Audio data processing device for sound card system

Abstract

The invention discloses an audio data processing device for a sound card system, and relates to the technical field of audio data processing device.The audio data processing device for the sound card system comprises a case, an auxiliary plate I is installed in the case, and an electronic element for processing audio data is installed on the upper surface of the auxiliary plate I; one side of the auxiliary plate I is fixedly connected with an auxiliary plate II, and the upper surface of the auxiliary plate I is fixedly connected with a plurality of connecting blocks. According to the device, the interior of the audio data processing device can be fully cooled, the cooling efficiency is improved, the normal operation temperature of internal electronic elements is kept, and performance reduction or automatic frequency reduction caused by overheating is avoided; therefore, stable audio processing capacity is kept, system faults or audio output interruption caused by connection problems are reduced, stable transmission of audio signals is ensured, noise and interference in signal transmission caused by poor contact in the using process due to looseness of a connecting line are avoided, and audio quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of audio data processing devices, and in particular to an audio data processing device for a sound card system. Background Art

[0002] Audio data processing devices refer to electronic devices used to process audio signals. They can record, edit, convert, enhance, reduce noise, mix and play sounds. These devices are widely used in broadcasting, television, music production, speech recognition, communications and consumer electronics.

[0003] The audio data processing device is mainly composed of input / output interfaces, digital signal processors (DSPs), analog-to-digital converters (ADCs), digital-to-analog converters (DACs), memories, central processing units (CPUs), and other components. These components work together to realize the functions of audio signal acquisition, processing, storage, and playback, providing users with a high-quality audio experience.

[0004] The existing audio data processing device may have the following problems during use:

[0005] When an audio data processing device processes audio signals, its internal electronic components, such as the digital signal processor (DSP), digital-to-analog converter (DAC), and digital signal processor (DSP), consume electrical energy during signal processing and data conversion, and convert part of the electrical energy into heat energy, which in turn causes heating within the audio data processing device. Furthermore, when performing digital signal processing operations on large amounts of audio data, such as filtering, compression, and decoding, the workload of the electronic components within the audio data processing device increases, thereby generating more heat. If the heat is not dissipated promptly and effectively, this heat will cause the temperature of the audio data processing device to rise. High temperatures can affect the performance and stability of the electronic components, resulting in reduced audio processing quality, increased noise, output interruptions, and other factors, affecting the quality of the processed audio. Long-term operation in a high-temperature environment will accelerate the aging and damage of electronic components, increase the risk of hardware failure, and in severe cases, damage the device and shorten its service life. Furthermore, excessively high temperatures can cause electronic components to short-circuit and other faults, thereby increasing the risk of fire.

[0006] In addition, when the audio data processing device is frequently plugged and unplugged and connected to a computer or other device, wear and tear will occur on the connection holes. Such wear and tear will cause unstable connection between the connecting cable and the device, which will affect the input or output of the audio signal, causing intermittent disconnection or signal loss in the processed audio product, affecting the audio quality. Loose connections will also introduce additional electromagnetic interference, resulting in hum or noise in the audio output. At the same time, when the connecting cable is loose, the user needs to frequently check and adjust the connection to ensure the normal operation of the device, which increases the inconvenience for the user.

[0007] Therefore, the present invention proposes an audio data processing device for a sound card system to remedy and improve the deficiencies of the prior art. Summary of the Invention

[0008] (1) Technical problems solved

[0009] In view of the deficiencies in the prior art, the present invention provides an audio data processing device for a sound card system, which solves the problems raised in the above background technology.

[0010] (2) Technical solution

[0011] To achieve the above objectives, the present invention is implemented through the following technical solutions: An audio data processing device for a sound card system includes a chassis, an auxiliary board 1 is installed inside the chassis, and electronic components for processing audio data are installed on the upper surface of the auxiliary board 1, an auxiliary board 2 is fixedly connected to one side of the auxiliary board 1, and a plurality of connecting blocks are fixedly connected to the upper surface of the auxiliary board 1, and the side of the connecting blocks close to the auxiliary board 1 passes through the auxiliary board 2 and extends to the outside of the chassis, and the side of the connecting blocks extending to the outside of the chassis is provided with connecting holes, and the side of the auxiliary board 1 close to the connecting block with the connecting hole is rotatably connected to a swivel, the number of the swivels is the same as the number of the connecting blocks, and the connecting holes provided on the surfaces of the swivel and the connecting block are located on the same horizontal cross-section, the interior of the swivel is fixedly connected to a fixing ring, the outer surface of the fixing ring is evenly provided with threads, the internal thread of the swivel is connected to the auxiliary ring, and the side of the auxiliary ring close to the threads is set as an inclined surface.

[0012] Preferably, a soft pad is fixedly connected to the surface of the teeth away from the swivel.

[0013] Preferably, a silicone pad is provided at the connection between the auxiliary board 2 and the chassis, and the auxiliary board 2 is fixedly connected to the chassis through the silicone pad.

[0014] Preferably, a heat dissipation device is installed inside the chassis, the top of the heat dissipation device passes through the chassis and extends to the top of the chassis, a liquid inlet is provided on one side of the heat dissipation device, a liquid inlet channel, a connecting channel and a liquid outlet channel are respectively provided inside the heat dissipation device, a liquid outlet is provided on one side of the heat dissipation device, the liquid inlet channel is located near the liquid inlet, the liquid outlet channel is located near the liquid outlet, the liquid inlet channel and the liquid outlet channel are connected to each other at one end away from the liquid inlet and the liquid inlet channel through a connecting channel, and the side walls of the heat dissipation device where the liquid inlet channel and the liquid outlet channel are provided are parallel to the manifold.

[0015] Preferably, the interior of the liquid inlet flow channel and the liquid outlet flow channel are fixedly connected with diverter plates, the spacing between adjacent diverter plates is the same, the interior of the connecting flow channel is evenly fixedly connected with spoiler columns, and the spoiler columns near the liquid inlet flow channel are inclined in the opposite direction to the spoiler columns near the liquid outlet flow channel.

[0016] Preferably, the heat dissipation device extends to the upper part of the chassis and is fixedly connected to a heat dissipation plate, and the upper surface of the heat dissipation plate is arranged to be arc-shaped.

[0017] Preferably, the lower surface of the auxiliary plate 1 is evenly fixedly connected with an auxiliary pad 1, the inner wall of the chassis and the side close to the auxiliary pad 1 are evenly fixedly connected with an auxiliary pad 2, the auxiliary pad 2 and the auxiliary pad 1 are located on the same vertical section, the lower surface of the auxiliary pad 1 is fixedly connected with a fixing rod 1, the upper surface of the auxiliary pad 2 is fixedly connected with a fixing rod 2, the outer surface of the fixing rod 1 is slidably connected with a sleeve 1, the outer surface of the fixing rod 2 is slidably connected with a sleeve 2, the sleeve 1 and the sleeve 2 are slidably connected, and magnetic blocks are provided inside the sleeve 1 and the sleeve 2.

[0018] Preferably, four magnetic blocks are provided and are arranged in polar directions with the same poles facing each other. The magnetic blocks are respectively the first magnet, the second magnet, the third magnet and the fourth magnet from top to bottom, and the surfaces of the first magnet and the fourth magnet are penetrated with through holes. The first fixing rod is slidably connected to the first magnet through the through hole opened on the surface of the first magnet, and the second fixing rod is slidably connected to the fourth magnet through the through hole opened on the surface of the fourth magnet. The first fixing rod is fixedly connected to the second magnet, and the second fixing rod is fixedly connected to the fourth magnet.

[0019] (3) Beneficial effects

[0020] The audio data processing device for a sound card system provided by the present invention has the following beneficial effects:

[0021] 1. By setting the spacing between adjacent manifolds to be the same and setting spoiler columns inside the connecting flow channel, the spoiler columns prevent the coolant flowing into the connecting flow channel from flowing back when in use. The same spacing between the manifolds can enable the coolant inside the heat sink to flow evenly in each area. The evenly flowing coolant can effectively take away the heat at different positions and achieve balanced cooling, so that the entire heat sink can fully dissipate heat inside the chassis, improve the heat dissipation efficiency, maintain the normal operating temperature of the electronic components inside the chassis, reduce the aging and damage of the electronic components caused by high temperature, ensure that the audio data processing device works within the appropriate temperature range, avoid performance degradation or automatic frequency reduction due to overheating, and thus maintain stable sound. Frequency processing capability can also avoid unstable system operation caused by poor heat dissipation, audio output interruption, increased noise and other problems, thereby improving system reliability. The heat dissipation device extends to the upper surface of the heat sink arranged above the chassis, and the upper surface is arranged in an arc shape. Compared with the flat surface, the arc-shaped heat sink surface can increase the heat dissipation surface area of the heat dissipation device, better dissipate heat, thereby improving the heat dissipation efficiency, and helping to reduce the temperature inside the chassis more quickly. Moreover, since the heat sink is located outside the chassis, it is more convenient to clean the dust on the surface of the heat sink, which can avoid the deterioration of the heat dissipation effect due to excessive dust on the surface of the heat sink, ensure that the heat sink has good heat conduction, and reduce the influence of dust on the heat dissipation efficiency of the heat sink.

[0022] 2. By providing a swivel at the connection hole opened in the connection block, when in use, the user inserts the connecting cable into the connection hole and then rotates the auxiliary ring. The inclined surface of the auxiliary ring close to the fixed ring squeezes the fixed ring to fix the connecting cable, which can improve the reliability of the entire sound card system and reduce system failures or audio output interruptions caused by connection problems. It can also prevent loose connections caused by accidental pulling or device movement, ensure stable transmission of audio signals, avoid poor contact caused by loose connecting cables during use, and cause noise and interference in signal transmission, reduce such noise and interference, and improve audio quality. In addition, since the swivel is rotatably connected to the connection hole opened in the connection block, the connecting cable can be rotated after being inserted into the connection hole and fixed. The ability of the connecting cable to rotate can provide a certain degree of flexibility, allowing the user to adjust the position or direction of the device without affecting the stability of the connection. It can also reduce the stress on the connecting cable caused by device movement or adjustment, and prevent the connecting cable from being damaged by excessive bending or pulling.

[0023] 3. By setting multiple magnetic blocks inside sleeve 1 and sleeve 2, and arranging the magnetic blocks with the same poles facing each other, when in use, the repulsive force between the same poles between the multiple magnetic blocks enables the auxiliary board 1 to be suspended inside the chassis, preventing the vibration generated by the chassis from being transmitted to the electronic components arranged above the auxiliary board 1 through the auxiliary board 1, thereby effectively reducing the relative vibration between the chassis and the auxiliary board 1, effectively absorbing and isolating the mechanical vibration generated by the operation of the equipment, reducing the impact of the vibration on the electronic components above the auxiliary board 1, and thus reducing the interference of the vibration caused by the external environment on the audio data processing device in processing audio signals. It effectively reduces the impact of vibration on audio processing, improves the stability of the audio data processing device, and thus improves the clarity and purity of the processed audio. In addition, the auxiliary board 2 is fixedly connected to the chassis through a silicone pad. The silicone pad serves as a support point between the chassis and the auxiliary board 2 to absorb and isolate vibration, reducing the interference transmitted to the electronic components above the auxiliary board 1 through the auxiliary board 2 when the chassis vibrates. This helps to improve the quality of the audio signal, reduce background noise and interference, and make the audio output clearer and more accurate. At the same time, it can also protect the electronic components above the auxiliary board 1 from physical shock and vibration, thereby extending the service life of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the cross-section structure of the main body of the present invention;

[0026] Figure 3 This is a schematic diagram of the cross-section structure of the rotating ring and the auxiliary ring of the present invention;

[0027] Figure 4 For the present invention Figure 3 Schematic diagram of the enlarged structure of A;

[0028] Figure 5 This is a schematic diagram of a cutaway top view of the three-dimensional structure of the heat dissipation device of the present invention;

[0029] Figure 6 This is a schematic diagram of a cutaway front perspective structure of the heat dissipation device of the present invention;

[0030] Figure 7 This is a schematic diagram of a partial cross-section structure of the chassis of the present invention;

[0031] Figure 8 For the present invention Figure 7 Schematic diagram of the enlarged structure of B.

[0032] The numbers in the figure represent:

[0033] 1. Chassis; 2. Auxiliary board 1; 3. Auxiliary board 2; 4. Connecting block; 5. Swivel; 6. Fixing ring; 7. Threaded joint; 8. Auxiliary ring; 9. Silicone pad; 10. Heat dissipation device; 11. Liquid inlet; 12. Liquid inlet channel; 13. Connecting channel; 14. Liquid outlet channel; 15. Liquid outlet; 16. Diverter plate; 17. Spoiler column; 18. Heat dissipation plate; 19. Auxiliary pad 1; 20. Auxiliary pad 2; 21. Fixing rod 1; 22. Fixing rod 2; 23. Sleeve 1; 24. Sleeve 2; 25. Magnetic block. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] refer to Figures 1 to 8 According to a preferred embodiment of the present invention, an audio data processing device for a sound card system will be described in detail below. An audio data processing device for a sound card system includes a chassis 1, an auxiliary board 2 is installed inside the chassis 1, and electronic components for processing audio data are installed on the upper surface of the auxiliary board 2. Auxiliary board 2 3 is fixedly connected to one side of the auxiliary board 2, and a plurality of connecting blocks 4 are fixedly connected to the upper surface of the auxiliary board 2. The side of the connecting block 4 close to the auxiliary board 2 passes through the auxiliary board 2 3 and extends to the outside of the chassis 1. The side of the connecting block 4 extending to the outside of the chassis 1 is provided with a connecting hole. A swivel 5 is rotatably connected to the side of the auxiliary board 2 close to the connecting block 4 where the connecting hole is provided. The number of swivels 5 is the same as the number of connecting blocks 4. The connecting holes provided on the surfaces of the swivel 5 and the connecting block 4 are all located on the same horizontal cross-section. A fixing ring 6 is fixedly connected to the inside of the swivel 5. The outer surface of the fixing ring 6 is evenly provided with a threaded groove 7. The internal thread of the swivel 5 is connected to an auxiliary ring 8, and the side of the auxiliary ring 8 close to the fixing ring 6 is set as an inclined surface.

[0036] A rubber pad is fixedly connected to the surface of the side of the thread mouth 7 away from the swivel 5 to prevent the thread mouth 7 from causing significant wear on the surface of the connecting wire when the connecting wire is fixed.

[0037] A silicone pad 9 is provided at the connection between the auxiliary board 2 3 and the chassis 1 , and the auxiliary board 2 3 is fixedly connected to the chassis 1 through the silicone pad 9 .

[0038] A heat sink 10 is installed inside the chassis 1. The top of the heat sink 10 passes through the chassis 1 and extends to the top of the chassis 1. A liquid inlet 11 is provided on one side of the heat sink 10. A liquid inlet channel 12, a connecting channel 13 and a liquid outlet channel 14 are respectively provided inside the heat sink 10. A liquid outlet 15 is provided on one side of the heat sink 10. A temperature sensor is provided inside the chassis 1. The temperature sensor transports the coolant through the liquid inlet 11 to the inside of the heat sink 10 through the control device, and the coolant flows through the liquid inlet channel 12, the connecting channel 13 and the liquid outlet channel 14 and then flows out from the liquid outlet 15. The liquid inlet channel 12 is located near the liquid inlet 11, and the liquid outlet channel 14 is located near the liquid outlet 15. The ends of the liquid inlet channel 12 and the liquid outlet channel 14 away from the liquid inlet 11 and the liquid inlet channel 12 are connected by the connecting channel 13. The side walls of the heat sink 10 where the liquid inlet channel 12 and the liquid outlet channel 14 are opened are parallel to the diverter plate 16.

[0039] The inside of the liquid inlet channel 12 and the liquid outlet channel 14 are both fixedly connected with diverter plates 16, and the spacing between adjacent diverter plates 16 is the same. The inside of the connecting channel 13 is evenly fixedly connected with spoiler columns 17, and the spoiler columns 17 near the liquid inlet channel 12 are inclined in the opposite direction to the spoiler columns 17 near the liquid outlet channel 14.

[0040] The heat dissipation device 10 extends to the upper part of the chassis 1 and is fixedly connected to a heat dissipation plate 18 , and the upper surface of the heat dissipation plate 18 is configured to be arc-shaped.

[0041] The lower surface of the auxiliary plate 12 is evenly fixedly connected with an auxiliary pad 19, and the inner wall of the chassis 1 and the side close to the auxiliary pad 19 are evenly fixedly connected with an auxiliary pad 20. The auxiliary pad 20 and the auxiliary pad 19 are located on the same vertical section. The auxiliary pad 20 and the auxiliary pad 19 are both made of silicone material to absorb and isolate vibration, and reduce the interference of the chassis 1 to the electronic components above the auxiliary plate 2 through the auxiliary plate 23 when the chassis 1 vibrates. The lower surface of the auxiliary pad 19 is fixedly connected with a fixing rod 1 21, and the upper surface of the auxiliary pad 20 is fixedly connected with a fixing rod 2 22. The outer surface of the fixing rod 21 is slidably connected with a sleeve 1 23, and the outer surface of the fixing rod 2 22 is slidably connected with a sleeve 24. The sleeve 1 23 and the sleeve 2 24 are slidably connected, and magnetic blocks 25 are provided inside the sleeve 1 23 and the sleeve 2 24.

[0042] Four magnetic blocks 25 are provided and arranged with like poles facing each other. When in use, the repulsive force between the like poles of the multiple magnetic blocks 25 allows the auxiliary board 2 to be suspended inside the chassis 1, thereby effectively reducing the relative vibration between the chassis 1 and the auxiliary board 2, effectively absorbing and isolating the mechanical vibration generated by the operation of the equipment, reducing the impact of vibration on the electronic components above the auxiliary board 2, and further reducing the interference of vibration caused by the external environment on the audio signal processing of the audio data processing device, effectively reducing the impact of vibration on audio processing, improving the stability of the audio data processing device, and thus improving the clarity and purity of the processed audio;

[0043] The magnetic block 25 is composed of a first magnet, a second magnet, a third magnet, and a fourth magnet from top to bottom, and the surfaces of the first magnet and the fourth magnet are penetrated by through holes. The fixing rod 1 21 is slidably connected to the first magnet through the through hole opened on the surface of the first magnet, and the fixing rod 2 22 is slidably connected to the fourth magnet through the through hole opened on the surface of the fourth magnet. The fixing rod 1 21 is fixedly connected to the second magnet, and the fixing rod 2 22 is fixedly connected to the fourth magnet.

[0044] The following is the entire working process and working principle of the above embodiment:

[0045] During use, first, the user plugs the connecting wire into the connecting hole opened in the connecting block 4, and then the user rotates the auxiliary ring 8 corresponding to the inner portion of the rotating ring 5 clockwise. The auxiliary ring 8 moves toward the auxiliary plate 2 3 during rotation. Since the side of the auxiliary ring 8 close to the fixing ring 6 is provided with an inclined surface, when the auxiliary ring 8 moves toward the auxiliary plate 2 3, the inclined surface of the auxiliary ring 8 squeezes the fixing ring 6 to fix the connecting wire plugged into the connecting hole. By fixing the connecting wire, the reliability of the entire sound card system can be improved, and system failures or audio output interruptions caused by connection problems can be reduced. It can also prevent the connection from becoming loose due to accidental pulling or device movement, thereby ensuring stable transmission of the audio signal and avoiding poor contact caused by loose connecting wires during use, which leads to noise and interference in signal transmission. This reduces such noise and interference and improves audio quality.

[0046] Furthermore, since the swivel 5 is rotatably connected to the connection hole opened in the connection block 4, the connection line can also be rotated after being inserted into the connection hole and fixed. The connection line can be rotated, which can provide a certain degree of flexibility, allowing the user to adjust the position or direction of the device without affecting the stability of the connection. It can also reduce the stress on the connection line caused by the movement or adjustment of the device, and prevent the connection line from being damaged due to excessive bending or pulling.

[0047] Next, the user inputs an audio signal and sets processing parameters. The audio data processing device then processes the input audio signal in real time according to the parameters set by the user and outputs the processed audio signal. The audio data processing device consumes electrical energy during signal processing and data conversion, and converts part of the electrical energy into heat energy, which causes heating inside the audio data processing device. When the sensor inside the chassis 1 detects that the temperature inside the chassis 1 is higher than the preset value, the sensor uses the control device to transport the coolant through the liquid inlet 11 to the liquid inlet channel 12 inside the heat sink 10, and then connects the flow channel 13 through the connection between the liquid inlet channel 12 and the liquid outlet channel 14, flows to the inside of the liquid outlet channel 14, and then flows to the outside of the heat sink 10 through the liquid outlet 15. Since the same spacing of the diverter plates 16 are provided inside the liquid inlet channel 12 and the liquid outlet channel 14, the coolant can be evenly distributed in each area inside the liquid inlet channel 12 and the liquid outlet channel 14. The coolant flows evenly, and the evenly flowing coolant can effectively take away the heat from different positions, achieve balanced cooling, and enable the entire heat dissipation device 10 to fully dissipate heat inside the chassis 1, thereby improving the heat dissipation efficiency, maintaining the normal operating temperature of the electronic components inside the chassis 1, reducing the aging and damage of the electronic components caused by high temperature, ensuring that the audio data processing device operates within an appropriate temperature range, avoiding performance degradation or automatic frequency reduction due to overheating, thereby maintaining stable audio processing capabilities, and also avoiding unstable system operation caused by poor heat dissipation, audio output interruption, increased noise and other problems, thereby improving the reliability of the system. In addition, since a spoiler column 17 is provided inside the connecting flow channel 13, and the spoiler column 17 near the liquid inlet flow channel 12 is inclined in the opposite direction to the spoiler column 17 near the liquid outlet flow channel 14, it is possible to avoid the coolant flowing to the connecting flow channel 13 from flowing back to the liquid inlet flow channel 12 again, resulting in poor heat dissipation effect.

[0048] Furthermore, since the heat dissipation device 10 extends to the upper surface of the heat dissipation plate 18 arranged above the chassis 1 and is arranged in an arc shape, when in use, the arc-shaped heat dissipation plate 18 surface can increase the heat dissipation surface area of the heat dissipation device 10 compared to the flat surface, better dissipate heat, thereby improving the heat dissipation efficiency, and helping to reduce the temperature inside the chassis 1 more quickly. Moreover, since the heat dissipation plate 18 is located outside the chassis 1, it is more convenient to clean the dust on the surface of the heat dissipation plate 18, and the deterioration of the heat dissipation effect caused by excessive dust on the surface of the heat dissipation plate 18 can be avoided, thereby ensuring that the heat dissipation plate 18 has good heat conduction and reducing the influence of dust on the heat dissipation efficiency of the heat dissipation plate 18.

[0049] Finally, when the audio data processing device is processing the audio signal, the chassis 1 will be affected by the surrounding environment and vibrate. The vibration generated by the chassis 1 can be transmitted to the fixed rod 22 and the sleeve 2 24 through the auxiliary pad 20. Since the sleeve 24 and the sleeve 1 23 are both provided with multiple magnetic blocks 25 inside, and the magnetic blocks 25 are arranged in polar directions with the same poles facing each other, the repulsive force between the multiple magnetic blocks 25 with the same poles causes the fixed rod 1 21 connected to the upper magnetic block 25 to support the auxiliary plate 1 2 upward through the auxiliary pad 19, thereby allowing the auxiliary plate 1 2 to float. Inside the chassis 1, the vibration generated by the chassis 1 is prevented from being transmitted through the auxiliary board 2 to the electronic components arranged above the auxiliary board 2, thereby effectively reducing the relative vibration between the chassis 1 and the auxiliary board 2, effectively absorbing and isolating the mechanical vibration generated by the operation of the equipment, reducing the impact of the vibration on the electronic components above the auxiliary board 2, and further reducing the interference of the vibration caused by the external environment on the audio data processing device in processing audio signals, effectively reducing the impact of vibration on audio processing, improving the stability of the audio data processing device, and thus improving the clarity and purity of the processed audio;

[0050] Furthermore, the auxiliary board 2 3 is fixedly connected to the chassis 1 through the silicone pad 9. The silicone pad 9 serves as a support point between the chassis 1 and the auxiliary board 2 3 to absorb and isolate vibrations, thereby reducing the interference transmitted to the electronic components above the auxiliary board 1 2 through the auxiliary board 2 3 when the chassis 1 vibrates. This helps to improve the quality of the audio signal, reduce background noise and interference, and make the audio output clearer and more accurate. At the same time, it can also protect the electronic components above the auxiliary board 2 from physical shock and vibration, thereby extending the service life of the equipment.

[0051] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An audio data processing device for a sound card system, comprising a chassis (1), wherein an auxiliary board (2) is installed inside the chassis (1), and electronic components for processing audio data are installed on the upper surface of the auxiliary board (2), and one side of the auxiliary board (2) is fixedly connected to the auxiliary board (3), and the upper surface of the auxiliary board (2) is fixedly connected to a plurality of connecting blocks (4), and the side of the connecting blocks (4) close to the auxiliary board (2) passes through the auxiliary board (3) and extends to the outside of the chassis (1), and the surface of the side of the connecting blocks (4) extending to the outside of the chassis (1) is provided with a connecting hole, characterized in that: The auxiliary plate (2) is rotatably connected to a swivel (5) on one side of the surface near the connection hole of the connection block (4). The number of the swivels (5) is the same as the number of the connection blocks (4). The connection holes opened on the surfaces of the swivel (5) and the connection block (4) are located on the same horizontal section. The interior of the swivel (5) is fixedly connected to a fixing ring (6). The outer surface of the fixing ring (6) is evenly provided with teeth (7). The interior of the swivel (5) is threadedly connected to an auxiliary ring (8). The side of the auxiliary ring (8) close to the teeth (7) is set as an inclined surface.

2. The audio data processing device for a sound card system according to claim 1, wherein: A soft pad is fixedly connected to the surface of the tooth opening (7) on one side away from the rotating ring (5).

3. The audio data processing device for a sound card system according to claim 1, wherein: A silica gel pad (9) is provided at the connection between the auxiliary plate 2 (3) and the chassis (1), and the auxiliary plate 2 (3) is fixedly connected to the chassis (1) via the silica gel pad (9).

4. The audio data processing device for a sound card system according to claim 1, wherein: A heat sink (10) is installed inside the chassis (1), the top of the heat sink (10) passes through the chassis (1) and extends to the top of the chassis (1), a liquid inlet (11) is provided on one side of the heat sink (10), a liquid inlet channel (12), a connecting channel (13) and a liquid outlet channel (14) are provided inside the heat sink (10), a liquid outlet (15) is provided on one side of the heat sink (10), the liquid inlet channel (12) is located near the liquid inlet (11), the liquid outlet channel (14) is located near the liquid outlet (15), the liquid inlet channel (12) and the liquid outlet channel (14) are connected at one end away from the liquid inlet (11) and the liquid inlet channel (12) through the connecting channel (13), and the side walls of the heat sink (10) where the liquid inlet channel (12) and the liquid outlet channel (14) are provided are parallel to the diverter plate (16).

5. The audio data processing device for a sound card system according to claim 4, wherein: The interiors of the liquid inlet flow channel (12) and the liquid outlet flow channel (14) are both fixedly connected with diverter plates (16), and the spacing between adjacent diverter plates (16) is the same. The interior of the communicating flow channel (13) is evenly fixedly connected with flow spoiler columns (17), and the flow spoiler columns (17) near the liquid inlet flow channel (12) and the flow spoiler columns (17) near the liquid outlet flow channel (14) are inclined in opposite directions.

6. The audio data processing device for a sound card system according to claim 4, wherein: The heat dissipation device (10) extends to the upper part of the chassis (1) and is fixedly connected to a heat dissipation plate (18), and the upper surface of the heat dissipation plate (18) is arranged to be arc-shaped.

7. The audio data processing device for a sound card system according to claim 1, wherein: The lower surface of the auxiliary plate 1 (2) is evenly fixedly connected with an auxiliary pad 1 (19), and the inner wall of the chassis (1) and the side close to the auxiliary pad 1 (19) are evenly fixedly connected with an auxiliary pad 2 (20), the auxiliary pad 2 (20) and the auxiliary pad 1 (19) are located in the same vertical section, the lower surface of the auxiliary pad 1 (19) is fixedly connected with a fixing rod 1 (21), the upper surface of the auxiliary pad 2 (20) is fixedly connected with a fixing rod 2 (22), the outer surface of the fixing rod 1 (21) is slidably connected with a sleeve 1 (23), the outer surface of the fixing rod 2 (22) is slidably connected with a sleeve 2 (24), the sleeve 1 (23) and the sleeve 2 (24) are slidably connected, and the interiors of the sleeve 1 (23) and the sleeve 2 (24) are both provided with magnetic blocks (25).

8. The audio data processing device for a sound card system according to claim 7, wherein: Four magnetic blocks (25) are provided and arranged in polar directions with the same poles facing each other. The magnetic blocks (25) are respectively a first magnet, a second magnet, a third magnet and a fourth magnet from top to bottom, and the surfaces of the first magnet and the fourth magnet are penetrated with through holes. The first fixing rod (21) is slidably connected to the first magnet through the through hole opened on the surface of the first magnet, and the second fixing rod (22) is slidably connected to the fourth magnet through the through hole opened on the surface of the fourth magnet. The first fixing rod (21) is fixedly connected to the second magnet, and the second fixing rod (22) is fixedly connected to the fourth magnet.

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