Measuring device and measuring system

Abstract

In the prior art, there has been a problem that it is difficult to appropriately measure a desired detection item for an object having a concave-convex portion or a low-rigidity object. A measurement device (1) is provided with: a sensor array unit (5) having a plurality of sensors (51) arranged on an arrangement surface and capable of each detecting a detection event pertaining to an object on the arrangement surface; and a flexible deformation layer (10) disposed between the sensor array unit (5) and the object. The deformation layer (10) has a plurality of portions separated from each other so as to be compressively deformable independently mainly in the normal direction of the disposition surface. By means of the measurement device (1), measurement results of detection items relating to an object can be obtained with little influence on the rigidity or shape of the object.

Description

Technical Field

[0001] The present invention relates to a measuring device and a measuring system configured to contact an object and measure detection matters related to the object. Background Art

[0002] Conventionally, pressure sensor arrays and the like have been proposed to measure detection items such as pressure distribution of an object such as an object touching the ground (for example, see Patent Document 1 listed below).

[0003] Patent Literature Patent Document 1: Japanese Patent Application Publication No. 2018-189513 Summary of the Invention

[0004] However, when using planar sensors such as conventional pressure sensor arrays to measure object characteristics, it can sometimes be difficult to adequately measure the desired characteristics for objects with uneven surfaces or low rigidity. For example, when measuring the pressure distribution within a specific area where an object touches the ground, variations in rigidity or shape near the object's contact surface can affect the measurement results.

[0005] The present invention has been made in view of such problems, and an object thereof is to provide a measuring device and a measuring system capable of obtaining measurement results of detection matters related to an object with little influence on the rigidity and shape of the object.

[0006] The measuring device of the first invention comprises: a sensor array portion having a plurality of sensors arranged on a configuration surface and each capable of detecting a detection event related to an object located relative to the configuration surface; and a flexible layer, or deformable layer, disposed between the sensor array portion and the object, the deformable layer having a plurality of mutually separated portions that can independently undergo compressive deformation primarily in a direction normal to the configuration surface.

[0007] With such a structure, for an object whose contact surface heights vary at different locations due to differences in rigidity or shape near the contact surface, the influence of the object's rigidity or shape on the measurement results is minimized, thereby enabling measurement results of detection items related to the object to be obtained.

[0008] In addition, the measuring device of the second invention is as follows. With respect to the first invention, the multiple sensors arranged in the sensor array portion are resistance change pressure sensors, capacitance change pressure sensors, photoelectric reflectors or surface acoustic wave devices, and the multiple sensors are respectively configured to detect changes in the physical properties corresponding to the deformation layer.

[0009] With such a configuration, the influence of the rigidity or shape of the object on the measurement result can be reduced, thereby reliably obtaining the measurement result of the detection item related to the object.

[0010] In addition, the measuring device of the third invention is as follows: with respect to the first or second invention, the deformable layer is formed using a material with a Poisson's ratio of less than 0.2, or has a plurality of parts with a shape or size such that adjacent parts do not contact each other when pressure is applied to the deformable layer in the vertical direction.

[0011] With such a structure, the multiple locations of the deformable layer are less likely to interfere with each other during compression, and a measurement result with high resolution in the direction along the arrangement surface can be obtained.

[0012] Furthermore, a measuring device according to a fourth invention is as follows, in relation to any one of the first to third inventions, wherein the plurality of sites are arranged in a row along the arrangement surface on the surface of the deformable layer facing the sensor array portion.

[0013] With this structure, the measurement results of the detection items related to the object can be obtained in a manner that minimizes the influence of the rigidity or shape of the object on the measurement results, and the contact surface with the object can be formed flat.

[0014] In addition, the measuring device of the fifth invention is as follows: with respect to any one of the first to fourth inventions, a plurality of sensors are arranged in a horizontal direction, and the deformable layer comprises: a first layer, in which a plurality of parts are arranged separately from each other in a direction along the configuration surface; and a plate-shaped second layer, which is arranged on at least any one side above or below the first layer.

[0015] With such a structure, the deformable layer is integrally formed, and can be easily arranged in the sensor array unit.

[0016] Furthermore, the measuring device of the sixth invention is as follows: with respect to the fifth invention, the ratio of the vertical dimension of the second layer to the vertical dimension of the deformable layer is less than 0.3.

[0017] With such a configuration, it is possible to obtain measurement results with high resolution in the direction along the arrangement surface.

[0018] In addition, the measuring device of the seventh invention is as follows: with respect to any one of the first to sixth inventions, multiple parts are separated from each other in the direction along the configuration surface, and filling materials are arranged between the multiple parts, which are different from the constituent materials constituting the multiple parts, and the rigidity of the filling material is less than half of the rigidity of the constituent material.

[0019] With such a structure, the deformable layer can be integrally formed and easily arranged on the sensor array unit, and the contact surface with respect to the object can be flattened.

[0020] Furthermore, the measuring device of the eighth invention is as follows, in any one of the first to seventh inventions, wherein the deformable layer is made of a material having a ratio of loss elastic modulus to storage elastic modulus of not more than one tenth.

[0021] With this structure, since the stable state is quickly restored after measurement, repeated measurements can be performed in a short time.

[0022] Furthermore, the measuring device of the ninth invention is as follows: with respect to any one of the first to eighth inventions, the deformable layer is made of a material in which stress generated by deformation applied from the outside increases monotonically with respect to the magnitude of the deformation.

[0023] With this structure, high-precision measurement results can be obtained.

[0024] Furthermore, the measuring device according to the tenth invention is as follows, in relation to any one of the first to ninth inventions, wherein the deformable layer is formed of a foam material having a closed-cell cell structure.

[0025] With such a structure, the deformable layer can be configured to have appropriate viscosity.

[0026] In addition, the measuring device of the eleventh invention is as follows: regarding any one of the first to tenth inventions, the multiple sensors are sensors that can detect pressure, have a rectangular opening for detection, and the thickness of the deformation layer is greater than 1 and less than 2.5 for the short side dimension of the rectangular opening.

[0027] With this structure, it is possible to prevent buckling or unexpected deformation of multiple locations of the deformable layer during compression, and to obtain appropriate measurement results for objects having a wider variety of shapes.

[0028] Furthermore, the measuring device according to the twelfth invention is as follows, in relation to any one of the first to eleventh inventions, wherein the deformable layer is formed using EPDM sponge rubber.

[0029] With this configuration, high-precision measurement results can be obtained for objects having various shapes.

[0030] The measuring system of the thirteenth invention includes a measuring device and a processing unit that obtains a measurement result using the detection result of the measuring device. The measuring device includes: a sensor array unit having a plurality of sensors arranged on a configuration surface and each capable of detecting detection matters related to an object located relative to the configuration surface; and a soft layer, or deformable layer, configured to be located between the sensor array unit and the object, the deformable layer having a plurality of portions separated from each other in a manner capable of independently undergoing compressive deformation mainly in the normal direction of the configuration surface. The processing unit is configured to use a different sensor as a reading target in each reading opportunity, and to obtain a measurement result in each of the plurality of reading opportunities using the detection result obtained by using a portion of the plurality of sensors as a reading target.

[0031] With this structure, high-precision measurement results can be obtained.

[0032] The measuring system of the fourteenth invention is as follows. With respect to the thirteenth invention, a plurality of sensors are arranged in at least one prescribed direction, and the processing unit is configured so that both of two sensors adjacent to each other in the prescribed direction do not become reading objects in the same reading opportunity. In each of the plurality of reading opportunities, the measurement result is obtained using the detection result obtained by using a part of the plurality of sensors as reading objects.

[0033] With such a structure, it is possible to obtain more reliable and high-precision measurement results.

[0034] The measurement system of the fifteenth invention is as follows. With respect to the thirteenth or fourteenth invention, a plurality of sensors are arranged in a matrix of N rows and M columns, and the processing unit is configured to obtain a measurement result using a detection result synthesized from a detection result of a first group of sensors that are the objects of reading in a first reading opportunity and a detection result of a second group of sensors that are the objects of reading in a second reading opportunity, wherein the first group of sensors are located in even rows and even columns among a plurality of sensors, and the second group of sensors are located in odd rows and odd columns among a plurality of sensors.

[0035] With such a structure, it is possible to obtain more reliable and high-precision measurement results.

[0036] According to the measuring device and the measuring system according to the present invention, it is possible to obtain measurement results of detection items related to an object with little influence of the rigidity or shape of the object. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 1 is a diagram showing the configuration of a measurement system using the measurement device according to this embodiment. Figure 2 It is a side view showing the structure of the measuring device. Figure 3 This is a diagram for explaining detection of an object using the measuring device. Figure 4 This is a diagram illustrating detection using a measuring device according to a comparative example. Figure 5 is a graph showing an example of the material characteristics of the deformable layer. Figure 6 This is a diagram illustrating a deformable layer according to a modified example of the measurement device according to the present embodiment. Figure 7 These are diagrams for explaining a deformable layer according to yet another modified example of the measurement device according to the present embodiment. Figure 8 These are diagrams for explaining a deformable layer according to yet another modified example of the measurement device according to the present embodiment. Figure 9 These are diagrams for explaining a deformable layer according to yet another modified example of the measurement device according to the present embodiment. Figure 10 This is a diagram showing an example of the measurement results of the sole of the foot in a comparative example. Figure 11 This is a diagram showing an example of the measurement results of the sole of the foot in the first configuration example. Figure 12 1 is a diagram showing an example of the measurement results of the sole of the foot in the second configuration example. Figure 13 1 is a diagram showing an example of the measurement results of the sole of the foot in the third configuration example. Figure 14 1 is a diagram showing an example of measurement results of the sole of the foot in the fourth configuration example. Figure 15 It is a diagram showing simulation results of measurement results of the sole of the foot according to the fifth configuration example. Figure 16 It is a diagram showing simulation results of measurement results of the sole of the foot according to the sixth configuration example. Figure 17 1 is a diagram showing simulation results of measurement results of the sole of the foot according to the seventh configuration example. Figure 18 This is a block diagram showing an example of a measurement system according to this embodiment. Figure 19 This is a diagram illustrating a specific example of a sensor reading method of the measurement system. Figure 20 This is a schematic diagram of the computer system in the above-mentioned embodiment. Figure 21is a block diagram of the computer system. Explanation of symbols 1-measuring device; 3-signal output unit; 5-sensor array unit; 10, 10a, 10b, 10c, 10d, 10e-deformation layer; 11-first layer; 12-second layer; 51-sensor; 51R-target sensor; 51S-non-target sensor; 52-opening; 55-substrate (an example of a configuration surface); 111-dividing portion; 113-isolating portion; 118-filling portion; 600-terminal device; 620-receiving portion; 640-processing portion; 660-output portion; 900-measuring system. DETAILED DESCRIPTION

[0038] Hereinafter, embodiments of the measuring device, etc. will be described with reference to the drawings. In the embodiments, components denoted by the same reference numerals have substantially the same configuration, and duplicate descriptions may be omitted.

[0039] (Implementation Method) In this embodiment, the measuring device is a contact-type measuring device capable of measuring the pressure distribution when an object contacts the ground. The measuring device comprises a sensor array and a segmented deformable layer connected to the sensor array. An example configuration of such a measuring device is described below.

[0040] Figure 1 1 is a diagram showing a configuration of a measurement system 900 using the measurement device 1 according to this embodiment.

[0041] As shown in the figure, the measurement system 900 includes, for example, a measurement device 1 and a terminal device 600 .

[0042] The measuring device 1 is used to measure detection items related to an object. The measuring device 1 is, for example, configured in the form of a flat plate parallel to a horizontal plane. The measuring device 1 as a whole can be configured in the form of a flexible sheet or a plate with a certain degree of rigidity. The measuring device 1 can be used by being connected to a terminal device 600. The connection method in this case can be either a wired connection or a wireless connection. The measuring device 1 is, for example, configured to output a signal related to the detection item to the terminal device 600. The measuring device 1 can also be configured to store information obtained about the detection item in a storage unit such as a built-in memory.

[0043] Furthermore, in this embodiment, detection items related to the object include, for example, information related to the object's shape or the stress (pressure) generated when the object touches the ground. In the example described below, the object is the sole of a human foot, and the detection items include information about the pressure distribution when the sole touches the ground. However, the objects and detection items are not limited to these, and are applicable to a variety of uses and detection items.

[0044] The terminal device 600 is, for example, a personal computer (PC) such as a so-called laptop computer. The terminal device 600 is configured to obtain measurement results based on the detection items of the measuring device 1. The measurement results can be, for example, values related to the detection items, or images based on signals related to the detection items. That is, the user of the measuring system 900 can use the terminal device 600 to use the measuring system 900. Furthermore, the terminal device 600 is not limited to a personal computer. For example, an information processing device such as a so-called smart phone or a tablet-type information terminal device can also be used. In addition, the functions performed by the terminal device 600 can also be built into the measuring device 1. In addition to the structure described below, the measuring device 1 can also have a structure such as a computer for processing information, and a display for displaying information output by the computer.

[0045] Furthermore, in this embodiment, the measurement device 1 adopts a configuration in which known sensors 51 are arranged as shown below. The terminal device 600 may obtain measurement results using these sensors 51 by a known method.

[0046] Figure 2 It is a side view showing the structure of the measuring device 1 .

[0047] As shown in the figure, in this embodiment, the measurement device 1 includes a sensor array unit 5 and a deformable layer 10 .

[0048] The sensor array unit 5 includes a plurality of sensors 51. In this embodiment, the sensor array unit 5 includes a substrate 55 parallel to a horizontal plane. On the substrate 55, circuits for obtaining detection results of the sensors 51 are mounted.

[0049] The plurality of sensors 51 are arranged on the top surface of the substrate 55. Specifically, the plurality of sensors 51 are arranged in a horizontal plane. For example, the plurality of sensors 51 may be arranged two-dimensionally along a first direction along the arrangement surface and a second direction along the arrangement surface that is different from the first direction. The plurality of sensors 51 are arranged in a matrix.

[0050] Furthermore, the arrangement of the multiple sensors 51 is not limited to this. For example, the multiple sensors 51 may be arranged in a one-dimensional array or in a circular or concentric ring arrangement. The multiple sensors 51 may be arranged in a two-dimensional or one-dimensional regular pattern or in an irregular pattern. Regular arrangement refers to, for example, arrangement at predetermined intervals, but is not limited to this. The multiple sensors 51 may have the same size or properties, but may also differ from each other.

[0051] Furthermore, the arrangement surface where the plurality of sensors 51 are arranged may not be a flat surface. The sensor array unit 5 may not be in the form of a sheet, and may have a curved arrangement surface, a circular arrangement surface, or a cylindrical arrangement surface.

[0052] The multiple sensors 51 are each configured to perform detection related to a detection matter on an object located relative to the configuration surface. That is, each sensor 51 is configured to detect an object located above the substrate 55. In this embodiment, the multiple sensors are each pressure sensors and are configured to have a portion (referred to as an opening) on the top for detection. In this embodiment, the opening of each sensor 51 is particularly configured to be rectangular when viewed from above, but this is not limited to this.

[0053] Each sensor 51 is, for example, a variable resistance pressure sensor, which is a well-known sensor. However, the present invention is not limited thereto and each sensor 51 may also be a variable capacitance pressure sensor. By using such sensors to form the sensor array unit 5, it is possible to detect the pressure distribution of an object.

[0054] Furthermore, each sensor 51 may be, for example, a photoelectric reflector. That is, although the sensor 51 performs contact measurement, it is not limited thereto and may also perform non-contact measurement. Furthermore, the sensor 51 may be a SAW (surface acoustic wave) type device.

[0055] Deformable layer 10 is provided above sensor array unit 5. In other words, deformable layer 10 is provided between sensor array unit 5 and an object to be detected. Alternatively, deformable layer 10 is provided so as to face the surface on which it is provided.

[0056] The deformable layer 10 is a soft layer. The deformable layer 10 is configured to be easily deformed when an object approaches the sensor array unit 5 and contacts the deformable layer 10. Examples of materials constituting the deformable layer 10 will be described later.

[0057] In this embodiment, the deformable layer 10 has a plurality of mutually separated portions. Hereinafter, these portions are referred to as divided portions 111. The plurality of divided portions 111 are arranged in a direction along the arrangement surface, that is, in a horizontal direction.

[0058] In the present embodiment, there is, for example, a gap between adjacent divided parts 111. Hereinafter, the gap between such divided parts 111 is sometimes referred to as an isolation portion 113. The divided parts 111 are separated from each other by the isolation portion 113, and can independently undergo compression deformation mainly in the up and down directions, i.e., the normal direction of the configuration surface. Being able to independently undergo compression deformation means that when compressed, it hardly contacts other divided parts 111, or even if it contacts other divided parts 111, its influence hardly affects the deformation of the divided part 111. In the present embodiment, each divided part 111 is made of a single soft material. The divided part 111 is made of a material having a Poisson's ratio as described later, and is separated from the other divided parts 111 by the isolation portion 113, so as to be able to independently undergo compression deformation.

[0059] In this embodiment, the deformable layer 10 includes a continuous portion 112 that connects the divided portions 111. The continuous portion 112 is formed using the same material as the divided portions 111. That is, in this embodiment, the deformable layer 10 is a layered portion having the continuous portion 112 and the divided portions 111, both made of a single material.

[0060] The continuous portion 112 is configured to extend in a direction parallel to the horizontal plane, for example. In other words, each of the divided portions 111 can be said to be a portion protruding from the continuous portion 112 in the vertical direction.

[0061] In this embodiment, continuous portion 112 is positioned above segmented portions 111. Specifically, continuous portion 112 forms the top surface of measurement device 1. In other words, segmented portions 111 are arranged on the surface of deformable layer 10 that faces the sensor array unit 5, facing the placement surface. Thus, since continuous portion 112 forms the top surface of measurement device 1, it can form a flat contact surface with an object.

[0062] The structure of the deformable layer 10 can also be described as follows. Specifically, the deformable layer 10 has multiple segmented portions 111 arranged horizontally, forming a layered structure as a whole. A layer in which these segmented portions 111 are separated from each other by separators 113 and arranged along the arrangement surface can be referred to as the first layer 11. Furthermore, in this embodiment, a continuous portion 112 is provided, forming a layered structure. This continuous portion 112 can be referred to as the second layer 12. Specifically, in this embodiment, the deformable layer 10 includes a first layer 11 and a second layer 12, with the second layer 12 positioned above the first layer 11. Alternatively, the second layer 12 can be positioned below the first layer 11. In other words, the second layer 12 can be described as a plate-like layer positioned at least on one side above or below the first layer 11. Alternatively, the second layer 12 can be positioned in the middle of the first layer 11, in which case the first layer 11 can be positioned above and below the second layer 12.

[0063] As described above, since the deformable layer 10 is composed of the first layer 11 and the plate-shaped second layer 12 , the deformable layer 10 can be integrally formed and easily arranged in the sensor array unit 5 .

[0064] Furthermore, instead of the isolation portion 113, the first layer 11 may further include a filling portion 118 (e.g., Figure 9 (as shown). Filling portion 118 is a portion formed of a material different from that of segmented portions 111 and is filled between adjacent segmented portions 111. In other words, in first layer 11, a filling material different from the material constituting segmented portions 111 may be disposed between each segmented portion 111. Thus, in a configuration using filling portion 118, even if deformable layer 10 is configured without second layer 12, deformable layer 10 can still be integrally formed and easily disposed within sensor array portion 5. An example configuration of filling portion 118 formed of such a filling material will be described later.

[0065] Figure 3 This is a diagram for explaining detection of an object 90 using the measuring device 1 . Figure 4 This is a diagram illustrating detection using a measuring device according to a comparative example.

[0066] Figure 3 In FIG. 1 , the deformation layer 10 of the measuring device 1 is shown as a simplified plate-shaped layer. Figure 3 and Figure 4 , an object 90 having concavoconvex portions on a surface (referred to as a bottom surface) facing the measuring device 1 etc. is shown. Hereinafter, a case of measuring the pressure distribution when the object 90 touches the ground will be described.

[0067] The comparative example shows measurement using the sensor array unit 5 alone, which lacks the deformable layer 10. In this case, the bottom surface of object 90 directly contacts the top surface of sensor array unit 5, allowing each sensor 51 to detect the pressure at that location. Because object 90 has uneven surfaces on its bottom surface, the bottom surface of object 90 partially contacts the sensor array unit 5. In areas where object 90 is not in contact, sensors 51 cannot detect pressure changes.

[0068] On the other hand, in this embodiment, due to the configuration of the measuring device 1 as described above, the bottom surface of the object 90 contacts the upper surface of the deformable layer 10 disposed on the upper surface of the sensor array unit 5. Because the deformable layer 10 is flexible, it deforms along the bottom surface of the object 90, deforming in accordance with the shape and pressure distribution of the bottom surface of the object 90. Thus, while the deformable layer 10 is vertically compressed and deformed, pressure is transmitted through the deformable layer 10 to the underlying sensors 51, where the pressure distribution is detected by the sensor array unit 5. Consequently, multiple sensors 51 detect pressure changes over a wider range than in the comparative example. Consequently, for an object 90 whose contact surface height varies across a wider range due to differences in rigidity or shape near the contact surface, the influence of the rigidity or shape of the object 90 on the measurement results can be minimized, allowing measurement results related to the pressure distribution of the object 90 to be obtained. The measuring device 1 is configured not to directly detect the contact or proximity of the object 90 via the sensor array unit 5, but rather to detect changes in the physical properties of the flexible deformable layer 10. While the physical properties described here are limited to density, elastic modulus, and properties related to light transmission, they are not limited to these. If object 90 is inherently soft, measuring the pressure distribution in the comparative example would require strictly knowing all of the object's softness and other conditions, making accurate measurement difficult. In contrast, the measurement device 1 of this embodiment measures changes in the physical properties of the soft, deformable layer 10, thereby obtaining measurement results that reflect the pressure distribution of the object's 90's hardness and shape. Consequently, even for objects 90 with uneven surfaces or low rigidity, the required detection parameters can be easily and appropriately measured.

[0069] In this embodiment, the deformable layer 10 can be formed of the following materials.

[0070] That is, the deformable layer 10 is formed of a material having a Poisson's ratio of less than 0.2. With this structure, the plurality of divided portions 111 of the deformable layer 10 are less likely to interfere with each other during compression, and high-resolution measurement results can be obtained along the arrangement surface.

[0071] Furthermore, the deformable layer 10 is constructed from a material whose ratio of the loss modulus to the storage modulus (Tanδ) is one-tenth or less. For example, a low-viscosity foam material such as polyurethane or silicone resin can be used. Using such a material allows the deformable layer 10 to quickly return to a stable state (a state where transient deformation has subsided) after measurement. This allows for rapid measurement, and after completion, repeated measurements can be performed quickly.

[0072] The deformation layer 10 is composed of a material in which the stress generated by the deformation applied from the outside increases monotonically with respect to the size of the deformation. Thus, high-precision measurement results can be obtained. That is, depending on the different sponge materials, there is a situation where the stress does not necessarily increase linearly with the increase in deformation. Such a phenomenon may occur, for example, due to the following reasons, that is, buckling occurs due to structural changes inside the material, which sometimes produces a platform area. In addition, when a dense material is used instead of a sponge, the contact surface with the sensor array part 5 or the interface with the contact object is in a constrained state and local changes in rigidity may occur. It is preferable to use a material in which the stress increases monotonically with respect to the size of the deformation to avoid such a phenomenon.

[0073] Furthermore, the deformable layer 10 is preferably configured such that the ratio of the vertical dimension LC of the second layer 12 to the vertical dimension LA (normal to the arrangement surface) is less than 0.3. This configuration enables high-resolution measurement results along the arrangement surface.

[0074] Furthermore, in the deformable layer 10, the thickness LA of the deformable layer 10 (hereinafter sometimes referred to as the aspect ratio) is preferably greater than 1 and less than 2.5 relative to the short side dimension Ls of the rectangular opening of each sensor 51. By keeping the aspect ratio low in this manner, it is possible to prevent the segmented portion 111 from buckling or unexpectedly deforming during compression, and appropriately transmit the force generated by compression by the object to the sensor array unit 5. Furthermore, since the aspect ratio is above a certain level, even for objects with large differences in unevenness on the bottom surface, the surface of the deformable layer 10 can be contacted more widely. This allows for appropriate measurement results for objects with a wider range of shapes.

[0075] As such a material, for example, a synthetic resin sponge or rubber can be used. For example, a foam material having a closed-cell structure can be used for the deformable layer 10. By using such a material, the deformable layer 10 can be constructed so as to have appropriate viscosity.

[0076] In this embodiment, EPDM sponge can be used to form the deformable layer 10. For example, "EPT-03S" manufactured by Waki Sangyo Co., Ltd. can be used as the EPDM sponge. This EPDM sponge rubber has a closed-cell structure and a hardness of 8±5.

[0077] Figure 5 Graph showing an example of the material properties of the deformable layer 10 .

[0078] Figure 5 Figure 2 shows the SS characteristics of "EPT-03S" manufactured by Waki Sangyo Co., Ltd. during a uniaxial compression test. The figure shows the relationship between true strain and true stress when a test piece with a width of 20 mm, a height of 20 mm, and a length of 5 mm is compressed at a rate of 0.5 mm per second.

[0079] As shown in the graph, when using this EPDM sponge, stress rises steadily in areas with minimal deformation. Then, as deformation increases, the stress increases monotonically, bypassing plateaus. Therefore, using this material allows for more accurate measurement of objects.

[0080] In addition, in the present embodiment, the deformable layer of the measuring device 1 may be configured as follows: In the following figures, the sensor array unit 5 is simplified in illustration.

[0081] Figure 6 This is a diagram illustrating a deformable layer 10 b according to a modified example of the measurement device 1 according to the present embodiment.

[0082] exist Figure 6 The illustrated measuring device 1 is provided with a deformable layer 10b. In the deformable layer 10b, the first layer 11, or the layer where the segmented portions 111 are arranged, is positioned above the second layer 12, or the continuous portion 112. Also in the deformable layer 10b, the ratio of the vertical dimension LC of the second layer 12 to the vertical dimension LA is preferably less than 0.3. Even with this configuration, as described above, the influence of the object's rigidity and shape on the measurement results can be minimized, thereby achieving measurement results that are accurate for the detection matters related to the object.

[0083] Figure 7 This is a diagram illustrating a deformable layer 10 c according to yet another modified example of the measurement device 1 according to the present embodiment.

[0084] exist Figure 7The illustrated measuring device 1 is provided with a deformable layer 10c. In the deformable layer 10c, the second layer 12, or continuous portion 112, is located midway between the first layer 11, or segmented portions 111. Even in the deformable layer 10c, the ratio of the vertical dimension LC of the second layer 12 to the vertical dimension LA is preferably less than 0.3. Even with this configuration, as described above, the influence of the object's rigidity and shape on the measurement results can be minimized, thereby enabling accurate measurement results relevant to the object's detection requirements.

[0085] Figure 8 This is a diagram illustrating a deformable layer 10 d according to yet another modified example of the measurement device 1 according to the present embodiment.

[0086] exist Figure 8 The illustrated measuring device 1 is provided with a deformable layer 10d. This deformable layer 10d comprises only a layer (first layer) in which dividing portions 111 are arranged with spacers 113 interposed therebetween. It lacks any portion corresponding to the second layer 12 in the aforementioned embodiment. Even with this structure, as described above, the influence of the object's rigidity and shape on the measurement results can be minimized, thereby enabling accurate measurement results of detection items related to the object.

[0087] Figure 9 These are diagrams for explaining a deformable layer 10 e according to yet another modified example of the measurement device 1 according to the present embodiment.

[0088] exist Figure 9 The illustrated measuring device 1 is provided with a deformable layer 10e. Deformable layer 10e does not include a portion corresponding to the second layer 12 in the aforementioned embodiment, and instead consists solely of a layer in which divided portions 111 are arranged with filling portions 118 interposed therebetween. Even with this structure, as described above, the influence of the rigidity and shape of the object on the measurement results can be minimized, thereby enabling accurate measurement results of detection matters related to the object.

[0089] Furthermore, the rigidity of the filling material forming the filling portion 118 is preferably less than half the rigidity of the material forming the segmented portion 111. More specifically, the combined rigidity of the filling material is preferably approximately one-third the rigidity of the segmented portion 111. This prevents deformation of one segmented portion 111 from affecting adjacent segments 111. Consequently, higher-resolution measurements can be obtained in the horizontal direction.

[0090] As described above, according to this embodiment, for an object whose contact surface heights vary at different locations due to differences in rigidity or shape near the contact surface, the influence of the rigidity or shape of the object on the measurement results can be minimized, thereby obtaining measurement results of detection items related to the object.

[0091] Furthermore, the measuring device 1 involved in this embodiment can be appropriately used, for example, to measure the pressure distribution on the ground when the test subject contacts the ground with the sole of the foot while standing or walking (sometimes referred to as the measurement result of the sole of the foot). That is, the shape of the sole of a person's foot varies from person to person, and the hardness of the concave and convex parts or the skin may be different. There may also be a situation where the arch of the foot is located at a higher position (so-called high arch foot) or there is a so-called floating toe. In such applications, by using the measuring device 1, the pressure distribution of the ground can be obtained for soles with various shapes or characteristics. Thus, for the purpose of making a judgment related to the state of the test subject based on the measurement result of the pressure distribution on the ground, a measurement result that can be flexibly applied can be obtained.

[0092] Figure 10 This is a diagram showing an example of the measurement results of the sole of the foot in a comparative example. Figure 11 This is a diagram showing an example of the measurement results of the sole of the foot in the first configuration example. Figure 12 1 is a diagram showing an example of the measurement results of the sole of the foot in the second configuration example. Figure 13 1 is a diagram showing an example of the measurement results of the sole of the foot in the third configuration example. Figure 14 1 is a diagram showing an example of measurement results of the sole of the foot in the fourth configuration example.

[0093] These figures show the pressure distribution measurement results as heat maps. The comparative examples show the measurement results when a measuring device without a deformable layer 10 is used. In the first configuration example, the deformable layer 10 is constructed using "EPT-03S" manufactured by Waki Sangyo Co., Ltd., with a thickness LA of 5 mm and a hardness of 8±5. In the second configuration example, the deformable layer 10 is constructed using "EPT-03S" manufactured by Waki Sangyo Co., Ltd., with a thickness LA of 10 mm and a hardness of 8±5. In the third configuration example, the deformable layer 10 is constructed using a material with a thickness LA of 20 mm and a hardness of 25±5. In the fourth configuration example, the deformable layer 10 is constructed using a polyurethane sponge with a thickness LA of 25 mm and a hardness of less than 8.

[0094] As shown in the figure, in the comparative example, the pressure distribution in the arch of the foot and the toes beyond the second toe is not well represented in the measurement results. Therefore, the measurement results can sometimes be difficult to use when determining whether a person has a high-arch foot or a floating toe. In contrast, using a measuring device 1 that includes a deformable layer 10 compared to the comparative example can capture the pressure distribution over a wider range of the sole. However, if the thickness is too large, the horizontal resolution of the pressure distribution may be reduced. Therefore, as a standard, a measuring device 1 can be constructed, such as in the second configuration example, by using a deformable layer 10 made of "EPT-03S" manufactured by Waki Sangyo Co., Ltd., with a thickness of approximately 10 mm and a hardness of 8±5. This allows for high horizontal resolution while also supporting a wider range of sole shapes. Furthermore, depending on the amount of stress that may be generated during measurement (such as the weight of the test subject) or other purposes, the deformable layer 10 can be configured as in the other configuration examples to achieve appropriate measurement results.

[0095] An example of simulation results for explaining the configuration example of the measurement device 1 according to the present embodiment is as follows.

[0096] Figure 15 It is a diagram showing simulation results of measurement results of the sole of the foot according to the fifth configuration example. Figure 16 It is a diagram showing simulation results of measurement results of the sole of the foot according to the sixth configuration example. Figure 17 1 is a diagram showing simulation results of measurement results of the sole of the foot according to the seventh configuration example.

[0097] In the simulation, the material of the deformable layer 10 was set to have a good correlation with the test results of the uniaxial compression test described above, and the Poisson's ratio was set to 0. Furthermore, using the pressure distribution measurement results of the actual prototype measuring device 1, a foot model with an appropriate Young's modulus was created, and the pressure distribution when a load was applied to the measuring device 1 was calculated. The figures show a diagram of the model showing various configuration examples of the measuring device 1, a thermal image showing the measurement results of the foot sole, and an explanatory note on the measurement results.

[0098] The fifth configuration example uses a deformable layer 10a with a thickness LA of 20 mm and an undivided structure at the dividing portion 111. In this case, no pressure distribution from the second toe to the fifth toe is observed. This result can be used as a comparative example.

[0099] The sixth configuration example uses a deformable layer 10d having a thickness LA of 20 mm and an array of 3.9 mm square divisions 111. In this case, the pressure distribution of each toe is revealed, and it is found that appropriate measurement results can be obtained.

[0100] The seventh configuration example uses a deformable layer 10e with a structure in which divided sections 111, each 4 mm square and with a thickness LA of 20 mm, are arranged with filling sections 118 interposed therebetween. Furthermore, the rigidity of the filling sections 118 is set to one-third of the rigidity of the divided sections 111. Even in this configuration, the pressure distribution of each toe is uniformly displayed, demonstrating that appropriate measurement results can be obtained.

[0101] (Measurement system operation example)

[0102] Hereinafter, an operation example of the measurement system 900 according to this embodiment will be described.

[0103] Figure 18 1 is a block diagram showing an example of a measurement system 900 according to this embodiment.

[0104] like Figure 18 As shown, the measuring device 1 includes a sensor array unit 5 composed of a plurality of sensors 51 and a signal output unit 3 .

[0105] The signal output unit 3 is configured to transmit the detection results of the sensor array unit 5 detected by the plurality of sensors 51 to the terminal device 600. The signal output unit 3 is configured by, for example, a circuit mounted on the substrate 55 of the sensor array unit 5, but is not limited thereto.

[0106] For example, the signal output unit 3 is configured to collectively transmit data (or signals) representing the detection results of each of the multiple sensors 51 for each reading opportunity (also referred to as a frame) that occurs at predetermined intervals. Hereinafter, the collective data of the detection results of each of the multiple sensors 51 in a particular reading opportunity will sometimes be referred to as a single frame of data. In other words, the signal output unit 3 is configured to transmit a single frame of data containing the detection results of the target sensors 51 being read at a predetermined frame rate (also referred to as a sampling rate, etc.).

[0107] The terminal device 600 includes, for example, a storage unit 610 , a reception unit 620 , an acceptance unit 630 , a processing unit 640 , and an output unit 660 .

[0108] Storage unit 610 stores information used by terminal device 600. Storage unit 610 is, for example, a nonvolatile recording medium, but may also be a volatile recording medium. Acquired information is stored in storage unit 610, but the storage process for information is not limited to this. For example, information may be stored via a recording medium, transmitted via a communication line, or input via an input device.

[0109] The receiving unit 620 receives information transmitted from the measuring device 1 or other devices via the network. The receiving unit 620 stores the received information in the storage unit 610, for example, and can be retrieved by the processing unit 640, etc. The receiving unit 620 is implemented, for example, by wireless or wired communication means.

[0110] Acceptor 630 accepts various input operations performed on terminal device 600 by a user using terminal device 600. Operations may be performed using, for example, an input device (not shown), but the present invention is not limited thereto. Input means for inputting information acceptable to acceptor 630 may include a numeric keypad, keyboard, mouse, or menu screen. Acceptor 630 may be implemented using a device driver for input means such as a numeric keypad or keyboard, or menu screen control software.

[0111] The processing unit 640 performs various information processing operations using various components of the terminal device 600. In this embodiment, the processing unit 640 is configured to read the detection result of the measurement device 1 as described later, and obtain a measurement result based on the result.

[0112] Typically, the processing unit 640 can be implemented by an MPU or memory. Typically, the processing procedures of the processing unit 640 are implemented by software, and the software is recorded in a recording medium such as a ROM. However, it can also be implemented by hardware (dedicated circuit).

[0113] The output unit 660 outputs information by, for example, displaying it on a display device. The information output method is not limited to this, and may also be output through, for example, sound output from a speaker. For example, the output unit 660 is configured to output information related to the measurement results obtained by the processing unit 640.

[0114] In this embodiment, the terminal device 600 receives data output from the measurement device 1 via the signal output unit 3 via the receiving unit 620. The processing unit 640 is configured to read the received data and obtain a measurement result.

[0115] In this embodiment, the measurement system 900 is configured to perform alternating sensor readings of a measurement device 1 having multiple sensors 51. Specifically, the processing unit 640 uses a portion of the multiple sensors as reading targets, thereby acquiring (reading) the detection results of a single reading opportunity. The processing unit 640 acquires detection results by reading a different sensor in each of multiple reading opportunities. The processing unit 640 uses the detection results obtained in each of these multiple reading opportunities to acquire measurement results. In other words, the processing unit 640 is configured to acquire measurement results using the alternating sensor readings of the measurement device 1 having multiple sensors 51.

[0116] In this embodiment, alternating sensor reading is implemented, for example, by the signal output unit 3 and the processing unit 640. For example, two combinations of target sensors 51R to be read are pre-set (sometimes referred to as the first group and the second group). Each time a reading opportunity arrives, the signal output unit 3 alternately transmits data from the first group of target sensors 51R as a frame of data, and transmits data from the second group of target sensors 51R as a frame of data. The processing unit 640 uses the first and second sets of data transmitted during each reading opportunity to obtain a measurement result. For example, the processing unit 640 synthesizes the first and second sets of data transmitted during two consecutive reading opportunities and obtains a measurement result as a single aggregated data set. This allows measurement results to be obtained using data detected by all of the multiple sensors 51. The measurement result may be, for example, a still image or a dynamic image (a time-series image) representing pressure distribution, but is not limited to this.

[0117] In this embodiment, it is believed that when using a deformable layer 10 in which the portions corresponding to the sensors 51 are not completely separated from each other, the deformation of the portion corresponding to one sensor 51 is affected by the deformation of the portions corresponding to other nearby sensors 51. In other words, the detection results of one sensor 51 may be correlated with the detection results of other nearby sensors 51. When using a measurement device 1 that employs such a deformable layer 10, it is possible to obtain higher-resolution, more accurate measurement results by synthesizing multiple sets of data obtained by alternately reading from the sensors and processing them as a single frame of data, compared to using the detection results of all sensors 51 in each frame.

[0118] Furthermore, when performing such sensor alternating reading, the frame rate is preferably higher than when processing the detection results of all sensors 51 in each frame, and more preferably doubled, for example. This allows for obtaining highly accurate results.

[0119] Figure 19 This is a diagram illustrating a specific example of a reading method of the sensor of the measurement system 900 .

[0120] In the following description, it is assumed that the sensor array unit 5 is used in which the sensors 51 are arranged in a matrix of N rows and M columns. Figure 19As shown, in this specific example, in the sensor alternating reading process, two combinations of target sensors 51 are set as the reading targets. In the first combination (step S101), sensors 51 located in even rows and even columns are designated as target sensors 51R, while sensors 51 located in odd rows and odd columns are designated as non-target sensors 51S. In the second combination (step S102), in contrast to the first combination, sensors 51 located in even rows and even columns are designated as non-target sensors 51S, while sensors 51 located in odd rows and odd columns are designated as target sensors 51R. During measurement, during the first reading opportunity, one frame of data is transmitted to the terminal device 600 for the first group (step S101). During the subsequent second reading opportunity, one frame of data is transmitted to the terminal device 600 for the second group (step S102). This process is repeated. In other words, the target sensors 51R are alternately switched between the first and second groups. The order of the first and second reading opportunities is not limited to this.

[0121] As described above, in this specific example, detection results are obtained for target sensors 51R in each frame, with adjacent sensors 51 in both the horizontal (row) and vertical (column) directions becoming non-target sensors 51S. Consequently, the correlation between the detection results of multiple target sensors 51R in each frame is relatively weak. For example, by combining the first and second sets of data transmitted consecutively and treating them as data from a single aggregated reading opportunity, the processing unit 640 can obtain measurement results with higher resolution.

[0122] Furthermore, when performing sensor alternating reading, it is preferable to select the target sensor 51R in each frame so that two adjacent sensors 51 are not read in the same frame, for example, in at least one direction. This allows for more reliable and accurate results.

[0123] Furthermore, when performing sensor alternation reading, the combination of target sensors 51R to be read may be three or more. In addition, the combination of target sensors 51R may be randomly determined in each frame.

[0124] Furthermore, the configuration of measurement system 900 is not limited to that described above. Alternatively, part or all of the processing for implementing alternate sensor reading may be performed by signal output unit 3 or the like of measurement device 1. For example, measurement device 1 may be configured so that processing unit 640 is substantially provided within measurement device 1. Alternatively, alternate sensor reading may be implemented by switching the reading results of each of the plurality of sensors 51 transmitted from signal output unit 3 frame by frame to be processed by processing unit 640.

[0125] Figure 20 This is a schematic diagram of the computer system 800 in the above embodiment. Figure 21 is a block diagram of the computer system 800 .

[0126] These figures show the configuration of a computer such as a terminal device that implements the above-described embodiments by executing the programs described in this specification. The above-described embodiments can be implemented by computer hardware and computer programs executed thereon.

[0127] The computer system 800 includes a computer 801 , a keyboard 802 , a mouse 803 , and a monitor 804 .

[0128] In addition to an optical disk drive (ODD) 8012, the computer 801 also includes an MPU 8013; a bus 8014 connected to the optical disk drive 8012 and other devices; a ROM 8015 for storing programs such as a boot program; a RAM 8016 connected to the MPU 8013 and providing temporary storage space for temporarily storing application commands and for storing application programs; and a hard disk 8017 for storing application programs, system programs, and data. Although not shown, the computer 801 may also include a network card for connecting to a LAN.

[0129] The program that causes the computer system 800 to execute the functions of the terminal device, etc., according to the above-described embodiment can also be stored in the optical disc 8101 and further transferred to the hard disk 8017 by inserting it into the optical disc drive 8012. Alternatively, the program can be sent to the computer 801 via a network (not shown) and stored in the hard disk 8017. When the program is executed, it is loaded into the RAM 8016. The program can also be loaded directly from the optical disc 8101 or the network.

[0130] The program does not necessarily need to include an operating system (OS) or third-party programs that cause the computer 801 to perform the functions of the terminal device, etc., described in the above-mentioned embodiments. It is sufficient that the program calls appropriate functions (modules) in a controlled manner and contains only the instructions that achieve the desired results. The operation of the computer system 800 is well known, and a detailed description thereof will be omitted.

[0131] Furthermore, in the above-mentioned program, the sending step of sending information or the receiving step of receiving information does not include processing performed by hardware, such as processing performed by a modem or interface card in the sending step (processing that can only be performed by hardware).

[0132] Furthermore, the computer that executes the above-mentioned program may be a single computer or multiple computers, that is, the program may be processed in a centralized manner or in a distributed manner.

[0133] Furthermore, in the above-described embodiment, two or more components present in one device may be physically realized by one medium.

[0134] In the above-mentioned embodiment, each component can also be constituted by dedicated hardware, or with respect to the component that can be realized by software, it can also be realized by executing a program. For example, a program execution unit such as a CPU reads out and executes a software program recorded in a recording medium such as a hard disk or a semiconductor memory, thereby realizing each component. During its execution, the program execution unit can also execute the program while accessing a storage unit or a recording medium. In addition, the program can be executed after being downloaded from a server, etc., or it can be executed after reading out a program recorded on a prescribed recording medium (for example, an optical disc, a magnetic disk, a semiconductor memory, etc.). In addition, the program can also be used as a program constituting a program product. In addition, the computer that executes the program can be either single or multiple. That is, it can be processed centrally or distributedly.

[0135] In addition, in the above-mentioned embodiment, each processing (each function) can be implemented by a single device (system) through centralized processing, or can be implemented by multiple devices through distributed processing (in this case, the system composed of multiple devices performing distributed processing can be grasped as a whole as one "device").

[0136] (other)

[0137] The present invention is not limited to the above-described embodiment, and various modifications are possible, and the modifications are also included in the scope of the present invention.

[0138] It is also possible to construct an embodiment that appropriately combines the components of the above-mentioned embodiments or modified examples. For example, the above-mentioned embodiments are not limited to their configurations per se, but rather the components of each of the above-mentioned embodiments or modified examples may be appropriately replaced or combined with components of other embodiments, etc. Furthermore, some components or functions of the above-mentioned embodiments or modified examples may be omitted.

[0139] The segmented parts can also be interpreted as being independently compressible and deformable, meaning that when the deformable layer is compressed or deformed by applying vertical force, it rarely contacts other segmented parts, or even if it contacts other segmented parts, its deformation is minimally affected. For example, the deformable layer is not limited to being composed of materials such as sponges with the Poisson's ratio described above. For example, the deformable layer can also be composed of a less compressible material, such as an elastomer, that does not contain an air layer like a sponge. When using such a less compressible material, it is preferable to configure the deformable layer so that the segmented parts can independently compress and deform under pressure. To achieve this, for example, the dimensions of the multiple segmented parts (including the dimensions of the separators) or the shapes of the multiple segmented parts can be set so that the segmented parts can independently compress and deform under pressure. In other words, the dimensions of the segmented parts, the dimensions of the separators, or the shapes of the segmented parts can be set so that deformation under pressure does not cause adjacent segmented parts to physically contact each other. Even when the deformable layer is composed of a less compressible material, contact between the segmented parts during pressure, which could affect the measurement results, can be prevented, allowing for appropriate measurement results. Furthermore, when using a material that does not contain an air layer, the absence of an air layer can improve the response speed. Furthermore, the deformable layer can be configured to have a high recovery rate or be less susceptible to plastic deformation, resulting in a more durable measuring device.

[0140] In the above-mentioned embodiment, although the example of using EPDM sponge as the material of the deformation layer is enumerated, other materials can also be used. For example, when using a sponge or foam material, for example, polyurethane sponge, silicone rubber sponge, polyester sponge, melamine sponge, EPDM sponge, NBR sponge, CR rubber sponge, NR sponge or porphyrin sponge can be used. In addition, when using an elastomeric material that is not a foam, for example, silicone rubber, polyurethane, styrene, polyolefin, polyvinyl chloride, polyamide (TPAE), nitrile or polybutadiene materials can also be used. Moreover, as the material of the deformation layer, it is preferred to use a material with a hardness of more than 20N and less than 200N measured by the A method hardness test specified in "JIS (Japanese Industrial Standard) K 6400-2", or a material with a hardness of 3 to 20 measured by "Aska Rubber Durometer Type C" (made by Polymer Meter Co., Ltd.) Furthermore, it is more preferable to use a material for the deformable layer that has a recovery rate of 95% or greater (a thickness reduction rate of 5% or less) as measured by the Method A repeated compression residual deformation test specified in JIS (Japanese Industrial Standards) K 6400-4. Using a material that meets these requirements allows for more appropriate measurement results and a more durable measuring device.

[0141] Furthermore, in the above-described embodiment, the segmented portions in the deformable layer may not be segmented in the same manner as the sensors in the sensor array unit. Furthermore, the segmentation positions (the positions of the isolation portions) may not be related to the segmentation positions of the sensors. Even in cases where the segmentation method or the positions of the isolation portions are not related to the arrangement of the sensors in the sensor array unit, no significant difference in accuracy will occur, and the same effects as in the above-described embodiment can be achieved.

[0142] The measurement device is not limited to measuring the soles of the feet. For example, it can also be used to measure the pressure distribution of a person sleeping, or to measure the pressure distribution of the waist or buttocks on the seat surface when a person is sitting. For example, the measurement device can also be used on beds, sofas, cushions, etc.

[0143] Furthermore, the measuring device is not limited to a rectangular mat shape, but can also be configured to have a configuration surface having various shapes or structures for measurement. That is, the application of the measuring device is not limited to a part of the human body, but can also be used appropriately and flexibly to measure the pressure distribution of various objects on the contact surface, or to measure detection items corresponding to three-dimensional shapes, etc. For example, in the case of a two-dimensional planar measuring device, the configuration surface can be in various shapes such as square, circular, rectangular, and sector-shaped. For example, the configuration surface can also be in the shape of an insole or a sole. In addition, for example, the configuration surface can be made into a curved surface, or a combination of multiple surfaces. For example, the deformable layer can also be configured to have a curved surface in the shape of a chair's seating surface, or in the shape of a handlebar of a bicycle, etc., or a handle of a racket used in ball sports, etc. In this case, the sensor array portion can have a shape that matches the shape of the configuration surface, or multiple sensors can be arranged at positions that match the shape of the configuration surface.

[0144] In addition, the configuration surface of the measuring device is not limited to the surface for placing the object. The measuring device can also be configured so that the deformation layer is deformed by being pressed against the surface of the object, or by rolling and moving on the surface of the object. For example, the measuring device can also be configured so that the configuration surface is composed of two surfaces, and the measurement is performed in a state where the object is clamped between the two surfaces. A measurement result corresponding to the shape of the object can be obtained. In addition, for example, a roller-shaped measuring device can be used, in which the sensors of the sensor array part are configured in a cylindrical shape, and the deformation layer is configured in a manner surrounding the outside thereof. With such a measuring device, by tracing the object, a measurement result corresponding to the shape of the object can be obtained based on the detection results of each sensor and the rotation speed of the roller-shaped part. Industrial applicability

[0145] As described above, the measuring device and the like according to the present invention have the effect of being able to obtain measurement results of detection items related to an object with little influence of the rigidity or shape of the object, and are useful as a measuring device and the like.

Claims

1. A measuring device, characterized in that: The device comprises: a sensor array unit having a plurality of sensors arranged on an upper surface of a configuration surface and each of which can detect a detection event related to an object located relative to the configuration surface; and a soft layer, i.e., a deformable layer, arranged to be located between the sensor array portion and the object, The deformable layer has a plurality of portions separated from each other mainly in the normal direction of the arrangement surface so as to be independently compressively deformable.

2. The measuring device according to claim 1, characterized in that The plurality of sensors provided in the sensor array portion are resistance change pressure sensors, capacitance change pressure sensors, photoelectric reflectors or surface acoustic wave devices. Each of the plurality of sensors is configured to detect a change in a physical property of the deformable layer.

3. The measuring device according to claim 1, characterized in that The deformable layer is formed of a material having a Poisson's ratio of less than 0.2, or has a plurality of portions having a shape or size such that adjacent portions do not contact each other when pressure is applied to the deformable layer in a vertical direction.

4. The measuring device according to claim 1, characterized in that The plurality of portions are arranged side by side in a direction along the arrangement surface on a surface of the deformable layer that faces the sensor array portion.

5. The measuring device according to claim 1, characterized in that A plurality of the sensors are arranged in a horizontal direction. The deformable layer includes a first layer having a plurality of the portions arranged spaced apart from each other in a direction toward the arrangement surface, and a plate-shaped second layer arranged on at least one of the upper and lower sides of the first layer.

6. The measuring device according to claim 5, wherein The ratio of the vertical dimension of the second layer to the vertical dimension of the deformable layer is less than 0.

3.

7. The measuring device according to claim 1, characterized in that The plurality of portions are separated from each other in a direction toward the configuration surface, A filling material is arranged between the plurality of the parts, which is different from the constituent material constituting the plurality of the parts. The rigidity of the filling material is less than or equal to half of the rigidity of the constituent material.

8. The measuring device according to claim 1, characterized in that The deformation layer is made of a material whose ratio of loss elastic modulus to storage elastic modulus is one tenth or less.

9. The measuring device according to claim 1, characterized in that The deformable layer is made of a material in which stress generated by deformation applied from the outside increases monotonically with respect to the magnitude of the deformation.

10. The measuring device according to claim 1, characterized in that The deformable layer is composed of a foam material with a closed-cell cell structure.

11. The measuring device according to claim 1, characterized in that The plurality of sensors are sensors capable of detecting pressure and have rectangular openings for detection. For the short side dimension of the rectangular opening, the thickness of the deformable layer is greater than 1 and less than 2.

5.

12. The measuring device according to claim 1, characterized in that The deformable layer is formed using EPDM sponge rubber.

13. A measuring system comprising a measuring device and a processing unit for obtaining a measurement result using a detection result of the measuring device, wherein: The measuring device includes: a sensor array unit having a plurality of sensors arranged on an upper surface of a configuration surface and each capable of detecting a detection event related to an object located relative to the configuration surface; and a soft layer, i.e., a deformable layer, arranged to be located between the sensor array portion and the object, The deformable layer has a plurality of portions separated from each other mainly in the normal direction of the arrangement surface so as to be independently compressively deformable. The processing unit is configured to use a different sensor as a reading target in each reading opportunity, and to obtain the measurement result using the detection result obtained by using some of the plurality of sensors as the reading target in each of the plurality of reading opportunities.

14. The measuring system according to claim 13, characterized in that The plurality of sensors are arranged in at least one predetermined direction. The processing unit is configured so that both of the two sensors adjacent to each other in the specified direction do not become reading objects in the same reading opportunity, and in each of multiple reading opportunities, the measurement result is obtained using the detection result obtained by using some of the multiple sensors as reading objects.

15. The measuring system according to claim 13, characterized in that The plurality of sensors are arranged in a matrix of N rows and M columns. The processing unit is configured to obtain the measurement result using the detection result synthesized from the detection result of the first group of sensors that are read in the first reading opportunity and the detection result of the second group of sensors that are read in the second reading opportunity, The first group of sensors are the sensors located in even rows and even columns among the plurality of sensors, The second group of sensors are the sensors located in odd rows and odd columns among the plurality of sensors.

Images