Chip capacitor drying mechanism and temperature control method thereof

Abstract

The invention discloses a chip capacitor drying mechanism and a temperature control method thereof. The drying mechanism comprises a fan, a heating box, a first hot air box, a second hot air box, a recovery fan, a ventilation valve and a temperature sensor. A heating wire is arranged in the heating box, a drying area is reserved between the first hot air box and the second hot air box, and the drying area is used for containing a drying furnace rotating disc. The recovery fan is located at the top of the drying area; and the temperature sensor is arranged in the drying area. According to the scheme, the first air inlet valve, the second air inlet valve, the heating wire and the ventilation valve are all electrically connected to the temperature sensor, and therefore the temperature in the drying area can be adjusted by adjusting the air inlet amount of the first hot air box and the second hot air box, the heating amount of the heating wire and the fresh air amount of the ventilation valve, and automatic control over the temperature in the drying area is achieved. In addition, due to cooperative adjustment of the multiple parameters, adjustment of the temperature in the drying area can be more accurate.

Description

Technical Field

[0001] The present invention relates to the technical field of chip capacitor production equipment, and in particular to a chip capacitor drying mechanism and a temperature control method thereof. Background Art

[0002] With the rapid development of electronic technology, the types of electronic components are becoming increasingly diverse. As people's requirements for the quality of electronic products continue to increase, capacitors, as a basic and important electronic component, are also widely used in the production of electronic products. The production and processing technology of capacitors has also been continuously improved. As one of the key processes in capacitor production, the capping process plays a decisive role in the production efficiency, product performance, and quality of capacitors. The capping process usually requires a capping machine to complete it.

[0003] In the prior art, the end-capping process generally includes the following steps:

[0004] (1) Prepare a material carrier, a fixing sticker, and an uncapped chip capacitor, then stick the fixing sticker on any side of the material carrier, and manually spread the uncapped chip capacitor on the other side of the material carrier so that the chip capacitor is implanted in the material hole of the material carrier, and at the same time, any end of the chip capacitor is stuck to the fixing sticker;

[0005] (2) placing the material carrier plate of step (1) into the end-sealing machine for silver printing to achieve the end-sealing of the end of the chip capacitor that is not adhered to the fixed sticker;

[0006] (3) The carrier plate of step (2) is removed from the end-capping machine and dried, and another fixed sticker is pasted on the other side of the carrier plate so that it is pasted to the end of the chip capacitor that has completed the end-capping operation, and the fixed sticker pasted to the end of the chip capacitor that has not been capped is torn off, so that the end of the chip capacitor that has not been capped is exposed;

[0007] (4) The material carrier in step (3) is placed inside a sealing machine for silver printing to seal the ends of the chip capacitors that have not been sealed;

[0008] (5) The material carrier of step (4) is removed from the sealing machine and dried, and the fixing sticker is torn off to obtain a chip capacitor with both ends sealed.

[0009] In the prior art, the dryer used in the chip capacitor termination process is generally a Ferris wheel-type drying furnace, such as the automatic drying device in the Chinese invention patent "A fully automatic production system for silver-coating both ends of chip components" with publication number CN109731743A. Its core structure is a drying furnace turntable, which transports the loading tray through a circular rotation to achieve the drying of the chip capacitor ends. In the above-mentioned automatic drying device, it is generally operated according to pre-set drying parameters (such as the heating temperature of the heating wire, the air volume of the fan, etc.). However, due to factors such as heat accumulation and heat leakage of the equipment, the drying parameters of the drying area of the automatic drying device may fluctuate during the drying process, thereby affecting the drying effect of the product and being detrimental to improving the product yield. Summary of the Invention

[0010] The purpose of the present invention is to propose a drying mechanism for chip capacitors and a temperature control method thereof, which can adjust the temperature of the drying area in real time during the drying process and realize fully automatic temperature control according to the drying requirements, so as to overcome the shortcomings of the existing technology.

[0011] To achieve this object, the present invention adopts the following technical solutions:

[0012] A chip capacitor drying mechanism includes a fan, a heating box, a first hot air box, a second hot air box, a recovery fan, a ventilation valve, and a temperature sensor; a heating wire is provided inside the heating box, a drying area is left between the first hot air box and the second hot air box, and the drying area is used to accommodate a drying furnace turntable; the recovery fan is located at the top of the drying area; and the temperature sensor is disposed inside the drying area;

[0013] The inlet of the recovery fan faces the drying area, and the inlet of the fan is connected to the outlet of the recovery fan through a pipeline;

[0014] The outlet of the fan is connected to the inlet of the heating box through a pipe; the outlet of the heating box is connected to the inlet of the first hot air box and the inlet of the second hot air box through pipes respectively, the outlet of the first hot air box and the outlet of the second hot air box are both oriented towards the drying area, and the outlet of the first hot air box and the outlet of the second hot air box are arranged opposite to each other;

[0015] The inlet of the ventilation valve is connected to the atmosphere, and the inlet of the fan is also connected to the outlet of the ventilation valve through a pipeline;

[0016] The inlet of the first hot air box is provided with a first air inlet valve, and the inlet of the second hot air box is provided with a second air inlet valve. The first air inlet valve, the second air inlet valve, the heating wire and the ventilation valve are all electrically connected to the temperature sensor.

[0017] Preferably, the fan is electrically connected to the temperature sensor.

[0018] Preferably, it further comprises an exhaust valve, wherein the outlet of the exhaust valve is connected to the atmosphere;

[0019] The outlet of the heating box is also connected to the inlet of the exhaust valve through a pipeline.

[0020] Preferably, the drying area includes a plurality of sub-areas, and the sub-areas are arranged in sequence along the unloading direction of the loading tray;

[0021] There are multiple temperature sensors, and the number of the sub-areas is the same as the number of the temperature sensors, and one temperature sensor is installed inside one sub-area;

[0022] The fan, the heating box, the first hot air box, the second hot air box and the ventilation valve constitute a drying component. There are multiple drying components, and the number of drying components is the same as the number of temperature sensors.

[0023] The outlet of the first hot air box and the outlet of the second hot air box in a drying component are both directed toward one of the sub-areas.

[0024] A temperature control method, applied to the drying mechanism of the above-mentioned chip capacitor, comprises the following steps:

[0025] A. Turning on the drying mechanism, with the first air inlet valve, the second air inlet valve, and the ventilation valve opened at initial openings, the heating wire operating at initial heating parameters, and the fan operating at an initial speed;

[0026] B. obtaining the temperature of the drying area through the temperature sensor;

[0027] C. Determining whether the temperature of the drying area is within a preset temperature range;

[0028] If yes, go to step D; if no, go to step E;

[0029] D. The openings of the first air inlet valve, the second air inlet valve, and the ventilation valve remain at their initial openings, the heating wire operates at its initial heating parameters, and the fan operates at its initial speed;

[0030] E. Adjust the openings of the first air inlet valve, the second air inlet valve, and the ventilation valve, and simultaneously adjust the heating parameters of the heating wire and the speed of the fan until the temperature of the drying area is within a preset temperature range.

[0031] A temperature control method, applied to the drying mechanism of the above-mentioned chip capacitor, comprises the following steps:

[0032] A. Turning on the drying mechanism, and openings of the first air inlet valve, the second air inlet valve, and the ventilation valve corresponding to each sub-area are opened according to the initial openings, the heating wire corresponding to each sub-area operates according to the initial heating parameters, and the fan corresponding to each sub-area operates at the initial speed;

[0033] B. acquiring the temperatures corresponding to all the sub-areas respectively through the temperature sensors corresponding to the sub-areas;

[0034] C. Determining whether the temperatures of all the sub-areas are within a preset temperature range;

[0035] If the temperature of the sub-region is within the preset temperature range, execute step D;

[0036] If the temperature of the sub-region is not within the preset temperature range, execute step E;

[0037] D. The openings of the first air inlet valve, the second air inlet valve, and the ventilation valve corresponding to the sub-area remain at their initial openings, the heating wire corresponding to the sub-area operates at its initial heating parameters, and the fan corresponding to the sub-area operates at its initial speed;

[0038] E. Adjust the openings of the first air inlet valve, the second air inlet valve and the ventilation valve corresponding to the sub-area, and at the same time adjust the heating parameters of the heating wire corresponding to the sub-area and the speed of the fan corresponding to the sub-area until the temperature of the sub-area is within the preset temperature range.

[0039] The technical solution provided by the present invention can have the following beneficial effects:

[0040] In this solution, the first and second air inlet valves, heating coil, and ventilation valve are all electrically connected to a temperature sensor. Therefore, the temperature within the drying area can be adjusted by adjusting the air intake of the first and second hot air boxes, the heating value of the heating coil, and the fresh air volume of the ventilation valve, achieving automatic temperature control within the drying area. Furthermore, the coordinated adjustment of multiple parameters allows for more precise temperature regulation within the drying area. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 It is a structural schematic diagram of a drying mechanism for a chip capacitor of the present invention.

[0042] Among them, there are the fan 1, the heating box 2, the first hot air box 3, the first air inlet valve 31, the second hot air box 4, the second air inlet valve 41, the recovery fan 5, the ventilation valve 6, and the exhaust valve 7. DETAILED DESCRIPTION

[0043] The technical solution of the present invention is further illustrated below through specific implementation methods.

[0044] A chip capacitor drying mechanism includes a fan 1, a heating box 2, a first hot air box 3, a second hot air box 4, a recovery fan 5, a ventilation valve 6, and a temperature sensor; a heating wire is provided inside the heating box 2, a drying area is left between the first hot air box 3 and the second hot air box 4, and the drying area is used to accommodate a drying furnace turntable; the recovery fan 5 is located at the top of the drying area; and the temperature sensor is provided inside the drying area.

[0045] The inlet of the recovery fan 5 faces the drying area, and the inlet of the fan 1 is connected to the outlet of the recovery fan 5 through a pipe;

[0046] The outlet of the fan 1 is connected to the inlet of the heating box 2 via a pipe; the outlet of the heating box 2 is connected to the inlet of the first hot air box 3 and the inlet of the second hot air box 4 via pipes, respectively. The outlet of the first hot air box 3 and the outlet of the second hot air box 4 are both oriented toward the drying area, and the outlet of the first hot air box 3 and the outlet of the second hot air box 4 are arranged opposite to each other;

[0047] The inlet of the ventilation valve 6 is connected to the atmosphere, and the inlet of the fan 1 is also connected to the outlet of the ventilation valve 6 through a pipeline;

[0048] The inlet of the first hot air box 3 is provided with a first air inlet valve 31, and the inlet of the second hot air box 4 is provided with a second air inlet valve 41. The first air inlet valve 31, the second air inlet valve 41, the heating wire and the ventilation valve 5 are all electrically connected to the temperature sensor.

[0049] Since existing automatic drying devices generally operate according to pre-set drying parameters, factors such as heat accumulation and heat leakage of the equipment may cause fluctuations in the drying parameters of the drying area of the automatic drying device during the drying process, thereby affecting the drying effect of the product and being detrimental to improving the product yield.

[0050] Therefore, in order to ensure the sealing effect of the product, this technical solution proposes a drying mechanism for the chip capacitor, such as Figure 1 As shown, it includes a fan 1 for realizing the circulation of drying gas in the mechanism, a heating box 2 for realizing gas heating, a first hot air box 3, a second hot air box 4, a recovery fan 5 for recovering waste heat, a ventilation valve 6 for introducing fresh air and a temperature sensor for detecting the current temperature in the drying area (not shown in the figure).

[0051] Specifically, the drying process of this scheme includes the following steps: first, the carrier tray containing the chip capacitors to be dried is placed on the drying furnace turntable (not shown in the figure), and then the carrier tray is transported in the drying area through the drying furnace turntable; the fan 1 and the heating box 2 are turned on to allow the air in the drying mechanism to flow, and at the same time, the air entering the heating box 2 is heated by the heating wire (not shown in the figure), and the drying gas obtained after heating is transported to the first hot air box 3 and the second hot air box 4 respectively, and then output to the drying area in opposite directions to dry the chip capacitors to be dried in the drying area; finally, the exhausted drying gas can be recovered by the recovery fan 5 for waste heat recovery, and can also be used as heat leakage protection to further improve the service life of the drying mechanism.

[0052] It should be noted that, since the first air inlet valve 31, the second air inlet valve 41, the heating wire and the ventilation valve 5 in this solution are all electrically connected to the temperature sensor, the temperature in the drying area can be adjusted by adjusting the air intake of the first hot air box 3, the second hot air box 4, the heating value of the heating wire and the fresh air volume of the ventilation valve 5, thereby realizing automatic control of the temperature in the drying area.

[0053] It should be noted that the adjustment of the air intake volume of the first hot air box 3 and the second hot air box 4, the heating value of the heating wire and the fresh air volume of the ventilation valve 5 can be done by technicians making a table or calculating the mapping relationship based on experience, and then the temperature control system of the drying mechanism can look up the table or adjust it according to the mapping relationship between each parameter and the temperature. This is not limited here.

[0054] To further explain, the fan 1 is electrically connected to the temperature sensor.

[0055] In a preferred embodiment of the present technical solution, the fan 1 is also electrically connected to the temperature sensor, so that the temperature in the drying area can also be adjusted by adjusting the air supply volume of the fan 1, and the coordinated adjustment of multiple parameters can make the temperature adjustment in the drying area more precise.

[0056] Further, it further comprises an exhaust valve 7, the outlet of the exhaust valve 7 being connected to the atmosphere;

[0057] The outlet of the heating box 2 is also connected to the inlet of the exhaust valve 7 through a pipeline.

[0058] This solution also provides an exhaust valve 7 in the mechanism. When the drying mechanism is finished or needs to be shut down for maintenance, the remaining drying gas in the drying mechanism can be discharged through the exhaust valve 7 to avoid heat accumulation inside the drying mechanism, thereby causing structural damage and reducing the service life of the drying device.

[0059] Further explaining, the drying area includes a plurality of sub-areas, and the sub-areas are arranged in sequence along the unloading direction of the loading tray;

[0060] There are multiple temperature sensors, and the number of the sub-areas is the same as the number of the temperature sensors, and one temperature sensor is installed inside one sub-area;

[0061] The fan 1, the heating box 2, the first hot air box 3, the second hot air box 4 and the ventilation valve 6 constitute a drying component. There are multiple groups of drying components, and the number of drying components is the same as the number of temperature sensors.

[0062] The outlet of the first hot air box 3 and the outlet of the second hot air box 4 in a drying component are both directed toward one of the sub-areas.

[0063] As a more optimized solution of this technology, the drying area is divided into multiple sub-areas (i.e., multiple controllable temperature zones) along the unloading direction of the loading tray. The temperature of each sub-area can be adjusted by adjusting the air intake of the first and second hot air boxes 3 and 4, the heating value of the heating wire, the fresh air volume of the ventilation valve 5, and the air supply volume of the fan 1. By independently regulating the temperature of multiple sub-areas, fully automatic temperature control can be achieved according to drying requirements (such as temperature curves corresponding to different products), thereby improving the intelligent level of the drying mechanism.

[0064] A temperature control method, applied to the drying mechanism of the above-mentioned chip capacitor, comprises the following steps:

[0065] A. Turn on the drying mechanism, and open the first air inlet valve 31, the second air inlet valve 41, and the ventilation valve 5 according to the initial openings, operate the heating wire according to the initial heating parameters, and operate the fan 1 according to the initial speed;

[0066] B. obtaining the temperature of the drying area through the temperature sensor;

[0067] C. Determining whether the temperature of the drying area is within a preset temperature range;

[0068] If yes, go to step D; if no, go to step E;

[0069] D. The openings of the first air inlet valve 31, the second air inlet valve 41, and the ventilation valve 5 remain at their initial openings, the heating wire operates at its initial heating parameters, and the fan 1 operates at its initial speed;

[0070] E. Adjust the openings of the first air inlet valve 31, the second air inlet valve 41 and the ventilation valve 5, and at the same time adjust the heating parameters of the heating wire and the speed of the fan 1 until the temperature of the drying area is within the preset temperature range.

[0071] A temperature control method, applied to the drying mechanism of the above-mentioned chip capacitor, comprises the following steps:

[0072] A. Turn on the drying mechanism, and the openings of the first air inlet valve 31, the second air inlet valve 41, and the ventilation valve 5 corresponding to each sub-area are opened according to the initial openings, the heating wire corresponding to each sub-area operates according to the initial heating parameters, and the fan 1 corresponding to each sub-area operates at the initial speed;

[0073] B. acquiring the temperatures corresponding to all the sub-areas respectively through the temperature sensors corresponding to the sub-areas;

[0074] C. Determining whether the temperatures of all the sub-areas are within a preset temperature range;

[0075] If the temperature of the sub-region is within the preset temperature range, execute step D;

[0076] If the temperature of the sub-region is not within the preset temperature range, execute step E;

[0077] D. The openings of the first air inlet valve 31, the second air inlet valve 41, and the ventilation valve 5 corresponding to the sub-area remain at their initial openings, the heating wire corresponding to the sub-area maintains initial heating parameters, and the fan 1 corresponding to the sub-area maintains initial speed;

[0078] E. Adjust the opening of the first air inlet valve 31, the second air inlet valve 41 and the ventilation valve 5 corresponding to the sub-area, and at the same time adjust the heating parameters of the heating wire corresponding to the sub-area and the speed of the fan 1 corresponding to the sub-area until the temperature of the sub-area is within the preset temperature range.

[0079] This technical solution also proposes a temperature control method for the drying mechanism of the above-mentioned chip capacitor, which can adjust the temperature of the drying area (or each sub-area in the drying area) in real time during the drying process, and realize fully automatic temperature control according to the drying requirements to overcome the shortcomings of the existing technology.

[0080] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will readily conceive of other specific embodiments of the present invention without inventive effort, and such embodiments will fall within the scope of protection of the present invention.

Claims

1. A drying mechanism for chip capacitors, characterized in that: The device comprises a fan, a heating box, a first hot air box, a second hot air box, a recovery fan, a ventilation valve and a temperature sensor; a heating wire is provided inside the heating box, a drying area is left between the first hot air box and the second hot air box, and the drying area is used to accommodate a drying furnace turntable; the recovery fan is located at the top of the drying area; the temperature sensor is provided inside the drying area; The inlet of the recovery fan faces the drying area, and the inlet of the fan is connected to the outlet of the recovery fan through a pipeline; The outlet of the fan is connected to the inlet of the heating box through a pipe; the outlet of the heating box is connected to the inlet of the first hot air box and the inlet of the second hot air box through pipes respectively, the outlet of the first hot air box and the outlet of the second hot air box are both oriented towards the drying area, and the outlet of the first hot air box and the outlet of the second hot air box are arranged opposite to each other; The inlet of the ventilation valve is connected to the atmosphere, and the inlet of the fan is also connected to the outlet of the ventilation valve through a pipeline; The inlet of the first hot air box is provided with a first air inlet valve, and the inlet of the second hot air box is provided with a second air inlet valve. The first air inlet valve, the second air inlet valve, the heating wire and the ventilation valve are all electrically connected to the temperature sensor.

2. A chip capacitor drying mechanism according to claim 1, characterized in that: The fan is electrically connected to the temperature sensor.

3. The drying mechanism for chip capacitors according to claim 1, characterized in that: Also includes an exhaust valve, the outlet of the exhaust valve is connected to the atmosphere; The outlet of the heating box is also connected to the inlet of the exhaust valve through a pipeline.

4. The drying mechanism for chip capacitors according to claim 2, characterized in that: The drying area includes a plurality of sub-areas, and the sub-areas are arranged in sequence along the unloading direction of the loading tray; There are multiple temperature sensors, and the number of the sub-areas is the same as the number of the temperature sensors, and one temperature sensor is installed inside one sub-area; The fan, the heating box, the first hot air box, the second hot air box and the ventilation valve constitute a drying component. There are multiple drying components, and the number of drying components is the same as the number of temperature sensors. The outlet of the first hot air box and the outlet of the second hot air box in a drying component are both directed toward one of the sub-areas.

5. A temperature control method, characterized in that: The drying mechanism for the chip capacitor according to claim 2 comprises the following steps: A. Turning on the drying mechanism, with the first air inlet valve, the second air inlet valve, and the ventilation valve opened at initial openings, the heating wire operating at initial heating parameters, and the fan operating at an initial speed; B. obtaining the temperature of the drying area through the temperature sensor; C. Determining whether the temperature of the drying area is within a preset temperature range; If yes, go to step D; if no, go to step E; D. The openings of the first air inlet valve, the second air inlet valve, and the ventilation valve remain at their initial openings, the heating wire operates at its initial heating parameters, and the fan operates at its initial speed; E. Adjust the openings of the first air inlet valve, the second air inlet valve, and the ventilation valve, and simultaneously adjust the heating parameters of the heating wire and the speed of the fan until the temperature of the drying area is within a preset temperature range.

6. A temperature control method, characterized in that: The drying mechanism for the chip capacitor according to claim 4 comprises the following steps: A. Turning on the drying mechanism, and openings of the first air inlet valve, the second air inlet valve, and the ventilation valve corresponding to each sub-area are opened according to the initial openings, the heating wire corresponding to each sub-area operates according to the initial heating parameters, and the fan corresponding to each sub-area operates at the initial speed; B. acquiring the temperatures corresponding to all the sub-areas respectively through the temperature sensors corresponding to the sub-areas; C. Determining whether the temperatures of all the sub-areas are within a preset temperature range; If the temperature of the sub-region is within the preset temperature range, execute step D; If the temperature of the sub-region is not within the preset temperature range, execute step E; D. The openings of the first air inlet valve, the second air inlet valve, and the ventilation valve corresponding to the sub-area remain at their initial openings, the heating wire corresponding to the sub-area operates at its initial heating parameters, and the fan corresponding to the sub-area operates at its initial speed; E. Adjust the openings of the first air inlet valve, the second air inlet valve and the ventilation valve corresponding to the sub-area, and at the same time adjust the heating parameters of the heating wire corresponding to the sub-area and the speed of the fan corresponding to the sub-area until the temperature of the sub-area is within the preset temperature range.

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