Detector module, detector, and medical imaging apparatus

Abstract

The invention discloses a detector module, a detector and a medical imaging device, the detector module comprises a module support and a plurality of sub-module assemblies, the module support extends along the Z direction, the plurality of sub-module assemblies are sequentially arranged along the Z direction, each sub-module assembly comprises a sub-module and a sub-module support, the sub-module is mounted on the sub-module support, and the sub-module support is mounted on the sub-module support. The sub-module support is detachably connected with the module support in the Y direction through a connecting structure. According to the detector module, the sub-module support is arranged, and the sub-module can be detachably connected with the module support together with the sub-module support, so that the sub-module assembly and the module support can be integrally disassembled, the sub-module and the module support do not need to be disassembled and assembled, the disassembling and assembling process can be simplified, and later maintenance of the detector module is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of medical equipment, and in particular to a detector module, a detector and a medical imaging device. Background Art

[0002] With the continuous advancement of medical technology, more and more medical devices are being used to assist in medical diagnosis or treatment. For example, CT (Computed Tomography) equipment is used to detect human diseases. CT equipment detects X-rays passing through the human body through a CT detector and converts the received optical signals into electrical signals. Multiple CT detection modules mounted on the CT detector housing are important components for achieving photoelectric conversion. Multiple detector submodules are installed on the CT detection modules to enhance the detector pixel unit and improve the diagnostic effectiveness of the CT detector.

[0003] In the related art, the disassembly and assembly operations of the detector submodule are cumbersome and inconvenient to maintain, and there is room for improvement. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a detector module whose submodule components and module bracket are easy to assemble and disassemble, facilitating subsequent maintenance.

[0005] The present invention also provides a detector having the above detector module.

[0006] The present invention also provides a medical imaging device having the detector.

[0007] According to an embodiment of the first aspect of the present invention, the detector module includes: a module bracket and a plurality of sub-module assemblies, wherein the module bracket extends along the Z direction, and the plurality of sub-module assemblies are arranged in sequence along the Z direction, the sub-module assembly includes a sub-module and a sub-module bracket, the sub-module is mounted on the sub-module bracket, and the sub-module bracket is detachably connected to the module bracket along the Y direction via a connecting structure.

[0008] According to the detector module of an embodiment of the present invention, by providing a sub-module bracket, the sub-module can be detachably connected to the module bracket together with the sub-module bracket. Therefore, the sub-module assembly and the module bracket can be removed as a whole without the need to disassemble and assemble the sub-module and the module bracket, which can simplify the disassembly and assembly process and facilitate the later maintenance of the detector module.

[0009] In some embodiments, the connection structure includes a plurality of first fasteners. A first connection hole is formed on the module bracket, and a second connection hole is formed on the sub-module bracket. The first fastener is provided along the Y direction, extending through corresponding first and second connection holes. The first fastener is installed along a direction from the sub-module bracket toward the module bracket and is exposed outside the sub-module. The spacing between a portion of the sub-module opposite the second connection hole in the Y direction and the second connection hole in the Y direction is greater than or equal to the length of the first fastener. The sub-module bracket is provided with a first recessed groove, which is notched toward the sub-module and recessed toward the module bracket. The second connection hole is formed on a bottom wall corresponding to the first recessed groove. The sub-module is spaced apart from the first recessed groove in the Y direction. The first recessed groove extends through two adjacent side surfaces of the sub-module bracket so that the first recessed groove is open on both one side in the Z direction and one side in the X direction. A second recessed groove is provided on one side wall of the first recessed groove in the X direction, which is recessed toward the center of the sub-module bracket. The width of the second recessed groove in the Y direction is greater than or equal to the length of the first fastener, and the sub-module is provided to avoid the second recessed groove.

[0010] In some embodiments, the side surface of the module bracket in the Y direction includes multiple mounting surfaces arranged in sequence along the Z direction, and the multiple mounting surfaces correspond one-to-one to the multiple sub-module brackets. The sub-module bracket has a connecting surface set toward the mounting surface, and the mounting surface is thermally coordinated with the connecting surface, and the module bracket defines a heat dissipation channel.

[0011] In some embodiments, the sub-module bracket includes: a base and at least one support base, the base is detachably connected to the module bracket, the support base is connected to the side of the base away from the module bracket, and extends in the Y direction toward the direction away from the module bracket, and the sub-module is installed on the support base; the sub-module includes a detection unit, an analog-to-digital conversion unit and a signal transmission unit, the detection unit is used to convert an optical signal into an analog signal, the analog-to-digital conversion unit is used to convert an analog signal into a digital signal, the signal transmission unit includes a first circuit board and at least one second circuit board, the first circuit board is provided on the side of the detection unit facing the module bracket, and connects the detection unit and the second circuit board, each second circuit board extends toward the module bracket and is connected to at least one analog-to-digital conversion unit; the support base supports the detection unit and the first circuit board in the Y direction, and the support base is opposite to and fixedly connected to the second circuit board along the X direction.

[0012] In some embodiments, the analog-to-digital conversion unit is connected to the side of the second circuit board facing the support base, and a boss protruding toward the second circuit board is provided on the side of the support base facing the second circuit board, and the boss abuts the second circuit board to form a accommodating space between the support base and the second circuit board, and the analog-to-digital conversion unit corresponding to the second circuit board is arranged in the accommodating space; and / or, the sub-module assembly further includes: a sub-module splint, which is arranged on the side of the second circuit board away from the support base, and the second circuit board is fixedly connected to the support base through the sub-module splint, so that the analog-to-digital conversion unit is in surface contact with the support base.

[0013] In some embodiments, there are multiple support bases, and the multiple support bases are arranged at intervals along the X direction, and the sub-modules are arranged in a one-to-one correspondence with the support bases.

[0014] In some embodiments, the signal transmission unit of each submodule includes two second circuit boards spaced apart along the X direction, and the second circuit boards adjacent to each other of two adjacent submodules are spaced apart along the X direction.

[0015] In some embodiments, a first channel is formed on the base, and a second channel opposite to the first channel is formed on the module bracket; the detector module also includes a third circuit board and a fourth circuit board, the third circuit board is arranged on the module bracket, and the fourth circuit board is passed through the first channel and the second channel, and connects the second circuit board and the third circuit board.

[0016] The detector according to the second aspect of the present invention comprises a plurality of housings and a plurality of detector modules according to the first aspect of the present invention, wherein the plurality of detector modules are arranged side by side along the X direction.

[0017] According to the detector of the present invention, by providing the detector module of the first aspect, the detector is more convenient to maintain and easy to use.

[0018] According to a third aspect of the present invention, a medical imaging device includes a scanning frame, a radiation source, and a detector according to the second aspect of the present invention; the radiation source and the detector are respectively arranged on the scanning frame, the radiation source is used to emit rays to the scanned object, and the detector is used to receive rays attenuated by the scanned object.

[0019] According to the medical imaging apparatus of the present invention, by providing the detector according to the second aspect, the medical imaging apparatus is easy to maintain.

[0020] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic structural diagram of a detector module according to one embodiment of the present invention;

[0022] Figure 2 is based on Figure 1 A partial enlarged view of area A of the example shown;

[0023] Figure 3 is a partial structural exploded diagram of a detector module according to one embodiment of the present invention;

[0024] Figure 4 is a schematic structural diagram of a submodule assembly according to an embodiment of the present invention;

[0025] Figure 5 is a side view of a submodule assembly according to one embodiment of the present invention;

[0026] Figure 6 is another partial structural exploded diagram of a detector module according to one embodiment of the present invention;

[0027] Figure 7 is based on Figure 4 A partial enlarged view of area B of the example shown;

[0028] Figure 8 is a structural diagram of a digital-to-analog conversion unit and a signal transmission unit according to an embodiment of the present invention;

[0029] Figure 9 is another structural schematic diagram of a detector module according to an embodiment of the present invention;

[0030] Figure 10 FIG. 1 is a partial structural diagram of a detector according to an embodiment of the present invention.

[0031] Reference numerals:

[0032] Detector 1000;

[0033] Detector module 100;

[0034] Module bracket 1; mounting surface 11; first connection hole 12; heat dissipation channel 13; second channel 14; third circuit board 15;

[0035] Submodule component 2; operation space 20;

[0036] Submodule 21; detection unit 211; scintillator array 2111; photodiode 2112; analog-to-digital conversion unit 212; detector AD chip 2121; signal transmission unit 213; first circuit board 2131; second circuit board 2132; substrate 214;

[0037] Submodule bracket 22; base 22a; support base 22b; connecting surface 221; second connecting hole 222; first sinking groove 223; second sinking groove 224; boss 225; accommodating space 226; first channel 227; T-shaped hole 228; third fastener 229;

[0038] Submodule clamping plate 23; second fastener 231;

[0039] Connecting structure 3; first fastener 31;

[0040] Fourth circuit board 4;

[0041] Shell 200. DETAILED DESCRIPTION

[0042] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limiting the present invention.

[0043] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those skilled in the art will appreciate the applicability of other processes and / or the use of other materials.

[0044] Detector module 100 is a component of detector 1000. Detector 1000 is used to detect radiation emitted by a radiation source after being attenuated by the scanned object. Therefore, each detector module 100 is also used to detect radiation emitted by a radiation source after being attenuated by the scanned object. Detector 1000 can be used in a variety of applications and can be used in medical imaging equipment or other equipment requiring scanning and imaging, such as security inspection equipment.

[0045] In CT scanners, XYZ coordinates are usually used, where X is the arrangement direction of the module bracket 1, Y is the vertical direction, and Z is perpendicular to the plane formed by the XY directions. The Z direction is usually the rotation axis of the scanner.

[0046] The X, Y, and Z directions mentioned below are coordinate directions commonly used in CT scanners when the detector module is used in a CT scanner. When the detector is used in other devices, the X, Y, and Z directions mentioned below can be expressed as three mutually perpendicular directions, i.e., the X direction is a first direction, the Y direction is a second direction, and the Z direction is a third direction, and the first direction, the second direction, and the third direction are mutually perpendicular.

[0047] For example, when the detector module 100 is used in a CT scanner, to facilitate manufacturing and improve yield, the detector is typically divided into dozens of detector modules 100 along the X-axis. These detector modules are arranged along a circular arc concentric with the focal point. To meet the increasing coverage requirements of a single human scan, the number of CT detector slices is increasing, requiring the installation of more submodules 21 on the detector module 100. Typically, several to dozens of submodules 21 are arranged along the Z-axis of the detector module 100, each with a pixel matrix of 32×6 or 32×32, to increase the number of detector pixel units and enhance the diagnostic effectiveness of the CT detector.

[0048] In the related art, multiple submodules are fixed to the module bracket of the detector module by screws or adhesives. During maintenance, the submodules need to be disassembled from the module bracket along the X direction. When there is insufficient space, the entire detector module needs to be replaced. The entire detector module can only be reused after the failure of a single submodule is eliminated, which makes maintenance inconvenient.

[0049] In order to solve the above problems, a detector module 100 according to an embodiment of a first aspect of the present invention will be described below with reference to the accompanying drawings.

[0050] According to the detector module 100 of the embodiment of the present invention, Figure 1 and Figure 2 As shown, the detector module 100 includes: a module bracket 1 and a sub-module assembly 2, the module bracket 1 is extended along the Z direction, the sub-module assembly 2 is multiple and arranged in sequence along the Z direction, the sub-module assembly 2 includes a sub-module 21 and a sub-module bracket 22, the sub-module 21 is installed on the sub-module bracket 22, and the sub-module bracket 22 is detachably connected to the module bracket 1 along the Y direction through the connecting structure 3.

[0051] The module bracket 1 is the main load-bearing component and installation component of the detector module 100, and multiple sub-module assemblies 2 are installed on the sub-module bracket 22; the sub-module assembly 2 is the main functional component of the detector module 100. The sub-module assembly 2 detects the rays emitted by the radiation source after attenuation by the scanned object and completes the conversion of X-rays into electrical signals.

[0052] It is worth noting that when the module bracket 1 is extended along the Z direction, and multiple sub-module components 2 are arranged in sequence along the Z direction, the extension direction of the module bracket 1 and the spacing direction of the sub-module components 2 can be a linear direction along the Z direction, or a nonlinear direction along the Z direction, for example, they can be arranged along a curved direction extending roughly along the Z direction.

[0053] The submodule assembly 2 includes a submodule 21 and a submodule bracket 22. The submodule 21 is used to convert X-rays into electrical signals. The submodule 21 is usually composed of a scintillator array 2111, a photodiode 2112, a substrate 214 and an AD conversion circuit, wherein the scintillator array 2111 is usually a matrix structure such as 32×16 or 16×16.

[0054] In the related art, the detector submodule is fixed to the module bracket of the CT detection module by screws or gluing through the submodule bracket. At the same time, the detector submodule is also fixedly connected to the module bracket. When disassembling the detector submodule from the module bracket, it is necessary to first contact the connection between the detector submodule and the module bracket, and then detach the detector submodule and the submodule bracket from the module bracket respectively. The operation is cumbersome and maintenance is inconvenient.

[0055] The detector module 100 of the embodiment of the present invention installs the sub-module 21 on the sub-module bracket 22, and the sub-module bracket 22 is detachably connected to the module bracket 1 along the Y direction through the connecting structure 3. Therefore, the sub-module 21 of the embodiment of the present application is installed as a whole on the sub-module bracket 22. The sub-module 21 is not connected to the module bracket 1. The sub-module assembly 2 and the module bracket 1 can be removed as a whole without disassembling and assembling the sub-module 21 and the module bracket 22, which can simplify the disassembly and assembly process.

[0056] In addition, the sub-module bracket 22 is detachably connected to the module bracket 1 along the Y direction through the connecting structure 3. In this way, there is sufficient disassembly space of the connecting structure 3, and the sub-module component 2 can be removed separately from the module bracket 1, thereby improving the situation where the connection between the sub-module component 2 and the module bracket 1 is blocked, facilitating operation, and thus facilitating the later maintenance of the detector module 100.

[0057] In the related art, submodules are directly fixed to the module bracket by screws or adhesives, which often requires multiple machining operations to ensure that the module bracket structure meets the submodule installation requirements. However, the present invention utilizes the combined structure of submodule 21 and submodule bracket 22 to integrate the mounting structure of submodule 21 into submodule bracket 22, simplifying the structure of module bracket 1, simplifying the processing technology, and reducing manufacturing costs.

[0058] According to the detector module 100 of an embodiment of the present invention, by providing a sub-module bracket 22, the sub-module 21 can be detachably connected to the module bracket 1 together with the sub-module bracket 22. Therefore, the sub-module assembly 2 and the module bracket 1 can be removed as a whole without the need to disassemble and assemble the sub-module 21 and the module bracket 22, which can simplify the disassembly and assembly process and facilitate the later maintenance of the detector module.

[0059] The submodule bracket 22 of the embodiment of the present invention can be installed on the submodule bracket 22 by bonding, or can be installed on the module bracket 1 by fixed connection with fasteners. For example, the submodule bracket 22 can be fixedly connected to the module bracket 1 by bolts, or the submodule bracket 22 can be installed on the module bracket 1 by bonding with fasteners.

[0060] In some embodiments of the present invention, the connection structure 3 includes an adhesive member, and the surface of one side of the module bracket 1 in the Y direction includes multiple mounting surfaces 11 arranged in sequence along the Z direction. The multiple mounting surfaces 11 correspond one to one with the multiple sub-module brackets 22. The sub-module bracket 22 has a connecting surface 221 arranged toward the mounting surface 11. At least part of the adhesive member is sandwiched between the mounting surface 11 and the connecting surface 221. The sub-module 21 is spaced apart on the side of the connecting surface 221 away from the mounting surface 11 to avoid the operating space 20.

[0061] The submodule bracket 22 is installed on the submodule bracket 22 by bonding. The submodule bracket 22 is bonded to the mounting surface 11 by facing the mounting surface 11 and the connecting surface 221, and the submodule 21 is arranged at intervals on the side of the connecting surface 221 away from the mounting surface 11, thereby avoiding the operating space 20. There is a larger space for bonding and separating the mounting surface 11 and the connecting surface 221, which is convenient for operation.

[0062] In other embodiments of the present invention, Figure 2 and Figure 3 As shown, the connection structure 3 includes multiple first fasteners 31, a first connection hole 12 is formed on the module bracket 1, and a second connection hole 222 is formed on the sub-module bracket 22. The first fasteners 31 are arranged along the Y direction to pass through the corresponding first connection hole 12 and the corresponding second connection hole 222.

[0063] By the fixing method of the first fastener 31 passing through the first connecting hole 12 and the second connecting hole 222 , the submodule bracket 22 and the module bracket 1 are reliably and stably connected.

[0064] Alternatively, as Figure 3 and Figure 4 As shown, the first fastener 31 is installed from the submodule bracket 22 to the module bracket 1 and is exposed outside the submodule 21 . The submodule 21 leaves an operating space 20 for disassembling the first fastener 31 .

[0065] The first fastener 31 is installed from the submodule bracket 22 toward the module bracket 1. It passes through the submodule bracket 22 and is fixedly connected to the module bracket 1. After installation, the first fastener 31 is exposed outside the submodule 21. When the first fastener 31 is used to assemble and disassemble the submodule bracket 22 and the module bracket 1, more space is available for operation. The entire submodule assembly 2 can be directly removed from the module bracket 1 without removing the submodule 21 from the module bracket 1, thus simplifying the operation process.

[0066] In addition, the first fastener 31 is installed along the sub-module bracket 22 in the direction of the module bracket 1, and the first fastener 31 is exposed in the direction away from the module bracket 1. Therefore, when the module bracket 1 is in the installed state, the sub-module assembly 2 can be removed from the module bracket 1, without having to first remove the module bracket 1 and then remove the sub-module assembly 2 from the module bracket 1, thereby simplifying the operation process and facilitating subsequent maintenance of the detector module 100.

[0067] Among them, Figure 4 As shown, the distance L1 between the portion of the submodule 21 opposite to the second connection hole 222 in the Y direction and the second connection hole 222 in the Y direction is greater than or equal to the length L2 of the first fastener 31 , so that the submodule 21 avoids the operating space 20 .

[0068] The portion of submodule 21 that opposes second connection hole 222 in the Y direction is spaced a greater distance L1 from second connection hole 222 and is greater than length L2 of first fastener 31. This spacing L1 between submodule 21 and second connection hole 222 allows for installation and removal of first fastener 31 along the Y direction. Installation and removal of submodule 21 and first fastener 31 do not interfere with each other, facilitating installation and removal of submodule assembly 2 and module bracket 1 and improving operational stability of submodule 21.

[0069] Alternatively, further optionally, the first fastener 31 is installed from the module bracket 1 toward the sub-module bracket 22 .

[0070] The first fastener 31 is installed from the module bracket 1 to the sub-module bracket 22. The first fastener 31 passes through the module bracket 1 and is fixedly connected to the sub-module bracket 22. The sub-module 21 is arranged at intervals on the side of the sub-module bracket 22 away from the module bracket 1. Therefore, the first fastener 31 is exposed on the side of the module bracket 1 away from the sub-module bracket 22. A large space is available for operation. The sub-module assembly 2 can be directly removed from the module bracket 1 as a whole without having to remove the sub-module 21 from the sub-module bracket 22 and then remove the sub-module bracket 22 from the module bracket 1, thereby simplifying the operation process.

[0071] The distance between the portion of submodule 21 that opposes second connection hole 222 in the Y direction and second connection hole 222 in the Y direction is greater than or equal to the length of first fastener 31 extending from second connection hole 222 toward submodule 21, thereby allowing submodule 21 to clear operating space 20. The installation and removal of submodule 21 and first fastener 31 do not interfere with each other, facilitating installation and removal of submodule assembly 2 and module bracket 1 and improving the operational stability of submodule 21.

[0072] In some embodiments of the present invention, Figure 4 As shown, the connection structure 3 includes a first fastener 31, which is installed from the submodule bracket 22 toward the module bracket 1. The installation of the submodule 21 avoids the installation and removal operation space 20 of the first fastener 31. The submodule bracket 22 is formed with a first recessed groove 223, which is notched toward the submodule 21 and recessed toward the module bracket 1. The second connection hole 222 is formed on the bottom wall corresponding to the first recessed groove 223.

[0073] The first recessed groove 223 helps define the operating space 20. By providing the first recessed groove 223 recessed toward the module bracket 1 and forming the second connection hole 222 on the bottom wall of the first recessed groove 223, the distance between the second connection hole 222 and the submodule 21 can be increased. Furthermore, by providing the recessed groove recessed toward the module bracket 1 in the submodule bracket 22, the submodule 21 can be installed closer to the module bracket 1 without raising the submodule 21's mounting position, thus reducing the volume of the submodule assembly 2.

[0074] In some embodiments of the present invention, Figure 4 As shown, the submodule 21 and the first sink 223 are spaced apart in the Y direction, and the first sink 223 passes through two adjacent side surfaces of the submodule bracket 22 so that the first sink 223 is open on one side in the Z direction and on one side in the X direction.

[0075] The first recessed groove 223 is recessed along the Y direction toward the module bracket 1. At the same time, the first recessed groove 223 is also open on the submodule bracket 22 on the side facing the Z direction, and is also open on the submodule bracket 22 on the side facing the X direction, thereby increasing the volume of the operating space 20 and connecting the operating space 20 with the external space. A larger space is provided for manipulating the first fastener 31, which facilitates the installation and removal of the first fastener 31.

[0076] In some embodiments of the present invention, Figure 4 As shown, a second groove 224 is provided on one side wall of the first groove 223 in the X direction and is recessed toward the center of the submodule bracket 22 along the X direction. The width L3 of the second groove 224 in the Y direction is greater than or equal to the length L1 of the first fastener 31, and the submodule 21 is arranged to avoid the second groove 224.

[0077] The first recessed groove 223 is open on one side along the X-direction on the submodule bracket 22, and a second recessed groove 224 is opened on the other side along the X-direction on the submodule bracket 22. The width L3 of the second recessed groove 224 in the Y-direction is greater than or equal to the length L1 of the first fastener 31, and the submodule 21 avoids the second recessed groove 224, which can reduce interference with the installation and disassembly of the first fastener 31.

[0078] In some embodiments of the present invention, Figure 3 As shown, the side surface of the module bracket 1 in the Y direction includes multiple mounting surfaces 11 arranged in sequence along the Z direction, the multiple mounting surfaces 11 correspond one-to-one to the multiple sub-module brackets 22, the first connecting hole 12 passes through the corresponding mounting surface 11, the sub-module bracket 22 has a connecting surface 221 set toward the mounting surface 11, the second connecting hole 222 passes through the connecting surface 221, the mounting surface 11 and the connecting surface 221 are thermally coordinated, and the module bracket 1 defines a heat dissipation channel 13.

[0079] The module bracket 1 is provided with multiple mounting surfaces 11 facing the sub-module assembly 2, and the sub-module bracket 22 is provided with a connecting surface 221 facing the module bracket 1. The mounting surface 11 and the connecting surface 221 correspond one-to-one. The first connecting hole 12 passes through the mounting surface 11, and the second connecting hole 222 passes through the connecting surface 221. The first fastener 31 passes through the connecting surface 221 and the mounting surface 11 to tightly fit the connecting surface 221 and the mounting surface 11.

[0080] The connection surface 221 and the mounting surface 11 are tightly fitted together. Heat generated by the submodule 21 is transferred to the module bracket 1 via the submodule bracket 22. Heat dissipation channels 13 are defined on the module bracket 1 to accelerate heat dissipation from the module bracket 1. The thermal contact between the module bracket 1 and the submodule assembly 2 accelerates heat dissipation from the submodule assembly 2 and improves the operating stability of the submodule assembly 2.

[0081] In some embodiments of the present invention, coolant flows in the heat dissipation channel 13 of the module bracket 1, and the sub-module bracket 22 defines a secondary heat dissipation channel. The coolant can flow between the heat dissipation channel and the secondary heat dissipation channel. The coolant can not only dissipate heat to the module bracket 1, but also flow directly into the sub-module bracket 22 to directly dissipate heat to the sub-module bracket 22. Therefore, the sub-module 21 can directly transfer heat to the coolant through the sub-module bracket 22 by thermal contact, shortening the heat transfer path, thereby improving the heat dissipation efficiency of the sub-module 21.

[0082] In some embodiments of the present invention, Figure 5As shown, the submodule bracket 22 includes: a base 22a and at least one support base 22b, the base 22a is detachably connected to the module bracket 1, the support base 22b is connected to the side of the base 22a away from the module bracket 1, and extends in the Y direction away from the module bracket 1, the submodule 21 is installed on the support base 22b, the submodule 21 includes a detection unit 211, an analog-to-digital conversion unit 212 and a signal transmission unit 213, the detection unit 211 is used to convert an optical signal into an analog signal, the analog-to-digital conversion unit 212 is used to convert an analog signal into a digital signal, and the signal transmission unit 213 is used to transmit a signal.

[0083] like Figure 5 and Figure 8 As shown, the signal transmission unit 213 includes a first circuit board 2131 and at least one second circuit board 2132. The first circuit board 2131 is arranged on the side of the detection unit 211 facing the module bracket 1, and connects the detection unit 211 and the second circuit board 2132. Each second circuit board 2132 extends toward the module bracket 1 and is connected to at least one analog-to-digital conversion unit 212.

[0084] Alternatively, as Figure 5 As shown, the detection unit 211 includes a scintillator array 2111 and a photodiode 2112. The scintillator array 2111 is usually a matrix structure of 32X16 or 16X16.

[0085] like Figure 5 and Figure 7 As shown, the support base 22b receives the detection unit 211 and the first circuit board 2131 in the Y direction, and the support base 22b is opposite to and fixedly connected to the second circuit board 2132 along the X direction.

[0086] The base 22a is detachably connected to the module support 1, and the support base 22b is used to receive the submodule 21. When the connection structure 3 includes a first fastener 31 and the first fastener 31 is installed from the submodule support 22 toward the module support 1, the surface of the base 22a facing the module support 1 is configured as a connection surface 221. The base 22a defines a first recessed groove 223, and the first fastener 31 securely connects the base 22a to the module support 1. The base 22a also defines a second recessed groove 224, or the support base 22b and the base 22a jointly define the second recessed groove 224.

[0087] In some embodiments of the present invention, Figure 5 and Figure 7As shown, the side of the second circuit board 2132 facing the support base 22b is connected to the analog-to-digital conversion unit 212, and the side of the support base 22b facing the second circuit board 2132 is provided with a boss 225 protruding toward the second circuit board 2132. The boss 225 abuts the second circuit board 2132 to form an accommodating space 226 between the support base 22b and the second circuit board 2132, and the analog-to-digital conversion unit 212 corresponding to the second circuit board 2132 is arranged in the accommodating space 226.

[0088] The boss 225 on the support base 22b stops on the second circuit board 2132, and an accommodating space 226 is formed between the non-protruding part of the support base 22b and the second circuit board 2132. The analog-to-digital conversion unit 212 on the second circuit board 2132 is arranged in the accommodating space 226, which can protect the analog-to-digital conversion unit 212 and prevent the support base 22b from crushing the analog-to-digital conversion unit 212.

[0089] In some embodiments of the present invention, Figure 5 and Figure 6 As shown, the second circuit board 2132 is connected to the side of the support seat 22b with the analog-to-digital conversion unit 212, and the sub-module assembly 2 also includes: a sub-module clamp 23, which is arranged on the side of the second circuit board 2132 away from the support seat 22b, and the second circuit board 2132 is fixedly connected to the support seat 22b through the sub-module clamp 23, so that the analog-to-digital conversion unit 212 is in surface contact with the support seat 22b.

[0090] The second circuit board 2132 is fixedly connected to the support base 22b via the submodule clamping plate 23, which improves the connection stability between the submodule 21 and the submodule bracket 22. Furthermore, the submodule clamping plate 23 compresses the second circuit board 2132 and the support base 22b along the X-axis, thereby allowing the analog-to-digital conversion unit 212 on the second circuit board 2132 to be in surface contact with the support base 22b. This improves the heat exchange between the analog-to-digital conversion unit 212 and the support base 22b, allowing heat from the analog-to-digital conversion unit 212 to be smoothly transferred to the submodule bracket 22, thereby facilitating heat dissipation of the submodule 21. For second circuit boards 2132 using a flexible printed circuit board (FPC) structure, since the flexible structure cannot be tightly attached to the support base, the submodule clamping plate 23 of the embodiment of the present application achieves better results.

[0091] In addition, the sub-module splint 23 is constructed as a metal part with strong thermal conductivity and high strength. The analog-to-digital conversion unit 212 can also be transmitted to the sub-module splint 23 via the second circuit board 2132. The area of the sub-module splint 23 facing outward is larger, so that the sub-module splint 23 can also help the analog-to-digital conversion unit 212 dissipate heat, further improving the heat dissipation efficiency of the sub-module 21.

[0092] Submodule clamping plate 23 also protects submodule 21. In related art, the joints between the submodule components of a detector module must be as small as possible. This results in relatively small distances between the circuit boards within the submodules, making them susceptible to collisions and scrapes during assembly and maintenance, leading to malfunctions. Submodule clamping plate 23 protects submodule 21, mitigates damage from friction and collisions during assembly and disassembly, and improves the reliability of submodule assembly 2.

[0093] In some embodiments of the present invention, Figure 5-Figure 8 As shown, the signal transmission unit 213 includes a first circuit board 2131 and two second circuit boards 2132. The second circuit boards 2132 are respectively connected to the two ends of the first circuit board 2131 in the X direction. The sides of the two second circuit boards 2132 facing the support seat 22b are connected to multiple analog-to-digital conversion units 212.

[0094] The submodule assembly 2 further includes a submodule clamping plate 23, which is disposed on a side of the second circuit board 2132 away from the support base 22b. The second circuit board 2132 is fixedly connected to the support base 22b via the submodule clamping plate 23, so that the analog-to-digital conversion unit 212 and the support base 22b are in surface contact. A boss 225, projecting toward the second circuit board 2132, is further disposed on the side of the support base 22b facing the second circuit board 2132. The boss 225 abuts the second circuit board 2132, forming a receiving space 226 between the support base 22b and the second circuit board 2132. The analog-to-digital conversion unit 212 corresponding to the second circuit board 2132 is disposed within the receiving space 226.

[0095] The submodule clamping plate 23 securely connects the second circuit board 2132 to the support base 22b along the X-axis, pressing the second circuit board 2132 against the support base 22b. This allows the multiple analog-to-digital conversion units 212 to securely fit the support base 22b, reducing the thermal resistance between the analog-to-digital conversion units 212 and the support base 22b and improving heat conduction. Furthermore, the protrusion 225 abuts the second circuit board 2132, preventing excessive compression between the second circuit board 2132 and the support base 22b, which could potentially crush the analog-to-digital conversion units 212.

[0096] In some embodiments of the present invention, Figure 5-Figure 7 As shown, a second fastener 231 is provided on the submodule clamping plate 23 , and the second fastener 231 is provided through the second circuit board 2132 and the boss 225 to fix the submodule clamping plate 23 and the support base 22 b.

[0097] Alternatively, as Figure 5As shown, corresponding to one support seat 22b, there is one second fastener 231, which passes through one sub-module clamp 23, the support seat 22b and another sub-module clamp 23 in sequence. The sub-module clamps 23 on both sides can be fixed to the second circuit board 2132 and the support seat 22b by using one second fastener 231, which can simplify the operation process.

[0098] Alternatively, further optionally, corresponding to one support base 22 b , there are multiple second fasteners 231 , and the second fasteners 231 respectively connect the two sub-module clamping plates 23 to the support base 22 b .

[0099] In some specific embodiments of the present invention, the second circuit board 2132 is a Chip On Film (COF) circuit board manufactured using a COF process, and the analog-to-digital conversion unit 212 on the COF circuit board is a detector AD chip 2121 .

[0100] In the related art, when the detector 1000 is working, the detector AD chip generates a large amount of heat. The detector AD chip and the submodule bracket can be in direct contact, or can be filled with thermal conductive materials such as thermal grease to reduce thermal resistance, or can be an air gap. The COF substrate 214 is usually very thin, about 0.1mm, and a reinforcing plate of about 0.3mm is attached to the back to improve rigidity. Even with the reinforcing plate, the rigidity of the COF circuit board is relatively poor. In this way, the top surface of the analog-to-digital conversion unit on the same COF circuit board is not coplanar, and the analog-to-digital conversion unit cannot fit well with the thermal conductive surface of the submodule bracket, which affects the heat dissipation effect.

[0101] Therefore, in an embodiment of the present invention, a submodule clamp 23 is provided on the outside of the COF circuit board, and the second fastener 231 presses the COF circuit board flatly on the submodule bracket 22, so that the analog-to-digital conversion unit 212 can be reliably fitted with the submodule bracket 22, reducing the thermal resistance between them and ensuring the heat conduction effect. The submodule clamp 23 can be made of a metal with strong thermal conductivity and high strength. After being tightened by screws, the heat of the chip can also be conducted to the surface of the clamp, so that the bracket surface can also become a heat dissipation path. The submodule bracket 22 is usually made of a metal material with high thermal conductivity and low density such as aluminum. The submodule bracket 22 is tightly connected to the module bracket 1 by the above-mentioned connection method, reducing the thermal resistance between the two, so that the heat of the detector 1000 chip is smoothly introduced into the module bracket 1, and is carried out of the detector 1000 area through the air flow in the air duct of the module bracket 1.

[0102] A boss 225 is provided on the sub-module bracket 22, and its height in the X direction is equivalent to or slightly higher than the height of the detector AD chip 2121. When the sub-module clamp 23 is locked to the sub-module bracket 22 by the clamp screw, the outer surface of the boss 225 contacts the inner surface of the COF circuit board. The boss 225 supports the sub-module clamp 23 and the COF circuit board to prevent the detector AD chip 2121 from being crushed.

[0103] In some embodiments of the present invention, the submodule 21 also includes a substrate 214, which is arranged on a side of the first circuit board 2131 close to the module bracket 1. The substrate 214 supports the detection unit 211 and the first circuit board 2131. The support base 22b is not only connected to the second circuit board 2132 in the X direction, but also connected to the substrate 214 in the Y direction, thereby improving the connection stability between the submodule 21 and the submodule bracket 22.

[0104] Alternatively, as Figure 5 and Figure 7 As shown, a T-shaped hole 228 is opened on the support base 22 b, and a third fastener 229 is disposed in the T-shaped hole 228 and passes through the support base 22 b toward the base plate 214 to connect the support base 22 b and the base plate 214 .

[0105] Alternatively, further optionally, the substrate 214 is connected to the support base 22b by bonding.

[0106] In some embodiments of the present invention, Figure 5 and Figure 7 As shown, there are multiple support bases 22b, and the multiple support bases 22b are arranged at intervals along the X direction. The sub-modules 21 are arranged in a one-to-one correspondence with the support bases 22b. The signal transmission unit 213 of each sub-module 21 includes two second circuit boards 2132 arranged at intervals along the X direction, and the second circuit boards 2132 adjacent to each other of two adjacent sub-modules 21 are arranged at intervals along the X direction.

[0107] The spacer portion provided between the second circuit boards 2132 of two adjacent submodules 21 can improve the damage caused by friction and collision during the disassembly and assembly of the submodule assembly 2, thereby improving the working reliability of the submodule assembly 2.

[0108] Furthermore, the provision of a spacing portion between the second circuit boards 2132 of two adjacent submodules 21 is also beneficial to heat dissipation of the second circuit boards 2132 .

[0109] In some embodiments of the present invention, Figure 4 and Figure 5 As shown, two support bases 22 b are provided on the base 22 a , and two submodules 21 are installed on a submodule bracket 22 .

[0110] In some embodiments of the present invention, Figure 2 As shown, a first channel 227 is formed on the base 22a, and a second channel 14 opposite to the first channel 227 is formed on the module bracket 1; Figure 9 As shown, the detector module 100 further includes a third circuit board 15 and a fourth circuit board 4 . The third circuit board 15 is disposed on the module bracket 1 , and the fourth circuit board 4 passes through the first channel 227 and the second channel 14 and connects the second circuit board 2132 and the third circuit board 15 .

[0111] It is worth noting that in the related art, the submodule is fixed to the module bracket by screws or gluing, and the circuit board of the submodule is installed on the side of the module bracket, so the circuit board of the submodule can naturally be connected to the circuit board on the module bracket.

[0112] The present invention sets a submodule bracket 22 and installs the submodule 21 on the submodule bracket 22. The submodule 21 has no direct connection with the module bracket 1. Therefore, it is necessary to set a circuit board to connect the circuit board of the submodule 21 and the circuit board of the module bracket 1 to complete signal transmission.

[0113] A first channel 227 extending along the Y direction is formed on the base 22a, and a second channel 14 opposite to the first channel 227 is formed on the module bracket 1. The fourth circuit board 4 is arranged through the first channel 227 and the second channel 14, thereby connecting the second circuit board 2132 and the third circuit board 15.

[0114] According to the detector 1000 of the second embodiment of the present invention, Figure 10 As shown, it includes a housing 200 and a plurality of detector modules 100 , and the plurality of detector modules 100 are arranged side by side along the X direction.

[0115] By setting up the above-mentioned detector module 100, the sub-module bracket 22 is detachably connected to the module bracket 1 along the Y direction through the connecting structure 3, so that the spacing between the sub-module brackets 2 with smaller spaces can be avoided. There is no need to disassemble the detector module 100 as a whole, and a certain sub-module component 2 can be disassembled separately. The maintenance of the detector 1000 is more convenient and easy to use.

[0116] In some embodiments of the present invention, the detector 1000 is a CT detector, and all detector modules 100 are arranged in the Z direction on an arc with a radius R. After the CT detector is assembled as a whole, the intersection of the center lines of all sub-modules 21 should coincide with the focus of the CT tube or be located near the focus of the CT tube.

[0117] According to the third embodiment of the present invention, the medical imaging device includes a scanning frame, a radiation source, and the detector 1000 of the above embodiment.

[0118] The radiation source and detector 1000 are each mounted on the gantry. The radiation source is used to emit radiation toward the scanned object, while the detector 1000 is used to receive radiation attenuated by the scanned object. As the gantry rotates about the Z axis, the radiation source and detector 1000 rotate synchronously with the gantry, maintaining radially opposed positions. This allows the detector 1000 to receive radiation, such as X-rays, emitted by the radiation source and passing through the scanned object.

[0119] The structure of the scanning frame is not limited. For example, the scanning frame forms a scanning cavity for receiving the scanned object, and the radiation source and the detector 1000 are respectively arranged on both radial sides of the scanning cavity.

[0120] Illustratively, in addition to the above components, the medical imaging device may further include a scanning bed for carrying a scanned object.

[0121] According to the medical imaging apparatus of the present invention, by providing the detector 1000 according to the second aspect, the medical imaging apparatus is easy to maintain.

[0122] In some embodiments of the present invention, the medical imaging device is a CT device.

[0123] The structure of a detector module 100 of a CT detector according to a specific embodiment of the present invention will be described below with reference to the accompanying drawings.

[0124] With the development of CT, the coverage of a single human body scan is required to be ever larger. Consequently, the number of slices in the CT detector 1000 system is increasing, and the number of corresponding detector 1000 pixel units is also increasing. This requires the installation of more detector 1000 submodules 21 on the same module. The increased number of submodules 21 increases the complexity of the support structure, requiring higher precision in machining and assembly. During subsequent maintenance, a failure of a single submodule 21 requires replacing the entire module, resulting in high maintenance costs.

[0125] To minimize CT imaging quality, the joints between the submodules 21 of the detector 1000 must be as small as possible. This results in a relatively small distance between the chips on the sides of the submodules 21, making them susceptible to collisions and scratches during assembly and maintenance, leading to chip failure. Furthermore, as the number of pixels in the submodules 21 increases, the number of chips and the resulting heat generation also increase exponentially. Therefore, it is necessary to increase heat dissipation capacity to ensure a stable operating environment for the scintillator 2111.

[0126] The present invention proposes a split-type detector module structure, which simplifies the large and complex structure of the bracket into a simple structural combination of a bracket base + multiple sub-module brackets 22, which can simplify the processing technology, reduce the processing difficulty of parts, and reduce the cost of parts.

[0127] Submodule 21 can be connected to submodule bracket 22 by bolting, bonding, or other methods. Together, submodule 21 and submodule bracket 22 form submodule assembly 2. Submodule assembly 2 is further connected to module bracket 1 via submodule bracket 22, either by bolting or bonding (shown in a bolted state). Several submodule assemblies 2 are connected to the bracket to form a module of CT detector 1000.

[0128] Submodules 21 can also be adjusted and disassembled individually, facilitating assembly, commissioning, and subsequent maintenance. A metal clamping plate is added to the chip area of submodule 21 to protect the chip and clamp it to the submodule bracket 22, reducing the thermal resistance between the chip and the bracket. This creates a new heat path, allowing heat to be transferred from one side of the clamping plate, enhancing the heat dissipation effect of submodule 21.

[0129] Other components of the detector module according to the embodiment of the present invention, such as the scintillator array and the photodiode, and operations are known to those skilled in the art and will not be described in detail here.

[0130] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0131] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0132] In the present invention, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0133] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0134] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0135] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A detector module, characterized in that: include: A module bracket, wherein the module bracket is extended along the Z direction; Multiple submodule assemblies are arranged in sequence along the Z direction. The submodule assemblies include submodules and submodule brackets. The submodules are installed on the submodule brackets. The submodule brackets are detachably connected to the module bracket along the Y direction through a connecting structure.

2. The detector module according to claim 1, characterized in that The connection structure includes a plurality of first fasteners. A first connection hole is formed on the module bracket, and a second connection hole is formed on the sub-module bracket. The first fasteners are provided along the Y direction through the corresponding first connection holes and the corresponding second connection holes. The first fasteners are installed along the direction from the sub-module bracket to the module bracket and exposed outside the sub-module. The distance between the portion of the sub-module opposite to the second connection hole in the Y direction and the second connection hole in the Y direction is greater than or equal to the length of the first fastener. The submodule bracket is provided with a first recessed groove with a notch facing the submodule and recessed toward the module bracket, and the second connection hole is formed on a bottom wall corresponding to the first recessed groove; The submodule and the first sink are spaced apart in the Y direction, and the first sink passes through two adjacent side surfaces of the submodule bracket, so that the first sink is open on one side in the Z direction and on one side in the X direction; The first groove is provided with a second groove on one side wall in the X direction, which is recessed along the X direction toward the center of the submodule bracket. The width of the second groove in the Y direction is greater than or equal to the length of the first fastener, and the submodule is arranged to avoid the second groove.

3. The detector module according to claim 1, wherein The side surface of the module bracket in the Y direction includes multiple mounting surfaces arranged in sequence along the Z direction, and the multiple mounting surfaces correspond one-to-one to the multiple sub-module brackets. The sub-module bracket has a connecting surface arranged toward the mounting surface, and the mounting surface is thermally coordinated with the connecting surface. The module bracket defines a heat dissipation channel.

4. The detector module according to any one of claims 1 to 3, characterized in that The submodule bracket includes: a base and at least one support base, the base is detachably connected to the module bracket, the support base is connected to a side of the base away from the module bracket and extends in the Y direction away from the module bracket, and the submodule is mounted on the support base; The submodule includes a detection unit, an analog-to-digital conversion unit, and a signal transmission unit. The detection unit is used to convert an optical signal into an analog signal. The analog-to-digital conversion unit is used to convert an analog signal into a digital signal. The signal transmission unit includes a first circuit board and at least one second circuit board. The first circuit board is provided on a side of the detection unit facing the module bracket and connects the detection unit and the second circuit board. Each second circuit board extends toward the module bracket and is connected to at least one of the analog-to-digital conversion units. The support base supports the detection unit and the first circuit board in the Y direction, and the support base is opposite to and fixedly connected to the second circuit board in the X direction.

5. The detector module according to claim 4, characterized in that The analog-to-digital conversion unit is connected to a side of the second circuit board facing the support base, and a boss protruding toward the second circuit board is provided on a side of the support base facing the second circuit board, the boss abutting the second circuit board to form an accommodation space between the support base and the second circuit board, and the analog-to-digital conversion unit corresponding to the second circuit board is arranged in the accommodation space; And / or, the sub-module assembly also includes: a sub-module splint, which is arranged on a side of the second circuit board away from the support seat, and the second circuit board is fixedly connected to the support seat through the sub-module splint, so that the analog-to-digital conversion unit is surface-to-surface fitted with the support seat.

6. The detector module according to claim 4, characterized in that There are a plurality of support bases, which are spaced apart along the X direction, and the submodules are arranged in a one-to-one correspondence with the support bases.

7. The detector module according to claim 6, characterized in that The signal transmission unit of each submodule includes two second circuit boards spaced apart along the X direction, and the second circuit boards adjacent to each other of two adjacent submodules are spaced apart along the X direction.

8. The detector module according to claim 4, characterized in that A first channel is formed on the base, and a second channel opposite to the first channel is formed on the module bracket; The detector module further includes a third circuit board and a fourth circuit board. The third circuit board is arranged on the module bracket. The fourth circuit board passes through the first channel and the second channel and connects the second circuit board and the third circuit board.

9. A detector, characterized in that: The device comprises a housing and a plurality of detector modules according to any one of claims 1 to 8, wherein the plurality of detector modules are arranged side by side along the X direction.

10. A medical imaging device, characterized in that: comprising a scanning frame, a radiation source and a detector according to claim 9; The radiation source and the detector are respectively arranged on the scanning frame. The radiation source is used to emit radiation toward the scanned object, and the detector is used to receive the radiation attenuated by the scanned object.

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