Heat dissipation structure, bridge arm, half-bridge module and vehicle

Abstract

The invention relates to a heat dissipation structure, a bridge arm, a half-bridge module and a vehicle, the heat dissipation structure comprises a component and a nozzle, the component is provided with a first inner cavity and a water outlet which communicate with each other, and part of the inner wall of the first inner cavity is a heat exchange surface; the nozzle is arranged in the first inner cavity; and the spraying end of the nozzle faces the heat exchange surface. According to the technical scheme, the jet flow with the high speed can be jetted to the heat exchange face through the nozzle, so that the nozzle conducts impact heat dissipation on the heat exchange face, fluid jetted by the nozzle can take away heat more quickly, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a heat dissipation structure, a bridge arm, a half-bridge module and a vehicle. Background Art

[0002] A half-bridge module is a type of power module. Half-bridge modules can be used in vehicle electronic control systems. For example, power converters and power inverters in hybrid electric vehicles and pure electric vehicles. A half-bridge module is a functional module that encapsulates a chip and its associated circuits. In a half-bridge module, the chip generates heat during operation. When the temperature of the chip rises, the performance of the chip decreases, affecting the operating efficiency and performance reliability of the entire related electronic equipment. Therefore, in the related art, a flow channel is provided in the half-bridge module, and the heat of the chip is removed by the flow of a heat exchange medium in the flow channel, thereby achieving chip cooling, so that the operating temperature of the chip is maintained within an appropriate range.

[0003] However, the heat dissipation method of removing the heat of the chip by the flow of the heat exchange medium in the flow channel has a low heat dissipation efficiency for the power chip. Summary of the Invention

[0004] The embodiments of the present application provide a heat dissipation structure to improve the heat dissipation efficiency of the half-bridge module, so as to at least solve the above-mentioned technical problems.

[0005] In order to achieve the above-mentioned purpose, according to the first aspect of the present application, a heat dissipation structure is provided, which includes a component and a nozzle, the component having a first inner cavity and a water outlet connected to each other, and part of the inner wall of the first inner cavity is a heat exchange surface; the nozzle is arranged in the first inner cavity; wherein the injection end of the nozzle faces the heat exchange surface.

[0006] Optionally, the component also has a second inner cavity and a water inlet that are connected, and the component has a partition that separates the first inner cavity and the second inner cavity, and a first through hole is provided on the partition; wherein the nozzle is provided on the partition, and the internal flow channel of the nozzle is connected to the second inner cavity through the first through hole.

[0007] Optionally, the heat dissipation structure further includes a cover plate, a second through hole is provided on the component, the second through hole is communicated with the second inner cavity, the cover plate is connected to the component and covers the second through hole; wherein the water inlet is provided on the cover plate.

[0008] Optionally, the heat dissipation structure further includes a water inlet pipe, the water inlet pipe is connected to the cover plate, and the water inlet is communicated with the inner hole of the water inlet pipe.

[0009] Optionally, a step groove is provided on the inner wall of the second inner cavity, the step groove is provided away from the partition plate, the step groove has a groove wall parallel to the cover plate, and the edge of the cover plate overlaps the groove wall.

[0010] Optionally, the water inlet is arranged opposite to the partition.

[0011] Optionally, the heat dissipation structure further includes a base plate, the component is provided with an opening, and the opening is connected to the first inner cavity; the base plate is connected to the component and closes the opening to form the first inner cavity, and the surface of the base plate facing the first inner cavity is the heat exchange surface.

[0012] Optionally, there are multiple water outlets, and among the multiple water outlets, at least two water outlets are arranged opposite to each other.

[0013] Optionally, along the spraying direction of the nozzle, the distance between the heat exchange surface and the spraying end of the nozzle is D, which satisfies: 2 mm ≤ D ≤ 5 mm.

[0014] Optionally, the water outlet is arranged on the inner wall of the first inner cavity opposite to the circumferential surface of the nozzle.

[0015] According to the second aspect of the present application, a bridge arm is provided, which includes a substrate, a chipset and the aforementioned heat dissipation structure; the substrate is connected to the side of the bottom plate facing away from the heat exchange surface; the chipset is connected to the side of the substrate facing away from the bottom plate; and the side of the bottom plate facing away from the substrate is connected to the component.

[0016] According to a third aspect of the present application, a half-bridge module is provided, which includes an upper bridge arm and a lower bridge arm; the lower bridge arm is arranged to be spaced apart from the upper bridge arm along a first direction; wherein the upper bridge arm and the lower bridge arm are the aforementioned bridge arms, and the chipset of the upper bridge arm and the chipset of the lower bridge arm are arranged facing each other.

[0017] Optionally, the half-bridge module further includes a heat-conducting column, which is located between the upper bridge arm and the lower bridge arm, and two ends of the heat-conducting column are respectively connected to the substrate of the upper bridge arm and the substrate of the lower bridge arm.

[0018] Optionally, the chipset of the upper bridge arm includes multiple first chips, which are arranged on the substrate of the upper bridge arm; the chipset of the lower bridge arm includes multiple second chips, which are arranged on the substrate of the lower bridge arm; wherein, along the first direction, at least some of the first chips and at least some of the second chips are staggered.

[0019] Optionally, the plurality of first chips are distributed in a matrix, and the plurality of second chips are distributed in a circle; or, the plurality of first chips are distributed in a circle, and the plurality of second chips are distributed in a matrix.

[0020] Optionally, the number of nozzles of the upper bridge arm is consistent with the number of the first chips, and the nozzles of the upper bridge arm correspond one-to-one with the first chips; and / or, the number of nozzles of the lower bridge arm is consistent with the number of the second chips, and the nozzles of the lower bridge arm correspond one-to-one with the second chip.

[0021] According to a fourth aspect of the present application, a vehicle is provided, comprising the aforementioned half-bridge module.

[0022] In the heat dissipation structure of the embodiment of the present application, through the above-mentioned technical solution, a jet with a relatively high speed can be sprayed toward the heat exchange surface through the nozzle, so that the nozzle can impact the heat exchange surface to dissipate heat, thereby enabling the fluid sprayed by the nozzle to take away the heat faster and improve the heat dissipation efficiency.

[0023] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0025] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0026] Figure 1 is a schematic structural diagram of a heat dissipation structure provided in an exemplary embodiment of the present disclosure;

[0027] Figure 2 is a schematic diagram showing the position of the nozzle in the first inner cavity provided in an exemplary embodiment of the present disclosure;

[0028] Figure 3 yes Figure 1 Cross-sectional view of AA;

[0029] Figure 4 is a schematic structural diagram of a bridge arm provided in an exemplary embodiment of the present disclosure;

[0030] Figure 5 yes Figure 4 Cross-sectional view of the middle BB;

[0031] Figure 6 is a schematic structural diagram of a half-bridge module provided in an exemplary embodiment of the present disclosure;

[0032] Figure 7 Schematic diagram of the internal structure of a half-bridge module provided in an exemplary embodiment of the present disclosure.

[0033] Description of reference numerals:

[0034] 1- heat dissipation structure; 11- component; 111- first inner cavity; 112- water outlet; 113- second inner cavity; 114- water inlet; 115- second through hole; 116- step groove; 117- partition; 118- heat exchange surface; 119- first through hole;

[0035] 12-nozzle; 13-cover plate; 14-water inlet pipe;

[0036] 15- bottom plate;

[0037] 2-bridge arm; 21-substrate; 22-chipset;

[0038] 3-half-bridge module; 31-upper bridge arm; 311-first chip; 32-lower bridge arm; 321-second chip; 33-thermal column. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0040] The following combination Figure 1-Figure 7 , a heat dissipation structure 1, a bridge arm 2, a half-bridge module 3 and a vehicle provided in this application are described in detail.

[0041] See also Figures 1 to 3 , Figure 1 is a schematic structural diagram of a heat dissipation structure 1 provided in an exemplary embodiment of the present disclosure, Figure 2 Schematic diagram of the position of the nozzle 12 in the first inner cavity 111 provided in an exemplary embodiment of the present disclosure. Figure 3 yes Figure 1 A cross-sectional view taken along line AA in FIG. An embodiment of the present application provides a heat dissipation structure 1. The heat dissipation structure 1 includes a component 11 and a nozzle 12. The component 11 has a first inner cavity 111 and a water outlet 112 that are interconnected. A portion of the inner wall of the first inner cavity 111 serves as a heat exchange surface 118. The nozzle 12 is disposed in the first inner cavity 111. The spray end of the nozzle 12 faces the heat exchange surface 118.

[0042] It can be understood that when the heat dissipation structure 1 is applied to the half-bridge module 3 , the chip is fixed to one side of the component 11 through the substrate 21 , and the spraying end of the nozzle 12 faces the chip.

[0043] It can be understood that the water pump provides pressurized fluid to the nozzle 12 through the pipeline, causing the nozzle 12 to spray the fluid at a relatively high velocity toward the slot of the first inner cavity 111. This causes the fluid to impact the heat exchange surface 118 of the base plate 15 at a certain velocity, thereby absorbing the heat generated by the chip and transferred to the base plate 15. After absorbing the heat, the fluid is discharged through the water outlet 112. The discharged fluid can be cooled by the temperature management device before being delivered to the nozzle 12 by the water pump.

[0044] The water pump may be directly connected to the internal flow channel of the nozzle 12 through a pipe. Alternatively, a cavity for storing fluid may be formed on the component 11, and the output port of the water pump may be connected to the internal flow channel of the nozzle 12 through the pipe and the cavity in turn.

[0045] Specifically, the jet formed by the fluid ejected by the nozzle 12 is aimed at the portion of the inner wall opposite to the chip, so that the jet hits the portion of the inner wall with a higher temperature at a higher speed. In this way, a temperature boundary layer can be formed at the portion of the inner wall hit by the jet, and the temperature boundary layer has a large temperature gradient (i.e., there is a large temperature difference between the portion of the bottom plate 15 hit by the jet and the rest of the inner wall), an axial velocity gradient (i.e., the velocity of the jet hitting the temperature boundary layer is high, resulting in a velocity difference relative to the rest of the inner wall), and a pressure gradient (i.e., the pressure of the jet hitting the temperature boundary layer is high, resulting in a pressure difference relative to the rest of the inner wall). In this way, a larger local heat transfer coefficient can be generated to obtain higher heat transfer performance, thereby improving heat transfer efficiency.

[0046] It can be understood that the greater the speed of the jet formed by the nozzle 12 spraying the fluid, the greater the pressure on the heat exchange surface impacted by the fluid. Correspondingly, the greater the flow path speed after the fluid contacts the inner wall, and the faster the heat in the contact area between the inner wall and the fluid will be taken away by the fluid.

[0047] In this embodiment, through the above scheme, a jet with a relatively high velocity can be sprayed toward the heat exchange surface 118 through the nozzle 12, so that the nozzle 12 can impact the heat exchange surface 118 to dissipate heat, thereby enabling the fluid sprayed by the nozzle 12 to take away the heat faster and improve the heat dissipation efficiency.

[0048] In addition, by providing the nozzle 12, the fluid can be directly delivered to each heat dissipation location to shorten the flow.

[0049] Furthermore, by providing the nozzle 12, a nozzle 12 can be configured for each heat dissipation location to improve the consistency of heat dissipation efficiency of each heat dissipation location, thereby improving the consistency of the operating temperature of each chip and thus improving the performance consistency of each chip.

[0050] See also Figure 3 In some embodiments, component 11 further comprises a second inner cavity 113 and a water inlet 114 that communicate with each other. Component 11 comprises a partition 117 that separates first inner cavity 111 from second inner cavity 113. Partition 117 is provided with a first through-hole 119. The nozzle 12 is disposed on partition 117. The internal flow channel of nozzle 12 communicates with the second inner cavity 113 via the first through-hole 119.

[0051] It can be understood that the partition 117 is located between the first inner cavity 111 and the second inner cavity 113 .

[0052] It can be understood that the output port of the water pump is connected to the second inner cavity 113 through the pipeline and the water inlet 114 , so that the fluid is delivered to the internal flow channel of the nozzle 12 through the second inner cavity 113 .

[0053] In this embodiment, by setting up the second inner cavity 113, when the output pressure of the water pump fluctuates, the liquid stored in the second inner cavity 113 can mitigate the impact of the pressure fluctuation on the fluid sprayed by the nozzle 12, thereby improving the pressure stability of the fluid sprayed by the nozzle 12.

[0054] In addition, when the heat dissipation structure 1 is equipped with multiple nozzles 12 , multiple first through holes 119 may be provided to simultaneously provide fluid to the multiple nozzles 12 through one second inner cavity 113 , thereby reducing the difficulty of arranging the paths of the multiple nozzles 12 .

[0055] See also Figure 1 and Figure 3 In some embodiments, the heat dissipation structure 1 further includes a cover plate 13 . A second through hole 115 is provided on the component 11 . The second through hole 115 communicates with the second inner cavity 113 . The cover plate 13 is connected to the component 11 and covers the second through hole 115 . A water inlet 114 is provided on the cover plate 13 .

[0056] It can be understood that the periphery of the cover plate 13 is sealed to the component 11 to seal the periphery of the second through hole 115 .

[0057] In this embodiment, the above configuration can improve the operability of processing the second inner cavity 113 and reduce the manufacturing cost and processing efficiency of the heat dissipation structure 1 .

[0058] See also Figure 1 and Figure 3 In some embodiments, the heat dissipation structure 1 further includes a water inlet pipe 14 . The water inlet pipe 14 is connected to the cover plate 13 . The water inlet 114 is communicated with the inner hole of the water inlet pipe 14 .

[0059] It can be understood that the water pump is connected to the water inlet pipe 14 through a pipeline.

[0060] In this embodiment, by providing the water inlet pipe 14, the matching area of the pipeline connected thereto can be increased, thereby improving the reliability and operability of the connection between the heat dissipation structure 1 and the pipeline.

[0061] See also Figure 3In some embodiments, a stepped groove 116 is provided on the inner wall of the second inner cavity 113. The stepped groove 116 is provided away from the partition 117. The stepped groove 116 has groove walls that are parallel to the cover plate 13. The edge of the cover plate 13 overlaps the groove walls. In this way, the mating surface area between the component 11 and the cover plate 13 can be increased, thereby improving the reliability of the connection between the component 11 and the cover plate 13. In addition, the stepped groove 116 can also be used to locate the installation position of the cover plate 13, thereby improving the ease of installation of the cover plate 13.

[0062] Illustratively, the surface of the cover plate 13 facing away from the second inner cavity 113 is flush with the surface of the component 11 penetrated by the second through hole 115 . This can improve the structural regularity of the heat dissipation structure 1 and facilitate assembly of the heat dissipation structure 1 with other components.

[0063] See also Figure 3 In some embodiments, the water inlet 114 is disposed opposite the partition 117. This allows the distance between the multiple nozzles 12 mounted on the partition 117 and the water inlet 114 to be shorter, thereby improving the consistency of the spray pressure of the multiple nozzles 12 and, consequently, improving the consistency of the heat dissipation efficiency of the multiple chips.

[0064] See also Figure 3 In some embodiments, the second inner cavity 113 and the first inner cavity 111 are arranged sequentially along the spray direction of the nozzle 12. This improves the compactness of the internal structure of the component 11. Furthermore, when the heat dissipation component 11 is used in the half-bridge module 3, the component 11 has a larger layout space in the spray direction of the nozzle 12. Thus, arranging the second inner cavity 113 and the first inner cavity 111 sequentially along the spray direction of the nozzle 12 can reduce the design difficulty of the component 11.

[0065] See also Figure 3 In some embodiments, the heat dissipation structure 1 further includes a base plate 15. The component 11 is provided with an opening. The opening is in communication with the first inner cavity 111. The base plate 15 is connected to the component 11 and closes the opening to form the first inner cavity 111. The surface of the base plate 15 facing the first inner cavity 111 is a heat exchange surface 118.

[0066] It can be understood that the substrate 21 is fixed to the side of the bottom plate 15 away from the first inner cavity 111. The nozzle 12 sprays fluid toward the portion of the bottom plate 15 corresponding to the chip.

[0067] It can be understood that the periphery of the bottom plate 15 is sealed to the component 11 to seal the periphery of the opening.

[0068] In this embodiment, the above configuration can improve the operability of processing the first inner cavity 111 and reduce the manufacturing cost and processing efficiency of the heat dissipation structure 1.

[0069] See also Figure 2In some embodiments, there are multiple water outlets 112. Among the multiple water outlets 112, at least two water outlets 112 are arranged opposite to each other. In this way, the drainage efficiency can be improved, which is conducive to improving the heat dissipation efficiency of the heat dissipation structure 1.

[0070] See also Figure 3 In some embodiments, along the injection direction of the nozzle 12 , the distance between the heat exchange surface 118 and the injection end of the nozzle 12 is D, which satisfies: 2 mm ≤ D ≤ 5 mm.

[0071] It will be understood that the spacing D includes but is not limited to 2mm, 2.2mm, 2.4mm, 2.6mm, 2.8mm, 3mm, 3.2mm, 3.4mm, 3.6mm, 3.8mm, 4mm, 4.2mm, 4.4mm, 4.6mm, 4.8mm, and 5mm.

[0072] For example, the height of the nozzle 12 is 6 mm, the depth of the first inner cavity 111 is 9 mm, and the distance between the plane where the notch of the first inner cavity 111 is located and the injection end of the nozzle 12 is 3 mm.

[0073] In this embodiment, through the above-mentioned limitation, on the one hand, it is possible to avoid the spacing D being too large, which would result in a larger size of the heat dissipation structure 1, thereby improving the compactness of the heat dissipation structure 1; on the other hand, it is possible to avoid the spacing D being too small, which would affect the flow of the fluid sprayed onto the base plate 15, thereby facilitating the improvement of the smoothness of the fluid flow.

[0074] See also Figure 2 In some embodiments, the water outlet 112 is disposed on the inner wall of the first inner cavity 111 opposite to the circumferential surface of the nozzle 12 .

[0075] Specifically, the nozzle 12 is located on the inner wall of the first inner cavity 111 close to the second inner cavity 113 .

[0076] In this way, the mutual interference between the fluid sprayed by the nozzle 12 and the fluid discharged from the water outlet 112 can be reduced, so as to facilitate the smoothness of the fluid sprayed by the nozzle 12 and the smoothness of the fluid discharged from the water outlet.

[0077] In one embodiment, the water inlet 114 has a circular cross-section with a diameter of 15 mm. Correspondingly, the inner diameter of the water inlet pipe 14 is 15 mm, and the outer diameter of the water inlet pipe 14 is 18 mm. The distance between the opposing surfaces of the cover plate 13 and the partition plate 117 is 6 mm, that is, the dimension of the second inner cavity 113 in the spraying direction of the nozzle 12 is 6 mm. The inner diameter of the nozzle 12 is 1.2 mm, and the outer diameter is 2.2 mm. The diameter of the water outlet 112 is 11 mm. The height of the nozzle 12 is 6 mm, and the depth of the first inner cavity 111 is 9 mm.

[0078] It is understood that the diameter of the water outlet 112 is greater than the depth of the first inner cavity 111. Therefore, the cross-section of the water outlet 112 is semicircular or a superior sector. A superior sector is a closed shape composed of a superior arc and a straight line. A superior arc is an arc with a central angle greater than 180° and less than 360°.

[0079] See also Figure 4 and Figure 5 , Figure 4 is a schematic structural diagram of a bridge arm 2 provided in an exemplary embodiment of the present disclosure, Figure 5 yes Figure 4 Cross-sectional view of BB in FIG. Accordingly, an embodiment of the present application further provides a bridge arm 2. The bridge arm 2 includes a substrate 21, a chipset 22, and the aforementioned heat dissipation structure 1. The substrate 21 is connected to the side of the bottom plate 15 facing away from the heat exchange surface 118. The chipset 22 is connected to the side of the substrate 21 facing away from the bottom plate 15. The side of the bottom plate 15 facing away from the substrate 21 is connected to the component 11.

[0080] For example, the base plate 15 may be at least partially embedded in the component 11 .

[0081] Specifically, the bottom plate 15 is welded to the base plate 21. The bottom plate 15 can be connected to the base plate 21 by vacuum welding, brazing, vapor phase welding, thermal conductive silicone grease, or other welding methods.

[0082] Exemplarily, the substrate 21 is sintered and connected to the chip through silver sintering or other solders such as copper, gold, and tin.

[0083] It can be understood that the bridge arm 2 includes the above-mentioned heat dissipation structure 1. Correspondingly, the bridge arm 2 has all the beneficial effects of the above-mentioned heat dissipation structure 1, which will not be described in detail in this disclosure.

[0084] See also Figure 6 and Figure 7 , Figure 6 is a schematic structural diagram of a half-bridge module 3 provided in an exemplary embodiment of the present disclosure, Figure 7 is a schematic diagram of the internal structure of a half-bridge module 3 provided in an exemplary embodiment of the present disclosure. Accordingly, embodiments of the present application also provide a half-bridge module 3. The half-bridge module 3 includes an upper bridge arm 31 and a lower bridge arm 32. The lower bridge arm 32 is spaced apart from the upper bridge arm 31 along a first direction. The upper bridge arm 31 and the lower bridge arm 32 are the aforementioned bridge arms 2. The chipset 22 of the upper bridge arm 31 and the chipset 22 of the lower bridge arm 32 are arranged facing each other.

[0085] It can be understood that the chipset 22 of the upper bridge arm 31 is electrically connected to the chipset 22 of the lower bridge arm 32. The chipset 22 of the upper bridge arm 31 and the chipset 22 of the lower bridge arm 32 can be connected in series or in parallel.

[0086] Exemplarily, the gap between the upper bridge arm 31 and the lower bridge arm 32 is filled with an insulating material, which includes but is not limited to silicone gel and epoxy resin.

[0087] Exemplarily, the substrate 21 may be a planar ceramic substrate, such as a thin film ceramic substrate (TFC), a thick film printed ceramic substrate (TPC), a directly bonded copper ceramic substrate (DBC), a directly deposited aluminum ceramic substrate (DBD), a directly electroplated copper ceramic substrate (DPC), an active metal welding ceramic substrate (DMB), a directly sputtered copper ceramic substrate (DSC) and a laser activated metal ceramic substrate (LDM), etc.

[0088] In this embodiment, by employing the bridge arm 2 provided in some embodiments of the present application, a high-velocity jet can be ejected from nozzle 12 toward the portion of base plate 15 corresponding to the chip, creating jet impingement heat dissipation. This allows the fluid ejected from nozzle 12 to more quickly remove heat from the chip, improving heat dissipation efficiency. This reduces the temperature gradient between chips and increases the output power of half-bridge module 3.

[0089] It can be understood that the half-bridge module 3 includes the above-mentioned bridge arm 2. Correspondingly, the half-bridge module 3 has all the beneficial effects of the above-mentioned bridge arm 2, which will not be described in detail in this disclosure.

[0090] In addition, in actual applications, when the half-bridge module 3 is applied to a three-phase circuit, the structure of the half-bridge module 3 provided in this embodiment can be configured for each phase.

[0091] See also Figure 6 and Figure 7 In some embodiments, the half-bridge module 3 further includes a heat-conducting column 33. The heat-conducting column 33 is located between the upper bridge arm 31 and the lower bridge arm 32. The two ends of the heat-conducting column 33 are respectively connected to the substrate 21 of the upper bridge arm 31 and the substrate 21 of the lower bridge arm 32.

[0092] It can be understood that the upper bridge arm 31 can be supported above the lower bridge arm 32 through the heat conducting column 33 .

[0093] For example, the heat conducting pillar 33 may be made of a metal material such as copper or aluminum, or an alloy material.

[0094] In this embodiment, by providing the heat-conducting pillars 33 , heat can be dissipated through the heat-conducting pillars 33 , thereby improving the heat dissipation efficiency of the chip and enhancing the heat dissipation capability of the half-bridge module 3 .

[0095] In some embodiments, the chipset 22 of the upper bridge arm 31 includes a plurality of first chips 311. The plurality of first chips 311 are disposed on the substrate 21 of the upper bridge arm 31. The chipset 22 of the lower bridge arm 32 includes a plurality of second chips 321. The plurality of second chips 321 are disposed on the substrate 21 of the lower bridge arm 32. In this manner, along the first direction, at least some of the first chips 311 and at least some of the second chips 321 are staggered. In this manner, the first chips 311 of the upper bridge arm 31 and the second chips 321 of the lower bridge arm 32 are staggered, which can reduce thermal coupling between the first chips 311 of the upper bridge arm 31 and the second chips 321 of the lower bridge arm 32, thereby improving the reliability of the first chips 311 and the second chips 321.

[0096] The following embodiments may be used for staggered arrangement of the first chips 311 of the upper bridge arm 31 and the second chips 321 of the lower bridge arm 32. In some embodiments, the plurality of first chips 311 are distributed in a matrix, and the plurality of second chips 321 are distributed in a circumference.

[0097] The following embodiments may also be used for staggered arrangement of the first chips 311 of the upper bridge arm 31 and the second chips 321 of the lower bridge arm 32. In other embodiments, the plurality of first chips 311 are distributed in a circumferential manner, and the plurality of second chips 321 are distributed in a matrix manner.

[0098] The two staggered arrangements of the first chip 311 of the upper bridge arm 31 and the second chip 321 of the lower bridge arm 32 can both arrange the first chip 311 and the second chip 321 neatly, thereby facilitating regular chip installation and improving assembly efficiency.

[0099] In some embodiments, the number of nozzles 12 in the upper bridge arm 31 is the same as the number of first chips 311, and the nozzles 12 in the upper bridge arm 31 correspond one-to-one to the first chips 311. In this way, a jet of impingement heat dissipation can be configured for each first chip 311 to improve the operating temperature of each chip, thereby enhancing the operating reliability and efficiency of the half-bridge module 3.

[0100] In some embodiments, the number of nozzles 12 in the lower bridge arm 32 is the same as the number of second chips 321, and the nozzles 12 in the lower bridge arm 32 correspond one-to-one to the second chips 321. In this way, a jet of impingement heat dissipation can be configured for each second chip 321 to improve the operating temperature of each second chip, thereby enhancing the operating reliability and efficiency of the half-bridge module 3.

[0101] Accordingly, an embodiment of the present application further provides a vehicle, which includes the aforementioned half-bridge module 3 .

[0102] The vehicle may be a fuel vehicle, a plug-in hybrid vehicle, a new energy vehicle, etc., and this disclosure does not make any specific limitations on this.

[0103] It can be understood that the vehicle includes the above-mentioned half-bridge module 3, and correspondingly, the vehicle has all the beneficial effects of the above-mentioned half-bridge module 3, which will not be described in detail in this disclosure.

[0104] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0105] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0106] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0107] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A heat dissipation structure (1), characterized in that: include: The component (11) has a first inner cavity (111) and a water outlet (112) that are connected to each other, and a portion of the inner wall of the first inner cavity (111) is a heat exchange surface (118); and a nozzle (12) disposed in the first inner cavity (111); Wherein, the spraying end of the nozzle (12) faces the heat exchange surface (118).

2. The heat dissipation structure (1) according to claim 1, characterized in that: The component (11) further comprises a second inner cavity (113) and a water inlet (114) that are connected to each other. The component (111) comprises a partition (117) that separates the first inner cavity (111) from the second inner cavity (113). A first through hole (119) is provided on the partition (117). The nozzle (12) is arranged on the partition (117), and the internal flow channel of the nozzle (12) is connected to the second inner cavity (113) through the first through hole (119).

3. The heat dissipation structure (1) according to claim 2, characterized in that: The heat dissipation structure (1) further comprises a cover plate (13); a second through hole (115) is provided on the component (11); the second through hole (115) is communicated with the second inner cavity (113); the cover plate (13) is connected to the component (11) and covers the second through hole (115); Wherein, the water inlet (114) is arranged on the cover plate (13).

4. The heat dissipation structure (1) according to claim 3, characterized in that: The heat dissipation structure (1) further comprises a water inlet pipe (14), the water inlet pipe (14) being connected to the cover plate (13), and the water inlet (114) being in communication with the inner hole of the water inlet pipe (14).

5. The heat dissipation structure (1) according to claim 3 or 4, characterized in that: A step groove (116) is provided on the inner wall of the second inner cavity (113), and the step groove (116) is provided away from the partition (117). The step groove (117) has a groove wall parallel to the cover plate (13), and the edge of the cover plate (13) overlaps the groove wall.

6. The heat dissipation structure (1) according to any one of claims 2 to 4, characterized in that: The water inlet (114) is arranged opposite to the partition (117).

7. The heat dissipation structure (1) according to any one of claims 1 to 5, characterized in that: The heat dissipation structure (1) further includes a base plate (15); the component (11) is provided with an opening, and the opening is communicated with the first inner cavity (111); the base plate (15) is connected to the component (11) and closes the opening to form the first inner cavity (111); the surface of the base plate (15) facing the first inner cavity (111) is the heat exchange surface (118).

8. The heat dissipation structure (1) according to any one of claims 1 to 5, characterized in that: There are a plurality of water outlets (112), and among the plurality of water outlets (112), at least two of the water outlets (112) are arranged opposite to each other.

9. The heat dissipation structure (1) according to any one of claims 1 to 5, characterized in that: Along the spraying direction of the nozzle (12), the distance D between the heat exchange surface (118) and the spraying end of the nozzle (12) satisfies: 2mm≤D≤5mm.

10. The heat dissipation structure (1) according to any one of claims 1 to 5, characterized in that: The water outlet (112) is arranged on the inner wall of the first inner cavity (111) opposite to the circumferential surface of the nozzle (12).

11. A bridge arm (2), characterized in that: include: a base plate (21) connected to a side of the bottom plate (15) facing away from the heat exchange surface (118); a chipset (22) connected to a side of the substrate (21) facing away from the bottom plate (15); And, in the heat dissipation structure (1) according to any one of claims 1 to 10, a side of the bottom plate (15) facing away from the substrate (21) is connected to the component (11).

12. A half-bridge module (3), characterized in that: include: Upper bridge arm (31); and a lower bridge arm (32) spaced apart from the upper bridge arm (31) along a first direction; The upper bridge arm (31) and the lower bridge arm (32) are the bridge arm (2) described in claim 9, and the chipset (22) of the upper bridge arm (31) and the chipset (22) of the lower bridge arm (32) are arranged facing each other.

13. The half-bridge module (3) according to claim 12, characterized in that The half-bridge module (3) further comprises a heat-conducting column (33), the heat-conducting column (33) being located between the upper bridge arm (31) and the lower bridge arm (32), and the two ends of the heat-conducting column (33) being respectively connected to the substrate (21) of the upper bridge arm (31) and the substrate (21) of the lower bridge arm (32).

14. The half-bridge module (3) according to claim 12, characterized in that The chipset (22) of the upper bridge arm (31) comprises a plurality of first chips (311), and the plurality of first chips (311) are arranged on the substrate (21) of the upper bridge arm (31); The chipset (22) of the lower bridge arm (32) comprises a plurality of second chips (321), and the plurality of second chips (321) are arranged on the substrate (21) of the lower bridge arm (32); Wherein, along the first direction, at least part of the first chip (311) and at least part of the second chip (321) are staggered.

15. The half-bridge module (3) according to claim 14, characterized in that The plurality of first chips (311) are distributed in a matrix, and the plurality of second chips (321) are distributed in a circumference; Alternatively, the plurality of first chips (311) are distributed in a circumferential manner, and the plurality of second chips (321) are distributed in a matrix manner.

16. The half-bridge module (3) according to claim 14, characterized in that The number of the nozzles (12) of the upper bridge arm (31) is consistent with the number of the first chips (311), and the nozzles (12) of the upper bridge arm (31) correspond to the first chips (311) in a one-to-one manner; And / or, the number of the nozzles (12) of the lower bridge arm (32) is consistent with the number of the second chips (321), and the nozzles (12) of the lower bridge arm (32) correspond to the second chips (321) one by one.

17. A vehicle, characterized in that: Comprising the half-bridge module (3) according to any one of claims 12 to 16.

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