Online liquid preparation etching equipment for semiconductor wafer preparation

Abstract

The invention relates to the field of semiconductor manufacturing, and discloses online liquid preparation etching equipment for semiconductor wafer preparation, which comprises an outer box, an etching tank and a cleaning tank are arranged in the outer box, a waste gas collection box is arranged on the outer side of the outer box, and a speed reduction motor is mounted on the back surface of the outer box; the swing arm is in transmission connection with an output shaft of the gear motor, a moving plate is rotationally installed on the front face of the swing arm, and a plurality of sets of supporting columns are fixedly installed at the bottom of the moving plate; and a plurality of sets of supporting grooves are formed in the outer edge of the top of the connecting block, and the supporting columns are movably connected into the supporting grooves in a sleeved mode and provide hoisting support for the connecting block. According to the device, through redesign, residual etching liquid remaining in the etching area of the lower surface of the wafer is rapidly thrown away through vibration, the function that the contact reaction time of all parts of the lower surface of the wafer and the etching liquid is synchronous is achieved, and therefore the etching precision of the device is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to an online liquid preparation and etching device for semiconductor wafer preparation. Background Art

[0002] Semiconductor wafers often undergo processes such as photolithography, etching, and packaging during fabrication. The surface of the wafer is often covered with a thin film. The photolithography machine engraves a pattern on the film surface, then etches through the removed wafer surface, and etches the wafer surface to form a circuit diagram. In the existing technology, there are wet etching and dry etching, of which wet etching was developed first. However, with the improvement of wafer processing precision requirements, wet etching has gradually failed to meet the wafer etching precision. This is because wet etching essentially uses high-strength concentrated acid (such as hydrofluoric acid) to react and corrode the pre-engraved circuit pattern on the wafer surface. The photolithography machine first removes part of the thin film covering the wafer surface, exposing only the part where the circuit diagram is to be drawn, thereby exposing the wafer surface to facilitate subsequent etching reactions. However, due to the isotropic nature of the etching solution material, the chemical properties of each part are the same, and the etching rate in all directions is also the same. Therefore, deep grooves may be etched if not careful. Therefore, this also completely restricts the maximum precision of wet etching. Summary of the Invention

[0003] The present application proposes an online liquid preparation etching device for semiconductor wafer preparation, which has the advantage of high etching accuracy and is used to solve the problem of uneven corrosion caused by the isotropy of the corrosion material in the prior art.

[0004] To achieve the above-mentioned purpose, the present application adopts the following technical solution: an online liquid etching device for semiconductor wafer preparation, comprising

[0005] An outer box, wherein an etching tank and a cleaning tank are provided inside the outer box, an exhaust gas collection box is provided outside the outer box, and a reduction motor is installed on the back of the outer box;

[0006] A swing arm is drivingly connected to the output shaft of the reduction motor, a movable plate is rotatably mounted on the front of the swing arm, and a plurality of support columns are fixedly mounted on the bottom of the movable plate;

[0007] A connecting block, wherein the outer edge of the top of the connecting block is provided with multiple groups of support grooves, the support columns are movably sleeved inside the support grooves and provide lifting support for the connecting block, and the interior of the support grooves is movably sleeved with springs;

[0008] The mounting plate is provided in multiple groups and fixedly connected to the bottom of the connecting block. Multiple groups of vacuum suction cups are fixedly installed on the top of the inner wall of the mounting plate, and the bottom of the vacuum suction cups vacuum-absorbs the wafer;

[0009] The reciprocating mechanism includes a frame 1 and a frame 2 fixedly mounted on the bottom of the movable plate, wherein cams 1 and 2 are rotatably mounted inside the frame 1 and the frame 2 respectively, a power motor is mounted on the back of the frame 1, and the output shaft of the power motor is transmission-connected to cams 1 and cams 2.

[0010] Preferably, the bottom of the front side of the swing arm is fixedly connected to a support shaft, an adapter sleeve is movably sleeved on the outer surface of the support shaft, and the bottom of the adapter sleeve is fixedly connected to the movable plate.

[0011] Preferably, the etching tank and the cleaning tank are respectively located on the left and right sides of the inner wall of the outer box, and the bottom of the inner wall of the outer box is equipped with an etching liquid circulation box and a cleaning liquid circulation box respectively located below the etching tank and the cleaning tank. The etching tank and the etching liquid circulation box are connected through a pipeline circulation, and the cleaning tank and the cleaning liquid circulation box are connected through a pipeline circulation. The exhaust gas collection box is fixedly installed on the left side of the outer box and is connected to the inner cavity of the outer box through a pipeline.

[0012] Preferably, the cam 1 and the cam 2 have the same shape and size, and the cam 1 and the cam 2 are symmetrically distributed up and down.

[0013] Preferably, the bottom of the outer surface of cam 1 abuts against the top of the connecting block, the distance from the bottom of cam 1 to its center is greater than the distance from the top of cam 1 to its center, and a clearance groove is provided on the front side of the top of the connecting block directly below cam 2.

[0014] Preferably, the axial cross-section of the support column is in a "T" shape, and the raised portion of the support column is inverted on the top of the inner wall of the support groove.

[0015] Preferably, a clamping slot is provided at the bottom end of the support column, and the upper and lower ends of the spring are elastically connected to the clamping slot and the support slot respectively.

[0016] Preferably, a sealing ring is fixedly connected to the bottom of the inner wall of the mounting plate, and the top of the wafer abuts against the sealing ring.

[0017] Preferably, a plurality of guide cylinders are fixedly connected to the bottom of the movable plate, guide grooves are provided inside the guide cylinders, and the inner walls of the guide cylinders are adapted to the outer sides of the connecting blocks.

[0018] Preferably, the number of the mounting plates is five groups, the first group of mounting plates is located directly below the connecting block, and the remaining four groups of mounting plates are equidistantly distributed on the outer edge of the bottom of the connecting block in a circular pattern.

[0019] The beneficial effects of the present invention are as follows:

[0020] This device has been redesigned to use vibration to quickly shake off the residual etching liquid remaining in the etching area on the lower surface of the wafer, thereby achieving the function of synchronizing the contact reaction time between each part of the lower surface of the wafer and the etching liquid, thereby improving the etching accuracy of the device.

[0021] 1. First, multiple mounting plates for fixing the wafers are arranged, and are fixed on a horizontal plane using connecting blocks. For wafers that only need to have one side etched, a supporting groove is provided on the top of the connecting block, and the supporting groove is sleeved therein, so that the supporting groove can provide lifting support for the connecting block, the mounting plate and the wafer, and the mounting plate can drive the connecting block to move upward and reset relative to the supporting column. Then, a spring is installed inside the supporting groove, so that the elastic force of the spring can drive the connecting block, the mounting plate and the wafer to move upward as a whole. When the movable plate drives the mounting plate and the wafer to leave the liquid surface of the etching solution, the spring pulls the connecting block, the mounting plate and the wafer upward, so that the etching solution remaining on the lower surface of the wafer is maintained in its original position under the action of inertia, thereby quickly separating from the lower surface of the wafer, reducing the corrosive effect of the etching solution remaining on the lower surface of the wafer.

[0022] 2. Then, a reciprocating mechanism is provided to push the connecting block downward to the lowest point, so that the connecting block has space to move upward. Due to the setting of the spring, the connecting block always has a tendency to move upward. The device is provided with a cam and uses its raised part to abut the connecting block downward to its lowest movement position. The power motor drives the cam to rotate, so that the cam gradually reduces the downward abutment of the connecting block when it rotates between 0°-180°. At the same time, the spring is used to drive the connecting block upward and fill the position, and the downward abutment of the connecting block is increased or decreased when the cam rotates between 180°-360°. degree, causing the connecting block to move downward. In this way, after using inertia to eliminate most of the moisture remaining on the lower surface of the wafer, the power motor is used to drive the cam to move in a cycle, so that the connecting block, the mounting plate and the wafer can move up and down rapidly, thereby throwing out the etching liquid residue and reaction products remaining in the gully structure formed by corrosion on the lower surface of the wafer, so that the wafer is completely out of contact with the etching liquid as soon as it leaves the etching liquid surface, so that all parts of the lower surface of the wafer can be in contact with the etching liquid and out of contact with the etching liquid at the same time, maintaining the consistency of the reaction and greatly improving the etching accuracy of the device.

[0023] 3. Finally, the cam 2 and cam 1 installed on the output shaft of the power motor are symmetrically distributed up and down, and the centrifugal forces generated by each other are offset when the power motor drives cam 1 and cam 2 to rotate, thereby avoiding the centrifugal force from affecting the horizontal state of the movable plate, the connecting block and the mounting plate as a whole. Since the raised parts of cam 1 and cam 2 are symmetrical up and down and distributed in a central symmetrical manner with the axis of the power motor, when the power motor drives cam 1 to rotate, the whole will generate centrifugal force along the axis of the power motor to the raised side of cam 1 or cam 2, and the raised parts of cam 1 and cam 2 are symmetrical up and down, thereby offsetting the two groups of centrifugal forces of opposite directions and equal magnitude, effectively improving the stability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings, which constitute a part of the specification, illustrate embodiments disclosed in the present application and, together with the description, serve to explain the principles disclosed in the present application in a clear and understandable manner.

[0025] The present disclosure can be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0026] Figure 1 It is a partial separation schematic diagram of the overall structure of the present invention;

[0027] Figure 2 This is a schematic diagram of the front appearance of the overall structure of the present invention;

[0028] Figure 3 Schematic diagram of the internal structure of the outer box of the present invention;

[0029] Figure 4 It is a partial front cutaway schematic diagram of the overall structure of the present invention;

[0030] Figure 5 For the present invention Figure 4 A magnified schematic diagram of the structure at center A;

[0031] Figure 6 This is a schematic diagram of the separation of the reduction motor, swing arm, support shaft, adapter cylinder, movable plate, guide cylinder, connecting block and reciprocating mechanism of the present invention;

[0032] Figure 7 It is a side view of the movable plate, guide cylinder, connecting block and reciprocating mechanism of the present invention;

[0033] Figure 8 It is a structural schematic diagram of the guide cylinder, connecting block, reciprocating mechanism, supporting column and mounting plate of the present invention.

[0034] Among them: 1. Outer box; 2. Reducer motor; 3. Swing arm; 4. Support shaft; 5. Adapter cylinder; 6. Moving plate; 7. Guide cylinder; 8. Connecting block; 9. Reciprocating mechanism; 91. Frame one; 92. Cam one; 93. Frame two; 94. Cam two; 95. Power motor; 10. Give way groove; 11. Support groove; 12. Support column; 13. Spring; 14. Mounting plate; 15. Sealing ring; 16. Vacuum suction cup; 17. Wafer; 18. Waste gas collection box; 19. Etching tank; 20. Etching liquid circulation box; 21. Cleaning tank; 22. Cleaning liquid circulation box; 23. Card slot; 24. Guide groove. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0036] See also Figures 1-8 This embodiment discloses an online liquid etching device for semiconductor wafer preparation, comprising

[0037] The outer box 1 is provided with an etching tank 19 and a cleaning tank 21 inside the outer box 1, an exhaust gas collecting box 18 is provided on the outside of the outer box 1, and a reduction motor 2 is installed on the back of the outer box 1;

[0038] The swing arm 3 is connected to the output shaft of the reduction motor 2. The front of the swing arm 3 is rotatably mounted with a movable plate 6, and the bottom of the movable plate 6 is fixedly mounted with multiple groups of support columns 12;

[0039] The outer edge of the top of the connecting block 8 is provided with multiple sets of support grooves 11, and the support columns 12 are movably sleeved inside the support grooves 11 to provide lifting support for the connecting block 8. The inner part of the support grooves 11 is movably sleeved with springs 13;

[0040] The mounting plate 14 is provided in multiple groups and fixedly connected to the bottom of the connecting block 8. Multiple groups of vacuum suction cups 16 are fixedly installed on the top of the inner wall of the mounting plate 14. The bottom of the vacuum suction cups 16 vacuum-absorbs the wafer 17;

[0041] The reciprocating mechanism 9 includes a frame 1 91 and a frame 2 93 fixedly mounted on the bottom of the movable plate 6. Cams 1 92 and 2 94 are rotatably mounted inside the frame 1 91 and the frame 2 93, respectively. A power motor 95 is mounted on the back of the frame 1 91. The output shaft of the power motor 95 is in driving connection with the cams 1 92 and 94.

[0042] This device has been redesigned to use vibration to quickly shake off the residual etching liquid remaining in the etching area on the lower surface of the wafer 17, thereby achieving the function of synchronizing the contact reaction time between each part of the lower surface of the wafer 17 and the etching liquid, thereby improving the etching accuracy of the device.

[0043] The support bracket 11 is provided on the top of the support bracket 11 so that the support bracket 11 can be lifted and supported by the support bracket 11, thereby ensuring that the support bracket 11 can lift and support the support bracket 11 and the wafer 17.

[0044] Then, the reciprocating mechanism 9 is provided to push the connecting block 8 downward to the lowest point, so that the connecting block 8 has space to move upward. Due to the setting of the spring 13, the connecting block 8 always has a tendency to move upward. The device is provided with a cam 92 and uses its raised part to abut the connecting block 8 downward to its lowest movement position, and drives the cam 92 to rotate by the power motor 95, so that the cam 92 gradually reduces the downward abutment of the connecting block 8 when it rotates between 0°-180°. At the same time, the spring 13 is used to drive the connecting block 8 upward and fill the position, and the downward abutment of the connecting block 8 is increased or decreased when the cam 92 rotates between 180°-360°. The connection block 8 moves downward. In this way, after most of the moisture remaining on the lower surface of the wafer 17 is eliminated by inertia, the power motor 95 is used to drive the cam 92 to move periodically, so that the connection block 8, the mounting plate 14 and the wafer 17 can move back and forth rapidly, thereby throwing out the etching liquid residue and reaction products remaining in the gully structure formed by corrosion on the lower surface of the wafer 17, so that the wafer 17 is completely out of contact with the etching liquid as soon as it leaves the etching liquid surface, so that all parts of the lower surface of the wafer 17 can be in contact with the etching liquid and out of contact with the etching liquid at the same time, maintaining the consistency of the reaction and greatly improving the etching accuracy of the device.

[0045] Finally, cam 2 94 and cam 1 92 installed on the output shaft of the power motor 95 are symmetrically distributed up and down, and when the power motor 95 drives cam 1 92 and cam 2 94 to rotate, the centrifugal forces generated by each other are offset, thereby avoiding the centrifugal force from affecting the overall horizontal state of the movable plate 6, the connecting block 8 and the mounting plate 14. Since the raised parts of cam 1 92 and cam 2 94 are symmetrical up and down and are centrally symmetrically distributed with the axis of the power motor 95, when the power motor 95 drives cam 1 92 to rotate, the whole will generate centrifugal force along the axis of the power motor 95 to the raised side of cam 1 92 or cam 2 94, and the raised parts of cam 1 92 and cam 2 94 are symmetrical up and down, thereby offsetting the two groups of centrifugal forces with opposite directions and the same size, effectively improving the stability of the device.

[0046] The bottom of the front of the swing arm 3 is fixedly connected to the support shaft 4, the outer surface of the support shaft 4 is movably sleeved with an adapter tube 5, and the bottom of the adapter tube 5 is fixedly connected to the movable plate 6;

[0047] When the reduction motor 2 drives the swing arm 3 to rotate, it will drive the adapter cylinder 5 and the movable plate 6 to move up and down, and because the support shaft 4 and the adapter cylinder 5 are movably connected to each other, the adapter cylinder 5 can keep the movable plate 6 as a whole level under the action of the dead weight of the movable plate 6, the guide cylinder 7 and the mounting plate 14.

[0048] Among them, the etching tank 19 and the cleaning tank 21 are respectively located on the left and right sides of the inner wall of the outer box 1. The bottom of the inner wall of the outer box 1 is installed with an etching liquid circulation box 20 and a cleaning liquid circulation box 22 respectively located below the etching tank 19 and the cleaning tank 21. The etching tank 19 and the etching liquid circulation box 20 are connected by a pipeline circulation, and the cleaning tank 21 and the cleaning liquid circulation box 22 are connected by a pipeline circulation. The exhaust gas collection box 18 is fixedly installed on the left side of the outer box 1 and is connected to the inner cavity of the outer box 1 through a pipeline.

[0049] The etching tank 19 is filled with etching liquid, which is responsible for wet etching the wafer 17, while the cleaning tank 21 is filled with cleaning liquid, which is responsible for cleaning the etched wafer 17. The exhaust gas collection box 18 is responsible for absorbing harmful gases generated during the operation of the device.

[0050] The cam 1 92 and the cam 2 94 have the same shape and size, and the cam 1 92 and the cam 2 94 are symmetrically distributed up and down;

[0051] Since the raised parts of cam 1 92 and cam 2 94 are symmetrical in vertical direction and distributed symmetrically with respect to the axis of the power motor 95, when the power motor 95 drives cam 1 92 to rotate, the whole will generate centrifugal force along the axis of the power motor 95 to the raised side of cam 1 92 or cam 2 94. Since the raised parts of cam 1 92 and cam 2 94 are symmetrical in vertical direction, the two sets of centrifugal forces of opposite directions and equal magnitude will offset each other, thereby effectively improving the stability of the device.

[0052] The bottom of the outer surface of the cam 1 92 abuts against the top of the connecting block 8. The distance between the bottom of the cam 1 92 and its center is greater than the distance between the top of the cam 1 92 and its center. A clearance groove 10 is formed on the front side of the top of the connecting block 8 and is located directly below the cam 2 94.

[0053] Cam 1 92 is designed as an eccentric protrusion, which can press the connecting block 8 downward and make the connecting block 8 at the lowest position of its own movement, providing space for subsequent upward movement. The spring 13 can apply pressure to the connecting block 8 upward and drive the connecting block 8 to move upward.

[0054] The axial cross-section of the support column 12 is in a "T" shape, and the raised portion of the support column 12 is inverted on the top of the inner wall of the support groove 11;

[0055] like Figure 5 As shown, the "T"-shaped support column 12 can be inverted to use its bottom protrusion to adapt to the inside of the support groove 11 to lift and support the connecting block 8, so that the connecting block 8 can move upward relative to the support column 12. At the same time, the support column 12 can also provide a guiding function for the up and down movement of the connecting block 8.

[0056] Among them, the bottom end of the support column 12 is provided with a slot 23, and the upper and lower ends of the spring 13 are elastically connected to the slot 23 and the support slot 11 respectively;

[0057] The spring 13 is located inside the clamping groove 23 and the supporting groove 11. The spring 13 pulls the connecting block 8 upward, so that the connecting block 8 can reciprocate up and down, thereby achieving the subsequent vibration to remove the residual etching liquid.

[0058] The bottom of the inner wall of the mounting plate 14 is fixedly connected with a sealing ring 15 , and the top of the wafer 17 abuts against the sealing ring 15 ;

[0059] After the vacuum chuck 16 adsorbs and fixes the wafer 17 , the top of the wafer 17 can be sealed by contacting the sealing ring 15 , thereby preventing the etching solution from leaking into the upper surface of the wafer 17 .

[0060] Among them, the bottom of the movable plate 6 is fixedly connected with multiple sets of guide cylinders 7, the interior of the guide cylinders 7 is provided with guide grooves 24, and the inner wall of the guide cylinders 7 is adapted to the outer side of the connecting block 8;

[0061] Wafer 17 provides a synchronous guiding function for the up and down movement of connecting block 8. Because the inner wall of guide cylinder 7 and the outer surface of connecting block 8 are fitted with each other, the opening of guide groove 24 can avoid the guide cylinder 7 and connecting block 8 from getting stuck during the up and down relative movement by giving way.

[0062] There are five groups of mounting plates 14. The first group of mounting plates 14 is located directly below the connecting block 8, and the remaining four groups of mounting plates 14 are equidistantly distributed around the outer edge of the bottom of the connecting block 8.

[0063] There are five groups of mounting plates 14, that is, the device can process five groups of wafers 17 at a time, and because the five groups of mounting plates 14 are at the same height, the etching solution residues of each group of wafers 17 can be roughly in a similar range.

[0064] Working principle:

[0065] When the device is working, the etching liquid is first introduced into the interior of the etching tank 19 through the etching liquid circulation box 20, and the cleaning liquid is introduced into the interior of the cleaning tank 21 through the cleaning liquid circulation box 22. The wafer 17 is placed on the bottom of the mounting plate 14, and the wafer 17 is adsorbed by the vacuum suction cup 16. The sealing ring 15 contacts the wafer 17 to form a seal, and the reduction motor 2 is started and the swing arm 3 is driven to rotate counterclockwise. At this time, the movable plate 6 and the mounting plate 14 are located above the etching tank 19 as a whole. The swing arm 3 rotates downward in a counterclockwise manner and drives the adapter cylinder 5, the movable plate 6 and the mounting plate 14 to move to the interior of the etching tank 19 until the bottom of the wafer 17 contacts the etching liquid. The reduction motor 2 is stopped and the exhaust gas collection box 18 is started to prepare to adsorb any dangerous gases that may be generated.

[0066] Then, the bottom of the wafer 17 reacts with the etching solution, causing multiple circuits corroded by the etching solution, i.e., a circuit diagram, to be generated on its lower surface. Subsequently, the reduction motor 2 is started, and the swing arm 3 is driven to reverse, and when the wafer 17 is driven upward and out of the interior of the etching groove 19, the power motor 95 is started, and the cam 1 92 and the cam 2 94 are driven to rotate simultaneously. When the cam 1 92 rotates to 0-180 degrees, its raised portion gradually moves away from the upper surface of the connecting block 8. The connecting block 8 is lifted upward by the action of the spring 13. When the cam 1 92 rotates to 180-360 degrees, its raised portion gradually approaches the upper surface of the connecting block 8. The connecting block 8 is pushed downward and reset by the action of the cam 92. That is, each time the cam 92 completes one rotation, the connecting block 8 performs an up-and-down reciprocating motion. When the connecting block 8 moves upward, the etching liquid attached to its lower surface will leave the surface of the connecting block 8 due to inertia. After multiple rotations of the cam 92, the connecting block 8 performs multiple up-and-down motions when the wafer 17 moves upward and leaves the etching liquid, thereby causing the wafer 17 to produce multiple up-and-down reciprocating motions. That is, when the wafer 17 leaves the etching liquid, the etching liquid residue attached to its surface will be quickly thrown off, so that the lower surface of the wafer 17 stops reacting with the etching liquid.

[0067] Finally, the reduction motor 2 drives the swing arm 3 to rotate clockwise, and the adapter cylinder 5 is movably connected to the support shaft 4. Under the action of the dead weight of the movable plate 6, the guide cylinder 7, the connecting block 8 and the mounting plate 14, the adapter cylinder 5 rotates relative to the support shaft 4, so that the movable plate 6 as a whole always remains in a horizontal state, and the mounting plate 14 and the wafer 17 are driven into the cleaning tank 21 to complete the cleaning.

[0068] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. An online liquid etching device for semiconductor wafer preparation, characterized in that: It comprises an outer box (1), wherein an etching tank (19) and a cleaning tank (21) are provided inside the outer box (1), an exhaust gas collecting box (18) is provided outside the outer box (1), and a reduction motor (2) is installed on the back of the outer box (1); A swing arm (3) is drivingly connected to the output shaft of the reduction motor (2); a movable plate (6) is rotatably mounted on the front of the swing arm (3); and a plurality of support columns (12) are fixedly mounted on the bottom of the movable plate (6); A connecting block (8), wherein the outer edge of the top of the connecting block (8) is provided with a plurality of supporting grooves (11), the supporting columns (12) are movably sleeved inside the supporting grooves (11) and provide hanging support for the connecting block (8), and the interior of the supporting grooves (11) is movably sleeved with springs (13); A mounting plate (14) is provided in multiple groups and fixedly connected to the bottom of the connecting block (8); multiple groups of vacuum suction cups (16) are fixedly installed on the top of the inner wall of the mounting plate (14); wafers (17) are vacuum-adsorbed on the bottom of the vacuum suction cups (16); A reciprocating mechanism (9) includes a frame 1 (91) and a frame 2 (93) fixedly mounted on the bottom of a movable plate (6), wherein a cam 1 (92) and a cam 2 (94) are rotatably mounted inside the frame 1 (91) and the frame 2 (93), and a power motor (95) is mounted on the back of the frame 1 (91), and the output shaft of the power motor (95) is in transmission connection with the cam 1 (92) and the cam 2 (94).

2. The online liquid preparation etching equipment for semiconductor wafer preparation according to claim 1, characterized in that: The bottom of the front face of the swing arm (3) is fixedly connected to a support shaft (4), an outer surface of the support shaft (4) is movably sleeved with an adapter cylinder (5), and the bottom of the adapter cylinder (5) is fixedly connected to a movable plate (6).

3. The online liquid preparation etching equipment for semiconductor wafer preparation according to claim 2, characterized in that: The etching tank (19) and the cleaning tank (21) are respectively located on the left and right sides of the inner wall of the outer box (1); an etching liquid circulation box (20) and a cleaning liquid circulation box (22) are respectively installed at the bottom of the inner wall of the outer box (1), and are located below the etching tank (19) and the cleaning tank (21); the etching tank (19) and the etching liquid circulation box (20) are circulated and connected through a pipeline; the cleaning tank (21) and the cleaning liquid circulation box (22) are circulated and connected through a pipeline; the waste gas collection box (18) is fixedly installed on the left side of the outer box (1) and is connected to the inner cavity of the outer box (1) through a pipeline.

4. The online liquid preparation etching equipment for semiconductor wafer preparation according to claim 3, characterized in that: The shape and size of the cam 1 (92) and the cam 2 (94) are the same, and the cam 1 (92) and the cam 2 (94) are symmetrically distributed up and down.

5. The online liquid preparation etching equipment for semiconductor wafer preparation according to claim 4, characterized in that: The bottom of the outer surface of the cam 1 (92) abuts against the top of the connecting block (8), the distance between the bottom of the cam 1 (92) and the center of the circle is greater than the distance between the top of the cam 1 (92) and the center of the circle, and the front side of the top of the connecting block (8) is provided with a clearance groove (10) located directly below the cam 2 (94).

6. The online liquid preparation etching equipment for semiconductor wafer preparation according to claim 5, characterized in that: The axial cross-section of the support column (12) is in a "T" shape, and the raised portion of the support column (12) is inverted on the top of the inner wall of the support groove (11).

7. The online liquid preparation etching equipment for semiconductor wafer preparation according to claim 6, characterized in that: A clamping slot (23) is provided at the bottom end of the support column (12), and the upper and lower ends of the spring (13) are elastically connected to the clamping slot (23) and the support slot (11) respectively.

8. The online liquid preparation etching equipment for semiconductor wafer preparation according to claim 7, characterized in that: A sealing ring (15) is fixedly connected to the bottom of the inner wall of the mounting plate (14), and the top of the wafer (17) abuts against the sealing ring (15).

9. The online liquid preparation etching equipment for semiconductor wafer preparation according to claim 8, characterized in that: The bottom of the movable plate (6) is fixedly connected to a plurality of guide cylinders (7), the interior of the guide cylinders (7) is provided with guide grooves (24), and the inner walls of the guide cylinders (7) are adapted to the outer sides of the connecting blocks (8).

10. The online liquid preparation etching equipment for semiconductor wafer preparation according to claim 9, characterized in that: The number of the mounting plates (14) is five groups, the first group of mounting plates (14) is located directly below the connecting block (8), and the remaining four groups of mounting plates (14) are equidistantly distributed on the outer edge of the bottom of the connecting block (8) in a circular pattern.

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