Device for preparing electronic grade epoxy resin
The dual-pipeline system enables efficient feeding of epoxy resin and real-time impurity filtration, solving the problem of untimely impurity removal in the production of electronic-grade epoxy resin and improving production efficiency and product purity.
Patent Information
- Application Number
- CN202510934025.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-08
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2045-07-08
AI Technical Summary
In the existing technology, impurities cannot be removed in real time during the production process of electronic-grade epoxy resin, resulting in substandard finished product quality, low feeding efficiency and insufficient reaction continuity.
A dual-pipeline system is used, one for feeding and the other for circulating filtration, which removes impurity particles generated by the reaction in real time, ensuring the continuity of the reaction process and efficient feeding.
It achieves rapid feeding, ensures the production of high-purity electronic-grade epoxy resin, avoids impurity accumulation, and improves production efficiency and product quality.
Smart Images

Figure CN120459933B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of epoxy resin production, and in particular to a device for preparing electronic-grade epoxy resin. Background Art
[0002] Epoxy resin is a thermosetting plastic, usually composed of epoxy resin, curing agent, accelerator and diluent. Epoxy resin is an organic compound, usually using propylene oxide and natural fatty acids as raw materials, curing agent usually uses fatty amines, aromatic amines or organic acids, accelerator can be active hydrogen compounds, catalysts, etc. During the production of epoxy resin, raw materials such as propylene oxide and natural fatty acids and ingredients need to be added to the production device (reactor), and epoxidation reaction is carried out under the action of alkaline catalyst to produce epoxy resin.
[0003] The prior art provides an epoxy resin raw material production device, application number CN202410114621.6, in which a collecting component is installed at the inner bottom end of the production device body, and the bottom ends of the two insert rods are welded and fixed to the rotating component. The bottom two sides of the rotating component are wedge-shaped structures and fit with the bottom of the production device body. The insert rod drives the rotating component and the collecting component to rotate together. Before use, the drive motor is controlled to run for a short time in advance so that the stirring member drives the insert rod, the rotating component and the collecting component to rotate together. The rotating component rotates in contact with the bottom of the production device body to scrape off the residual attachments at the bottom of the production device body. After scraping, the attachments are collected in the collecting component, which makes it easy to clean the attachments. This solves the problem that after use in the existing epoxy resin raw material production device, residues and attachments will be generated at the bottom of the container, which needs to be manually removed with a scraper or by manual knocking.
[0004] However, the existing technology, especially this solution, still has the following problems: for the production and preparation of high-quality electronic-grade epoxy resins, impurities are generated during the production process. If these impurities are not discharged in time during the epoxy resin preparation reaction, the quality of the final epoxy resin product will not meet the electronic grade requirements. The preparation equipment in the existing technology cannot remove impurities in real time during the epoxy resin preparation reaction, and the feeding efficiency is low and the reaction continuity is insufficient. Therefore, we need to propose a device for preparing electronic-grade epoxy resins. Summary of the Invention
[0005] The purpose of the present invention is to provide a technical solution to distinguish between the two states of the feeding process and the reaction process, ensure the continuity of the feeding and reaction, and at the same time filter out impurities generated during the reaction process in real time to solve the problems in the prior art raised in the above background technology.
[0006] To achieve the above object, the present invention adopts the following technical solutions:
[0007] A device for preparing electronic-grade epoxy resin, comprising:
[0008] The reactor and two sets of delivery pipes are provided with a feeding process and a reaction process for preparing epoxy resin raw materials. The reactor is provided with a preset capacity. First, the internal feeding of the reactor is the feeding process, and when the feeding reaches the preset capacity, it turns into the reaction process;
[0009] During the feeding process, two sets of conveying pipes are used to feed epoxy resin raw materials at the same time;
[0010] During the reaction process, one set of delivery pipes is used to feed the epoxy resin raw materials, and the other set of delivery pipes is used to circulate and filter the materials already existing inside the reactor. The circulation filtration is used to filter out the impurity particles generated by the epoxy resin during the reaction process.
[0011] Preferably, the delivery pipeline includes a delivery pipeline 1 and a delivery pipeline 2, wherein the delivery pipeline 1 and the delivery pipeline 2 are respectively provided with a pump body 1 and a pump body 2, the delivery pipeline 2 is provided with a filter for circulating filtration, and the delivery pipeline 2 is provided with a branch pipeline in parallel with the filter;
[0012] The second delivery pipe is connected with a connecting pipe, and the second delivery pipe is connected to the side of the reactor through the connecting pipe. The second delivery pipe and the connecting pipe are used for the delivery of circulating filtration.
[0013] Preferably, the second delivery pipeline is provided with a first switch valve, and the branch pipeline is provided with a second switch valve. When the second switch valve of the branch pipeline is opened, the second delivery pipeline and the branch pipeline are used to realize the feeding of epoxy resin raw materials.
[0014] Preferably, the reactor is further provided with an auxiliary material feeding mechanism, which is used to add auxiliary materials required for epoxy resin preparation into the reactor during the reaction process.
[0015] Preferably, the auxiliary material feeding mechanism includes a mounting circular tube, on which a plurality of nozzles are provided, and the mounting circular tube can uniformly add auxiliary materials to the interior of the reactor through the nozzles.
[0016] Preferably, the mounting tube can be raised and lowered inside the reactor, and the nozzle can be rotated on the mounting tube. A stirring piece is provided inside the reactor, and while the stirring piece rotates and the mounting tube is raised and lowered, the nozzle rotates to inject auxiliary materials into the reactor.
[0017] Preferably, the auxiliary material feeding mechanism includes an auxiliary material pipe and an injection cavity, the auxiliary material pipe is connected to the reactor and is provided with a pump body 3, and the injection cavity is connected to the auxiliary material pipe through a material guide pipe;
[0018] The auxiliary material tube is used for adding a variety of different auxiliary materials, and the injection cavity is used for adding a single auxiliary material.
[0019] Preferably, the injection cavity can add specific auxiliary materials through the material guide tube, and a telescopic driving part is provided on the injection cavity, which is used to push out the auxiliary materials inside the injection cavity. The telescopic driving part can realize the quantitative and constant speed addition of the auxiliary materials inside the injection cavity.
[0020] Preferably, the delivery pipeline 1 and the delivery pipeline 2 are provided with a switch valve 3, the pump body 1 is installed on the delivery pipeline 1 through the switch valve 3, and the pump body 2 is installed on the delivery pipeline 2 through the switch valve 3.
[0021] Preferably, the inlet ends of the delivery pipe 1 and the delivery pipe 2 are installed with a transfer pipe 2, the outlet ends of the delivery pipe 1 and the delivery pipe 2 are installed with a transfer pipe 1, and the delivery pipe 1 and the delivery pipe 2 are connected to the bottom of the reactor through the transfer pipe 1.
[0022] Technical effects and advantages of the present invention: Compared with the prior art, the device for preparing electronic-grade epoxy resin proposed by the present invention has the following advantages:
[0023] The present invention significantly shortens the initial filling time and improves production efficiency by using dual pipelines for parallel feeding during the feeding process, ensuring that the product is of high-purity electronic grade: online circulation filtration is carried out simultaneously during the reaction process to continuously and actively remove impurity particles generated by the reaction. This avoids the risk of impurities accumulating in the reactor or not being processed until the reaction is completed, and directly improves the purity of the final epoxy resin to electronic grade standards. Maintaining reaction continuity: During the reaction process, one set of pipelines continuously feeds to ensure an uninterrupted supply of raw materials required for the reaction. Efficient use of resources: One set of delivery pipelines undertakes different tasks in two modes, feeding and circulating filtration at the same time, realizing pipeline function reuse and device compactness. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 This is one of the three-dimensional structural schematic diagrams of the device for preparing electronic grade epoxy resin according to the present invention;
[0025] Figure 2 This is a second schematic diagram of the three-dimensional structure of the device for preparing electronic-grade epoxy resin according to the present invention;
[0026] Figure 3 Schematic diagram of the structure of the delivery pipeline and filter in an embodiment of the present invention;
[0027] Figure 4 Schematic diagram of the structure of the delivery pipeline and connecting pipes in an embodiment of the present invention;
[0028] Figure 5 Schematic diagram of the front cross-sectional structure of the device for preparing electronic grade epoxy resin according to the present invention;
[0029] Figure 6 For the present invention Figure 5 Schematic diagram of the enlarged structure at A in the middle;
[0030] Figure 7 Schematic diagram of the internal structure of the reactor in an embodiment of the present invention;
[0031] Figure 8 For the present invention Figure 7 Schematic diagram of the enlarged structure at point B in the middle.
[0032] In the picture:
[0033] 11. Reactor; 12. Auxiliary material pipe; 13. Pump body (III); 14. Mounting seat; 15. Telescopic member; 16. Mounting round pipe; 17. Nozzle; 18. Telescopic drive member; 19. Injection cavity; 110. Material guide pipe; 111. Stirring member;
[0034] 21. Pump body 1; 22. Pump body 2; 23. Transfer pipe 1; 24. Delivery pipe 1; 25. Delivery pipe 2; 26. Branch pipe; 27. Connecting pipe; 28. Filter; 29. On-off valve 1; 210. Transfer pipe 2; 211. On-off valve 2; 212. On-off valve 3. DETAILED DESCRIPTION
[0035] The subject matter described herein will now be discussed with reference to exemplary embodiments. It should be understood that these embodiments are discussed solely to enable those skilled in the art to better understand and implement the subject matter described herein, and that the functions and arrangements of the elements discussed may be varied without departing from the scope of this specification. Various examples may omit, substitute, or add various processes or components as needed. Furthermore, features described for some examples may be combined in other examples.
[0036] The invention provides Figures 1 to 8 As shown, a device for preparing electronic grade epoxy resin comprises:
[0037] The reactor 11 and two sets of delivery pipes are provided with a feeding process and a reaction process for preparing epoxy resin raw materials. The reactor 11 is provided with a preset capacity. First, the internal feeding of the reactor 11 is the feeding process, and when the feeding reaches the preset capacity, it turns into the reaction process;
[0038] During the feeding process, two sets of conveying pipes are used to feed epoxy resin raw materials at the same time;
[0039] During the reaction, one set of delivery pipes is used to feed the epoxy resin raw material, and the other set of delivery pipes is used to circulate and filter the material already present in the reactor 11. The circulation filtration is used to filter out impurity particles generated by the epoxy resin during the reaction.
[0040] Working Principle: Dual-mode operation mechanism. During the feeding process, two sets of pipelines operate simultaneously, rapidly delivering epoxy resin raw material into reactor 11 until the preset capacity is reached, triggering a mode switch. During the reaction process, one set of pipelines continues feeding to maintain the required raw material supply. The other set of pipelines switches to a circulating filtration mode: the material in reactor 11 is extracted, filtered to remove impurities generated by the reaction, and then returned to reactor 11. The preset capacity triggers the switch: When the feed volume reaches the preset capacity, a specific liquid level in reactor 11 is the key point for automatically or manually triggering the switch from the feeding process to the reaction process.
[0041] Improve production efficiency: The parallel feeding of dual pipelines during the feeding process significantly shortens the initial filling time. Ensure high-purity electronic grade products: Online circulation filtration is carried out simultaneously during the reaction process to continuously and actively remove impurity particles generated by the reaction. This avoids the risk of impurities accumulating in the reactor 11 or not being processed until the reaction is completed, and directly improves the purity of the final epoxy resin to the electronic grade standard. Maintain reaction continuity: During the reaction, one set of pipelines continuously feeds to ensure an uninterrupted supply of raw materials required for the reaction. Efficient use of resources: A set of delivery pipelines undertakes different tasks in two modes, feeding and circulating filtration at the same time, realizing pipeline function reuse and compactness of the device.
[0042] like Figure 1 and Figure 3 As shown, the delivery pipeline includes a delivery pipeline 1 24 and a delivery pipeline 2 25, on which a pump body 1 21 and a pump body 2 22 are respectively provided. A filter 28 for circulating filtration is provided on the delivery pipeline 25, and a branch pipeline 26 connected in parallel with the filter 28 is provided on the delivery pipeline 25;
[0043] The second delivery pipe 25 is connected to a connecting pipe 27 , and the second delivery pipe 25 is connected to the side of the reactor 11 through the connecting pipe 27 . The second delivery pipe 25 and the connecting pipe 27 are used for circulating filtration delivery.
[0044] like Figure 5 As shown, specifically, the device of the present application includes two states, one state is a feeding process state, the purpose of which is to quickly feed the inside of the reactor 11, and the other state is a reaction process state, the purpose of which is to continue feeding while performing circulating filtration between the reactor 11 and the external filter 28, and the particles generated during the epoxy resin raw material preparation reaction are filtered out by the filter 28, thereby obtaining a better quality epoxy resin to meet the standards of electronic grade epoxy resin.
[0045] More specifically, the preset capacity is customized by the staff, which is specifically expressed as the liquid level height of the material inside the reactor 11. The liquid level height is set to position one, and the connection position of the connecting pipe 27 and the reactor 11 is set to position two. Position one is set to be higher than position two.
[0046] like Figure 3 As shown, the delivery pipe 25 is provided with a switch valve 1 29, and the branch pipe 26 is provided with a switch valve 211. When the switch valve 211 of the branch pipe 26 is opened, the delivery pipe 25 and the branch pipe 26 are used to realize the feeding of epoxy resin raw materials.
[0047] like Figures 5 to 7 As shown, the reactor 11 is further provided with an auxiliary material feeding mechanism, which is used to add auxiliary materials required for epoxy resin preparation into the reactor 11 during the reaction process.
[0048] like Figure 7 and Figure 8 As shown, the auxiliary material feeding mechanism includes a mounting circular tube 16 , on which multiple groups of nozzles 17 are provided. The mounting circular tube 16 can uniformly add auxiliary materials to the interior of the reactor 11 through the nozzles 17 .
[0049] like Figures 5 to 7 As shown, the mounting circular tube 16 can be raised and lowered inside the reactor 11, and the nozzle 17 can be rotated on the mounting circular tube 16. A stirring member 111 is provided inside the reactor 11. While the stirring member 111 rotates and the mounting circular tube 16 is raised and lowered, the nozzle 17 rotates to inject auxiliary materials into the interior of the reactor 11.
[0050] Specifically, such as Figures 5 to 7 As shown, a mounting seat 14 is installed inside the reactor 11, and a telescopic member 15 is installed at the bottom of the mounting seat 14. The mounting tube 16 is installed on the mounting seat 14 through the telescopic member 15. The telescopic member 15 is configured as a multi-section telescopic push rod to achieve the lifting of the mounting tube 16.
[0051] like Figure 5 and Figure 6 As shown, the auxiliary material feeding mechanism includes an auxiliary material pipe 12 and an injection cavity 19. The auxiliary material pipe 12 is connected to the reactor 11 and is provided with a pump body 3 13. The injection cavity 19 is connected to the auxiliary material pipe 12 through a material guide pipe 110.
[0052] The auxiliary material tube 12 is used for adding a variety of different auxiliary materials, and the injection cavity 19 is used for adding a single auxiliary material.
[0053] like Figure 5As shown, the injection cavity 19 can add auxiliary materials through the guide tube 110. A telescopic driving member 18 is provided on the injection cavity 19. The telescopic driving member 18 is used to push out the auxiliary materials inside the injection cavity 19. The telescopic driving member 18 can realize the quantitative and constant speed addition of auxiliary materials inside the injection cavity 19.
[0054] like Figure 3 and Figure 4 As shown, the delivery pipe 1 24 and the delivery pipe 2 25 are provided with a third on-off valve 212. The pump body 1 21 is mounted on the delivery pipe 1 24 via the third on-off valve 212, and the pump body 2 22 is mounted on the delivery pipe 2 25 via the third on-off valve 212. A second transfer pipe 210 is mounted at the inlet ends of the delivery pipe 1 24 and the delivery pipe 2 25, and a first transfer pipe 23 is mounted at the outlet ends of the delivery pipe 1 24 and the delivery pipe 2 25. The delivery pipe 1 24 and the delivery pipe 2 25 are connected to the bottom of the reactor 11 via the first transfer pipe 23.
[0055] In summary, the present invention also has the following comprehensive effects:
[0056] Dual-mode workflow: Feeding: Two delivery pipes simultaneously deliver epoxy resin raw material to reactor 11, rapidly filling it to the preset capacity. Reaction: Once the liquid level reaches the preset height, the mode switches: Delivery pipe 1 24 continues to feed raw material, ensuring a constant supply of raw material for the reaction. Delivery pipe 2 25 is used for internal material circulation and filtration: Material within reactor 11 is pumped out of pump 2 2 through connecting pipe 27, passes through filter 28 to remove impurities generated by the reaction, and then returns to reactor 11.
[0057] Circulation Filtration: During the reaction process, by closing the second on-off valve 211 of the branch pipe 26, the material is forced to flow through the filter 28 on the second delivery pipe 25 for filtration. The function of the branch pipe 26 and its second on-off valve 211 is to open during the feeding process, allowing the second delivery pipe 25 to bypass the filter 28 and directly feed the reactor 11 quickly.
[0058] Auxiliary Material Addition Mechanism: During the reaction, the required auxiliary materials are added through the auxiliary material feeding mechanism. Auxiliary materials can be added via two pathways: Multiple auxiliary materials: Driven by pump body 3 13, they enter reactor 11 through auxiliary material pipe 12. A single auxiliary material can be added to injection chamber 19 at a constant rate and quantity. The telescopic drive member 18 precisely controls the ejection of the auxiliary material, which then enters reactor 11 through guide pipe 110 and auxiliary material pipe 12. The mounting tube 16 is raised and lowered by the telescopic member 15, and the nozzle 17 mounted thereon is rotatable. Combined with the stirring action of the stirring member 111, this achieves dynamic and uniform distribution of the auxiliary material within reactor 11.
[0059] Improve efficiency and purity: High-efficiency feeding: Dual pipelines work simultaneously during the feeding process, significantly shortening the initial filling time.
[0060] Online impurity removal: Circulating filtration is performed simultaneously during the reaction process to continuously remove particulate impurities generated by the reaction, directly improving the purity of the final epoxy resin product to meet electronic-grade standards. This eliminates the risk of impurity deposition or secondary contamination associated with centralized filtration after the reaction is complete. Continuous feeding: Raw materials are continuously replenished through the delivery pipeline 24 hours a day to maintain the reaction process.
[0061] Multifunctional and flexible equipment: Conveying pipeline 25, through branch pipeline 26 and valve configuration, serves two purposes: as a rapid feed channel during the feed phase and as a circulating filtration channel during the reaction phase. This optimizes pipeline utilization and equipment layout. The valve system provides flexible control over material flow.
[0062] Optimize reaction uniformity and quality: Dynamic auxiliary material addition: The liftable and rotating nozzle 17, combined with stirring, ensures highly uniform dispersion of auxiliary materials in the reaction system, preventing local concentrations from being too high or too low, promoting a smooth and sufficient reaction and improving product quality consistency. Quantitative and constant rate addition: The combination of the injection chamber 19 and the telescopic drive 18 allows for precise control of the addition of specific auxiliary materials to meet specific process requirements.
[0063] Guarantee of design rationality: The design of the preset liquid level being higher than the circulation outlet ensures that in the reaction circulation filtration mode, there is a sufficient liquid level to allow the material to be effectively extracted and circulated to avoid vacuum or air intake. Summary: The core advantage of this device lies in the combination of efficient production and high-purity electronic-grade products through the design of dual-pipeline division of labor, rapid feeding, continuous feeding, circulation filtration and online filtration during the reaction process. Assisted by a dynamic and uniform auxiliary material addition system, the stability of the reaction process and product quality are further guaranteed. The valve configuration and liquid level design ensure that the working mode can be switched and operated reliably.
[0064] The above describes the embodiments of the present invention, but the present invention is not limited to the above specific implementation methods. The above specific implementation methods are merely illustrative and not restrictive. Ordinary technicians in this field can also make many forms under the guidance of the present invention, all of which are protected by the present invention.
Claims
1. A device for preparing electronic grade epoxy resin, characterized in that, include: A reactor (11) and two sets of delivery pipes, wherein the reactor (11) is provided with a feeding process and a reaction process for preparing epoxy resin raw materials, and the reactor (11) is provided with a preset capacity. First, the internal feeding of the reactor (11) is the feeding process, and when the feeding reaches the preset capacity, it is converted into the reaction process; During the feeding process, two sets of conveying pipes are used to feed epoxy resin raw materials at the same time; During the reaction process, one set of delivery pipes is used to feed the epoxy resin raw material, and another set of delivery pipes is used to perform circulation filtration on the materials already present in the reactor (11), and the circulation filtration is used to filter out the impurity particles generated by the epoxy resin during the reaction process; The delivery pipeline comprises a delivery pipeline 1 (24) and a delivery pipeline 2 (25), wherein the delivery pipeline 1 (24) and the delivery pipeline 2 (25) are respectively provided with a pump body 1 (21) and a pump body 2 (22), the delivery pipeline 2 (25) is provided with a filter (28) for circulating filtration, and the delivery pipeline 2 (25) is provided with a branch pipeline (26) connected in parallel with the filter (28); The second delivery pipe (25) is connected to a connecting pipe (27), and the second delivery pipe (25) is connected to the side of the reactor (11) through the connecting pipe (27). The second delivery pipe (25) and the connecting pipe (27) are used for circulating filtration delivery.
2. The device for preparing electronic grade epoxy resin according to claim 1, characterized in that: The second delivery pipe (25) is provided with a first on-off valve (29), and the branch pipe (26) is provided with a second on-off valve (211). When the second on-off valve (211) of the branch pipe (26) is opened, the second delivery pipe (25) and the branch pipe (26) are used to feed the epoxy resin raw material.
3. The device for preparing electronic grade epoxy resin according to claim 1, characterized in that: The reactor (11) is also provided with an auxiliary material feeding mechanism, which is used to add auxiliary materials required for epoxy resin preparation into the reactor (11) during the reaction process.
4. The device for preparing electronic grade epoxy resin according to claim 3, characterized in that: The auxiliary material feeding mechanism comprises a mounting circular tube (16), on which a plurality of nozzles (17) are arranged. The mounting circular tube (16) can uniformly add auxiliary materials to the interior of the reactor (11) through the nozzles (17).
5. The device for preparing electronic grade epoxy resin according to claim 4, characterized in that: The mounting circular tube (16) can be raised and lowered inside the reactor (11), and the nozzle (17) can be rotated on the mounting circular tube (16). A stirring member (111) is provided inside the reactor (11). While the stirring member (111) rotates and the mounting circular tube (16) is raised and lowered, the nozzle (17) rotates to inject auxiliary materials into the interior of the reactor (11).
6. The device for preparing electronic grade epoxy resin according to claim 3, characterized in that: The auxiliary material feeding mechanism comprises an auxiliary material pipe (12) and an injection cavity (19); the auxiliary material pipe (12) is connected to the reactor (11) and is provided with a pump body (13); the injection cavity (19) is connected to the auxiliary material pipe (12) via a material guide pipe (110); The auxiliary material tube (12) is used for adding a variety of different auxiliary materials, and the injection cavity (19) is used for adding a single auxiliary material.
7. The device for preparing electronic grade epoxy resin according to claim 6, characterized in that: The injection cavity (19) can be used to add specific auxiliary materials through the material guide tube (110). A telescopic driving member (18) is provided on the injection cavity (19). The telescopic driving member (18) is used to push out the auxiliary materials inside the injection cavity (19). The telescopic driving member (18) can achieve quantitative and constant speed addition of the auxiliary materials inside the injection cavity (19).
8. The device for preparing electronic grade epoxy resin according to claim 1, characterized in that: The delivery pipe 1 (24) and the delivery pipe 2 (25) are provided with a switch valve 3 (212), the pump body 1 (21) is installed on the delivery pipe 1 (24) through the switch valve 3 (212), and the pump body 2 (22) is installed on the delivery pipe 2 (25) through the switch valve 3 (212).
9. The device for preparing electronic grade epoxy resin according to claim 8, characterized in that: The inlet ends of the delivery pipe 1 (24) and the delivery pipe 2 (25) are installed with a transfer pipe 2 (210), and the outlet ends of the delivery pipe 1 (24) and the delivery pipe 2 (25) are installed with a transfer pipe 1 (23). The delivery pipe 1 (24) and the delivery pipe 2 (25) are connected to the bottom of the reactor (11) through the transfer pipe 1 (23).
Citation Information
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