Display module and display device

Abstract

The invention provides a display module and a display device, the display module comprises a first area and a second area, and the first area at least partially surrounds the second area. The display module further comprises a display panel, a cover plate and a heat dissipation structure. The cover plate comprises a bent part located in the first area, and the bent part is bent towards the side where the display panel is located in the direction away from the second area. The heat dissipation structure is located on the side, away from the cover plate, of the display panel and comprises a first part and a second part, the first part is overlapped with the bent part in the direction perpendicular to the plane where the display panel is located, and the second part is located in the second area. Wherein the first part is provided with an opening. Under the action of the opening, the structural rigidity of the first part is relatively weakened, so that when the heat dissipation structure is arranged, the first part can be attached to the bent part along with the shape. According to the arrangement mode, the rigidity of the first part can be reduced, the risk of a gap between the heat dissipation structure and a structure attached to the heat dissipation structure is reduced, and then the die mark problem is solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] In existing display modules, a heat dissipation film (such as copper foil) is typically applied to the side of the display panel away from the cover plate. However, with the increasing popularity of curved screen designs, the cover plate often features a curved design near the edge. Consequently, the portion of the display panel corresponding to the curved cover plate is susceptible to bending during lamination.

[0003] However, since the heat dissipation film usually contains metal materials with good thermal conductivity, that is, the heat dissipation film often has a certain rigidity, when the heat dissipation film is laid on the side of the display panel away from the cover plate, the part of the heat dissipation film corresponding to the bent part of the cover plate is prone to loose fit, thereby causing mold printing problems. Summary of the Invention

[0004] In view of this, the present application provides a display module and a display device to solve the above-mentioned mold printing problem.

[0005] In a first aspect, the present application provides a display module, comprising a first area and a second area, wherein the first area at least partially surrounds the second area.

[0006] The display module also includes a display panel, a cover plate, and a heat dissipation structure. The cover plate includes a bent portion located in a first region, which bends toward the display panel, away from the second region. The heat dissipation structure is located on the side of the display panel away from the cover plate. It consists of a first portion and a second portion. The first portion overlaps the bent portion, perpendicular to the plane of the display panel, and the second portion is located in the second region. The first portion has an opening.

[0007] In a second aspect, the present application provides a display device, comprising the display module provided in the first aspect.

[0008] Under the action of the opening, the structural rigidity of the first part is relatively weakened. Then, when the heat dissipation structure is set, the first part can be better fitted to the part of the structure (which can refer to the display panel, or the membrane structure located on the side of the display panel away from the cover plate) located in the first area, that is, the first part can be attached to the bent part in a conformal manner. Therefore, the setting method of the present application helps to reduce the rigidity of the first part, reduce the risk of gaps between the heat dissipation structure and the structure to which it is attached, and thus improve the mold printing problem. In addition, when the heat dissipation structure absorbs the heat generated by the display module when it is working, based on the thermal expansion phenomenon, the heat dissipation structure itself is prone to slight thermal expansion. The setting of the opening can give the first part of the heat dissipation structure sufficient expansion space, reducing the degree to which the first part expands toward the edge of the display module when heated. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0010] Figure 1 A schematic diagram of a partial structure of a display module related to the present application; Figure 2 A schematic top view of a partial structure of a display module provided in this application; Figure 3 for Figure 2 The display module shown along the section line AA 'sectional schematic diagram; Figure 4 A schematic top view of a partial structure of a display module provided in this application; Figure 5 for Figure 4 A schematic cross-sectional view of the display module shown along section line BB'; Figure 6 for Figure 2 Another cross-sectional view of the display module along section line AA' is shown; Figure 7 for Figure 2 Another cross-sectional view of the display module along section line AA' is shown; Figure 8 for Figure 2 Another cross-sectional view of the display module along section line AA' is shown; Figure 9 for Figure 2 Another cross-sectional view of the display module along section line AA' is shown; Figure 10 for Figure 2 Another cross-sectional view of the display module along section line AA' is shown; Figure 11 for Figure 2 Another cross-sectional view of the display module along section line AA' is shown; Figure 12 for Figure 2 Another cross-sectional view of the display module along section line AA' is shown; Figure 13 A schematic diagram of a display device provided in this application. DETAILED DESCRIPTION

[0011] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0012] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0013] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0014] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0015] Figure 1 This is a schematic diagram of a partial structure of a display module related to the present application.

[0016] Conventional display modules 10' typically include a cover plate 01', a display panel 02', and a heat dissipation film 03'. In a curved screen design, a curved portion 011' on the cover plate 01' near the edge of the display module 10' can bend toward the display panel 02'. To ensure proper adhesion between the display panel 02' and the cover plate 01', the portion of the display panel 02' corresponding to the curved portion 011' also bends, which in turn causes the portion of the heat dissipation film 03' near the edge of the display module 10' to also bend.

[0017] It should be noted that in order to improve heat dissipation performance, the heat dissipation film 03' usually contains metal components, that is, the heat dissipation film 03' often has a certain degree of rigidity. Therefore, when the heat dissipation film 03' is laid on the side of the display panel 02' away from the cover plate 01', the rigidity of the heat dissipation film 03' can easily lead to poor adhesion of the heat dissipation film 03' to the edge area of the display module 10' (for example, the following may occur: Figure 1 As a result, a molding problem occurs in the above-mentioned edge area, resulting in a poor display effect.

[0018] Figure 2 This is a schematic top view of a partial structure of a display module provided in this application. Figure 3 for Figure 2 The display module is shown as a cross-sectional view along the section line AA'.

[0019] In order to solve the above problems, the present application provides a display module 10, such as Figure 2 As shown, the display module 10 includes a first area 101 and a second area 102, where the first area 101 at least partially surrounds the second area 102. Relative to the second area 102, the first area 101 may be closer to the edge of the display module 10. In a curved screen design, the first area 101 may correspond to a curved portion of the display module 10.

[0020] Combine Figure 2 and Figure 3 The display module 10 further includes a display panel 01, a cover plate 02, and a heat dissipation structure 03. The cover plate 02 includes a bent portion 021 located in the first region 101. This bent portion 021 bends toward the display panel 01, moving away from the second region 102. Therefore, the portion of the film layer (including the display panel 01) located on the side of the cover plate 02 facing the display panel 01, corresponding to the bent portion 021, can also bend.

[0021] The heat dissipation structure 03 may be made of metal. For example, the heat dissipation structure 03 may include copper foil. In this case, compared with some film structures in the display module 10, the heat dissipation structure 03 has stronger rigidity.

[0022] The heat dissipation structure 03 is located on the side of the display panel 01 away from the cover plate 02. Considering that the portion of the display panel 01 corresponding to the bent portion 021 can be bent, the portion of the heat dissipation structure 03 corresponding to the bent portion 021 can also be bent.

[0023] The heat dissipation structure 03 includes a first portion 031 and a second portion 032. In a direction perpendicular to the plane of the display panel 01, the first portion 031 overlaps the bent portion 021. Thus, the first portion 031 can be located in the first region 101, and the second portion 032 can be located in the second region 102. It should be noted that the first portion 031 can be bent.

[0024] The first portion 031 is provided with an opening 310. This opening 310 reduces the structural rigidity of the first portion 031. Therefore, when the heat dissipation structure 03 is installed, the first portion 031 can be well adhered to the portion of the structure (which can refer to the display panel 01 or the film structure located on the side of the display panel 01 away from the cover plate 02) located in the first region 101. In other words, the first portion 031 can be conformally attached to the bent portion. Therefore, the arrangement of this embodiment helps reduce the rigidity of the first portion 031, reducing the risk of gaps between the heat dissipation structure 03 and the structure to which it is attached, thereby improving mold printing issues.

[0025] In addition, when the heat dissipation structure 03 absorbs the heat generated by the display module 10 during operation, the heat dissipation structure 03 itself is prone to slight thermal expansion due to the thermal expansion phenomenon. The setting of the opening 310 can provide the first portion 031 of the heat dissipation structure 03 with sufficient expansion space, thereby reducing the degree of expansion of the first portion 031 toward the edge of the display module 10 when heated.

[0026] Figure 4 This is a schematic top view of a partial structure of a display module provided in this application. Figure 5 for Figure 4 The display module is shown as a cross-sectional view along the section line BB'.

[0027] In addition, combined Figure 4 and Figure 5 The display module 10 may further include a flexible circuit board 04 . The flexible circuit board 04 may overlap with the binding area 103 . At least a portion of the flexible circuit board 04 may be located on a side of the heat dissipation structure 03 away from the cover plate 02 .

[0028] In one embodiment of the present application, Figure 3 As shown, the opening 310 is located on the side of the first portion 031 close to the display panel 01. It should be noted that the depth of the opening 310 can be less than the thickness of the heat dissipation structure 03, that is, the opening 310 does not penetrate the heat dissipation structure 03. The side of the first portion 031 away from the cover plate 02 is flatter than the side of the first portion 031 close to the cover plate 02. Therefore, the arrangement of this embodiment helps to ensure good flatness on the side of the first portion 031 away from the cover plate 02 while reducing the rigidity of the first portion 031. This prevents gaps between the portion of the heat dissipation structure 03 located on the side away from the cover plate 02 and the heat dissipation structure 03, further reducing the risk of mold printing problems.

[0029] In one embodiment of the present application, Figure 3 As shown, the widths of any two openings 310 are the same. The configuration of this embodiment helps to reduce the difficulty of preparing the openings 310 while reducing the rigidity of the first portion 031 .

[0030] Figure 6 for Figure 2 FIG. 1 is another cross-sectional view of the display module along section line AA′.

[0031] In one embodiment of the present application, Figure 6 As shown, the width of the opening 310 increases in a direction away from the second region 102 .

[0032] In this embodiment, the greater the width of the opening 310, the weaker the rigidity of the portion of the first portion 031 corresponding to the opening 310, and the correspondingly greater the ductility. Considering that the farther away from the second area 102, the greater the angle of inclination of the cover plate 02 relative to the plane of the display panel 01 can be, the arrangement of this embodiment helps further improve the fit of the first portion 031, minimize the risk of gaps in the fit, and improve mold printing issues.

[0033] In one embodiment of the present application, combining 3 and Figure 6 The arrangement of the present embodiment helps to reduce the difficulty of manufacturing the heat dissipation structure 03 while reducing the rigidity of the first portion 031 .

[0034] Figure 7 for Figure 2 FIG. 1 is another cross-sectional view of the display module along section line AA′.

[0035] In one embodiment of the present application, Figure 7 As shown, the spacing between two adjacent openings 310 decreases as they move away from the second region 102. Within a unit area, the density of the distribution of openings 310 can affect the rigidity of the first portion 031 within that range. For example, the denser the distribution of openings 310 within a certain range, the weaker the rigidity of the first portion 031 within that range. Therefore, in this embodiment, by reducing the spacing between adjacent openings 310 as they approach the edge, the closer to the edge of the display module 10, the denser the distribution of openings 310. That is, the rigidity of the first portion 031 can be weakened as it moves away from the second region 102, helping to minimize the risk of gaps forming in the first portion 031.

[0036] In one embodiment of the present application, Figure 3 As shown, the width w of the opening 310 satisfies: w ≤ 0.2 mm. In this embodiment, since the width of the first portion 031 is limited, the width of the opening 310 determines the number of openings 310 that can be set. That is, when setting the distribution density of the openings 310 on the first portion 031, the width of the opening 310 needs to be considered to ensure that the overall rigidity of the first portion 031 can adapt to a gap-free arrangement. When w ≤ 0.2 mm, the rigidity of the first portion 031 corresponding to the distribution density of the openings 310 can achieve gap-free bonding between the first portion 031 and a portion of the structure (e.g., the display panel 01).

[0037] In one embodiment of the present application, Figure 3 As shown, the spacing Δw between adjacent openings 310 satisfies: Δw≤0.1 mm.

[0038] In the embodiment of the present application, in addition to the width of the openings 310, the spacing between adjacent openings 310 can also affect the distribution density of the openings 310. The smaller the spacing between adjacent openings 310, the greater the distribution density of the openings 310 on the first portion 031. Therefore, in the configuration of this embodiment, the distribution density of the openings 310 can be further adjusted in combination with the width of the openings 310, so that the rigidity of the first portion 031 is more consistent with the requirements for seamless lamination, effectively improving the mold printing problem.

[0039] Figure 8 for Figure 2 FIG. 1 is another cross-sectional view of the display module along section line AA′.

[0040] In one embodiment of the present application, Figure 8 As shown, the thickness H1 of the first portion 031 is smaller than the thickness H2 of the second portion 032 . Compared with the second portion 032 , the film structure corresponding to the first portion 031 is thinner, that is, the structure corresponding to the first portion 031 has stronger ductility.

[0041] In the embodiment of the present application, the design of H1<H2 helps to make the structural ductility corresponding to the first part 031 at a stronger level. When the heat dissipation structure 03 needs to bend, the structural ductility of the first part 031 can make it easier to bend, which helps the first part 031 to achieve a seamless fitting effect and avoid structural damage to the first part 031 due to bending.

[0042] Figure 9 for Figure 2 FIG. 1 is another cross-sectional view of the display module along section line AA′.

[0043] In one embodiment of the present application, Figure 9 As shown, the first portion 031 further includes a spacer 311, which can be considered as a portion of the first portion 031 located between adjacent openings 310. In a direction perpendicular to the plane where the display panel 01 is located, the spacer 311 does not overlap with the opening 310.

[0044] The thickness of the spacer 311 is h1, the depth of the opening 310 is h2, and h2≤0.5 In addition to the width of the opening 310, the depth of the opening 310 can also affect the effect of the opening 310 on the ductility of the first portion 031. For example, the greater the depth of the opening 310, the greater the ductility of the portion of the first portion 031 corresponding to the opening 310 (which may be referred to as the connecting portion B in the figure), and the easier it is for this portion to adhere to the bent structure (for example, the portion of the display panel 01 corresponding to the bent portion 021).

[0045] It should be noted that the depth of the opening 310 can also affect the connection strength between adjacent spacers 311. For example, the deeper the opening 310, the thinner the portion of the first portion 031 corresponding to the opening 310 (referred to as the connection portion B in the figure). The thinner the thickness of the connection between two spacers 311 adjacent to the opening 310, the weaker the connection strength of the connection portion B on the first portion 031. Therefore, if the opening 310 is too deep when the first portion 031 is bent, the first portion 031 may easily break at the connection portion B.

[0046] In the embodiment of the present application, h2≤0.5 The configuration of h1 helps to maximize the ductility of the opening 310 on the first portion 031 while ensuring that the depth of the opening 310 is unlikely to reach a large value, thereby preventing the first portion 031 from breaking during the bending process.

[0047] Figure 10 for Figure 2 FIG. 1 is another cross-sectional view of the display module along section line AA′.

[0048] In one embodiment of the present application, Figure 9 As shown, the depth of the opening 310 increases in a direction away from the second region 102 .

[0049] In the embodiment of the present application, it is known that the greater the depth of the opening 310, the greater the ductility of the portion of the first portion 031 corresponding to the opening 310 (which may be referred to as the connecting portion B in the figure). Therefore, in this embodiment, by increasing the depth of the opening 310 toward the edge of the display module 10, the ductility of the first portion 031 is gradually enhanced along the edge of the display module 10. This arrangement facilitates the ductility of the first portion 031 to adapt to changes in the tilt of the cover plate 02, and helps achieve a seamless fitting arrangement of the first portion 031.

[0050] Figure 11 for Figure 2 FIG. 1 is another cross-sectional view of the display module along section line AA′.

[0051] In one possible implementation, Figure 11As shown, the plurality of openings 310 on the first portion 031 include a first opening 3101, a second opening 3102, and a third opening 3103. The first opening 3101, the second opening 3102, and the third opening 3103 are adjacent in a direction away from the second region 102, and the third opening 3103 is located on a side of the first opening 3101 away from the second region 102. The second opening 3102 is located between the first opening 3101 and the third opening 3103. The depth of the first opening 3101 is h21, the depth of the second opening 3102 is h22, and the depth of the third opening 3103 is h23, where h22 / h21=h23 / h22.

[0052] In this implementation, referring to the respective depths of the first opening 3101, the second opening 3102, and the third opening 3103, the design dimensions h22 / h21=h23 / h22 can be considered as follows: the depth of the opening 310 increases proportionally as it moves away from the second region 102. This arrangement helps the ductility of the first portion 031 adapt to changes in the tilt of the cover plate 02 while reducing the difficulty in preparing the opening 031.

[0053] Figure 12 for Figure 2 FIG. 1 is another cross-sectional view of the display module along section line AA′.

[0054] In one embodiment of the present application, Figure 12 As shown, the display module 10 further includes a filler 05 located on the side of the heat dissipation structure 03 close to the display panel 01 and filling the opening 310. The filler 05 may include an acrylic copolymer, and the adhesiveness of the filler 05 may improve the attachment stability of the heat dissipation structure 03.

[0055] In the embodiment of the present application, when the filler 05 fills the opening 310, it means that in addition to the spacer 311, the filler 05 can also contact the inner wall of the opening 310, so the contact area between the filler 05 and the first part 031 is relatively large. Considering the adhesive properties of the filler 05, this arrangement can enhance the adhesion of the filler 05 to the first part 031, preventing the first part 031 from falling off the film structure (such as the display panel 01) to which it is attached due to bending. In addition, the filler 05 can also act as a "stress medium" located within the opening 310. When the display module 10 is stressed, the filler 05 can exert stress, preventing the opening 310 from undergoing structural changes due to the lack of a stress-free medium inside.

[0056] Figure 13 A schematic diagram of a display device provided in this application.

[0057] The present application provides a display device 20, such as Figure 13As shown, the display device 20 includes the above-mentioned display module 10. The display device 20 can be a mobile phone. In addition, the display device 20 can also be an electronic device such as a computer or a television.

[0058] The display device 20 provided in the embodiment of the present application has greatly improved the mold printing problem during the display process.

[0059] In this specification, reference can be made to the same or similar parts between the various embodiments. In particular, for the device embodiment and the terminal embodiment, since they are basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the description in the method embodiment.

Claims

1. A display module, characterized in that: include: a first region and a second region, the first region at least partially surrounding the second region; Display panel; a cover plate, comprising a bent portion located in the first area; Along a direction away from the second area, the bent portion bends toward the side where the display panel is located; a heat dissipation structure located on a side of the display panel away from the cover plate; the heat dissipation structure includes a first portion and a second portion, wherein the first portion overlaps the bent portion in a direction perpendicular to the plane of the display panel, and the second portion is located in the second area; Wherein, the first part is provided with an opening.

2. The display module according to claim 1, wherein: The opening is located on a side of the first portion close to the display panel.

3. The display module according to claim 1, wherein: The widths corresponding to any two of the openings are the same.

4. The display module according to claim 1, wherein: The width of the opening increases in a direction away from the second region.

5. The display module according to claim 3 or 4, characterized in that: The plurality of openings are arranged at equal intervals.

6. The display module according to claim 3, wherein: In a direction away from the second region, the distance between two adjacent openings decreases.

7. The display module according to claim 1, wherein: The width w of the opening satisfies: w≤0.2 mm.

8. The display module according to claim 1, wherein: The spacing Δw between adjacent openings satisfies: Δw≤0.1 mm.

9. The display module according to claim 1, wherein: The thickness of the first portion is smaller than the thickness of the second portion.

10. The display module according to claim 1, wherein: The first portion further includes a spacer portion, wherein the spacer portion does not overlap with the opening along a direction perpendicular to the plane where the display panel is located; The thickness of the spacer is h1, the depth of the opening is h2, and h2≤0.5 h1.

11. The display module according to claim 10, wherein: The depth of the opening increases in a direction away from the second region.

12. The display module according to claim 1, wherein: The display module further includes a filling glue, which is located on a side of the heat dissipation structure close to the display panel and fills the opening.

13. A display device, characterized in that: Comprising the display module according to any one of claims 1-12.

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