High-intensive flying robot heat dissipation structure with heat dissipation and flying aerodynamic performance

Abstract

The invention provides a high-intensive flying robot heat dissipation structure with heat dissipation and flight aerodynamic performance, and belongs to the field of aircraft heat dissipation structures. The problem that additional airflow generated by an existing air cooling heat dissipation device is prone to forming coupling interference with flying main airflow, and consequently aerodynamic characteristics are degraded is solved. The heat dissipation system comprises a flight control circuit board heat dissipation structure located at the gravity center of the robot, a Jetson Orin NX heat dissipation structure, binocular camera heat dissipation structures which are symmetrical on the front side and the rear side and a TOF obstacle avoidance module heat dissipation structure, and is used for achieving heat dissipation of the robot without generating moment and gyroscopic moment to affect the posture of the robot. The motion control stability of the robot is ensured while the heat dissipation performance is ensured, and the effects of effectively protecting important elements, prolonging the service life of the robot, improving the running stability and safety of the robot and ensuring the motion control stability of the robot can be achieved; and technical support is provided for performance improvement and practical application of the highly-intensive flying robot.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation structures of flying robots, and in particular to a highly compact heat dissipation structure of a flying robot that combines heat dissipation with flight aerodynamics. Background Art

[0002] A highly compact flying robot refers to an unmanned aerial platform that integrates a large number of electronic components, including processors, sensors, and communication modules, within a limited internal space, enabling it to perform complex tasks. With their excellent maneuverability, spatial accessibility, and versatility, these robots have shown great potential for application in military reconnaissance, terrain mapping, disaster monitoring, and other fields. However, as their functionality continues to expand and their intelligence continues to improve, their power consumption density has increased significantly. The highly compact design has led to a significant problem of heat accumulation in heat-generating components. Failure to dissipate heat effectively and in a timely manner will lead to a decline in the performance of electronic components, shorten their lifespan, and even cause system failures, seriously threatening the reliability and stability of the flying robot.

[0003] The efficient heat dissipation technologies used by traditional flying robots are mainly liquid cooling and heat pipe cooling. Although liquid cooling has high heat dissipation efficiency, it requires an additional liquid cooling circulation system, and has problems such as complex structure, heavy weight, and high risk of leakage. It is difficult to meet the lightweight and high reliability requirements of flying robots. Although heat pipe cooling achieves a good balance between thermal conductivity and device weight, its size and shape are limited by the manufacturing process, making it difficult to adapt to the complex spatial layout within highly compact flying robots and unable to achieve uniform and efficient heat dissipation. Therefore, traditional methods are difficult to effectively solve the heat dissipation problems of highly compact flying robots. There is an urgent need to design a heat dissipation structure that is efficient, lightweight, and compact.

[0004] In recent years, universities and research institutions at home and abroad have conducted preliminary research on heat dissipation structure design for highly compact flying robots. For example, efficient structural designs based on microchannel cooling technology utilize the convective heat transfer effect of fluids within microchannels to optimize local heat flux density; thermal management technologies based on phase change materials achieve transient thermal buffering through latent heat absorption during solid-liquid phase transitions; and directional heat conduction technologies based on thermal metamaterials achieve directional heat transfer through topological manipulation of heat flux through artificial structures. However, these new cooling technologies generally face industrial bottlenecks such as complex preparation processes and high mass production costs. In contrast, air cooling, with its advantages of simple structure, manageable cost, and lightweight design, presents a solution with great potential for engineering applications. However, it is important to note that the motion control systems of highly compact flying robots rely on precise airflow distribution. The additional airflow generated by air-cooling devices can easily couple with the main airflow, leading to degraded aerodynamic characteristics. Therefore, ensuring heat dissipation efficiency while ensuring compatibility between the cooling airflow and the flight airflow remains a key challenge in the application of air-cooling technology in highly compact flying robots.

[0005] Based on this background, this paper proposes a heat dissipation structure design for highly compact flying robots, achieving both efficient heat dissipation and compatibility with flight aerodynamic characteristics. This research provides an innovative technical path to overcome the thermal management bottleneck of highly compact flying robots. Summary of the Invention

[0006] The technical problems to be solved by the present invention are:

[0007] In order to solve the problem that the additional airflow generated by the existing air-cooling heat dissipation device is easy to form coupling interference with the main flight airflow, resulting in deterioration of aerodynamic characteristics.

[0008] The present invention is to solve the above technical problems using the following technical solutions:

[0009] The present invention provides a highly compact flying robot heat dissipation structure that combines heat dissipation with flight aerodynamics. The heat dissipation structure includes a flight control circuit board heat dissipation structure located at the center of gravity of the robot, a Jetson Orin NX heat dissipation structure, a binocular camera heat dissipation structure symmetrically located on both the front and rear sides, and a TOF obstacle avoidance module heat dissipation structure. The heat dissipation structure is used to achieve robot heat dissipation without generating torque or gyroscopic torque that affects the robot's posture.

[0010] The flight control circuit board heat dissipation structure includes a circuit board heat sink and a circuit board heat dissipation fan;

[0011] The Jetson Orin NX heat dissipation structure includes a computing power platform heat sink and a computing power platform cooling fan;

[0012] The binocular camera heat dissipation structure includes a camera cooling fan arranged above the binocular camera heat dissipation grid, and the wind direction of the camera cooling fan is perpendicular to the wind direction of the heat dissipation grid;

[0013] The heat dissipation structure of the TOF obstacle avoidance module includes a heat dissipation boss and a phase change sheet arranged on the heat dissipation boss.

[0014] Furthermore, in the flight control circuit board heat dissipation structure, the circuit board heat sink is arranged on the back of the flight control circuit board, and the circuit board heat dissipation fan is arranged on the circuit board heat sink for dissipating heat from the circuit board heat sink.

[0015] Furthermore, in the Jetson Orin NX heat dissipation structure, the computing power platform heat sink is arranged on the hard disk on the back of the Jetson Orin NX high-performance computing power platform, and the computing power platform cooling fan is arranged on the computing power platform heat sink and is opposite to the cooling fan on the front of the Jetson Orin NX high-performance computing power platform, which is used to dissipate heat from the computing power platform heat sink and offset the torque and gyroscopic torque generated by the cooling fan of the Jetson Orin NX high-performance computing power platform.

[0016] Furthermore, in the binocular camera heat dissipation structure, the binocular camera's own heat dissipation grid is a plurality of evenly distributed and through heat dissipation channels, and the camera heat dissipation fan is arranged above the heat dissipation grid to blow away the hot air from the heat dissipation grid.

[0017] Furthermore, in the binocular camera heat dissipation structure, there are two camera cooling fans located on the front and rear binocular cameras, and the camera cooling fans on the front and rear binocular cameras are positioned relative to each other, so as to offset the torque and gyroscopic torque generated by the camera cooling fans on both sides.

[0018] Furthermore, in the heat dissipation structure of the TOF obstacle avoidance module, the heat dissipation boss includes two rounded rectangular blocks and is arranged in the TOF heating area. Each rectangular block is provided with a phase change sheet for achieving rapid heat conduction.

[0019] Furthermore, when calculating the torque, the following formula is used:

[0020]

[0021] Where M is the moment, is the thrust generated by the fan, is the connection vector between the center of mass of the flying robot and the fan;

[0022] Analysis of the fan's center position and thrust direction shows that the torques generated by the two camera cooling fans on the front binocular camera and the two camera cooling fans on the rear binocular camera cancel each other out. The torques generated by the Jetson Orin NX high-performance computing platform's built-in cooling fan and the configured computing platform cooling fan also cancel each other out. The flight control circuit board's heat dissipation structure, located at the robot's center of gravity, does not generate any torque that affects its posture.

[0023] Furthermore, when calculating the gyroscopic torque, the following formula is used:

[0024]

[0025] in, is the gyroscopic torque, is the cooling fan's moment of inertia, is the angular velocity vector of the cooling fan, is the rotational angular velocity of the cooling fan;

[0026] The gyroscopic torques generated by the two camera cooling fans on the front binocular camera and the two camera cooling fans on the rear binocular camera offset each other. The gyroscopic torques generated by the cooling fan built into the Jetson Orin NX high-performance computing platform and the configured computing platform cooling fan offset each other. During normal operation, the circuit board cooling fan on the flight control circuit board is far smaller than the control torque in all directions of the robot and can be ignored.

[0027] Furthermore, the moment of inertia of the cooling fan that comes with the Jetson Orin NX high-performance computing power platform is the same as the moment of inertia of the computing power platform cooling fan set on the Jetson Orin NX high-performance computing power platform.

[0028] Furthermore, the circuit board cooling fan on the flight control circuit board is the same model as the computing platform cooling fan set on the Jetson Orin NX high-performance computing platform.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] ① The present invention effectively solves the problem of heat accumulation caused by the high power consumption density of high-intensity flying robots, and improves the operating stability and safety of the equipment.

[0031] ② The present invention minimizes the impact of the cooling fan airflow on the robot's flight airflow through the reasonable spatial distribution of the fan, thereby ensuring the motion control accuracy of the equipment.

[0032] ③ The heat dissipation fan of the present invention is simple and practical in design, cost-controllable, and easy to manufacture and maintain.

[0033] ④ The present invention combines the heat dissipation structure with the metal support of the robot itself to improve the overall rigidity of the robot.

[0034] In summary, the present invention ensures the motion control stability of the robot while ensuring the heat dissipation performance, can effectively protect important components, extend the service life of the robot, improve the operation stability and safety of the robot, and ensure the stability of the robot's motion control, providing technical support for the performance improvement and practical application of high-intensity flying robots. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram of a heat dissipation structure of a flight control circuit board according to an embodiment of the present invention;

[0036] Figure 23-D view of a 2006 type cooling fan according to an embodiment of the present invention;

[0037] Figure 3 Schematic diagram of the heat dissipation structure of Jetson Orin NX in an embodiment of the present invention;

[0038] Figure 4 Schematic diagram of the heat dissipation structure of the binocular camera (front side) in an embodiment of the present invention, where the arrow indicates the air outlet direction of the camera's cooling fan;

[0039] Figure 5 Three views of the RFB1804 cooling fan according to an embodiment of the present invention;

[0040] Figure 6 Schematic diagram of the heat dissipation boss on the TOFSense-M laser sensor in an embodiment of the present invention;

[0041] Figure 7 Schematic diagram of the main heating area of the TOFSense-M laser sensor in an embodiment of the present invention;

[0042] Reference numerals:

[0043] 1-1, circuit board heat sink; 1-2, circuit board cooling fan; 3-1, computing power platform heat sink; 3-2, computing power platform cooling fan; 4-1, camera cooling fan; 4-2, heat dissipation grid; 6-1, heat dissipation boss; 6-2, TOF fixing boss. DETAILED DESCRIPTION

[0044] In the description of the present invention, it should be noted that the terminology in each embodiment, such as "up", "down", "front", "back", "left", "right", etc., which indicate directions, are only for simplifying the description of the positional relationship based on the drawings in the specification, and do not mean that the referred elements and devices must be operated in accordance with the specific directions and defined operations and methods and structures in the specification. Such directional nouns do not constitute a limitation to the present invention.

[0045] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0046] Specific implementation plan 1: Combined Figures 1 to 7 As shown, the present invention provides a highly compact flying robot heat dissipation structure that combines heat dissipation with flight aerodynamics.

[0047] The highly compact flying robot of the present invention includes an aircraft control circuit board located at the center of gravity of the robot, binocular cameras on the front and rear sides, a Jetson Orin NX computing platform, and a time-of-flight obstacle avoidance module. To ensure the robot's high heat dissipation characteristics and good motion control stability, the heat dissipation structure includes a heat dissipation structure for the flight control circuit board, a heat dissipation structure for the Jetson Orin NX, a heat dissipation structure for the binocular cameras, and a heat dissipation structure for the time-of-flight obstacle avoidance module.

[0048] Combine Figure 1 As shown, the flight control circuit board heat dissipation structure includes a circuit board heat sink 1-1 and a circuit board cooling fan 1-2, which are used to dissipate heat from the flight control circuit board when the robot is working; since the flight control circuit board is designed to be arranged on the front, in order to facilitate the arrangement of the heat dissipation structure and not interfere with the original components, the circuit board cooling fan 1-2 and the circuit board heat sink 1-1 are placed on the back of the circuit board; the circuit board cooling fan 1-2 directly faces the circuit board heat sink 1-1 designed on the metal structure to discharge air, and a 2006 model cooling fan produced by Dongke Chuangwei Company is selected. This fan has the characteristics of high speed, small size and low noise;

[0049] Combine Figure 2 As shown, the fan size of the 2006 model cooling fan is 20mm×20mm×6mm, the rated voltage is DC5V, the voltage range is DC3.5V-7V, the starting voltage is DC3.5V, the power consumption is 0.6W, the rated current is 0.12A±0.02A, the speed is 13000±10%RPM, the air volume is 0.77CFM, the air pressure is 16.91Pa, and the weight is 3g;

[0050] Combine Figure 3 As shown, the Jetson Orin NX heat dissipation structure includes a computing platform heat sink 3-1 and a computing platform cooling fan 3-2, which are used to dissipate heat from the Jetson Orin NX high-performance computing platform (used to run the top-level algorithm) when the robot is working; the front of the Jetson Orin NX high-performance computing platform circuit board has a built-in cooling fan, and its heat sink covers the entire area of the front, so there is no need to add an additional fan to dissipate heat from the front; in contrast, the back of the Jetson Orin NX high-performance computing platform does not have its own heat dissipation structure. During normal operation, the hard disk module fixed to the back will generate a lot of heat. To prevent heat accumulation and danger, an active heat dissipation method is adopted by the fan; the computing platform heat sink 3-1 and the computing platform cooling fan 3-2 are set on the hard disk on the back of the Jetson Orin NX high-performance computing platform. When it is working, the presence of the heat dissipation structure can help the back of the circuit board to effectively dissipate heat; the model of the computing platform cooling fan 3-2 is still the 2006 model fan of Dongke Chuangwei Company;

[0051] Combine Figure 4 As shown, the binocular camera heat dissipation structure uses a camera cooling fan 4-1 to dissipate heat from the binocular camera when the robot is working; the flying robot is equipped with two binocular cameras, which are respectively located on the front and rear sides of the flying robot. Taking the installation position and the shape of the heat dissipation structure into consideration, since the heat dissipation grilles 4-2 of the binocular cameras are located on the upper and lower sides of the through-hole and are narrow and long in shape, a side-outlet camera cooling fan 4-1 is selected, which can reduce the space occupied by the installation to a certain extent and maximize the use of the fan's air outlet; combined with Figure 4 The wind direction arrow in the figure indicates that the hot air first diffuses out from the grid and is then blown downward by the fan. The arrow indicates the direction in which the fan blows the hot air. The fan model is the RFB1804 side-discharge cooling fan produced by Dongke Chuangwei Company. This fan has the characteristics of high speed, small size and low noise.

[0052] Combine Figure 5 As shown, the fan size of the RFB1804 cooling fan is 18mm×18mm×4mm, the voltage is DC5V, the current is 0.05A, the noise is 26DBA, the power is 0.25W, the air volume is 0.2CFM, the speed is 17800±5%RPM, the weight is 1.8g, the bearing structure is a hydraulic bearing, and the temperature range is -10℃ to +60℃;

[0053] The TOF obstacle avoidance module heat dissipation structure includes a heat dissipation boss 6-1 and a phase change plate for heat dissipation of the TOF obstacle avoidance module when the robot is working; the TOF obstacle avoidance module uses Nooploop's TOFSense-M model laser sensor, and the actual measurement by the temperature gun and the analysis of the sensor heating components are as follows;

[0054] Calculate the power of each component using Joule's law:

[0055] Regional thermal resistance calculation: , ,

[0056] Regional temperature changes:

[0057] Where P is the sensor heating power, I is the sensor current, R is the sensor resistance, L is the contact surface thickness, A is the contact surface area, k is the material thermal conductivity, and h is the convection heat transfer coefficient. is the thermal conduction resistance, is the convection thermal resistance, is the total thermal resistance, is the temperature change;

[0058] The TOF heating area is a fixed area. Considering the presence of metal pins and pads on the back of the sensor, to prevent the risk of short circuits, a heat dissipation boss 6-1 is designed to contact the circuit board. The heat dissipation boss 6-1 is positioned and sized to fit the main heating area. A phase change film with a thermal conductivity of 6.0W / (mK) is attached to the surface of the heat dissipation boss 6-1, which can effectively transfer heat to the entire metal frame, achieving fast and efficient heat conduction.

[0059] Combine Figure 6 As shown, it also includes a TOF fixing boss 6-2, which is 0.5mm higher than the plane, has an inner diameter of 3mm, an outer diameter of 5mm, and a hole spacing that is the same as the TOF fixing hole spacing, and is used to fix and raise the TOF; the heat dissipation boss 6-1 is 0.3mm higher than the plane and consists of two rounded rectangles with a size of 7.23mm×3.5mm (corner radius 0.5mm);

[0060] Combine Figure 7 As shown, the rectangular area surrounded by the black dotted line represents the main heat-generating area of TOF. A thermally conductive phase change sheet with a thermal conductivity of 6.0W / (mK) is attached to the surface of the boss in the main heat-generating area, which can effectively transfer heat to the entire metal frame to achieve fast and efficient heat conduction.

[0061] This invention provides a highly efficient heat dissipation structure for a highly compact flying robot. The structure comprises a heat dissipation structure for a flight control circuit board, a Jetson Orin NX, a binocular camera, and a time-of-flight obstacle avoidance module. To ensure operational stability and safety, active cooling fans are installed for the main heat-generating components (including circuit board cooling fans 1-2, computing platform cooling fans 3-2, and camera cooling fan 4-1). Furthermore, given that the robot's motion control power is provided by fan airflow, to prevent the additional airflow generated by the active cooling fans from interfering with the main flight airflow, a symmetrical design is implemented with respect to the robot's central axis of motion, taking into account the flow fields and airflow sizes of each cooling fan. This design eliminates the effects of the cooling fan airflow on the robot's moment of inertia and gyroscopic torque. The geometric layout and fan thrust are designed to minimize the net force and torque exerted by the fans on the robot.

[0062] Based on the aforementioned heat dissipation structure, the impact of the cooling fans on the robot's motion control was analyzed. The two selected cooling fans and the built-in fan for the Jetson Orin NX are compact and lightweight. Furthermore, their impact on the robot's motion control during normal operation needed to be evaluated. A right-handed system was established, with the robot's center of gravity as the origin and the interaction module surface as the negative x-axis. The positions and related parameters of the fans on the robot are shown in the following table.

[0063] Table 1 Flying robot cooling fan location and related parameters

[0064]

[0065] Analyzing the thrust and direction of the fans above, we can conclude that the net force acting on the flying robot is 0. The torque generated by each cooling fan can be calculated using the torque calculation formula below.

[0066]

[0067] Where M is the moment, is the thrust generated by the fan, is the connection vector between the center of mass of the flying robot and the fan. Analysis of the fan's center position and thrust direction shows that the torques generated by the two upper binocular cooling fans and the two lower binocular cooling fans (i.e., the upper pair and the lower pair of the four camera cooling fans 4-1 on the front and rear sides) cancel each other out. The torques generated by the front and rear fans of Jetson Orin NX cancel each other out. Since the flight control circuit board's heat dissipation structure is located at the flying robot's center of gravity, it does not generate any torque that affects its posture.

[0068] Similarly, we analyze the effect of the gyroscopic torque generated by the cooling fan on the flying robot. According to the gyroscopic torque calculation formula:

[0069]

[0070] in, is the gyroscopic torque, is the cooling fan's moment of inertia, is the angular velocity vector of the cooling fan, is the angular velocity of the cooling fan. It is known that the moment of inertia of the Jetson Orin NX's built-in cooling fan is approximately equal to that of the 2006 cooling fan. Therefore, the gyroscopic torques generated by the two upper binocular cooling fans and the two lower binocular cooling fans cancel each other out, and the gyroscopic torques generated by the front and rear cooling fans of the Jetson Orin NX cancel each other out. Because the PCB cooling fans 1-2 on the flight control circuit board heat dissipation structure have an extremely small moment of inertia, the gyroscopic torque they generate during normal operation is only 0.032 N·mm, far less than the control torque of the flight robot in all directions. Furthermore, the on / off and speed of the PCB cooling fans 1-2 can be controlled during flight robot operation to further mitigate their impact on control. Therefore, the impact of the PCB cooling fans 1-2 on the overall operation of the flight robot is negligible.

[0071] Although the present invention is disclosed as above, the scope of protection disclosed by the present invention is not limited thereto. Those skilled in the art of the present invention may make various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications will fall within the scope of protection of the present invention.

Claims

1. A highly compact flying robot heat dissipation structure that combines heat dissipation with flight aerodynamics, characterized by: It includes the flight control circuit board heat dissipation structure located at the center of gravity of the robot, the Jetson Orin NX heat dissipation structure, the binocular camera heat dissipation structure symmetrical on the front and back sides, and the TOF obstacle avoidance module heat dissipation structure, which are used to achieve robot heat dissipation without generating torque and gyroscopic torque that affect the robot's posture. The flight control circuit board heat dissipation structure comprises a circuit board heat sink (1-1) and a circuit board heat dissipation fan (1-2); The Jetson Orin NX heat dissipation structure includes a computing power platform heat sink (3-1) and a computing power platform cooling fan (3-2); The binocular camera heat dissipation structure comprises a camera heat dissipation fan (4-1) arranged above the binocular camera heat dissipation grid (4-2), and the wind direction of the camera heat dissipation fan (4-1) is perpendicular to the wind direction of the heat dissipation grid (4-2); The TOF obstacle avoidance module heat dissipation structure comprises a heat dissipation boss (6-1) and a phase change sheet arranged on the heat dissipation boss (6-1).

2. A highly compact flying robot heat dissipation structure with both heat dissipation and flight aerodynamics according to claim 1, characterized in that: In a flight control circuit board heat dissipation structure, the circuit board heat sink (1-1) is arranged on the back of the flight control circuit board, and the circuit board heat dissipation fan (1-2) is arranged on the circuit board heat sink (1-1) for dissipating heat from the circuit board heat sink (1-1).

3. The highly compact flying robot heat dissipation structure having both heat dissipation and flight aerodynamics according to claim 2, characterized in that: In the Jetson Orin NX heat dissipation structure, the computing power platform heat sink (3-1) is arranged on the hard disk on the back of the Jetson Orin NX high-performance computing power platform, and the computing power platform cooling fan (3-2) is arranged on the computing power platform heat sink (3-1) and is opposite to the cooling fan provided on the front of the Jetson Orin NX high-performance computing power platform, and is used to dissipate heat from the computing power platform heat sink (3-1) and offset the torque and gyroscopic torque generated by the cooling fan provided on the Jetson Orin NX high-performance computing power platform.

4. The highly compact flying robot heat dissipation structure having both heat dissipation and flight aerodynamics according to claim 3, characterized in that: In the binocular camera heat dissipation structure, the binocular camera's own heat dissipation grid (4-2) is a plurality of evenly distributed and through-connected heat dissipation channels, and the camera heat dissipation fan (4-1) is arranged above the heat dissipation grid (4-2) to dissipate hot air from the heat dissipation grid (4-2).

5. The highly compact flying robot heat dissipation structure having both heat dissipation and flight aerodynamics according to claim 4, characterized in that: In the binocular camera heat dissipation structure, the number of camera cooling fans (4-1) located on the front and rear binocular cameras is two, and the camera cooling fans (4-1) on the front and rear binocular cameras are opposite to each other, so as to offset the torque and gyroscopic torque generated by the camera cooling fans (4-1) on both sides.

6. The highly compact flying robot heat dissipation structure having both heat dissipation and flight aerodynamics according to claim 5, characterized in that: In the heat dissipation structure of the TOF obstacle avoidance module, the heat dissipation boss (6-1) comprises two rounded rectangular blocks and is arranged in the TOF heating area, and each rectangular block is provided with a phase change sheet for achieving rapid heat conduction.

7. The highly compact flying robot heat dissipation structure having both heat dissipation and flight aerodynamics according to claim 6, characterized in that: When calculating the torque, the following formula is used: ； Where M is the moment, is the thrust generated by the fan, is the connection vector between the center of mass of the flying robot and the fan; Analysis of the fan's center position and thrust direction shows that the torques generated by the two camera cooling fans (4-1) on the front binocular camera and the two camera cooling fans (4-1) on the rear binocular camera cancel each other out. The torques generated by the Jetson Orin NX high-performance computing platform's built-in cooling fan and the preset computing platform cooling fan (3-2) cancel each other out. The flight control circuit board's heat dissipation structure, located at the flying robot's center of gravity, does not generate any torque that affects its posture.

8. The highly compact flying robot heat dissipation structure having both heat dissipation and flight aerodynamics according to claim 7, characterized in that: When calculating the gyro torque, the following formula is used: ； in, is the gyroscopic torque, is the cooling fan's moment of inertia, is the angular velocity vector of the cooling fan, is the rotational angular velocity of the cooling fan; The gyroscopic torques generated by the two camera cooling fans (4-1) on the front binocular camera and the two camera cooling fans (4-1) on the rear binocular camera cancel each other out. The gyroscopic torques generated by the cooling fan of the Jetson Orin NX high-performance computing platform and the set computing platform cooling fan (3-2) cancel each other out. The circuit board cooling fans (1-2) on the flight control circuit board are much smaller than the control torque in all directions of the robot during normal operation and can be ignored.

9. The highly compact flying robot heat dissipation structure having both heat dissipation and flight aerodynamics according to claim 8, characterized in that: The moment of inertia of the cooling fan that comes with the Jetson Orin NX high-performance computing power platform is the same as the moment of inertia of the computing power platform cooling fan (3-2) set on the Jetson Orin NX high-performance computing power platform.

10. The highly compact flying robot heat dissipation structure having both heat dissipation and flight aerodynamics according to claim 9, characterized in that: The circuit board cooling fans (1-2) on the flight control circuit board are the same model as the computing platform cooling fans (3-2) set on the Jetson Orin NX high-performance computing platform.

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