Temperature control device, control method thereof, control device and electrical equipment

Abstract

The invention relates to the technical field of electrical equipment, and discloses a temperature control device, a control method thereof, a control device and electrical equipment. The temperature control device comprises a shell, a first air door, a second air door, an air supply module, an evaporator and an air guide barrel communicating with the second air door. An air duct is formed in the shell, the shell is provided with an air outlet of the air duct, two first air inlets and two second air inlets, and the first air inlets are closer to the air outlet than the second air inlets in the air outlet direction of the air duct; the first air door corresponds to the first air inlet, and the second air door corresponds to the second air inlet; in the air outlet direction of the air duct, the first air inlet is closer to the air outlet than the evaporator, and the second air inlet is farther away from the air outlet than the evaporator; each air duct is located in the air duct and is perpendicular to the air outlet direction of the air duct. The temperature control device can reduce the frosting probability of the evaporator and improve the working efficiency of the evaporator.

Description

Technical Field

[0001] The present application relates to the technical field of electrical equipment, for example, to a temperature control device and a control method thereof, a control device, and electrical equipment. Background Art

[0002] An evaporator is a type of heat exchange device that uses phase change to condense a solution or precipitate a substance from it. Evaporators are often used in temperature control devices (such as cooling / heating equipment).

[0003] Related technology provides a cooling and heating device with adjustable temperature and humidity, including a housing and a door. The housing is provided with a heating system, a cooling system, and a controller, and a compressor compartment is provided on the outside of the housing. The cooling and heating device also includes a water box and a humidity-regulating fan provided above the water box. An air inlet duct and a return air duct are provided on both sides of the housing, respectively. A temperature and humidity regulating chamber is provided at the bottom of the inner cavity of the housing. The temperature and humidity regulating chamber is layered from top to bottom with an evaporator chamber, a humidity-regulating fan chamber, and a water box chamber. The inlet of the evaporator chamber is connected to the return air duct, and the outlet of the evaporator chamber is connected to the return air duct through dampers 1 and 2, so that the air flow is directly sent into the air inlet duct in one of two ways, or enters the air inlet duct through the humidity-regulating fan chamber and the water box chamber. When the air flow enters the humidity-regulating fan chamber, the humidity-regulating fan starts.

[0004] In related-art cooling and heating devices, the evaporator chamber inlet is directly connected to the return air duct. Air transported by the return air duct must pass through the evaporator chamber before entering the supply air duct. In this case, if the humidity of the air transported by the return air duct is high, the probability of frost forming on the evaporator will increase significantly, affecting the evaporator's normal operation. Furthermore, when outside air needs to come into contact with the evaporator, the contact area between the air and the evaporator is small, resulting in low evaporator efficiency in related-art cooling and heating devices.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0006] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0007] The embodiments of the present disclosure provide a temperature control device and a control method thereof, a control device, and an electrical device, for reducing the probability of frosting of an evaporator.

[0008] According to a first aspect of the present disclosure, a temperature control device is provided, comprising:

[0009] The housing has an air duct formed therein, and the housing is provided with an air outlet of the air duct, two first air inlets, and two second air inlets, wherein along the air outlet direction of the air duct, the first air inlets are closer to the air outlet than the second air inlets;

[0010] a first damper and a second damper, the first damper being arranged in the housing near the first air inlet, and the second damper being arranged in the housing near the second air inlet, the first damper being used to open or close the first air inlet, and the second damper being used to open or close the second air inlet;

[0011] The air supply module is located in the air duct and is used to send the air in the air duct to the air outlet;

[0012] The evaporator is located in the air duct, and along the air outlet direction of the air duct, the evaporator is located between the first air door and the second air door, the two first air inlets are closer to the air outlet than the evaporator, and the two second air inlets are farther away from the air outlet than the evaporator;

[0013] Each air duct is located in the air duct and perpendicular to the air outlet direction of the air duct. The two second air inlets are respectively connected to the two air ducts to send external air into the air duct through the air ducts. The outlets of the two air ducts connected to the two second air inlets are in opposite directions and avoid each other.

[0014] In some embodiments, the housing includes a first side wall and a second side wall opposite to each other along a first direction, two first air inlets are respectively located on the first side wall and the second side wall, two second air inlets are respectively located on the first side wall and the second side wall, and the first direction is perpendicular to the air outlet direction of the air duct; the two first air inlets are spaced apart along the second direction, and the two second air inlets are spaced apart along the second direction, and the second direction is perpendicular to the first direction and perpendicular to the air outlet direction of the air duct; each air guide tube is parallel to the first direction.

[0015] In some embodiments, the housing includes a first side wall and a second side wall opposite to each other along a first direction, two first air inlets are respectively located on the first side wall and the second side wall, two second air inlets are respectively located on the first side wall and the second side wall, and the first direction is perpendicular to the air outlet direction of the air duct; the two first air inlets are spaced apart along the second direction, and the two second air inlets are spaced apart along the second direction, and the second direction is perpendicular to the first direction and perpendicular to the air outlet direction of the air duct; each air guide tube is parallel to the third direction, and the angle between the third direction and the first direction is an acute angle.

[0016] In some embodiments, the two first air inlets are respectively connected to two air ducts to deliver external air into the air duct through the air ducts. The outlets of the two air ducts connected to the two first air inlets face opposite directions and avoid each other. In some embodiments, the temperature control device further includes a humidification module having a mist discharge unit. The exhaust hole of the mist discharge unit is located within the air duct. Along the air outlet direction of the air duct, the exhaust hole of the mist discharge unit is closer to the air outlet than the evaporator.

[0017] In some embodiments, the humidification module includes a heating water tank and a microwave module. The heating water tank is used to store water and is connected to the air inlet end of the water mist discharge part. The microwave module is arranged outside the heating water tank.

[0018] In some embodiments, the humidification module includes a water supply tank and a water supply pipe. The water supply pipe is connected to the water supply tank. Multiple water outlets are provided on the side wall of the water supply pipe. The water outlets provided on the water supply pipe are located inside the heating water tank.

[0019] In some embodiments, the temperature control device further includes a heating module, which is located in the air duct and between the evaporator and the humidification module along the air outlet direction of the air duct.

[0020] In some embodiments, the temperature control device further includes a defrost module, which is located in the air duct and close to the evaporator.

[0021] In some embodiments, the defrost module includes:

[0022] Refrigeration fin bracket, used for connecting with the shell;

[0023] A semiconductor refrigeration chip is arranged on a refrigeration chip bracket;

[0024] The cold end radiator is arranged on the side of the semiconductor refrigeration plate away from the evaporator;

[0025] The hot end radiator is arranged on the side of the semiconductor refrigeration plate close to the evaporator;

[0026] The cooling fan is arranged on the hot end radiator and faces the evaporator.

[0027] According to a second aspect of the present disclosure, a control method for a temperature control device is provided. The control method is used to control the temperature control device provided by the first aspect of the present disclosure. The control method includes:

[0028] During the operation of the evaporator, obtain reference data affecting the frosting condition of the evaporator;

[0029] Based on the reference data, one of the first damper and the second damper is controlled to be opened and the other is controlled to be closed.

[0030] In some embodiments, the reference data includes a humidity value of the target compartment and an operating state of the humidification module, where the operating state of the humidification module is an open state and a closed state; based on the reference data, controlling one of the first damper and the second damper to be open and the other to be closed comprises:

[0031] When the humidity value of the target compartment exceeds a preset humidity threshold, the first damper is controlled to close and the second damper is controlled to open;

[0032] When the humidity value of the target compartment does not exceed the preset humidity threshold and the humidification module is in the on state, the first damper is controlled to be opened and the second damper is controlled to be closed.

[0033] According to a third aspect of the present disclosure, a control device for a temperature control device is provided. The control device is communicatively connected to the evaporator, the first damper and the second damper respectively, and the control device is configured to execute the control method for the temperature control device provided in the second aspect of the present disclosure.

[0034] According to a fourth aspect of the present disclosure, an electrical device is provided. The electrical device includes a device body and the temperature control device provided by the first aspect of the present disclosure, and the temperature control device is arranged on the device body.

[0035] In some embodiments, the electrical device further comprises:

[0036] A third aspect of the present disclosure provides a control device for a temperature control device;

[0037] The control device is arranged on the device body, and the control device is respectively communicated with the evaporator, the first damper and the second damper in the temperature control device. The control device is configured to execute the control method for the temperature control device provided in the second aspect of the present disclosure.

[0038] The temperature control device and control method thereof, control device, and electrical equipment provided by the embodiments of the present disclosure can achieve the following technical effects:

[0039] The temperature control device includes a housing having an air duct formed therein. A first air inlet and a second air inlet are provided in the housing, and an air outlet direction is defined along the air duct, with the first air inlet being closer to the air outlet than the second air inlet. The temperature control device also includes a first damper for opening or closing the first air inlet and a second damper for opening or closing the second air inlet. The evaporator is located between the first damper and the second damper.

[0040] External air can be delivered into the air duct through any one of the first air inlet and the second air inlet and their corresponding air guide tube. Specifically, when the air supply module is started, external air can be delivered into the air duct through any one of the first air inlet and the second air inlet and their corresponding air guide tube. The air supply module can drive the air in the air duct to flow toward the air outlet along the outlet direction of the air duct.

[0041] If the humidity of the air supplied to the air duct is high, then only the first damper can be opened, and the air can only enter the air duct through the first air inlet and the air guide tube connected to the first air inlet. In this case, since the first air inlet is closer to the air outlet than the second air inlet, most of the air will flow directly to the air outlet without passing through the evaporator, which can avoid the evaporator from coming into contact with a large amount of air with high humidity, thereby reducing the probability of frost on the evaporator and contributing to the normal operation of the evaporator.

[0042] If the humidity of the air supplied to the air duct is low, then only the second damper can be opened, and the air can only enter the air duct through the second air inlet and the air guide tube connected to the second air inlet. In this case, most of the air flowing into the air duct will come into contact with the evaporator, which helps to improve the working efficiency of the evaporator; and because the humidity of the air is low at this time, the probability of frost on the evaporator will not be significantly increased. Furthermore, for the two air guide tubes connected to the two second air inlets, by limiting the air guide tubes to be located in the air duct, perpendicular to the air outlet direction of the air duct, and the outlets of the two air guide tubes facing opposite directions and avoiding each other, the air in the air duct can be guided by the two air guide tubes and driven by the air supply module to form a spiral airflow flowing toward the air outlet of the air duct. When the air flows through the evaporator in the form of a spiral airflow, the air and the evaporator will be more fully in contact, the contact area between the air and the evaporator will be increased, and the working efficiency of the evaporator will be improved.

[0043] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] One or more embodiments are exemplarily described by corresponding drawings. These exemplary descriptions and drawings do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation. In addition,

[0045] Figure 1 is a structural schematic diagram of a temperature control device provided by an embodiment of the present disclosure;

[0046] Figure 2 is a schematic diagram of an airflow path in a temperature control device provided by an embodiment of the present disclosure;

[0047] Figure 3 The embodiment of the present disclosure provides Figure 2 A top view of

[0048] Figure 4 Schematic diagram of the structure of the first damper and the second damper provided in an embodiment of the present disclosure;

[0049] Figure 5Schematic diagram of the relationship between the first damper, the air guide tube and the housing provided in an embodiment of the present disclosure;

[0050] Figure 6 Schematic diagram of the relationship between the second damper, the air guide tube and the housing provided by the embodiment of the present disclosure;

[0051] Figure 7 This is a structural diagram of an air supply module provided by an embodiment of the present disclosure;

[0052] Figure 8 is a structural schematic diagram of a humidification module provided in an embodiment of the present disclosure;

[0053] Figure 9 is a structural diagram of a microwave module provided by an embodiment of the present disclosure;

[0054] Figure 10 is a structural schematic diagram of a heating module provided by an embodiment of the present disclosure;

[0055] Figure 11 is a schematic diagram of the positional relationship between the evaporator and the defrost module provided in an embodiment of the present disclosure;

[0056] Figure 12 is a flow chart of a control method for a temperature control device provided by an embodiment of the present disclosure;

[0057] Figure 13 is a structural schematic diagram of a control device for a temperature control device provided by an embodiment of the present disclosure;

[0058] Figure 14 It is a structural diagram of an electrical device provided by an embodiment of the present disclosure.

[0059] Reference numerals:

[0060] 100-temperature control device;

[0061] 10-housing;

[0062] 101-air duct, 102-air outlet, 103-first air inlet, 104-second air inlet;

[0063] 105-first side wall, 106-second side wall;

[0064] 20-first damper, 30-second damper;

[0065] 40-air supply module, 401-fan, 402-fan bracket;

[0066] 50-evaporator;

[0067] 60-air duct;

[0068] 70-humidification module;

[0069] 701-water mist discharge part, 7011-exhaust hole;

[0070] 702-heating water tank, 7021-glass magnetic permeable hole;

[0071] 703-microwave module, 7031-housing, 7032-control board, 7033-transformer;

[0072] 7034-cooling fan, 7035-magnetron, 7036-waveguide;

[0073] Bracket 704, carrier plate 7041, bracket 705;

[0074] 706-water supply tank; 7061-water inlet, 7062-overflow port, 7063-float valve

[0075] 707-water supply pipe, 7071-water outlet;

[0076] 80-heating module, 801-carrying bracket, 802-heating tube;

[0077] 90-defrost module;

[0078] 901- refrigeration plate bracket, 902- semiconductor refrigeration plate, 903- cold end radiator;

[0079] 904-hot end radiator, 905-cooling fan, 906-heat insulation board;

[0080] 1001-drainage shell;

[0081] 200-control device for temperature control device;

[0082] 300-Electrical equipment, 3001-Equipment body. DETAILED DESCRIPTION

[0083] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The accompanying drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0084] In the description and claims of the embodiments of the present disclosure, as well as in the accompanying drawings, the terms "first," "second," and the like are used to distinguish similar items and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate to describe the embodiments of the present disclosure herein. In addition, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions.

[0085] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to having a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0086] Furthermore, the terms "disposed," "connected," and "fixed" should be interpreted broadly. For example, "connected" can mean a fixed connection, a removable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or an internal connection between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in the embodiments of this disclosure based on the specific circumstances.

[0087] Unless otherwise stated, the term "plurality" means two or more.

[0088] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B means: A or B.

[0089] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0090] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other.

[0091] An evaporator is a type of heat exchange device that uses phase change to condense a solution or precipitate a substance from it. Evaporators are often used in temperature control devices (such as cooling / heating equipment).

[0092] Related technology provides a cooling and heating device with adjustable temperature and humidity, including a housing and a door. The housing is provided with a heating system, a cooling system, and a controller, and a compressor compartment is provided on the outside of the housing. The cooling and heating device also includes a water box and a humidity-regulating fan provided above the water box. An air inlet duct and a return air duct are provided on both sides of the housing, respectively. A temperature and humidity regulating chamber is provided at the bottom of the inner cavity of the housing. The temperature and humidity regulating chamber is layered from top to bottom with an evaporator chamber, a humidity-regulating fan chamber, and a water box chamber. The inlet of the evaporator chamber is connected to the return air duct, and the outlet of the evaporator chamber is connected to the return air duct through dampers 1 and 2, so that the air flow is directly sent into the air inlet duct in one of two ways, or enters the air inlet duct through the humidity-regulating fan chamber and the water box chamber. When the air flow enters the humidity-regulating fan chamber, the humidity-regulating fan starts.

[0093] In related-art cooling and heating devices, the evaporator chamber inlet is directly connected to the return air duct. Air transported by the return air duct must pass through the evaporator chamber before entering the supply air duct. In this case, if the humidity of the air transported by the return air duct is high, the probability of frost forming on the evaporator will increase significantly, affecting the evaporator's normal operation. Furthermore, when outside air needs to come into contact with the evaporator, the contact area between the air and the evaporator is small, resulting in low evaporator efficiency in related-art cooling and heating devices.

[0094] Combine Figures 1 to 11 As shown, an embodiment of the present disclosure provides a temperature control device 100, which includes a housing 10, a first damper 20, a second damper 30, an air supply module 40, an evaporator 50, and at least two air guide tubes 60. First, it should be noted that in the drawings, the Z direction represents the air outlet direction, the X direction represents the first direction, the Y direction represents the second direction, and the M direction represents the third direction.

[0095] An air duct 101 is formed inside the housing 10 , and the housing 10 is provided with an air outlet 102 of the air duct 101 , two first air inlets 103 and two second air inlets 104 . Along the air outlet direction of the air duct 101 , the first air inlet 103 is closer to the air outlet 102 than the second air inlet 104 .

[0096] A first damper 20 is disposed within the housing 10 near the first air inlet 103, and a second damper 30 is disposed within the housing 10 near the second air inlet 104. The first damper 20 is used to open or close the first air inlet 103, and the second damper 30 is used to open or close the second air inlet 104. An air supply module 40 is disposed within the air duct 101 and is used to deliver air within the air duct 101 to the air outlet 102 of the air duct 101. The evaporator 50 is disposed within the air duct 101. Along the outlet direction of the air duct 101, the two first air inlets 103 are closer to the air outlet 102 than the evaporator 50, and the two second air inlets 104 are farther from the air outlet 102 than the evaporator 50.

[0097] Each air duct 60 is located in the air duct 101 and is perpendicular to the air outlet direction of the air duct 101. The two second air inlets 104 are respectively connected to the two air ducts 60 to send the external air into the air duct 101 through the air duct 60. The outlets of the two air ducts 60 connected to the two second air inlets 104 face opposite directions and avoid each other.

[0098] In some embodiments, there are four air ducts 60. The two second air inlets 104 are respectively connected to the two air ducts 60 to deliver external air into the air duct 101 through the air ducts 60. The outlets of the two air ducts 60 connected to the two second air inlets 104 face opposite directions and avoid each other. The two first air inlets 103 are respectively connected to the two air ducts 60 to deliver external air into the air duct 101 through the air ducts 60. The outlets of the two air ducts 60 connected to the two first air inlets 103 face opposite directions and avoid each other.

[0099] In the disclosed embodiment, a temperature control device 100 includes a housing 10 having an air duct 101 formed therein. A first air inlet 103 and a second air inlet 104 are provided on the housing 10. The housing 10 defines an air outlet direction along the air duct 101, with the first air inlet 103 being closer to the air outlet 102 than the second air inlet 104. The temperature control device 100 also includes a first damper 20 for opening or closing the first air inlet 103 and a second damper 30 for opening or closing the second air inlet 104. The evaporator 50 is located between the first damper 20 and the second damper 30.

[0100] External air can be delivered into the air duct 101 through any one of the first air inlet 103 and the second air inlet 104 and its corresponding air guide tube 60. Specifically, when the air supply module 40 is started, external air can be delivered into the air duct 101 through any one of the first air inlet 103 and the second air inlet 104 and its corresponding air guide tube 60. The air supply module 40 can drive the air in the air duct 101 to flow toward the air outlet 102 along the outlet direction of the air duct 101.

[0101] If the humidity of the air supplied to the air duct 101 is high, then only the first damper 20 can be opened, and the air can only enter the air duct 101 through the first air inlet 103 and the air guide tube 60 connected to the first air inlet 103. In this case, since the first air inlet 103 is closer to the air outlet 102 than the second air inlet 104, most of the air will flow directly to the air outlet 102 without passing through the evaporator 50, which can avoid the evaporator 50 from coming into contact with a large amount of air with high humidity, thereby reducing the probability of frosting on the evaporator 50 and contributing to the normal operation of the evaporator 50.

[0102] If the humidity of the air supplied to the air duct 101 is low, only the second damper 30 can be opened, and air can only enter the air duct 101 through the second air inlet 104 and the air guide 60 connected to the second air inlet 104. In this case, most of the air flowing into the air duct 101 will come into contact with the evaporator 50, which helps improve the operating efficiency of the evaporator 50. Moreover, since the humidity of the air is low at this time, the probability of frosting on the evaporator 50 will not be significantly increased.

[0103] Figure 2 and Figure 3 Schematic diagram of the airflow path in the temperature control device 100 is shown, wherein: Figure 3 yes Figure 2 A top view of Figure 2 and Figure 3 In the figure, arrows are used to indicate airflow paths. For the two air ducts 60 connected to the two first air inlets 103, it is defined that the air ducts 60 are both located in the air duct 101, perpendicular to the air outlet direction of the air duct 101, and the outlets of the two air ducts 60 are in opposite directions and avoid each other. Under the above-mentioned definition of the setting direction and position relationship of the two air ducts 60, when the first damper 20 is opened and the air supply module 40 is started, a stream of external air enters the air duct 101 through a first air inlet 103 and the air duct 60 connected to the first air inlet 103, and another stream of external air enters the air duct 101 through another first air inlet 103 and the air duct 60 connected to the first air inlet 103. The two streams of air will form convection. At the same time, the air supply module 40 drives the air in the air duct 101 to flow to the air outlet 102 along the air outlet direction of the air duct 101. In this way, as Figure 2 and Figure 3 As shown, under the guidance of the two air guide tubes 60 and the drive of the air supply module 40 , the air in the air duct 101 will form a spiral airflow flowing toward the air outlet 102 of the air duct 101 .

[0104] For the two air ducts 60 connected to the two second air inlets 104, it is defined that the air ducts 60 are both located in the air duct 101, perpendicular to the air outlet direction of the air duct 101, and the outlets of the two air ducts 60 face opposite directions and avoid each other. Under the above-mentioned definition of the setting direction and position relationship of the two air ducts 60, when the second damper 30 is open and the air supply module 40 is started, a stream of external air enters the air duct 101 through a second air inlet 104 and the air duct 60 connected to the second air inlet 104, and another stream of external air enters the air duct 101 through another second air inlet 104 and the air duct 60 connected to the second air inlet 104. The two streams of air will form convection. At the same time, the air supply module 40 drives the air in the air duct 101 to flow to the air outlet 102 along the air outlet direction of the air duct 101. In this way, Figure 2 and Figure 3As shown, under the guidance of the two air guides 60 and the drive of the air supply module 40, the air in the air duct 101 forms a spiral airflow that flows toward the air outlet 102 of the air duct 101. When the air flows through the evaporator 50 in the form of a spiral airflow, the air and the evaporator 50 are more fully contacted, the contact area between the air and the evaporator 50 is increased, and the operating efficiency of the evaporator 50 is improved.

[0105] Optionally, the first damper 20 and the second damper 30 may be Figure 4 The damper in the form of a grille with adjustable opening can also be a damper in the form of a double-leaf door, or a sliding damper that can be opened and closed by sliding. The specific forms of the first damper 20 and the second damper 30 can be determined according to actual needs, and the embodiment of the present disclosure does not limit this.

[0106] In some embodiments, the housing 10 is in a straight cylindrical shape, and an air duct 101 formed inside the housing 10 extends along the length of the housing 10. One end of the housing 10 is sealed, and an air outlet 102 is provided at the other end of the housing 10. A first air inlet 103 and a second air inlet 104 are provided on the sidewalls of the housing 10. The air outlet direction of the air duct 101 is from the sealed end of the housing 10 to the air outlet 102 of the housing 10.

[0107] In some embodiments, combined Figure 1 As shown, the housing 10 is cylindrical and vertically arranged, with an air duct 101 formed inside the housing 10 extending vertically. The air outlet 102 is at the top, and below the air outlet 102, the main air supply module 40, the first air inlet 103, the evaporator 50, and the second damper 30 are arranged in order from top to bottom.

[0108] In some embodiments, combined Figure 1 As shown, the temperature control device 100 also includes a drainage shell 1001, which includes two openings. The edge of one opening of the drainage shell 1001 is connected to the side wall of the outer shell 10, and the first damper 20 and the second damper 30 are both contained inside the drainage shell 1001. The external air is drained to the first damper 20 and the second damper 30 through the other opening of the drainage shell 1001.

[0109] In some embodiments, as Figure 5 and Figure 6As shown, the housing 10 includes a first sidewall 105 and a second sidewall 106 that are opposite each other along a first direction. Two first air inlets 103 are located on the first sidewall 105 and the second sidewall 106, respectively, and two second air inlets 104 are located on the first sidewall 105 and the second sidewall 106, respectively. The first direction is perpendicular to the air outlet direction of the air duct 101. The two first air inlets 103 are spaced apart along a second direction, and the two second air inlets 104 are spaced apart along the second direction. The second direction is perpendicular to the first direction and perpendicular to the air outlet direction of the air duct 101. Each air guide 60 is parallel to the third direction, and the angle between the third direction and the first direction is acute.

[0110] In some embodiments, the housing 10 includes a first sidewall 105 and a second sidewall 106 arranged opposite each other along a first direction. Two first air inlets 103 are located on the first sidewall 105 and the second sidewall 106, respectively, and two second air inlets 104 are located on the first sidewall 105 and the second sidewall 106, respectively. The first direction is perpendicular to the air outlet direction of the air duct 101. The two first air inlets 103 are spaced apart along a second direction, and the two second air inlets 104 are spaced apart along the second direction. The second direction is perpendicular to the first direction and perpendicular to the air outlet direction of the air duct 101. Each air guide 60 is parallel to the first direction.

[0111] In some embodiments, combined Figure 1 and Figure 7 As shown, the air supply module 40 includes one or more fans 401. Specifically, the air supply module 40 also includes a fan bracket 402. The fans 401 are mounted on the fan bracket 402, which is connected to the inner wall of the housing 10. When the fans 401 are activated, external air can be supplied into the air duct 101 through either the first air inlet 103 or the second air inlet 104. The fans 401 can then drive the air in the air duct 101 to flow toward the air outlet 102 along the outlet direction of the air duct 101.

[0112] Optionally, the fan bracket 402 may be connected to the inner wall of the housing 10 by bolts. The fan bracket 402 may also be connected to the inner wall of the housing 10 by other means, such as clamping or welding.

[0113] In some embodiments, combined Figure 1 and Figure 8As shown, the temperature control device 100 also includes a humidification module 70. The humidification module 70 has a mist discharge unit 701. The exhaust hole 7011 of the mist discharge unit 701 is located in the air duct 101. Along the outlet direction of the air duct 101, the exhaust hole 7011 of the mist discharge unit 701 is closer to the air outlet 102 than the evaporator 50. The humidification module 70 is used to generate water mist and deliver the water mist into the air duct 101 through the exhaust hole 7011 of the mist discharge unit 701. When the fan 401 is turned on, the fan 401 can drive the water mist in the air duct 101 to flow along the outlet direction of the air duct 101 toward the air outlet 102.

[0114] The exhaust hole 7011 of the water mist discharge part 701 is closer to the air outlet 102 than the evaporator 50. When the humidification module 70 generates water mist, under the drive of the air supply module 40, most of the water mist discharged by the water mist discharge part 701 flows directly to the air outlet 102 without passing through the evaporator 50 and contacting the evaporator 50. This avoids the frost of the evaporator 50 due to the contact of the water mist generated by the humidification module 70 with the evaporator 50 to a certain extent.

[0115] In some embodiments, the humidification module 70 includes a heating water tank 702 and a microwave module 703. The heating water tank 702 stores water and is connected to the air inlet of the mist discharge unit 701. The microwave module 703 is disposed outside the heating water tank 702 and emits microwaves to heat the water in the heating water tank 702, thereby evaporating the water and generating mist. The mist in the heating water tank 702 is then transported into the air duct 101 through the exhaust holes 7011 of the mist discharge unit 701.

[0116] Since the microwave module 703 is disposed outside the heating water tank 702, the water in the heating water tank 702 can also be heated. This achieves water-electricity separation, improves safety, and minimizes scaling of the microwave module 703. Furthermore, using the microwave module 703 to heat the water in the heating water tank 702 does not significantly reduce thermal efficiency and provides high humidification efficiency.

[0117] In some embodiments, the sidewall of the heating water tank 702 adjacent to the microwave module 703 is made of glass and metal and is provided with a glass magnetic perforation 7021. Microwaves emitted by the microwave module 703 can smoothly penetrate through the glass magnetic perforation 7021 into the interior of the heating water tank 702. The remaining inner walls of the heating water tank 702 are made of metal to reflect the microwaves and form a microwave field.

[0118] In some embodiments, the humidification module 70 includes a bracket 704 having a support plate 7041. The heating water tank 702 is placed on the top surface of the support plate 7041. The bottom surface of the support plate 7041 is provided with a bracket 705. The microwave module 703 is placed on the bracket 705 and is close to the bottom plate of the heating water tank 702. The bottom plate of the heating water tank 702 is made of glass and metal and is provided with a glass magnetic permeable hole 7021.

[0119] In some embodiments, the humidification module 70 includes a water supply tank 706 and a water supply pipe 707. The water supply pipe 707 is connected to the water supply tank 706. Multiple water outlets 7071 are provided on the sidewall of the water supply pipe 707. These outlets 7071 are located within the heating water tank 702. Water in the water supply tank 706 flows into the heating water tank 702 through the multiple water outlets 7071 on the sidewall of the water supply pipe 707. The provision of multiple water outlets 7071 on the sidewall of the water supply pipe 707 effectively prevents the problem of excessive temperature disturbance in the heating water tank 702 caused by cold water entering the heating water tank 702 in conventional direct-discharge systems, thereby preventing the rapid drop in temperature of the heating water tank 702 from affecting the amount of water mist discharged.

[0120] In some embodiments, one end of the water supply pipe 707 is connected to the water supply tank 706, and the other end of the water supply pipe 707 extends into the interior of the heating water tank 702. The length of the water supply pipe 707 extending into the heating water tank 702 exceeds half the width of the heating water tank 702, thereby increasing the resistance to water return from the heating water tank 702 to the water supply tank 706, and to some extent hindering the hot water in the heating water tank 702 from flowing back into the water supply tank 706.

[0121] Optionally, the water replenishment tank 706 is placed on the top surface of the supporting plate 7041 of the bracket 704 .

[0122] In some embodiments, the water supply tank 706 is provided with a water inlet 7061, an overflow port 7062, and a float valve 7063. Water automatically enters the water supply tank 706 through the water inlet 7061, and the water flow is controlled by the float valve 7063. The provision of the overflow port 7062 can solve the problem of water overflow caused by a malfunction of the float valve 7063.

[0123] In some embodiments, the housing 10 is cylindrical and vertically arranged, with an air duct 101 formed within the housing 10 extending vertically. The air outlet 102 is located at the top. Below the air outlet 102, the air supply module 40, the exhaust holes 7011 of the mist discharge unit 701, and the evaporator 50 are arranged in order from top to bottom. When the humidification module 70 generates mist, driven by the air supply module 40, most of the mist discharged from the mist discharge unit 701 flows directly toward the air outlet 102 above, rather than drifting downward to the evaporator 50. This, to a certain extent, prevents frost on the evaporator 50 caused by contact between the mist generated by the humidification module 70 and the evaporator 50.

[0124] Combine Figure 8 and Figure 9 As shown, microwave module 703 includes a housing 7031, a control board 7032, a transformer 7033, a heat dissipation fan 7034, a magnetron 7035, and a waveguide 7036. The control board 7032, transformer 7033, heat dissipation fan 7034, magnetron 7035, and waveguide 7036 are all disposed within housing 7031. An air outlet grille 7037 is disposed within housing 7031 at a position corresponding to heat dissipation fan 7034, and an air inlet grille 7038 is disposed within housing 7031 at a position distal from air outlet grille 7037. Housing 7031 is placed on bracket 705 near the bottom plate of heating water tank 702, with waveguide 7036 facing the glass magnetic permeable hole 7021 at the bottom of heating water tank 702.

[0125] In some embodiments, combined Figure 1 and Figure 10 As shown, the temperature control device 100 further includes a heating module 80. The heating module 80 is located within the air duct 101, along the outlet direction of the air duct 101, between the evaporator 50 and the humidification module 70. The heating module 80 heats the air in the air duct 101, providing the heat required for constant temperature. The power and number of heating modules 80 can be set according to the compartment load.

[0126] Since the heating module 80 is located between the evaporator 50 and the humidification module 70, after the heating module 80 heats the air in the air duct 101, the water mist generated by the humidification module 70 can be kept away from the evaporator 50, which can to a certain extent prevent the water mist from contacting the evaporator 50 and causing frost on the evaporator 50.

[0127] In some embodiments, the housing 10 is straight and vertically arranged, and the air duct 101 formed inside the housing 10 extends in the vertical direction. The air outlet 102 is at the top. Below the air outlet 102, the air supply module 40, the exhaust hole 7011 of the water mist exhaust unit 701, the heating module 80, and the evaporator 50 are arranged in sequence from top to bottom. After the heating module 80 heats the air in the air duct 101, the water mist discharged from the water mist exhaust unit 701 can float upward to away from the evaporator 50, which can to a certain extent prevent the water mist from contacting the evaporator 50 and causing frost on the evaporator 50. In addition, the heating module 80 is adjacent to the evaporator 50, and the heat generated by the heating module 80 helps the evaporator 50 to defrost.

[0128] In some embodiments, the heating module 80 includes a supporting bracket 801 and a heating tube 802 . The heating tube 802 is disposed on the supporting bracket 801 . The supporting bracket 801 is connected to the inner wall of the housing 10 . The heating tube 802 is used to flow high-temperature water to heat the surrounding air.

[0129] Optionally, the supporting bracket 801 may be connected to the inner wall of the housing 10 by bolts. The supporting bracket 801 may also be connected to the inner wall of the housing 10 by other means, such as clamping or welding.

[0130] In some embodiments, the heating module 80 includes a heating wire, and the surrounding air is heated by energizing the heating wire to increase its temperature.

[0131] In some embodiments, combined Figure 1 and Figure 11 As shown, the temperature control device 100 further includes a defrost module 90 , which is located in the air duct 101 and close to the evaporator 50 . The defrost module 90 can generate heat to melt frost on the surface of the evaporator 50 .

[0132] In some embodiments, the defrost module 90 includes a refrigeration fin bracket 901, a semiconductor refrigeration fin 902, a cold end radiator 903, a hot end radiator 904, and a cooling fan 905. The refrigeration fin bracket 901 is used to connect to the inner wall of the housing 10, the semiconductor refrigeration fin 902 is disposed on the refrigeration fin bracket 901, the cold end radiator 903 is disposed on the side of the semiconductor refrigeration fin 902 away from the evaporator 50, the hot end radiator 904 is disposed on the side of the semiconductor refrigeration fin 902 close to the evaporator 50, and the cooling fan 905 is disposed on the hot end radiator 904 and faces the evaporator 50.

[0133] Optionally, the cooling fin bracket 901 may be connected to the inner wall of the housing 10 by bolts. The cooling fin bracket 901 may also be connected to the inner wall of the housing 10 by other means, such as clamping or welding.

[0134] The semiconductor refrigeration chip 902 is made of semiconductor materials. The semiconductor refrigeration chip 902 uses the Peltier effect of semiconductor materials. When direct current passes through a galvanic couple composed of two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple respectively. The heat generated is used to defrost and the cooling capacity is used to maintain the room temperature.

[0135] In the embodiment of the present disclosure, the side facing the evaporator 50 is defined as the first side, and the side facing away from the evaporator 50 is defined as the second side. When the evaporator 50 needs to be defrosted, the heat generated by the first side of the semiconductor refrigeration plate 902 passes through the hot end radiator 904 and the cooling fan 905, so that the heat is quickly convected and evenly distributed on the evaporator 50, and the defrosting speed is fast. The second side of the semiconductor refrigeration plate 902 generates cold energy at the same time, and the cold energy is dissipated through the cold end radiator 903 to stabilize the temperature in the room. Optionally, the defrost module 90 also includes a heat insulation plate 906. The heat insulation plate 906 can physically partition the first side and the second side of the semiconductor refrigeration plate 902 to avoid the consumption of heat and cold offsetting each other.

[0136] In the disclosed embodiment, the above-mentioned defrost module 90 can continue to output cold air when the evaporator 50 is defrosting, thereby achieving rapid humidification. Moreover, basically no additional heat is introduced during humidification, and there is no condensation loss, which helps to achieve efficient energy saving and precise temperature control.

[0137] In some embodiments, the defrost module 90 includes a heating plate. The temperature of the heating plate is increased by energizing the heating plate, and the evaporator 50 is defrosted by radiating heat to the evaporator 50 .

[0138] Combine Figure 12 As shown, the embodiment of the present disclosure provides a control method for a temperature control device 100. The control method is used to control the temperature control device 100 provided by the embodiment of the present disclosure. The control method can be executed by a control device 200. The control method includes:

[0139] S1201 , the control device 200 obtains reference data that affects the frosting condition of the evaporator 50 during the operation of the evaporator 50 .

[0140] S1202 : The control device 200 controls one of the first damper 20 and the second damper 30 to be open and the other to be closed based on the reference data.

[0141] In some embodiments, the reference data includes the humidity value of the target compartment and the working state of the humidification module 70 , where the working state of the humidification module 70 is an on state and an off state.

[0142] Based on the reference data, one of the first damper 20 and the second damper 30 is controlled to be open and the other is controlled to be closed, including: when the humidity value of the target compartment exceeds a preset humidity threshold, the first damper 20 is controlled to be closed and the second damper 30 is controlled to be open; when the humidity value of the target compartment does not exceed the preset humidity threshold and the humidification module 70 is in the on state, the first damper 20 is controlled to be open and the second damper 30 is controlled to be closed.

[0143] Specifically, when the humidity value of the target compartment exceeds a preset humidity threshold, the first damper 20 is controlled to close and the second damper 30 is controlled to open. At this time, the external air enters the air duct 101 from the second air inlet 104 and flows to the air outlet 102 after passing through the evaporator 50.

[0144] When the humidity value of the target compartment does not exceed the preset humidity threshold, the humidification module 70 is automatically turned on. At this time, the external air entering the air duct 101 contains a large amount of wet steam. If the external air flow passes through the evaporator 50 at this time, it will cause a large amount of frost on the evaporator 50, and the humidity will decrease after the steam condenses. In this case, the humidification module 70 must continue to operate at high power to maintain a stable humidity, resulting in energy waste and low efficiency. In this case, the first damper 20 is controlled to open and the second damper 30 is controlled to close. At this time, the external air entering the air duct 101 does not pass through the evaporator 50 but flows directly to the air outlet 102. This can prevent the evaporator 50 from coming into contact with a large amount of high-humidity air, thereby reducing the probability of frost on the evaporator 50 and facilitating the normal operation of the evaporator 50. In addition, the humidification module 70 does not need to continue to operate at high power, reducing energy waste.

[0145] In some embodiments, when the humidity value of the target compartment exceeds a preset humidity threshold, the air supply module 40, the heating module 80, and the evaporator 50 are controlled to start working, and the first damper 20 is controlled to be closed and the second damper 30 is controlled to be opened; then, it is determined whether the evaporator 50 is frosted. If it is determined that the evaporator 50 is frosted, the evaporator 50 is controlled to stop working, and the defrost module 90 is controlled to start working to defrost the evaporator 50; when it is determined that the evaporator 50 has finished defrosting, the defrost module 90 is controlled to stop working, and the evaporator 50 is controlled to continue working.

[0146] In some embodiments, when the humidity value of the target compartment does not exceed a preset humidity threshold, the air supply module 40, the heating module 80, the evaporator 50 and the humidification module 70 are controlled to start working, and the first damper 20 is controlled to be opened and the second damper 30 is controlled to be closed; then, it is determined whether the evaporator 50 is frosted. If it is determined that the evaporator 50 is frosted, the evaporator 50 is controlled to stop working, and the defrost module 90 is controlled to start working to defrost the evaporator 50; when it is determined that the evaporator 50 has finished defrosting, the defrost module 90 is controlled to stop working, and the evaporator 50 is controlled to continue working.

[0147] Combine Figure 13 As shown, an embodiment of the present disclosure provides a control device for a temperature control device, wherein the control device 200 includes a processor 201 and a memory 202. Optionally, the control device 200 may further include a communication interface 203 and a bus 204. The processor 201, the communication interface 203, and the memory 202 may communicate with each other through the bus 204. The communication interface 203 may be used for information transmission. The processor 201 may call the logic instructions in the memory 202 to execute the control method for the temperature control device of the above embodiment.

[0148] In addition, the logic instructions in the memory 202 can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent product.

[0149] Memory 202, as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as program instructions / modules corresponding to the methods in the embodiments of the present disclosure. Processor 201 executes the program instructions / modules stored in memory 202 to execute functional applications and process data, thereby implementing the control method for the temperature control device in the above-mentioned embodiments.

[0150] The memory 202 may include a program storage area and a data storage area. The program storage area may store an operating system and at least one application required for a function; the data storage area may store data generated based on the use of the terminal device. Furthermore, the memory 202 may include a high-speed random access memory and a non-volatile memory.

[0151] An embodiment of the present disclosure provides a computer-readable storage medium storing computer-executable instructions, wherein the computer-executable instructions are configured to execute the above-mentioned control method for a temperature control device.

[0152] The technical solutions of the embodiments of the present disclosure may be embodied in the form of a software product, which is stored in a storage medium and includes one or more instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in the embodiments of the present disclosure. The aforementioned storage medium may be a non-transitory storage medium, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, among other media capable of storing program code.

[0153] The above description and the accompanying drawings fully illustrate the embodiments of the present disclosure so that those skilled in the art can practice them. Other embodiments may include structural, logical, electrical, process and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Moreover, the words used in this application are only used to describe the embodiments and are not used to limit the claims. As used in the description of the embodiments and claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to also include plural forms. Similarly, the term "and / or" as used in this application refers to any and all possible combinations of one or more associated listings. In addition, when used in this application, the term "comprise" and its variations "comprises" and / or comprising refer to the presence of stated features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups of these. In the absence of further restrictions, an element defined by the sentence "comprising a..." does not exclude the presence of other identical elements in the process, method or device that includes the element. In this article, each embodiment may focus on the differences from other embodiments, and the same and similar parts between the various embodiments can be referenced to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method part disclosed in the embodiments, then the relevant parts can be found in the description of the method part.

[0154] Combine Figure 14 As shown, an embodiment of the present disclosure provides an electrical device 300, which includes a device body 3001 and the temperature control device 100 provided in the above embodiment, wherein the temperature control device 100 is disposed in the device body 3001. The electrical device 300 can be a refrigerator, a freezer, a wine cabinet, etc.

[0155] In some embodiments, the electrical device 300 further includes the control device 200 for the temperature control device 100 provided in the above-mentioned embodiments. The control device 200 is disposed in the device body 3001 and is respectively in communication with the evaporator 50, the first damper 20, and the second damper 30 in the temperature control device 100. The control device 200 is configured to execute the control method for the temperature control device 100 provided in the embodiments of the present disclosure.

[0156] In some embodiments, the control device 200 is further communicatively connected to one or more of the air supply module 40 , the humidification module 70 , the heating module 80 and the defrost module 90 to control the operating status of the connected modules.

[0157] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless expressly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

[0158] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software may depend on the specific application and design constraints of the technical solution. The technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of the present disclosure. The technicians will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0159] In the embodiments disclosed herein, the disclosed methods and products (including but not limited to devices, equipment, etc.) can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units can be merely a logical functional division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between each other shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, and can be electrical, mechanical or other forms. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected to implement this embodiment according to actual needs. In addition, the functional units in the embodiments of the present disclosure may be integrated into a processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0160] The flowcharts and block diagrams in the accompanying drawings show the possible implementation architectures, functions and operations of the systems, methods and computer program products according to the embodiments of the present disclosure. In this regard, each box in the flowchart or block diagram can represent a module, program segment or part of the code, and the module, program segment or part of the code contains one or more executable instructions for implementing the specified logical functions. In some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, or they can sometimes be executed in the opposite order, which can depend on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different boxes can also occur in an order different from that disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps can actually be executed substantially in parallel, or they can sometimes be executed in the opposite order, which can depend on the functions involved. Each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented by a dedicated hardware-based system that performs the specified function or action, or may be implemented by a combination of dedicated hardware and computer instructions.

Claims

1. A temperature control device, characterized in that: include: The housing has an air duct formed therein, and the housing is provided with an air outlet of the air duct, two first air inlets, and two second air inlets, wherein along the air outlet direction of the air duct, the first air inlets are closer to the air outlet than the second air inlets; a first damper and a second damper, the first damper being arranged in the housing near the first air inlet, and the second damper being arranged in the housing near the second air inlet, the first damper being used to open or close the first air inlet, and the second damper being used to open or close the second air inlet; The air supply module is located in the air duct and is used to send the air in the air duct to the air outlet; The evaporator is located in the air duct, and along the air outlet direction of the air duct, the evaporator is located between the first air door and the second air door, the two first air inlets are closer to the air outlet than the evaporator, and the two second air inlets are farther away from the air outlet than the evaporator; There are at least two air guide tubes, each of which is located in the air duct and perpendicular to the air outlet direction of the air duct. The two second air inlets are respectively connected to the two air guide tubes to send external air into the air duct through the air guide tubes. The outlets of the two air guide tubes connected to the two second air inlets are in opposite directions and avoid each other.

2. The temperature control device according to claim 1, characterized in that: The housing includes a first side wall and a second side wall opposite to each other along a first direction, two first air inlets are respectively located on the first side wall and the second side wall, and two second air inlets are respectively located on the first side wall and the second side wall, and the first direction is perpendicular to the air outlet direction of the air duct; The two first air inlets are spaced apart along the second direction, and the two second air inlets are spaced apart along the second direction, and the second direction is perpendicular to the first direction and perpendicular to the air outlet direction of the air duct; Each air guide tube is parallel to the first direction.

3. The temperature control device according to claim 1, characterized in that: The housing includes a first side wall and a second side wall opposite to each other along a first direction, two first air inlets are respectively located on the first side wall and the second side wall, and two second air inlets are respectively located on the first side wall and the second side wall, and the first direction is perpendicular to the air outlet direction of the air duct; The two first air inlets are spaced apart along the second direction, and the two second air inlets are spaced apart along the second direction, and the second direction is perpendicular to the first direction and perpendicular to the air outlet direction of the air duct; Each air guide tube is parallel to the third direction, and the angle between the third direction and the first direction is an acute angle.

4. The temperature control device according to any one of claims 1 to 3, characterized in that: The two first air inlets are respectively connected to the two air ducts to send external air into the air duct through the air ducts. The outlets of the two air ducts connected to the two first air inlets face opposite directions and avoid each other.

5. The temperature control device according to any one of claims 1 to 3, characterized in that: Also includes: The humidification module has a water mist discharge part, the exhaust hole of the water mist discharge part is located in the air duct, and along the air outlet direction of the air duct, the exhaust hole of the water mist discharge part is closer to the air outlet than the evaporator.

6. The temperature control device according to any one of claims 1 to 3, characterized in that: Also includes: The heating module is located in the air duct and between the evaporator and the humidification module along the air outlet direction of the air duct.

7. A control method for a temperature control device, characterized in that: Used to control the temperature control device according to any one of claims 1 to 6, comprising: During the operation of the evaporator, obtain reference data affecting the frosting condition of the evaporator; Based on the reference data, one of the first damper and the second damper is controlled to be opened and the other is controlled to be closed.

8. A control device for a temperature control device, characterized in that: The control device is communicatively connected to the evaporator, the first damper, and the second damper respectively, and is configured to execute the control method for a temperature control device according to claim 7 .

9. An electrical device, characterized in that: include: Equipment body; The temperature control device according to claim 7, wherein the temperature control device is arranged on the device body.

10. The electrical equipment according to claim 9, characterized in that: Also includes: The control device for a temperature control device according to claim 8; The control device is arranged on the device body, and the control device is respectively communicated with the evaporator, the first damper and the second damper in the temperature control device. The control device is configured to execute the control method for the temperature control device according to claim 7.

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