10 Antioxidants Antioxidant 4020 1 solvent water 1

[0121] Example 3

[0122] This embodiment provides a packaging component, such as Figure 5 As shown, it includes a second Mylar 54, one surface of which is provided with a hot-pressed adhesive layer, which sequentially includes a hot-melt adhesive layer 51, a base material layer 50 and a double-sided adhesive layer 53, and the double-sided adhesive layer 53 is adhered to the surface of the second Mylar 54.

[0123] The hot melt adhesive layer 51 is formed by the hot melt adhesive composition in Example 1. The adhesive layer formed by the hot melt adhesive composition has a thickness of 0.04 mm, a matte surface (grid matte structure), a matte appearance, and a reversible hot melt conversion temperature of 60°C; the side away from the substrate layer 50 is a matte isolation film 52.

[0124] The substrate layer 50 is a 9G non-woven tissue paper substrate with a thickness of 0.01 mm.

[0125] The double-sided adhesive layer 53 is a 0.05mm thick acrylic double-sided adhesive layer composed of an acrylic pressure-sensitive adhesive with a temperature resistance of approximately 95°C. It comprises 87wt% of an acrylic resin elastomer and 13wt% of a second additive. The raw material ratios can be found in Tables 5 and 6. Both surfaces of the double-sided adhesive layer 53 feature a gridded design and air guide grooves.

[0126] The matte isolation film 52 is polished away, and the thickness of the hot-pressed adhesive layer is 0.1 mm.

[0127] The basic processing technology of the hot-pressed adhesive layer is as follows: the hot melt adhesive formula of Example 1 is used to prepare the glue; the hot melt adhesive is first coated on the non-woven tissue paper substrate, and after two coatings, it is initially cured for 10 hours, and then the acrylic pressure-sensitive adhesive is coated again, and after two coatings, it is cured again; after the curing is completed, white glassine paper is used on the surface of the acrylic pressure-sensitive adhesive for isolation and protection.

[0128] The white glassine paper is peeled off and adhered to the surface of the second Mylar 54 through the double-sided adhesive layer 53 to form the packaging component.

[0129] The mass ratio of the hot melt adhesive layer, the double-sided adhesive layer and the base material layer is 60%:30%:10%.

[0130] Table 5 Monomer formula of acrylic resin elastomer

[0131] monomer Abbreviation Feed mass ratio 2-Ethylhexyl acrylate 2EHA 8 Butyl acrylate BA 52 Hydroxyethyl acrylate HEA 2 2-Hydroxypropyl acrylate HPA 5 acrylic acid AA 6 Glycidyl methacrylate GMA 1

[0132] Table 6 Composition of additives in double-sided adhesive

[0133] Components Specific types parts by weight Tackifying resin C5 resin 50 Epoxy plasticizers Epoxidized soybean oil 2 filler Precipitated silica 20 vulcanizing agent Polyamine 10 Antioxidants Antioxidant 4020 1 solvent water 1

[0134] Example 4

[0135] This embodiment provides a packaging component, such as Figure 6As shown, it includes a third Mylar 64, one surface of which is provided with a hot-pressed adhesive layer, which sequentially includes a bonded hot-melt adhesive layer 61, a base material layer 60 and a double-sided adhesive layer 63, and the double-sided adhesive layer 63 is adhered to the surface of the third Mylar 64.

[0136] The hot melt adhesive layer 61 is formed by the hot melt adhesive composition in Example 2. The adhesive layer formed by the hot melt adhesive composition has a thickness of 0.065 mm, a matte surface (grid matte structure), a matte appearance, and a reversible hot melt conversion temperature of 60°C; the side away from the substrate layer 60 is a matte isolation film 62.

[0137] The substrate layer 60 is a 14G non-woven tissue paper substrate with a thickness of 0.01 mm.

[0138] The double-sided adhesive layer 63 is a 0.075mm thick acrylic double-sided adhesive layer composed of an acrylic pressure-sensitive adhesive with a temperature resistance of approximately 95°C. It comprises: 93wt% of an acrylic resin elastomer; 7wt% of a second additive. The raw material ratios can be found in Tables 7 and 8. Both surfaces of the double-sided adhesive layer 63 feature a gridded design and air guide grooves.

[0139] The matte isolation film 62 is polished away, and the thickness of the hot-pressed adhesive layer is 0.15 mm.

[0140] The basic processing technology of the hot-pressed adhesive layer is as follows: the hot melt adhesive formula of Example 2 is used to prepare the glue; the hot melt adhesive is first coated on the non-woven tissue paper substrate, and after two coatings, it is initially cured for 12 hours, and then the acrylic pressure-sensitive adhesive is coated again, and after two coatings, it is cured again; after the curing is completed, white glassine paper is used on the surface of the acrylic pressure-sensitive adhesive for isolation and protection.

[0141] The white glassine paper is peeled off and is pasted on the surface of the third Mylar 64 through the double-sided adhesive layer 63 to form the packaging component.

[0142] The mass ratio of the hot melt adhesive layer, the double-sided adhesive layer and the base material layer is 57%:30%:13%.

[0143] The second Mylar and the third Mylar respectively represent Mylar sheets in different embodiments and use hot melt adhesive compositions in different embodiments.

[0144] Table 7 Monomer formula of acrylic resin elastomer

[0145] monomer Abbreviation Feed mass ratio 2-Ethylhexyl acrylate 2EHA 10 Butyl acrylate BA 60 Hydroxyethyl acrylate HEA 3 2-Hydroxypropyl acrylate HPA 4 acrylic acid AA 8 Glycidyl methacrylate GMA 2

[0146] Table 8 Composition of additives in double-sided adhesive

[0147] Components Specific types parts by weight Tackifying resin C5 resin 40 Epoxy plasticizers Epoxidized soybean oil 10 filler Precipitated silica 30 vulcanizing agent Polyamine 10 Antioxidants Antioxidant 4020 1 solvent water 1

[0148] Example 5

[0149] This embodiment is a processing flow for a metal shell of a laptop computer, and the steps may be as follows:

[0150] according to Figure 7 As shown, the aluminum body 71 (thickness 0.8mm) is selectively opened in the Z direction corresponding to the position of the processor to form three closable heat dissipation holes, among which the heat dissipation hole 710 is the larger hole in the middle, and the heat dissipation holes 712 and 713 are symmetrically distributed on both sides, and are basically rectangular holes.

[0151] The packaging component in Example 3 is pasted onto the aluminum body 71 after the holes are opened. Figure 8 As shown, the second Mylar tape 54 (or third Mylar tape 64) is located at the heat dissipation holes 710, 712, and 713 that need to be sealed, and has a thickness of 0.05mm. The inner side of the system is guaranteed to be free of adhesive. The hot melt adhesive layer 51 is attached to the outside of the aluminum body 71. The corresponding heat dissipation holes 712 and 713 are rectangular hollow structures, which can save 0.65mm of Z-direction space.

[0152] On the outside of the aluminum body 71 to which the packaging component is attached, the hot melt adhesive layer 51 is attached to the aluminum heat dissipation mesh sheet 711 by a hot pressing process to ensure heat dissipation and a substantially full matte appearance. Figure 9 shown.

[0153] Among them, such as Figure 10 The hot pressing jig shown can press the adhesive structure of the hot pressing adhesive layer without sticking to the internal structure of the system, and it avoids contact with the second Mylar 54, thereby ensuring the hot pressing effect.

[0154] Example 6

[0155] The processing flow is basically the same as that of Example 5, except that by using the packaging component in Example 4, 0.6 mm of Z-direction space can be saved.

[0156] Comparative Example 1

[0157] This comparative example provides a hot melt adhesive composition formulation, using only polystyrene resin as the resin, as follows: It forms a glossy adhesive layer with low viscosity and a pull-out force of less than 10 kgf; and a reversible hot melt transition temperature of 40°C.

[0158] The hot melt adhesive of Example 1 can form a matte adhesive layer, and the pull-out force can reach more than 10 kgf; the reversible hot melt conversion temperature is 60° C., and the performance is better than the comparative example product.

[0159] Table 9 Hot melt adhesive formula

[0160] Components Proportion parameter polystyrene resin 98％ Transparency 90% additive 2％

[0161] Table 10 Composition of additives in hot melt adhesive

[0162] Components Specific types parts by weight Tackifying resin C5 resin 30 Epoxy plasticizers Epoxidized soybean oil 10 filler Precipitated silica 30 vulcanizing agent Polyamine 10 Antioxidants Antioxidant 4020 1 solvent water 1

[0163] This comparative example provides a packaging component, in which the hot-pressed adhesive layer sequentially includes a bonded hot melt adhesive layer, a substrate layer and a double-sided adhesive layer, and the composition of the hot melt adhesive layer is as described above; the mass ratio of the hot melt adhesive layer, the double-sided adhesive layer and the substrate layer is 40%:30%:30%.

[0164] A 20G non-woven fabric substrate is used; the double-sided adhesive layer includes: 87wt% of an acrylic resin elastomer; 13wt% of a second additive. The raw material proportions are shown in Tables 11 and 12. The temperature resistance is 85°C, and adhesive overflow occurs at around 85°C.

[0165] By applying Example 3 or Example 4, the bonding strength of the hot-pressed adhesive layer can reach a pull-out force of more than 10 kgf. Figure 11 This is the condition after testing of the electronic device housing used in the embodiment of the present application. It can be seen that it still has a high appearance quality after undergoing high humidity and high temperature tests. Figure 12 This is the situation before and after the test of applying the hot pressing adhesive of Comparative Example 1. The white area is the overflow of adhesive.

[0166] Table 11 Monomer formula of acrylic resin elastomer

[0167] monomer Abbreviation Feed mass ratio 2-Ethylhexyl acrylate 2EHA 4-6 Butyl acrylate BA 40-48 Hydroxyethyl acrylate HEA 1-2 2-Hydroxypropyl acrylate HPA 2-3 acrylic acid AA 4-5 Glycidyl methacrylate GMA 3-4

[0168] Table 12 Composition of additives in double-sided adhesive

[0169] Components Specific types parts by weight Tackifying resin C5 resin 50 Epoxy plasticizers Epoxidized soybean oil 2 filler Precipitated silica 20 vulcanizing agent Polyamine 10 Antioxidants Antioxidant 4020 1

[0170] Comparative Example 2

[0171] This comparative example provides a hot melt adhesive composition formulation, using polystyrene resin and epoxy resin in different proportions, as follows (the additive composition is the same as in Example 1). Adding too high a proportion of epoxy resin increases the hardness after curing, which can generate excess stress during bonding and make the adhesive more susceptible to debonding.

[0172] Table 13 Hot melt adhesive formula

[0173] Components Proportion parameter polystyrene resin 93％ Transparency 90% epoxy resin 6％ Epoxy content 0.44 additive 1％

[0174] Comparative Example 3

[0175] This comparative example provides a hot melt adhesive composition formulation, using polystyrene resin and phenolic resin as the resins, and the formulation is as follows (the additive composition is the same as in Example 1). The addition of phenolic resin prolongs the curing time and requires a higher temperature, which is not conducive to application.

[0176] Table 14 Hot melt adhesive formula

[0177] Components Proportion parameter polystyrene resin 95％ Transparency 90% Phenolic resin 4％ additive 1％

[0178] The foregoing descriptions of specific exemplary embodiments of the present application are for purposes of illustration and description. These descriptions are not intended to limit the present application to the precise forms disclosed, and it is apparent that many variations and modifications are possible in light of the foregoing teachings. The exemplary embodiments are selected and described for the purpose of explaining the specific principles of the present invention and their practical application, thereby enabling those skilled in the art to realize and utilize the various exemplary embodiments of the present application and various options and modifications. The scope of the present application is intended to be defined by the claims and their equivalents.

Claims

1. A hot melt adhesive composition comprising: More than 95 wt% of polystyrene resin; 1 to 5 wt% of epoxy resin; 0 to 4 wt% of a first additive; the first additive comprises a first tackifying resin, a first plasticizer and a first filler.

2. The hot melt adhesive composition according to claim 1, wherein the weight ratio of the first tackifying resin, the first plasticizer and the first filler is (30-50): (2-10): (5-40).

3. The hot melt adhesive composition according to any one of claims 1 to 2, wherein the first additive further comprises one or more of a first vulcanizing agent, a first antioxidant, and a first solvent; Calculated in parts by weight, the first additive may optionally include: 0 to 20 parts of a first vulcanizing agent; 0 to 1 part of a first antioxidant; and 0 to 1 part of a first solvent.

4. The hot melt adhesive composition according to any one of claims 1 to 3, wherein the hot melt adhesive composition forms a non-transparent adhesive layer, the adhesive layer formed by the hot melt adhesive composition has a surface matte structure, and the light transmittance of the adhesive layer may be less than 50%; And / or, at least one side of the adhesive layer formed by the hot melt adhesive composition is further provided with an isolation film.

5. A hot-pressed adhesive component comprising a supporting substrate and a hot-melt adhesive layer bonded to at least one side thereof, wherein the hot-melt adhesive layer is formed from a hot-melt adhesive composition comprising: More than 95 wt% of polystyrene resin; 1-5 wt% epoxy resin; 0 to 4 wt% of a first additive; the first additive includes a first tackifying resin, a first plasticizer and a first filler.

6. A packaging component comprising an insulating member, wherein at least one surface of the insulating member is provided with a hot-press adhesive layer, the hot-press adhesive layer sequentially comprising a hot-melt adhesive layer, a base material layer, and a double-sided adhesive layer, the double-sided adhesive layer being adhered to at least one surface of the insulating member; The hot melt adhesive layer is formed by a hot melt adhesive composition, which includes: more than 95wt% of polystyrene resin; 1-5wt% of epoxy resin; 0-4wt% of a first additive; the first additive includes a first tackifying resin, a first plasticizer and a first filler.

7. The packaging component according to claim 6, wherein at least one of the following conditions is satisfied: the base material layer has a gram weight of less than 18 g / m 2 The double-sided adhesive layer is an acrylic double-sided adhesive layer with a temperature resistance of more than 90°C; the double-sided adhesive layer has a grid structure; The double-sided adhesive layer may include: 87-93 wt% of an acrylic resin elastomer; 7-13 wt% of a second additive; the second additive includes a second tackifying resin, a second plasticizer, and a second filler; The copolymer monomers of the acrylic resin elastomer include a main monomer and a modified monomer, wherein the main monomer includes butyl acrylate and 2-ethylhexyl acrylate, and the modified monomer includes one or more of acrylic acid, glycidyl methacrylate, hydroxyethyl acrylate and 2-hydroxypropyl acrylate; In the main monomer of the acrylic resin elastomer, the mass ratio of butyl acrylate and 2-ethylhexyl acrylate is (51-60): (8-10); and / or, the modified monomer of the acrylic resin elastomer includes: 3-8 parts of acrylic acid, 1-3 parts of glycidyl methacrylate, 2-3 parts of hydroxyethyl acrylate, and 4-5 parts of 2-hydroxypropyl acrylate.

8. An electronic device comprising a metal housing having a heat dissipation mesh structure, wherein a packaging component is attached to the interior of the metal housing at locations corresponding to the heat dissipation mesh structure; The packaging component includes an insulating member, at least one surface of the insulating member is provided with a hot-pressing adhesive layer, the hot-pressing adhesive layer sequentially including a hot-melt adhesive layer, a base material layer and a double-sided adhesive layer, and the double-sided adhesive layer is adhered to at least one surface of the insulating member; The hot melt adhesive layer is formed by a hot melt adhesive composition, wherein the hot melt adhesive layer of the hot press adhesive layer is adhered to the metal shell; the hot melt adhesive composition comprises: More than 95 wt% of polystyrene resin; 1-5 wt% of epoxy resin; 0-4 wt% of a first additive; the first additive comprises a first tackifying resin, a first plasticizer and a first filler.

9. The electronic device according to claim 8, wherein the thermal adhesive layer completely covers a surface of the insulating member; or the metal housing comprises a body and a heat dissipation mesh sheet embedded and mounted on the outside of the body, the heat dissipation mesh sheet having a heat dissipation mesh structure and being mounted at a location corresponding to a heat generation location of the electronic device; and the heat dissipation mesh sheet extends in a direction consistent with the plane of the body; In a direction perpendicular to the extension of the heat dissipation mesh sheet, the main body is further provided with a plurality of heat dissipation holes corresponding to the heat generating positions of the electronic device; and a packaging component is pasted on the main body corresponding to the heat dissipation mesh structure.

10. The electronic device according to claim 9, wherein the main body has a plurality of closable heat dissipation holes, the insulating member is located at a position on the main body where the heat dissipation holes need to be closed, and the hot melt adhesive layer of the hot pressing adhesive layer is adhered to the main body; the hot pressing adhesive layer optionally has a hollow structure that is consistent with the position of the heat dissipation holes of the main body.

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