An indium phosphide chip packaging device

Abstract

This invention relates to the field of chip packaging technology, specifically to an indium phosphide chip packaging device, comprising a chip fixture, a spot welding head, a hot welding head, a cold welding head, a testing mechanism, and a conveyor belt. Multiple support frames are sequentially arranged on the outer side of the conveyor belt, and electric push rods are mounted on the support frames. A connecting plate is fixedly connected to the output end of each electric push rod. This invention uses a chain conveyor belt and a packaging positioning mechanism mounted on a fixed block. This packaging positioning mechanism can simultaneously transport and position the chip module. Furthermore, during the sequential spot welding, hot welding, and cold welding of the indium phosphide chips on the chip module, the mechanism, in cooperation with a pressing and engaging mechanism, further achieves precise positioning of the indium phosphide chips on the chip module during packaging, preventing the chip module from deviating from its initial position due to intermittent conveyor belt transport, thus further ensuring the indium phosphide chip packaging efficiency of the chip module.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically to an indium phosphide chip packaging device. Background Technology

[0002] Indium phosphide (InP) chips, due to their wide bandgap characteristics, exhibit light-emitting properties at communication wavelengths, making them widely used in photonic communication. Currently, the packaging process for InP chips in existing chip modules involves first using a fixture to attach the chip to a chip module at a transfer mechanism. Then, the transfer mechanism transports the chip module with the chip to a spot-welding position for spot welding. After spot welding, the module is sequentially transferred by the transfer mechanism to hot-welding and cold-welding stations, thus completing the InP chip packaging process. However, during the packaging process of the indium phosphide chip in the chip module, the chip module is located on the conveyor belt of the conveyor mechanism. The existing conveyor belt has multiple protrusions, and the chip module is located between two protrusions. However, the width between the two protrusions is greater than the width of the chip module. Furthermore, the conveyor belt uses intermittent conveying to cooperate with the packaging equipment. This conveying method causes the chip module on the conveyor belt to be subjected to instantaneous acceleration and deceleration. The chip module and the indium phosphide chip on it are subjected to instantaneous forces, causing the chip module to deviate from its initial position on the conveyor belt. As a result, the indium phosphide chip in the chip module will be misaligned during spot welding, hot welding, and cold welding, which further affects the packaging accuracy of the indium phosphide chip in the chip module. Therefore, we propose an indium phosphide chip packaging device. Summary of the Invention

[0003] The purpose of this invention is to provide an indium phosphide chip packaging device to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: an indium phosphide chip packaging device, comprising a chip fixture, a spot welding head, a hot welding head, a cold welding head, a testing mechanism, and a conveyor belt. Multiple support frames are sequentially arranged on the outer side of the conveyor belt, and electric push rods are mounted on the support frames. A connecting plate is fixedly connected to the output end of each electric push rod, and the multiple connecting plates respectively support the spot welding head, the hot welding head, the cold welding head, and the testing mechanism. The conveyor belt is a chain conveyor belt, and multiple fixing blocks are fixedly installed at equal intervals on the chain conveyor belt. A packaging positioning mechanism is installed on the side of each fixing block away from the chain conveyor belt. A pressing and engaging mechanism is provided on the connecting plate. The multiple pressing and engaging mechanisms cooperate with the multiple packaging positioning mechanisms to ensure that the spot welding head, the hot welding head, and the cold welding head sequentially and precisely weld and package the indium phosphide chip on the chip module.

[0005] Furthermore, the packaging positioning mechanism includes a support plate, a positioning frame, a positioning component, a connecting component, and a pushing component. The support plate is fixedly installed on the side of the fixed block away from the chain conveyor belt, and a moving groove is provided on the side of the support plate near the support frame. There are two positioning frames, one end of which is slidably connected inside the moving groove, and the other end of which extends to the outside of the support plate. The connecting component is located inside the moving groove and is used to connect the two positioning frames.

[0006] The positioning frame is provided with a movable port, and the positioning component is connected to the movable port. The two positioning components position the chip module relative to each other.

[0007] Both sides of the support plate are provided with push grooves. There are two push members. One end of each push member is connected to the two push grooves, and the other end of the push member is connected to the moving frame. When the push member moves to the pressing and engaging mechanism, the pressing and engaging mechanism pushes the positioning frame through the push member.

[0008] Furthermore, the connector includes a connecting spring, which is located inside the moving groove, and both ends of the connecting spring are fixedly connected to two positioning frames. Through the connector, the two positioning frames are connected.

[0009] Furthermore, the positioning component includes a positioning block, a positioning rod, a limiting block, and a positioning spring. Two positioning blocks are provided, and the two positioning blocks slide through the moving opening respectively. The two ends of the positioning spring are fixedly connected to the two positioning blocks. The positioning rod is L-shaped and is fixedly connected to the positioning block. One end of the positioning rod is fixedly connected to the limiting block. The limiting block is used to limit the chip module. Through the provided positioning component, the chip module on the support plate is positioned.

[0010] Furthermore, the side of the limiting block closest to the chip module is set as a slope, which facilitates the positioning of the chip module by the limiting block.

[0011] Furthermore, the pushing component includes a first pushing block, a second pushing block, a pushing rod, a support component, and a contact component. The first pushing block is fixedly connected to the positioning frame, and the second pushing block is slidably connected to the outside of the first pushing block. The sides of the first and second pushing blocks that are close to each other are both set as pushing slopes. The contact component is installed on the side of the second pushing block away from the first pushing block. One end of the pushing rod is connected to the second pushing block, and the other end of the pushing rod is connected to the support component. The support component is connected to the pushing groove. Through the provided pushing component, the positioning frame is pushed.

[0012] Furthermore, the support member includes a support spring and a push plate. The support spring is located inside the push groove. One end of the support spring is fixedly connected to the push plate, and the other end of the support spring is fixedly connected to the push plate. The push plate is L-shaped. One end of the push plate is slidably connected to the push groove, and the other end of the push plate is fixedly connected to the push rod. Through the provided support member, the push rod is supported.

[0013] Furthermore, the contact element includes a support block and a contact block. One end of the support block is fixedly connected to the second push block, and the other end of the support block is fixedly connected to the contact block. The side of the contact block away from the support block is arc-shaped. Through the provided contact element, the function of connecting the pressing and engaging mechanism is realized.

[0014] Furthermore, both sides of the connecting plate are provided with connecting ends, and an adjustment port is formed between the connecting ends and the connecting plate. The pressing and fitting mechanism is connected to the adjustment port. The pressing and fitting mechanism includes an adjusting sleeve, an adjusting bolt, a pressing rod, and a pressing block. The adjusting sleeve is slidably sleeved on the outside of the connecting end, and the adjusting sleeve slides through the adjustment port. The side of the adjusting sleeve away from the connecting end is provided with a threaded hole, and the adjusting bolt is threadedly connected to the threaded hole.

[0015] The pressing rod is fixedly installed at the bottom of the adjusting sleeve, and the pressing block is fixedly installed at the bottom of the pressing rod. Through the provided pressing engagement mechanism, the sealing positioning mechanism is pushed.

[0016] Furthermore, the pressing block is wedge-shaped, which facilitates the pressing block's pushing action on the contact block.

[0017] This invention has at least the following beneficial effects:

[0018] 1. In use, this invention uses a chain conveyor belt, with multiple fixed blocks evenly spaced on the chain conveyor belt. A packaging and positioning mechanism is installed on each fixed block. This mechanism can simultaneously transport and position the chip module. Furthermore, during the sequential spot welding, hot welding, and cold welding of the indium phosphide chips on the chip module, the mechanism, in conjunction with a pressing mechanism, further ensures precise positioning of the indium phosphide chips during packaging. This prevents the chip module from deviating from its initial position due to intermittent conveyor belt transport, thus guaranteeing the packaging efficiency of the indium phosphide chips.

[0019] 2. The packaging and positioning mechanism in this invention can transport and position chip modules of different sizes, while ensuring the packaging accuracy of indium phosphide chips on the chip modules without affecting the placement and retrieval of the chip modules. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 For the present invention Figure 1 Enlarged structural diagram of region A in the middle;

[0022] Figure 3 This is a side view of the overall structure of the present invention;

[0023] Figure 4 This is a schematic diagram of the electric actuator structure of the present invention;

[0024] Figure 5 For the present invention Figure 4 Enlarged structural diagram of region B in the middle;

[0025] Figure 6 This is a schematic diagram of the connecting plate structure of the present invention;

[0026] Figure 7 This is a schematic diagram of the chain conveyor belt structure of the present invention;

[0027] Figure 8 This is a schematic diagram of the support plate structure of the present invention;

[0028] Figure 9 This is a schematic diagram of the synchronization plate structure of the present invention;

[0029] Figure 10 This is a schematic diagram of the second push block structure of the present invention;

[0030] Figure 11 This is a schematic diagram of the push plate structure of the present invention.

[0031] In the diagram: 1-Chip clamp; 11-Spot welding head; 12-Hot welding head; 13-Cold welding head; 14-Testing mechanism; 2-Conveyor belt; 21-Chain plate conveyor belt; 3-Support frame; 31-Electric push rod; 4-Connecting plate; 41-Connecting end; 42-Adjustment port; 5-Fixing block; 6-Encapsulation positioning mechanism; 61-Support plate; 611-Moving groove; 612-Push groove; 62-Positioning frame; 621-Moving port; 63-Positioning component; 631-Positioning block; 632-Positioning rod; 633-Limit block; 6331-Slope surface; 634-Positioning spring; 64-Connector Components; 641-Connecting spring; 65-Pushing component; 651-First pushing block; 652-Second pushing block; 653-Push rod; 654-Supporting component; 6541-Supporting spring; 6542-Push plate; 655-Contact component; 6551-Supporting block; 6552-Contact block; 7-Pressing engagement mechanism; 71-Adjusting sleeve; 72-Adjusting bolt; 73-Pressing rod; 74-Pressing block; 8-Pressing plate; 81-Synchronizing plate; 82-First pressing block; 83-Connecting frame; 84-Second pressing block; 85-Slide rod; 86-Slide sleeve; 87-Buffer spring. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Example 1

[0034] Please see Figures 1 to 4 An indium phosphide chip packaging device includes a chip fixture 1, a spot welding head 11, a hot welding head 12, a cold welding head 13, a testing mechanism 14, and a conveyor belt 2. In this embodiment, the testing mechanism 14 is an existing mechanism that can test the indium phosphide chip on the packaged chip module, so it will not be described in detail. Multiple support frames 3 are arranged sequentially on the outer side of the conveyor belt 2, and electric push rods 31 are installed on the support frames 3. The output end of the electric push rods 31 is fixedly connected to a connecting plate 4, and the multiple connecting plates 4 respectively support the spot welding head 11, the hot welding head 12, the cold welding head 13, and the testing mechanism 14.

[0035] Please see Figures 4 to 5 and Figures 7 to 11The conveyor belt 2 is a chain plate conveyor belt 21, and multiple fixed blocks 5 are fixedly installed at equal intervals on the chain plate conveyor belt 21. A sealing and positioning mechanism 6 is installed on the side of the fixed block 5 away from the chain plate conveyor belt 21. The sealing and positioning mechanism 6 includes a support plate 61, a positioning frame 62, a positioning element 63, a connecting element 64, and a pushing element 65. The support plate 61 is fixedly installed on the side of the fixed block 5 away from the chain plate conveyor belt 21, and a moving groove 611 is provided on the side of the support plate 61 close to the support frame 3. There are two positioning frames 62. One end of the two positioning frames 62 is slidably connected to the inside of the moving groove 611, and the other end of the two positioning frames 62 extends to the outside of the support plate 61. The connecting element 64 is located inside the moving groove 611. In this embodiment, the positioning frame 62 is U-shaped, and the connecting element 64 is used to connect the two positioning frames 62.

[0036] The positioning frame 62 is provided with a movable port 621, and the positioning component 63 is connected to the movable port 621. The two positioning components 63 position the chip module relative to each other.

[0037] Both sides of the support plate 61 are provided with push grooves 612, and there are two push members 65. One end of the two push members 65 is connected to the two push grooves 612 respectively, and the other end of the push member 65 is connected to the movable frame. When the push member 65 moves to the pressing and engaging mechanism 7, the pressing and engaging mechanism 7 pushes the positioning frame 62 through the push member 65.

[0038] The connector 64 includes a connecting spring 641, which is located inside the moving groove 611, and both ends of the connecting spring 641 are fixedly connected to two positioning brackets 62.

[0039] The positioning component 63 includes a positioning block 631, a positioning rod 632, a limiting block 633, and a positioning spring 634. There are two positioning blocks 631, which slide through the moving opening 621 respectively. The two ends of the positioning spring 634 are fixedly connected to the two positioning blocks 631. The positioning rod 632 is L-shaped and is fixedly connected to the positioning block 631. One end of the positioning rod 632 is fixedly connected to the limiting block 633. The limiting block 633 is used to limit the chip module. The side of the limiting block 633 closest to the chip module is provided with a slope surface 6331.

[0040] In this embodiment, the positioning spring 634 is in a compressed state, so that when the two limiting blocks 633 between the positioning frames 62 are positioning the chip module, the two limiting blocks 633 further abut against the two ends of the chip module under the reverse elastic force of the positioning spring 634. At the same time, due to the setting of the positioning spring 634 and the reverse elastic force of the connecting spring 641 between the two positioning frames 62, chip modules of different lengths and widths can be positioned.

[0041] Please see Figures 9 to 11 The pushing component 65 includes a first pushing block 651, a second pushing block 652, a pushing rod 653, a support member 654, and a contact member 655. The first pushing block 651 is fixedly connected to the positioning frame 62, and the second pushing block 652 is slidably connected to the outside of the first pushing block 651. The sides of the first pushing block 651 and the second pushing block 652 that are close to each other are both set as pushing slopes. The contact member 655 is installed on the side of the second pushing block 652 away from the first pushing block 651. One end of the pushing rod 653 is connected to the second pushing block 652, and the other end of the pushing rod 653 is connected to the support member 654. The support member 654 is connected to the pushing groove 612.

[0042] The support member 654 includes a support spring 6541 and a push plate 6542. The support spring 6541 is located inside the push groove 612. One end of the support spring 6541 is fixedly connected to the push plate 6542, and the other end of the support spring 6541 is fixedly connected to the push plate 6542. The push plate 6542 is L-shaped. One end of the push plate 6542 is slidably connected to the push groove 612, and the other end of the push plate 6542 is fixedly connected to the push rod 653.

[0043] The contact 655 includes a support block 6551 and a contact block 6552. One end of the support block 6551 is fixedly connected to the second push block 652, and the other end of the support block 6551 is fixedly connected to the contact block 6552. The side of the contact block 6552 away from the support block 6551 is arc-shaped.

[0044] Specific implementation process: When packaging the indium phosphide chip of the chip module, the chip module is first placed on the support plate 61 at one end of the chain conveyor belt 21 by a robotic arm. At this time, the four limiting blocks 633 on the support plate 61 limit the chip module through the inclined surface 6331 on them. As the chain conveyor belt 21 is driven, the chain conveyor belt 21, through the fixing block 5 and the support plate 61, drives the chip module on the support plate 61 to the position of the chip fixture 1. The chip fixture 1 places the indium phosphide chip in the chip slot of the chip module. Then, the chip module is intermittently conveyed by the chain conveyor belt 21, so that the chip module passes through the spot welding, hot welding and cold welding positions in sequence for welding and packaging. Then, the chip module after the indium phosphide chip is tested by the testing mechanism 14. After the test is completed, it is conveyed to the pick-up station along with the chain conveyor belt 21, and the robotic arm removes the packaged chip module.

[0045] Please see Figures 3 to 6 The connecting plate 4 is provided with a pressing and mating mechanism 7. Multiple pressing and mating mechanisms 7 cooperate with multiple packaging and positioning mechanisms 6 to enable the spot welding head 11, hot welding head 12, and cold welding head 13 to precisely weld and package the indium phosphide chip on the chip module in sequence.

[0046] Both sides of the connecting plate 4 are provided with connecting ends 41, and an adjustment port 42 is formed between the connecting ends 41 and the connecting plate 4. The pressing and fitting mechanism 7 is connected to the adjustment port 42. The pressing and fitting mechanism 7 includes an adjusting sleeve 71, an adjusting bolt 72, a pressing rod 73 and a pressing block 74. The adjusting sleeve 71 is slidably sleeved on the outside of the connecting end 41, and the adjusting sleeve 71 slides through the adjustment port 42. The side of the adjusting sleeve 71 away from the connecting end 41 is provided with a threaded hole, and the adjusting bolt 72 is threadedly connected to the threaded hole.

[0047] The pressure rod 73 is fixedly installed at the bottom of the adjusting sleeve 71, and the pressure block 74 is fixedly installed at the bottom of the pressure rod 73. The pressure block 74 is wedge-shaped.

[0048] In this embodiment, the adjusting sleeve 71 is slidably sleeved on the outside of the connecting end 41, and simultaneously locked to the connecting end 41 by the adjusting bolt 72. Thus, the position of the adjusting sleeve 71 relative to the connecting end 41 can be adjusted according to the size of the chip module. After adjusting the adjusting sleeve 71, the position of the pressing rod 73 and the pressing block 74 relative to the contact block 6552 can be further adjusted. Thus, according to different sizes of chip modules, when the chip module moves with the support plate 61 to the position of the two pressing blocks 74 at a workstation, the pressing block 74 can adjust its pressing position and pressing force for different sizes of chip modules, further ensuring that chip modules of different sizes can be stably transported and accurately packaged.

[0049] Specific implementation process: Further, when the chip module with the indium phosphide chip is sequentially conveyed to the spot welding head 11, hot welding head 12, cold welding head 13, or testing mechanism 14 along with the chain conveyor belt 21, the chain conveyor belt 21 stops moving. At this time, with the operation of the electric push rod 31, the connecting plate 4 moves down. As the connecting plate 4 moves down, the welding head, hot welding head 12, cold welding head 13, or testing head continues to move down onto the indium phosphide chip, realizing the welding, packaging, or testing between the indium phosphide chip and the chip module.

[0050] As the connecting plate 4 moves downward, the pressing rod 73 drives the pressing blocks 74 to move downward. The two pressing blocks 74 first contact the two contact blocks 6552 on the support plate 61. Since the pressing blocks 74 are wedge-shaped, they continuously push the contact blocks 6552 as the pressing blocks move downward. Simultaneously, the second pushing block 652 moves relative to the first pushing block 651. Because the first pushing block 651 and the second pushing block 652... Since the inclined planes are set to push each other, the two first pushing blocks 651 on the support plate 61 move towards each other. At the same time, the two positioning frames 62 move towards each other. While the two positioning frames 62 move towards each other, the four limiting blocks 633 on the two positioning frames 62 further limit and fix the four corners of the chip module until the soldering head or hot soldering head 12 or cold soldering head 13 or test head stops moving down. Then the chip module completes precise positioning, further ensuring the packaging accuracy of the chip module.

[0051] Example 2

[0052] Please see Figures 4 to 5 and Figures 8 to 9 Example 2 is a further supplement to Example 1. Specifically, a pressing plate 8 is provided on one side of the chip fixture 1. When the chip fixture 1 moves to the groove of the chip module, a synchronization plate 81 is connected to it through the pressing plate 8. A first pressing block 82 is fixedly connected to the bottom of the synchronization plate 81. A connecting frame 83 is fixedly connected to the bottom of the first pressing block 82. A second pressing block 84 is fixedly connected to the other end of the connecting frame 83. Both the first pressing block 82 and the second pressing block 84 are wedge-shaped. Slide rods 85 are fixedly connected to both ends of the bottom of the connecting frame 83. A sliding sleeve 86 is slidably sleeved on the outer side of the bottom of the slide rod 85. Both sliding sleeves 86 are fixedly installed on the support of the conveyor belt 2. A buffer spring 87 is sleeved on the outer side of the slide rod 85. The two ends of the buffer spring 87 are fixedly connected to the connecting frame 83 and the sliding sleeve 86, respectively.

[0053] Furthermore, when the chip fixture 1 clamps the indium phosphide chip from the chip supply stage to the groove of the chip module, the pressing plate 8 contacts the synchronization plate 81. As the chip is placed on the groove by the downward movement of the chip fixture 1, the pressing plate 8 moves downward synchronously and presses the synchronization plate 81. As the synchronization plate 81 moves downward, the first pressing block 82 and the second pressing block 84 move downward synchronously through the connecting frame 83. When the first pressing block 82 and the second pressing block 84 move downward synchronously, they push the two contact blocks 6552, and the two positioning frames 62 move towards each other, further driving the multiple limiting blocks 633 to further limit and fix the chip module, thereby achieving precise placement of the indium phosphide chip on the groove of the chip module.

[0054] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0055] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An indium phosphide chip packaging device, comprising a chip fixture (1), a spot welding head (11), a hot welding head (12), a cold welding head (13), a testing mechanism (14), and a conveyor belt (2), wherein multiple support frames (3) are sequentially arranged on the outer side of the conveyor belt (2), and an electric push rod (31) is mounted on the support frame (3), wherein a connecting plate (4) is fixedly connected to the output end of the electric push rod (31), and the multiple connecting plates (4) respectively support the spot welding head (11), the hot welding head (12), the cold welding head (13), and the testing mechanism (14), characterized in that: The conveyor belt (2) is a chain plate conveyor belt (21), and multiple fixed blocks (5) are fixedly installed at equal intervals on the chain plate conveyor belt (21). A packaging positioning mechanism (6) is installed on the side of the fixed block (5) away from the chain plate conveyor belt (21). A pressing engagement mechanism (7) is provided on the connecting plate (4). Multiple pressing engagement mechanisms (7) cooperate with multiple packaging positioning mechanisms (6) to make the spot welding head (11), hot welding head (12), and cold welding head (13) sequentially and accurately weld and package the indium phosphide chip on the chip module. The packaging positioning mechanism (6) includes a support plate (61), a positioning frame (62), a positioning component (63), a connecting component (64), and a pushing component (65). The support plate (61) is fixedly installed on the side of the fixed block (5) away from the chain conveyor belt (21), and the support plate (61) is provided with a moving groove (611) on the side of the support frame (3). There are two positioning frames (62), one end of the two positioning frames (62) is slidably connected inside the moving groove (611), and the other end of the two positioning frames (62) extends to the outside of the support plate (61). The connecting component (64) is located inside the moving groove (611), and the connecting component (64) is used to connect the two positioning frames (62). The positioning frame (62) is provided with a movable port (621), and the positioning component (63) is connected to the movable port (621). The two positioning components (63) position the chip module relative to each other. Both sides of the support plate (61) are provided with push grooves (612). There are two push members (65). One end of the two push members (65) is connected to the two push grooves (612) respectively, and the other end of the push member (65) is connected to the positioning frame (62). When the push member (65) moves to the pressing engagement mechanism (7), the pressing engagement mechanism (7) pushes the positioning frame (62) through the push member (65). The connector (64) includes a connecting spring (641), which is located inside the moving groove (611), and both ends of the connecting spring (641) are fixedly connected to two positioning brackets (62). The connecting plate (4) has connecting ends (41) on both sides, and an adjustment port (42) is formed between the connecting end (41) and the connecting plate (4). The pressing mechanism (7) is connected to the adjustment port (42). The pressing mechanism (7) includes an adjusting sleeve (71), an adjusting bolt (72), a pressing rod (73), and a pressing block (74). The adjusting sleeve (71) is slidably sleeved on the outside of the connecting end (41), and the adjusting sleeve (71) slides through the adjustment port (42). The side of the adjusting sleeve (71) away from the connecting end (41) is provided with a threaded hole, and the adjusting bolt (72) is threadedly connected to the threaded hole. The pressure rod (73) is fixedly installed at the bottom of the adjusting sleeve (71), and the pressure block (74) is fixedly installed at the bottom of the pressure rod (73).

2. The InP chip package device of claim 1, wherein: The positioning component (63) includes a positioning block (631), a positioning rod (632), a limiting block (633), and a positioning spring (634). There are two positioning blocks (631), which slide through the moving opening (621) respectively. The two ends of the positioning spring (634) are fixedly connected to the two positioning blocks (631). The positioning rod (632) is L-shaped and is fixedly connected to the positioning block (631). One end of the positioning rod (632) is fixedly connected to the limiting block (633). The limiting block (633) is used to limit the chip module.

3. The InP chip package device of claim 2, wherein: The limiting block (633) is set with a ramp surface (6331) on the side near the chip module.

4. The InP chip package device of claim 1, wherein: The pusher (65) includes a first pusher block (651), a second pusher block (652), a pusher rod (653), a support member (654), and a contact member (655). The first pusher block (651) is fixedly connected to the positioning frame (62), and the second pusher block (652) is slidably connected to the outside of the first pusher block (651). The sides of the first pusher block (651) and the second pusher block (652) that are close to each other are both set as push slopes. The contact member (655) is installed on the side of the second pusher block (652) away from the first pusher block (651). One end of the pusher rod (653) is connected to the second pusher block (652), and the other end of the pusher rod (653) is connected to the support member (654). The support member (654) is connected to the push groove (612).

5. The InP chip package device of claim 4, wherein: The support member (654) includes a support spring (6541) and a push plate (6542). The support spring (6541) is located inside the push groove (612). One end of the support spring (6541) is fixedly connected to the push plate (6542). The push plate (6542) is L-shaped. One end of the push plate (6542) is slidably connected to the push groove (612), and the other end of the push plate (6542) is fixedly connected to the push rod (653).

6. The InP chip package device of claim 4, wherein: The contact element (655) includes a support block (6551) and a contact block (6552). One end of the support block (6551) is fixedly connected to the second push block (652), and the other end of the support block (6551) is fixedly connected to the contact block (6552). The side of the contact block (6552) away from the support block (6551) is arc-shaped.

7. The InP chip package device of claim 1, wherein: The pressing block (74) is wedge-shaped.

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