Modular assembly

Abstract

The present disclosure relates to a modular assembly for joining together modules of a device. The assembly includes two modules configured to be engageable with each other to abut each other. These modules each have a body (71; 72) and a plurality of adapters (81; 82), each configured to be coupled to a corresponding adapter (82; 82) of another one of the modules; 81), and a corresponding verification circuit is completed. Each verification circuit is configured to be closed when the adapter of one of the modules engages with a corresponding adapter of another of the modules. The adapter is configured to be electrically isolated from the body of one of the two modules, and the corresponding adapter is configured to be electrically connected to the body of the other of the two modules. The modules include composite elements configured to electro-optically interact or optically interact with each other during operation of the device.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from European application No. 22213194.8, filed on December 13, 2022, which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to a modular component, a device comprising the modular component, and an apparatus comprising the device or the modular component. Background Art

[0004] When manufacturing semiconductor integrated circuit (IC) chips, undesirable pattern defects inevitably appear on substrates (i.e., wafers) or masks during the manufacturing process due to, for example, optical effects and accidental particle intrusion, thereby reducing yield. Therefore, monitoring the extent of undesirable pattern defects is an important process in IC chip manufacturing. More generally, evaluating (e.g., inspecting and / or measuring) the surface of a substrate or other object / material is an important process during and / or after its manufacture.

[0005] Evaluation tools (which are referred to herein as evaluation systems) are known to use charged particle beams to evaluate objects (which may be referred to as samples), for example, to detect pattern defects. These systems typically use electron microscopy techniques, such as scanning electron microscopes (SEMs). In an SEM, a primary electron beam at relatively high energy lands on a sample with a relatively low landing energy, with a final deceleration step as the target. The electron beam is focused as a probe point on the sample. The interaction between the material structure at the probe point and the landing electrons from the electron beam causes signal electrons to be emitted from the surface, such as secondary electrons, backscattered electrons, or Auger electrons. Signal electrons can be emitted from the material structure of the sample. By scanning the primary electron beam as a probe point on the sample surface, signal electrons can be emitted across the surface of the sample. By collecting these emitted signal electrons from the sample surface, the pattern inspection system can obtain an image representing the characteristics of the material structure of the surface of the sample.

[0006] In applications such as charged particle systems (e.g., SEMs), different components or modules within the system are expected to be correctly aligned relative to each other during use. In some applications, different modules should be aligned to within a few microns (e.g., 5 microns) of each other. Known processes for verifying that modules are accurately aligned require precise measurements or verification during operation. This can be a challenging and time-consuming process, thereby reducing productivity and increasing costs. In addition, verifying alignment can be difficult when the interface or engagement surface of two adjoining modules is in an obstructed or difficult-to-access area of the device (e.g., in a device held in a vacuum). Summary of the Invention

[0007] It is an object of the present disclosure to provide a modular assembly for verifiably joining modules of a device together.

[0008] According to one aspect of the present invention, a modular assembly for joining the modules of a device together is provided, and the device is used to measure, inspect, process or manufacture semiconductor components. The assembly includes two modules, and the two modules are configured to be able to engage with each other to abut each other. These modules each have a main body and a plurality of adapters, and the plurality of adapters are each configured to engage with the corresponding adapter of another module in the module and complete the corresponding verification circuit. Each verification circuit is configured to be closed when the adapter of a module in these modules engages with the corresponding adapter of another module in these modules. The adapter is configured to be electrically isolated from the main body of a module in the two modules, and the corresponding adapter is configured to be electrically connected to the main body of the other module in the two modules.

[0009] According to another aspect of the present invention, there is provided an apparatus for projecting a beam of radiation, such as photons or charged particles, towards a sample. The apparatus comprises the modular assembly described.

[0010] According to another aspect of the present invention, there is provided an apparatus for measuring, inspecting, processing or manufacturing a semiconductor component, the apparatus comprising the device or the modular assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects of the present disclosure will become more apparent from the following description of exemplary embodiments with reference to the accompanying drawings.

[0012] Figure 1 is a schematic diagram illustrating an exemplary charged particle beam inspection apparatus.

[0013] Figure 2 is shown as Figure 1 Schematic diagram of an exemplary multi-beam apparatus that is a portion of an exemplary charged particle beam inspection apparatus.

[0014] Figure 3 is a schematic diagram of an exemplary electron-optical array including a converging lens array, an objective lens array, and a detector array.

[0015] Figure 4 is a schematic diagram illustrating an exemplary arrangement of a modular assembly including three modules, each with a corresponding adapter.

[0016] Figure 5 is a schematic diagram illustrating an exemplary arrangement for sending data from a detector module to an external data processing device.

[0017] Figure 6 is a schematic diagram showing an exemplary arrangement of modules with adapters.

[0018] Figure 7 is a schematic diagram illustrating an exemplary arrangement of modules with corresponding adapters and verification circuits connected to the corresponding adapters.

[0019] Figure 8A is a schematic diagram illustrating an exemplary arrangement of an adapter, a corresponding adapter, and a verification circuit connected to the corresponding adapter.

[0020] Figure 8B is a schematic cross-sectional view through a module to illustrate the operation of the present invention when the modules are engaged.

[0021] Figure 9 is shown including alignment with the module of FIG8 Figure 7 Schematic diagram of the modular components of the module.

[0022] Figure 10A is a schematic diagram showing a plan view of an exemplary arrangement of an adapter having a cylindrical shape and a corresponding adapter having a cylindrical shape.

[0023] Figure 10B It shows Figure 10A Schematic diagram of a coupling and a corresponding side view of the coupling.

[0024] Figure 11A is a schematic plan view showing an exemplary arrangement of an adapter having a spherical shape and a corresponding adapter having a spherical shape.

[0025] Figure 11B It shows Figure 11A Schematic diagram of a coupling and a corresponding side view of the coupling.

[0026] Figure 12A is a schematic plan view showing an exemplary arrangement of an adapter having a cylindrical shape and a corresponding adapter having a spherical shape.

[0027] Figure 12B is a schematic diagram showing a side view of the adapter of Figure 102A and a corresponding adapter.

[0028] Figure 13A is a schematic diagram showing a plan view of an exemplary arrangement of an adapter having a planar shape and a corresponding adapter having a spherical shape.

[0029] Figure 13B It shows Figure 13A Schematic diagram of a coupling and a corresponding side view of the coupling. DETAILED DESCRIPTION

[0030] Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings, in which like reference numerals in different figures represent like or similar elements unless otherwise specified. The implementations set forth in the following description of the exemplary embodiments are not intended to represent all implementations consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with aspects related to the present invention as recited in the appended claims.

[0031] The increased computing power of electronic devices (which reduces the physical size of the devices) can be achieved by significantly increasing the packaging density of circuit components (such as transistors, capacitors, diodes, etc.) on IC chips. This has been achieved through increased resolution, which enables the manufacture of smaller structures. For example, the IC chip of a smartphone the size of a thumbnail and released in 2019 or earlier may include over 2 billion transistors, each smaller than 1 / 1000 the size of a human hair. Therefore, it is not surprising that semiconductor IC manufacturing is a complex and time-consuming process with hundreds of individual steps. Even an error in a single step can seriously affect the functionality of the final product. In some cases, even a single defect can cause device failure. A goal of the manufacturing process is to improve the overall yield of the process. For example, to achieve a 75% yield for a 50-step process (where a step indicates the number of layers formed on the wafer), each individual step must have a yield higher than 99.4%. If each individual step has a yield of 95%, the overall process yield will be as low as 7%.

[0032] While high process yield is desirable in IC chip fabrication facilities, maintaining high substrate (i.e., wafer) throughput (defined as the number of substrates processed per hour) is also critical. High process yield and high substrate throughput can be impacted by the presence of defects. This is particularly true if operator intervention is required to review the defect. Therefore, high-throughput detection and identification of micron- and nanometer-scale defects by inspection systems, such as scanning electron microscopes ("SEMs"), is crucial to maintaining high yields and low costs.

[0033] The SEM includes a scanning device and a detector device. The scanning device includes an illumination device and a projection device, the illumination device including an electron source for generating primary electrons, the projection device for scanning a sample (such as a substrate) using one or more focused beams of primary electrons. The illumination device or illumination system together with the projection device or projection system can at least be collectively referred to as an electron-optical device or electron-optical device column. The primary electrons interact with the sample and generate secondary electrons. The detection device captures the secondary electrons from the sample as the sample is scanned, enabling the SEM to create an image of the scanned area of the sample. For high-throughput inspection, some inspection devices use multiple focused beams of primary electrons, i.e., multi-beams. The component beams of the multi-beam can be referred to as sub-beams or beamlets. The multi-beams are capable of scanning different parts of the sample at the same time. Therefore, a multi-beam inspection device is capable of inspecting samples at a much higher speed than a single-beam inspection device.

[0034] An implementation of a known multi-beam inspection apparatus is described below.

[0035] The figures are schematic. Therefore, the relative sizes of the components in the figures are exaggerated for clarity. In the following description of the figures, the same or similar reference numerals refer to the same or similar components or entities, and only the differences related to individual embodiments are described. Although the description and drawings are directed to electron-optical devices, it should be understood that these embodiments are not intended to limit the present disclosure to specific charged particles. Therefore, in this document, references to electrons can be considered more generally as references to charged particles, which are not necessarily electrons.

[0036] Now refer to Figure 1 , Figure 1 FIG2 is a schematic diagram showing an exemplary charged particle beam inspection apparatus 100 , which may also be referred to as a charged particle beam evaluation system or simply an evaluation system. Figure 1 The charged particle beam inspection apparatus 100 in FIG. 1 includes a main chamber 10, a load lock chamber 20, an electron beam device 40, an equipment front end module (EFEM) 30, and a controller 50. The controller can be distributed between different components of the evaluation system, for example, included in the electron beam device 40. The electron beam device 40 is within the main chamber 10.

[0037] The EFEM 30 includes a first load port 30a and a second load port 30b. The EFEM 30 may include additional load port(s). The first load port 30a and the second load port 30b may, for example, receive front-opening pods (FOUPs) containing substrates (e.g., semiconductor substrates or substrates made of other material(s)) or samples to be inspected (substrates, wafers, and samples are collectively referred to as "samples" hereinafter). One or more robotic arms (not shown) in the EFEM 30 transfer the samples to the load lock chamber 20.

[0038] The load lock chamber 20 is used to remove gas from around the sample. This creates a vacuum, which is a local air pressure lower than the pressure of the surrounding environment. The load lock chamber 20 can be connected to a load lock vacuum pump system (not shown) that removes gas particles from the load lock chamber 20. The operation of the load lock vacuum pump system enables the load lock chamber to reach a first pressure lower than atmospheric pressure. After reaching the first pressure, one or more robotic arms (not shown) transfer the sample from the load lock chamber 20 to the main chamber 10. The main chamber 10 is connected to a main chamber vacuum pump system (not shown). The main chamber vacuum pump system removes gas particles from the main chamber 10 so that the pressure around the sample reaches a second pressure lower than the first pressure. After reaching the second pressure, the sample is transferred to an electron beam device, by which the sample can be inspected. The electron beam device 40 may include a multi-beam electron optical device.

[0039] The controller 50 is connected to the electron beam device 40 with signals (e.g., electricity), for example, as a distributed component of the controller 50. The controller 50 can be a processor (such as a computer) configured to control the charged particle beam inspection device 100. The controller 50 can also include a processing circuit system configured to perform various signal and image processing functions. Although the controller 50 is in Figure 1 30, but it will be appreciated that the controller 50 may be part of the structure. The controller 50 may be located in one of the components of the charged particle beam inspection device, or may be distributed across at least two of the components. While the present disclosure provides an example of a main chamber 10 housing an electron beam inspection device, it should be noted that the various aspects of the present disclosure, in its broadest sense, are not limited to a chamber housing an electron beam inspection device. Rather, it will be appreciated that the aforementioned principles may also be applied to other systems and other device arrangements operating at a second pressure.

[0040] Now refer to Figure 2 , Figure 2 is a schematic diagram showing an exemplary charged particle beam evaluation apparatus 40. The electron beam apparatus 40 may be used as Figure 1Portions of an exemplary charged particle beam inspection system 100 are provided. The electron beam apparatus 40 includes an electron source 201 and a charged particle device array (or apparatus) 230. The charged particle device 230 may be referred to as or include a projection device for directing a primary charged particle beam 202 to a sample 208. The electron source 201 and the associated and constituent charged particle optical elements may be referred to as an illumination device for generating the primary charged particle beam 202. The evaluation apparatus includes a sample support that supports the sample 208. The sample support in this example includes a sample holder 207. The sample holder 207 holds the sample 208 (e.g., a substrate or mask) for evaluation. The sample holder 207 is supported by a motorized or actuated stage 209. The electron beam apparatus 40 also includes a detector 240. The detector 240 detects signal charged particles (e.g., electrons) from the sample 208. The detector 240 generates a detection signal when the signal charged particles are detected.

[0041] The charged particle beam evaluation device 40 may include a plurality of modules configured to be coupled to each other. Figure 2 As shown, one module 61 may include the source 201, and another module 62 may include the charged particle device 230. The modules may be configured to engage with each other so that the module 61 is aligned relative to the other module 62. The modules 61, 62 may be configured to be aligned relative to the charged particle beam 202.

[0042] The electron source 201 may include a cathode (not shown) and an extractor or anode (not shown). During operation, the electron source 201 is configured to emit electrons from the cathode as primary electrons. The primary electrons are extracted or accelerated by the extractor and / or anode to form a primary electron beam 202.

[0043] The charged particle device 230 is configured to convert the primary electron beam 202 into a plurality of charged particle beams 211, 212, 213 and direct each beam onto the sample 208. Although only three beams are shown for simplicity, there may actually be tens, hundreds, thousands, tens of thousands, or even hundreds of thousands (or more) of beams. These beams may be referred to as beamlets or beamlets. A plurality of charged particle beams may be collectively referred to as a multi-beam or beam grid. A beam grid with so many beams (e.g., more than one thousand beams) may have, for example, a field of view greater than 0.5 mm, for example, in the range of 0.5 to 30 mm or 1 to 30 mm.

[0044] The controller 50 (e.g., a control system including distributed controllers) may be connected to Figure 1The controller 50 may be configured to control various components of the charged particle beam inspection apparatus 100, such as the electron source 201, the electron detection device 240, the charged particle device 230, and the actuation stage 209. The controller 50 may perform various image and signal processing functions. The controller 50 may also generate various control signals to control the operation of the charged particle beam inspection apparatus 100, including the operation of the electron beam device 40.

[0045] The charged particle device 230 can be configured to focus, for example, beams 211, 212, and 213 onto the sample 208 for inspection, and can form three detection spots 221, 222, and 223 on the surface of the sample 208. The charged particle device 230 can be configured to deflect the primary beams 211, 212, and 213 to scan the detection spots 221, 222, and 223 across individual scanning areas in a portion of the surface of the sample 208. In response to the primary beams 211, 212, and 213 being incident on the detection spots 221, 222, and 223 on the sample 208, electrons are generated from the sample 208, including secondary electrons and backscattered electrons, which can be referred to as signal charged particles. The secondary electrons typically have electron energies as great as fifty electron volts (≤50 eV), and the backscattered electrons typically have electron energies between fifty electron volts (50 eV) and the landing energies of the primary beams 211 , 212 , and 213 .

[0046] The detector 240 can send detection signals generated in the detector 240 (e.g., as imaging signals or detection signals) to the controller 50 or a signal processing system (not shown, which can be part of the controller 50), for example, to construct an image of the corresponding scanned area of the sample 208. The detector 240 can be at least partially incorporated into the charged particle device 230, or can be separate therefrom, for example, where a secondary optical train directs the secondary electrons to the detector 240.

[0047] The controller 50 may include an image processing system comprising an image collector (not shown) and a storage device (not shown). For example, the controller may include a processor, a computer, a server, a mainframe, a terminal, a personal computer, any type of mobile computing device, or a combination thereof. The image collector may include at least some of the processing functionality of the controller. Thus, the image collector may include at least one or more processors. The image collector may be communicatively coupled to the detector 240 to allow signal communication, such as by electrical conductors, fiber optic cables, portable storage media, infrared (IR), Bluetooth, the internet, a wireless network, radio, or a combination thereof. The image collector may receive detection signals from the detector 240, process the data included in the signals, and construct an image therefrom. Thus, the image collector may capture an image of the sample 208. The image collector may also perform various post-processing functions, such as generating outlines and overlaying indicators on the captured image. The image collector may be configured to adjust the brightness, contrast, and other aspects of the captured image. The storage device may be a storage medium such as a hard drive, a flash drive, a cloud storage device, random access memory (RAM), or other types of computer-readable memory. The storage device may be coupled to the image collector and may be used to save the scanned raw image data as a raw image and to save a post-processed image.

[0048] The image collector can capture one or more images of the sample 208 based on the imaging signal received from the detector 240. The imaging signal can correspond to a scanning operation for performing charged particle imaging. The captured image can be a single image including multiple imaging areas. The single image can be stored in a storage device. The single image can be an original image, which can be divided into multiple areas. Each of the multiple areas can include an imaging area containing features of the sample 208. The captured image can include multiple images of a single imaging area of the sample 208 sampled multiple times over a period of time. These multiple images can be stored in a storage device. The controller 50 can be configured to perform image processing steps using multiple images of the same position of the sample 208.

[0049] The controller 50 may include a measurement circuit system (e.g., an analog-to-digital converter) to obtain the distribution of the detected secondary electrons. A portion of the controller for such functionality may be included in or near the detector. The electron distribution data collected during the detection time window can be used in combination with the corresponding scan path data of each of the primary beams 211, 212, and 213 incident on the sample surface to reconstruct an image of the inspected sample structure. The reconstructed image can be used to reveal various features of the internal or external structure of the sample 208. Therefore, the reconstructed image can be used to reveal any defects that may be present in and / or on the sample.

[0050] The controller 50 can control the actuated stage 209 to move the sample 208 during inspection of the sample 208, for example, to provide a scanning motion of the stage relative to the path of the primary beam. The controller 50 can enable the actuated stage 209 to at least move the sample 208, such as continuously, at a constant speed, for example, in a direction such as a portion of the scanning motion of the stage, during inspection of the sample. The controller 50 can control the movement of the actuated stage 209 such that it varies the speed of movement of the sample 208 depending on various parameters. For example, at least with respect to a combined step and scan strategy of the stage, the controller can control the stage speed (including its direction) depending on the characteristics of the inspection step and / or scan of the scanning process, such as disclosed in EPA 21171877.0 filed on May 3, 2021, which is incorporated herein by reference. When the actuation stage is controlled, actuation of the stage and thereby of the sample may enable the sample to be positioned, eg dynamically positioned, relative to the path of the primary beam.

[0051] Figure 3 2 is a schematic diagram of an exemplary charged particle device 41 for use in an evaluation device. Such a charged particle device 41 may include a source 201. For ease of explanation, the lens array is schematically shown in this article as an array of elliptical shapes. Each elliptical shape represents one of the lenses in the lens array. Elliptical shapes are generally used to represent lenses, similar to the biconvex shapes often used in optical lenses. In the context of charged particle devices such as those discussed herein, it will be understood that the lens array will generally operate electrostatically, and therefore may not require any physical elements using biconvex shapes. As described below, the lens array may instead include a plurality of plates with apertures. Each plate with an aperture may be referred to as an electrode. These electrodes may be provided in series along the path of a beam grid of a plurality of charged particle beams (which may also be referred to as beamlets). Therefore, these electrodes are also connected in series along the path of the charged particle beam of the beam grid.

[0052] The electron source 201 guides electrons to a converging lens array 231 that forms part of the charged particle device 230. The electron source 201 is desirably a high-brightness thermal field emitter with a good compromise between brightness and total emission current. There can be dozens, hundreds, thousands, or even tens of thousands of converging lenses 231. The converging lenses of the array 231 can include a multi-electrode lens and have a structure based on EP1602121A1, which is incorporated herein by reference, and in particular discloses a lens array for dividing an electron beam into a plurality of beamlets, the array providing a lens for each beamlet. The converging lens array can be in the form of at least two (e.g., three) plates, used as electrodes, with the apertures in each plate aligned with the apertures in the other plates to define a path for the charged particle beam to pass through these plates. At least two plates are maintained at different potentials during operation to achieve the desired lens effect. Between the plates of the converging lens array are electrically insulating plates, for example, made of an insulating material such as ceramic or glass, with one or more apertures for the charged particle beam. Additionally or alternatively, one or more plates may feature an aperture in which each plate has its own electrode, for example, with an array of electrodes around its periphery, or arranged as an aperture group with a common electrode. In one variant, one or more plates may include multiple sections or strips with multiple apertures. In another alternative arrangement, a macrocollimator is provided in place of the converging lens array. The macrocollimator may act on the beam from source 201 before it has been split into multiple beams. The macrocollimator may be implemented magnetically, electrostatically, or magneto-electrostatically.

[0053] In some embodiments, the converging lens array is formed from an array of three plates, where charged particles have the same energy upon entering and exiting each lens. This arrangement can be configured as a single lens and can be referred to as a single lens. Therefore, chromatic dispersion occurs only within the single lens itself (between the lens's entrance and exit electrodes), limiting off-axis chromatic aberration. When the converging lens thickness is low (e.g., a few millimeters), such chromatic aberration has little or negligible effect.

[0054] Each converging lens in the array directs electrons into a respective beam 211, 212, 213, which are focused at a respective intermediate focus 233. A collimator or array of collimators may be positioned to operate at the respective intermediate focus 233. The collimator may take the form of a deflector 235 provided at the intermediate focus 233. The deflector 235 is configured to bend the respective beam 211, 212, 213 by an amount sufficient to ensure that the chief ray (which may also be referred to as the beam axis) is incident on the sample 208 substantially perpendicularly (i.e., substantially at 90° to the nominal surface of the sample). It should be noted that in an arrangement with a macro converging lens, the converging lens may collimate or assist in collimating the source beam, or in one embodiment, collimate multiple beams.

[0055] The objective lens array 401 is provided below the deflector 235. The objective lens array 501 includes an objective lens for each beam 211, 212, 213. The objective lens array 401 projects the beams 211, 212, and 213 onto the sample 208. The objective lens array 401 may include two or more (e.g., at least three) plate electrode arrays connected to corresponding potential sources.

[0056] Optionally, a control lens array 250 is provided between the deflector 235 and the objective lens array 401. The control lens array 250 includes a control lens for each beam 211, 212, 213. The control lens array 250 provides an additional degree of freedom for controlling the properties of the beams 211, 212, 213. The control lens array 250 may include two or more (e.g., at least three) plate electrode arrays connected to corresponding potential sources. The function of the control lens array 250 is to optimize the beam opening angle relative to the reduction in the speed of light and / or control the beam energy delivered to the objective lenses, each of which directs the corresponding beam 211, 212, 213 onto the sample 208. In one embodiment, the control lens array can be considered as part of the objective lens, for example, as an additional plate associated with the objective lens array.

[0057] Optionally, a scanning deflector array 260 is provided between the control lens array 250 and the objective lens array 401. The scanning deflector array 260 includes a scanning deflector for each beam 211, 212, 213. Each scanning deflector is configured to deflect the corresponding beam 211, beam 212, beam 213 into one or two directions to scan the beam across the sample 208 in one or two directions. Alternatively, a macro scanning deflector can be provided to scan the charged particle beam on the sample 208. The macro scanning deflector can be provided on the control lens array 250. In one embodiment, such a macro scanning deflector can operate on the source beam and can be present together with the macro converging lens.

[0058] The detector module 402 of the detector is provided in the objective lens or between the objective lens and the sample 208 for detecting signal electrons / particles from the sample 208. An exemplary configuration of such a detector module 402 is described below. It should be noted that the detector can additionally or alternatively have detector elements along the primary beam path of the objective lens array 401 or even the control lens array 250. The detector module can be an array of detector elements (e.g., a detector array). Each element can be associated with an individual beam, for example, positioned to detect signal particles generated by the individual beam.

[0059] Figure 3The charged particle device 41 in the apparatus can be configured to control the landing energy of electrons on the sample 208 by varying the potentials applied to electrodes of the control lens and the objective lens. The control lens and the objective lens work together and can be referred to as an objective lens assembly. The landing energy can be selected to increase the emission and detection of secondary electrons depending on the properties of the sample being evaluated. A detector module can be included in the objective lens assembly.

[0060] The objective lens can be configured to reduce the electron beam by more than 10 times, desirably in the range of 50 to 100 times or more. The objective lens can include three electrodes: a middle electrode, a lower electrode, and an upper electrode. The upper electrode can be omitted. An objective lens with only two electrodes can have lower aberrations than an objective lens with more electrodes. A three-electrode objective lens can have a larger potential difference between the electrodes, thereby achieving a stronger lens. Additional electrodes (i.e., more than two electrodes) provide additional degrees of freedom for controlling the electron trajectory, for example, to focus the secondary electrons as well as the incident beam.

[0061] In some embodiments, the objective array assembly includes a detector having a detector module 402 positioned below at least one electrode of the objective array 401. Detector module 402 may include, or even take the form of, a detector array. In one embodiment, at least a portion of the detector is adjacent to and / or integrated with the objective array 401. For example, detector module 402 may be implemented by integrating a CMOS chip detector into the bottom electrode of the objective array 401. Integrating detector module 402 into the objective array can replace a secondary device array. The CMOS chip is preferably oriented facing the sample (due to the relatively small distance between the sample and the bottom of the electron optical system, which may be, for example, in the range of 10 to 400 microns, desirably in the range of 50 to 200 microns, and optionally approximately 100 microns). It should be noted that even in the case where the detector is positioned above the lowest beam electron optical element of a charged particle device, the lowest beam electron optical element and the sample may be closely spaced, for example, by a similar distance (e.g., approximately 100 microns). In one embodiment, the electrodes for capturing signal charged particles are formed in the top metal layer of the CMOS device. Electrodes can also be formed in other layers of the substrate, such as those of a CMOS chip. CMOS power and control signals can be connected to the CMOS via through-silicon vias (TSVs). For robustness, the bottom electrode desirably consists of two components: the CMOS chip and a passive silicon plate with an aperture. This plate protects the CMOS from high electric fields.

[0062] In one embodiment, an electrode arrangement (such as a single electrode or multiple electrodes) surrounds at least some of the apertures. In one arrangement, a single electrode is, for example, arranged around each aperture. In another embodiment, multiple electrode elements are provided around each aperture, for example as detector elements. The signal charged particles captured by the electrode elements surrounding an aperture can be combined into a single detection signal, or used to generate independent detection signals. The electrode elements can be separated radially (i.e., to form multiple concentric rings), angularly separated (i.e., to form multiple fan-shaped pieces), radially and angularly separated (providing an arrangement similar to a dart board), or separated in a grid (e.g., like a chessboard) or in any other convenient manner.

[0063] In one arrangement, the charged particle device may comprise a plurality of Figure 3 Shown and referenced Figure 3 Charged particle devices are described that are configured to scan and image one or more samples simultaneously. Such charged particle devices may include a multi-device array system of multiple charged particle devices.

[0064] Figure 3 The charged particle device 41 may include a first module 61 and a second module 62, the first module 61 and the second module 62 being configured to engage with each other so that the first module is aligned relative to the second module 62, as described above with respect to Figure 2 As described. In one arrangement, there may be more than two modules. Different modules 61, 62 may include one or more submodules 611, 612, 613 and 614. The allocation of submodules to different modules may vary between designs. The allocation shown is intended to be an exemplary arrangement. (Since the components between submodules and modules may be similar, unless otherwise stated, in the remaining description, references to modules include references to submodules.) For example, there may be a module 611 including a source, another module 612 including a converging lens array 231, another module including a deflector 235, and a lower beam module 614 including a lower beam of a component of the deflector 235. For example, the lower beam module may include one or more of the control lens array 250, the scanning deflector array 260, the objective lens array 401 and / or the detector module 402.

[0065] For example, an apparatus for measuring, inspecting, processing or manufacturing semiconductor components may include a plurality of modules 611, 612, 613 (or 61, 62) configured to be coupled to each other. Such a module may include a body and a plurality of couplers; a portion of a charged particle device 41, such as a source 201. A first module 611 including a body 71 and a plurality of couplers 81 is provided in FIG. Figure 4 The first module 611 may include Figure 3The second module 612 including the main body 72 and the plurality of adapters 82 is Figure 4 The second module 612 may include Figure 3 The third module 613 including the main body 73 and a plurality of adapters 83 is Figure 4 The second module 613 may be a collimator (such as Figure 3 Although different modules are specifically described as having particular components, this described arrangement is exemplary and such a module may have two or more adjacent electron-optical assemblies of a device such as the charged particle device 41 which may take the form of a device column.

[0066] A modular assembly may be provided for joining together modules of a device (such as a first module 611 and a second module 612, and / or a second module 612 and a third module 613). It may be desirable to join the modules together so that the first module 611 is positioned relative to the second module 612 at a predetermined target position, and vice versa. That is, it is desirable that the first module 611 and the second module 612 are joined when the first module 611 and the second module 612 are in a determined position relative to each other; such relative position may be referred to as a predetermined target position (note that the positioning of a feature relative to a different feature (such as a first module and a second module) mentioned herein may be considered to mean the position of the different feature relative to the feature, or the relative positioning of the feature and the different feature relative to each other). For some applications, it may be desirable to position the first module 611 relative to the second module 612 to within a few microns of the target position, particularly within a tolerance of 5 microns or less. Therefore, it is desirable that the modular assembly provide components to assist in positioning the modules at the target positions, as well as components for verifying that the modules are positioned at the target positions. The engager 81 of the first module 611 can be configured to engage or contact the engager 82 of the second module 622 when the first module 611 is in a target position relative to the second module 612. In this way, the engagers 81, 82 of two modules can facilitate alignment of the modules relative to each other by providing a contact point between the two or more modules.

[0067] Figure 4 The modular assembly comprises three modules 611, 612, 613, which are configured to be able to engage with each other to abut each other in the direction indicated by arrow 91. (Note that the reference numerals are for convenience only and are not intended to refer to Figure 3 As shown and referenced in Figure 3612. The same identical modules described herein are used, although they can be used in such an arrangement. This part of the description is intended to refer to the mode of engagement of different modules, rather than the mode of engagement of specific different electronic optical components therein). In other words, when the device is operated, the first module 611 and the third module 613 are expected to be deployed at the target location relative to the second module 622. When the first module 611 is in the target location, one or more surfaces of the first module 611 can contact the second module 612. The adapter 82 of a module 612 is each configured to engage with the corresponding adapter 81 of another module 611. In other words, these modules are configured so that when the first module 611 is in the target location relative to the second module 612, each adapter in the adapter 81 of the first module 611 will contact the adapter 82 of the second module 612.

[0068] The position of the adapter is expected to be known within a predetermined tolerance so that the relative position of the module as determined by the adapter can be verified to reach the required accuracy. The predetermined tolerance is expected to be 5 microns or less. Such verification helps to ensure that the components (such as electron optical components) in different modules are aligned with enough accuracy to each other, for example, aligned with each other with enough accuracy to the expected charged particle beam path along which components are positioned during operation. For example, the adapter of each module can be calibrated during manufacture so that their positions are within tolerance requirements. For example, different modules can be calibrated (i.e. pre-calibration) before assembling. In this way, when module is correctly aligned for operation, the adapter of two adjacent modules can reliably engage as expected. For example, the position of the adapter is pre-calibrated relative to the main body of the corresponding module. Because module may include components (such as electron optical components), therefore adapter can be pre-calibrated relative to components during the manufacture of module. Because components may need to be positioned within a certain range of expected path, for example, alignment path (such as charged particle beam path), adapter can be positioned relative to the expected path in the module. When the module is assembled and the charged particle device is in operation, the adapter may be pre-calibrated to be positioned relative to the charged particle beam.

[0069] An arrangement involving multiple optical fibers (or other communication channels) Figure 5. Each optical fiber 242 is connected to a subunit (or detector unit) 241 of the detector module 240 and transmits a signal generated by the corresponding subunit 241 to a data processing device 500 outside the main cavity 10. Each subunit 241 may include one or more individual electrodes of the detector module 240. It should be appreciated that in a multi-device array system (or multi-charged particle device system or multi-device system) capable of imaging a large portion of the sample 208 at a time, a large number of optical fibers 242 will be required, and therefore the vacuum feedthrough 11 must be large. In addition to taking up space, a large vacuum feedthrough or multiple smaller feedthroughs may also be difficult to seal.

[0070] It should be noted that for arrangements including multiple planar electron-optical elements (e.g., electrodes) positioned along multiple beam paths, the detector module or detector array can have internal circuitry. This internal circuitry can include some or all of the processing circuitry (e.g., CMOS structures) for connecting the individual detector elements or detector cells in the detector array. In an alternative arrangement, two or more of the signal conduits for different detector cells can have common or adjacent connections in the surface of the detector module. Co-locating multiple connections for the signal conduits to the detector module simplifies connecting the signal conduits to the detector modules. In one arrangement, multiple detector cells have a common signal conduit, so that the multiple detector cells can be grouped. Each detector cell can be associated with one of the multiple beams, so that the detector is arranged to detect signal particles from the sample generated by a specific beam from the multiple beams. In a different arrangement, arrays of detector cells associated with different pixels can each be associated with one of the multiple beams. Such an arrangement can be suitable for inspection systems used to detect defects. Such an arrangement can be suitable for metrology systems in which each pixel (e.g., detector cell) is used to count signal electrons.

[0071] Figure 5 The arrangement may include a plurality of modules configured to engage with each other. Figure 2 As shown, one module 61 may include the source 201 (e.g., at least the source) and optionally one or more other components of the charged particle device 41. Another module 62 may include other components of the charged particle device, such as charged particle detection components, such as the detector 240 and the subunit 241. The modules may be configured to engage with each other so that the module 61 is aligned relative to the other module 62. The modules 61 and 62 may be configured to be aligned relative to the charged particle beam 202.

[0072] The first module 611 including the main body 71 and the plurality of adapters 81 is Figure 6 The second module 612 including the main body 72 and the plurality of adapters 82 is shown in FIG. Figure 7The first module and the second module may each include Figure 3 For example, the first module 611 may include the source 201, and the second module 612 may include the converging lens array 231. The first module 611 is configured to engage with the second module 612 so that when all the engagers 81 of the first module 611 engage with the engagers 82 of the second module 612, the first module is aligned in a target position relative to the second module 612. Figure 7 As shown in FIG, each adapter 82 of the second module 612 is connected to the verification circuit 92, or at least to the electrical wiring (such as wires and other conductors) of such a circuit. That is, different verification circuits 92 may include different adapters 82 of the second module 612. The main body of the first module 611 can be connected to the power supply of the same verification circuit (see FIG. Figure 8B The power supply 95 of the first module 611 is connected to the main body 71 of the first module 611. In other words, the same main body 71 of the first module 611 can be connected to all different verification circuits. The main body 71 and the adapter 81 of the first module 611 can be in electrical communication with each other. For example, the main body 71 and the adapter 81 of the first module 611 can be in direct electrical contact with each other. The connection of the power supply of one of the verification circuits to the main body 71 of the first module 611 is actually an electrical connection of the adapter 81 of the first module 611.

[0073] Figure 8A Elements of a modular assembly are shown including a first module 611 and a second module 612 . Figure 8A Shown is the arrangement in target position of wherein module 611 relative to second module 612. First module 611 and second module 612 are described when they are engaged. In order to make it possible to see adapter and verification circuit more clearly, module body 71, module body 72 are not shown. In this position, each adapter 82 of a module (for example, second module 612) engages with the corresponding adapter 81 of another module (for example, first module 611). Each adapter 82 of a module (for example, second module 612) in the module contacts with the corresponding adapter 81 of another module (for example, first module 611). Each verification circuit 92 is configured to be closed or complete when the adapter 81 of a module (for example, first module 611) in the module engages with the corresponding adapter 82 of another module (for example, second module 612) in the module. In this way, modular assembly can be used to verify that each adapter 82 of a module 612 has engaged with its corresponding adapter 81 of another module 611. This is because the engagers of the different modules that become engaged are in electrical communication with the same authentication circuit (and therefore part of the same authentication circuit).

[0074] exist Figure 8AIn the arrangement shown in , the adapter 82 of the second module 612 is configured to be electrically isolated from the body 72 of the second module 612. In this arrangement, the corresponding adapter 81 of the first module 611 is configured to be electrically connected to the body 71 of the first module 611. Therefore, there is isolation between the body 72 of the second module 612 and the adapter 82 of the second module, such as the isolator 93. Such an arrangement is Figure 8B are shown schematically in the figure, where the same features have Figure 6 、 Figure 7 as well as Figure 8A The same reference numerals are used in the figures. In the arrangement shown, two verification circuits 92 are shown with an isolator 93 between the body 72 of the second module and the coupler 82 of the second module 612. The verification circuits 92 are shown connected to the body 71 of the first module 611 and to a corresponding power source 95. In this way, each verification circuit 92 is not complete until an electrical connection is established with the verification circuit 92 by physically and electrically connecting the coupler 82 of the second module 612 to the corresponding coupler 81 of the first module 611. If the verification circuit 92 is complete or closed, the coupler 81 of the first module 611 and the corresponding coupler 82 of the second module 612 are in contact. If all verification circuits 92 are complete or closed, each coupler 81 and the corresponding coupler 82 must be in contact. This is in Figure 8B is depicted in . In one verification circuit (left side), a gap 96 is shown between the couplers, which gap 96 can be detected by the alarm 94. In another verification circuit 92 (right side), the couplers 81 and 82 are in contact with each other (are engaged), which can be detected by the alarm 94. Details of the alarm will be mentioned later. Different arrangements for isolation can be used, for example: an isolation layer can be between the coupler and the body 72 of the second module; or the coupler includes isolation material (i.e., in addition to the electrical path between the connection to the verification circuit and the contact point for contacting another coupler of a different module); or another practical arrangement that is obvious to those skilled in the art.

[0075] Each adapter of a module and the corresponding adapter of another module can be referred to as a pair of adapters, which are coupled to complete the verification circuit. In each pair of adapters, there is an isolated adapter of one module and a connected adapter of another module. In each pair of adapters, the isolated adapter is configured to be electrically isolated from the main body of the first module, and the connected adapter is configured to be electrically connected to the main body of the second module. The isolated adapter in the adapter pair is connected to the verification circuit so that the contact between the isolated adapter and the connected adapter in the adapter pair completes the verification circuit. Figure 7 and Figure 8A An arrangement is shown in which all verification circuits 92 are provided on the same module 612. This means that Figure 6 、 Figure 7 as well as Figure 8A In the arrangement of FIG, the isolated adapter is the adapter 82 of the second module 612, and the connected adapter is the adapter 81 of the first module 611. In other words, the body 72 and the plurality of adapters 81 of one module 612 in the modules are configured to be electrically isolated from each other, and the body 71 and the plurality of adapters 81 of another module 611 in the modules are configured to be electrically connected to each other.

[0076] In an alternative arrangement, not all verification circuits may be provided on the same module. A module may include a plurality of adapters, each adapter belonging to a respective adapter pair. The plurality of adapters may include one or more first adapters, each first adapter being electrically isolated from the body of the module and each first adapter being connected to the verification circuit, and one or more second adapters being electrically connected to the body of the module. An example module having such an adapter is Figure 4 As shown in and referenced Figure 4 The second module is described.

[0077] Figure 9 Shown Figure 8A Floor plan of the modular components. Figure 8A Differently, the main body 71 of the first module 611 and the main body 72 of the second module 612 are Figure 9 Visible in. Figure 9 Also included are arrows 85 indicating the direction of the load applied to urge each adapter 82 and the corresponding adapter 81 together. Figure 9 The components shown in FIG. 8 are otherwise the same as those shown in FIG. 8 and described above with reference to FIG. 8 .

[0078] The modular assembly desirably further includes a pre-tensioning unit (not depicted) configured to apply a load to force the adapter 82 and the corresponding adapter 81 together. The modular assembly may include a plurality of pre-tensioning units, each pre-tensioning unit configured to apply a load to force one of the adapters 82 and the corresponding adapter 81 together, such as Figure 9 For example, when a pair of adapters 81 and 82 are connected together. Figure 9As shown, each pretensioning unit is desirably configured to apply a load in a single translation direction. Each adapter 82 is configured to engage with the corresponding adapter 82 at a contact point on the interface surface of the corresponding adapter. The pretensioning unit is configured to apply a load (referred to as a pretensioning load) in a direction perpendicular to the interface surface of the corresponding adapter at the contact point. The pretensioning unit can be arranged to apply a force to the adapter (associated therewith) that is opposite to the force applied to the adapter at the contact point (i.e., between the adapter and the corresponding adapter). The pretensioning unit can have the same module as the adapter associated therewith, or be located outside the module of the adapter associated therewith.

[0079] The pre-tensioning unit may, for example, include a resilient member, such as a spring element. When contact is made between two adapters of different modules, the resilient member may be positioned between the bodies of the different modules during engagement of the modules. The pre-tensioning unit may help ensure that the adapters remain in contact with each other, provided that the modules are aligned within a few microns of the desired relative alignment between the modules.

[0080] The load applied by the pretensioning unit is desirably higher than the deformation load, desirably generating a load as pretension on the corresponding adapter, for example, on the interface surface between the adapters that join the two modules. The deformation load is a threshold load, above which one or both of the modules or their components may be permanently deformed, for example, may be subject to plastic deformation. That is, the pretensioning force is limited. The size of the pretensioning load is limited in that it should not exceed the maximum allowable load on the adapter, where the maximum allowable load is the load corresponding to the maximum allowable deformation of the adapter so that the alignment is within acceptable tolerances.

[0081] The pretension load can optionally be set by iteratively applying a load until it is determined that the pretension load is greater than the deforming force. In other words, the pretension load can be iteratively increased until the verification circuit shows that the coupler is always in contact. This iteration can be performed when installing or replacing a module. Desirably, the pretension load is as high as possible, but does not significantly exceed the deforming load. For example, the pretension load can be between 50N and 150N, desirably between 70N and 120N, and more desirably between 80N and 110N. The deforming load can be between 800N and 150N.

[0082] Optionally, there may be a seal between the two modules, which may be made of an elastic material and which may be annular, such as an O-ring. The modules may be pressed together using the seal between the modules, for example, to form a seal between the modules. For example, the modules may be pressed together in the Z direction, with the seal (e.g., an O-ring) between the two modules in the Z direction. Multiple adapters may be distributed in the desired positions and orientations to verify that the two modules are relatively aligned in the X direction, the Y direction, and the rotational direction around the Z direction.

[0083] The pretension unit is configured to apply a load to a pair of adapters so that the adapters are forced together. For example, the force can cause the adapter to deflect a deflection distance. Due to the deflection, even if the relative position of the module changes by several microns, each adapter and the corresponding adapter can still remain engaged and in contact with each other. In this way, the engagement of each pair of adapters can be used to verify that the relative position of the module is within the deflection distance in the engagement direction of the adapter pair at the target position. The deflection distance can be up to 20 microns, preferably up to 10 microns, and more preferably up to 5 microns. It is expected that the deflection should be lower than the size of the tolerance. The engagement of the adapter with the corresponding adapter is expected to be used to verify the alignment of the modules relative to each other. If the adapter does not deflect, even very small misalignment (e.g., 1 micron misalignment) may cause the engagement to fail. However, in practical applications, misalignment within the deflection distance can be acceptable and expected. Therefore, the application of the pretension load can prevent the verification circuit from becoming incomplete / disconnected and avoid triggering the realignment of the module when the module is actually aligned within an acceptable tolerance range for the application. This arrangement can therefore save a considerable amount of time, for example days, during which it would otherwise be impossible to tell whether a misalignment exists or which module is misaligned in which degree of freedom. It can also avoid unnecessary realignment of the modules.

[0084] The modular assembly may include up to six adapters, for example for engagement between two modules. Desirably, the adapters of one module are configured to engage with corresponding adapters of another module so that the two modules are aligned in up to six degrees of freedom.

[0085] For example, Figure 9 The modular assembly consists of six adapters. In other words, Figure 9 Each of the two modules 611, 612 of the arrangement comprises three adapters 81, 82. The number of adapter pairs engaging the two modules may correspond to the number of degrees of freedom that may be aligned in the modular assembly.

[0086] The three adapters of each module are arranged so that when the three adapters of one module engage with the corresponding three adapters of another module. Thus, by engaging three pairs of adapters, the modular assembly can be aligned in three degrees of freedom. Desirably, the two modules are aligned in two translational degrees of freedom and one rotational degree of freedom. For example, Figure 9 The two modules are arranged so that the modules are aligned in a translational horizontal direction or XY direction and in a rotational direction about a vertical direction or Z direction.

[0087] exist Figure 9 In the arrangement, when the modules are joined, the body 71 of the first module 611 is partially located within the body 72 of the second module 612. The modules are concentric relative to each other and share a common axis. The common axis is the axis in the Z direction, which is the axis of Figure 9 Desirably, the common axis is a common axis of an alignment path, such as a beam path of radiation, such as charged particles or light, during operation of an apparatus comprising the modular assembly.

[0088] Each verification circuit can be configured to verify the alignment of the positioning of the two modules relative to each other in one degree of freedom when the verification circuit is closed. In other words, each verification circuit can be complete or closed when the first module 611 is aligned with the second module 612 in a single degree of freedom. Therefore, the number of closed verification circuits can indicate the number of contacting couplers and the number of degrees of freedom in which the joined modules are aligned relative to each other. The degree of freedom desirably corresponds to the direction of the load applied by the pretensioning unit.

[0089] The modular assembly is desirably configured such that alignment between two modules is verified when verification circuits of all of the plurality of adapters of the two modules are closed.

[0090] The modular assembly may include or be configured to control an alarm 94, such as a speaker or a light. The alarm 94, such as a light (which illuminates when the corresponding verification circuit 92 is closed) Figure 7 , Figure 8 and Figure 9 The modular assembly is desirably configured to trigger an alarm when all verification circuits are closed. Desirably, there are multiple alarms, each corresponding to a different verification circuit, and the modular assembly is configured to trigger each of the alarms when the verification circuit corresponding to the alarm is completed or closed.

[0091] The modular assembly may be configured such that when alignment between two modules is verified, the modules are configured to align with a beam path of particles, which may be photons or charged particles, that is common to the modules of the modular assembly.

[0092] Figure 9An example of a modular assembly comprising two modules 611, 612 is provided. However, e.g. Figure 4 As shown in , a device may include more than two modules, for example, three modules 611, 612, 613. Figure 4 As shown in the arrangement of FIG, in addition to the first module 611 and the second module 612, the modular assembly can also include at least another module 613, the other module 613 including at least one adapter 83, the at least one adapter 83 being configured to engage with the adapter 82 of one of the two modules 611, 612. The other module 613 includes another body 73 and another plurality of adapters 83, each of the other plurality of adapters 83 being configured to engage with a corresponding adapter 82 of the other module (e.g., the second module 612). The engagement of each adapter 83 of the other module 613 with the corresponding adapter 82 of the other module (e.g., the second module 612) can complete a corresponding verification circuit, similar to the verification circuit of the arrangement of FIG8 described above. Unless otherwise specified, the features can be the same. The completion of all verification circuits associated with the adapter 83 of the other module 613 can verify that the other module 613 is aligned relative to the other module (e.g., the second module 612).

[0093] Modular assembly can comprise more than three modules.In addition, a module can be provided with the adapter that is configured to engage with the adapter of more than one other module.In other words, the first module can be provided with two adapters, wherein one adapter in the two adapters is configured to engage with the corresponding adapter of the second module, to complete the first verification circuit (or verification circuit set, if many pairs of adapters are used to engage between the first module and the second module), and another adapter in the two adapters is configured to engage with the corresponding adapter of the third module, to complete the second verification circuit (or second verification circuit set, if many pairs of adapters are used to engage between the first module and the third module).In this way, it can be verified that the first module is correctly aligned or positioned relative to other two modules on at least one degree of freedom.

[0094] The adapter of a module in the module is desirably configured to engage with the corresponding adapter of another module at a single contact point between them.The adapter can have an interface surface, and this interface surface is configured to contact with the interface surface of the corresponding adapter.The interface surface of the adapter can be shaped so that there is a single contact point between this adapter and the corresponding adapter. In other words, desirably every pair of adapters (comprising the adapter of a module and the corresponding adapter of another module) determines the relative position of two modules only on a degree of freedom.For example, this can be achieved by using the adapter pair shaped as shown in the following reference figure 10 to Figure 13.

[0095] Figure 10A The adapter 811 and the corresponding adapter 821 are shown in a plan view from above. Figure 10B Shown in side view orthogonal to the plan Figure 10A The adapter 811 and the corresponding adapter 821. Figure 4 , Figure 8 and Figure 9 The arrangement is similar to Figure 10A and Figure 10B In the arrangement, the adapter 811 has a cylindrical surface that is configured to contact a corresponding cylindrical surface of the adapter 821.

[0096] like Figure 10A and Figure 10B As shown, a single point of contact can be a point of contact between two cylinders that are angled relative to each other. Alternatively, one or both of the adapter and the corresponding adapter can have an interface surface that is only part of the surface of a cylinder (such as a semi-cylinder). The adapter and the corresponding adapter can each have a convex surface as the interface surface, and the convex surface is not necessarily a cylindrical surface. Desirably, the interface surface of the adapter is bent along a first direction, and desirably is configured to engage with the convex surface that is bent along a second direction. Desirably, the second direction is angled relative to the first direction. Desirably, the second direction is orthogonal to the first direction. In this way, a single point of contact can be realized between an adapter and the corresponding adapter.

[0097] Figure 11A Adapter 812 and corresponding adapter 822 are shown in plan view from above. Figure 11B Shown in side view orthogonal to the plan Figure 11A The adapter 812 and the corresponding adapter 822. Figure 11A and Figure 11B In the arrangement, the adapter 812 has a spherical surface that is configured to contact a corresponding spherical surface of the adapter 822.

[0098] like Figure 11A and Figure 11B As shown, the single contact point can be the contact point between two spheres. Alternatively, the adapter and the corresponding adapter may each have a convex surface curved in two directions as the interface surface, the convex surface optionally being at least part of a spherical surface.

[0099] Figure 12A Adapter 811 and corresponding adapter 822 are shown in plan view from above. Figure 12B Shown in side view orthogonal to the plan Figure 12A The adapter 811 and the corresponding adapter 822 in the embodiment. Figure 12A and 12BIn the arrangement, the adapter 811 has a cylindrical surface that is configured to contact the corresponding spherical surface of the adapter 822.

[0100] like Figure 12A and Figure 12B As shown, a single contact point can be a contact point between a cylinder and a sphere. Alternatively, the adapter can have an interface surface that is only part of the surface of a cylinder (such as a semi-cylinder). Each adapter can have a convex surface as the interface surface, which is not necessarily a cylindrical surface. Desirably, the interface surface of the adapter is curved along a first direction. The corresponding adapter can have a convex surface that is curved in two directions as the interface surface. In an alternative arrangement, the adapter can have a convex surface that is curved in two directions (such as at least part of a spherical surface) as the interface surface, and the corresponding adapter can have a convex surface (such as a cylindrical surface) as the interface surface.

[0101] Figure 13A Adapter 813 and corresponding adapter 822 are shown in plan view from above. Figure 13B Shown in side view orthogonal to the plan Figure 13A The adapter 813 and the corresponding adapter 822 in the embodiment. Figure 13A and Figure 13B In the arrangement, the adapter 813 has a planar surface, such as a flat surface, that is configured to contact a corresponding spherical surface of the adapter 822.

[0102] like Figure 13A and Figure 13B As shown, the single contact point can be the contact point between a planar surface and a sphere. Alternatively, the adapter can have a planar surface as the interface surface, and the corresponding adapter can have a convex surface curved in two directions (eg, a hemispherical shape) as the interface surface.

[0103] In any of the above example configurations of the adapter and the corresponding adapter, the shape of the interface surface of the adapter and the shape of the interface surface of the corresponding adapter can be interchanged. Figure 13A and Figure 13B It is shown that the adapter has a planar surface as the interface surface and the corresponding adapter has a spherical surface as the interface surface, but an alternative configuration can also be provided in which the adapter has a spherical surface as its interface surface and the corresponding adapter has a planar surface as its interface surface.

[0104] In some arrangements, such as Figure 4 and Figure 7 to Figure 1 0 arrangement, each module includes multiple adapters. Figure 4 and Figure 7 to Figure 1In an arrangement of 0, all adapters have an interface surface of the same shape, in particular a cylindrical interface surface. In an alternative arrangement, a module may include two or more adapters, and these two or more adapters may have interface surfaces of different shapes. For example, a module may include a first adapter having a spherical interface surface and a second adapter having a planar interface surface.

[0105] At least one of the modules of the modular assembly may include a composite element, such as an optical or electro-optical element or another system for manufacturing semiconductor components or different components that need to be patterned. Desirably, such optical or electro-optical elements may include at least one of a lens, a beam-limiting aperture, a corrector, a detector, and a source. More desirably, one or more of the elements include an array. More than one of the modules of the modular assembly may include a composite element. At least two adjacent modules include composite elements that are configured to perform electro-optical or optical interactions with each other during operation of the device. For example, all modules in the modules of the modular assembly may include composite elements. Desirably, these modules are configured to align with respect to the beam path of particles (e.g., photons or charged particles, such as electrons). Verification circuits can be used to determine that adjacent modules are mechanically aligned. Components that guide the charged particle beam (such as an objective lens array) can be aligned with the mechanical components of the module.

[0106] The body of one or more modules in the module comprises at least part of a wall of the vacuum chamber. The body of one or more modules in different modules may provide a wall of the vacuum chamber. Adjacent modules may comprise elements that form a pressure-resistant seal between the bodies of the two adjacent modules when the adjacent modules are joined. Thus, there may be a seal provided between one module and the other adjacent modules such that the interface or (multiple) joining surfaces of the modular assembly are configured to be sealed. In one embodiment, the module may be a component, such as a segment, of an electromagnetic shield, for example, for a magnetic shield comprising a highly permeable alloy.

[0107] Although the present invention has been described with reference to an evaluation system (e.g., a charged particle evaluation system), the present invention may be applied to any other suitable system. Such modules and modular assemblies comprising at least two adjacent modules may comprise parts of an optical or electro-optical system, or another other system for manufacturing patterned products (such as semiconductor components, such as chips). Such systems may comprise at least one of a lithography system (such as an electronic or photolithography system), an evaluation system (such as a metrology or inspection system), or a system for track (such as a coater, developer, or other processing system).

[0108] The following terms are provided:

[0109] Item 1. A modular component for joining together modules of a device for measuring, inspecting, processing or manufacturing semiconductor components, the component comprising: two modules, the two modules being configured to be able to join together to abut each other, the modules each having a body and a plurality of couplers, the plurality of couplers each being configured to join with a corresponding coupler of another module in the modules and complete a corresponding verification circuit; wherein each verification circuit is configured to be closed when the coupler of one module in the modules is joined with the corresponding coupler of the other module in the modules, wherein the coupler is configured to be electrically isolated from the body of the one module in the two modules, and the corresponding coupler is configured to be electrically connected to the body of the other module in the two modules.

[0110] Clause 2. A modular assembly according to clause 1, wherein the body of the one of the modules and the plurality of adapters are configured to be electrically isolated from each other, and the body of the other of the modules and the plurality of adapters are configured to be electrically connected to each other.

[0111] Clause 3. The modular assembly of any one of clauses 1 or 2, wherein the adapter is configured to engage with the corresponding adapter at a single point of contact between the adapter and the corresponding adapter.

[0112] Clause 4. The modular assembly of any one of clauses 1 to 3, further comprising a pre-tensioning unit configured to apply a load to force the adapter together with the corresponding adapter.

[0113] Clause 5. The modular assembly of Clause 4, wherein the pretensioning unit is configured to apply the load in a single translational direction.

[0114] Clause 6. The modular assembly of clause 4 or 5, wherein the pretensioning unit comprises a spring element.

[0115] Clause 7. The modular assembly of any one of clauses 4 to 6, wherein the load is between 50N and 150N.

[0116] Clause 8. A modular assembly according to any one of clauses 4 to 7, wherein the load is higher than the deformation load, desirably to produce the load as a pre-tension force on the corresponding adapter.

[0117] Clause 9. The modular assembly of any one of clauses 3 to 8, wherein the adapter is configured to engage with a corresponding adapter at a contact point on a surface of the corresponding adapter.

[0118] Clause 10. The modular assembly of clause 8 or 9, wherein the pretensioning unit is configured to apply the load at the contact point in a direction perpendicular to the surface of the corresponding adapter.

[0119] Clause 11. A modular assembly according to any preceding clause, wherein each module comprises up to six couplers and desirably the couplers of one module are configured to couple with corresponding couplers of the other module such that the two modules are aligned in up to six degrees of freedom.

[0120] Clause 12. The modular assembly of clause 11, wherein the two modules each comprise three adapters.

[0121] Clause 13. A modular assembly according to clause 12, wherein the three couplers of each module are arranged so that when the three couplers of one module engage with the corresponding three couplers of the other module, the two modules are desirably aligned in two translational degrees of freedom and one rotational degree of freedom.

[0122] Clause 14. A modular assembly according to any preceding clause, wherein each verification circuit is configured to verify alignment of the positioning of the two modules relative to each other in a degree of freedom, desirably the orientation when the verification circuit is closed.

[0123] Clause 15. The modular assembly of any preceding clause, wherein the modular assembly is configured such that alignment between two modules is verified when the verification circuits of all of the plurality of adapters of the two modules are closed.

[0124] Clause 16. The modular assembly of Clause 15, wherein when alignment between two modules is verified, the modules are configured to align with a particle beam path common to the modules of the modular assembly.

[0125] Clause 17. The modular assembly of any preceding clause, further comprising an alarm, such as a speaker or light, configured to be triggered upon closure of each verification circuit.

[0126] Clause 18. A modular assembly according to any one of clauses 3 to 17, wherein the coupler and one of the corresponding couplers have a convex surface, the convex surface is desirably curved in a first direction, desirably the convex surface is at least a portion of the surface of a cylinder, the convex surface is configured to couple with a convex surface of the other of the coupler and the corresponding coupler that is desirably curved in a second direction, the second direction is desirably at an orthogonal angle to the first direction, desirably the convex surface is at least a portion of the surface of a cylinder.

[0127] Clause 19. A modular assembly according to any one of clauses 3 to 17, wherein the coupler and one of the corresponding couplers have a convex surface that is desirably curved in one direction, the coupler desirably has a cylindrical shape including the convex surface, the convex surface desirably is configured to couple with a convex surface of the other of the coupler and the corresponding coupler that is desirably curved in two directions, and the convex surface of the other of the coupler and the corresponding coupler is desirably a spherical surface.

[0128] Clause 20. A modular assembly according to any one of clauses 3 to 17, wherein the coupler and one of the corresponding couplers have a convex surface that is curved in two directions, desirably the convex surface is a spherical surface, desirably the surface of the other of the coupler and the corresponding coupler has a planar surface, desirably the convex surface is configured to engage with the planar surface of the other of the coupler and the corresponding coupler.

[0129] Clause 21. A modular assembly according to any one of clauses 3 to 17, wherein the coupler and the corresponding coupler each have a convex surface curved in two directions, desirably the convex surface is a spherical surface, desirably the convex surface of the coupler and the convex surface of the corresponding coupler are configured to engage with each other.

[0130] Clause 22. A modular assembly according to any preceding clause, wherein the body of one of the modules is within the body of another of the modules when the modules are joined, desirably so that the modules are concentric relative to each other and share a common axis, desirably the common axis of a beam path of radiation such as charged particles or light during operation of an apparatus including the modular assembly.

[0131] Clause 23. A modular assembly according to any preceding clause, wherein at least one of the modules comprises a composite element, the composite element being, for example, an optical or electro-optical element, desirably the composite element being at least one of a lens, a beam-limiting aperture, a corrector, a detector and a source, desirably wherein one or more of the elements comprises an array.

[0132] Clause 24. The modular assembly of any preceding clause, wherein at least two adjacent modules comprise composite elements configured to electro-optically or optically interact with each other during operation of the device.

[0133] Clause 25. A modular assembly according to any preceding clause, wherein the module is configured to be aligned relative to a beam path of particles, such as photons or charged particles.

[0134] Clause 26. The modular assembly of any preceding clause, wherein the body of one or more of the modules comprises at least a portion of a vacuum chamber wall.

[0135] Clause 27. A modular assembly according to any of the preceding clauses, further comprising at least one additional module, the additional module comprising at least one coupler configured to engage with a coupler of one of the two modules, desirably the additional module comprising an additional body and an additional plurality of couplers, each of the additional plurality of couplers being configured to engage with a corresponding coupler of another of the modules and completing a corresponding verification circuit for verifying the alignment of the additional module with one of the two other modules.

[0136] Item 28. A modular assembly for verifiably joining together modules of an apparatus for measuring, inspecting, processing or manufacturing semiconductor components, the modular assembly comprising: two modules adjacent to each other and capable of joining together, the modules having a body and a plurality of couplers, the individual couplers engaging with corresponding couplers of the adjacent modules to close corresponding individual verification circuits for verifying alignment in degrees of freedom.

[0137] Clause 29. The assembly of Clause 28, wherein the individual adapters of the first module engage with corresponding adapters of the second module at a single contact point under limited pre-tension.

[0138] Clause 30. The assembly of Clause 28, wherein the individual adapter engages a corresponding adapter of an adjacent module at a single point of contact.

[0139] Clause 31. The assembly of clause 28 or 29, wherein the individual adapters of one of the first module or the second module are isolated from the body of the module.

[0140] Clause 32. A component according to any one of clauses 28 to 31, wherein at least one of the individual connectors of a first module of the two modules is electrically isolated from the body of the first module, and the corresponding connector of a second module of the two modules is electrically connected to the body of the second module.

[0141] Clause 33. The assembly of any one of clauses 28 to 32, wherein at least one of the modules comprises an isolator between the body of the module and each of the adapters.

[0142] Clause 34. The assembly of any one of Clauses 28 to 33, further comprising a pre-tensioning unit for applying a load to force an individual adapter together with a corresponding adapter of another body.

[0143] Clause 35. The evaluation device of clause 34, wherein the pretensioning unit is configured to apply the load in a single translational direction.

[0144] Clause 36. Evaluation device according to clause 34 or 35, wherein the pretensioning unit comprises an elastic member, such as a spring.

[0145] Clause 37. The evaluation device of Clause 36, wherein the elastic member is an elastic member between the bodies during engagement of the bodies.

[0146] Clause 38. The evaluation device according to any one of clauses 34 to 37, wherein the load is higher than a threshold load (or deformation load), whereby the load is applied as a pre-tension to the corresponding adapter.

[0147] Clause 39. The assembly of any of clauses 28 to 38, wherein each module is pre-calibrated.

[0148] Clause 40. The assembly of clause 39, wherein the position of the adapter relative to the body of each module is pre-calibrated.

[0149] Item 41. A component according to item 39 or 40, wherein the position of the adapter relative to a component included in the module (such as an electron optical component) is pre-calibrated, for example the adapter is pre-calibrated relative to an alignment path, such as an optical path, for example a charged particle beam path within the module.

[0150] Item 42. A modular assembly for verifiably joining together modules of an apparatus for measuring, inspecting, processing or manufacturing semiconductor components, the modular assembly comprising: two modules adjacent to each other and capable of joining together, the modules having a body and a plurality of couplers, the individual couplers engaging with corresponding couplers of the adjacent modules to close the corresponding verification circuit, wherein the individual couplers of the first module engage with the corresponding couplers of the second module at a single contact point under limited pre-tension, the individual couplers of one of the first module or the second module being isolated from the body of the module.

[0151] Clause 43. An apparatus for projecting a beam of radiation, such as photons or charged particles, towards a sample, the apparatus comprising a modular assembly according to any preceding clause.

[0152] Clause 44. An apparatus for measuring, inspecting, processing or manufacturing semiconductor components, the apparatus comprising the device according to clause 43 or the modular assembly according to any one of clauses 1 to 27.

[0153] Clause 45. The apparatus of Clause 44, further comprising a sample support configured to support a sample, desirably a substrate, a workpiece, or a target.

[0154] Clause 46. The apparatus of clause 44 or 45, wherein the apparatus is a measurement system, an inspection system, or a manufacturing system.

[0155] Item 47. An apparatus according to any one of items 44 to 46, wherein the apparatus is an optical apparatus for projecting light onto a sample, such as an optical lithography apparatus or an optical evaluation apparatus; or an electron-optical apparatus for projecting charged particles onto a sample, such as an electron-optical lithography or evaluation apparatus.

[0156] Reference to the system of parts or parts or element that can be controlled to manipulate charged particle beam in some way, comprise configuration controller, control system or control unit, be used to control this part to manipulate charged particle beam in described mode, and alternatively use other controllers or equipment (for example, voltage source and / or current source) to control this part to manipulate charged particle beam in this way.For example, voltage source can be electrically connected to one or more parts, to apply electric potential to these parts, such as comprising control lens array 250 and object lens array 241 in non-limiting list.

[0157] References to upper and lower, up and down, above and below, etc. should be understood to refer to directions parallel to (typically, but not always, perpendicular to) the upper and lower beam directions of the charged particle beam impinging on the sample 208. Thus, references to upper and lower beams are intended to refer to directions relative to the beam path, regardless of any gravitational field that is present.

[0158] The electron optical elements described herein can take the form of a series of aperture arrays or electron optical elements arranged in an array along a beam or multi-beam path. Such electron optical elements can be electrostatic. In one embodiment, all electron optical elements (for example, from the beam-limiting aperture array to the last electron optical element in the sample front beam path) can be electrostatic and / or can be in the form of an aperture array or a plate array. In some arrangements, one or more electron optical elements are manufactured as a microelectromechanical system (MEMS) (i.e., using MEMS manufacturing technology). The electron optical element can have magnetic elements and electrostatic elements. For example, a composite array lens can be characterized by a macro magnetic lens surrounding a multi-beam path, which has upper and lower pole plates in the magnetic lens and is arranged along the multi-beam path. An aperture array for the beam path of the multi-beam can be provided in the pole plate. Electrodes can be located above, below, or between the pole plates to control and optimize the electromagnetic field of the composite lens array.

[0159] Evaluation devices, tools, or systems according to the present disclosure may include devices that perform qualitative evaluations (e.g., pass / fail) on a sample, devices that perform quantitative measurements (e.g., the size of a feature) on a sample, or devices that generate an image of a map of a sample. Examples of evaluation devices, tools, or systems are inspection tools (e.g., for identifying defects), review tools (e.g., for classifying defects), and metrology tools, or tools that can perform any combination of evaluation functions associated with inspection tools, review tools, or metrology tools (e.g., metrology inspection tools).

[0160] The function provided by controller or control system or control unit can be computer-implemented.Any suitable combination of elements all can be used to provide required function, including such as CPU, RAM, SSD, mainboard, network connection, firmware, software and / or other elements known in the art allowing required computing operation to be performed.Required computing operation can be limited by one or more computer programs.These one or more computer programs can be provided in the form of the medium (alternatively non-transient medium) storing computer-readable instructions.When computer-readable instructions are read by computer, computer performs required method steps.Computer can comprise independent unit or distributed computing system, and this distributed computing system has a plurality of different computers connected to each other via network.

[0161] Although the present invention has been described in conjunction with various embodiments, other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples should be considered as exemplary only, with the true scope and spirit of the invention being indicated by the appended claims and clauses disclosed herein.

Claims

1. A modular assembly for joining together modules of an apparatus for measuring, inspecting, processing, or manufacturing semiconductor components, the assembly comprising: Two modules configured to be engageable with each other to abut each other, each module having a body and a plurality of engagers, each of the plurality of engagers configured to engage with a corresponding engager of another of the modules and complete a corresponding verification circuit, wherein the abutting modules include composite elements configured to electro-optically or optically interact with each other during operation of the device; Wherein each verification circuit is configured to be closed when a coupler of one of the modules engages with a corresponding coupler of the other of the modules, wherein the coupler is configured to be electrically isolated from the body of the one of the two modules and the corresponding coupler is configured to be electrically connected to the body of the other of the two modules.

2. The modular assembly of claim 1 , wherein the body of the one of the modules and the plurality of adapters are configured to be electrically isolated from each other, and the body of the other of the modules and the plurality of adapters are configured to be electrically connected to each other.

3. A modular assembly according to any one of claims 1 or 2, wherein the adapter is configured to engage with the corresponding adapter at a single point of contact between the adapter and the corresponding adapter.

4. The modular assembly according to any one of claims 1 to 3, further comprising a pre-tensioning unit configured to apply a load to force the adapter together with the corresponding adapter.

5. The modular assembly of claim 4, wherein the pre-tensioning unit is configured to apply the load in a single translational direction.

6. A modular assembly according to claim 4 or 5, wherein the load is higher than the deformation load, desirably to generate the load as a pre-tension on the corresponding said adapter.

7. A modular assembly according to any one of claims 3 to 6, wherein the adapter is configured to engage with a corresponding adapter at a contact point on a surface of the corresponding adapter.

8. The modular assembly according to claim 6 or 7, wherein the pre-tensioning unit is configured to apply the load at the contact point in a direction perpendicular to the surface of the corresponding adapter.

9. A modular assembly according to any preceding claim, wherein each module comprises up to six couplers, and desirably the couplers of one module are configured to engage with corresponding couplers of the other module such that the two modules are aligned in up to six degrees of freedom.

10. A modular assembly according to any preceding claim, wherein each verification circuit is configured to verify alignment of the positioning of the two modules relative to each other in a degree of freedom, desirably the orientation when the verification circuit is closed.

11. A modular assembly according to any preceding claim, wherein the modular assembly is configured such that alignment between two modules is verified when the verification circuits of all of the plurality of adapters of the two modules are closed.

12. A modular assembly according to any preceding claim, wherein when alignment between two modules is verified, the modules are configured to align with a particle beam path that is common to the modules of the modular assembly.

13. A modular assembly according to any preceding claim, wherein the body of one of the modules is within the body of the other of the modules when the modules are joined, desirably so that the modules are concentric relative to each other and share a common axis, desirably the common axis of the beam path of radiation such as charged particles or light during operation of an apparatus including the modular assembly.

14. A modular assembly according to any preceding claim, wherein the body of one or more of the modules comprises at least part of a vacuum chamber wall.

15. A modular assembly according to any preceding claim, wherein the modules are configured to be aligned relative to a beam path of particles, such as photons or charged particles.

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