Roll plating equipment for water electroplating thickening

Through the design of homogenizer and conductive tape of the roller plating equipment, the problem of uneven copper foil plating layer in the water electroplating equipment is solved, and the thickness consistency and production efficiency of the electroplating copper deposition thickened layer are improved.

CN120443277APending Publication Date: 2025-08-08XIAN TAIJIN NEW ENERGY & MATERIALS SCI TECH CO LTD
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Patent Information

Application Number
CN202510861053.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-25
Publication Date
2025-08-08

AI Technical Summary

Technical Problem

Existing water electroplating equipment has problems such as uneven copper foil plating, uneven conductivity, and foil surface wrinkles, resulting in low production efficiency and high cost.

Method used

The roller plating equipment is adopted to improve the uniformity of the electrolyte by arranging the liquid homogenizer and a number of conductive tapes that are closely fitted with the electroplating carrier roller, and a conductive tape cleaning module is set up to ensure the consistency of the thickness of the electroplated copper deposited thickened layer on the substrate.

Benefits of technology

The thickness consistency of the electroplated copper deposition thickened layer is improved, the foil surface wrinkles are reduced, the manufacturing cost is reduced, and the product quality and production efficiency are ensured.

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Abstract

Roll plating equipment for water electroplating thickening comprises an unwinding roller, an electroplating carrier roller and a winding roller, shafts of the unwinding roller, the electroplating carrier roller and the winding roller are parallel to one another, the electroplating carrier roller is arranged in an electrolytic bath with a liquid homogenizer at the bottom, the annular conductive bands are tightly attached to the electroplating carrier roller, and the parts, outside the electrolytic bath, of the conductive bands are provided with carbon brush type conductive modules in a matched mode; a to-be-thickened base material is unwound from the unwinding roller and wound on the electroplating carrier roller, the conductive band is tangent and synchronously rotates with the base material along with the electroplating carrier roller, an electrolyte is uniformly distributed through the liquid homogenizer and enters a gap between the electrolytic bath and the electroplating carrier roller to be subjected to an electrolytic reaction, the thickened base material is rotated out of the electrolyte along with the electroplating carrier roller, and then the conductive band is stripped from the base material. The conductive band enters the electroplating circulation again through the carbon brush type conductive module; the uniformity of the electrolyte entering the electrolytic bath is improved, the thickness consistency of the electrocoppering deposition thickening layer on the base material is improved, the overall layout of the device is simple, and the manufacturing cost is reduced.
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Description

Technical Field

[0001] The invention belongs to the technical field of composite copper foil, and in particular relates to roller plating equipment for water electroplating thickening. Background Art

[0002] Composite copper foil is a micron-sized material with a "copper-polymer-copper" structure. It begins with a polymer film as a substrate, and then deposits a metallic copper layer on both the top and bottom surfaces of the substrate using processes such as water electrolysis. The metal layer is thickened to over 1μm by thickening, allowing it to replace traditional electrolytic copper foil. Water electroplating roller plating equipment can thicken composite copper foil materials using the principle of water electrolysis. Existing water electroplating equipment typically has a horizontal or vertical electroplating structure. Both structures suffer from uneven copper foil coatings. Furthermore, the high resistance of the composite copper foil's middle layer affects its electrical conductivity, making the design of the conductive mechanism for water electroplating equipment used for composite copper foil difficult. Problems such as wrinkles on the foil surface, uneven conductivity, and copper plating of the conductive device often occur, resulting in low production efficiency.

[0003] Chinese patent application publication number CN113430606A discloses a water electroplating apparatus comprising a discharge mechanism, a receiving mechanism, and a plating bath. The discharge mechanism and receiving mechanism are used to discharge and receive thin film substrates, respectively, and the plating bath is used to electroplate thin film substrates. However, this patent application presents difficulties in uniformly filling the plating bath and ensuring a good seal. Furthermore, the conductive copper strip cannot be cleaned, which impacts the quality of the electroplating.

[0004] Chinese patent application publication number CN114164478A discloses a horizontal electroplating apparatus comprising an unwinding mechanism and a plating bath. The bath houses an upper row of positive conductive titanium baskets and a lower row of positive conductive titanium baskets. Cathode edge conductive mechanisms are located on both sides of the upper and lower rows of positive conductive titanium baskets. Synchronicity between the upper and lower conductive belts is difficult to ensure, and poor synchronization can lead to wrinkling on the surface of the substrate being plated, impacting product quality. Summary of the Invention

[0005] In order to overcome the shortcomings of the above-mentioned prior art, the purpose of the present invention is to provide a roller plating equipment for water electroplating thickening. By arranging a liquid equalizer and arranging a plurality of annular conductive belts that are tightly fitted with the electroplating carrier roller, the uniformity of the electrolyte entering the electrolytic cell is greatly improved, the thickness consistency of the electroplated copper deposition thickening layer on the substrate is improved, the contact area of the substrate on the conductive roller is increased, and the probability of wrinkles on the foil surface is reduced. The conductive belt cleaning module reduces the probability of copper plating. The overall layout of the device is simple, which greatly reduces the manufacturing cost.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is:

[0007] A roller plating device for thickening water electroplating includes an unwinding roller 2 and a winding roller 7 for unwinding and rewinding a substrate 1, and an electrolytic cell 5 for electroplating the substrate 1. A plating carrier roller 3 is provided in the electrolytic cell 5. A plurality of annular conductive belts 401 are tightly fitted on the outer periphery of the plating carrier roller 3. The conductive belts 401 are tightly fitted to the plating carrier roller 3 through magnetic attraction to achieve synchronous rotation. The substrate 1 passes between the fitting parts of the conductive belts 401 and the plating carrier roller 3. The conductive belt 401 outside the electrolytic cell 5 is equipped with a carbon brush-type conductive module 403, and its carbon brushes 40304 are fitted to the surface of the conductive belt 401.

[0008] The carbon brush-type conductive module 403 includes a base 40301, which is built into the shell 40302. A base 40303 is provided on the upper surface of the base 40301, which passes through the upper surface of the shell 40302. A carbon brush 40304 is provided on the top of the base 40303. A number of screws 40305 are also provided on the base 40301, and all screws 40305 pass through the upper surface of the shell 40302. An adjustment spring 40306 is provided on the screw 40305 outside the shell 40302, and a nut 40307 is provided at the end of the screw 40305 so that the two ends of the adjustment spring 40306 are respectively against the upper surface of the shell 40302 and the nut 40307.

[0009] Two first spray pipes 9 are provided outside the electrolytic cell 5 , and the two first spray pipes 9 are respectively placed at the inlet where the substrate 1 enters the electrolytic cell 5 and at the outlet where the substrate 1 leaves the electrolytic cell 5 .

[0010] A first squeezing roller 801 in contact with the electroplating carrier roller 3 is provided at the entrance of the substrate 1 into the electrolytic tank 5 , and a second squeezing roller 802 in contact with the electroplating carrier roller 3 is provided at the exit of the substrate 1 from the electrolytic tank 5 .

[0011] A liquid equalizer 501 is provided at the bottom of the electrolytic cell 5, and the liquid equalizer 501 includes a liquid inlet box 50101. A main pipe 50102 for liquid inlet and a plurality of branch pipes 50103 for liquid outlet are provided on the side wall of the liquid inlet box 50101. The same number of liquid inlet holes as the branch pipes 50103 are opened at the bottom of the electrolytic cell 5, and the electrolytic cell 5 is connected to the branch pipes 50103 through the liquid inlet holes; a stirring rod 50104 is provided inside the liquid inlet box 50101, and a plurality of stirring paddles 50105 are provided on the stirring rod.

[0012] The roller plating equipment is also provided with a conductive belt cleaning module 402, which includes a box body 40201 with an opening at the top. The conductive belt 401 outside the electrolytic cell 5 circulates from one end of the box body 40201 into the other end and slides out. Several pairs of third squeezing rollers 40202, cleaning brushes 40203 and second spray pipes 10 are symmetrically arranged in the box body 40201. The conductive belt 401 passes between the symmetrical third squeezing rollers 40202, cleaning brushes 40203 and second spray pipes 10.

[0013] A winding roller 6 is provided between the winding roller 7 and the electroplating carrier roller 3 , and the axes of the winding roller 6 , the unwinding roller 2 , the electroplating carrier roller 3 and the winding roller 7 are parallel to each other.

[0014] An overflow tank 11 is provided on the top of the electrolytic tank 5 , and the overflow tank 11 is connected to the liquid preparation system.

[0015] The electroplating carrier roller 3 includes a roller 301 made of lightweight plastic and hollow inside. Both ends of the roller 301 are covered with roller side plates 302. A plurality of annular reinforcing ribs 303 are fitted on the inner wall of the roller 301. Each reinforcing rib 303 is fixedly connected to the central axis 305 through a number of brackets 304. Both ends of the central axis 305 pass through the roller side plates 302.

[0016] The conductive belt 401 is a rubber belt doped with magnetic fillers, in which a soft copper belt is embedded. The magnetic fillers account for ≥60% of the total mass of the conductive belt, and the magnetic fillers include neodymium iron boron powder, carbonyl iron powder or aluminum nickel cobalt.

[0017] The conductive belt 401 is tightly attached to the electroplating carrier roller 3 by magnetic attraction and keeps rotating synchronously.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The present invention adopts a roller plating design. By arranging a liquid homogenizer 501, the uniformity of the electrolyte entering the electrolytic cell 5 can be greatly improved, thereby improving the thickness consistency of the electroplated copper deposited thickening layer on the substrate 1.

[0020] 2. The present invention is provided with a plurality of self-circulating conductive belts 401, which are tightly attached to the electroplating carrier roller 3 through magnetic attraction. At the same time, the conductive belts 401 rotate synchronously with the electroplating carrier roller 3, thereby improving the conductive efficiency and uniformity of the substrate surface.

[0021] 3. The water electroplating thickening device of the present invention has a simple overall layout, a small number of guide rollers, less workload for adjusting the roller spacing between the guide rollers, and low equipment maintenance costs. While ensuring product quality, this layout structure greatly reduces manufacturing costs.

[0022] 4. The present invention processes a liquid inlet with the same width as the electroplating carrier roller 3 at the bottom of the electrolytic cell 5, and stirs the electrolyte by setting a liquid equalizer 501 to ensure that the solution is sprayed evenly on the substrate at the same time, thereby ensuring the uniformity of the electroplating layer of the substrate.

[0023] 5. In the present invention, the conductive tape 401 enters the conductive tape cleaning module 402 each time after being peeled off from the substrate during the circulation process to clean foreign matter and a small amount of precipitated copper layer adhering to the conductive tape, so as to avoid the generation of convex spots on the substrate surface during the next cycle that affect the quality of the composite copper foil.

[0024] 6. In the present invention, an overflow tank 11 is designed at the top of the electrolytic cell 5. After the solution enters the electrolytic cell 5 from the bottom, an electrochemical reaction occurs on the electroplating carrier roller 3. As the solution continues to flow in, the upper layer of solution flows out of the overflow tanks 11 at both ends and returns to the liquid preparation system to replenish the ion concentration. The solution circulation scheme of the present invention ensures that the electrolytic cell has a continuous and stable ion concentration for the electroplating reaction.

[0025] In summary, the present invention greatly improves the uniformity of the electrolyte entering the electrolytic cell, improves the thickness consistency of the electroplated copper deposited thickening layer on the substrate, simplifies the overall layout of the device, and greatly reduces manufacturing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the roller plating equipment of the present invention.

[0027] Figure 2 This is a side view of the roller plating equipment after the side panels are removed.

[0028] Figure 3 This is a three-dimensional diagram of the roller plating equipment after the side panels of the present invention are removed.

[0029] Figure 4 This is a front view of a half-section structural schematic diagram of the electroplating carrier roller 3 of the present invention.

[0030] Figure 5 It is a three-dimensional diagram of a half-section structure of the electroplating carrier roller 3 of the present invention.

[0031] FIG6( a ) is a structural perspective view of the liquid equalizer 501 of the present invention.

[0032] FIG6( b ) is a cross-sectional view of the structure of the liquid equalizer 501 of the present invention.

[0033] Figure 7 Schematic diagram of the structure of the carbon brush type conductive module 403 of the present invention.

[0034] Figure 8 Schematic diagram of the structure of the conductive tape cleaning module 402 of the present invention.

[0035] In the figure, 1. substrate; 2. unwinding roller; 3. electroplating carrier roller; 301. roller; 302. roller side plate; 303. reinforcing rib; 304. bracket; 305. central axis; 401. conductive belt; 402. conductive belt cleaning module; 40201. box body; 40202. third squeezing roller; 40203. cleaning brush; 403. carbon brush type conductive module; 40301. base; 40302. shell; 40303. base; 40304. carbon brush; 4 0305. Screw; 40306. Adjusting spring; 40307. Nut; 404. Guide wheel; 5. Electrolytic cell; 501. Liquid equalizer; 50101. Liquid inlet box; 50102. Main pipe; 50103. Branch pipe; 50104. Stirring rod; 50105. Stirring paddle; 6. Winding roller; 7. Winding roller; 801. First extrusion roller; 802. Second extrusion roller; 9. First spray pipe; 10. Second spray pipe; 11 Overflow tank; 12. Equipment frame. DETAILED DESCRIPTION

[0036] The structural principle and working principle of the present invention are described in detail below with reference to the accompanying drawings.

[0037] See also Figure 1 , shows a roller plating equipment for water electroplating thickening, see Figures 2-3 , Figure 2 、 Figure 3 The roller plating equipment after the side panels are removed is to facilitate the display of its internal structure. The roller plating equipment includes an unwinding roller 2 and a winding roller 7 for unwinding and rewinding the substrate 1, and an electrolytic cell 5 for electroplating the substrate 1. The electrolytic cell 5 is provided with an electroplating carrier roller 3. Two annular conductive belts 401 are tightly fitted at both ends of the outer periphery of the electroplating carrier roller 3. Each conductive belt 401 is tightly fitted with the electroplating carrier roller 3 by magnetic attraction to achieve synchronous rotation. The substrate 1 is moved from the conductive belt 401 to the electroplating carrier roller. 3, the conductive belt 401 outside the electrolytic cell 5 is equipped with a carbon brush-type conductive module 403 and a conductive belt cleaning module 402. The carbon brush 40304 of the carbon brush-type conductive module 403 is in contact with the surface of the conductive belt 401. The conductive belt 401 outside each electrolytic cell 5 is guided by the guide wheel 404 to circulate from one end of the conductive belt cleaning module 402 to the other end, thereby achieving conductivity of the substrate 1 and ensuring consistent conductivity efficiency of the conductive medium on the surface of the conductive belt 401. Figure 7The carbon brush type conductive module 403 includes a base 40301, which is built into the shell 40302. The upper surface of the base 40301 is provided with a seat 40303, which passes through the upper surface of the shell 40302. A carbon brush 40304 is provided on the top of the seat 40303. The base 40301 is also provided with four screws 40305, which all pass through the upper surface of the shell 40302. An adjustment spring 40306 is provided on the screw 40305 outside the housing 40302. A nut 40307 is provided at the end of the screw 40305 so that the ends of the adjustment spring 40306 respectively abut against the upper surface of the housing 40302 and the nut 40307. By adjusting the position of the nut 40307, the adjustment spring 40306 is compressed, which lifts the base 40301 and the base 40303 upward, driving the carbon brush 40304 to squeeze the conductive strip 401; see Figure 8 The conductive belt cleaning module 402 includes a box body 40201 with an opening at the top. The conductive belt 401 outside the electrolytic cell 5 circulates and enters from one end of the box body 40201 and slides out from the other end. Several pairs of third squeezing rollers 40202, cleaning brushes 40203 and second spray pipes 10 are symmetrically arranged in the box body 40201. The conductive belt 401 passes between the symmetrical third squeezing rollers 40202, cleaning brushes 40203 and second spray pipes 10. The symmetrical arrangement is conducive to uniform force on the conductive belt 401.

[0038] Two first spray pipes 9 are provided outside the electrolytic cell 5 to spray and clean the surface of the substrate 1 and the conductive tape 401 ; the two first spray pipes 9 are respectively placed at the entrance where the substrate 1 enters the electrolytic cell 5 and at the exit where the substrate 1 leaves the electrolytic cell 5 .

[0039] The first spray pipe 9 and the second spray pipe 10 are both externally connected to a water pump and communicated with a special water source for cleaning, which is a conventional technology.

[0040] A first squeezing roller 801 is provided at the entrance of the electrolytic cell 5, which is in contact with the electroplating carrier roller 3. A second squeezing roller 802 is provided at the exit of the electrolytic cell 5, which is in contact with the electroplating carrier roller 3. The first squeezing roller 801 and the second squeezing roller 802 are provided to flatten the substrate 1. The second squeezing roller 802 can also squeeze out any residual electrolyte on the surface of the substrate 1.

[0041] A winding roller 6 is arranged between the winding roller 7 and the electroplating carrier roller 3 to ensure that the wrap angle of the substrate 1 on the electroplating carrier roller 3 does not change as the winding diameter increases, thereby meeting the process requirements; the axes of the unwinding roller 2, the electroplating carrier roller 3, the winding roller 6, the winding roller 7, the first squeezing roller 801 and the second squeezing roller 802 are parallel to each other, in order to ensure that the substrate 1 is evenly stressed and not deformed, while ensuring stable operation of the equipment.

[0042] As shown in FIG6(a) and FIG6(b), a liquid equalizer 501 is provided at the bottom of the electrolytic cell 5 to achieve the purpose of evenly allowing the electrolyte to enter the electrolytic cell 5; the liquid equalizer 501 includes a liquid inlet box 50101, and a main pipe 50102 for liquid inlet and 11 branch pipes 50103 for liquid outlet are provided on the side wall of the liquid inlet box 50101. The main pipe 50102 is connected to the system for preparing the electrolyte, and the bottom of the electrolytic cell 5 is provided with the same number of liquid inlet holes as the branch pipes 50103. The electrolytic cell 5 is provided with liquid inlet holes. It is connected to the branch pipe 50103; a stirring rod 50104 is provided inside the liquid inlet box 50101, and 7 stirring paddles 50105 are provided on the stirring rod. The power of the stirring rod 50104 is provided by an external motor, which drives the stirring paddles 50105 to rotate continuously to ensure the uniformity of the electrolyte, and ensure that the electrolyte can enter the electrolytic cell 5 evenly. The electrolyte overflows into the system for preparing the electrolyte through the bottom liquid inlet box 50101 and the end face overflow groove 11, and then circulates from the main pipe 50102 back to the liquid inlet box 50101.

[0043] An overflow tank 11 is located at the top of the electrolytic cell 5 and is connected to the liquid preparation system. Solution enters the electrolytic cell 5 from the bottom and undergoes an electrochemical reaction on the electroplating carrier roller 3. As the solution continues to flow in, the upper layer of solution flows out of the overflow tank 11 and returns to the liquid preparation system to replenish the ion concentration. The solution circulation scheme of the present invention ensures that the electrolytic cell has a continuous and stable ion concentration for the electroplating reaction.

[0044] The electroplating carrier roller 3 includes a roller 301 made of lightweight plastic and hollow inside. The roller 301 is the contact surface with the substrate 1 and is made of UPVC or PP. UPVC is used in this embodiment. Both ends of the roller 301 are covered with roller side panels 302. A plurality of annular reinforcing ribs 303 are fitted on the inner wall of the roller 301. Each reinforcing rib 303 is fixedly connected to the central axis 305 through 6 brackets 304. The reinforcing ribs 303 and the brackets 304 are made of metal. In this embodiment, 3 reinforcing ribs 303 are provided. Each reinforcing rib 303 is welded to the central axis 305 through 6 brackets 304 and is made of stainless steel. The reinforcing ribs 303 and the brackets 304 support the roller 301 to prevent deformation. Both ends of the central axis 305 pass through the roller side panels 302, which are used to mount the electroplating carrier roller 3 on the side panels. The substrate 1 is coated on the surface of the electroplating carrier roller 3, and the electroplating carrier roller 3 is placed in the electrolytic tank 5. The electrolyte enters the gap between the two from the liquid equalizer 501 to complete the thickening of the plating layer of the substrate 1.

[0045] The conductive belt 401 is a rubber belt doped with magnetic fillers, and a soft copper belt is embedded in the rubber belt. The rubber and the magnetic fillers account for 75% of the total mass of the conductive belt 401, and the magnetic fillers are neodymium iron boron powder.

[0046] In one embodiment, the rubber and the magnetic filler account for 70% of the total mass of the conductive tape 401 , and the magnetic filler is carbonyl iron powder.

[0047] In another embodiment, the rubber and the magnetic filler account for 85% of the total mass of the conductive tape 401 , and the magnetic filler is aluminum nickel cobalt.

[0048] The driving shafts of the unwinding roller 2, the electroplating carrier roller 3 and the winding roller 7 are respectively connected to the power output shaft of the external motor for driving.

[0049] The conductive belt 401 rotates synchronously with the electroplating carrier roller 3 through magnetic attraction.

[0050] In this embodiment, the bearings of the unwinding roller 2, the guide wheel 404, the winding roller 6, the winding roller 7, the first squeezing roller 801, the second squeezing roller 802 and the central axis 305 are all fixed by the equipment frame 12, which is a conventional technology.

[0051] The working principle of the present invention is:

[0052] After the thickened substrate 1 is unwound from the unwinding roller 2 and wound onto the electroplating carrier roller 3, the conductive belts 401 on both sides are tangential to the substrate 1 and rotate synchronously with the electroplating carrier roller 3, and are flattened by the squeezing roller 801. Then the first spray pipe 9 sprays and cleans the surface of the substrate 1 and the conductive belt 401. The electrolyte is evenly distributed into the gap between the electrolytic tank 5 and the electroplating carrier roller 3 through the liquid equalizer 501 to cause an electrolytic reaction. After the thickened substrate 1 is rotated out of the electrolyte with the electroplating carrier roller 3, it is cleaned by the first spray pipe 9, and then the residual electrolyte on the surface is squeezed out by the squeezing roller 802. Then the conductive belt 401 is peeled off from the substrate 1. The conductive belt 401 first passes through the carbon brush conductive module 403, and then is guided into the conductive belt cleaning module 402 through the guide wheel 404, which is mainly used to clean the copper particles and residual solution that may exist on the surface of the conductive belt. After the cleaning is completed, it passes through a group of carbon brush conductive modules 403 and the guide wheel 404 to enter the electroplating cycle again.

Claims

1. A roller plating device for thickening water electroplating, comprising an unwinding roller (2) and a winding roller (7) for unwinding and winding a substrate (1), and an electrolytic cell (5) for electroplating the substrate (1), wherein an electroplating carrier roller (3) is provided in the electrolytic cell (5), characterized in that: The outer periphery of the electroplating carrier roller (3) is tightly fitted with a plurality of annular conductive belts (401), the substrate (1) passes between the conductive belts (401) and the fitted portion of the electroplating carrier roller (3), and the conductive belt (401) outside the electrolytic cell (5) is matched with a carbon brush-type conductive module (403), the carbon brushes (40304) of which are fitted with the surface of the conductive belt (401).

2. The roller plating equipment for water electroplating thickening according to claim 1, characterized in that: The carbon brush type conductive module (403) includes a base (40301), which is built into the shell (40302). A seat (40303) is provided on the upper surface of the base (40301), and the seat (40303) passes through the upper surface of the shell (40302). A carbon brush (40304) is provided on the top of the seat (40303). A plurality of screws (40305) are also provided on the base (40301), and all the screws (40305) pass through the upper surface of the shell (40302). An adjustment spring (40306) is provided on the screw (40305) outside the shell (40302), and a nut (40307) is provided at the end of the screw (40305) so that the two ends of the adjustment spring (40306) are respectively against the upper surface of the shell (40302) and the nut (40307).

3. The roller plating equipment for thickening water electroplating according to claim 1, characterized in that: Two first spray pipes (9) are arranged outside the electrolytic tank (5), and the two first spray pipes (9) are respectively placed at the inlet where the substrate (1) enters the electrolytic tank (5) and the outlet where the substrate (1) leaves the electrolytic tank (5).

4. The roller plating equipment for thickening water electroplating according to claim 1, characterized in that: A first squeezing roller (801) that is in contact with the electroplating carrier roller (3) is provided at the entrance of the substrate (1) entering the electrolytic tank (5), and a second squeezing roller (802) that is in contact with the electroplating carrier roller (3) is provided at the exit of the substrate (1) leaving the electrolytic tank (5).

5. The roller plating equipment for thickening water electroplating according to claim 1, characterized in that: A liquid equalizer (501) is provided at the bottom of the electrolytic cell (5), and the liquid equalizer (501) includes a liquid inlet box (50101). A main pipe (50102) for liquid inlet and a plurality of branch pipes (50103) for liquid outlet are provided on the side wall of the liquid inlet box (50101). The bottom of the electrolytic cell (5) is provided with the same number of liquid inlet holes as the branch pipes (50103). The electrolytic cell (5) is connected to the branch pipes (50103) through the liquid inlet holes. A stirring rod (50104) is provided inside the liquid inlet box (50101), and a plurality of stirring paddles (50105) are provided on the stirring rod.

6. The roller plating equipment for thickening water electroplating according to claim 1, characterized in that: The roller plating equipment is also provided with a conductive belt cleaning module (402), which includes a box body (40201) with an upper opening. The conductive belt (401) outside the electrolytic cell (5) circulates and enters from one end of the box body (40201) and slides out from the other end. Several pairs of third squeezing rollers (40202), cleaning brushes (40203) and second spray pipes (10) are symmetrically arranged in the box body (40201) from top to bottom. The conductive belt (401) passes between the symmetrical third squeezing rollers (40202), cleaning brushes (40203) and second spray pipes (10).

7. The roller plating equipment for thickening water electroplating according to claim 1, characterized in that: A winding roller (6) is provided between the winding roller (7) and the electroplating carrier roller (3), and the axes of the winding roller (6), the unwinding roller (2), the electroplating carrier roller (3) and the winding roller (7) are parallel to each other.

8. The roller plating equipment for thickening water electroplating according to claim 1, characterized in that: An overflow tank (11) is provided on the top of the electrolytic tank (5), and the overflow tank (11) is connected to the liquid preparation system.

9. The roller plating equipment for thickening water electroplating according to claim 1, characterized in that: The electroplating carrier roller (3) comprises a roller (301) made of lightweight plastic material and having a hollow interior. Both ends of the roller (301) are covered with roller side plates (302). A plurality of annular reinforcing ribs (303) are provided on the inner wall of the roller (301). Each reinforcing rib (303) is fixedly connected to a central shaft (305) via a plurality of brackets (304). Both ends of the central shaft (305) pass through the roller side plates (302).

10. The roller plating equipment for water electroplating thickening according to claim 1, characterized in that: The conductive belt (401) is a rubber belt doped with magnetic fillers, wherein a soft copper belt is embedded in the rubber belt, wherein the magnetic fillers account for ≥60% of the total mass of the conductive belt, and the magnetic fillers include neodymium iron boron powder, carbonyl iron powder or aluminum nickel cobalt; the conductive belt (401) is tightly fitted with the electroplating carrier roller (3) through magnetic attraction to achieve synchronous rotation.

Citation Information

Patent Citations

  • Water electroplating equipment

    CN113430606A

  • Horizontal electroplating equipment

    CN114164478A