A multi-category and multi-level Clip assembly process

Abstract

A multi-category multi-level Clip assembly process belongs to the field of chip processing technology. It includes an execution station, which is characterized in that: there are multiple execution stations, the conveying unit passes through all the execution stations at the same time, a temporary storage station is set between adjacent execution stations, and the conveying unit also includes a carrying mechanism that runs back and forth; it also includes the following steps: step 1001, input of the chip frame; step 1002, the chip frame arranges multiple jumpers at the current execution station; step 1003, temporary storage of the chip frame; step 1004, transfer of the chip frame; step 1005, judging whether the chip frame has passed all the execution stations. In the technical solution of the present application, in the process of the chip frame moving along the conveying unit, multiple jumpers are arranged when passing through each execution mechanism, which is more conducive to the packaging of the chip structure with a multi-level jumper structure.

Description

Technical Field

[0001] The present invention relates to the field of chip processing technology, and in particular to a multi-category and multi-level Clip assembly process. Background Art

[0002] In the chip processing technology of the prior art, the upper surface of the chip is converted from the wire bonding welding method to the Clip packaging process, which can improve the production efficiency of the product, reduce manufacturing costs, and solve the problems of cold solder joints and lead neck breakage caused by wire welding. In the Clip packaging process, for example, taking the technical solution described in the Chinese invention patent with application number 202111674902.X, application date December 31, 2021, and patent name “Fully Automatic Transistor CLIP Assembly Line and Method” as an example, the general process is: chip frame gluing; placing and pasting the chip on the chip frame; chip gluing; jumper installation, the jumper frame is punched out by a punching mechanism to obtain the jumper, and then the pick-up mechanism transfers the jumper to the glued chip (such as the technical solutions recorded in the Chinese invention patent with application number 202411462375.X, application date October 18, 2024, and patent name "Copper sheet bonding equipment for punching and loading semiconductor devices and assembly method thereof", and the technical solutions recorded in the Chinese invention patent with application number 202021382135.6, application date July 14, 2020, and patent name "Jump chip automatic installation machine"), and then sent to the subsequent process for further processing.

[0003] However, existing technologies, including the aforementioned technical solutions, suffer from the following drawbacks: Multiple jumpers are typically arranged in layers within a chip's layout, and these jumpers are often arranged vertically. In existing technologies, only one set of pick-up devices is typically installed on the drive mechanism. This requires multiple pick-up stations to place and retrieve jumpers, or multiple round trips by a single set of pick-up devices. This not only reduces efficiency and increases chip processing time, but also reduces reliability when the pick-up devices handle multiple different jumpers. Summary of the Invention

[0004] The technical problem to be solved by the present invention is: to overcome the shortcomings of the existing technology and provide a chip frame that arranges multiple jumpers when passing through each actuator during the movement along the conveying unit, which is more conducive to realizing a multi-category and multi-level Clip assembly process for chip structure packaging with a multi-level jumper structure.

[0005] The jumper frame with jumpers arranged on it is wound in a roll and arranged in the feeding unit. At the same time, there are two execution stations corresponding to each feeding unit. Multiple jumpers can be arranged at one station, which improves the work efficiency of the multi-category and multi-level Clip assembly process.

[0006] The technical solution adopted by the present invention to solve its technical problems is as follows: the multi-category multi-level Clip assembly process includes an assembly system, wherein an execution station is provided in the assembly system, and a picking unit and a punching unit are provided in the execution station. The characteristics are as follows: there are multiple execution stations, a conveying unit passes through all the execution stations at the same time, and a temporary storage station is provided between adjacent execution stations. The conveying unit also includes a reciprocating carrying mechanism, and each carrying mechanism passes through an execution station on its reciprocating path;

[0007] The following steps are also included:

[0008] Step 1001: A carrier mechanism that travels back and forth between the input end of a conveying unit and a temporary storage station receives a chip frame delivered from a previous process and delivers it to the first execution station.

[0009] Step 1002: After the chip frame enters the execution station, a punching unit in the execution station operates to obtain multiple different jumper wires, and then a picking unit sequentially places the multiple jumper wires obtained by punching on the surface of the chip frame.

[0010] Step 1003: After the chip frame completes the placement of multiple jumpers at the current execution station, the chip frame is transferred by the carrier mechanism to a temporary storage station following the current execution station. The temporary storage mechanism at the temporary storage station removes the chip frame, and the carrier mechanism returns to the previous temporary storage station or the input end of the conveyor unit.

[0011] Step 1004: The carrier mechanism, which traverses between the current temporary storage station and the subsequent temporary storage station, moves to the current temporary storage station to receive the temporarily stored chip frame, and after receiving the chip frame, sends the chip frame to the subsequent temporary storage station. During the process of sending the chip frame to the subsequent temporary storage station, the jumper placement operation is performed at the execution station that the chip frame passes through.

[0012] Step 1005: Check whether the chip frame has passed through all execution stations and completed the jumper arrangement. If it has passed through all execution stations, the end support mechanism will send the chip frame to the output end of the conveying unit for output. If it has not passed through all execution stations, return to step 1002.

[0013] Preferably, when executing step 1002, the picking mechanism places the jumpers in a solder box and a solder box in sequence before arranging the jumpers in sequence on the surface of the chip frame.

[0014] Preferably, a feeding unit is set above the conveying unit, and the strip jumper frame is wound in a roll in the feeding unit. The feeding unit is located above two adjacent execution stations and is respectively connected to the punching units in the two execution stations.

[0015] Preferably, the feeding unit includes a feeding fixed frame mounted above the conveying unit, and a plurality of feeding trays are respectively arranged on the side surfaces of the feeding fixed frame before and after the movement of the chip frame, and a jumper frame is respectively wound around each feeding tray; and punching units corresponding to the feeding trays one by one and receiving the jumper frames are respectively arranged below the feeding fixed frame.

[0016] Preferably, picking units are provided below the side surfaces on both sides of the front and rear of the feeding fixed frame. The picking units are located outside the multiple punching units on the same side. The picking units are docked with the multiple punching units on the same side and together form an execution station.

[0017] Preferably, the conveying unit is a linearly arranged conveying rail that passes through all execution stations. A plurality of supporting mechanisms for placing chip frames are provided on the conveying rail. The supporting mechanisms independently reciprocate on the surface of the conveying rail and two adjacent supporting mechanisms are docked front and back.

[0018] Preferably, the joint between two adjacent supporting mechanisms is a temporary storage station, and a temporary storage mechanism for realizing chip frame grabbing and transfer is provided at the temporary storage station.

[0019] Preferably, two feeding trays are respectively provided on the side surfaces on the front and rear sides of the feeding fixing frame, and a punching unit is respectively arranged under the two feeding trays on the same side. The picking unit docking with the two punching units on the same side includes a picking translation module, and two groups of picking components working alternately are arranged on the picking translation module, and an adsorption mechanism docking with the corresponding punching unit is respectively provided in each picking component.

[0020] Preferably, the picking assembly includes a base for connecting to the moving part of the translation module, a vertically arranged lifting module is provided on the end face of the base, the adsorption mechanism is rotatably installed on the moving part of the lifting module, and a rotating drive mechanism is provided on the surface of the lifting module for connecting to the adsorption mechanism and driving the adsorption mechanism to rotate.

[0021] Preferably, the punching unit includes a punching main frame, on the surface of the punching main frame are arranged in sequence along the moving direction of the jumper frame: a driving frame for driving the jumper frame to move and a punching frame for punching the jumper frame to obtain the jumper; a solder box and a solder box are also arranged in sequence at the output end of the punching frame.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] In the technical solution of the present application, when the chip frame moves along the conveying unit, multiple jumpers are arranged when passing through each actuator, which is more conducive to the packaging of the chip structure with a multi-level jumper structure.

[0024] In the multi-category and multi-level Clip assembly process described in the technical solution of this application, the jumper frame with jumpers arranged is wound in a roll and arranged in the feeding unit. At the same time, there are two execution stations corresponding to each feeding unit, and the arrangement of multiple jumpers can be performed at one station, thereby improving work efficiency.

[0025] In the conveying unit of the present application, multiple carrying mechanisms are arranged on the surface of the conveying track. During the reciprocating operation of adjacent carrying mechanisms, chips are processed and docked and transferred at different execution stations, thereby improving the processing efficiency of the chips.

[0026] By setting a temporary storage mechanism at the joint of the front and rear carrying mechanisms, the two carrying mechanisms are assisted to realize the transfer of the chip frame, and the automatic completion of the chip frame transfer and processing is further realized.

[0027] Multiple feeding trays are set at each execution station, so that different jumpers can be obtained at one station. When the chip is moving, multiple different jumpers can be arranged on the chip at this station, thereby shortening the length of the entire production line, improving work efficiency, and being more conducive to the arrangement of multiple or / and multi-layer jumpers on the chip.

[0028] In the punching unit, a code disk is set. When the code disk rotates, the photoelectric sensor is continuously triggered. By counting the photoelectric sensor, the rotation angle of the code disk is detected, thereby realizing the detection of the rotation angle of the two driving gear disks, and further realizing the detection of the movement distance of the frame on the surface of the driving frame.

[0029] In the picking unit, when the rotation detection switch is triggered twice in succession at the side opening of the rotating detection disk, it means that the rotating detection disk has rotated more than 360°, avoiding excessive rotation of the adsorption mechanism in the same direction and causing damage to the pipeline used to transport gas. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a process flow chart for multi-category and multi-level Clip assembly.

[0031] Figure 2 Axonometric drawing of the assembly system.

[0032] Figure 3 for Figure 2 The schematic diagram after the outer cover is omitted.

[0033] Figure 4 A view of the picking unit in the execution station is omitted for the assembly system.

[0034] Figure 5 for Figure 4 Front view of .

[0035] Figure 6 for Figure 5 Middle AA section view.

[0036] Figure 7 Left side view of the pick unit for assembly system.

[0037] Figure 8 This is an axonometric view of the pickup assembly of the pickup unit.

[0038] Figure 9 This is the left view of the adsorption mechanism of the picking unit.

[0039] Figure 10 for Figure 9 Middle BB section view.

[0040] Figure 11 Axonometric drawing of the punched unit for the assembly system.

[0041] Figure 12 Left side view of the punching unit of the assembly system.

[0042] Figure 13 for Figure 12 Center CC section view.

[0043] Figure 14 for Figure 3 The view after the feeding unit, picking unit and punching unit are omitted.

[0044] Figure 15 This is a front view of the output mechanism in the conveying mechanism of the assembly system.

[0045] Figure 16 for Figure 15 Right view of .

[0046] Figure 17 Axonometric view of the carrier mechanism in the conveyor unit of the assembly system.

[0047] Figure 18 This is an axonometric view of the temporary storage mechanism in the conveying unit of the assembly system.

[0048] Among them: 1. Workbench; 2. Outer cover; 3. Feed unit; 4. Conveyor unit; 5. Pickup unit; 6. Punching unit; 7. Feed tray; 8. Mounting frame; 9. Crossbeam; 10. Jumper frame; 11. Lining tape reel; 12. Lining tape; 13. Solder box; 14. Feed motor; 15. Pickup translation module; 16. Pickup assembly; 17. Pickup support; 18. Translation limit switch; 19. Valve box; 20. Pickup back plate; 21. Rotating motor; 22. Coupling; 23. Rotating detection plate; 24. Pickup lifting frame ; 25. Adsorption mechanism; 26. Solder box; 27. Rotation mounting bracket; 28. Rotation detection switch; 29. ​​Lifting reset spring; 30. Translation limit plate; 31. Lifting detection plate; 32. Lifting limit switch; 33. Picking base; 34. Picking lifting module; 35. Rotating rack; 36. Adsorption lifting cylinder; 37. Air nozzle; 38. Linear bearing; 39. Lifting block; 40. Guide shaft; 41. Adsorption spring; 42. Adsorption block; 43. Suction nozzle; 44. Telescopic air pipe; 45. Collection box; 46. Punching Hole; 47, punching frame; 48, driving top plate; 49, punching transmission mechanism; 50, guide frame; 51, guide plate; 52, punching bottom plate; 53, driving gear disc; 54, punching cylinder; 55, punching top plate; 56, punching code disc; 57, photoelectric sensor; 58, punching drive motor; 59, punching plate; 60, driving bottom plate; 61, output mechanism; 62, temporary storage mechanism; 63, carrying mechanism; 64, conveying guide rail; 65, output transmission mechanism; 66, output frame; 67, output lifting plate; 68, Output gripper cylinder; 69, output distance sensor; 70, output gripper; 71, output column; 72, output beam; 73, output linear module; 74, lifting drive motor; 75, clamping groove; 76, load-bearing bottom plate; 77, load-bearing top plate; 78, proximity sensor; 79, receiving groove; 80, clamping plate; 81, clamping cylinder; 82, temporary storage column; 83, temporary storage beam; 84, temporary storage lifting cylinder; 85, lifting frame; 86, temporary storage distance sensor; 87, temporary storage gripper cylinder; 88, temporary storage gripper. DETAILED DESCRIPTION

[0049] Figures 1 to 18 The best embodiment of the present invention is shown below in conjunction with the attached Figures 1 to 18 The present invention is further described.

[0050] A multi-category multi-level Clip assembly process, including Figure 2~Figure 3The assembly system shown includes a workbench 1, which is a cabinet. The surface of the workbench 1 is a work surface. A conveying unit 4 is provided on the surface of the work surface. The conveying unit 4 is arranged along the length of the work surface. A plurality of feeding units 3 are mounted directly above the conveying unit 4. Two punching units 6 are respectively provided on both sides of the lower part of the feeding unit 3. A picking unit 5 is also provided on the outside of the two punching units 6 on each side of the feeding unit 3. Each picking unit 5 and its corresponding two punching units 6 constitute an execution station. The picking units 5 and the punching units 6 are all arranged on the work surface. In the assembly system of the present application, there are two feeding units 3, so the picking units 5 and the punching units 6 arranged below the two feeding units 3 constitute a total of four execution stations, and the conveying unit 4 passes through the middle of all the execution stations.

[0051] like Figures 4 to 6 As shown, the feeding unit 3 includes a crossbeam 9, both ends of which are fixed to the inner side of the outer cover 2, and a mounting bracket 8 is provided at both ends of the lower part of the crossbeam 9. A feeding tray 7 is provided on the front and rear sides of each mounting bracket 8, and the two feeding trays 7 on the same side of the mounting bracket 8 correspond to the two punching units 6 in the execution station below the feeding unit 3.

[0052] The feed tray 7 is disc-shaped, and each feed tray 7 is rotatably mounted on the corresponding end surface of its corresponding mounting frame 8 via a rotating shaft at its center. A jumper frame 10 with jumpers is wound in the form of a continuous strip in the slot in the middle of the feed tray 7. A lining strip 12 of the same length and width as the frame is also wound around the feed tray 7 at the same time as the jumper frame 10, and the lining strip 12 serves as an isolation.

[0053] A feed motor 14 is provided at the bottom of the inner side of the mounting frame 8, corresponding to the feed tray 7. A lining tape reel 11 is provided at the bottom of the outer surface of the mounting frame 8, corresponding to the feed motor 14. The lining tape reel 11 is also rotatably mounted on the surface of the mounting frame 8 via its rotating shaft, and is located below the side of the corresponding feed tray 7. The rotating shaft of the lining tape reel 11 passes through the mounting frame 8 and extends to the inner side of the mounting frame 8, and is located below the corresponding feed motor 14. The motor shaft of the feed motor 14 is connected to the rotating shaft of the lining tape reel 11 located below it through a known transmission method (such as a synchronous belt mechanism), and drives the lining tape reel 11 to rotate.

[0054] After the jumper frame 10 and the lining tape 12 attached thereto are released from the feed tray 7, the lining tape 12 is wound around the lining tape reel 11, and the jumper frame 10 extends downward to the corresponding punching unit 6. As the lining tape reel 11 rotates, the lining tape 12 is continuously wound around its surface and collected. During the process of continuous winding and collection of the lining tape 12, the jumper frame 10 is continuously fed to the execution station below it and enters the corresponding punching unit 6.

[0055] like Figure 7 As shown, the pick-up unit 5 includes two pick-up pillars 17 spaced apart and support beams mounted horizontally on the upper surfaces of the pick-up pillars 17 at both ends. A pick-up translation module 15 is mounted on the upper surface of the support beams. A pick-up assembly 16 is mounted on each of the two sliders in the pick-up translation module 15. Each pick-up assembly 16 corresponds to a punching unit 6. After the jumper wire frames 10 released from the feed tray 7 enter the corresponding punching unit 6 and are punched to obtain jumper wires, the pick-up assemblies 16 on the corresponding side arrange the jumper wires on the surface of the chip.

[0056] Combine Figure 8 The pickup assembly 16 includes a pickup base 33, to which the slider in the pickup translation module 15 is fixed. A valve box 19 is located on the surface of the pickup base 33, and a solenoid valve assembly is housed within the valve box 19. An external air source is connected to the solenoid valve assembly within the valve box 19 via a pipeline (not shown) and to the pneumatic components of the pickup assembly 16.

[0057] A pickup backplane 20 is vertically fixed to the front end of the pickup base 33. A pickup lift module 34 is vertically arranged on the surface of the pickup backplane 20. A pickup lift frame 24 is located in front of the pickup lift module 34, and the slider of the pickup lift module 34 is mounted on the back of the pickup lift frame 24. A lift detection plate 31 is located on one side of the top of the pickup lift frame 24, and a lift limit switch 32 is located on the upper portion of the same side of the pickup backplane 20. A translation limit plate 30 is located on one side of the bottom of the pickup backplane 20, and a translation limit switch 18 is located on the front end of the main frame. Two translation limit switches 18 are provided, one corresponding to each of the two pickup assemblies 16. The lifting limit switch 32 and the translation limit switch 18 are both implemented using common U-shaped photoelectric sensors on the market. When the lifting detection plate 31 rises to the lifting limit switch 32, the lifting limit switch 32 is triggered, and the picking lifting module 34 stops running. Similarly, after the translation limit plate 30 triggers the corresponding translation limit switch 18, the picking translation module 15 stops the operation of the corresponding picking component 16.

[0058] Two lifting and returning springs 29 are installed on the front end surface of the picking lifting frame 24, and a support plate is horizontally arranged on the top of the picking back plate 20. The front end of the support plate extends forward to the top of the picking lifting frame 24, and the other ends of the two lifting and returning springs 29 extend upward and are hung with the support plate.

[0059] A rotating mounting frame 27 is installed on the front surface of the picking lifting frame 24, and a rotating motor 21 is installed on the top of the rotating mounting frame 27. The motor shaft of the rotating motor 21 passes downward through the top surface of the rotating mounting frame 27 and enters the interior of the rotating mounting frame 27. The rotating motor 21 is connected to a rotating shaft through a coupling 22 in the rotating mounting frame 27. The rotating shaft passes downward through the rotating mounting frame 27 and the picking lifting frame 24 and is connected to the adsorption mechanism 25 located at the bottom of the picking lifting frame 24, thereby driving the adsorption mechanism 25 to rotate.

[0060] A rotation detection disk 23 is also horizontally fixed to the bottom of the coupling 22. An opening is provided on one side of the rotation detection disk 23, and a rotation detection switch 28 is provided on one side of the rotation mounting bracket 27. The rotation detection disk 23 is rotatably located within the rotation detection switch 28. The rotation detection switch 28 is also implemented using a U-shaped photoelectric sensor. When the rotation detection switch 28 is triggered twice consecutively at the opening on the side of the rotation detection disk 23, it indicates that the rotation detection disk 23 has rotated more than 360 degrees, preventing excessive rotation of the adsorption mechanism 25 in the same direction, which may damage the pipeline used to transport gas.

[0061] like Figures 9 and 10 As shown, the adsorption mechanism 25 includes a rotating frame 35, which is a rectangular frame. Two lifting blocks 39 are arranged side by side within the rotating frame 35. A suction lifting cylinder 36 is fixed to the surface of each lifting block 39. The suction lifting cylinder 36 adopts a common commercially available needle cylinder. The air circuit of the suction lifting cylinder 36 is connected to the valve box 19 mentioned above.

[0062] The main body of the suction lift cylinder 36 is fixed to the surface of the corresponding lifting block 39. The piston rod of the suction lift cylinder 36 passes through the lifting block 39 and is fixed to the surface of the bottom plate of the rotating frame 35. When the piston rod of the suction lift cylinder 36 moves, it drives the main body and the lifting block 39 to rise and fall within the rotating frame 35 because the bottom of the piston rod is fixed.

[0063] A guide shaft 40 is provided on each side of the suction lift cylinder 36. One end of the guide shaft 40 is fixed to the bottom plate of the rotating frame 35, and the other end extends vertically through the lifting block 39, where it is movably connected. Each lifting block 39 also has a lifting shaft at each end. The top of the lifting shaft is fixed to the bottom of the lifting block 39, and the lifting shaft extends downward through the bottom plate of the rotating frame 35 to the bottom of the rotating frame 35. Two suction blocks 42 are also provided at the bottom of the rotating frame 35, corresponding to each lifting block 39. The suction blocks 42 are fixed to the lifting shafts extending from the corresponding lifting blocks 39. Therefore, when the lifting block 39 is raised and lowered within the rotating frame 35 by the suction lift cylinder 36, the suction blocks 42 are simultaneously raised and lowered at the bottom of the pickup lift frame 24. Each lifting shaft is also fitted with an suction spring 41, which assists in restoring the shaft after lifting. Linear bearings 38 are also provided at the lifting connection of the lifting shaft.

[0064] A through-hole is also provided in the center of the base of the rotating frame 35. Two telescopic air tubes 44 are located within this through-hole. The upper portions of these two telescopic air tubes 44 extend upward through their corresponding lifting blocks 39 and connect to air nozzles 37 located on the surfaces of these blocks. These nozzles 37 are then connected to the valve box 19 via a pipeline. The two telescopic air tubes 44 extend through the through-hole in the center of the base of the rotating frame 35 to the underside of the rotating frame 35 and pass through their corresponding suction blocks 42. Suction nozzles 43 are located at the bottom of these suction blocks 42. The bottoms of these telescopic air tubes 44 mate with the suction nozzles 43 located at the bottom of their corresponding suction blocks 42.

[0065] like Figures 11 to 13 As shown, the punching unit 6 includes a main frame consisting of a punching top plate 55 and a punching bottom plate 52, spaced apart from each other. A guide frame 50, a drive frame, and a punching frame 47 are sequentially arranged on the surface of the main frame along the direction of movement of the jumper frame 10. A guide plate 51 is also provided at the end of the guide frame 50. After being released from the feed tray 7, the jumper frame 10 is guided to the surface of the guide frame 50 by the action of the guide plate 51. Driven by the drive frame, the punching process is performed on the surface of the punching frame 47 to produce a jumper wire.

[0066] The drive frame includes a drive base plate 60 that is fixed to the surface of the top plate. A vertical plate is vertically fixed at each end of the drive base plate 60. A drive top plate 48 is horizontally arranged on the surface of the vertical plates on both sides. The jumper frame 10 passes through the surface of the drive top plate 48. Two drive gear discs 53 are arranged between the drive top plate 48 and the drive base plate 60. The two drive gear discs 53 are coaxially fixed. Two card plates are also spaced apart on the surface of the drive top plate 48. A card slot is formed between the two card plates and the surface of the drive top plate 48. The two drive gear discs 53 are respectively located below the two card plates. When the jumper frame 10 passes through the surface of the drive top plate 48, it passes between the card plate and the drive top plate 48, and the teeth at the edges of the two drive gear discs 53 are stuck in the tooth holes at the edge of the jumper frame 10, driving the jumper frame 10 to move.

[0067] A punching drive motor 58 is disposed on the lower surface of the punching top plate 55. The motor shaft of the punching drive motor 58 extends to the outside of the main frame and is connected to the punching transmission mechanism 49. The punching transmission mechanism 49 extends obliquely upward to the drive frame and is connected to the rotating shafts of the two drive gear discs 53. The punching drive motor 58 and the punching transmission mechanism 49 drive the two drive gear discs 53 to rotate. The punching transmission mechanism 49 is also implemented using a known transmission method (such as a synchronous belt mechanism).

[0068] A punching code disk 56 is provided in the drive frame, which is coaxially fixed with the two drive gear discs 53 and rotates synchronously. A notch is provided at the edge of the punching code disk 56. A punching photoelectric sensor 57 is provided on one side of the punching code disk 56. The punching code disk 56 is clamped between the transmitting end and the receiving end of the punching photoelectric sensor 57. When the punching code disk 56 rotates, the punching photoelectric sensor 57 is continuously triggered. By counting the punching photoelectric sensor 57, the rotation angle of the punching code disk 56 is detected, thereby realizing the detection of the rotation angle of the two drive gear discs 53, and further realizing the detection of the movement distance of the jumper frame 10 on the surface of the drive frame.

[0069] A punching cylinder 54 is also provided on the surface of the punching base plate 52, and the piston rod of the punching cylinder 54 is facing the punching frame 47 upward. A group of punching holes 46 are provided at intervals on the surface of the punching frame 47, and the punching holes 46 pass through the punching frame 47 downward. A punching plate 59 is provided in each of the two punching holes 46, and the tops of the two punching plates 59 are punches. The bottoms of the two punching plates 59 are respectively connected to the tops of the piston rods of the punching cylinder 54. When the piston rod of the punching cylinder 54 moves, it drives the two punching plates 59 to move back and forth in the vertical direction, and through the punches at the tops thereof, punches are performed on the jumper frame 10 located on the surface of the punching frame 47, thereby obtaining jumpers.

[0070] A collection box 45 is also provided at the output end of the punching rack 47. The waste obtained by punching gradually falls into the collection box 45 for collection as the jumper frame 10 moves. On the side of the collection box 45, along the moving direction of the jumper frame 10, a solder box 13 and a solder box 26 are also provided in sequence. The solder box 13 and the solder box 26 are respectively fixed by a punching top plate 55. Before the pick-up unit 5 transfers the jumper to the chip surface through the suction nozzle 43, it first places the jumper in the solder box 13 to dip in flux, then places it in the solder box 26 to dip in solder, and finally places the jumper in the corresponding position on the chip surface, thereby omitting the step of dispensing glue before arranging the jumper on the chip. In addition, a heating device is provided at the solder box 13 and the solder box 26 to ensure that the flux in the solder box 13 and the solder in the solder box 26 are in a molten state.

[0071] like Figure 14 As shown, the conveyor unit 4 includes a conveyor rail 64, which is implemented using a linear module known in the art. The surface of the workbench 1 serves as the work surface, and the conveyor rail 64 is arranged along the length of the work surface. The input end of the conveyor rail 64 extends to the outside of the work surface, used to dock with the previous process and transfer the chip frame with the chip mounted thereto. The output end of the conveyor rail 64 is provided with an output mechanism 61 for transferring the chip frame that has completed the corresponding process on the work surface to the subsequent process.

[0072] The surface of the conveyor rail 64 is equipped with multiple sliders: slider 1 to slider N. Each slider is also equipped with a carrier mechanism 63 for placing chip frames. Two adjacent sliders reciprocate on the surface of the conveyor rail 64 to transfer chip frames. A temporary storage station is also provided between two adjacent execution stations. A temporary storage mechanism 62 is installed at the temporary storage station. The temporary storage station is the intersection of the two adjacent sliders. At the temporary storage station, the temporary storage mechanism 62 assists the carrier mechanism 63 on the surfaces of the two sliders to transfer chip frames.

[0073] Specifically: Sliders 1 to N are arranged as follows: Sliders 1 are arranged between the input end of the conveying guide rail 64 and the first temporary storage station, and only move back and forth between the input end of the conveying guide rail 64 and the first temporary storage station; Sliders 2 are arranged between the first temporary storage station and the second temporary storage station, and only move back and forth between the first temporary storage station and the second temporary storage station; ...; Sliders N are arranged between the last temporary storage station and the output mechanism 61, and only move back and forth between the last temporary storage station and the output mechanism 61.

[0074] The carrier mechanism 63, which shuttles between the input end of the conveyor rail 64 and the first temporary storage station, receives a chip frame from the previous process at the input end of the conveyor rail 64 and moves to the first execution station for processing. After completing processing at the first execution station, it continues to move to the first temporary storage station, where the temporary storage mechanism 62 removes the chip frame from the surface of the carrier mechanism 63. After unloading, the carrier mechanism 63 moves back to the input end of the conveyor rail 64 to receive the next chip frame. The carrier mechanism 63, which shuttles between the first and second temporary storage stations, moves to the first temporary storage station after unloading a chip frame. The temporary storage mechanism 62 at the first temporary storage station transfers the stored chip frame to its surface and delivers it to the second execution station for processing. After processing is complete, it is delivered to the second temporary storage station, and so on. This cycle repeats until the chip frame, having completed processing at the final execution station, is delivered to the output mechanism 61 for subsequent processing.

[0075] like Figure 15-16 As shown, the output mechanism 61 includes two output columns 71 arranged vertically side by side on the work surface. An output beam 72 is horizontally arranged on top of the output columns 71, and the output beam 72 is perpendicular to the arrangement direction of the conveyor guide rails 64. An output linear module 73 is also arranged on the surface of the output beam 72. The output frame 66 is fixed to the slider on the surface of the output linear module 73. The horizontal plate on the back of the output frame 66 is fixed to the surface of the slider of the output linear module 73. A vertical plate is vertically fixed to the end face of the output frame 66 facing the conveyor unit 4, and the vertical plate is located outside the output linear module 73.

[0076] A guide rail is fixed vertically on the surface of the vertical plate of the output frame 66, and an output lifting plate 67 is clamped on the surface of the guide rail. An output transmission mechanism 65 is also provided on one side of the guide rail on the surface of the vertical plate, and a lifting drive motor 74 is provided on the surface of the horizontal plate. The motor shaft of the lifting drive motor 74 passes through the vertical plate and is connected to the output transmission mechanism 65. The output transmission mechanism 65 is implemented by a synchronous belt mechanism, including two vertically arranged pulleys and a synchronous belt installed between the two pulleys. The motor shaft of the lifting drive motor 74 passes through the vertical plate and is coaxially fixed to one of the pulleys (the driving pulley). The side of the output lifting plate 67 is fixed to the synchronous belt. Therefore, when the lifting drive motor 74 rotates, it can drive the output lifting plate 67 to rise and fall in the vertical direction under the guidance of the guide rail through the output transmission mechanism 65.

[0077] An output clamping cylinder 68 is fixed at the bottom of the output lifting plate 67 , a group of output clamping claws 70 are relatively fixed at the output end of the output clamping claw cylinder 68 , and an output distance measuring sensor 69 is respectively provided at the two output clamping claws 70 .

[0078] like Figure 18 As shown, the temporary storage mechanism 62 includes a temporary storage column 82 vertically arranged on the surface of the work surface, and a temporary storage beam 83 horizontally arranged on the top of the temporary storage column 82. The temporary storage beam 83 is arranged perpendicular to the arrangement direction of the conveying guide rail 64. A temporary storage lifting cylinder 84 is fixed at the end of the temporary storage beam 83, and the piston rod of the temporary storage lifting cylinder 84 is vertically downward. A temporary storage lifting frame 85 is fixed to the side of the piston rod of the temporary storage lifting cylinder 84, and a temporary storage clamping cylinder 87 is fixed at the bottom of the temporary storage lifting frame 85. The temporary storage clamping cylinder 87 is downward facing the conveying guide rail 64. A group of temporary storage clamping claws 88 are relatively fixed at the output end of the temporary storage clamping claw cylinder 87, and a temporary storage distance sensor 86 is respectively provided at the two temporary storage clamping claws 88.

[0079] like Figure 17 As shown, the support mechanism 63 includes a vertically spaced support base plate 76 and a support top plate 77. The support base plate 76 is used to secure the corresponding slider. The support base plate 76 and the support top plate 77 are connected as a whole by multiple connecting columns at the four corners. A receiving groove 79 for accommodating the chip frame is formed on the surface of the support top plate 77. Clamping grooves 75 are further formed outward at opposite ends of the receiving groove 79. The bottom of the clamping groove 75 is lower than the bottom of the receiving groove 79. A groove is also formed in the middle of the receiving groove 79, and a proximity sensor 78 is disposed within the groove. The proximity sensor 78 is entirely located within the groove.

[0080] An opening communicating with the receiving groove 79 is provided at a corner of the support top plate 77. A clamping plate 80 is provided at the opening. A clamping cylinder 81 is fixed to the bottom surface of the support top plate 77. The piston rod of the clamping cylinder 81 is connected to the clamping plate 80. When the proximity sensor 78 detects that the chip frame has been placed, the clamping cylinder 81 is activated, driving the clamping plate 80 to move toward the receiving groove 79, thereby securing the chip frame in the receiving groove 79 through the clamping plate 80.

[0081] The specific working process and working principle are as follows:

[0082] The multi-category and multi-level Clip assembly process implemented by the above assembly system includes: Figure 1 The following steps are shown:

[0083] Step 1001, inputting the chip framework;

[0084] The carrying mechanism 63 that travels back and forth between the input end of the conveying rail 64 and the first temporary storage station receives the chip frame delivered by the previous process at the input end of the conveying rail 64. The carrying mechanism 63 is driven by its bottom slider to move to the first execution station for corresponding processing.

[0085] Step 1002: The chip frame arranges multiple jumpers at the current execution station;

[0086] After entering the execution station, the chip frame is positioned between the two punching units 6. After being released from the feed tray 7 and entering the punching unit 6, the jumper frame 10 is guided to the surface of the guide frame 50 by the guide plate 51 and then enters the drive frame. Inside the drive frame, the punching drive motor 58 rotates, driving the gear plate 53 and simultaneously driving the jumper frame 10 into the punching frame 47. The continuous operation of the punching cylinder 54 punches the jumper frame 10, producing jumper wires.

[0087] Then the picking translation module 15 in the picking unit 5 controls the movement of the corresponding picking component 16 and moves it to the top of the jumper. The picking lifting module 34 drives the picking lifting frame 24 to move downward, causing the adsorption mechanism 25 to descend to the top of the jumper. The electromagnetic valve group in the valve box 19 outputs high-pressure gas to the adsorption lifting cylinder 36, which drives the adsorption block 42 to move downward and contact the jumper. After contact, the jumper is adsorbed by the suction nozzle 43. The adsorption lifting cylinder 36 moves again, driving the jumper to rise. Before the jumper is transferred to the chip surface through the suction nozzle 43, the jumper is first placed in the solder box 13 to dip in flux, then placed in the solder box 26 to dip in solder, and finally the adsorbed jumper is transferred to the surface of the chip. Then the adsorption lifting cylinder 36 transfers the jumper to the corresponding bonding point of the chip. The suction at the suction nozzle 43 is then canceled to release the jumper. The current pick assembly 16 moves away under the combined action of the pick-up translation module 15 and the pick-up lift module 34, while another set of pick assemblies 16 simultaneously transfers another jumper wire to the chip surface. The chip then moves on to the next process. During the pick-up and release process of the jumper wires, the suction mechanism 25 is rotated by the rotary motor 21 when necessary, so that the suction nozzle 43 can align with the arrangement of the jumper wires.

[0088] Step 1003, temporary storage of the chip frame;

[0089] After the chip frame completes the above-mentioned actions at the current execution station, it continues to move to the temporary storage station behind the current execution station. At this time, the temporary storage lifting cylinder 84 is actuated to send the temporary storage clamping cylinder 87 to the carrier mechanism 63 via the temporary storage lifting frame 85. The temporary storage clamping claws 88 on both sides enter the clamping groove 75. The temporary storage clamping claw cylinder 87 is actuated to clamp the chip frame with the temporary storage clamping claws 88. After the clamping cylinder 81 is actuated to release the chip frame, the piston rod of the temporary storage lifting cylinder 84 rises to remove the chip frame from the surface of the carrier mechanism 63. After unloading, the carrier mechanism 63 moves back to the input end of the conveying guide 64, ready to receive the next chip frame.

[0090] Step 1004, transfer of chip frame;

[0091] After unloading the chip frame, the carrier mechanism 63, which shuttles between the current temporary storage station and the subsequent temporary storage station, moves to the current temporary storage station. The temporary storage lift cylinder 84 in the temporary storage mechanism 62 at the current temporary storage station actuates, via the temporary storage lift frame 85, to move the temporary storage gripper cylinder 87 to the carrier mechanism 63. The temporary storage grippers 88 on both sides enter the clamping groove 75, transferring the chip frame into the receiving groove 79. The temporary storage gripper cylinder 87 actuates to release the chip frame. After the proximity sensor 78 detects the placement of the chip frame, the clamping cylinder 81 actuates to secure the chip frame, and the piston rod of the temporary storage lift cylinder 84 rises. The carrier mechanism 63 then transports the loaded chip frame to the subsequent processing station for processing.

[0092] Step 1005: Check whether the chip framework traverses all execution stations;

[0093] Whether the chip frame has passed through all the execution stations and completed the arrangement of the jumpers, if it has traversed all the execution stations, execute step 1006, otherwise return to step 1002.

[0094] Step 1006: Outputting the chip frame;

[0095] After the chip frame passes through all the execution stations and the jumper arrangement is completed, the chip frame processed at the last execution station is sent to the output mechanism 61 by the last carrying mechanism 63 and then output to the subsequent process.

[0096] When executing the above process flow, the chip frame can also first execute steps 1003 to 1004, complete the temporary storage and transfer of the chip frame with the assistance of the temporary storage mechanism 62, and then the supporting mechanism 63 receiving the chip frame completes the arrangement of the jumper at the corresponding execution station.

[0097] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any other manner. Any person skilled in the art may utilize the above-disclosed technical content to modify or modify the present invention into equivalent embodiments. However, any simple modifications, equivalent variations, and modifications to the above embodiments that do not depart from the technical content of the present invention and are based on the technical essence of the present invention remain within the scope of protection of the present invention.

Claims

1. A multi-category, multi-level Clip assembly process, comprising an assembly system, wherein an execution station is provided in the assembly system, wherein a picking unit (5) and a punching unit (6) are provided in the execution station, and wherein: There are multiple execution stations, and the conveying unit (4) passes through all the execution stations at the same time. A temporary storage station is provided between adjacent execution stations. The conveying unit (4) also includes a carrying mechanism (63) that runs back and forth, and each carrying mechanism (63) passes through at least one execution station on its back and forth path. The following steps are also included: Step 1001: The carrier mechanism (63) that travels back and forth between the input end of the conveying unit (4) and the temporary storage station receives the chip frame delivered from the previous process and delivers it to the first execution station; Step 1002, executing the punching unit (6) in the work station to obtain a plurality of different jumpers, and the picking unit (5) arranges the jumpers on the surface of the chip frame in sequence; Step 1003: After the chip frame completes the jumper arrangement at the current execution station, the carrier mechanism (63) transfers the chip frame to a temporary storage station subsequent to the current execution station, and the temporary storage mechanism (62) at the temporary storage station takes the chip frame out, and the carrier mechanism (63) returns to the previous temporary storage station or the input end of the conveying unit (4); Step 1004, the carrying mechanism (63) that travels back and forth between the current temporary storage station and the subsequent temporary storage station moves to the current temporary storage station to receive the temporarily stored chip frame, and after receiving the chip frame, sends the chip frame to the subsequent temporary storage station. In the process of sending the chip frame to the subsequent temporary storage station, the jumper arrangement operation is performed at the execution station it passes through; Step 1005: If the chip frame has traversed all the execution stations, the end carrier mechanism (63) will send the chip frame to the output end of the conveying unit (4) for output. If it has not traversed all the execution stations, return to step 1002.

2. The multi-category, multi-level Clip assembly process according to claim 1, characterized in that: When executing step 1002, the picking mechanism (5) places the jumpers in the solder box (13) and the solder box (26) before arranging the jumpers in sequence on the surface of the chip frame.

3. The multi-category, multi-level Clip assembly process according to claim 1, characterized in that: A feeding unit (3) is mounted above the conveying unit (4), and a strip-shaped jumper frame (10) is wound in a roll and arranged in the feeding unit (3). The feeding unit (3) is located above two adjacent execution stations and is respectively connected to the punching units (6) in the two execution stations.

4. The multi-category, multi-level Clip assembly process according to claim 3, characterized in that: The feeding unit (3) includes a feeding fixed frame mounted above the conveying unit (4), and a plurality of feeding trays (7) are respectively arranged on the side surfaces of the feeding fixed frame along the front and rear sides of the chip frame, and a jumper frame (10) is respectively wound around each feeding tray (7); and punching units (6) corresponding to the feeding trays (7) and receiving the jumper frames (10) are respectively arranged below the feeding fixed frame.

5. The multi-category, multi-level Clip assembly process according to claim 3, characterized in that: Pick-up units (5) are provided below the side surfaces on both sides of the front and rear of the feed fixing frame. The pick-up units (5) are located outside the plurality of punching units (6) on the same side. The pick-up units (5) are docked with the plurality of punching units (6) on the same side and together form an execution station.

6. The multi-category, multi-level Clip assembly process according to claim 3, characterized in that: The conveying unit (4) is a linearly arranged conveying rail (64), which passes through all execution stations. A plurality of supporting mechanisms (63) for placing chip frames are arranged on the conveying rail (64). The supporting mechanisms (63) independently reciprocate on the surface of the conveying rail (64) and two adjacent supporting mechanisms (63) are connected front and back.

7. The multi-category, multi-level Clip assembly process according to claim 6, characterized in that: The butt joint of two adjacent carrying mechanisms (63) is a temporary storage station, and a temporary storage mechanism (62) for realizing chip frame capture and transfer is provided at the temporary storage station.

8. The multi-category, multi-level Clip assembly process according to claim 5, characterized in that: Two feeding trays (7) are respectively provided on the side surfaces of the front and rear sides of the feeding fixed frame. A punching unit (6) is respectively arranged under the two feeding trays (7) on the same side. The picking unit (5) docked with the two punching units (6) on the same side includes a picking translation module (15). Two groups of picking components (16) working alternately are arranged on the picking translation module (15). An adsorption mechanism (25) docked with the corresponding punching unit (6) is respectively provided in each picking component (16).

9. The multi-category, multi-level Clip assembly process according to claim 8, characterized in that: The pickup assembly (16) includes a base for connecting to the moving part of the translation module, a vertically arranged lifting module is provided on the end surface of the base, an adsorption mechanism (25) is rotatably installed on the moving part of the lifting module, and a rotation drive mechanism for connecting to the adsorption mechanism (25) and driving the adsorption mechanism (25) to rotate is provided on the surface of the lifting module.

10. The multi-category and multi-level Clip assembly process according to any one of claims 3 to 5 or 8, characterized in that: The punching unit (6) includes a punching main frame, on the surface of which are arranged in sequence along the moving direction of the jumper frame (10): a driving frame for driving the jumper frame (10) to move and a punching frame (47) for punching the jumper frame (10) to obtain a jumper; and a solder box (13) and a solder box (26) are also arranged in sequence at the output end of the punching frame (47).

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