Display panel and display device

Abstract

The invention relates to a display panel and a display device. The display panel comprises a first metal layer; the first insulating layer is located on one side of the first metal layer away from the substrate; the first conductive layer is located on one side of the first insulating layer away from the substrate; the light-emitting device layer is located on the side, away from the substrate, of the first insulating layer, and the first conductive layer comprises a plurality of first electrodes; the packaging structure is located on the side, away from the substrate, of the light-emitting device layer; the touch function layer is located on the side, away from the substrate, of the packaging structure, and at least one touch metal layer comprises a plurality of touch electrodes; wherein at least one of the first metal layer and the first conductive layer comprises a first power line, and the first power line is electrically connected with one of the first electrode and the second electrode; the at least one touch metal layer further comprises at least one heat dissipation electrode, and the heat dissipation electrode is electrically connected with the first power line through a through hole penetrating through at least part of the film layer between the heat dissipation electrode and the first power line. Heat dissipation of the power signal line can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the continuous development of display technology, organic light-emitting diode (OLED) display devices have been widely used in many fields such as flat panel displays, flexible displays, automotive displays and solid-state lighting due to their advantages such as wide color gamut, high contrast, energy saving and foldability.

[0003] However, with the development of display technology and the expansion of application scenarios, how to achieve heat dissipation of power signal lines has become an urgent problem that needs to be solved. Summary of the Invention

[0004] Based on this, it is necessary to provide a display panel and a display device to solve the problem of how to achieve heat dissipation of power signal lines.

[0005] In a first aspect, an embodiment of the present application provides a display panel, comprising:

[0006] substrate;

[0007] a first metal layer, located on one side of the substrate;

[0008] a first insulating layer, located on a side of the first metal layer away from the substrate;

[0009] a first conductive layer, located on a side of the first insulating layer away from the substrate;

[0010] a light-emitting device layer located on a side of the first insulating layer away from the substrate, the light-emitting device layer comprising a plurality of light-emitting devices spaced apart from each other, wherein the light-emitting devices comprise a first electrode, a light-emitting material layer, and a second electrode stacked sequentially in a direction away from the substrate in a direction perpendicular to the plane of the substrate, and the first conductive layer comprises a plurality of the first electrodes;

[0011] an encapsulation structure, located on a side of the light-emitting device layer away from the substrate;

[0012] a touch function layer, located on a side of the package structure away from the substrate, the touch function layer comprising at least one touch metal layer and at least one touch insulation layer, wherein the at least one touch metal layer comprises a plurality of touch electrodes;

[0013] Wherein, at least one of the first metal layer and the first conductive layer includes a first power line, and the first power line is electrically connected to one of the first electrode and the second electrode;

[0014] At least one touch metal layer further includes at least one heat dissipation electrode, and the heat dissipation electrode is electrically connected to the first power line via a through hole penetrating at least a portion of the film layer between the heat dissipation electrode and the first power line.

[0015] In some embodiments, at least a portion of at least one of the heat dissipation electrodes is exposed.

[0016] In some embodiments, further comprising:

[0017] an optical adhesive layer, located on a side of the touch function layer away from the substrate;

[0018] A protective cover plate, located on a layer of the optical adhesive layer away from the substrate;

[0019] At least a portion of the orthographic projection of at least one of the heat dissipation electrodes on the plane where the substrate is located is located outside the range of the orthographic projection of the optical adhesive layer on the plane where the substrate is located, and is in direct contact with air.

[0020] In some embodiments, in a direction perpendicular to the plane of the substrate, the touch functional layer includes a first touch conductive layer, a first touch insulating layer, a second touch conductive layer, and a second touch insulating layer stacked sequentially in a direction away from the substrate;

[0021] At least one of the first touch conductive layer and the second touch conductive layer includes the heat dissipation electrode.

[0022] In some embodiments, the touch insulating layer located on a side of the heat dissipation electrode away from the substrate includes a heat dissipation opening, and the heat dissipation opening exposes the heat dissipation electrode.

[0023] In some embodiments, the display panel includes a display area and a non-display area surrounding at least a portion of the display area, and the through hole is located in the non-display area;

[0024] In a direction perpendicular to the plane of the substrate, the encapsulation structure includes a first inorganic encapsulation structure, a first organic encapsulation structure, and a second inorganic encapsulation structure, which are sequentially stacked in a direction away from the substrate;

[0025] wherein the edge of the first organic encapsulation structure is located between the display area and the through hole, and the through hole passes through the first inorganic encapsulation structure and the second inorganic encapsulation structure; or

[0026] In the non-display area on the same side of the display area, the through hole is located on a side of an edge of the first inorganic encapsulation structure, an edge of the first organic encapsulation structure, and an edge of the second inorganic encapsulation structure away from the display area.

[0027] In some embodiments, the through hole passes through the insulating layer between the heat dissipation electrode and the first power line, and the insulating layer between the heat dissipation electrode and the first power line includes the first insulating layer, at least a portion of the film layer of the packaging structure and at least one of the touch insulating layers.

[0028] In some embodiments, the display panel includes a plurality of thin film transistors located between the substrate and the light emitting device layer, and the display panel further includes:

[0029] a semiconductor layer, located between the substrate and the first metal layer, the semiconductor layer including an active portion of the thin film transistor;

[0030] a gate insulating layer, located between the semiconductor layer and the first metal layer;

[0031] The first metal layer includes a first conductive electrode, and the first conductive electrode is electrically connected to the active portion of the corresponding thin film transistor.

[0032] In some embodiments, the display panel further includes:

[0033] a second insulating layer, located between the first metal layer and the first insulating layer;

[0034] a second metal layer, located between the second insulating layer and the first insulating layer;

[0035] At least one of the first metal layer and the second metal layer includes a second power line, and the second power line is electrically connected to the other of the first electrode and the second electrode.

[0036] In the second aspect, based on the same application concept, an embodiment of the present application further provides a display device, which includes any display panel provided in the first aspect.

[0037] In an embodiment of the present application, in a display panel, a first metal layer is located on one side of a substrate; a first insulating layer is located on a side of the first metal layer away from the substrate; a first conductive layer is located on a side of the first insulating layer away from the substrate; a light-emitting device layer is located on a side of the first insulating layer away from the substrate, the first conductive layer including a first electrode of the light-emitting device; an encapsulation structure is located on a side of the light-emitting device layer away from the substrate; and a touch function layer is located on a side of the encapsulation structure away from the substrate. At least one of the first metal layer and the first conductive layer includes a first power line electrically connected to one of the first electrode and the second electrode; and the at least one touch metal layer further includes at least one heat dissipation electrode electrically connected to the first power line via a through hole penetrating at least a portion of the film layer between the heat dissipation electrode and the first power line. In a first aspect, the at least one touch metal layer is used as the at least one heat dissipation electrode, and the heat dissipation electrode is electrically connected to the first power line via a through hole penetrating at least a portion of the film layer between the heat dissipation electrode and the first power line. Heat in the first power line can be transferred to the heat dissipation electrode, thereby increasing the heat dissipation area of the first power line. Furthermore, the heat dissipation electrode has a high thermal conductivity, which can quickly reduce the heat and temperature in the first power line, thereby improving the performance and reliability of the display panel. Secondly, the heat dissipation electrode is made of the touch metal layer and is closer to the outside of the display panel, which can better dissipate heat and increase the heat dissipation speed. Thirdly, the heat dissipation electrode is only connected to the first power line and does not form a closed current loop with other electrodes or other structures. Therefore, the heat dissipation electrode will not adversely affect the electrical signal in the first power line. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0039] Figure 1 This is a first overall top view schematic diagram of a display panel provided in an embodiment of the present application.

[0040] Figure 2 This is a second overall top view schematic diagram of a display panel provided in an embodiment of the present application.

[0041] Figure 3 This is a schematic diagram of a first cross-sectional structure of a display panel provided in an embodiment of the present application.

[0042] Figure 4 This is a schematic diagram of a second cross-sectional structure of a display panel provided in an embodiment of the present application.

[0043] Figure 5This is a schematic diagram of a third cross-sectional structure of a display panel provided in an embodiment of the present application.

[0044] Figure 6 This is a schematic diagram of a fourth cross-sectional structure of a display panel provided in an embodiment of the present application.

[0045] Figure 7 This is a schematic diagram of a fifth cross-sectional structure of a display panel provided in an embodiment of the present application.

[0046] Figure 8 A schematic diagram of a display device provided in an embodiment of the present application.

[0047] Figure 1: Display device 200; display panel 100; first metal layer 81; first insulating layer 82; first conductive layer 83; light-emitting device layer 256; packaging structure 30; touch function layer 45T; light-emitting device 256f; first electrode layer 21; light-emitting material layer 25; second electrode 26; touch metal layer 50; touch insulating layer 40; first power line D1; heat dissipation electrode S1; through hole Sk1; heat dissipation opening Sk2; first gap Sk3; first notch S k4; optical adhesive layer 61; protective cover 62; third touch insulating layer 43; first touch conductive layer 51; first touch insulating layer 41; second touch conductive layer 52; second touch insulating layer 42; bridging electrode 511; touch electrode 521; first inorganic encapsulation structure 31; first organic encapsulation structure 32; second inorganic encapsulation structure 33; second insulating layer 91; second metal layer 92; second power line D2; display area AA; non-display area BB; first edge 30b;

[0048] First dotted line C1-C2; substrate 11; semiconductor layer 12; gate insulating layer 13; first conductive metal layer 14; first interlayer insulating layer 15; second conductive metal layer 16; second interlayer insulating layer 17; third conductive metal layer 18; planarization layer 19; pixel definition layer 22; thin film transistor T0; active portion 121; gate 141; second capacitor electrode 161; source 181; drain 182; first electrode 211; pixel definition structure 221. DETAILED DESCRIPTION

[0049] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.

[0051] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. Furthermore, when a layer is referred to as being "under" another layer, it can be directly under or one or more intervening elements may also be present. It will also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening elements may also be present.

[0052] In the case of using “including,” “having,” and “comprising” described herein, another component may be added unless a clear limiting term such as “only,” “consisting of,” etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as having one number.

[0053] It should be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of this application.

[0054] It should also be understood that when interpreting an element, even if not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of the specific value determined by those skilled in the art. For example, "approximately," "approximately," or "substantially" can mean within one or more standard deviations, and is not limited here.

[0055] Furthermore, in the specification, the phrase “planar distribution diagram” refers to a drawing when the target portion is viewed from above, and the phrase “cross-sectional diagram” refers to a drawing when a section taken by vertically cutting the target portion is viewed from the side.

[0056] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0057] It will be apparent to those skilled in the art that various modifications and variations can be made to this application without departing from the spirit or scope of this application. Therefore, this application is intended to cover modifications and variations of this application that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the embodiments provided in the examples of this application may be combined with each other unless there is any inconsistency.

[0058] As mentioned in the background technology section, with the development of display technology and the expansion of application scenarios, how to achieve heat dissipation of power signal lines has become an urgent problem to be solved. Currently, various application fields of display panels such as mobile phones, wearables, and vehicles all have high brightness mode (HBM high brightness) requirements. For example, in high brightness mode, the brightness of the white screen is required to reach 2000nit or even 3000nit to ensure the display effect under outdoor sunlight. However, when the brightness of the display panel is too high, the current on the power signal line is very large. According to Joule's Law, the formula P=I 2 Rt, when the brightness of the display panel is too high, the Joule heat power on the power signal line will increase, and the thermal conductivity of the insulating material (such as silicon nitride and / or silicon oxide, etc.) in contact with the power signal line is low, resulting in the temperature of the power signal line, light-emitting devices and other parts rising, thereby reducing the performance and reliability of the display panel.

[0059] Based on the above technical problems, the inventors have discovered that in a display panel, a first metal layer is located on one side of a substrate; a first insulating layer is located on a side of the first metal layer away from the substrate; a first conductive layer is located on a side of the first insulating layer away from the substrate; a light-emitting device layer is located on a side of the first insulating layer away from the substrate, the first conductive layer including a first electrode of the light-emitting device; an encapsulation structure is located on a side of the light-emitting device layer away from the substrate; and a touch function layer is located on a side of the encapsulation structure away from the substrate; wherein at least one of the first metal layer and the first conductive layer includes a first power line, the first power line being electrically connected to one of the first electrode and the second electrode; and the at least one touch metal layer further includes at least one heat dissipation electrode, the heat dissipation electrode being electrically connected to the first power line via a through hole penetrating at least a portion of the film layer between the heat dissipation electrode and the first power line. In a first aspect, the at least one touch metal layer is used as the at least one heat dissipation electrode, the heat dissipation electrode being electrically connected to the first power line via a through hole penetrating at least a portion of the film layer between the heat dissipation electrode and the first power line. Heat in the first power line can be transferred to the heat dissipation electrode, thereby increasing the heat dissipation area of the first power line. Furthermore, the heat dissipation electrode has a high thermal conductivity, which can quickly reduce the heat and temperature in the first power line, thereby improving the performance and reliability of the display panel. Secondly, the heat dissipation electrode is made of the touch metal layer and is closer to the outside of the display panel, which can better dissipate heat and increase the heat dissipation speed. Thirdly, the heat dissipation electrode is only connected to the first power line and does not form a closed current loop with other electrodes or other structures. Therefore, the heat dissipation electrode will not adversely affect the electrical signal in the first power line.

[0060] The above is the core concept of this application. The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of this application.

[0061] See also Figures 1 to 6 . Figure 1 This is a first overall top view schematic diagram of a display panel provided in an embodiment of the present application. Figure 2 This is a second overall top view schematic diagram of a display panel provided in an embodiment of the present application.

[0062] Figure 3 This is a schematic diagram of a first cross-sectional structure of a display panel provided in an embodiment of the present application. Figure 4 This is a schematic diagram of a second cross-sectional structure of a display panel provided in an embodiment of the present application. Figure 5 This is a schematic diagram of a third cross-sectional structure of a display panel provided in an embodiment of the present application. Figure 6 This is a schematic diagram of a fourth cross-sectional structure of a display panel provided in an embodiment of the present application. Figure 7This is a schematic diagram of a fifth cross-sectional structure of a display panel provided in an embodiment of the present application.

[0063] Figures 3 to 5 for Figure 1 The first dotted line C1-C2 direction, or Figure 1 Schematic diagram of the cross-sectional structure at the first dotted line C1-C2 in FIG. Figure 6 for Figure 2 The first dotted line C1-C2 direction, or Figure 2 Schematic diagram of the cross-sectional structure at the first dotted line C1-C2 in FIG.

[0064] The present application provides a display panel 100 , which includes a substrate 11 , a first metal layer 81 , a first insulating layer 82 , a first conductive layer 83 , a light-emitting device layer 256 , an encapsulation structure 30 , and a touch function layer 45T. The first metal layer 81 is located on one side of the substrate 11; the first insulating layer 82 is located on the side of the first metal layer 81 away from the substrate 11; the first conductive layer 83 is located on the side of the first insulating layer 82 away from the substrate 11; the light-emitting device layer 256 is located on the side of the first insulating layer 82 away from the substrate 11, and the light-emitting device layer 256 includes a plurality of spaced light-emitting devices 256f. In a direction perpendicular to the plane of the substrate 11, the light-emitting device 256f includes a first electrode 211, a light-emitting material layer 25, and a second electrode 26 stacked in sequence in a direction away from the substrate 11, and the first conductive layer 83 includes a plurality of first electrodes 211; the packaging structure 30 is located on the side of the light-emitting device layer 256 away from the substrate 11; the touch function layer 45T is located on the side of the packaging structure 30 away from the substrate 11, and the touch function layer 45T includes at least one touch metal layer 50 and at least one touch insulating layer 40, and the at least one touch metal layer 50 includes a plurality of touch electrodes. Among them, at least one of the first metal layer 81 and the first conductive layer 83 includes a first power line D1, and the first power line D1 is electrically connected to one of the first electrode 211 and the second electrode 26; at least one touch metal layer 50 also includes at least one heat dissipation electrode S1, and the heat dissipation electrode S1 is electrically connected to the first power line D1 through a through hole Sk1 that penetrates at least part of the film layer between the heat dissipation electrode S1 and the first power line D1.

[0065] For example, in a direction away from the substrate 11, the display panel 100 includes a first metal layer 81, a first insulating layer 82, a first conductive layer 83, a light-emitting device layer 256, an encapsulation structure 30, and a touch function layer 45T. In the display area AA, the first metal layer 81 and the first conductive layer 83 are film layers within the encapsulation structure 30. The touch function layer 45T is a film layer outside the encapsulation structure 30.

[0066] For example, Figures 3 to 6As shown, although only one light emitting device 256f is illustrated, the light emitting device layer 256 includes a plurality of light emitting devices 256f that are spaced apart. The plurality of light emitting devices 256f that are spaced apart may be arranged in an array, which is not limited here.

[0067] For example, the light-emitting device 256f includes a first electrode 211, a light-emitting material layer 25, and a second electrode 26, which are sequentially stacked in a direction away from the substrate 11. One of the first electrode 211 and the second electrode 26 is an anode, and the other of the first electrode 211 and the second electrode 26 is a cathode. In the present embodiment, the first electrode 211 is used as the anode and the second electrode 26 is used as the cathode.

[0068] For example, at least one of the first metal layer 81 and the first conductive layer 83 includes a first power line D1. The first power line D1 can be a line that provides a cathode signal, such as a VSS signal line. The first power line D1 can be a VDD signal line, which is electrically connected to the source or drain of a drive transistor in a pixel drive circuit. The signal of the VDD signal line can be input to an anode. However, the first power line is not limited to being a VSS signal line or a VDD signal line.

[0069] For example, at least one touch metal layer 50 further includes at least one heat dissipation electrode S1. The heat dissipation electrode S1 is electrically connected to the first power line D1 via a through-hole Sk1 that penetrates at least a portion of the film layer between the heat dissipation electrode S1 and the first power line D1. In some embodiments, in a display panel, one touch metal layer 50 includes the heat dissipation electrode S1. In some embodiments, in a display panel, two touch metal layers 50 each include a heat dissipation electrode S1.

[0070] It should be noted that the heat dissipation electrode S1 is electrically connected to the first power line D1 via a through hole Sk1 that penetrates at least a portion of the film layer between the heat dissipation electrode S1 and the first power line D1. In some embodiments, the heat dissipation electrode S1 is electrically connected to the first power line D1 via a through hole Sk1 that penetrates at least one touch insulating layer 40. In some embodiments, the heat dissipation electrode S1 is electrically connected to the first power line D1 via a through hole Sk1 that penetrates at least a portion of the film layer in the package structure 30.

[0071] In the embodiment of the present application, in the display panel 100, the first metal layer 81 is located on one side of the substrate 11; the first insulating layer 82 is located on the side of the first metal layer 81 away from the substrate 11; the first conductive layer 83 is located on the side of the first insulating layer 82 away from the substrate 11; the light-emitting device layer 256 is located on the side of the first insulating layer 82 away from the substrate 11, and the first conductive layer 83 includes the first electrode 211 of the light-emitting device 256f; the encapsulation structure 30 is located on the side of the light-emitting device layer 256 away from the substrate 11; and the touch function layer 45T is located on the side of the encapsulation structure 30 away from the substrate 11; wherein, at least one of the first metal layer 81 and the first conductive layer 83 includes a first power line D1, which is electrically connected to one of the first electrode 211 and the second electrode 26; and the at least one touch metal layer 50 further includes at least one heat dissipation electrode S1, which is electrically connected to the first power line D1 via a through hole Sk1 that penetrates at least a portion of the film layer between the heat dissipation electrode S1 and the first power line D1. First, at least one touch metal layer 50 is used as at least one heat dissipation electrode S1. Heat dissipation electrode S1 is electrically connected to first power line D1 via a through hole Sk1 that penetrates at least a portion of the film layer between heat dissipation electrode S1 and first power line D1. Heat in first power line D1 can be transferred to heat dissipation electrode S1, increasing the heat dissipation area of first power line D1. Heat dissipation electrode S1 has high thermal conductivity, which can quickly reduce the heat and temperature in first power line D1, thereby improving the performance and reliability of the display panel. Second, heat dissipation electrode S1 is made of touch metal layer 50, and heat dissipation electrode S1 is closer to the outside of the display panel, which can better dissipate heat and increase the heat dissipation speed. Third, heat dissipation electrode S1 is only connected to first power line D1 and does not form a closed current loop with other electrodes or other structures. Therefore, heat dissipation electrode S1 will not adversely affect the electrical signals in first power line D1.

[0072] In some embodiments, at least a portion of at least one heat dissipation electrode S1 is exposed.

[0073] For example, at least part of at least one heat dissipation electrode S1 is exposed, that is, at least part of the heat dissipation electrode S1 connected to the first power line D1 is exposed. Exposed means that it is not covered and completely wrapped by the optical adhesive layer and / or the touch insulation layer 40. The heat dissipation electrode S1 can be in direct contact with the air, thereby greatly improving the heat dissipation efficiency and effect on the heat dissipation electrode S1, thereby better dissipating the heat of the first power line D1.

[0074] In some embodiments, as Figures 3 to 6As shown, the display panel 100 further includes an optical adhesive layer 61 and a protective cover plate 62. The optical adhesive layer 61 is located on the side of the touch function layer 45T away from the substrate 11; the protective cover plate 62 is located on a layer of the optical adhesive layer 61 away from the substrate 11. At least a portion of the orthographic projection of at least one heat dissipation electrode S1 on the plane of the substrate 11 is located outside the range of the orthographic projection of the optical adhesive layer 61 on the plane of the substrate 11 and is in direct contact with air.

[0075] For example, Figures 3 to 6 As shown, the optical adhesive layer 61 can be, but is not limited to, OCA or OCR. The protective cover plate 62 (CG, cover glass) can be, but is not limited to, glass, polyimide, or ultra-thin glass (UTG). The protective cover plate 62 is attached to the side of the touch function layer 45T away from the substrate via the optical adhesive layer 61.

[0076] For example, Figures 3 to 6 As shown, at least a portion of the orthographic projection of at least one heat dissipation electrode S1 on the plane where the substrate 11 is located is outside the range of the orthographic projection of the optical adhesive layer 61 on the plane where the substrate 11 is located, and is in direct contact with the air; that is, at least a portion of the heat dissipation electrode S1 is not covered by the optical adhesive layer 61, for example Figure 5 The middle optical adhesive layer 61 includes a first notch Sk4 at a position corresponding to the heat dissipation electrode S1 , thereby facilitating at least partial exposure of the heat dissipation electrode S1 , thereby improving the heat dissipation rate of the heat dissipation electrode S1 .

[0077] In some embodiments, as Figures 3 to 6 As shown, in a direction perpendicular to the plane of the substrate 11, the touch function layer 45T includes a first touch conductive layer 51, a first touch insulating layer 41, a second touch conductive layer 52, and a second touch insulating layer 42 stacked in sequence in a direction away from the substrate 11; at least one of the first touch conductive layer 51 and the second touch conductive layer 52 includes a heat dissipation electrode S1.

[0078] For example, Figures 3 to 6 As shown, in a direction perpendicular to the plane of the substrate 11, the touch function layer 45T includes a third touch insulating layer 43, a first touch conductive layer 51, a first touch insulating layer 41, a second touch conductive layer 52, and a second touch insulating layer 42, which are sequentially stacked in a direction away from the substrate 11. The film structure of the touch function layer 45T is not limited thereto.

[0079] For example, Figures 3 to 6 As shown, one of the first touch conductive layer 51 and the second touch conductive layer 52 may include multiple touch electrodes, and one of the first touch conductive layer 51 and the second touch conductive layer 52 may include multiple bridging electrodes, which may connect two adjacent touch electrodes with the same signal. Figures 3 to 6It is shown that the second touch conductive layer 52 includes a plurality of touch electrodes 521 , and the first touch conductive layer 51 includes a plurality of bridging electrodes 511 .

[0080] For example, Figures 3 to 6 As shown, the first touch conductive layer 51 and / or the second touch conductive layer 52 includes a heat dissipation electrode S1 .

[0081] In some embodiments, as Figures 3 to 6 As shown, the touch insulating layer 40 located on a side of the heat dissipation electrode S1 away from the substrate 11 includes a heat dissipation opening Sk2 , and the heat dissipation opening Sk2 exposes the heat dissipation electrode S1 .

[0082] For example, Figure 3 As shown, the first touch conductive layer 51 includes a heat dissipation electrode S1, a heat dissipation opening Sk2 penetrates the first touch insulation layer 41 and the second touch insulation layer 42, and a first gap Sk3 is formed between the optical adhesive layer 61 and the second touch insulation layer 42. The heat dissipation electrode S1 is exposed through the heat dissipation opening Sk2 and the first gap Sk3 and can be in contact with the air.

[0083] For example, compared to Figure 3 Example, Figure 4 It is illustrated that the first electrode layer 21 includes a first power line D1 .

[0084] For example, Figure 5 As shown, the second touch conductive layer 52 includes a heat dissipation electrode S1, a heat dissipation opening Sk2 penetrates the second touch insulating layer 42, and the optical adhesive layer 61 includes a first notch Sk4 corresponding to the heat dissipation electrode S1. The heat dissipation electrode S1 is exposed through the heat dissipation opening Sk2 and the first notch Sk4 and can be in contact with the air.

[0085] For example, in some embodiments, the heat dissipation electrode S1 may be exposed through the heat dissipation opening Sk2 and the first notch Sk4 and may be in contact with air. The heat dissipation opening Sk2 passes through the first touch insulation layer 41 and the second touch insulation layer 42 .

[0086] In some embodiments, as Figure 1 、 Figures 3 to 5 As shown, the display panel 100 includes a display area AA and a non-display area BB surrounding at least part of the display area AA, and the through hole Sk1 is located in the non-display area BB; in a direction perpendicular to the plane where the substrate 11 is located, the encapsulation structure 30 includes a first inorganic encapsulation structure 31, a first organic encapsulation structure 32 and a second inorganic encapsulation structure 33 stacked in sequence in a direction away from the substrate 11; wherein, the edge of the first organic encapsulation structure 32 is located between the display area AA and the through hole Sk1, and the through hole Sk1 passes through the first inorganic encapsulation structure 31 and the second inorganic encapsulation structure 33.

[0087] For example, the first inorganic encapsulation structure 31 and the second inorganic encapsulation structure 33 are made of inorganic materials, such as silicon nitride and / or silicon oxide.

[0088] For example, the material of the first organic encapsulation structure 32 is an organic material, such as polyimide or resin.

[0089] For example, Figure 1 、 Figures 3 to 5 As shown, the edge of the first inorganic encapsulation structure 31 and the second inorganic encapsulation structure 33 is a first edge 30 b .

[0090] For example, Figure 1 、 Figures 3 to 5 As shown, the edge of the first organic encapsulation structure 32 is located between the edge of the first inorganic encapsulation structure 31 and the display area AA, the edge of the first organic encapsulation structure 32 is located between the edge of the second inorganic encapsulation structure 33 and the display area AA, and the edge of the first organic encapsulation structure 32 is located between the display area AA and the through hole Sk1. The through hole Sk1 penetrates the first and second inorganic encapsulation structures 31 and 33. The first organic encapsulation structure 32 is relatively thick, so the through hole Sk1 does not need to penetrate the first organic encapsulation structure 32. This allows for better fabrication of the through hole Sk1 and avoids the through hole Sk1 not being able to penetrate the first organic encapsulation structure 32.

[0091] In some embodiments, as Figure 2 、 Figure 6 As shown, the display panel 100 includes a display area AA and a non-display area BB surrounding at least a portion of the display area AA, and the through hole Sk1 is located in the non-display area BB; in a direction perpendicular to the plane where the substrate 11 is located, the encapsulation structure 30 includes a first inorganic encapsulation structure 31, a first organic encapsulation structure 32, and a second inorganic encapsulation structure 33 that are stacked in sequence in a direction away from the substrate 11; wherein, in the non-display area BB on the same side of the display area AA, the through hole Sk1 is located on the side of the edge of the first inorganic encapsulation structure 31, the edge of the first organic encapsulation structure 32, and the edge of the second inorganic encapsulation structure 33 away from the display area AA.

[0092] For example, Figure 6 As shown, the edge of the first inorganic encapsulation structure 31 and the second inorganic encapsulation structure 33 is a first edge 30 b .

[0093] For example, Figure 2 、 Figure 6As shown, the edge of the first organic encapsulation structure 32 is located between the edge of the first inorganic encapsulation structure 31 and the display area AA, and the edge of the first organic encapsulation structure 32 is located between the edge of the second inorganic encapsulation structure 33 and the display area AA. The through hole Sk1 is located on the side of the edge of the first inorganic encapsulation structure 31, the edge of the first organic encapsulation structure 32, and the edge of the second inorganic encapsulation structure 33 away from the display area AA, and the through hole Sk1 does not penetrate the first and second inorganic encapsulation structures 31, 33. In this case, the through hole Sk1 can be prevented from damaging the first and second inorganic encapsulation structures 31, 33, thereby preventing damage to the encapsulation performance of the encapsulation structure 30.

[0094] In some embodiments, the through hole Sk1 passes through the insulating layer between the heat dissipation electrode S1 and the first power line D1. The insulating layer between the heat dissipation electrode S1 and the first power line D1 includes the first insulating layer 82, at least part of the film layer of the packaging structure 30 and at least one touch insulating layer 40.

[0095] For example, Figure 3 As shown, the first touch conductive layer 51 includes a heat dissipation electrode S1 , and a through hole Sk1 penetrates the third touch insulating layer 43 , the first inorganic packaging structure 31 and the second inorganic packaging structure 33 .

[0096] For example, Figure 5 As shown, the second touch conductive layer 52 includes a heat dissipation electrode S1 , and a through hole Sk1 penetrates the first touch insulating layer 41 , the third touch insulating layer 43 , the first inorganic packaging structure 31 and the second inorganic packaging structure 33 .

[0097] For example, Figure 3 As shown, the through hole Sk1 also penetrates the planar layer 19 and the pixel definition layer 22

[0098] In some embodiments, as Figures 3 to 6 As shown, the display panel 100 includes a plurality of thin film transistors T0 located between the substrate 11 and the light-emitting device layer 256. The display panel 100 also includes a semiconductor layer 12 and a gate insulating layer 13. The semiconductor layer 12 is located between the substrate 11 and the first metal layer 81 and includes active portions 121 of the thin film transistors T0. The gate insulating layer 13 is located between the semiconductor layer 12 and the first metal layer 81. The first metal layer 81 includes first conductive electrodes, which are electrically connected to the active portions 121 of the corresponding thin film transistors T0.

[0099] For example, in some embodiments, the first conductive electrode may be the source electrode 181 or the drain electrode 182. In other embodiments, the first conductive electrode may be an electrode connected to the source electrode 181 or the drain electrode 182. For example, the first conductive electrode may be a first connecting electrode connected between the drain electrode 182 and the first electrode 211.

[0100] For example, Figures 3 and 4 The film structure of the display panel 100 is illustrated as an example. The film structure of the display panel 100 includes a substrate 11, a semiconductor layer 12, a gate insulating layer 13, a first conductive metal layer 14, a first interlayer insulating layer 15, a second conductive metal layer 16, a second interlayer insulating layer 17, a third conductive metal layer 18, a planarization layer 19, a first electrode layer 21, and a pixel definition layer 22, which are stacked in sequence. The semiconductor layer 12 includes an active portion 121 of the thin film transistor T0. The first conductive metal layer 14 includes a gate 141 and a first capacitor electrode of the thin film transistor T0. The second conductive metal layer 16 includes a second capacitor electrode 161 in the pixel driving circuit. The third conductive metal layer 18 includes a source 181 and a drain 182 of the thin film transistor T0. The first electrode layer 21 includes a plurality of first electrodes 211. The pixel definition layer 22 includes a plurality of pixel definition structures 221 and a plurality of pixel openings surrounded by the pixel definition structures 221. The light emitting material layer 25 is at least partially filled in the pixel openings. The second electrode is disposed on a side of the light emitting material layer 25 and the pixel definition structure 221 away from the substrate 11. The film structure of the display panel 100 is not limited to Figures 3 to 6 shown.

[0101] For example, Figures 3 to 6 For example, the third conductive metal layer 18 is the first metal layer 81, the planar layer 19 is the first insulating layer 82, and the first electrode layer 21 is the first conductive layer 83. However, the first metal layer 81, the first insulating layer 82, and the first conductive layer 83 are not limited thereto.

[0102] In some embodiments, as Figure 7 As shown, the display panel 100 further includes a second insulating layer 91 and a second metal layer 92. The second insulating layer 91 is located between the first metal layer 81 and the first insulating layer 82, and the second metal layer 92 is located between the second insulating layer 91 and the first insulating layer 82; wherein at least one of the first metal layer 81 and the second metal layer 92 includes a second power line D2, and the second power line D2 is electrically connected to the other of the first electrode 211 and the second electrode 26.

[0103] For example, Figure 7 As shown, the first power line D1 may be one of a VSS signal line and a VDD signal line, and the second power line D2 may be the other of the VSS signal line and the VDD signal line.

[0104] For example, Figure 7 As shown, it is illustrated that the second metal layer 92 includes the first power line D1 and the first metal layer 81 includes the second power line D2.

[0105] For example, Figure 7As shown, the first power line D1 and / or the second power line D2 may be connected to the corresponding heat dissipation electrode S1.

[0106] See also Figure 8 , Figure 8 A schematic diagram of a display device provided in an embodiment of the present application.

[0107] Secondly, based on the same application concept, the present application also provides a display device 200, which includes any one of the display panels 100 described above, or includes a display panel 100 that combines any of the features described above.

[0108] For example, the display device 200 also has the beneficial effects of the display panel 100 in the above embodiment. The similarities can be understood by referring to the above explanation of the display panel 100 and will not be repeated below.

[0109] For example, the display device 200 provided in the embodiment of the present application can be Figure 8 The mobile phone shown can also be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop monitors, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, industrial control equipment, medical display screens, touch interactive terminals, etc. The embodiments of this application do not specifically limit this.

[0110] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0111] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: include: substrate; a first metal layer, located on one side of the substrate; a first insulating layer, located on a side of the first metal layer away from the substrate; a first conductive layer, located on a side of the first insulating layer away from the substrate; a light-emitting device layer located on a side of the first insulating layer away from the substrate, the light-emitting device layer comprising a plurality of light-emitting devices spaced apart from each other, wherein the light-emitting devices comprise a first electrode, a light-emitting material layer, and a second electrode stacked sequentially in a direction away from the substrate in a direction perpendicular to the plane of the substrate, and the first conductive layer comprises a plurality of the first electrodes; an encapsulation structure, located on a side of the light-emitting device layer away from the substrate; a touch function layer, located on a side of the package structure away from the substrate, the touch function layer comprising at least one touch metal layer and at least one touch insulation layer, wherein the at least one touch metal layer comprises a plurality of touch electrodes; Wherein, at least one of the first metal layer and the first conductive layer includes a first power line, and the first power line is electrically connected to one of the first electrode and the second electrode; At least one touch metal layer further includes at least one heat dissipation electrode, and the heat dissipation electrode is electrically connected to the first power line via a through hole penetrating at least a portion of the film layer between the heat dissipation electrode and the first power line.

2. The display panel according to claim 1, wherein: At least a portion of at least one of the heat dissipation electrodes is exposed.

3. The display panel according to claim 1, wherein: Also includes: an optical adhesive layer, located on a side of the touch function layer away from the substrate; A protective cover plate, located on a layer of the optical adhesive layer away from the substrate; At least a portion of the orthographic projection of at least one of the heat dissipation electrodes on the plane where the substrate is located is located outside the range of the orthographic projection of the optical adhesive layer on the plane where the substrate is located, and is in direct contact with air.

4. The display panel according to claim 1, wherein: In a direction perpendicular to the plane of the substrate, the touch function layer includes a first touch conductive layer, a first touch insulating layer, a second touch conductive layer, and a second touch insulating layer, which are sequentially stacked in a direction away from the substrate; At least one of the first touch conductive layer and the second touch conductive layer includes the heat dissipation electrode.

5. The display panel according to claim 4, wherein: The touch insulating layer located on a side of the heat dissipation electrode away from the substrate comprises a heat dissipation opening, and the heat dissipation opening exposes the heat dissipation electrode.

6. The display panel according to claim 1, wherein: The display panel includes a display area and a non-display area surrounding at least a portion of the display area, and the through hole is located in the non-display area; In a direction perpendicular to the plane of the substrate, the encapsulation structure includes a first inorganic encapsulation structure, a first organic encapsulation structure, and a second inorganic encapsulation structure, which are sequentially stacked in a direction away from the substrate; wherein the edge of the first organic encapsulation structure is located between the display area and the through hole, and the through hole passes through the first inorganic encapsulation structure and the second inorganic encapsulation structure; or, In the non-display area on the same side of the display area, the through hole is located on a side of an edge of the first inorganic encapsulation structure, an edge of the first organic encapsulation structure, and an edge of the second inorganic encapsulation structure away from the display area.

7. The display panel according to claim 1, wherein: The through hole penetrates the insulating layer between the heat dissipation electrode and the first power line. The insulating layer between the heat dissipation electrode and the first power line includes the first insulating layer, at least part of the film layer of the packaging structure, and at least one touch insulating layer.

8. The display panel according to claim 1, wherein: The display panel includes a plurality of thin film transistors located between a substrate and the light emitting device layer, and the display panel further includes: a semiconductor layer, located between the substrate and the first metal layer, the semiconductor layer including an active portion of the thin film transistor; a gate insulating layer, located between the semiconductor layer and the first metal layer; The first metal layer includes a first conductive electrode, and the first conductive electrode is electrically connected to the active portion of the corresponding thin film transistor.

9. The display panel according to claim 8, wherein: The display panel further includes: a second insulating layer, located between the first metal layer and the first insulating layer; a second metal layer, located between the second insulating layer and the first insulating layer; At least one of the first metal layer and the second metal layer includes a second power line, and the second power line is electrically connected to the other of the first electrode and the second electrode.

10. A display device, characterized in that: The device comprises the display panel according to any one of claims 1 to 9.

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