A detection device and system for detecting flatness of an electrode plate

Abstract

The application discloses a kind of detection device and system of detecting electrode plate flatness, to solve the problems of low efficiency, low accuracy, high requirements for device use conditions existing in traditional detection process.The detection device of the application is abutted between the upper plate and the lower plate of the electrode plate to be detected;The detection device includes a housing, a linear displacement sensor assembly, a coil assembly and a connecting assembly;The housing includes an upper cover and a base for forming a closed space, the upper cover is connected to the top of the linear displacement sensor assembly, the base is connected to the linear displacement sensor assembly through the connecting assembly, and the coil assembly is connected to the bottom of the linear displacement sensor assembly.By integrated design and closed design, it can prevent external moisture and corrosive gas from entering, protect internal electronic components, prolong the service life of the device, improve detection accuracy, simplify the operation process of detection, and improve the compatibility and detection efficiency of the detection device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor device detection, in particular to a detection device and system for detecting flatness of an electrode plate. BACKGROUND

[0002] In the field of semiconductor manufacturing, the detection of flatness between electrode plates is a core link to ensure device performance and yield, and the flatness of electrode plates (such as photomask plates, CMP polishing heads, and RF electrodes) directly affects the accuracy of nanoscale pattern transfer. For example, in the photolithography process, micron-level deviation between the mask plate and the wafer gap will cause overlay error to expand, causing circuit short circuit or open circuit. In the chemical mechanical polishing process, the unevenness of the electrode plate will exacerbate the non-uniformity of the wafer surface film thickness, reducing the yield of subsequent film deposition and photolithography.

[0003] The traditional method relies on the operator to use a contact tool (such as a vernier caliper) to measure the thickness of the electrode plate at multiple points, and calculate the difference between the maximum value and the minimum value as the flatness index. There are low detection efficiency and precision, and it is impossible to realize dynamic detection of electrode plate deformation in high-temperature or vacuum environment.

[0004] There are also devices that detect object displacement by using the eddy current effect, but there are problems such as large device volume, difficulty in adapting to narrow space detection, device in an open test space affecting the detection result, and inability to measure non-conductive material structures, with limited use conditions. SUMMARY

[0005] (I) Invention purpose

[0006] The purpose of the present application is to provide a detection device and system for detecting flatness of an electrode plate, aiming to solve the problems of low efficiency and precision in the traditional detection process, and high requirements for device use conditions.

[0007] (II) Technical solutions

[0008] To solve the above problems, the present application provides a detection device for detecting flatness of an electrode plate, which abuts between the upper and lower electrode plates of the electrode plate to be detected.

[0009] The detection device comprises a housing, a linear displacement sensor assembly, a coil assembly, and a connecting assembly.

[0010] The housing comprises an upper cover and a base for forming a closed space, the upper cover is connected to the top of the linear displacement sensor assembly, the base is connected to the linear displacement sensor assembly through the connecting assembly, and the coil assembly is connected to the bottom of the linear displacement sensor assembly.

[0011] The linear displacement sensor assembly generates an excitation signal, the coil assembly generates an alternating magnetic field, the base generates an induced eddy current in the alternating magnetic field, the induced eddy current generates a counter magnetic field opposite to the direction of the alternating magnetic field, when the distance between the upper cover and the base changes, the linear displacement sensor assembly slides on the base through the connecting assembly, and the linear displacement sensor assembly detects a voltage signal generated by the impedance change of the coil assembly and converts it into linear displacement change data.

[0012] Preferably, the linear displacement sensor assembly comprises an eddy current plate and a sensor shell, the eddy current plate is fixedly connected with the sensor shell, the upper cover is located at the top of the eddy current plate and is fixedly connected with the sensor shell, the sensor shell is connected with the base through the connecting assembly, and the eddy current plate drives the coil assembly to generate an alternating magnetic field and processes a voltage signal of the coil assembly.

[0013] Preferably, the eddy current plate comprises a power module, a control module, an excitation and detection module, an analog-to-digital conversion module and a communication module.

[0014] The power module is connected with the control module and is used to provide power for the eddy current plate.

[0015] The control module controls the operation of each module and processes signals.

[0016] The excitation and detection module is connected with the control module and is used to drive the coil assembly to generate an alternating magnetic field, receive a voltage signal of the coil assembly and transmit the voltage signal to the control module.

[0017] The analog-to-digital conversion module is connected with the control module and is used to convert the voltage signal into a digital signal.

[0018] The communication module is connected with the control module and is used to transmit data of the control module to an upper computer.

[0019] Preferably, the coil assembly comprises a first mounting plate and a coil, the first mounting plate is fixedly connected with the bottom of the sensor shell, and the coil is connected with the first mounting plate.

[0020] Preferably, the coil assembly further comprises a second mounting plate, the first mounting plate is connected with the second mounting plate, and a mounting groove is formed between the first mounting plate and the second mounting plate, and the coil is arranged in the mounting groove.

[0021] Preferably, the connecting assembly comprises a spring, a top end of the spring is connected with the sensor shell, and a bottom end of the spring is connected with the base.

[0022] Preferably, the connecting assembly further comprises a sliding block, the sliding block is sleeved on the outside of the sensor shell and connected with the sensor shell, and the outer wall of the sliding block is in sliding connection with the inner side wall of the base.

[0023] Preferably, vertical through grooves are formed in the side surfaces of the base, limiting portions are formed in the side surfaces of the sensor shell, and mounting holes are formed in the side surfaces of the sliding block, and the limiting portions are in sliding connection with the through grooves through the mounting holes.

[0024] Preferably, the detection device further comprises an adapter plate, the adapter plate is connected with the linear displacement sensor assembly, and a reference coil is fixed on the adapter plate, the reference coil being used for monitoring environmental interference signals.

[0025] In another aspect, the application provides a system for detecting the flatness of an electrode plate, the system comprising an electrode plate structure, the electrode plate structure comprising an upper electrode plate and a lower electrode plate, a plurality of detection devices being arranged at different positions between the upper electrode plate and the lower electrode plate, and the plurality of detection devices being configured to transmit data of the current position to a host computer through a communication module of the linear displacement sensor assembly.

[0026] (Three) beneficial effects

[0027] The above technical scheme of the application has the following beneficial technical effects:

[0028] 1. By arranging the integrated detection device between the upper electrode plate and the lower electrode plate, the compact volume design enables the detection device to adapt to the detection of narrow spaces, and by respectively parallelly attaching the upper cover and the base to the surfaces of the upper electrode plate and the lower electrode plate, the uniform stress on the upper and lower contact surfaces during the detection process is achieved, effectively preventing the electrode plate from being indented or damaged during the detection process.

[0029] 2. The linear displacement sensor assembly is arranged in the closed space formed by the upper cover and the base, avoiding the detachment of metal debris or dust caused by component friction and vibration during the detection process, meeting the requirement of "no additional particulate matter" in semiconductor manufacturing, preventing the intrusion of external moisture and corrosive gas, protecting the internal electronic components, prolonging the service life of the device, and improving the detection accuracy.

[0030] 3. In the semiconductor scenario, the same device may be compatible with mixed detection requirements of metal (such as copper interconnection electrodes) and non-metal (such as silicon dioxide insulating electrode plates), and by using the standardized detection device and the general eddy current algorithm, the detection object can be seamlessly switched without the need to replace hardware or recalibrate, simplifying the operation process of detection and improving the compatibility and detection efficiency of the detection device. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is an explosion schematic diagram of the detection device in the device provided by the application.

[0032] Figure 2 is a whole schematic diagram of a detection device according to the present application;

[0033] Figure 3 is a structural block diagram of an eddy current plate according to the present application;

[0034] Figure 4 is a structural schematic diagram of a sensor housing according to the present application;

[0035] Figure 5 is a structural schematic diagram of a first mounting plate and a second mounting plate according to the present application;

[0036] Figure 6 is a structural schematic diagram of a slider according to the present application;

[0037] Figure 7 is a structural schematic diagram of a base according to the present application.

[0038] Reference numerals:

[0039] 1, housing; 11, upper cover; 12, base; 12a, through slot;

[0040] 2, linear displacement sensor assembly; 21, eddy current plate; 22, sensor housing; 221, limiting portion;

[0041] 3, coil assembly; 31, first mounting plate; 31a, mounting slot; 32, coil; 33, second mounting plate;

[0042] 4, connecting assembly; 41, spring; 42, slider; 42a, mounting hole;

[0043] 5, adapter plate. DETAILED DESCRIPTION

[0044] In order to make the objectives, technical solutions and advantages of the present application clearer, further detailed description will be made to the present application with reference to the specific embodiments and the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present application. In addition, in the following description, the description of the well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present application.

[0045] The layer structure diagrams according to the embodiments of the present application are shown in the drawings. The drawings are not drawn to scale, in which some details are enlarged for the purpose of clarity, and some details can be omitted. The shapes of various regions, layers shown in the drawings, and their relative sizes, positional relationships can deviate in practice due to manufacturing tolerances or technical limitations, and regions / layers with different shapes, sizes, relative positions can be additionally designed by those skilled in the art according to actual needs.

[0046] Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present application.

[0047] In the description of the present application, it should be noted that the terms "first" and "second" are only for the purpose of description, and cannot be understood or implied as indicating or implying relative importance.

[0048] In combination Figure 1 and Figure 2 , one aspect of the present application provides a detection device for detecting flatness of an electrode plate, the detection device abutting between an upper electrode plate and a lower electrode plate of the electrode plate to be detected; the detection device comprises a shell 1, a linear displacement sensor assembly 2, a coil assembly 3 and a connecting assembly 4; the shell 1 comprises an upper cover 11 and a base 12 for forming a closed space, the upper cover 11 is connected with the top of the linear displacement sensor assembly 2, the base 12 is connected with the linear displacement sensor assembly 2 through the connecting assembly 4, and the coil assembly 3 is connected with the bottom of the linear displacement sensor assembly 2; the linear displacement sensor assembly 2 generates an excitation signal, the coil assembly 3 generates an alternating magnetic field, the base 12 generates an induced eddy current in the alternating magnetic field, the induced eddy current generates a counter magnetic field opposite to the direction of the alternating magnetic field, when the distance between the upper cover 11 and the base 12 changes, the linear displacement sensor assembly 2 slides on the base 12 through the connecting assembly 4, the linear displacement sensor assembly 2 detects a voltage signal generated by the impedance change of the coil assembly 3 and converts it into linear displacement change data.

[0049] Specifically, the upper cover 11 abuts against the upper pole plate, and the base 12 abuts against the lower pole plate, which can form a sealed space through the structure itself or set a sealing element to form a closed space, so as to prevent external particles from entering the detection environment and seal the linear displacement sensor assembly 2, the coil assembly 3, etc. inside. The upper cover 11 serves as the top support of the linear displacement sensor assembly 2, and the base 12 is elastically connected to the linear displacement sensor assembly 2 through the connecting assembly 4. When the distance between the upper and lower pole plates changes, the base 12 moves with the lower pole plate, and drives the connecting assembly 4 to make the linear displacement sensor assembly 2 slide vertically to the upper and lower pole plates. The linear displacement sensor assembly 2 generates an excitation signal to drive the coil assembly 3 to generate an alternating magnetic field. When the base 12 moves up and down due to the change of the distance between the pole plates, the distance between the coil assembly 3 and the base 12 changes, resulting in the change of the impedance of the coil 32. The linear displacement sensor assembly 2 converts the voltage signal of the coil 32 into linear displacement data through detection, analog-to-digital conversion and signal processing. The coil assembly 3 generates an alternating magnetic field under the action of the excitation signal, and the base 12 generates an induced eddy current in the magnetic field as a target conductor. The counter-magnetic field generated by the eddy current interacts with the magnetic field of the coil 32, changing the impedance of the coil 32. The connecting assembly 4 connects the linear displacement sensor assembly 2 and the base 12, and provides elastic support, so that the linear displacement sensor assembly 2 can move with the upper pole plate.

[0050] It should be noted that the specific way of forming a closed space by the shell is not limited here. The linear displacement sensor assembly 2 and the base 12 are movably connected through the connecting assembly 4. A sealing structure such as a sealing ring can be provided on the movable part to achieve sealing effect without affecting movement. Or the movable part is arranged in a sealing sleeve, which can achieve sealing effect and keep the shell in a closed state. The specific material of the base 12 is not limited here, which can generate an induced eddy current and a counter-magnetic field under the alternating magnetic field of the coil assembly 3, such as aluminum, copper and other materials. The specific shape of the detection device is not limited, which is preferably designed as an integral and flat cylindrical shape, which can effectively avoid damage to the electrode plate during detection.

[0051] By such a setting, by setting an integrated detection device between the upper and lower pole plates, the volume design is compact, so that the detection device can adapt to the detection of narrow space, and at the same time, the upper cover 11 and the base 12 are respectively attached to the surface of the upper and lower pole plates, so that the upper and lower contact surfaces are uniformly stressed during the detection process, effectively preventing the electrode plate from being indented or damaged during the detection process, and the overall structure reduces the connection nodes between the components, which can suppress the resonance phenomenon in the vibration environment of the equipment operation (such as the mechanical scanning process of the semiconductor equipment), and ensure the stability of the detection signal. The shell 1 forms a closed space to avoid the generation of particulate matter or the entry of external pollutants during the detection process, and meets the requirements of clean environment for semiconductor manufacturing, and solves the problem of particulate pollution caused by non-closed. The distance between the eddy current effect detection coil 32 and the base 12 changes without contacting the surface of the electrode plate, avoiding the indentation or damage to the pole plate caused by traditional contact measurement (such as vernier caliper), and at the same time, the electrode plate deformation in harsh environments such as vacuum and high temperature can be monitored in real time. The line displacement sensor assembly 2 is designed to slide on the base 12, so that the device can sensitively respond to the vertical displacement change of the electrode plate in micrometer or even nanometer level, and the displacement data is accurately captured through the impedance change of the coil 32, improving the detection accuracy. In the semiconductor scene, the same equipment may be compatible with mixed detection requirements of metal (such as copper interconnection electrode) and non-metal (such as silicon dioxide insulating pole plate), and through standardized detection device and general eddy current algorithm, without changing hardware or recalibration, the detection object can be seamlessly switched, the operation process of detection is simplified, and the compatibility and detection efficiency of the detection device are improved.

[0052] In a preferred case, the line displacement sensor assembly 2 includes an eddy current plate 21 and a sensor shell 22, the eddy current plate 21 is fixedly connected with the sensor shell 22, the upper cover 11 is located at the top of the eddy current plate 21 and is fixedly connected with the sensor shell 22, the sensor shell 22 is connected with the base 12 through the connecting assembly 4, and the eddy current plate 21 drives the coil assembly 3 to generate an alternating magnetic field and processes the voltage signal of the coil assembly 3.

[0053] By such a setting, the eddy current plate 21 is fixedly connected with the sensor shell 22, and the upper cover 11 is directly connected with the top of the shell, which cancels the wire design between the probe and the controller in the traditional split structure, greatly reduces the volume of the device, and enables it to extend into the narrow space between the electrode plates for detection, solving the problem of large volume in the prior art that cannot detect narrow space. At the same time, the sensor shell 22 serves as a support main body, and each component is fixed by screws to ensure that the eddy current plate 21, the coil assembly 3 and the like are stable in position during the detection process, avoid signal fluctuation caused by vibration or movement, and improve detection reliability.

[0054] Here, the specific connection mode of the current plate, the coil assembly 3 and the upper cover 11 with the sensor shell 22 is not limited, such as Figure 4As shown, in one optional case, an installation space of the eddy current plate 21 is formed in the sensor housing 22, the eddy current plate 21 is fixed in the installation space by setting screw holes on the sensor housing 22 and fixing the eddy current plate 21 in the installation space by screws, and then the upper cover 11 is fixed on the top of the sensor housing 22 and the coil assembly 3 is fixed on the bottom of the sensor housing 22 by screws.

[0055] In combination Figure 3 In a preferred case, the eddy current plate 21 includes a power module, a control module, an excitation and detection module, an analog-to-digital conversion module, and a communication module; the power module is connected with the control module and is used to provide power for the eddy current plate 21; the control module controls the operation of each module and performs signal processing; the excitation and detection module is connected with the control module and is used to drive the coil assembly 3 to generate an alternating magnetic field, receive a voltage signal of the coil assembly 3, and transmit the voltage signal to the control module; the analog-to-digital conversion module is connected with the control module and is used to convert the voltage signal into a digital signal; and the communication module is connected with the control module and is used to transmit data of the control module to an upper computer.

[0056] Specifically, the power module includes a power management system, which provides stable power for the eddy current plate 21 and the entire device, and ensures the normal operation of excitation circuits, detection circuits, etc. For example, the voltage is adjusted by a power management chip to meet the power supply needs of different modules. The control module serves as a core processing unit, receives the voltage signal transmitted by the excitation and detection module, performs pre-processing such as amplification and filtering, converts the analog signal into a digital signal through the analog-to-digital conversion module, finally converts the digital signal into linear displacement data through an algorithm, and controls the communication module to transmit data. The excitation and detection module includes an oscillation circuit, which generates a high-frequency excitation signal to drive the coil 32 to generate an alternating magnetic field; at the same time, the voltage signal generated by the coil 32 due to impedance changes is collected by the detection module and transmitted to the control module for processing. For example, when the distance between the coil 32 and the base 12 changes, the voltage signal changes accordingly, and the excitation and detection module captures the changes in real time and transmits them to the control module. The analog-to-digital conversion module converts the analog voltage signal into a digital signal (such as an AD value), which facilitates digital signal processing and algorithm calculation by the control module, and improves signal processing accuracy and anti-interference ability. The communication module uses RS485 and other communication protocols to transmit the displacement data processed by the control module to the upper computer, realizing data aggregation and real-time display of multiple devices. For example, when multiple detection devices work simultaneously, the communication module ensures that the data of each device is accurately transmitted to the upper computer, facilitating unified analysis of the flatness of the electrode plate.

[0057] Through such a setting, each functional module has clear division of labor, the power module ensures stable power supply, the control module concentrates signal processing, the excitation and detection module focuses on magnetic field generation and signal acquisition, the analog-digital conversion module improves signal accuracy, and the communication module ensures reliable data transmission. The overall system stability and anti-interference ability are significantly enhanced. Through the algorithm processing of the analog-digital conversion and control modules, the small changes in the coil 32 voltage (corresponding to the small displacement between the electrode plates) can be accurately converted into digital quantities, achieving nanoscale detection accuracy and meeting the detection requirements of the flatness of the semiconductor electrode plate.

[0058] In a preferred case, the eddy current plate 21 further includes an expansion interface, which provides a peripheral interface for the eddy current plate 21 for debugging and maintenance, and can also connect a standard displacement calibration instrument through the expansion interface to update the voltage-displacement mapping table. For example, when the wire displacement sensor assembly 2 is applied to a shell made of different materials, the voltage-displacement mapping table needs to be adjusted according to different materials to ensure the accuracy of the detection results.

[0059] In combination Figures 1 to 5 In a preferred case, the coil assembly 3 includes a first mounting plate 31 and a coil 32, and the first mounting plate 31 is fixedly connected to the bottom of the sensor shell 22, and the coil 32 is connected to the first mounting plate 31.

[0060] Specifically, the first mounting plate 31 is fixed to the bottom of the sensor shell 22 as a direct mounting carrier for the coil 32. The coil 32 is fixed on the first mounting plate 31 to ensure the stability of the position of the coil 32 and avoid displacement of the coil 32 due to vibration or movement, which affects the magnetic field distribution and detection accuracy. The coil 32 is arranged on the first mounting plate 31 and located on the side close to the base 12, and generates an alternating magnetic field under the action of an excitation signal. The inductance of the coil 32 is strictly designed according to the range, and is adaptively designed according to the actual needs of the detection device. For example, a coil 32 with fewer turns is used for a larger range, and a coil 32 with more turns is used for a smaller range, to ensure that the magnetic field strength and detection sensitivity match the actual needs.

[0061] Through such a setting, the first mounting plate 31 is fixedly connected to the sensor shell 22, and the coil 32 is fixed on the first mounting plate 31 to form a rigid support structure, preventing displacement or deformation of the coil 32 during detection, ensuring stable magnetic field distribution and improving detection accuracy. By adjusting the number of turns, wire diameter, etc. of the coil 32 on the first mounting plate 31, different detection ranges can be flexibly adapted, such as using a high-sensitivity coil 32 design for detecting micrometer-level displacement and a wide-range coil 32 design for detecting larger displacement, expanding the application range of the device.

[0062] It should be noted that the specific connection method between the coil 32 and the first mounting plate 31 is not limited here, and the coil 32 is sandwiched in the middle by AB glue or clamping, or by two upper and lower mounting plates. In a preferred case, the coil assembly 3 also includes a second mounting plate 33, the first mounting plate 31 is connected to the second mounting plate 33, and a mounting groove 31a is formed between the first mounting plate 31 and the second mounting plate 33, and the coil 32 is arranged in the mounting groove 31a. Specifically, the second mounting plate 33 is connected to the first mounting plate 31 (such as by screws or glue), and a mounting groove 31a is formed between the two, and the coil 32 is embedded in the mounting groove 31a. The first mounting plate 31 and the second mounting plate 33 sandwich the coil 32 in the middle, forming a physical protective layer to isolate external pollutants such as dust and water vapor, while reducing the impact of external electromagnetic interference on the magnetic field of the coil 32.

[0063] This arrangement completely encloses the coil 32, preventing external particulate contaminants from contacting it. This reduces the impact of environmental interference on the coil 32's magnetic field, ensuring the purity of the detection signal and improving measurement accuracy. For example, in the complex electromagnetic environment of a semiconductor manufacturing plant, this structure effectively suppresses external interference, resulting in more reliable detection results. The mounting plates are removable (e.g., screw connections). If the coil 32 ages or becomes damaged due to long-term use, the first and second mounting plates 31, 33 can be quickly removed and replaced with a new coil 32 without disassembling the entire device, reducing maintenance costs and time.

[0064] It should be noted that the specific structure of the first mounting plate 31 and the second mounting plate 33 is not limited here. The mounting groove 31a can be set on the first mounting plate 31, and the two sides of the second mounting plate 33 are flat, similar to the structure of the cover plate, and the coil 32 is fixed in the mounting groove 31a of the first mounting plate 31; or the first mounting plate 31 and the second mounting plate 33 are set into a symmetrical structure, and the two together form the mounting groove 31a, which is conducive to improving the versatility of the first mounting plate 31 and the second mounting plate 33.

[0065] In a preferred case, the connecting assembly 4 includes a spring 41, the top end of the spring 41 is connected to the sensor housing 22, and the bottom end of the spring 41 is connected to the base 12. Specifically, the top end of the spring 41 is connected to the sensor housing 22, such as by a threaded pin or a clamp, and the bottom end is connected to the base 12, forming an elastic connection. When the distance between the upper and lower plates changes, the spring 41 is compressed or rebounds, driving the linear displacement sensor assembly 2 to move vertically relative to the base 12, thereby changing the distance between the coil 32 and the base 12. The elastic coefficient of the spring 41 is designed according to the plate material and the detection accuracy requirements. For example, a high elastic coefficient spring 41 is used for a rigid plate to ensure that a small displacement can cause a significant deformation of the spring 41 and a change in the impedance of the coil 32; a low elastic coefficient spring 41 is used for an easily deformable plate to avoid damage to the plate.

[0066] By such an arrangement, the pressure of the base 12 in contact with the lower pole plate is controlled at a very low level (much smaller than the surface tolerance threshold of the pole plate) by precisely designing the strength of the spring 41, avoiding the traditional contact measurement tools (such as vernier caliper) to cause indentation or scratch on the surface of the pole plate, protecting the surface topography of the pole plate, especially suitable for the detection of semiconductor electrode plates with nanoscale precision. The elastic deformation characteristics of the spring 41 enable the device to quickly respond to micrometer-level displacement changes between the pole plates. For example, when the flatness of the pole plate changes by 0.5 μm, the deformation of the spring 41 causes the distance between the coil 32 and the base 12 to change, and the impedance change of the coil 32 can be detected by the eddy current plate 21 and converted into displacement data, realizing high-precision real-time monitoring.

[0067] In combination Figures 1 to 7 In a preferred case, the connecting assembly 4 further comprises a sliding block 42, which is sleeved on the outside of the sensor housing 22 and connected with the sensor housing 22, and the outer wall of the sliding block 42 is in sliding connection with the inner side wall of the base 12. Specifically, the sliding block 42 is sleeved on the outside of the sensor housing 22, the inner wall of which is connected with the sensor housing 22, and the outer wall is in sliding connection with the inner side wall of the base 12. When the base 12 moves with the lower pole plate, the sliding block 42 and the sensor housing 22 slide vertically along the inner wall of the base 12.

[0068] By such an arrangement, the sliding block 42 is connected with the sensor housing 22, limiting the horizontal movement of the linear displacement sensor assembly 2, avoiding false changes in the distance between the coil 32 and the base 12 caused by horizontal shaking, and ensuring that the detected displacement data only reflects the vertical flatness difference between the upper and lower pole plates, thereby improving the measurement accuracy. For example, in a pole plate vibration environment, the sliding block 42 structure can effectively suppress horizontal vibration interference, making the detection result true and reliable. The sliding block 42 is sleeved on the outside of the sensor housing 22, without the need for additional guide rails or complex guide components, thus having a simple and compact structure, reducing the size of the device, facilitating installation in a narrow space between electrode plates, and reducing the cost of mechanical processing.

[0069] It should be noted that the specific connection method of the sliding block 42 and the sensor housing 22 is not limited herein, which can be clamping, screwing or welding, and the specific sliding method of the sliding block 42 and the sensor housing 22 along the inner wall of the base 12 can be to provide a matching sliding rail assembly on the inner side wall of the base 12 and the outer side wall of the sliding block 42, so that the sliding block 42 and the sensor housing 22 can slide in the vertical direction along the side wall of the base 12. In a preferred case, the side of the base 12 is formed with a vertical through slot 12a, the side of the sensor housing 22 is formed with a limiting portion 221, and the side of the sliding block 42 is formed with a mounting hole 42a, and the limiting portion 221 passes through the mounting hole 42a and is in sliding connection with the through slot 12a.

[0070] Specifically, a vertical through slot 12a is formed on the side of the base 12, which cooperates with the limiting part 221 (such as a protrusion or a pin) on the side of the sensor shell 22. The limiting part 221 passes through the mounting hole 42a of the sliding block 42 and is inserted into the through slot 12a. When the sliding block 42 moves vertically with the base 12, the limiting part 221 slides up and down in the through slot 12a, thereby playing a guiding and limiting role. The width of the through slot 12a is slightly larger than the width of the limiting part 221, allowing vertical sliding but limiting horizontal movement.

[0071] Through such an arrangement, the cooperation between the through slot 12a and the limiting part 221 further strengthens the vertical guiding function, preventing the sliding block 42 from tilting or deviating during sliding, ensuring that the linear displacement sensor assembly 2 and the base 12 are always vertically aligned, and avoiding detection deviation caused by installation errors or external forces. For example, in multi-device collaborative detection, the vertical guiding consistency of each device can improve the comparability and accuracy of overall detection data. The structural design of the through slot 12a and the limiting part 221 makes the device assembly process simpler, as the limiting part 221 only needs to be aligned with the through slot 12a and inserted to achieve sliding connection, without the need for complex calibration or adjustment steps, thereby improving production efficiency and assembly accuracy.

[0072] It should be noted that the number and distribution of the mounting hole 42a, the limiting part 221 and the through slot 12a are not limited here, and in combination with Figure 4 、 Figure 6 and Figure 7 , in optional cases, the mounting hole 42a, the limiting part 221 and the through slot 12a are arranged one by one and uniformly arranged in the circumferential direction on the inner side of the base 12.

[0073] In the preferred case, the detection device further comprises an adapter plate 5, which is connected with the eddy current plate 21, and the adapter plate 5 is fixedly connected with the sensor shell 22, and a reference coil is fixed on the adapter plate 5, which is used for monitoring environmental interference signals. Specifically, the adapter plate 5 is fixed in the sensor shell 22 and connected with the eddy current plate 21, and a reference coil is mounted thereon (not shown in the figure). The reference coil is arranged in parallel with the detection coil 32 and is used for monitoring electromagnetic interference signals (such as electromagnetic fields generated by other equipment in the workshop). The control module compares the signals of the reference coil and the detection coil 32 to eliminate environmental interference factors and obtain displacement data that truly reflects the change of the distance between the plates.

[0074] Through such a setting, the environmental interference is monitored in real time by the reference coil, the common-mode interference (such as the influence of spatial electromagnetic field fluctuation and temperature change on the coil 32) is eliminated by using the differential measurement principle, the detection signal only retains the differential-mode component caused by the change of the electrode plate spacing, and the detection precision and reliability are greatly improved. For example, in a strong electromagnetic interference environment, the reference coil can effectively offset the external interference signal, and ensure that the detection data is real and reliable. At the same time, the detection device can work stably in a complex electromagnetic environment or a scene with large temperature and humidity changes, without the need for additional anti-interference measures, which widens the application scenarios of the device and meets the detection needs of various process environments (such as photolithography and CMP polishing) in semiconductor manufacturing.

[0075] Another aspect of the present application provides a system for detecting the flatness of an electrode plate, which comprises an electrode plate structure, the electrode plate structure comprising an upper electrode plate and a lower electrode plate, a plurality of detection devices being arranged at different positions between the upper electrode plate and the lower electrode plate, and the plurality of detection devices transmitting the data of the current position to an upper computer through the communication module of the linear displacement sensor assembly. Specifically, a plurality of detection devices are arranged at different positions between the upper electrode plate and the lower electrode plate, and each detection device independently detects the electrode plate spacing at the position. The communication module of each device is connected with the upper computer through an RS485 bus and transmits the detection data in real time. The upper computer software collects, stores and analyzes the displacement data of the plurality of positions, calculates the spacing difference between the points, and evaluates the overall flatness of the electrode plate.

[0076] Through such a setting, the flatness difference of different regions on the surface of the electrode plate can be captured by multi-point detection, avoiding the limitations of single-point measurement, for example, the warping difference between the center region and the edge region of the electrode plate can be detected, and the overall appearance of the electrode plate can be comprehensively reflected. Real-time data transmission enables the operator to view the flatness change of each point through the upper computer interface, discover the deformation of the electrode plate in time and adjust the process parameters, and improve the production qualification rate. The synchronous work of the plurality of devices can greatly shorten the detection time, and the efficiency is improved compared with the traditional point-by-point contact measurement. The communication module supports the simultaneous work and data transmission of the plurality of detection devices, the upper computer can receive the detection data of each position in real time, the multi-point synchronous detection of the surface of the electrode plate is realized, the cost and error of manual detection and analysis are reduced, the flatness is comprehensively evaluated, and the detection efficiency and accuracy are improved.

[0077] It should be understood that the above specific embodiments of the present application are only used for illustrative or explanatory purposes of the principles of the present application, and do not constitute a limitation on the present application. Therefore, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the present application shall be included in the protection scope of the present application. In addition, the appended claims of the present application are intended to cover all variations and modifications falling within the scope and boundary of the appended claims, or the equivalent forms of such scope and boundary.

Claims

1. A detection device for detecting the flatness of an electrode plate, characterized in that: The detection device is in contact with the upper electrode plate and the lower electrode plate of the electrode plate to be detected; The detection device comprises a housing (1), a linear displacement sensor assembly (2), a coil assembly (3) and a connecting assembly (4); The housing (1) comprises an upper cover (11) and a base (12) for forming a closed space, wherein the upper cover (11) abuts against the upper electrode plate, and the base (12) abuts against the lower electrode plate. The upper cover (11) is connected to the top of the linear displacement sensor assembly (2), the base (12) is connected to the linear displacement sensor assembly (2) via the connecting assembly (4), and the coil assembly (3) is connected to the bottom of the linear displacement sensor assembly (2); The linear displacement sensor assembly (2) comprises an eddy current plate (21) and a sensor housing (22), wherein the eddy current plate (21) is fixedly connected to the sensor housing (22); The connecting assembly (4) includes a spring (41) and a slider (42), the top end of the spring (41) is connected to the sensor housing (22), and the bottom end of the spring (41) is connected to the base (12); The slider (42) is sleeved on the outside of the sensor housing (22) and connected to the sensor housing (22), and the outer wall of the slider (42) is slidably connected to the inner side wall of the base (12); The linear displacement sensor assembly (2) generates an excitation signal, the coil assembly (3) generates an alternating magnetic field, the base (12) generates an induced eddy current in the alternating magnetic field, and the induced eddy current generates an anti-magnetic field in the opposite direction to the alternating magnetic field. When the distance between the upper cover (11) and the base (12) changes, the linear displacement sensor assembly (2) slides on the base (12) through the connecting assembly (4), and the linear displacement sensor assembly (2) detects a voltage signal generated by the impedance change of the coil assembly (3) and converts the voltage signal into linear displacement change data.

2. The detection device according to claim 1, characterized in that The upper cover (11) is located on the top of the eddy current plate (21) and is fixedly connected to the sensor housing (22). The sensor housing (22) is connected to the base (12) via the connecting assembly (4). The eddy current plate (21) drives the coil assembly (3) to generate an alternating magnetic field and processes the voltage signal of the coil assembly (3).

3. The detection device according to claim 2, characterized in that The eddy current plate (21) comprises a power module, a control module, an excitation and detection module, an analog-to-digital conversion module and a communication module; The power module is connected to the control module and is used to provide power to the eddy current plate (21); The control module controls the operation of each module and performs signal processing; The excitation and detection module is connected to the control module and is used to drive the coil assembly (3) to generate an alternating magnetic field, receive a voltage signal from the coil assembly (3) and transmit it to the control module; The analog-to-digital conversion module is connected to the control module and is used to convert the voltage signal into a digital signal; The communication module is connected to the control module and is used to transmit data of the control module to the host computer.

4. The detection device according to claim 2, characterized in that The coil assembly (3) comprises a first mounting plate (31) and a coil (32), wherein the first mounting plate (31) is fixedly connected to the bottom of the sensor housing (22), and the coil (32) is connected to the first mounting plate (31).

5. The detection device according to claim 4, characterized in that The coil assembly (3) further comprises a second mounting plate (33), the first mounting plate (31) being connected to the second mounting plate (33), a mounting groove (31a) being formed between the first mounting plate (31) and the second mounting plate (33), and the coil (32) being arranged in the mounting groove (31a).

6. The detection device according to claim 2, characterized in that A vertical through slot (12a) is formed on the side of the base (12), a limiting portion (221) is formed on the side of the sensor housing (22), a mounting hole (42a) is formed on the side of the slider (42), and the limiting portion (221) passes through the mounting hole (42a) and is slidably connected to the through slot (12a).

7. The detection device according to claim 1, characterized in that The detection device further comprises an adapter plate (5), the adapter plate (5) being connected to the linear displacement sensor assembly (2), a reference coil being fixed on the adapter plate (5), and the reference coil being used to monitor environmental interference signals.

8. A system for detecting the flatness of an electrode plate, comprising the detection device according to any one of claims 1 to 7, characterized in that: The system also includes an electrode plate structure, which includes an upper electrode plate and a lower electrode plate. Multiple detection devices are provided at different positions between the upper electrode plate and the lower electrode plate. The multiple detection devices transmit current position data to a host computer through the communication module of the linear displacement sensor assembly.

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