Display temperature control circuit, display temperature control method and display device

Abstract

A display temperature control circuit, a display temperature control method and a display device, the display temperature control circuit comprises a first power supply, a heating module, a shunt module, a detection module and a controller, the heating module is electrically connected with the first power supply, and the heating module is used for increasing the temperature of a circuit board; the shunting module is electrically connected with the first power supply and is connected in parallel with the heating module; the detection module is used for detecting the temperature of the heating module; the controller is electrically connected with the detection module and the shunting module and used for controlling the shunting module to be connected or disconnected according to the temperature detected by the detection module so that the temperature of the heating module can be within a preset range. In a low-temperature or high-humidity environment, the heating module of the display temperature control circuit can heat and bake the circuit board, so that the circuit board can work normally; meanwhile, the display temperature control circuit can control the temperature of the heating module to be within a preset range through connection or disconnection of the shunt module, so that the temperature of the heating module is prevented from being too high, and a suitable working environment can be continuously provided for the circuit board.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display temperature control circuit, a display temperature control method, and a display device. Background Art

[0002] A display device includes a display panel, a main circuit board, circuit boards (including horizontal and vertical circuit boards), and a timing controller. The chip on the main circuit board receives signals to be transmitted, processes them, and then transmits them to the timing controller. The timing controller then transmits the received data via the circuit boards to the display panel, thereby driving the display panel for display.

[0003] Circuit boards are responsible for the transmission, distribution, and control of electrical signals. However, in cold or tropical regions with high humidity, low temperatures or moisture can affect the proper functioning of components on circuit boards, leading to poor signal transmission or even signal distortion. Summary of the Invention

[0004] The purpose of this application is to provide a display temperature control circuit, a display temperature control method and a display device, which can continuously provide a suitable working environment for a circuit board.

[0005] To achieve the purpose of this application, this application provides the following technical solutions:

[0006] In a first aspect, the present application provides a display temperature control circuit, comprising a first power supply, a heating module, a shunt module, a detection module and a controller, wherein the heating module is electrically connected to the first power supply, and the heating module is used to increase the temperature of the circuit board; the shunt module is electrically connected to the first power supply and is arranged in parallel with the heating module; the detection module is used to detect the temperature of the heating module; the controller is electrically connected to the detection module and the shunt module, and the controller is used to control the shunt module to be connected or disconnected according to the temperature detected by the detection module, so that the temperature of the heating module is within a preset range.

[0007] In one embodiment, the display temperature control circuit also includes a second power supply, the detection module is electrically connected to the second power supply, the detection module includes a thermistor, the controller is electrically connected to both the thermistor and the shunt module, and the controller is used to control the connection or disconnection of the shunt module according to the voltage of the thermistor.

[0008] In one embodiment, the detection module further includes a first resistor and a second resistor. The thermistor is connected in parallel with the first resistor and then in series with the second resistor. The controller is connected to an end of the thermistor that is away from the second resistor after being connected in parallel with the first resistor.

[0009] In one embodiment, the shunt module includes multiple shunt units, which are arranged in parallel. Each of the shunt units includes a shunt resistor and a switch arranged in series. The controller is electrically connected to the multiple switches and is used to control the switches to be opened or closed.

[0010] In a second aspect, the present application further provides a display temperature control method, which is applied to the display temperature control circuit as described in any one of the various embodiments of the first aspect, comprising:

[0011] The detection module detects the temperature of the heating module;

[0012] The controller controls the shunt module to shunt the current output by the first power supply according to the temperature detected by the detection module, thereby controlling the magnitude of the current flowing through the heating module so that the temperature of the heating module is within a preset range.

[0013] In one embodiment, the shunt module includes a plurality of shunt units arranged in parallel, each of which includes a shunt resistor and a switch arranged in series. The controller is electrically connected to the plurality of switches and is used to control the switches to be opened or closed.

[0014] When the temperature of the heating module is lower than a first preset value, the switches of all the diversion units are turned off;

[0015] When the temperature of the heating module is higher than the first preset value and lower than a second preset value, the switches of at least some of the diversion units are closed, and the number of closed switches of the plurality of diversion units increases as the ambient temperature rises, and the second preset value is greater than the first preset value;

[0016] When the temperature of the heating module is higher than a second preset value, the switches of all the diversion units are closed.

[0017] In one embodiment, there are four diversion units, and the temperature of the heating module includes four preset values T1, T2, T3 and T4 that increase in sequence;

[0018] When the temperature of the heating module is less than or equal to T1, the switches of the four diversion units are all disconnected;

[0019] When the temperature of the heating module is greater than T1 and less than or equal to T2, the switch of one of the diversion units is closed, and the switches of the other three diversion units are opened;

[0020] When the temperature of the heating module is greater than T2 and less than or equal to T3, the switches of two of the shunt units are closed, and the switches of the other two shunt units are opened;

[0021] When the temperature of the heating module is greater than T3 and less than or equal to T4, the switches of three of the shunt units are closed, and the switch of the remaining shunt unit is opened;

[0022] When the temperature of the heating module is greater than T4, the switches of the four diversion units are all closed.

[0023] In a third aspect, the present application further provides a display device, comprising a circuit board and a display temperature control circuit as described in any one of the various embodiments of the first aspect, wherein the heating module is arranged on the circuit board.

[0024] In one embodiment, the first power supply, the shunt module, the detection module and the controller are all disposed on the circuit board.

[0025] In one embodiment, the circuit board includes a plurality of stacked functional layers; the heating module is disposed on the functional layer, or the heating module and the functional layer are stacked.

[0026] By setting up a heating module and a shunt module in parallel, the detection module detects the temperature of the heating module, and the controller controls the connection or disconnection of the shunt module according to the temperature detected by the detection module. In a low temperature or high humidity environment, the heating module can heat and bake the circuit board so that the circuit board can work normally and avoid signal distortion; at the same time, the display temperature control circuit can control the temperature of the heating module to be within a preset range by connecting or disconnecting the shunt module, avoiding the temperature of the heating module from being too high, and continuously providing a suitable working environment for the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the implementation methods of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the implementation methods or the description of the prior art. Obviously, the drawings described below are only some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 is a schematic diagram showing a temperature control circuit according to an embodiment;

[0029] Figure 2 is a flow chart showing a temperature control method according to an embodiment;

[0030] Figure 3 is a schematic diagram of a display device according to an embodiment;

[0031] Figure 4 is a schematic cross-sectional view of a circuit board and a heating module according to an embodiment;

[0032] Figure 5It is a cross-sectional schematic diagram of a circuit board and a heating module according to another embodiment.

[0033] Description of reference numerals:

[0034] 1000-display device;

[0035] 100 - display temperature control circuit, 10 - first power supply, 20 - heating module, 30 - shunt module, 31 - shunt unit, 40 - detection module, 50 - controller, 60 - second power supply, R1 - thermistor, R2 - first resistor, R3 - second resistor, R4 - shunt resistor, SW - switch;

[0036] 200-circuit board, 201-device layer, 202-power layer, 203-ground layer, 204-signal transmission layer;

[0037] 300-display panel;

[0038] 400-Source driver. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0040] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may be an intermediate component. When a component is referred to as being "connected to" another component, it may be directly connected to the other component or there may be an intermediate component.

[0041] Unless otherwise defined, all technical and scientific terms used in this application have the same meanings as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used in this application includes any and all combinations of one or more of the relevant listed items.

[0042] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0043] Please refer to Figure 1An embodiment of the present invention provides a display temperature control circuit 100, comprising a first power supply 10, a heating module 20, a shunt module 30, a detection module 40, and a controller 50. The heating module 20 is electrically connected to the first power supply 10 and is used to increase the temperature of a circuit board 200; the shunt module 30 is electrically connected to the first power supply 10 and is arranged in parallel with the heating module 20; the detection module 40 is used to detect the temperature of the heating module 20; and the controller 50 is electrically connected to the detection module 40 and the shunt module 30. The controller 50 is used to control the connection or disconnection of the shunt module 30 based on the temperature detected by the detection module 40, so as to keep the temperature of the heating module 20 within a preset range.

[0044] The first power supply 10 is used to supply power to the heating module 20 and the shunt module 30. The first power supply 10 can be any feasible power supply in the art, without specific limitation. Optionally, the first power supply 10 is a constant current source, that is, the first power supply 10 can output a stable current that does not change with load changes, which can meet the needs of precision electronic equipment. Optionally, the first power supply 10 can specifically be a linear constant current source, a switching constant current source, a mirror constant current source, an adjustable constant current source, a digitally controlled constant current source, etc.

[0045] The heating module 20 is used to convert electrical energy into thermal energy, and the heat generated by the heating module 20 increases as the current of the heating module 20 increases. Optionally, the heating module 20 includes at least one heating element, which can be a device that can generate heat when powered, such as a heating wire, a heating film, a ceramic heating plate, a conductive coating, etc., without limitation. Optionally, the heating module 20 is disposed on or adjacent to the circuit board 200, and the heat generated by the heating module 20 can be used to bake the circuit board 200 to increase the temperature of the circuit board 200.

[0046] The shunt module 30 is used to shunt the current passing through the heating module 20 when connected, thereby controlling the current flowing through the heating module 20 and, in turn, the temperature of the heating module 20. The shunt module 30 can be a single current-adjustable circuit, through which the current flowing through the circuit can be adjusted. Alternatively, the shunt module 30 can include multiple adjustment circuits, through which the current flowing through the shunt module 30 can be adjusted by controlling the number of connected circuits. The details are not limited thereto.

[0047] The detection module 40 is used to detect the temperature of the heating module 20 and transmit the detection signal to the controller 50. The controller 50 is used to control the connection or disconnection of the shunt module 30 based on the detection signal of the detection module 40 to adjust the temperature of the heating module 20. Optionally, the detection module 40 can adopt any feasible temperature detection device in the art, such as a thermistor, a thermocouple sensor, a platinum resistance sensor, an integrated temperature sensor, etc., without limitation.

[0048] Specifically, when the detection module 40 detects that the temperature of the module to be heated 20 is lower than the preset value, the controller 50 controls the shunt module 30 to be disconnected so that all the current of the first power supply 10 flows through the heating module 20, and the heating module 20 can quickly heat up to a preset range; when the detection module 40 detects that the temperature of the module to be heated 20 is higher than the preset value, the controller 50 controls the shunt module 30 to be connected so that at least part of the current of the first power supply 10 flows through the shunt module 30, and the current flowing through the heating module 20 is reduced, which can reduce the heating temperature of the heating module 20 and control the temperature of the heating module 20 to be within the preset range.

[0049] The circuit board 200 in the display device 1000 is responsible for the transmission, distribution, and control of electrical signals. However, in low-temperature environments, the conductivity of the signal transmission lines carried by the circuit board 200 deteriorates, increasing their resistance, which may cause signal attenuation. Simultaneously, the signal lines become more brittle at low temperatures, affecting their mechanical properties and durability. In high-humidity environments, moisture can degrade the insulation performance of the signal transmission lines and enter their interior, causing changes in their dielectric constant and even corrosion, impacting their signal transmission function.

[0050] The display temperature control circuit 100 in the embodiment of the present invention is configured with a heating module 20 and a shunt module 30 connected in parallel. The detection module 40 detects the temperature of the heating module 20, and the controller 50 controls the connection or disconnection of the shunt module 30 according to the temperature detected by the detection module 40. In a low temperature or high humidity environment, the heating module 20 can heat and bake the circuit board 200 so that the circuit board 200 can operate normally and avoid signal distortion. At the same time, the display temperature control circuit 100 can control the temperature of the heating module 20 to be within a preset range by connecting or disconnecting the shunt module 30, thereby avoiding the temperature of the heating module 20 being too high and continuously providing a suitable working environment for the circuit board 200.

[0051] In one embodiment, Figure 1 As shown, the temperature control circuit 100 also includes a second power supply 60, the detection module 40 is electrically connected to the second power supply 60, the detection module 40 includes a thermistor R1, and the controller 50 is electrically connected to the thermistor R1 and the shunt module 30. The controller 50 is used to control the connection or disconnection of the shunt module 30 according to the voltage of the thermistor R1.

[0052] The second power supply 60 is used to supply power to the detection module 40 and the controller 50. Optionally, the type of the second power supply 60 can refer to the first power supply 10 described above, and will not be described in detail.

[0053] Thermistor R1 is used to change its resistance value according to the temperature of the heating module 20. In this application, it is used as a temperature sensor to reflect the temperature changes of the heating module 20. Thermistor R1 has high sensitivity, a wide operating range, and a small size. It can change its resistance value significantly and sensitively with temperature changes. Optionally, thermistor R1 can be a metal oxide thermistor, a ceramic thermistor, a semiconductor thermistor, an organic thermistor, etc., without specific limitation.

[0054] Optionally, the resistance of thermistor R1 may increase with increasing temperature (i.e., a positive temperature coefficient of resistance thermistor) or decrease with increasing temperature (i.e., a negative temperature coefficient of resistance thermistor), without limitation. In the embodiment of the present invention, a negative temperature coefficient of resistance thermistor is used, which will not be described in detail below.

[0055] Optionally, thermistor R1 is disposed within heating module 20, or thermistor R1 at least partially overlaps heating module 20. Thermistor R1 senses temperature changes in heating module 20 and changes its resistance, converting this resistance change into a change in voltage across thermistor R1. Upon receiving the voltage change signal from thermistor R1, controller 50 converts the voltage value into the corresponding temperature of heating module 20 and controls the connection or disconnection of shunt module 30 based on the temperature.

[0056] By setting up a second power supply 60 and a thermistor R1, the controller 50 determines the temperature of the heating module 20 through the voltage of the thermistor R1, and controls the connection or disconnection of the shunt module 30 according to the obtained temperature. It can detect the temperature of the heating module 20 in real time and make corresponding adjustments in time, and can continuously provide a suitable working environment for the circuit board 200, indicating that the control logic of the temperature control circuit 100 is simple and efficient.

[0057] In one embodiment, Figure 1 As shown, the detection module 40 also includes a first resistor R2 and a second resistor R3. The thermistor R1 is set in parallel with the first resistor R2 and then in series with the second resistor R3. The controller 50 is connected to the end of the thermistor R1 and the first resistor R2 that are connected in parallel and away from the second resistor R3.

[0058] The first resistor R2 and the second resistor R3 can be any feasible electronic component with resistance in the art, without specific limitation. Optionally, the first resistor R2 and the second resistor R3 can be wire-wound resistors, metal film resistors, etc., or other components that can be equivalent to resistors. Since the total resistance value in the parallel circuit will be less than the resistance value of any single resistor, after the thermistor R1 and the first resistor R2 are set in parallel, the combination of the thermistor R1 and the first resistor R2 in parallel will be more sensitive to temperature changes, which can make the thermistor R1 more sensitive to temperature changes in the heating module 20; when the resistance of the thermistor R1 changes with temperature and becomes too small, the resistance of the thermistor R1 after being connected in parallel with the first resistor R2 will be even smaller, and it is easy to be damaged when the current is too large, and the second resistor R3 is set in series with the thermistor R1 and the first resistor R2 after being connected in parallel, and the second resistor R3 can play a role in protecting the circuit.

[0059] In addition, since the thermistor R1 is a nonlinear element, in order to more conveniently measure temperature, the thermistor R1 can be linearized by using a series-parallel resistor method. That is, in the embodiment of the present invention, the thermistor R1 is connected in parallel with the first resistor R2 and then in series with the second resistor R3. This allows the total resistance of the thermistor R1 circuit to exhibit an approximately linear relationship with temperature within a certain range, making temperature measurement simple and effective.

[0060] Optionally, in the thermistor circuit (i.e., a circuit in which the thermistor R1 is connected in parallel with the first resistor R2 and then in series with the second resistor R3), the second resistor R3 is grounded away from the end in which the thermistor R1 and the first resistor R2 are connected in parallel. Then, the resistance change of the thermistor R1 circuit will be reflected at the front end of the thermistor R1 circuit (i.e., the end in which the thermistor R1 and the first resistor R2 are connected in parallel and away from the second resistor R3). The controller 50 can reflect the resistance change of the thermistor R1 circuit by detecting the front end voltage of the thermistor R1 circuit, thereby reflecting the temperature change of the heating module 20. The detection method is simple and efficient.

[0061] Optionally, the specific corresponding values of the front-end voltage value and the temperature of the thermistor circuit can be calculated based on actual conditions and measurements, and there is no specific limitation.

[0062] In one embodiment, Figure 1 As shown, the shunt module 30 includes multiple shunt units 31, which are arranged in parallel. Each shunt unit 31 includes a shunt resistor R4 and a switch SW arranged in series. The controller 50 is electrically connected to the multiple switches SW and is used to control the switch SW to be opened or closed.

[0063] Optionally, multiple shunt units 31 are arranged in parallel, and multiple shunt units 31 are all arranged in parallel with the heating module 20. The shunt resistor R4 can be any feasible resistor or component with a certain resistance value in the field, without limitation. The switch SW is used to control the connection or disconnection of the shunt resistor R4. When the switch SW is disconnected, the shunt resistor R4 is disconnected. When the switch SW is closed, the shunt resistor R4 is connected. Part of the current of the first power supply 10 flows through the shunt resistor R4, and not all flows through the heating module 20. The heating module 20 can be shunted to avoid excessive heating of the heating module 20.

[0064] When the temperature of the heating module 20 is lower than the preset range, the switches SW of the multiple shunt units 31 are all disconnected, and all the current of the first power supply 10 passes through the heating module 20, so that the heating module 20 is quickly heated and the temperature of the circuit board 200 is increased; when the temperature of the heating module 20 is within the preset range, the controller 50 controls the switches SW of the multiple shunt units 31 to be connected or disconnected according to the temperature of the heating module 20 detected by the detection module 40, so that the temperature of the heating module 20 is continuously within the preset range; when the temperature of the heating module 20 is higher than the preset range, the switches SW of the multiple shunt units 31 are all connected, that is, the overall current of the shunt module 30 is at the maximum value, which can maximize the sharing of the current of the first power supply 10 flowing through the heating module 20, so as to quickly reduce the heat generated by the heating module 20, reduce the temperature of the heating module 20 and return to the preset range, thereby avoiding damage to the circuit board 20 caused by excessive temperature of the heating module 20.

[0065] By setting the shunt module 30 to include multiple shunt units 31 arranged in parallel, the controller 50 controls the switches SW of the multiple shunt units 31 to open or close, so as to control the temperature of the heating module 20 to remain within a preset range, ensuring the normal operation of the circuit board 200, and the control logic is simple and efficient.

[0066] The present invention also provides a display temperature control method, please refer to Figure 2 , the display temperature control circuit 100 used in the embodiment of the present invention includes:

[0067] Step S10, the detection module 40 detects the temperature of the heating module 20;

[0068] In step S20 , the controller 50 controls the shunt module 30 to shunt the current output by the first power supply according to the temperature detected by the detection module 40 , thereby controlling the current flowing through the heating module 20 to keep the temperature of the heating module 20 within a preset range.

[0069] The display temperature control method in the embodiment of the present invention is to set a detection module 40 to detect the temperature of the heating module 20, and the controller 50 controls the connection or disconnection of the shunt module 30 according to the temperature of the heating module 20 detected by the detection module 40. In a low temperature or high humidity environment, the heating module 20 can heat and bake the circuit board 200 so that the circuit board 200 can work normally and avoid signal distortion; at the same time, the display temperature control circuit 100 can control the temperature of the heating module 20 to be within a preset range by connecting or disconnecting the shunt module 30, thereby avoiding the temperature of the heating module 20 being too high and continuously providing a suitable working environment for the circuit board 200.

[0070] In one embodiment, the shunt module 30 includes a plurality of shunt units 31 connected in parallel, each shunt unit 31 including a shunt resistor R4 and a switch SW connected in series. Step S20 further includes:

[0071] When the temperature of the heating module 20 is lower than the first preset value, the switches SW of all the shunt units 31 are disconnected;

[0072] When the temperature of the heating module 20 is higher than the first preset value and lower than the second preset value, the switches SW of at least some of the shunt units 31 are closed, and the number of closed switches SW of the plurality of shunt units 31 increases as the ambient temperature rises, and the second preset value is greater than the first preset value;

[0073] When the temperature of the heating module 20 is higher than the second preset value, the switches SW of all the shunt units 31 are closed.

[0074] Optionally, in the embodiment of the present invention, the preset range of the temperature of the heating module 20 can be a range from a first preset value to a second preset value, or can be a partial range between the first preset value and the second preset value, without limitation. When the temperature of the heating module 20 is lower than the first preset value, the switches SW of the plurality of shunt units 31 are all disconnected, and all the current of the first power supply 10 passes through the heating module 20, so that the heating module 20 is rapidly heated and the temperature of the circuit board 200 is increased. When the temperature of the heating module 20 is between the first preset value and the second preset value, the controller 50 controls the switches SW of the plurality of shunt units 31 to be connected or disconnected according to the temperature of the heating module 20 detected by the detection module 40, so that the temperature of the heating module 20 remains within the preset range. When the temperature of the heating module 20 is higher than the second preset value, the switches SW of the plurality of shunt units 31 are all connected, i.e., the overall current of the shunt modules 30 is at its maximum value, which can maximize the sharing of the current flowing through the heating module 20 from the first power supply 10, thereby quickly reducing the heat generated by the heating module 20, lowering the temperature of the heating module 20 back to the preset range, and preventing the excessive temperature of the heating module 20 from damaging the circuit board.

[0075] The display temperature control method can adjust the number of connections of the shunt unit 31 in real time according to the temperature detected by the detection module 40, and can continuously provide a suitable working environment for the circuit board 200. The control logic is simple and efficient.

[0076] In one embodiment, there are four diversion units 31, and the temperature of the heating module 20 includes four preset values T1, T2, T3 and T4 that increase in sequence;

[0077] When the temperature of the heating module 20 is less than or equal to T1, the switches SW of the four shunt units 31 are all disconnected;

[0078] When the temperature of the heating module 20 is greater than T1 and less than or equal to T2, the switch SW of one shunt unit 31 is closed, and the switches SW of the other three shunt units 31 are opened;

[0079] When the temperature of the heating module 20 is greater than T2 and less than or equal to T3, the switches SW of two shunt units 31 are closed, and the switches SW of the other two shunt units 31 are opened;

[0080] When the temperature of the heating module 20 is greater than T3 and less than or equal to T4, the switches SW of three shunt units 31 are closed, and the switch SW of the remaining shunt unit 31 is opened;

[0081] When the temperature of the heating module 20 is greater than T4, the switches SW of the four diversion units 31 are all closed.

[0082] Optionally, T1 is a first preset value and T4 is a second preset value.

[0083] In a specific embodiment, the temperature preset values T1, T2, T3 and T4 of the heating module 20 and their corresponding voltage values and the number of conduction of the switch SW are as follows, and the specific working process of the display temperature control method is as follows:

[0084] T1 is 40°C, and the front-end voltage of the thermistor R1 circuit corresponding to T1 is 2V. When the temperature of the heating module 20 is less than or equal to 40°C, the switches SW of all the shunt units 31 are in the off state, and the current output by the first power supply 10 all passes through the heating module 20, and the temperature of the heating module 20 begins to rise.

[0085] T2 is 50°C, and the front-end voltage of the thermistor R1 circuit corresponding to T2 is 1.9V; when the temperature of the heating module 20 rises to between T1 and T2, the switch SW of one shunt unit 31 is closed, and the switches SW of the other three shunt units 31 are disconnected. Part of the current flows to the ground through the conductive shunt unit 31, the current passing through the heating module 20 is reduced, and the temperature rise rate of the heating module 20 is reduced.

[0086] T3 is 60°C, and the front-end voltage of the thermistor R1 circuit corresponding to T2 is 1.8V; when the temperature of the heating module 20 rises to between T2 and T3, the switches SW of two shunt units 31 are closed, and the switches SW of the other two shunt units 31 are disconnected, the current passing through the heating module 20 is further reduced, and the temperature rise rate of the heating module 20 is further reduced.

[0087] T4 is 70°C, and the front-end voltage of the thermistor R1 circuit corresponding to T4 is 1.7V; when the temperature of the heating module 20 rises to between T3 and T4, the switches SW of the three shunt units 31 are closed, and the switch SW of the remaining shunt unit 31 is disconnected, and the current passing through the heating module 20 is further reduced. At this time, the heat generated by the heating module 20 will be lower than the heat dissipation of the circuit board 200 itself, and the circuit board 200 begins to cool down to avoid the temperature of the heating area being too high, which affects the normal operation of the circuit board 200.

[0088] When the temperature of the heating module 20 rises to greater than 70° C., the switches SW of the four shunt units 31 are all closed, and the current passing through the heating module 20 is reduced to a minimum, so as to quickly reduce the temperature of the heating module 20 .

[0089] Optionally, the preset temperature range of the heating module 20 may be 55°C to 65°C. By controlling the temperature of the heating module 20 using the display temperature control method according to the embodiment of the present invention, the signal transmission lines on the circuit board 200 can be baked in a low-temperature or high-humidity environment to ensure that the dielectric constant of the signal transmission lines does not change. At the same time, the operating environment temperature of the circuit board 200 is prevented from being too high, thereby continuously providing a suitable operating environment for the circuit board 200.

[0090] Please refer to Figure 3 An embodiment of the present invention further provides a display device 1000 , including a circuit board 200 and a display temperature control circuit 100 in an embodiment of the present invention, wherein a heating module 20 is disposed on the circuit board 200 .

[0091] Optionally, the display device 1000 further includes a display panel 300, a circuit main board, a circuit board 200, a timing controller 50 (Timing Control, referred to as TCON), etc. The display panel 300 is provided with a gate drive circuit and a source drive circuit, and the circuit main board is provided with a system-on-chip (System On Chip, referred to as SOC). The circuit board 200 assumes the functions of transmitting, distributing and controlling electrical signals through components such as signal transmission lines provided thereon. Optionally, the circuit board 200 includes a horizontal circuit board (X-Board, referred to as XB board) and a vertical circuit board (Y-Board, referred to as YB board). The circuit main board and the circuit board 200 are usually connected by a flexible flat cable (Flexible Flat Cable, referred to as FFC) to transmit signals between the two.

[0092] Optionally, the circuit board 200 includes a horizontal circuit board. The horizontal circuit board is typically disposed on one side of the display panel 300 in the longitudinal direction and is electrically connected to the source driver circuit on the display panel 300 via the source driver 400. When the display device 1000 is in operation, the system-on-chip receives and outputs image data signals to be transmitted. The input signal is then processed by the row expansion module and the column expansion module, and the processed data is transmitted to the timing controller. The timing controller transmits the received data via the horizontal circuit board to the source driver circuit and gate driver circuit of the display panel 300, thereby driving the display panel 300 for display.

[0093] Optionally, the heating module 20 in the display temperature control circuit 100 is disposed on a circuit board 200. The circuit board 200 can be a single, independent circuit board or a plurality of circuit boards arranged in parallel, i.e., the circuit board 200 includes multiple circuit boards arranged in parallel with spaces between the multiple circuit boards. If the circuit boards are multiple circuit boards arranged in parallel, the driver circuit board assembly can be disposed on any of the circuit boards, and each adjacent two circuit boards in the multiple circuit boards are electrically connected via respective connectors.

[0094] The display device 1000 in the embodiment of the present invention adopts the display temperature control circuit 100 in the embodiment of the present invention. The heating module 20 of the display temperature control circuit 100 is set on the circuit board 200. The signal transmission line on the circuit board 200 can be baked in a low temperature or high humidity environment to ensure that the dielectric constant of the signal transmission line does not change. At the same time, the overall operating temperature of the circuit board 200 and even the display device 1000 can be increased to meet the normal operation of the display device 1000 in a low temperature environment.

[0095] Optionally, the heating module 20 and the circuit board 200 may be connected by welding, bonding, clamping, screwing, etc., which is not specifically limited.

[0096] Optionally, the heating module 20 is disposed on the circuit board 200, while the remaining components of the display temperature control circuit 100, such as the first power supply 10, the shunt module 30, the detection module 40, and the controller 50, are externally disposed on the circuit board 200. With this configuration, the heating module 20 has a larger heating area, and the space occupied by the remaining components of the display temperature control circuit 100 on the circuit board 200 is reduced, effectively increasing the operating temperature of the circuit board 200 or baking the signal transmission lines to prevent changes in the dielectric constant due to moisture intrusion into the signal transmission lines, which could lead to signal transmission distortion.

[0097] Alternatively, in one embodiment, the first power supply 10, the current shunting module 30, the detection module 40 and the controller 50 are all disposed on the circuit board 200. The display temperature control device has a high degree of integration, which facilitates the assembly of the circuit board 200 and other devices.

[0098] Please refer to Figure 4 and Figure 5 , the circuit board 200 includes a plurality of functional layers stacked together.

[0099] Optionally, the multiple functional layers include a device layer 201, a power layer 202 (Power layer), a ground layer 203 (GND layer), a signal transmission layer 204, etc. The device layer 201 is used to place electronic components and devices of the circuit board 200. The power layer 202 is mainly responsible for providing power and is a key part of the power distribution and return path in the circuit board 200. The ground layer 203 and the signal transmission layer 204 are used for routing ground lines and signal transmission lines, among which the signal transmission layer 204 is used to transmit point-to-point (P2P) high-speed signals and timing signals, etc.

[0100] In one embodiment, please refer to Figure 4 , the heating module 20 is arranged in the functional layer. Optionally, the circuit board 200 includes four functional layers stacked in the X direction, and the four functional layers are the device layer 201, the power layer 202, the ground layer 203 and the signal transmission layer 204 from top to bottom in the X direction. Since the signal transmission line of the signal transmission layer 204 is easily affected by low temperature or high humidity environment, the signal transmission layer 204 is mainly baked to ensure the normal working temperature of the signal transmission line. Therefore, the heating module 20 is arranged in the ground layer 203, and overlaps with the signal transmission area of the signal transmission layer 204 in the orthographic projection in the X direction. With such a configuration, the heating module 20 can bake the signal transmission line to avoid changes in the dielectric constant of the signal transmission line due to the entry of water vapor, which ultimately leads to signal distortion; at the same time, the overall operating temperature of the circuit board 200 is increased to meet the normal operation of the circuit board 200 in a low temperature environment.

[0101] Alternatively, in another embodiment, please refer to Figure 5 , the heating module 20 is stacked with the functional layer. Optionally, the circuit board 200 includes six functional layers stacked in the X direction. In addition to the device layer 201, the power layer 202, the ground layer 203 and the signal transmission layer 204 stacked in sequence from bottom to top in the X direction, the heating module 20 is arranged as the fifth functional layer on the surface of the signal transmission layer 204 facing away from the ground layer 203 in the X direction to heat the entire signal transmission layer 204, covering a wider heating area and achieving higher efficiency. At the same time, a ground layer 203 is stacked on the surface of the heating module 20 facing away from the signal transmission layer 204 as the sixth functional layer, thereby achieving a better electrical shielding effect of the circuit board 200.

[0102] Alternatively, the heating module 20 and the functional layer may also be arranged in any other feasible manner without limitation.

[0103] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship of terms such as "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", and "outside" are based on the orientation or positional relationship described in the accompanying drawings. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present application.

[0104] The above disclosure is only a preferred embodiment of the present application, and certainly cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made in accordance with the claims of the present application are still within the scope covered by the present application.

Claims

1. A display temperature control circuit, characterized in that: include: a first power source; a heating module, electrically connected to the first power supply, and configured to increase the temperature of the circuit board; A shunt module, electrically connected to the first power source and arranged in parallel with the heating module; A detection module, used to detect the temperature of the heating module; A controller is electrically connected to the detection module and the shunt module, and is used to control the shunt module to be connected or disconnected according to the temperature detected by the detection module, so that the temperature of the heating module is within a preset range.

2. The display temperature control circuit according to claim 1, characterized in that: The display temperature control circuit also includes a second power supply, the detection module is electrically connected to the second power supply, the detection module includes a thermistor, the controller is electrically connected to the thermistor and the shunt module, and the controller is used to control the shunt module to be connected or disconnected according to the voltage of the thermistor.

3. The display temperature control circuit according to claim 2, characterized in that: The detection module further includes a first resistor and a second resistor. The thermistor is connected in parallel with the first resistor and then in series with the second resistor. The controller is connected to an end of the thermistor that is connected in parallel with the first resistor and is away from the second resistor.

4. The display temperature control circuit according to claim 2, characterized in that: The shunt module includes multiple shunt units, which are arranged in parallel. Each of the shunt units includes a shunt resistor and a switch arranged in series. The controller is electrically connected to the multiple switches and is used to control the switches to be opened or closed.

5. A display temperature control method, characterized in that: The display temperature control circuit according to any one of claims 1 to 4 comprises: The detection module detects the temperature of the heating module; The controller controls the shunt module to shunt the current output by the first power supply according to the temperature detected by the detection module, thereby controlling the magnitude of the current flowing through the heating module so that the temperature of the heating module is within a preset range.

6. The display temperature control method according to claim 5, characterized in that: The shunt module includes a plurality of shunt units connected in parallel, each of which includes a shunt resistor and a switch connected in series. The controller is electrically connected to the plurality of switches and is used to control the switches to be opened or closed. When the temperature of the heating module is lower than a first preset value, the switches of all the diversion units are turned off; When the temperature of the heating module is higher than the first preset value and lower than a second preset value, the switches of at least some of the diversion units are closed, and the number of closed switches of the plurality of diversion units increases as the ambient temperature rises, and the second preset value is greater than the first preset value; When the temperature of the heating module is higher than a second preset value, the switches of all the diversion units are closed.

7. The display temperature control method according to claim 6, characterized in that: There are four diversion units, and the temperature of the heating module includes four preset values T1, T2, T3 and T4 that increase in sequence; When the temperature of the heating module is less than or equal to T1, the switches of the four diversion units are all disconnected; When the temperature of the heating module is greater than T1 and less than or equal to T2, the switch of one of the diversion units is closed, and the switches of the other three diversion units are opened; When the temperature of the heating module is greater than T2 and less than or equal to T3, the switches of two of the shunt units are closed, and the switches of the other two shunt units are opened; When the temperature of the heating module is greater than T3 and less than or equal to T4, the switches of three of the shunt units are closed, and the switch of the remaining shunt unit is opened; When the temperature of the heating module is greater than T4, the switches of the four diversion units are all closed.

8. A display device, characterized in that: It comprises a circuit board and the display temperature control circuit according to any one of claims 1 to 4, wherein the heating module is arranged on the circuit board.

9. The display device according to claim 8, wherein The first power supply, the shunt module, the detection module and the controller are all arranged on the circuit board.

10. The display device according to claim 8, wherein The circuit board includes a plurality of functional layers stacked in layers; The heating module is arranged on the functional layer, or the heating module and the functional layer are stacked.

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