Display module, bonding effect detection method and display device

Abstract

The invention provides a display module, a bonding effect detection method and a display device, and relates to the technical field of display equipment. The display module comprises a display panel and a circuit board, the display panel comprises a display area, a frame area and a bonding area, the frame area surrounds at least part of the display area, the bonding area is located on the side, away from the display area, of the frame area, the display panel further comprises a first conductive part and at least one mark, the first conductive part is located in the bonding area, and the at least one mark is located in the frame area; the circuit board comprises a second conductive part and a covering film, the second conductive part is located on one side of the first conductive part, and the covering film is located on one side, deviating from the first conductive part, of the second conductive part; the cover film includes an opaque film layer. The mark is arranged in the frame area, the actual distance between the mark and the cover film is detected, and the actual distance is compared with the preset distance threshold value, so that the purpose of detecting the bonding effect of the first conductive part of the display panel and the second conductive part of the circuit board under the condition that the cover film is lightproof is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display module, a bonding effect detection method, and a display device. Background Art

[0002] In recent years, organic light-emitting display modules have gradually become the mainstream products in the display field. Due to their advantages such as high image quality, power saving, thin body and wide range of applications, they are widely used in various consumer electronic products such as mobile phones, TVs, laptops, desktop computers, etc.

[0003] However, in current display modules, there is a problem of being unable to detect the bonding effect between the display panel and the circuit board. Summary of the Invention

[0004] The embodiments of the present application provide a display module, a bonding effect detection method, and a display device, which are intended to detect the bonding effect of a display panel and a circuit board.

[0005] An embodiment of the first aspect of the present application provides a display module, which includes a display panel and a circuit board. The display panel includes a display area, a frame area and a bonding area. The frame area surrounds at least a portion of the display area, and the bonding area is located on a side of the frame area away from the display area. The display panel also includes a first conductive portion and at least one mark. The first conductive portion is located in the bonding area, and the at least one mark is located in the frame area; the circuit board includes a second conductive portion and a covering film, the second conductive portion is located on one side of the first conductive portion, and the covering film is located on a side of the second conductive portion away from the first conductive portion; wherein the covering film includes an opaque film layer.

[0006] According to an embodiment of the first aspect of the present application, the at least one mark includes a first mark and a second mark, and the first mark and the second mark are located on opposite sides of the first conductive portion.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the minimum distance between at least one mark and the display area is greater than the minimum distance between at least one mark and the bonding area.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the first conductive portion includes a plurality of first sub-portions spaced apart along the first direction, and the first mark and the second mark are located on both sides of the first conductive portion in the first direction.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the minimum distance between the first mark and the first conductive portion is equal to the minimum distance between the second mark and the first conductive portion.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a polarizer, which is located on the display side of the display panel, and covers the display area and part of the border area. The orthographic projection of at least one mark on the reference plane does not overlap with the orthographic projection of the polarizer on the reference plane, and the reference plane is parallel to the display surface of the display panel.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of at least one mark on the reference plane is located on the side of the orthographic projection of the polarizer on the reference plane facing the bonding area.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the circuit board further includes a first metal layer, the first metal layer and the covering film are arranged in the same layer with an interval, and the circuit board further includes a bending area, and the interval area between the first metal layer and the covering film covers at least part of the bending area.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the circuit board also includes a substrate layer, the substrate layer is located between the first metal layer and the second conductive part, the first metal layer includes a plurality of first wires, the substrate layer has a plurality of conductive vias, and each first wire and the second conductive part are connected through the plurality of conductive vias.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, a support layer is provided on the surface of the substrate layer facing the second conductive portion.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the support layer includes a metal material, the support layer includes a clearance hole set through it, the second conductive part is located in the clearance hole and is in contact with the substrate layer, and the second conductive part is insulated from the support layer.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, the support layer includes a first sublayer and a second sublayer that are stacked.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the relief hole is connected to the conductive via.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, at least one mark and the first conductive portion are provided in the same layer;

[0019] And / or, an orthographic projection of the first conductive portion on the reference plane at least partially overlaps with an orthographic projection of the second conductive portion on the reference plane, and the reference plane is parallel to the display surface of the display panel.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the circuit board further includes a protective layer, which is located on a side of the cover film away from the second conductive portion.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the opaque film layer includes a metal layer.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the opaque film layer includes a copper layer or an aluminum layer.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the mark includes a cross-shaped mark.

[0024] An embodiment of a second aspect of the present application provides a bonding effect detection method for detecting the bonding effect of the display panel and the circuit board provided in any of the above embodiments. The detection method includes:

[0025] Determine the actual distance between the edge of the cover film closest to the mark and the mark;

[0026] The actual distance is compared with the preset distance threshold. If the actual distance is within the preset distance threshold, the bonding effect is determined to be qualified; if the actual distance is outside the preset distance threshold, the bonding effect is determined to be unqualified.

[0027] According to an embodiment of the second aspect of the present application, the at least one mark includes a first mark and a second mark, the first mark and the second mark are located on both sides of the first conductive portion in the first direction, and the minimum distance between the first mark and the first conductive portion is equal to the minimum distance between the second mark and the first conductive portion;

[0028] The actual distance includes a first actual distance between an edge of the cover film close to the mark and the first mark, and a second actual distance between an edge of the cover film close to the mark and the second mark.

[0029] According to an embodiment of the second aspect of the present application, in the step of comparing the actual distance with a preset distance threshold, determining that the bonding effect is qualified if the actual distance is within the preset distance threshold; and determining that the bonding effect is unqualified if the actual distance is outside the preset distance threshold:

[0030] Compare the actual difference between the first actual distance and the second actual distance with the preset distance threshold. If the actual difference is within the preset distance threshold, the bonding effect is determined to be qualified; if the actual difference is outside the preset distance threshold, the bonding effect is determined to be unqualified.

[0031] According to an embodiment of the second aspect of the present application, before determining the actual distance between the edge of the cover film close to the mark and the mark, the detection method further includes:

[0032] Obtain the detection images corresponding to the border area and the bonding area;

[0033] The actual distance between the edge of the cover film close to the mark and the mark is determined, including:

[0034] The edge of the cover film close to the mark and the mark in the detection image are measured to generate an actual distance between the edge of the cover film close to the mark and the mark.

[0035] An embodiment of the third aspect of the present application provides a display device, which includes the display module provided by any of the above embodiments.

[0036] In the display module provided in the embodiment of the present application, the display module includes a display panel and a circuit board. The display panel includes a display area, a frame area, and a bonding area. The frame area surrounds at least a portion of the display area. The bonding area is located on the side of the frame area away from the display area. The display panel also includes a first conductive portion and at least one mark. The first conductive portion is located in the bonding area, and the at least one mark is located in the frame area. The circuit board includes a second conductive portion and a covering film. The second conductive portion is located on one side of the first conductive portion, and the covering film is located on the side of the second conductive portion away from the first conductive portion. The covering film includes an opaque film layer. The present application achieves the purpose of detecting the bonding effect of the first conductive portion of the display panel and the second conductive portion of the circuit board when the covering film is opaque by providing at least one mark in the frame area and detecting the actual distance between the mark and the covering film (opaque). The actual distance is compared with a preset distance threshold. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0038] Figure 1a FIG. 1 is a schematic structural diagram of a display module provided in one embodiment of the present application.

[0039] Figure 1b Shown along Figure 1a Schematic diagram of the cross-sectional structure of the P1-P2 line.

[0040] Figure 2 FIG2 is a schematic structural diagram of a display module provided in another embodiment of the present application.

[0041] Figure 3 FIG2 is a schematic structural diagram of a display module provided in another embodiment of the present application.

[0042] Figure 4 Shown along Figure 2 Schematic diagram of the cross-sectional structure of line N1-N2.

[0043] Figure 5 Shown along Figure 2 Schematic diagram of the cross-sectional structure of line N3-N4.

[0044] Figure 6 Shown along Figure 2Another cross-sectional structural diagram of the N3-N4 line.

[0045] Figure 7 FIG2 is a flow chart of a bonding effect detection method provided in an embodiment of the present application.

[0046] Figure 8 FIG2 is a flow chart of a bonding effect detection method provided in another embodiment of the present application.

[0047] Figure 9 FIG2 is a schematic structural diagram of a display device provided in one embodiment of the present application.

[0048] Explanation of the accompanying drawings: display module 100; display panel 110; display area A; frame area B; bonding area C; mark 111; circuit board 120; first conductive portion 112; second conductive portion 121; covering film 122; first mark 1121; second mark 1122; first direction X; polarizer POL; first metal layer M1; bending area D; first sublayer M2; second sublayer M3; substrate layer M4; conductive via K; protective layer 123; display device 10. DETAILED DESCRIPTION

[0049] In display modules provided by related art, the circuit board's cover film is made of a light-transmitting material to facilitate testing the bonding between the display panel's first conductive portion and the circuit board's second conductive portion. However, if the cover film is made of an opaque material, the bonding between the first and second conductive portions cannot be tested.

[0050] In order to solve the above technical problems, an embodiment of the present application provides a display module, which includes a display panel and a circuit board. The display panel includes a display area, a frame area and a bonding area. The frame area surrounds at least part of the display area, and the bonding area is located on the side of the frame area away from the display area. The display panel also includes a first conductive portion and at least one mark. The first conductive portion is located in the bonding area, and the at least one mark is located in the frame area. The circuit board includes a second conductive portion and a covering film. The second conductive portion is located on one side of the first conductive portion, and the covering film is located on the side of the second conductive portion away from the first conductive portion. The covering film includes an opaque film layer. The present application sets at least one mark in the frame area, and can detect the actual distance between the mark and the covering film (opaque), and compare the actual distance with a preset distance threshold, thereby achieving the purpose of detecting the bonding effect of the first conductive portion of the display panel and the second conductive portion of the circuit board under the condition that the covering film is opaque.

[0051] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0052] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0053] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or region, it may mean that it is directly on the other layer or region, or that other layers or regions are included between it and the other layer or region. Furthermore, if the component is turned over, the layer or region will be "below" or "beneath" the other layer or region.

[0054] To solve the above technical problems, embodiments of the present application provide a display module, a bonding effect detection method, and a display device. The following will describe various embodiments of the display module, the bonding effect detection method, and the display device in conjunction with the accompanying drawings.

[0055] In a first aspect, the present application provides a display module. Figure 1a FIG2 is a schematic structural diagram of a display module provided in one embodiment of the present application. Figure 1b Shown along Figure 1a Schematic diagram of the cross-sectional structure of the P1-P2 line. Figure 1a and Figure 1bAs shown, the display module 100 includes a display panel 110 and a circuit board 120. The display panel 110 includes a display area A, a frame area B and a bonding area C. The frame area B surrounds at least a portion of the display area A, and the bonding area C is located on the side of the frame area B away from the display area A. The display panel 110 also includes a first conductive portion 112 and at least one mark 111. The first conductive portion 112 is located in the bonding area C, and the at least one mark 111 is located in the frame area B; the circuit board 120 includes a second conductive portion 121 and a covering film 122. The second conductive portion 121 is located on one side of the first conductive portion 112, and the covering film 122 is located on the side of the second conductive portion 121 away from the first conductive portion 112; wherein the covering film 122 includes an opaque film layer.

[0056] The bonding area C and the frame area B are both non-display areas. The bonding area C may be a non-display area on the display panel covered by the circuit board, and the frame area B is a non-display area not covered by the circuit board.

[0057] It should be noted that in Figure 1a In the embodiment, the second conductive portion 121 covers the first conductive portion 112.

[0058] therefore, Figure 1a The first conductive portion 112 is not directly shown. Optionally, the orthographic projection of the first conductive portion 112 on a reference plane at least partially overlaps with the orthographic projection of the second conductive portion 121 on the reference plane, and the reference plane is parallel to the display surface of the display panel, so that the second conductive portion 121 covers at least a portion of the first conductive portion 112, and the second conductive portion 121 and the first conductive portion 112 are electrically connected.

[0059] The first conductive portion 112 and the second conductive portion 121 may also be referred to as pads, gold fingers, etc., and are used to bond the display panel 110 and the circuit board 120 .

[0060] The present application sets at least one mark 111 in the border area B, and can detect the actual distance between the mark 111 and the covering film 122 (opaque), and compare the actual distance with a preset distance threshold, thereby achieving the purpose of detecting the bonding effect between the first conductive portion 112 of the display panel 110 and the second conductive portion 121 of the circuit board 120 when the covering film 122 is opaque.

[0061] Figure 2 FIG. 1 is a schematic diagram of the structure of a display module provided by another embodiment of the present application. Figure 2 As shown, according to the embodiment of the first aspect of the present application, the at least one mark 111 includes a first mark 1121 and a second mark 1122 , and the first mark 1121 and the second mark 1122 are located on opposite sides of the first conductive portion 112 .

[0062] In the embodiment of the present application, by setting marks on opposite sides of the first conductive part 112, the position of the first conductive part 112 can be more accurately located, thereby improving the accuracy of the detection equipment in identifying whether the first conductive part 112 is correctly bonded to the second conductive part 121.

[0063] The first mark 1121 and the second mark 1122 can serve as reference points to help detect whether the bond between the first conductive portion 112 and the second conductive portion 121 is properly aligned and whether there is any offset, thereby improving the quality and reliability of the bond. Furthermore, the mark design provided in the embodiments of the present application is well-suited for automated inspection systems. Automated visual inspection equipment can easily identify these marks 111 and assess the bonding effect by measuring the distance between the marks 111 and the cover film 122.

[0064] The embodiment of the present application uses the first mark 1121 and the second mark 1122 located on both sides of the first conductive portion 112 respectively to reduce the erroneous judgment caused by the position offset of the single-sided mark 111, thereby improving the robustness and fault tolerance of the entire detection system.

[0065] Optionally, at least one mark 111 is located in the border area B near the bonding area C. That is, the minimum distance between the at least one mark 111 and the display area A is greater than the minimum distance between the at least one mark 111 and the bonding area C.

[0066] The embodiment of the present application improves detection accuracy. The mark 111 is set closer to the bonding area C within the border area B, which can help more accurately locate the position of the first conductive part 112, thereby further improving the accuracy of the detection equipment in identifying whether the first conductive part 112 is correctly bonded to the second conductive part 121. Secondly, the bonding quality is improved. The mark 111 near the bonding area C can serve as a reference point to help detect whether the bond between the first conductive part 112 and the second conductive part 121 is correctly aligned and whether there is any offset, which helps to improve the quality and reliability of the bonding. In addition, by setting the mark 111 near the bonding area C, the error judgment caused by the offset of the mark 111 position is reduced, thereby further improving the robustness and fault tolerance of the entire detection system.

[0067] Optionally, the first conductive portion 112 includes a plurality of first sub-portions spaced apart along the first direction X, and the first mark 1121 and the second mark 1122 are located on both sides of the first conductive portion 112 in the first direction X.

[0068] refer to Figure 2 , the first direction X can be Figure 2In the transverse direction of the view shown, the multiple first sub-parts of the first conductive part 112 are spaced apart in the transverse direction, and the first mark 1121 and the second mark 1122 are located on the left and right sides of the first conductive part 112, thereby reducing the risk of low accuracy caused by the position offset of the single-side mark 111 of the first conductive part 112.

[0069] Optionally, the minimum distance between the first mark 1121 and the first conductive portion 112 is equal to the minimum distance between the second mark 1122 and the first conductive portion 112. The minimum distance between the first mark 1121 and the first conductive portion 112 may be the distance between the first mark 1121 and one of the plurality of first sub-portions close to the first mark 1121, that is, the minimum distance between the first mark 1121 and the first conductive portion 112 may be the distance between the first mark 1121 and the first conductive portion 112. Figure 2 Similarly, the minimum distance between the second mark 1122 and the first conductive portion 112 may be the distance between the second mark 1122 and one of the plurality of first sub-portions close to the second mark 1122, that is, the minimum distance between the second mark 1122 and the first conductive portion 112 may be the distance between the second mark 1122 and the first conductive portion 112. Figure 2 The minimum distance between the first mark 1121 and the first conductive portion 112 is equal to the minimum distance between the second mark 1122 and the first conductive portion 112. It is also possible to determine whether the first conductive portion 112 is correctly bonded to the second conductive portion 121 by determining whether the distances between the cover film 122 and the first mark 1121 and the second mark 1122 are equal. Figure 3 FIG. 1 is a schematic diagram of the structure of a display module provided by another embodiment of the present application. Figure 3 As shown, according to the embodiment of the first aspect of the present application, the display panel 110 further includes a polarizer POL. The polarizer POL is located on a side of the at least one mark 111 facing the display side of the display panel 110. The polarizer POL covers the display area A and a portion of the frame area B. The orthographic projection of the at least one mark 111 on the reference plane and the orthographic projection of the polarizer POL on the reference plane do not overlap. The reference plane is parallel to the display surface of the display panel.

[0070] In the embodiment of the present application, the orthographic projection of at least one mark 111 on the reference plane and the orthographic projection of the polarizer POL on the reference plane do not overlap, that is, at least one mark 111 is not located within the coverage range of the polarizer POL, thereby reducing the impact of the polarizer POL on the detection equipment's grasping and identification of the mark 111.

[0071] In addition, placing at least one mark 111 within the range not covered by the polarizer POL can protect the mark 111 from physical damage, especially during transportation and installation, thereby reducing the risk of the mark 111 being scratched or worn.

[0072] Optionally, the orthographic projection of the at least one mark 111 on the reference surface is located on the side of the orthographic projection of the polarizer POL on the reference surface facing the bonding area C. That is, the orthographic projection of the at least one mark 111 on the reference surface and the bonding area C are located on the same side of the orthographic projection of the polarizer POL on the reference surface.

[0073] The embodiments of the present application improve detection accuracy. The location of the mark 111 near the bonding area C can help more accurately locate the position of the first conductive part 112, thereby further improving the accuracy of the detection equipment in identifying whether the first conductive part 112 is correctly bonded to the second conductive part 121. Secondly, the bonding quality is further improved. The mark 111 near the bonding area C can serve as a reference point to help detect whether the bond between the first conductive part 112 and the second conductive part 121 is correctly aligned and whether there is any offset, which helps to improve the quality and reliability of the bonding. In addition, by positioning the mark 111 near the bonding area C, erroneous judgments caused by the offset of the mark 111 are reduced, thereby further improving the robustness and fault tolerance of the entire detection system.

[0074] Figure 4 Shown along Figure 2 Schematic diagram of the cross-sectional structure of the N1-N2 line. Figure 4 As shown, according to the implementation of the first aspect of the present application, the circuit board 120 also includes a first metal layer M1, and the first metal layer M1 and the covering film 122 are arranged in the same layer and spaced apart. The circuit board 120 also includes a bending area D, and the spacing area between the first metal layer M1 and the covering film 122 covers at least part of the bending area D.

[0075] Optionally, the first metal layer M1 and the cover film 122 are disposed in the same layer. The first metal layer M1 and the cover film 122 can be considered to be physically located in the same layer. For example, the first metal layer M1 and the cover film 122 can both be in contact with and connected to the same surface of the same film layer. Alternatively, the first metal layer M1 and the cover film 122 can be fabricated and formed in the same process step.

[0076] A portion of the circuit board 120 (eg, the first metal layer M1 ) is bent to the non-display side of the display panel 110 through the bending region D, thereby reducing the border width of the display module 100 and facilitating the development of a narrow-border design for the display module 100 .

[0077] In addition, the first metal layer M1 and the cover film 122 are spaced apart, which improves the structural stability of the bending region D and reduces stress concentration that may occur during the bending process, thereby reducing the risk of the bending region D being cracked or damaged.

[0078] Optionally, the circuit board 120 also includes a substrate layer M4, which is located between the first metal layer M1 and the second conductive part 121. The first metal layer M1 includes multiple first wires, and the substrate layer M4 has multiple conductive vias K. Each of the first wires and the second conductive part 121 is connected through multiple conductive vias K.

[0079] When signal connections need to be established between different layers of the circuit board 120, conductive vias K are used to connect metal layers on both sides. For example, when a signal line needs to pass through the substrate layer M4 from one side to the other side of the substrate layer M4, conductive vias K are used to connect the signal lines on both sides of the substrate layer M4.

[0080] Optional, such as Figure 5 and Figure 6 As shown, a support layer is provided on the surface of the substrate layer M4 facing the second conductive portion 121. The support layer is provided to enhance the support capability of the substrate layer M4. There are various ways to provide the support layer, and the material of the support layer can be an insulating material. In this case, the second conductive portion 121 can be provided on the surface of the support layer facing away from the substrate layer M4. A through hole is provided in the support layer that communicates with the conductive via K, thereby connecting the second conductive portion 121 to the first wire via.

[0081] In other optional embodiments, the support layer is made of a metal material and includes a clearance hole extending therethrough. The second conductive portion 121 is located in the clearance hole and is in contact with the substrate layer, thereby improving the problem of short circuit between the second conductive portion 121 and the support layer.

[0082] Optionally, the support layer includes a first sub-layer M2 and a second sub-layer M3 that are stacked. The materials of the first sub-layer M2 and the second sub-layer M3 may both include copper materials.

[0083] Optionally, the clearance hole and the conductive via K are connected, so that the second conductive portion 121 can be electrically connected to the first conductive wire through the conductive via K in the clearance hole.

[0084] According to the implementation of the first aspect of the present application, at least one mark 111 and the first conductive portion 112 are provided in the same layer.

[0085] Arranging the mark 111 and the first conductive part 112 in the same layer allows at least one mark 111 and the first conductive part 112 to be prepared and formed in the same process step, which simplifies the manufacturing process and does not require additional preparation steps to form the mark 111, thereby reducing the complexity of the manufacturing process.

[0086] Figure 6 Shown along Figure 2 Another cross-sectional structural diagram of the N3-N4 line. Figure 6As shown, according to the embodiment of the first aspect of the present application, the circuit board 120 further includes a protective layer 123 , and the protective layer 123 is located on the side of the cover film 122 away from the second conductive portion 121 .

[0087] The protective layer 123 can provide additional physical protection for the circuit board 120, particularly during transportation and installation, reducing the risk of physical damage to the circuit board 120. The protective layer 123 helps improve the overall structural stability of the circuit board 120 and reduces any bending or deformation that may occur during use. The protective layer 123 can also prevent external contaminants (such as dust and moisture) from entering the interior of the circuit board 120, reducing the risk of corrosion or short circuits on the circuit board 120. The protective layer 123 can also serve as an electromagnetic shielding layer, reducing the impact of external electromagnetic interference on the circuit board 120 and improving the electromagnetic compatibility of the circuit board 120.

[0088] In some embodiments, the protective layer 123 can be obtained by spraying an anti-oxidation material.

[0089] According to an embodiment of the first aspect of the present application, the opaque film layer includes a metal layer.

[0090] Optionally, the opaque film layer includes a copper layer or an aluminum layer.

[0091] refer to Figures 1a to 3 Optionally, the mark 111 includes a cross mark. Of course, the mark 111 can also be a mark 111 in other graphic or text shapes, such as a circle or a square.

[0092] The structure of the display module 100 provided in this application has been described in detail above. The following describes a method for testing the bonding effectiveness of the display panel 110 and the circuit board 120 in the display module 100. It will be appreciated that this testing method corresponds to the structure of the display panel 110 and the circuit board 120 provided in any of the aforementioned embodiments. Therefore, the structures mentioned in this testing method can refer to the above-mentioned description of the display panel 110 and the circuit board 120 and will not be further described here.

[0093] Figure 7 FIG. 1 is a flow chart of a bonding effect detection method provided by an embodiment of the present application. Figure 7 As shown, an embodiment of the second aspect of the present application provides a bonding effect detection method for detecting the bonding effect of the display panel 110 and the circuit board 120 provided in any of the above embodiments. The detection method includes the following steps:

[0094] Step S701 : determining the actual distance between the edge of the cover film 122 close to the mark 111 and the mark 111 .

[0095] Step S702 , comparing the actual distance with a preset distance threshold. If the actual distance is within the preset distance threshold, the bonding effect is determined to be qualified; if the actual distance is outside the preset distance threshold, the bonding effect is determined to be unqualified.

[0096] In some embodiments, during the process of determining the actual distance, the mark 111 may be replaced by its center, that is, step S701 may specifically determine the actual distance between the edge of the cover film 122 close to the mark 111 and the center of the mark 111 .

[0097] In some embodiments, the preset distance threshold may be, for example, 4 to 6 microns. If the actual distance is within the range of 4 to 6 microns, the bonding effect is determined to be qualified; if the actual distance is less than 4 microns or greater than 6 microns, the bonding effect is determined to be unqualified.

[0098] The detection method provided in the embodiment of the present application achieves the purpose of detecting the bonding effect between the first conductive portion 112 of the display panel 110 and the second conductive portion 121 of the circuit board 120 when the cover film 122 is opaque.

[0099] Figure 8 FIG. 1 is a flow chart of a bonding effect detection method provided by another embodiment of the present application. Figure 8 As shown, according to the implementation of the second aspect of the present application, before determining the actual distance between the edge of the covering film 122 close to the mark 111 and the mark 111, the detection method also includes: step S801, obtaining the detection image corresponding to the border area B and the bonding area C.

[0100] Determining the actual distance between the edge of the covering film 122 close to the mark 111 and the mark 111 includes: step 802, measuring the edge of the covering film 122 close to the mark 111 and the mark 111 in the detection image to generate the actual distance between the edge of the covering film 122 close to the mark 111 and the mark 111.

[0101] In some embodiments, a camera is used to capture the border area B and the bonding area C to generate a detection image. This embodiment of the present application provides a method for determining the actual distance by measuring the edge of the cover film 122 near the mark 111 and the center of the mark 111 in the detection image to obtain the actual distance.

[0102] In some embodiments, as described above, the at least one mark 111 includes a first mark 1121 and a second mark 1122. The first mark 1121 and the second mark 1122 are located on opposite sides of the first conductive portion 112 in the first direction X. The minimum distance between the first mark 1121 and the first conductive portion 112 is equal to the minimum distance between the second mark 1122 and the first conductive portion 112. The actual distance may include a first actual distance between the edge of the cover film 122 proximate the mark 111 and the first mark 1121, and a second actual distance between the edge of the cover film 122 proximate the mark 111 and the second mark 1122. In step S702, the actual difference between the first actual distance and the second actual distance may be compared with a preset distance threshold. If the actual difference is within the preset distance threshold, the bonding is determined to be acceptable; if the actual difference is outside the preset distance threshold, the bonding is determined to be unacceptable. Alternatively, the preset distance threshold may be 0. In this case, when the first actual distance and the second actual distance are equal and the actual difference between the first actual distance and the second actual distance is 0, the bonding is determined to be acceptable; otherwise, it is unacceptable, thereby simplifying the inspection method. In other embodiments, to account for process errors, the preset distance threshold may be 1 μm, 2 μm, or the like, as long as the bonding can be determined to be acceptable based on the actual difference and the preset distance threshold.

[0103] Figure 9 FIG. 1 is a schematic diagram of the structure of a display device provided in one embodiment of the present application. Figure 9 As shown, an embodiment of the third aspect of the present application provides a display device 10, which includes a display module 100 provided by any of the above embodiments. Its technical principles and effects are similar and will not be repeated here.

[0104] The display device 10 in the embodiment of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0105] While the embodiments described above are not exhaustive, they do not limit the invention to specific embodiments. Clearly, numerous modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A display module, characterized in that: The display module includes: a display panel, the display panel comprising a display area, a frame area, and a bonding area, the frame area surrounding at least a portion of the display area, the bonding area being located on a side of the frame area away from the display area, the display panel further comprising a first conductive portion and at least one mark, the first conductive portion being located in the bonding area, and the at least one mark being located in the frame area; a circuit board, the circuit board comprising a second conductive portion and a cover film, the second conductive portion being located on one side of the first conductive portion, and the cover film being located on a side of the second conductive portion facing away from the first conductive portion; Wherein, the covering film includes a light-proof film layer.

2. The display module according to claim 1, wherein: The at least one mark includes a first mark and a second mark, wherein the first mark and the second mark are located on opposite sides of the first conductive portion; Preferably, the minimum distance between the at least one mark and the display area is greater than the minimum distance between the at least one mark and the bonding area; Preferably, the first conductive portion includes a plurality of first sub-portions spaced apart along a first direction, and the first mark and the second mark are located on both sides of the first conductive portion in the first direction; Preferably, the minimum distance between the first mark and the first conductive portion is equal to the minimum distance between the second mark and the first conductive portion.

3. The display module according to claim 1, wherein: The display panel further includes a polarizer, the polarizer being located on a display side of the display panel, the polarizer covering the display area and a portion of the frame area, an orthographic projection of the at least one mark on a reference plane and an orthographic projection of the polarizer on the reference plane not overlapping, and the reference plane and the display surface of the display panel being parallel; Preferably, the orthographic projection of the at least one mark on the reference plane is located on a side of the orthographic projection of the polarizer on the reference plane that faces the bonding area.

4. The display module according to claim 1, wherein: The circuit board further includes a first metal layer, the first metal layer and the cover film are arranged in the same layer and spaced apart, the circuit board further includes a bending area, and the spacing area between the first metal layer and the cover film covers at least a portion of the bending area; Preferably, the circuit board further comprises a substrate layer, the substrate layer being located between the first metal layer and the second conductive portion, the first metal layer comprising a plurality of first conductive wires, the substrate layer having a plurality of conductive vias, and each of the first conductive wires and the second conductive portion being connected via the plurality of conductive vias; Preferably, a support layer is provided on the surface of the substrate layer facing the second conductive portion; Preferably, the material of the support layer includes a metal material, the support layer includes a clearance hole provided therethrough, the second conductive portion is located in the clearance hole and is in contact with and connected to the base material layer, and the second conductive portion is insulated from the support layer; Preferably, the support layer comprises a first sublayer and a second sublayer which are stacked; Preferably, the relief hole is connected to the conductive via.

5. The display module according to claim 1, wherein: The at least one mark and the first conductive portion are provided in the same layer; And / or, an orthographic projection of the first conductive portion on a reference plane at least partially overlaps with an orthographic projection of the second conductive portion on the reference plane, and the reference plane is parallel to a display surface of the display panel.

6. The display module according to claim 1, wherein: The circuit board further includes a protective layer, which is located on a side of the cover film away from the second conductive portion.

7. The display module according to any one of claims 1 to 6, characterized in that: The opaque film layer includes a metal layer; Preferably, the opaque film layer comprises a copper layer or an aluminum layer; Preferably, the mark comprises a cross-shaped mark.

8. A bonding effect detection method for detecting the bonding effect of a display panel and a circuit board according to any one of claims 1 to 7, characterized in that: The detection method comprises: determining an actual distance between an edge of the cover film proximate to the mark and the mark; The actual distance is compared with a preset distance threshold. If the actual distance is within the preset distance threshold, the bonding effect is determined to be qualified; if the actual distance is outside the preset distance threshold, the bonding effect is determined to be unqualified.

9. The detection method according to claim 8, characterized in that The at least one mark includes a first mark and a second mark, the first mark and the second mark are located on both sides of the first conductive portion in a first direction, and the minimum distance between the first mark and the first conductive portion is equal to the minimum distance between the second mark and the first conductive portion; The actual distance includes a first actual distance between an edge of the cover film close to the mark and the first mark, and a second actual distance between an edge of the cover film close to the mark and the second mark; Preferably, in the step of comparing the actual distance with a preset distance threshold, and determining that the bonding effect is qualified if the actual distance is within the preset distance threshold; and determining that the bonding effect is unqualified if the actual distance is outside the preset distance threshold: comparing an actual difference between the first actual distance and the second actual distance with a preset distance threshold, and determining that the bonding effect is qualified if the actual difference is within the preset distance threshold; If the actual difference is outside the preset distance threshold range, the bonding effect is determined to be unqualified; Preferably, before determining the actual distance between the edge of the covering film close to the mark and the mark, the detection method further comprises: Acquire detection images corresponding to the border area and the bonding area; Wherein, determining the actual distance between the edge of the covering film close to the mark and the mark includes: The edge of the cover film close to the mark and the mark in the detection image are measured to generate an actual distance between the edge of the cover film close to the mark and the mark.

10. A display device, characterized in that: The display device includes the display module according to any one of claims 1 to 7.

Images