Loudspeaker module, method of assembling the same and electronic device

Abstract

The application provides a loudspeaker module, an assembling method thereof and an electronic device, and relates to the technical field of loudspeakers. The loudspeaker module comprises a shell, a core and a shielding piece. The core is fixed to the shell and divides the space in the shell into a front cavity and a rear cavity. The core comprises a first outer surface and a first outer peripheral surface. The first outer surface faces away from the front cavity, and the first outer peripheral surface surrounds the outer periphery of the first outer surface. The core is further provided with a first lap joint groove. The first lap joint groove penetrates the first outer surface and the first outer peripheral surface. The shell is provided with a first wall plate. The first wall plate is fixed in the first lap joint groove. The shielding piece is arranged in the rear cavity and located on the circumferential outer side of the core. The side of the shielding piece away from the core is filled with sound-absorbing material between the shielding piece and the shell. The core is provided with a first air permeable hole. The shielding piece is provided with a second air permeable hole. The first air permeable hole and the second air permeable hole are in communication.

Description

Technical Field

[0001] This application relates to the field of loudspeaker technology, and in particular to a loudspeaker module, its assembly method, and an electronic device. Background Technology

[0002] Speaker modules are used to convert audio electrical signals such as music and voice into sound, and have the function of supporting external audio playback. Therefore, they are increasingly widely used in electronic devices such as mobile phones, tablets, and laptops.

[0003] With the development of electronic devices such as mobile phones and tablets, people have higher demands for the audio experience of speaker modules. Higher low-frequency loudness brings a better audio experience. In related technologies, the settings for improving low-frequency loudness will affect the overall thickness of the speaker module, making the overall thickness of the speaker module thicker. Summary of the Invention

[0004] This application provides a speaker module, its assembly method, and an electronic device, which can reduce the overall thickness of the speaker module.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] In a first aspect, this application provides a speaker module, including a housing, a core, and a shielding member. The core is fixed to the housing and divides the space inside the housing into a front cavity and a rear cavity. The core includes a first outer surface and a first outer peripheral surface. The first outer surface faces away from the front cavity, and the first outer peripheral surface surrounds the outer periphery of the first outer surface. The core is also provided with a first overlapping groove that penetrates the first outer surface and the first outer peripheral surface. The housing has a first wall panel that is fixed in the first overlapping groove. The shielding member is disposed in the rear cavity and located on the circumferential outer side of the core. The side of the shielding member facing away from the core and the housing are filled with sound-absorbing material. The core has a first vent hole, and the shielding member has a second vent hole that communicates with the first vent hole.

[0007] The speaker module in this application, through the setting of the rear shell structure, makes the first wall plate of the rear shell fixed in the first overlapping groove of the core, thereby realizing the setting of the partial structure of the core exposed. The thickness of the core in the Z direction is a1, and the thickness of the first wall plate in the Z direction is a2. Since the first wall plate is embedded in the first overlapping groove on the outer periphery of the magnetic conductor, the thickness of the rear shell does not affect the thickness of the speaker module. The total thickness of the core and the rear shell of the speaker module in the Z direction is b = a1, thus realizing the thinning of the speaker module.

[0008] Meanwhile, the first wall panel of the housing is fixed in the first overlapping groove and the shielding member is completely placed in the rear cavity. If glue is applied between the first wall panel and the first overlapping surface, the glue will spread along the first wall panel and the first overlapping surface when it overflows. This avoids the glue in the first overlapping groove from spreading directly to the shielding member, reducing the risk of glue flowing to the shielding member and clogging the second vent hole, thereby improving the acoustic performance of the speaker module.

[0009] In one possible implementation of the first aspect, the housing includes a front housing and a rear housing. The rear housing includes a first wall panel, and the front housing includes a side panel and a front wall panel. The front and rear housings are assembled to form a receiving cavity. The core is located within the receiving cavity of the housing and divides the receiving cavity into a front cavity and a rear cavity. That is, the core and the front housing define the front cavity. The core, the front housing, and the rear housing define the rear cavity. In this way, the housing forms an independent housing structure, allowing the speaker module itself to form a closed rear cavity.

[0010] In one possible implementation of the first aspect, the core includes a diaphragm and a driving device. The diaphragm may be located on the side facing the front cavity, and the driving device may be located in the rear cavity. The driving device is used to drive the diaphragm to vibrate, and the diaphragm vibration can drive the air in the front cavity to vibrate, thereby generating sound waves that are transmitted to the outside of the electronic device so that the user can receive the sound waves.

[0011] In one possible implementation of the first aspect, the driving device includes a voice coil fixedly connected to the diaphragm, a magnetic circuit system disposed on one side of the diaphragm, and a frame for mounting the diaphragm and the magnetic circuit system. When energized, the voice coil generates an induced magnetic field, which interacts with the magnetic field of the magnetic circuit system, causing the voice coil to displace under the magnetic force of the magnetic circuit system, thereby driving the diaphragm to vibrate.

[0012] In one possible implementation of the first aspect, the core includes a magnetic conductor. Specifically, the core includes a magnetic circuit system comprising the magnetic conductor and a magnet assembly. The magnet assembly is connected to the magnetic conductor, and a magnetic gap is formed within the magnet assembly. When the voice coil receives a signal from the signal receiving structure, the voice coil drives the diaphragm to vibrate under the influence of the magnetic field within the magnetic gap. By constraining the magnetic lines of force through the magnetic conductor, the magnetic field strength within the magnetic gap can be increased, thereby enhancing the driving strength of the diaphragm.

[0013] In one possible implementation of the first aspect, and with the first overlapping groove formed on the magnetic conductor to create an exposed magnetic conductor configuration, the housing does not need to completely cover the core, thereby reducing the thickness of the speaker module and facilitating the thinning of the speaker module.

[0014] In one possible implementation of the first aspect, the depth of the first overlapping groove is greater than or equal to 0.03 mm and less than or equal to 0.15 mm. For example, the depth of the first overlapping groove can be 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.15 mm, etc. In this way, the depth of the first overlapping groove is relatively shallow, which avoids the first overlapping groove being too deep and affecting the magnetic conductivity of the enhanced magnetic conductive component, while also enabling the thickness of the first wall panel to be set lightly.

[0015] In one possible implementation of the first aspect, the thickness of the first wall panel is less than or equal to the depth of the first lap groove, so that the first wall panel does not protrude from the core.

[0016] In one possible implementation of the first aspect, the bottom wall of the first lap groove forms a first lap surface, and the first wall panel is bonded to the first lap surface, thereby achieving a sealed connection between the rear shell and the core.

[0017] In one possible implementation of the first aspect, one of the kernel and the first wall panel is provided with a first positioning structure, and the other is provided with a second positioning structure. The first positioning structure is used to cooperate with the second positioning structure for positioning, so as to achieve accurate assembly of the first wall panel and the kernel.

[0018] In one possible implementation of the first aspect, the first positioning structure is a positioning groove, and the second positioning structure is a positioning protrusion. The positioning groove can be formed on the first wall panel and is connected to the third opening. The positioning protrusion is located on the magnetic conductor and protrudes to one side of the first overlapping groove. For example, in actual assembly, the positioning protrusion can be aligned with the positioning groove along the Z direction, and the first wall panel can be pushed into the first overlapping groove along the Z direction to complete the positioning of the positioning protrusion and the positioning groove.

[0019] In one possible implementation of the first aspect, the shielding member is connected to the side of the first wall panel facing the rear cavity, thereby completely covering and fixing the first wall panel in the rear cavity.

[0020] In one possible implementation of the first aspect, the first wall panel includes a first connecting part and a second connecting part that are connected to each other. The first connecting part is located in a first overlapping groove, and the second connecting part is located on the circumferential outer side of the core. The shielding member is connected to the second connecting part, thereby fixing the shielding member to the first wall panel. In the actual assembly process, it is not necessary to assemble and fix the shielding member and the core separately. The assembly between the shielding member and the core can be completed with the help of the rear shell.

[0021] In one possible implementation of the first aspect, the first connecting part and the second connecting part are integrally formed. That is, the first wall panel is directly formed through a one-time manufacturing process, and the connection between the first connecting part and the second connecting part is completed at the same time as the first connecting part is formed. There is no need to form the connection between the first connecting part and the second connecting part through other processes. For example, the first wall panel can be an integrally formed steel plate structure. In this way, not only can the processing technology of the first wall panel be simplified and the processing difficulty be reduced, but assembly efficiency and assembly difficulty can also be taken into account.

[0022] In one possible implementation of the first aspect, at least a portion of the first wall panel and the shielding member are integrally formed. For example, the second connecting portion of the first wall panel and the shielding member are integrally formed; or, the first connecting portion, the second connecting portion, and the shielding member are all integrally formed. For example, the first wall panel and the shielding member may be an integrally formed steel plate structure, and the shielding member has a second vent hole, thereby simplifying the processing technology of the first wall panel and the shielding member.

[0023] In one possible implementation of the first aspect, the shielding member includes a first body portion and a first flange portion connected together. The first body portion surrounds the outer periphery of the core, and a second vent is disposed on the first body portion. The first flange portion is located on the side of the first body portion away from the core and is connected to a first wall panel. The first flange portion has a connecting surface facing the first wall panel, and the connecting surface is fixedly connected to the first wall panel. Applying adhesive to the connecting surface side can make the adhesive application position as far away from the first body portion as possible, thereby reducing the risk of adhesive overflow clogging the second vent on the first body portion.

[0024] In one possible implementation of the first aspect, the connecting surface may include a first region and a second region. A gap is formed between the first region and the first wall panel, and no adhesive is applied in the gap. Adhesive is applied to the second region to form an adhesive layer between the second region and the first wall panel. When adhesive overflow occurs in the second region, the adhesive will first diffuse to the gap between the first region and the first wall panel, so that the gap in the second region forms a buffer effect and reduces the risk of adhesive overflowing directly onto the first body and blocking the second vent.

[0025] In one possible implementation of the first aspect, the first region is located on the side of the second region closer to the core, that is, the first region is located between the first body portion and the second region. In this way, the second region with the adhesive layer is located as far away from the first body portion as possible, further reducing the risk of adhesive overflow directly clogging the first body portion.

[0026] In one possible implementation of the first aspect, the shielding member includes a first flange portion that is not circumferentially arranged. The first flange portion itself forms a notch. Since the notch position no longer requires glue application, the first body portion can have more second vent holes in the area opposite to the notch in the Z direction compared to other areas of the first flange portion. In this case, even if the number of second vent holes increases and they are closer to the notch, there will be no risk of glue overflow clogging the holes.

[0027] In one possible implementation of the first aspect, the shielding member includes a plurality of non-circular first flanges spaced apart in the circumferential direction, with at least two first flanges forming a notch. Thus, the first body portion can have more second vent holes in the area opposite to the notch in the upward direction compared to other areas of the first flanges. In this case, even if the number of second vent holes increases and they are closer to the notch, there is no risk of glue overflow clogging the holes.

[0028] Secondly, this application provides a speaker module, including a housing, a core, a shield, and a seal. The core is fixed to the housing and divides the space within the housing into a front cavity and a rear cavity. The core includes a first outer surface and a first outer peripheral surface. The first outer surface faces away from the front cavity, and the first outer peripheral surface surrounds the outer periphery of the first outer surface. The core also has a first overlapping groove that penetrates the first outer surface and the first outer peripheral surface. The shield is located in the rear cavity and on the circumferential outer side of the core. The side of the shield facing away from the core is filled with sound-absorbing material between itself and the housing. The core has a first vent hole, and the shield has a second vent hole, which communicates with the first vent hole. The housing includes a second wall panel, and the shield is connected to the second wall panel and defines a second overlapping groove. The second overlapping groove is located on the circumferential outer side of the first overlapping groove and communicates with it. The speaker module also includes a seal, with a portion of the seal disposed within the first overlapping groove and another portion disposed within the second overlapping groove.

[0029] The speaker module in this application changes the structure of the rear housing and adds a seal, forming an exposed seal and magnetic conductor. Since the seal is embedded in the first and second overlapping grooves, and the second wall panel surrounds the circumferential outer side of the seal without superimposing on the magnetic conductor, the thickness of the rear housing does not affect the thickness of the speaker module. Thus, the total thickness b of the speaker module core and the rear housing in the Z direction is equal to the thickness a1 of the core in the Z direction, thereby achieving a thinner speaker module.

[0030] In one possible implementation of the second aspect, the housing includes a front housing and a rear housing. The rear housing includes a second wall panel, and the front housing includes a side panel and a front wall panel. The front and rear housings are assembled to form a receiving cavity. The core is located within the receiving cavity of the housing and divides the receiving cavity into a front cavity and a rear cavity. That is, the core and the front housing define the front cavity. The core, the front housing, and the rear housing define the rear cavity. In this way, the housing forms an independent housing structure, allowing the speaker module itself to form a closed rear cavity.

[0031] In one possible implementation of the second aspect, the bottom wall of the first overlapping groove forms a first overlapping surface, the bottom wall of the second overlapping groove 861 forms a second overlapping surface, the seal is bonded to the first overlapping surface, and the seal is bonded to the second overlapping surface, thereby realizing the connection between the core, the shield and the second wall panel, and sealing the rear cavity.

[0032] In one possible implementation of the second aspect, the seal includes a third inner surface connected to a first overlapping surface and a second overlapping surface. When applying adhesive between the third inner surface and the first overlapping surface, the adhesive can be applied to the side of the first overlapping surface away from the first outer peripheral surface. Similarly, when applying adhesive between the seal and the second overlapping surface, the adhesive can be applied to the side of the second overlapping surface away from the first outer peripheral surface. That is, adhesive is applied to the outer edge region of the third inner surface, thus keeping the adhesive as far away from the first outer peripheral surface as possible. Even if excess adhesive occurs, it will not flow onto the shielding member located on the circumferential outer side of the core and block the second vent, thereby improving the acoustic performance of the speaker module.

[0033] In one possible implementation of the second aspect, the thickness of the seal is less than or equal to the thickness of the first lap groove, so that the seal does not protrude from the core, thereby avoiding the seal being too thick and affecting the overall thickness of the speaker module.

[0034] In one possible implementation of the second aspect, the thickness of the seal is less than or equal to the thickness of the second lap groove, so that the seal does not protrude from the core, thereby avoiding the seal being too thick and affecting the overall thickness of the speaker module.

[0035] In one possible implementation of the second aspect, the thickness of the seal is less than or equal to the thickness of the first overlapping groove and the thickness of the seal is less than or equal to the thickness of the second overlapping groove, so that the seal does not protrude from the core, thereby avoiding the seal being too thick and affecting the overall thickness of the speaker module.

[0036] In one possible implementation of the second aspect, the depth of the second overlapping groove is greater than or equal to 0.03 mm and less than or equal to 0.15 mm, and the depth of the first overlapping groove can be equal to the depth of the second overlapping groove. For example, the depth of the second overlapping groove can be 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.15 mm, etc., thus making both the depth of the first and second overlapping grooves relatively shallow, allowing for a thinner and lighter design of the seal and the second wall panel.

[0037] In one possible implementation of the second aspect, the second wall panel does not protrude beyond the magnetic conductor, thus avoiding the rear housing being too thick and affecting the overall thickness of the speaker module.

[0038] In one possible implementation of the second aspect, the shielding member is integrally formed with the second wall panel. For example, the second wall panel is connected to the side of the first flange portion away from the front cavity, and the second wall panel, the first flange portion, and the first body portion are all integrally formed. For example, the second wall panel and the shielding member can be integrally formed steel plate structures. In this case, the cross-section of the second wall panel and the first flange portion can be Z-shaped, and the cross-section of the first flange portion and the first body portion can be L-shaped. The shielding member is provided with a second vent hole, thereby simplifying the processing technology of the second wall panel and the shielding member.

[0039] In one possible implementation of the second aspect, the sealant is a sealant. That is, after the first and second overlapping grooves are joined to form a sealing groove, sealant is applied to both the first and second overlapping grooves so that the sealant itself forms a sealant. The sealant connects the core and the shielding part while achieving the sealing of the rear cavity.

[0040] Thirdly, this application provides a method for assembling a speaker module, wherein the speaker module is the speaker module in any of the above embodiments, and the assembly method includes: connecting a shield to a housing to form a first component, and fixing a core to the first component.

[0041] The speaker module assembly method in this application does not require separate assembly and fixation between the shield and the core. The first part is first assembled with the shield using the rear housing to form the first component, and then the rear housing is fixed to the core to complete the assembly between the shield and the core.

[0042] In one possible implementation of the third aspect, the steps of fixing the kernel to the first component specifically include:

[0043] The core is fixed to the front shell to form a second component. At this point, the second component includes the core, the front wall panel, and the side panels.

[0044] The second component is fixed to the first component to form a speaker module. The speaker module at this time includes a core, a front wall panel, a side panel, a shield, and a housing; or, the speaker module at this time includes a core, a front wall panel, a side panel, a shield, a housing, and a seal.

[0045] In one possible implementation of the third aspect, when the housing includes a first wall panel, the assembly process of the speaker module is as follows: connecting a shield to one side of the first wall panel to form a first component including the shield and the first wall panel; fixing the core to the front housing to form a second component; connecting the first component and the second component to form a speaker module including the housing, the shield and the core.

[0046] In one possible implementation of the third aspect, when the housing includes a second wall panel, the assembly process of the speaker module is as follows: the shielding member is integrally formed with the second wall panel to form a first component including the shielding member and the second wall panel; the core is fixed to the front housing to form a second component; the first component and the second component are connected; and the seal is fixed in the sealing groove to form a speaker module including the housing, the shielding member, the seal, and the core.

[0047] Fourthly, this application provides an electronic device, including a housing and a speaker module, wherein the speaker module is disposed within the housing, and the speaker module is the speaker module in any of the above embodiments.

[0048] In one possible implementation of the fourth aspect, the speaker module has a sound outlet channel, and the housing is provided with a sound outlet hole. The sound signal output by the speaker module is output through the sound outlet channel. The sound signal output from the sound outlet channel is further output to the outside of the electronic device through the sound outlet hole.

[0049] The technical effects of any of the design methods in the third to fourth aspects can also be found in the technical effects of different design methods in the first aspect, which will not be repeated here. Attached Figure Description

[0050] Figure 1 Schematic diagrams of the structure of electronic devices provided in some embodiments of this application;

[0051] Figure 2 for Figure 1 An exploded view of the electronic device shown;

[0052] Figure 3 This is a three-dimensional structural diagram of a speaker module provided in some embodiments of this application;

[0053] Figure 4 for Figure 3 The speaker module shown is a cross-sectional view at line AA;

[0054] Figure 5 for Figure 3 The exploded view of the speaker module shown.

[0055] Figure 6a A schematic diagram illustrating the principle of the kernel provided for some embodiments of this application;

[0056] Figure 6b This is a schematic diagram of the structure of a magnetic circuit system provided in some embodiments of this application;

[0057] Figure 7a This is an exploded view of a speaker module provided in some other embodiments of this application;

[0058] Figure 7b for Figure 7a A cross-sectional structural view of the speaker module shown.

[0059] Figure 8a for Figure 7b Enlarged view of point A in the middle;

[0060] Figure 8b This is an exploded view of a speaker module provided in some embodiments of this application;

[0061] Figure 9a for Figure 8b A cross-sectional structural view of the speaker module shown.

[0062] Figure 9b for Figure 9a Enlarged view at point B in the middle;

[0063] Figure 10 for Figure 9b Exploded structural diagram of the inner core, first wall panel and shielding component;

[0064] Figure 11 for Figure 9b Schematic diagram of the connection structure between the central shielding component, the first wall panel, and the core;

[0065] Figure 12 for Figure 8b A schematic diagram of a structure of the shielding component of the speaker module shown;

[0066] Figure 13 for Figure 8b Another structural schematic diagram of the shielding component of the speaker module shown;

[0067] Figure 14 for Figure 8b A partially exploded 3D schematic diagram of the speaker module shown.

[0068] Figure 15 This is an exploded view of a speaker module provided in some embodiments of this application;

[0069] Figure 16a for Figure 15 A cross-sectional structural view of the speaker module shown.

[0070] Figure 16b for Figure 16a Enlarged view at point C;

[0071] Figure 17 for Figure 16b A partially exploded structural diagram of the core, shielding components, second wall panel, and seals.

[0072] Figure 18 for Figure 16bThe exploded structural diagram of the core, shielding component, second wall panel, and seal is shown in the middle.

[0073] Figure 19 A schematic flowchart illustrating the assembly method of a speaker module provided in some embodiments of this application;

[0074] Figure 20 The manufacturing process diagram of the speaker module when the housing includes a first wall panel, as provided in some embodiments of this application;

[0075] Figure 21 This diagram illustrates the manufacturing process of a speaker module when the housing includes a second wall panel, as provided in some embodiments of this application.

[0076] Figure label:

[0077] 100. Electronic devices;

[0078] 10. Outer shell; 11. Back cover; 12. Frame; 12a. Port; 12b. Sound outlet; 13. Midplate; 13a. Mounting slot;

[0079] 20. Screen; 21. Light-transmitting cover; 22. Display screen;

[0080] 30. Main circuit board;

[0081] 40. Secondary circuit board;

[0082] 50. Connection structure;

[0083] 60. Battery;

[0084] 70. USB devices;

[0085] 80. Speaker module; 80a. Sound output channel; 80b. First component; 80c. Second component;

[0086] 81. Shell; 811. Front shell; 8111. Side panel; 8112. Front wall panel; 8112a. First part; 8112b. Second part; Q1. Front cavity; Q2. Rear cavity; 812. Rear shell; 812a. Third opening; 812b. Fourth opening; 812c. Fifth opening; 8122. First wall panel; 8122a. Second outer surface; 8122b. Second inner surface; 81221. First connecting part; 81222. Second connecting part; 8123. Second wall panel; m1. Third outer peripheral surface; m2. Fourth outer surface; m3. Fourth inner surface;

[0087] 82. Core; 82a. First vent; 82b. First outer peripheral surface; 82c. First lap groove; 82c1. First lap surface;

[0088] 821 Diaphragm; 822 Drive unit; 8221 Voice coil; 8222 Magnetic circuit system; 8222a Magnetic conductor; m4 First outer surface; m5 First inner surface; m6 Second outer peripheral surface; 8222b Magnet assembly; n1 Center magnet; n2 Edge magnet; n3 Magnetic gap; 8223 Frame;

[0089] 831. Sound-absorbing material; 832. First positioning structure; 833. Second positioning structure; 834. Adhesive layer;

[0090] 84. Covering component; 841. First flanged portion; 8411. Connecting surface; 8411a. First region; 8411b. Second region; 842. First body portion; 8421. Second vent hole; 8422. Notch; 843. Second flanged portion; 844. Second body portion;

[0091] 85. Seal; 851. Third outer surface; 852. Third inner surface; 85a. First sealing part; 85b. Second sealing part;

[0092] 86. Sealing groove; 861. Second lap groove; 8613. Second lap surface;

[0093] 90. Electrical connectors. Detailed Implementation

[0094] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0095] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0096] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0097] In the description of the embodiments of this application, "and / or" is merely a way of describing the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this application generally indicates that the related objects before and after it are in an "or" relationship.

[0098] In the embodiments of this application, directional terms such as "outer" may be defined relative to the orientation in which the components are schematically placed in the accompanying drawings. It should be understood that these directional terms can be relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation in which the components are placed in the accompanying drawings.

[0099] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after the connection.

[0100] In the description of embodiments of this application, the terms "vertical" and "parallel" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximately parallelism, wherein the acceptable deviation range for approximately parallelism may be, for example, within 5°, 8°, or 10°; "vertical" includes absolute verticalism and approximately verticalism, wherein the acceptable deviation range for approximately verticalism may also be, for example, within 5°, 8°, or 10°.

[0101] This application provides an electronic device, which is a type of electronic device with sound playback function. Specifically, the electronic device includes, but is not limited to, mobile phones, tablet personal computers, laptop computers, personal digital assistants (PDAs), personal computers, laptops, in-vehicle devices, wearable devices, portable music players, radios, etc. Among them, wearable devices include, but are not limited to, smart bracelets, smartwatches, smart head-mounted displays, smart glasses, etc.

[0102] Please see Figure 1 and Figure 2 , Figure 1This is a schematic diagram of the structure of an electronic device 100 provided in some embodiments of this application. Figure 2 for Figure 1 The exploded view of the electronic device 100 shown is illustrated in an embodiment of this application, where the electronic device 100 is a candybar phone. In other embodiments, the electronic device 100 may also be a foldable phone.

[0103] Specifically, the electronic device 100 may include a housing 10, a screen 20, a main circuit board 30, a secondary circuit board 40, a connection structure 50, a battery 60, and a speaker module 80.

[0104] It should be noted that, Figure 1 , Figure 2 The accompanying drawings below only schematically illustrate some components included in the electronic device 100; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 , Figure 2 And the limitations of the figures below. In addition, when the electronic device 100 is some other type of electronic device, the electronic device 100 may not include the sub-circuit board 40, the connection structure 50, the screen 20 and the battery 60.

[0105] exist Figure 1 and Figure 2 In the illustrated embodiment, the electronic device 100 is in the shape of a rectangular plate. For ease of description in the following embodiments, an XYZ coordinate system is established. Specifically, the width direction of the electronic device 100 is defined as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis; the X, Y, and Z axes are perpendicular to each other. It is understood that the coordinate system setting of the electronic device 100 can be flexibly configured according to actual needs and is not specifically limited here. In other embodiments, the shape of the electronic device 100 may also be a square plate, a rhomboid plate, a circular plate, an elliptical plate, an oblong plate, a triangular plate, or an irregularly shaped plate, etc.

[0106] Screen 20 is used to display images, videos, etc. Please refer to [link / reference]. Figure 2 The screen 20 includes a light-transmitting cover 21 and a display panel 22. The light-transmitting cover 21 and the display panel 22 are stacked together. Specifically, the light-transmitting cover 21 and the display panel 22 are fixedly connected by means of adhesive bonding or other methods. The light-transmitting cover 21 mainly serves to protect the display panel 22 and prevent dust. The materials of the light-transmitting cover 21 include, but are not limited to, glass, ceramic, and plastic.

[0107] The display screen 22 can be a flexible display screen or a rigid display screen. For example, the display screen 22 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MLED) display screen, a micro organic light-emitting diode (MLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD), etc.

[0108] The housing 10 is used to protect the internal electronic components of the electronic device 100. Please continue reading. Figures 1 to 2 The outer casing 10 includes a back cover 11 and a frame 12. The back cover 11 is located on the side of the display screen 22 away from the light-transmitting cover plate 21, and the back cover 11, the light-transmitting cover plate 21, and the display screen 22 are stacked on top of each other. The frame 12 is located between the back cover 11 and the light-transmitting cover plate 21, and the frame 12 is fixed to the back cover 11. For example, the frame 12 can be fixed to the back cover 11 by means of adhesive, snap-fit, welding, or screw connection. The frame 12 can also be integrally formed with the back cover 11, that is, the frame 12 and the back cover 11 are a single structure, which provides a high connection strength between the frame 12 and the back cover 11. The material of the back cover 11 includes, but is not limited to, metal, ceramic, plastic, and glass. In order to achieve the thinness and lightness of the electronic device 100 while ensuring the structural strength of the back cover 11, the material of the back cover 11 can be metal. The material of the frame 12 includes, but is not limited to, metal, ceramic, plastic, and glass. The material of the frame 12 can be the same as that of the back cover 11, or it can be different.

[0109] In some embodiments, the light-transmitting cover 21 is fixed to the frame 12. Specifically, the light-transmitting cover 21 can be fixed to the frame 12 by adhesive bonding. The light-transmitting cover 21, the back cover 11, and the frame 12 form an internal accommodating space for the electronic device 100. This internal accommodating space houses the display screen 22, the main circuit board 30, the secondary circuit board 40, the connection structure 50, the battery 60, and the speaker module 80.

[0110] The main circuit board 30 is used to integrate the main control chip. The main circuit board 30 can be fixed to the surface of the display screen 22 near the back cover 11. For example, the main circuit board 30 can be fixed to the surface of the display screen 22 near the back cover 11 by means of threaded connection, snap-fit, adhesive connection or soldering.

[0111] In other embodiments, please refer to Figure 2 The outer casing 10 also includes a middle plate 13. The middle plate 13 is fixed to the inner surface of the frame 12 around its perimeter. Exemplarily, the middle plate 13 can be fixed to the frame 12 by means of welding, threaded connection, snap-fit, or adhesive connection. The middle plate 13 can also be integrally formed with the frame 12. The material of the middle plate 13 includes, but is not limited to, metal, ceramic, plastic, and glass. The material of the middle plate 13 can be the same as that of the back cover 11, or it can be different. The middle plate 13 serves as the structural "skeleton" of the electronic device 100, and the main circuit board 30 can be fixed to the side surface of the middle plate 13 facing the back cover 11 by means of threaded connection, snap-fit, welding, etc.

[0112] The main control chip can be, for example, an application processor (AP), double data rate synchronous dynamic random access memory (DDR), or universal flash storage (UFS). In some embodiments, the main circuit board 30 is electrically connected to the screen 20, and the main circuit board 30 is used to control the screen 20 to display images or videos. The main circuit board 30 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board.

[0113] The secondary circuit board 40 is fixed inside the electronic device 100. The secondary circuit board 40 and the main circuit board 30 are arranged in the Y-axis direction. The secondary circuit board 40 can be fixed to the surface of the middle plate 13 facing the back cover 11. Specifically, the secondary circuit board 40 can be fixed to the surface of the middle plate 13 facing the back cover 11 by means of threaded connection, snap-fit, adhesive connection, or welding. In other embodiments, when the housing 10 does not include the middle plate 13, the secondary circuit board 40 can also be fixed to the side surface of the display screen 22 facing the back cover 11. Specifically, the secondary circuit board 40 can be fixed to the side surface of the display screen 22 facing the back cover 11 by means of threaded connection, snap-fit, adhesive connection, or welding. The secondary circuit board 40 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board.

[0114] The secondary circuit board 40 is electrically connected to the main circuit board 30 via a connection structure 50 to enable data and signal transmission between the secondary circuit board 40 and the main circuit board 30. The connection structure 50 can be a flexible printed circuit board (FPC). In other embodiments, the connection structure 50 can also be a wire or enameled wire.

[0115] The secondary circuit board 40 integrates a universal serial bus (USB) device 70. This USB device 70 can be a USB Type-C interface device, a USB Type-A interface device, a USB Type-B Micro-B interface device, or a USB Type-B interface device.

[0116] A port 12a is provided on the frame 12 corresponding to the position of the USB device 70. Accessories such as chargers, headphones, and data cables can be electrically connected to the USB device 70 through the port 12a to realize the transmission of power, signals, and data.

[0117] The battery 60 is fixed inside the electronic device 100. The battery 60 is located between the main circuit board 30 and the sub-circuit board 40. The battery 60 provides power to the main circuit board 30, the sub-circuit board 40, the screen 20, and the speaker module 80, etc. In some embodiments, the surface of the middle plate 13 facing the back cover 11 has a mounting groove 13a, in which the battery 60 is mounted. In other embodiments, when the housing 10 does not include the middle plate 13, the mounting groove 13a may also be defined by the main circuit board 30, the sub-circuit board 40, and the side surface of the display screen 22 facing the back cover 11.

[0118] The battery 60 may include, but is not limited to, nickel-cadmium batteries, nickel-metal hydride batteries, lithium batteries, or other types of batteries containing bare cells. Furthermore, the number of batteries 60 in this embodiment may be multiple or single; the specific number and arrangement of batteries 60 in this embodiment can be set according to actual needs.

[0119] The speaker module 80 is used to convert audio electrical signals such as music and voice into sound, enabling the electronic device 100 to support external audio playback. In some embodiments, the speaker module 80 is electrically connected to the sub-circuit board 40. Specifically, the speaker module 80 can be electrically connected to the sub-circuit board 40 via an electrical connector 90. This electrical connector 90 can be a flexible printed circuit (FPC). In other embodiments, the electrical connector can also be a wire or enameled wire.

[0120] At this time, the voice electrical signal sent by the main circuit board 30 is transmitted to the speaker module 80 via the secondary circuit board 40, and further converted into a sound signal output by the speaker module 80. For details, please refer to [link to relevant documentation]. Figure 2 The speaker module 80 has a sound output channel 80a. The sound signal output by the speaker module 80 is output through the sound output channel 80a. A sound outlet 12b is provided on the frame 12. The sound outlet 12b communicates with the sound output channel 80a. The sound signal output from the sound output channel 80a is further output to the outside of the electronic device 100 through the sound outlet 12b. In other embodiments, the speaker module 80 can also be directly electrically connected to the main circuit board 30 via a connection structure 50 such as an FPC, wires, or enameled wire.

[0121] It should be noted that, Figure 2 The description takes one speaker module 80 as an example, with the speaker module 80 located on the side of the battery 60 facing away from the main circuit board 30. In other optional embodiments of this application, the speaker module 80 may also be disposed adjacent to and electrically connected to the main circuit board 30. In this case, the main circuit board 30 sends audio signals to the speaker module 80 electrically connected to it, which converts the signals into sound output. Alternatively, the number of speaker modules 80 may be greater than or equal to two, with at least one speaker module 80 disposed adjacent to and electrically connected to the sub-circuit board 40, and at least one speaker module 80 disposed adjacent to and electrically connected to the main circuit board 30.

[0122] Please see Figure 3 and Figure 4 , Figure 3 This is a three-dimensional structural diagram of the speaker module 80 provided in some embodiments of this application. Figure 4 for Figure 3 The speaker module 80 shown is a cross-sectional view at line AA. The speaker module 80 includes a housing 81. The housing 81 forms an independent housing structure, such that the speaker module 80 itself forms a module structure with a closed rear cavity Q2 (the specific description of the rear cavity Q2 is given below).

[0123] For details, please continue reading. Figure 3 and Figure 4 The housing 81 includes a front housing 811 and a rear housing 812. The front housing 811 includes a side panel 8111 and a front wall panel 8112. The front housing 811 and the rear housing 812 are assembled to form a receiving cavity. The front housing 811 and the rear housing 812 can be connected by snap-fit ​​connection, adhesive connection, screw connection, welding connection, etc. In this way, a sealed connection is formed between the front housing 811 and the rear housing 812, which helps to reduce the molding difficulty and assembly difficulty of the housing 81.

[0124] Please see Figure 5 , Figure 5 for Figure 3 The exploded view of the speaker module 80 shown indicates that the front panel 8112 includes a first part 8112a and a second part 8112b. The first part 8112a and the rear housing 812 are distributed along the Z-axis on opposite sides of the core 82. The second part 8112b is fixed to the circumferential outer side of the core 82 and is connected to both the first part 8112a and the rear housing 812. Specifically, the first part 8112a and the second part 8112b can be bonded together or integrally formed. The second part 8112b can be fixed to the rear housing 812 by bonding together.

[0125] Please refer to the following: Figure 4 and Figure 5 The speaker module 80 also includes a core 82, which is the core component in the speaker module 80 used to generate sound. The core 82 is located within the receiving cavity of the housing 81 and divides the receiving cavity into a front cavity Q1 and a rear cavity Q2. That is, the core 82 and the front housing 811 define the front cavity Q1. The core 82, the front housing 811, and the rear housing 812 define the rear cavity Q2. The front cavity Q1 and... Figure 2 The sound outlet channel 80a shown is connected to the core 82, which has a first vent 82a connected to the rear cavity Q2. The core 82 exchanges air with the rear cavity Q2 through the first vent 82a. When the core 82 is working, it can drive the air in the front cavity Q1 to vibrate. The vibrating air in the front cavity Q1 is led out through the sound outlet channel 80a, forming sound, and further transmitting the sound through… Figure 2 The sound outlet 12b, which is connected to the sound outlet channel 80a shown, leads to the outside of the electronic device 100 so that it can be heard by the user.

[0126] For details, please refer to Figure 6a , Figure 6a The following is a schematic diagram of the kernel 82 provided in some embodiments of this application. The kernel 82 may include a diaphragm 821 and a driving device 822.

[0127] The diaphragm 821 can be located facing Figure 4 The drive unit 822 can be located on one side of the front cavity Q1. Figure 4 The rear cavity Q2 is located in the center. The driving device 822 is used to drive the diaphragm 821 to vibrate. The vibration of the diaphragm 821 can drive the air in the front cavity Q1 to vibrate and form a sound wave. The sound wave is transmitted to the outside of the electronic device 100 through the sound outlet channel 80a and the sound outlet hole in sequence, so that the user can receive the sound wave.

[0128] The drive device 822 includes, but is not limited to, an electric (moving coil) drive device, an electrostatic (capacitive) drive device, an electromagnetic (reed) drive device, or a piezoelectric (crystal) drive device. In some embodiments, the drive device may be a moving coil drive device. For details, please refer to [further details]. Figure 6a The driving device 822 includes a voice coil 8221 fixedly connected to the diaphragm 821, a magnetic circuit system 8222 disposed on one side of the diaphragm 821, and a frame 8223 for mounting the diaphragm 821 and the magnetic circuit system 8222. When energized, the voice coil 8221 generates an induced magnetic field. This induced magnetic field interacts with the magnetic field of the magnetic circuit system 8222, causing the voice coil 8221 to displace under the magnetic force of the magnetic circuit system 8222, thereby driving the diaphragm 821 to vibrate.

[0129] The magnetic circuit system 8222 is used to cooperate with the voice coil 8221 to drive the diaphragm 821 to vibrate. See also the following embodiments. Figure 6b , Figure 6b The diagram below shows the structure of a magnetic circuit system 8222 provided in some embodiments of this application. The magnetic circuit system 8222 includes a magnetic conductor 8222a and a magnet assembly 8222b.

[0130] Along the Z-axis, the magnetic conductor 8222a has a first outer surface m4 and a first inner surface m5, the first outer surface m4 being located opposite to... Figure 4 On one side of the front cavity Q1, the first inner surface m5 is located facing... Figure 4 The front cavity Q1 is located on one side. The magnet assembly 8222b is located on the side facing the first inner surface m5 and is connected to the magnetic conductor 8222a. For example, the magnetic conductor 8222a and the magnet assembly 8222b can be fixedly connected by means of adhesive bonding or the like.

[0131] In some embodiments, please refer to Figure 6a and Figure 6b The magnet assembly 8222b may include a central magnet n1 and at least one edge magnet n2, the edge magnet n2 being arranged circumferentially around the central magnet n1, and a magnetic gap n3 defining a space between the central magnet n1 and the edge magnet n2. A voice coil 8221 may extend into the magnetic gap n3. Specifically, a magnetic circuit is formed between the central magnet n1 and the edge magnet n2. When the voice coil 8221 receives a signal from the signal receiving structure, it drives the diaphragm 821 to vibrate under the influence of the magnetic field within the magnetic gap n3. By constraining the magnetic lines of force through the magnetic conductor 8222a, the magnetic field strength within the magnetic gap n3 can be increased, thereby enhancing the driving strength of the diaphragm 821. Of course, in other embodiments, the voice coil 8221 may not extend into the aforementioned magnetic gap n3.

[0132] With the trend towards thinner and smaller electronic devices, Figures 3 to 5In the speaker module 80 shown, the volume of the rear cavity Q2 is limited. For a better audio experience, please refer to... Figure 4 Generally, sound-absorbing material 831 is filled into the rear cavity Q2 of the speaker module 80. By filling the rear cavity Q2 with sound-absorbing material 831, the air flow path can be extended to maximize the equivalent volume of the rear cavity Q2, forming a virtual rear cavity, and at the same time improving the low-frequency performance and sound loudness of the speaker module 80.

[0133] The sound-absorbing material 831 includes multiple sound-absorbing particles, the materials of which include, but are not limited to, one or more of melamine, zeolite, glass fiber, and activated carbon. However, research has found that the sound-absorbing material 831 can enter the core 82 through the first vent 82a on the core 82, affecting the vibration of the diaphragm 821, and thus affecting the normal operation of the speaker module 80.

[0134] Based on this, please continue reading Figure 4 and Figure 5 The speaker module 80 also includes a shield 84, which is located in the rear cavity Q2 and on the circumferential outer side of the core 82. Specifically, the core 82 also has a first outer peripheral surface 82b, which is annularly arranged around the circumferential outer side of the first outer surface m4. The shield 84 is located on the side facing the first outer peripheral surface 82b and is spaced apart from the first outer peripheral surface 82b.

[0135] Specifically, sound-absorbing material 831 is filled on the side of the shielding member 84 facing away from the core 82, and the shielding member 84 has a second vent 8421. The first vent 82a and the second vent 8421 are connected, and the second vent 8421 is connected to the inner cavity, thereby achieving airflow communication between the core 82 and the rear cavity Q2 through the second vent 8421 on the shielding member 84. The shielding member 84 can block the sound-absorbing material 831, preventing the sound-absorbing material 831 from entering the core 82 through the first vent 82a. It can be understood that the second vent 8421 is not large enough for the sound-absorbing material 831 to pass through; that is, the size of the second vent 8421 needs to be smaller than the size of the sound-absorbing particles. Therefore, since the sound-absorbing particles are located on the side of the shield 84 away from the core 82, and the size of the second vent 8421 is smaller than the size of the sound-absorbing particles, the shield 84 can prevent the sound-absorbing particles from entering the core 82 while connecting the core 82 and the rear cavity Q2, which is beneficial to improving the reliability of the speaker module 80 operation.

[0136] In some embodiments, please continue reading Figure 4 and Figure 5The core 82 is also provided with a first overlapping groove 82c, which penetrates the first outer surface m4 and the first outer peripheral surface 82b of the core 82. The shielding member 84 includes a second flange portion 843 and a second body portion 844. The second flange portion 843 is fixed in the first overlapping groove 82c so that the second body portion 844 surrounds the circumferential outer side of the core 82. The rear shell 812 is provided on the side of the core 82 and the shielding member 84 away from the front cavity Q1, that is, in the Z direction, the rear shell 812 completely covers the core 82 and the shielding member 84.

[0137] Please refer to the following: Figure 6b In some embodiments, the first overlapping groove 82c is formed on the magnetic conductive member 8222a, and in order to ensure the connection strength of the shielding member 84 in the first overlapping groove 82c, the depth of the first overlapping groove 82c can be greater than or equal to 0.05mm and less than or equal to 0.2mm. For example, the groove depth L1 of the first overlapping groove 82c in the Z direction can be 0.05mm, 0.1mm, 0.15mm, 0.2mm, etc.

[0138] In the above Figures 4 to 5 In the embodiment shown, the thickness of the core 82 in the Z direction is a1, and the thickness of the rear housing 812 in the Z direction is a2. Since the rear housing 812 completely covers the core 82 and is stacked with the magnetic conductor 8222a in the Z direction, the total thickness of the core 82 and the rear housing 812 of the speaker module 80 in the Z direction is b = a1 + a2, which makes the speaker module 80 relatively thick.

[0139] Furthermore, if the second flange portion 843 and the core 82 are connected by adhesive, the adhesive residue between the second flange portion 843 and the core 82 can easily flow along the outer surface of the second flange portion 843 onto the second body portion 844, blocking the second vent hole 8421 and thus reducing the venting area of ​​the first vent hole 82a of the core 82, thereby reducing the acoustic performance of the speaker module 80.

[0140] Based on this, please refer to Figure 7a , Figure 7a This is an exploded structural diagram of a speaker module 80 provided in other embodiments of this application. In this embodiment, the speaker module 80 includes a housing 81, a core 82, and a shielding member 84. The housing 81 includes a front housing 811 and a rear housing 812. In this embodiment, the front housing 811, the core 82, and the shielding member 84 are... Figure 4 The front housing 811, core 82, and shield 84 in the illustrated embodiment have the same structure.

[0141] Please refer to the following: Figure 7a and Figure 7b , Figure 7b for Figure 7aThe cross-sectional view of the speaker module 80 shown illustrates how, in order to reduce the total thickness of the speaker module 80 in the Z direction, the structure of the rear housing 812 is modified. The rear housing 812 is made into a third opening 812a, and a portion of the magnetic conductor 8222a is located within the third opening 812a, resulting in the exposed magnetic conductor 8222a. In this way, the housing 81 does not need to completely cover the core 82, thereby reducing the thickness of the speaker module 80 and facilitating the thinning of the speaker module 80.

[0142] Please see Figure 8a , Figure 8a for Figure 7b In the enlarged view at point A, the second flange 843 of the shielding member 84 is located inside the first overlapping groove 82c of the magnetic conductor 8222a. The rear housing 812 is arranged around the shielding member 84 on the circumferential outer side away from the magnetic conductor 8222a, thus avoiding the superposition of the magnetic conductor 8222a and the rear housing 812 in the Z direction.

[0143] Please refer to the following: Figure 7b and Figure 8a In this embodiment, the thickness of the core 82 in the Z direction is a1, and the thickness of the rear housing 812 in the Z direction is a2. Since the magnetic conductor 8222a of the rear housing 812 and the core 82 does not overlap, the thickness of the rear housing 812 does not affect the thickness of the speaker module 80. The total thickness of the core 82 and the rear housing 812 of the speaker module 80 in the Z direction is b = a1, compared to... Figure 4 The speaker module 80 of the embodiment shown has reduced the superimposed thickness a2 of the rear housing 812, thereby achieving a reduction in the overall thickness of the speaker module 80.

[0144] For further information, please refer to [link / reference]. Figure 8a In this embodiment, the rear housing 812 surrounds the outer circumferential region of the shielding member 84 away from the magnetic conductive member 8222a and needs to be connected to the shielding member 84. Specifically, the rear housing 812 can be fixed to the second body portion 844, or the rear housing 812 can be fixed to the connection bend of the second body portion 844 and the second flange portion 843. For example, adhesive can be applied at the connection bend of the second body portion 844 and the second flange portion 843 to achieve adhesive fixation of the rear housing 812.

[0145] However, this fixing method provides weak support for the rear housing 812, and the adhesive can easily overflow and flow along the outer surface of the second body 844 to block the second vent 8421, affecting the acoustic performance of the speaker module 80.

[0146] In order to reduce the thickness of the speaker module 80 while avoiding blockage of the second vent 8421 on the shield 84, please refer to Figure 8b and Figure 9a , Figure 8b This is an exploded view of the speaker module 80 provided in some embodiments of this application. Figure 9a for Figure 8b The image shows a cross-sectional view of the speaker module 80. The speaker module 80 includes a housing 81, a core 82, and a shielding member 84. The housing 81 includes a front housing 811 and a rear housing 812. In this embodiment, the front housing 811 and the core 82 are... Figure 4 In the illustrated embodiment, the front housing 811 and the core 82 have the same structure. That is, the front housing 811 and the rear housing 812 are assembled to form an internal receiving cavity. The core 82 is fixed inside the housing 81 and is connected to the front housing 811 and the rear housing 812 respectively, dividing the space inside the housing 81 into the front cavity Q1 and the rear cavity Q2. For the structure of the front housing 811 and the core 82, please refer to the above text, which will not be repeated here. The shielding member 84 is provided in the rear cavity Q2.

[0147] In some embodiments, the housing 81 includes a first wall panel 8122, which is fixed to a first overlapping groove 82c. The rear housing 812 has a fourth opening 812b, and a portion of the magnetic conductor 8222a may be located within the fourth opening 812b. In this case, the first wall panel 8122 surrounds the circumferential outer side of the magnetic conductor 8222a, forming an exposed magnetic conductor 8222a. At least a portion of the first wall panel 8122 is located within the first overlapping groove 82c, thereby achieving a fixed connection with the core 82.

[0148] It is understood that the rear housing 812 includes a first wall panel 8122, that is, at least a portion of the rear housing 812 forms the first wall panel 8122. At this time, the side panel 8111 of the front housing 811 is connected to the circumferential outer side of the first wall panel 8122. The first wall panel 8122 and the side panel 8111 can be directly connected, or connected through other structures of the rear housing 812.

[0149] Please see Figure 9b and Figure 10 , Figure 9b for Figure 9a Enlarged view at point B in the middle. Figure 10 for Figure 9bAn exploded view of the core 82, the first wall panel 8122, and the shielding member 84 shows that the core 82 has a first overlapping groove 82c extending through the first outer surface m4 and the first outer peripheral surface 82b. Specifically, the first overlapping groove 82c includes a first opening and a second opening. The first opening is formed on the first outer surface m4, and the second opening is formed on the first outer peripheral surface 82b. The bottom wall of the first overlapping groove 82c forms a first overlapping surface 82c1, and the first wall panel 8122 is fixed to the first overlapping groove 82c. In some embodiments, the first wall panel 8122 can be bonded to the first overlapping surface 82c1 in the first overlapping groove 82c. In other embodiments, the first wall panel 8122 can be welded to the first overlapping surface 82c1 in the first overlapping groove 82c, thereby achieving a sealed connection between the rear shell 812 and the core 82.

[0150] and Figure 4 Similar to the embodiment shown, the core 82 also includes a magnetic conductive element 8222a. A first overlapping groove 82c can be formed on the magnetic conductive element 8222a. The magnetic conductive element 8222a has a first outer surface m4 and a second outer peripheral surface m6. The second outer peripheral surface m6 extends along the Z direction and connects between the first outer surface m4 and the first overlapping surface 82c1 to form a stepped surface. At this time, the first overlapping groove 82c is formed by the two surfaces of the second outer peripheral surface m6 and the first overlapping surface 82c1, thereby forming openings on both sides, namely the first opening and the second opening. The first wall plate 8122 located in the first overlapping groove 82c can be connected to the first overlapping surface 82c1, or it can be connected to both the first overlapping surface 82c1 and the second outer peripheral surface m6.

[0151] In some other embodiments, the core 82 may not include the magnetic conductor 8222a, and the first lap groove 82c may be directly formed on other structures of the core 82.

[0152] In some embodiments, the shielding member 84 is located on the side facing the first outer peripheral surface 82b and can be completely covered by the first wall panel 8122 within the rear cavity Q2. The side of the shielding member 84 facing away from the core 82 is filled with sound-absorbing material 831 between itself and the housing 81. The core 82 has a first vent 82a, and the shielding member 84 has a second vent 8421. The first vent 82a communicates with the second vent 8421, and the second vent 8421 communicates with the rear cavity Q2, thereby achieving airflow communication between the core 82 and the rear cavity Q2. Simultaneously, the shielding member 84 can block the sound-absorbing material 831, preventing it from entering the core 82 through the first vent 82a.

[0153] Figures 8b to 10 The speaker module 80 of the illustrated embodiment, compared to Figure 4 and Figure 7aThe speaker module 80 shown has a modified rear housing 812 structure, forming a configuration where the magnetic conductor 8222a is exposed from the fourth opening 812b. The core 82 has a thickness of a1 in the Z direction, and the first wall plate 8122 has a thickness of a2 in the Z direction. Since the first wall plate 8122 is not superimposed on the magnetic conductor 8222a and is embedded in the first overlapping groove 82c on the outer periphery of the magnetic conductor 8222a, the thickness of the rear housing 812 does not affect the thickness of the speaker module 80. The total superimposed thickness of the core 82 and the rear housing 812 in the Z direction of the speaker module 80 is b = a1, thus achieving a thinner speaker module 80.

[0154] Furthermore, in the above embodiment, the first wall panel 8122 of the housing 812 is fixed in the first overlapping groove 82c and the shielding member 84 is completely disposed in the rear cavity Q2. At this time, if glue is applied between the first wall panel 8122 and the first overlapping surface 82c1, when the adhesive overflows, it will spread along the first wall panel 8122 and / or the first overlapping surface 82c1 on the glued surface, thereby avoiding the situation where the adhesive in the first overlapping groove 82c directly spreads to the shielding member 84, reducing the risk of adhesive flowing to the shielding member 84 and clogging the second vent 8421, thereby improving the acoustic performance of the speaker module 80.

[0155] In some embodiments, please continue reading Figure 10 The thickness of the first wall plate 8122 is less than or equal to the depth of the first overlapping groove 82c. The thickness of the first wall plate 8122 is a2, and the depth of the first overlapping groove 82c is L1, which is the vertical distance in the Z direction between the first overlapping surface 82c1 and the first outer surface m4. a2 is less than or equal to L1. This ensures that the first wall plate 8122 does not protrude from the magnetic conductive element 8222a.

[0156] Specifically, the first wall panel 8122 forms a second outer surface 8122a and a second inner surface 8122b facing away from each other in the Z direction. The second inner surface 8122b is formed on the side of the first wall panel 8122 facing the front cavity Q1 and is connected to the first overlapping surface 82c1. The second outer surface 8122a can be flush with the first outer surface m4; or, the second outer surface 8122a can be partially flush with the first outer surface m4, with the other part located on the side of the first outer surface m4 near the front cavity Q1; or, the second outer surface 8122a can be entirely located on the side of the first outer surface m4 near the front cavity Q1, so that the first wall panel 8122 does not protrude from the magnetic conductor 8222a. This avoids the first wall panel 8122 being too thick and affecting the overall thickness of the speaker module 80, and ensures the thinning of the speaker module 80 in all areas.

[0157] Furthermore, in this embodiment, the depth of the first overlapping groove 82c is greater than or equal to 0.03mm and less than or equal to 0.15mm. For example, the depth L1 of the first overlapping groove 82c can be 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, 0.15mm, etc. Thus, compared to... Figure 4 The speaker module 80 shown has a shallow first overlapping groove 82c. This avoids the first overlapping groove 82c being too deep and affecting the magnetic conductivity of the enhanced magnetic component 8222a, while also allowing the first wall panel 8122 to be made thinner.

[0158] The shielding member 84, located within the rear cavity Q2, needs to be fixed relative to the core 82 to ensure its shielding effect on the sound-absorbing material 831. In some embodiments, please refer to... Figure 9a and Figure 10 The shielding member 84 can be connected to the first wall panel 8122. For example, the shielding member 84 can be connected to the second inner surface 8122b of the first wall panel 8122 and surround the outer periphery of the core 82. In other embodiments, the shielding member 84 can also be connected to other locations of the housing 81, which is not limited herein.

[0159] Specifically, the first wall panel 8122 includes a first connecting part 81221 and a second connecting part 81222 that are connected to each other. The first connecting part 81221 is disposed in the first overlapping groove 82c, and the second connecting part 81222 is located on the circumferential outer side of the core 82 and extends out of the first overlapping groove 82c. The first connecting part 81221 is connected to the first overlapping surface 82c1. The shielding member 84 can be connected to the second connecting part 81222, thereby fixing the shielding member 84 and the first wall panel 8122.

[0160] It is understood that the surfaces of the first connecting portion 81221 and the second connecting portion 81222 facing the front cavity Q1 together form the second inner surface 8122b, and the surfaces of the first connecting portion 81221 and the second connecting portion 81222 facing away from the front cavity Q1 together form the second outer surface 8122a. In some embodiments, to facilitate the processing of the first wall panel 8122, the second outer surface 8122a and the second inner surface 8122b can be flat and parallel surfaces. In other embodiments, the second outer surface 8122a can be formed by connecting multiple sub-surfaces that are not coplanar in the Z direction. In this case, the thickness a2 of the first wall panel 8122 in the Z direction can be considered as the maximum thickness of the first wall panel 8122.

[0161] In some embodiments, the first connecting portion 81221 and the second connecting portion 81222 can be integrally formed. That is, the first wall panel 8122 is directly formed through a single manufacturing process, and the connection between the first connecting portion 81221 and the second connecting portion 81222 is completed simultaneously with the formation of the first connecting portion 81221, without the need for another process to form the connection between the first connecting portion 81221 and the second connecting portion 81222. For example, the first wall panel 8122 can be formed integrally by CNC machining, such as computer-controlled precision machining (CNC process), or casting, such as mold casting. For instance, the first wall panel 8122 can be an integrally formed steel plate structure. This not only simplifies the processing technology of the first wall panel 8122 and reduces the processing difficulty, but also balances assembly efficiency and assembly difficulty.

[0162] In other embodiments, the first connecting part 81221 and the second connecting part 81222 can also be connected in a sealed manner by assembly, such as by snap-fitting, adhesive bonding, screw connection, welding, etc. The specific connection method is not limited here.

[0163] When the shell 812 and the core 82 are actually assembled, the first connecting part 81221 of the first wall panel 8122 can be inserted into the first overlapping groove 82c from the first opening along the Z direction from one side of the first outer surface m4, or the first connecting part 81221 of the first wall panel 8122 can be inserted into the first overlapping groove 82c from the second opening from one side of the first outer peripheral surface 82b. The connection between the first wall panel 8122 and the core 82 can be achieved by welding, bonding or other connection methods.

[0164] In other embodiments, please refer to [reference needed]. Figure 10 and Figure 11 , Figure 11 for Figure 9b The diagram shows the connection structure of the shielding member 84, the first wall panel 8122, and the core 82. The shielding member 84 includes a first body part 842 and a first flange part 841 connected together. The first body part 842 surrounds the outer periphery of the core 82. A second vent 8421 is provided on the first body part 842. The first flange part 841 is located on the side of the first body part 842 away from the core 82, and the first flange part 841 is connected to the first wall panel 8122.

[0165] The first flange portion 841 and the core 82 are located on opposite sides of the first body portion 842 along the axial direction of the second vent hole 8421, that is, the first flange portion 841 is folded towards the side away from the core 82 to facilitate the connection of the first flange portion 841 and the second connecting portion 81222. The first flange portion 841 has a connecting surface 8411 facing the first wall panel 8122, and the connecting surface 8411 and the second inner surface 8122b are fixedly connected. For example, the connecting surface 8411 can be connected to the second inner surface 8122b by adhesive bonding, or the connecting surface 8411 can be connected to the second inner surface 8122b by welding.

[0166] In some embodiments, the amount of adhesive can be controlled by applying adhesive to a localized area of ​​the connecting surface 8411 as needed. This achieves the connection between the first flange 841 and the first wall panel 8122 while reducing the risk of excess adhesive clogging the second vent 8421 on the first body portion 842. For details, please refer to [link / reference needed]. Figure 11 The connecting surface 8411 may include a first region 8411a and a second region 8411b. A gap is formed between the first region 8411a and the first wall panel 8122, and no adhesive is applied in the gap. Adhesive is applied to the second region 8411b to form an adhesive layer 834 between the second region 8411b and the first wall panel 8122. When adhesive overflows in the second region 8411b, the adhesive will first diffuse to the gap between the first region 8411a and the first wall panel 8122, so that the gap formed in the second region 8411b forms a buffer effect, reducing the risk of adhesive overflowing directly onto the first body part 842 and blocking the second vent 8421.

[0167] Furthermore, the first region 8411a may be located on the side of the second region 8411b closer to the core 82. That is, the first region 8411a is located between the first body portion 842 and the second region 8411b. In this way, the second region 8411b, on which the adhesive layer 834 is provided, is as far away from the first body portion 842 as possible, further reducing the risk of adhesive overflow directly clogging the first body portion 842.

[0168] In some embodiments, at least a portion of the first wall panel 8122 and the shielding member 84 are integrally formed. For example, the second connecting portion 81222 of the first wall panel 8122 and the shielding member 84 are integrally formed; or, the first connecting portion 81221, the second connecting portion 81222, and the shielding member 84 are all integrally formed. For example, the first wall panel 8122 and the shielding member 84 may be integrally formed steel plate structures, and the shielding member 84 is provided with a second vent hole 8421, thereby simplifying the processing technology of the first wall panel 8122 and the shielding member 84.

[0169] exist Figures 8b to 9aIn any embodiment, the first body portion 842 may be provided with multiple rows of second vent holes 8421 along the Z direction. It is understood that the more vent holes there are, the higher the ventilation efficiency of the rear cavity Q2 and the core 82. In order to increase the number of second vent holes 8421 and avoid the adhesive overflow between the first flange portion 841 and the first wall panel 8122 from affecting the second vent holes 8421, in some embodiments, the first flange portion 841 may be arranged in a non-circular shape.

[0170] Please see Figure 12 , Figure 12 for Figure 8b The diagram shows a structural schematic of the shield 84 of the speaker module 80. The shield 84 includes a first flange 841 that is not circumferentially arranged. The first flange 841 itself forms a notch 8422. Since no glue is needed at the notch 8422, the first body part 842 can be provided with more second vent holes 8421 in the area opposite to the notch 8422 in the Z direction than in other areas of the first flange 841. At this time, even if the number of second vent holes 8421 increases and they are closer to the notch 8422, there will be no risk of glue overflow and blockage.

[0171] In other embodiments, please refer to Figure 13 , Figure 13 for Figure 8b Another structural schematic diagram of the shield 84 of the speaker module 80 shown. The shield 84 includes a plurality of non-circular first flange portions 841 that are spaced apart in the circumferential direction. At least two first flange portions 841 are arranged to form a notch 8422. In this way, the first body portion 842 can be provided with more second vent holes 8421 in the area opposite to the notch 8422 in the Z direction than in other areas of the first flange portions 841.

[0172] In some other embodiments, the shielding member 84 may only include the first body part 842. In this case, the shielding member 84 is fixed relative to the core 82 by connecting the first body part 842 to the first wall panel 8122. Furthermore, the first body part 842 is provided with a second vent hole 8421 that communicates with the first vent hole 82a and the inner cavity.

[0173] In some embodiments, please refer to Figure 14 , Figure 14 for Figure 8b The speaker module 80 shown is partially exploded in three-dimensional view. One of the core 82 and the first wall panel 8122 is provided with a first positioning structure 832, and the other is provided with a second positioning structure 833. The first positioning structure 832 is used to cooperate with the second positioning structure 833 for positioning, so as to achieve accurate assembly of the first wall panel 8122 and the core 82.

[0174] Specifically, the first positioning structure 832 can be disposed on the first connecting part 81221, and the second positioning structure 833 can be disposed on the magnetic conductive part 8222a. During the process of placing the first wall plate 8122 into the first overlapping groove 82c, the first positioning structure 832 is aligned with the second positioning structure 833 to push the first wall plate 8122, so that the first positioning structure 832 and the second positioning structure 833 cooperate to position and complete the assembly of the first wall plate 8122 and the core 82.

[0175] Specifically, the first positioning structure 832 is a positioning groove, and the second positioning structure 833 is a positioning protrusion. Please refer to the following: Figure 14 In some embodiments, a positioning groove is formed on the first wall panel 8122, and the positioning groove communicates with the third opening 812a. The positioning protrusion is located on the magnetic conductive element 8222a and protrudes to one side of the first overlapping groove 82c. For example, in actual assembly, the positioning protrusion can be aligned with the positioning groove along the Z direction, and the first wall panel 8122 can be pushed into the first overlapping groove 82c along the Z direction to complete the positioning of the positioning protrusion and the positioning groove.

[0176] Understandably, the specific shape of the positioning groove is not limited, but it needs to match the shape of the positioning protrusion in order to achieve the matching positioning of the two.

[0177] In other embodiments, please refer to [reference needed]. Figure 15 and Figure 16a , Figure 15 This is an exploded view of the speaker module 80 provided in some embodiments of this application. Figure 16a for Figure 15 The cross-sectional structural view of the speaker module 80 shown is in... Figure 15 In the illustrated embodiment, the speaker module 80 includes a housing 81, a core 82, a shield 84, and a seal 85. The housing 81 includes a front housing 811 and a rear housing 812. This embodiment is similar to... Figure 8b The front housing 811 and the core 82 are the same in the embodiment shown. That is, the front housing 811 and the rear housing 812 are assembled to form an internal cavity. The core 82 is fixed inside the housing 81 and is connected to the front housing 811 and the rear housing 812 respectively, dividing the cavity into a front cavity Q1 and a rear cavity Q2.

[0178] It should be noted that this embodiment is different from... Figure 8b The difference in the embodiment shown is that the rear cavity Q2 inside the housing 81 is not completely sealed by the housing 81, but needs to be sealed by the housing 81, the shielding member 84 and the sealing member 85.

[0179] For details, please refer to Figure 15The rear housing 812 has a fifth opening 812c. The core 82 includes a magnetic conductor 8222a. A portion of the magnetic conductor 8222a can be located within the fifth opening 812c. A sealing member 85 surrounds the circumferential outer side of the magnetic conductor 8222a. A second wall plate 8123 surrounds the circumferential outer side of the sealing member 85, forming an exposed configuration of the magnetic conductor 8222a and the sealing member 85.

[0180] For details, please refer to the following: Figure 16a and Figure 16b , Figure 16b for Figure 16a In the enlarged view at point C, the core 82 has a first overlapping groove 82c, and the shell 81 has a second wall plate 8123. The second wall plate 8123 is connected to the shield 84 and defines a second overlapping groove 861. The second overlapping groove 861 is located circumferentially outside the first overlapping groove 82c and communicates with the first overlapping groove 82c. A part of the seal 85 can be located in the first overlapping groove 82c, and another part can be located in the second overlapping groove 861. At this time, the side plate 8111 of the front shell 811 is connected to the circumferentially outside the second wall plate 8123. The second wall plate 8123 and the side plate 8111 can be directly connected, or connected through other structures of the rear shell 812.

[0181] The second lap groove 861 has a seventh opening and an eighth opening. The seventh opening faces the same side as the first opening, and the eighth opening mates with the second opening. Please refer to the reference section. Figure 16b and Figure 17 , Figure 17 for Figure 16b The diagram shows a partial exploded view of the core 82, the shielding member 84, the second wall plate 8123, and the sealing member 85. At this point, the first overlapping groove 82c and the second overlapping groove 861 are spliced ​​together to form a sealing groove 86 with a large volume. The sealing member 85 can be set in the sealing groove 86 to realize the connection between the core 82, the shielding member 84, and the second wall plate 8123, and to close the rear cavity Q2.

[0182] In some embodiments, the bottom wall of the first overlapping groove 82c forms a first overlapping surface 82c1, the bottom wall of the second overlapping groove 861 forms a second overlapping surface 8613, and the second wall plate 8123 has a third outer peripheral surface m1, which is connected to the shielding member 84. Specifically, the surface of the shielding member 84 facing away from the front cavity Q1 may form the second overlapping surface 8613, and the second wall plate 8123 protrudes at least partially relative to the second overlapping surface 8613 away from the front cavity Q1 to define the second overlapping groove 861. The sealing member 85 may be connected to the first overlapping surface 82c1 and the second overlapping surface 8613, or it may be connected to the first overlapping surface 82c1, the second outer peripheral surface m1, and the second overlapping surface 8613.

[0183] exist Figures 15 to 17The speaker module 80 of the illustrated embodiment, compared to Figure 8b The speaker module 80 shown has a modified rear housing 812 structure with the addition of a seal 85, resulting in exposed seal 85 and magnetic conductor 8222a. Since the seal 85 is embedded in the first overlapping groove 82c and the second overlapping groove 861, and the second wall plate 8123 surrounds the circumferential outer side of the seal 85 without superimposing on the magnetic conductor 8222a, the thickness of the rear housing 812 does not affect the thickness of the speaker module 80. Thus, the total thickness b of the core 82 and the rear housing 812 in the Z direction of the speaker module 80 is equal to the thickness a1 of the core 82 in the Z direction, thereby achieving a thinner speaker module 80.

[0184] In some embodiments, please refer to Figure 16a and Figure 17 The seal 85 includes a third outer surface 851 and a third inner surface 852 disposed opposite to each other in the Z direction. The third outer surface 851 is formed on the side of the seal 85 away from the front cavity Q1, that is, the third outer surface 851 and the first outer surface m4 of the core 82 face the same side. The third inner surface 852 is formed on the side of the seal 85 facing the front cavity Q1. The third inner surface 852 is connected to the first lap surface 82c1 and the second lap surface 8613.

[0185] When applying adhesive between the third inner surface 852 and the first overlapping surface 82c1, the adhesive can be applied to the side of the first overlapping surface 82c1 away from the first outer peripheral surface 82b. Similarly, when applying adhesive between the seal 85 and the second overlapping surface 8613, the adhesive can be applied to the side of the second overlapping surface 8613 away from the first outer peripheral surface 82b. That is, adhesive is applied to the outer edge area of ​​the third inner surface 852, thus keeping the adhesive as far away from the first outer peripheral surface 82b as possible. Even if excess adhesive occurs, it will not flow onto the shield 84 located on the circumferential outer side of the core 82 and block the second vent 8421, thereby improving the acoustic performance of the speaker module 80.

[0186] In some embodiments, the first overlapping surface 82c1 and the second overlapping surface 8613 can be flush, in which case the third inner surface 852 can form a flat surface to connect with the first overlapping surface 82c1 and the second overlapping surface 8613, reducing assembly difficulty. Meanwhile, to facilitate the processing of the seal 85, the third outer surface 851 and the third inner surface 852 can form relatively parallel surfaces. The third inner surface 852 is connected to the core 82 and the shielding member 84 through welding or bonding.

[0187] In some embodiments, the seal 85 includes a first sealing portion 85a and a second sealing portion 85b, which may be integrally formed. For example, the first sealing portion 85a and the second sealing portion 85b may be an integrally formed steel plate structure. The first sealing portion 85a is located in the first overlapping groove 82c, and the second sealing portion 85b is located in the second overlapping groove 861. In some embodiments, the first sealing portion 85a may be bonded or welded to the first overlapping surface 82c1 in the first overlapping groove 82c. Similarly, the second sealing portion 85b may be bonded or welded to the second overlapping surface 8613 in the second overlapping groove 861, thereby achieving a sealing connection of the seal 85.

[0188] In some embodiments, please refer to Figure 18 , Figure 18 for Figure 16b The diagram shows the overall exploded structure of the core 82, shield 84, second wall plate 8123, and seal 85. The thickness of the seal 85 is less than or equal to the depth of the first overlapping groove 82c, that is, the thickness a4 of the first sealing part 85a is less than or equal to the depth L1 of the first overlapping groove 82c. Similarly, the thickness of the seal 85 can also be less than or equal to the thickness of the second overlapping groove 861, and the thickness a5 of the second sealing part 85b is less than or equal to the depth L2 of the second overlapping groove 861. In this way, the seal 85 does not protrude from the magnetic conductor 8222a, thereby avoiding the seal 85 being too thick and affecting the overall thickness of the speaker module 80.

[0189] In some embodiments, the depth of the second overlapping groove 861 is less than or equal to the depth of the first overlapping groove 82c, that is, L2 is less than or equal to L1, so that the first sealing part 85a and the second sealing part 85b are integrally embedded in the sealing groove 86 and do not protrude from the magnetic conductive member 8222a.

[0190] In some embodiments, the second wall panel 8123 may not protrude from the magnetic conductive element 8222a; please refer to the relevant documentation. Figure 17 and Figure 18The second wall panel 8123 has a fourth outer surface m2 and a fourth inner surface m3 arranged opposite to each other in the Z direction. The fourth outer surface m2 is formed on the side of the second wall panel 8123 away from the front cavity Q1, and the fourth inner surface m3 is formed on the side of the second wall panel 8123 facing the front cavity Q1. For example, the fourth outer surface m2 may be flush with the first outer surface m4; or, the fourth outer surface m2 may be partially flush with the first outer surface m4, with another part located on the side of the first outer surface m4 near the front cavity Q1; or, the fourth outer surface m2 may be entirely located on the side of the first outer surface m4 near the front cavity Q1, thereby making the fourth outer surface m2 flush with the first outer surface m4, or the side of the fourth outer surface m2 pointing towards the rear housing 812 in the Z direction may be lower than the first outer surface m4, to avoid the rear housing 812 being too thick and affecting the overall thickness of the speaker module 80.

[0191] In summary, in the Z direction, neither the seal 85 nor the second wall plate 8123 protrudes from the first outer surface m4. For example, the first outer surface m4, the third outer surface 851, and the fourth outer surface m2 are flush with each other, thus ensuring the reduction of thickness in all areas of the speaker module 80.

[0192] In some embodiments, the depth L1 of the first overlapping groove 82c is greater than or equal to 0.03 mm and less than or equal to 0.15 mm, and / or the depth L2 of the second overlapping groove 861 is greater than or equal to 0.03 mm and less than or equal to 0.15 mm. In some embodiments, the depth L1 of the first overlapping groove 82c may be equal to the depth L2 of the second overlapping groove 861. For example, the depth L2 of the second overlapping groove 861 may be 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.15 mm, etc., so that the depths of both the first overlapping groove 82c and the second overlapping groove 861 are relatively shallow, and the sealing member 85 and the second wall plate 8123 are also made thin.

[0193] In some embodiments, the shielding member 84 includes a first flange portion 841 and a first body portion 842. For details regarding the specific configuration of the first flange portion 841 and the first body portion 842, please refer to the above text. Figure 10 The detailed description of the illustrated embodiments will not be repeated here. It is understood that... Figure 10 In the illustrated embodiment, at least a portion of the connecting surface 8411 formed by the first flange 841 forms Figure 18 The second overlapping surface 8613 in the second overlapping groove 861 in the embodiment shown.

[0194] In some embodiments, the shielding member 84 and the second wall panel 8123 are integrally formed. For example, the second wall panel 8123 is connected to the side of the first flange portion 841 away from the front cavity Q1, and the second wall panel 8123, the first flange portion 841, and the first body portion 842 are all integrally formed. For example, the shielding member 84 and the second wall panel 8123 can be integrally formed by CNC machining, such as computer digital control precision machining (CNC process), or by casting, such as mold casting. For example, the second wall panel 8123 and the shielding member 84 can be integrally formed steel plate structures. In this case, the cross-section of the second wall panel 8123 and the first flange portion 841 can be Z-shaped, and the cross-section of the first flange portion 841 and the first body portion 842 can be L-shaped. The shielding member 84 is provided with a second vent hole 8421, thereby simplifying the processing technology of the second wall panel 8123 and the shielding member 84.

[0195] In other embodiments, the shielding member 84 and the second wall panel 8123 are also connected in a sealed manner by assembly, such as by snap-fitting, adhesive bonding, screw connection, welding, etc. The specific connection method is not limited here.

[0196] In some embodiments, the seal 85 can also be a sealant. That is, after the first lap groove 82c and the second lap groove 861 are joined to form the sealing groove 86, sealant is applied to both the first lap groove 82c and the second lap groove 861 so that the sealant itself forms the sealant 85. The sealant connects the core 82 and the shielding member 84 while sealing the rear cavity Q2.

[0197] The assembly method for speaker module 80 is described below. Please refer to [link / reference]. Figure 19 , Figure 19 This is a schematic flowchart illustrating the assembly method of a speaker module 80 provided in some embodiments of this application. The speaker module 80 in this embodiment can be any of the speaker modules 80 described in the above embodiments.

[0198] Specifically, the assembly method of speaker module 80 includes:

[0199] S100: Connect the shielding member 84 to the housing 81 to form the first component 80b;

[0200] S200: Fix the core 82 to the first component 80b.

[0201] In some embodiments, step S200, which fixes the core 82 to the first component 80b, specifically includes:

[0202] S201. The core 82 and the front shell 811 are fixed to form a second component 80c. At this time, the second component 80c includes the core 82, the front wall plate 8112 and the side wall plate 8111.

[0203] S202. Fix the second component 80c to the first component 80b to form a speaker module 80. The speaker module 80 at this time includes a core 82, a front wall panel 8112, a side panel 8111, a shield 84, and a housing 81. Alternatively, the speaker module 80 at this time includes a core 82, a front wall panel 8112, a side panel 8111, a shield 84, a housing 81, and a seal 85.

[0204] In some embodiments, the portion where the housing 81 connects to the shield 84 may be Figures 8b to 12 The first wall panel 8122 of the rear housing 812 shown may, in some embodiments, have a portion connected to the shield 84 that is also [missing information]. Figures 15 to 18 The seal 85 shown is described below with reference to two embodiments for ease of explanation:

[0205] Example 1, please refer to Figure 20 , Figure 20 A schematic diagram illustrating the assembly process of the speaker module 80 when the housing 81 provided in some embodiments of this application includes the first wall panel 8122:

[0206] A1: By step S100, the shielding member 84 is connected to one side of the first wall panel 8122 to form a first component 80b including the shielding member 84 and the first wall panel 8122. For example, the shielding member 84 and the first wall panel 8122 can be connected by adhesive bonding or welding. At this time, the rear housing 812 has a fourth opening 812b.

[0207] A2: The core 82 is fixed to the front housing 811 to form the second component 80c. For example, the front wall panel 8112 and the side panel 8111 can be integrally formed, or they can be fixed by adhesive connection or welding connection. The core 82 can be adhesively connected to the front housing 811 or welded to it. The magnetic conductive part 8222a of the core 82 has a first overlapping groove 82c.

[0208] It is understandable that the formation of the second component 80c and the first component 80b do not interfere with each other; that is, the formation of the first component 80b in A1 and the second component 80c in A2 can be carried out simultaneously.

[0209] A3: Connect the first component 80b and the second component 80c. For example, the second component 80c can be placed on the operating table with the magnetic conductor 8222a facing upwards. The shielding member 84 of the first component 80b is placed facing downwards on the second component 80c, so that the magnetic conductor 8222a enters the fourth opening 812b and the first wall plate 8122 of the first component 80b enters the first overlapping groove 82c, and the first wall plate 8122 is fixed in the first overlapping groove 82c.

[0210] Example 2, please refer to Figure 21 , Figure 21 A schematic diagram illustrating the assembly process of the speaker module 80 when the housing 81 provided in some embodiments of this application includes the second wall panel 8123:

[0211] A1: In step S100, the shielding member 84 and the second wall panel 8123 are integrally formed to form a first component 80b including the shielding member 84 and the second wall panel 8123. For example, the shielding member 84 and the second wall panel 8123 are integrally formed metal steel plate structures. At this time, the rear housing 812 has a fifth opening 812c, and the second wall panel 8123 and the shielding member 84 define a second overlapping groove 861 that communicates with the fifth opening 812c.

[0212] A2: The core 82 and the front shell 811 are fixed to form the second component 80c. For example, the front wall panel 8112 and the side panel 8111 can be integrally formed and fixed to the core 82 by adhesive or welding. Similarly, the formation of the first component 80b in A1 and the second component 80c in A2 can be carried out simultaneously.

[0213] A3: Connect the first component 80b and the second component 80c. For example, the second component 80c can be placed on the operating table with the magnetic conductor 8222a facing upwards. The shielding member 84 of the first component 80b is placed facing the second component 80c and downwards on the second component 80c, so that the magnetic conductor 8222a enters the fifth opening 812c. The second wall panel 8123 is connected to the front housing 811, and the second overlapping groove 861 surrounds the outer periphery of the first overlapping groove 82c and docks with the first overlapping groove 82c to form a sealing groove 86.

[0214] A4: Fix the seal 85 inside the sealing groove 86. For example, in some embodiments, the seal 85 can be sealed to the first overlapping surface 82c1 and the second overlapping surface 8613 by adhesive bonding and welding. In other embodiments, sealant can also be applied to the first overlapping surface 82c1 and the second overlapping surface 8613 to form the seal 85.

[0215] It is important to note that, in Figure 19 and Figure 20In the illustrated embodiment, the rear housing 812 and the magnetic conductor 8222a are sealed together. Exemplarily, the inner edge of the fourth opening 812b and the magnetic conductor 8222a can be sealed together by filling with sealant, and the inner edge of the fifth opening 812c and the magnetic conductor 8222a can also be sealed together by filling with sealant. Using sealant is convenient and suitable for sealing gaps of different shapes, with a wide range of applications. The sealant mentioned in this context includes, but is not limited to, one or more of the following: UV-curing adhesive, polyurethane, silicone rubber, polysulfide rubber, neoprene rubber, and epoxy resin sealant.

[0216] Understandably, in Figure 19 and Figure 20 In the speaker module 80 formed by the embodiment shown, there is no need to separately assemble and fix the shield 84 and the core 82. The assembly between the shield 84 and the core 82 can be completed by means of the rear housing 812. In addition to the assembly of the above structure, the speaker module 80 can also be assembled with other structures, which are not limited in this application.

[0217] The electronic device 100 according to the embodiments of this application can be equipped with a speaker module 80 of any of the above embodiments, thereby reducing the overall thickness of the electronic device 100.

[0218] In some embodiments of the speaker module 80 of the electronic device 100, the structure of the rear housing 812 is changed to form a configuration in which only the magnetic conductive element 8222a is exposed from the position of the fourth opening 812b. The first wall plate 8122 of the rear housing 812 is fixed in the first overlapping groove 82c of the core 82, so that the first wall plate 8122 is not superimposed on the magnetic conductive element 8222a. In this way, the total thickness of the speaker module 80 in the Z direction is reduced, and the speaker module 80 and the electronic device 100 are made thinner.

[0219] Meanwhile, the shielding member 84 is completely placed inside the rear cavity Q2, and the first wall panel 8122 of the rear housing 812 is fixed in the first overlapping groove 82c. At this time, if adhesive is applied between the first wall panel 8122 and the first overlapping surface 82c1 for sealing connection, the adhesive will not overflow even if it overflows into the shielding member 84 and block the second vent hole 8421, thereby improving the acoustic performance of the speaker module 80.

[0220] In some other electronic devices 100, the structure of the rear housing 812 is modified, and a seal 85 is added, resulting in an exposed configuration of the seal 85 and the magnetic conductor 8222a. Since the seal 85 is embedded in the first overlapping groove 82c and the second overlapping groove 861 and does not overlap with the magnetic conductor 8222a, the total thickness of the speaker module 80 in the Z direction is reduced, thus achieving a thinner speaker module 80 and electronic device 100. Simultaneously, by sealing the connection of the seal 85, adhesive is kept as far away as possible from the first outer peripheral surface 82b. Even if adhesive overflow occurs, it will not flow onto the shield 84 located on the circumferential outer side of the core 82 and block the second vent 8421, thereby improving the acoustic performance of the speaker module 80.

[0221] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0222] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A speaker module, characterized in that, include: The housing includes a first wall panel; The core is fixed to the housing and divides the space inside the housing into a front cavity and a rear cavity. The core includes a first outer surface and a first outer peripheral surface. The first outer surface faces away from the front cavity and the first outer peripheral surface surrounds the outer periphery of the first outer surface. The core is also provided with a first overlapping groove that penetrates the first outer surface and the first outer peripheral surface. The first wall panel includes a first connecting part and a second connecting part that are connected to each other. The first connecting part is disposed in the first overlapping groove and the second connecting part is located on the circumferential outer side of the core. A shielding member is disposed in the rear cavity and located on the circumferential outer side of the core. The side of the shielding member facing away from the core is filled with sound-absorbing material between itself and the shell. The core has a first vent hole, and the shielding member has a second vent hole. The first vent hole and the second vent hole are in communication.

2. The speaker module according to claim 1, characterized in that, The thickness of the first wall panel is less than or equal to the depth of the first lap groove.

3. The speaker module according to claim 1, characterized in that, The core includes a magnetic conductive element, and the first overlapping groove is formed in the magnetic conductive element.

4. The speaker module according to claim 1, characterized in that, One of the core and the first wall panel is provided with a first positioning structure, and the other is provided with a second positioning structure. The first positioning structure is used to cooperate with the second positioning structure for positioning.

5. The speaker module according to claim 4, characterized in that, The first positioning structure is a positioning groove, and the second positioning structure is a positioning protrusion.

6. The loudspeaker module according to any one of claims 1-5, characterized in that, The shielding member is connected to the side of the first wall panel facing the rear cavity.

7. The loudspeaker module according to any one of claims 1-5, characterized in that, The shielding member is connected to the second connecting part.

8. The speaker module according to claim 1, characterized in that, The first connecting part and the second connecting part are integrally formed.

9. The loudspeaker module according to any one of claims 1-5, characterized in that, At least a portion of the first wall panel is integrally formed with the shielding member.

10. The loudspeaker module according to any one of claims 1-5, characterized in that, The shielding component includes a first body portion and a first flange portion connected together. The first body portion surrounds the outer periphery of the core, and the second vent is disposed on the first body portion. The first flange is located on the side of the first body that is away from the core, and the first flange is connected to the first wall panel.

11. The speaker module according to claim 10, characterized in that, The first flange has a connecting surface facing the first wall panel. The connecting surface includes a first region and a second region. The first region is located on the side of the second region closer to the core. A gap is formed between the first region and the first wall panel. An adhesive layer is provided between the second region and the first wall panel.

12. The loudspeaker module according to any one of claims 1-5, characterized in that, The depth of the first lap groove is greater than or equal to 0.03 mm and less than or equal to 0.15 mm.

13. The loudspeaker module according to any one of claims 1-5, characterized in that, The housing also includes interconnected side panels and a front wall panel; The side panel is connected to the outer circumferential side of the first wall panel. The front wall panel includes a first part and a second part. The first part is located on the side of the core near the front cavity and is connected to the side panel. The second part is connected to the first part and to the first wall panel.

14. A loudspeaker module, characterized in that, include: The housing, including the second wall panel; The core is fixed to the housing and divides the space inside the housing into a front cavity and a rear cavity. The core includes a first outer surface and a first outer peripheral surface. The first outer surface faces away from the front cavity and the first outer peripheral surface surrounds the outer periphery of the first outer surface. The core is also provided with a first overlapping groove that penetrates the first outer surface and the first outer peripheral surface. A shielding member is disposed in the rear cavity and located on the circumferential outer side of the core. The side of the shielding member facing away from the core is filled with sound-absorbing material between itself and the shell. The core has a first vent hole, and the shielding member has a second vent hole. The first vent hole and the second vent hole are in communication. The shielding member is connected to the second wall panel and defines a second overlapping groove. The second overlapping groove is located circumferentially outside the first overlapping groove and communicates with the first overlapping groove. The speaker module also includes a sealing member, a portion of which is disposed in the first overlapping groove and another portion of which is disposed in the second overlapping groove.

15. The speaker module according to claim 14, characterized in that, The thickness of the seal is less than or equal to the thickness of the first overlap groove, and / or the thickness of the seal is less than or equal to the thickness of the second overlap groove.

16. The speaker module according to claim 14 or 15, characterized in that, The shielding component is integrally formed with the second wall panel.

17. The speaker module according to claim 14 or 15, characterized in that, The second wall panel does not protrude from the core.

18. The speaker module according to claim 14 or 15, characterized in that, The sealing element is a sealant.

19. An assembly method for a loudspeaker module according to any one of claims 1-18, characterized in that, include: The shielding member is connected to the housing to form a first component; The kernel is fixed to the first component.

20. An electronic device, characterized in that, The device includes a housing and a speaker module, wherein the speaker module is the speaker module according to any one of claims 1-18, and the speaker module is disposed within the housing.

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