Lining structure for radio frequency electrode cavities and methods of use thereof

Abstract

This invention proposes an inner liner structure for a radio frequency (RF) electrode cavity and its usage method. The inner liner structure includes: several inner liner bodies, all placed within the RF electrode cavity, with adjacent inner liner bodies in contact, and a wiring inlet formed between the last inner liner body and the first inner liner body; each inner liner body is connected to the inner top surface of the RF electrode cavity; several layers of wiring grooves for installing cables or conduits, which are formed on the inner wall of the inner liner bodies and distributed along the height direction of the inner liner bodies; cables are engaged with corresponding wiring grooves, with one end located outside the inner liner structure and the other end located in the cavity enclosed by the inner liner structure and extending towards the electrostatic chuck; conduits are engaged with corresponding wiring grooves, with one end located outside the inner liner structure and the other end located in the cavity enclosed by the inner liner structure and extending towards the electrostatic chuck. This invention ensures that the winding paths within the RF electrode cavity are identical, thereby reducing density and maintaining wafer processing uniformity and yield.

Description

Technical Field

[0001] This invention belongs to the field of wafer manufacturing equipment, and particularly relates to an inner liner structure for a radio frequency electrode cavity and its usage method. Background Technology

[0002] Electrostatic chucks are key pieces of equipment used in semiconductor manufacturing processes to hold and handle wafers. By applying a voltage to the chuck surface, an electrostatic force is created between the chuck and the wafer, causing the wafer to adhere tightly to the chuck.

[0003] The electrostatic chuck has the following functions:

[0004] It features built-in multi-zone heating electrodes and a circulating cooling circuit to maintain a stable temperature for the wafer;

[0005] Electrostatic electrodes are used to generate an electric field that attracts the wafer;

[0006] The helium flow channel on the back of the wafer enhances wafer heat dissipation and provides feedback on wafer adsorption status.

[0007] The ejector pin has a pre-drilled through-hole; the ejector pin is used for wafer transfer.

[0008] Radio frequency electrode.

[0009] like Figure 1 As shown, the back of the electrostatic chuck has multiple interfaces reserved to meet different functional requirements, including: heating electrode power supply interface, heating electrode temperature measurement interface, circulating cooling circuit inlet and outlet interface, DC high voltage input interface, helium interface, pin reserved through hole, and radio frequency feed interface.

[0010] However, the existing technology has the following problems: 1) With a fixed external dimension of the electrostatic chuck, different winding paths will increase the density of cable connections on the back of the electrostatic chuck, thereby increasing the difficulty of wiring and routing during manufacturing and maintenance. 2) Different winding paths may lead to differences in the working performance of the electrostatic chuck, thus affecting the uniformity and yield of wafer processing. Summary of the Invention

[0011] The purpose of this invention is to provide an inner liner structure for a radio frequency electrode cavity and its method of use. This inner liner structure ensures that the winding paths within the radio frequency electrode cavity are identical, thereby reducing density and maintaining wafer processing uniformity and yield. The technical solution adopted is as follows:

[0012] A liner structure for a radio frequency electrode cavity, comprising:

[0013] Several inner liner bodies are placed inside the radio frequency electrode cavity, with adjacent inner liner bodies in contact. An inlet gap is formed between the last inner liner body and the first inner liner body. Each inner liner body is connected to the inner top surface of the radio frequency electrode cavity. All inner liner bodies form an inner liner structure.

[0014] Several layers of wiring channels are used to install cables or pipes. They are opened on the inner wall of the inner lining body and distributed along the height direction of the inner lining body.

[0015] The cable is fitted with the corresponding wiring trough, with one end located outside the inner lining structure and the other end located in the cavity enclosed by the inner lining structure and extending toward the electrostatic chuck; the conduit is fitted with the corresponding wiring trough, with one end located outside the inner lining structure and the other end located in the cavity enclosed by the inner lining structure and extending toward the electrostatic chuck.

[0016] Preferably, the wiring channel does not penetrate the inner lining body.

[0017] Preferably, along the height direction of the inner lining body, several layers of threaded holes are formed on the inner wall of the inner lining body;

[0018] The threaded hole layer includes several threaded holes, each of which is connected to a wire tie seat by a fastener.

[0019] Preferably, the threaded hole does not penetrate the inner liner body.

[0020] Preferably, the lining structure is made of a non-metallic material.

[0021] A method of using an inner liner structure for a radio frequency electrode cavity includes the following steps:

[0022] Step 1: Install the inner liner structure into the radio frequency electrode cavity:

[0023] All the inner liner bodies are pushed sequentially into the grooves formed by the inner wall of the radio frequency electrode cavity, and so that...

[0024] Each inner liner body is placed in close contact with the inner wall of the radio frequency electrode cavity;

[0025] Then, each inner liner body is fixed to the inner top surface of the radio frequency electrode cavity in sequence using fasteners;

[0026] Step 2, winding:

[0027] Cables and conduits enter the inner lining structure through the inlet notch and mate with the wiring trough;

[0028] The cable or conduit has one end located outside the liner structure and extends from the inlet window on the RF electrode cavity to the outside of the RF electrode cavity, and the other end located in the cavity enclosed by the liner structure and extends toward the electrostatic chuck.

[0029] Step 3: Place one end of the cable or conduit in the RF electrode cavity and pass it through the mating plate and electrostatic chuck in sequence;

[0030] Step 4: Install the radio frequency electrode cavity onto the docking plate.

[0031] Compared with the prior art, the advantages of the present invention are:

[0032] 1. The same winding path ensures uniformity and high yield in wafer processing. Specifically, the winding path involves the cable (pipe) engaging with a corresponding wiring slot, with one end located outside the inner liner structure and the other end inside the cavity enclosed by the inner liner structure, extending towards the electrostatic chuck. Operators can follow this winding path for wiring, avoiding the randomness and uncertainty of manual operation. Therefore, the same winding path is used for wafers in different process chambers, maintaining uniformity and high yield in wafer processing.

[0033] 2. The winding paths are the same, which can reduce the density and facilitate maintenance.

[0034] 3. The material of the inner lining structure, the threaded holes, and the wiring grooves all ensure a safe distance between the RF electrode and the inner wall of the RF electrode cavity. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the wiring and tubing on the back of an electrostatic chuck in the prior art;

[0036] Figure 2 A schematic diagram of the liner structure of the radio frequency electrode cavity;

[0037] Figure 3 This is a schematic diagram of the wiring (wiring and piping) of the inner lining structure;

[0038] Figure 4 A schematic diagram of the wiring and tubing inside the radio frequency electrode cavity without an inner liner.

[0039] Figure 5 A schematic diagram of the wiring and tubing inside the radio frequency electrode cavity with an inner liner already installed.

[0040] Figure 6 This is a schematic diagram showing the installation location of the cable tie. Detailed Implementation

[0041] The radio frequency electrode cavity liner structure and its usage method of the present invention will be described in more detail below with reference to the schematic diagrams, which illustrate preferred embodiments of the present invention. It should be understood that those skilled in the art can modify the present invention described herein while still achieving the advantageous effects of the present invention. Therefore, the following description should be understood as being of general knowledge to those skilled in the art and is not intended to limit the present invention.

[0042] A liner structure for a radio frequency electrode cavity, comprising:

[0043] Several inner liner bodies are placed in the radio frequency electrode cavity, and adjacent inner liner bodies are in contact with each other. An inlet gap is formed between the last inner liner body and the first inner liner body. Each inner liner body is connected to the inner top surface of the radio frequency electrode cavity.

[0044] Several layers of wiring channels are used to install cables or pipes. They are opened on the inner wall of the inner lining body and distributed along the height direction of the inner lining body.

[0045] The winding path is as follows: the cable (pipe) is fitted with the corresponding wiring groove, with one end located outside the inner lining structure and the other end located in the cavity enclosed by the inner lining structure and extending towards the electrostatic chuck.

[0046] The lining mechanism adopts a multi-piece structure, which facilitates installation and removal.

[0047] Therefore, since a single semiconductor device has multiple process chambers, operators can follow the aforementioned wiring paths to perform wiring, avoiding the arbitrariness and uncertainty of manual operation. Thus, if the corresponding wiring paths are the same for wafers in different process chambers, the uniformity and yield of wafer processing can be maintained.

[0048] In this embodiment, the "wire" in "incoming line", "winding line", and "wiring trough" refers to a cable or conduit.

[0049] In this embodiment, the wiring groove does not penetrate the inner liner body. Its function is to isolate the inner wall of the radio frequency electrode cavity from the cables and pipes, so as to avoid the radio frequency influence of the cables and the cooling influence of the pipes on the inner wall of the radio frequency electrode cavity.

[0050] Furthermore, such as Figure 5 As shown, the inlet notch is positioned opposite to the inlet window on the RF electrode cavity.

[0051] To prevent cables or conduits from slipping off the inner liner and altering the winding path, threaded holes are provided in the inner liner for mounting cable ties. Specifically:

[0052] Along the height direction of the inner lining body, several layers of threaded holes are opened on the inner wall of the inner lining body.

[0053] The threaded hole layer includes several threaded holes, each of which is secured to a wire tie holder by a fastener, such as... Figure 6 As shown, the wire tie is used to fix the winding path.

[0054] The multi-layered layout of threaded holes can further optimize wiring and conduit routing, and separate electrical, pneumatic, and fiber optic conduits.

[0055] In this embodiment, the threaded hole does not penetrate the inner liner body. Its function is to isolate the inner wall of the radio frequency electrode cavity from the cables and pipes, so as to avoid the radio frequency influence of the cables and the cooling influence of the pipes on the inner wall of the radio frequency electrode cavity.

[0056] In this embodiment, the inner liner structure is a cylindrical barrel-shaped structure with a certain wall thickness, and the inner liner body extends along the inner wall of the radio frequency electrode cavity and fits with the inner wall of the radio frequency electrode cavity.

[0057] For electrostatic chucks without radio frequency electrodes, the liner does not need to consider discharge safety, meaning the liner thickness can be thinner, and the liner can be made into a narrow strip, without having to completely cover the inner wall of the cavity.

[0058] Due to the charged nature of radio frequency electrodes, the electrostatic chuck and the metal components connected to it must maintain a safe distance from surrounding metal components to avoid short circuits and radio frequency discharge, which could affect equipment safety and device lifespan.

[0059] In this embodiment, the inner lining structure is made of non-metallic materials, such as PTFE and PEEK, which have the characteristics of insulation, heat resistance and excellent structural strength.

[0060] Therefore, the inner lining structure is made of non-metallic materials, ensuring a safe distance between the electrostatic chuck and the inner wall of the RF electrode cavity. Figure 1 In this design, the RF electrode cavity, the ejector pin lifting mechanism, the RF feed (rod), and the docking plate are all made of metal.

[0061] In addition, such as Figure 1 As shown in the figure, the rectangular frame is a partition structure, that is, the radio frequency feed (rod) is routed through separate channels from other water, electricity and gas pipes.

[0062] A method of using an inner liner structure for a radio frequency electrode cavity includes the following steps:

[0063] Step 1: Install the inner liner structure into the radio frequency electrode cavity.

[0064] All the inner liner bodies are pushed sequentially into the grooves formed by the inner wall of the radio frequency electrode cavity, and so that...

[0065] Each inner liner body is placed in close contact with the inner wall of the radio frequency electrode cavity;

[0066] Then, each inner liner body is fixed to the inner top surface of the radio frequency electrode cavity in turn using fasteners.

[0067] like Figure 6 The threaded holes on the inner lining body are not shown.

[0068] Therefore, the inner lining mechanism adopts a multi-piece structure, which facilitates installation and removal.

[0069] Step 2, winding.

[0070] Cables and conduits enter the inner lining structure through the inlet notch and mate with the wiring trough.

[0071] The cable or conduit has one end located outside the liner structure and extends from the inlet window on the RF electrode cavity to the outside of the RF electrode cavity, and the other end located in the cavity enclosed by the liner structure and extends toward the electrostatic chuck.

[0072] One part of the cables and conduits enter through the inlet and are wound clockwise, while the other part enters through the inlet and is wound counterclockwise, in order to further reduce the density on the back of the electrostatic chuck.

[0073] The objects (cables and conduits) to be wound clockwise and the objects (cables and conduits) to be wound counterclockwise are both selected in advance by a person.

[0074] Step 3: Place one end of the cable or conduit in the RF electrode cavity and pass it through the mating plate and electrostatic chuck in sequence;

[0075] Step 4: Install the radio frequency electrode cavity onto the docking plate.

[0076] like Figures 4-5 Because only one winding path is used during the winding process, the winding density is reduced, facilitating later maintenance. Furthermore, for the same process chamber, operators can follow the aforementioned winding path for wiring, avoiding the arbitrariness and uncertainty of manual operation. Therefore, the winding path is the same for wafers in different process chambers, thus maintaining the uniformity and yield of wafer processing.

[0077] The above are merely preferred embodiments of the present invention and do not constitute any limitation on the present invention. Any equivalent substitutions or modifications made by those skilled in the art to the technical solutions and content disclosed in the present invention without departing from the scope of the present invention shall be deemed to have remained within the protection scope of the present invention.

Claims

1. A liner structure for a radio frequency electrode cavity, characterized in that, include: Several inner liner bodies are placed inside the radio frequency electrode cavity, with adjacent inner liner bodies in contact. An inlet gap is formed between the last inner liner body and the first inner liner body, and all inner liner bodies form an inner liner structure. Each inner liner body is connected to the inner top surface of the radio frequency electrode cavity. Several layers of wiring channels are used to install cables or pipes. They are opened on the inner wall of the inner lining body and distributed along the height direction of the inner lining body. The cable is fitted with the corresponding wiring trough, with one end located outside the inner lining structure and the other end located in the cavity enclosed by the inner lining structure and extending toward the electrostatic chuck; the conduit is fitted with the corresponding wiring trough, with one end located outside the inner lining structure and the other end located in the cavity enclosed by the inner lining structure and extending toward the electrostatic chuck.

2. The liner structure for the radio frequency electrode cavity according to claim 1, characterized in that, The wiring channel does not penetrate the inner lining body.

3. The liner structure for the radio frequency electrode cavity according to claim 1, characterized in that, Along the height direction of the inner lining body, several layers of threaded holes are opened on the inner wall of the inner lining body. The threaded hole layer includes several threaded holes, each of which is connected to a wire tie seat by a fastener.

4. The liner structure for the radio frequency electrode cavity according to claim 3, characterized in that, The threaded hole does not penetrate the inner liner body.

5. The liner structure for the radio frequency electrode cavity according to claim 1, characterized in that, The inner lining body is made of non-metallic material.

6. A method of using an inner liner structure for a radio frequency electrode cavity, characterized in that, Includes the following steps: Step 1: Install the inner liner structure into the radio frequency electrode cavity: All the inner liner bodies are pushed sequentially into the grooves formed by the inner wall of the radio frequency electrode cavity, and so that... Each inner liner body is placed in close contact with the inner wall of the radio frequency electrode cavity; Then, each inner liner body is fixed to the inner top surface of the radio frequency electrode cavity in sequence using fasteners; Step 2, winding: Cables and conduits enter the inner lining structure through the inlet notch and mate with the wiring trough; The cable or conduit has one end located outside the liner structure and extends from the inlet window on the RF electrode cavity to the outside of the RF electrode cavity, and the other end located in the cavity enclosed by the liner structure and extends toward the electrostatic chuck. Step 3: Place one end of the cable or conduit in the RF electrode cavity and pass it through the mating plate and electrostatic chuck in sequence; Step 4: Install the radio frequency electrode cavity onto the docking plate.

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