Light emitting device

Abstract

Provided is a light-emitting device in which a plurality of light-emitting elements arranged in a row are electrically connected by being divided into two or more groups that can be independently driven, respectively. The present invention is provided with: a substrate having a mounting surface including an arrangement region, a plurality of first wirings, and a plurality of second wirings; a plurality of light-emitting elements including one or more first, second, and third light-emitting elements and arranged in two rows and N columns (N > = 2) in the arrangement region; one or more relay means including one or more first relay means disposed in an inter-row region of the plurality of light-emitting elements disposed in two rows and N columns within the arrangement region; a plurality of first light-emitting element wirings which connect one or a plurality of first light-emitting elements in series and which include wirings joined to the first relay member; a plurality of second light-emitting element wirings connecting one or a plurality of second light-emitting elements in series; and a plurality of third light-emitting element wirings connecting one or a plurality of third light-emitting elements in series.

Description

[0001] This application is a divisional application of the invention patent application with the application date of January 21, 2022, application number 202210071337.6, and invention name “Light-emitting device”. Technical Field

[0002] The present invention relates to a light emitting device. Background Art

[0003] Patent Document 1 discloses a light-emitting device in which a relay component is disposed between a laser element and a lead terminal. Electrical wires for electrically connecting the laser element and the lead terminal are connected to the relay component, thereby achieving electrical connection via the relay component. Patent Document 1 also discloses an embodiment in which multiple laser elements are arranged in a matrix, with the multiple laser elements arranged in a row connected in series, enabling the multiple laser elements to be driven independently in each row.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: (Japan) Patent Application Laid-Open No. 2018-190750 Summary of the Invention

[0007] Technical problem to be solved by the invention

[0008] Provided is a light emitting device in which a plurality of light emitting elements arranged in a row are divided into two or more groups that can be driven independently and electrically connected.

[0009] Technical solutions to technical problems

[0010] The light-emitting device disclosed in the embodiment comprises: a base having a mounting surface including a configuration area, a plurality of first wirings arranged at positions away from the configuration area in a first direction, and a plurality of second wirings arranged at positions away from the configuration area in a direction opposite to the first direction; a plurality of light-emitting elements including one or more first light-emitting elements, one or more second light-emitting elements, and one or more third light-emitting elements, which are arranged in two rows and N columns (N≥2) within the configuration area and each have a light exit point above the mounting surface; one or more relay components including one or more first relay components, which are arranged in the configuration area in an area between the rows of the plurality of light-emitting elements arranged in two rows and N columns; a plurality of wirings for the first light-emitting elements, which connect the one or more first light-emitting elements in series to two wirings of the plurality of first wirings and the plurality of second wirings; a plurality of wirings for the second light-emitting elements Wiring, which connects the one or more second light-emitting elements in series to two of the multiple first wirings and the multiple second wirings; multiple third light-emitting element wiring, which connects the one or more third light-emitting elements in series to two of the multiple first wirings and the multiple second wirings; the wiring of at least one of the two wirings connecting the one or more first light-emitting elements in series is not joined to the second light-emitting element wiring and the third light-emitting element wiring, the wiring of at least one of the two wirings connecting the one or more second light-emitting elements in series is not joined to the first light-emitting element wiring and the third light-emitting element wiring, the wiring of at least one of the two wirings connecting the one or more third light-emitting elements in series is not joined to the first light-emitting element wiring and the second light-emitting element wiring, and the multiple first light-emitting element wirings include wiring joined to the first relay component.

[0011] Effects of the Invention

[0012] According to the present invention, a light emitting device can be provided in which a plurality of light emitting elements arranged in a row are divided into two or more groups that can be driven independently and electrically connected. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a perspective view of a light emitting device according to each embodiment.

[0014] Figure 2 It is a top view of the light emitting device according to each embodiment.

[0015] Figure 3 Some components are omitted. Figure 2 A cross-sectional view of the light-emitting device taken along line III-III.

[0016] Figure 4This is a plan view for explaining the wiring state of the light emitting device according to the first embodiment.

[0017] Figure 5 This is a plan view for explaining an example of the definition of the inter-row area, the intra-row area, and the extra-row area in the light emitting device of each embodiment.

[0018] Figure 6 This is a plan view for explaining a wiring state of a light emitting device according to a first modification of the first embodiment.

[0019] Figure 7 This is a plan view for explaining a wiring state of a light emitting device according to a second modification of the first embodiment.

[0020] Figure 8 This is a plan view for explaining a wiring state of a light emitting device according to a third modification of the first embodiment.

[0021] Figure 9 This is a plan view for explaining a wiring state of a light emitting device according to a fourth modified example of the first embodiment.

[0022] Figure 10 It is a plan view for explaining the wiring state of the light emitting device according to the second embodiment.

[0023] Figure 11 It is a plan view for explaining the wiring state of the light emitting device according to the first modified example of the second embodiment.

[0024] Figure 12 This is a plan view for explaining a wiring state of a light emitting device according to a second modification of the second embodiment.

[0025] Figure 13 This is a schematic diagram of a light-emitting element according to a third embodiment.

[0026] Figure 14A This is a plan view for explaining an example of conventional wiring for the light emitting element of the third embodiment.

[0027] Figure 14B It is a plan view for explaining another example of conventional wiring for the light emitting element of the third embodiment.

[0028] Figure 15A This is a plan view for explaining an example of wiring with respect to a light-emitting element in the light-emitting device according to the third embodiment.

[0029] Figure 15BThis is a plan view for explaining another example of wiring of the light-emitting element in the light-emitting device according to the third embodiment.

[0030] Figure 15C This is a plan view for explaining another example of wiring of the light-emitting element in the light-emitting device according to the third embodiment.

[0031] Figure 15D This is a plan view for explaining another example of wiring of the light-emitting element in the light-emitting device according to the third embodiment.

[0032] Figure 15E This is a plan view for explaining another example of wiring of the light-emitting element in the light-emitting device according to the third embodiment.

[0033] Figure 15F This is a plan view for explaining another example of wiring of the light-emitting element in the light-emitting device according to the third embodiment.

[0034] Figure 16A Yes Figure 14A 、 Figure 14B 、 Figure 15A and Figure 15B This figure compares the temperature characteristics of light output in wiring examples.

[0035] Figure 16B Yes Figure 14A 、 Figure 14B 、 Figure 15A and Figure 15B This figure compares the temperature characteristics of the forward voltage in an example of wiring.

[0036] Figure 16C Yes Figure 15B 、 Figure 15C and Figure 15D This figure compares the temperature characteristics of the forward voltage in an example of wiring.

[0037] Figure 16D Yes Figure 15A 、 Figure 15E and Figure 15F This figure compares the temperature characteristics of the forward voltage in an example of wiring.

[0038] Description of Reference Numerals

[0039] 1, 2, 3 light-emitting device; 10 substrate; 12 base; 12a convex portion; 14 side wall portion; 16 wiring; 161 first wiring; 162 second wiring; 20 light-emitting element; 20A first light-emitting element; 20B second light-emitting element; 20C third light-emitting element; 21 light exit point; 21A first light exit point; 21B second light exit point; 22 waveguide; 22A first waveguide; 22B second waveguide; 30 base; 40 relay component; 40A first relay component; 40B second relay component; 40C third relay component; 40D fourth relay component; 50 reflecting component; 60 wiring; 60A wiring for the first light-emitting element; 60B wiring for the second light-emitting element; 60C wiring for the third light-emitting element; 70 sealing component; 80 lens component; A1 inter-row area; A2 in-row area; A3 out-of-row area. DETAILED DESCRIPTION

[0040] In this specification and claims, polygons such as triangles and quadrilaterals are also referred to as polygons, including those with corners that have been rounded, chamfered, chamfered, or rounded. Furthermore, this term is not limited to corners (ends of sides); shapes with processed edges in the middle of the sides are also considered polygons. In other words, shapes that retain the basic polygonal form but undergo partial processing are included in the definition of "polygon" as described in this specification and claims.

[0041] Furthermore, this is not limited to polygons; the same applies to words that represent specific shapes, such as trapezoids, circles, and concave-convex shapes. Furthermore, the same applies when dealing with the sides that form that shape. In other words, even if processing is performed on a corner or the middle of a side, the interpretation of "side" includes the processed portion. It should be noted that when distinguishing a "polygon" or "side" that has not been partially processed from a processed shape, the term "strict" is added, for example, in the description of a "strict quadrilateral."

[0042] Furthermore, in this specification or claims, descriptions such as up and down, left and right, front and back, front and back, near the front, and back side merely state the relationships of relative positions, orientations, directions, etc., which may be inconsistent with the relationships during use.

[0043] In addition, in some drawings, arrows are used to indicate directions such as the X direction, the Y direction, and the Z direction. The directions of these arrows correspond to each other in a plurality of drawings of the same embodiment.

[0044] Furthermore, in this specification, when describing components, etc., the term "component" or "portion" may be used. A "component" refers to an object that is physically treated as a single entity. An object that is physically treated as a single entity is one that can be treated as a single component during the manufacturing process. On the other hand, a "portion" may refer to an object that is not physically treated as a single entity. For example, "portion" is used to refer to a portion of a component.

[0045] It should be noted that the distinction between "component" and "portion" described above is not intended to limit the claims based on the doctrine of equivalents. In other words, even if a component is described as a "component" in a claim, the applicant does not consider that treating the component as a single physical entity is an essential condition for the application of the present invention based solely on this description.

[0046] Furthermore, in this specification or the claims, when multiple components are present and are distinguished, the components may be preceded by "first" or "second" to distinguish them. Furthermore, the objects distinguished in this specification and the claims may differ. Therefore, even if the claims describe a component with the same reference numerals as those in this specification, the objects specified by the component may differ between this specification and the claims.

[0047] For example, in this specification, there are structural elements that are distinguished by being annotated with "first," "second," and "third." When the structural elements annotated with "first" and "third" in this specification are recorded in the claims, from the perspective of easy identification, there is a case where the structural elements are annotated with "first" and "second" in the claims to distinguish the structural elements. In this case, the structural elements annotated with "first" and "second" in the claims refer to the structural elements annotated with "first" and "third" in this specification, respectively. It should be noted that the application of this rule is not limited to structural elements, and it can also be used reasonably and flexibly for other objects.

[0048] The following describes a specific embodiment of the present invention. Furthermore, a specific embodiment for implementing the present invention will be described with reference to the accompanying drawings. It should be noted that the embodiment for implementing the present invention is not limited to this specific embodiment. In other words, the illustrated embodiment is not the only embodiment for implementing the present invention. It should be noted that the sizes and positional relationships of the components shown in the drawings are sometimes exaggerated for ease of understanding.

[0049] <First embodiment>

[0050] A light emitting device 1 according to the first embodiment will be described. Figures 1 to 5 1 is a diagram for explaining an exemplary embodiment of the light emitting device 1 . Figure 1 It is a perspective view of the light emitting device 1 . Figure 2 3 is a top view of the light emitting device 1 . Figure 3 yes Figure 2 It should be noted that, in Figure 3 In order to avoid complicating the figure, the components arranged on the base 12 are omitted. Figure 4 It is a plan view for explaining a wiring state for electrically connecting a plurality of light-emitting elements included in the light-emitting device 1 . Figure 5 This is a plan view showing an example of the definition of inter-row areas, intra-row areas, and extra-row areas (to be described later) in the light emitting device 1 .

[0051] The light emitting device 1 includes a plurality of components, including a base 10 , a plurality of light emitting elements 20 , a plurality of bases 30 , one or more relay members 40 , a plurality of reflective members 50 , a plurality of wirings 60 , a sealing member 70 , and a lens member 80 .

[0052] It should be noted that the light emitting device 1 may include other components. For example, the light emitting device 1 may include further light emitting elements in addition to the plurality of light emitting elements 20. Furthermore, the light emitting device 1 may not include some of the components listed here.

[0053] First, the components of the light emitting device 1 will be described.

[0054] (Base 10)

[0055] The base 10 includes a base 12 and a side wall 14. The base 12 has a mounting surface for mounting other components. The side wall 14 surrounds the mounting surface. The mounting surface is the top surface of the base 12, and the side wall 14 forms a side wall extending upward from the mounting surface.

[0056] The base 12 has a protrusion 12a. Specifically, the base 12 has a first surface, a second surface located above the first surface, and one or more side surfaces connecting the first and second surfaces. The second surface can serve as a mounting surface. The sidewalls can be formed laterally relative to the second surface. Specifically, the sidewalls 14 can be formed to surround the entire second surface.

[0057] The area of the base 12 surrounded by the sidewall 14 is rectangular in shape. The long side of this rectangle can be in the range of 15 mm to 35 mm, and the short side can be in the range of 10 mm to 25 mm. The long side can be 1.4 times or more and 2.5 times or less of the short side. In the illustrated example of the base 10, the long side is parallel to the X direction, and the short side is parallel to the Y direction.

[0058] In a top view, the mounting surface is rectangular. The long side of the rectangle is parallel to the long side of the area surrounded by the side wall portion 14, and the short side of the rectangle is parallel to the short side of the area surrounded by the side wall portion 14. The long side of the rectangle can be at least 0.75 times and less than 1 times the long side of the area surrounded by the side wall portion 14. The short side of the rectangle can be at least 0.7 times and less than 1 times the short side of the area surrounded by the side wall portion 14.

[0059] The base 12 and the sidewall 14 can be formed from different components. For example, the sidewall 14 can be formed using a base component primarily made of copper, copper-tungsten, copper-molybdenum, steel, or iron, or a wall component primarily made of steel or iron. As a specific example, the base 10 can be formed by joining a base component primarily made of oxygen-free copper and a wall component primarily made of mild steel having a carbon content within a range of 0.12% to 0.30%.

[0060] The primary material refers to the material that accounts for the largest proportion by weight or volume of the object being formed. It should be noted that when the object being formed is composed of a single material, that material is the primary material. In other words, a material is considered the primary material if it accounts for 100% of the total weight or volume of that material.

[0061] It should be noted that, as described above, when the base 12 and the sidewall 14 are made of different materials, the base 12 has a shape with the protrusion 12a, thereby suppressing warping of the mounting surface. It should be noted that the shape of the base 10 is not limited to this and, for example, can be a flat plate. If the base 10 is a flat plate, the sidewall 14 is not present.

[0062] The base 10 further includes a plurality of wirings 16. The plurality of wirings 16 include a first wiring 161 and a second wiring 162 that face each other across the mounting surface. The plurality of wirings 16 include a plurality of first wirings 161. The plurality of wirings 16 include a plurality of second wirings 162. The plurality of wirings 16 include a plurality of first wirings 161 and the same number of second wirings 162.

[0063] Each wiring 16 has an inner wiring region provided inside the side wall and an outer wiring region provided outside the side wall. The inner wiring region and the outer wiring region of the wiring 16 are electrically connected. For example, the wiring 16 is provided through the side wall portion 14.

[0064] The wiring 16 can be, for example, a pin penetrating the side wall portion 14. Alternatively, the wiring 16 can be, for example, a metal film provided on the upper surface of the base 10. The wiring 16 can be formed mainly of a metal such as kovar, copper, or iron.

[0065] (Light-emitting element 20)

[0066] The light-emitting element 20 emits light. The light-emitting element 20 has an upper surface, a lower surface, and one or more side surfaces, one or more of which serve as light-emitting surfaces. The light-emitting element 20 emits light from one or more exit points on the light-emitting surface. These exit points are referred to as light-emitting points. A specific example of the light-emitting element 20 is a semiconductor laser element.

[0067] For example, a light emitting element emitting blue light, a light emitting element emitting green light, or a light emitting element emitting red light can be used as the light emitting element 20. It should be noted that a light emitting element emitting light of another color can also be used as the light emitting element 20.

[0068] Here, blue light refers to light with a peak emission wavelength in the range of 420nm to 494nm. Green light refers to light with a peak emission wavelength in the range of 495nm to 570nm. Red light refers to light with a peak emission wavelength in the range of 605nm to 750nm.

[0069] Here, a semiconductor laser element is described. In a top view, a semiconductor laser element has a rectangular shape with one opposite side as the long side and the other opposite side as the short side. The semiconductor laser element is formed by stacking multiple semiconductor layers including an active layer from the bottom surface to the top surface. The side surface containing one of the two short sides of the rectangle is the output end face from which light is emitted. It should be noted that the output end face of the semiconductor laser element can also be referred to as the light output surface of the light-emitting element 20. The upper and lower surfaces of the semiconductor laser element are larger in area than the output end face.

[0070] Light (laser light) emitted from a semiconductor laser element exhibits divergence. Divergent light is emitted from the emission end facet of the semiconductor laser element. Light emitted from a semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") in a plane parallel to the emission end facet of the semiconductor laser element. The FFP refers to the shape and intensity distribution of the emitted light at a distance from the emission end facet.

[0071] Here, light passing through the center of the elliptical shape of the FFP, in other words, light with peak intensity in the light intensity distribution of the FFP, is referred to as light traveling along the optical axis or light passing through the optical axis. 2 Light of the above intensity is called the main part of light.

[0072] The FFP of light emitted from a semiconductor laser device is an elliptical shape, with the stacking direction being longer than the direction perpendicular to the stacking direction. The stacking direction refers to the direction in which the multiple semiconductor layers, including the active layer, are stacked in a semiconductor laser device. The direction perpendicular to the stacking direction can also be referred to as the in-plane direction of the semiconductor layer. Furthermore, the major axis of the elliptical FFP can be referred to as the fast axis of the semiconductor laser device, and the minor axis as the slow axis of the semiconductor laser device.

[0073] The light emitted from the semiconductor laser element is divergent light. Here, 1 / e of the peak light intensity based on the light intensity distribution of FFP is used. 2 The angle at which light of the light intensity is diverged is the light divergence angle of the semiconductor laser element. The light divergence angle is 1 / e of the peak light intensity. 2 In addition to the light intensity of the peak light intensity, there are cases where the light intensity can be obtained based on the half-value of the peak light intensity. In the description of this specification, when it is simply referred to as "light divergence angle", it means 1 / e of the peak light intensity. 2 It should be noted that the divergence angle in the fast axis direction is greater than the divergence angle in the slow axis direction.

[0074] Semiconductor laser elements that emit blue light or green light include those containing nitride semiconductors. Examples of nitride semiconductors include GaN, InGaN, and AlGaN. Semiconductor laser elements that emit red light include those containing InAlGaP, GaInP, GaAs, or AlGaAs semiconductors.

[0075] (Abutment 30)

[0076] The base 30 has a lower surface, an upper surface, and one or more side surfaces. The width of the base 30 is smallest in the vertical direction. The base 30 is formed in a rectangular parallelepiped shape. It should be noted that the shape is not limited to a rectangular parallelepiped. The base 30 can be formed primarily of, for example, aluminum nitride, silicon nitride, or silicon carbide.

[0077] (Relay component 40)

[0078] The relay component 40 has a lower surface, an upper surface, and one or more side surfaces. The width of the relay component 40 is smallest in the vertical direction. The relay component 40 is in the shape of a rectangular parallelepiped. It should be noted that the shape is not limited to a rectangular parallelepiped. The relay component 40 can be formed primarily from, for example, silicon nitride, aluminum nitride, silicon carbide, or aluminum oxide.

[0079] (Reflective member 50)

[0080] The reflective component 50 has a light-reflecting surface for reflecting light. The reflective component 50 has a lower surface and an upper surface, and the light-reflecting surface is inclined relative to the lower surface of the reflective component 50. In other words, the light-reflecting surface is neither perpendicular nor parallel to the lower surface of the reflective component 50. The light-reflecting surface is a plane and is inclined at a 45-degree angle relative to the lower surface of the reflective component 50. It should be noted that the light-reflecting surface does not have to be a plane, and its inclination angle does not have to be 45 degrees.

[0081] The reflective component 50 can be formed primarily from glass or metal. The primary material can be any heat-resistant material; for example, glass such as quartz or BK7 (borosilicate glass), or metal such as aluminum, can be used. Furthermore, the reflective component 50 can be formed primarily from Si. If the primary material is reflective, a light-reflecting surface can be formed from the primary material. To form a light-reflecting surface made of a different material, for example, a metal film such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2 can be formed.

[0082] The reflectivity of the light reflecting surface relative to the peak wavelength of light irradiating the light reflecting surface is 90% or higher. Alternatively, the reflectivity may be 95% or higher. It should be noted that the reflectivity here is 100% or lower or less than 100%.

[0083] (Wiring 60)

[0084] Wiring 60 is composed of a linear conductor with two ends forming joints. In other words, wiring 60 has joints at both ends of the linear portion for connecting to other components. Wiring 60 is used to electrically connect two components. For example, wires primarily made of metal can be used as wiring 60. Examples of metals include gold, aluminum, silver, and copper.

[0085] (Sealing member 70)

[0086] Sealing member 70 has an upper surface and a lower surface. Sealing member 70 has a light-transmitting portion with high light transmittance extending from the upper surface to the lower surface. High light transmittance refers to a light transmittance of 80% or greater. However, the transmittance need not be 80% or greater for all wavelengths of light.

[0087] The sealing member 70 may be composed of a frame member having one or more openings and one or more light-transmitting members covering the one or more openings. In this case, the frame member may not have high light transmittance. The light-transmitting member includes a light-transmitting portion.

[0088] The light-transmitting portion of the sealing member 70 can be formed mainly of a light-transmitting material such as glass, sapphire, or quartz. The main material of the frame member can be metal, for example.

[0089] (Lens component 80)

[0090] The lens component 80 has an upper surface, a lower surface, side surfaces, and multiple lens surfaces. The multiple lens surfaces are arranged on the upper surface. The multiple lens surfaces are arranged in a matrix of two rows and N columns (N is a natural number greater than 2). It should be noted that the lens surfaces can also be arranged on the lower surface.

[0091] The upper and lower surfaces are planes. Multiple lens surfaces intersect the upper surface. In a top view, the multiple lens surfaces are surrounded by the upper surface. In a top view, the lens component 80 has a rectangular shape. The lower surface of the lens component 80 is rectangular.

[0092] Here, in lens component 80, the portion overlapping with the multiple lens surfaces in a top view is referred to as the lens portion. In lens component 80, the portion overlapping with the upper surface in a top view is referred to as the non-lens portion. The lens portion is defined as the lens-shaped portion on the side of the lens surface when bisected by an imaginary plane including the upper surface, and as the flat-plate-shaped portion on the lower surface. The lower surface of the lens portion is a portion of the lower surface of lens component 80.

[0093] The lens component 80 has high light transmittance. The entire lens portion is formed to have high light transmittance. The lens component 80 can be formed using a light-transmitting material such as glass or synthetic quartz as a main material.

[0094] (Light-emitting device 1)

[0095] Next, the light emitting device 1 including the above-mentioned components will be described.

[0096] In the light-emitting device 1, multiple light-emitting elements 20 are arranged on a substrate 10. The multiple light-emitting elements 20 are arranged on the mounting surface of the substrate 10. The light emission points of the multiple light-emitting elements 20 are all located above the mounting surface. The multiple light-emitting elements 20 are arranged within the arrangement area of the mounting surface. In other words, the area within the mounting surface that surrounds the multiple light-emitting elements 20 arranged on the mounting surface is referred to as the arrangement area.

[0097] The plurality of light-emitting elements 20 are arranged in a matrix. The plurality of light-emitting elements 20 are arranged in two rows and N columns (N is a natural number greater than or equal to 2). The light emission points of the N light-emitting elements 20 arranged in the same row can be arranged at equal intervals in the row direction. It should be noted that the light-emitting device 1 can further include multiple light-emitting elements arranged in a matrix with three or more rows. Similarly, the light-emitting elements can be further arranged so that the number of columns is greater than N.

[0098] The spacing between adjacent light-emitting elements 20 in the row direction is 1.2 mm to 4 mm. The spacing between adjacent light-emitting elements 20 in the row direction is smaller than the spacing between adjacent light-emitting elements 20 in the column direction. The spacing between adjacent light-emitting elements 20 in the column direction is 4 mm to 8 mm.

[0099] In the illustrated example of the light-emitting device 1, the row direction in the matrix is parallel to the X direction, and the column direction is parallel to the Y direction. Furthermore, semiconductor laser elements are used as the light-emitting elements 20. Furthermore, the plurality of light-emitting elements 20 are arranged in two rows and seven columns. It should be noted that the plurality of light-emitting elements 20 can be arranged in three or more columns. This allows the length of the configuration area to align with the length of the mounting surface, enabling efficient arrangement of the plurality of light-emitting elements.

[0100] The first wiring 161 and the second wiring 162 are arranged at positions away from the configuration area in opposite directions, with the configuration area as the base point. The plurality of first wirings 161 are arranged at positions away from the configuration area in a first direction, and the plurality of second wirings 162 are arranged at positions away from the configuration area in a direction opposite to the first direction.

[0101] In the illustrated example of the light-emitting device 1, the first direction and the direction opposite to the first direction are parallel to the X direction. The first wirings 161 and second wirings 162 are provided in the same number of rows as the plurality of light-emitting elements 20 arranged in a matrix. In other words, the first wirings 161 and the second wirings 162 are each composed of two wirings 16.

[0102] The plurality of light-emitting elements 20 include one or more first light-emitting elements 20A, one or more second light-emitting elements 20B, and one or more third light-emitting elements 20C. The first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C are electrically connected so that they can be driven independently. The details of this connection will be described later.

[0103] The first light emitting element 20A, the second light emitting element 20B, and the third light emitting element 20C emit light of different colors. The first light emitting element 20A, the second light emitting element 20B, and the third light emitting element 20C can emit light of different colors selected from red, green, and blue.

[0104] It should be noted that the plurality of first light-emitting elements 20A emit light of the same color. Furthermore, the difference in peak wavelength of the emitted light within the plurality of first light-emitting elements 20A is within 30 nm. The same applies to the second light-emitting element 20B and the third light-emitting element 20C.

[0105] The plurality of first light-emitting elements 20A can include two or more first light-emitting elements 20A each emitting light with a peak wavelength that differs within a range of 3 nm to 10 nm. The difference in peak wavelength is preferably 3 nm to 5 nm. For example, when the laser light emitted from the light-emitting device 1 is used for image display, speckle noise can be mitigated by emitting light of the same color with different peak wavelengths. The second light-emitting element 20B and the third light-emitting element 20C can similarly be configured to emit multiple lights with different peak wavelengths.

[0106] In the illustrated example of light-emitting device 1, the first to seventh columns of the second row are first light-emitting elements 20A, the first, second, sixth, and seventh columns of the first row are second light-emitting elements 20B, and the third to fifth columns of the first row are third light-emitting elements 20C. First light-emitting elements 20A emit red light, second light-emitting elements 20B emit green light, and third light-emitting elements 20C emit blue light.

[0107] In the illustrated example of the light-emitting device 1, the plurality of first light-emitting elements 20A include first light-emitting elements 20A whose peak wavelength of emitted light is a first wavelength, and first light-emitting elements 20A whose peak wavelength of emitted light is a second wavelength greater than the first wavelength. The second wavelength is larger than the first wavelength, within a range of 3 nm to 10 nm. Furthermore, the plurality of first light-emitting elements 20A include first light-emitting elements 20A whose peak wavelength of emitted light is a third wavelength greater than the second wavelength. The third wavelength is larger than the second wavelength, within a range of 3 nm to 10 nm.

[0108] The third wavelength is preferably greater than the first wavelength, within a range of 3 nm to 10 nm. Furthermore, the second wavelength is greater than the first wavelength, within a range of 3 nm to 5 nm, and the third wavelength is greater than the second wavelength, within a range of 3 nm to 5 nm. In multiple light-emitting elements emitting light of the same color, by suppressing the difference between the maximum and minimum peak wavelengths of the light to less than 10 nm, light can be emitted without significant color variation.

[0109] The plurality of light-emitting elements 20 are arranged so that their light-emitting surfaces face the side. The plurality of light-emitting elements 20 are arranged so that their light-emitting surfaces face the same direction. It should be noted that the same direction here refers to a situation where each light-emitting surface converges within a range of ±5 degrees in a top view. In the example of the light-emitting device 1 shown in the figure, the light-emitting surface of the light-emitting element 20 is parallel to the X direction and perpendicular to the Y direction. Furthermore, the optical axis of the light emitted from the plurality of light-emitting elements 20 is parallel to the Y direction.

[0110] The light emitting elements 20 are respectively arranged on the base 30. The light emitting elements 20 are arranged on the mounting surface via the base 30. A plurality of light emitting elements 20 are arranged on a plurality of bases 30. The bases 30 are provided one to one with respect to the light emitting elements 20.

[0111] The plurality of bases 30 include two or more bases 30 of different sizes in a plan view. In the illustrated example of the light-emitting device 1, the first light-emitting element 20A is bonded to the base 30 having a relatively larger area among the two bases 30 of different sizes. This improves heat dissipation from the first light-emitting element 20A.

[0112] The plurality of reflective components 50 are disposed on the base 10. The plurality of reflective components 50 are disposed on the mounting surface of the base 10. The plurality of reflective components 50 are disposed within the mounting surface configuration area. In other words, the region within the mounting surface surrounded by the plurality of reflective components 50 disposed on the mounting surface and the light emitting element 20 can be defined as the configuration area.

[0113] The multiple reflective components 50 reflect light emitted from the multiple light-emitting elements 20. The light reflected by the reflective components 50 travels upward. The light-reflecting surface of the reflective components 50 is inclined at a 45-degree angle relative to the direction of travel of light passing through the optical axis. Light passing through the optical axis is reflected by the reflective components 50 and travels in a direction perpendicular to the mounting surface. This direction is parallel to the Z direction.

[0114] The plurality of reflective members 50 reflects a major portion of light emitted from the plurality of light emitting elements 20. Hereinafter, the reflective member 50 that reflects a major portion of light emitted from the light emitting element 20 will be referred to as the reflective member 50 corresponding to the light emitting element 20.

[0115] The multiple reflective components 50 include one or more reflective components 50 corresponding to one or more first light-emitting elements 20A, one or more reflective components 50 corresponding to one or more second light-emitting elements 20B, and one or more reflective components 50 corresponding to one or more third light-emitting elements 20C.

[0116] The reflective components 50 are disposed one-to-one with respect to the light-emitting elements 20. The reflective components 50 are arranged in a matrix. The reflective components 50 are arranged in two rows and N columns (N is a natural number greater than or equal to 2). The N reflective components 50 arranged in the same row are arranged at equal intervals. It should be noted that the reflective components 50 may include reflective components 50 corresponding to a plurality of light-emitting elements 20 arranged in a continuous pattern.

[0117] For example, the plurality of reflective components 50 may include reflective components 50 corresponding to the plurality of first light emitting elements 20A arranged in series, reflective components 50 corresponding to the plurality of second light emitting elements 20B arranged in series, and reflective components 50 corresponding to the plurality of third light emitting elements 20C arranged in series.

[0118] The light reflecting surface of the reflective member 50 reflects more than 90% of the main portion of the irradiated light. It should be noted that the light emitting device 1 may not include the reflective member 50. In this case, for example, the emission end face of the light emitting element 20 faces upward.

[0119] One or more relays 40 are disposed on the base 10. The one or more relays 40 are disposed on the mounting surface of the base 10. The one or more relays 40 include one or more first relays 40A disposed in the inter-row region of the plurality of light emitting elements 20 arranged in two rows and N columns.

[0120] The inter-row region refers to the area between the rows of multiple components arranged in two rows and N columns, specifically the area between the components in the first row and the components in the second row. Therefore, the inter-row region of the multiple light-emitting elements 20 arranged in two rows, the inter-row region of the multiple reflective components 50 arranged in two rows, the inter-row region between the multiple light-emitting elements 20 arranged in the first row and the multiple reflective components 50 arranged in the second row, and the inter-row region between the multiple reflective components 50 arranged in the first row and the multiple light-emitting elements 20 arranged in the second row can be separately defined. Hereinafter, these are referred to as the first inter-row region, the second inter-row region, the third inter-row region, and the fourth inter-row region, respectively.

[0121] The inter-row area is the area sandwiched between two imaginary lines parallel to the row direction in a top view. The two imaginary lines are an imaginary line passing through the position closest to the second row of components arranged in multiple columns in the first row, and an imaginary line passing through the position closest to the first row of components arranged in multiple columns in the second row. Figure 5 In FIG. 1 , as an example of an interline area, a first interline area A1 is indicated by hatching.

[0122] One or more first relay members 40A are arranged in an area overlapping the first inter-row area, the second inter-row area, the third inter-row area, and the fourth inter-row area. One or more first relay members 40A are arranged in an inter-row area that does not include either the plurality of light emitting elements 20 or the plurality of reflective members 50 in the third inter-row area or the fourth inter-row area.

[0123] The one or more relay components 40 include one or more second relay components 40B arranged in an out-of-row region of the plurality of light-emitting elements 20 arranged in two rows and N columns. The out-of-row region refers to a region of one of the two rows that does not include a component, bounded by an imaginary line parallel to the row direction and passing through the farthest position from the other row, among the components arranged in multiple columns.

[0124] Therefore, it is possible to separately define the out-of-row area based on the plurality of light-emitting elements 20 arranged in the first row, the out-of-row area based on the plurality of reflective components 50 arranged in the first row, the out-of-row area based on the plurality of light-emitting elements 20 arranged in the second row, and the out-of-row area based on the plurality of reflective components 50 arranged in the second row. Hereinafter, they are referred to as the first out-of-row area, the second out-of-row area, the third out-of-row area, and the fourth out-of-row area, respectively. Figure 5 In FIG. 1 , as an example of an out-of-line area, a first out-of-line area A3 is indicated by hatching.

[0125] The one or more relay components 40 include one or more third relay components 40C, each of which is bonded to the other end of the wiring 60 whose one end is bonded to the wiring 16. The third relay components 40C are arranged at a position spaced apart from the light-emitting element 20 located at one end of the plurality of light-emitting elements 20 arranged in the row direction in a direction opposite to the direction in which the adjacent light-emitting element 20 is arranged. In contrast to the third relay components 40C, the first relay component 40A and the second relay component 40B may also be relay components 40 whose both ends are bonded to the wiring 60 that is not bonded to the wiring 16.

[0126] It should be noted that it is possible to define an intra-row area other than the inter-row area and the extra-row area. The intra-row area refers to an area sandwiched between the inter-row area and the extra-row area determined based on the components arranged in multiple columns in the same row. Figure 5 In FIG. 1 , as an example of an inter-row region, an intra-row region A2 based on the light emitting elements 20 arranged in the first row is indicated by hatching. The intra-row region A2 is a region sandwiched between the first inter-row region A1 and the first out-of-row region A3.

[0127] exist Figure 4 In the example of the light emitting device 1 shown, the relays 40 are arranged in the row region based on the light emitting elements 20 arranged in the first row. Furthermore, the relays 40 are arranged in the row region based on the reflective members 50 arranged in the first row.

[0128] The plurality of wirings 60 are provided to electrically connect the plurality of light emitting elements 20 and the plurality of wirings 16. The plurality of wirings 60 include a plurality of first light emitting element wirings 60A that connect one or more first light emitting elements 20A in series with two wirings 16 among the plurality of first wirings 161 and the plurality of second wirings 162.

[0129] The plurality of wirings 60 include a plurality of second light emitting element wirings 60B that connect one or more second light emitting elements 20B in series with two wirings 16 among the plurality of first wirings 161 and the plurality of second wirings 162 .

[0130] The plurality of wirings 60 include a plurality of third light emitting element wirings 60C that connect one or more third light emitting elements 20C in series with two wirings 16 among the plurality of first wirings 161 and the plurality of second wirings 162 .

[0131] A first light emitting element wiring 60A is bonded to each of two wirings 16 connecting one or more first light emitting elements 20A in series. Furthermore, the second light emitting element wiring 60B and the third light emitting element wiring 60C are not bonded to at least one of the two wirings 16 .

[0132] A second light emitting element wiring 60B is bonded to each of two wirings 16 connecting one or more second light emitting elements 20B in series. Furthermore, at least one of the two wirings 16 is not bonded to the first light emitting element wiring 60A and the third light emitting element wiring 60C.

[0133] A third light emitting element wiring 60C is bonded to each of two wirings 16 connecting one or more third light emitting elements 20C in series. Furthermore, at least one of the two wirings 16 is not bonded to the first light emitting element wiring 60A and the second light emitting element wiring 60B.

[0134] The plurality of wirings 16 include a wiring 16 connected to the first light emitting element wiring 60A, the second light emitting element wiring 60B, and the third light emitting element wiring 60C. This wiring 16 is one wiring 16 among the plurality of first wirings 161 and the plurality of second wirings 162.

[0135] The plurality of first light-emitting element wirings 60A include wirings 60 bonded to the first relay 40A. It should be noted that the first relay 40A may be a first relay 40A located in any of the first to fourth inter-row regions. The plurality of first light-emitting element wirings 60A include wirings 60 bonded to one or more first relays 40A and wirings 60 bonded to one or more first light-emitting elements 20A or one or more bases 30 on which the one or more first light-emitting elements 20A are mounted.

[0136] One or more first light-emitting elements 20A are electrically connected to two first wirings 161. A plurality of first light-emitting element wirings 60A are bonded to one or more first relay components 40A, which are located on the opposite side of the one or more first light-emitting elements 20A via one or more reflective components 50 corresponding to the one or more first light-emitting elements 20A.

[0137] Furthermore, the plurality of first light emitting element wirings 60A are joined to one or more first light emitting elements 20A and one or more first relays 40A so as to surround one or more reflecting members 50 corresponding to the one or more first light emitting elements 20A.

[0138] In the illustrated example of the light-emitting device 1, the plurality of first light-emitting element wirings 60A are joined in a manner such that, starting with the first wiring 161 closer to the first light-emitting element 20A of the two first wirings 161, the plurality of first light-emitting elements 20A arranged in the row direction, the plurality of relay components 40, and the other first wiring 161 are sequentially connected. Furthermore, there are no first light-emitting element wirings 60A that pass between adjacent reflective components 50 of the plurality of reflective components 50 arranged in the row direction, corresponding to the plurality of first light-emitting elements 20A.

[0139] The plurality of second light-emitting element wirings 60B include wirings 60 bonded to the second relays 40B. It should be noted that the second relays 40B are arranged in an area outside the rows of the second light-emitting elements 20B or in an area outside the rows of the reflective members 50 corresponding to the second light-emitting elements 20B. The plurality of second light-emitting element wirings 60B include wirings 60 bonded to one or more second relays 40B and wirings 60 bonded to one or more second light-emitting elements 20B or to one or more bases 30 on which the one or more second light-emitting elements 20B are mounted.

[0140] One or more second light-emitting elements 20B are electrically connected to a first wiring 161 and a second wiring 162. Multiple second light-emitting element wirings 60B are bonded to one or more second relay components 40B, which are located on the opposite side of the one or more third light-emitting elements 20C, with one or more reflective components 50 corresponding to the one or more third light-emitting elements 20C interposed therebetween. The multiple second light-emitting element wirings 60B include a second light-emitting element wiring 60B bonded to a relay component 40 disposed between two reflective components 50 corresponding to the second light-emitting elements 20B and the third light-emitting elements 20C, respectively, disposed adjacent to each other in the row direction. The relay component 40 is disposed in an area outside the row of the second light-emitting elements 20B. This allows electrical connection of the second light-emitting elements 20B to be achieved, bypassing the third light-emitting elements 20C.

[0141] In the illustrated example of the light-emitting device 1, one or more second light-emitting elements 20B are arranged in the same row, one in a direction from the third light-emitting element 20C, and one or more second light-emitting elements 20B are arranged in a direction opposite to the one in a direction from the third light-emitting element 20C. These are referred to as the second light-emitting elements 20B on the one side and the second light-emitting elements 20B on the other side, respectively. The plurality of second light-emitting element wirings 60B are connected in a manner that sequentially connects the second light-emitting elements 20B on the one side, the plurality of relay components 40, the second light-emitting elements 20B on the other side, and the second wirings 162, starting from the first wiring 161.

[0142] The plurality of third light-emitting element wirings 60C include wirings 60 that are joined to the first relay 40A. It should be noted that the first relay 40A may be a first relay 40A located in any of the first to fourth inter-row regions. The plurality of third light-emitting element wirings 60C include wirings 60 that are joined to one or more first relays 40A located in the row direction, further in the direction of the first wiring 161 than the third light-emitting element 20C closest to the first wiring 161. Furthermore, the plurality of third light-emitting element wirings 60C include wirings 60 that are joined to one or more first relays 40A located in the row direction, further in the direction of the second wiring 162 than the third light-emitting element 20C closest to the second wiring 162.

[0143] One or more third light-emitting elements 20C are electrically connected to one first wiring 161 and one second wiring 162. The plurality of third light-emitting element wirings 60C are bonded to one or more first relays 40A in the inter-row region, closer to the third light-emitting element 20C in the column direction than to the first relay 40A bonded to the first light-emitting element wiring 60A. The plurality of third light-emitting element wirings 60C include a third light-emitting element wiring 60C bonded to a relay 40 disposed between the second light-emitting element 20B and the third light-emitting element 20C, which are adjacently disposed in the row direction. The one or more first relays 40A include a first relay 40A bonded to the other end of a wiring 60, one end of which is bonded to the third light-emitting element 20C or the base 30 on which the third light-emitting element 20C is mounted, and to the other end of a wiring 60, one end of which is bonded to the first relay 40A bonded to the first light-emitting element wiring 60A.

[0144] In the example of the light-emitting device 1 shown in the figure, multiple third light-emitting elements are connected by wiring 60C in a manner starting from the first wiring 161, sequentially connecting one or more first relay components 40A, multiple third light-emitting elements 20C arranged in the row direction, one or more first relay components 40A, and the second wiring 162.

[0145] The one or more relays 40 include the relay 40 connected to the first light emitting element wiring 60A and the second light emitting element wiring 60B. The plurality of wirings 60 include both the first light emitting element wiring 60A and the first light emitting element wiring 60B. This simplifies the wiring.

[0146] The one or more relay components 40 include a relay component 40 that is connected to the first light-emitting element wiring 60A and the third light-emitting element wiring 60C. Furthermore, the relay component 40 may be the first relay component 40A. The plurality of wirings 60 include a wiring 60 that is both the first light-emitting element wiring 60A and the third light-emitting element wiring 60C. This allows the two current paths to merge at a desired location in the inter-row region.

[0147] The relay 40 to which the first and second light-emitting element wirings 60A and 60B are bonded can be different from the relay 40 to which the first and third light-emitting element wirings 60A and 60C are bonded.

[0148] In this manner, if the current paths are combined, the plurality of wirings 60 may include wirings 60 that function only as the first light-emitting element wiring 60A, wirings 60 that function only as the second light-emitting element wiring 60B, wirings 60 that function only as the third light-emitting element wiring 60C, and wirings 60 that function as at least the first light-emitting element wiring 60A and the second light-emitting element wiring 60B. Furthermore, the plurality of wirings 60 may include wirings 60 that function as at least the first light-emitting element wiring 60A and the third light-emitting element wiring 60C. Furthermore, the plurality of wirings 60 may include wirings 60 that function as the first light-emitting element wiring 60A, the second light-emitting element wiring 60B, and the third light-emitting element wiring 60C.

[0149] The plurality of relay components 40 include a relay component 40 at which the current paths of the first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C merge. This relay component 40 can be the third relay component 40C. The wiring 60 connected to the first relay component 40A does not include a wiring 60 that functions as the first light-emitting element wiring 60A, the second light-emitting element wiring 60B, and the third light-emitting element wiring 60C.

[0150] In the illustrated example of the light-emitting device 1, the current paths electrically connecting the plurality of first light-emitting elements 20A to the two wirings 16 include a first path electrically connecting only the first light-emitting element 20A, a second path electrically connecting only the first light-emitting element 20A and the third light-emitting element 20C, and a third path electrically connecting the first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C. Furthermore, the physical lengths of the paths decrease in order of the first path, the second path, and the third path. The length of the first path is at least twice the sum of the lengths of the second and third paths.

[0151] In the light emitting device 1, the plurality of relay members 40 include relay members 40 having a smaller area when viewed from above than the base 30. The area of all the plurality of relay members 40 when viewed from above can be smaller than the area of the base 30. This facilitates selection of the number and positions of the plurality of relay members 40 to be arranged in the inter-row area.

[0152] The number of relays 40 disposed in the light emitting device 1 may be greater than 2×N. The number of relays 40 disposed in the light emitting device 1 may be greater than the number of light emitting elements 20. The number of relays 40 disposed in the light emitting device 1 may be greater than the number of bases 30.

[0153] The relay member 40 is formed of the same material as the base 30, that is, the same main material. It should be noted that the relay member 40 may be formed of a different main material than the base 30. In this case, the base 30 preferably has a higher thermal conductivity than the relay member 40. While the base 30 preferably takes into account the heat dissipation properties of the heat generated by the light-emitting element 20, it is also conceivable that the relay member 40 may have a lower thermal conductivity than the base 30 because the light-emitting element 20 is not mounted on the relay member 40.

[0154] The sealing member 70 seals the space where the plurality of light emitting elements 20 are arranged. The light emitting elements 20 can be arranged in the airtightly sealed space. This can prevent the light quality from being deteriorated due to the influence of dust on the light emitting elements 20.

[0155] Sealing member 70 is disposed on the side wall of base 10. The upper surface of the side wall is bonded to the lower surface of sealing member 70. The frame member of sealing member 70 is bonded to the side wall. Light reflected by reflecting member 50 passes through sealing member 70. A significant portion of the light passes through the light-transmitting portion of sealing member 70 and is emitted from sealing member 70. At least 90% of the significant portion of light emitted from light-emitting element 20 is emitted from sealing member 70.

[0156] The lens component 80 is positioned above the plurality of light-emitting elements 20. The lens component 80 is disposed above the sealing component 70. The lens component 80 is bonded to the sealing component 70. The lens component 80 is bonded using, for example, a UV-curable adhesive. Using a UV-curable adhesive allows the mounting position of the lens component 80 to be adjusted, allowing it to be bonded at a desired position.

[0157] The lens member 80 is arranged so that the light emitted from each light emitting element 20 passes through each lens surface and is emitted.

[0158] <Modification of the First Embodiment>

[0159] Next, light-emitting devices according to variations of the first embodiment will be described. Several variations are presented below. Each variation differs from the light-emitting device 1 according to the first embodiment in the arrangement of the plurality of light-emitting elements 20. Consequently, the different arrangements of the plurality of light-emitting elements 20 lead to differences in the connection method of the wiring 60 and the arrangement of the relay 40.

[0160] In the light emitting devices of each modification, the base 10, reflective member 50, sealing member 70, and lens member 80 are the same as those of the light emitting device 1 of the first embodiment. Therefore, these components can be considered to be the same as those described in the light emitting device 1 of the first embodiment.

[0161] In the light emitting devices of the respective modifications, the description of the components of the light emitting element 20 , the base 30 , the relay 40 , and the wiring 60 can be considered to be the same as the description of the components in the first embodiment.

[0162] Figure 1 is a perspective view of a light emitting device according to each modified example, Figure 2 1 and 2 are plan views of light emitting devices according to various modifications. In various modifications, the inter-row area, the intra-row area, and the extra-row area have the same definitions as those described in the light emitting device 1 according to the first embodiment.

[0163] and, Figures 6 to 9 The light emitting devices of the respective modifications are described below. The light emitting devices of the respective modifications have already been described in the light emitting device 1 of the first embodiment. If there are no inconsistencies between the light emitting devices of the modifications and the drawings, the light emitting devices of the modifications are considered to be the same.

[0164] <First Modification>

[0165] Figure 6This is a top view illustrating the wiring electrically connecting multiple light-emitting elements included in a light-emitting device 1A according to a first modification. In the illustrated light-emitting device 1A, the first through seventh columns of the second row are first light-emitting elements 20A, the first through third columns, the sixth, and the seventh columns of the first row are second light-emitting elements 20B, and the fourth and fifth columns of the first row are third light-emitting elements 20C. The first light-emitting elements 20A emit blue light, the second light-emitting elements 20B emit red light, and the third light-emitting elements 20C emit green light.

[0166] In the light-emitting device 1A, second light-emitting elements 20B are arranged on both sides of the third light-emitting element 20C, sandwiching the third light-emitting element 20C therebetween. Regarding the second light-emitting elements 20B arranged on both sides, the peak wavelength of light emitted from the second light-emitting element 20B arranged on one side is greater than the peak wavelength of light emitted from the second light-emitting element 20B arranged on the other side, and is within a range of 3 nm to 10 nm.

[0167] Multiple second light-emitting elements 20B are arranged on one side, and multiple second light-emitting elements 20B are arranged on the other side. The peak wavelength of light emitted from the second light-emitting elements 20B arranged on one side is less than 3 nm. The peak wavelength of light emitted from the second light-emitting elements 20B arranged on the other side is less than 3 nm.

[0168] The plurality of second light-emitting elements 20B arranged on one side are arranged in greater numbers than the plurality of second light-emitting elements 20B arranged on the other side, and the peak wavelength of the light emitted is shorter. For example, when using red light-emitting elements, the light-emitting elements with shorter peak wavelengths have better relative visibility. Therefore, increasing the number of light-emitting elements with shorter peak wavelengths can make the light appear brighter.

[0169] When mounted on the base 30, the electrodes on the top surfaces of the first light-emitting elements 20A in the light-emitting device 1 are different from those in the light-emitting device 1A. In the light-emitting device 1, the wiring 60 is bonded to the base 30 and the first relay 40A, on which the first light-emitting elements 20A at the end of the plurality of first light-emitting elements 20A arranged in the row direction are placed. In the light-emitting device 1A, the wiring 60 is bonded to the top surfaces of the first light-emitting elements 20A at the end of the plurality of first light-emitting elements 20A arranged in the row direction and to the relay 40 (hereinafter referred to as the fourth relay 40D) located outside the inter-row area. In the illustrated light-emitting device 1A, the fourth relay 40D is located in the fourth out-row area. This arrangement of the fourth relay 40D allows the wiring 60 to be bonded so that it is not located on the optical path of light reflected by the reflective member 50.

[0170] <Second Modification>

[0171] Figure 7 This is a plan view illustrating the wiring electrically connecting the plurality of light-emitting elements included in a light-emitting device 1B according to a second modification. In light-emitting device 1B, the arrangement of first light-emitting element 20A, second light-emitting element 20B, and third light-emitting element 20C and the color of the light emitted are the same as those in light-emitting device 1.

[0172] In the light-emitting device 1B, the plurality of first light-emitting elements 20A include a first light-emitting element 20A emitting light having a peak wavelength of a first wavelength, a first light-emitting element 20A emitting light having a peak wavelength of a second wavelength, and a first light-emitting element 20A emitting light having a peak wavelength of a third wavelength. These elements are hereinafter referred to as the first light-emitting element 20A emitting light having a first wavelength, the first light-emitting element 20A emitting light having a second wavelength, and the first light-emitting element 20A emitting light having a third wavelength, respectively.

[0173] In the light emitting device 1B, the number of first light emitting elements 20A with the first wavelength is greater than the number of first light emitting elements 20A with the second wavelength. The number of first light emitting elements 20A with the first wavelength is greater than the number of first light emitting elements 20A with the third wavelength.

[0174] The plurality of first light-emitting elements 20A of the first wavelength include a first light-emitting element 20A disposed between the first light-emitting element 20A of the second wavelength and the first light-emitting element 20A of the third wavelength. The plurality of first light-emitting elements 20A include a first light-emitting element 20A of the second wavelength disposed between two first light-emitting elements 20A of the first wavelength. The plurality of first light-emitting elements 20A include a first light-emitting element 20A of the third wavelength disposed between two first light-emitting elements 20A of the first wavelength.

[0175] The peak wavelengths of light emitted by adjacent first light-emitting elements 20A in the array are different from each other within a range of 3 nm to 10 nm. The first light-emitting elements 20A are arranged so that the same wavelengths are not adjacent to each other among the first, second, and third wavelengths.

[0176] In the illustrated light-emitting device 1B, the peak wavelength of light emitted by the first light-emitting element 20A having the first wavelength is 640 nm or less. The peak wavelength of light emitted by the first light-emitting element 20A having the third wavelength is 645 nm or greater. The difference in peak wavelength between the first light-emitting element 20A having the smallest and the first light-emitting element 20A having the largest peak wavelength among the plurality of first light-emitting elements 20A is 10 nm or less. First light-emitting elements 20A having the first wavelength are arranged at both ends and between the plurality of first light-emitting elements 20A arranged in the row direction. The first light-emitting elements 20A having the second wavelength and the first light-emitting elements 20A having the third wavelength are arranged symmetrically with respect to the first light-emitting element 20A having the first wavelength arranged between the two ends.

[0177] The direction of current flow in the light-emitting device 1B is opposite to that in the light-emitting device 1. In the light-emitting device 1, the wiring 60 is bonded to the base 30 and the first relay 40A on which the first light-emitting elements 20A located at the end of the plurality of first light-emitting elements 20A arranged in the row direction are mounted. In the light-emitting device 1B, the wiring 60 is bonded to the upper surface of the first light-emitting element 20A located at the end of the plurality of first light-emitting elements 20A arranged in the row direction and the first relay 40A. The first relay 40A is arranged between two reflective members 50. The first relay 40A is arranged in the row region based on the reflective member 50 corresponding to the first light-emitting element 20A. In the light-emitting device 1B, there are first light-emitting element wirings 60A corresponding to the plurality of first light-emitting elements 20A, passing between adjacent reflective members 50 of the plurality of reflective members 50 arranged in the row direction. By arranging the first relay 40A in this manner, the number of relays 40 can be reduced.

[0178] <Third Modification>

[0179] Figure 8 This is a top view illustrating the wiring electrically connecting multiple light-emitting elements included in a light-emitting device 1C according to a third variation. In the illustrated light-emitting device 1C, the first, fourth, and seventh columns of the second row are first light-emitting elements 20A, the first through seventh columns of the first row are second light-emitting elements 20B, and the second, third, fifth, and sixth columns of the second row are third light-emitting elements 20C. The first light-emitting element 20A emits blue light, the second light-emitting element 20B emits red light, and the third light-emitting element 20C emits green light.

[0180] In the light-emitting device 1C, one or more second relay components 40B are arranged in the row-outside regions on both sides of the column direction, sandwiching the inter-row region. The light-emitting device 1C includes one or more second relay components 40B arranged in the first or second row-outside regions, and one or more second relay components 40B arranged in the third or fourth row-outside regions. The illustrated light-emitting device 1C includes one or more second relay components 40B arranged in the second row-outside region and multiple second relay components 40B arranged in the third row-outside region.

[0181] The light-emitting device 1C includes a plurality of first light-emitting elements 20A disposed at both ends of a row and arranged between the two ends, and a plurality of third light-emitting elements 20C disposed so as to sandwich the first light-emitting elements 20A disposed between the two ends. The plurality of third light-emitting elements 20C are symmetrically arranged with respect to the first light-emitting element 20A disposed between the two ends.

[0182] The relationship between the wavelengths and arrangement of the plurality of second light-emitting elements 20B arranged in the row direction in the illustrated light-emitting device 1C is similar to that of the plurality of first light-emitting elements 20A in the light-emitting device 1 or the plurality of first light-emitting elements 20A in the light-emitting device 1B. In the light-emitting device 1C, the second light-emitting elements 20B having the first wavelength, the second light-emitting elements 20B having the second wavelength, and the second light-emitting elements 20B having the third wavelength are arranged in the same manner as the plurality of first light-emitting elements 20A in the light-emitting device 1B.

[0183] In the light-emitting device 1C, one or more first light-emitting elements 20A are electrically connected to one first wiring 161 and one second wiring 162, one or more second light-emitting elements 20B are electrically connected to two second wirings 162, and one or more third light-emitting elements 20C are electrically connected to one first wiring 161 and one second wiring 162.

[0184] <Fourth Modification>

[0185] Figure 9 This is a top view illustrating the wiring electrically connecting multiple light-emitting elements included in a light-emitting device 1D according to a fourth variation. In the light-emitting device 1D, a first light-emitting element 20A, a second light-emitting element 20B, and a third light-emitting element 20C are arranged in a row. Furthermore, the first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C are arranged in one of two rows. Furthermore, in the first and second rows, light-emitting elements 20 emitting the same color are arranged in the same column.

[0186] In the illustrated example of light-emitting device 1A, the fifth to seventh columns of the first row and the fifth to seventh columns of the second row constitute first light-emitting elements 20A, the third and fourth columns of the first row and the third and fourth columns of the second row constitute second light-emitting elements 20B, and the first and second columns of the first row and the first and second columns of the second row constitute third light-emitting elements 20C. First light-emitting elements 20A emit red light, second light-emitting elements 20B emit blue light, and third light-emitting elements 20C emit green light.

[0187] In the light-emitting device 1D, second relays 40B are arranged in two rows in the non-row region. One or more second relays 40B are arranged in each row. The current paths of the one or more second relays 40B arranged in the first row and the one or more second relays 40B arranged in the second row electrically connect the light-emitting elements 20 emitting light of different colors.

[0188] In the light-emitting device 1D, one or more first relay components 40A are disposed in the inter-row region to electrically connect the first light-emitting elements 20A in the first and second rows. One or more first relay components 40A are disposed in the inter-row region to electrically connect the second light-emitting elements 20B in the first and second rows. One or more first relay components 40A are disposed in the inter-row region to electrically connect the third light-emitting elements 20C in the first and second rows.

[0189] In the light-emitting device 1D, the relay 40 that is connected to the wiring 60 that is both the first light-emitting element wiring 60A and the second light-emitting element wiring 60B is not disposed in the first inter-row region. The relay 40 that is connected to the wiring 60 that is both the first light-emitting element wiring 60A and the third light-emitting element wiring 60C is not disposed in the first inter-row region. The relay 40 that is connected to the wiring 60 that is both the second light-emitting element wiring 60B and the third light-emitting element wiring 60C is not disposed in the first inter-row region.

[0190] <Second embodiment>

[0191] Next, a light emitting device 2 according to a second embodiment will be described. Figures 1 to 3 as well as Figure 10 It is a diagram for explaining an exemplary embodiment of the light emitting device 2 . Figure 1 It is a perspective view of the light emitting device 2 . Figure 2 2 is a top view of the light emitting device 2 . Figure 3 yes Figure 2 Cross-sectional view at section line III-III. Figure 10This is a plan view illustrating the state of wiring electrically connecting a plurality of light-emitting elements included in the light-emitting device 2. In the second embodiment, the inter-row area, the intra-row area, and the extra-row area have the same definitions as those described in the light-emitting device 1 of the first embodiment.

[0192] The light-emitting device 2 includes multiple components. These components include a base 10, multiple light-emitting elements 20, multiple bases 30, one or more relay components 40, multiple reflective members 50, multiple wirings 60, a sealing member 70, and a lens member 80. It should be noted that the light-emitting device 2 may also include other components. Furthermore, the light-emitting device 2 may not include some of the components listed here.

[0193] In the description of the light emitting device 1 and each component of the first embodiment, the light emitting device 2 Figures 1 to 3 as well as Figure 10 If there is no inconsistency in the comparison of the figures, it can be said that the same is true for the light emitting device 2.

[0194] In the light emitting device 2, the plurality of light emitting elements 20 include one or more first light emitting elements 20A and one or more second light emitting elements 20B. The first light emitting elements 20A and the second light emitting elements 20B are electrically connected so as to be independently drivable.

[0195] The first light emitting element 20A and the second light emitting element 20B emit light of the same color. The first light emitting element 20A and the second light emitting element 20B emit light of a color selected from red, green, and blue. For example, the first light emitting element 20A and the second light emitting element 20B emit blue light.

[0196] For example, by connecting all the light-emitting elements 20 arranged in the row direction in series and driving the light-emitting elements 20 in different rows individually, the total size of the light emitted by each element can be kept within a region that is closer to a square. Such a region may be preferable for optical control.

[0197] Alternatively, the first light-emitting element 20A and the second light-emitting element 20B may emit light of different colors. The first light-emitting element 20A and the second light-emitting element 20B may emit light of different colors selected from red, green, and blue. For example, the first light-emitting element 20A may emit blue light, and the second light-emitting element 20B may emit green light.

[0198] In the illustrated example of light-emitting device 2, the first to fifth columns of the first row and the first to fifth columns of the second row are first light-emitting elements 20A, while the sixth and seventh columns of the first row and the sixth and seventh columns of the second row are second light-emitting elements 20B. First light-emitting elements 20A emit blue light, and second light-emitting elements 20B emit green light.

[0199] In the matrix arrangement of the plurality of light emitting elements 20, both the first light emitting elements 20A and the second light emitting elements 20B are arranged in the same row of two adjacent rows. In each of the two adjacent rows, the plurality of first light emitting elements 20A and the plurality of second light emitting elements 20B are arranged in the same row.

[0200] exist Figure 10 In the example of the light emitting device 2 shown, the relays 40 are arranged in the row region based on the reflective members 50 arranged in the first row. Furthermore, the relays 40 are arranged in the row region based on the reflective members 50 arranged in the second row.

[0201] In the light-emitting device 2, two first wirings 161 among the plurality of wirings 16 are joined to the first light-emitting element wiring 60A, and two second wirings 162 among the plurality of wirings 16 are joined to the second light-emitting element wiring 60B. The first light-emitting element wiring 60A is not joined to any of the plurality of second wirings 162, and the second light-emitting element wiring 60B is not joined to any of the plurality of first wirings 161.

[0202] In a plan view, the first light emitting element 20A and the second light emitting element 20B adjacent to each other in the row direction (in Figure 10 The relay 40 joined to the first light emitting element wiring 60A and the relay 40 joined to the second light emitting element wiring 60B are arranged between two imaginary lines parallel to the column direction (the first light emitting elements 20A in the fifth column and the second light emitting elements 20B in the sixth column).

[0203] Between these two imaginary lines, the relay component 40 bonded to the first light-emitting element wiring 60A is arranged in the inter-row area, while the relay component 40 bonded to the second light-emitting element wiring 60B is arranged in the off-row area. In the illustrated example of the light-emitting device 2, the relay component 40 bonded to the first light-emitting element wiring 60A is arranged in the first inter-row area A1, and the relay component 40 bonded to the second light-emitting element wiring 60B is arranged in the first off-row area and the third off-row area, respectively.

[0204] Except for the third relay 40C, no relay 40 bonded to the first light-emitting element wiring 60 is disposed in the region where the first and second out-of-row regions overlap, or in the region where the third and fourth out-of-row regions overlap. One or more relays 40 bonded to the second light-emitting element wiring 60, that is, relays 40 other than the third relay 40C, are disposed in each of the regions where the first and second out-of-row regions overlap, and in the regions where the third and fourth out-of-row regions overlap.

[0205] In the first light-emitting element 20A and the second light-emitting element 20B that are adjacent to each other in the row direction, when the configuration area is divided into two parts using an imaginary line passing through the first light-emitting element 20A and parallel to the column direction, the second light-emitting element wiring 60B and the relay component 40 connected to the second light-emitting element wiring 60B are not configured in the area that does not include the second light-emitting element 20B.

[0206] In the first light-emitting element 20A and the second light-emitting element 20B that are adjacent to each other in the row direction, when the configuration area is divided into two parts using an imaginary line passing through the second light-emitting element 20B and parallel to the column direction, the first light-emitting element wiring 60A and the relay component 40 connected to the first light-emitting element wiring 60A are not configured in the area that does not include the first light-emitting element 20A.

[0207] <Variations of the Second Embodiment>

[0208] Next, light-emitting devices according to variations of the second embodiment will be described. Several variations are presented below, each of which differs from the arrangement of the plurality of light-emitting elements 20 in the light-emitting device 2 of the second embodiment. Consequently, the different arrangements of the plurality of light-emitting elements 20 may result in different connection methods for the wiring 60 and different arrangements for the relay components 40.

[0209] In the light emitting devices of each modified example, the base 10, reflecting member 50, sealing member 70, and lens member 80 are the same as those of the light emitting device 2 of the second embodiment. Therefore, these components are the same as those described in the light emitting device 1 of the first embodiment.

[0210] In the light emitting devices of the respective modifications, the description of the components of the light emitting element 20 , the base 30 , the relay 40 , and the wiring 60 can be said to be the same as the description of the components in the first embodiment.

[0211] Figure 1 is a perspective view of a light emitting device according to each modified example, Figure 11 and 2 are plan views of light emitting devices according to various modifications. In various modifications, the inter-row area, the intra-row area, and the extra-row area have the same definitions as those described in the light emitting device 1 according to the first embodiment.

[0212] and, Figure 11 and Figure 12 The following drawings relate to the various modifications described below. The light-emitting devices of the various modifications have already been described for the light-emitting device 2 of the second embodiment. For details that do not differ from the drawings of the modifications, the same descriptions can be applied to the light-emitting devices of the modifications.

[0213] <First Modification>

[0214] Figure 11 This is a plan view illustrating the wiring electrically connecting multiple light-emitting elements included in a light-emitting device 2A according to a first modification. In the illustrated light-emitting device 2A, the first through fourth columns of the first row and the first through fourth columns of the second row are first light-emitting elements 20A, while the fifth through seventh columns of the first row and the fifth through seventh columns of the second row are second light-emitting elements 20B.

[0215] As shown in the second embodiment and the first modification, the first light emitting element 20A is arranged on one side and the second light emitting element 20B is arranged on the other side with two adjacent specific columns as the boundary in a plurality of rows. In this case, the specific two columns can be selected as appropriate.

[0216] <Second Modification>

[0217] Figure 12 This is a plan view illustrating the wiring electrically connecting multiple light-emitting elements included in a light-emitting device 2B according to a second modified example. In the illustrated light-emitting device 2B, the first to third columns of the first row and the first to fourth columns of the second row are first light-emitting elements 20A, while the fourth to seventh columns of the first row and the fifth to seventh columns of the second row are second light-emitting elements 20B.

[0218] In the light-emitting device 2B, an equal number of first light-emitting elements 20A and second light-emitting elements 20B are arranged in two rows and M columns (M is an odd number greater than or equal to 3). Furthermore, only in the center column (the column obtained by dividing M+1 by 2) of the M columns are first light-emitting elements 20A arranged in one of the two rows, and second light-emitting elements 20B arranged in the other. In the remaining columns, either first light-emitting elements 20A or second light-emitting elements 20B are arranged in both rows.

[0219] Between imaginary lines parallel to the column direction of the light-emitting elements 20 arranged in the columns adjacent to the central column, a relay component 40 bonded to the first light-emitting element wiring 60A and a relay component 40 bonded to the second light-emitting element wiring 60B are arranged. In the inter-row region, a relay component 40 bonded to the first light-emitting element wiring 60A is arranged between these two imaginary lines.

[0220] <Third embodiment>

[0221] A light emitting device 3 according to a third embodiment will be described. Figures 13 to 16D It is a diagram for explaining an exemplary embodiment of the light emitting device 3 . Figure 13 This is a schematic diagram of the light emitting element 20 in the light emitting device 3 . Figure 14A and Figure 14B 1 and 2 are plan views each showing an example of conventional wiring with respect to the light emitting element 20 . Figures 15A to 15F 3 is a top view showing an example of wiring with respect to the light emitting element 20 in the light emitting device 3. Figures 13 to 15F , the waveguide 22 is marked with a dotted line. Figure 16A Yes Figure 14A 、 Figure 14B 、 Figure 15A and Figure 15B This figure compares the temperature characteristics of light output in wiring examples. Figure 16B Yes Figure 14A 、 Figure 14B 、 Figure 15A and Figure 15B This figure compares the temperature characteristics of the forward voltage in an example of wiring. Figure 16C Yes Figure 15B 、 Figure 15C and Figure 15D This figure compares the temperature characteristics of the forward voltage in an example of wiring. Figure 16D Yes Figure 15A 、 Figure 15E and Figure 15F This figure compares the temperature characteristics of the forward voltage in an example of wiring.

[0222] It should be noted that Figures 1 to 9 This figure also illustrates the light emitting device 3. The description of the light emitting device of the first embodiment and each modified example is also considered as the description of the light emitting device 3. However, in the description of the light emitting device of the first embodiment and each modified example, the description of the light emitting device of the first embodiment and each modified example is omitted. Figures 13 to 16D Any content that conflicts between the drawings of the light-emitting device 3 and the following description of the light-emitting device 3 does not apply to the description of the light-emitting device 3.

[0223] The light emitting device 3 includes a plurality of components, including a base 10 , one or more light emitting elements 20 , one or more bases 30 , one or more relays 40 , one or more reflective members 50 , a plurality of wirings 60 , a sealing member 70 , and a lens member 80 .

[0224] It should be noted that the light-emitting device 3 may include other components. Furthermore, the light-emitting device 3 may not have the same structure as the light-emitting device of the first embodiment or its variations. Furthermore, the invention disclosed by the light-emitting device 3 of the second embodiment is not limited to light-emitting devices in which a plurality of light-emitting elements arranged in a row are divided into two or more independently drivable groups and electrically connected.

[0225] The one or more light-emitting elements 20 included in the light-emitting device 3 include a light-emitting element 20 having two or more light-emitting points 21 in the light-emitting surface. For example, the light-emitting element 20 is a semiconductor laser element. Furthermore, in the light-emitting device 3, the first light-emitting element 20A can be such a light-emitting element 20 having two or more light-emitting points 21. Hereinafter, for convenience of explanation, the light-emitting device 3 will be described using the first light-emitting element 20A as the light-emitting element 20. It should be noted that the second light-emitting element 20B or the third light-emitting element 20C can replace the first light-emitting element 20A or be the same as the first light-emitting element 20A and have two or more light-emitting points 21 in the light-emitting surface.

[0226] The first light-emitting element 20A includes two or more waveguides 22 corresponding to different light exit points 21. In a top view, the two or more waveguides 22 extend perpendicular to the light exit surface. It should be noted that the term "perpendicular" here includes a difference of ±5 degrees. Furthermore, the waveguides 22 may be arranged so as not to extend perpendicular to the light exit surface.

[0227] Figure 13 The light emitting element 20 is shown as having two light exit points 21 (a first light exit point 21A and a second light exit point 21B). The light emitting element 20 is also shown as having a first waveguide 22A corresponding to the first light exit point 21A and a second waveguide 22B corresponding to the second light exit point.

[0228] Figure 14A and Figure 14B The following illustrates a conventional method for bonding wiring 60 to a first light-emitting element 20A having two light-emitting points 21 and two waveguides 22. As shown in these figures, wiring 60 is bonded to the upper surface of the first light-emitting element 20A, which intersects the light-emitting surface, with the bonding position directly above each waveguide 22. Furthermore, the number of wirings 60 bonded directly above each waveguide 22 is equal.

[0229] Such a joining scheme can be considered to be based on the technical idea of joining the wiring 60 as evenly or symmetrically as possible relative to each waveguide 22 so that the current flows evenly, ensuring that the light output and the electrical load of each waveguide 22 are not biased, thereby enabling the light-emitting element to operate stably.

[0230] On the other hand, depending on the degree of current applied to the first light emitting element 20, it may be preferable to have a plurality of wirings 60 connected to the first light emitting element 20A instead of one. Figure 14A or Figure 14B That is, according to this technical concept, the number of wirings 60 connected to the first light-emitting element 20A is configured to be an integer multiple of the number of waveguides 22. For example, if it is desirable to have two wirings 60 due to the relationship with the applied current, and considering the electrical load on each waveguide 22, it is possible to provide two wirings 60 for each waveguide 22.

[0231] Figures 15A to 15F The example shown here is a method for bonding the wires 60 that is not based on such conventional methods and their technical concepts. The bonding state shown here can be applied to a light-emitting device 3 in which two or more but no more than five wires 60 are bonded to the upper surface of a single first light-emitting element 20A. Furthermore, the present invention is not limited to this embodiment and can also be applied to a light-emitting device 3 in which six or more wires 60 are bonded to the upper surface of a single first light-emitting element 20A.

[0232] A plurality of wirings 60 are bonded to the upper surface of the first light-emitting element 20A in the light-emitting device 3. The first light-emitting element wiring 60A includes a plurality of wirings 60 bonded to the upper surface of the first light-emitting element 20A. It should be noted that the plurality of wirings 60 bonded to the upper surface of a first light-emitting element 20A mentioned here may refer to wirings 60 bonded to the upper surface of the first light-emitting element 20A at one end and bonded to a common component other than the light-emitting element 20A at the other end. In other words, the plurality of wirings 60 may not include wirings 60 bonded to different components at the other end. For example, among the plurality of wirings 60 bonded to the upper surface of the first light-emitting element 20A, if there are a plurality of wirings 60 bonded to the base 30 at the other end and a wiring 60 bonded to the Zener diode at the other end, the latter can be excluded from the object.

[0233] like Figures 15A to 15F As shown in FIG. 1 , the number of wirings 60 bonded to the upper surface of one first light emitting element 20A is two or more. Figures 15B to 15DAs shown, the number of wirings 60 bonded to the upper surface of a single first light-emitting element 20A is three or more. Thus, the number of wirings 60 bonded to the upper surface of a single first light-emitting element 20A can be either an even number or an odd number. In other words, a configuration in which an odd number of wirings 60 bonded to a light-emitting element 20 having two waveguides 22 is possible.

[0234] In the top view, in the light-emitting device 3, the number of wirings 60 existing in the area overlapping with the first waveguide 22A and the number of wirings 60 existing in the area overlapping with the second waveguide 22B at the bonding position on the upper surface of the first light-emitting element 20A are both 0, or, when at least one of them is more than one, their numbers are not the same. Figure 15A 、 Figure 15B 、 Figure 15E and Figure 15F represents an example of the former (all zero), Figure 15C and Figure 15D The latter example is shown (one or more and not the same number of either one). Note that the bonding position refers to the center point of the bonding shape of the wiring 60 bonded to the upper surface.

[0235] The plurality of wirings 60 bonded to the top surface of the first light-emitting element 20A are located in the region between an imaginary line perpendicular to the light-emitting surface (hereinafter referred to as the first imaginary line) passing through the point of the first waveguide 22A closest to the second waveguide 22B and passing through the imaginary line perpendicular to the light-emitting surface (hereinafter referred to as the second imaginary line) passing through the point of the second waveguide 22B closest to the first waveguide 22A. It should be noted that the region between the first and second imaginary lines does not include the region above the first and second imaginary lines. Figure 15A 、 Figure 15B 、 Figure 15E and Figure 15F By setting the bonding position of the wiring 60 in this region, the wiring 60 can be bonded more stably than, for example, bonding the wiring 60 to one end of the upper surface of the first light emitting element 20A.

[0236] The plurality of wirings 60 bonded to the upper surface of the first light-emitting element 20A are bonded only to the region bounded by the first imaginary line and encompassing the second waveguide 22B in a top view, or only to the region bounded by the second imaginary line and encompassing the first waveguide 22A in a top view. It should be noted that even if these regions are identified, they do not include the first or second imaginary lines. Figure 15D This is an example of the former. Figure 15C The following are examples of the latter.

[0237] With respect to the plurality of wirings 60 bonded to the upper surface of the first light-emitting element 20A, when the upper surface of the first light-emitting element 20A is divided into two parts with the first imaginary line as the boundary, the number of wirings 60 having bonding positions in an area that does not include the second waveguide 22B in a top view is zero. Furthermore, when the upper surface of the first light-emitting element 20A is divided into two parts with the second imaginary line as the boundary, the number of wirings 60 having bonding positions in an area that does not include the first waveguide 22A in a top view is zero. It should be noted that even if these areas are identified, they do not include the first imaginary line and the second imaginary line. Figure 15A 、 Figure 15B 、 Figure 15E and Figure 15F This example is shown.

[0238] With respect to the plurality of wirings 60 bonded to the upper surface of the first light-emitting element 20A, when the upper surface of the first light-emitting element 20A is divided into two parts with the imaginary line (hereinafter referred to as the third imaginary line) being the midline between the first and second imaginary lines as the boundary, the number of wirings 60 bonded to the region on the first waveguide 22A side and the number of wirings 60 bonded to the region on the second waveguide 22B side are different if both are zero or if at least one of them has one or more. It should be noted that even if these regions are identified, the third imaginary line is not included.

[0239] On the upper surface of the first light-emitting element 20A, in a direction perpendicular to the light-emitting surface, the distance between the wiring 60 located closest to the light-emitting surface and the wiring 60 located farthest from the light-emitting surface is greater than the absolute value of the difference between the distance between the light-emitting surface and the wiring 60 located closest to the light-emitting surface and the distance between the surface on the opposite side of the light-emitting surface and the wiring 60 located farthest from the light-emitting surface. Figures 15A to 15F In addition to Figure 15E All other numbers are examples.

[0240] In a direction perpendicular to the light emitting surface, the distance between the plurality of wirings 60 bonded to the upper surface of the first light emitting element 20A is not less than 200 μm and not more than 500 μm. The number of the plurality of wirings 60 bonded to the upper surface of the first light emitting element 20A is not less than the number obtained by dividing the length of the plurality of wirings 60 bonded to the upper surface of the first light emitting element 20A in the direction perpendicular to the light emitting surface by 500 μm (decimals are rounded down) and not more than the number obtained by dividing the length of the plurality of wirings 60 bonded to the upper surface of the first light emitting element 20A in the direction perpendicular to the light emitting surface by 200 μm (decimals are rounded down).

[0241] Below, consider 16A to 16D It should be noted that in 16A to 16DIn the experiment, a semiconductor laser element emitting laser light with a peak wavelength of 643 nm was used as the first light emitting element 20A. Figures 15A to 15F For each state of the connection of the wiring 60, five first light emitting elements 20A are prepared, and the average of the five measured values is calculated. 16A to 16D The measurement results are plotted in . Furthermore, the temperature characteristics were measured at 25°C, 45°C, and 60°C. The temperature was obtained by driving the semiconductor laser element in a sealed package and measuring the package temperature.

[0242] like Figure 16A As shown, even when the number of wires 60 bonded to the top surface of the first light-emitting element 20A is changed, no significant difference is observed in the temperature characteristics of the light output [W]. Furthermore, no significant difference is observed compared to the conventional bonding scheme for the wires corresponding to the respective waveguides 22. In other words, even when the bonding scheme is not the same as the conventional one, the temperature characteristics of the light output Po [W] are not significantly affected.

[0243] like Figure 16B As shown, there is a tendency that the smaller the number of the plurality of wirings 60 bonded to the upper surface of the first light emitting element 20A, the higher the forward voltage Vf [V]. On the other hand, the rate of change of Vf with respect to temperature change ( Figure 16B No significant difference was observed in terms of the inclination angles of the individual lines in the wiring diagram. Reducing the number of wirings 60 not only reduces manufacturing costs but also shortens manufacturing time, improving productivity. To balance this with the increase in Vf, the number of wirings 60 bonded to the top surface of the first light-emitting element 20A is preferably three or more and five or less.

[0244] like Figure 16C As shown, in the top view, when the direction perpendicular to the light emitting surface is the up-down direction, even if the same number of wirings 60 are arranged close to the center, close to the right, or close to the left, no significant difference is found when comparing the various arrangements. Figures 15B to 15D In this example, the faulty transmitter was checked for deviations by increasing the applied current. No different trends or regularities were observed between those closer to the center, those closer to the right, and those closer to the left. This means that even when wiring 60 is positioned closer to either side from the center, it can be assumed that there is no significant deviation in the current applied to the waveguide 22 closer to the wiring 60 and those farther away.

[0245] like Figure 16D As shown, the same number of wiring 60 is connected as shown in FIG. Figure 15E Compared with that connection, Figure 15A or Figure 15F That way the Vf is lower. Figure 15E The point where a plurality of wirings 60 are joined at a narrow interval near the light emitting surface is Figure 15A and Figure 15F Different. A plurality of wirings 60 are joined at wide intervals near the light emitting surface. Figure 15A and a plurality of wirings 60 joined at narrow intervals at a position away from the light emitting surface. Figure 15F In comparison, it is conceivable that the relationship between the distance from the light emitting surface, the interval or distance between the plurality of wirings 60 , the distance from the surface opposite to the light emitting surface, and the like may affect the temperature characteristics of Vf.

[0246] It should be noted that, in the illustrated light emitting device 3, a light emitting element 20 having two waveguides 22 is exemplified. However, even in a light emitting element 20 having three or more waveguides 22, the wiring 60 bonding scheme described in the second embodiment can be applied.

[0247] For example, in a top view, on the upper surface of a light-emitting element 20 having two or more waveguides 22, the number of wirings 60 in the area where the bonding position overlaps with the waveguide 22 relative to each waveguide 22 is zero or at least one of them is one or more, and their numbers are not the same.

[0248] Furthermore, for example, in a top view, the bonding positions of the plurality of wirings 60 bonded to the upper surface of a light-emitting element 20 having two or more waveguides 22 are located in a region centered when an imaginary line parallel to the direction in which the waveguides 22 extend divides the upper surface of the light-emitting element 20 into three equal parts. Furthermore, if the number of wirings 60 bonded to the regions at both ends is zero or at least one of them is one or more, the numbers of wirings 60 are not the same.

[0249] Furthermore, without resorting to conventional bonding schemes, the number of wires 60 bonded to the top surface of a light-emitting element 20 having two or more waveguides 22 can be reduced to less than the number of waveguides 22 multiplied by two. It should be noted that the wire diameter (Ø) of the wires 60 in this case can be between 50 μm and 100 μm. A larger wire diameter provides greater stability and increases the current that can be applied, so a wire diameter of 50 μm or more is recommended. Furthermore, to prevent the wire bonding profile on the top surface of the light-emitting element 20 from becoming excessively large, a wire diameter of 100 μm or less is preferred.

[0250] Furthermore, in a light-emitting element 20 having two or more waveguides 22, the thickness of the electrode bonded to the wiring 60 can be greater than 0.1 μm and less than 10 μm. Furthermore, the thickness of the electrode is preferably greater than 0.3 μm and less than 0.5 μm. Sufficiently ensuring the thickness of the electrode facilitates current propagation. For example, based on the strength relationship of the substrate, it is possible that the electrode thickness is greater for a semiconductor laser element containing a GaAs-based semiconductor than for a semiconductor laser element containing a GaN-based semiconductor. In the case where the light-emitting element 20 having two or more waveguides 22 is a GaAs-based semiconductor laser element, the wiring bonding scheme of this embodiment can be considered suitable.

[0251] The embodiments of the present invention have been described above. The light-emitting device of the present invention is not strictly limited to the light-emitting devices of the embodiments and the various modified examples. In other words, the present invention is not necessarily limited to the appearance and structure of the light-emitting devices disclosed in the embodiments or the various modified examples. Moreover, it is not necessary to fully possess all the constituent elements and they can be applied flexibly. For example, in the case where the claims do not record a part of the constituent elements of the light-emitting device disclosed in the embodiments, these constituent elements are the design freedom of those skilled in the art to allow replacement, omission, deformation of shape, change of materials, etc., and on this basis, the constituent elements applicable to the invention recorded in the claims are determined.

[0252] Industrial Applicability

[0253] The light emitting device described in each embodiment can be used in a projector, a vehicle headlight, a head-mounted display, lighting, a display, and the like.

Claims

1. A light emitting device, characterized in that: have: A semiconductor laser element having an upper surface, a light emitting surface having two light emitting points consisting of a first light emitting point and a second light emitting point, and two waveguides consisting of a first waveguide corresponding to the first light emitting point and a second waveguide corresponding to the second light emitting point, the waveguides extending in a direction perpendicular to the light emitting surface; wiring lines, which are bonded to the upper surface and are in a number of two or more and five or less; In the top view, at the bonding position in the upper surface of the semiconductor laser element, the number of the wirings existing in the area overlapping with the first waveguide and the number of the wirings existing in the area overlapping with the second waveguide are both 0, or, when at least either side is more than one, their numbers are not the same.

2. The light emitting device according to claim 1, wherein The two or more and five or less wirings are an odd number of wirings, which is three or five.

3. The light emitting device according to claim 1, wherein Each of the two or more and five or less wirings is bonded to the upper surface of the semiconductor laser element at one end and bonded to a common component other than the semiconductor laser element at the other end. The light emitting device according to claim 1 , wherein: The two or more and five or less wirings are bonded to the upper surface of the semiconductor laser element at intervals of 200 μm or more and 500 μm or less. The light emitting device according to claim 1 , wherein: The semiconductor laser element emits red light. The light emitting device according to claim 1 , wherein: For each of the two or more and five wirings, a bonding position with the upper surface of the semiconductor laser element is located in a region between a first imaginary line passing through a point of the first waveguide closest to the second waveguide and perpendicular to the light emitting surface, and a second imaginary line passing through a point of the second waveguide closest to the first waveguide and perpendicular to the light emitting surface, The area does not include the first imaginary line and the second imaginary line.

7. The light emitting device according to claim 2, wherein: For each of the two or more and five wirings, a bonding position with the upper surface of the semiconductor laser element is located in a region between a first imaginary line passing through a point of the first waveguide closest to the second waveguide and perpendicular to the light emitting surface, and a second imaginary line passing through a point of the second waveguide closest to the first waveguide and perpendicular to the light emitting surface, The area does not include the first imaginary line and the second imaginary line.

8. The light emitting device according to claim 3, wherein: For each of the two or more and five wirings, a bonding position with the upper surface of the semiconductor laser element is located in a region between a first imaginary line passing through a point of the first waveguide closest to the second waveguide and perpendicular to the light emitting surface, and a second imaginary line passing through a point of the second waveguide closest to the first waveguide and perpendicular to the light emitting surface, The area does not include the first imaginary line and the second imaginary line.

9. The light emitting device according to claim 4, wherein: For each of the two or more and five wirings, a bonding position with the upper surface of the semiconductor laser element is located in a region between a first imaginary line passing through a point of the first waveguide closest to the second waveguide and perpendicular to the light emitting surface, and a second imaginary line passing through a point of the second waveguide closest to the first waveguide and perpendicular to the light emitting surface, The area does not include the first imaginary line and the second imaginary line.

10. The light emitting device according to claim 5, wherein For each of the two or more and five wirings, a bonding position with the upper surface of the semiconductor laser element is located in a region between a first imaginary line passing through a point of the first waveguide closest to the second waveguide and perpendicular to the light emitting surface, and a second imaginary line passing through a point of the second waveguide closest to the first waveguide and perpendicular to the light emitting surface, The area does not include the first imaginary line and the second imaginary line.

11. The light emitting device according to claim 1, wherein For each of the two or more and five wirings, in a relationship between a first imaginary line that passes through a point of the first waveguide closest to the second waveguide and is perpendicular to the light emitting surface and a second imaginary line that passes through a point of the second waveguide closest to the first waveguide and is perpendicular to the light emitting surface, a bonding position with the upper surface of the semiconductor laser element exists only in a first region that includes the second waveguide in a top view and has the first imaginary line as a boundary, or exists only in a second region that includes the first waveguide in a top view and has the second imaginary line as a boundary, The first area does not include the first imaginary line, and the second area does not include the second imaginary line.

12. The light emitting device according to claim 2, wherein: For each of the two or more and five wirings, in a relationship between a first imaginary line that passes through a point of the first waveguide closest to the second waveguide and is perpendicular to the light emitting surface and a second imaginary line that passes through a point of the second waveguide closest to the first waveguide and is perpendicular to the light emitting surface, a bonding position with the upper surface of the semiconductor laser element exists only in a first region that includes the second waveguide in a top view and has the first imaginary line as a boundary, or exists only in a second region that includes the first waveguide in a top view and has the second imaginary line as a boundary, The first area does not include the first imaginary line, and the second area does not include the second imaginary line.

13. The light emitting device according to claim 3, wherein: For each of the two or more and five wirings, in a relationship between a first imaginary line that passes through a point of the first waveguide closest to the second waveguide and is perpendicular to the light emitting surface and a second imaginary line that passes through a point of the second waveguide closest to the first waveguide and is perpendicular to the light emitting surface, a bonding position with the upper surface of the semiconductor laser element exists only in a first region that includes the second waveguide in a top view and has the first imaginary line as a boundary, or exists only in a second region that includes the first waveguide in a top view and has the second imaginary line as a boundary, The first area does not include the first imaginary line, and the second area does not include the second imaginary line.

14. The light emitting device according to claim 4, wherein: For each of the two or more and five wirings, in a relationship between a first imaginary line that passes through a point of the first waveguide closest to the second waveguide and is perpendicular to the light emitting surface and a second imaginary line that passes through a point of the second waveguide closest to the first waveguide and is perpendicular to the light emitting surface, a bonding position with the upper surface of the semiconductor laser element exists only in a first region that includes the second waveguide in a top view and has the first imaginary line as a boundary, or exists only in a second region that includes the first waveguide in a top view and has the second imaginary line as a boundary, The first area does not include the first imaginary line, and the second area does not include the second imaginary line.

15. The light emitting device according to claim 5, wherein For each of the two or more and five wirings, in a relationship between a first imaginary line that passes through a point of the first waveguide closest to the second waveguide and is perpendicular to the light emitting surface and a second imaginary line that passes through a point of the second waveguide closest to the first waveguide and is perpendicular to the light emitting surface, a bonding position with the upper surface of the semiconductor laser element exists only in a first region that includes the second waveguide in a top view and has the first imaginary line as a boundary, or exists only in a second region that includes the first waveguide in a top view and has the second imaginary line as a boundary, The first area does not include the first imaginary line, and the second area does not include the second imaginary line.

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